Sensor assembly for electronic device

Abstract

A sensor assembly suitable for consumer electronic devices is provided. In a tablet computer (electronic device), a sensor assembly 106 includes a solid-state sensor, such as a capacitive sensor, a piezoelectric sensor, or a piezoresistive sensor. The sensor assembly 106 includes many features that provide a compact profile and make it well-suited for integration into the small space of an electronic device enclosure. The sensor assembly 106 also includes features that isolate the motion of various parts of the sensor assembly 106, allowing for accurate detection of sensed events. The sensor assembly 106 is coupled to a tactile actuator, a speaker, or both, to mimic the feel of a mechanical button and enhance the user experience.

Description

[Technical Field]

[0001] The described embodiments relate to a sensor assembly suitable for consumer electronic devices. According to some embodiments, the sensor assembly includes a solid-state sensor, such as a capacitive touch sensor. [Background technology]

[0002] Conventional mechanical switches are used in many applications within electronic products. For example, many button and keyboard designs include mechanically-based actuators that rely on relatively large movements to complete an electrical circuit. Advantages of mechanical switches include their low cost and ability to provide audible and tactile responses to users. However, mechanical switches are relatively large in size, making them difficult to integrate into products with very limited space. This can be a significant obstacle when integrating them into modern portable electronic products that contain many electronic components within a small enclosure. Furthermore, mechanical switches can wear out quickly and may require frequent replacement. Therefore, improved sensor and actuator designs for electronic devices are needed. Summary of the Invention

[0003] This specification describes various embodiments relating to a sensor assembly for an electronic device. In certain embodiments, the sensor assembly includes a solid-state sensor that requires low deflection for actuation and has a small cross-sectional profile.

[0004] According to a further embodiment, an electronic device is described. The electronic device includes a speaker and a tactile component. The electronic device also includes a display cover covering a display of the electronic device. The display cover has an opening. The electronic device further includes a sensor assembly for accepting input for the electronic device. The sensor assembly includes a sensor cover disposed within the opening of the display cover and having an outer surface configured to accept the input. The sensor assembly also includes a sensor configured to detect the input. The sensor generates one or more signals that activate the tactile component and the speaker in response to the input.

[0005] According to one embodiment, a sensor assembly for detecting and responding to an input is described. The sensor assembly includes a sensor cover having an outer surface for receiving the input. The sensor assembly also includes a trim surrounding an outer periphery. The sensor assembly further includes a compliant member disposed between the sensor cover and a ledge of the trim. The compliant member is configured to contract in response to the input and provide a restoring force. The sensor assembly further includes a capacitive touch sensor configured to detect the input.

[0006] According to another embodiment, an electronic device is described. The electronic device includes a display cover that covers a display of the electronic device. The display cover has an opening that defines a chamfered inner edge. The electronic device also includes a sensor assembly for accepting an input for the electronic device. The sensor assembly includes the sensor cover disposed within the opening and having an outer surface configured to accept the input. The sensor assembly also includes a trim disposed within the opening between the sensor cover and the display cover. The trim has a chamfered outer edge that engages the chamfered inner edge of the display cover. The sensor assembly further includes a sensor configured to detect the input.

[0007] These and other embodiments are described in more detail below. [Brief explanation of the drawings]

[0008] The present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, in which like reference numerals indicate like structural elements, and in which:

[0009] [Figure 1A] 1 shows a perspective view of a consumer electronic device that may include the sensor assembly described herein. [Figure 1B] 1 shows a perspective view of a consumer electronic device that may include the sensor assembly described herein.

[0010] [Figure 2] 1 illustrates an exploded view of a portion of an electronic device including a sensor assembly, according to some embodiments.

[0011] [Figure 3A] 1B shows a top view of the sensor assembly portion of the electronic device shown in FIG. 1A. [Figure 3B] 1B shows a top view of the sensor assembly portion of the electronic device shown in FIG. 1A.

[0012] [Figure 4A] 3C shows a cross-sectional view of the sensor assembly portion of the electronic device shown in FIG. 3B.

[0013] [Figure 4B] 1 shows a top view of an electronic device having a sensor assembly, a haptic engine, and a speaker.

[0014] [Figure 5] 1 illustrates a cross-sectional view of a sensor assembly portion of an electronic device according to some embodiments.

[0015] [Figure 6] 1 shows a flowchart illustrating steps for assembling a sensor assembly in an electronic device, according to some embodiments.

[0016] [Figure 7A]1 illustrates a cross-sectional view of a mounting configuration of a sensor assembly according to some embodiments. [Figure 7B] 1 illustrates a cross-sectional view of a mounting configuration of a sensor assembly according to some embodiments. [Figure 7C] 1 illustrates a cross-sectional view of a mounting configuration of a sensor assembly according to some embodiments.

[0017] [Figure 8A] 1 illustrates a cross-sectional view of a sealing arrangement of a sensor assembly according to some embodiments. [Figure 8B] 1 illustrates a cross-sectional view of a sealing arrangement of a sensor assembly according to some embodiments. [Figure 8C] 1 illustrates a cross-sectional view of a sealing arrangement of a sensor assembly according to some embodiments. [Figure 8D] 1 illustrates a cross-sectional view of a sealing arrangement of a sensor assembly according to some embodiments. [Figure 8E] 1 illustrates a cross-sectional view of a sealing arrangement of a sensor assembly according to some embodiments.

[0018] [Figure 9A] 1A-1D illustrate cross-sectional and top views of a trimless sensor assembly configuration, according to some embodiments. [Figure 9B] 1A-1D illustrate cross-sectional and top views of a trimless sensor assembly configuration, according to some embodiments. [Figure 9C] 1A-1D illustrate cross-sectional and top views of a trimless sensor assembly configuration, according to some embodiments.

[0019] [Figure 10A] 1A-1D show cross-sectional and top views of a vibration sensor assembly configuration according to some embodiments. [Figure 10B] 1A-1D show cross-sectional and top views of a vibration sensor assembly configuration according to some embodiments. [Figure 10C] 1A-1D show cross-sectional and top views of a vibration sensor assembly configuration according to some embodiments. [Figure 10D]1A-1D show cross-sectional and top views of a vibration sensor assembly configuration according to some embodiments.

[0020] [Figure 11A] 1A-1D show cross-sectional views of a sensor assembly with different detection configurations according to some embodiments. [Figure 11B] 1A-1D show cross-sectional views of a sensor assembly with different detection configurations according to some embodiments. [Figure 11C] 1A-1D show cross-sectional views of a sensor assembly with different detection configurations according to some embodiments.

[0021] [Figure 11D] FIG. 11D illustrates a perspective view of a bracket as part of the sensor assembly configuration of FIG. 11C, according to some embodiments.

[0022] [Figure 12A] 1A and 1B show cross-sectional views of a portion of an electronic device including a sensor assembly before and during a bonding operation, respectively. [Figure 12B] 1A and 1B show cross-sectional views of a portion of an electronic device including a sensor assembly before and during a bonding operation, respectively.

[0023] [Figure 13A] 1 illustrates a sensor assembly configuration for preventing adhesive overflow during a bonding operation, according to some embodiments. [Figure 13B] 1 illustrates a sensor assembly configuration for preventing adhesive overflow during a bonding operation, according to some embodiments. [Figure 13C] 1 illustrates a sensor assembly configuration for preventing adhesive overflow during a bonding operation, according to some embodiments. [Figure 13D] 1 illustrates a sensor assembly configuration for preventing adhesive overflow during a bonding operation, according to some embodiments. [Figure 13E]1 illustrates a sensor assembly configuration for preventing adhesive overflow during a bonding operation, according to some embodiments. [Figure 13F] 1 illustrates a sensor assembly configuration for preventing adhesive overflow during a bonding operation, according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0024] Reference will now be made in detail to exemplary embodiments as illustrated in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred embodiment. On the contrary, the following description is intended to cover alternatives, modifications, and equivalents that may be included within the spirit and scope of the described embodiments, as defined by the appended claims.

[0025] Described herein are features of sensor assemblies well suited for consumer products such as portable electronic devices. According to some embodiments, the sensor assemblies include solid-state sensors. Compared to traditional mechanical switches and buttons that rely on physical contact between contact pads, solid-state sensors utilize voltage or capacitance changes to switch between on and off modes. This aspect makes solid-state sensors less susceptible to wear compared to mechanical switches. Additionally, solid-state sensors are generally more compact than mechanical switches and buttons, making them well suited for integration into small form-factor enclosures, such as those for portable electronic devices.

[0026] Furthermore, solid-state pressure sensor designs can require significantly less movement and force to actuate compared to mechanical switches and buttons. Because the sensor assembly involves minimal or little movement (e.g., 10 micrometers or less, sometimes 5 micrometers or less), a user may not perceive the movement of the sensor assembly (e.g., a button) itself when pressed. Thus, the sensor assembly can be configured to provide tactile feedback (output) to the user in response to the user's touch input, thereby giving the user the experience of having pressed and actuated a button, even if the sensor assembly moves very little. Examples of tactile feedback can include tactile (e.g., vibration) feedback. In some examples, the signal to the user is in the form of acoustic or sonic feedback (i.e., producing a sound). In some cases, the sensor assembly is configured to provide a combination of tactile and acoustic feedback. These feedback features can mimic the experience of activating a mechanical switch or button, thereby providing a pleasant experience for the user. Furthermore, the sensor assembly can provide tactile feedback in response to the user's tactile input (e.g., the user's touch), giving the user an engaging and satisfying sensation and experience with the electronic device.

[0027] The sensor assemblies described herein can include many features that improve the performance of the sensor assembly when integrated into an electronic device. For example, a trim surrounding the sensor cover or cap can prevent lateral movement of the sensor assembly and isolate movement of portions of the sensor assembly toward or away from the touch sensor.

[0028] The sensor assemblies described herein are well suited for integration into consumer products such as computers, mobile phones, tablet devices, wearable electronic devices, and electronic device accessories, such as those manufactured by Apple Inc., based in Cupertino, California.

[0029] These and other embodiments are discussed below with reference to Figures 1A-13F. However, those skilled in the art will readily appreciate that the detailed description set forth herein with respect to these figures is for purposes of illustration only and should not be construed as limiting.

[0030] 1A and 1B illustrate consumer products that may include sensor assemblies such as those described herein. FIG. 1A illustrates a mobile phone 102, and FIG. 1B illustrates a tablet computer 104, each of which includes a sensor assembly 106 configured to sense input from a user. The sensor assembly 106 may be configured to activate one or more electrical circuits within the respective device 102 or 104 and may thereby be referred to as a button assembly or a switch assembly. For example, the sensor assembly 106 may be configured to activate aspects of the displays 108 of the devices 102 and 104, respectively. The sensor assembly 106 may be designed to aesthetically enhance the appearance of the enclosures 110 of the devices 102 and 104. In some cases, the sensor assembly 106 is integrated with the display cover 112 of the enclosure 110.

[0031] The sensor assembly 106 may include one or more sensors to detect input (e.g., touch, press, motion, light). In some cases, the sensors include one or more capacitive, piezoelectric, and piezoresistive sensors. In some cases, the sensor assembly 106 is configured to provide an output, such as tactile or acoustic feedback, to a user indicating that the sensor assembly 106 has been activated in response to the input. In some embodiments, the sensor assembly 106 includes a fingerprint sensor capable of detecting and distinguishing fingerprints of different users. It should be noted that the sensor assemblies described herein may be integrated within any suitable electronic device and are not limited to the devices 102 and 104 shown in FIGS. 1A and 1B . For example, the sensor assemblies may be implemented in a laptop computer or a wearable electronic device.

[0032] FIG. 2 shows an exploded view of a portion of an electronic device (e.g., a mobile phone 102) and illustrates how the sensor assembly 106 is configured to fit within an opening 201 in a display cover 112. The display cover 112 can represent a transparent or partially transparent material that covers and protects the underlying display assembly. The display cover 112 can be constructed of glass (e.g., sapphire), plastic, ceramic, and / or other suitable materials. In some cases, the display cover 112 is coupled to another portion of the enclosure for the mobile phone (e.g., a metal portion of the enclosure) using a fastening mechanism 208. A bracket 211 can be used to secure the sensor assembly 106 to the cover 112 via fasteners 211. Note that the sensor assembly 106 can be inserted into an opening in any suitable portion of the electronic device and is not limited to being integrated with the display cover. For example, the sensor assembly 106 can be inserted into an opening in an opaque enclosure wall of the electronic device.

[0033] As shown, the sensor assembly 106 can be pre-assembled and modular for ease of assembly into an electronic device. The sensor assembly 106 includes a sensor portion 205 and a cable portion 207. The sensor portion 205 can include a sensor configured to detect input (e.g., touch, press, motion, light). In some cases, the sensor is configured to detect a touch or push input from a user's finger. In some examples, the sensor includes one or more capacitive, piezoelectric, and piezoresistive sensors. In some cases, the sensor assembly 106 includes a fingerprint sensor configured to detect a user's fingerprint. The cable portion 207 can include wiring that electrically connects the sensor portion 205 to other electrical components within the electronic device. In some embodiments, the cable portion 207 includes one or more flexible (flex) cables. The sensor cover 202 corresponds to a cosmetic cover having an exterior or outer surface configured to accept input. In some embodiments, the sensor cover 202 is at least partially transparent to allow an underlying fingerprint sensor to detect the pattern of a user's fingerprint.

[0034] The sensor cover 202 is surrounded by a trim 204, which can correspond to a rigid ring or frame having an aperture for receiving the sensor cover 202. In some cases, an intermediate layer, such as an adhesive or polymer layer, is disposed between the sensor cover 202 and the display cover 112. In other cases, the trim 204 is configured to directly engage the sensor cover 202 and the display cover 112 to provide an interference fit. In some embodiments, the trim 204 is constructed of a metallic material that can provide sufficient rigidity without being too brittle. However, in some cases, the trim is constructed of other rigid materials, such as a polymer or ceramic material. As described in more detail below, the trim 204 can limit movement of the sensor assembly 106 once assembled within the display cover 112. Additionally, the trim 116 is visible to the user and can improve the appearance of the sensor assembly 106. Due to its multiple functions, the trim 116 can be referred to as a bracket, brace, support, washer, ring, band, or other suitable term.

[0035] The sensor assembly 106 can be configured to facilitate assembly and disassembly. For example, the sensor assembly 106 can be assembled from the top side of the opening 201, and the bracket 210 can be assembled from the bottom side of the opening 201, as shown in FIG. 2. The bracket 210 can be constructed of metal that is grounded to the enclosure of the electronic device, and a non-conductive portion 212 of the bracket 210 electrically insulates the conductive portion of the bracket 210 from the sensor assembly 106. Because the cable portion 207 is to be positioned under the display cover 112, the cable portion 207 can be threaded through the opening 201, and the trim 204 and sensor cover 202 can be adjusted to fit snugly within the opening 201. The bracket 210 supporting the sensor assembly 106 can then be secured to the display cover 112 using a fastener 211. In the embodiment of FIG. 2, the fastener 211 is a screw, but can alternatively or additionally include a clip, a press-fit fastener, a weld, or other suitable fastener. In some cases, the fastener 211 a is aligned with the center of the opening 201 and the sensor cover 202 .

[0036] It should be noted that the shape of the sensor assembly 106 may vary depending on design requirements. In particular, the sensor cover 202 and trim 204 are not limited to being round or circular as shown. For example, the sensor cover 202 and trim 204 may have a rectangular, triangular, oval, or any other suitable shape.

[0037] 3A and 3B show top views of a portion of an electronic device 102 including a sensor assembly 106. FIG. 3B shows the sensor assembly 106 with a sensor cover 202, while FIG. 3A shows the sensor assembly 106 without the sensor cover 202. FIG. 3A shows a sensor component 304 disposed beneath the sensor cover 202. In some embodiments, the sensor component 304 is a fingerprint sensor or a touch sensor. Surrounding the sensor component 304 is a compliant member 302, which represents one or more layers of a flexible or elastic material, such as silicone or other polymer. In some cases, the compliant member 302 includes separate components (in this case, four circular segment-shaped components) to house the rectangular-shaped sensor component 304. However, it should be noted that the compliant member 302 can have any suitable shape and include any suitable number of components. FIG. 3B shows the sensor assembly 106 fully assembled within the electronic device 102. As shown, the sensor cover 202 is surrounded by a trim 204, both of which are exposed to a user of the electronic device 102. The sensor cover 202 also provides a contact surface for a user to contact and activate the sensor assembly 106.

[0038] FIG. 4A illustrates a cross-sectional view (along line AA in FIG. 3B ) of a portion of the electronic device 102, according to some embodiments, illustrating how the sensor device assembly 106 may be assembled within the electronic device 102. The trim 204 is disposed between the sensor cover 202 and the display cover 112, which is coupled to the enclosure portion 110. As illustrated, the sensor assembly 106 has a very thin cross-section, thereby providing space for components such as component 414. In one particular embodiment, component 414 is a driver as part of the display assembly. The trim 204 includes a ledge 404 that supports the underside of the sensor cover 202. A compliant member 302 having a thickness t is disposed between the sensor cover 202 and the ledge 404 of the trim 204. The compliant member 302 may be adhered to the sensor cover 202 and the ledge 404 by an adhesive layer (not shown), such as a layer of heat-activated film, pressure-sensitive adhesive, liquid adhesive, or other suitable adhesive. In some embodiments, the compliant member 302 includes holes or grooves to accommodate adhesive overflow.

[0039] Inset 400 shows a detailed cross-sectional view of the stack of sensor assembly 106. Beneath sensor cover 202 is fingerprint sensor 304 configured to scan a user's fingerprint through sensor cover 202. In some cases, fingerprint sensor 304 is a silicon chip with a capacitor array in communication with software that can capture a user's fingerprint image and match it to stored fingerprint data. Fingerprint sensor 304 can be coupled to sensor cover 202 by adhesive 407, which can be an optically clear adhesive or other suitable adhesive.

[0040] Below the fingerprint sensor 304 is a touch sensor 402, which in the embodiment of FIG. 4A is a capacitive touch sensor including a first layer 402a and a second layer 402b. A capacitor module 423 is associated with the touch sensor 402. In some embodiments, the first layer 402a and the second layer 402b each represent a flat, flexible material including a layer of a conductive material (e.g., copper) or other suitable material (e.g., indium tin oxide (ITO)) capacitively coupled to one another. The first layer 402a is physically coupled to the fingerprint sensor 304 by a first adhesive layer 408, and the second layer 402b is physically coupled to a stiffener 405 by a second adhesive layer 409 (which can be a different or the same type of adhesive). The first layer 402a and the second layer 402b are separated by a gap 406 having a distance d, such that a change in the distance d is detected by a voltage or capacitance change. Distance d can vary depending on the design and manufacture of touch sensor 402. Gap 406 can be filled with air or other non-conductive material, such as a compliant gel. In some embodiments, air has been found to provide better sensing capabilities than gel.

[0041] When a user touches the outer surface 413 of the sensor cover 202, the force is transmitted to the first layer 402a in a direction 403 (called the sensing direction) toward the sensor 402 and into the pressed position. This, in turn, causes a corresponding decrease in the distance d between the capacitive layers 402a and 402b, thereby causing a change in voltage or capacitance in the touch sensor 402. The touch sensor 402 generates a signal that activates one or more electrical circuits in the electronic device 102. The compliant member 302 is composed of a compliant material that provides a resistive force (opposite the sensing direction 403) that returns the sensor cover 202, thereby causing the first layer 402a to also return to the unpressed position. Once the sensor cover 202 returns to the unpressed position, the compliant member 302 returns to its full thickness t. Because the space for the compliant member 302 is very small, the thickness t should be very thin. In some cases, the thickness is about 500 micrometers or less, and in some cases, in the range of about 50 to 100 micrometers.

[0042] The change in distance d sufficient to cause actuation of the touch sensor 402 depends on the design of the touch sensor 402. Generally, the required change in distance d will be very small. In some cases, the change in distance d is approximately 2-3 micrometers (corresponding to a compliance of approximately 5-10 nm / gram-force for the touch sensor 402). The ledge 404 of the trim 204 acts as a hard stop that limits the amount of movement of the sensor cover 202 in the sensing direction 403. Specifically, the ledge prevents the first layer 402a from contacting or otherwise getting too close to the second layer 402b. In some cases, deflection of the material of the sensor cover 202 when pressed by a user can also contribute to the change in distance d. However, this aspect can be taken into account in the design of the sensor assembly 106. In some embodiments, to reduce material deflection effects of the sensor cover 202, the sensor cover 202 is constructed of a rigid material such as glass (e.g., sapphire), ceramic, or a hard polymer. In some embodiments, the sensor cover 202 moves from the unpressed position to the pressed position by a distance of less than about 50 micrometers in the detection direction 403. In some cases, the sensor cover 202 moves from the unpressed position to the pressed position by a distance of less than about 10 micrometers. In a specific embodiment, the sensor cover 202 moves from the unpressed position to the pressed position by a distance of about 4 micrometers.

[0043] It should be noted that the embodiments described herein are not limited to capacitive sensors. For example, instead of or in addition to capacitive touch sensors 402, sensor assembly 106 may include piezoelectric or piezoresistive sensors. That is, any suitable solid-state sensor may be used.

[0044] Compared to conventional mechanical switches and buttons, the sensor assembly 106 requires little physical movement of the assembly itself for actuation. This allows the sensor assembly 106 to have a much more compact cross-section (z-stack) compared to mechanical switches and buttons, thereby providing more space for other components within the electronic device 102, such as component 414. Furthermore, the sensor assembly 106 does not need to rely on mechanical contact within the touch sensor 402. Instead, the sensor 402 can utilize small voltage or capacitance changes resulting from relatively small force inputs, which can be achieved using solid-state sensors. Generally, solid-state sensors, such as capacitive touch, piezoelectric, and piezoresistive sensors, can include electrical circuits embedded within solid materials, such as semiconductor materials. The relatively non-mechanical aspect of solid-state sensors can reduce wear and tear on the sensor assembly 106 compared to conventional mechanical switches and buttons. Furthermore, the sensor assembly 106 can require less force to actuate compared to mechanical switches and buttons, thereby providing easier input and a better user experience for the electronic device 102. Additionally, because a solid state sensor requires less movement in the sensing direction 403 compared to a mechanical switch, the cross section of the sensor assembly 106 can be smaller (thinner) than the cross section of a mechanical switch assembly.

[0045] Other design considerations include the ability to isolate the movement of the sensor cover 202 as it transitions between the compressed and uncompressed positions. For example, the tight engagement of the trim 204 with the display cover 112 and the sensor cover 202 prevents lateral movement of the sensor assembly 106 relative to the sensing direction 403. As such, the trim 204 should be sized and shaped to conform to the size and shape of the openings in the sensor cover 202 and the display cover 112, respectively. Additionally, the stiffener 405 provides rigid support for the second layer 402b of the touch sensor 402. The stiffener 405 is coupled to the trim 204 via fasteners 418, which in some embodiments are weld spots. This is because welding has been found to provide the strongest bond in some cases and the most reliable rigidity within the limited space provided for the sensor assembly 106. The above structural features in combination with bracket 210 prevent sensor assembly 106 from penetrating into internal cavity 412 and coming into contact with components 414 during drop events and other applications of large forces.

[0046] In the embodiment of FIG. 4A , the trim 204 has a chamfered edge 410 that corresponds to a chamfered edge 411 on the display cover 112. This chamfered design creates a hard stop to prevent the sensor assembly 106 from penetrating into the internal cavity 412 of the enclosure 110. Specifically, the bracket 210 and fastener 211 a support and secure the sensor assembly 106 to the display cover 112, while the matching chamfered shapes of the trim 204 and the display cover 112 further prevent the sensor assembly 106 from shifting and penetrating into the internal cavity 412. These chamfered shapes may be more advantageous than stepped shapes for manufacturing purposes. In particular, stepped shapes are more difficult to polish than chamfered shapes. Furthermore, the angled geometry allows for greater flexibility in terms of lamination tolerances compared to stepped shapes. In some embodiments, the chamfered edges 410 and 411 are each chamfered by approximately 45 degrees relative to the outer surface 425 of the display cover 112. In some embodiments, the sensor assembly 106 is positioned such that the outer surface 413 of the sensor cover 202 is slightly recessed (in some cases by approximately 100 micrometers) relative to the outer surface 425 of the display cover 112. This recessed configuration of the sensor cover 202 can help prevent accidental activation (i.e., false triggering) of the sensor assembly 106.

[0047] In some embodiments, the sensor assembly 106 is configured to provide feedback to the user. For example, the sensor assembly 106 can be electrically connected to a haptic actuator 415 (which can be referred to as a haptic component) that causes vibrations in the electronic device 102. This type of haptic feedback is sometimes referred to as haptic feedback, and the haptic actuator 415 can be referred to as a haptic engine. Additionally or alternatively, the sensor assembly 106 can be electrically connected to a speaker 416 that provides audio feedback to the user. In some cases, the combination of both haptic and audio feedback creates an experience for the user that mimics the pressing of a mechanical button or switch. In one embodiment, the sensor assembly 106 causes the speaker 416 to generate a very quiet, high-pitched, and crisp sound that mimics the sound of a mechanical button being pressed, and causes the haptic actuator 415 to generate a very brief vibration that mimics the feel of a mechanical button being pressed. In some cases, the haptic actuator 415 can vibrate and also generate sound without adding sound from the speaker 416.

[0048] The haptic actuator 415 and speaker 416 can be located in any suitable portion of the electronic device 102. For example, the haptic actuator 415 can be located distal (not shown) of the electronic device 102 relative to the sensor assembly 106 and can be activated by other electronic components of the electronic device 102. Similarly, the speaker 416 can be located on a sidewall (not shown) of the electronic device 102 and can be used to provide other sounds (e.g., ringtones and alerts) to the user. That is, the sensor assembly 106 can activate the haptic actuator 415 and / or speaker 416 that are already components of the electronic device 102 for other purposes. In other embodiments, the haptic actuator 415 and / or speaker 416 are dedicated feedback components for the sensor assembly 106. In these designs, it can be advantageous to locate the haptic actuator 415 and / or speaker 416 adjacent to the sensor assembly 106.

[0049] In some embodiments, one or more sealing features provide a moisture barrier from the external environment. For example, a seal 420 positioned around the inner periphery of the trim 204 adjacent to the compliant member 302 can prevent moisture from the external environment from entering between the sensor cover 202 and the trim 204 and contacting the fingerprint sensor 304 or touch sensor 402 or entering the internal cavity 412. Because the seal 420 is positioned adjacent to the compliant member 302, the material of the seal 420 must be flexible enough to prevent interference with the compression and expansion of the compliant member 302. In some cases, the seal 420 is composed of a highly flexible polymer adhesive, such as a silicone-based adhesive.

[0050] The seal 421 can prevent moisture from entering the interior cavity 412 between the trim 204 and the display cover 112. In some cases, the seal 421 is in the form of an O-ring disposed in a groove 422 on the outer periphery of the trim 204. If the seal 421 is an O-ring, the diameter of the O-ring may need to be smaller than conventionally made due to the very limited space in and around the sensor assembly 106. In certain embodiments, the diameter of the O-ring seal 421 is less than about 0.5 millimeters.

[0051] 4B illustrates a top view of a portion of device 102 showing the location of sensor assembly 106 in relation to haptic actuator 415 and speaker 416, according to some embodiments. As shown, haptic actuator 415 and speaker 416 can be separate electronic components housed within enclosure 110. In some cases, haptic actuator 415 and speaker 416 are disposed proximate to and partially below sensor assembly 106. In some examples, haptic actuator 415 and speaker 416 each perform functions other than those exclusively dictated by sensor assembly 106. For example, haptic actuator 415 can provide haptic feedback to the user (e.g., by vibrating enclosure 112) in response to other types of input from the user, such as touch input from the user contacting display 417 or other suitable signals commanded by device 102 (e.g., phone call, text message, alert, etc.). In some cases, the haptic actuator 415 generates a sound when vibrated, thereby also providing acoustic feedback to the user. The speaker 416 can be positioned to generate a sound, which is directed through one or more openings 419 in the enclosure 110. The speaker 416 can generate a sound 427 in response to any suitable signal directed by the device 102 (e.g., user input, a phone call, a text message, an alarm, etc.). In this manner, the haptic actuator 415 and the speaker 416 can each have multiple uses and are not dedicated solely to servicing the sensor assembly 106. However, in some embodiments, the haptic actuator 415 and the speaker 416 are entirely dedicated to responding to signals from the sensor assembly 106.

[0052] It should be noted that the locations of the haptic actuators 415 and speakers 416 on the device 102 can vary according to design needs and are not limited to the locations depicted in FIG. 4B . In some designs, it may be advantageous to position the haptic actuators 415 and speakers 416 in close proximity to the sensor assembly 106 so that a user can more easily associate the vibrations of the haptic actuators 415 and the noise of the speaker 416 with pressure on the sensor assembly 106. However, in some cases, it may be advantageous to position the haptic actuators 415 and speakers 416 in different locations within the device 102. For example, in some designs, one or both of the haptic actuators 415 and speakers 416 may be located on the opposite side of the device 102 from the location of the sensor assembly 106. Furthermore, the number of haptic actuators 415 and speakers 416 can vary depending on the desired user experience and design requirements.

[0053] FIG. 5 illustrates a cross-sectional view of a portion of electronic device 500 including a sensor assembly 506, according to some embodiments. Sensor assembly 506 is assembled within an opening in enclosure portion 512. In some embodiments, enclosure portion 512 corresponds to a display cover that covers a display assembly of electronic device 500. Sensor assembly 506 includes a fingerprint sensor 524 and a touch sensor 522. Fingerprint sensor 524 is configured to recognize a user's fingerprint features through sensor cover 502. Touch sensor 522 is configured to detect input, such as from a user's finger touching exterior surface 513 of sensor cover 502. Touch sensor 522 may be any suitable solid-state sensor capable of detecting touch input. In some embodiments, touch sensor 522 includes one or more capacitive, piezoelectric, and piezoresistive sensors. The small cross-section of sensor assembly 506 provides more space within enclosure 512 for other components, such as electronic component 514.

[0054] The trim 504 surrounds the periphery of the sensor cover 502 and separates the movement of the sensor cover 502 between a pressed position and an unpressed position. Specifically, the trim 504 prevents lateral movement of the sensor cover 502, limiting movement of the sensor cover 502 in the sensing direction 503 (toward the touch sensors 522) and in the direction opposite the sensing direction 503 (away from the touch sensors 522). The compliant member 508 is disposed between the sensor cover 502 and a ledge 532 of the trim 504. The compliant member 508 may be in the form of a single piece or multiple pieces (see, for example, compliant member 302 in FIG. 3A ). When a user applies force to the outer surface 513 of the sensor cover 502, the thickness t of the compliant member 508 is compressed accordingly. The compliant member 508 is configured to provide a return force that returns the sensor cover 502 from the pressed position to the unpressed position.

[0055] The sensor cover 502 is coupled to the first layer 522a of the touch sensor 522, and the stiffener 505 is coupled to the second layer 522a of the touch sensor 522. The stiffener 505 is rigidly coupled to the enclosure portion 512 via the trim 504, thereby maintaining the second layer 522b fixed relative to the enclosure portion 512. Thus, when the sensor cover 502 moves to a compressed position in the sensing direction 503 in response to a force, the distance d of the gap 506 between the first layer 522a and the second layer 522a decreases, thereby causing a voltage or capacitance change in the touch sensor 502. In some cases, this change in voltage or capacitance causes the touch sensor 502 to generate a signal that activates one or more components. When the compliant member 508 returns the sensor cover 502 to the uncompressed position, the gap 506 returns to its original distance d, thereby returning the voltage or capacitance to its original voltage. In some cases, a change in voltage or capacitance causes touch sensor 502 to generate a signal that deactivates one or more components and / or activates one or more other components.

[0056] In some embodiments, the sensor assembly 506 is electrically connected to a haptic actuator 515 and / or a speaker 516. This configuration allows a touch event from a user to be associated with haptic and / or audio feedback to the user. For example, the sensor assembly 106 may cause the speaker 516 to generate a clicking sound and / or the haptic actuator 515 to generate a very brief vibration that simulates the pressing of a mechanical switch. The haptic actuator 515 and speaker 516 may be part of the sensor assembly 506 itself or may be located in different areas of the electronic device 500.

[0057] 6 shows a flowchart illustrating steps for assembling a sensor assembly within an electronic device. At 602, a trim is placed around the sensor cover of the sensor assembly. The sensor cover can have a round, rectangular, triangular, oval, or other suitable shape, and the trim has apertures of a corresponding shape. At 604, one or more moisture seals are placed around the trim. In one embodiment, the moisture seals have an O-ring shape and are placed in grooves around the trim's periphery. The moisture seals can be composed of a compliant material such as silicone or other polymeric material.

[0058] At 606, the sensor assembly is placed within an opening in an enclosure for the electronic device. The sensor assembly can be assembled within a wall of the enclosure, such as a transparent glass display cover for the electronic device or an opaque metal or plastic wall of the enclosure. The opening should have a shape that corresponds to the shape of the outer periphery of the trim so that a tight fit between the two is achieved. In some cases, the sensor assembly is assembled from the top side of the opening, while the bracket is assembled from the bottom side of the opening 201. In some cases, this involves bending and threading a cable portion of the sensor assembly into the opening before fitting the trim and sensor cover snugly within the opening. In some cases, the top surface of the sensor cover is recessed relative to the top surface of the enclosure.

[0059] At 608, the sensor assembly is secured to the enclosure. In some embodiments, a bracket supports the bottom of the sensor assembly against the enclosure. Fasteners, such as screws or welds, can be used to secure the bracket and sensor assembly to the enclosure. In some cases, the fasteners are tightened so that the chamfered interface between the trim and the enclosure tightly engages one another.

[0060] 7A-7C illustrate cross-sectional views of implementations of a sensor assembly according to some embodiments. FIG. 7A illustrates a sensor assembly 706 fully assembled within an electronic device 700. The sensor assembly 706 includes a sensor cover 702 having a perimeter surrounded by a trim 704. The trim 704 is disposed between and engages the sensor cover 702 and an enclosure portion 712. In some embodiments, the enclosure portion 712 corresponds to a display cover that covers a display assembly of the electronic device 700. As shown, the trim 704 has a chamfered edge 707 that engages with a corresponding chamfered edge 708 of the enclosure portion 712. In some cases, the shapes of the chamfered edges 707 and 708 are selected such that the outer surface 711 of the sensor cover 702 is recessed relative to the outer surface 713 of the enclosure 712. The chamfered edge implementation illustrated in FIG. 7A is similar to that of FIG. 4A described above.

[0061] One advantage of the mounting configuration of FIG. 7A is that the chamfered edges 707 of the trim 704 can secure the sensor cover 702 around its entire perimeter, thereby preventing a user from forcing the sensor assembly 706 into the internal cavity 715 or applying pressure on the electronic component 714. This can be particularly important when the electronic component 714 includes a relatively fragile component, such as a silicon chip. In some embodiments, the electronic component 714 includes a driver as part of a display assembly. Even if the electronic device 700 experiences a drop or other high-impact event, the chamfered edges 707 and 708 fully secure the sensor assembly 706 so that it does not penetrate into the cavity 715 or apply significant pressure on the electronic component 714. Another advantage of the mounting configuration of FIG. 7A is that the chamfered edges 707 and 708 can limit pressure from a user's finger to the sensing direction 703.

[0062] 7B shows a sensor assembly 726 assembled within an electronic device 720. Instead of trim, the sensor assembly 726 is supported by a backplate 724. The backplate 724 is coupled to both the sensor cover 722 and the enclosure portion 732 and is disposed below the sensors 726 and 727. In some embodiments, the sensor 726 corresponds to part of a touch sensor, and the sensor 727 corresponds to part of a fingerprint sensor. The backplate 724 can be coupled to the enclosure portion 732 and / or the sensor cover 722 by adhesive or by engagement from an insert molding process. For example, the backplate 724 can be composed of a plastic material molded onto the enclosure portion 732. In some embodiments, the outer surface 731 of the sensor cover 722 is recessed relative to the outer surface 733 of the enclosure portion 732.

[0063] One advantage of the implementation configuration of FIG. 7B is that the backplate 724 can be made invisible to the user, and the backplate 724 can provide an aesthetic advantage in some applications. Further, with this configuration, the pressure from the user's finger can be restricted to the sensing direction 723. Further, due to its position, the backplate 724 can provide strong support to the sensor assembly 726 so that the sensor assembly 726 does not intrude into the internal cavity 735 or contact the electronic component 734. However, this configuration may not provide as much support at the top of the sensor assembly 726 as in embodiments including a trim. However, this factor may not be important depending on the specific application of the electronic device 720 and other design considerations.

[0064] FIG. 7C shows a sensor assembly 746 assembled within an electronic device 720. In this embodiment, the enclosure portion 752 corresponds to a display cover that covers the display assembly of the electronic device 740. In certain embodiments, at least a portion of the enclosure portion 752 is at least partially transparent so that the underlying display is visible through the enclosure portion 752. Instead of a separate sensor cover, the enclosure portion 752 covers the sensor assembly 746. That is, a portion of the enclosure portion 752 acts as a sensor cover. In some embodiments, the portion covering the sensor assembly 746 is locally thinned to provide a recess 742 within the enclosure portion 752. The recess 742 may be detectable (in some cases, visually detectable) by the user when the user touches the enclosure portion 752 and when the recess 742 acts as a guide so that the user can locate the sensor assembly 746. In other embodiments, the recess 742 is disposed within the inner surface of the enclosure portion 752 (i.e., the back surface of the enclosure portion 752 adjacent to the sensor 747).

[0065] One advantage of the implementation configuration of FIG. 7C is that the enclosure portion 752 provides a continuous surface that covers the display and sensor assembly 746 of the electronic device 740. This allows the sensor assembly 746 to be well protected from liquids or other agents without using a seal. Additionally, the continuous surface of the enclosure portion 752 can be aesthetically appealing in some applications. However, this configuration may limit the movement of the sensor assembly 746 in the sensing direction 743. Specifically, since the enclosure portion 752 covers the sensor assembly 746, the movement of the sensor assembly 746 in the sensing direction 743 depends on the deflection of the material of the enclosure portion 752, and this deflection may limit the amount of movement in the sensing direction 743. Since it depends on the material of the enclosure portion 752, this may make it more difficult for the user to fully press and activate the sensor assembly 746. Further, if the material of the enclosure portion 752 is sufficiently flexible, the user's touch input may cause the sensor assembly 746 to intrude into the internal cavity 755 or contact the electronic component 754. However, these factors may not be important depending on the specific application of the electronic device 740 and other design considerations.

[0066] FIGS. 8A - 8E show cross-sectional views of a sealing configuration of a sensor assembly according to some embodiments. FIG. 8A shows a sensor assembly 806 disposed within an opening of an enclosure portion 812 of an electronic device 800. For simplicity, the sensor assembly 806 and the trim 804 are shown as a single block. Insertion illustration 802 shows a detailed view of the interfacial region where the seal 808 is disposed between the trim 804 and the enclosure portion 812. Seal 821 prevents moisture from entering between the trim 804 and the enclosure portion 812. In some cases, the seal 821 is in the form of an O-ring disposed within a groove 810 on the outer periphery of the trim 804. The embodiment shown in FIG. 8A has a sealing configuration similar to that of FIG. 4A.

[0067] FIG. 8B shows a sensor assembly 826 disposed within an opening in an enclosure portion 832 of an electronic device 820. For simplicity, the sensor assembly 826 and the trim 824 are illustrated as a single block. Inset 822 shows a detailed view of the interface area between the trim 824 and the enclosure portion 832 where an adhesive 828 is disposed. Like the seal 810 described above, the adhesive 828 prevents moisture from entering between the trim 824 and the enclosure 832. The adhesive 828 can be composed of any suitable adhesive, including one or more of a heat-activated film, a pressure-sensitive adhesive, a liquid adhesive, or other suitable adhesive material. In some embodiments, the trim 834 includes a groove 830 that accommodates the adhesive 828.

[0068] FIG. 8C shows a sensor assembly 846 disposed within an opening in an enclosure portion 852 of an electronic device 840. For simplicity, the sensor assembly 846 and the trim 844 are illustrated as a single block. Inset 842 shows a detailed view of the interface area between the trim 844 and the enclosure portion 852 where an adhesive 848 is disposed. The seal 848 prevents moisture from entering between the trim 844 and the enclosure portion 852. The adhesive 848 may be any suitable adhesive, including one or more of a heat-activated film, a pressure-sensitive adhesive, a liquid adhesive, or other suitable adhesive material. In the embodiment of FIG. 8C , the adhesive 848 is disposed within a space 850 between the trim 844 and the enclosure portion 852. The size of the space 850 depends on the offset between the chamfer 853 of the trim 844 and the chamfer 855 of the enclosure portion 852. In one embodiment, the chamfer 853 of the trim 844 is larger than the chamfer 855 of the enclosure portion 852 .

[0069] FIG. 8D shows a sensor assembly 866 disposed within an opening in an enclosure portion 872 of an electronic device 860. For simplicity, the sensor assembly 866 and the trim 864 are depicted as a single block. An inset 862 shows a detailed view of the interface area between the trim 864 and the enclosure portion 872. A gasket 868 is disposed on the inner surfaces of the trim 864 and the enclosure portion 872 and is configured to prevent moisture from infiltrating between the trim 864 and the enclosure portion 872. The gasket 868 can be constructed of any suitable material, including one or more polymeric materials, such as silicone. In some cases, the gasket 868 is adhered to the inner surfaces of the trim 864 and / or the enclosure portion 872 with an adhesive. In some embodiments, the gasket 868 is constructed of a waterproof plastic and is adhered to the inner surfaces of the trim 864 and the enclosure portion 872 with an adhesive overlay. Because the gasket 868 is accessible from the interior of the enclosure, this configuration allows for the gasket 868 to be assembled either before or after the sensor assembly 866 is assembled.

[0070] FIG. 8E shows a sensor assembly 886 disposed within an opening in an enclosure portion 892 of an electronic device 880. For simplicity, the sensor assembly 886 and trim 884 are illustrated as a single block. Inset 882 shows a detailed view of the interface area between the trim 884 and the enclosure portion 892. Potting 888 is disposed on the inner surfaces of the trim 884 and the enclosure portion 892 and is configured to prevent moisture from infiltrating between the trim 884 and the enclosure portion 892. The potting 888 may include one or more adhesive materials applied to the inner surfaces of the trim 864 and / or the enclosure portion 872. The potting 888 should be applied in a sufficiently flowable state so that portions of the potting 888 flow between the trim 864 and / or the enclosure portion 872. Once dried and cured, the potting 888 provides sufficient sealing. The potting 888 can be applied before or after the sensor assembly 886 is assembled.

[0071] 9A-9C show cross-sectional and top views of an electronic device 900 having a trimless sensor assembly configuration, according to some embodiments. Figures 9A and 9B show top views of a portion of the electronic device 900 having a sensor assembly 906. Figure 9A shows the sensor assembly 906 with the sensor cover 902, and Figure 9B shows the sensor assembly 906 without the sensor cover 202. Figure 9C shows a cross-sectional view at BB in Figure 9A.

[0072] 9A shows that the sensor cover 902 is adjacent to the display cover 912 with no trim between them. FIG. 9B shows that the sensor component 904 is disposed below the sensor cover 902. In some embodiments, the sensor component 904 is a fingerprint sensor or a touch sensor. Surrounding the sensor component 904 is a mounting ring 916, which is surrounded by a compressible gasket 932.

[0073] 9C shows the sensor cover 902 adjacent to the display cover 912 without trim, and the display cover 912 coupled to the enclosure portion 910. A mounting ring 916 supports the sensor cover 902 and is disposed between the sensor cover 902 and the stiffener 905. The sensor assembly 906 is coupled to the display cover 912 with fasteners 911. In some embodiments, the mounting ring 916 is comprised of a conductive material (e.g., metal) that capacitively senses the presence of a finger on the outer surface 913 of the sensor cover 902. That is, the mounting ring 916 is configured to capacitively detect the presence of a finger through the sensor cover 902.

[0074] The compressible gasket 932 is disposed between the sensor cover 902 and the ledge 918 of the display cover 912. The compressible gasket 932 can be made from any suitable compressible material, including one or more polymers or adhesives. In some embodiments, the compressible gasket 932 is comprised of a layer of compressible material. The compressible gasket 932 may be in the form of a single piece or may have multiple pieces. In some cases, the compressible gasket 932 has a round ring shape corresponding to the round shape of the sensor cover 902. When a user touches the outer surface 913 of the sensor cover 902, the thickness of the compressible gasket 932 decreases in the sensing direction 903. This force is transferred to the first capacitive layer 922a, thereby decreasing the distance between the first capacitive layer 922a and the second capacitive layer 922b. This, in turn, causes a change in voltage or capacitance of the touch sensor 922. The touch sensor 922 then generates a signal that activates one or more electrical circuits of the electronic device 900. The compressible gasket 932 is composed of a compliant material that provides a resistive force (opposite the sensing direction 903) that returns the sensor cover 902 to its uncompressed position. Once the sensor cover 902 returns to its uncompressed position, the compressible gasket 932 returns to its full thickness.

[0075] 10A-10D show cross-sectional and top views of a sensor assembly 1006 configured to vibrate, according to some embodiments. FIG. 10A shows a top view of a portion of an electronic device 1000 having a sensor assembly 1006. FIG. 10B shows a cross-sectional view at CC of FIG. 10A. FIG. 10C shows a cross-sectional view at DD of FIG. 10B. FIG. 10D shows a cross-sectional view at EE of FIG. 10B.

[0076] FIG. 10A shows a piezoelectric actuator 1001 disposed adjacent to a sensor assembly 1006. The piezoelectric actuator 1001 is configured to vibrate the sensor assembly 1006 in response to a user touching the sensor cover 1002. FIG. 10B shows that the sensor cover 1002 is periphery-surrounded by a movable trim 1008, which is surrounded by a fixed trim 1004. The movable trim 1008 can be composed of a compressible and flexible material, such as a compliant polymer (e.g., silicone). The fixed trim 1004 can be made of a relatively rigid material, such as metal. In some embodiments, the fixed trim 1004 corresponds to a metal ring. In some cases, the fixed trim 1004 has a chamfered edge that engages with a chamfered edge of the display cover 1012.

[0077] The seal 1011 is disposed between the movable trim 1008 and the fixed trim 1004 and is configured to prevent water or other liquids from entering between the movable trim 1008 and the fixed trim 1004. In some embodiments, the seal 1011 is composed of a compressible material such as a flexible polymer. The shape and size of the seal 1011 comply with space limitations within the sensor assembly 1006. In some embodiments, the seal 1011 has an O-ring shape. In some embodiments, the movable trim 1008 has a groove 1013 and the fixed trim 1004 has a groove 1015 that accommodates the seal 1011. The sensor component 1014 can represent a portion of one or more sensors, such as a fingerprint sensor that detects features of a user's fingerprint and / or a touch sensor that detects a user's touch.

[0078] The display cover 1012 is supported by a cover frame 1015, which is coupled to the enclosure portion 1010. In some embodiments, the cover frame 1015 is constructed of a fiberglass-reinforced material, such as fiberglass reinforced with polyamide. A flange 1016 is disposed between the display cover 1012 and the cover frame 1015 and provides extra support for the display cover 1012. In some embodiments, the flange 1016 is constructed of a rigid metal, such as stainless steel. A retention post 1017 is disposed below the sensor component 1014. A bracket 1019 supports a fixed actuator beam 1020, which is coupled to a piezoelectric actuator 1001. When the sensor component 1014 detects a touch from a user, the sensor component 1014 generates a signal that activates the piezoelectric actuator 1001. The piezoelectric actuator 1001 then moves (i.e., vibrates) a portion of the sensor assembly 1006 up and down along plane Z. For example, the piezoelectric actuator 1001 can be configured to move the sensor assembly 1006 such that the user feels the sensor cover 1002 vibrate in response to the input. That is, the sensor assembly 1006 can provide tactile feedback (output) that the user can feel and that informs the user that the sensor assembly 1006 has been activated.

[0079] The cross-sectional view of FIG. 10C shows that the retention post 1017 can be secured to the bracket 1019 by a retaining clip 1025. The bracket 1019 is coupled to the fixed trim 1004 via a weld 1022. The retention post 1017 is coupled to and supports the movable trim 1008. The cross-sectional view of FIG. 10D shows that the fixed actuator beam 1020 is fixedly held by the bracket 1019. A flexure dome 1021, which can be constructed of a resilient yet rigid material (e.g., metal), is coupled at one end to a connector 1024 via a weld 1026 and at the other end to the fixed actuator beam 1020 via a weld 1030. The connector 1024 is coupled to a piezoelectric actuator 1001 (not shown). When the sensor component 1014 detects an input, the sensor component 1014 generates a signal that activates the piezoelectric actuator 1001. In response, the piezoelectric actuator 1001 pushes the connector 1024 in a push direction 1029. The connector 1024 slides along the fixed actuator beam 1020, bending the flex dome 1021 and pushing up and releasing the stiffener 1027. The stiffener 1027 then compresses and expands the movable trim 1008, thereby causing the sensor cover 1002 to move (i.e., oscillate) up and down along plane Z.

[0080] 11A-11C show cross-sectional views of sensor assemblies with different detection configurations, according to some embodiments. The embodiments of Figures 11A-11C include structures that allow for detection of force input at a less localized base (i.e., not just beneath the sensor cover).

[0081] FIG. 11A shows an electronic device 1100 including a sensor assembly 1106. The sensor assembly 1106 includes a sensor cover 1102 surrounded by a trim 1104 and disposed within an opening in a display cover 1112. The display cover 1112 is coupled to an enclosure portion 1110. A bracket 1119 secures the sensor assembly 1106 to the enclosure portion 1110. The fingerprint sensor 1105 is configured to recognize a user's fingerprint features through the sensor cover 1102. The sensor assembly 1106 has an active area-based force-sensing configuration. Specifically, when a user touches or presses on the sensor cover 1112, the force deflects the display cover 1112, thereby reducing the distance 1108 between the display cover 1112 and the component 1114. This activates a force sensor 1118 (e.g., a flex capacitive sensor) disposed between the display cover 1112 and the component 1114. This configuration allows sensing in the area surrounding the sensor cover 1102.

[0082] FIG. 11B shows an electronic device 1120 including a sensor assembly 1126. The sensor assembly 1126 includes a sensor cover 1122 that is surrounded by a trim 1124 and disposed within an opening in a display cover 1132. The display cover 1132 is coupled to an enclosure portion 1130 (including enclosure portions 1130a and 1130b). A bracket 1139 secures the sensor assembly 1126 to the enclosure portions 1130a and 1130b. The fingerprint sensor 1125 is configured to recognize a user's fingerprint signature through the sensor cover 1122. The sensor assembly 1126 has a display cover-to-enclosure sensing configuration. Specifically, when a user touches or presses on the sensor cover 1122, the force deflects the display cover 1132, thereby decreasing the distance 1128 between the bracket 1139 and the enclosure section 1130a. This activates a force sensor 1129 (eg, a flex capacitive sensor) located between the bracket 1139 and the enclosure portion 1130a.

[0083] FIG. 11C shows an electronic device 1140 including a sensor assembly 1146. The sensor assembly 1146 includes a sensor cover 1142 surrounded by a trim 1144 and disposed within an opening in a display cover 1152. The display cover 1152 is coupled to an enclosure portion 1150. A bracket 1159 secures the sensor assembly 1146 to the enclosure portion 1150. The fingerprint sensor 1145 is configured to recognize a user's fingerprint features through the sensor cover 1142. The sensor assembly 1146 has an external module-based force-sensing configuration. Specifically, when a user touches or presses on the sensor cover 1142, the force deflects the display cover 1132, thereby reducing a distance 1158 between the sensing assembly 1146 and the bracket 1159. In some embodiments, the distance 1158 is between the stiffener 1148 of the sensor assembly 1146 and the bracket 1159. This activates a force sensor 1149 (eg, a flex capacitive sensor) disposed between the sensing assembly 1146 and the bracket 1159 .

[0084] 11D shows a perspective view of a bracket 1159 incorporated into the sensor assembly 1146 configuration of FIG. 11C , according to some embodiments. The bracket 1159 includes a relief cut 1155 that can improve the signal from small relative deflections of the display cover 1152. In some embodiments, the bracket 1159 can include a conductive portion 1153 (e.g., made of metal) and a non-conductive portion 1157 (e.g., plastic) that electrically insulates the conductive portion 1153. As shown, the non-conductive portion 1157 can include an opening 1151 for a fastener (not shown). The bracket 1159 is shown as a single piece. However, in other embodiments, a bracket having multiple pieces is used.

[0085] 12A and 12B show cross-sectional views of a portion of an electronic device including a sensor assembly 1206 before and during a bonding operation, respectively, according to some embodiments. FIG. 12A shows the sensor assembly 1206 before the bonding operation, where a compliant member 1208 is disposed between the sensor cover 1202 and the trim 1204. In some embodiments, the compliant member 1208 includes one or more layers of a soft or resilient material, such as silicone or other polymer. As discussed above with the compliant member 302 of FIG. 3, the compliant member 1208 may be a single piece or may include separate pieces (e.g., four circular segment-shaped pieces to accommodate a rectangular-shaped sensor component). However, it should be noted that the compliant member 1208 can have any suitable shape and include any suitable number of pieces. To secure the compliant member 1208 to the sensor cover 1202 and the trim 1204, an adhesive layer 1209a is applied between the compliant member 1208 and the sensor cover 1202, and an adhesive layer 1209b is applied between the compliant member 1208 and the ledge 1218 of the trim 1204. The adhesive layers 1209a and 1209b may comprise any one or more suitable adhesive materials, such as a layer of a heat-activated film, a pressure-sensitive adhesive, a liquid adhesive, or other suitable adhesive material.

[0086] 12B shows the sensor assembly 1206 during a bonding operation, where a force is applied to the sensor cover 1202 toward the ledge 1218 of the trim 1204. As shown, if the adhesive layers 1209a and 1209b are in a liquid or semi-liquid form, the adhesive layers 1209a and 1209b may cause overflow 1212 around the sides of the compliant member 1208. After the adhesive layers 1209a and 1209b dry and harden, the overflow 1212 may become harder than the material of the compliant member 1208, reducing the flexibility of the compliant member 1208.

[0087] 13A-13F illustrate sensor assembly configurations for preventing adhesive overflow 1212. FIG. 13A illustrates a top view and a cross-sectional AA view of a portion of an electronic device having a sensor assembly 1306. The top view shows the sensor assembly 1306 without the sensor cover 1302, thereby exposing the sensor component 1305 (e.g., a fingerprint sensor). The cross-sectional AA view shows a compliant member 1308 disposed between the sensor cover 1302 and a ledge 1307 of the trim 1304. The thickness t1 of adhesive layer 1309a and the thickness t2 of adhesive layer 1309b are each thin enough to eliminate or reduce the occurrence of overflow and thick enough to bond the compliant member 1308 to the sensor cover 1302 and the trim 1304. In some embodiments, the combined thickness (t1 + t2) of adhesive layers 1309a and 1309b is approximately 20 micrometers.

[0088] FIG. 13B shows a top view and a cross-sectional BB view of a portion of an electronic device with a sensor assembly 1316. The top view shows the sensor assembly 1316 without the sensor cover 1312, thereby exposing the sensor component 1315 (e.g., a fingerprint sensor). The cross-sectional BB view shows the compliant member 1318 disposed between the sensor cover 1312 and the ledge 1307 of the trim 1314. In this embodiment, the combined thickness (t3 + t4) of adhesive layers 1319a and 1319b is greater than the combined thickness (t1 + t2) of adhesive layers 1309a and 1309b described above with reference to FIG. 13A. This greater amount of adhesive material can increase the adhesive strength of the compliant member 1318 to the sensor cover 1302 and trim 1304 compared to a thinner adhesive layer. In some embodiments, the combined thickness (t3 + t4) is approximately 20 micrometers. However, in some cases, larger thicknesses t3 and t4 may increase the risk of overflow around the edges of compliant member 1318, as discussed above with reference to FIG. 2B.

[0089] FIG. 13C shows a top view and a cross-sectional CC view of a portion of an electronic device having a sensor assembly 1326. The top view shows the sensor assembly 1326 without the sensor cover 1322, thereby exposing the sensor component 1325 (e.g., a fingerprint sensor). The cross-sectional CC view shows the compliant member 1324 positioned between the sensor cover 1322 and the ledge 1327 of the trim 1328. Prior to the application of force during the bonding operation (see, e.g., FIG. 2B ), adhesive layer 1329a covers a smaller surface area than compliant member 1328 and has a smaller amount of adhesive material than adhesive layer 1329b. This configuration can eliminate or reduce the amount of overflow at the top edge of compliant member 1328. Specifically, when force is applied during the bonding operation, both adhesive layers 1329a and 1329b will spread toward the edge of compliant member 1328. Because the adhesive layer 1329a is in a smaller volume, the adhesive layer 1329a does not or is less likely to overflow. This configuration can be useful in embodiments where less adhesive material is required to properly adhere the compliant member 1328 to the sensor cover 1322 compared to the amount of adhesive material required to properly adhere the compliant member 1328 to the trim 1324.

[0090] FIG. 13D shows a top view and a cross-sectional DD view of a portion of an electronic device with a sensor assembly 1336. The top view shows the sensor assembly without the sensor cover 1332, thereby exposing the sensor component 1335 (e.g., a fingerprint sensor). The cross-sectional DD view shows the compliant member 1338 disposed between the sensor cover 1332 and the ledge 1337 of the trim 1334. In this embodiment, both adhesive layers 1339a and 1339b cover a smaller surface area than the compliant member 1338 and have a smaller amount of adhesive material than the embodiment of FIG. 3A or 3B. This configuration can eliminate or reduce the amount of overflow at the top and bottom edges of the compliant member 1338 once force is applied during the bonding operation (see FIG. 2B). However, care should be taken to ensure that the adhesive layers 1339a and 1339b are of sufficient volume to properly bond the compliant member 1338 to the sensor cover 1332 and trim 1334. In some cases, this may mean increasing tolerances during the manufacturing process.

[0091] 13E shows a top view and a cross-sectional E-E view of a portion of an electronic device having a sensor assembly 1346. The top view shows the sensor assembly 1346 without the sensor cover 1342, thereby exposing the sensor component 1345 (e.g., a fingerprint sensor). The cross-sectional E-E view shows the compliant member 1348 disposed between the sensor cover 1342 and the ledge 1347 of the trim 1344. In this embodiment, the adhesive layers 1349a and 1349b are alternately arranged. In particular, the adhesive layer 1349a is disposed proximate the first end 1341 of the compliant member 1348, and the adhesive layer 1349b is disposed proximate the second end 1343 of the compliant member 1348. In some cases, the adhesive layers 1349a and 1349b do not overlap in the central portion 1340 of the compliant member 1348. When force is applied during the bonding operation, any overflow will be directed toward the opposite ends of compliant member 1348 (i.e., first end 1341 and second end 1343), thereby preventing bonding of either of the overflow adhesive layers 1349a and 1349b at the edges of compliant member 1348. Note that even with an alternating adhesive layer configuration, care must be taken to ensure that the loads applied during the bonding operation are equal.

[0092] FIG. 13F shows a top view and a cross-sectional FF view of a portion of an electronic device having a sensor assembly 1356. The top view shows the sensor assembly 1356 without the sensor cover 1352, thereby exposing the sensor component 1355 (e.g., a fingerprint sensor). The cross-sectional FF view shows a compliant member 1358 disposed between the sensor cover 1352 and a ledge 1357 of the trim 1354. In this embodiment, the compliant member 1358 includes a recess 1353 corresponding to a groove that provides space for the adhesive layer 1259a to flow into during the bonding operation (e.g., as shown in FIG. 12B), thereby preventing overflow of adhesive material over the outer edge of the compliant member 1358. Furthermore, this configuration can improve the uniform distribution of the adhesive layer 1259a on the surface of the compliant member 1358. The recess 1353 can have any suitable shape and is not limited to the elongated groove shape shown in FIG. 13F. For example, the recess can be circular, triangular, rectangular, and / or chevron-shaped. In some embodiments, recesses for accommodating adhesive layer 1259b are on opposite sides of compliant member 1358. In some embodiments, two sides of compliant member 1358 include recesses for accommodating adhesive layer 1259a and adhesive layer 1259b.

[0093] The foregoing description, for purposes of explanation, uses specific terminology to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Thus, the foregoing descriptions of the specific embodiments described herein have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teachings.

Claims

1. A wearable electronic device, comprising: a housing including a wall, the housing defining an opening; a display assembly supported by the housing; an outer protective cover positioned over the display assembly; a sensor assembly positioned within the opening, the sensor assembly comprising: (i) a sensor cover disposed within the opening and having an accessible and movable outer surface; (ii) a sensor assembly comprising: a movement sensor capable of detecting a first movement of the exterior surface and providing a first signal in response to the first movement, the movement sensor further capable of detecting a second movement of the exterior surface and providing a second signal in response to the second movement, the second movement being in a different direction than the first movement; a first component in communication with the movement sensor and configured to operate based on the first signal, the first component including a tactile component; a second component in communication with the motion sensor and configured to operate based on the second signal, the second component including an audio component; A wearable electronic device, wherein the haptic component is configured to operate independently of the operation of the audio component.

2. 10. The wearable electronic device of claim 1, wherein actuation of at least one of the first component and the second component includes generating a vibration.

3. The wearable electronic device of claim 2 , wherein the first component vibrates the sensor assembly in response to the first signal.

4. The wearable electronic device of claim 1 , wherein the opening is defined by a sidewall.

5. The wearable electronic device of claim 4 , wherein the accessible and movable exterior surface is disposed on the side wall.

6. 10. The wearable electronic device of claim 1, further comprising a speaker in communication with the first component; The wearable electronic device, wherein the speaker is capable of providing auditory feedback.

7. The wearable electronic device of claim 6 , wherein the auditory feedback comprises a clicking sound.

8. 10. The wearable electronic device of claim 1, the first component is actuated in response to a first distance of the first movement; The wearable electronic device, wherein the second component is activated in response to a second distance of the second movement.

9. The wearable electronic device of claim 1 , wherein the movement sensor is capable of detecting a push input to the sensor cover.

10. The wearable electronic device of claim 1 , wherein the movement sensor is capable of detecting movement of the sensor cover.

11. The wearable electronic device of claim 1 , wherein the sensor assembly comprises a pre-assembled module.

12. 1. A portable electronic device, comprising: a housing supporting the display assembly and defining an opening; a processor supported by the housing and in communication with the display assembly; a sensor assembly supported by the housing and in communication with the processor, the sensor assembly including a moving sensor and a sensor cover, the sensor assembly being positioned within the opening; a first movement of the sensor cover in a first direction in accordance with a first input applied by a user is detectable by the movement sensor; a second movement of the sensor cover in a second direction different from the first direction in accordance with a second input applied by a user is detectable by the movement sensor; a sensor assembly capable of providing a first signal to the processor corresponding to detecting the first movement exceeding a first threshold distance and a second signal to the processor corresponding to detecting the second movement exceeding a second threshold distance; a first component in communication with the processor, the first component capable of providing first feedback based on the first signal indicating that the first movement exceeds the first threshold distance, the first feedback including haptic feedback; a second component operable to provide second feedback based on the second signal indicating that the second movement exceeds the second threshold distance, the second feedback comprising auditory feedback; The portable electronic device, wherein the tactile feedback is generated independently from the auditory feedback from the second component.

13. 13. The portable electronic device of claim 12, further comprising a speaker in communication with the processor and capable of providing the auditory feedback.

14. 14. The portable electronic device of claim 13, wherein the auditory feedback is in the form of a quiet, high-pitched, clear sound.

15. 13. The portable electronic device of claim 12, wherein the first component is capable of providing a periodic vibration in response to a command from the processor based on an incoming call.

16. A wearable electronic device, comprising: a housing having a bottom wall, a sidewall at least partially defining a housing opening and a sidewall opening, and a display cover positioned in the housing opening; a display assembly supported by the housing, disposed within the housing opening, and covered by the display cover; a processor supported by the housing and in communication with the display assembly; a speaker in communication with the processor; a pre-assembled sensor assembly supported by the housing within the sidewall opening and in communication with the processor, the sensor assembly comprising: (i) a sensor cover disposed within the sidewall opening and having an accessible and movable outer surface; (ii) a movement sensor capable of detecting first and second movements of the exterior surface and providing first and second signals, respectively, in response to the first or second movements, wherein the first movement is in a first direction and the second movement is in a second direction different from the first direction; and a haptic component in communication with the processor and operable to provide vibrations in response to a command from the processor based on the first signal; the speaker is capable of providing auditory feedback based on the second signal; The wearable electronic device, wherein the haptic component is configured to generate the vibrations independently of the auditory feedback from the speaker.

17. 17. The wearable electronic device of claim 16, wherein the tactile component is capable of vibrating the pre-assembled sensor assembly in response to the command.

18. 17. The wearable electronic device of claim 16, wherein the tactile component is capable of providing a first pattern of vibrations in response to the command from the processor based on the first signal and a second pattern of vibrations in response to a second command from the processor based on an incoming call.

19. 17. The wearable electronic device of claim 16, wherein the movement sensor is capable of detecting movement of the sensor cover.

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