Inspection method for IC sockets and IC modules

Abstract

To provide an IC socket for optical modules with which stable conduction of electricity is possible without using a thermo-stream and which is compatible with a temperature regulation mechanism.SOLUTION: A contact type temperature adjustment element 208 (e.g., a Peltier element) is used instead of a thermo-stream, for temperature adjustment. In order to bring the temperature adjustment element 208 and an optical module 203 into thermal contact, a pressure medium 206 is provided that comes into contact with the optical module 203 penetrating a top face of a lid 202, and the pressure medium 206 and the temperature adjustment element 208 are brought into contact to perform the temperature adjustment of the optical module 203. Furthermore, the pressure medium 206 is provided with a fitting hole for connecting to the temperature adjustment element 208 with good accuracy.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an IC socket and an IC module inspection method, and more particularly to a technique for inspecting an IC module mounted in an IC socket at a predetermined temperature. [Background technology]

[0002] In recent years, there has been a demand for smaller, lower-power, and faster optical communication transceivers to cope with the increase in communication traffic. To achieve these goals, research and development has been conducted on IC modules equipped with optical chips and optical fibers, such as BGA (Ball Grid Array) and LGA (Land Grid Array) as input / output interfaces for electrical signals (Patent Document 1).

[0003] In pre-shipment inspections of IC modules equipped with BGAs, optical chips, and optical fibers, IC sockets are used, just as with ICs and IC modules (or IC packages) equipped with BGAs, such as processors and ASICs. FIGS. 1(a) and 1(b) show an example of a conventional IC socket 100. FIG. 1(a) shows a conventional socket body before mating. FIG. 1(b) shows a conventional socket body after mating. The IC socket 100 includes a transposition section 101 equipped with contact pins 104 and a lid 102 attached to the transposition section. An IC module 103 equipped with optical fibers 110 is attached between the contact pins 104 and the lid 102. The lid 102 includes an elastic member 105, such as a spring, inside the lid 102, and a latch 107. When the latch 107 engages with the engagement section of the transposition section 101, the elastic force of the elastic member 105 acts on a pressing body (pusher) 106, which presses the IC module 103 against the contact pins 104. This allows the terminal portion of the IC module 103 to come into contact with the contact pins 104, thereby establishing mutual conduction. Lid There are two types of lid: a clamshell type, in which the lid is connected to the socket body by a hinge, and a one-touch type (latch type), in which the lid is fitted to the socket body (transposition portion 101 and lid 102) by a latch (claw) 107 provided on the lid 102, but which allows the IC socket 100 itself to be attached and detached. When testing the IC module in a temperature environment, a non-contact temperature adjustment element (not shown), called a Thermostream, which sprays jet air at approximately -100°C to 300°C onto the IC module, is used to change the temperature environment for the IC socket 100 as a whole. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-194041 Summary of the Invention [Problem to be solved by the invention]

[0005] IC sockets are also used to test IC modules equipped with BGA, optical chips, and optical fibers, but the thermostream, which ejects jets of air, causes the optical fiber to vibrate, which changes the polarization state of the optical signal passing through the optical fiber and affects the test results.

[0006] The present invention has been made in consideration of these problems, and aims to provide an IC socket that can regulate temperature without using a thermostream and that allows testing without affecting the IC module to be installed. [Means for solving the problem]

[0007] In order to solve the above problems, the invention of an IC socket according to an embodiment of the present invention comprises a transposition part on which an IC module is removably mounted and which is provided with contact pins, a lid body attached to the transposition part via the IC module mounted on the transposition part, and a pressing body capable of pressing the mounted IC module by being attached to the transposition part, the pressing body penetrating the lid body and having a part exposed from the lid body, and a pressing body connected to the part of the pressing body exposed from the lid body. , enabling temperature control by cooling and heating and a Peltier element, wherein the pressing body is configured to bring the terminal portion of the IC module into contact with the contact pin to establish electrical continuity by pressing, and to thermally connect the Peltier element and the attached IC module. [Effects of the Invention]

[0008] The present invention can provide an IC socket capable of controlling temperature without using a thermostream. [Brief explanation of the drawings]

[0009] [Figure 1] 1A is a cross-sectional view showing a conventional socket body before mating, and FIG. 1B is a cross-sectional view showing a conventional socket body after mating. [Figure 2]1A is a top view showing an IC socket according to the first embodiment of the present invention, FIG. 1B is a cross-sectional view showing an IC socket according to the first embodiment of the present invention before mating, and FIG. 1C is a cross-sectional view showing an IC socket according to the first embodiment of the present invention after mating. [Figure 3] 1A is a top view showing an IC socket according to a second embodiment of the present invention, FIG. 1B is a cross-sectional view showing the IC socket according to the second embodiment of the present invention before mating, and FIG. 1C is a cross-sectional view showing the IC socket according to the second embodiment of the present invention after mating. [Figure 4] 1A is a top view showing an IC socket according to a third embodiment of the present invention, FIG. 1B is a cross-sectional view showing the IC socket according to the third embodiment of the present invention before mating, and FIG. 1C is a cross-sectional view showing the IC socket according to the third embodiment of the present invention after mating. [Figure 5] 1(a) is a cross-sectional view showing a process of using an IC socket according to a third embodiment of the present invention; FIG. 1(b) is a cross-sectional view showing a process of using an IC socket according to a third embodiment of the present invention; FIG. 1(c) is a cross-sectional view showing a process of using an IC socket according to a third embodiment of the present invention; [Figure 6] FIG. 10 is a diagram showing a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present technology will be described with reference to the drawings. Parts having the same functions are designated by the same reference numerals.

[0011] (Embodiment 1) This embodiment relates to an IC socket 200.

[0012] Fig. 2(a) is a top view showing an IC socket 200 according to the first embodiment of the present invention. Fig. 2(b) is a cross-sectional view showing the IC socket 200 according to the first embodiment of the present invention before mating. Fig. 2(c) is a cross-sectional view showing the IC socket 200 according to the first embodiment of the present invention after mating.

[0013] The IC socket 200 includes a transposition section 201 having contact pins 204 and a lid 202 attached to the transposition section, and an IC module 203 having an optical fiber 210 is attached between the contact pins 204 and the lid 202. The lid 202 includes an elastic member 205 on its inner side and also includes a latch 207. When the latch 207 is engaged with an engagement section of the transposition section 201, the elastic force of the elastic member 205 acts on a pressing body (pusher) 206, which can press the IC module 203 against the contact pins 204. This allows the terminal sections of the IC module 203 to come into contact with the contact pins 204, establishing electrical conduction between them. The lid body is of a clamshell type, connected to the socket body by a hinge, and of a one-touch type (latch type), which fits with the socket body (transposition part 201 and lid body 202) by a latch (claw) 207 provided on the lid body 202, but allows the IC socket 200 itself to be attached and detached.

[0014] The elastic member 205 may be, for example, a spring or rubber.

[0015] The pressing body 206 may be made of, for example, metal or plastic.

[0016] For example, the transposition part 201 has a recess on its side surface for fitting with a protrusion, and a latch 207 is provided on the side surface of the lid body 202, including a protrusion extending from the latch, and the recess and the protrusion fit together. That is, the transposition part 201 and the lid body 202 (socket body) fit together by the latch (claw) 207 provided on the lid body 202.

[0017] 2(a), the end of latch 207 does not coincide with the side surface of lid 202, but a latch having an end that coincides with the side surface of lid 202 may be used. The recess of lid 202 may have any shape as long as it can fit into the protrusion of latch 207.

[0018] 2(a) to 2(c), in the IC socket 200 of this embodiment, the pressing body 206 penetrates the cover 202, and the upper part of the pressing body 206 is exposed from the cover 202. Therefore, the pressing body 206 connects to the temperature adjustment element 208 at the upper part of the pressing body 206 on the opposite side of the IC module 203. The pressing body 206 can also connect to the temperature adjustment element 208 in areas on its surface other than the connection area between the temperature adjustment element 208 and the attached IC module 203. In other words, by bringing the pressing body 206 into contact with the temperature adjustment element (Peltier unit) 208, the pressing body 206 can thermally connect the temperature adjustment element 208 and the attached IC module 203. This enables temperature adjustment of the IC module 203 placed in the IC socket 200.

[0019] This allows temperature adjustment without using a thermostream, and makes it possible to prevent the influence of fluctuations in the polarization of optical fibers in IC modules on optical signals during testing.

[0020] The contact-type temperature adjusting element 208 may be a Peltier element, a heat pump, a heat dissipation fin, etc. In particular, when a Peltier element is used, it is possible to achieve compact and precise temperature adjustment.

[0021] (Embodiment 2) This embodiment relates to an IC socket 300 that is different from the IC socket 200 described in embodiment 1. The method of connecting the temperature adjusting element 208 is different.

[0022] Fig. 3(a) is a top view showing an IC socket 300 according to embodiment 2 of the present invention. Fig. 3(b) is a cross-sectional view showing the IC socket 300 according to embodiment 2 of the present invention before mating. Fig. 3(c) is a cross-sectional view showing the IC socket 300 according to embodiment 2 of the present invention after mating.

[0023] IC socket 300 includes transposition section 201 having contact pins 204 and lid 202 attached to the transposition section, and IC module 203 having optical fiber 210 is attached between contact pins 204 and lid 202. Lid 202 includes elastic member 205 on its inner side and also includes latch 207. When latch 207 is engaged with an engagement section of transposition section 201, the elastic force of elastic member 205 acts on pressing body (pusher) 306, which can press IC module 203 against contact pins 204. This allows the terminal sections of IC module 203 to come into contact with contact pins 204, establishing mutual conduction. The lid body is of a clamshell type, connected to the socket body by a hinge, and of a one-touch type (latch type) that fits with the socket body (transposition part 201 and lid body 202) by a latch (claw) 207 provided on the lid body 202, but allows the IC socket 300 itself to be attached and detached.

[0024] The elastic member 205 may be, for example, a spring or rubber.

[0025] The pressing body 206 may be made of, for example, metal or plastic.

[0026] As shown in FIGS. 3(a) to 3(c), the pressing body 306 of the IC socket 300 has a fitting hole 306a at its top, which allows for precise connection to a contact-type temperature adjustment element (Peltier unit) 208. The pressing body 306 connects to the temperature adjustment element 208 at the top of the pressing body 306 on the opposite side of the IC module 203. The pressing body 306 can also connect to the temperature adjustment element 208 at a surface area of ​​the pressing body 306 other than the connection area between the pressing body 306 and the mounted IC module 203. In other words, the pressing body 306 is brought into contact with the temperature adjustment element 208. In this way, the pressing body 306 can thermally connect the temperature adjustment element 208 to the mounted IC module 203. This allows for temperature adjustment of the IC module 203 placed in the IC socket 200.

[0027] 3(a) to 3(c) show an example in which two fitting holes 306a are provided in the pressing body 306, but the number is not limited to two. In addition, the cross-sectional shape of the fitting holes may be circular or rectangular.

[0028] In this embodiment, it is possible to provide an IC socket capable of controlling the temperature without using a thermostream.

[0029] (Embodiment 3) This embodiment relates to an IC socket 400 that is different from the IC sockets of embodiments 1 and 2. The method of connecting the temperature adjusting element 208, and the shape and operation method of the pressing body are different.

[0030] Fig. 4(a) is a top view showing an IC socket 400 according to embodiment 3 of the present invention. Fig. 4(b) is a cross-sectional view showing the IC socket 400 according to embodiment 2 of the present invention before mating. Fig. 3(c) is a cross-sectional view showing the IC socket 400 according to embodiment 2 of the present invention after mating.

[0031] IC socket 400 includes transposition section 201 having contact pins 204 and lid 202 attached to the transposition section, and IC module 203 having optical fiber 210 is attached between contact pins 204 and lid 202. Lid 202 includes elastic member 205 on its inner side and also includes latch 207. When latch 207 is engaged with an engagement section of transposition section 201, the elastic force of elastic member 205 acts on pressing body (pusher) 206, which can press IC module 203 against contact pins 204. This allows terminal sections of IC module 203 to come into contact with contact pins 204, establishing mutual conduction. The lid body is of a clamshell type, connected to the socket body by a hinge, and of a one-touch type (latch type), which fits into the socket body (transposition part 201 and lid body 202) by a latch (claw) 207 provided on the lid body 202, but allows the IC socket 400 itself to be attached and detached.

[0032] The elastic member 205 may be, for example, a spring or rubber.

[0033] The pressing body 206 may be made of, for example, metal or plastic.

[0034] As shown in Figures 4(a) to (c), the IC socket 400 of the present invention has a through-type pressing body 406 provided with a hole 406a, e.g., a screw hole, for connecting an auxiliary jig 409 for transposition, and the auxiliary jig 409 for transposition that can be connected to and detached from the lid body 202.

[0035] A specific configuration of IC socket 400 of this embodiment includes a mechanism for connecting auxiliary jig 409 for transposition to pressing body 406 that penetrates lid body 202. As shown in Fig. 5(a), auxiliary jig 409 for transposition can be connected to and detached from lid body 202, and as shown in Figs. 5(b) and 5(c), a mechanism for vertically raising and lowering pressing body 406 is provided.

[0036] For example, in FIG. 5, a mechanism for connecting an auxiliary jig 409 for transposition is configured with a screw hole.

[0037] As shown in FIG. 4(c), the auxiliary jig 409 for transposition is made up of a structure 409a connectable to the lid 202 and a screw 409b.

[0038] To use the transposition auxiliary jig 409, first, attach the transposition auxiliary jig 409 to the lid 202, and then, as shown in FIG. 5(b), turn the screw 409b to pull up (pull) the pressing body 406 until it becomes flat on the underside of the lid 202. Then, the lid 202 with the transposition auxiliary jig 409 attached is fixed to the transposition unit (transposition table). Here, the manner in which the transposition auxiliary jig 409 is fixed by the latch 207 is described, but a clamshell type may also be used.

[0039] Then, as shown in FIG. 5( c), the screw 409 b is loosened to slowly lower the pressing body 406, and the auxiliary jig 409 for transposition is removed, thereby enabling connection to a contact-type temperature adjustment element (Peltier unit). The pressing body 406 connects to the temperature adjustment element at the upper portion of the pressing body 406 on the opposite side of the IC module 203. The pressing body 406 can also connect to the temperature adjustment element (not shown) in areas on its surface other than the connection area between the pressing body 406 and the mounted IC module 203. In other words, the pressing body 406 contacts the temperature adjustment element (not shown). In this way, the pressing body 406 can thermally connect the temperature adjustment element (not shown) to the mounted IC module 203. This enables temperature adjustment of the IC module 203 transposed in the IC socket 200.

[0040] According to this embodiment, the above-described mechanism eliminates the need for an operator to push the cover body in to attach it, and prevents the cover from being pushed in biasedly. In addition, because the pressing body descends vertically, even modules with optical fibers connected thereto are less likely to be displaced biasedly.

[0041] Therefore, in the IC socket of this embodiment, the auxiliary jig for transposition prevents the module from being displaced during transposition, which prevents contact failure. In addition, since the auxiliary jig for transposition is removable, it can be connected to a contact-type temperature adjustment element, and because it does not use a thermostream that emits jet air to shake the optical fiber, it does not affect the inspection results.

[0042] <Comparative Example> In the conventional IC socket 100 shown in FIG. 1, the IC module 103 may tilt and be displaced, resulting in poor contact with the contact pins 104 and causing poor electrical continuity.

[0043] Furthermore, as shown in FIG. 6(a), in the case of an IC module 103a equipped with an optical fiber 110a, since the optical fiber 110a is connected, the weight of the optical fiber 110a itself can easily cause the module to become biased and displaced. [Industrial Applicability]

[0044] The present invention is applicable to the technical field relating to an IC socket and an IC module inspection method. [Explanation of symbols]

[0045] 100, 200, 300, 400 IC sockets 101, 201 Transposition part 102, 202 Lid 103, 103a, 203 IC modules 104, 204 Contact pins 105, 205 Elastic member 106, 206, 306, 406 Pusher 107, 207 Latch 208 Temperature control element (Peltier unit) 306a mating hole 309 Locating Pin 406a hole 409 Auxiliary Jig 409a structure 409b Screw 110, 110a, 210 optical fiber

Claims

1. a transposition unit to which an IC module is removably attached and which is provided with contact pins; a cover attached to the transposition unit via an IC module attached to the transposition unit; a pressing body that is capable of pressing the mounted IC module by being attached to the transposition section, the pressing body penetrating the lid body and having a portion exposed from the lid body; a Peltier element connected to a portion of the pressing body exposed from the lid body, the Peltier element enabling temperature adjustment by cooling and heating; Equipped with the pressing body is configured to bring the terminal portion of the IC module into contact with the contact pin to establish electrical continuity by pressing the pressing body, and to thermally connect the Peltier element and the attached IC module; The apparatus further includes an auxiliary jig for transposition that can be connected to and separated from the lid body and has a mechanism for moving the pressing body up and down, the moving mechanism being a structure that is connected to or separated from the lid body, the structure having a screw hole, a screw that engages with the screw hole of the structure, and a screw hole that is provided in the pressing body and engages with the screw; An IC socket comprising:

2. 2. The IC socket according to claim 1, wherein the lid and the transposition portion are fitted together by a latch provided on the lid.

3. 2. The IC socket according to claim 1, wherein the connection between the lid body and the transposition portion is a one-touch type, which is made possible by a latch provided on the lid body engaging with the transposition portion, or a clamshell type, in which the lid body and the transposition portion are connected and fitted together by a hinge connecting the lid body and the transposition portion.

4. 4. The IC socket according to claim 1, wherein the pressing body has a fitting hole so that the Peltier element can be connected using a positioning pin.

5. 1. A method for inspecting an IC module using an IC socket, the method comprising: a transposition section for removably mounting an IC module and having contact pins; a lid body attached to the transposition section via the IC module mounted on the transposition section; a pressing body capable of pressing the mounted IC module by being attached to the transposition section, the pressing body penetrating the lid body with a portion exposed from the lid body; and a Peltier element connected to the portion of the pressing body exposed from the lid body, which enables temperature adjustment by cooling and heating, a step of pressing the IC module mounted by attachment to the transposition section with the pressing body provided on the lid body, and bringing the terminal section of the IC module into contact with the contact pins by the pressing to establish electrical continuity, thereby thermally connecting the Peltier element and the mounted IC module with the pressing body; and The method further includes a step of attaching an auxiliary jig for transposition to the pressing body before attaching the lid body, The connecting step includes: The terminal portion of the IC module is brought into contact with the contact pin to establish electrical continuity; After removing the auxiliary jig for transposition from the pressing body, the Peltier element is connected to the pressing body.

1. A method for inspecting an IC module, comprising:

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