Vehicle lighting fixtures

Abstract

To provide a vehicular lamp capable of suppressing malfunction due to dew condensation.SOLUTION: A vehicular headlamp 1 is equipped with: a chip type light emission component 30 that includes grounding terminals 33 having rows 32F and 32S made of a plurality of signal terminals 32 aligned in a horizontal direction and edges 33F and 33S opposite to the rows, and a light emitting portion 35; and a circuit substrate 20 that includes a grounding land 23 having rows 22F and 22S made of a plurality of signal lands 22 aligned in the horizontal direction and individually soldered to the signal terminals and edges 23F and 23S opposite to the rows, and soldered to the grounding terminal 33, and to which a mounting surface 20S of the chip type light emission component 30 is fixed in a non-horizontal direction. Any of the edges 33F, 33S, 23F, and 23S extends in the non-horizontal direction.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a vehicle lamp. [Background technology]

[0002] BACKGROUND ART Vehicle lighting fixtures, such as automobile headlights, that change the light distribution pattern of emitted light are known, and Patent Document 1 listed below discloses such a vehicle lighting fixture.

[0003] The vehicle lamp described in Patent Document 1 below has a light source unit consisting of a multi-segment LED (Light Emitting Diode) array mounted on a circuit board, and the direction of light emitted from the multi-segment LED can be controlled by changing the orientation of this circuit board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-131922 Summary of the Invention [Problem to be solved by the invention]

[0005] The multi-segment LEDs described above are usually provided with multiple signal terminals and ground terminals. However, LEDs generate heat during use, and in order to cool the multi-segment LED, this heat may be conducted from the multi-segment LED to the substrate. For this reason, a ground electrode may be provided on the back of the multi-segment LED, and its area may be larger than that of the other signal terminals. Such an electrode with a large area for heat dissipation is sometimes called an exposed pad.

[0006] In recent years, the distance between the exposed pad and the signal terminal has become smaller due to the trend toward higher density component mounting. Therefore, if condensation occurs between the exposed pad and the signal terminal, there is a concern that the condensation may short-circuit the exposed pad and the signal terminal, causing the vehicle lamp to malfunction.

[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a vehicle lamp that can suppress malfunctions caused by condensation. [Means for solving the problem]

[0008] In order to achieve the above object, the vehicle lamp of the present invention comprises a chip-type light-emitting component including a row of a plurality of signal terminals arranged in a horizontal direction, a ground terminal having an edge facing the row, and a light-emitting portion that emits light to be irradiated to the outside of the vehicle; and a circuit board to which the mounting surface of the chip-type light-emitting component is fixed non-horizontally, the circuit board including a row of a plurality of signal lands arranged in the horizontal direction and soldered individually to each of the signal terminals, and ground lands having an edge facing the row and soldered to the ground terminals, wherein the edge of at least one of the ground terminals and the ground lands extends in a non-horizontal direction.

[0009] In this vehicle lamp, the arrangement direction of the signal terminals is non-parallel to the edge of the ground terminal facing the signal terminals. Even if condensation occurs between a signal terminal and a ground terminal facing the signal terminal or between a signal land and a ground land facing the signal land, the non-horizontal edge of at least one of the ground terminal and the ground land allows the condensed water to flow easily along the edge due to gravity. This can prevent short circuits between the ground line and the signal line. Therefore, this vehicle lamp can prevent malfunctions due to condensation.

[0010] The edge extending in a non-horizontal direction is composed of a plurality of edge portions that are not parallel to each other.

[0011] In this case, the width of the entire edge in the direction perpendicular to the extending direction of the row of the signal terminals can be made smaller than when the edge facing the row of the signal terminals or signal lands is linear and inclined relative to the row, and therefore the widths of the edges of the ground terminals or ground lands in the horizontal and perpendicular directions can be made smaller, which can contribute to the miniaturization of the vehicle lamp.

[0012] In this case, it is preferable that the center of the edge extending in the non-horizontal direction is located above the end of the edge.

[0013] This configuration allows the condensed water to flow outward from the ground terminals and ground lands, thereby further reducing the risk of short circuits.

[0014] It is also preferable that the edge of the ground terminal and the edge of the ground land facing the edge are both non-horizontal.

[0015] With this configuration, condensed water can be more effectively flushed away, and short circuits can be further prevented.

[0016] Furthermore, it is preferable that the chip-type light-emitting component has a pair of the rows sandwiching the ground terminal, the circuit board has a pair of the rows sandwiching the ground land, and that the edges of at least one of the ground terminal and the ground land that face the pair of the rows extend in a non-horizontal direction.

[0017] In this case, condensation water can easily flow from the pair of edges of the ground terminals and the pair of edges of the ground lands, so even in this case, malfunctions due to condensation can be suppressed.

[0018] The chip-type light-emitting component may be a micro LED array.

[0019] The circuit board may have a mounting surface for the chip-type light-emitting component fixed vertically, and the light-emitting portion may emit the light from the side opposite to the circuit board. [Effects of the Invention]

[0020] As described above, the present invention provides a vehicle lamp that can suppress malfunctions caused by condensation. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a schematic diagram showing a vehicle headlamp according to an embodiment of the present invention; [Figure 2] FIG. 2 is a front view of a chip-type light-emitting component. [Figure 3] FIG. 2 is a rear view of the chip-type light-emitting component. [Figure 4] FIG. [Figure 5] 10 is a cross-sectional view showing the state of soldering between the chip-type light-emitting component and the circuit board. FIG. [Figure 6] 10 is a modified example of a chip-type light-emitting component. DETAILED DESCRIPTION OF THE INVENTION

[0022] Below, embodiments for carrying out a vehicle lamp according to the present invention are illustrated with reference to the accompanying drawings. The embodiments illustrated below are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention can be modified and improved without departing from the spirit thereof. Furthermore, the present invention may also be realized by appropriately combining the components in the embodiments illustrated below. Note that in the drawings referred to below, the dimensions of each component may be changed to facilitate understanding.

[0023] In this embodiment, a vehicle headlamp will be described as an example of a vehicle lamp. Fig. 1 is a schematic diagram showing a vehicle headlamp in this embodiment. As shown in Fig. 1, the vehicle headlamp 1 in this embodiment mainly comprises a lamp unit 2 and a housing 10.

[0024] The casing 10 mainly comprises a housing 11 and a front cover 12. The front cover 12 transmits light emitted from the lamp unit 2. The housing 11 is configured in a box shape with an opening at the front, and the front cover 12 is fixed to the housing 11 so as to close the opening. In this way, an accommodation space surrounded by the housing 11 and the front cover 12 is formed in the casing 10, and the lamp unit 2 is disposed in the accommodation space.

[0025] The lighting unit 2 of this embodiment mainly comprises a circuit board 20 fixed in the vertical direction, a chip-type light-emitting component 30 mounted on the circuit board 20, and a projection lens 40 that transmits light emitted by the chip-type light-emitting component 30.

[0026] FIG. 2 is a front view of the chip-type light-emitting component 30. As shown in FIG. 2, the chip-type light-emitting component 30 of this embodiment is a micro LED array, and a light-emitting portion 35 is provided in a main body 30M, which is a package. The main body 30M has a roughly rectangular parallelepiped shape, and as shown in FIG. 2, has a rectangular shape when viewed from the front. The light-emitting portion 35 is formed by arranging a plurality of light-emitting elements 36 that emit light in a matrix. The number of light-emitting elements 36, which is the number of pixels of the light-emitting portion 35, is, for example, from one thousand to tens of thousands. Each light-emitting portion 35 emits light to the side opposite the circuit board 20.

[0027] FIG. 3 is a rear view of the chip-type light-emitting component 30. A plurality of pad-type terminals are provided on the rear surface of the chip-type light-emitting component 30, which faces the circuit board 20. These pad-type terminals include a plurality of signal terminals 32 and a ground terminal 33. Each signal terminal 32 is a terminal to which a control signal is input to control the on / off of each light-emitting element 36 and the intensity of light emitted by each light-emitting element 36. In this embodiment, the signal terminals 32 are generally circular. The signal terminals 32 are arranged along the longitudinal direction of the chip-type light-emitting component 30, forming a pair of rows 32F and 32S indicated by dotted lines. Each of the signal terminals 32 forming the pair of rows 32F and 32S is provided near the longitudinal edges of the main body 30M.

[0028] The ground terminal 33 is located between a pair of rows 32F and 32S. Therefore, the ground terminal 33 is sandwiched between a plurality of opposing signal terminals 32 and has an edge 33F facing one row 32F and an edge 33S facing the other row 32S. One edge 33F extends in a direction non-parallel to the longitudinal direction of one row 32F, and the other edge 33S extends in a direction non-parallel to the longitudinal direction of the other row 32S. In this embodiment, the one edge 33F is composed of non-parallel, linear edge portions 33F1 and 33F2. The lengths of edge portion 33F1 and edge portion 33F2 are approximately the same, and edge portions 33F1 and 33F2 are symmetrical with respect to a line passing through the center of row 32F and perpendicular to the longitudinal direction. Furthermore, the connection point between edge portions 33F1 and 33F2 of edge 33F is closest to row 32F. Therefore, edge 33F moves away from row 32F as it moves from the center of row 32F in the longitudinal direction toward the outside of the back surface of chip-type light-emitting component 30 along the longitudinal direction of row 32F. The other edge 33S is composed of non-parallel linear edge portions 33S1 and 33S2, and has a shape obtained by shifting one edge 33F toward row 32S. Edge portion 33S1 is parallel to edge 33F1 and has the same length as edge 33F1, and edge portion 33S2 is parallel to edge 33F2 and has the same length as edge 33F2. Therefore, edge portions 33S1 and 33S2 are symmetrical with respect to a line passing through the center of row 32S and perpendicular to the longitudinal direction. Furthermore, the connection point between edge portions 33S1 and 33S2 of edge 33S is farthest from row 32S. Therefore, the edge 33S approaches the row 32S from the center in the longitudinal direction of the row 32S toward the outside of the back surface of the chip-type light-emitting component 30 along the longitudinal direction of the row 32S. Therefore, when the chip-type light-emitting component 30 is arranged with the row 32F above the row 32S, the center of the edge 33F is located above the end of the edge 33F, and the center of the edge 33S is located above the end of the edge 33S. Note that the edges 33F, 33S of the ground terminal 33 that face the rows 32F, 32S of the multiple signal terminals 32 preferably have an overall slope of 10 degrees or more with respect to the longitudinal direction of the rows 32F, 32S.

[0029] The size of the ground terminal 33 is larger than the combined size of all the signal terminals 32. With the ground terminal 33 having such a size, heat generated in the light emitting portion 35 is easily conducted to the circuit board 20.

[0030] Fig. 4 is a front view of the circuit board 20. As shown in Fig. 4, a plurality of lands are provided on the component mounting surface 20S of the circuit board 20 on which the chip-type light-emitting component 30 is mounted. These lands are provided at positions corresponding to the respective terminals of the chip-type light-emitting component 30, with shapes and sizes corresponding to the respective terminals. Therefore, signal lands 22 are provided at positions corresponding to the respective signal terminals 32, and ground lands 23 are provided at positions corresponding to the respective ground terminals 33.

[0031] Therefore, the signal lands 22 form a pair of rows 22F and 22S indicated by dotted lines. Each of the signal lands 22 forming the pair of rows 22F and 22S is provided along the extension direction of a predetermined edge of the circuit board 20.

[0032] The ground land 23 is located between a pair of rows 22F and 22S. Therefore, the ground land 23 is sandwiched between a plurality of opposing signal lands 22 and has an edge 23F facing one row 22F and an edge 23S facing the other row 22S. One edge 23F extends in a direction non-parallel to the longitudinal direction of one row 22F, while the other edge 23S extends in a direction non-parallel to the longitudinal direction of the other row 22S. In this embodiment, the one edge 23F is composed of non-parallel, linear edge portions 23F1 and 23F2. The lengths of the edge portion 23F1 and the edge portion 23F2 are approximately the same, and the edge portions 23F1 and 23F2 are symmetrical with respect to a line passing through the center of the row 22F and perpendicular to the longitudinal direction. Furthermore, the connection point between edge portion 23F1 and edge portion 23F2 of edge 23F is closest to row 22F. Therefore, edge 23F moves away from row 22F as it moves from the center of row 22F in the longitudinal direction toward the outside of mounting surface 20S of circuit board 20 along the longitudinal direction of row 22F. The other edge 23S is composed of non-parallel linear edge portions 23S1 and 23S2, and has a shape obtained by shifting one edge 23F toward row 22S. Edge portion 23S1 is parallel to edge 23F1 and has the same length as edge 23F1, and edge portion 23S2 is parallel to edge 23F2 and has the same length as edge 23F2. Therefore, edge portions 23S1 and 23S2 are symmetrical with respect to a line passing through the center of row 22S and perpendicular to the longitudinal direction. Furthermore, the connection point between edge portion 23S1 and edge portion 23S2 of edge 23S is farthest from row 22S. Therefore, edge 23S approaches row 22S from the center in the longitudinal direction of row 22S toward the outside of the back surface of circuit board 20 along the longitudinal direction of row 22S. Therefore, when circuit board 20 is placed with row 22F above row 22S, the center of edge 23F is located higher than the end of edge 23F, and the center of edge 23S is located higher than the end of edge 23S. Note that edges 23F, 23S of ground lands 23 that face rows 22F, 22S of multiple signal lands 22 preferably have an overall gradient of 10 degrees or more with respect to the longitudinal direction of rows 22F, 22S, similar to the gradient of edges 33F, 33S of ground terminals 33.

[0033] An example of the circuit board 20 is a glass epoxy substrate having wiring provided thereon and lands provided to connect to the wiring. Another example of the circuit board 20 is a metal substrate made of copper or the like having an insulating layer provided on its surface, multiple wiring provided on the insulating layer, and lands provided to connect to the wiring. However, in this other example, no insulating layer may be provided at the location where the ground lands 23 are provided, and the metal substrate and the ground lands 23 may be electrically connected. In this case, when the chip-type light-emitting component 30 is mounted, heat generated in the light-emitting portion 35 is easily conducted from the ground terminals 33 to the metal substrate via the ground lands 23.

[0034] 5 is a cross-sectional view showing the soldering of the chip-type light-emitting component 30 and the circuit board 20. Note that FIG. 5 is a cross-sectional view passing through a ground terminal 33, a pair of signal terminals 32 sandwiching the ground terminal 33, and a ground land 23, a pair of signal lands 22 sandwiching the ground land 23. Each signal terminal 32 constituting row 32F of the chip-type light-emitting component 30 faces each signal land 22 constituting row 22F of the circuit board 20, and each signal terminal 32 constituting row 32S faces each signal land 22 constituting row 22S, respectively. Furthermore, an edge 33F of the ground terminal 33 faces an edge 23F of the ground land 23, and the edge 33S faces the edge 23S, so that the ground terminal 33 faces the ground land 23. In this state, the signal terminals 32 and the signal lands 22, which face each other, are soldered together with the solder 52, and the ground terminals 33 and the ground lands 23 are soldered together with the solder 53. Therefore, although not particularly shown, when the circuit board 20 is viewed from the front, the shape of the solder 52 is generally the same as the shapes of the signal terminals 32 and the signal lands 22, which face each other, and the shape of the solder 53 is generally the same as the shapes of the ground terminals 33 and the ground lands 23, which face each other.

[0035] With the chip-type light-emitting component 30 mounted on the circuit board 20 in this manner, the circuit board 20 is fixed within the housing 10 so that the component mounting surface 20S is aligned vertically, as shown in FIG. 1. The vertical direction is the direction along the direction of gravity. In this embodiment, as shown in FIG. 4, the circuit board 20 is fixed so that the rows 22F and 22S of the circuit board 20 are horizontal, with row 22F being higher than row 22S. Therefore, the signal lands 22 constituting each of the rows 22F and 22S are arranged horizontally. Therefore, as shown in FIG. 3, the rows 32F and 32S of the chip-type light-emitting component 30 are horizontal, with row 32F being higher than row 32S. Therefore, the signal terminals 32 constituting each of the rows 32F and 32S are arranged horizontally. Furthermore, edges 33F, 33S of the ground terminal 33 and edges 23F, 23S of the ground land 23 each extend non-horizontally and have a slope. Specifically, edges 33F, 33S of the ground terminal 33 each slope diagonally downward from the center to both ends, and edges 23F, 23S of the ground land 23 each slope diagonally downward from the center to both ends. Furthermore, edges of solder 53 facing solder 52 also extend non-horizontally and have a slope, each sloped diagonally downward from the center to both ends. In this state, if the edges 33F, 33S of the ground terminal 33 have an inclination of 10 degrees or more relative to the longitudinal direction of the rows 32F, 32S as described above, the edges 33F, 33S have an inclination of 10 degrees or more relative to the horizontal direction, and if the edges 23F, 23S of the ground land 23 have an inclination of 10 degrees or more relative to the longitudinal direction of the rows 22F, 22S as described above, the edges 23F, 23S have an inclination of 10 degrees or more relative to the horizontal direction.

[0036] In the vehicle headlamp 1 configured as described above, when a control signal from a control unit (not shown) is input to the chip-type light-emitting component 30 via the signal lands 22, the solder 52, and the signal terminals 32, the desired light-emitting element 36 in response to the control signal emits light with the desired intensity, and light in a desired pattern is emitted from the light-emitting unit 35 to the side opposite the circuit board 20. This light passes through the projection lens 40 and the front cover 12 at a predetermined divergence angle, and light in a desired light distribution pattern is irradiated.

[0037] Furthermore, in products that use circuit boards, condensation may occur on the circuit board if the humidity is high and the temperature is low when not in use. In the vehicle headlamp 1, if there is a large amount of condensation, water droplets may accumulate between the ground terminal 33 and the signal terminal 32, between the ground land 23 and the signal land 22, or between the solder 53 and the solder 52. However, as described above, because each edge has a slope and extends non-horizontally, the water droplets tend to flow along the edges.

[0038] In the present embodiment, an example has been described in which the edges 33F, 33S of the ground terminal 33 and the edges 23F, 23S of the ground land 23 extend non-horizontally. However, if any of the edges 33F, 33S of the ground terminal 33 and the edges 23F, 23S of the ground land 23 extend non-horizontally, water droplets are more likely to flow along the non-horizontal edge than if all of these edges extend horizontally.

[0039] As described above, the vehicle headlamp 1 as a vehicle lamp of this embodiment comprises: a chip-type light-emitting component 30 including rows 32F, 32S of a plurality of signal terminals 32 arranged horizontally, ground terminals 33 having edges 33F, 33S opposite the rows 32F, 32S, and a light-emitting portion 35 that emits light to be irradiated to the outside of the vehicle; and a circuit board 20 to which the mounting surface 20S of the chip-type light-emitting component 30 is fixed non-horizontally, including rows 22F, 22S of a plurality of signal lands 22 arranged horizontally and individually soldered to each of the signal terminals 32, and ground lands 23 having edges 23F, 23S opposite the rows 22F, 22S and soldered to the ground terminals 33. One of the edges 33F, 33S facing the rows 32F, 32S of the ground terminals 33 and the edges 23F, 23S facing the rows 22F, 22S of the ground lands 23 extends in a non-horizontal direction.

[0040] In such a vehicle headlamp 1, even if condensation occurs as described above and water droplets accumulate between the ground terminal 33 and the signal terminal 32, between the ground land 23 and the signal land 22, or between the solder 53 and the solder 52, gravity makes it easy for the water droplets to flow along non-horizontal edges. This makes it possible to prevent short circuits between the ground line and the signal line. Therefore, the vehicle headlamp 1 of this embodiment can prevent malfunctions due to condensation.

[0041] Furthermore, in the vehicle headlamp 1 of this embodiment, the edge extending in a non-horizontal direction is made up of multiple edge portions that are not parallel to one another. Therefore, the width of the entire edge in the direction perpendicular to the row direction can be made smaller than when the edge is linear and sloped. This makes it possible to reduce the overall width of the edge of the ground terminal 33 and the ground land 23, which can contribute to the miniaturization of the vehicle headlamp 1.

[0042] Furthermore, in the vehicle headlamp 1 of this embodiment, the center of the non-horizontally extending edge is located above the edge of the edge, which allows condensed water to flow outward from the ground terminal 33 and the ground land 23. This further reduces short circuits.

[0043] In the vehicle headlamp 1 of this embodiment, the edges 33F, 33S of the ground terminal 33 and the edges 23F, 23S of the ground land 23 facing the edges 33F, 33S are both non-horizontal. Therefore, compared to a case where the edges 33F, 33S of the ground terminal 33 are non-horizontal and the edges 23F, 23S of the ground land 23 are horizontal, for example, condensed water can be more easily shed and short circuits can be more effectively prevented.

[0044] Although the present invention has been described above using the above-mentioned embodiments as examples, the present invention is not limited to these.

[0045] For example, in the above embodiment, the vehicle lamp 1 has been described as an example of a vehicle lamp, but the vehicle lamp of the present invention is not limited to a vehicle headlamp as long as it is a lamp that emits light to be irradiated to the outside of the vehicle. For example, the vehicle lamp of the present invention may be one that emits light rearward or laterally of the vehicle.

[0046] In the above embodiment, the chip-type light-emitting component 30 is described as a micro LED array. However, the chip-type light-emitting component 30 does not have to be a micro LED array as long as it is a chip-type light-emitting component that emits light. For example, it may be a DMD. In this case, the light-emitting section 35 provided in the main body 30M shown in FIG. 2 is composed of multiple micro mirrors arranged in a matrix instead of the multiple light-emitting elements 36 shown in FIG. 2. Even in this case, the DMD has terminals similar to those shown in FIG. 4, and the circuit board 20 also has lands similar to those shown in FIG. 4. The opposing terminals and lands are soldered together in the same manner as in the above embodiment. In this case, the vehicle headlamp 1 includes a light source, such as an LED or LD (Laser Diode), within the housing 10, which irradiates light toward the DMD. In a vehicle headlamp configured in this manner, the micro mirrors reflect light incident from the light source, allowing the chip-type light-emitting component 30 to emit light in a desired pattern. The light emitted from the chip-type light emitting component 30 passes through the projection lens 40 and the front cover 12 at a predetermined divergence angle, as in the above embodiment, and is irradiated with light having a desired light distribution pattern.

[0047] In the above embodiment, an example was described in which one edge 33F of the ground terminal 33 is composed of non-parallel edge portions 33F1 and 33F2, and the other edge 33S is composed of non-parallel edge portions 33S1 and 33S2. However, the shape of the ground terminal 33 is not limited to the above embodiment. FIG. 6 shows a modified example of the chip-type light-emitting component 30, viewed from the same perspective as FIG. 3. As shown in FIG. 6, in the chip-type light-emitting component 30 of this modified example, one edge 33F of the ground terminal 33 is linear and moves away from the row 32F of the multiple signal terminals 32 from one end to the other, while the other edge 33S is linear and moves closer to the row 32S of the multiple signal terminals 32 from one end to the other. In this case, when the ground terminal 33 of the chip-type light-emitting component 30 and the ground land 23 of the circuit board 20 are viewed from the front, the ground land 23 of the circuit board 20 preferably has a shape symmetrical to the ground terminal 33 so that the edge 33F and the edge 23F face each other in parallel when the chip-type light-emitting component 30 is mounted on the mounting surface 20S. Note that in this modification, even if the ground terminal 33 of the chip-type light-emitting component 30 has the shape shown in Fig. 6, the edge 23F or the edge 23S of the ground land 23 of the circuit board 20 may be horizontal. Alternatively, if the ground land 23 of the circuit board 20 has a shape like the ground terminal 33 of the chip-type light-emitting component 30 in Figure 6, in which one edge 23F moves away from the row 22F of the multiple signal lands 22 from one end to the other and the other edge 23S moves closer to the row 22S of the multiple signal lands 22 from one end to the other, the ground terminal 33 of the chip-type light-emitting component 30 may have a shape such that the edge 33F or edge 33S extends horizontally, parallel to the rows 32F and 32S, unlike Figure 6.

[0048] Furthermore, in the above embodiment and modified example, an example was described in which both of the pair of edges 33F, 33S are non-parallel to the rows 32F, 32S. However, one of the pair of edges 33F, 33S may be non-parallel to the opposing row 32F, 32S, and the other may be parallel. In this case, one of the pair of edges 33F, 33S is non-horizontal, and the other is horizontal. Similarly, one of the pair of edges 23F, 23S may be non-parallel to the opposing row 22F, 22S, and the other is parallel. In this case, one of the pair of edges 23F, 23S is non-horizontal, and the other is horizontal.

[0049] Furthermore, the chip-type light-emitting component 30 may emit light from another portion instead of emitting light from the side opposite to the circuit board 20 side.

[0050] Furthermore, the circuit board 20 does not necessarily have to be fixed vertically as in the above embodiment, as long as the component mounting surface 20S is not fixed horizontally. For example, if the mounting surface 20S of the circuit board 20 is fixed at an angle and the light emitted from the chip-type light-emitting component 30 propagates obliquely upward, a reflector that reflects the emitted light to the projection lens 40 may be provided. [Industrial Applicability]

[0051] As described above, according to the present invention, a vehicle lamp capable of suppressing malfunctions due to condensation is provided, and can be used in the field of vehicle lamps for automobiles and the like. [Explanation of symbols]

[0052] 1. Vehicle headlamp 20 Circuit board 22 Signal land 22F,22S...row 23 Ground land 23F, 23S... Edge 30. Chip-type light-emitting component 32...Signal terminal 32F,32S...row 33 Ground terminal 33F, 33S... Edge 40 Projection lens 52, 53...Solder

Claims

1. a chip-type light-emitting component including a row of a plurality of signal terminals arranged in a horizontal direction, a ground terminal having an edge facing the row, and a light-emitting portion that emits light to be irradiated to the outside of the vehicle; a circuit board including a row of signal lands arranged in the horizontal direction and individually soldered to the signal terminals, and ground lands having edges facing the row and soldered to the ground terminals, the circuit board having a mounting surface for the chip-type light-emitting component fixed non-horizontally; Equipped with The edge of at least one of the ground terminal and the ground land extends in a non-horizontal direction. A vehicle lamp characterized by:

2. The non-horizontally extending edge is made up of a plurality of edge portions that are not parallel to one another.

2. A vehicle lamp according to claim 1.

3. The center of the non-horizontally extending edge is located above the edge of the edge.

3. A vehicle lamp according to claim 2.

4. The edge of the ground terminal and the edge of the ground land facing the edge are both non-horizontal.

4. A vehicle lamp according to claim 1, wherein the light source is a light source for a vehicle.

5. the chip-type light-emitting component has a pair of the rows sandwiching the ground terminal therebetween, the circuit board has a pair of the rows sandwiching the ground land therebetween, In at least one of the ground terminal and the ground land, the edges facing the pair of rows extend in a non-horizontal direction.

5. A vehicle lamp according to claim 1, wherein the light source is a light source for a vehicle.

6. The chip-type light-emitting component is a micro LED array.

6. A vehicle lamp according to claim 1, wherein the light source is a light source for a vehicle.

7. the circuit board is fixed such that the mounting surface of the chip-type light-emitting component is vertically oriented; The light emitting portion emits the light from the side opposite to the circuit board side.

7. A vehicle lamp according to claim 1, wherein the light source is a light source for a vehicle.

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