Circuit structure

Abstract

To provide a technology that can reduce the weight in a circuit configuration having two semiconductor elements constituting a bidirectional relay.SOLUTION: A circuit configuration 10 includes a first bus bar 20 and a second bus bar 30, a first semiconductor element 40 and a second semiconductor element 50, a power circuit unit that electrically connects a first power terminal 42 of the first semiconductor element 40 and a third power terminal 52 of the second semiconductor element 50, and a control circuit unit for electrically connecting both a first signal terminal 44 of the first semiconductor element 40 and a second signal terminal 54 of the second semiconductor element 50 to a control device. At least one of the power circuit unit and the control circuit unit has flexible conductive paths 62 and 64.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to circuitry. [Background technology]

[0002] Patent Document 1 discloses a circuit assembly in which semiconductor switching elements and bus bars are connected. In the circuit assembly described in Patent Document 1, the drain terminal and source terminal of the semiconductor switching elements are connected to a first bus bar and a second bus bar, respectively, and the semiconductor switching elements are mounted on the bus bars.

[0003] Patent Document 2 discloses a circuit board in which a semiconductor element and a conductive piece are connected. In the circuit board described in Patent Document 2, some of the multiple terminals of the semiconductor element are connected to the conductive piece via an FPC (flexible printed circuit board). This is said to increase the degree of freedom in arranging the semiconductor element and reduce the stress applied to the fixing portion of the semiconductor element. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-96769 [Patent Document 2] Japanese Patent Publication No. 2020-13896 Summary of the Invention [Problem to be solved by the invention]

[0005] The semiconductor elements in the circuit structures described in Patent Documents 1 and 2 are expected to control a unidirectional current. There is a demand for a circuit structure having two semiconductor elements that constitute a bidirectional relay, and for a lightweight circuit structure.

[0006] Therefore, an object of the present invention is to provide a technology that can reduce the weight of a circuit assembly having two semiconductor elements that constitute a bidirectional relay. [Means for solving the problem]

[0007] The circuit structure of the present disclosure includes a first bus bar and a second bus bar that form a power circuit, a first semiconductor element having a first power terminal, a second power terminal, and a first signal terminal, a second semiconductor element having a third power terminal, a fourth power terminal, and a second signal terminal, a power circuit section that electrically connects the first power terminal and the third power terminal, and a control circuit section that electrically connects both the first signal terminal and the second signal terminal to a control device, wherein the second power terminal is electrically connected to the first bus bar and the first semiconductor element is mounted on the first bus bar, the fourth power terminal is electrically connected to the second bus bar and the second semiconductor element is mounted on the second bus bar, and at least one of the power circuit section and the control circuit section has a flexible conductive path. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to reduce the weight of a circuit assembly having two semiconductor elements that constitute a bidirectional relay. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic plan view showing a circuit assembly according to a first embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 3 is a partially enlarged view of FIG. [Figure 4] FIG. 2 is a schematic plan view of the circuit assembly with the case omitted. [Figure 5] FIG. 5 is a plan view showing the flexible wiring member. [Figure 6] FIG. 6 is a plan view showing a modified example of the flexible wiring member. [Figure 7] FIG. 7 is a schematic diagram showing a connection state between the flexible wiring member and the control circuit board. [Figure 8] FIG. 8 is a schematic diagram showing another connection mode between the flexible wiring member and the control circuit board. DETAILED DESCRIPTION OF THE INVENTION

[0010] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0011] The circuit configuration of the present disclosure is as follows.

[0012] (1) A circuit assembly comprising: a first bus bar and a second bus bar constituting a power circuit; a first semiconductor element having a first power terminal, a second power terminal, and a first signal terminal; a second semiconductor element having a third power terminal, a fourth power terminal, and a second signal terminal; a power circuit section electrically connecting the first power terminal and the third power terminal; and a control circuit section for electrically connecting both the first signal terminal and the second signal terminal to a control device, wherein the second power terminal is electrically connected to the first bus bar and the first semiconductor element is mounted on the first bus bar, the fourth power terminal is electrically connected to the second bus bar and the second semiconductor element is mounted on the second bus bar, and at least one of the power circuit section and the control circuit section has a flexible conductive path. At least one of the power circuit section electrically connecting the first power terminal and the third power terminal and the control circuit section for electrically connecting both the first signal terminal and the second signal terminal to the control device has a flexible conductive path. When the power circuit section has a flexible conductive path, a bus bar does not need to be used as a member for electrically connecting the first power terminal and the third power terminal, which reduces the weight of the circuit assembly. Also, when the control circuit section has a flexible conductive path, the first signal terminal and the second signal terminal are both connected to a single flexible conductive path, which reduces the weight of the circuit assembly compared to when the first signal terminal and the second signal terminal are connected to separate flexible conductive paths.

[0013] (2) In the circuit assembly of (1), both the power circuit section and the control circuit section may have flexible conductive paths, thereby enhancing the effect of reducing the weight of the circuit assembly.

[0014] (3) In the circuit assembly of (2), both the conductive path of the power circuit section and the conductive path of the control circuit section may be provided on one flexible wiring member, which eliminates the need for multiple flexible wiring members and reduces costs.

[0015] (4) In the circuit assembly of (3), the conductive path of the control circuit may be provided along the outer edge of the flexible wiring member, and the conductive path of the power circuit may be provided in an area of the flexible wiring member surrounded by the conductive path of the control circuit member. This allows the conductive path of the power circuit and the conductive path of the control circuit to be provided in a single layer of flexible wiring member. This eliminates the need to provide multiple layers of circuits in the flexible wiring member, thereby reducing costs.

[0016] (5) The circuit assembly of (3) or (4) may further include an insulating spacer provided between the first bus bar and the second bus bar, the flexible wiring member is arranged so as to extend from the first bus bar across the insulating spacer to the second bus bar, the connection portion between the first power terminal and the power circuit unit and the connection portion between the first signal terminal and the control circuit unit are located on the first bus bar, and the connection portion between the third power terminal and the power circuit unit and the connection portion between the second signal terminal and the control circuit unit are located on the second bus bar. This allows the flexible wiring member to deform and absorb displacement between the connected portions when the bus bar and the insulating spacer, which have different thermal expansion coefficients, thermally expand and contract, thereby preventing electrical disconnection at the connected portions.

[0017] (6) In the circuit assembly of any one of (1) to (5), a plurality of pairs of the first semiconductor element and the second semiconductor element may be provided, and the first power terminal and the third power terminal of the plurality of pairs of the first semiconductor element and the second semiconductor element may be connected via one conductive path. This reduces the electrical resistance of the conductive path connecting the first power terminal and the third power terminal, thereby suppressing the amount of heat generated when a large current flows.

[0018] [Details of the embodiments of the present disclosure] Specific examples of the circuit configuration of the present disclosure will be described below with reference to the drawings. Note that the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0019] [Embodiment 1] The circuit assembly 10 according to the first embodiment will be described below. Fig. 1 is a schematic plan view showing the circuit assembly 10 according to the first embodiment. Fig. 2 is a schematic cross-sectional view taken along line II-II in Fig. 1. Fig. 3 is a partially enlarged view of Fig. 2. Fig. 4 is a schematic plan view of the circuit assembly 10 with the case 80 omitted.

[0020] The circuit assembly 10 is mounted, for example, on a vehicle equipped with a main system and a subsystem related to an autonomous driving function. For example, when the main system fails and switching to the subsystem is required, the circuit assembly 10 functions as a switching device that electrically disconnects the main system from the subsystem. The circuit assembly 10 includes a first bus bar 20, a second bus bar 30, a first semiconductor element 40, a second semiconductor element 50, a power circuit unit, and a control circuit unit. Here, the circuit assembly 10 is housed in a case 80.

[0021] The first busbar 20 and the second busbar 30 constitute a power circuit. The first busbar 20 and the second busbar 30 are each formed into a plate shape from a conductive material such as copper or a copper alloy. The first busbar 20 has a first element connection portion 22 and a first external connection portion 24. The second busbar 30 has a second element connection portion 32 and a second external connection portion 34. The first element connection portion 22 is a portion that is connected to a first semiconductor element 40. The second element connection portion 32 is a portion that is connected to a second semiconductor element 50. The first external connection portion 24 and the second external connection portion 34 are portions to which ends of a wire harness or the like are connected. Here, the first element connection portion 22 and the second element connection portion 32 are each formed into a flat plate shape and fit within the case 80. The first element connection portion 22 and the second element connection portion 32 are arranged with a gap between them so that their main surfaces are flush with each other. An insulating spacer 82, which will be described later, is provided between the first element connection portion 22 and the second element connection portion 32. The first external connection portion 24 and the second external connection portion 34 are each formed in a flat plate shape and protrude outside the case main body that surrounds the first element connection portion 22 and the second element connection portion 32 of the case 80. For example, a through hole is formed in each of the first external connection portion 24 and the second external connection portion 34. The first external connection portion 24 and the second external connection portion 34 are connected to terminals of a wire harness with bolts using the through holes.

[0022] Each of the first semiconductor element 40 and the second semiconductor element 50 is a semiconductor switching element that controls the on / off of a current. Such a semiconductor switching element has two power terminals and a gate terminal. In a semiconductor switching element, the on / off of a gate is controlled via the gate terminal, thereby controlling the on / off of a current between the two power terminals. Some semiconductor switching elements can block the flow of current from one power terminal to the other power terminal when the gate is off, but cannot completely block the flow of current from the other power terminal to the one power terminal. If the current controlled by such a semiconductor switching element is large, the current leaking from the other power terminal to one power terminal when the gate is off can become significant. Therefore, by connecting two semiconductor switching elements (first semiconductor element 40 and second semiconductor element 50 in this example) in series so that the orientations of their two power terminals are opposite to each other, one semiconductor switching element blocks current in one direction and the other semiconductor switching element blocks current in the other direction, thereby making it possible to block current in both directions in the circuit configuration. Note that an example of such a semiconductor switching element is a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor).

[0023] The first semiconductor element 40 has a first power terminal 42, a second power terminal 43, and a first signal terminal 44. The first semiconductor element 40 is mounted on the first bus bar 20. The second semiconductor element 50 has a third power terminal 52, a fourth power terminal 53, and a second signal terminal 54. The second semiconductor element 50 is mounted on the second bus bar 30. The first power terminal 42 and the third power terminal 52 are electrically connected via a power circuit. The second power terminal 43 is electrically connected to the first bus bar 20, and the fourth power terminal 53 is electrically connected to the second bus bar 30. The first signal terminal 44 and the second signal terminal 54 are connected to a control device via a control circuit. For example, if the first semiconductor element 40 and the second semiconductor element 50 are MOSFETs, the first power terminal 42 and the third power terminal 52 are source terminals, the second power terminal 43 and the fourth power terminal 53 are drain terminals, and the first signal terminal 44 and the second signal terminal 54 are gate terminals. Hereinafter, the first power terminal 42 and the third power terminal 52 may be referred to as source terminals 42, 52. The second power terminal 43 and the fourth power terminal 53 may be referred to as drain terminals 43, 53, and the first signal terminal 44 and the second signal terminal 54 may be referred to as gate terminals 44, 54.

[0024] In the example shown in FIG. 1 , the terminal arrangement of the first semiconductor element 40 and the terminal arrangement of the second semiconductor element 50 are the same. In the first semiconductor element 40, a source terminal 42 and a gate terminal 44 are provided on one side of the main body 41, and a drain terminal 43 is provided on the other side. Similarly, in the second semiconductor element 50, a source terminal 52 and a gate terminal 54 are provided on one side of the main body 51, and a drain terminal 53 is provided on the other side. The first semiconductor element 40 and the second semiconductor element 50 are arranged in opposite directions so that the side surfaces of the main bodies 41, 51 on which the source terminals 42, 52 are provided face each other. The first semiconductor element 40 and the second semiconductor element 50 are arranged offset in the direction in which the source terminals 42, 52 and the gate terminals 44, 54 are aligned so that the source terminals 42, 52 face each other. The gate terminal 44 of the first semiconductor element 40 and the gate terminal 54 of the second semiconductor element 50 are offset from each other. The gate terminal 44 of the first semiconductor element 40 does not face the second semiconductor element 50. The gate terminal 54 of the second semiconductor element 50 does not face the first semiconductor element 40.

[0025] The power circuit section connects the first power terminal 42 and the third power terminal 52. The power circuit section is provided with a connection section with the first power terminal 42 and a connection section with the third power terminal 52. The control circuit section is a circuit section that receives control signals from the control device or communicates with the control device and issues on / off signals to both the first signal terminal 44 and the second signal terminal 54, and may include functions for detecting current and voltage, etc., and safety functions for MOSFET failures, etc. The control circuit section is provided with a connection section with the first signal terminal 44 and a connection section with the second signal terminal 54. Such a control device is assumed to be, for example, an ECU (Electronic Control Unit) provided outside the circuit assembly 10. It is assumed that the ECU and the circuit assembly 10 are connected via a wire harness. For this reason, the control circuit section is provided with a harness connection section.

[0026] At least one of the power circuit section and the control circuit section has flexible conductive paths 62, 64. Here, both the power circuit section and the control circuit section have flexible conductive paths 62, 64. Here, the flexible conductive path 62 of the power circuit section and the flexible conductive path 64 of the control circuit section are provided in one flexible wiring member 60. The flexible wiring member 60 will be described below with reference to Figure 5 in addition to Figures 1 to 4. Figure 5 is a plan view showing the flexible wiring member 60.

[0027] The flexible wiring member 60 has flexible conductive paths 62, 64 and an insulating portion 66. The conductive paths 62, 64 are made of a conductive foil or a thin conductive plate, etc. The insulating portion 66 is made of an insulating film, etc. Both the conductive paths 62, 64 and the insulating portion 66 are easily bendable. For example, the flexible wiring member 60 is an FPC (flexible printed circuit). The insulating portion 66 of the FPC is a substrate body made of, for example, a polyimide film, etc. Conductive paths 62, 64 made of, for example, copper foil, are provided on the substrate body. The flexible conductive paths 62, 64 are, for example, conductive paths formed on a flexible substrate (flexible printed circuit). In the FPC, the conductive paths 62, 64 are exposed at the connection portions with the source terminal 42 and gate terminal 44 of the first semiconductor element 40 and the source terminal 52 and gate terminal 54 of the second semiconductor element 50. The conductive paths 62, 64 may be appropriately covered with a cover film or the like in areas other than the connection portions with the terminals 42, 44, 52, 54 of the semiconductor elements 40, 50. The flexible wiring member 60 may be a member other than an FPC, for example, an FFC (Flexible Flat Cable).

[0028] Here, the power circuit section has a conductive path 62, and the control circuit section has a conductive path 64. Here, a pair of source terminals 42, 52 are connected to the same conductive path 62. Therefore, the power circuit section is essentially composed of only the conductive path 62, excluding the connecting member. In addition to the conductive path 64, the control circuit section further includes a control board circuit section provided on the control circuit board 70. The connection portion of the control circuit section with the first signal terminal 44 and the connection portion with the second signal terminal 54 are provided on the conductive path 64, and a harness connection portion is provided on the control board circuit section. The connection manner at each connection portion between the terminals 42, 44, 52, 54 of the semiconductor elements 40, 50 and the conductive paths 62, 64 is not particularly limited, and can be, for example, by solder S, terminals, or the like. Figures 2 and 3 show the connection via solder S.

[0029] Here, two conductive paths 62, 64 are formed in one conductor layer in the flexible wiring member 60. A portion of the conductive path 64 is provided along the outer edge of the flexible wiring member 60. The conductive path 62 is provided in a region of the flexible wiring member 60 that is surrounded by an insulating portion 66. At this time, the conductive path 62 is formed to a size that allows connection to one set of a first semiconductor element 40 and a second semiconductor element 50. In other words, one flexible wiring member has multiple conductive paths 62, and multiple sets of first semiconductor elements 40 and second semiconductor elements 50 are each connected to a different conductive path 62.

[0030] FIG. 6 is a plan view showing a modified example of the flexible wiring member 60. In FIG.

[0031] A flexible wiring member 160 according to the modified example is configured so that source terminals 42, 52 of multiple pairs of first semiconductor elements 40 and second semiconductor elements 50 can be connected via a single flexible conductive path 162. In the example shown in FIG. 6, the conductive path 162 is formed longer in the parallel direction of the multiple first semiconductor elements 40 than the conductive path 62, and has a length corresponding to the multiple (here, two) first semiconductor elements 40. Two pairs of first semiconductor elements 40 and second semiconductor elements 50 can be connected to a single conductive path 162. In the example shown in FIG. 6, four pairs of first semiconductor elements 40 and second semiconductor elements 50 are divided into two pairs, and each pair can be connected to a different conductive path 162. Four pairs of first semiconductor elements 40 and second semiconductor elements 50 may also be connected to a single flexible conductive path for a power circuit unit.

[0032] An insulating spacer 82 separates the first bus bar 20 and the second bus bar 30. For example, the insulating spacer 82 is part of the case 80. The flexible wiring member 60 is arranged to extend from the first bus bar 20, across the insulating spacer 82, to the second bus bar 30. The connection portion between the source terminal 42 and the conductive path 62, and the connection portion between the gate terminal 44 and the conductive path 64 are located on the first bus bar 20. The connection portion between the source terminal 52 and the conductive path 62, and the connection portion between the gate terminal 54 and the conductive path 64 are located on the second bus bar 30.

[0033] The control circuit board 70 has a board main body made of an insulating material and a control board circuit section made of a conductive material. Here, the control circuit board 70 is assumed to be a printed circuit board with a rigid board main body, but it may also be a printed circuit board with a flexible board main body. The control board circuit section is provided with a connection section that connects to the conductive path 64. The control circuit board 70 may be provided with a connector 72 as a harness connection section. The connector 72 has a connector housing made of insulating resin and connector terminals that electrically connect the control circuit board to an external conductor. The control circuit board 70 may be fixed to the case 80 or the bus bars 20, 30, for example. For example, the control circuit board 70 may be supported by the case 80 with a gap between it and the bus bars 20, 30.

[0034] The case 80 is made of an insulating resin. The case 80 is a molded product that is insert-molded using the first bus bar 20 and the second bus bar 30 as insert parts. The case 80 has an insulating spacer 82, a first bus bar holding portion 84, and a second bus bar holding portion 86. The insulating spacer 82 is provided between the first bus bar 20 and the second bus bar 30 and serves as a portion that separates the first bus bar 20 and the second bus bar 30. One side of the insulating spacer 82 contacts the first bus bar 20, and the other side contacts the second bus bar 30. It is preferable that the top surface of the insulating spacer 82 is formed flush with the main surfaces of the first bus bar 20 and the second bus bar 30.

[0035] The first busbar holding portion 84 is a portion that holds the first busbar 20. The first busbar holding portion 84 holds the outer edge of the first busbar 20 opposite the outer edge that contacts the insulating spacer 82. The first busbar holding portion 84 also holds the connecting portion of the first busbar 20 between the first element connection portion 22 and the first external connection portion 24. The second busbar holding portion 86 is a portion that holds the second busbar 30. The second busbar holding portion 86 holds the outer edge of the second busbar 30 opposite the outer edge that contacts the insulating spacer 82. The second busbar holding portion 86 also holds the connecting portion of the second busbar 30 between the second element connection portion 32 and the second external connection portion 34. For example, the first busbar holding portion 84 holds the first busbar 20 by sandwiching it in the thickness direction. Similarly, the second busbar holding portion 86 holds the second busbar 30 by sandwiching it in the thickness direction. A through hole 25 is formed in the portion of the first bus bar 20 that is held by the first bus bar holding portion 84. The portion of the first bus bar holding portion 84 that covers one side of the first bus bar 20 and the portion that covers the other side are connected via a connecting portion within the through hole 25. Similarly, a through hole 35 is formed in the portion of the second bus bar 30 that is held by the second bus bar holding portion 86. In the second bus bar holding portion 86, the portion that covers one side of the second bus bar 30 and the portion that covers the other side are also connected via a connecting portion within the through hole 35.

[0036] The case 80 may be provided with fixing portions for fixing the control circuit board 70, fixing portions for fixing the cover, etc. Such fixing portions may be, for example, screw holes. Furthermore, for example, such fixing portions may be either locking protrusions or locking recesses used in a locking structure with a mating member.

[0037] The conductive path 64 of the flexible wiring member 60 is connected at the other end to the control board circuit section of the control circuit board 70. FIG. 7 is a schematic diagram showing a connection between the flexible wiring member 60 and the control circuit board 70. FIG. 8 is a schematic diagram showing another connection between the flexible wiring member 60 and the control circuit board 70. For example, the flexible wiring member 60 may be in contact with the bus bars 20, 30 at one end and with the control circuit board 70 at the other end, and bent in the thickness direction at the portion between them. The flexible wiring member 60 may be folded back in the thickness direction between one end and the other end, as in the example shown in FIG. 7. The flexible wiring member 60 may be bent without being folded back in the thickness direction between one end and the other end, as in the example shown in FIG. 8. The flexible wiring member 60 does not have to be folded back or bent in the thickness direction between one end and the other end. The conductive path 64 and the control board circuit section can be connected via, for example, solder, a terminal, a connector, or the like.

[0038] As another connection mode between the flexible wiring member 60 and the control circuit board 70, the flexible wiring member 60 and the control circuit board 70 may be connected without contacting each other. In this case, for example, a terminal provided on either the flexible wiring member 60 or the control circuit board 70 may extend to the other, and the flexible wiring member 60 and the control circuit board 70 may be connected via that terminal.

[0039] <Effects of the First Embodiment> At least one of the power circuit section that electrically connects the source terminals 42, 52 and the control circuit section that electrically connects both the gate terminals 44, 54 to the control device has conductive paths 62, 64. Here, both the power circuit section and the control circuit section have conductive paths 62, 64. When the power circuit section has conductive path 62, a bus bar does not need to be used as a member that electrically connects the source terminals 42, 52, and the weight of the circuit assembly 10 can be reduced. Furthermore, when the control circuit section has conductive path 64, both the gate terminals 44, 54 are connected to a single conductive path 64, and thus the weight of the circuit assembly 10 can be reduced compared to when the gate terminals 44, 54 are connected to separate conductive paths.

[0040] Furthermore, both the conductive path 62 of the power circuit section and the conductive path 64 of the control circuit section are provided on one flexible wiring member 60. This eliminates the need to provide multiple flexible wiring members 60, thereby reducing costs.

[0041] Additionally, a conductive path 64 of the control circuit section is provided along the outer edge of the flexible wiring member 60, and a conductive path 62 of the power circuit section is provided in an area of the flexible wiring member 60 that is surrounded by the conductive path 64 of the control circuit section. This allows the power circuit section and the control circuit section to be provided in a single layer of flexible wiring member 60. This eliminates the need to provide multiple layers of conductive paths in the flexible wiring member 60, thereby reducing costs.

[0042] Furthermore, flexible wiring member 60 is arranged so as to extend from first bus bar 20 across insulating spacer 82 to second bus bar 30, with the connection portion between source terminal 42 and the power circuit portion and the connection portion between gate terminal 44 and the control circuit portion being located on first bus bar 20, and the connection portion between source terminal 52 and the power circuit portion and the connection portion between gate terminal 54 and the control circuit portion being located on second bus bar 30. As a result, when bus bars 20, 30 and insulating spacer 82, which have different thermal expansion coefficients, thermally expand and contract, flexible wiring member 60 deforms to absorb displacement between the connections, thereby preventing electrical disconnection at the connections.

[0043] Furthermore, when the flexible wiring member 160 is employed, the source terminals 42, 52 of multiple pairs of first semiconductor elements 40 and second semiconductor elements 50 are connected via one conductive path 162. This reduces the electrical resistance of the conductive path 162 connecting the source terminals 42, 52, and suppresses the amount of heat generated when a large current flows.

[0044] [Variations] Although the foregoing has been described assuming that both the power circuit section and the control circuit section have conductive paths 62, 64, this is not a required configuration. Of the power circuit section and the control circuit section, only the power circuit section may have the conductive path 62, or only the control circuit section may have the conductive path 64. When only the power circuit section has the conductive path 62, for example, the gate terminals 44, 54 may be directly connected to the control circuit board 70 via a terminal or the like provided on the control circuit board 70, without via the conductive path 64. When only the control circuit section has the conductive path 64, for example, the source terminals 42, 52 may be connected via a third bus bar provided separately from the first bus bar 20 and the second bus bar 30.

[0045] Furthermore, although it has been described above that the conductive path 62 for the power circuit section and the conductive path 64 for the control circuit section are provided on one flexible wiring member 60, this is not an essential configuration. A flexible wiring member having the conductive path 62 for the power circuit section and a flexible wiring member having the conductive path 64 for the control circuit section may be provided separately.

[0046] Furthermore, although the conductive path 62 of the power circuit section and the conductive path 64 of the control circuit section have been described as being provided on the same layer in one flexible wiring member 60, this is not a required configuration. One flexible wiring member may have multiple conductive layers, and the conductive path of the power circuit section and the conductive path of the control circuit section may be provided on different conductive layers.

[0047] The configurations described in the above embodiments and modifications can be combined as appropriate as long as they are not mutually contradictory. [Explanation of symbols]

[0048] 10 Circuit components 20 No. 1 bus bar 22 First element connection part 24 First external connection part 25 through holes 30 Second bus bar 32 Second element connection part 34 Second external connection part 35 through holes 40 First semiconductor element 41 Main Unit 42 Source terminal (first power terminal) 43 Drain terminal (second power terminal) 44 Gate terminal (first signal terminal) 50 second semiconductor element 51 Main Unit 52 Source terminal (third power terminal) 53 Drain terminal (fourth power terminal) 54 Gate terminal (second signal terminal) 60, 160 Flexible wiring material 62, 162 Conductive path (power circuit section) 64 Conductive path (control circuit section) 66 Insulation section 70 Control circuit board 72 connectors 80 cases 82 Insulating spacer 84 First bus bar holding part 86 Second bus bar holding part S solder

Claims

1. a first bus bar and a second bus bar that configure a power circuit; a first semiconductor device having a first power terminal, a second power terminal, and a first signal terminal; a second semiconductor device having a third power terminal, a fourth power terminal, and a second signal terminal; a power circuit section that electrically connects the first power terminal and the third power terminal; a control circuit section for electrically connecting both the first signal terminal and the second signal terminal to a control device; Equipped with the second power terminal is electrically connected to the first bus bar, and the first semiconductor element is mounted on the first bus bar; the fourth power terminal is electrically connected to the second bus bar, and the second semiconductor element is mounted on the second bus bar; At least the power circuit section of the power circuit section and the control circuit section has a flexible conductive path, a control circuit board provided separately from the flexible conductive path; The substrate of the control circuit board is a rigid type, the flexible conductive path is connected to the control circuit board while bending in a thickness direction, a plurality of pairs of the first semiconductor element and the second semiconductor element are provided; A circuit structure in which the power circuit portion in the flexible conductive path has a first conductive path for a first set of the first semiconductor element and the second semiconductor element among multiple sets of the first semiconductor element and the second semiconductor element, and a second conductive path for a second set of the first semiconductor element and the second semiconductor element.

2. 2. The circuit assembly according to claim 1, A circuit assembly, wherein both the power circuit section and the control circuit section have flexible conductive paths.

3. 3. The circuit assembly according to claim 2, A circuit assembly, in which both the conductive path of the power circuit section and the conductive path of the control circuit section are provided on one flexible wiring member.

4. 4. The circuit assembly according to claim 3, the conductive path of the control circuit section is provided along an outer edge of the flexible wiring member, A circuit assembly in which the conductive path of the power circuit section is provided in a region of the flexible wiring member that is surrounded by the conductive path of the control circuit section.

5. The circuit assembly according to claim 3 or 4, an insulating spacer provided between the first bus bar and the second bus bar; the flexible wiring member is arranged so as to extend from the first bus bar across the insulating spacer to the second bus bar, a connection portion between the first power terminal and the power circuit unit and a connection portion between the first signal terminal and the control circuit unit are located on the first bus bar, a connection portion between the third power terminal and the power circuit portion and a connection portion between the second signal terminal and the control circuit portion are located on the second bus bar.

6. The circuit assembly according to any one of claims 1 to 5, a plurality of pairs of the first semiconductor element and the second semiconductor element are provided; A circuit structure, in which the first power terminals and the third power terminals of a plurality of pairs of the first semiconductor elements and the second semiconductor elements are connected via one of the conductive paths.

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