Dual interface card and manufacturing method thereof

Abstract

To provide a dual interface card configured to prevent an antenna from being separated from a card substrate while securing electrical connection reliability between an IC module and the antenna and adhesiveness of the IC module to the card.SOLUTION: A dual interface card 1 includes a card substrate 2, an antenna 8 having a first end 81 and a second end 82, and an IC module 7 having an IC chip and multiple terminals 73a, 73b. The IC module 7 is arranged in a recess 9 of the card substrate 2. The terminals 73a, 73b and the ends 81, 82 are electrically connected so as to face each other. The end 81 (82) is configured by repeatedly folding an antenna wire 83 and has a first section 86 (87) which is exposed and formed of parts other than bent parts and second sections 84a (85a) and 84b (85b) which are buried and include the bent parts. The antenna wire 83 in the second sections is inclined with respect to a surface on which the recess 9 is formed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a dual interface card capable of contact and non-contact communication with an external device. [Background technology]

[0002] Conventional IC cards include contact IC cards, which input and output electrical signals through an external connection terminal on the card surface, and contactless IC cards, which input and output electrical signals via an antenna using electromagnetic induction or other methods. In addition to these, dual-interface cards, which combine the functions of both contact and contactless IC cards with a single IC chip, are also in use. Dual-interface cards can be used as contact IC cards, which are effective in preventing external leakage of input and output data during financial transactions, and as highly convenient contactless IC cards, which allow data to be exchanged in close proximity when entering and exiting a room or using a ticket gate at a station. For this reason, dual-interface cards are becoming increasingly popular in the market.

[0003] A dual interface card is manufactured as follows. First, as described in Patent Document 1, a card substrate including one or more core sheets is formed, and an area for embedding an IC module is cut from the surface of the card substrate. The IC module is then embedded in the area. Conductive wires are arranged on one of the one or more core sheets, and the conductive wires form a wound antenna for providing the contactless communication function and contact terminals that are in electrical contact with terminals of the IC module. The contact terminals are, for example, arranged in a meandering shape.

[0004] In Patent Document 1, when cutting out the area to embed the IC module, a contact opening deeper than the first recess for mounting the outer periphery of the IC module is provided in a portion of the first recess, so that the contact terminal of the winding antenna is exposed only in the contact opening. Therefore, the contact opening is filled with a liquid conductive adhesive to electrically connect the IC module terminal and the contact terminal, and adhesive tape is sandwiched in the remaining first recess to secure the IC module to the card substrate. This poses challenges, such as managing the amount of conductive adhesive filled into the narrow contact opening and managing the adhesion conditions for different types of adhesive, such as the conductive adhesive and adhesive tape.

[0005] Meanwhile, Patent Document 2 describes a hybrid IC card that processes information from an external read / write device in at least one IC chip housed inside the card body, either contact or contactless, and communicates with the external read / write device. In this hybrid IC card, the antenna sheet housed inside the card body is an antenna sheet that includes a wire-wound antenna formed by winding a conductor around a circumference and a connection terminal formed by continuously folding back the conductor, and the conductor of the connection terminal is welded at the point where it is continuously folded back. While this document does not provide detailed explanations, it is believed that when cutting out a mounting hole for embedding an IC module, the entire connection terminal, formed by continuously folding back the conductor of the wire-wound antenna, is exposed on the surface of the mounting hole.

[0006] In this case, unlike Patent Document 1, there is no contact opening for filling with conductive adhesive, and by applying the same conductive adhesive to the mounting hole, the IC module can be fixed to the card body while establishing electrical connection between the IC module and the connection terminal of the wire-wound antenna. However, although the connection terminal of the wire-wound antenna is supported by the card body at the portion that contacts the card body, there is a possibility that the conductor constituting the connection terminal may peel off from the card body due to cutting resistance of the end mill that cuts and forms the mounting hole. In addition, welding part of the conductor of the connection terminal complicates the process. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 2019-219732 [Patent Document 2] Japanese Patent Application Laid-Open No. 2001-155128 Summary of the Invention [Problem to be solved by the invention]

[0008] The present disclosure has been made in consideration of these circumstances, and aims to provide a dual interface card and a manufacturing method thereof that can prevent part of the antenna from peeling off from the card base, and ensure the reliability of the electrical connection between the IC module and the antenna, and the adhesion of the IC module to the card. [Means for solving the problem]

[0009] According to this embodiment, a dual interface card capable of contact communication and contactless communication with an external device comprises a card base, an antenna having at least a plurality of ends arranged inside the card base, and an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip, wherein the IC module is arranged in a recess provided in the card base, the plurality of terminals and the plurality of ends face each other and are electrically connected, the plurality of ends are formed by an antenna wire that constitutes the antenna, which has a repeated folding structure from the outer periphery of the recess toward the center, the plurality of ends being formed by parts other than the bent part of the antenna wire, and comprising: a first part of the antenna wire exposed in the recess; and a second part consisting of a part including the bent part of the antenna wire, wherein the antenna wire is embedded in the card base, and the antenna wire of the second part is inclined with respect to the surface on which the recess is formed.

[0010] In addition, in a dual interface card according to another embodiment of the present invention, the recess may be composed of a first recess of approximately the same depth formed on the outer periphery, and a second recess formed closer to the center than the first recess and deeper than the first recess.

[0011] In a dual interface card according to another embodiment of the present invention, the IC module may have the plurality of terminals and the plurality of end portions that face each other electrically connected to each other via an anisotropic conductive film.

[0012] In addition, in a dual interface card according to another embodiment of the present invention, the outer periphery may be a substantially rectangular shape having sides that are substantially parallel to the short and long sides of the card base, and the multiple ends may be configured by a repeated folding structure from the outer periphery, which is a side of the recess that is substantially parallel to the short sides of the card base, toward the center by the antenna wire that constitutes the antenna.

[0013] In addition, in a dual interface card according to another embodiment of the present invention, when the area of the first portion including the antenna wire that overlaps with the multiple terminals in a planar view is defined as an overlap area, and the area other than the overlap area is defined as a non-overlapping area, the value of the arrangement pitch of the antenna wire in the overlap area may be smaller than the value of the arrangement pitch of the antenna wire in the non-overlapping area.

[0014] In a dual interface card according to another embodiment of the present invention, a portion of the antenna other than the bent portion of the folded structure may be inclined with respect to a straight line along the outer periphery.

[0015] In addition, in a dual interface card according to another embodiment of the present invention, the portion of the folded structure of the antenna may be defined as a first region, and the other region may be defined as a second region, and the first portion may overlap the entire terminal in a planar view, and the second portion may be arranged to surround the periphery of the first portion. It's okay to have one.

[0016] According to another embodiment of the present invention, a method for manufacturing a dual interface card capable of contact communication and contactless communication with an external device includes: an antenna forming step of embedding an antenna wire in a first substrate while applying heat and pressure to form an antenna having multiple ends on one side of the first substrate; a laminating step of laminating a second substrate on the first substrate on which the antenna has been formed, so as to sandwich the antenna; a punching step of punching a laminate of the first substrate and the second substrate into a card-sized card base; a recess forming step of forming a recess in the card base for embedding an IC module; an IC module preparing step of preparing an IC module having an IC chip and multiple terminals electrically connected to the IC chip; and an IC module bonding step of bonding the IC module to the recess of the card base via a conductive adhesive layer so that the multiple terminals and the multiple ends facing each other are electrically connected, The multiple end portions are composed of a first portion of the antenna wire other than the bent portion and exposed in the recess, and a second portion of the antenna wire including the bent portion, where the antenna wire is embedded in the card base. In the antenna forming process, the antenna wire is embedded in the first base material while applying heat and pressure to the antenna wire so that the antenna wire in the second portion is inclined with respect to the surface on which the recess is formed. [Effects of the Invention]

[0017] According to this embodiment, it is possible to provide a dual interface card and a manufacturing method thereof that can prevent part of the antenna from peeling off from the card base, and ensure the reliability of the electrical connection between the IC module and the antenna, and the adhesion of the IC module to the card. [Brief explanation of the drawings]

[0018] [Figure 1]FIG. 2 is a plan view illustrating the structure of the dual interface card according to the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view showing a cross section taken along line AA in FIG. [Figure 3] FIG. 2 is a cross-sectional view showing a cross section taken along line BB in FIG. [Figure 4] 1A and 1B are diagrams illustrating an IC module and a connection between the IC module and an antenna. [Figure 5] 1(b) and 2(a) are a plan view and a cross-sectional view, respectively, corresponding to FIG. 1(b) and FIG. 2(a), illustrating the structure of a dual interface card according to a second embodiment. [Figure 6] FIG. 1(b) is a plan view illustrating the structure of a dual interface card according to a third embodiment of the present invention. [Figure 7] FIG. 1(b) is a plan view illustrating the structure of a dual interface card according to a fourth embodiment of the present invention. [Figure 8] FIG. 4 is a cross-sectional view showing a state before recesses corresponding to FIG. 3(a) are formed. DETAILED DESCRIPTION OF THE INVENTION

[0019] An example of a dual interface card according to the present disclosure will be described below with reference to the drawings, etc. However, the dual interface card according to the present disclosure is not limited to the embodiments and examples described below.

[0020] The figures shown below are schematic illustrations. Therefore, the size and shape of each part are appropriately exaggerated to facilitate understanding. Furthermore, hatching indicating the cross section of a member is omitted as appropriate in each figure. The numerical values such as dimensions of each member and the names of materials described in this specification are examples of embodiments and are not limited to these, and may be selected and used as appropriate. In this specification, terms specifying shapes or geometric conditions, such as parallel, orthogonal, and perpendicular, are intended to include not only their strict meanings but also substantially the same state.

[0021] 1. First embodiment An example of a first embodiment of a dual interface card according to the present disclosure will now be described. For ease of explanation, an XYZ coordinate system will be established for the dual interface card 1. First, as shown in FIGS. 1(a) and 2(b), the Z axis is defined as the normal direction to the main surface of the dual interface card 1. The direction from the main surface on which the external connection terminals 71 of the IC module 7 are not arranged to the main surface on which the external connection terminals 71 are arranged is defined as the +Z direction or upward in the thickness direction, and the opposite direction is defined as the -Z direction or downward in the thickness direction.

[0022] When dual interface card 1 is viewed from the +Z direction, the line perpendicular to both short sides of dual interface card 1 and the Z axis is defined as the X axis, the direction from one short side closer to external connection terminal 71 toward the other short side is defined as the +X direction or rightward direction, and the opposite direction is defined as the -X direction or leftward direction. Furthermore, the axis perpendicular to the X and Z axes is defined as the Y axis, the direction from one long side farther from external connection terminal 71 toward the other long side is defined as the +Y direction or upward direction, and the opposite direction is defined as the -Y direction or downward direction.

[0023] 1(a) is a plan view of the dual interface card 1 as viewed from the +Z direction, and FIG. 1(b) is an enlarged view of the dual interface card 1 of FIG. 1(a) near the external connection terminal 71 to explain the arrangement of the antenna 8. To make the configuration of the antenna 8 easier to understand, the IC module 7 is omitted, and the antenna wire 83 embedded in the card base 2 is indicated by a dashed line. The antenna 8 is not exposed in the area outside the outer periphery 93 of the recess 9. FIG. 2(a) is a cross-sectional view of the dual interface card 1 of FIG. 1(b) taken along line AA as viewed from the -Y direction. The IC module 7 is omitted from FIG. 2(a), and FIG. 2(b) is a view of the dual interface card 1 of FIG. 2(a) with the IC module 7 mounted.

[0024] 3(a) is a cross-sectional view of the dual interface card 1 in FIG. 1(b) taken along line BB, which is orthogonal to line AA, viewed from the -X direction. FIG. 3(a) is a view without the IC module 7, and FIG. 3(b) is a view of FIG. 3(a) with the IC module 7 mounted.

[0025] As shown in FIG. 1(a), dual interface card 1 has the form of a generally rectangular thin plate with rounded corners when viewed from the +Z direction. Furthermore, on the surface of the dual interface card on the +Z direction side, an IC module 7 including external connection terminals 71 is disposed slightly to the upper left of the center, i.e., closer to the -X direction and closer to the +Y direction than the center. As shown in FIGS. 2(a) and 2(b), IC module 7 is embedded in a recess 9 formed in card base 2, and is disposed so that the surface of external connection terminals 71 on the +Z direction side is generally flush with the surface of card base 2 on the +Z direction side. This form of dual interface card 1 complies with ISO / IEC 7816, the international IC card standard.

[0026] As shown in Figure 2(a), the card base 2 that constitutes the card body of the dual interface card 1 is formed by laminating and integrating, in order from the -Z direction, an over-sheet layer 6, a core layer 5, a core layer 4, and an over-sheet layer 3. Typically, the over-sheet layers 6 and 3 are transparent substrates, and the core layers 5 and 4 are white substrates, but this is not limited thereto. In addition, an antenna wire 83 that constitutes the antenna 8 is disposed between the core layers 5 and 4 so as to be sandwiched between them.

[0027] The antenna wire 83 constituting the antenna 8 is partially exposed in a region of the bottom surface 91a of a first recess 91 that is formed relatively shallowly within the recess 9, and is completely buried inside the card base 2 in the rest of the region. In other words, the antenna wire 83 is buried inside the card base 2, but in the process of cutting the card base 2 to form the recess 9, a portion of the antenna wire 83 is cut along with the recess 9 to an extent that the portion does not break, and the cut surface of the antenna wire 83 is exposed on the bottom surface 91a of the first recess 91. In addition to the first recess 91 that is formed on the outer periphery 93 side and has approximately the same depth, the recess 9 further includes a second recess 92 that is formed closer to the center than the first recess 91 and is deeper than the first recess 91.

[0028] As shown in FIG. 2( b), the IC module 7 is embedded such that the external connection terminals 71 and the substrate 72 supporting the external connection terminals 71 are placed on the bottom surface 91 a of the first recess 91 of the recess 9, and the substrate 72 is mechanically joined to the bottom surface 91 a of the first recess 91 of the card base 2 via a conductive adhesive layer 11. Incidentally, the second recess 92 houses an IC chip body 74, which is a protruding portion of the IC module 7. Furthermore, a terminal 73 a electrically connected to an IC chip provided inside the IC module 7 is provided on the surface of the substrate 72 opposite the external connection terminals 71. At this time, due to the effect of heat and pressure when embedding the IC module 7 in the recess 9 of the card base 2, the antenna wire 83 exposed on the bottom surface 91 a and the terminal 73 a are electrically connected via the conductive adhesive layer 11.

[0029] Here, both ends of the antenna wire 83 of the antenna 8, which is formed so that most of it is embedded inside the card base 2 and a portion thereof is exposed from the first recess 91, have the shapes shown as the first end 81 and the second end 82 in FIG. 1(b). That is, the first end 81 and the second end 82, which are both ends of the antenna 8, are arranged side by side along the X-axis direction so that they partially overlap with the first recess 91 in a plan view along the Z-axis. The first end 81 and the second end 82 each have a structure in which the antenna wire 83 is repeatedly folded from the outer periphery 93 of the first recess 91 toward the center of the recess 91.

[0030] In other words, the first end 81 and the second end 82 are formed to have a structure known as a zigzag shape, a meander shape, or a bellows shape. In this way, by increasing the exposed area of the antenna wire 83 per unit area exposed in the recess 9, the reliability of the electrical connection between the terminal 73a of the IC module 7 and the antenna 8 can be improved.

[0031] Furthermore, at the first end 81 and the second end 82 of the antenna wire 83, the portions other than the bent portions at the upper and lower ends of the folded structure are arranged along straight lines m1 and m2 that are parallel to sides 93a and 93b, respectively, along the outer periphery 93 of the first recess 91, i.e., straight lines parallel to the Y-axis. The first end 81 and the second end 82 each include a first portion that is made up of the portions of the antenna wire 83 other than the bent portion, and where the surface of the antenna wire 83 that faces the recess 9 is exposed. Furthermore, the first end 81 and the second end 82 each include a second portion that is adjacent to both ends of the first portion and is made up of a portion that includes the bent portion of the antenna wire 83, and where the antenna wire 83 is embedded in the card base 2 and is not exposed.

[0032] The first portions are exposed regions 86 and 87, which are regions consisting of a collection of approximately linear portions including the central portion along the Y axis of antenna wire 83 at first end 81 and second end 82. Exposed regions 86 and 87 are arranged so that the distance from the surface of card base 2 on which recess 9 is formed to antenna wire 83 is a relatively shallow first distance. The second portions are covered regions 84a, 84b and 85a, 85b, which are adjacent to exposed region 86 as covered regions 84a and 84b, respectively, at both ends of first end 81 on the +Y direction side and the -Y direction side along the Y axis.

[0033] Similarly, the second portion is provided at both ends of the second end 82 on the +Y direction side and the −Y direction side along the Y axis as covered regions 85a and 85b adjacent to the exposed region 87. In covered regions 84a, 84b and 85a, 85b, the antenna wire 83 is inclined in a direction away from the surface of the card base 2 on which the recess 9 is formed, relative to the antenna wire 83 in exposed regions 86 and 87. In other words, the antenna wire 83 is arranged so that the distance from the surface of the card base 2 on which the recess 9 is formed to the antenna wire 83 is inclined from a first distance to a second distance that is longer than the first distance.

[0034] Therefore, the depth from the surface of the card base 2 where the recesses 9 are not formed to the first recess 91 is approximately the same at every point, but due to the embedding depth relationship described above, the antenna wires 83 at the first end 81 and the second end 82 are exposed on the surface of the first recess 91 in certain areas, and are covered and embedded in the card base 2 in other areas.

[0035] In the exposed regions 86 and 87, the antenna wire 83 is exposed from the surface of the first recess 91 of the card base 2, and in the covered regions 84a, 84b and 85a, 85b, the antenna wire 83 is buried deeper than the surface of the first recess 91 of the card base 2. The way in which the antenna wire 83 of the first end 81 is buried in the card base 2 is as shown in Figures 3(a) and 3(b). That is, in the exposed region 86, the antenna wire 83 is disposed substantially parallel to the bottom surface 91a of the first recess 91 of the card base 2, i.e., along the Y axis, and the portion on the +Z direction side is cut away to expose the conductor portion.

[0036] On the other hand, in the covered areas 84a and 84b, the antenna wire 83 is disposed at an angle θ1 with respect to the bottom surface 91a of the first recess 91 of the card base 2, i.e., the direction along the Y axis, and most of the portion on the +Z direction side is embedded in the card base 2. In the covered areas 84a and 84b, the respective antenna wires 83 are inclined approximately symmetrically along the Z axis, i.e., approximately line-symmetrically.

[0037] The dual interface card 1 of this embodiment has the above-described features. Therefore, in the exposed regions 86 and 87 of the first end 81 and the second end 82, which are formed by the folded-back structure of the antenna wire 83, the exposed antenna wire 83 is aligned along the X-axis at a relatively narrow pitch. This ensures good electrical connection between the terminals 73a and 73b of the IC module 7 and the antenna wire 83 via the conductive adhesive layer 11. Furthermore, because the first recess 91 formed along the outer periphery 93 of the IC module 7 is formed to approximately the same depth at any point, it is easy to electrically connect the IC module 7 and the antenna 8 and mechanically connect the IC module 7 and the card base 2 via the conductive adhesive layer 11 made of the same material.

[0038] Furthermore, the antenna wire 83 is embedded in the card base 2 in the covered regions 84a, 84b and 85a, 85b, which are the tip portions on the +Y and −Y directions sides of the exposed regions 86, 87 of the first end 81 and the second end 82. Therefore, when the recess 9 including the first recess 91 is formed by cutting, the cutting resistance of the end mill prevents the antenna wire 83, which is partially embedded in the card base 2, from peeling off from the card base 2. This is because both ends of the first end 81 and the second end 82 along the Y-axis direction are embedded and fixed in the card base 2. This prevents a portion of the antenna from peeling off from the card base, ensuring the reliability of the electrical connection between the IC module and the antenna and the adhesion of the IC module to the card.

[0039] The configuration of the dual interface card 1 of this embodiment and the manufacturing method thereof will be described in detail below.

[0040] (a) Card base The card base 2 refers to the card body excluding the IC module 7 that constitutes the dual interface card 1. As described above, the card base 2 typically has a configuration in which an over-sheet layer 6, a core layer 5, a core layer 4, and an over-sheet layer 3 are laminated in this order from one end of the card base 2 in the -Z direction in the thickness direction. Between the core layers 5 and 4, an antenna 8 wound in a loop shape and formed from a coated conductor wire or the like is disposed. The card base 2 may refer to both the card before the recess 9 is formed and the card after the recess 9 is formed, and may refer to both the card with and without the antenna 8. Furthermore, the first end 81 and the second end 82 of the antenna 8 are disposed with the antenna wire 83 processed into a predetermined shape, as described above.

[0041] However, the layer configuration of the card base 2 is not limited to this, and may be a three-layer configuration of an over-sheet layer, a core layer, and an over-sheet layer, a two-layer configuration of a core layer and a core layer, or a five-layer configuration of an over-sheet layer, a core layer, a core layer with an antenna formed thereon, a core layer, and an over-sheet layer, etc. Furthermore, printing or an embedded magnetic stripe may be applied to the surface of the over-sheet layer 3 or 6 of the card base 2 opposite to the core layer 4 or 5, or printing may be applied to the surface of the core layer 4 or 5 adjacent to the over-sheet layer 3 or 6.

[0042] From the standpoint of conforming to standards such as ISO / IEC 7816, the thickness of the card base 2 is preferably 0.76 mm or more and 0.84 mm or less, but may be outside this range.

[0043] (i) Core layer A wide variety of white or colored plastic sheets can be used for the core layers 4 and 5, including the following single films or composite films: polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, polyurethane, etc. The thickness of the core sheet can be selected appropriately taking into account the overall thickness of the card, but can be, for example, approximately 0.25 mm or more and 0.38 mm or less. As described below, antenna 8 must be positioned on the surface of either core layer 4 or 5 so that it is sandwiched between the two core layers.

[0044] (ii) Oversheet layer The over-sheet layers 3 and 6 are usually made of the same material as the core layer, but are often made of a transparent material with a thickness of about 0.05 mm to 0.10 mm. From the viewpoint of preventing curling when the laminate of the core layer and the over-sheet layer is integrated by heat pressing or the like, it is preferable that the over-sheet layers 3 and 6 have the same thickness, but they do not necessarily have to be the same.

[0045] The material for the over-sheet layer may be any material that is adhesive when heated, but even if the over-sheet layer itself is not adhesive when heated, the core layer and the over-sheet layer can be integrated by additionally forming a layer of a known adhesive that generates adhesive force when heated between them. Furthermore, when dual interface card 1 is used as a magnetic card, a magnetic stripe may be embedded in advance by thermal transfer or the like into one or both of over-sheet layers 3 and 6 on the main surface opposite core layers 4 and 5.

[0046] (iii) Antenna sheet In this embodiment, as described below, the antenna 8 is formed on one surface of the core layer 5, and the first end 81 and the second end 82, which are the ends of the antenna wire 83 that constitute the antenna 8, are each processed into a predetermined shape and arranged. The formation of the antenna 8 on the core layer 5 is performed by applying a predetermined heat and pressure to the antenna wire 83, and embedding the antenna wire 83 in the core layer 5 while melting the core layer 5 and the coating of the antenna wire 83. The intermediate product in which the antenna 8 is embedded in the core layer 5 is sometimes referred to as an antenna sheet 12. The antenna sheet 12 can be distributed on the market by itself as a component for manufacturing the dual interface card 1, or a commercial model in which a sheet material such as the core layer 5 is supplied to a processor, who processes it into the antenna sheet 12 and delivers it to the supplier.

[0047] The method for forming the antenna sheet 12 will be described in detail later, but can be summarized as follows: First, a coated conductor coated with an insulating member is embedded into the surface of the core layer 5 using a winding former, starting from either one of the first ends 81 or 82 and ending at the other. That is, while applying a predetermined heat and pressure to the core layer 5, an antenna supply head is drawn into a loop shape as shown in FIG. 1(a), and antenna wires 83 supplied from the antenna supply head are sequentially embedded into the core layer 5.

[0048] Here, the first end 81 and the second end 82, which are either the start point or the end point of the antenna wire 83, are aligned in the left-right direction of the intended mounting position of the IC module 7 to form a predetermined shape described below, and are arranged so that portions of them overlap the terminals 73a and 73b of the IC module 7. Then, the winding forming machine cuts the antenna wire 83 after forming either the first end 81 or the second end 82, which are the end points of the antenna 8. In this way, the core layer 5 (antenna sheet 12) on which the antenna 8 is formed is obtained.

[0049] (iv) Antenna Terminals 73a and 73b of the IC module 7 are electrically connected to a first end 81 and a second end 82 of the antenna 8 formed on the core layer 5, respectively, so that the IC chip of the IC module 7 and the antenna 8 form a communication circuit for contactless communication. The communication circuit may be one that performs close-proximity communication using, for example, the 13.56 MHz HF frequency band specified in ISO / IEC 18092 or ISO / IEC 144443. Alternatively, the communication circuit may be one that performs communication using other frequency bands, such as the 920 MHz UHF frequency band, the 125 kHz LF frequency band, or the 2.45 GHz microwave frequency band.

[0050] When dual interface card 1 is held over an external device such as a reader / writer, the magnetic field generated by the reader / writer generates an electromotive force or current in the communication circuit, which supplies power to the IC chip. This enables the IC chip to be driven, enabling contactless transmission and reception of information with the reader / writer and reading and rewriting of information from and to the memory.

[0051] The antenna wire 83 constituting the antenna 8 is typically formed of a coated conductor wire, which is a copper wire coated with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum can also be selected. By using coated conductor wire, the dual interface card 1 can be manufactured more inexpensively than, for example, copper foil etching methods.

[0052] The diameter of the antenna wire 83 is not particularly limited as long as it can ensure the characteristics as a contactless communication circuit, but it can be, for example, 0.03 mm or more and 0.30 mm or less, and preferably 0.05 mm or more and 0.15 mm or less. By setting the diameter in the latter range, durability against heat pressure during embedding and external forces due to cutting can be improved, and good communication characteristics can be ensured.

[0053] Next, the configurations of the first end 81 and the second end 82 will be described in detail. At the first end 81 in Fig. 1(b), one end of the antenna 8 extending from the -X direction toward the +X direction subsequently forms a repeatedly folded structure from the outer periphery 93 of the recess toward the center in a plan view along the Z axis. That is, the antenna wire 83 extends from the -X direction toward the +X direction so that the folded structure is repeated multiple times.

[0054] The folded structure has substantially arc-shaped bent portions at the ends on the +Y direction side and the -Y direction side, i.e., the upper end and the lower end, and the portion other than the bent portion connecting the bent portion at the upper end and the bent portion at the lower end is substantially straight or curved. However, from the viewpoint of the efficiency of the process of embedding the antenna wire 83 in the core layer 5 and of saving the material of the antenna wire 83, it is preferable to form the portion other than the bent portion as substantially straight as possible. Note that the second end 82 has the same configuration as the first end 81 except that it is substantially symmetrical with respect to the Y axis, and at the second end 82, the antenna wire 83 extends from the +X direction side toward the -X direction side so that the folded structure is repeated multiple times in succession.

[0055] Furthermore, the portions of each of the first end 81 and the second end 82 other than the bent portions of the folded structure are arranged along straight lines m1 and m2 that are approximately parallel to the Y axis and that align with sides 93a and 93b of the outer periphery 93 of the recess 9, and the zigzag arrangement pitch between adjacent portions other than the bent portions is approximately constant. Furthermore, in a plan view along the Z axis direction, the first end 81 and the second end 82 are each formed to follow the outline of a substantially rectangular shape surrounded by two sides along the X axis direction and two sides along the Y axis direction. However, both the first end 81 and the second end 82 may follow the outline of a shape other than a substantially rectangular shape, such as a parallelogram, a rhombus, or a substantially polygonal shape, or may follow the outline of a shape surrounded by multiple line segments and multiple curves, such as a circular arc and a straight line.

[0056] On the other hand, as shown in FIGS. 3( a) and 3(b), when the first end 81 is viewed in cross section along the X-axis direction, the position of the antenna wire 83 along the thickness direction of the card base 2, i.e., along the Z-axis direction, is not constant. In the exposed region 86 of the antenna wire 83 at the first end 81, which includes the central portion along the Y-axis direction, the antenna wire 83 is disposed so as to be substantially parallel to the Y-axis, and its +Z-side surface is exposed at the bottom surface 91a of the first recess 91. The bottom surface 91a of the first recess 91 is also substantially parallel to the Y-axis. However, in the covered regions 84a and 84b, which are the ends of the exposed region 86 on the +Y-axis side and the −Y-axis side, respectively, of the antenna wire 83 at the first end 81, the antenna wire 83 is disposed so as to be inclined by a predetermined angle along the Y-axis. That is, the antenna wire 83 at the first end 81 is bent toward the −Z direction at both ends of the exposed region 86 and disposed so as to be inclined so as to be recessed into the card base 2. In other words, the antenna wires 83 in the covered regions 84a and 84b are inclined relative to the antenna wires 83 in the exposed regions 86 and 87 in a direction away from the surface of the card base 2 on which the recess 9 is formed.

[0057] Because the antenna wire 83 of the first end 81 is arranged as described above, the distance from the surface of the card base 2 on the side where the first recess 91 is formed without the recess 9 or from the surface before the recess 9 is formed to the antenna wire 83 varies depending on the location along the Y axis. The distance from the surface of the card base 2 to the antenna wire 83 in the exposed area 86 is the same as the depth from the surface of the card base 2 to the bottom surface 91a of the first recess 91, and this can be referred to as the first distance. In FIG. 3(a), the first distance is d1.

[0058] The longest distance from the surface of the card base 2 to the antenna wire 83 in the covered area 84a is the edge of the covered area 84a in the +Y direction, which can be referred to as the second distance. In FIG. 3(a), the second distance is d2. The same applies to the covered area 84b. In this case, the value of d2 is greater than the value of d1. If the diameter of the antenna wire 83 is d0, the first distance d1 is considered to approximate the distance from the surface of the card base 2 to the approximate center position of the cross section of the antenna wire 83 before cutting the exposed area 86. Therefore, the difference d12 between the second distance and the first distance is defined as d12 = d2 - d1, and it is preferable that d12 > d0 / 2. When this condition is satisfied, the antenna wire 83 in the covered areas 84a and 84b is suitably embedded in the card base 2, and the holding force for fixing the antenna wire 83 to the card base 2 is increased.

[0059] In this embodiment, the first distance is defined as the distance from the surface of the card base 2 to the antenna wire 83, that is, the distance from the surface of the card base 2 to the cut surface of the antenna wire 83, i.e., the distance from the surface of the card base 2 to the center of the cross section of the antenna wire 83 along the thickness direction of the card base 2.

[0060] However, the distance from the surface of the card base 2 to the antenna wire 83 in the present disclosure is not limited to this, and for example, both the first distance and the second distance may be the distance from the surface of the card base 2 to the center of the cross section of the antenna wire 83 along the thickness direction of the card base 2. In this case, the first distance may be estimated from the center position of the cross section of the original antenna wire 83 in the cut state.

[0061] Here, in a cross-sectional view from the -X direction, in covered region 84a on the +Y direction side of exposed region 86, antenna wire 83 is inclined counterclockwise by angle θ1 with respect to the Y axis direction, and in covered region 84b on the -Y direction side of exposed region 86, antenna wire 83 is inclined clockwise by angle θ1 with respect to the Y axis direction. In other words, antenna wires 83 in covered regions 84a and 84b are arranged so that they are inclined approximately symmetrically with respect to the Z axis.

[0062] In other words, the antenna wires 83 in the covered regions 84a and 84b are arranged so as to be substantially symmetrical with respect to each other. However, the absolute values of the inclination angles of the antenna wires 83 in the covered regions 84a and 84b with respect to the Y-axis direction do not necessarily need to be the same, and they do not necessarily have to be substantially symmetrical with respect to each other. In addition, in a cross-sectional view from the -X direction, the antenna wires 83 in the covered regions 84a and 84b have been described as extending in a substantially linear manner inclined by angle θ1, but this is not limited thereto. The antenna wires 83 in the covered regions 84a and 84b may extend in a curved manner, such as a substantially arc-like shape, or in a broken line manner, such as a substantially stepped shape. The above descriptions regarding the first end 81, the exposed region 86, and the covered regions 84a and 84b also apply to the second end 82, the exposed region 87, and the covered regions 85a and 85b.

[0063] There are no particular limitations on the inclination angle θ1 of the antenna wire 83 in the covered areas 84a and 84b with respect to the Y-axis direction, as long as the antenna wire 83 is appropriately embedded in the card base 2 in the covered areas 84a and 84b. The angle θ1 is preferably, for example, 1 degree or more and 30 degrees or less, and more preferably 2 degrees or more and 20 degrees or less. By keeping the angle θ1 in the former range, it is possible to prioritize either ensuring reliable coverage of the antenna wire in the covered areas or stabilizing the work of embedding the antenna wire. By keeping the angle θ1 in the latter range, it is possible to achieve both stabilization of the work of embedding the antenna wire and ensuring reliable coverage of the antenna wire in the covered areas.

[0064] As a result, the depth of the first recess 91 is formed to be approximately the same everywhere in the recess 9, but the first end 81 has an exposed region 86 and covered regions 84a and 84b which are both ends of the exposed region 86 along the Y-axis direction. The exposed region 86 is a region where the antenna wire 83 is exposed in the first recess 91, and the covered regions 84a and 84b are regions where the antenna wire 83 is not exposed in the first recess 91 but is embedded in the card base 2. The same is true for the second end 82.

[0065] The IC module 7 typically has a contour shape that is substantially rectangular with rounded corners when viewed in a plan view along the Z axis. In this case, the contour shape of the recess 9 is also substantially the same as the contour shape of the IC module 7. Specifically, in consideration of the accuracy of the mounting position of the IC module 7 on the card body 2, the contour shape is often made approximately 0.1 mm to 0.2 mm larger than the contour shape of the IC module 7. In this case, the outer periphery 93 of the recess 9 is substantially rectangular with sides substantially parallel to the short and long sides of the card body 2, and the first end 81 and the second end 82 are formed by a structure in which the antenna wire 83 is repeatedly folded back from the outer periphery 93, which is the side of the recess 9 that is substantially parallel to the short sides of the card body 2, toward the center.

[0066] On the other hand, if the contour shape of the IC module 7 and recess 9 is an ellipse or the like, the straight line along the side of the outer periphery 93 of the recess 9 indicates a tangent to the center of the side, since the side is a curve such as an arc. Usually, the contour of the IC module 7 is configured to be symmetrical in the vertical and horizontal directions, so if the first end 81 and the second end 82 are formed in the horizontal direction, the straight line along the side of the outer periphery 93 of the recess 9 will be a straight line parallel to the Y axis.

[0067] The arrangement pitch of the zigzag shape of the antenna wires 83 at the first end 81 depends on factors such as the capacity of the winding machine and the quality of the antenna sheet 12 after the antenna wires 83 are embedded in the core layer 5, but is preferably 0.50 mm or less, and more preferably 0.25 mm or less. By setting the arrangement pitch within the former range, the exposed area of the antenna wires 83 per unit area at the first end 81 can be increased, thereby expanding the area for electrical connection with the terminals 73a of the IC module 7. This improves the reliability of the electrical connection and reduces the electrical resistance at the contact points between the antenna wires 83 and the terminals 73a. By setting the arrangement pitch within the latter range, the above-mentioned effects can be further enhanced.

[0068] In this embodiment, of the region of first end 81 along the X-axis direction, the end on the +X direction side is substantially coincident with the boundary between first recess 91 and second recess 92, and the end on the −X direction side is located closer to the −X direction than the end of first recess 91, which is the outer periphery 93 of recess 9. In this way, when the end on the +X direction side of first end 81 is substantially coincident with the boundary between first recess 91 and second recess 92 or is located closer to the −X direction than this, it is possible to not cut antenna wire 83 when cutting second recess 92, or to reduce the amount of cutting of antenna wire 83. This makes it possible to suppress unintended branching of antenna wire 83, i.e., the occurrence of whiskers, which is more likely to occur as the cutting depth increases.

[0069] Furthermore, in the region of first end 81 along the X-axis direction, the end on the -X direction side is located closer to the -X direction than the end of first recess 91, which is the outer periphery 93 of recess 9. This ensures that the densely packed region of antenna wire 83 remains uninterrupted even if there is a misalignment of antenna 8 with respect to core layer 5 or a misalignment of the formation position of recess 9. This ensures a reliable electrical connection with terminal 73a of IC module 7. However, in the region of first end 81 along the X direction, the end on the +X direction side may be located closer to the +X direction than the boundary between first recess 91 and second recess 92, or the end on the -X direction side may be located closer to the +X direction than the end of first recess 91, which is the outer periphery 93 of recess 9.

[0070] The above description is about the relationship between the first end 81 of the antenna 8 and the terminal 73a of the IC module 7 that is electrically connected thereto, but the same relationship also holds between the second end 82 and the terminal 73b that is electrically connected thereto. Also, in this embodiment, the description is based on the premise that the antenna 8 has two ends, the first end 81 and the second end 82, for electrically connecting with the IC module 7, but the antenna 8 may have three or more ends, and the IC module 7 may have the same number of corresponding terminals.

[0071] (b) IC module Next, each of the main components of the IC module 7 will be described mainly with reference to FIGS. 2(b) and 4. FIG. 4(a) is a view of the external connection terminal 71 side of the IC module 7 from the +Z direction, similar to FIG. 1(a). FIG. 4(b) is a view of the IC module 7 from the -Z direction, opposite to FIG. 4(a). Most of the molded portion 74b of the IC chip body 74 is omitted here to allow a see-through view of the interior. FIG. 4(c) is an enlarged cross-sectional view of portion C near the terminal 73a in FIG. 2(b).

[0072] The IC module 7 is embedded in a recess 9 formed in the card base 2, and terminals 73a and 73b of the IC module 7 are electrically connected to a first end 81 and a second end 82 of the antenna 8, respectively, thereby forming a communication circuit for contactless communication. At this time, contact communication with a contact-type reader / writer or the like can be performed through the external connection terminal 71 provided on the IC module 7.

[0073] Substrate 72 is formed by bonding copper foil to the front and back of a flexible insulating resin film, such as glass epoxy resin or polyimide resin, with an adhesive, and leaving the copper foil on the front and back of the resin film so as to form a predetermined pattern. Specifically, a photosensitive material is applied, a film plate with a predetermined pattern is placed, exposed, and the non-photosensitive portion is etched away to form external connection terminal 71 on one copper foil surface of the resin film and terminals 73a and 73b on the other copper foil surface. This process sequentially forms substrate 72, with copper foil remaining in the predetermined pattern on the front and back of the resin film. Substrate 72 also has a plurality of bonding holes 76, which are through-holes for wire bonding to external connection terminal 71, pre-formed in the substrate.

[0074] As shown in Fig. 4(a), the external connection terminal 71 has sections defined for the external terminal as defined by the ISO / IEC 7816-2 standard. As shown in Fig. 4(b), these sections are connected to the IC chip 74a by wires 75 such as gold wires through the bonding holes 76 provided in the substrate 72. Similarly, the terminals 73a and 73b are connected to the IC chip 74a by wires 75. These bonding holes 76 and wires 75 are covered and protected by the molded portion 74b.

[0075] An IC chip body 74 is disposed on the surface of the substrate 72 opposite to the surface on which the external connection terminals 71 are formed. The IC chip body 74 is composed of an IC chip 74a adhered and fixed to the substrate 72 with an adhesive, bonding wires 75 for connection, and a molded portion 74b made of sealing resin for protecting these. The IC chip 74a includes a CPU for controlling both contact and contactless communication operations, storage devices such as RAM, ROM, EEPROM, and flash memory, and various circuits such as an interface circuit for decoding input signals and generating output signals for contact and contactless communication, and a power generation circuit. Note that these various circuits may be provided as elements separate from the IC chip 74a.

[0076] The molded portion 74b is provided as a protruding portion that covers the IC chip 74a and the wires 75 to protect them from external force loads and environmental loads. The molded portion 74b is made of an ultraviolet curable resin, a thermosetting resin, or the like.

[0077] (c) Conductive adhesive layer After forming a recess 9 for embedding the IC module 7 in the card base 2 by cutting using an end mill or the like, the conductive adhesive layer 11 is described below, which embeds and fixes the IC module 7 in the recess 9 and electrically and mechanically connects it to the recess 9. As shown in Fig. 4(c), the conductive adhesive layer 11 is a liquid or tape-like member that is disposed so as to be sandwiched between the core layer 5 in the portion where the antenna wire 83 is partially cut away and exposed on the bottom surface 91a, the substrate 72 of the IC module 7, and the terminal 73a formed on the substrate 72.

[0078] The conductive adhesive layer 11 may be applied or attached in advance to the surface of the substrate 72 of the IC module 7 opposite the external connection terminal 71, or may be applied or attached to the bottom surface 91a of the recess 9 of the card base 2 after cutting.

[0079] A typical conductive adhesive layer 11 also serves as a mechanical connection between the IC module 7 and the cut card base 2, and may be applied or attached to the entire back surface of the substrate 72 or to a portion of the recess 9 that corresponds to the first recess 91. In this way, the same type of conductive adhesive layer 11 can be used to electrically connect the IC chip 74a and the antenna 8 and to mechanically connect the IC module 7 and the card base 2, which contributes to simplification of the process.

[0080] However, the conductive adhesive layer 11 may be applied and stuck to the rear surface of the substrate 72 so as to cover only the areas of the terminals 73a and 73b, and another adhesive that is not conductive may be applied and stuck to the rest of the rear surface of the substrate 72. This is because the other adhesive does not need to be considered in terms of conductivity, making it easier to select an adhesive that is more advantageous for mechanical connection.

[0081] The conductive adhesive layer 11, which can be used for both electrical and mechanical connection, can be anisotropically conductive film (ACF) or anisotropically conductive paste (ACP). Other materials that can be used include conductive pastes, such as epoxy resin with silver particles dispersed as a filler. When using ACF, the ACF can be thermally laminated over the entire back surface of the substrate 72 of the IC module 7, and the IC module 7 can then be embedded in the recess 9 of the card base 2 after being cut. This allows for heat pressing at a predetermined temperature and load. This facilitates electrical connection between the IC chip 74a and the antenna 8. Furthermore, the mechanical connection of the IC module 7 to the card base 2 can be simultaneously achieved, simplifying the process of mounting the IC module 7 on the card base 2.

[0082] The electrical connection between the IC chip 74a and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2 when an ACF is used as the conductive adhesive layer 11 can be explained as follows, based on Figure 4(c). The conductive adhesive layer 11 has a configuration in which conductive particles 11a, each consisting of spherical resin or metal spheres surrounded by a metal film, are dispersed in an adhesive 11b, which is a binder containing an adhesive component. Here, thermal pressure is applied to the substrate 72 from the +Z direction to the -Z direction so that the conductive adhesive layer 11, which is arranged so as to be sandwiched between the core layer 5 from which a portion of the antenna wire 83 is exposed, the substrate 72 of the IC module 7, and the terminals 73a formed on the substrate 72, is compressed.

[0083] As a result, strong thermal pressure is applied to the area of the conductive adhesive layer 11 that is particularly narrow and is sandwiched between the core layer 5 and the terminal 73a, and the conductive particles 11a of the conductive adhesive layer 11 in this area are pressed against the exposed antenna wire 83 of the core layer 5 and the terminal 73a along the thickness direction of the conductive adhesive layer 11. Furthermore, if the conductive particles 11a are small, the conductive particles 11a overlap in a daisy chain manner from the antenna wire 83 to the terminal 73a along the thickness direction of the conductive adhesive layer 11. In other words, the exposed antenna wire 83 and the terminal 73a are electrically connected via the conductive particles 11a.

[0084] On the other hand, between the core layer 5 and the substrate 72 in the region where the terminals 73a are not present, the conductive particles 11a are not compressed to the extent that they are pressed against the antenna wire 83 and the terminals 73a along the thickness direction of the conductive adhesive layer 11, or to the extent that they overlap in a daisy chain fashion. However, the adhesive force of the adhesive 11b generated by the thermal pressure mechanically connects the core layer 5 and the substrate 72.

[0085] (d) Manufacturing method of dual interface card 1 Next, an example of a method for manufacturing the dual interface card 1 using the card base 2, IC module 7, and conductive adhesive layer 11 described above will be described.

[0086] First, a coated conductor wire coated with an insulating member is embedded as an antenna wire 83 using a winding former, starting from either the first end 81 or the second end 82 and ending at the other, on the surface of either the core layer 5 or 4 on the side not adjacent to the over-sheet layer 6 or 3. Specifically, for example, while applying a predetermined heat and pressure to the core layer 5, an antenna supply head is drawn into a loop shape as shown in FIG. 1(a), and the antenna wire 83 supplied from the antenna supply head is successively embedded in the core layer 5.

[0087] Here, antenna wire 83 is arranged at predetermined positions on the left and right of the planned mounting position of IC module 7 so that first end 81 and second end 82 are aligned in the left-right direction, and antenna wire 83 is cut at its end point. The movement of the winding machine is changed to adjust the arrangement position of antenna wire 83 so that first end 81 and second end 82 are formed by the antenna wire 83 constituting antenna 8 having a repeated folded structure extending from the outer periphery 93 toward the center of recess 9. Furthermore, antenna 8 is formed by being embedded in core layer 5 so that the portion of antenna wire 83 other than the bent portion of the folded structure is aligned along a straight line along the Y-axis, which is a straight line along the outer periphery 93, and so that first end 81 and second end 82 each follow the outline of a rectangle.

[0088] When the winding machine embeds the antenna wire 83 into the core layer 5, the antenna supply head is moved at a relatively high speed for the portions of the antenna wire 83 other than the bent portions of the folded-back structure at the first end 81 and the second end 82. This condition is sometimes referred to as the first condition. As a result, the amount of heat transferred from the antenna supply head to the core layer 5 via the antenna wire 83 is reduced, and the antenna wire 83 is embedded relatively shallowly into the core layer 5. On the other hand, for the bent portions of the antenna wire 83, the antenna supply head is moved at a relatively low speed. As a result, the amount of heat transferred from the antenna supply head to the core layer 5 via the antenna wire 83 is increased, and the antenna wire 83 is embedded relatively deeply into the core layer 5. This condition is sometimes referred to as the second condition.

[0089] To accurately embed the bent portion of the antenna wire 83, which is approximately arc-shaped, into the core layer 5, the shape precision of the antenna 8 can be improved by moving the antenna supply head more slowly than for the non-bent portion of the antenna wire 83, which is often approximately straight. However, if the structure of the winding forming machine allows the temperature applied to the antenna wire 83 by the antenna supply head to be changed at high speed, the movement speed of the antenna supply head may be left unchanged or changed only slightly, and the temperature applied to the antenna wire 83 may instead be changed. This also applies to the following embodiments, etc.

[0090] As a result of the above, the arrangement of antenna wire 83 at first end 81 when viewing a cross section of card base 2 along the X axis is as shown in Figures 3(a) and 3(b). That is, of antenna wire 83 at first end 81, antenna wire 83 is arranged along the Y axis in exposed region 86. Furthermore, in covered regions 84a and 84b at the ends of exposed region 86 on the +Y direction side and the -Y direction side, respectively, antenna wire 83 is arranged along the Y axis, tilted toward the -Z direction by a predetermined angle.

[0091] Next, as shown in Figure 2, over-sheet layer 6, core layer 5, core layer 4, and over-sheet layer 3 are stacked in this order from the bottom in the thickness direction. After that, each large-sized sheet laminate with cards arranged vertically and horizontally in multiple faces is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the laminate via the stainless steel plates. At this time, an antenna 8 has already been formed on core layer 5.

[0092] By undergoing such a heat pressing process, a card base consisting of large sheets in which the layers of the laminate are integrated can be obtained. If either the oversheet layer or the core layer has heat resistance such that they do not heat-seal at a predetermined temperature, an adhesive sheet that heat-seals at a predetermined temperature can be sandwiched between the layers, or an adhesive can be applied, and then the resulting mixture can be subjected to the heat pressing process to obtain a card base consisting of large sheets in which the layers are integrated.

[0093] The large-sized card substrate obtained as described above, on which cards are arranged in a multi-faced array, is punched out by a punching machine into card substrates 2 that meet the ISO / IEC 7816 card size. In addition, recesses 9 for embedding IC modules 7 are formed in the card substrate 2 by cutting using an end mill. This results in the cut card substrate 2. As described above, the recesses 9 are made up of two stages: a first recess 91 for accommodating the flat substrate 72 of the IC module 7, and a second recess 92 for accommodating the convex IC chip body 74.

[0094] Here, the embedding depth of the antenna 8 will be described using FIG. 8. FIG. 8 is a diagram showing a cross-section of the card substrate 2 before the formation of the recess 9, corresponding to FIG. 3(a). The depth of the first recess 91 is associated with the embedding depths of the first end 81 and the second end 82 of the antenna 8. That is, when the first recess 91 is formed by cutting, the antenna wires 83 in the exposed regions 86 and 87 of the first end 81 and the second end 82 are exposed on the bottom surface 91a of the first recess 91. In other words, the depth from the surface on the side where the external connection terminal 71 of the card substrate 2 is exposed to the bottom surface 91a of the first recess 91 is the first distance d1, and the distance to the upper end of the antenna wire 83 on either one of the exposed regions 86 and 87 is d01. Also, the distance from the said surface to the lower end of the said one antenna wire 83 is d02. At this time, for the values of d1, d01, and d02, d01 < d1 < d02 holds. This is because if this is not satisfied, the antenna wire 83 will be disconnected or will not be exposed from the bottom surface 91a due to cutting.

[0095] Also, the recess 9 is formed so that the surface of the external connection terminal 71 is substantially flush with the surface of the non-cutting region of the card substrate 2. Here, the thickness of the substrate 72 of the IC module 7 is about 0.07 mm or more and 0.2 mm or less, and the thickness of the IC chip body 74 is about 0.45 mm or more and 0.75 mm or less. Also, the thickness of the conductive adhesive layer 11 is usually about 0.03 mm or more and 0.2 mm or less. Considering these, the depth of the first recess 91 is usually about 0.1 mm or more and 0.4 mm or less, and the depth of the second recess 92 is usually about 0.48 mm or more and 0.78 mm or less. Note that the depth of the second recess 92 is deeper than the depth of the first recess 91.

[0096] Meanwhile, separate from the manufacturing of the card base 2 and the cutting process for forming the recess 9, the conductive adhesive layer 11 is attached to the IC module 7. The IC module 7 is typically a module tape in which the IC module 7 is continuously formed on a long tape in one or two rows. A tape-shaped ACF is attached to the surface of this module tape opposite the surface on which the external connection terminals 71 are formed, while applying a certain amount of heat and pressure. The module tape with the ACF attached is then punched out with a punching machine into a roughly rectangular IC module 7 with rounded corners, thereby obtaining the IC module 7 with the conductive adhesive layer 11 attached.

[0097] Thereafter, the IC module 7 with the conductive adhesive layer 11 attached is embedded in the card base 2 with the recess 9 formed therein, and a predetermined heat block is pressed against the external connection terminal 71 to apply a predetermined heat pressure toward the card base 2 for a predetermined time. This melts the conductive adhesive layer 11 made of ACF, thereby establishing electrical connections between the terminals 73a and 73b of the IC module 7 and the first end 81 and second end 82 of the antenna 8, as well as mechanical connections between the IC module 7 and the card base 2. The application time and heat pressure conditions vary depending on the type and composition of the ACF, but an example is a time of 0.5 seconds to 10.0 seconds, a temperature of 150°C to 250°C, and a pressure of 20 MPa to 100 MPa.

[0098] (e) Dual Interface Card of the First Embodiment In summary, the dual interface card 1 of the first embodiment includes a card base 2 and an antenna 8 disposed inside the card base 2 and having at least a plurality of ends, namely, a first end 81 and a second end 82. The dual interface card 1 further includes an IC module 7 having an IC chip 74a and a plurality of terminals 73a and 73b electrically connected to the IC chip 74a. The IC module 7 is disposed in a recess 9 provided in the card base 2 so that the plurality of terminals 73a and 73b facing each other and the plurality of first ends 81 and second ends 82 are electrically connected to each other.

[0099] The first end 81 and the second end 82, which are the multiple end portions, are configured by an antenna wire 83 that constitutes the antenna 8, which is repeatedly folded back from the outer periphery 93 of the recess 9 toward the center, and a part of them is exposed to the recess 9. Furthermore, the part of the folded back structure of the antenna 8 other than the bent part is along a straight line that follows the sides 93a and 93b of the outer periphery 93. Typically, the multiple first end portions 81 and second end portions 82 are formed so as to follow the outline of a substantially rectangle.

[0100] The first end 81 and the second end 82 are formed from a portion of the antenna wire 83 other than the bent portion, and include exposed regions 86 and 87 as first portions exposed in the recess 9 of the antenna wire 83. The first end 81 and the second end 82 are also formed from a portion of the antenna wire 83 that includes the bent portion, and include covered regions 84a, 84b and 85a, 85b as second portions adjacent to both ends of the first portion, where the antenna wire 83 is embedded in the card base 2 and is not exposed.

[0101] The antenna wire 83 of the first portion is disposed so that the distance from the surface of the card base 2 on which the recess 9 is formed to the antenna wire 83 of the first portion is a first distance. The antenna wire 83 of the second portion is disposed so that the distance from the surface to the antenna wire 83 of the second portion is inclined at an angle θ1 from the first distance to a second distance that is longer than the first distance.

[0102] The dual interface card 1 of this embodiment has the following advantages. First, the exposed antenna wire 83 is concentrated in exposed areas 86 and 87 at first end 81 and second end 82, which are formed by the folded-back structure of antenna wire 83. This ensures good electrical connection between terminals 73a and 73b of IC module 7 and antenna wire 83 via conductive adhesive layer 11. Furthermore, first recess 91 formed along outer periphery 93 of IC module 7 can be formed to approximately the same depth, allowing the electrical connection between IC module 7 and antenna 8 and the mechanical connection between IC module 7 and card base 2 to be achieved via conductive adhesive layer 11 made of the same material.

[0103] Furthermore, the antenna wire 83 in the covered regions 84a, 84b and 85a, 85b is inclined in a direction away from the surface of the card base 2 on which the recess 9 is formed, relative to the antenna wire 83 in the exposed regions 86 and 87. As a result, the antenna wire 83 is embedded in the card base 2 in the covered regions 84a, 84b and 85a, 85b at the first end 81 and the second end 82. This prevents the antenna wire 83 from peeling off from the card base 2 due to the cutting resistance of the end mill when forming the recess 9, including the first recess 91, by cutting. This prevents part of the antenna from peeling off from the card base, ensuring the reliability of the electrical connection between the IC module and the antenna and the adhesion of the IC module to the card.

[0104] 2. Second embodiment Next, a dual interface card according to a second embodiment of the present disclosure will be described.

[0105] FIG. 5(a) is a diagram illustrating the configuration of the periphery of the first end 81a and the second end 82a of the antenna 8 of a dual interface card 1a of a second embodiment, corresponding to FIG. 1(b). FIG. 5(b) is a cross-sectional view of the dual interface card 1a of FIG. 5(a) cut along line DD, viewed from the -Y direction. The first end 81a and the second end 82a of the dual interface card 1a of this embodiment differ from the first end 81 and the second end 82 of the first embodiment in that the exposed areas of the antenna wire 83 are different. In this embodiment, the covered areas are located not only at the +Y and -Y ends of the exposed areas 86a and 87a, but also at the -X and +X ends. That is, in the first end 81a, the covered areas 84c and 84d are located at the +Y and -Y ends of the exposed area 86a, respectively. However, the covered areas do not have to be located at both the -X and +X ends; they may be located at only one of the ends.

[0106] In addition, covered regions 84p and 84q are disposed at the ends of exposed region 86a on the −X and +X directions, respectively. Furthermore, in a plan view along the Z axis, terminals 73a and 73b of IC module 7 entirely overlap exposed regions 86a and 87a. In other words, exposed regions 86a and 87a, which are first portions, entirely overlap terminals 73a and 73b in a plan view along the Z axis. Covered regions 84c, 84d, 84p, and 84q, and 85c, 85d, 85p, and 85q, which are second portions, are disposed so as to surround the peripheries of the first portions, respectively.

[0107] 5(b), of the antenna wire 83 embedded in the card base 2 on the -Z direction side of the first recess 91, in covered regions 84p and 84q on the -X direction side and +X direction side, the antenna wire 83 is completely buried below the card base 2 on the bottom surface 91a. In the exposed region 86a sandwiched between these two regions, approximately the lower half of the antenna wire 83 is buried below the card base 2 on the bottom surface 91a, but approximately the upper half has been removed by cutting, exposing the conductor on the bottom surface 91a.

[0108] When viewed in a cross section of the card base 2 along the X axis, the arrangement of the antenna wire 83 in the exposed region 86a of the first end 81a is the same as that shown in FIGS. 3(a) and 3(b). That is, among the antenna wires 83 of the first end 81a, in the exposed region 86a, the antenna wire 83 is arranged along the Y axis. Furthermore, in the covered regions 84c and 84d at the ends of the exposed region 86a, namely the end on the +Y direction side and the end on the -Y direction side, the antenna wire 83 is arranged along the Y axis, tilted by a predetermined angle toward the -Z direction. On the other hand, although not shown, among the antenna wires 83 of the first end 81a, in the covered regions 84p and 84q, the antenna wire 83 is arranged along the Y axis. However, the antenna wire 83 is generally buried deeper in the -Z direction of the card base 2 than the exposed region 86a.

[0109] The above description of first end 81a also applies to second end 82a. That is, in the above description, terminal 73a, exposed region 86a, and covered regions 84c, 84d, 84p, and 84q can be replaced with terminal 73b, exposed region 87a, and covered regions 85c, 85d, 85p, and 85q, respectively. Also, the configuration of second end 82a can be replaced with the configuration of first end 81a by assuming that they are substantially symmetrical with respect to the Y axis, i.e., substantially line-symmetrical.

[0110] Embedding the antenna wire 83 in the core layer 5 using the winding former can be performed as follows. First, in the regions of the first end 81a and the second end 82a, including the exposed regions 86 and 87, the antenna wire 83 can be embedded in the core layer 5 in the same manner as in the first embodiment. That is, the antenna supply head is moved relatively quickly in the regions other than the bent portion of the folded structure, and moved relatively slowly in the bent portion. On the other hand, in the region including the coated regions 84p, 84q, 85p, and 85q, the antenna supply head is moved relatively slowly throughout the entire region.

[0111] Thus, in dual interface card 1a of the second embodiment, exposed regions 86a and 87a overlap entirely with terminals 73a and 73b in a plan view along the Z axis, and covered regions 84c, 84d and 85c, 85d are arranged to surround the periphery of the first portion. As a result, exposed regions 86 and 87, from which antenna wires 83 of first end 81a and second end 82a are exposed, overlap entirely with terminals 73a and 73b of IC module 7, thereby achieving good electrical connection between IC module 7 and antenna 8.

[0112] Furthermore, in the areas surrounding exposed areas 86a and 87a of first end 81a and second end 82a, covered areas 84c, 84d, 84p, 84q and 85c, 85d, 85p, 85q are arranged to cover antenna wire 83. This further prevents antenna wire 83 from peeling off from card base 2 due to the cutting resistance of the end mill when forming recess 9 including first recess 91. In addition, since the possibility of the end mill coming into contact with antenna wire 83 can be reduced, defects in the electrical connection between IC module 7 and antenna 8 due to breakage of the antenna wire can be reduced.

[0113] Furthermore, since the wiring direction of the antenna wire 83 and the moving direction of the end mill are substantially the same, it is possible to reduce the occurrence of so-called whiskers, which are problems that cause unintended branching of the antenna wire 83. If whiskers occur, they may become pinched between the IC module 7 and the card base 2, causing problems with the mechanical connection between them, and they may also cause the IC module 7 to protrude from the surface of the card base 2, resulting in a defective appearance.

[0114] 3. Third embodiment Next, a dual interface card according to a third embodiment of the present disclosure will be described.

[0115] Fig. 6(a) is a diagram showing the configuration around first end 81b and second end 82b of antenna 8 of dual interface card 1b of the third embodiment, corresponding to Fig. 1(b). Fig. 6(b) is an enlarged view of the vicinity of first end 81b of dual interface card 1b of Fig. 6(a). First end 81b and second end 82b of dual interface card 1b of this embodiment differ from first end 81 and second end 82 of the first embodiment in that the arrangement pitch between antenna wires 83 in exposed areas 86b and 87b varies depending on the location.

[0116] That is, in exposed regions 86b and 87b, which are the first portions, the overlapping region is the region including antenna wire 83, where portions of antenna wire 83 other than the bent portion of the folded structure overlap terminals 73a and 73b of IC module 7, respectively, in a plan view along the Z axis. Taking first end 81b as an example, the overlapping region is second region AR2 in FIG. 6(b). Second region AR2 is the region of antenna wire 83 in exposed region 86b of first end 81b that overlaps terminal 73a along the Z axis, and is a substantially rectangular region that extends to the boundaries with covered regions 84e and 84f along the Y axis.

[0117] The first end 81b has an exposed area 86b where the antenna wire 83 is exposed from the first recess 91. It also has a covered area 84e adjacent to the exposed area 86b on the +Y direction side and where the antenna wire 83 is covered by the card base 2, and a covered area 84f adjacent to the exposed area 86b on the -Y direction side and where the antenna wire 83 is covered by the card base 2. The exposed area 86b is a substantially rectangular area in a plan view along the Z axis.

[0118] The area other than the overlapping area is referred to as the non-overlapping area. Taking first end 81b as an example, the non-overlapping areas are, within exposed region 86b, first region AR1 adjacent to second region AR2 on the −X direction side in FIG. 6(b) and third region AR3 adjacent to second region AR2 on the +X direction side. First region AR1 is a substantially rectangular area within exposed region 86b of first end 81b, surrounded by the second region AR2, side 93a of outer periphery 93, and boundaries with covered regions 84e and 84f. Third region AR3 is a substantially rectangular area within exposed region 86b of first end 81b, surrounded by the second region AR2, the outer periphery of second recess 92, and boundaries with covered regions 84e and 84f.

[0119] At this time, the value of the array pitch between the antenna lines 83 adjacent to each other in the overlapping region is smaller than the value of the array pitch between the antenna lines 83 adjacent to each other in the non-overlapping region. That is, let the value of the array pitch of the antenna lines 83 in the second region AR2 be p2, the value of the similar array pitch in the first region AR1 be p1, and the value of the similar array pitch in the third region AR3 be p3. At this time, p2 < p1 and p2 < p3, and typically p1 = p3 may hold, but their values may also be different. In other words, among the first end portion 81b, the array pitch of the portion other than the bent portion of the folded structure of the antenna line 83 in the portion overlapping with the terminal 73a is narrower than the array pitch of the other portion not overlapping with the terminal 73a.

[0120] As described above, in the portion where the first end portion 81b overlaps with the terminal 73a of the IC module 7, the value of the array pitch of the portion other than the bent portion of the folded structure of the antenna line 83 is arranged to be smaller than the value of the other portion. Thereby, the contact area related to the electrical connection between the IC module 7 and the antenna 8 can be increased. Thus, a better electrical connection between the IC module 7 and the antenna 8 can be achieved. Also, since the value of the array pitch in the portion not overlapping with the terminal 73a is arranged to be large, while further reducing the usage amount of the antenna line 83, the embedding operation of the antenna line 83 can be made more efficient. Furthermore, during the cutting process, the degree of contact between the end mill and the antenna line 83 can be reduced, so that an unintended branch of the antenna line 83 can be suppressed.

[0121] Note that the content described above for the first end portion 81b also applies to the second end portion 82b in the same manner. That is, in the above description, each of the terminal 73a, the exposed region 86b, the covering regions 84e, 84f, and the side 93a of the outer periphery 93 may be replaced with the terminal 73b, the exposed region 87b, the covering regions 85e, 85f, and the side 93b of the outer periphery 93. Also, it may be replaced assuming that the configuration of the second end portion 82b is substantially left - right symmetric, that is, substantially line - symmetric, with respect to the Y - axis with the configuration of the first end portion 81b.

[0122] 4. Fourth Embodiment Next, a dual interface card according to a fourth embodiment of the present disclosure will be described.

[0123] FIG. 7(a) is a diagram showing the configuration of the periphery of the first end 81c and the second end 82c of the antenna 8 of a dual interface card 1c of the fourth embodiment, corresponding to FIG. 1(b). FIG. 7(b) is an enlarged view of the vicinity of the first end 81c of the dual interface card 1c of FIG. 7(a). In the first end 81c and the second end 82c of the dual interface card 1c of this embodiment, the portions other than the bent portion of the folded-back structure of the antenna wire 83 are inclined clockwise by a predetermined angle θ2 with respect to a line along the side 93a of the outer periphery 93 of the recess 9, i.e., a line m1 parallel to the Y axis. This differs from the first end 81 of the first embodiment.

[0124] The first end 81c has an exposed region 86c where the antenna wire 83 is exposed from the first recess 91. Also, the first end 81c has a covered region 84g adjacent to the exposed region 86c on the +Y direction side and where the antenna wire 83 is covered by the card base 2, and a covered region 84h adjacent to the exposed region 86c on the -Y direction side and where the antenna wire 83 is covered by the card base 2. The exposed region 86c is a substantially rectangular region in a plan view along the Z axis.

[0125] Here, the entire first end 81c is arranged to follow the outline of a rectangle whose width along the Y axis is W22 and whose width along the X axis is W32. That is, the length of the portion other than the bent portion of the folded structure is approximately the same near the approximate center of the first end 81c along the X axis direction. However, near the end on the -X direction side and the end on the +X direction side, the length of the portion other than the bent portion of the folded structure gradually decreases toward the -X direction and the +X direction, respectively. Furthermore, the exposed region 86c of the first end 81c is arranged to follow the outline of a rectangle whose width along the Y axis is W21 and whose width along the X axis is W31. Here, W21 <W22であり、かつ、W31<W32である。

[0126] The inclination angle θ2 is preferably 2 degrees or more and 20 degrees or less, and more preferably 5 degrees or more and 15 degrees or less. The inclination angle θ2 does not need to be strictly the same in all portions of the folded structure other than the bent portions, and may vary within the above-mentioned range. When the inclination angle θ2 is in the former range, the antenna wire 83 is inclined relative to the direction along the Y-axis, which is the movement direction of the end mill when cutting the recess 9, thereby further suppressing unintended branching of the antenna wire 83.

[0127] Furthermore, if the end of first end 81c on the +X direction side is located closer to the +X direction than the boundary between first recess 91 and second recess 92, antenna wire 83 will be cut when second recess 92 is cut, resulting in a break in the wire. However, if inclination angle θ2 is within the former range, the region where antenna wire 83 is broken can be reduced, ensuring a reliable electrical connection between antenna 8 and terminal 73a of IC module 7.

[0128] On the other hand, by setting the inclination angle θ2 within the latter range, it is possible to effectively suppress the occurrence of whiskers, which are branches of the antenna wire 83. Furthermore, even if the end of the first end 81 on the +X direction side is located on the +X direction side of the boundary between the first recess 91 and the second recess 92, it is possible to further reduce the region of disconnection of the antenna wire 83 due to cutting of the antenna wire 83 when cutting the second recess 92. As a result, it is possible to further improve the reliability of the electrical connection between the antenna 8 and the terminal 73a of the IC module 7.

[0129] In particular, when the end on the +X direction side is located on the +X direction side of the boundary between the first recess 91 and the second recess 92, it is preferable to arrange the antenna wire 83 in this region so that it includes the bent portion of the folded structure but does not include any portion other than the bent portion. By doing so, when cutting the second recess 92, it is less likely that the antenna wire 83 will branch from the bent portion that is at a large angle from the direction along the Y axis, which is the movement direction of the end mill, and this ultimately contributes to improved quality.

[0130] In this embodiment, the inclination angle θ2 is the angle at which the portion other than the bent portion is inclined clockwise with respect to the straight line m1. However, there is no problem in replacing the above-mentioned θ2 with the angle at which the portion other than the bent portion is inclined counterclockwise with respect to the straight line m1. This is because even if the portion other than the bent portion is inclined counterclockwise, the same effect as when it is inclined clockwise can be obtained.

[0131] The above description of first end 81c also applies to second end 82c. That is, in the above description, terminal 73a, exposed region 86c, covered regions 84g and 84h, and side 93a of outer periphery 93 can be replaced with terminal 73b, exposed region 87c, covered regions 85g and 85h, and side 93b of outer periphery 93, respectively. Also, the configuration of second end 82c can be replaced with the configuration of first end 81c, assuming that they are substantially symmetrical with respect to the Y axis, i.e., substantially line-symmetrical.

[0132] As described above, the embodiments and modifications described in this disclosure can be combined in part or in whole to the extent that no contradictions arise, and such combinations are naturally included in this disclosure. For example, first end 81a of the second embodiment may have a substantially rectangular exposed area 86a that overlaps the entire terminal 73a, while antenna wire 83 of the first end may be arranged so that the portion other than the bent portion is inclined with respect to the Y axis, as in first end 81c of the fourth embodiment.

[0133] Furthermore, in the first end 81a of the second embodiment and the first end 81c of the fourth embodiment, the arrangement pitch value of the portion other than the bent portion of the antenna wire 83 in the exposed region may be small in the region overlapping with the terminal 73a and large in the region not overlapping, as in the first end 81b of the third embodiment. This is because, even when the respective embodiments and modified examples are combined in this manner, the same effects of the respective embodiments and modified examples can be obtained. [Explanation of symbols]

[0134] 1, 1a, 1b, 1c dual interface card 2 Card Base 3, 6 oversheet layers 4, 5 Core layer 7, 7a IC module 8 Antennas 9 Recess 11 Conductive adhesive layer 11a Conductive particles 11b Adhesive 71 External connection terminal 72 PCB 73a, 73b terminal 74 IC chip body 74a IC chip 74b molded part 74p Pad 75 wire 76 Bonding Hole 77 Lead section 81, 81a, 81b, 81c First end 81p, 81q 1st electrode 82, 82a, 82b, 82c 2nd end 83 Antenna Wire 84a, 84b, 84c, 84d, 84e, 84f, 84g, 84h, 84p, 84q, 85a, 85b, 85c, 85d, 85e, 85f, 85g, 85h, 85p, 85q Coverage area 86, 86a, 86b, 86c, 87, 87a, 87b, 87c exposed area 91 First recess 91a bottom 92 Second recess 93 Outer circumference Areas 93a and 93b

Claims

1. A dual interface card capable of contact communication and contactless communication with an external device, A card base; an antenna having at least a plurality of ends disposed within the card base; an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip; the IC module is disposed in a recess provided in the card base, the plurality of terminals and the plurality of ends are electrically connected to each other in opposition to each other; the plurality of ends are configured by an antenna wire that constitutes the antenna, with the antenna wire being repeatedly folded back from the outer periphery toward the center of the recess, the plurality of ends include a first portion formed of a portion other than the bent portion of the antenna wire and exposed in the recess of the antenna wire, and a second portion formed of a portion including the bent portion of the antenna wire, the antenna wire being embedded in a card base; the antenna wire of the second portion is inclined with respect to a surface on which the recess is formed, A dual interface card, wherein an area of the first portion including the antenna wire that overlaps with the plurality of terminals in a planar view is defined as an overlap area, and an area other than the overlap area is defined as a non-overlapping area, and the arrangement pitch of the antenna wire in the overlap area is smaller than the arrangement pitch of the antenna wire in the non-overlapping area.

2. A dual interface card capable of contact communication and contactless communication with an external device, A card base; an antenna having at least a plurality of ends disposed within the card base; an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip; the IC module is disposed in a recess provided in the card base, the plurality of terminals and the plurality of ends are electrically connected to each other in opposition to each other; the plurality of ends are configured by an antenna wire that constitutes the antenna, with the antenna wire being repeatedly folded back from the outer periphery toward the center of the recess, the plurality of ends include a first portion formed of a portion other than the bent portion of the antenna wire and exposed in the recess of the antenna wire, and a second portion formed of a portion including the bent portion of the antenna wire, the antenna wire being embedded in a card base; the antenna wire of the second portion is inclined with respect to a surface on which the recess is formed, A dual interface card, wherein the first portion overlaps the entire terminal in a plan view, and the second portion is disposed so as to surround the periphery of the first portion.

3. 3. A dual interface card as described in claim 1 or claim 2, wherein the recesses are composed of a first recess formed on the outer periphery and having approximately the same depth, and a second recess formed closer to the center than the first recess and deeper than the first recess.

4. 4. The dual interface card according to claim 1, wherein the plurality of terminals and the plurality of end portions of the IC module that face each other are electrically connected to each other via an anisotropic conductive film.

5. 5. A dual interface card as described in any one of claims 1 to 4, wherein the outer periphery is a substantially rectangular shape having sides substantially parallel to the short and long sides of the card body, and the multiple ends are formed by a repeated folding structure of the antenna wire constituting the antenna from the outer periphery, which is a side of the recess substantially parallel to the short sides of the card body, toward the center.

6. 6. The dual interface card according to claim 1, wherein the antenna wire of the first portion is inclined with respect to a straight line along the outer periphery.

7. A method for manufacturing a dual interface card capable of contact communication and contactless communication with an external device, comprising: an antenna forming step of embedding an antenna wire into a first base material while applying heat and pressure to form an antenna having a plurality of ends on one surface of the first base material; a lamination step of laminating a second base material on the first base material on which the antenna is formed so as to sandwich the antenna; a punching step of punching a laminate obtained by stacking the first base material and the second base material into a card-sized card base; a recess forming step of forming a recess in the card base for embedding an IC module; an IC module preparation step of preparing an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip; an IC module adhering step of adhering the IC module to the recess of the card base via a conductive adhesive layer so that the plurality of terminals and the plurality of end portions facing each other are electrically connected, the plurality of ends are configured by an antenna wire that constitutes the antenna, with the antenna wire being repeatedly folded back from the outer periphery toward the center of the recess, the plurality of ends include a first portion formed of a portion other than the bent portion of the antenna wire and exposed in the recess of the antenna wire, and a second portion formed of a portion including the bent portion of the antenna wire, the antenna wire being embedded in a card base; a method for manufacturing a dual interface card, wherein in the antenna forming process, the antenna wire of the second portion is inclined with respect to the surface on which the recess is formed, and the region of the first portion including the antenna wire that overlaps with the plurality of terminals in a planar view is defined as an overlap region, and the region other than the overlap region is defined as a non-overlapping region, and the antenna wire is embedded in the first substrate while applying thermal pressure to the antenna wire so that the arrangement pitch of the antenna wire in the overlap region is smaller than the arrangement pitch of the antenna wire in the non-overlapping region.

8. A method for manufacturing a dual interface card capable of contact communication and contactless communication with an external device, comprising: an antenna forming step of embedding an antenna wire into a first base material while applying heat and pressure to form an antenna having a plurality of ends on one surface of the first base material; a lamination step of laminating a second base material on the first base material on which the antenna is formed so as to sandwich the antenna; a punching step of punching a laminate obtained by stacking the first base material and the second base material into a card-sized card base; a recess forming step of forming a recess in the card base for embedding an IC module; an IC module preparation step of preparing an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip; an IC module adhering step of adhering the IC module to the recess of the card base via a conductive adhesive layer so that the plurality of terminals and the plurality of end portions facing each other are electrically connected, the plurality of ends are configured by an antenna wire that constitutes the antenna, with the antenna wire being repeatedly folded back from the outer periphery toward the center of the recess, the plurality of ends include a first portion formed of a portion other than the bent portion of the antenna wire and exposed in the recess of the antenna wire, and a second portion formed of a portion including the bent portion of the antenna wire and in which the antenna wire is embedded in a card base; In the antenna forming step, the antenna wire is embedded in the first base material while applying heat and pressure to the antenna wire so that the antenna wire of the second portion is inclined with respect to the surface on which the recess is formed; A method for manufacturing a dual interface card, wherein the first portion overlaps the entire terminal in a plan view, and the second portion is arranged to surround the periphery of the first portion.

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