Valve device, fluid control device, fluid control method, semiconductor manufacturing device, and semiconductor manufacturing method

The valve device addresses assembly challenges and damage risks by using an annular protrusion in the valve chamber to ensure proper disk positioning and Cv value, improving fluid flow efficiency and durability.

JP7716778B2Active Publication Date: 2025-08-01FUJIKIN INC
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Patent Information

Application Number
JP2023549380
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-09-27
Filing Date
2022-06-30
Publication Date
2025-08-01
Estimated Expiration
2042-06-30

AI Technical Summary

Technical Problem

The existing valve devices in semiconductor manufacturing face issues with assembly difficulty, compromised Cv values, and risk of damage due to improper contact between the disk seal and valve chamber, leading to reduced fluid flow efficiency.

Method used

The valve device incorporates a valve chamber with an annular protrusion on its bottom surface to facilitate easier assembly of the inner disk at a predetermined position, ensuring a specified gap and reducing the risk of damage by allowing the lower sheet to be plastically deformed and crushed, thus securing the Cv value.

Benefits of technology

The solution enables easier assembly, maintains a stable Cv value, and reduces the risk of inner disk breakage, enhancing fluid flow efficiency and durability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention addresses the problem of providing a valve device, and the like, comprising an inner disc that can be easily assembled, thus ensuring an adequate Cv value and reducing the risk of damage. The present invention comprises: a valve body 10 that includes fluid passages 11, 12 and a valve chamber 13; an inner disc 20 that has an inner annular part 22 disposed around a first opening 15, an outer annular part 21, and a connection part 23; a diaphragm 33 that blocks and connects the flow path by coming into contact with and separating from an annular upper sheet 26 disposed on the upper end of the inner annular part 22, the lower surface of the diaphragm 33 being in contact with the upper surface of the outer annular part 21, and that is disposed while being pressed by a pressing adapter 30 which presses an upper surface peripheral section of the diaphragm 33 downward from above; and an annular lower sheet that is disposed on the lower end of the inner annular part 22 and is in close contact with a valve chamber bottom surface that is the bottom surface of the valve chamber 13. An annular valve chamber bottom surface protruding section 14a that protrudes upward is in close contact with a portion of a lower sheet lower end face 25a that is the lower end face of the lower sheet 25.
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Description

Technical Field

[0001] The present invention relates to a valve device, a fluid control device, a fluid control method, a semiconductor manufacturing device, and a semiconductor manufacturing method.

Background Art

[0002] For example, in a semiconductor manufacturing process, a valve device for controlling the supply of various process gases is used for a chamber of a semiconductor manufacturing device. The invention described in Patent Document 1 mainly relates to a direct touch type metal diaphragm valve used in a gas supply system or the like of semiconductor manufacturing equipment. As shown in FIG. 9, the valve body 101 of the metal diaphragm valve 100 has a fluid inlet 110, a fluid outlet 111, a valve seat 113, and a metal diaphragm 102. The valve seat 113 is disposed in an annular groove formed in the valve body 101. The fluid enters from the fluid inlet 110, passes through the valve chamber 112 from the lower surface side of the metal diaphragm 102, and exits from the fluid outlet 111.

[0003] The invention described in Patent Document 2 also mainly relates to a diaphragm valve used in a gas supply system or the like of semiconductor manufacturing equipment. As shown in FIG. 10, the valve body 202 of the valve device 200 includes a first flow path 221, a second flow path 222, and a valve chamber 223. An inner disk 203 is disposed in the valve chamber 223. The inner disk 203 includes an inner annular portion 232 and an outer annular portion 231. A valve seat 248 that contacts and separates from the diaphragm 241 is disposed at the upper end portion of the inner annular portion 232, and a disk seal 249 that is in close contact with the bottom surface of the valve chamber 223 is disposed at the lower end portion of the inner annular portion 232.

[0004] The valve device 200 described in Patent Document 2 is provided with a replaceable inner disk 203 that is not present in the metal diaphragm valve 100 described in Patent Document 1. Therefore, unlike the metal diaphragm valve 100 described in Patent Document 1, it is not necessary to form a groove for arranging the valve seat 113 in the valve body 202, which has the advantage of easy processing. Further, in the metal diaphragm valve 100 described in Patent Document 1, when the valve seat 113 or the like is worn out, additional processing of the valve body 101 has to be performed for replacement or the like. In contrast, in the valve device 200 described in Patent Document 2, the inner disk 203 can be taken out and repaired or replaced, which has the advantage of easy maintenance.

[0005] Furthermore, the valve chamber 223 of the valve device 200 described in Patent Document 2 is formed deeper in the vertical direction than the valve chamber 112 of the metal diaphragm valve 100 described in Patent Document 1. Due to this difference, the valve device 200 described in Patent Document 2 can process a large volume of fluid.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0007] In the valve device 200 of Patent Document 2 in FIG. 10, the bonnet 205 is screwed into the screw hole 225 to press the presser adapter 243 from above. The presser adapter 243 presses the periphery of the diaphragm 241 from above. The periphery of the diaphragm 241 presses the outer annular portion 231 from above. The force is transmitted to the inner annular portion 232, and the disk seal 249 is crushed against the bottom surface of the valve chamber 223 from above, and the inner disk 203 is arranged at a predetermined position.

[0008] However, in the valve device 200 of Patent Document 2, since the contact between the bottom surface of the disk seal 249 and the bottom surface of the valve chamber 223 is a contact between flat surfaces, there is a problem that even when the bonnet 205 is tightened, the disk seal 249 is not completely crushed and the inner disk 203 cannot descend to the designed position. If the inner disk 203 cannot descend to the designed position, the gap between the valve seat 248 and the diaphragm 241 becomes small, resulting in a problem that the Cv value becomes small. Here, the Cv value is an index indicating the ease of flow of a fluid such as gas in an on-off valve.

[0009] In addition, a repulsive force from the disk seal 249 acts upward on the inner annular portion 232, and a force from the bonnet 205 acts downward on the outer annular portion 231 from above. Therefore, an excessive force may be applied to the portion connecting the inner annular portion 232 and the outer annular portion 231, causing damage. In order to prevent damage, if the diameter of the hole opening in this connecting portion is reduced, a new problem arises that the Cv value becomes small.

[0010] The present invention has been made in view of such points, and an object thereof is to provide a valve device or the like including an inner disk that is easy to assemble at a predetermined position, secures the Cv value, and has little risk of damage.

Means for Solving the Problems

[0011] The present invention (1) includes a valve body that forms a first flow path and a second flow path, which are fluid passages, and a valve chamber that communicates with the first flow path and the second flow path, an inner annular portion disposed around a first opening that opens into the valve chamber at an edge of the first flow path, an outer annular portion disposed on an outer peripheral side of the inner annular portion, and an inner disk having a plurality of second openings that communicate with the second flow path and a connecting portion that connects the inner annular portion and the outer annular portion, a diaphragm that shuts off and communicates the first flow path and the second flow path by contacting and separating from an annular upper sheet disposed at an upper end portion of the inner annular portion, and is press-fitted by a pressing adapter that presses a peripheral portion of an upper surface downward from above so that a peripheral edge portion of a lower surface thereof contacts an upper surface of the outer annular portion, and an annular lower sheet disposed at a lower end portion of the inner annular portion and in close contact with a valve chamber bottom surface that is a bottom surface of the valve chamber, and the valve device is such that an annular valve chamber bottom surface protruding portion that protrudes upward at a peripheral edge portion on the first opening side of the valve chamber bottom surface is in close contact with a part of a lower end surface of the lower sheet that is a lower end surface of the lower sheet.

[0012] In the present invention (1), since the valve chamber bottom surface has an annular valve chamber bottom surface protruding portion that protrudes upward at a peripheral edge portion of the first opening, and this valve chamber bottom surface protruding portion is in close contact with a part of a lower end surface of the lower sheet that is a lower end surface of the lower sheet, the area of the lower end surface of the lower sheet that receives the pressing force from above becomes small, and it is easily plastically deformed and crushed, and it becomes easy to assemble the inner disk at a predetermined position. As a result, it is possible to set the gap between the valve sheet and the diaphragm as specified, secure the Cv value, and provide a valve device including an inner disk with less risk of breakage.

[0013] The present invention (2) is the valve device of the present invention (1), in which the lower sheet is held in a lower sheet groove formed on an end surface of the inner annular portion on the valve body side.

[0014] According to the present invention (2), since the lower sheet is held in the lower sheet groove formed on the end surface of the inner annular portion on the valve body side, the lower sheet can be easily held on the inner annular portion.

[0015] The present invention (3) is a valve device of the present invention (1) or the present invention (2), in which there is a gap for accommodating the bulging portion of the lower sheet generated when the diaphragm is pressed and arranged by the pressing adapter between the upper surface of the protruding portion on the bottom surface of the valve chamber and the lower end surface of the inner annular portion.

[0016] According to the present invention (3), there is a gap for accommodating the bulging portion of the lower sheet generated when the diaphragm is pressed and arranged by the pressing adapter between the upper surface of the protruding portion on the bottom surface of the valve chamber and the lower end surface of the inner annular portion. Therefore, the lower sheet is more likely to be crushed, so it is easier to assemble the inner disk at a predetermined position, more likely to ensure the Cv value, and a valve device with an inner disk having less risk of breakage can be obtained.

[0017] The present invention (4) is a fluid control device in which a plurality of fluid devices are arranged from the upstream side to the downstream side, and the plurality of fluid devices include the valve device of any one of the present inventions (1) to (3).

[0018] The present invention (5) is a flow rate control method for adjusting the flow rate of a fluid by using the valve device of any one of the present inventions (1) to (3).

[0019] The present invention (6) is a semiconductor manufacturing apparatus that uses the valve device of any one of the present inventions (1) to (3) for controlling the process gas in the manufacturing process of a semiconductor device that requires a processing step by a process gas in a sealed chamber.

[0020] The present invention (7) is a semiconductor manufacturing method that uses the valve device of any one of the present inventions (1) to (3) for controlling the flow rate of the process gas in the manufacturing process of a semiconductor device that requires a processing step by a process gas in a sealed chamber.

Effects of the Invention

[0021] According to the present invention, by making it easy to assemble the inner disk at a predetermined position, it is possible to provide a valve device or the like including an inner disk that ensures a Cv value and has a low risk of breakage.

Brief Description of the Drawings

[0022]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the following embodiments are essentially preferred examples and are not intended to limit the scope of the present invention, its applications, or its uses.

[0024] Figure 1 is a partial cross-sectional view of a valve device according to an embodiment of the present invention. Before explaining this valve device, the explanations of FIGS. 2 and 3 will be given. FIG. 2 schematically shows the differences in valve bodies of Patent Document 1 (A), Patent Document 2 (B), and the present invention (C), and explains the differences in valve bodies.

[0025] FIG. 2(A) shows the valve body 101 of the metal diaphragm 100 of Patent Document 1. The fluid inlet 110 and the fluid outlet 111 communicate with each other in the valve chamber 112. FIG. 2(B) shows the valve body 202 of the valve device 200 of Patent Document 2. The first flow path 221 and the second flow path 222 communicate with each other in the valve chamber 223. The valve chamber 223 in FIG. 2(B) is enlarged in the vertical direction compared to the valve chamber 112 in FIG. 2(A). In the case of FIG. 2(A), the passage of the fluid outlet 111 communicates with the valve chamber 112 from bottom to top, while in the case of FIG. 2(B), the second passage 222 communicates directly with the valve chamber 223 from the lateral direction. Due to this difference in structure, the valve device 200 can flow more fluid than the metal diaphragm 100, and the Cv value can also be made larger.

[0026] The valve device 1 in FIG. 2(C) shows the valve body 10 of an embodiment of the present invention. The first flow path 11, the second flow path 12, and the valve chamber 13 are formed inside. The difference between FIG. 2(C) and FIG. 2(B) is that in FIG. 2(B), the bottom surface of the valve chamber 223 is flat, while in FIG. 2(C), around the opening of the first flow path 11 protrudes at the bottom surface of the valve chamber 12. This is one of the characteristic parts of the present invention.

[0027] FIG. 3 is a perspective view of the inner disk 20, and this inner disk 20 is disposed in the valve chamber 13. The inner disk 20 includes an outer annular portion 21, an inner annular portion 22, and a connecting portion 23 that connects the outer annular portion 21 and the inner annular portion 22. An upper sheet groove 22a for accommodating the upper sheet 26 (see FIG. 1) is formed at the upper end portion of the inner annular portion 22. Four second openings 24 are formed in the outer annular portion 23. Through this second opening 24, the fluid flows out into the second flow path 24 (see FIG. 1).

[0028] Next, the entire valve device 1 in Fig. 1 will be described. In the valve body 10, a first flow path 11, a second flow path 12, and a valve chamber 13 are formed, and a bonnet portion 16 is formed on the upper part with a recess inside. In the valve chamber 13, the inner disk 20 described in Fig. 3 above is arranged. An upper sheet 26 is disposed above the inner annular portion 22, and a lower sheet 25 is disposed below it. The lower sheet 25 is in close contact with the bottom surface 14 of the valve chamber. There is a first opening 15 on the bottom surface 14 of the valve chamber, which communicates with the valve chamber 13. After the inner disk 20 is arranged, the fluid passes through the first opening 15 and enters the inside of the inner annular portion 22. A second opening 24 is formed in the connecting portion 23. A diaphragm 33 pressed by a press adapter 30 is disposed on the upper sheet 26.

[0029] Above the bonnet 16, an actuator having a lower casing 50 and an upper casing 60 as a housing is arranged. The actuator is composed of a spring coil 61, a first piston 65, a bulkhead 72, a second piston 69, and a stem 38. The operating gas introduced from the operating gas supply port 62 moves the stem 38 up and down through the operating gas passage 64. The upper casing 60 and the lower casing 50 are connected by screwing the female thread 71 at the lower part of the upper casing and the male thread 51 of the lower casing. Many O-rings 63, 66, 67, 68, 70, 52 are arranged to maintain airtightness.

[0030] In the lower recess of the lower casing 50, a stroke increasing mechanism composed of a lid 40, a tapering 39, and a ball 37 is provided. The valve body 10 and the actuator are connected by a nut 34. The female thread 35 at the lower part of the nut is screwed with the male thread 17 at the upper part of the bonnet portion. The male thread 43 at the upper part of the bonnet is screwed with the female thread 53 of the lower casing. By screwing the nut 34, the press adapter 30 presses the periphery of the diaphragm 33 and fixes the diaphragm 33 between it and the outer annular portion 21. The male thread 41 of the lid is screwed with the female thread 42 at the upper part of the nut.

[0031] The tip tapered portion of the stem 38 presses the disk 36 downward, the disk 36 presses the diaphragm retainer 32 downward, presses the diaphragm 33 to deform it and brings it into contact with the upper sheet 26 to block the fluid flow. When the stem 38 moves upward, it opens and the fluid flows.

[0032] FIG. 4 shows a partial cross-sectional view of the lower end portion of the inner annular portion 22. An annular lower sheet groove 22b for holding the lower sheet 25 is formed on the lower end surface. The position of the outer lower end surface 22d, which is the lower end surface outside the lower sheet groove 22b, is lower than the position of the inner lower end surface 22e, which is the inner lower end surface. This is because, after inserting the lower sheet 25, the outer peripheral side lower end portion of the inner annular portion 22 is bent inward using the cut 22c in order to crimp it inward from the outer peripheral side of the inner annular portion 22 so that the lower sheet 25 does not come off. Note that the upper end portion of the inner annular portion 22 has a structure substantially the same as that of the lower end portion, and the upper sheet 26 is fixed by crimping it into the upper sheet groove.

[0033] FIG. 5 shows a partial cross-sectional view of the lower end portion of the inner annular portion 22 with the lower sheet 25 attached when the inner disk 20 is disposed at a predetermined position. The outer peripheral side lower end portion of the inner annular portion 22 is crimped inward using the cut 22c. Due to the pressing force from above by the press adapter 30 (see FIG. 1), the lower sheet 25 abuts against the upper surface of the valve chamber bottom protrusion upper surface 14b of the valve chamber bottom protrusion 14a on the first opening 15 side that opens to the valve chamber bottom surface 14 of the valve chamber 13 formed in the valve body 10. Therefore, as shown in the figure, the lower end surface 25a of the lower sheet, which was originally flat, has a step and is in a crushed state, and the inner disk 20 can be easily disposed at a predetermined position. By easily disposing the inner disk 20 at a predetermined position, a valve device is provided that ensures a Cv value and has an inner disk with a low risk of damage.

[0034] There is a gap 22f between the inner lower end surface 22e and the upper surface 14b of the valve chamber bottom surface protrusion. Since the plastically deformed and bulged inner bulge 25b enters this gap 22f, the lower sheet 25 is more likely to be crushed, making it easier to assemble the inner disk 20 into a predetermined position, ensuring a more secure Cv value, and enabling the valve device 1 to be provided with an inner disk 20 that is less likely to be damaged.

[0035] Figure 6 is an actual cut-away photograph of the lower end of the inner annular portion 22 to which the lower sheet 25 is attached when the inner disk 20 is arranged at a predetermined position. It can be seen that a distinct step is formed at the boundary between the pressed portion and the non-pressed portion on the lower end surface 25a of the lower sheet. It is also clearly visible that the lower sheet 25 bulges on the side of the first opening 15 (see Figure 1) and an inner bulge 25b is formed. Note that the bulge (flow of material) of the lower sheet 25 occurs inside because the contact portion between the upper surface 14b of the valve chamber bottom surface protrusion and the lower sheet 25 is inside the lower sheet 25. However, when the upper surface 14b of the valve chamber bottom surface protrusion is formed outside the illustrated example, the contact portion is on the outside of the lower sheet 25 and the bulge is also formed on the outside.

[0036] The lower sheet 25 is made of a synthetic resin, such as PFA, PA, PI, PCTFE, etc. However, when a high load is continuously applied, the resin deforms over time, and in the end, it may reach a state of damage. The portion surrounded by the dotted line in Figure 6 is the high-load region, and no load is applied to the outer portion of the lower sheet 25. For this reason, the outer portion where no load is applied is less likely to experience creep, and the progress of creep can be stopped in the outer portion, preventing the lower sheet 25 from being damaged. Without the valve chamber bottom surface protrusion 14a, the entire lower end surface 25a of the lower sheet becomes flat, and creep deformation also occurs on the outside of the lower sheet 25, increasing the likelihood of eventually reaching a state of fracture.

[0037] FIG. 7 is a schematic diagram showing an application example of the valve device according to an embodiment of the present invention to a semiconductor manufacturing process, and an application example of the valve device 1 will be described. The semiconductor manufacturing apparatus 300 shown in FIG. 7 is an apparatus for executing a semiconductor manufacturing process by ALD method, 301 is a process gas supply source, 302 is a gas box, 303 is a tank, 304 is a control unit, 305 is a processing chamber, and 306 is an exhaust pump. In the semiconductor manufacturing process by ALD method, it is necessary to precisely adjust the flow rate of the processing gas, and it is also necessary to secure a certain amount of the flow rate of the processing gas due to the increase in the diameter of the substrate. The gas box 302 is an integrated gas system (fluid control device) in which various fluid control devices such as an on-off valve, a regulator, and a mass flow controller are integrated and housed in a box in order to supply the accurately metered process gas to the processing chamber 305.

[0038] The tank 303 functions as a buffer for temporarily storing the processing gas supplied from the gas box 302. The control unit 304 executes flow rate adjustment control by controlling the supply of the operation gas to the valve device 1. The processing chamber 305 provides a sealed processing space for film formation on the substrate by ALD method. The exhaust pump 306 evacuates the inside of the processing chamber 305. According to such a system configuration, if a command for flow rate adjustment is sent from the control unit 304 to the valve device 1, the initial adjustment of the processing gas becomes possible.

[0039] FIG. 8 is a perspective view showing an example of a fluid control device using the valve device of the present embodiment, and an example of the fluid control device to which the present invention is applied will be described. The fluid control device shown in FIG. 8 is provided with a metal base plate BS arranged along the width directions W1, W2 and extending in the longitudinal directions G1, G2. Note that W1 indicates the front side, W2 indicates the back side, G1 indicates the upstream side, and G2 indicates the downstream side. A plurality of fluid devices 311A to 311E are installed on the base plate BS via a plurality of flow path blocks 312, and a flow path (not shown) through which fluid flows from the upstream side G1 to the downstream side G2 is formed by the plurality of flow path blocks 312, respectively.

[0040] Here, the "fluid device" is a device used in a fluid control device for controlling the flow of a fluid, which includes a body defining a fluid flow path and has at least two flow ports opening on the surface of the body. Specifically, it includes, but is not limited to, an on-off valve (two-way valve) 311A, a regulator 311B, a pressure gauge 311C, an on-off valve (three-way valve) 311D, a mass flow controller 311E, etc. The introduction pipe 313 is connected to the flow port on the upstream side of the flow path not shown above. The present invention is applicable to various valve devices such as the above on-off valves 311A, 311D, and regulator 311B.

Industrial Applicability

[0041] As described above, the valve device of the present invention can provide a valve device etc. that secures a Cv value and has an inner disk with a low risk of breakage by making it easy to assemble the inner disk at a predetermined position, and can also be suitably used in fluid control devices and semiconductor manufacturing devices.

Explanation of Reference Numerals

[0042] 1 Valve device 10 Valve body 11 First flow path 12 Second flow path 13 Valve chamber 14 Valve chamber bottom surface 14a Valve chamber bottom surface protrusion 14b Upper surface of valve chamber bottom surface protrusion 15 First opening 16 Bonnet part 17 Male screw on the upper part of the bonnet part 20 Inner disk 21 Outer annular part 22 Inner annular part 22a Groove for upper sheet 22b Groove for lower sheet 22c Notch 22d Outer lower end surface 22e Inner lower end surface 22f Gap 23 Connection part 24 Second opening 25 Lower sheet 25a Lower end face of the lower sheet 25b Inner bulging portion 26 Upper sheet 30 Pressing adapter 32 Diaphragm presser 33 Diaphragm 34 Nut 35 Female thread at the lower part of the nut 36 Disk 37 Ball 38 Stem 39 Taper 40 Lid 41 Male thread of the lid 42 Female thread at the upper part of the nut 43 Male thread at the upper part of the nut 50 Lower casing 51 Male thread at the upper part of the lower casing 52 O-ring 53 Female thread at the lower part of the lower casing 60 Upper casing 61 Spring coil 62 Operating gas supply port 63 O-ring 64 Operating gas passage 65 First piston 66, 67, 68 O-rings 69 Second piston 70 O-ring 71 Female thread at the lower part of the upper casing 72 Bulkhead 300 Semiconductor manufacturing apparatus 301 Process gas supply source 302 Gas box 303 Tank 304 Control unit 305 Processing chamber 306 Exhaust pump 311A On-off valve (two-way valve) 311B Regulator 311C Pressure gauge 311D On-off valve (three-way valve) 311E Mass Flow Controller 312 Flow Path Block 313 Inlet Pipe

Claims

1. A valve body that forms a first flow path and a second flow path that are fluid passageways, and a valve chamber that communicates with the first flow path and the second flow path, An inner annular portion disposed around a first opening that opens into the valve chamber at an edge of the first flow path, an outer annular portion disposed on an outer peripheral side of the inner annular portion, and a plurality of second openings that communicate with the second flow path, and an inner disk having a connecting portion that connects the inner annular portion and the outer annular portion, A diaphragm that shuts off and communicates the first flow path and the second flow path by contacting and separating from an annular upper sheet disposed at an upper end portion of the inner annular portion, and is pressed and disposed by a pressing adapter whose lower surface peripheral portion contacts the upper surface of the outer annular portion and presses the upper surface peripheral portion from above downward, An annular lower sheet disposed at a lower end portion of the inner annular portion and in close contact with a valve chamber bottom surface that is a bottom surface of the valve chamber, An annular valve chamber bottom surface protruding portion that protrudes upward at a peripheral portion on the first opening side of the valve chamber bottom surface is in close contact with a part of a lower sheet lower end surface that is a lower end surface of the lower sheet, A valve device having a gap between an upper surface of the valve chamber bottom surface protruding portion and a lower end surface of the inner annular portion to accommodate a bulging portion of the lower sheet generated when the diaphragm is pressed and disposed by the pressing adapter.

2. The valve device according to claim 1, wherein the lower sheet is held in a lower sheet groove formed on an end surface of the inner annular portion on the valve body side.

3. A fluid control device in which a plurality of fluid devices are arranged from an upstream side to a downstream side, The fluid control device, wherein the plurality of fluid devices include the valve device according to claim 1 or 2.

4. A flow rate control method for adjusting the flow rate of a fluid by using the valve device according to any one of claims 1 or 2.

5. A semiconductor manufacturing apparatus that uses the valve device according to claim 1 or 2 for controlling a process gas in a manufacturing process of a semiconductor device that requires a processing step using a process gas in a sealed chamber.

6. A semiconductor manufacturing method that uses the valve device according to claim 1 or 2 for controlling the flow rate of a process gas in a manufacturing process of a semiconductor device that requires a processing step using a process gas in a sealed chamber.

Citation Information

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