Gas delivery assembly, components thereof, and reactor system including same

Abstract

To provide a gas supply assembly, and a reactor system including the gas supply assembly.SOLUTION: An exemplary gas supply assembly includes a vessel, a valve plate, a housing enclosing the vessel and the valve plate, a gas feedthrough having a first end interior of the housing and a second end exterior of the housing, and one or more valves attached to the valve plate, where at least one valve is fluidly coupled to an interior of the vessel. The assemblies can further include a removable gas line having a first end coupled to the at least one valve and a second end coupled to the gas feedthrough. Additionally or alternatively, the gas supply assembly can include one or more valve plate leveling devices coupled to the valve plate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates generally to gas phase reactor systems and components thereof. More specifically, examples of the present disclosure relate to gas supply assemblies for gas phase reactor systems, components of gas supply assemblies, and reactor systems including gas supply assemblies. [Background technology]

[0002] Gas-phase reactor systems, such as reactor systems including chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), other cyclic deposition, and / or similar reactors, can be used for a variety of applications, including the deposition and etching of materials on substrate surfaces. For example, gas-phase reactor systems can be used to deposit and / or etch layers on substrates to form semiconductor devices, flat panel display devices, photovoltaic devices, microelectromechanical systems (MEMS), and the like.

[0003] A typical gas phase reactor system includes one or more reactors, each reactor including one or more reaction chambers, one or more precursor gas sources and / or reactant gas sources fluidly connected to the reaction chamber, one or more carrier gas sources and / or purge gas sources fluidly connected to the reaction chamber, one or more gas distribution systems for delivering gases (e.g., precursor gases / reactant gases and / or carrier or purge gases) to the surface of the substrate within the reaction chamber, and at least one exhaust source fluidly connected to the reaction chamber.

[0004] It may be desirable to use precursors in gas phase reactor systems that may be solid or liquid at room temperature and pressure because such precursors may be relatively easy to transport, may be relatively safe to transport, may provide desirable film and / or deposition properties, and / or may be relatively inexpensive to use. Typically, such precursors are stored in a container that may be coupled to the reactor as part of the reactor system.

[0005] The use of precursors that are liquid or solid at room temperature and pressure can require frequent replacement of precursor containers, which can affect the throughput of the reactor system. Additionally or alternatively, using precursor containers of different sizes can be difficult. Therefore, improved reactor systems and gas delivery assemblies are desirable. Summary of the Invention [Means for solving the problem]

[0006] Various embodiments of the present disclosure relate to gas supply assemblies suitable for use in gas-phase reactors, reactor systems including one or more gas supply assemblies, and components of gas supply assemblies. The gas supply assemblies and gas-phase reactor systems may be used, for example, to manufacture electronic devices. While the manner in which various embodiments of the present disclosure address shortcomings of previous assemblies and systems is described in more detail below, generally, various embodiments of the present disclosure provide improved gas supply assemblies and reactor systems that include relatively large precursor source vessels, allow for relatively easy removal and / or installation of precursor source vessels, and / or allow for the use of precursor source vessels of various sizes.

[0007] According to at least one embodiment of the present disclosure, a gas supply assembly includes a container, a valve plate, a housing enclosing the container and the valve plate, a gas feedthrough having a first end inside the housing and a second end outside the housing, and one or more valves attached to the valve plate, wherein the at least one valve is fluidly connected to the interior of the container, and a removable gas line has a first end connected to the at least one valve and a second end connected to the gas feedthrough. The container can hold a solid or liquid precursor at ambient temperature and pressure (NTP). The size of the container can vary depending on the application. For example, for use with a solid precursor, the container's capacity can be greater than 500 g, or between about 500 g and about 2 kg, or between about 500 g and about 1.75 kg, or between about 750 g and about 1.5 kg, and the volume for holding the solid precursor can be between 0.25 L and 1 L. For use with liquid precursors, the volume of the vessel can be greater than 0.5 L, or between about 0.5 L and about 2 L, or between about 0.75 L and about 2 L, or between about 0.75 L and about 1.5 L. The gas supply assembly can include one or more valve plate leveling devices coupled to (e.g., in contact with) the valve plate. The removable gas lines can include one or more sections angled relative to each other (e.g., greater than zero and less than 180 degrees, or between about 60 degrees and about 120 degrees). The gas feedthrough can include a casing, which can include one or more heaters embedded within the casing. An exemplary gas supply assembly can include a heater below the vessel and one or more heater leveling devices coupled to (e.g., in contact with) the heater.

[0008] According to a further embodiment of the present disclosure, a gas supply assembly includes a vessel, a valve plate, a housing enclosing the vessel and the valve plate, a gas feedthrough having a first end inside the housing and a second end outside the housing, and a plurality of valves attached to the valve plate, at least one of the plurality of valves being fluidly connected to the interior of the vessel, and one or more valve plate leveling devices being connected to the valve plate. The assembly may further include a removable gas line having a first end connected to the at least one valve and a second end connected to the gas feedthrough. The vessel is capable of holding a solid or liquid precursor at ambient temperature and pressure (NTP). The capacity of the solid precursor vessel may be greater than 500 g, or between about 500 g and about 2 kg, or between about 500 g and about 1.75 kg, or between about 750 g and about 1.5 kg, and the volume for holding the solid precursor may be between 0.25 L and 1 L. The volume of the liquid precursor container can be greater than 0.5 L, or between about 0.5 L and about 2 L, or between about 0.75 L and about 2 L, or between about 0.75 L and about 1.5 L. The removable gas line can include one or more sections that are angled relative to one another (e.g., greater than zero and less than 180 degrees, or between about 60 and about 120 degrees). The gas feedthrough can include a casing, which can include one or more heaters embedded within the casing. An exemplary gas supply assembly can include a heater below the container and one or more heater leveling devices coupled to (e.g., in contact with) the heater.

[0009] According to yet a further exemplary embodiment of the present disclosure, a gas phase reactor system comprises one or more gas supply assemblies as described herein.

[0010] According to yet a further embodiment of the present disclosure, an assembly includes a valve plate, one or more valve plate leveling devices coupled to (e.g., in contact with) the valve plate, a base, and a gauge for leveling the valve plate, which can be used to level the valve plate prior to coupling a container to the valve plate.

[0011] These and other embodiments will be readily apparent to those skilled in the art from the following detailed description of specific embodiments which refer to the accompanying drawings, and the invention is not limited to any particular embodiment disclosed.

[0012] A more complete understanding of the exemplary embodiments of the present disclosure can be obtained by reference to the detailed description and claims when considered in conjunction with the following illustrative drawings. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 illustrates a reactor system according to an embodiment of the present disclosure. [Figure 2] FIG. 2 illustrates a gas supply assembly in accordance with at least one embodiment of the present disclosure. [Figure 3] 3 and 4 illustrate a portion of a gas supply assembly according to at least one embodiment of the present disclosure. [Figure 4] Same as above. [Figure 5] FIG. 5 illustrates a removable gas line in accordance with at least one embodiment of the present disclosure. [Figure 6] 6A and 6B illustrate a solid source container according to at least one embodiment of the present disclosure. [Figure 7] FIG. 7 illustrates a gas feedthrough according to at least one embodiment of the present disclosure. [Figure 8] 8 and 9 illustrate a leveling device according to a further embodiment of the present disclosure. [Figure 9] Same as above. [Figure 10] FIG. 10 illustrates a gauge according to yet a further embodiment of the present disclosure. [Figure 11] FIG. 11 illustrates a gas supply assembly in accordance with at least one other embodiment of the present disclosure. [Figure 12] FIG. 12 illustrates a container according to a further embodiment of the present disclosure. [Figure 13] FIG. 13 illustrates a portion of a gas supply assembly in accordance with at least one other embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0014] It will be appreciated that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of the illustrated embodiments of the present disclosure.

[0015] Although certain specific embodiments and examples are disclosed below, it will be understood by those skilled in the art that the invention extends beyond the specifically disclosed embodiments and / or uses of the invention, as well as obvious modifications and equivalents thereof. Therefore, it is not intended that the scope of the disclosed invention should be limited by the specific disclosed embodiments set forth below.

[0016] The present disclosure generally relates to gas distribution assemblies, components of the assemblies, and reactor systems including one or more gas distribution assemblies. The gas distribution assemblies and reactor systems described herein can be used to process substrates, such as semiconductor wafers, for forming electronic devices. By way of example, the assemblies and reactor systems described herein can be used to form or grow epitaxial layers on the surface of a substrate. However, unless otherwise specified, the reactor systems and gas distribution assemblies are not so limited.

[0017] Turning now to the drawings, Figure 1 illustrates a reactor system 100 according to an embodiment of the present disclosure. The reactor system 100 includes a reaction chamber 102, a gas distribution system 104, a gas supply assembly 106, an exhaust source 108, and a controller 110. In the illustrated embodiment, the reactor system 100 also includes a second gas source 112.

[0018] The reaction chamber 102 can be or can include a reaction chamber suitable for gas-phase reactions. The reaction chamber 102 can be formed of a suitable material, such as quartz. The reactor system 100 can include any suitable number of reaction chambers 102 and can optionally include one or more substrate handling systems. By way of example, the reaction chamber 102 can include a cross-flow cold-wall epitaxial reaction chamber.

[0019] The gas distribution system 104 can be configured to provide one or more precursors, one or more reactants, and / or one or more purge and / or carrier gases to the reaction chamber 102. The gas distribution system 104 can be used to meter and control the gas flow rates of one or more precursor gases, reactant gases, purge gases, and / or carrier gases to the reaction chamber 102. For example, the gas distribution system 104 can be used to meter gases, with or without a carrier gas, from the gas supply assembly 106 and / or the second gas source 112 to the reaction chamber 102.

[0020] The gas supply assembly 106 can be configured to hold a precursor that is solid or liquid at the NTP and to vaporize a solid or liquid precursor for vapor-phase delivery of the precursor to the reaction chamber 102. Exemplary gas supply assemblies suitable for the gas supply assembly 106 are discussed in more detail below.

[0021] The exhaust source 108 may include, for example, one or more vacuum sources. Exemplary vacuum sources include one or more dry vacuum pumps and / or one or more turbomolecular pumps.

[0022] The controller 110 can be configured to perform various functions and / or processes as described herein. The controller 110 can include one or more microprocessors, memory elements, and / or switching elements to perform various functions. While the controller 110 is illustrated as a single unit, it can alternatively comprise multiple devices. By way of example, the controller 110 can be used to control gas flow (e.g., by monitoring flow rates and controlling valves), control motors, and / or control the flow of coolant into and / or out of cooling tubes or channels of the gas distribution assembly 104, and / or control heaters, such as one or more of the heaters described herein.

[0023] The second gas source 112 can include any suitable material. By way of example, the second gas source 112 can include a material that is a gas, liquid, or solid at NTP. The material can be used as an etchant, a carrier gas, or as a precursor or reactant in a deposition process.

[0024] 2 illustrates a gas supply assembly 200 suitable for use as the gas supply assembly 106. The gas supply assembly 200 includes a vessel 202, a valve plate or pallet 204, a housing 206, a gas feedthrough 208, and valves 210-228. The gas supply assembly 200 also includes a removable gas line 302, which is illustrated in FIG.

[0025] The vessel 202 is shown in more detail in Figures 6A (top view) and 6B (side view). In the illustrated embodiment, the vessel 202 is capable of holding a solid precursor material. Alternative vessels suitable for use in the gas delivery assembly 106 configured to hold a liquid precursor are illustrated in Figures 11 and 12.

[0026] The vessel 202 can be formed of any suitable material. By way of example, the vessel 202 can be formed of stainless steel. In other embodiments, the vessel 202 or components thereof can be formed of a high nickel alloy, aluminum, or titanium. It should be understood that the vessel 202 or components thereof can be formed of any other material sufficient to allow sufficient heat transfer to vaporize the precursor disposed within the source vessel 202, while being inert or not reacting to any significant extent with the precursor or contents within the vessel 202.

[0027] In the illustrated embodiment, the container 202 includes a base 602, an interior section 604 having a recessed area 606 formed therein, and a lid 230 that may be removably attached to the base 602. The lid 230 may include a plurality of openings that are fluidly connected to one or more of the valves 214, 222, 226.

[0028] The recessed area 606 may be machined directly into the base 602. Alternatively, the recessed area 606 may be formed in one or more trays that are inserted into the base 602. When the lid 230 is removably attached to the base 602, a seal 608 may be disposed between the lid 230 and the base 602 such that the contents of the container 202 are secured therein. In one embodiment, the base 602 and the lid 230 are formed of the same material so that both have substantially the same thermal conductivity and the same coefficient of thermal expansion. In another embodiment, the base 602 may be formed of a different material than the material used to form the lid 230.

[0029] The seal 608 may be or include an O-ring disposed in a groove formed in the base 602. In another embodiment, the seal 608 may be formed as a metal gasket or V-seal configured to be disposed between the base 602 and the lid 230. The seal 608 may be formed in any shape, size, or configuration sufficient to provide a seal when the lid 230 is attached to the base 602 and securely secure the contents within the container 202. In one example, the seal 608 is formed from an elastomer, although one skilled in the art will understand that the seal 608 may be formed from any other material sufficient to provide a seal, such as, but not limited to, a polymer or a metal.

[0030] The lid 230 and the base 602 can be configured to be mechanically attached to one another, for example, using one or more attachment devices (e.g., bolts, screws, or the like). In certain embodiments, the lid 230 and the base 602 are mechanically attached in an airtight manner.

[0031] The recessed area 606 may include a channel pathway 610 and one or more pads 612-616, which may include, for example, an inlet recessed pad 616, an outlet recessed pad 612, and a burp recessed pad 614. The recessed pads 612-616 may be generally triangular-shaped recessed areas extending downward from a contact surface 618 of the base 602. The shape of the recessed pads 612-616 may be substantially the same shape and size as a portion of a corresponding filtration device (not shown) that may extend from the underside of the lid 230 into the base 602 such that a portion of each filtration device is received within the corresponding recessed pad 612-616. The recessed pads 612-616 extend downward from the contact surface 618 to a predetermined depth. In one embodiment, all of the recessed pads 612-616 have the same depth. In another embodiment, the depth of at least one of the recessed pads 612-616 is different from the other depths. When the base 602 is filled with precursor, the volumes within each of the recessed pads 612-616 do not need to be filled with precursor. When a carrier gas is introduced into the base 602, for example, through a filtration device, the carrier gas can contact and distribute within the inlet recessed pad 616 before traveling throughout the remainder of the recessed region 606. Because none of the recessed pads 612-616 preferably have precursor disposed within them, introducing the carrier gas into the inlet recessed pad 616 prevents the carrier gas from directly contacting the precursor, potentially suppressing the precursor or causing precursor particles to mix with the carrier gas. In the illustrated embodiment, each of the recessed pads 612-616 of the recessed region 606 is fluidly connected via a channel 610 formed within the body 602.

[0032] Channel 610 can extend from contact surface 608, with channel 610 being a continuous pathway through which gas may travel between inlet recessed pad 616 and outlet recessed pad 612. In another embodiment, recessed region 610 may not include a recessed pad. Channel 610 can be formed in body 602 such that channel 610 is deeper than the depth of recessed pads 612-616. In one embodiment, the depth of channel 610 is constant along the entire length of channel 610. In another embodiment, the depth of channel 610 varies along the length of channel 610.

[0033] When the vessel 202 is filled with liquid or solid precursor material (not shown), the precursor material is preferably disposed only within the channels 610 of the recessed region 606. The channels 610 can be filled to a depth below the bottom surfaces of the recessed pads 612-616 to prevent or mitigate any of the precursor material from being disposed within the recessed pads 612-616. Additionally, the bottom surface of the outlet recessed pad 612 can be disposed above the top surface of the precursor material such that any precursor material particles tend to remain within the channels 610.

[0034] The volume of vessel 202 (e.g., the volume of channel 610) can vary depending on the application. According to embodiments of the present disclosure, the volume of vessel 202 (e.g., the volume of channel 610) can be greater than 500 g, or between about 500 g and about 2 kg, or between about 500 g and about 1.75 kg, or between about 750 g and about 1.5 kg, and the volume for holding the solid precursor can be between 0.25 L and 1 L. The depth of channel 610 can be, for example, greater than 30 mm, greater than 40 mm, or between about 30 mm and about 120 mm, or between about 40 mm and about 80 mm, or between about 50 mm and about 70 mm.

[0035] Valve plate or pallet 204 is configured to hold one or more of valves 210-228. According to an embodiment of the present disclosure, valve plate 204 resides above centerline axis 232 of gas feedthrough 208 to accommodate vessel 202.

[0036] Valves 210-228 may include any suitable valves, such as controllable valves. By way of example, valves 210-228 may be or include solenoid valves.

[0037] According to an exemplary embodiment of the present disclosure, the removable gas line 302 allows for relatively easy and configurable installation of the vessel 202 within the housing 206. With reference to FIGS. 3-5 , the removable gas line 302 may include a first end 502, a second end 504, and a conduit 506 therebetween. The first end 502 may be configured to fluidly couple to the first end 304 of the gas feedthrough 208. The second end 504 may be configured to couple to one or more valves 210-228, such as the inlet of the valve 210. The first end 502 may be sealably coupled to the first end 304 using a sealing member such as an O-ring, a metal gasket, or the like. The second end 504 may similarly be sealed to a valve using a sealing member such as an O-ring, a metal gasket, or the like. Furthermore, the angle between the first end 502 and the conduit 506 may be greater than zero and less than 180 degrees, or between about 60 and about 120 degrees. Similarly, the angle between second end 504 and conduit 506 can be greater than zero and less than 180 degrees, or between about 60 and about 120 degrees.

[0038] Conduit 506 is sealably coupled to first end 502 and second end 504 across at least a portion of the distance between first end 502 and second end 504. The length of conduit 506 can be selected based on, for example, the size or height of container 202 (the depth of the container can at least partially determine the container's volume and the length of conduit 506). Thus, assembly 200 can easily accommodate containers 202 of different dimensions. According to embodiments of the present disclosure, the height of conduit 506 can range from about 10 mm to about 100 mm, about 25 mm to about 100 mm, about 20 mm to about 80 mm, or about 25 mm to about 50 mm. In the illustrated example, conduit 506 is coupled to second end 504 using coupler 508 and second conduit 510, which can also be varied in length to accommodate containers 202 of various sizes.

[0039] The housing 206 may be formed of any suitable material. By way of example, the housing 206 may be formed of stainless steel, titanium, or the like.

[0040] The gas feedthrough 208 includes a first end 304 that is inside the housing 206 and a second end 702, shown in FIG. 7, that is outside the housing 206. In the illustrated example, the gas feedthrough 208 includes a coupler 704 for connecting the gas feedthrough 208 to, for example, the coupler 236 attached to the housing 206. The gas feedthrough 208 also includes a casing 706 that houses the tube 708. The gas feedthrough 208 may also include one or more heaters 710 enclosed between the tube 708 and the casing 706.

[0041] The gas supply assembly 200 may include a gas line cover 306 to reduce heat loss from the removable gas line 302 .

[0042] 8 and 9, the gas supply assembly 200 may also include one or more valve plate leveling devices 802, 902. In some cases, the valve plate 204 may be leveled prior to installation of the vessel 202 using one or more valve plate leveling devices 802, 902.

[0043] Valve plate leveling device 802 may include, for example, a set pin 804 and a bracket 806 for receiving set pin 804. Bracket 806 may include a threaded region 810 for threadably receiving set pin 804. Additionally, an end 812 of bracket 806 may be coupled to valve plate 204. The leveling of valve plate 204 in the X direction can be set using set pin 804. An end 808 of set pin 804 may contact gas feedthrough 208 when the desired leveling is achieved.

[0044] The valve plate leveling device 902 may include a set pin 904 and a bracket 906. The bracket 906 may be attached to the valve plate 204. The set pin 904 may be threadably received by a support flange 908, which may be directly or indirectly coupled to the housing 206. The leveling of the valve plate 204 (e.g., in the X direction) may be adjusted, and then the set pin 904 may be used to set the position of the valve plate 204 in the X direction, for example, by an end 910 of the set pin 904 applying a force against the bracket 906.

[0045] 10 , a gauge 1000 is illustrated for leveling the valve plate 204 in the Y direction prior to installation of a vessel. In particular, the gauge 1000 can be used to align the valve plate 204 relative to a heater plate 1002. In the illustrated example, the gauge 1000 includes a first portion 1004 (e.g., a U-shaped bracket) and a second portion 1006 (e.g., another U-shaped bracket). A bubble leveler 1008 on the heater plate 1002 and a bubble leveler 1010 on the second portion 1006 can be used for leveling measurements, for example, using one or more heater leveling devices 1012. By way of example, the leveling of the heater plate 1002 can be adjusted until flat contact between the first portion 1004 and the heater plate 1002 is established.

[0046] 11 illustrates another gas supply assembly 1100 suitable for use with system 100, according to an additional embodiment of the present disclosure. Gas supply assembly 1100 is similar to gas supply assembly 200, except that gas supply assembly 1100 is configured to store liquid precursors rather than solid precursors.

[0047] The gas supply assembly 1100 includes a vessel 1102, a valve plate or pallet 1104, a housing 1106, a gas feedthrough 1108, valves 1110-1122, and a liquid inlet 1124. The gas supply assembly 200 also includes a removable gas line 302, as shown in FIG.

[0048] The vessel 1102 can be formed of any suitable material. By way of example, the vessel 1102 may be formed from, for example, stainless steel, high-nickel alloys, aluminum, titanium, or the like. It should be understood that the vessel 1102 or components thereof may be formed from any other material sufficient to allow sufficient heat transfer to vaporize precursors disposed within the vessel 1102, while being inert or not reacting to any significant extent with the precursors or contents within the vessel 1102.

[0049] In the illustrated embodiment, the container 1102 includes a base 1202 including an interior section 1204 having a recessed area 1206 formed therein, and a lid 1208 that may be removably attached to the base 1202. The lid 1208 may include a plurality of openings that are fluidly connected to one or more of the valves 1112, 1120.

[0050] Recessed area 1206 may be machined directly into base 1202. Additionally or alternatively, recessed area 1206 may be substantially cylindrical. The capacity of container 1202 may be greater than 0.5 L, or between about 0.5 L and about 2 L, or between about 0.75 L and about 2 L, or between about 0.75 L and about 1.5 L.

[0051] A seal 1210 may be disposed between the lid 1208 and the base 1202 to securely secure the contents within the container 1102. In one embodiment, the base 1202 and the lid 1208 are formed of the same material so that both have substantially the same thermal conductivity and the same coefficient of thermal expansion. In another embodiment, the base 1202 may be formed of a different material than the material used to form the lid 1208.

[0052] The seal 1210 may be or include an O-ring disposed in a groove 1212 formed (e.g., machined) in the base 1202. In another embodiment, the seal 1210 may be formed as a metal gasket or V-seal configured to be disposed between the base 1202 and the lid 1208. The seal 1210 may be formed in any shape, size, or configuration sufficient to provide a seal when the lid 1208 is attached to the base 1202 and securely secure the contents within the container 1102. In one example, the seal 1210 is formed from an elastomer, although one skilled in the art will understand that the seal 1210 may be formed from any other material sufficient to provide a seal, such as, but not limited to, a polymer or a metal.

[0053] Housing 1106, gas feedthrough 1108, and valves 1110-1122 may be the same as or similar to housing 206, gas feedthrough 208, and valves 210-228.

[0054] Gas supply assembly 1100 may include the same or similar valve plate leveling device illustrated in connection with gas supply assembly 200. Additionally, gas supply assembly 200 may include a removable gas line, such as, for example, removable gas line 302 coupled between valve 1110 and gas feedthrough 1108.

[0055] The gas supply assembly 1100 may also include a drip pan 1302, as shown in Figure 13. The assembly may include a stop 1304 attached to the drip pan 1302.

[0056] The exemplary embodiments of the disclosure set forth above do not limit the scope of the present invention, as these embodiments are merely examples of embodiments of the present invention. For example, some examples may not include a solid-source precursor container even though they are illustrated with a solid precursor source container. Any equivalent embodiments are intended to be within the scope of the present invention. Indeed, various modifications of the present disclosure in addition to those shown and described herein, such as alternative useful combinations of the described elements, may become apparent to those skilled in the art from the description. Such modifications and embodiments are also intended to be within the scope of the appended claims. [Explanation of symbols]

[0057] 100 Reactor System 102 Reaction Chamber 104 Gas Distribution System 106 Gas Supply Assembly 108 Exhaust Source 110 Controller 112 Secondary Gas Source 200 Gas Supply Assembly 202 Container 204 Valve Plate or Pallet 206 Housing 208 Gas Feedthrough 201~228 Valves 230 Lid 302 Gas Line 304 first end of gas feedthrough 306 Gas Line Cover 502 First End 504 Second End 506 Conduit 508 Coupler 510 Second Conduit 602 base 604 Internal Section 606 Concave area 608 Sticker 610 Channel Path 612 Exit recess pad 614 Burp Depression Pad 616 Entrance recess pad 618 Contact surface 702 second end of gas feedthrough 704 Coupler 706 Casing 708 Tube 710 Heater 802, 902 Valve Plate Leveling Device 804 Set pin 806 Bracket 808 End of set pin 810 Thread Area 812 Bracket end 904 Set pin 906 Bracket 910 End of set pin 1000 gauge 1002 heater plate First part of 1004 gauge Second part of 1006 gauge 1008, 1010 Bubble Leveler 1012 Heater Leveling Device 1100 Gas Supply Assembly 1102 Container 1104 Valve Plate or Pallet 1106 Housing 1108 Gas Feedthrough 1110~1122 Valve 1124 Liquid inlet 1202 Base 1204 Internal Section 1206 Concave area 1208 Lid 1210 Seal 1212 Groove 1302 Drip Pan 1304 Stop part

Claims

1. 1. A gas supply assembly comprising: A container and A valve plate; a lid disposed between the container and the valve plate; a housing enclosing the container, the lid, and the valve plate; a gas feedthrough having a first end disposed within the housing and a second end disposed outside the housing; one or more valves attached to the valve plate, at least one valve fluidly connected to an interior of the vessel; a removable gas line having a first end connected to the at least one valve and a second end connected to the gas feedthrough; a first valve plate leveling device comprising: a first bracket attached to the valve plate; and a first set pin threadably received in the first bracket and configured with an end contacting the gas feedthrough to set the level of the valve plate; a second valve plate leveling device comprising: a support flange directly or indirectly connected to the housing; a second bracket attached to the valve plate; and a second set pin threadably received in the support flange and configured with an end contacting the second bracket to set the level of the valve plate; A gas supply assembly comprising:

2. The gas supply assembly of claim 1 , wherein the container holds a solid precursor.

3. 3. The gas supply assembly of claim 2, wherein the capacity of the container is greater than 500 g, or between about 500 g and about 2 kg, or between about 500 g and about 1.75 kg, or between about 750 g and about 1.5 kg.

4. The gas supply assembly of claim 1 , wherein the container holds a liquid precursor.

5. 5. The gas supply assembly of claim 4, wherein the container has a capacity greater than 0.5 L, or between about 0.5 L and about 2 L, or between about 0.75 L and about 2 L, or between about 0.75 L and about 1.5 L.

6. The gas supply assembly of claim 1 , further comprising a drip pan and a stop attached to the drip pan.

7. The gas supply assembly of claim 1 , wherein the removable gas line comprises a first end and a conduit coupled to the first end.

8. The gas supply assembly of claim 7 , wherein an angle between the first end and the conduit is greater than zero and less than 180 degrees.

9. The gas supply assembly of claim 7 , further comprising a coupler between the first end and the second end.

10. The gas supply assembly of claim 1 , further comprising a gas line cover covering at least a portion of the removable gas line.

11. The gas supply assembly of claim 1 , wherein the gas feedthrough comprises a casing.

12. The gas supply assembly of claim 11 , wherein the gas feedthrough further comprises a heater embedded within the casing.

13. 1. A gas supply assembly comprising: A container and A valve plate; a lid disposed between the container and the valve plate; a heater plate below the vessel; a housing enclosing the vessel, the lid, the heater plate, and the valve plate; a gas feedthrough having a first end disposed within the housing and a second end disposed outside the housing; a plurality of valves mounted to the valve plate, at least one valve of the plurality of valves being fluidly connected to an interior of the vessel; a first valve plate leveling device comprising: a first bracket attached to the valve plate; and a first set pin threadably received in the first bracket and configured with an end contacting the gas feedthrough to set the level of the valve plate; a second valve plate leveling device comprising: a support flange directly or indirectly connected to the housing; a second bracket attached to the valve plate; and a second set pin threadably received in the second bracket and configured to have an end contact the second bracket to set the level of the valve plate; a gauge comprising a first portion coupled to the heater plate, a second portion coupled to the valve plate and in contact with the first portion, and one or more heater leveling devices coupled to the heater plate, the gauge configured to adjust the level of the valve plate via the first portion and the second portion by adjusting the heater leveling devices.

14. 14. The gas supply assembly of claim 13, further comprising a removable gas line having a first end connected to the at least one valve and a second end connected to the gas feedthrough.

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