Fluororesin sheet and metal-clad fluororesin substrate including same
The fluororesin sheet and metal-clad substrate address handleability and transmission issues by using a laminated fluoropolymer and inorganic filler structure, ensuring high tensile strength and improved high-frequency performance.
Patent Information
- Application Number
- JP2024147667
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-02-22
- Filing Date
- 2024-08-29
- Publication Date
- 2025-08-28
- Estimated Expiration
- 2043-11-13
AI Technical Summary
Conventional fluororesin sheets are easily torn and difficult to handle, and glass fiber cloth-laminated substrates face issues with thickness restrictions and dielectric constant fluctuations, leading to poor high-frequency transmission characteristics.
A fluororesin sheet composed of fluoropolymer and inorganic filler, oriented in the plane direction with laminated structure, providing high tensile strength and handleability without glass fiber cloth, and a metal-clad substrate with improved thermal conductivity and dielectric properties.
The fluororesin sheet and metal-clad substrate offer enhanced handleability, tensile strength, and improved high-frequency transmission characteristics, suitable for high-speed communication boards and antenna boards.
Smart Images

Figure 0007730968000003 
Figure 0007730968000004 
Figure 0007730968000005
Abstract
Description
[Technical Field]
[0001] The present invention relates to a fluororesin sheet useful for printed wiring boards for high-speed communications using high frequencies such as millimeter waves and microwaves, and a method for producing a metal-clad fluororesin substrate including the same. [Background technology]
[0002] With the advancement of high-speed communications such as 5G, there is currently a strong demand for high-speed communication boards and antenna boards that have low transmission loss even when using high frequencies such as millimeter waves. Furthermore, the trend toward high-density packaging and ultra-thin wiring boards for information terminals such as smartphones is progressing significantly. For high-speed communications such as 5G, printed circuit boards are widely used, which are made by laminating prepregs obtained by impregnating low-dielectric glass cloth such as D-glass, NE-glass, or L-glass with thermoplastic resins such as fluororesin or polyphenylene ether, or thermosetting resins such as low-dielectric epoxy resin or low-dielectric maleimide resin, and then curing the prepregs under heat and pressure. Patent Document 1 proposes mixing a fluororesin with low-molecular-weight polytetrafluoroethylene fine powder and an inorganic filler, and impregnating the mixture into a glass fiber cloth to produce a fluororesin prepreg. Patent Document 2 proposes hydrophilizing the surface of the fluororesin prepreg impregnated into a glass fiber cloth by subjecting it to amino and hydroxyl groups, and then laminating it to a metal foil. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Publication No. 2020-50860 [Patent Document 2] Japanese Patent Publication No. 2022-114351 Summary of the Invention [Problem to be solved by the invention]
[0004] However, fluororesin sheets have the problem of being easily torn and difficult to handle. While Patent Documents 1 and 2 improve the handleability by impregnating a glass fiber cloth with the fluororesin to form a fluororesin prepreg, there has been a demand for a fluororesin sheet metal-clad fluororesin substrate that does not use a glass fiber cloth and that is easy to handle by itself.
[0005] In order to solve the above-mentioned problems of the prior art, the present invention provides a fluororesin sheet that is easy to handle as a single unit, and a metal-clad fluororesin substrate including the same. [Means for solving the problem]
[0006] The fluororesin sheet of the present invention is a fluororesin sheet containing a fluoropolymer and an inorganic filler, The fluororesin sheet is made up of multiple sheets laminated in the thickness direction. Press molding The fluoropolymer is oriented in the surface direction of the fluororesin sheet and is entangled with the inorganic filler to coat the inorganic filler. And, The fluororesin sheet has a tensile strength of 6 MPa or more in both the length direction and the width direction, and a breaking elongation of 10% or more in both the length direction and the width direction, The fluororesin sheet Thickness direction It is characterized by a thermal conductivity of 0.3 to 10 W / m·K.
[0007] The metal-clad laminate of the present invention has a metal foil laminated to at least one surface of the fluororesin sheet. [Effects of the Invention]
[0008] The present invention provides a fluororesin sheet that is easy to handle by itself and a metal-clad fluororesin substrate that includes the same, which contains a fluoropolymer and an inorganic filler, and the fluoropolymer is oriented in the plane direction of the fluororesin sheet. [Brief explanation of the drawings]
[0009] [Figure 1] FIG. 1 is an SEM cross-sectional photograph (magnification: 500 times) of a fluororesin sheet according to one embodiment of the present invention. [Figure 2] FIG. 2 is an SEM cross-sectional photograph (magnification: 1000 times) of a fluororesin sheet according to one embodiment of the present invention. [Figure 3] FIG. 3 is an SEM cross-sectional photograph (magnification: 500 times) of the fluororesin sheet of the comparative example. [Figure 4] FIG. 4 is an SEM cross-sectional photograph (magnification: 1000 times) of the fluororesin sheet of the comparative example. [Figure 5] FIG. 5 is a schematic perspective view of a copper-clad fluororesin substrate according to one embodiment of the present invention. [Figure 6] 6A to 6D are schematic perspective views showing a method for producing a fluororesin sheet according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0010] The inventors have studied the problems with conventional fluororesin sheets laminated with glass fiber cloth and metal-clad fluororesin substrates containing such sheets, and have found that the conventional products have problems such as difficulty in forming thin films due to restrictions on the thickness of the glass fiber cloth, and also in terms of physical properties, the difference in volume balance between fluororesin and glass fiber cloth causes fluctuations in dielectric constant, which tends to result in poorer transmission characteristics at high frequencies compared to clothless substrates, and the high viscosity of fluororesin makes it difficult to impregnate deep inside, which can lead to the possibility of air entrapment.The present invention was completed based on these ideas.
[0011] The present invention relates to a fluororesin sheet containing a fluoropolymer and an inorganic filler. The fluororesin sheet may be composed of a fluoropolymer and an inorganic filler, or additives other than the fluoropolymer and inorganic filler, such as pigments, stabilizers, oils, alcohols, and resins, may be added. The fluoropolymer is oriented in the plane direction of the fluororesin sheet. That is, the fluororesin sheet has a laminated structure when viewed in the cross-sectional direction. This structure provides high tensile strength in multiple directions and good handleability of the fluororesin sheet alone, even without the use of glass fiber cloth. Of course, the use of glass fiber cloth is not excluded, and it may be layered at any location. Preferably, the fluororesin sheet is used alone, without the use of glass fiber cloth. This fluororesin sheet preferably has a structure in which fluoropolymers are layered in the thickness direction. This structure provides high strength in various directions and improved handleability.
[0012] The fluororesin sheet preferably has a tensile strength of 5 MPa or more in both the length direction and width direction, more preferably greater than 5 MPa, and even more preferably 6 MPa or more. The higher the upper limit, the better, but practically it is preferably 100 MPa or less, and even more preferably 95 MPa or less. This provides high strength in various directions and improves handleability.
[0013] The fluororesin sheet preferably has a breaking elongation in both the length direction and width direction of 1% or more, more preferably 5% or more, and even more preferably 10% or more. The upper limit is preferably 500% or less, and even more preferably 400% or less. This provides high elongation in various directions and improves handleability.
[0014] The fluoropolymer is preferably at least one selected from the group consisting of polytetrafluoroethylene (PTFE), perfluoroalkoxyalkane polymer (PFA), and perfluoroethylenepropene copolymer (FEP). In particular, a combination of PTFE as the main component at 50% by mass or more and PFA and / or FEP as the secondary components at less than 50% by mass is preferred.
[0015] The inorganic filler is preferably at least one selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, aluminum nitride, boron nitride, silicon nitride, barium titanate, barium sulfate, and magnesium hydroxide. These serve as reinforcing materials and / or thermally conductive materials. The reinforcing materials can increase the strength of the sheet, and the thermally conductive materials can transfer heat from heat-generating components such as semiconductors to heat-dissipating materials.
[0016] In the fluororesin sheet, the inorganic filler is preferably 100 to 1000 parts by volume, more preferably 150 to 900 parts by volume, and even more preferably 200 to 800 parts by volume, per 100 parts by volume of the fluororesin, thereby improving reinforcement and / or thermal conductivity. Each particle of the inorganic filler preferably has a D50 (median diameter) of 0.01 to 100 μm, more preferably 0.1 to 90 μm, and even more preferably 0.1 to 80 μm in cumulative particle size distribution on a volume basis as determined by a laser diffraction light scattering method, thereby improving reinforcement and / or thermal conductivity.
[0017] The thermal conductivity of the fluororesin sheet is preferably 0.1 to 10 W / m·K, more preferably 0.2 to 10 W / m·K, and even more preferably 0.3 to 10 W / m·K, thereby providing favorable thermal conductivity.
[0018] The thickness of the fluororesin sheet is preferably 0.05 to 10.0 mm, more preferably 0.1 to 9 mm, and even more preferably 0.12 to 8 mm, which allows it to be used with a variety of circuit boards.
[0019] The mass per unit area of the fluororesin sheet is 80 to 40,000 g / m 2 It is preferable that the density is 160 to 30,000 g / m 2 and more preferably 200 to 20,000 g / m 2 This allows the production of circuit boards with different characteristics.
[0020] The fluororesin sheet can be adhered to metal foil with a surface roughness of Rz 0.85 to 2.0, and the adhesive strength with the metal foil is preferably a peel strength of up to 40 N / cm. More preferably, the peel strength is 5.0 to 40 N / cm, and even more preferably 5.3 to 40 N / cm. This allows it to be used with a variety of circuit boards.
[0021] The solder heat resistance is preferably such that the copper foil does not peel off or swell when a 50mm square copper-clad fluororesin substrate sample is floated in a solder bath at 288°C for 10 minutes. This improves the processability of the soldering work.
[0022] The metal-clad fluororesin substrate of the present invention has a metal foil laminated to at least one surface of any of the above-mentioned fluororesin sheets, preferably on both surfaces or in multiple layers, making it suitable for use in a wide variety of circuit boards.
[0023] The metal-clad fluororesin substrate preferably has a dielectric loss tangent at a frequency of 10 GHz of 0.0001 to 0.003. The metal-clad fluororesin substrate preferably has a relative dielectric constant at a frequency of 10 GHz of 1.5 to 20. This makes it suitable for use as a high-frequency circuit board.
[0024] The metal foil is preferably copper foil, which allows it to be used for high frequency circuit boards.
[0025] The manufacturing method of the present invention includes the following steps. (1) First step An aqueous dispersion of fluoropolymer and an inorganic filler are mixed, compounded, and press-molded into a sheet. Here, compound has the same meaning as green body. Press molding is preferably performed at room temperature and a pressure of 0.5 to 4.0 MPa. Compounding can be performed using a variety of mixing methods, including planetary mixing, kneader mixing, shaking, three-roll milling, and pot milling. (2)Second process The sheets are laminated and press-molded again to obtain a sheet. The press molding is preferably performed at room temperature under a pressure of 0.15 to 2.5 MPa. The lamination and press molding may be repeated multiple times. The multiple times is preferably 2 to 20 times, more preferably 3 to 15 times. The lamination is preferably at least one type selected from the group consisting of unidirectional lamination (parallel lamination), multidirectional lamination (cross lamination), and a combination thereof. This results in a structure in which the fluoropolymer is laminated in the thickness direction of the fluororesin sheet and oriented in the plane direction. Additionally, by repeating the lamination and press molding multiple times, the fluoropolymer becomes entangled with the inorganic filler and coats the inorganic filler. This results in a structure in which interfacial peeling between the inorganic filler and the fluoropolymer is eliminated. As described above, the structure in which the fluororesin sheet is laminated in the thickness direction and oriented in the plane direction, combined with the structure in which interfacial peeling between the inorganic filler and the fluoropolymer is eliminated, synergistically results in a fluororesin sheet with high tensile strength in multiple directions and easy to handle by itself, even without the use of glass fiber cloth. (3) Rolling, drying, and degreasing processes The sheet obtained as described above is rolled, dried, and degreased. Rolling is preferably used for rolling. Drying is preferably natural drying (air drying at room temperature). Degreasing is preferably performed by heat treatment at 200 to 300°C for 5 to 24 hours. This removes unnecessary organic matter.
[0026] The following description will be made with reference to the drawings. In the following drawings, the same reference numerals indicate the same parts. FIG. 1 is a scanning electron microscope (SEM) cross-sectional photograph (magnification: 500x) of a fluororesin sheet 1 according to one embodiment of the present invention. The fluoropolymer 2 is oriented in the plane direction of the fluororesin sheet 1. That is, it is the fluoropolymer 2 that is aligned in the horizontal direction. This fluoropolymer 2 is entangled with the inorganic filler 3 and coats the inorganic filler, and no clear sea-island structure is observed between the inorganic filler 3 and the fluoropolymer 2. Note that the vertical lines in FIG. 1 are cut marks made when the cross section is cut by ion milling. It can also be observed that this fluororesin sheet 1 has a structure in which the fluoropolymer 2 is laminated in layers in the thickness direction. That is, it has a laminated structure when viewed from the cross section. FIG. 2 is an SEM cross-sectional photograph (magnification: 1000x) of a fluororesin sheet according to one embodiment of the present invention.
[0027] Figure 3 is an SEM photograph (magnification 500x) of a fluororesin sheet 4 of a comparative example. This fluororesin sheet 4 was produced by a method that did not include the second step (lamination press step) of the method of the present invention. The fluoropolymer 5 and inorganic filler 6 form a clear sea-island structure, and no orientation of the fluoropolymer 5 is observed. The interface between the inorganic filler 6 and the fluoropolymer 5 can be clearly observed, with some areas showing interfacial delamination. In Figure 3, the vertical lines are cut scratches made when the cross section was cut by ion milling. Figure 4 is an SEM cross-sectional photograph (magnification 1000x) of the fluororesin sheet of the comparative example.
[0028] 5 is a schematic perspective view of a copper-clad fluororesin substrate 7 according to one embodiment of the present invention. This copper-clad fluororesin substrate 7 has copper foils 8a and 8b attached to both sides of a fluororesin sheet 1. The fluororesin sheet 1 is heated to a temperature near its melting point of 326°C and is attached to the copper foils 8a and 8b by heat pressing. An adhesive may be used at this time.
[0029] 6A-6D are schematic perspective views showing a method for producing a fluororesin sheet according to one embodiment of the present invention. FIG. 6A shows a fluororesin sheet 9 obtained in the first step of the method of the present invention. FIG. 6B shows an example in which this fluororesin sheet 9 is cross-laminated as indicated by arrows 10 and 11. The folding angle is arbitrary. FIG. 6C shows a fluororesin sheet 9 stacked in parallel as indicated by arrows 10 and 11. A mixed lamination may be formed by mixing the cross lamination of FIG. 6B and the parallel lamination of FIG. 6C. The fluororesin sheet 9 thus stacked is pressed with press plates 14 and 15 as shown in FIG. 6D. Next, the fluororesin sheet of the present invention is obtained by the rolling, drying, and degreasing steps described above. [Example]
[0030] The present invention will be described below using examples, but is not limited to these examples. Various parameters were measured by the following methods. <Dielectric constant, dielectric loss tangent> Measurements were performed using a network analyzer (Keysight Technologies) using the cavity resonator perturbation method. <Effective relative permittivity, transmission loss> The transmission loss was measured using a network analyzer (manufactured by Keysight). <Peel strength> The peel-off strength was measured by peeling at 90° according to JIS C6481 (1996) using a tensile tester (manufactured by Shimadzu Corporation). <Tensile strength, elongation> Tensile tests and elongation tests were performed using a tensile testing machine (Shimadzu Corporation) in accordance with ASTM D638 (1995). The tensile strength and elongation were measured on a 5 cm wide sample and converted to values per cm. Elongation refers to the elongation at break. <Specific gravity> The specific gravity was measured using a hydrometer (Mettler-Toledo) according to ASTM D792:20 (2020). The liquid used was ethanol. <Thermal resistance, thermal conductivity> The thermal resistance was measured according to a method compliant with ASTM D5470 (2017) (the sample was sandwiched between aluminum blocks, a load of 5 kgf was applied, and the thermal resistance value was measured from the temperature difference between the top and bottom and the electric power, and the thermal conductivity was calculated from the thermal resistance value). The thermal conductivity was also calculated from the slope of the measured value. <Solder heat resistance> The solder heat resistance was confirmed by floating a 50mm square copper-clad fluororesin substrate sample in a solder bath at 288°C for 10 minutes and checking whether the copper foil peeled off or blistered. <Other physical properties> Measured according to industry standard tests.
[0031] Example 1 <Raw materials> 132 parts by volume of silica (LS-44: Marukama Kamado Toryo Co., Ltd.) with a D50 median diameter of 13.5 μm, measured by the laser diffraction light scattering method, was added to a container. An aqueous dispersion (60% concentration) of polytetrafluoroethylene (31-JR: Mitsui Chemours) was then added to the container so that the resin content was 95 parts by volume, and an aqueous dispersion (56% concentration) of perfluoroethylene (335-JR: Mitsui Chemours) was added to the container so that the resin content was 5 parts by volume. The mixture was stirred to obtain a dispersion. <Mixed> The dispersion obtained above was stirred for 2 minutes with a propeller machine adjusted to a rotation speed of 60 to 70 rpm, and then stirred for 2 minutes with a propeller machine adjusted to a rotation speed of 60 to 70 rpm. <Solidification> The dispersion thus obtained was solidified. <Compounding (making clay)> The solidified dispersion liquid was scooped out with a spatula or the like and kneaded. <Molding> The clay obtained as described above was placed in a metal frame having an inner frame of 14 cm square and a thickness of 1.5 cm, and press-molded at room temperature under a pressure of 2.0 MPa. <Lamination press> The molded body that had been soaked for a sufficient time was placed in a metal frame with an inner frame of 21 cm square and 0.65 cm thick, and press-molded at room temperature under a pressure of 1.5 MPa. After that, the lamination shown in Figure 6A and the lamination shown in Figure 6B were performed once each, and then press-molded at room temperature under a pressure of 1.0 MPa. <Rolling> The molded body obtained above was placed on a 100 μm thick polyethylene terephthalate (PET) film and rolled with a roll gap of 3.5 mm. At this time, it is desirable to set a low rolling reduction. Rolling was repeated until the desired thickness (approximately 0.16 mm) was reached. <Drying> The sheet obtained by the rolling was dried while still on the PET film. <Degreasing> The resulting dried sheet was cut to a predetermined size and placed in an oven and heated at 250°C for 12 hours. <Heat pressing> The long degreased sheet obtained in the degreasing process was cut to a predetermined size (for example, 200 mm length, 300 mm width), and copper foil (manufactured by Fukuda Metal Foil and Powder Co., Ltd., product name "CF-T4X-SV18") / degreased sheet / copper foil were stacked in this order, gradually heated to a temperature of 350°C, and vacuum-heat-pressed at a vacuum degree of 0.9 kPa and a pressure of 8.0 MPa to form a laminate. The size of the obtained copper-clad fluororesin substrate was 200 mm length, 300 mm width, 0.127 mm thickness, and a mass per unit area of 555 g / m 2 It was. The fluororesin sheet for evaluation was prepared by pressing only the sheet under the same conditions as above, without using copper foil. The size of the obtained fluororesin sheet was 200 mm long, 300 mm wide, 0.127 mm thick, and the mass per unit area was 272 g / m. 2 It was.
[0032] (Comparative Example 1) The same procedure as in Example 1 was carried out except that the lamination press step was not performed. However, the processability after rolling was poor, and it was difficult to obtain a long fluororesin sheet. The reason for this was that without the lamination press step, the fluororesin sheet was weak and prone to tearing in the longitudinal direction. However, although a long fluororesin sheet could not be obtained, a small sheet of approximately 100 mm in length and 60 mm in width was obtained, and was then rolled, dried, degreased, and hot-pressed in the same manner as in Example 1 to obtain a single fluororesin sheet for evaluation.
[0033] Example 2 <Raw materials> 100 g of alumina with a D50 median diameter of 2 μm and 265 volume parts of alumina with a D50 median diameter of 10 μm were added to a container using the laser diffraction light scattering method. An aqueous dispersion of polytetrafluoroethylene (31-JR: manufactured by Mitsui Chemours) (60% concentration) was then added to the container so that the resin content was 95 volume parts, and an aqueous dispersion of perfluoroethylene (335-JR: manufactured by Mitsui Chemours) (56% concentration) was added to the container so that the resin content was 5 volume parts. The mixture was stirred to obtain a dispersion. <Mixed> The resulting dispersion was stirred for 2 minutes with a propeller machine adjusted to a rotation speed of 60 to 70 rpm. <Solidification> The dispersion thus obtained was solidified. <Compounding (making clay)> The solidified dispersion liquid was scooped out with a spatula or the like and kneaded. <Molding> The clay obtained as described above was placed in a metal frame having an inner frame of 14 cm square and a thickness of 1.5 cm, and press-molded at room temperature under a pressure of 0.65 MPa. <Lamination press> The molded body that had been soaked for a sufficient time was placed in a metal frame with an inner frame of 21 cm square and 0.65 cm thick, and press-molded at room temperature under a pressure of 0.40 MPa. Then, lamination shown in Figure 6A and lamination shown in Figure 6B were repeated twice, and then press-molded at room temperature under a pressure of 0.35 MPa. <Rolling> The molded body obtained above was placed on a 100 μm thick polyethylene terephthalate (PET) film and rolled with a roll gap of 3.5 mm. At this time, it is desirable to set a low rolling reduction. Rolling was repeated until the desired thickness (approximately 0.127 mm) was reached. <Drying> The sheet obtained by the rolling was dried while still on the PET film. <Degreasing> The resulting dried sheet was cut to a predetermined size and placed in an oven and heated at 250°C for 12 hours. <Heat pressing> The long degreased sheet obtained in the degreasing process was cut to a specified size, and the copper foil (manufactured by Fukuda Metal Foil and Powder Co., Ltd., product name "CF-T4X-SV18") / degreased sheet / copper foil were stacked in this order, gradually heated to a temperature of 350°C, and vacuum-heat-pressed at a vacuum degree of 0.9 kPa and a pressure of 8 MPa to form a laminate. The resulting copper-clad fluororesin substrate measured 200 mm in length, 300 mm in width, 0.127 mm in thickness, and had a mass per unit area of 693 g / m. 2 It was. The fluororesin sheet for evaluation was prepared by pressing only the sheet under the same conditions as above, without using copper foil. The size of the obtained fluororesin sheet was 200 mm long, 300 mm wide, 0.127 mm thick, and the mass per unit area was 410 g / m. 2 It was. A scanning electron microscope (SEM) cross-sectional photograph (magnification: 500x) of this fluororesin sheet alone is shown in Figure 1. As is clear from Figure 1, the fluoropolymer 2 is laminated in the thickness direction of the fluororesin sheet 1 and oriented in the plane direction. In other words, it is the fluoropolymer 2 that is aligned in the horizontal direction. This fluoropolymer 2 is entangled with the inorganic filler 3 and coats the inorganic filler, and no clear sea-island structure is observed between the inorganic filler 3 and the fluoropolymer 2. As is clear from Figures 1 and 2, it can also be confirmed that there is a laminated structure.
[0034] (Comparative Example 2) The same procedure as in Example 2 was carried out except that the lamination press step was not performed. However, the processability after rolling was poor, and it was difficult to obtain a long fluororesin sheet. The reason for this was that without the lamination press step, the fluororesin sheet was weak and prone to tearing in the longitudinal direction. However, although a long fluororesin sheet could not be obtained, a small sheet of approximately 100 mm in length and 60 mm in width was obtained, and the sheet was rolled, dried, degreased, and hot-pressed in the same manner as in Example 2 to obtain a single fluororesin sheet for evaluation. A scanning electron microscope (SEM) cross-sectional photograph (magnification: 500x) of this fluororesin sheet alone is shown in Figure 3. As is clear from Figure 3, the fluoropolymer 5 and inorganic filler 6 form a clear sea-island structure, and no orientation of the fluoropolymer 5 was observed. The interface between the inorganic filler 6 and the fluoropolymer 5 could also be clearly observed, with some areas showing interfacial delamination. This state can also be confirmed in Figure 4. The physical properties of the fluororesin sheet alone and the physical properties of the copper-clad fluororesin substrate are summarized in Table 1 and Table 2, respectively.
[0035] [Table 1]
[0036] [Table 2]
[0037] As is clear from Table 1-2, in Examples 1 and 2, it was possible to obtain fluororesin sheets that were easy to handle without using glass fiber cloth, and it was confirmed that the physical properties and electrical properties were also good. [Industrial Applicability]
[0038] The fluororesin sheet of the present invention and a metal-clad fluororesin substrate comprising the same are useful for wiring substrates such as IoT devices and wearable devices that have low transmission loss even when using high frequencies such as millimeter waves, high-speed transmission FPCs, transceivers, high-speed communication boards, antenna boards, smartphones, smartwatches, communication base station antennas, collision sensors, distance sensors, sensors in train monitoring systems, satellite communication antennas, intersection inspection sensors, security image sensors, runway foreign object detection systems, and river water level monitoring sensors. [Explanation of symbols]
[0039] 1,4,9 Fluorine resin sheet 2,5 Fluoropolymers 3,6 Inorganic filler 7 Copper-clad fluororesin substrate 8a,8b copper foil 14,15 Press plate
Claims
1. A fluororesin sheet containing a fluoropolymer and an inorganic filler, The fluororesin sheet is a degreased sheet formed by laminating a plurality of sheets in the thickness direction through press molding, the fluoropolymer is oriented in a plane direction of the fluororesin sheet and entangles with the inorganic filler to coat the inorganic filler, The fluororesin sheet has a tensile strength of 6 MPa or more in both the length direction and the width direction, and a breaking elongation of 10% or more in both the length direction and the width direction, The fluororesin sheet has a thermal conductivity in the thickness direction of the fluororesin sheet of 0.3 to 10 W / m·K.
2. 2. The fluororesin sheet according to claim 1, wherein the fluoropolymer is at least one selected from the group consisting of polytetrafluoroethylene (PTFE), perfluoroalkoxyalkane polymer (PFA), and perfluoroethylenepropene copolymer (FEP).
3. 2. The fluororesin sheet according to claim 1, wherein the inorganic filler is at least one selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, aluminum nitride, boron nitride, silicon nitride, barium titanate, barium sulfate, and magnesium hydroxide.
4. 2. The fluororesin sheet according to claim 1, wherein the fluororesin sheet contains 100 to 1000 parts by volume of inorganic filler relative to 100 parts by volume of the fluororesin.
5. 2. The fluororesin sheet according to claim 1, wherein each particle of the inorganic filler has a D50:median diameter of 0.01 to 100 μm in cumulative particle size distribution on a volume basis as determined by a laser diffraction light scattering method.
6. 2. The fluororesin sheet according to claim 1, wherein the thickness of the fluororesin sheet is 0.05 to 10.0 mm.
7. The mass per unit area of the fluororesin sheet is 80 to 40,000 g / m 2 2. The fluororesin sheet according to claim 1, wherein
8. 2. The fluororesin sheet according to claim 1, wherein the fluororesin sheet can be adhered to a metal foil having a surface roughness Rz of 0.85 to 2.0, and the adhesive strength to the metal foil is a peel strength of up to 40 N / cm.
9. A metal-clad fluororesin substrate, comprising the fluororesin sheet according to any one of claims 1 to 8, and a metal foil laminated to at least one surface of the fluororesin sheet.
10. 10. The metal-clad fluororesin substrate according to claim 9, wherein the metal-clad fluororesin substrate has a dielectric loss tangent of 0.0001 to 0.003 at a frequency of 10 GHz.
11. 10. The metal-clad fluororesin substrate according to claim 9, wherein the metal-clad fluororesin substrate has a relative dielectric constant of 1.5 to 20 at a frequency of 10 GHz.
12. 10. The metal-clad fluororesin substrate according to claim 9, wherein the metal foil is a copper foil.
Citation Information
Patent Citations
Filler-containing fluororesin sheet
JP2008238828A
Method for producing filler-containing fluororesin sheet
JP2015077792A
Methods of manufacturing composite material sheet and thermally conductive sheet
JP2017141345A
Fluorine resin composition, and prepreg and copper-clad substrate using the same
JP2020050860A
Insulating resin material, insulating resin material with metal layer using the same, and wiring board
JP2021061406A