Adjusting read voltage levels based on number of programmed bits in a memory subsystem

Abstract

A target value for a programmed bit is established for each programming distribution of a set of programming distributions for a memory subsystem. A read voltage level is applied to determine a measured value of the programmed bit in one or more programming distributions of the set of programming distributions. The target value of the programmed bit is compared to the measured value of the programmed bit to determine a comparison result, and an action is performed in light of the comparison result.

Description

[Technical Field]

[0001] FIELD Embodiments of the present disclosure relate generally to memory subsystems, and more particularly to adjusting read voltage levels based on the number of programmed bits in a memory subsystem. [Background technology]

[0002] The memory subsystem may include one or more memory devices that store data. The memory devices may be, for example, non-volatile and volatile memory devices. In general, a host system may utilize the memory subsystem to store data in and retrieve data from the memory devices.

[0003] The present disclosure will be more fully understood from the detailed description provided below and from the accompanying drawings of various embodiments of the present disclosure, which, however, should not be construed as limiting the disclosure to particular embodiments, but are merely for purposes of illustration and understanding. [Brief explanation of the drawings]

[0004] [Figure 1] FIG. 1 illustrates an exemplary computing system including a memory subsystem in accordance with some embodiments of the present disclosure. [Figure 2] FIG. 10 is a flow diagram of an exemplary method for managing read voltage levels in view of a comparison of a measured value of a programmed bit in a programming distribution with a target value of the programmed bit in the programming distribution, according to some embodiments. [Figure 3] 1A-1C illustrate an exemplary set of programming distributions for an exemplary memory device having target values ​​for programmed bits established by a read level adjustment component, according to some embodiments. [Figure 4]1A-1C illustrate example circuit diagrams corresponding to example read level adjustment components and corresponding functionality, according to some embodiments. [Figure 5] 10 is a graph illustrating a plot of the number of programmed bits corresponding to the applied sensing voltage level, according to some embodiments. [Figure 6] 10 is a graph illustrating various techniques that may be used by a read level adjustment component to adjust and settle on a desired read voltage level in light of a comparison of a measured value of a programmed bit and a target value of the programmed bit. [Figure 7] FIG. 1 is a block diagram of an exemplary computer system in which implementations of the present disclosure can operate. DETAILED DESCRIPTION OF THE INVENTION

[0005] Aspects of the present disclosure are directed to adjusting read levels based on the number of programmed bits in a memory subsystem. The memory subsystem may be a storage device, a memory module, or a hybrid of a storage device and a memory module. Examples of storage devices and memory modules are described below in conjunction with FIG. 1. Generally, a host system may utilize a memory subsystem that includes one or more components, such as a memory device, that store data. The host system may provide data to be stored in the memory subsystem and may request data to be retrieved from the memory subsystem.

[0006] A memory subsystem may include multiple memory devices with one or more arrays of memory cells to store data. A cell is an electronic circuit that stores information. Depending on the cell type, a cell can store one or more bits of binary information and has various logical states that correlate to the number of bits stored. The logical states may be represented by binary values ​​such as "0" and "1," or combinations of such values. A memory device may be organized from bits arranged in a two-dimensional grid. Memory cells are etched onto a silicon wafer in an array of columns (hereinafter also referred to as bit lines) and rows (hereinafter also referred to as word lines). A word line may refer to one or more rows of memory cells in a memory device that are used in conjunction with one or more bit lines to generate the address of each memory cell. The intersection of a bit line and a word line constitutes the address of a memory cell. A block hereinafter refers to a unit of a memory device used to store data and may include a group of memory cells, a word line group, a word line, or an individual memory cell.

[0007] A memory device can store an amount of charge into a memory cell based on programming level voltages or threshold voltages (Vt) corresponding to multiple programming distributions associated with each data value. The memory device can read or determine the data value stored in the memory cell using read level voltages (also referred to as "read levels") corresponding to the threshold voltage for each programming distribution of the memory cell.

[0008] However, as memory cells undergo programming, sensing, and erase cycles over time, the threshold voltages corresponding to the programming distributions of the memory cells may change, which may result in erroneous reading of the memory cells, i.e., the determined state of the memory cells during a read operation performed on the memory cells may be a state other than the state to which the memory cells were programmed.

[0009] Aspects of the present disclosure address the above and other deficiencies by having a memory subsystem that includes a feedback system for dynamically adapting to changes in read level threshold voltages corresponding to the programming distributions of the memory subsystem. During the programming process, the system establishes a fixed or target ratio of programmed bits to erased bits (referred to herein as a "target ratio of programmed bits") for each programming distribution of the memory device. The target ratio of programmed bits may include a substantially equal number of programmed bits in each of the programming distributions. For example, for an MLC memory device with four programming distributions, the target ratio of programming bits for each distribution may be one-fourth.

[0010] During a read operation, a read voltage level associated with a distribution state is applied, and a summing function is performed to determine or measure a cumulative or total number of programmed bits corresponding to the applied read voltage level. The measured total number of programmed bits is used to identify a measured proportion of programmed bits, and the measured proportion is compared to a target proportion of programmed bits to generate a comparison result. The comparison result is used by the system as a signal to drive the applied read voltage level to the target read voltage level. For example, using the comparison result, the system can adjust (e.g., increase or decrease) the applied read voltage level to establish the target read voltage level for performing the read operation.

[0011] Advantageously, systems according to embodiments of the present disclosure eliminate the need to implement costly calibration algorithms to continuously predict read levels within a memory device. This results in a more efficient read path that results in an improved trigger rate (i.e., the rate at which device error correction fails and requires additional corrective reads to return the requested data). Furthermore, the target read levels corresponding to each programming distribution are individually adjusted to reflect the desired convergence based on the bit signal. Advantages of the present disclosure further include establishing optimal read values ​​for executing read operations without adding additional latency. Furthermore, read operations are internally calibrated within each read using a feedback system so that movements in read levels (e.g., due to disturb mechanisms) are tracked. Therefore, no additional calibration schemes are required to predict changes in threshold voltage levels due to wear or changes over time related to operation or environment.

[0012] 1 illustrates an exemplary computing system 100 including a memory subsystem 110 according to some embodiments of the present disclosure. Memory subsystem 110 may include media such as one or more volatile memory devices (e.g., memory device 140), one or more non-volatile memory devices (e.g., memory device 130), or a combination of the like.

[0013] The memory subsystem 110 can be a storage device, a memory module, or a hybrid of a storage device and a memory module. Examples of storage devices include solid-state drives (SSDs), flash drives, universal serial bus (USB) flash drives, embedded multimedia controller (eMMC) drives, universal flash storage (UFS) drives, secure digital (SD) cards, and hard disk drives (HDDs). Examples of memory modules include dual in-line memory modules (DIMMs), small outline DIMMs (SO-DIMMs), and various types of non-volatile dual in-line memory modules (NVDIMMs).

[0014] Computing system 100 may be a computing device such as a desktop computer, a laptop computer, a network server, a mobile device, a vehicle (e.g., an aircraft, drone, train, automobile, or other transportation), an Internet of Things (IoT) enabled device, an embedded computer (e.g., one contained in a vehicle, industrial equipment, or networked commercial device), or any such computing device that includes memory and processing devices.

[0015] Computing system 100 may include a host system 120 coupled to one or more memory subsystems 110. In some embodiments, host system 120 is coupled to different types of memory subsystems 110. Figure 1 illustrates an example of a host system 120 coupled to one memory subsystem 110. As used herein, "coupled to" or "coupled with" generally refers to a connection between components, which may be an indirect or direct communication connection (e.g., without intervening components), including a connection that is wired or wireless, electrical, optical, magnetic, etc.

[0016] Host system 120 may include a processor chipset and a software stack executed by the processor chipset. The processor chipset may include one or more cores, one or more caches, a memory controller (e.g., an NVDIMM controller), and a storage protocol controller (e.g., a PCIe controller, a SATA controller). Host system 120 uses memory subsystem 110, for example, to write data to and read data from memory subsystem 110.

[0017] The host system 120 may be coupled to the memory subsystem 110 via a physical host interface. Examples of physical host interfaces include, but are not limited to, a Serial Advanced Technology Attachment (SATA) interface, a Peripheral Component Interconnect Express (PCIe) interface, a Universal Serial Bus (USB) interface, Fibre Channel, Serial Attached SCSI (SAS), a Double Data Rate (DDR) memory bus, a Small Computer System Interface (SCSI), a Dual In-Line Memory Module (DIMM) interface (e.g., a DIMM socket interface supporting Double Data Rate (DDR)), etc. The physical host interface may be used to transmit data between the host system 120 and the memory subsystem 110. The host system 120 may further utilize an NVM Express (NVMe) interface to access components (e.g., memory device 130) when the memory subsystem 110 is coupled to the host system 120 via a PCIe interface. The physical host interface may provide an interface for passing control signals, address signals, data signals, and other signals between the memory subsystem 110 and the host system 120. 1 illustrates, by way of example, memory subsystem 110. In general, host system 120 may access multiple memory subsystems via the same communication connection, multiple separate communication connections, and / or a combination of communication connections.

[0018] The memory devices 130, 140 may include any combination of different types of non-volatile and / or volatile memory devices. The volatile memory devices (e.g., the memory device 140) may be random access memories (RAMs), such as, but not limited to, dynamic random access memories (DRAMs) and synchronous dynamic random access memories (SDRAMs).

[0019] Some examples of nonvolatile memory devices (e.g., memory device 130) include write-in-place memories such as non-and (NAND)-type flash memories and three-dimensional cross-point ("3D cross-point") memory devices, which are cross-point arrays of nonvolatile memory cells. Cross-point arrays of nonvolatile memory, in conjunction with stackable cross-grid data access arrays, can perform bit storage based on changes in bulk resistance. Additionally, in contrast to many flash-based memories, cross-point nonvolatile memories can perform write-in-place operations, where nonvolatile memory cells can be programmed without the nonvolatile memory cells being first erased. NAND-type flash memories include, for example, two-dimensional NAND (2D NAND) and three-dimensional NAND (3D NAND).

[0020] Each of the memory devices 130 may include one or more arrays of memory cells. One type of memory cell, for example, a single-level cell (SLC), can store one bit per cell. Other types of memory cells, such as multi-level cell (MLC), three-level cell (TLC), four-level cell (QLC), and five-level cell (PLC), can store multiple bits per cell. In some embodiments, each of the memory devices 130 may include one or more arrays of memory cells, such as SLC, MLC, TLC, QLC, or any combination of the like. In some embodiments, a particular memory device may include an SLC portion of memory cells, as well as an MLC portion, a TLC portion, a QLC portion, or a PLC portion. The memory cells of the memory devices 130 may be grouped into pages, which may refer to logical units of a memory device used to store data. In some types of memory (e.g., NAND), pages may be grouped to form blocks.

[0021] Although non-volatile memory components such as a 3D cross-point array of non-volatile memory cells and NAND-type flash memory (e.g., 2D NAND, 3D NAND) are described, the memory device 130 may be based on any other type of non-volatile memory, such as read-only memory (ROM), phase-change memory (PCM), self-sorting memory, other chalcogenide-based memory, ferroelectric transistor random access memory (FeTRAM), ferroelectric random access memory (FeRAM), magnetic random access memory (MRAM), spin-transfer torque (STT)-MRAM, conductive bridge RAM (CBRAM), resistive random access memory (RRAM), oxide-based RRAM (OxRAM), negative-or (NOR) flash memory, and electrically erasable programmable read-only memory (EEPROM).

[0022] Memory subsystem controller 115 (or controller 115 for brevity) can communicate with memory device 130 to perform operations such as reading data, writing data, or erasing data in memory device 130, and other such operations. Memory subsystem controller 115 may include hardware such as one or more integrated circuits and / or discrete components, buffer memory, or a combination thereof. The hardware may include digital circuitry having dedicated (i.e., hard-coded) logic to perform the operations described herein. Memory subsystem controller 115 may be a microcontroller, dedicated logic circuitry (e.g., a field programmable gate array (FPGA), application-specific integrated circuit (ASIC), etc.), or other suitable processor.

[0023] Memory subsystem controller 115 may be a processing device that includes one or more processors (e.g., processor 117) configured to execute instructions stored in local memory 119. In the illustrated example, local memory 119 of memory subsystem controller 115 includes embedded memory configured to store instructions for implementing various processes, operations, logic flows, and routines that control the operation of memory subsystem 110, including handling communications between memory subsystem 110 and host system 120.

[0024] In some embodiments, local memory 119 may include memory registers that store memory pointers, retrieved data, etc. Local memory 119 may also include read-only memory (ROM) for storing microcode. While the example memory subsystem 110 of FIG. 1 is shown including a memory subsystem controller 115, in other embodiments of the present disclosure, memory subsystem 110 may not include a memory subsystem controller 115 and instead rely on external control (e.g., provided by an external host or by a processor or controller separate from the memory subsystem).

[0025] In general, memory subsystem controller 115 can receive commands or operations from host system 120 and translate the commands or operations into instructions or appropriate commands to achieve the desired access to memory device 130. Memory subsystem controller 115 can be responsible for other operations, such as wear leveling operations, garbage collection operations, error detection and error correction code (ECC) operations, encryption operations, caching operations, and address translation between logical block addresses (e.g., logical block addresses (LBAs), namespaces) and physical block addresses (e.g., physical block addresses) associated with memory device 130. Memory subsystem controller 115 can further include host interface circuitry and communicate with host system 120 through this physical host interface. The host interface circuitry can translate commands received from the host system into command instructions for accessing memory device 130 and translate responses associated with memory device 130 into information for host system 120.

[0026] Memory subsystem 110 may also include additional circuits or components not shown. In some embodiments, memory subsystem 110 may include a cache or buffer (e.g., DRAM) and address circuitry (e.g., row and column decoders) that can receive addresses from memory subsystem controller 115 and decode the addresses to access memory device 130.

[0027] In some embodiments, memory device 130 includes a local media controller 135 that operates in conjunction with memory subsystem controller 115 to perform operations on one or more memory cells of memory device 130. An external controller (e.g., memory subsystem controller 115) can externally manage memory device 130 (e.g., perform media management operations on memory device 130). In some embodiments, memory device 130 is a managed memory device, which is a raw memory device combined with a local controller for media management (e.g., local controller 135) within the same memory device package. An example of a managed memory device is a managed NAND (MNAND) device.

[0028] The memory subsystem 110 includes a read level adjustment component 113 that can be used to adjust target read voltage level values ​​given the number of programmed bits (or bit lines) in each programming distribution of the memory device. In an embodiment, during a write or program process, the read level adjustment component 113 establishes a target value of programmed bits for each programming distribution state. In an embodiment, the target value is based on the ratio of programmed bits to erased bits for each programming distribution state of any type of memory subsystem (e.g., an SLC memory device, an MLC memory device, a QLC memory device, etc.). In one example, for an MLC memory subsystem having four programming distributions, the target value or ratio can be established so that each programming distribution includes one-quarter of the total number of programmed bits.

[0029] During a read operation, the read level adjustment component 113 applies an initial read voltage level to determine a measured value of the programmed bit in the programming distribution. In an embodiment, the measured value may be based on the ratio of programmed bits to erased bits for the programming distribution. The read level adjustment component 113 may perform a summing function to measure the number of programmed bits and the corresponding measured ratio of the programmed bits. The measured value of the programmed bit is compared to the target value of the programmed bit to determine a comparison result. In light of the comparison result, the read level adjustment component 113 performs a corresponding action. In an embodiment, if the comparison result indicates that the measured value of the programmed bit is substantially equal to the target value of the programmed bit (e.g., within a predetermined tolerance or range), the read level adjustment component 113 performs a read operation and reads data using the applied read voltage level. In an embodiment, if the comparison result indicates that the measured value of the programmed bit is greater than the target value of the programmed bit, the read level adjustment component 113 reduces the applied read voltage level to an adjusted read voltage level. In an embodiment, if the comparison result indicates that the measured value of the programmed bit is less than the target value of the programmed bit, the read level adjustment component 113 increases the applied read voltage level to an adjusted read voltage level. The read level adjustment component 113 can iteratively apply the adjusted read voltage level until the measured value of the programmed bit is substantially equal (e.g., within a tolerance or threshold) to the target value of the programmed bit.

[0030] 2 is a flow diagram of an exemplary method 200 for managing read voltage levels during a read operation to read data in a memory device. Method 200 may be performed by processing logic, which may include hardware (e.g., a processing device, circuitry, dedicated logic, programmable logic, microcode, device hardware, integrated circuit, etc.), software (e.g., instructions run or executed on a processing device), or a combination thereof. In some embodiments, method 200 is performed by read level adjustment component 113 of FIG. 1. Although shown in a particular sequence or order, unless otherwise noted, the order of processes may be modified. Therefore, the illustrated embodiments should be understood as merely examples, and the illustrated processes may be performed in a different order, and some processes may be performed in parallel. Additionally, one or more processes may be omitted in various embodiments. Therefore, not all processes are required in all embodiments. Other process flows are possible.

[0031] 2, in operation 210, processing logic establishes a target value of the programmed bits for each programming distribution of a set of programming distributions for the memory subsystem. In an embodiment, the target value of the programmed bits may be a ratio of programmed bits to erased bits for the programming distribution. In an embodiment, the target value of the programmed bits corresponding to each of the programming distributions may be established during programming time of the memory subsystem.

[0032] For example, for an MLC memory device having four programming distributions, the processing logic may establish target values ​​of the programmed bits such that each of the four programming distributions comprises one-quarter of the programmed bits. Figure 3 illustrates an example set of programming distributions 210 (e.g., programming distributions (PD)0, PD1, PD2, and PD3) for an example MLC memory device having target values ​​of the programmed bits established by the read level adjustment component 113 (e.g., by operation 210 of process 200 illustrated in Figure 2). As shown, during the programming process, target values ​​of the programmed bits for each of the programming distributions (PD0, PD1, PD2, and PD3) are established. In this example, each of the four programming distributions may be programmed to comprise one-quarter of the total number of programmed bits.

[0033] In operation 220, processing logic applies read voltage levels to determine measured values ​​of programmed bits corresponding to one or more programming distributions of the set of programming distributions. In an embodiment, the measured value may be a ratio of programmed bits to erased bits in the programming distribution. In an embodiment, the measured value may be determined by performing a summing function to sum or count the total number of programmed bit lines corresponding to the programming distribution. The application of read voltage levels and summing of the measured values ​​of programmed bits is described in more detail below with respect to FIG. 4. For example, as illustrated in FIG. 3, a read voltage level (RL2) may be applied to determine or measure the number of programmed bits of programming distribution 1 (PD1). As illustrated in FIG. 3, the target value of the programmed bits associated with PD1 is one-half the total number of programmed (e.g., readable) bits.

[0034] In operation 230, processing logic compares the target value of the programmed bits to the measured value of the programmed bits to determine a comparison result. In an embodiment, the comparison may be made between a target ratio of programmed bits to erased bits for the programming distribution and a measured ratio of programmed bits to erased bits for the programming distribution.

[0035] At operation 240, processing logic performs actions in light of the comparison results. In an embodiment, the actions may include performing a read operation using an applied read level voltage in response to determining that the comparison results indicate that the measured value of the programmed bit is substantially equal to the target value of the programmed bit. In an embodiment, the measured value of the programmed bit is determined to be substantially equal to the target value of the programmed bit if the two values ​​are equal or within a predetermined tolerance or range. In an embodiment, the actions may include decreasing the applied read voltage level to an adjusted read voltage level in response to determining that the comparison results indicate that the measured value of the programmed bit is greater than the target value of the programmed bit. In an embodiment, the actions may include increasing the applied read voltage level to an adjusted read voltage level in response to determining that the comparison results indicate that the measured value of the programmed bit is less than the target value of the programmed bit.

[0036] In an embodiment, operations 220, 230, and 240 may be performed iteratively, each time producing an adjusted read voltage level, which is applied to determine an updated measured value of the programmed bit (as in operation 220) to be compared with a target value of the programmed bit (as in operation 230) until the comparison indicates that the updated measured value of the programmed bit is substantially equal to the target value of the programmed bit.

[0037] FIG. 4 illustrates an example circuit diagram 400 corresponding to an example read level adjust component 113 of the present application. Read voltage levels are applied to word lines of a memory device 420, and a summing function 410 is performed to determine the number of programmed bit lines (e.g., BL1, BL2, BL3...BLN). The summed or accumulated value is used by the read level adjust component 113 to determine a measured value of the programmed bit (e.g., the number of programmed bit lines) and compare it to a target value for the programmed bit. At 430, the read voltage adjust component 113 can determine that the measured value of the programmed bit is substantially equal to the target value for the programmed bit. Based on the comparison result, the read voltage adjust component 113 performs a read operation at 435 using the applied read voltage levels.

[0038] In an embodiment, at 440, the read voltage adjustment component 113 may determine that the measured value of the programmed bit is greater than the target value of the programmed bit. Based on this comparison result, the read voltage adjustment component 113 reduces the applied read voltage level to an adjusted (reduced) read voltage level at 445. The adjusted read voltage level is fed back and applied to the word line at 420, and the summing operation is repeated to identify an updated measured value of the programmed bit.

[0039] In an embodiment, at 450, the read voltage adjustment component 113 may determine that the measured value of the programmed bit is less than the target value of the programmed bit. Based on this comparison result, the read voltage adjustment component 113 increases the applied read voltage level to an adjusted (decreased) read voltage level at 455. The adjusted read voltage level is fed back and applied to the word line at 420, and the summing function is repeated to identify an updated measured value of the programmed bit.

[0040] FIG. 5 is a graph illustrating a plot of the number of programmed bits in an independent bit line setup with respect to a common applied measurement voltage. As shown, a read voltage level adjustment component can use the comparison result to drive the read threshold levels (e.g., RL1, RL2, and RL3) to values ​​where the measured programmed bit values ​​are substantially equal to the target programmed bit values. As shown, the target programmed bit values ​​(or target programmed bit levels) are established and correspond to valleys between adjacent programming distributions. Advantageously, by taking action in light of the comparison result, the applied read voltage levels can be adjusted to determine when the target programmed bit values ​​are achieved. In the example illustrated in FIG. 5, the target programmed bit level for RL1 is one-quarter of the total programmed bits, the target programmed bit level for RL2 is one-half of the total programmed bits, and the target programmed bit level for RL3 is three-quarters of the total programmed bits.

[0041] 6 is a graph illustrating various techniques that may be used by the read level adjust component to adjust and settle on a desired read voltage level (e.g., a read voltage level that produces a measured value of a programmed bit that is substantially equal to a target value of the programmed bit). As illustrated in FIG. 6, in an embodiment, the read level adjust component adjusts the read voltage level applied to the word line by lamp In one embodiment, the read voltage level may be overdriven by a read level adjustment component to overshoot or saturate the read voltage level and then back off from saturation to determine a desired read voltage level (e.g., a read voltage level that causes the measured value of the programmed bit to be substantially equal to the target value of the programmed bit). In another embodiment, the read level adjustment component may adjust the read voltage level to approach a convergence point without overdriving (e.g., underdamping), depending on the characteristics of the memory device and the feedback system described above.

[0042] According to embodiments of the present application, setting the read voltage level in view of a target number of programmed bits allows significant common mode rejection of disturb mechanisms such as changes in array conditions from the programmed state (e.g., transient VT), read disturb, program disturb, data retention, thermal compensation, etc. In particular, the systems and methods described herein are useful for addressing expected charge loss for replacement gate memory devices (e.g., NAND devices).

[0043] Additionally, the read voltage adjustment component and corresponding functionality reduces chip complexity and time to market by allowing for dynamic adjustment and internal monitoring of read voltage levels. Thus, memory devices including read voltage adjustment components employ internal signals to determine optimized or desired read points. This allows the memory device to dynamically adapt to shifted or disturbed data.

[0044] Advantageously, to read the intermediate state, the memory device may conform to or be driven to the target value of the programmed bit and latch on read. The systems and methods described herein compensate for the difference in placement and return the correct data. In addition, the read retry path is shortened by the read level adjustment component because an internally provided signal is actively used to determine the valley location (e.g., mitigating the need to perform a second read in response to an inaccurate initial read level offset). Therefore, no specific offset for data retention or cross temperature is required.

[0045] Additionally, the systems and methods described herein remove the constraint on placement distribution at the same point for all word lines. Because the read process keyes off internal signals as control input data, large variations in valley locations can be targeted without adversely affecting trigger rates. This creates additional flexibility when creating read window budgets. In embodiments, read voltage levels can be adjusted specifically for each memory cell being read.

[0046] 7 illustrates an exemplary machine, computer system 700, within which a set of instructions may be executed to cause the machine to perform any one or more of the methodologies discussed herein. In some embodiments, computer system 700 may correspond to a host system (e.g., host system 120 of FIG. 1 ) that includes, is coupled to, or utilizes a memory subsystem (e.g., memory subsystem 110 of FIG. 1 ) or may be used to perform operations of a controller (e.g., to run an operating system to perform operations corresponding to read level adjust component 113 of FIG. 1 ). In alternative embodiments, the machine may be connected (e.g., networked) to other machines within a LAN, an intranet, an extranet, and / or the Internet. The machine may operate in the capacity of a server or client machine in a client-server network environment, as a peer machine in a peer-to-peer (or distributed) network environment, or as a server or client machine in a cloud computing infrastructure or environment.

[0047] The machine may be a personal computer (PC), tablet PC, set-top box (STB), personal digital assistant (PDA), cell phone, web appliance, server, network router, switch or bridge, digital or non-digital circuit, or any machine capable of executing (sequentially or otherwise) a set of instructions that specify actions to be taken by that machine. Further, while a single machine is shown, the term "machine" shall also be considered to include any collection of machines that individually or collectively execute a set of instructions (or multiple sets) to perform any one or more of the methodologies discussed herein.

[0048] The exemplary computer system 700 includes a processing device 702, a main memory 704 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM), etc.), a static memory 706 (e.g., flash memory, static random access memory (SRAM), etc.), and a data storage system 718, which communicate with each other via a bus 730.

[0049] Processing device 702 represents one or more general-purpose processing devices, such as a microprocessor, central processing unit, or the like. More specifically, the processing device may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets or a processor implementing a combination of instruction sets. Processing device 702 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), a network processor, or the like. Processing device 702 is configured to execute instructions 726 to perform the operations and steps discussed herein. Computer system 700 may further include a network interface device 708 for communicating over a network 720.

[0050] Data storage system 718 may include a machine-readable storage medium 724 (also known as a computer-readable medium) on which is stored one or more sets of instructions 726, or software embodying any one or more of the methodologies or functions described herein. The instructions 726 may also reside, completely or at least partially, within main memory 704 and / or within processing device 702 during execution thereof by computer system 700, with main memory 704 and processing device 702 also constituting machine-readable storage media. The machine-readable storage medium 724, data storage system 718, and / or main memory 704 may correspond to memory subsystem 110 of FIG. 1.

[0051] In one embodiment, instructions 726 include instructions for implementing functionality corresponding to a data protection component (e.g., read level adjustment component 113 of FIG. 1 ). While machine-readable storage medium 724 is shown to be a single medium in the exemplary embodiment, the term “machine-readable storage medium” shall be considered to include a single medium or multiple media that store one or more sets of instructions. The term “machine-readable storage medium” shall also be considered to include any medium that can store or encode a set of instructions for execution by a machine and that cause a machine to perform any one or more of the methodologies of the present disclosure. The term “machine-readable storage medium” shall therefore be considered to include, but is not limited to, solid-state memory, optical media, and magnetic media.

[0052] Some portions of the preceding detailed descriptions are presented in terms of algorithms and symbolic representations of operations on data bits within a computer memory. These algorithmic descriptions and representations are the means used by those skilled in the data processing arts to most effectively convey the substance of their work to others skilled in the art. An algorithm is here, and generally, conceived to be a self-consistent sequence of operations leading to a desired result. The operations require physical manipulations of physical quantities. Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, combined, compared, and otherwise manipulated. It has proven convenient at times, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.

[0053] It should be borne in mind, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities. This disclosure may refer to the actions and processes of a computer system, or similar electronic computing device, that manipulate and transform data represented as physical (electronic) quantities in the computer system's registers and memory into other data that are similarly represented as physical quantities in the computer system's memory or registers or other such information storage systems.

[0054] The present disclosure also relates to an apparatus for performing the operations herein. This apparatus may be specially constructed for the intended purposes, or it may comprise a general-purpose computer selectively activated or reconfigured by a computer program stored in the computer. Such a computer program may be stored on a computer-readable storage medium such as any type of disk, including, but not limited to, floppy disk, optical disk, CD-ROM, and magneto-optical disk, read-only memory (ROM), random access memory (RAM), EPROM, EEPROM, magnetic or optical card, or any type of medium suitable for storing electronic instructions, each of which is coupled to a computer system bus.

[0055] The algorithms and displays presented herein are not inherently related to any particular computer or other apparatus. Various general-purpose systems can be used with programs in accordance with the teachings herein, or it may prove convenient to construct more specialized apparatus to perform the methods. The structure of a variety of these systems appears to be set forth in the description that follows. Additionally, the present disclosure is not described with reference to any particular programming language. It will be understood that a variety of programming languages ​​can be used to implement the teachings of the present disclosure as described herein.

[0056] The present disclosure may be provided as a computer program product, or software, which may include a machine-readable medium having stored thereon instructions that can be used to program a computer system (or other electronic device) to perform a process according to the present disclosure. A machine-readable medium includes any mechanism for storing information in a form readable by a machine (e.g., a computer). In some embodiments, the machine-readable (e.g., computer-readable) medium includes a machine- (e.g., computer-) readable storage medium, such as read-only memory ("ROM"), random access memory ("RAM"), magnetic disk storage media, optical storage media, flash memory components, and the like.

[0057] In the foregoing specification, embodiments of the present disclosure have been described with reference to specific exemplary embodiments thereof. It will be apparent that various modifications may be made thereto without departing from the broad spirit and scope of the embodiments of the present disclosure as set forth in the following claims. The specification and drawings are, therefore, to be regarded in an illustrative rather than a restrictive sense.

Claims

1. a first operation of establishing, by a processing device, a target value of a programmed bit for each programming distribution of a set of programming distributions for a memory subsystem; a second operation of determining, prior to performing each read operation that reads data from a memory cell in the memory subsystem, a measurement of a programmed bit in one or more of the set of programming distributions based on a first read voltage level; a third operation of comparing the target value of the programmed bit with the measured value of the programmed bit to determine a comparison result; a fourth operation of adjusting the first read voltage level according to the comparison to generate an adjusted read voltage level; a fifth operation of performing the read operation using the adjusted read voltage level; Including, if the comparison result in the third operation indicates that the measured value of the programmed bit is not substantially equal to the target value of the programmed bit, then repeatedly performing the second operation, the third operation, and the fourth operation to generate the further comparison result until a further comparison result indicates that the measured value of the programmed bit is substantially equal to the target value of the programmed bit. method.

2. 2. The method of claim 1, wherein the comparison result indicates that the measured value of a programmed bit is substantially equal to the target value of a programmed bit, and the read operation is performed using the first read voltage level as the adjusted read voltage level.

3. 2. The method of claim 1, wherein the comparison result indicates that the measured value of a programmed bit is greater than the target value of a programmed bit, and the adjusted read voltage level is produced by decreasing the first read voltage level.

4. 2. The method of claim 1, wherein the comparison result indicates the measured value of a programmed bit is less than the target value of a programmed bit, and the adjusted read voltage level is generated by increasing the first read voltage level.

5. 2. The method of claim 1, wherein the target value of programmed bits for a first programming distribution comprises a target ratio of a first number of programmed bits in the first programming distribution to a second number of erased bits.

6. 10. The method of claim 1, wherein a summing function is performed to determine a total number of programmed bits corresponding to the one or more programming distributions given the first read voltage level.

7. A non-transitory computer-readable medium containing instructions, The instructions, when executed by a processing device, cause the processing device to: a first operation of establishing target values ​​of programmed bits for a set of programming distributions of a memory subsystem, the target values ​​of programmed bits being established such that a number of programmed bits for each programming distribution of the set of programming distributions is equal to one another; a second operation of performing a summing function to determine a cumulative total number of programmed bits in one or more programming distributions corresponding to a first read voltage level before performing each read operation that reads data from memory cells in the memory subsystem; a third operation of determining a measure of programmed bits in view of the cumulative total number of programmed bits; a fourth operation of comparing the target value of the programmed bit with the measured value of the programmed bit to determine a comparison result; a fifth operation of adjusting the first read voltage level according to the comparison to generate an adjusted read voltage level; a sixth operation of setting the adjusted read voltage level; a seventh operation of applying the adjusted read voltage level to a word line portion of the memory subsystem to perform the read operation; and performing an operation including if the comparison result in the fourth operation indicates that the measured value of the programmed bit is not substantially equal to the target value of the programmed bit, then repeatedly performing the second operation, the third operation, the fourth operation, and the fifth operation to generate the further comparison result until a further comparison result indicates that the measured value of the programmed bit is substantially equal to the target value of the programmed bit. Non-transitory computer-readable medium.

8. 8. The non-transitory computer-readable medium of claim 7, wherein in response to the comparison result indicating that the measured value of a programmed bit is greater than the target value of a programmed bit, the adjusted read voltage level is generated by decreasing the first read voltage level.

9. 8. The non-transitory computer-readable medium of claim 7, wherein in response to the comparison result indicating that the measured value of a programmed bit is less than the target value of a programmed bit, the adjusted read voltage level is generated by increasing the first read voltage level.

10. The operation is determining an updated measured ratio of programmed bits to erased bits in view of the updated cumulative total number of programmed bits corresponding to the adjusted read voltage level; performing the read operation in response to determining that the updated measured ratio of programmed bits to erased bits is substantially equal to a target ratio of programmed bits to erased bits; The non-transitory computer-readable medium of claim 7 further comprising:

11. 8. The non-transitory computer-readable medium of claim 7, wherein the target value of programmed bits for a first programming distribution comprises a target ratio of a first number of programmed bits in the first programming distribution to a second number of erased bits.

12. a memory device; a processing device operatively coupled to the memory device; A system comprising: the processing device a first operation of establishing a target value of a programmed bit for each programming distribution of a set of programming distributions for a memory subsystem; a second operation of determining, prior to performing each read operation that reads data from a memory cell in the memory subsystem, a measurement of a programmed bit in one or more of the set of programming distributions based on a first read voltage level; a third operation of comparing the target value of the programmed bit with the measured value of the programmed bit to determine a comparison result; a fourth operation of adjusting the first read voltage level according to the comparison to generate an adjusted read voltage level; a fifth operation of performing the read operation using the adjusted read voltage level; and performing an operation including if the comparison result in the third operation indicates that the measured value of the programmed bit is not substantially equal to the target value of the programmed bit, then repeatedly performing the second operation, the third operation, and the fourth operation to generate the further comparison result until a further comparison result indicates that the measured value of the programmed bit is substantially equal to the target value of the programmed bit. system.

13. 13. The system of claim 12, wherein the comparison result indicates that the measured value of the programmed bit is substantially equal to the target value of the programmed bit, and the read operation is performed using the first read voltage level as the adjusted read voltage level.

14. 13. The system of claim 12, wherein the comparison result indicates the measured value of the programmed bit is greater than the target value of the programmed bit, and the adjusted read voltage level is produced by decreasing the first read voltage level.

15. 13. The system of claim 12, wherein the comparison result indicates the measured value of the programmed bit is less than the target value of the programmed bit, and the adjusted read voltage level is produced by increasing the first read voltage level.

16. 13. The system of claim 12, wherein the target value of programmed bits for a first programming distribution comprises a target ratio of a first number of programmed bits in the first programming distribution to a second number of erased bits.

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