Electronic control device and method for manufacturing the electronic control device

Abstract

To provide an electronic control device and a manufacturing method thereof that can suppress the overflow of an adhesive while enabling the application of the adhesive using a one-stroke writing route as an application route.SOLUTION: In an electronic control device and a manufacturing method thereof according to the present invention, in the electronic control device in which a circuit board is housed in a housing consisting of a case and a cover, the case has a groove portion to which an adhesive is applied, the groove portion forms a one-stroke writing path that passes around the periphery of the case and around the screw in a one-stroke writing manner, and the groove depth of the two-pass groove portion of the groove portion that passes twice in the one-stroke writing path is made deeper than the groove depth of the one-pass passage groove portion that passes once in the one-stroke writing path of the groove portion.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an electronic control device in which a circuit board is housed in a housing made up of a case and a cover, and to a method for manufacturing the same. [Background technology]

[0002] The electronic control device disclosed in Patent Document 1 is an electronic control device in which a circuit board is housed in a housing formed by a first case and a second case, with a protrusion formed on the periphery of the second case being pressed into a groove formed on the periphery of the first case via a sealing material, and the groove is formed so that a pair of groove side surfaces opposing each other via a groove bottom surface are inclined so that they move away from each other the further they are from the groove bottom surface, and the groove bottom surface is provided with a plurality of through holes communicating with the outside, and the groove bottom surface is formed so that the groove depth becomes shallower the further it is from the through holes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6347194 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the case of an electronic control device in which a circuit board is housed in a housing consisting of a case and a cover, and the case and cover are joined with adhesive, if the adhesive can be applied using a single-stroke path as the application path, the adhesive application work can be carried out efficiently. However, in a single-stroke path that passes along the periphery of the case and around the screws that connect the case and cover, The adhesive It is supposed to be applied twice in parts. , in areas where it is applied twice The amount of coating increases. Therefore, in the adhesive application process, which uses a single-stroke application path, the adhesive is applied twice.There was a problem that the adhesive would overflow from the part, and the overflowing adhesive would adhere to the circuit board, shortening the life of the solder, and the overflowing adhesive would also stain the appearance of the housing.

[0005] The present invention has been made in view of the conventional situation, and its object is to provide a method for applying adhesive in a single stroke. process While enabling The coating process The present invention provides an electronic control device and a method for manufacturing the same, which can prevent adhesive from spilling out from a portion where the adhesive is applied twice. [Means for solving the problem]

[0006] According to one aspect of the electronic control device of the present invention, there is provided an electronic control device in which a circuit board is housed in a housing made up of a case and a cover, the case and the cover being joined together with an adhesive and screws, the case having grooves to which the adhesive is applied, the grooves forming a unicursal path that passes around the periphery of the case and the periphery of the screws in a unicursal manner, the groove depth of a two-pass groove portion that passes twice in the unicursal path being twice the application height of the adhesive, and the groove depth of a one-pass groove portion that passes once in the unicursal path being twice the application height of the adhesive The upper surface of the adhesive applied inside the one-pass groove portion and the upper surface of the adhesive applied inside the two-pass groove portion are set to the same height.

[0007] Furthermore, according to one aspect of the method for manufacturing an electronic control device of the present invention, a method for manufacturing an electronic control device in which a circuit board is housed in a housing in which a case and a cover are joined with an adhesive and screws includes a groove forming step of forming grooves in the case, the grooves forming a unicursal path that passes around the periphery of the case and the periphery of the screws in a single stroke, and the grooves are formed so that a two-pass groove portion that passes twice in the unicursal path has a groove depth that is twice the groove depth of a one-pass groove portion that passes once in the unicursal path; and an adhesive application step of applying the adhesive to the inside of the grooves, the adhesive being applied to the inside of the grooves along the unicursal application path to a height equal to the groove depth of the one-pass groove portion, and the adhesive being applied to the two-pass groove portion twice, and the adhesive being applied to the one-pass groove portion once. By doing so, the upper surface of the adhesive applied to the inside of the one-time-passage groove portion and the upper surface of the adhesive applied to the inside of the two-time-passage groove portion are made to be at the same height. The method includes the application step, an assembly step of assembling the case and the cover by pressing the peripheral portion of the cover into the groove of the case, and a fixing step of fixing the cover to the case with the screw. [Effects of the Invention]

[0008] According to the present invention, adhesive is applied using a single-stroke path. process While enabling The coating process This can prevent adhesive from overflowing from areas where adhesive is applied twice. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is an exploded perspective view of the electronic control device. [Figure 2] FIG. 2 is an external perspective view of the electronic control device. [Figure 3] FIG. [Figure 4] FIG. [Figure 5] FIG. 4 is an enlarged view of region B in FIG. [Figure 6] FIG. 5 is an enlarged view of region C in FIG. [Figure 7]FIG. 5 is an enlarged view of region C in FIG. 4, showing a single-stroke path (application path). [Figure 8] 6 is a cross-sectional view taken along the line AA in FIG. 5. [Figure 9] 6 is a cross-sectional view taken along the line AA in FIG. 5, illustrating a first application state to a two-passage groove portion. [Figure 10] 6 is a cross-sectional view taken along the line AA in FIG. 5, illustrating a second application state to the double-passage groove portion. [Figure 11] 6 is a cross-sectional view taken along line AA in FIG. 5, showing a state in which the cover is fixed to the case. [Figure 12] FIG. 5 is an enlarged view of region C in FIG. 4, showing a case where slopes are provided in two places. [Figure 13] FIG. 5 is an enlarged view of region C in FIG. 4, showing a case where the direction of the slope of the slope is changed. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic control device and a manufacturing method thereof according to the present invention will be described below with reference to the drawings. The electronic control device in the following embodiment is applied to, for example, an electrically controlled brake of an automobile.

[0011] FIG. 1 is an exploded perspective view showing one embodiment of an electronic control device 100, and FIG. 2 is a perspective view showing the exterior of the assembled electronic control device 100. As shown in FIG. The electronic control device 100 comprises a cover 200 , a circuit board 300 , a bus bar assembly 400 , a heat dissipation sheet 500 , and a case 600 .

[0012] The case 600 and the cover 200 form a housing 700 that houses the circuit board 300 and other components therein. For example, the cover 200 is made by press-cutting a pre-plated steel sheet, and the case 600 is made of aluminum die-cast.

[0013] The case 600 has four female threads 610 into which male threads 800 for fixing the cover 200 are threaded, and grooves 620 into which waterproof adhesive is applied are formed around the periphery of the case 600 and around the female threads 610 (groove forming process). When assembling and manufacturing the electronic control device 100, after applying a waterproof adhesive to the groove portion 620 of the case 600 (application process), the busbar assembly 400 is placed on the case 600, and the male screw 900 is tightened into the case 600 through the through hole provided in the busbar assembly 400, thereby fixing the busbar assembly 400 to the case 600.

[0014] The circuit board 300 is then snap-fit ​​onto the bus bar assembly 400 having the connector 410 . Thereafter, the cover 200 is assembled to the case 600 by pushing the peripheral edge of the cover 200 into the groove 620 (assembly process), and the four male screws 800 are tightened into the respective female screws 610 to fix the cover 200 to the case 600 (fixing process).

[0015] The waterproof adhesive is a thermosetting adhesive, and after the male thread 800 is tightened into the female thread 610 to fix the cover 200 to the case 600, the electronic control device 100 is placed in a thermosetting oven to harden the waterproof adhesive (hardening process). Because the cover 200 is manufactured by press-cutting a pre-plated steel plate, the edges are not plated and are prone to rust. Therefore, the periphery of the cover 200 is protected with a waterproof adhesive to prevent the cover 200 from rusting.

[0016] Next, the groove 620 formed in the case 600 will be described in detail. Figure 3 is a top view of the electronic control device 100, Figure 4 is a top view of the case 600, Figure 5 is a partially enlarged view of the top of the electronic control device 100 (enlarged view of area B in Figure 3), and Figure 6 is a partially enlarged view of the top of the case 600 (enlarged view of area C in Figure 4).

[0017] The groove portion 620 consists of a case peripheral groove portion 621 provided along the periphery of the case 600 and a thread peripheral groove portion 622 provided so as to surround the female thread 610, and the thread peripheral groove portion 622 is formed so as to partially overlap with the case peripheral groove portion 621. The groove 620, which is made up of the case peripheral groove 621 and the thread peripheral groove 622, forms a unicursal path that passes around the periphery of the case 600 and the periphery of the female thread 610 in a unicursal manner.

[0018] FIG. 7 is a diagram showing a unicursal path formed by the groove 620 around the female thread 610. The single-stroke path shown in Figure 7 travels through case peripheral groove 621 from left to right in Figure 7, passes through the overlapping portion of thread peripheral groove 622 and case peripheral groove 621, then travels around female thread 610 along thread peripheral groove 622, then passes through the overlapping portion of thread peripheral groove 622 and case peripheral groove 621 again, and continues through case peripheral groove 621.

[0019] As described above, in the unicursal path formed by the groove 620, the thread circumferential groove 622 and the case circumferential groove 621 pass through the overlapping portion twice, and pass through the other portions once. In the following, the portion where the screw peripheral groove portion 622 and the case peripheral groove portion 621 overlap and pass twice in the unicursal path will be referred to as the two-pass groove portion 623, and the case peripheral groove portion 621 and the screw peripheral groove portion 622 excluding the two-pass groove portion 623, which pass only once in the unicursal path, will be referred to as the one-pass groove portion 624.

[0020] Here, the waterproof adhesive can be applied to the groove 620 using the unicursal path formed by the groove 620 as an application path. Furthermore, the groove width of the one-pass groove portion 624 and the groove width of the two-pass groove portion 623 are made the same, in other words, the groove width of groove portion 620 is made the same throughout, and when the application path is a single-stroke path, the application height of the waterproof adhesive is the same for the one-pass groove portion 624 and the two-pass groove portion 623.

[0021] If the above-mentioned single-stroke path is used as the application path, the waterproof adhesive will be applied only once to the one-pass groove portion 624, whereas the waterproof adhesive will be applied twice to the two-pass groove portion 623. Therefore, if the groove depth of groove portion 620 is kept constant throughout to match the application height of the waterproof adhesive, in double-pass groove portion 623 where the waterproof adhesive is applied twice, the waterproof adhesive may overflow from the opening edge of groove portion 620.

[0022] Furthermore, the waterproof adhesive that spills out from the opening edge of the groove portion 620 may adhere to the circuit board 300, shortening the lifespan of the solder and possibly soiling the appearance of the housing 700 (case 600 and / or cover 200). Therefore, rather than making the groove depth of groove portion 620 the same over the entire area, the groove depth of double-pass groove portion 623, which passes through twice in a single-stroke path, i.e., which is applied twice when the single-stroke path is used as the application path, is made deeper than the groove depth of single-pass groove portion 624.

[0023] FIG. 8 is a cross-sectional view of the case 600 taken along line AA in FIG. 5, showing the difference in groove depth between the single-pass groove portion 624 and the double-pass groove portion 623. In FIG. In other words, the groove bottom surface of the two-pass groove portion 623 is one step lower than the groove bottom surface of the one-pass groove portion 624, and the groove bottom surface of the groove portion 620 is formed to have a depression 625 (recessed portion) in the area of ​​the two-pass groove portion 623.

[0024] In this way, by making the groove depth of the two-pass groove portion 623 deeper than the groove depth of the one-pass groove portion 624, when the waterproof adhesive is applied using a single-stroke path as the application path, even if the waterproof adhesive is applied to the two-pass groove portion 623 twice, the waterproof adhesive can be prevented from overflowing from the two-pass groove portion 623. Here, for example, when the groove depth of the single-pass groove portion 624 is the application height H of the waterproof adhesive, the depth of the depression 625 of the double-pass groove portion 623 is set to the application height H, and the groove depth of the double-pass groove portion 623 is set to twice the application height H.

[0025] FIG. 9 shows a state in which the waterproof adhesive 626 is filled into the depression 625 after the first application of the waterproof adhesive to the two-passage groove portion 623. When the waterproof adhesive 626 is applied to the two-pass groove portion 623 for the first time, the waterproof adhesive 626 fills the depression 625, and if the upper surface of the waterproof adhesive 626 in this state is the bottom surface of the groove, the groove depth of the two-pass groove portion 623 when the waterproof adhesive 626 is applied again will be equal to the groove depth of the one-pass groove portion 624 (in other words, the application height H).

[0026] Figure 10 shows the state after the waterproof adhesive 626 has been applied to the two-pass groove portion 623 for the first time, the waterproof adhesive 626 has been applied to the thread periphery groove portion 622 (one-pass groove portion 624), and then the waterproof adhesive 626 has been applied to the two-pass groove portion 623 for the second time. The second application of waterproof adhesive to the two-pass groove portion 623 is applied on top of the waterproof adhesive 626 applied the first time, and the groove depth of the two-pass groove portion 623 is set to twice the application height H of the waterproof adhesive.

[0027] Therefore, when the waterproof adhesive is applied to the groove portion 620 using a single stroke as the application path, the upper surface of the waterproof adhesive 626 applied twice to the two-pass groove portion 623 will be at approximately the same height as the upper surface of the waterproof adhesive 626 applied to the one-pass groove portion 624, thereby preventing the waterproof adhesive 626 from overflowing from the two-pass groove portion 623. This can prevent the waterproof adhesive from adhering to the circuit board 300 and the housing 700 from becoming dirty with the waterproof adhesive.

[0028] FIG. 11 shows a state in which the cover 200 is assembled to the case 600 and further fixed to the case 600 with male screws 800 . When the cover 200 is assembled to the case 600, the peripheral edge of the cover 200, i.e., the part that is not plated and is prone to rust, is pressed into the waterproof adhesive 626 applied to the groove 620, and the peripheral edge of the cover 200 is protected by the waterproof adhesive 626.

[0029] Here, waterproof adhesive 626 is applied to groove 620 including double-pass groove 623 to a substantially uniform height, so that waterproof adhesive 626 is prevented from spilling out of groove 620 . In other words, by applying the waterproof adhesive to the groove portion 620 using a single stroke as the application path, the application work can be simplified while preventing the waterproof adhesive from spilling out of the groove portion 620, thereby preventing the waterproof adhesive from adhering to the circuit board 300 and the waterproof adhesive from contaminating the housing 700.

[0030] However, if a recess 625 is provided in the groove bottom surface of the two-pass groove portion 623 and the groove depth of the two-pass groove portion 623 is made deeper than the groove depth of the one-pass groove portion 624, a step will occur at the boundary between the groove bottom surface of the one-pass groove portion 624 (case peripheral groove portion 621 and thread peripheral groove portion 622) and the groove bottom surface of the two-pass groove portion 623 (recess 625). Furthermore, if there is a steep step on the bottom surface of groove portion 620, when waterproof adhesive is applied to groove portion 620, there is a possibility that air bubbles will remain in the step portion, for example, in the corner between the rising surface and the bottom surface of the groove.

[0031] Therefore, slopes 627a, 627b, 627c, and 627d are provided at four boundary points between the groove bottom of the one-time passage groove portion 624 and the groove bottom of the two-time passage groove portion 623 (recess 625) to smooth out the steps (see FIG. 6). The first slope 627a is a slope provided at the step in the application path from the case peripheral groove 621 to the recess 625, and is formed so as to slope gently downward along the application path (from the case peripheral groove 621 to the recess 625).

[0032] In addition, the second slope 627b is a slope provided at the step in the application path from the recess 625 to the screw circumferential groove portion 622, and is formed so as to be a gentle uphill slope along the application path (from the recess 625 to the screw circumferential groove portion 622) (see Figures 8 to 11). In addition, the third slope 627c is a slope provided at the step in the application path from the screw circumferential groove portion 622 to the recess 625, and is formed so as to be a gentle downward slope along the application path (from the screw circumferential groove portion 622 to the recess 625).

[0033] Furthermore, the fourth slope 627d is a slope provided at the step in the application path from the recess 625 to the case peripheral groove portion 621, and is formed so as to be a gentle uphill slope along the application path (from the recess 625 to the case peripheral groove portion 621). In this way, if slopes 627a, 627b, 627c, 627d are provided at the boundary between the groove bottom surface of single-pass groove portion 624 and the groove bottom surface of double-pass groove portion 623 (recess 625), it is possible to prevent air bubbles from being mixed into the waterproof adhesive.

[0034] FIG. 12 shows an embodiment in which the number of locations where slopes are provided is reduced, and in comparison with the configuration of FIG. 6, third slope 627c and fourth slope 627d are omitted, and first slope 627a and second slope 627b are provided. Even if the location where the third slope 627c is provided in Figure 6 is a steep step, the waterproof adhesive fills the recess 625 during the first application to the two-pass groove portion 623, so that the upper surface of the waterproof adhesive applied to the recess 625 and the groove bottom surface of the thread periphery groove portion 622 are approximately flat with a sufficiently small step.

[0035] Similarly, even if the location where the fourth slope 627d is provided in Figure 6 is a steep step, the waterproof adhesive fills the recess 625 during the first application to the two-pass groove portion 623, so that the upper surface of the waterproof adhesive applied to the recess 625 and the bottom surface of the groove of the case peripheral groove portion 621 are approximately flat with a sufficiently small step. In addition, where the third slope 627c and the fourth slope 627d shown in FIG. 6 are provided, the waterproof adhesive is applied in a flat state without any steps.

[0036] Therefore, even if the third slope 627c and the fourth slope 627d shown in FIG. 6 are omitted, it is possible to prevent the inclusion of air bubbles. On the other hand, the locations where the first slope 627a and the second slope 627b are provided are locations where the bottom surface of the groove passes through with a step, so if a slope to smooth out the step is not provided, there is a possibility that air bubbles will get mixed in. Therefore, even if the third slope 627c and the fourth slope 627d shown in FIG. 6 are omitted, the presence of the first slope 627a and the second slope 627b can prevent the inclusion of air bubbles.

[0037] FIG. 13 shows a configuration in which first to fourth slopes 627a, 627b, 627c, and 627d are provided in groove portion 620, and the inclined surfaces of second slope 627b and third slope 627c are provided along the application path. The second slope 627b and the third slope 627c shown in FIG. 6 form an inclined surface that ascends or descends in a direction perpendicular to the direction in which the two-passage groove portion 623 extends.

[0038] However, when the application path passes through the portion where the second slope 627b and the third slope 627c are provided, the application path does not bend at a right angle, but rather gradually changes direction to draw an arc. Therefore, the slope surfaces of the second slope 627b and the third slope 627c are provided at an angle to the direction perpendicular to the direction in which the two-pass groove portion 623 extends so as to form an inclined surface that ascends or descends along the direction in which the application path travels. Of the first to fourth slopes 627a, 627b, 627c, and 627d shown in FIG. 13, the third slope 627c and the fourth slope 627d may be omitted, and the portion where the third slope 627c and the fourth slope 627d are provided may be made into a steep step portion.

[0039] The technical ideas explained in the above embodiments can be used in appropriate combinations as long as no contradiction occurs. Furthermore, although the contents of the present invention have been specifically described with reference to preferred embodiments, it is obvious that a person skilled in the art can adopt various modified embodiments based on the basic technical idea and teachings of the present invention.

[0040] For example, the present invention is not limited to a configuration in which the thread peripheral groove 622 and the case peripheral groove 621 overlap to form the two-pass groove 623 . In an electronic control device 100 in which the screw peripheral groove portion 622 and the case peripheral groove portion 621 are provided independently of each other and a connecting groove portion that connects these screw peripheral groove portion 622 and case peripheral groove portion 621 is provided as a two-pass groove portion, the same action and effect can be obtained by making the groove depth of the two-pass groove portion deeper than the groove depth of the one-pass groove portion.

[0041] Furthermore, the first to fourth slopes 627a, 627b, 627c, 627d are not limited to slopes with a constant gradient, but can be slopes that combine multiple slopes with different gradients, or slopes with a gradient that changes continuously. Furthermore, the thread periphery groove 622 is not limited to a groove provided around the female thread, but may be, for example, a groove provided around an embedded bolt or the like. [Explanation of symbols]

[0042] 100...Electronic control device, 200...Cover, 300...Circuit board, 600...Case, 610...Female thread, 620...Groove, 621...Case peripheral groove, 622...Thread peripheral groove, 623...Two-pass groove, 624...Single-pass groove, 625...Recess, 626...Waterproof adhesive, 700...Housing, 800...Male thread

Claims

1. An electronic control device in which a circuit board is housed in a housing made up of a case and a cover, The case and the cover are joined together with adhesive and screws, the case has a groove to the inside of which the adhesive is applied; the groove portion forms a unicursal path that passes around the periphery of the case and the screw in a unicursal manner; The groove depth of a two-pass groove portion that passes twice in the unicursal path is set to twice the application height of the adhesive, and the groove depth of a one-pass groove portion that passes once in the unicursal path is set to the application height of the adhesive, so that the upper surface of the adhesive applied inside the one-pass groove portion and the upper surface of the adhesive applied inside the two-pass groove portion are set to the same height. Electronic control unit.

2. 2. The electronic control device according to claim 1, a slope is provided to make the step of the groove bottom surface between the one-time-pass groove portion and the two-time-pass groove portion gentler; Electronic control unit.

3. 2. The electronic control device according to claim 1, In the unicursal path, a slope is provided to make the step of the groove bottom gentler in a portion from the one-time-pass groove portion to the two-time-pass groove portion for a first pass through the two-time-pass groove portion, and in a portion to the one-time-pass groove portion after the first pass through the two-time-pass groove portion. Electronic control unit.

4. 2. The electronic control device according to claim 1, The groove width of the first-pass groove portion and the groove width of the second-pass groove portion are equal to each other. Electronic control unit.

5. A method for manufacturing an electronic control device in which a circuit board is housed in a housing in which a case and a cover are joined with an adhesive and screws, comprising the steps of: A groove forming step of forming a groove in the case, The grooves are formed so that the grooves form a unicursal path that passes around the periphery of the case and the periphery of the screw in a unicursal manner, and the groove depth of a two-pass groove portion that passes twice in the unicursal path is twice the groove depth of a one-pass groove portion that passes once in the unicursal path. the groove forming step; An application step of applying the adhesive to the inside of the groove, The application height of the adhesive is set to be the same as the groove depth of the single-pass groove portion, the adhesive is applied to the inside of the groove portion along a single-stroke application path, the adhesive is applied to the two-pass groove portion twice, and the adhesive is applied to the one-pass groove portion once, so that the upper surface of the adhesive applied to the inside of the single-pass groove portion and the upper surface of the adhesive applied to the inside of the two-pass groove portion are set to the same height. the coating step; an assembly process of assembling the case and the cover by pressing the peripheral edge of the cover into the groove of the case; a fixing step of fixing the cover to the case with the screws; A method for manufacturing an electronic control device having the above-mentioned steps.

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