Aggregate sheet, and method for manufacturing aggregate sheet

Abstract

To provide an aggregate sheet capable of suppressing a tear taking a penetration hole as a starting point, and to provide a method of manufacturing the same.SOLUTION: An aggregate sheet 1 comprises a wiring circuit board 2, a frame 3, and a reinforcement part 4. The wiring circuit board 2 has a support layer 11, a base insulating layer 12, and a conductor pattern 13. The frame 3 supports the wiring circuit board 2. The frame 3 has a penetration hole 31. The reinforcement part 4 is arranged at an edge of the penetration hole 31. The reinforcement part 4 reinforces the edge of the penetration hole 31.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an aggregate sheet and a method for manufacturing the aggregate sheet.

Background Art

[0002] Conventionally, a wiring circuit board printing sheet having a plurality of wiring circuit boards has been known (see, for example, Patent Document 1 below).

[0003] In the manufacture of the above wiring circuit board printing sheet, after forming wiring circuit elements on a metal support sheet, the outer shape of the wiring circuit board is formed by etching the metal support sheet around the wiring circuit elements.

[0004] Thereafter, when peeling the etching resist used in the etching of the metal support sheet, the wiring circuit board printing sheet is immersed in a peeling solution while being sandwiched between mesh plates.

[0005] The wiring circuit board printing sheet has through holes. In a state where the wiring circuit board printing sheet is sandwiched between mesh plates, the pins of the mesh plates are inserted through the through holes of the wiring circuit board printing sheet.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] Here, it is assumed that the wiring circuit board printing sheet having a plurality of wiring circuit boards (without individually separating the plurality of wiring circuit boards) is processed or conveyed by inserting pins or the like through the through holes as described in Patent Document 1.

[0008] In this case, depending on the processing method and the conveyance method, a load may concentrate on the edge of the through hole, and the wiring circuit board printed sheet may be torn starting from the through hole.

[0009] The present invention provides an aggregate sheet capable of suppressing tearing of the aggregate sheet starting from a through hole, and a method for manufacturing the aggregate sheet.

Means for Solving the Problems

[0010] The present invention [1] includes a wiring circuit board having a support layer, an insulating layer disposed on one surface of the support layer in the thickness direction, and a conductor pattern disposed on one surface of the insulating layer in the thickness direction, a frame for supporting the wiring circuit board, the frame having a through hole, and a reinforcing portion disposed at an edge of the through hole and reinforcing the edge of the through hole.

[0011] According to such a configuration, at least the edge of the through hole can be reinforced, and tearing of the frame starting from the through hole can be suppressed.

[0012] The present invention [2] includes the aggregate sheet according to [1] above, wherein the frame is made of a metal foil having a thickness of 50 μm or less, and the thickness of the reinforcing portion is 6 μm or more.

[0013] According to such a configuration, when a frame made of a thin metal foil is provided, the edge of the through hole can be reinforced.

[0014] The present invention [3] includes the aggregate sheet according to [2] above, wherein when the thickness of the frame is taken as 100%, the thickness of the reinforcing portion is 50% or more.

[0015] The present invention [4] is the aggregate sheet according to any one of [1] to [3] above, wherein the reinforcing portion has a second through hole communicating with the through hole, and an inner surface of the second through hole is flush with an inner surface of the through hole.

[0016] According to such a configuration, the edge of the through hole can be intensively reinforced.

[0017] The present invention [5] includes any one of the aggregate sheets from [1] to [4] above, wherein the through-hole can receive a tool for hanging the aggregate sheet.

[0018] According to such a configuration, the aggregate sheet can be handled in a state of being hung on a tool.

[0019] Therefore, the handling property of the aggregate sheet can be improved.

[0020] The present invention [6] is a method for manufacturing any one of the aggregate sheets from [1] to [5] above, including a pattern step of forming the insulating layer and the conductor pattern on one surface of the metal foil drawn from a first roll which is a roll of metal foil, forming the reinforcing portion on one surface of the metal foil, forming the through-hole in the metal foil to manufacture a second roll having a plurality of the aggregate sheets, and a cutting step of cutting each of the plurality of aggregate sheets from the second roll, wherein the through-hole receives a tool for hanging the cut aggregate sheet, and includes a method for manufacturing an aggregate sheet.

[0021] According to such a configuration, the cut aggregate sheet can be handled in a state of being hung on a tool.

[0022] Therefore, the handling property of the cut aggregate sheet can be improved.

[0023] The present invention [7] further includes a plating step of plating the terminals of the conductor pattern, and the through-hole receives the tool in the plating step, and includes a method for manufacturing the aggregate sheet of [6] above.

[0024] According to such a configuration, in the plating step, the handling property of the cut aggregate sheet can be improved.

Advantages of the Invention

[0025] According to the aggregate sheet of the present invention and the method for manufacturing the aggregate sheet, it is possible to suppress the aggregate sheet from being torn starting from the through holes.

Brief Description of the Drawings

[0026]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Embodiments for Carrying Out the Invention

[0027] 1. Aggregate Sheet As shown in FIG. 1, the aggregate sheet 1 has a sheet shape extending in a first direction and a second direction. The second direction is orthogonal to the first direction. The aggregate sheet 1 includes a plurality of wiring circuit boards 2, a frame 3, and a plurality of reinforcing portions 4A, 4B, 4C, 4D.

[0028] (1) Wiring circuit board The plurality of wiring circuit boards 2 are arranged at intervals in the first direction and also arranged at intervals in the second direction. Each of the plurality of wiring circuit boards 2 has the same structure. Therefore, one of the plurality of wiring circuit boards 2 will be described, and the description of the other wiring circuit boards 2 will be omitted.

[0029] The wiring circuit board 2 extends in the first direction and the second direction. In the present embodiment, the wiring circuit board 2 has a substantially rectangular shape. Note that the shape of the wiring circuit board 2 is not limited.

[0030] The wiring circuit board 2 has a support layer 11, a base insulation layer 12 as an example of an insulation layer, a conductor pattern 13, and a cover insulation layer 14.

[0031] (1-1) Support layer As shown in FIG. 2A, the support layer 11 supports the base insulation layer 12, the conductor pattern 13, and the cover insulation layer 14 (see FIG. 2B). In the present embodiment, the support layer 11 is made of a metal foil. Examples of the metal include a stainless alloy and a copper alloy.

[0032] The thickness of the metal foil, that is, the thickness of the support layer 11, is, for example, 50 μm or less, preferably 30 μm or less, and, for example, 10 μm or more, preferably 15 μm or more.

[0033] (1-2) Base insulation layer The base insulating layer 12 is disposed on one surface S1 of the support layer 11 in the thickness direction. The thickness direction is orthogonal to the first direction and the second direction. The base insulating layer 12 is disposed between the support layer 11 and the conductor pattern 13 in the thickness direction. The base insulating layer 12 insulates the support layer 11 and the conductor pattern 13. The base insulating layer 12 is made of resin. Examples of the resin include polyimide.

[0034] The thickness of the base insulating layer 12 is, for example, 30 μm or less, preferably 15 μm or less, and for example, 1 μm or more, preferably 3 μm or more.

[0035] (1-3) Conductor Pattern The conductor pattern 13 is disposed on one surface S11 of the base insulating layer 12 in the thickness direction. The conductor pattern 13 is disposed on the opposite side of the support layer 11 with respect to the base insulating layer 12 in the thickness direction. The shape of the conductor pattern 13 is not limited.

[0036] In the present embodiment, as shown in FIG. 1, the conductor pattern 13 includes a plurality of terminals 131A, 131B, 131C, 131D, a plurality of terminals 132A, 132B, 132C, 132D, and a plurality of wirings 133A, 133B, 133C, 133D. Note that the number of terminals and the number of wirings are not limited.

[0037] (1-3-1) Terminal The terminals 131A, 131B, 131C, 131D are disposed at one end of the wiring circuit board 2 in the second direction. In the present embodiment, the terminals 131A, 131B, 131C, 131D are arranged in the first direction with a space therebetween. Each of the terminals 131A, 131B, 131C, 131D has a square land shape.

[0038] As shown in FIG. 2A, the terminal 131A includes a conductor layer 1311 and a plating layer 1312.

[0039] The conductor layer 1311 is the main body part of the terminal 131A. The conductor layer 1311 is disposed on one surface S11 of the base insulating layer 12 in the thickness direction. The conductor layer 1311 is made of metal. Examples of the metal include copper.

[0040] The thickness of the conductor layer 1311 is, for example, 3 μm or more, preferably 5 μm or more, and, for example, 50 μm or less, preferably 30 μm or less.

[0041] The plating layer 1312 covers the surface of the conductor layer 1311. The plating layer 1312 suppresses corrosion of the conductor layer 1311. The plating layer 1312 is made of metal. Examples of the metal include nickel, gold, and tin. The plating layer 1312 may be composed of one layer or a plurality of layers. When the plating layer 1312 is composed of a plurality of layers, each of the plurality of layers may be made of a different metal from each other.

[0042] The thickness of the plating layer 1312 is, for example, 0.1 μm or more, preferably 0.2 μm or more, and, for example, 5 μm or less, preferably 4 μm or less.

[0043] The terminals 131B, 131C, and 131D have the same structure as the terminal 131A. Therefore, the description of the terminals 131B, 131C, and 131D is omitted.

[0044] As shown in FIG. 1, the terminals 132A, 132B, 132C, and 132D are disposed at the other end of the wiring circuit board 2 in the second direction. In the present embodiment, the terminals 132A, 132B, 132C, and 132D are arranged in the first direction with spaces therebetween. Each of the terminals 132A, 132B, 132C, and 132D has a square land shape.

[0045] The terminals 132A, 132B, 132C, and 132D have the same structure as the terminal 131A. Therefore, the description of the terminals 132A, 132B, 132C, and 132D is omitted.

[0046] (1-3-2) Wiring One end of wiring 133A is connected to terminal 131A. The other end of wiring 133A is connected to terminal 132A. Wiring 133A electrically connects terminal 131A and terminal 132A.

[0047] One end of wiring 133B is connected to terminal 131B. The other end of wiring 133B is connected to terminal 132B. Wiring 133B electrically connects terminal 131B and terminal 132B.

[0048] One end of wiring 133C is connected to terminal 131C. The other end of wiring 133C is connected to terminal 132C. Wiring 133C electrically connects terminal 131C and terminal 132C.

[0049] One end of wiring 133D is connected to terminal 131D. The other end of wiring 133D is connected to terminal 132D. Wiring 133D electrically connects terminal 131D and terminal 132D.

[0050] In the following description, each of terminals 131A, 131B, 131C, and 131D is referred to as terminal 131, each of terminals 132A, 132B, 132C, and 132D is referred to as terminal 132, and each of wirings 133A, 133B, 133C, and 133D is referred to as wiring 133.

[0051] As shown in FIG. 2B, wiring 133 is made of the same metal as conductor layer 1311 (see FIG. 2A) of terminal 131. The thickness of wiring 133 is, for example, 3 μm or more, preferably 5 μm or more, and, for example, 50 μm or less, preferably 30 μm or less.

[0052] (1-4) Cover insulation layer As shown in FIG. 1, cover insulation layer 14 covers all of the wirings 133. Cover insulation layer 14 is disposed above base insulation layer 12 in the thickness direction. Note that cover insulation layer 14 does not cover terminals 131 and 132. Cover insulation layer 14 is made of resin. Examples of the resin include polyimide.

[0053] The thickness of the cover insulating layer 14 is, for example, 30 μm or less, preferably 15 μm or less, and, for example, 1 μm or more, preferably 3 μm or more.

[0054] (2) Frame The frame 3 is disposed on the outer periphery of the aggregate sheet 1. The frame 3 surrounds the plurality of wiring circuit boards 2. In the present embodiment, the frame 3 has a frame shape. Specifically, the frame 3 includes a first frame 3A, a second frame 3B, a third frame 3C, and a fourth frame 3D.

[0055] The first frame 3A is disposed at one end of the aggregate sheet 1 in the first direction and extends in the second direction.

[0056] The second frame 3B is disposed at the other end of the aggregate sheet 1 in the first direction and is spaced apart from the first frame 3A in the first direction. The plurality of wiring circuit boards 2 are disposed between the first frame 3A and the second frame 3B in the first direction. The second frame 3B extends in the second direction.

[0057] The third frame 3C is disposed at one end of the aggregate sheet 1 in the second direction and extends in the first direction. One end of the third frame 3C in the first direction is connected to one end of the first frame 3A in the second direction at the corner C1 of the aggregate sheet 1. The other end of the third frame 3C in the first direction is connected to one end of the second frame 3B in the second direction at the corner C2 of the aggregate sheet 1.

[0058] The fourth 3D frame is disposed at the other end of the aggregate sheet 1 in the second direction. The fourth 3D frame is disposed away from the third frame 3C in the second direction. The plurality of wiring circuit boards 2 are disposed between the third frame 3C and the fourth frame 3D in the second direction. The fourth frame 3D extends in the first direction. One end of the fourth frame 3D in the first direction is connected to the other end of the first frame 3A in the second direction at the corner C3 of the aggregate sheet 1. The other end of the fourth frame 3D in the first direction is connected to the other end of the second frame 3B in the second direction at the corner C4 of the aggregate sheet 1.

[0059] As shown in FIG. 2A, the frame 3 is made of a metal foil. The frame 3 is made of the same metal foil as the support layer 11 of the wiring circuit board 2. Examples of the metal include a stainless alloy and a copper alloy. The thickness of the metal foil, that is, the thickness T11 of the frame 3 is, for example, 50 μm or less, preferably 30 μm or less, and for example, 10 μm or more, preferably 15 μm or more.

[0060] Here, when the thickness T11 of the frame 3 is equal to or less than the above upper limit value, the rigidity of the frame 3 is low. Therefore, when handling the aggregate sheet 1, wrinkles may occur on the aggregate sheet 1. Therefore, it is difficult to handle the aggregate sheet 1.

[0061] Examples of the scene where it is difficult to handle the aggregate sheet 1 include a scene where the aggregate sheet 1 is carried, and a plating process in the manufacturing method of the aggregate sheet 1 described later.

[0062] Also, in the present embodiment, the aggregate sheet 1 has notches 5 between the frame 3 and the wiring circuit board 2, and between the two wiring circuit boards 2. Therefore, the rigidity of the entire aggregate sheet 1 is further reduced. Therefore, it is more difficult to handle the aggregate sheet 1.

[0063] Note that the aggregate sheet 1 has a connection portion 6A (see FIG. 1) that connects the frame 3 and the wiring circuit board 2, and a connection portion 6B (see FIG. 1) that connects two wiring circuit boards 2 to each other. The plurality of wiring circuit boards 2 are supported by the frame 3 via the connection portion 6A while being connected to each other via the connection portion 6B.

[0064] As shown in FIG. 1, the frame 3 has a plurality of through holes 31A, 31B, 31C, 31D.

[0065] In the present embodiment, the through hole 31A is located at the corner C1. The through hole 31B is located at the corner C2. The through hole 31C is located at the corner C3. The through hole 31D is located at the corner C4. In the present embodiment, each of the through holes 31A, 31B, 31C, 31D has a circular shape. Each of the through holes 31A, 31B, 31C, 31D can receive an instrument for hanging the aggregate sheet 1.

[0066] The instrument for hanging the aggregate sheet 1 is not limited. Examples of the instrument for hanging the aggregate sheet 1 include a bar, a wire, a pin, and a hook.

[0067] In the following description, each of the through holes 31A, 31B, 31C, 31D is referred to as a through hole 31. The number, arrangement, and shape of the through holes 31 are not limited.

[0068] (3) Reinforcing portion As shown in FIG. 1, in the present embodiment, the reinforcing portion 4A is disposed at the edge of the through hole 31A. The reinforcing portion 4A extends along the edge of the through hole 31A. The reinforcing portion 4A surrounds the through hole 31A. In other words, the reinforcing portion 4A has a through hole 41A. The through hole 41A communicates with the through hole 31A.

[0069] The reinforcing portion 4B is disposed at the edge of the through hole 31B. The reinforcing portion 4B extends along the edge of the through hole 31B. The reinforcing portion 4B surrounds the through hole 31B. In other words, the reinforcing portion 4B has a through hole 41B. The through hole 41B communicates with the through hole 31B.

[0070] The reinforcing part 4C is disposed at the edge of the through hole 31C. The reinforcing part 4C extends along the edge of the through hole 31C. The reinforcing part 4C surrounds the through hole 31C. In other words, the reinforcing part 4C has a through hole 41C. The through hole 41C communicates with the through hole 31C.

[0071] The reinforcing part 4D is disposed at the edge of the through hole 31D. The reinforcing part 4D extends along the edge of the through hole 31D. The reinforcing part 4D surrounds the through hole 31D. In other words, the reinforcing part 4D has a through hole 41D. The through hole 41D communicates with the through hole 31D.

[0072] In the following description, each of the reinforcing parts 4A, 4B, 4C, and 4D is referred to as the reinforcing part 4, and each of the through holes 41A, 41B, 41C, and 41D is referred to as the through hole 41.

[0073] In the present embodiment, the reinforcing part 4 has a circular shape. Note that the shape of the reinforcing part 4 is not limited. In the present embodiment, the reinforcing part 4 may be square-shaped or may be discontinuous.

[0074] As shown in FIG. 2A, in the present embodiment, the reinforcing part 4 is disposed on one surface S21 of the frame 3 in the thickness direction. The reinforcing part 4 is made of metal. Preferably, the reinforcing part 4 is made of the same metal as the conductor layer 1311 of the terminal 131. When the reinforcing part 4 and the conductor layer 1311 are made of the same metal, the reinforcing part 4 can be formed using the process of forming the conductor layer 1311.

[0075] The thickness T12 of the reinforcing part 4 is, for example, 6 μm or more, preferably 10 μm or more, and, for example, 100 μm or less, preferably 60 μm or less.

[0076] When the thickness T11 of the frame 3 is taken as 100%, the thickness T12 of the reinforcing part 4 is, for example, 50% or more, preferably 80% or more, more preferably 100% or more, and, for example, 300% or less, preferably 250% or less.

[0077] When the thickness T12 of the reinforcing portion 4 is equal to or greater than the above lower limit value with the thickness T11 of the frame 3 being 100%, the strength of the edge of the through hole 31 can be further improved.

[0078] The inner surface IS1 of the through hole 41 may be separated from the inner surface IS2 of the through hole 31. The distance between the inner surface IS1 of the through hole 41 and the inner surface IS2 of the through hole 31 is, for example, less than 5 μm, preferably 3 μm or less, more preferably 1 μm or less, and even more preferably 0 μm. In other words, the inner surface IS1 of the through hole 41 is preferably flush with the inner surface IS2 of the through hole 31.

[0079] 2. Method for manufacturing the aggregate sheet Next, the method for manufacturing the above-described aggregate sheet 1 will be described.

[0080] In the present embodiment, the aggregate sheet 1 is manufactured by a semi-additive method. The aggregate sheet 1 may be manufactured by an additive method. The manufacturing method of the aggregate sheet 1 includes a pattern process (see FIGS. 3A to 3C), a cutting process (see FIG. 4A), and a plating process (see FIG. 4B).

[0081] (1) Pattern process As shown in FIGS. 3A to 3C, in the pattern process, on one surface S31 of the metal foil M drawn from the first roll R1 (not shown) which is a roll of the metal foil, a base insulating layer 12 (see FIG. 3A) and a conductor pattern 13 (see FIG. 3B) are formed, a reinforcing portion 4 (see FIG. 3B) is formed on one surface S31 of the metal foil M, and a through hole 31 (see FIG. 3C) is formed in the metal foil M to manufacture a second roll R2 (see FIG. 4A) having a plurality of aggregate sheets 1. During the pattern process, the metal foil M is stretched between the first roll R1 and the second roll R2.

[0082] Specifically, to form the base insulating layer 12, first, a solution (varnish) of a photosensitive resin is applied to one surface S31 of the metal foil M and dried to form a coating film of the photosensitive resin. Next, the coating film of the photosensitive resin is exposed and developed.

[0083] As a result, as shown in FIG. 3A, the base insulating layer 12 is formed on one surface S31 of the metal foil M.

[0084] The conductor pattern 13 and the reinforcing portion 4 are formed by electrolytic plating.

[0085] To form the conductor pattern 13 and the reinforcing portion 4 by electrolytic plating, first, a seed layer is formed on one surface S11 of the base insulating layer 12 and on one surface S31 of the metal foil M. The seed layer is formed, for example, by sputtering. Examples of the material of the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0086] Next, a plating resist is bonded to one surface S11 of the base insulating layer 12 and to one surface S31 of the metal foil M.

[0087] Next, the plating resist is exposed in a state where the portions where the conductor layer 1311 (see FIG. 2A), the wiring 133 (see FIG. 2B), and the reinforcing portion 4 (see FIG. 2A) are formed are shielded from light.

[0088] Next, the exposed plating resist is developed. Then, the plating resist in the shielded portion is removed, and the seed layer is exposed in the portions where the conductor layer 1311, the wiring 133, and the reinforcing portion 4 are formed. Note that the plating resist in the exposed portion, that is, the portion where the conductor layer 1311, the wiring 133, and the reinforcing portion 4 are not formed, remains.

[0089] Next, the conductor layer 1311, the wiring 133, and the reinforcing portion 4 are formed by electrolytic plating on the exposed seed layer. After the electrolytic plating is completed, the plating resist is peeled off. Then, the seed layer covered by the plating resist is removed by etching.

[0090] As a result, as shown in FIG. 3B, the conductor layer 1311 and the wiring 133 are formed on one surface S11 of the base insulating layer 12, and the reinforcing portion 4 is formed on one surface S31 of the metal foil M.

[0091] Next, in the same manner as the formation of the base insulating layer 12, a cover insulating layer 14 (see FIGS. 1 and 2B) is formed on the base insulating layer 12 and the conductor pattern 13.

[0092] Next, as shown in FIG. 3C, the metal foil M is etched to form the through holes 31. Also, notches 5 are formed between the frame 3 and the wiring circuit board 2, and between the two wiring circuit boards 2.

[0093] Thus, the second roll R2 having a plurality of aggregate sheets 1 is manufactured.

[0094] (2) Cutting process Next, after the patterning process, a cutting process is performed.

[0095] As shown in FIG. 4A, in the cutting process, each of the plurality of aggregate sheets 1 is cut from the second roll R2. Specifically, the aggregate sheet 1 fed out from the second roll R2 is cut out with a cutter. The cutting method is not limited. Thereby, a plurality of aggregate sheets 1 independent of each other are obtained.

[0096] (3) Plating process Next, after the cutting process, a plating process is performed.

[0097] In the plating process, the conductor layers 1311 of all the terminals 131 of the cut aggregate sheet 1 and the conductor layers 1311 of all the terminals 132 are plated. In the plating process, the conductor layer 1311 is plated by electroless plating. Thereby, a plating layer 1312 (see FIG. 2A) is formed on the surface of the conductor layer 1311.

[0098] Specifically, as shown in FIG. 4B, the cut aggregate sheets 1 are put together in a plurality and placed in a basket B, and the basket B is immersed in a plating solution.

[0099] At this time, the aggregate sheet 1 is suspended in the basket B. In the present embodiment, the aggregate sheet 1 is suspended in the basket B with the bar B1 inserted through the through hole 31A, the bar B2 inserted through the through hole 31B, the bar B3 inserted through the through hole 31C, and the bar B4 inserted through the through hole 31D. That is, the through hole 31 receives the bar as a tool for suspending the cut aggregate sheet 1 in the plating process. Thereby, the handleability of the cut aggregate sheet 1 can be improved. Further, the aggregate sheet 1 is suspended in the basket B with the movement of the four corners C1, C2, C3, and C4 restricted. Therefore, it is possible to suppress the aggregate sheet 1 from being wrinkled during the plating process.

[0100] In addition, since the edge of the through hole 31 is reinforced by the reinforcing portion 4, it is possible to suppress the frame 3 from being broken starting from the through hole 31, and the aggregate sheet 1 can be stably suspended in the basket B.

[0101] 3. Operational Effects (1) According to the aggregate sheet 1, as shown in FIGS. 1 and 2A, it is possible to reinforce the edge of the through hole 31 and suppress the frame 3 from being broken starting from the through hole 31.

[0102] (2) According to the aggregate sheet 1, the frame 3 is made of a metal foil having a thickness of 50 μm or less, and the thickness of the reinforcing portion 4 is 6 μm or more.

[0103] Therefore, when the frame 3 made of a thin metal foil is provided, it is possible to reinforce the edge of the through hole 31.

[0104] (3) According to the aggregate sheet 1, as shown in FIG. 2A, the inner surface IS1 of the through hole 41 of the reinforcing portion 4 is flush with the inner surface IS2 of the through hole 31.

[0105] Therefore, the edge of the through hole 41 can be intensively reinforced.

[0106] (4) According to the aggregate sheet 1, as shown in FIG. 4B, the aggregate sheet 1 can be suspended, for example, inside the basket B. In the state where the aggregate sheet 1 is suspended inside the basket B, the through-hole 4A receives the bar B1 for suspending the aggregate sheet 1, the through-hole 4B receives the bar B2 for suspending the aggregate sheet 1, the through-hole 4C receives the bar B3 for suspending the aggregate sheet 1, and the through-hole 4D receives the bar B4 for suspending the aggregate sheet 1.

[0107] Thereby, the aggregate sheet 1 can be handled in a state of being suspended by the bars B1, B2, B3, and B4.

[0108] As a result, the handleability of the aggregate sheet 1 can be improved.

[0109] (5) According to the manufacturing method of the aggregate sheet 1, as shown in FIGS. 3B and 3C, the reinforcing portion 4 and the through-hole 31 can be formed while the metal foil M is stretched between the first roll R1 and the second roll R2.

[0110] And, as shown in FIG. 4B, the cut aggregate sheet 1 can be handled in a state of being suspended by the bars B1, B2, B3, and B4.

[0111] As a result, the handleability of the cut aggregate sheet 1 can be improved.

[0112] (6) According to the manufacturing method of the aggregate sheet 1, as shown in FIG. 4B, in the plating process, the terminals 131 and 132 of the cut aggregate sheet 1 are plated.

[0113] Here, in the plating process, the cut aggregate sheet 1 can be immersed in the plating solution in a state of being suspended by the bars B1, B2, B3, and B4.

[0114] Therefore, in the plating process, the handleability of the cut aggregate sheet 1 can be improved.

[0115] 4. Modification Example Next, with reference to FIGS. 5 to 16, a modification example will be described. In the modification example, the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0116] (1) If the reinforcing portion 4 is disposed at least at the edge of the through hole 31 and the configuration used in the manufacture of the wiring circuit board 2 can be avoided, the shape of the reinforcing portion 4 is not limited.

[0117] For example, as shown in FIG. 5, the reinforcing portion 20 may have a frame shape.

[0118] Specifically, the reinforcing portion 20 includes a first reinforcing portion 20A, a second reinforcing portion 20B, a third reinforcing portion 20C, and a fourth reinforcing portion 20D.

[0119] The first reinforcing portion 20A is disposed on the first frame 3A. The first reinforcing portion 20A reinforces the first frame 3A. The first reinforcing portion 20A extends in the second direction. In other words, the first reinforcing portion 20A extends in the direction in which the first frame 3A extends.

[0120] The second reinforcing portion 20B is disposed on the second frame 3B. The second reinforcing portion 20B reinforces the second frame 3B. The second reinforcing portion 20B extends in the second direction. In other words, the second reinforcing portion 20B extends in the direction in which the second frame 3B extends.

[0121] The third reinforcing portion 20C is disposed on the third frame 3C. The third reinforcing portion 20C reinforces the third frame 3C. The third reinforcing portion 20C extends in the first direction. In other words, the third reinforcing portion 20C extends in the direction in which the third frame 3C extends. One end portion of the third reinforcing portion 20C in the first direction is connected to one end portion of the first reinforcing portion 20A in the second direction at the corner C11 of the reinforcing portion 20. The other end portion of the third reinforcing portion 20C in the first direction is connected to one end portion of the second reinforcing portion 20B in the second direction at the corner C12 of the reinforcing portion 20.

[0122] The fourth reinforcing part 20D is disposed on the fourth frame 3D. The fourth reinforcing part 20D reinforces the fourth frame 3D. The fourth reinforcing part 20D extends in the first direction. In other words, the fourth reinforcing part 20D extends in the direction in which the fourth frame 3D extends. One end of the fourth reinforcing part 20D in the first direction is connected to the other end of the first reinforcing part 20A in the second direction at the corner C13 of the reinforcing part 20. The other end of the fourth reinforcing part 20D in the first direction is connected to the other end of the second reinforcing part 20B in the second direction at the corner C14 of the reinforcing part 20.

[0123] The corner C11 of the reinforcing part 20 is disposed at the edge of the through hole 31A. The corner C12 of the reinforcing part 20 is disposed at the edge of the through hole 31B. The corner C13 of the reinforcing part 20 is disposed at the edge of the through hole 31C. The corner C14 of the reinforcing part 20 is disposed at the edge of the through hole 31D.

[0124] The reinforcing part 20 has through holes 201A, 201B, 201C, and 201D. The through hole 201A is disposed at the corner C11 of the reinforcing part 20. The through hole 201A communicates with the through hole 31A. The through hole 201B is disposed at the corner C12 of the reinforcing part 20. The through hole 201B communicates with the through hole 31B. The through hole 201C is disposed at the corner C13 of the reinforcing part 20. The through hole 201C communicates with the through hole 31C. The through hole 201D is disposed at the corner C14 of the reinforcing part 20. The through hole 201D communicates with the through hole 31D.

[0125] (2) As shown in FIG. 6, the frame 3 may be between the two wiring circuit boards 2. In this case, the reinforcing part 20 may also be provided on the frame 3 between the two wiring circuit boards 2.

[0126] (3) As shown in FIG. 7A, in the patterning process, a reinforcing part 4 having no through hole 41 is formed on the metal foil M, and as shown in FIG. 7B, when the metal foil M is etched, the reinforcing part 4 may also be etched to form the through hole 31 and the through hole 41.

[0127] (4) As shown in FIG. 8A, in the patterning process, a reinforcing portion 4 without a through hole 41 is formed on the metal foil M. As shown in FIG. 8B, the metal foil M is etched. Then, as shown in FIG. 8C, the through hole 31 and the through hole 41 may be formed by punching the reinforcing portion 4 and the metal foil M.

[0128] (5) As shown in FIGS. 9A and 9B, in the patterning process, the reinforcing portion 4 is not formed. As shown in FIG. 9C, when the metal foil M is etched, the through hole 31 is formed. Then, as shown in FIG. 9D, the reinforcing portion 4 may be formed at the edge of the through hole 31 and inside the through hole 31 by electrolytic plating.

[0129] (6) As shown in FIG. 10, in the modification of the above (5), the reinforcing portion 4 may be formed on both sides of the metal foil M.

[0130] (7) As shown in FIG. 11, the reinforcing portion 30 may be disposed on the other surface S22 of the frame 3 in the thickness direction.

[0131] (8) As shown in FIG. 12, the aggregate sheet 1 may include a reinforcing portion 4 disposed on one surface S21 of the frame 3 in the thickness direction and a reinforcing portion 40 disposed on the other surface S22 of the frame 3 in the thickness direction. The reinforcing portion 40 may be made of the same metal as the reinforcing portion 4. The reinforcing portion 40 has a through hole 401. The through hole 401 communicates with the through hole 31. The inner surface IS3 of the through hole 401 is preferably flush with the inner surface IS2 of the through hole 31.

[0132] According to such a configuration, the reinforcing portions (the reinforcing portion 4 and the reinforcing portion 40) can be provided on both surfaces of the frame 3.

[0133] As a result, the frame 3 can be reinforced more effectively.

[0134] (9) As shown in FIG. 13, the reinforcing portion 50 may include a first layer 501 made of the same resin as the base insulating layer 12 and a second layer 502 made of the same metal as the conductor layer 1311. The first layer 501 is disposed on one surface S21 of the frame 3. The second layer 502 is disposed on the first layer 501.

[0135] Further, the reinforcing portion 50 may include a third layer 503 made of the same resin as the cover insulating layer 14. The third layer 503 is disposed on the second layer 502.

[0136] (10) As shown in FIG. 14A, the reinforcing portion 60 may include a first layer 601 made of metal and a second layer 602 made of metal.

[0137] As shown in FIG. 14B, the wiring 133 may include a first conductor layer 1331 and a second conductor layer 1332. The first conductor layer 1331 is disposed on one surface S11 of the base insulating layer 12 in the thickness direction. The first conductor layer 1331 may be made of the same metal as the conductor layer 1311 of the terminal 131. The second conductor layer 1332 is disposed on the first conductor layer 1331 in the thickness direction. At least a part of the second conductor layer 1332 is in contact with the first conductor layer 1331. In other words, the second conductor layer 1332 is electrically connected to the first conductor layer .....

[0138] In this case, the first layer .....

[0139] According to such a configuration, the reinforcing portion 60 can be formed by using the process of forming the first conductor layer 1331 and the process of forming the second conductor layer 1332.

[0140] Therefore, it is possible to improve the degree of freedom in the design of the conductor pattern 13 and form the reinforcing portion 60 while suppressing an increase in the number of man-hours.

[0141] As shown in FIG. 15B, the conductor pattern 13 may have a first wiring 71 and a second wiring 72. The aggregate sheet 1 may have an intermediate insulating layer 73.

[0142] The first wiring 71 is disposed on the base insulating layer 12. The first wiring 71 is formed by electrolytic plating, similarly to the wiring 133 described above.

[0143] The second wiring 72 is disposed apart from the first wiring 71. In other words, the second wiring 72 is not electrically connected to the first wiring 71. The second wiring 72 is disposed on the intermediate insulating layer 73. The second wiring 72 is formed by electrolytic plating, similarly to the wiring 133 described above.

[0144] The intermediate insulating layer 73 is disposed between the first wiring 71 and the second wiring 72. The intermediate insulating layer 73 insulates between the first wiring 71 and the second wiring 72. The intermediate insulating layer 73 is formed on the first wiring 71 and the base insulating layer 12 in the same manner as the base insulating layer 12.

[0145] In this case, the first layer 601 (see FIG. 15A) of the reinforcing portion 60 may be made of the same metal as the first wiring 71. The second layer 602 (see FIG. 15A) may be made of the same metal as the second wiring 72.

[0146] According to such a configuration, the reinforcing portion 60 can be formed by using the process of forming the first wiring 71 and the process of forming the second wiring 72.

[0147] Therefore, it is possible to improve the degree of freedom in the design of the conductor pattern 13, and to form the reinforcing portion 60 while suppressing an increase in man-hours.

[0148] (12) As shown in FIG. 16, the terminal 131 or the terminal 132 may further have a second conductor layer 1313 disposed on the conductor layer 1311.

[0149] In this case, the first layer 601 of the reinforcing portion 60 may be made of the same metal as the conductor layer 1311. The second layer 602 may be made of the same metal as the second conductor layer 1313.

[0150] (13) The above-described embodiments and each modification can be combined with each other.

Explanation of Reference Numerals

[0151] 1 Aggregate sheet 2 Wiring circuit board 3 Frame 31 Through hole 4 Reinforcing portion 41 Through hole 11 Support layer S1 One surface of the support layer 12 Base insulating layer S11 One surface of the base insulating layer 13 Conductor pattern 131 Terminal 132 Terminal M Metal foil R1 First roll R2 Second roll

Claims

1. A wiring circuit board having a support layer, an insulating layer disposed on one surface of the support layer in the thickness direction, and a conductor pattern disposed on one surface of the insulating layer in the thickness direction, a frame for supporting the wiring circuit board, the frame having a through hole, and a reinforcing portion disposed at an edge of the through hole for reinforcing the edge of the through hole. An aggregate sheet comprising the same.

2. The frame is made of a metal foil having a thickness of 50 μm or less, The thickness of the reinforcing portion is 6 μm or more. The aggregate sheet according to claim 1.

3. When the thickness of the frame is taken as 100%, the thickness of the reinforcing portion is 50% or more. The aggregate sheet according to claim 2.

4. The reinforcing portion has a second through hole communicating with the through hole, The inner surface of the second through hole is flush with the inner surface of the through hole. The aggregate sheet according to any one of claims 1 to 3.

5. The through hole is capable of receiving an instrument for suspending the aggregate sheet. The aggregate sheet according to any one of claims 1 to 4.

6. A method for manufacturing the aggregate sheet according to any one of claims 1 to 5, forming the insulating layer and the conductor pattern on one surface of the metal foil drawn from a first roll which is a roll of metal foil, forming the reinforcing portion on one surface of the metal foil, forming the through hole in the metal foil, and manufacturing a second roll having a plurality of the aggregate sheets, a pattern step; a cutting step of cutting each of the plurality of aggregate sheets from the second roll; including, The through hole receives an instrument for suspending the cut aggregate sheet. A method for manufacturing an aggregate sheet.

7. Further including a plating step of plating terminals of the conductor pattern, The through hole receives the instrument in the plating step. The method for manufacturing an aggregate sheet according to claim 6.

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