Molded parts

Abstract

To provide a molding component for facilitating a soldering work and also preventing a contact between adjacent soldering parts.SOLUTION: A molding component 1 includes an inner component module 2 having a first molding part 40, soldering parts 60, and a second molding part 50. Lead wires include first lead wires 12, 13 and second lead wires 22, 23. The first molding part 40 includes a partition part 43 having a first surface I and a second surface II. The first lead wires 12, 13 include first exposure parts 12a, 13a on the first surface I, and the second lead wires 22, 23 include second exposure parts 22a, 23a on the second surface II. The first lead wires 12, 13 and the second lead wires 22, 23 are positioned without overlapping in a plane view from a direction of the first surface I or a direction of the second surface II. The soldering parts 60 include: first soldering parts 61 positioned on the first surface I; and second soldering parts 62 positioned on the second surface II.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to molded parts. [Background technology]

[0002] Vehicles such as automobiles are equipped with wheel speed sensors that measure the rotational speed of wheels. A known example of such a wheel speed sensor is the device described in Patent Document 1. The wheel speed sensor described in Patent Document 1 includes a plurality of detection element units and a holder unit that holds the plurality of detection element units. The holder unit is formed by injection molding while the detection element units are maintained in a predetermined arrangement. Furthermore, the detection element units and the holder unit are covered with a resin molded unit to form a molded body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-096828 Summary of the Invention [Problem to be solved by the invention]

[0004] In the molded part described in Patent Document 1, multiple terminals extend from the detection element portion, which is an insert when the resin molded portion is formed. Each terminal is connected to a core wire by soldering. In this case, adjacent terminals are close to each other, and the solder portions connecting each terminal to its corresponding core wire are also close to each other. When soldering in this situation, it is necessary to perform the soldering work in a way that prevents contact between adjacent solder portions, making the soldering work difficult.

[0005] Therefore, an object of the present invention is to provide a molded part that allows easy soldering and prevents contact between adjacent soldered portions. [Means for solving the problem]

[0006] The molded component of the present disclosure comprises an internal component module including at least one internal component having an electric component body and a lead wire extending from the electric component body, and a first molded portion covering a part of the internal component, an electric conductor connected to the lead wire and leading to another electric component, a solder portion connecting the lead wire and the electric conductor, and a second molded portion covering the internal component module, the electric conductor, and the solder portion, wherein the lead wire includes a first lead wire and a second lead wire, and the first molded portion comprises a partition portion including a first surface and a second surface facing in a direction opposite to the direction in which the first surface faces. The first lead wire has a first exposed portion on the first surface that is exposed from the first molded portion, and the second lead wire has a second exposed portion on the second surface that is exposed from the first molded portion, the first lead wire and the second lead wire are arranged in positions that do not overlap when viewed in a plan view from the direction in which the first surface faces or the direction in which the second surface faces, and the solder portion includes a first solder portion located on the first surface and connecting the first exposed portion and the electrical conductor, and a second solder portion located on the second surface and connecting the second exposed portion and the electrical conductor. [Effects of the Invention]

[0007] According to the present disclosure, the soldering operation is easy and contact between adjacent solder portions is prevented. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a molded part. [Figure 2] FIG. 2 is a perspective view showing the molded part excluding the second molded portion. [Figure 3] FIG. 3 is a plan view showing the molded part excluding the second molded portion. [Figure 4] FIG. 4 is a side view showing the molded part excluding the second molded portion. [Figure 5] FIG. 5 is a cross-sectional view showing the VV cross section of FIG. [Figure 6]FIG. 6 is an explanatory diagram showing a cross section perpendicular to the extending direction of the lead wires in another embodiment. [Figure 7] FIG. 7 is an explanatory diagram showing a cross section perpendicular to the extending direction of the lead wires in another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0010] The molded parts of the present disclosure are as follows:

[0011] (1) An internal component module including at least one internal component having an electrical component body and a lead wire extending from the electrical component body, and a first molding part covering a part of the internal component, an electrical conductor connected to the lead wire and leading to another electrical component, a solder part connecting the lead wire and the electrical conductor, and a second molding part covering the internal component module, the electrical conductor, and the solder part, wherein the lead wire includes a first lead wire and a second lead wire, and the first molding part includes a partition part including a first surface and a second surface facing in a direction opposite to the direction in which the first surface faces, The first lead wire has a first exposed portion on the first surface that is exposed from the first molded portion, and the second lead wire has a second exposed portion on the second surface that is exposed from the first molded portion, the first lead wire and the second lead wire are arranged in positions that do not overlap when viewed in a plane from the direction in which the first surface faces or the direction in which the second surface faces, and the solder portion includes a first solder portion located on the first surface and connecting the first exposed portion to the electrical conductor, and a second solder portion located on the second surface and connecting the second exposed portion to the electrical conductor.

[0012] Such a molded part includes a first solder portion located on the first surface and connecting the first exposed portion to the electrical conductor, and a second solder portion located on the second surface and connecting the second exposed portion to the electrical conductor, which facilitates soldering and prevents contact between adjacent solder portions, thereby preventing a short circuit between the first lead wire and the second lead wire due to contact between adjacent solder portions.

[0013] (2) In the molded part of (1), the lead wire extending from the electrical component body in the first internal part may be the first lead wire, and the lead wire extending from the electrical component body in the second internal part may be the second lead wire.

[0014] With such a molded part, the lead wire of the first internal part has a first exposed portion on the first surface, and the lead wire of the second internal part has a second exposed portion on the second surface, thereby preventing a short circuit between the lead wire of the first internal part and the lead wire of the second internal part.

[0015] (3) In the molded part of (1) or (2), the first lead wire may include a plurality of first lead wires, the second lead wire may include a plurality of second lead wires, and the first molded part may further include a first partition wall separating the first lead wires and a second partition wall separating the second lead wires.

[0016] With such a molded part, the first molded portion has a first isolation wall that separates each of the first lead wires and a second isolation wall that separates each of the second lead wires, thereby preventing short circuits between lead wires located on the same plane.

[0017] (4) In the molded part of (2), the first internal part and the second internal part may be arranged in mirror symmetry with respect to a virtual plane that passes through the middle of each electrical component body and is along the extension direction of the lead wire.

[0018] With such a molded part, the first internal part and the second internal part can be positioned in the same position inside the molded part. This makes it easier to align the electrical characteristics of the first internal part and the second internal part. For example, if the first internal part and the second internal part are sensors, the first internal part and the second internal part can be positioned in the same position relative to the object to be detected. This makes it possible to expect that the first internal part and the second internal part will output detection signals with similar output characteristics when detecting the object to be detected.

[0019] (5) In any one of the molded parts (1) to (4), the first surface may be recessed in the direction in which the second surface faces in a cross-sectional view perpendicular to the extension direction of the lead wire.

[0020] With such a molded part, the lead wires on the first surface and the lead wires on the second surface can be bent into similar shapes.

[0021] (6) In any one of the molded parts (1) to (5), the first surface may be recessed in the direction of the second surface by an amount corresponding to the thickness of the lead wire in a cross-sectional view perpendicular to the direction in which the lead wire extends.

[0022] With this molded part, the lead wires on the first surface and the lead wires on the second surface can be bent in the same shape. Since the lead wires can be aligned in the same thickness direction, it is not necessary to provide a different bending angle for one lead wire than for the other. This reduces the amount of stress, such as bending, that is applied to one lead wire compared to the other lead wires.

[0023] (7) In any one of the molded parts (1) to (6), the partition portion may have a first step portion between the first surface and the reverse side of the second surface, and a second step portion between the second surface and the reverse side of the first surface, and the corner portion of the first step portion may be chamfered, and the corner portion of the second step portion may be chamfered.

[0024] Such a molded component facilitates soldering due to the shape of the stepped portion.

[0025] [Details of the embodiments of the present disclosure] Specific examples of molded parts according to the present disclosure will be described below with reference to the drawings. However, the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0026] The drawings are schematic, and for the sake of convenience, components may be omitted or simplified as appropriate. Furthermore, the relative sizes and positions of components shown in different drawings are not necessarily accurately depicted and may be changed as appropriate. Hatching may also be used in drawings such as plan views that are not cross-sectional views to facilitate understanding of the embodiments.

[0027] In the following description, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions of them may be omitted to avoid duplication.

[0028] [First embodiment] The molded part 1 according to this embodiment will now be described. Fig. 1 is a perspective view of the molded part 1. Fig. 2 is a perspective view of the molded part 1 excluding the second molded portion 50. Fig. 3 is a plan view of the molded part 1 excluding the second molded portion 50. Fig. 4 is a side view of the molded part 1 excluding the second molded portion 50. Fig. 5 is a cross-sectional view showing the VV cross section of Fig. 3. In each drawing and the following description, the longitudinal direction of the molded part 1 is designated as L, and the width direction is designated as W.

[0029] <Configuration of molded part 1> The molded part 1 is used, for example, to measure the rotational speed of a vehicle tire. The molded part 1 detects magnetic field fluctuations caused by the rotation of a detection object that rotates along with the tire. The molded part 1 includes an internal component module 2. The internal component module 2 includes at least one (here, two) internal component 10, 20 and a first molded portion 40 that covers a portion of the internal component 10, 20. The internal component 10, 20 has a detection element main body 11, 21 as an electronic component main body and lead wires 12, 13, 22, 23 extending from the detection element main body 11, 21. The molded part 1 also includes a connection terminal 30 as an electrical conductor connected to the lead wires 12, 13, 22, 23 (here, four, but the number is not particularly limited), a solder portion 60 that connects the lead wires 12, 13, 22, 23 to the connection terminal 30, and a second molded portion 50 that covers the internal component module 2, the connection terminal 30, and the solder portion 60. The connection terminal 30 as an electrical conductor is connected to other electrical components.

[0030] In this embodiment, there are four lead wires 12, 13, 22, 23 (two lead wires for each of the detection element bodies 11, 21), but the present invention includes one or more lead wires for each of the detection element bodies 11, 21.

[0031] <Configuration of internal components 10 and 20> The internal component 10 includes a first internal component 10 and a second internal component 20 (the first internal component and the second internal component are collectively referred to as "internal components"). As described above, the first internal component 10 has a detection element body 11 as an electronic component body, and lead wires 12 and 13 (two in this case) extending from the detection element body 11. The two lead wires 12 and 13 are arranged in parallel with a gap between them. The second internal component 20 has a configuration similar to that of the first internal component 10. The second internal component 20 has a detection element body 21 as an electronic component body, and lead wires 22 and 23 (two in this case).

[0032] The first internal part 10 and the second internal part 20 are aligned in the width direction W of the molded part 1. The four lead wires 12, 13, 22, 23 extend along the longitudinal direction L of the molded part 1 in parallel with one another.

[0033] The detection element bodies 11 and 21 detect magnetic field fluctuations caused by the rotation of a detection object that rotates with the rotation of a tire, for example. The detection element bodies 11 and 21 may also detect magnetic field fluctuations around the detection element bodies 11 and 21 that occur with the movement of a magnet attached to a rotor or the like in a magnetic encoder. The detection element bodies 11 and 21 output electrical signals corresponding to such magnetic field fluctuations (wheel rotation speed). The detection element bodies 11 and 21 are, for example, arranged at different positions in the rotation direction of the detection object, thereby generating electrical signals at different times. The electrical signals output from the detection element bodies 11 and 21 are transmitted to the connection terminal 30 via lead wires 12, 13, 22, and 23. The electrical signals sent to the connection terminal 30 are input to other electrical components (for example, a control unit or a control device).

[0034] The lead wires 12, 13, 22, 23 include first lead wires 12, 13 and second lead wires 22, 23 (the first lead wires and second lead wires are collectively referred to as "lead wires"). In this embodiment, the lead wires 12, 13 extending from the detection element body 11 of the first internal component 10 are the first lead wires 12, 13. Furthermore, the lead wires 22, 23 extending from the detection element body 21 of the second internal component 20 are the second lead wires 22, 23. The first lead wires 12, 13 and the second lead wires 22, 23 are formed, for example, in the shape of a rectangular thin plate. The first lead wires 12, 13 extend in parallel from the detection element body 11, and the second lead wires 22, 23 extend in parallel from the detection element body 21. The detection element bodies 11, 21 are adjacent to each other with a gap between them. Furthermore, the detection element bodies 11 and 21 are in the same position within the first molded portion 40. Therefore, the first lead wires 12 and 13 and the second lead wires 22 and 23 are parallel to each other as a whole.

[0035] The first lead wires 12 and 13 are a plurality (two in this case) of first lead wires 12 and 13. The second lead wires 22 and 23 are a plurality (two in this case) of second lead wires 22 and 23.

[0036] 3 to 5, the first lead wires 12 and 13 have first exposed portions 12a and 13a that are exposed from the first molded portion 40 on a first surface I (described later) of the first molded portion 40. The first exposed portions 12a and 13a are tip portions of the first lead wires 12 and 13. Parts of the first exposed portions 12a and 13a are to be soldered. The first lead wires 12 and 13 and the connection terminal 30 are connected to each other by soldering with a solder portion 60 at the soldered portions.

[0037] The second lead wires 22, 23 have second exposed portions 22a, 23a that are exposed from the first molded portion 40 on a second surface II (described later) of the first molded portion 40. The second exposed portions 22a, 23a are tip portions of the second lead wires 22, 23. A portion of the second exposed portions 22a, 23a is a portion to be soldered. The second lead wires 22, 23 and the connection terminal 30 are connected to each other by soldering with a solder portion 60 at this soldered portion.

[0038] As shown in Fig. 3, the first lead wires 12, 13 and the second lead wires 22, 23 are arranged in positions where they do not overlap in a plan view. A plan view is a plan view from the direction in which the first surface I faces or the direction in which the second surface II faces. In this embodiment, the first surface I and the second surface II are parallel planes. Therefore, the direction in which the first surface I faces and the direction in which the second surface II faces are the same direction.

[0039] <Configuration of connection terminal 30> The connection terminal 30 is connected to the first lead wires 12, 13 and the second lead wires 22, 23, and is connected to other electrical components.

[0040] The connection terminal 30 has four connection terminals 31, 32, 33, and 34 (connection terminals 31, 32, 33, and 34 are collectively referred to as "connection terminals 30"). The connection terminals 30 are made of a metal material such as copper, copper alloy, aluminum, aluminum alloy, or stainless steel. The connection terminals 30 are formed, for example, from a conductive material by, for example, pressing a metal plate. The connection terminals 30 have a degree of rigidity that allows them to maintain a fixed shape.

[0041] The connection terminals 31, 32, 33, and 34 are connected to the lead wires 12, 13, 22, and 23, respectively. As shown in Figures 1 and 2, one end of each of the connection terminals 31, 32, 33, and 34 is exposed from the first molded portion 40 to form exposed portions 31a, 32a, 33a, and 34a.

[0042] Here, connection terminals 31 and 32 of connection terminal 30 will be described. As shown in Fig. 3, a part of exposed portions 31a and 32a of connection terminals 31 and 32 is to be soldered. This soldered portion is connected to the above-mentioned lead wires 12 and 13 by solder portion 60. The connection of connection terminals 33 and 34 to lead wires 22 and 23 is similar to the connection of connection terminals 31 and 32 to lead wires 12 and 13, and therefore will not be described here.

[0043] Each of the connection terminals 31, 32, 33, and 34 has a connector-use exposed portion 31c, 32c, 33c, and 34c exposed from the first molded portion 40 and the second molded portion 50. Specifically, the other end of each of the connection terminals 31, 32, 33, and 34, opposite the exposed portions 31a, 32a, 33a, and 34a, is exposed from the first molded portion 40 and the second molded portion 50, forming the connector-use exposed portion 31c, 32c, 33c, and 34c. The connector-use exposed portions 31c, 32c, 33c, and 34c are connected to a connector that is connected to another electrical component. The connector-use exposed portions 31c, 32c, 33c, and 34c allow the molded part 1 itself to have a connector. This allows the molded part 1 itself to be directly connected to a connector extending from another electrical component (e.g., a control unit or a control device).

[0044] <Solder part 60> The solder portion 60 connects the first lead wires 12, 13 and the second lead wires 22, 23 to the connection terminal 30 as an electrical conductor.

[0045] As shown in FIGS. 3 to 5, the solder portion 60 includes first solder portions 61a, 61b and second solder portions 62a, 62b (the first solder portions 61a, 61b and the second solder portions 62a, 62b are collectively referred to as the "solder portion 60", the first solder portions 61a and 61b are collectively referred to as the "first solder portion 61", and the second solder portions 62a and 62b are collectively referred to as the "second solder portion 62"). The first solder portions 61 (61a, 61b) are located on the first surface I. The first solder portions 61 (61a, 61b) connect the first exposed portions 12a, 13a and the connection terminals 30. More specifically, first solder portion 61a connects first exposed portion 12a and connection terminal 31, and first solder portion 61b connects first exposed portion 13a and connection terminal 32.

[0046] Furthermore, the second solder portions 62 (62a, 62b) are located on the second surface II. Furthermore, the second solder portions 62 (62a, 62b) connect the second exposed portions 22a, 23a to the connection terminal 30. More specifically, the second solder portion 62a connects the second exposed portion 22a to the connection terminal 33, and the second solder portion 62b connects the second exposed portion 23a to the connection terminal 34.

[0047] As described above, the first solder portions 61a, 61b and the second solder portions 62a, 62b are arranged on different surfaces, so the soldering work for the first solder portions 61a, 61b and the soldering work for the second solder portions 62a, 62b can be performed on different surfaces, making the soldering work easier.

[0048] <First molding section 40> The first molded portion 40 has a head portion 41, a connection terminal holding portion 42, and a connecting portion 43 that connects the head portion 41 and the connection terminal holding portion 42. The first molded portion 40 is formed of, for example, resin. The first molded portion 40 is a portion that is molded using a resin material with the internal components 10 and 20 as inserts.

[0049] The head portion 41 covers the detection element bodies 11 and 21. The head portion 41 has a recess 41a and an inner through-hole 41b that penetrates from the surface of the first molded portion 40 to the internal component 20.

[0050] As shown in FIG. 5 , the first internal component 10 and the second internal component 20 are arranged in mirror symmetry with respect to an imaginary plane C that passes through the center of the respective detection element bodies 11 and 21 and that is aligned along the direction of extension of the first lead wires 12 and 13 and the second lead wires 22 and 23. Note that plane C is also perpendicular to the first plane I and the second plane II. This molded component 1 allows the first internal component 10 and the second internal component 20 to maintain the same orientation within the molded component 1, thereby aligning the orientations of the first internal component 10 and the second internal component 20 relative to the object to be detected as closely as possible. This makes it easier for the first internal component 10 and the second internal component 20 to output detection signals with similar output characteristics when detecting an object to be detected. This facilitates processing of the detection signals and improves the accuracy of detecting the object to be detected.

[0051] In the head portion 41 of the first molded portion 40, a plurality of (three in this case) recesses 41a are formed on the first surface I side, and at least one (one in this case) recess 41a is formed on the second surface II side. The recess 41a is a portion into which the tip of a positioning pin for fixing the first molded portion 40 is inserted when molding the second molded portion 50. In other words, the recess 41a is a portion into which a positioning pin of a mold device is inserted when mold molding is performed using the first molded portion 40 as an insert. The recess 41a is a recess that opens to the surface of the first molded portion 40 but does not reach the surfaces of the internal components 10, 20.

[0052] Furthermore, a plurality of (here, two) inner through holes 41b are formed on the first surface I side of the head portion 41 of the first molded portion 40. The inner through holes 41b are marks of positioning pins used to fix portions of the internal components 10, 20 when the first molded portion 40 is molded. When the first molded portion 40 is removed from the mold, the inner through holes 41b are formed as marks of the positioning pins. The inner through holes 41b penetrate all the way to the surfaces of the internal components 10, 20, and portions of the surfaces of the internal components 10, 20 are exposed within the inner through holes 41b. In this embodiment, the positioning pins press and fix portions of the lead wires 12, 13, 22, and 23 of the internal components 10, 20, for example. The inner through holes 41b are formed so as to expose portions of the lead wires 12, 13, 22, and 23. Therefore, the lead wires 12, 13, 22, and 23 that were fixed by the positioning pins when the first molded portion 40 was molded are exposed to the outside of the first molded portion 40 through the inner through-holes 41b. Similarly, holes are also formed on the second surface II as traces of holding parts for holding the internal parts 10 and 20, but are not shown in the drawings.

[0053] The connection terminal holding portion 42 holds a portion of the connection terminal 30. The connection terminal holding portion 42 holds multiple (four in this example) connection terminals 31, 32, 33, and 34 in fixed positions. This holds the exposed portions 31a, 32a, 33a, and 34a and the connector exposed portions 31c, 32c, 33c, and 34c in fixed positions. This holds the connector exposed portions 31c, 32c, 33c, and 34c in fixed positions suitable for connection with connectors of other electrical components. For example, the connector exposed portions 31c, 32c, 33c, and 34c are held in positions that are parallel to each other and protrude in the same direction. Furthermore, the exposed portions 31a, 32a, 33a, and 34a are held in fixed positions suitable for connection with the lead wires 12, 13, 22, and 23 (for example, positions that contact the lead wires 12, 13, 22, and 23 from the side opposite the connecting portion 43).

[0054] The connecting portion 43 is a partition portion 43 that includes a first surface I and a second surface II that faces in the opposite direction to the direction of the first surface I. The partition portion 43 (connecting portion 43) also serves to connect the head portion 41 and the connection terminal holding portion 42 so that the connection terminal holding portion 42 is maintained in a fixed position relative to the head portion 41. The partition portion 43 may be thinner than the head portion 41 and the connection terminal holding portion 42.

[0055] The partition portion 43 has a mounting portion 44 on which the first lead wires 12, 13 and the second lead wires 22, 23 are mounted. A first mounting surface 44a on which the first lead wires 12, 13 are mounted is formed on a first surface I of the partition portion 43. A second mounting surface 44b on which the second lead wires 22, 23 are mounted is formed on a second surface II of the partition portion 43.

[0056] In this embodiment, the normal directions (arrow N in FIG. 4) of the first mounting surface 44a and the second mounting surface 44b are the same. The lead wires 12 and 13 are mounted on the first mounting surface 44a, and the lead wires 22 and 23 are mounted on the second mounting surface 44b. By arranging the lead wires 12 and 13 on the first mounting surface 44a and the lead wires 22 and 23 on the second mounting surface 44b, the first solder portions 61a and 61b (see FIGS. 3 and 5) on the first lead wires 12 and 13 do not come into contact with the second solder portions 62a and 62b (see FIGS. 3 and 5) on the second lead wires 22 and 23. This prevents short circuits between the first lead wires 12 and 13 and the second lead wires 22 and 23.

[0057] The first molding portion 40 further includes a first separating wall 45 separating the lead wires 12, 13 from each other, and a second separating wall 46 separating the second lead wires 22, 23 from each other.

[0058] More specifically, a first separating wall 45 is disposed between the lead wires 12 and 13 to separate the lead wires 12 and 13. This first separating wall 45 prevents the first solder portion 61a on the first lead wire 12 from contacting the first solder portion 61b on the first lead wire 13. Furthermore, the first lead wires 12 and 13 do not come into contact with each other. This prevents a short circuit between the first lead wire 12 and the first lead wire 13.

[0059] Similarly, a second separating wall 46 is disposed between the second lead wires 22 and 23 to separate the second lead wires 22 and 23. This second separating wall 46 prevents the second solder portion 62a on the second lead wire 22 from contacting the second solder portion 62b on the second lead wire 23. Furthermore, the second lead wires 22 and 23 do not come into contact with each other. This prevents a short circuit between the second lead wires 22 and 23.

[0060] 5, the first surface I is recessed from the second surface II in the direction in which the second surface II faces in a cross-sectional view perpendicular to the extension direction of the first lead wires 12, 13 and the second lead wires 22, 23. More specifically, the first surface I is recessed from the back surface of the second surface II. In the thickness direction of the partition portion 43, the first surface I is located away from the second surface II in the direction in which the second surface II faces. In this embodiment, the first surface I is recessed from the second surface II in the direction in which the second surface II faces by an amount equal to the thickness t of the first lead wires 12, 13 (second lead wires 22, 23).

[0061] Similarly, the second surface II is recessed from the first surface I in the direction in which the first surface I faces in a cross-sectional view perpendicular to the extension direction of the first lead wires 12, 13 and the second lead wires 22, 23. More specifically, the second surface II is recessed from the back surface of the first surface I. In the thickness direction of the partition portion 43, the second surface II is located away from the first surface I in the direction in which the first surface I faces. In this embodiment, the second surface II is recessed from the first surface I in the direction in which the first surface I faces by an amount equal to the thickness t of the second lead wires 22, 23 (first lead wires 12, 13).

[0062] By arranging the first lead wires 12, 13 and the second lead wires 22, 23 in this manner, the positions of the lead wires (first lead wires 12, 13, second lead wires 22, 23) in the thickness direction can be aligned. This allows the first internal component 10 and the second internal component 20 to be used with the same shape. That is, the positions of the lead wires (first lead wires 12, 13, second lead wires 22, 23) in the thickness direction can be aligned in the normal direction of the first surface I (normal direction of the second surface II). There is no need to provide a bending angle for any of the lead wires 12, 13, 22, 23 that is different from that of the other lead wires. This makes it possible to suppress the application of loads such as bending to any of the lead wires compared to the other lead wires. Furthermore, there is no need to provide different shapes for the first lead wires 12, 13 and the second lead wires 22, 23 or to forcibly change their shapes.

[0063] 5, the partition 43 has a first step 47 between the first surface I and the back surface II-2 of the second surface II. As described above, the first surface I is recessed from the second surface II by a thickness t. In this embodiment, the first step 47 is formed perpendicular to the first surface I and the second surface II. Furthermore, corners 47a of the first step 47 are chamfered.

[0064] The partition 43 also has a second step 48 between the second surface II and the back surface I-2 of the first surface I. As described above, the second surface II is recessed from the first surface I by a thickness t. Like the first step 47, the second step 48 is also formed perpendicular to the first surface I and the second surface II. Furthermore, corners 48a of the second step 48 are chamfered.

[0065] <Second molding section 50> 1, the second molding part 50 covers the internal component module 2, the connection terminal 30, and the solder part 60. The second molding part 50 includes a head covering part 51 that covers the head part 41 of the first molding part 40, a cylindrical part 52 that surrounds a part of the connection terminal 30, and a connecting part 53 that connects the head covering part 51 and the cylindrical part 52. The second molding part 50 also includes an annular protrusion 54 that protrudes outward from the outer periphery of the connecting part 53.

[0066] In the head portion covering portion 51 of the second molded portion 50, a plurality of (three in this example) outer through holes 51a are formed on the first surface I side of the first molded portion 40, and at least one (one in this example) outer through hole 51a is formed on the second surface II side of the first molded portion 40. The outer through holes 51a are marks of positioning pins used to fix a portion of the first molded portion 40 when the second molded portion 50 is molded. When the second molded portion 50 is removed from the mold, the outer through hole 51a is formed as the mark of the positioning pin. The outer through hole 51a penetrates all the way to the surface of the first molded portion 40, and a portion of the first molded portion 40 is exposed within the outer through hole 51a. In this embodiment, the positioning pin engages with the recess 41a of the first molded portion 40 to fix the first molded portion 40. Therefore, the recess 41a, which was fixed by the positioning pin when the second molded portion 50 was molded, is exposed to the outside of the second molded portion 50 through the outer through hole 51a.

[0067] The cylindrical portion 52 surrounds the connector exposed portions 31c, 32c, 33c, and 34c of the connection terminal 30. The cylindrical portion 52 and the connector exposed portions 31c, 32c, 33c, and 34c are formed in a shape suitable for engagement with a mating connector connected to another electrical component. For example, the mating connector has a plurality of mating terminal portions connectable to the connector exposed portions 31c, 32c, 33c, and 34c. The mating terminal portions are formed in, for example, a columnar terminal shape. The mating connector has a housing portion that holds the plurality of mating terminal portions in positions corresponding to the connector exposed portions 31c, 32c, 33c, and 34c. The cylindrical portion 52 is formed in a cylindrical shape into which the housing portion of the mating connector can be inserted. As a result, the cylindrical portion 52 and the connector exposed portions 31c, 32c, 33c, and 34c are directly connected to the mating connector connected to another electrical component.

[0068] The connecting portion 53 is located between the head covering portion 51 and the cylindrical portion 52. The connecting portion 53 covers the first exposed portions 12a, 13a and the second exposed portions 22a, 23a of the lead wires 12, 13, 22, 23, the exposed portions 31a, 32a, 33a, 34a of the connection terminals 31, 32, 33, 34, and the solder portion 60. As a result, the first lead wires 12, 13, the second lead wires 22, 23, the connection terminals 30, and the solder portion 60 are covered by the second molded portion 50 and are not exposed to the outside of the molded part 1.

[0069] An O-ring 70 (see FIG. 1) is attached to the peripheral portion of the connecting portion 53, closer to the head covering portion 51 than the annular protrusion 54. The O-ring 70 is an annular member made of an elastic material such as rubber. Contact between the O-ring 70 and another member having a shape corresponding to the O-ring 70 prevents the flow of liquid through the O-ring 70 as a boundary.

[0070] <Soldering work> FIG. 5 is an explanatory diagram showing the approach direction of the soldering iron when soldering the solder portion 60.

[0071] 5, the first exposed portions 12a, 13a of the first lead wires 12, 13 fixed by the first molding portion 40 and the exposed portions 31a, 32a of the connection terminals 31, 32 (30) are connected by first solder portions 61a, 61b. Also, the second exposed portions 22a, 23a of the second lead wires 22, 23 fixed by the first molding portion 40 and the exposed portions 33a, 34a of the connection terminals 33, 34 (30) are connected by second solder portions 62a, 62b. The first solder portions 61a, 61b (solder portion 60) and the second solder portions 62a, 62b (solder portion 60) use a metal material (solder) having a melting temperature lower than that of the lead wires 12, 13, 22, 23 and the connection terminals 30 to be joined. In this embodiment, the solder is heated to approximately 250°C to 350°C with a soldering iron to melt. The molten solder spreads around the connection portions of first exposed portions 12a, 13a, second exposed portions 22a, 23a, and exposed portions 31a, 32a, 33a, 34a. In this spread state, the molten solder solidifies again when cooled by the outside air.

[0072] Referring to FIG. 5, for example, when connecting the first exposed portion 12a and the exposed portion 31a, the solder, which is the material of the solder portion 60 (61a), is placed close to the first exposed portion 12a and the exposed portion 31a. A soldering iron approaches this solder in the direction of arrow D1. At this time, there is no component that would hinder the soldering iron's approach to the solder. This allows for smooth soldering. Furthermore, the first exposed portion 12a and the exposed portion 31a are separated from the adjacent first exposed portion 13a and the exposed portion 32a by the first separating wall 45. Therefore, even when the first solder portion 61a spreads when melted, it is prevented from coming into contact with the first exposed portion 13a, the exposed portion 32a, and the first solder portion 61b. This prevents a short circuit between the first lead wires 12 and 13.

[0073] When connecting the first exposed portion 13a and the exposed portion 32a, the solder, which is the material of the solder portion 60 (61b), is placed close to the first exposed portion 13a and the exposed portion 32a. The soldering iron approaches this solder in the direction of arrow D2. At this time, there is no component that prevents the soldering iron from approaching the solder. The first exposed portion 13a and the second exposed portion 22a are adjacent in the W direction. However, they are separated by the partition portion 43. Therefore, the soldering operation of the exposed portion 32a to the first exposed portion 13a and the soldering operation of the exposed portion 33a to the second exposed portion 22a can be performed smoothly without worrying about the solder contacting each other. In addition, the corner portion 47a of the first step portion 47 is chamfered. Therefore, the soldering iron can be inserted in the direction of arrow D2 without being interfered with by the corner portion 47a. This facilitates soldering with the soldering iron. Furthermore, first exposed portion 13a is separated from the adjacent first exposed portion 12a by first separating wall 45. Therefore, first solder portion 61b, which solders first exposed portion 13a and exposed portion 32a, is prevented from coming into contact with first exposed portion 12a, exposed portion 31a, and first solder portion 61a, even when the solder spreads when melted. This prevents a short circuit between first lead wires 12 and 13, and also prevents a short circuit between first lead wire 13 and second lead wire 22.

[0074] The connection between the second exposed portion 22a and the exposed portion 33a and the connection between the second exposed portion 23a and the exposed portion 34a are similar to the connection between the first exposed portion 12a and the exposed portion 31a and the connection between the first exposed portion 13a and the exposed portion 32a. When connecting the second exposed portion 22a and the exposed portion 33a, the soldering iron approaches in the direction of arrow D3. At this time, there is no component that would hinder the soldering iron from approaching the solder. Furthermore, due to the action of the partition portion 43 and the second isolation wall 46, the soldering operation can be performed smoothly without worrying about mutual solder contact. Furthermore, when connecting the second exposed portion 23a and the exposed portion 34a, the soldering iron approaches in the direction of arrow D4. At this time, there is no component that would hinder the soldering iron from approaching the solder. Furthermore, due to the action of the second isolation wall 46, the soldering operation can be performed smoothly without worrying about mutual solder contact.

[0075] <Effects of the above-described embodiments> Next, examples of effects obtained by the above-described embodiments will be described. Note that in the following description, the effects will be described based on the specific configurations exemplified in the above-described embodiments, but these may be replaced with other specific configurations exemplified in the present specification as long as the same effects are obtained.

[0076] Furthermore, the replacement may be made across multiple embodiments, i.e., configurations illustrated in different embodiments may be combined to produce the same effect.

[0077] The molded part 1 configured as described above includes an internal component module 2 including at least one internal component 10, 20 having a detection element body 11, 21 as an electric component body and lead wires 12, 13, 22, 23 extending from the electric component body (detection element body 11, 21), a first molded part 40 covering a part of the internal component 10, 20, connection terminals 30 as electric conductors connected to the lead wires 12, 13, 22, 23 and leading to other electric components, a solder part 60 connecting the lead wires 12, 13, 22, 23 and the electric conductor (connection terminal 30), and a second molded part 50 covering the internal component module 2, the electric conductor (connection terminal 30), and the solder part 60, and the lead wires 12, 13, 22, 23 include the first lead wires 12, 13 and the second lead wires 22, 23, and the first molded part 40 The device is provided with a partition portion 43 including a surface I and a second surface II facing in a direction opposite to the direction in which the first surface I faces, and the first lead wires 12 and 13 have first exposed portions 12a and 13a exposed from the first molded portion 40 on the first surface I, and the second lead wires 22 and 23 have second exposed portions 22a and 23a exposed from the first molded portion 40 on the second surface II, and the first lead wires 12 and 13 and the second lead wires 22 and 23 The solder portions 60 are arranged in positions that do not overlap when viewed in a plan view from the direction in which the first surface I faces or the direction in which the second surface II faces, and include a first solder portion 61 that is located on the first surface I and connects the first exposed portions 12a, 13a to the electrical conductor (connection terminal 30), and a second solder portion 62 that is located on the second surface II and connects the second exposed portions 22a, 23a to the electrical conductor (connection terminal 30).

[0078] With this configuration, the first solder section 61 and the second solder section 62 are arranged on different surfaces, the first surface I and the second surface II, which makes the soldering operation easier.

[0079] Furthermore, since a partition portion 43 is provided that separates the first surface I from the second surface II, contact between the first solder portion 61 and the second solder portion 62 is prevented. Therefore, a short circuit between the first lead wire 13 and the second lead wire 22 is prevented without providing a partition wall between the adjacent first lead wire 13 and the second lead wire 22. In particular, the first lead wire 13 and the second lead wire 22 are arranged more inward in the width direction W of the molded part 1 than the first lead wire 12 and the second lead wire 23. For this reason, it is difficult to approach the first lead wire 13 and the second lead wire 22 from the outside with a soldering iron. Therefore, when soldering the first lead wire 13 and the second lead wire 22, arranging the lead wires on different surfaces in this manner is particularly effective.

[0080] Furthermore, according to the above-mentioned molded part 1, the internal parts 10, 20 include a first internal part 10 and a second internal part 20, and the lead wires 12, 13 extending from the electrical part body (detection element body 11) in the first internal part 10 are first lead wires 12, 13, and the lead wires 22, 23 extending from the electrical part body (detection element body 21) in the second internal part 20 are second lead wires 22, 23.

[0081] With this configuration, the first lead wires 12, 13 extending from the electric component body (detection element body 11) of the first internal component 10 and the second lead wires 22, 23 extending from the electric component body (detection element body 21) of the second internal component 20 are arranged on different surfaces (first surface I and second surface II). Therefore, it is possible to prevent a short circuit between the first lead wires 12, 13 extending from the electric component body (detection element body 11) of the first internal component 10 and the second lead wires 22, 23 extending from the electric component body (detection element body 21) of the second internal component 20.

[0082] Furthermore, according to the molded part 1 as described above, the first lead wires 12, 13 include a plurality (here, two) of first lead wires 12, 13, and the second lead wires 22, 23 include a plurality (here, two) of second lead wires 22, 23, and further include a first partition wall 45 separating each of the first lead wires (first lead wires 12, 13) and a second partition wall 46 separating each of the second lead wires (second lead wires 22, 23).

[0083] This configuration prevents short circuits between the first lead wires 12, 13 or the second lead wires 22, 23 arranged on the same surface (the first surface I or the second surface II). Even if the first separating wall 45 is provided, soldering can be performed from the side of the first lead wires 12, 13 opposite the first separating wall 45 (arrow D1 or arrow D2). In this way, the first separating wall 45 does not become a component that obstructs the soldering operation. Therefore, the first separating wall 45 prevents short circuits between the first lead wires 12, 13 while minimizing the effect on the difficulty of the soldering operation.

[0084] Furthermore, in the molded part 1 described above, the first surface I and the second surface II are parallel, and the first internal part 10 and the second internal part 20 are arranged in mirror symmetry with respect to an imaginary plane C that passes through the middle position of each electrical part body (detection element body 11, 21) and runs along the extension direction of the first lead wires 12, 13 and the second lead wires 22, 23.

[0085] With this configuration, the two internal components (first internal component 10 and second internal component 20) are arranged in mirror symmetry with respect to an imaginary plane C that passes through the midpoint of each electrical component body (detection element body 11, 21), so that the first internal component 10 and the second internal component 20 have the same orientation within the molded component 1. In other words, the orientations of the first internal component 10 and the second internal component 20 relative to the object to be detected can be aligned as much as possible. This makes it easier for the first internal component 10 and the second internal component to output detection signals with similar output characteristics when detecting the object to be detected. This makes it easier to process the detection signals and improves the detection accuracy of the object to be detected.

[0086] Furthermore, in the molded part 1 described above, the first surface I is recessed in the direction in which the second surface II faces in a cross-sectional view perpendicular to the extension direction of the first lead wires 12, 13 and the second lead wires 22, 23 (see Figure 5).

[0087] With this configuration, the first lead wires 12, 13 can be arranged on the first surface I at a position recessed toward the second surface II, so that the bending angle of the first lead wires 12, 13 extending from the electric component body (detection element body 11) becomes gentle. This eliminates the need for excessive adjustment of the angle at which the first lead wires 12, 13 are drawn out from the electric component body (detection element body 11).

[0088] Preferably, in a cross-sectional view perpendicular to the extension direction of the first lead wires 12, 13 and the second lead wires 22, 23 (see Figure 5), the first surface I is recessed from the second surface II in the direction in which the second surface II faces by an amount equal to the thickness t of the first lead wires 12, 13.

[0089] With this configuration, the first lead wires 12, 13 can be arranged on the first surface I at a position recessed toward the second surface II by the thickness t of the first lead wires 12, 13 from the second surface II in the direction toward the second surface II, thereby aligning the positions of the first lead wires 12, 13 and the second lead wires 22, 23 in the thickness direction. This reduces bending of the first lead wires 12, 13 extending from the electrical component body (detection element body 11). Furthermore, for example, when a first internal component 10 and a second internal component 20 are provided, the first internal component 10 and the second internal component 20 can have the same shape.

[0090] Preferably, the second surface II is recessed from the first surface I in the direction of the first surface I in a cross-sectional view (see FIG. 5) perpendicular to the direction in which the first lead wires 12, 13 and the second lead wires 22, 23 extend. More preferably, the second surface II is recessed from the first surface I in the direction in which the first surface I faces by an amount equal to the thickness t of the second lead wires 22, 23 in a cross-sectional view (see FIG. 5) perpendicular to the direction in which the first lead wires 12, 13 and the second lead wires 22, 23 extend.

[0091] The effect of such a configuration is similar to the effect of the above-mentioned configuration in which the first surface I is recessed in the direction in which the second surface II faces, relative to the second surface II, and therefore a description thereof will be omitted.

[0092] Furthermore, in the molded part 1 described above, the partition 43 has a first step 47 between the first surface I and the back surface II-2 of the second surface II and a second step 48 between the second surface II and the back surface I-2 of the first surface I. The corners 47a between the first surface I and the end of the back surface II-2 of the second surface II are chamfered, and the corners 48a between the second surface II and the end of the back surface I-2 of the first surface I are chamfered. The chamfered shape refers to a shape having a chamfered surface with corners removed. However, the chamfered surface may be flat or curved.

[0093] With this configuration, corner portions 47a of first step portion 47 are formed in a chamfered shape, which supports the soldering operation to first lead wires 12, 13. In addition, corner portions 48a of second step portion 48 are formed in a chamfered shape, which supports the soldering operation to second lead wires 22, 23.

[0094] <Other> FIG. 6 is an explanatory diagram showing a cross section perpendicular to the direction in which lead wires 212, 213, 222, and 223 extend in another embodiment.

[0095] In the above-described embodiment, the lead wires 12, 13 extending from the detection element body 11 of the first internal part 10 are the first lead wires 12, 13, and the lead wires 22, 23 extending from the detection element body 21 of the second internal part 20 are the second lead wires 22, 23, but the embodiment of Figure 6 has a different configuration.

[0096] In the embodiment of FIG. 6, of the multiple (here, two) lead wires 212, 213 extending from the detection element body 211, the lead wire 212 is the first lead wire 212, and the lead wire 213 is the second lead wire 213. Similarly, of the multiple (here, two) lead wires 222, 223 extending from the detection element body 221, the lead wire 222 is the first lead wire 222, and the lead wire 223 is the second lead wire 223. In other words, the lead wires 212, 222 are arranged on the first surface I, and the lead wires 213, 223 are arranged on the second surface II. Even with this arrangement, adjacent solder portions 260 are arranged on different surfaces, so contact between the solder portions 260 is suppressed. Note that here again, the first lead wires 212, 222 and the second lead wires 213, 223 are collectively referred to as "lead wires."

[0097] Furthermore, when adjacent first lead wires 212, 222 and second lead wires 213, 223 are arranged alternately in the parallel direction of the lead wires on the first surface I and the second surface II, the lead wires 212, 213, 222, 223 are isolated by the partition portion 243. Therefore, isolation walls between the lead wires 212, 213, 222, 223 are not necessary.

[0098] FIG. 7 is an explanatory diagram showing a cross section perpendicular to the direction in which lead wires 312, 313, 322, and 323 extend in another embodiment.

[0099] In the above-described embodiment, the first surface I is positioned more recessed than the second surface II in the direction in which the second surface II faces when viewed in a cross section perpendicular to the extension direction of the first lead wires 12, 13 and the second lead wires 22, 23, and the second surface II is positioned more recessed than the first surface I in the direction in which the first surface I faces when viewed in a cross section perpendicular to the extension direction of the first lead wires 12, 13 and the second lead wires 22, 23, but the embodiment in Figure 7 has a different configuration.

[0100] In the embodiment of FIG. 7 , the first surface I is not recessed in the direction in which the second surface II faces. There is no step between the first surface I and the back surface II-2 of the second surface II, and the surface is flat. Furthermore, the second surface II is not recessed in the direction in which the first surface I faces. There is no step between the second surface II and the back surface I-2 of the first surface I, and the surface is flat. Because the first surface I is not recessed in the direction in which the second surface II faces, and the second surface II is not recessed in the direction in which the first surface I faces, the positions of the first lead wires 312, 313 and the second lead wires 322, 323 in the thickness direction are misaligned. However, even with this configuration, contact between adjacent solder portions 360 is suppressed. Furthermore, because no recesses are formed, the configuration of the first molding portion 40 can be simplified.

[0101] Furthermore, while the above-described embodiment is configured to include two internal components 10, 20, the number of internal components may be one or three or more. Configurations that include multiple lead wires as a whole are included in the present invention. When there is one internal component, the single internal component may have multiple lead wires, and the lead wires may be arranged separately on both the first surface I and the second surface II of the partition 43.

[0102] Furthermore, in the above-described embodiment, one internal component 10 (20) has two lead wires 12, 13 (22, 23), but this is not limited to this. The present invention also includes a configuration in which one internal component has one lead wire, or a configuration in which one internal component has three or more lead wires. However, when one internal component has one lead wire, it is sufficient that the internal component is configured to have multiple lead wires overall, provided that the internal component has other internal components with one or more lead wires.

[0103] In the above-described embodiment, there are two first lead wires 12, 13 and two second lead wires 22, 23, and the configuration includes a first partition wall 45 separating the first lead wires 12, 13 and a second partition wall 46 separating the second lead wires 22, 23, but the present invention is not limited to this. The present invention also includes a configuration in which there are three or more first lead wires or second lead wires and a partition wall is provided between each of the first lead wires or each of the second lead wires.

[0104] In the above-described embodiment, the corner portions 47a of the first step portion 47 are chamfered, and the corner portions 48a of the second step portion 48 are also chamfered, but this is not limiting. The present invention also includes whether the corner portions 47a of the first step portion 47 are rounded or whether the corner portions 48a of the second step portion 48 are rounded.

[0105] In the above-described embodiment, the connection terminal 30 is used as an electrical conductor connected to another electrical component, but this is not limiting. For example, a general electric wire may be used as the electrical conductor, and this is also within the scope of the present invention. In this case, the core wire exposed at the end of the electric wire may be soldered to a lead wire as the electrical conductor.

[0106] In the above-described embodiment, the first molding section 40 is configured to include the connection terminal holding section 42 that holds a part of the connection terminal 30, but the present invention is not limited to this. Any configuration in which the first molding section 40 includes a partition section that includes a first surface and a second surface is included in the present invention.

[0107] Furthermore, in the above-described embodiment, the first internal component 10 and the second internal component 20 are molded as inserts when the first molded portion 40 is molded, but this is not limited to this. The first internal component 10 and the second internal component 20 do not have to be molded as inserts when the first molded portion 40 is molded. In this case, a configuration in which the inner through-hole 41b is not formed can be adopted. For example, a first molded portion having recesses into which the first internal component 10 and the second internal component 20 can be fitted may be molded separately from the first internal component 10 and the second internal component 20, and the first internal component 10 and the second internal component 20 may be fitted into the recesses of the first molded portion 40. In this case, the first molded portion may be an assembly of multiple components that can be assembled to accommodate the first internal component 10 and the second internal component 20 therein.

[0108] <Modifications of the above-described embodiments> In the embodiments described above, the material, composition, dimensions, shape, relative positional relationship, or implementation conditions of each component may also be described, but these are merely examples in all aspects and are not limited to those described in this specification.

[0109] Therefore, countless modifications and equivalents not shown as examples are contemplated within the scope of the technology disclosed in the present specification, including, for example, modifying, adding, or omitting at least one component, and further, extracting at least one component in at least one embodiment and combining it with a component in another embodiment. [Explanation of symbols]

[0110] 1 Molded parts 2 Internal Component Module 10 First internal part (internal part) 11, 21, 211, 221 Detector element body 12,13,212,222,312,313 First lead wire (lead wire) 12a,13a 1st exposed part 20 Second internal part (internal part) 22,23,213,223,322,323 Second lead wire (lead wire) 22a,23a 2nd exposed part 30, 31, 32, 33, 34 Connection terminals 31a,32a,33a,34a Exposed part 31c, 32c, 33c, 34c Exposed parts for connectors 40 1st molding section 41 Head 41a Recess 41b Inner through hole 42 Connection terminal holder 43,243 Connection section (partition section) 44 Placement section 44a First mounting surface 44b Second mounting surface 45 1st isolation wall 46 Second isolation wall 47 First step 47a Corner section 48 Second step 48a Corner section 50 2nd molding section 51 Head covering part 51a Outer through hole 52 Cylindrical part 53 Connecting part 54 Annular protrusion 60,260,360 Solder part 61, 61a, 61b First solder part (solder part) 62, 62a, 62b Second solder part (solder part) 70 O-rings C side D1, D2, D3, D4 arrows I Front page I-2 Back II Side 2 II-2 Back L Longitudinal direction W width direction

Claims

1. an internal component module including: at least one internal component having an electrical component body and a lead wire extending from the electrical component body; and a first molding portion covering a portion of the internal component; an electrical conductor connected to the lead wire and leading to another electrical component; a solder portion connecting the lead wire and the electrical conductor; a second molding portion covering the internal component module, the electrical conductor, and the solder portion; Equipped with the lead wires include a first lead wire and a second lead wire; The first molding portion includes a partition portion including a first surface and a second surface facing in a direction opposite to a direction in which the first surface faces, the first lead wire has a first exposed portion on the first surface that is exposed from the first molded portion; the second lead wire has a second exposed portion on the second surface that is exposed from the first molded portion, the first lead wire and the second lead wire are arranged at positions where they do not overlap with each other in a plan view from a direction in which the first surface faces or a direction in which the second surface faces, The molded part, wherein the solder portion includes a first solder portion located on the first surface and connecting the first exposed portion and the electrical conductor, and a second solder portion located on the second surface and connecting the second exposed portion and the electrical conductor.

2. 2. The molded part according to claim 1, the internal components include a first internal component and a second internal component; the lead wire extending from the electrical component body of the first internal component is the first lead wire, A molded part, wherein the lead wire extending from the electrical component body in the second internal part is the second lead wire.

3. 3. The molded part according to claim 2, the first lead wires include a plurality of first lead wires; the second lead wire includes a plurality of second lead wires; The first molded portion includes a first isolation wall that separates the first lead wires and a second isolation wall that separates the second lead wires.

4. The molded part according to claim 2 or 3, A molded component, wherein the first internal component and the second internal component are arranged in mirror symmetry with respect to an imaginary plane that passes through the middle of each electrical component body and is along the extension direction of the lead wire.

5. The molded part according to claim 4, The molded part, wherein the first surface is recessed in a direction toward the second surface relative to the second surface in a cross-sectional view perpendicular to the extending direction of the lead wire.

6. The molded part according to claim 5, The first surface is recessed in a direction in which the second surface faces by an amount corresponding to the thickness of the lead wire in a cross-sectional view perpendicular to the direction in which the lead wire extends.

7. The molded part according to claim 5, the partition portion has a first step portion between the first surface and a surface opposite to the second surface, and a second step portion between the second surface and a surface opposite to the first surface, a corner portion of the first step portion is chamfered, A molded part, wherein a corner portion of the second step portion is chamfered.

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