Substrate Processing Equipment

Abstract

To provide a substrate processing apparatus capable of appropriately transferring a substrate and provide a substrate transfer method.SOLUTION: The present invention relates to a substrate processing apparatus 1 and a substrate transfer method. A hand 61 comprises: a base part 65; a suction part 68; a first reception part 82; a second reception part 83; and a reception driving part 86. The suction part 68 is attached to the base part 65. The suction part 68 allows air to flow along an upper surface 16 of a substrate W, and sucks the substrate W upward without contacting the substrate W. The first reception part 82 and the second reception part 83 are supported on the base part 65. The first reception part 82 and the second reception part 83 are arranged below the substrate W sucked by the suction part 68, and can receive a lower surface of the substrate W. The reception driving part 86 causes the second reception part 83 to approach the first reception part 82 by moving the second reception part 83 with respect to the base part 65, and separates the second reception part 83 from the first reception part 82.SELECTED DRAWING: Figure 15

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates, such as semiconductor wafers, liquid crystal display substrates, organic electroluminescence (EL) substrates, flat panel display (FPD) substrates, optical display substrates, magnetic disk substrates, optical disk substrates, magneto-optical disk substrates, photomask substrates, and solar cell substrates. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus. Hereinafter, the reference symbols used in Patent Document 1 will be written in parentheses. The substrate processing apparatus (1) includes a load port (16) and an inspection device. The load port (16) stores a cassette (C). The cassette (C) stores a plurality of wafers (W). The inspection device includes a main chuck (13) on which the substrate (W) is placed, and a probe card (14) provided above the main chuck (13).

[0003] The substrate processing apparatus 1 includes a substrate transfer device 18. The substrate transfer device 18 holds a substrate W based on Bernoulli's principle. The substrate transfer device 18 transfers the substrate W between a cassette C stored in a load port 16 and the main chuck 13.

[0004] The substrate transfer device (18) includes tweezers (17) and a suction device (171). The suction device (171) is attached to the underside of the tweezers (17). The suction device (171) is connected to a high-pressure air source. The high-pressure air source supplies high-pressure air to the suction device (171). When the suction device (171) is positioned above the substrate (W), the high-pressure air flows out of the suction device (171) through a gap between the suction device (171) and the upper surface of the substrate (W). This allows the suction device (171) to hold the upper surface of the substrate (W). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-270626 Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, substrates have become thinner and larger in diameter. As the thickness of a substrate decreases and the diameter of the substrate increases, the amount of bending of the substrate increases significantly. As a result, it can be difficult for conventional substrate transport devices to transport the substrate properly.

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus and a substrate transport method that are capable of appropriately transporting substrates. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention has the following configuration: That is, the present invention is a substrate processing apparatus, a first transport mechanism for transporting a substrate; The first transport mechanism is Hand and a hand driving unit that moves the hand; Equipped with The hand the base portion; a suction unit attached to the base unit, which causes a gas to flow along an upper surface of the substrate and sucks the substrate upward without coming into contact with the substrate; a first receiving portion supported by the base portion and disposed below the substrate to be sucked by the suction portion, the first receiving portion being capable of receiving at least one of a lower surface of the substrate and an edge of the substrate; a second receiving portion supported by the base portion and disposed below the substrate to be sucked by the suction portion, the second receiving portion being capable of receiving at least one of a lower surface of the substrate and an edge of the substrate; a receiving portion driving portion that moves the second receiving portion relative to the base portion, thereby bringing the second receiving portion closer to the first receiving portion and moving the second receiving portion away from the first receiving portion; Equipped with A substrate processing apparatus.

[0009] The hand includes a base and a suction unit. The suction unit is attached to the base. The suction unit flows a gas along the upper surface of the substrate. The suction unit sucks the substrate upward without coming into contact with the substrate. Thus, the hand can suitably support the substrate.

[0010] The first transport mechanism includes a hand drive unit that moves the hand, and therefore the first transport mechanism can suitably transport the substrate supported by the hand.

[0011] The hand further includes a first receiving portion and a second receiving portion. The first receiving portion and the second receiving portion are supported by the base portion. The first receiving portion and the second receiving portion are disposed below the substrate that is sucked by the suction portion. The first receiving portion and the second receiving portion can receive at least one of the bottom surface and the edge of the substrate. Therefore, even if the substrate falls downward from the suction portion, the first receiving portion and the second receiving portion can receive the substrate. In other words, there is no risk that the first transport mechanism will drop the substrate.

[0012] The hand includes a receiving part driver. The receiving part driver moves the second receiving part relative to the base part. The receiving part driver moves the second receiving part closer to the first receiving part and moves the second receiving part away from the first receiving part. This allows the hand to pick up and place a substrate without the first and second receiving parts interfering with the substrate.

[0013] As described above, the present substrate processing apparatus can transport substrates appropriately.

[0014] In the above-described substrate processing apparatus, When the first transport mechanism transports a substrate, at least a part of the first receiving section and at least a part of the second receiving section are preferably arranged in a position overlapping the substrate being sucked by the suction section in a plan view. When the first transport mechanism transports the substrate, the first receiving portion and the second receiving portion can reliably prevent the substrate from falling off the hand.

[0015] In the above-described substrate processing apparatus, a placement section for placing a substrate; Equipped with It is preferable that the first transport mechanism places the substrate on the first receiving section and the second receiving section by stopping the suction of the substrate by the suction section, and then places the substrate on the placement section. When the first transport mechanism places the substrate on the platform, there is no risk of the hand damaging the substrate, and therefore the first transport mechanism can properly place the substrate on the platform.

[0016] In the above-described substrate processing apparatus, a processing unit for processing a substrate; Equipped with The processing unit a substrate holder for holding a substrate; Equipped with It is preferable that the first transport mechanism places the substrate on the first receiving portion and the second receiving portion by stopping the suction of the substrate by the suction portion, and then places the substrate on the substrate holding portion. The first transport mechanism can properly place the substrate on the substrate holder.

[0017] In the above-described substrate processing apparatus, the second receiving portion is movable relative to the base portion to a fall-off prevention position and a retracted position, When the second receiving portion is in the fall-off prevention position, at least a portion of the second receiving portion overlaps with the substrate sucked by the suction portion in a plan view; When the second receiving portion is in the retracted position, it is preferable that the substrate be able to pass between the first receiving portion and the second receiving portion in a vertical direction in a horizontal position. When the second receiving portion is in the drop prevention position, the second receiving portion can reliably prevent the substrate from dropping off from the hand. When the second receiving portion is in the retracted position, the substrate can pass vertically between the first and second receiving portions in a horizontal position. Therefore, the hand can pick up and place the substrate without the first and second receiving portions interfering with the substrate.

[0018] In the above-described substrate processing apparatus, The receiving portion driving portion is an actuator that moves the second receiving portion to a fall-off prevention position and a retracted position; an elastic member that biases the second receiving portion from the retracted position toward the fall-off prevention position; It is preferable to have: Because the receiver drive unit includes an actuator, the second receiver can be suitably moved to the fall-prevention position and the retracted position. Because the receiver drive unit includes an elastic member, when the actuator is disconnected from its power source, only the elastic force of the elastic member acts on the second receiver. As a result, the second receiver moves to the fall-prevention position by the elastic force of the elastic member. Therefore, even when the actuator is disconnected from the power source, the second receiver can suitably prevent the substrate from falling off the hand.

[0019] In the above-described substrate processing apparatus, The receiving portion driving portion is an electric motor that moves the second receiving portion relative to the base portion; It is preferable to have: The receiving part drive part is equipped with an electric motor, so the movement speed of the second receiving part can be easily controlled. As a result, even if the second receiving part comes into contact with the substrate while moving, the impact that the second receiving part gives to the substrate can be reduced, and damage to the substrate by the second receiving part can be prevented.

[0020] In the above-described substrate processing apparatus, The first receiving portion is preferably fixed to the base portion. The structure in which the base portion supports the first receiving portion can be simplified.

[0021] In the above-described substrate processing apparatus, The hand a first contact portion fixed to the base portion and configured to come into contact with at least one of an upper surface of a substrate sucked by the suction portion and an edge of the substrate; a first wall portion connected to the first contact portion, extending downward from the first contact portion along a side of the substrate attracted to the suction portion; Equipped with The first receiving portion is preferably connected to the first wall portion. The first contact portion can hold the substrate, which is sucked by the suction portion, in a predetermined position.

[0022] The present invention provides a substrate transport method, comprising: a suction unit attached to a base unit causing a gas to flow along an upper surface of the substrate, sucking the substrate upward without contacting the substrate, and a hand driving unit moving the base unit, thereby transporting the substrate; a step of placing the substrate on a receiving portion supported by the base portion and disposed below the suction portion by causing the suction portion to stop suctioning the substrate; transferring the substrate from the receiving part to the placing part; The substrate transport method includes the steps of:

[0023] According to this substrate transport method, there is no risk of damaging the substrate when placing it on the mounting section. Therefore, the substrate can be properly placed on the mounting section. In this way, the substrate transport method can properly transport the substrate.

[0024] The present invention provides a substrate transport method, comprising: a suction unit attached to a base unit causing a gas to flow along an upper surface of the substrate, sucking the substrate upward without contacting the substrate, and a hand driving unit moving the base unit, thereby transporting the substrate; a step of placing the substrate on a receiving portion supported by the base portion and disposed below the suction portion by causing the suction portion to stop suctioning the substrate; transferring the substrate from the receiving portion to a substrate holding portion of a processing unit; The substrate transport method includes the steps of:

[0025] According to this substrate transport method, there is no risk of damaging the substrate when placing it on the substrate holding part. Therefore, the substrate can be placed properly on the substrate holding part. In this way, this substrate transport method allows the substrate to be transported properly.

[0026] The present invention provides a substrate processing apparatus, a first transport mechanism that transports the substrate; a second transport mechanism that transports the substrate; a platform on which a substrate to be transported between the first transport mechanism and the second transport mechanism is placed; Equipped with The first transport mechanism is Hand and Equipped with The hand a suction unit that causes a gas to flow along either the upper surface or the lower surface of the substrate and sucks the substrate without coming into contact with the substrate; Equipped with A substrate processing apparatus.

[0027] The first transport mechanism includes a hand. The hand includes a suction unit. The suction unit flows gas along the upper surface of the substrate, sucking the substrate without contacting the substrate. Therefore, the hand can suitably support the substrate. Therefore, the first transport mechanism can suitably transport the substrate. In this way, the present substrate processing apparatus can suitably transport the substrate.

[0028] In the above-described substrate processing apparatus, The placement unit is a first inclined surface in contact with a first side of the substrate; a second inclined surface that is disposed at a position facing the first inclined surface in the horizontal direction and that contacts a second side portion of the substrate; Equipped with a distance between an upper end of the first inclined surface and an upper end of the second inclined surface in a horizontal direction is greater than a diameter of the substrate; It is preferable that the distance in the horizontal direction between the lower end of the first inclined surface and the lower end of the second inclined surface is narrower than the distance in the horizontal direction between the upper end of the first inclined surface and the upper end of the second inclined surface. The distance in the horizontal direction between the upper end of the first inclined surface and the upper end T of the second inclined surface is larger than the diameter of the substrate. Therefore, even if the positions of the substrates placed on the mounting section by the first transport mechanism and the second transport mechanism vary, the mounting section can properly receive the substrate. The distance in the horizontal direction between the lower end of the first inclined surface and the lower end of the second inclined surface is narrower than the distance in the horizontal direction between the upper end of the first inclined surface and the upper end of the second inclined surface. Therefore, the first inclined surface and the second inclined surface can properly guide the substrate to a predetermined position.

[0029] In the above-described substrate processing apparatus, a first processing unit for processing a substrate; Equipped with the first transport mechanism transports the substrate to the first processing unit; The first processing unit a first substrate holding portion; Equipped with The first substrate holding unit is The first plate and a support portion that protrudes upward from an upper surface of the first plate, that contacts at least one of a lower surface of the substrate and an edge of the substrate, and that supports the substrate at a position higher than the upper surface of the first plate; a gas outlet formed on an upper surface of the first plate, for blowing gas between the upper surface of the first plate and a lower surface of the substrate supported by the support portion, and for sucking the substrate downward; It is preferable to have: The first substrate holding part includes a support part and a gas outlet, so that the first substrate holding part can hold the substrate suitably.

[0030] In the above-described substrate processing apparatus, a carrier placement section for placing a carrier that accommodates a plurality of substrates; Equipped with The second transport mechanism transports the substrate to the carrier placed on the carrier placement section. It is preferable. The second transport mechanism can suitably transport the substrate from the carrier to the first transport mechanism.The second transport mechanism can suitably transport the substrate from the first transport mechanism to the carrier.

[0031] The present invention provides a substrate processing apparatus, a first processing unit for processing a substrate; a first transport mechanism that transports substrates to the first processing unit; a control unit that controls the first processing unit and the first transport mechanism; Equipped with The first processing unit The first plate and a support portion that protrudes upward from the upper surface of the first plate, contacts at least one of the lower surface and the edge of the substrate, and supports the substrate at a position higher than the upper surface of the first plate; a gas outlet formed on an upper surface of the first plate, for blowing gas between the upper surface of the first plate and a lower surface of the substrate supported by the support portion, and for sucking the substrate downward; Equipped with The first transport mechanism is a suction unit that causes a gas to flow along either the upper surface or the lower surface of the substrate and sucks the substrate without coming into contact with the substrate; a suction adjusting unit that adjusts the flow rate of gas supplied to the suction unit; Equipped with The control unit changes the flow rate of the gas supplied to the suction unit in accordance with the shape of the substrate transported by the first transport mechanism. A substrate processing apparatus.

[0032] The substrate processing apparatus includes a first processing unit, which includes a first plate, a support, and a gas outlet, so that the first processing unit can hold the substrate in a suitable manner.

[0033] The substrate processing apparatus includes a first transport mechanism for transporting a substrate to a first processing unit. The first transport mechanism includes a suction unit and a suction adjustment unit. The suction adjustment unit adjusts the suction force of the suction unit by adjusting the flow rate of gas supplied to the suction unit.

[0034] The substrate processing apparatus includes a control unit that controls the first processing unit and the first transport mechanism. The control unit changes the flow rate of gas supplied to the suction unit depending on the shape of the substrate being transported by the first transport mechanism. Therefore, the suction unit can suck the substrate with an appropriate suction force regardless of the shape of the substrate. Therefore, the first transport mechanism can transport the substrate appropriately.

[0035] As described above, the present substrate processing apparatus can transport substrates appropriately.

[0036] In the above-described substrate processing apparatus, The control unit preferably changes the flow rate of the gas supplied to the suction unit in accordance with the thickness of a main portion of the substrate located inside the peripheral edge of the substrate. The suction section can suck the substrate with an appropriate suction force regardless of the thickness of the main portion of the substrate, and therefore the first transport mechanism can suitably transport the substrate regardless of the thickness of the main portion of the substrate.

[0037] In the above-described substrate processing apparatus, The substrate is a first substrate having a recess formed by a main portion of the substrate located inside a peripheral edge portion of the substrate being recessed from the peripheral edge portion of the substrate, and not having a glass protective plate; a second substrate that does not have the recess; Including, When the first transport mechanism transports the first substrate, the control unit adjusts the flow rate of the gas supplied to the suction unit to a first flow rate; When the first transport mechanism transports the second substrate, the control unit preferably adjusts the flow rate of the gas supplied to the suction unit to a second flow rate that is greater than the first flow rate. The suction unit can suck the first substrate and the second substrate with appropriate suction force, so whether the substrate being transported by the first transport mechanism is the first substrate or the second substrate, the first transport mechanism can transport the substrate appropriately.

[0038] In the above-described substrate processing apparatus, The substrate is a first substrate having a recess formed by a main portion of the substrate located inside a peripheral edge portion of the substrate being recessed from the peripheral edge portion of the substrate, and not having a glass protective plate; a third substrate having the recess and a glass protective plate; Including, When the first transport mechanism transports the first substrate, the control unit adjusts the flow rate of the gas supplied to the suction unit to a first flow rate; When the first transport mechanism transports the third substrate, the control unit preferably adjusts the flow rate of the gas supplied to the suction unit to a third flow rate that is greater than the first flow rate. The suction unit can suck the first substrate and the third substrate with appropriate suction force, so whether the substrate being transported by the first transport mechanism is the first substrate or the third substrate, the first transport mechanism can transport the substrate appropriately.

[0039] The present invention provides A substrate processing apparatus, a first transport mechanism that transports the substrate between the first position and the second position; a control unit that controls the first transport mechanism; Equipped with The first transport mechanism is Hand and a hand driving unit that moves the hand; Equipped with The hand A base portion; a suction unit attached to the base unit, which causes a gas to flow along a first surface of the substrate and sucks the first surface of the substrate without coming into contact with the substrate; Equipped with The control unit is a substrate processing apparatus that moves the hand at a first speed when the first transport mechanism is transporting a substrate, and moves the hand at a second speed that is greater than the first speed when the first transport mechanism is not transporting a substrate.

[0040] The substrate processing apparatus includes a first transport mechanism. The first transport mechanism includes a hand and a hand drive unit. The hand includes a base unit and a suction unit. Therefore, the hand can favorably support the substrate.

[0041] The substrate processing apparatus includes a control unit that controls the first transport mechanism, and the control unit controls the moving speed of the hand.

[0042] When the first transport mechanism is transporting a substrate, the movement speed of the hand is relatively slow. Therefore, when the first transport mechanism is transporting a substrate, the suction unit can properly suck the substrate. Therefore, the first transport mechanism can properly transport the substrate.

[0043] When the first transport mechanism is not transporting a substrate, the movement speed of the hand is relatively high, and therefore, when the first transport mechanism is not transporting a substrate, the movement time of the hand can be shortened.

[0044] As described above, the substrate processing apparatus can transport substrates appropriately.

[0045] In the above-described substrate processing apparatus, The first speed is preferably 50% or less of the second speed. When the first transport mechanism is transporting a substrate, the suction section can more appropriately suck the substrate, and when the first transport mechanism is not transporting a substrate, the movement time of the hand can be further reduced.

[0046] In the above-described substrate processing apparatus, It is preferable that the control unit moves the hand at a first acceleration when the first transport mechanism is transporting a substrate, and moves the hand at a second acceleration greater than the first acceleration when the first transport mechanism is not transporting a substrate. The control unit controls the acceleration of the hand. When the first transport mechanism is transporting a substrate, the acceleration of the hand is relatively small. Therefore, when the first transport mechanism is transporting a substrate, the suction unit can more appropriately suck the substrate. When the first transport mechanism is not transporting a substrate, the acceleration of the hand is relatively large. Therefore, when the first transport mechanism is not transporting a substrate, the movement time of the hand can be further reduced. [Effects of the Invention]

[0047] According to the present invention, the substrate can be transported appropriately. [Brief explanation of the drawings]

[0048] [Figure 1] 1 is a plan view of a substrate processing apparatus according to an embodiment; [Figure 2] FIG. 2 is a control block diagram of the substrate processing apparatus. [Figure 3] FIG. [Figure 4] FIG. 4(a) is a cross-sectional view of the first substrate, FIG. 4(b) is a cross-sectional view of the second substrate, and FIG. 4(c) is a cross-sectional view of the third substrate. [Figure 5] FIG. 5(a) is a plan view of a normal diameter substrate, and FIG. 5(b) is a plan view of a large diameter substrate. [Figure 6] FIG. [Figure 7] FIG. 10 is a plan view of the carrier shelf. [Figure 8] FIG. 2 is a left side view showing the configuration of a central portion of the substrate processing apparatus in the width direction. [Figure 9] FIG. [Figure 10] FIG. [Figure 11] FIG. 2 is a left side view showing the configuration of the left part of the substrate processing apparatus. [Figure 12] FIG. [Figure 13] FIG. [Figure 14] FIG. [Figure 15] FIG. [Figure 16] 16(a) and 16(b) are side views of the hand. [Figure 17] 10 is a plan view of a suction portion, a substrate to be sucked by the suction portion, and a receiving portion. FIG. [Figure 18] FIG. [Figure 19] FIG. 2 is a diagram schematically illustrating the configuration of a first processing unit. [Figure 20] FIG. 2 is a plan view of the first plate. [Figure 21] 21(a) and 21(b) are detailed plan views of the position adjustment pin. [Figure 22] 22(a) and 22(b) are side views of the position adjustment pin. [Figure 23] 23(a) and 23(b) are side views of the lift pin. [Figure 24] FIG. 2 is a diagram schematically illustrating the configuration of a second processing unit. [Figure 25] FIG. 2 is a plan view of a second plate. [Figure 26] Figures 26(a) and 26(b) are detailed plan views of the edge contact pin. [Figure 27] 27(a) and 27(b) are side views of the edge contact pin. [Figure 28] 10 is a flowchart showing the procedure of an operation performed by the control unit to acquire the shape of a substrate. [Figure 29] 10 is a flowchart showing the procedure of control by the control unit and the operation of the transport mechanism. [Figure 30] 30(a) to 30(d) are diagrams showing an example of the operation of the transport mechanism to pick up a substrate from a shelf of a carrier. [Figure 31] 31(a) and 31(b) are diagrams showing the relationship between the substrate placed on the shelf and the insertion height of the hand. [Figure 32] 32(a) to 32(d) are diagrams schematically illustrating an example of the operation of the transport mechanism to take a substrate from a shelf of the mounting section. [Figure 33] 10 is a flowchart showing the procedure of control by the control unit and the operation of the transport mechanism. [Figure 34] 34(a) to 34(d) are diagrams showing an example of the operation of the transport mechanism to take a substrate from a shelf of the mounting section. [Figure 35] 35(a) to 35(d) are diagrams schematically illustrating an example of the operation of the transport mechanism to take a substrate from a shelf of the mounting section. [Figure 36] 36(a) to 36(f) are diagrams schematically illustrating an example of an operation in which the transport mechanism delivers a substrate to a substrate holder of a processing unit. [Figure 37] 37(a) to 37(f) are diagrams schematically illustrating an example of the operation of the transport mechanism to take a substrate from the substrate holder of a processing unit. [Figure 38] 38(a) to 38(d) are diagrams schematically illustrating an example of the operation of the transport mechanism to place a substrate on a shelf of the platform. [Figure 39] 39(a) to 39(d) are diagrams schematically illustrating an example of the operation of the transport mechanism to place a substrate on a shelf of the platform. [Figure 40] 10 is a flowchart showing the procedure of an example of operation of the first processing unit. [Figure 41] 10 is a timing chart showing an example of the operation of the first processing unit. [Figure 42] FIG. 10 is a diagram schematically illustrating the configuration of a first processing unit in a modified embodiment. [Figure 43] FIG. 10 is a diagram schematically illustrating the configuration of a first processing unit in a modified embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0049] The substrate processing apparatus of the present invention will be described below with reference to the drawings.

[0050] <Outline of substrate processing equipment> 1 is a plan view of a substrate processing apparatus 1 according to an embodiment of the present invention, which processes a substrate (eg, a semiconductor wafer) W.

[0051] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (electroluminescence), a substrate for an FPD (flat panel display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, or a substrate for a solar cell.

[0052] The substrate processing apparatus 1 includes an indexer unit 2. The indexer unit 2 includes a plurality of (e.g., four) carrier placement units 3 and a transport mechanism 4. Each carrier placement unit 3 places one carrier C thereon. The carrier C stores a plurality of substrates W. The carrier C is, for example, a FOUP (front opening unified pod). The transport mechanism 4 is accessible to all of the carriers C placed on the carrier placement units 3.

[0053] The substrate processing apparatus 1 includes a processing block 5. The processing block 5 is connected to the indexer unit 2.

[0054] The processing block 5 includes a receiver 6, a plurality of processing units 7, and a transport mechanism 8. The receiver 6 receives a plurality of substrates W. Each processing unit 7 processes one substrate W. The transport mechanism 8 is accessible to the receiver 6 and all of the processing units 7. The transport mechanism 8 transports the substrates W to the receiver 6 and the processing units 7.

[0055] The receiver 6 is disposed between the transport mechanism 4 and the transport mechanism 8. The transport mechanism 4 is also accessible to the receiver 6. The transport mechanism 4 transports the substrate W to the receiver 6. The receiver 6 places the substrate W to be transported between the transport mechanism 4 and the transport mechanism 8.

[0056] The substrate processing apparatus 1 includes a control unit 9. The control unit 9 controls the transfer mechanisms 4 and 8 and the processing unit 7.

[0057] 2 is a control block diagram of the substrate processing apparatus 1. A control unit 9 is connected to the transport mechanisms 4 and 8 and the processing units 7 so as to be able to communicate with each other.

[0058] The control unit 9 is realized by a central processing unit (CPU) that executes various processes, a random-access memory (RAM) that serves as a work area for the processes, and a storage medium such as a fixed disk. The storage medium stores various types of information in advance. The storage medium stores, for example, information regarding the operating conditions of the transport mechanisms 4, 8 and the processing unit 7. The information regarding the operating conditions of the processing unit 7 is, for example, a processing recipe (processing program) for processing the substrate W. The storage medium stores, for example, information for identifying each substrate W.

[0059] An example of the operation of the substrate processing apparatus 1 will be described. The transport mechanism 4 transports the substrate W from the carrier C on the carrier mount part 3 to the mount part 6. The transport mechanism 8 transports the substrate W from the mount part 6 to one of the processing units 7. The processing unit 7 processes the substrate W. The transport mechanism 8 transports the substrate W from the processing unit 7 to the mount part 6. The transport mechanism 4 transports the substrate W from the mount part 6 to the carrier C on the carrier mount part 3.

[0060] The transport mechanism 4 is an example of a second transport mechanism in the present invention. The transport mechanism 8 is an example of a first transport mechanism in the present invention. The carrier C, the receiver 6, and the processing unit are examples of a first position and a second position in the present invention.

[0061] For convenience, in this specification, the direction in which the indexer unit 2 and the processing block 5 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the processing block 5 toward the indexer unit 2 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y" or "side." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The vertical direction is referred to as the "up-down direction Z." The up-down direction Z is perpendicular to the front-rear direction X and also perpendicular to the width direction Y. In each figure, for reference, front, rear, right, left, top, and bottom are indicated as appropriate.

[0062] <Shape of substrate W> FIG. 3 is a plan view of the substrate W. The basic shape of the substrate W will be described. The substrate W has a thin, flat plate shape. The substrate W has a substantially circular shape in a plan view. The substrate W has a peripheral portion 12 and a main portion 13. The main portion 13 is a portion of the substrate W located inside the peripheral portion 12. A semiconductor device is formed in the main portion 13. For convenience, FIG. 3 shows the boundary between the peripheral portion 12 and the main portion 13 with a dashed line.

[0063] In this specification, the substrates W are classified into a number of types depending on their shapes. First, the substrates W are classified into a first substrate W1, a second substrate W2, and a third substrate W3 depending on the thickness of the main portion 13 of the substrate W.

[0064] FIG. 4(a) is a cross-sectional view of a first substrate W1. FIG. 4(b) is a cross-sectional view of a second substrate W2. FIG. 4(c) is a cross-sectional view of a third substrate W3. The first substrate W1 is a substrate W that includes a recess 14 formed by recessing the main portion 13 more than the peripheral portion 12, and does not include a glass protective plate 15. The recess 14 is formed, for example, by a grinding process. The second substrate W2 is a substrate W that does not include the recess 14. The third substrate W3 is a substrate W that includes the recess 14 and a glass protective plate 15. The first substrate W1 may be composed of only the substrate main body 11. Alternatively, the first substrate W1 may include at least one of a resin coating, a resin tape, a resin sheet, and a resin film in addition to the substrate main body 11. The second substrate W2 may be composed of only the substrate main body 11. Alternatively, the second substrate W2 may include, in addition to the substrate main body 11, at least one of a resin coating, a resin tape, a resin sheet, a resin film, and a protective plate 15. The third substrate W3 includes the substrate main body 11 and the protective plate 15. The protective plate 15 is, for example, attached to the substrate main body 11. The third substrate W3 may further include at least one of a resin coating, a resin tape, a resin sheet, and a resin film.

[0065] The main portion 13 of the first substrate W1 is thinner than the main portion 13 of the second substrate W2. The main portion 13 of the first substrate W1 is thinner than the main portion 13 of the third substrate W3. The first substrate W1 has lower rigidity than the second substrate W2 and the third substrate W3. The first substrate W1 is more flexible than the second substrate W2 and the third substrate W3.

[0066] Specifically, the main portion 13 of the first substrate W1 has a thickness T1. The main portion 13 of the second substrate W2 has a thickness T2. The main portion 13 of the third substrate W3 has a thickness T3. Thickness T1 is smaller than thickness T2. Thickness T1 is smaller than thickness T3. Thickness T1 is, for example, 10 μm or more and 200 μm or less. Thickness T2 is, for example, 600 μm or more and 1000 μm or less. Thickness T3 is, for example, 800 μm or more and 1200 μm or less.

[0067] The peripheral portion 12 of the first substrate W1 has a thickness T4. The peripheral portion 12 of the second substrate W2 has a thickness T5. The peripheral portion 12 of the third substrate W3 has a thickness T6. The thickness T4 is, for example, the same as the thickness T5. The thickness T4 is smaller than the thickness T6. The thickness T4 is, for example, not less than 600 μm and not more than 1000 μm. The thickness T5 is, for example, not less than 600 μm and not more than 1000 μm. The thickness T6 is, for example, not less than 1400 μm and not more than 2200 μm.

[0068] Secondly, the substrates W are classified into normal diameter substrates WN and large diameter substrates WL according to their diameters D.

[0069] Figure 5(a) is a plan view of a normal diameter substrate WN. Figure 5(b) is a plan view of a large diameter substrate WL. The normal diameter substrate WN has a diameter D1. The large diameter substrate WL has a diameter D2. The diameter D2 is larger than the diameter D1.

[0070] The diameter D1 is, for example, 300 mm, and the diameter D2 is, for example, 301 mm.

[0071] For example, the first substrate W1 and the second substrate W2 belong to the normal diameter substrate WN, and the third substrate W3 belongs to the large diameter substrate WL.

[0072] The substrate processing apparatus 1 processes a first substrate W1, a second substrate W2, and a third substrate W3. The substrate processing apparatus 1 processes a normal diameter substrate WN and a large diameter substrate WL.

[0073] <Career C> 6 is a front view of the carrier C. The carrier C includes a container 21 and a plurality of shelves 22. The shelves 22 are installed inside the container 21. The shelves 22 are arranged so as to be aligned in the vertical direction Z. Two shelves 22 adjacent to each other in the vertical direction Z are close to each other. The distance between two shelves 22 adjacent to each other in the vertical direction Z is, for example, 10 mm.

[0074] Each shelf 22 carries one substrate W in a horizontal position. The shelves 22 contact the lower surface 16 of the substrate W. For example, the shelves 22 contact the lower surface 16 of the substrate W at the peripheral edge portion 12. The shelves 22 do not contact the upper surface 17 of the substrate W. In this way, the shelves 22 support the substrate W. When the shelves 22 support the substrate W, the shelves 22 allow the substrate W to move upward relative to the shelves 22.

[0075] Each shelf 22 includes a first shelf 23 and a second shelf 24. The first shelf 23 and the second shelf 24 are spaced apart from each other. The first shelf 23 and the second shelf 24 face each other in the horizontal direction. The distance E1 between the first shelf 23 and the second shelf 24 arranged side by side in the horizontal direction is smaller than the diameter D of the substrate W.

[0076] 7 is a plan view of the shelves 22 of the carrier C. The first shelf 23 supports a first side 18 of the substrate W. The second shelf 24 supports a second side 19 of the substrate W. The second side 19 is located on the opposite side of the center J of the substrate W from the first side 18. The first side 18 and the second side 19 each include a portion of the peripheral edge 12 of the substrate W. The first side 18 and the second side 19 may also each include a portion of the main portion 13 of the substrate W.

[0077] The carrier C has a barcode (not shown). The barcode is an identifier for identifying the carrier C or for identifying the substrate W in the carrier C. The barcode is attached to the container 21, for example.

[0078] The configuration of each part of the substrate processing apparatus 1 will be described below.

[0079] <Indexer part 2> Please refer to Fig. 1. The carrier placement units 3 are arranged in a row in the width direction Y. The indexer unit 2 is equipped with a barcode reader 31. The barcode reader 31 reads the barcode attached to the carrier C placed on the carrier placement unit 3. The barcode reader 31 is attached to the carrier placement unit 3, for example.

[0080] The indexer unit 2 includes a transport space 32. The transport space 32 is disposed behind the carrier placement unit 3. The transport space 32 extends in the width direction Y. The transport mechanism 4 is installed in the transport space 32. The transport mechanism 4 is disposed behind the carrier placement unit 3.

[0081] The transport mechanism 4 includes a hand 33 and a hand drive unit 34. The hand 33 supports one substrate W in a horizontal position. The hand 33 supports the substrate W by coming into contact with the lower surface 16 of the substrate W. The hand drive unit 34 is connected to the hand 33. The hand drive unit 34 moves the hand 33.

[0082] 1 and 8. FIG. 8 is a left side view showing the configuration of a central portion of the substrate processing apparatus 1 in the width direction Y. The hand driving unit 34 includes a rail 34a, a horizontal moving unit 34b, a vertical moving unit 34c, a rotating unit 34d, and an advancing / retreating moving unit 34e. The rail 34a is fixedly installed. The rail 34a is disposed at the bottom of the transport space 32. The rail 34a extends in the width direction Y. The horizontal moving unit 34b is supported by the rail 34a. The horizontal moving unit 34b moves in the width direction Y relative to the rail 34a. The vertical moving unit 34c is supported by the horizontal moving unit 34b. The vertical moving unit 34c moves in the up-down direction Z relative to the horizontal moving unit 34b. The rotating unit 34d is supported by the vertical moving unit 34c. The rotating unit 34d rotates relative to the vertical moving unit 34c. The rotating unit 34d rotates about a rotation axis A1. The rotation axis A1 is parallel to the vertical direction Z. The forward / backward moving portion 34e moves back and forth in one horizontal direction determined by the orientation of the rotating portion 34d.

[0083] The hand 33 is fixed to the forward / backward moving section 34e. The hand 33 is movable in parallel in the horizontal direction and the up / down direction Z. The hand 33 is rotatable around a rotation axis A1.

[0084] Fig. 9 is a plan view of the hand 33. Fig. 10 is a side view of the hand 33. The structure of the hand 33 will be described. The hand 33 includes a connecting portion 35. The connecting portion 35 is connected to the forward / backward moving portion 34e.

[0085] The hand 33 includes two rods 36. Each rod 36 is supported by a connecting portion 35. The two rods 36 are spaced apart from each other. The two rods 36 extend linearly. The two rods 36 extend in the same direction from the connecting portion 35. The two rods 36 are parallel to each other. The direction in which each rod 36 extends is referred to as a first direction F1. The first direction F1 is horizontal. The first direction F1 is the same as the direction in which the advancing / retreating portion 34e moves back and forth relative to the rotating portion 34d. A horizontal direction perpendicular to the first direction F1 is referred to as a second direction F2. The two rods 36 are aligned in the second direction F2.

[0086] The total length L1 of the two rods 36 in the second direction F2 is smaller than the interval E1, so that the two rods 36 can pass in the vertical direction Z between the first shelf 23 and the second shelf 24, which are horizontally opposed to each other.

[0087] Each rod 36 has a length substantially equal to the diameter D of the substrate W. That is, the length L2 of the rod 36 in the first direction F1 is substantially equal to the diameter of the substrate W.

[0088] Each rod 36 is thin. That is, the length L3 of one rod 36 in the second direction F2 is small. The length of the rod 36 in the second direction F2 is, for example, 10 mm. The length L3 is approximately constant across the first direction F1. That is, the length L3 is approximately constant from the base end of the rod 36 to the tip end of the rod 36. Each rod 36 has an approximately constant cross-sectional shape across the first direction F1. That is, the cross-sectional shape of the rod 36 is approximately constant from the base end of the rod 36 to the tip end of the rod 36.

[0089] The hand 33 has a plurality of (for example, four) contact portions 37. A contact portion 37 is attached to each rod 36. Each contact portion 37 protrudes upward from each rod 36. Each contact portion 37 contacts the lower surface 16 of the substrate W. More specifically, each contact portion 37 contacts the lower surface 16 at the peripheral edge portion 12 of the substrate W. This allows the hand 33 to support one substrate W in a horizontal position. Each contact portion 37 does not contact the upper surface 17 of the substrate W. The hand 33 allows the substrate W to move upward relative to the hand 33. When the hand 33 supports the substrate W, the contact portions 37 and the rods 36 overlap the substrate W in a planar view.

[0090] The hand 33 includes a substrate detector 38. The substrate detector 38 detects the substrate W supported by the hand 33. The substrate detector 38 is attached to a rod 36.

[0091] See Fig. 2. The barcode reader 31 is communicably connected to the control unit 9. The hand driving unit 34 and the board detection unit 38 of the transport mechanism 4 are communicably connected to the control unit 9. The control unit 9 receives the detection results of the barcode reader 31 and the board detection unit 38. The control unit 9 controls the hand driving unit 34.

[0092] <Processing Block 5> Referring to FIG. 1, the arrangement of each element of the processing block 5 will be described. The processing block 5 includes a transport space 41. The transport space 41 is arranged in the center of the processing block 5 in the width direction Y. The transport space 41 extends in the front-rear direction X. The transport space 41 is adjacent to the transport space 32 of the indexer unit 2.

[0093] The placement unit 6 and the transport mechanism 8 are installed in the transport space 41. The placement unit 6 is disposed in front of the transport mechanism 8. The placement unit 6 is disposed behind the transport mechanism 4. The placement unit 6 is disposed between the transport mechanism 4 and the transport mechanism 8.

[0094] The processing units 7 are arranged on both sides of the transport space 41. The processing units 7 are arranged so as to surround the sides of the transport mechanism 8. Specifically, the processing block 5 includes a first processing section 42 and a second processing section 43. The first processing section 42, the transport space 41, and the second processing section 43 are arranged in this order in the width direction Y. The first processing section 42 is arranged to the right of the transport space 41. The second processing section 43 is arranged to the left of the transport space 41.

[0095] 11 is a left side view showing the configuration of the left part of the substrate processing apparatus 1. In the second processing section 43, a plurality of processing units 7 are arranged in a matrix in the front-rear direction X and the up-down direction Z. For example, in the second processing section 43, six processing units 7 are arranged in two rows in the front-rear direction X and three columns in the up-down direction Z.

[0096] Although not shown in the drawings, in the first processing section 42, a plurality of processing units 7 are arranged in a matrix in the front-rear direction X and the up-down direction Z. For example, in the first processing section 42, six processing units 7 are arranged in two rows in the front-rear direction X and three rows in the up-down direction Z.

[0097] 12 is a front view of the mounting section 6. The structure of the mounting section 6 will be described. The mounting section 6 is capable of mounting multiple substrates W. The mounting section 6 includes multiple shelves 45 and a support wall 48. The support wall 48 supports each shelf 45. The shelves 45 are arranged so as to be aligned in the vertical direction Z. Two shelves 45 adjacent to each other in the vertical direction Z are close to each other.

[0098] Each shelf 45 carries one substrate W in a horizontal position. The shelves 45 contact the lower surface 16 of the substrate W. For example, the shelves 45 contact the lower surface 16 at the peripheral edge portion 12 of the substrate W. The shelves 45 do not contact the upper surface 17 of the substrate W. In this way, the shelves 45 support the substrate W. When the shelves 45 support the substrate W, the shelves 45 allow the substrate W to move upward relative to the shelves 45.

[0099] Each shelf 45 includes a first shelf 46 and a second shelf 47. The first shelf 46 and the second shelf 47 are spaced apart from each other. The first shelf 46 and the second shelf 47 face each other in the horizontal direction (specifically, the width direction Y). The distance E2 between the first shelf 46 and the second shelf 47 arranged side by side in the horizontal direction is smaller than the diameter D of the substrate W. The distance E2 is larger than the length L1.

[0100] 13 is a plan view of the shelves 45 of the mounting section 6. The first shelf 46 supports the first side portion 18 of the substrate W. The second shelf 47 supports the second side portion 19 of the substrate W.

[0101] FIG. 14 is a detailed view of the shelf 45 of the mounting section 6. The first shelf 46 has a first inclined surface 51. The second shelf 47 has a second inclined surface 55. The first inclined surface 51 and the second inclined surface 55 are spaced apart from each other. The second inclined surface 55 faces the first inclined surface 51 in the horizontal direction (specifically, the width direction Y). The first inclined surface 51 and the second inclined surface 55 are bilaterally symmetrical when viewed from the front. The first inclined surface 51 and the second inclined surface 55 are bilaterally symmetrical when viewed from the front-rear direction X. The first inclined surface 51 contacts the first side portion 18 of the substrate W. The second inclined surface 55 contacts the second side portion 19 of the substrate W.

[0102] The distance E2 corresponds to the distance in the horizontal direction between the first inclined surface 51 and the second inclined surface 55. The distance E2 decreases downward.

[0103] The first inclined surface 51 has an upper end 51T. The second inclined surface 55 has an upper end 55T. A distance ET between the upper ends 51T and 55T in the horizontal direction is larger than the diameter D of the substrate W. For example, the distance ET is 306 mm. For example, the difference between the distance ET and the diameter D of the substrate W is 1% or more of the diameter of the substrate W. For example, the difference between the distance ET and the diameter D of the substrate W is 2 mm or more.

[0104] The first inclined surface 51 has a lower end 51B. The second inclined surface 55 has a lower end 55B. A distance EB between the lower ends 51B and 55B in the horizontal direction is narrower than the distance ET. The distance EB is smaller than the diameter D of the substrate W.

[0105] The angle of the first inclined surface 51 is not constant over the entire first inclined surface 51. The first inclined surface 51 has an upper inclined surface 52 and a lower inclined surface 53. The lower inclined surface 53 is disposed below the upper inclined surface 52. The lower inclined surface 53 is tangent to the lower end of the upper inclined surface 52. The upper inclined surface 52 is inclined at a first angle θ1 with respect to the horizontal plane. The lower inclined surface 53 is inclined at a second angle θ2 with respect to the horizontal plane. The second angle θ2 is smaller than the first angle θ1. The lower inclined surface 53 is closer to horizontal than the upper inclined surface 52.

[0106] Similarly, the second inclined surface 55 has an upper inclined surface 56 and a lower inclined surface 57. The second inclined surface 55, the upper inclined surface 56, and the lower inclined surface 57 have the same shapes as the first inclined surface 51, the upper inclined surface 52, and the lower inclined surface 53, except that they are bilaterally symmetrical.

[0107] The first inclined surface 51 has a midpoint 51M. The midpoint 51M is the connection position between the upper inclined surface 52 and the lower inclined surface 53. The second inclined surface 55 has a midpoint 55M. The midpoint 55M is the connection position between the upper inclined surface 56 and the lower inclined surface 57. The distance EM between the midpoints 51M and 55M in the horizontal direction is approximately equal to the diameter D of the substrate W.

[0108] 1 and 7, the structure of the transport mechanism 8 will be described.

[0109] The transport mechanism 8 includes a hand 61 and a hand driving unit 62. The hand 61 supports one substrate W in a horizontal position. The hand driving unit 62 is connected to the hand 61. The hand driving unit 62 moves the hand 61.

[0110] The hand driving unit 62 comprises a support 62a, a vertical moving unit 62b, a rotating unit 62c, and an advancing / retreating moving unit 62d. The support 62a is fixedly installed. The support 62a extends in the vertical direction Z. The vertical moving unit 62b is supported by the support 62a. The vertical moving unit 62b moves in the vertical direction Z relative to the support 62a. The rotating unit 62c is supported by the vertical moving unit 62b. The rotating unit 62c rotates relative to the vertical moving unit 62b. The rotating unit 62c rotates around a rotation axis A2. The rotation axis A2 is parallel to the vertical direction Z. The advancing / retreating moving unit 62d moves back and forth horizontally in one direction determined by the orientation of the rotating unit 62c.

[0111] Figure 15 is a bottom view of the hand 61. Figures 16(a) and 16(b) are side views of the hand 61. The hand 61 is fixed to the forward / backward moving section 62d. The hand 61 is movable in parallel in the horizontal direction and the up / down direction Z. The hand 61 is rotatable around a rotation axis A2.

[0112] The following describes the structure of the hand 61. The hand 61 includes a connecting portion 64. The connecting portion 64 is connected to the forward / backward moving portion 62d.

[0113] The hand 61 includes a base portion 65. The base portion 65 is supported by the connecting portion 64. The base portion 65 extends horizontally from the connecting portion 64.

[0114] The base portion 65 includes two branch portions 66. The branch portions 66 are spaced apart from each other. The branch portions 66 extend in the same direction from the connecting portion 64. The direction in which the branch portions 66 extend is referred to as the third direction F3. The third direction F3 is horizontal. The third direction F3 is the same as the direction in which the forward / backward moving portion 62d moves back and forth relative to the rotating portion 62c. A horizontal direction perpendicular to the third direction F3 is referred to as the fourth direction F4. The two branch portions 66 are aligned in the fourth direction F4. In a plan view, the two branch portions 66 are symmetrical with respect to a virtual line that passes between the two branch portions 66 and is parallel to the third direction F3. Each branch portion 66 is curved. The branch portions 66 have portions that curve away from each other. In other words, the branch portions 66 have portions that curve so as to bulge outward in the fourth direction F4.

[0115] The hand 61 includes a suction unit 68. The suction unit 68 is attached to the base unit 65. The suction unit 68 blows gas. The suction unit 68 blows gas downward. The suction unit 68 blows gas onto the substrate W from a position above the substrate W. Here, "a position above the substrate W" refers to a position higher than the substrate W and overlapping with the substrate W in a planar view. FIG. 15 shows the substrate W being sucked by the suction unit 68 with a dashed line. The suction unit 68 blows gas onto the upper surface 17 of the substrate W. The suction unit 68 causes the gas to flow along the upper surface 17 of the substrate W. As a result, the suction unit 68 sucks the substrate W without coming into contact with the substrate W. Specifically, a negative pressure is created by the gas flowing along the upper surface 17 of the substrate W. That is, the air pressure received by the upper surface 17 of the substrate W is lower than the air pressure received by the lower surface 16 of the substrate W. According to Bernoulli's principle, an upward force acts on the substrate W. That is, the substrate W is sucked upward. The substrate W is sucked toward the suction portion 68. However, the suction portion 68 does not come into contact with the substrate W that is being sucked by the suction portion 68. The base portion 65 also does not come into contact with the substrate W that is being sucked by the suction portion 68.

[0116] The suction unit 68 includes a plurality of (six) suction pads 69. Each suction pad 69 is installed on the lower surface of the base unit 65. The suction pads 69 are embedded in the base unit 65. The suction pads 69 are spaced apart from each other. In a plan view, the suction pads 69 are arranged on a circumference around the center J of the substrate W sucked by the suction unit 68.

[0117] Each suction pad 69 is circular in plan view. Each suction pad 69 has a cylindrical shape with a central axis parallel to the vertical direction Z. Each suction pad 69 has a lower portion that is open downward. The suction pad 69 blows out gas from the lower portion of the suction pad 69. Before blowing out the gas, the suction pad 69 may form a swirling airflow. For example, the suction pad 69 may form an airflow swirling around the central axis of the suction pad 69 inside the suction pad 69, and then the suction pad 69 may release the swirling airflow to the outside of the suction pad 69.

[0118] The transport mechanism 8 includes a gas supply path 71. The gas supply path 71 supplies gas to the suction unit 68. The gas supply path 71 has a first end and a second end. The first end of the gas supply path 71 is connected to a gas supply source 72. The second end of the gas supply path 71 is connected to the suction unit 68. The second end of the gas supply path 71 is connected to each suction pad 69. The gas supplied to the suction unit 68 is, for example, nitrogen gas or air. The gas supplied to the suction unit 68 is, for example, high-pressure gas or compressed gas.

[0119] The transport mechanism 8 includes a suction adjuster 73. The suction adjuster 73 is provided in the gas supply path 71. The suction adjuster 73 adjusts the flow rate of the gas supplied to the suction unit 68. That is, the suction adjuster 73 adjusts the flow rate of the gas blown out by the suction unit 68. The suction adjuster 73 may adjust the flow rate of the gas supplied to the suction unit 68 in a continuous manner. The suction adjuster 73 may adjust the flow rate of the gas supplied to the suction unit 68 in a stepped manner. As the flow rate of the gas supplied to the suction unit 68 increases, the suction force acting on the substrate W increases. The suction adjuster 73 includes, for example, a flow rate adjustment valve. The suction adjuster 73 may further include an on-off valve.

[0120] The hand 61 includes a contact portion 74. The contact portion 74 is attached to the lower surface of the base portion 65. The contact portion 74 protrudes downward from the base portion 65. The contact portion 74 protrudes to a position lower than the suction portion 68. The contact portion 74 is disposed in a position that overlaps the substrate W sucked by the suction portion 68 in a plan view. The contact portion 74 contacts the upper surface 17 of the substrate W sucked by the suction portion 68. More specifically, the contact portion 74 contacts the upper surface 17 at the peripheral portion 12 of the substrate W. The contact portion 74 does not contact the lower surface 16 of the substrate W sucked by the suction portion 68. The contact portion 74 itself allows the substrate W to move downward relative to the contact portion 74.

[0121] The suction portion 68 sucks the substrate W upward, and the contact portion 74 comes into contact with the upper surface 17 of the substrate W, thereby supporting the substrate W and keeping it in a predetermined position.

[0122] The contact portion 74 is disposed at a position farther from the center J of the substrate W sucked by the suction portion 68 than the suction portion 68. The contact portion 74 is disposed radially outward from the substrate W sucked by the suction portion 68 than the suction portion 68.

[0123] The contact portion 74 includes a plurality of (e.g., two) first contact portions 75 and a plurality of (e.g., two) second contact portions 76. The position of the first contact portions 75 is approximately the same as the position of a first receiving portion 82, which will be described later, when viewed from the bottom. The first contact portions 75 and the second contact portions 76 are spaced apart from each other. The first contact portions 75 are attached to the tip portion of the base portion 65. The first contact portions 75 are arranged at a position farther from the connecting portion 64 than the suction portion 68. The second contact portions 76 are attached to the base end portion of the base portion 65. The second contact portions 76 are arranged at a position closer to the connecting portion 64 than the suction portion 68.

[0124] The hand 61 includes a wall portion 77. The wall portion 77 is attached to the underside of the base portion 65. The wall portion 77 extends downward from the base portion 65. The wall portion 77 extends to a position lower than the contact portion 74. The wall portion 77 extends to a position lower than the substrate W sucked by the suction portion 68. The wall portion 77 is positioned so as not to overlap the substrate W sucked by the suction portion 68 in a planar view. The wall portion 77 is positioned to the side of the substrate W sucked by the suction portion 68. The wall portion 77 does not come into contact with the substrate W sucked by the suction portion 68. However, when the substrate W is shifted horizontally by more than a predetermined value, the wall portion 77 comes into contact with the substrate W. In this way, the wall portion 77 restricts the substrate W from shifting horizontally by more than the predetermined value. The predetermined value is, for example, 3 mm.

[0125] The wall portion 77 is disposed at a position farther from the center J of the substrate W sucked by the suction portion 68 than the contact portion 74. The wall portion 77 is disposed radially outward of the substrate W sucked by the suction portion 68 than the contact portion 74.

[0126] The wall portion 77 includes a plurality of (e.g., two) first wall portions 78 and a plurality of (e.g., two) second wall portions 79. The first wall portions 78 and the second wall portions 79 are fixed to the base portion 65. The first wall portions 78 and the second wall portions 79 are spaced apart from each other. The first wall portions 78 are attached to the tip portion of the base portion 65. The first wall portions 78 are arranged at a position farther from the connecting portion 64 than the suction portion 68. The second wall portions 79 are attached to the base end portion of the base portion 65. The second wall portions 79 are arranged at a position closer to the connecting portion 64 than the suction portion 68.

[0127] The first wall portion 78 is connected to the first contact portion 75. The first wall portion 78 extends downward from the first contact portion 75. The second wall portion 79 is connected to the second contact portion 76. The second wall portion 79 extends downward from the second contact portion 76.

[0128] The hand 61 includes a receiving portion 81. The receiving portion 81 is supported by the base portion. The receiving portion 81 is positioned below the substrate W that is sucked by the suction portion 68. The receiving portion 81 does not come into contact with the substrate W that is sucked by the suction portion 68. The receiving portion 81 can receive the lower surface 16 of the substrate W. That is, the receiving portion 81 can come into contact with the lower surface 16 of the substrate W. The receiving portion 81 can support the substrate W. The receiving portion 81 does not come into contact with the upper surface 17 of the substrate W. The receiving portion 81 allows the substrate W to move upward relative to the receiving portion 81.

[0129] The receiving portion 81 includes a plurality of (for example, two) first receiving portions 82. The first receiving portions 82 are supported by the base portion 65. The first receiving portions 82 are fixed to the base portion 65. The first receiving portions 82 are immovable relative to the base portion 65. The first receiving portions 82 are disposed below the substrate W that is sucked by the suction portion 68. The first receiving portions 82 are capable of receiving the lower surface 16 of the substrate W. That is, the first receiving portions 82 are capable of coming into contact with the lower surface 16 of the substrate W.

[0130] The first receiving portion 82 is disposed at a position farther from the center J of the substrate W sucked by the suction portion 68 than the suction portion 68. The first receiving portion 82 is disposed radially outward from the substrate W sucked by the suction portion 68 than the suction portion 68. The first receiving portion 82 is disposed at the tip of the base portion 65. The first receiving portion 82 is disposed at a position farther from the connecting portion 64 than the suction portion 68.

[0131] The first receiving portion 82 is disposed below the first contact portion 75. The first receiving portion 82 overlaps with the first contact portion 75 in a plan view.

[0132] The first receiving portion 82 is connected to the first wall portion 78. The first receiving portion 82 extends horizontally from the first wall portion 78. In a plan view, the first receiving portion 82 extends from the first wall portion 78 toward the center J of the substrate W sucked by the suction portion 68.

[0133] The first contact portion 75, the first wall portion 78, and the first receiving portion 82 described above are integrally molded members. The first contact portion 75, the first wall portion 78, and the first receiving portion 82 are inseparable from one another. The second contact portion 76 and the second wall portion 79 are integrally molded members. The second contact portion 76 and the second wall portion 79 are inseparable from one another.

[0134] The transport mechanism 8 includes a second receiving portion 83. The second receiving portion 83 is supported by the base portion 65. The second receiving portion 83 is disposed below the substrate W that is sucked by the suction portion 68. The second receiving portion 83 is capable of receiving the lower surface 16 of the substrate W. In other words, the second receiving portion 83 is capable of coming into contact with the lower surface 16 of the substrate W.

[0135] The second receiving portion 83 is arranged at a position farther from the center J of the substrate W sucked by the suction portion 68 than the suction portion 68. The second receiving portion 83 is arranged radially outward from the substrate W sucked by the suction portion 68 than the suction portion 68. The second receiving portion 83 is arranged at the base end of the base portion 65. The second receiving portion 83 is arranged at a position closer to the connecting portion 64 than the suction portion 68. The second receiving portion 83 is arranged between the two branch portions 66. The second receiving portion 83 is arranged between the two second contact portions 76.

[0136] The second receiving portion 83 is movable relative to the base portion 65. The second receiving portion 83 is movable horizontally relative to the base portion 65. Specifically, the second receiving portion 83 is movable between a drop prevention position and a retracted position. FIG. 15 shows the second receiving portion 83 in the drop prevention position with a dashed line. FIG. 15 shows the second receiving portion 83 in the retracted position with a solid line. When the second receiving portion 83 moves from the retracted position to the drop prevention position, the second receiving portion 83 approaches the first receiving portion 82. When the second receiving portion 83 moves from the drop prevention position to the retracted position, the second receiving portion 83 moves away from the first receiving portion 82. When the second receiving portion 83 is in the retracted position, the second receiving portion 83 does not overlap with the substrate W sucked by the suction portion 68 in a plan view.

[0137] 17 is a plan view of the suction unit 68, the substrate W sucked by the suction unit 68, and the receiving unit 81. In FIG. 17, the second receiving unit is located in the drop-off prevention unit. At least a portion of the first receiving unit 82 overlaps with the substrate W sucked by the suction unit 68 in a plan view. When the second receiving unit 83 is in the drop-off prevention position, at least a portion of the second receiving unit 83 overlaps with the substrate W sucked by the suction unit 68 in a plan view. The second receiving unit 83 is located on the opposite side of the first receiving unit 82 with respect to the center J of the substrate W sucked by the suction unit 68.

[0138] FIG. 18 is a plan view of the receiving portion 81. In FIG. 18, the second receiving portion 83 is in the retracted position. When the second receiving portion 83 is in the retracted position, the space between the first receiving portion 82 and the second receiving portion 83 is larger than the substrate W. When the second receiving portion 83 is in the retracted position, the substrate W can pass between the first receiving portion 82 and the second receiving portion 83 in the vertical direction Z in a horizontal position. For convenience, the substrate W is shown in FIG. 18. Note that the position of the substrate W shown in FIG. 18 is different from the position of the substrate W sucked by the suction portion 68.

[0139] 15, 16(a), and 16(b). The wall portion 77 further includes a third wall portion 80. The third wall portion 80 is connected to the second receiving portion 83. The third wall portion 80 extends upward from the second receiving portion 83. The second receiving portion 83 extends horizontally from the third wall portion 80. In a plan view, the second receiving portion 83 extends from the third wall portion 80 toward the center J of the substrate W sucked by the suction portion 68.

[0140] The second receiving portion 83 and the third wall portion 80 are integrally molded members. The second receiving portion 83 and the third wall portion 80 are inseparable from each other. The second receiving portion 83 and the third wall portion 80 move together. The third wall portion 80 is also movable relative to the base portion 65.

[0141] The hand 61 includes a receiving portion driving unit 86. The receiving portion driving unit 86 is supported by, for example, the base portion 65. The receiving portion driving unit 86 is connected to the second receiving portion 83. For example, the receiving portion driving unit 86 is connected to the second receiving portion 83 via the third wall portion 80. The receiving portion driving unit 86 moves the second receiving portion 83 relative to the base portion 65. The receiving portion driving unit 86 moves the second receiving portion 83 in the horizontal direction. The receiving portion driving unit 86 moves the second receiving portion 83 back and forth in the third direction F3. The receiving portion driving unit 86 moves the second receiving portion 83 closer to the first receiving portion 82 and moves the second receiving portion 83 away from the first receiving portion 82. The receiving portion driving unit 86 moves the second receiving portion 83 between a drop-off prevention position and a retracted position.

[0142] The receiving part drive part 86 includes an actuator 87. The actuator 87 moves the second receiving part 83 by a power source input to the actuator 87. The actuator 87 moves the second receiving part 83 from the retracted position to the fall-off prevention position, and moves the second receiving part 83 from the fall-off prevention position to the retracted position. The actuator 87 is, for example, an air cylinder. The power source of the air cylinder is air pressure. The actuator 87 is, for example, an electric motor. The power source of the electric motor is electricity.

[0143] The receiving portion driving portion 86 further includes an elastic member 88. The elastic member 88 biases the second receiving portion 83 from the retracted position toward the fall-off prevention position. The elastic member 88 is, for example, a spring. The elastic member 88 may be disposed outside the actuator 87. Alternatively, the elastic member 88 may be disposed inside the actuator 87.

[0144] When the power source of the actuator 87 is stopped, the second receiving portion 83 is maintained in the retracted position by the elastic member 88.

[0145] The hand 61 includes a board detection unit 89. The board detection unit 89 detects the board W supported by the hand 61. The board detection unit 89 is attached to the base unit 65.

[0146] See Figure 2. The hand driving unit 62, suction adjustment unit 73, receiving unit driving unit 86 (actuator 87), and substrate detection unit 89 of the transport mechanism 8 are communicatively connected to the control unit 9. The control unit 9 receives the detection result of the substrate detection unit 89. The control unit 9 controls the hand driving unit 62, suction adjustment unit 73, and receiving unit driving unit 86 (actuator 87).

[0147] Referring to Figure 1, the basic structure of the processing unit 7 will be described. Each processing unit 7 comprises a substrate holding part 91, a rotation drive part 92, and a guard 93. The substrate holding part 91 holds one substrate W. The substrate holding part 91 holds the substrate W in a horizontal position. The rotation drive part 92 is connected to the substrate holding part 91. The rotation drive part 92 rotates the substrate holding part 91. The guard 93 is arranged to surround the side of the substrate holding part 91. The guard 93 receives the processing liquid.

[0148] The processing units 7 are classified into a first processing unit 7A and a second processing unit 7B depending on the structure of the substrate holding part 91. The substrate holding part 91 of the first processing unit 7A is called a Bernoulli chuck or a Bernoulli gripper. The Bernoulli chuck is suitable for holding a relatively thin substrate W. The substrate holding part 91 of the second processing unit 7B is called a mechanical chuck or a mechanical gripper. The mechanical chuck is suitable for holding a relatively thick substrate W.

[0149] For example, each of the six processing units 7 arranged in the first processing section 42 is a first processing unit 7A. For example, each of the six processing units 7 arranged in the second processing section 43 is a second processing unit 7B.

[0150] Hereinafter, the substrate holding part 91 of the first processing unit 7A will be referred to as the "first substrate holding part 91A" where appropriate. The rotation drive part 92 of the first processing unit 7A will be referred to as the "first rotation drive part 92A" where appropriate. The substrate holding part 91 of the second processing unit 7B will be referred to as the "second substrate holding part 91B" where appropriate. The rotation drive part 92 of the second processing unit 7B will be referred to as the "second rotation drive part 92B" where appropriate.

[0151] Figure 19 is a diagram showing a schematic configuration of the first processing unit 7A, omitting the guard 93. The structure of the first processing unit 7A will be described.

[0152] The first substrate holding part 91A includes a first plate 101. The first plate 101 has a substantially disk shape. The first plate 101 has an upper surface 102. The upper surface 102 is substantially horizontal. The upper surface 102 is substantially flat.

[0153] The first rotation drive unit 92A is connected to the lower part of the first plate 101. The first rotation drive unit 92A rotates the first plate 101. The first rotation drive unit 92A causes the first plate 101 to rotate about a rotation axis A3. The rotation axis A3 is parallel to the vertical direction Z. The rotation axis A3 passes through the center of the first plate 101.

[0154] 20 is a plan view of the first plate 101. The top surface 102 of the first plate 101 is circular in plan view. The top surface 102 of the first plate 101 is larger than the substrate W in plan view.

[0155] The first substrate holding part 91A has a plurality of (for example, 30) fixed pins 103. The fixed pins 103 support the substrate W. Each fixed pin 103 is fixed to the first plate 101. Each fixed pin 103 is immovable relative to the first plate 101. Each fixed pin 103 is immovable relative to the first plate 101. Each fixed pin 103 is immovable relative to the first plate 101. Each fixed pin 103 does not have a movable part that is movable relative to the first plate 101.

[0156] The fixing pins 103 are arranged on the periphery of the upper surface 102 of the first plate 101. The fixing pins 103 are arranged on a circumference around the rotation axis A3 in a plan view. The fixing pins 103 are spaced apart from each other.

[0157] 19 and 20. The fixed pins 103 protrude upward from the upper surface 102 of the first plate 101. The fixed pins 103 contact the lower surface 16 of the substrate W. More specifically, the fixed pins 103 contact the lower surface 16 at the peripheral edge portion 12 of the substrate W. As a result, the fixed pins 103 support the substrate W at a position higher than the upper surface 102 of the first plate 101. FIG. 20 shows the substrate W supported by the fixed pins 103 by dashed lines.

[0158] The fixed pins 103 do not contact the upper surface 17 of the substrate W. The fixed pins 103 allow the substrate W to move upward relative to the fixed pins 103. The fixed pins 103 do not contact the edge 20 of the substrate W. The fixed pins 103 themselves allow the substrate W to slide relative to the fixed pins 103. In this way, the fixed pins 103 themselves do not hold the substrate W.

[0159] The first substrate holding part 91A is provided with a gas outlet 104. The gas outlet 104 is formed on the upper surface 102 of the first plate 101. The gas outlet 104 is disposed at a position overlapping the substrate W supported by the fixing pins 103 in a plan view. The gas outlet 104 blows gas upward. The gas outlet 104 blows gas between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103. The gas outlet 104 blows gas onto the substrate W from a position below the substrate W supported by the fixing pins 103. The gas is supplied between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103. The gas flows along the lower surface 16 of the substrate W supported by the fixing pins 103. In this way, the gas outlet 104 sucks the substrate W. Specifically, a negative pressure is created by gas flowing along the lower surface 16 of the substrate W. That is, the air pressure received by the lower surface 16 of the substrate W is lower than the air pressure received by the upper surface 17 of the substrate W. According to Bernoulli's principle, a downward force acts on the substrate W. That is, the substrate W is sucked downward. The substrate W is sucked toward the gas outlet 104 and the first plate 101. However, the gas outlet 104 does not come into contact with the substrate W. The first plate 101 also does not come into contact with the substrate W.

[0160] The gas outlet 104 sucks the substrate W downward, and the fixing pins 103 come into contact with the lower surface 16 of the substrate W, thereby supporting the substrate W and keeping it in a predetermined position. The suction force acting on the substrate W prevents the substrate W from sliding horizontally relative to the fixing pins 103. In other words, the first substrate holding part 91A holds the substrate W.

[0161] The gas outlet 104 includes one first outlet 105 and multiple second outlets 106. The first outlet 105 is disposed in the center of the upper surface 102 of the first plate 101. The first outlet 105 is disposed on the rotation axis A3 of the first plate 101. The second outlet 106 is disposed radially outward from the first outlet 105 about the rotation axis A3 of the first plate 101. The second outlet 106 is disposed radially inward from the fixing pin 103 about the rotation axis A3 of the first plate 101. The second outlets 106 are arranged circumferentially around the rotation axis A3 in a plan view.

[0162] The first processing unit 7A includes a first gas supply path 107 and a second gas supply path 108. The first gas supply path 107 supplies gas to the first blow-out port 105. The second gas supply path 108 supplies gas to the second blow-out port 106. A portion of the first gas supply path 107 and a portion of the second gas supply path 108 are formed inside the first plate 101. The first gas supply path 107 has a first end and a second end. The first end of the first gas supply path 107 is connected to a gas supply source 109. The second end of the first gas supply path 107 is connected to the first blow-out port 105. The second gas supply path 108 has a first end and a second end. The first end of the second gas supply path 108 is connected to the gas supply source 109. The second end of the second gas supply path 108 is connected to the second blow-out port 106. The gas supplied to the first outlet 105 and the second outlet 106 is, for example, nitrogen gas or air. The gas supplied to the first outlet 105 and the second outlet 106 is, for example, high-pressure gas or compressed gas.

[0163] The first processing unit 7A includes a first blow-out adjustment unit 111 and a second blow-out adjustment unit 112. The first blow-out adjustment unit 111 is provided in the first gas supply path 107. The second blow-out adjustment unit 112 is provided in the second gas supply path 108. The first blow-out adjustment unit 111 adjusts the flow rate of the gas blown out from the first blow-out outlet 105. That is, the first blow-out adjustment unit 111 adjusts the flow rate of the gas supplied to the first blow-out outlet 105. The second blow-out adjustment unit 112 adjusts the flow rate of the gas blown out from the second blow-out outlet 106. That is, the second blow-out adjustment unit 112 adjusts the flow rate of the gas supplied to the second blow-out outlet 106. As the flow rate of the gas blown out from the first blow-out outlet 105 increases, the suction force acting on the substrate W increases. As the flow rate of the gas blown out from the second blow-out outlet 106 increases, the suction force acting on the substrate W increases.

[0164] The first air outlet adjustment unit 111 cannot adjust the flow rate of the gas blown out from the second air outlet 106. The second air outlet adjustment unit 112 cannot adjust the flow rate of the gas blown out from the first air outlet 105. The first air outlet adjustment unit 111 and the second air outlet adjustment unit 112 can operate independently of each other. Therefore, the flow rate of the gas blown out from the first air outlet 105 and the flow rate of the gas blown out from the second air outlet 106 can be adjusted independently of each other. The first air outlet adjustment unit 111 and the second air outlet adjustment unit 112 each include, for example, a flow rate adjustment valve. The first air outlet adjustment unit 111 and the second air outlet adjustment unit 112 may each further include an on-off valve.

[0165] The processing unit 7 includes a plurality of (e.g., six) position adjustment pins 113. The position adjustment pins 113 are supported by the first plate 101. The position adjustment pins 113 are movable in the horizontal direction relative to the first plate 101. As the position adjustment pins 113 move relative to the first plate 101, the position adjustment pins 113 can come into contact with the substrate W supported by the fixed pins 103 and can move away from the substrate W supported by the fixed pins 103. More specifically, the position adjustment pins 113 can come into contact with the edge 20 of the substrate W supported by the fixed pins 103. The position adjustment pins 113 adjust the position of the substrate W supported by the fixed pins 103. The position adjustment pins 113 adjust the position of the substrate W in the horizontal direction. The position adjustment pins 113 position the center J of the substrate W supported by the fixed pins 103 on the rotation axis A3 of the first plate 101.

[0166] In this specification, the position of the position adjustment pin 113 in contact with the substrate W is referred to as the "adjustment position." The position of the position adjustment pin 113 away from the substrate W is referred to as the "retracted position." The position adjustment pin 113 is movable between the adjustment position and the retracted position.

[0167] The position adjustment pins 113 are arranged on the periphery of the upper surface 102 of the first plate 101. The position adjustment pins 113 are arranged on a circumference around the rotation axis A3 in a plan view. The position adjustment pins 113 are arranged at approximately the same height as the substrate W supported by the fixing pins 103.

[0168] Figures 21(a) and 21(b) are detailed plan views of the position adjustment pin. Figures 22(a) and 22(b) are side views of the position adjustment pin. Figures 21(a) and 22(a) show the position adjustment pin 113 in the retracted position. Figures 21(b) and 22(b) show the position adjustment pin 113 in the adjusted position. Each position adjustment pin 113 is fixed to a shaft portion 114. The shaft portion 114 extends downward from the position adjustment pin 113. The shaft portion 114 is supported by the first plate 101. The position adjustment pin 113 is supported by the first plate 101 via the shaft portion 114. The shaft portion 114 is rotatable relative to the first plate 101. The shaft portion 114 is rotatable around a rotation axis A4. The rotation axis A4 is parallel to the vertical direction Z. The rotation axis A4 passes through the center of the shaft portion 114. The position adjustment pin 113 is disposed at a position eccentric to the rotation axis A4 of the shaft portion 114. As the shaft portion 114 rotates relative to the first plate 101, the position adjustment pin 113 moves horizontally relative to the first plate 101. Specifically, the position adjustment pin 113 pivots about the rotation axis A4. As a result, the position adjustment pin 113 moves closer to the rotation axis A3 of the first plate 101 and further away from the rotation axis A3 of the first plate 101. As the position adjustment pin 113 approaches the rotation axis A3 of the first plate 101, the position adjustment pin 113 moves to the adjustment position. In other words, the position adjustment pin 113 comes into contact with the edge 20 of the substrate W supported by the fixing pin 103. Furthermore, the position adjustment pin 113 pushes the edge 20 of the substrate W that is in contact with the position adjustment pin 113 toward the rotation axis A4. The substrate W is adjusted to a predetermined position by a plurality of position adjustment pins 113 provided at different positions pressing against the edge 20 of the substrate W. As the position adjustment pins 113 move away from the rotation axis A3 of the first plate 101, the position adjustment pins 113 move to the retracted position. The position adjustment pins 113 move away from the edge 20 of the substrate W supported by the fixed pins 103.

[0169] 20, the processing unit 7 includes a plurality of (e.g., six) lift pins 116. The lift pins 116 are arranged on the periphery of the upper surface 102 of the first plate 101. The position adjustment pins 113 are arranged circumferentially around the rotation axis A3 in a plan view.

[0170] 23(a) and 23(b) are side views of the lift pins 116. The lift pins 116 are supported by the first plate 101. The lift pins 116 are supported so as to be movable in the vertical direction Z relative to the first plate 101. The lift pins 116 support the substrate W. The lift pins 116 move the substrate W supported by the lift pins 116 in the vertical direction Z.

[0171] 23(a) shows the lift pins 116 in the upper position. The lift pins 116 are capable of supporting the substrate W in the upper position. When the substrate W is in the upper position, the substrate W is at a higher position than the fixed pins 103.

[0172] 23(b), the lift pins 116 lower the substrate W from the upper position, thereby transferring the substrate W to the fixed pins 103. After the lift pins 116 transfer the substrate W to the fixed pins 103, the lift pins 115 further move downward relative to the first plate 101, and move away from the substrate W supported by the fixed pins 103.

[0173] In this specification, the position of the lift pins 116 that is not in contact with the substrate W supported by the fixed pins 103 is referred to as the lower position. Figure 23(b) shows the lift pins 116 in the lower position.

[0174] The lift pins 116 move upward from the lower position to remove the substrate W from the fixed pins 103 .

[0175] In this way, the lift pins 116 move between the upper position and the lower position, whereby the lift pins 116 transfer the substrate W to the fixed pins 103 and take the substrate W from the fixed pins 103.

[0176] 19, the first processing unit 7A includes a processing liquid supply part 121. The processing liquid supply part 121 supplies the processing liquid to the substrate W.

[0177] The processing liquid supply unit 121 includes a nozzle 122. The nozzle 122 ejects the processing liquid onto the substrate W. The nozzle 122 is provided so as to be movable between a processing position and a retracted position. In FIG. 19, the nozzle 122 in the processing position is shown by a dashed line. In FIG. 19, the nozzle 122 in the retracted position is shown by a solid line. The processing position is a position above the substrate W held by the first substrate holding unit 91A. When the nozzle 122 is in the processing position, the nozzle 122 overlaps with the substrate W held by the first substrate holding unit 91A in a planar view. When the nozzle 122 is in the retracted position, the nozzle 122 does not overlap with the substrate W held by the first substrate holding unit 91A in a planar view.

[0178] The processing liquid supply unit 121 includes a pipe 123. The pipe 123 supplies the processing liquid to the nozzle 122. The pipe 123 has a first end and a second end. The first end of the pipe 123 is connected to a processing liquid supply source 124. The second end of the pipe 123 is connected to the nozzle 122.

[0179] The first processing unit 7A includes a flow rate adjuster 125. The flow rate adjuster 125 is provided on the pipe 123. The flow rate adjuster 125 adjusts the flow rate of the processing liquid supplied to the substrate W by the processing liquid supply unit 121. In other words, the flow rate adjuster 125 adjusts the flow rate of the processing liquid discharged from the nozzle 122.

[0180] The first processing unit 7A includes a substrate detector 127. The substrate detector 127 detects the substrate W supported by the fixing pins 103. Furthermore, the substrate detector 127 detects the position of the substrate W supported by the fixing pins 103. The substrate detector 127, for example, captures an image of the edge 20 of the substrate W supported by the fixing pins 103. The substrate detector 127 is, for example, disposed above the first substrate holder 91A. The substrate detector 127 is, for example, an image sensor.

[0181] 2, the first rotation drive unit 92A, position adjustment pins 113, lift pins 116, first blow-out adjustment unit 111, second blow-out adjustment unit 112, flow rate adjustment unit 125, and substrate detection unit 127 of the first processing unit 7A are communicatively connected to the control unit 9. The control unit 9 receives the detection result of the substrate detection unit 127. The control unit 9 controls the first rotation drive unit 92A, position adjustment pins 113, lift pins 116, first blow-out adjustment unit 111, second blow-out adjustment unit 112, and flow rate adjustment unit 125.

[0182] The fixed pin 103 is an example of a support portion in the present invention. The position adjustment pin 113 is an example of a position adjustment portion in the present invention. The lift pin 116 is an example of a lift portion in the present invention.

[0183] Figure 24 is a diagram showing a schematic configuration of the second processing unit 7B. The guard 93 is not shown in Figure 24. The structure of the second processing unit 7B will be described in detail. Note that the same components as those in the first processing unit 7A are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0184] The second substrate holding part 91B includes a second plate 131. The second plate 131 has a substantially disc shape. The second plate 131 has an upper surface 132. The upper surface 132 is substantially horizontal. The upper surface 132 is substantially flat.

[0185] The second rotation drive unit 92B is connected to the lower part of the second plate 131. The second rotation drive unit 92B rotates the second plate 131. The second rotation drive unit 92B causes the second plate 131 to rotate around a rotation axis A5. The rotation axis A5 is parallel to the vertical direction Z. The rotation axis A5 passes through the center of the second plate 131.

[0186] 25 is a plan view of the second plate 131. The upper surface 132 of the second plate 131 is circular in plan view. The upper surface 132 of the second plate 131 is larger than the substrate W in plan view.

[0187] The second substrate holding unit 91B is equipped with a plurality of (for example, six) edge contact pins 133. The edge contact pins 133 are attached to the second plate 131. The edge contact pins 133 are supported by the second plate 131. The edge contact pins 133 are movable relative to the second plate 131. When the second rotation drive unit 92B rotates the second substrate holding unit 91B, the edge contact pins 133 come into contact with the edge 20 of the substrate W. When the second rotation drive unit 92B rotates the second substrate holding unit 91B, the edge contact pins 133 hold the edge 20 of the substrate W to prevent the substrate W from slipping relative to the edge contact pins 133. Figure 25 shows the substrate W held by the edge contact pins 133 by dashed lines.

[0188] The edge contact pins 133 are disposed on the peripheral edge of the second plate 131. The edge contact pins 133 are arranged circumferentially around the rotation axis A5 in a plan view.

[0189] 26(a) and 26(b) are detailed plan views of the edge contact pin 133. Figures 27(a) and 27(b) are side views of the edge contact pin 133. The edge contact pin 133 and the configuration associated with the edge contact pin 133 are illustrated.

[0190] Each edge contact pin 133 is fixed to a small piece 134. The small piece 134 is sufficiently smaller than the second plate 131. The small piece 134 has a wedge shape in a plan view. The small piece 134 extends horizontally.

[0191] The small piece portion 134 further supports a lower surface contact pin 135. The lower surface contact pin 135 is also fixed to the small piece portion 134. The edge contact pin 133 and the lower surface contact pin 135 each protrude upward from the small piece portion 134. The lower surface contact pin 135 contacts the lower surface 16 of the substrate W. More specifically, the lower surface contact pin 135 contacts the lower surface 16 at the peripheral edge portion 12 of the substrate W. In this way, the lower surface contact pin 135 supports the substrate W. The lower surface contact pin 135 does not contact the upper surface 17 of the substrate W. The lower surface contact pin 135 allows the substrate W to move upward relative to the lower surface contact pin 135.

[0192] The small piece portion 134 is fixed to the shaft portion 136. The shaft portion 136 extends downward from the small piece portion 134. The shaft portion 136 is supported by the second plate 131. The edge contact pin 133 and the lower surface contact pin 135 are supported by the second plate 131 via the shaft portion 136. The shaft portion 136 is rotatable relative to the second plate 131. The shaft portion 136 is rotatable around a rotation axis A6. The rotation axis A6 is parallel to the vertical direction Z. The rotation axis A6 passes through the center of the shaft portion 136.

[0193] The lower surface contact pin 135 is disposed on the rotation axis A6 of the shaft portion 136. The rotation axis A6 passes through the center of the lower surface contact pin 135. When the shaft portion 136 rotates relative to the second plate 131, the lower surface contact pin 135 also rotates relative to the second plate 131. However, the position of the lower surface contact pin 135 relative to the second plate 131 does not substantially change. The distance between the lower surface contact pin 135 and the rotation axis A5 does not change.

[0194] The edge contact pin 133 is disposed at a position eccentric to the rotation axis A6 of the shaft portion 136. As the shaft portion 136 rotates relative to the second plate 131, the edge contact pin 133 moves horizontally relative to the second plate 131. Specifically, the edge contact pin 133 moves closer to the rotation axis A5 of the second plate 131 and moves away from the rotation axis A5 of the second plate 131.

[0195] 26(a) and 27(a), as the edge contact pins 133 approach the rotation axis A5 of the second plate 131, the edge contact pins 133 come into contact with the edge 20 of the substrate W supported by the lower surface contact pins 135. Furthermore, the edge contact pins 133 may push the edge 20 of the substrate W that is in contact with the edge contact pins 133 toward the rotation axis A5.

[0196] 26(b) and 27(b), as the edge contact pins 133 move away from the rotation axis A4 of the second plate 131, the edge contact pins 133 move away from the edge 20 of the substrate W supported by the lower surface contact pins 135.

[0197] When the second rotation drive unit 92B rotates the second substrate holding unit 91B, the edge contact pins 133 do not separate from the substrate W. The second rotation drive unit 92B rotates the second substrate holding unit 91B with the edge contact pins 133 in contact with the edge 20 of the substrate W. This prevents the substrate W from slipping relative to the edge contact pins 133 when the second substrate holding unit 91B rotates. In other words, the edge contact pins 133 hold the edge 20 of the substrate W.

[0198] In the second substrate holding part 91B, the lift pins 116 can support the substrate W at a position higher than the lower surface contact pins 135. The lift pins 116 can transfer the substrate W to the lower surface contact pins 135 and can also remove the substrate W from the lower surface contact pins 135.

[0199] The second substrate holding part 91B does not suck the substrate W held by the edge contact pins 133. The second substrate holding part 91B does not blow gas between the upper surface 132 of the second plate 131 and the lower surface 16 of the substrate W held by the edge contact pins 133. The second plate 131 does not have a gas blowing outlet.

[0200] 2, the second rotation drive unit 92B, the lift pins 116, the flow rate adjuster 125, and the edge contact pins 133 of the second processing unit 7B are communicatively connected to the control unit 9. The control unit 9 controls the second rotation drive unit 92B, the lift pins 116, the flow rate adjuster 125, and the edge contact pins 133.

[0201] The edge contact pin 133 is an example of an edge contact portion in the present invention.

[0202] <Operation example of substrate processing apparatus 1> The following operation examples will be explained in order. An example of operation in which the control unit 9 acquires the shape of the substrate W Operation example of transport mechanism 4 Operation example of transport mechanism 8 Operation example of the first processing unit 7A Operation example of the second processing unit 7B

[0203] <Example of Operation in Which the Control Unit 9 Acquires the Shape of the Substrate W> FIG. 28 is a flowchart showing the procedure of an example of an operation in which the control unit 9 acquires the shape of the substrate W.

[0204] Step S1 The barcode reader 31 reads the barcode attached to the carrier C. The barcode reader 31 outputs the detection result of the barcode reader 31 to the control unit 9.

[0205] Step S2 The control unit 9 determines the shape of the substrate W based on the detection result of the barcode reader 31. Specifically, the control unit 9 identifies whether the substrate W in the carrier C belongs to the first substrate W1, the second substrate W2, or the third substrate W3. The control unit 9 identifies whether the substrate W in the carrier C belongs to the normal diameter substrate WN or the large diameter substrate WL.

[0206] The control unit 9 manages the position of the substrate W in association with the shape of the substrate W even after the substrate W is unloaded from the carrier C. Specifically, the control unit 9 manages the shape of the substrate W transported by the transport mechanisms 4 and 8 at each time, the shape of the substrate W placed on the receiver 6 at each time, and the shape of the substrate W processed by the processing unit 7 at each time. When the control unit 9 manages the position and shape of the substrate W, the control unit 9 may refer to the detection results of the substrate detectors 38, 89, and 127 as appropriate.

[0207] <Operation example of transport mechanism 4> FIG. 29 is a flowchart showing the procedure of the control by the control unit 9 and the operation of the transport mechanism 4.

[0208] Step S11 The control unit 9 determines the height position of the hand 33 when the hand 33 of the transport mechanism 4 is inserted into the carrier C. Specifically, the control unit 9 determines the height position of the hand 33 when the hand 33 of the transport mechanism 4 is inserted between two shelves 22 adjacent in the vertical direction Z. Hereinafter, the height position of the hand 33 when the hand 33 of the transport mechanism 4 is inserted between two shelves 22 adjacent in the vertical direction Z is abbreviated as "height position HA." The control unit 9 changes the height position HA depending on the shape of the substrate W that the transport mechanism 4 picks up from the shelf 22 or the substrate W that the transport mechanism 4 places on the shelf 22.

[0209] Specifically, when the substrate W that the transport mechanism 4 picks up from the shelf 22 or the substrate W that the transport mechanism 4 places on the shelf 22 is the first substrate W1, the control unit 9 determines the height position HA to be the first height position HA1. When the substrate W that the transport mechanism 4 picks up from the shelf 22 or the substrate W that the transport mechanism 4 places on the shelf 22 is the second substrate W2, the control unit 9 determines the height position HA to be the second height position HA2. When the substrate W that the transport mechanism 4 picks up from the shelf 22 or the substrate W that the transport mechanism 4 places on the shelf 22 is the third substrate W3, the control unit 9 determines the height position HA to be the third height position HA3. The second height position HA2 is higher than the first height position HA1. The third height position HA3 is higher than the first height position HA1. The third height position HA3 is the same as the second height position HA2.

[0210] Similarly, the control unit 9 determines the height position of the hand 33 of the transport mechanism 4 when the hand 33 is inserted into the receiver 6. Specifically, the control unit 9 determines the height position of the hand 33 when the hand 33 of the transport mechanism 4 is inserted between two shelves 45 adjacent in the vertical direction Z. Hereinafter, the height position of the hand 33 when the hand 33 of the transport mechanism 4 is inserted between two shelves 45 adjacent in the vertical direction Z is abbreviated as "height position HB." The control unit 9 changes the height position HB depending on the shape of the substrate W that the transport mechanism 4 picks up from the shelf 45 or the substrate W that the transport mechanism 4 places on the shelf 45.

[0211] Specifically, when the substrate W that the transport mechanism 4 picks up from the shelf 45 or the substrate W that the transport mechanism 4 places on the shelf 45 is the first substrate W1, the control unit 9 determines the height position HB to be the first height position HB1. When the substrate W that the transport mechanism 4 picks up from the shelf 45 or the substrate W that the transport mechanism 4 places on the shelf 45 is the second substrate W2, the control unit 9 determines the height position HB to be the second height position HB2. When the substrate W that the transport mechanism 4 picks up from the shelf 45 or the substrate W that the transport mechanism 4 places on the shelf 45 is the third substrate W3, the control unit 9 determines the height position HB to be the third height position HB3. The second height position HB2 is higher than the first height position HB1. The third height position HB3 is higher than the first height position HB1. The third height position HB3 is the same as the second height position HB2.

[0212] Step S12 The control unit 9 determines the insertion amount of the hand 33 of the transport mechanism 4 when the hand 33 is inserted between two shelves 22 adjacent in the vertical direction Z. The insertion amount of the hand 33 inserted between two shelves 22 adjacent in the vertical direction Z corresponds to the movement amount of the hand 33 in the front-to-rear direction X when the hand 33 of the transport mechanism 4 is inserted between two shelves 22 adjacent in the vertical direction Z. Hereinafter, the insertion amount of the hand 33 inserted between two shelves 22 adjacent in the vertical direction Z will be abbreviated as the "insertion amount KA." The control unit 9 changes the insertion amount KA depending on the shape of the substrate W that the transport mechanism 4 takes from the shelf 22 or the substrate W that the transport mechanism 4 places on the shelf 22.

[0213] When the substrate W that the transport mechanism 4 takes from the shelf 22 or the substrate W that the transport mechanism 4 places on the shelf 22 is a normal diameter substrate WN, the control unit 9 determines the insertion amount KA to be the first insertion amount KA1. When the substrate W that the transport mechanism 4 takes from the shelf 22 or the substrate W that the transport mechanism 4 places on the shelf 22 is a large diameter substrate WL, the control unit 9 determines the insertion amount KA to be the second insertion amount KA2. The second insertion amount KA2 is greater than the first insertion amount KA1.

[0214] Similarly, the control unit 9 determines the insertion amount of the hand 33 when the hand 33 of the transport mechanism 4 is inserted between two shelves 45 adjacent in the vertical direction Z. Hereinafter, the insertion amount of the hand 33 inserted between two shelves 45 adjacent in the vertical direction Z is abbreviated as "insertion amount KB." The control unit 9 changes the insertion amount KB depending on the shape of the substrate W that the transport mechanism 4 takes from the shelf 45 or the substrate W that the transport mechanism 4 places on the shelf 45.

[0215] When the substrate W that the transport mechanism 4 takes from the shelf 45 or the substrate W that the transport mechanism 4 places on the shelf 45 is a normal diameter substrate WN, the control unit 9 determines the insertion amount KB to be the first insertion amount KB1. When the substrate W that the transport mechanism 4 takes from the shelf 45 or the substrate W that the transport mechanism 4 places on the shelf 45 is a large diameter substrate WL, the control unit 9 determines the insertion amount KB to be the second insertion amount KB2. The second insertion amount KB2 is greater than the first insertion amount KB1.

[0216] Step S13 The control unit 9 determines the movement speed and acceleration of the hand 33 of the transport mechanism 4. Hereinafter, the movement speed of the hand 33 of the transport mechanism 4 will be abbreviated as "movement speed VA." Hereinafter, the acceleration of the hand 33 of the transport mechanism 4 will be abbreviated as "acceleration AA." The control unit 9 changes the movement speed VA depending on whether the transport mechanism 4 is supporting a substrate W. The control unit 9 changes the acceleration AA depending on whether the transport mechanism 4 is supporting a substrate W.

[0217] When the control unit 9 determines the moving speed VA and the acceleration AA, the control unit 9 may refer to the detection result of the board detection unit 38 as appropriate.

[0218] When the transport mechanism 4 supports the substrate W, the control unit 9 determines the moving speed VA to be a first speed VA1. When the transport mechanism 4 does not support the substrate W, the control unit 9 determines the moving speed VA to be a second speed VA2. The second speed VA2 is greater than the first speed VA1. For example, the first speed VA1 is 50% or less of the second speed VA2.

[0219] When the transport mechanism 4 supports the substrate W, the control unit 9 determines the acceleration AA to be the first acceleration AA1. When the transport mechanism 4 does not support the substrate W, the control unit 9 determines the acceleration AA to be the second acceleration AA2. The second acceleration AA2 is greater than the first acceleration AA1. For example, the first acceleration AA1 is 70% or less of the second acceleration AA2.

[0220] Step S14 The control unit 9 controls the transport mechanism 4 (specifically, the hand driving unit 34) based on the determined height positions HA, HB, insertion amounts KA, KB, movement speed VA, and acceleration AA.

[0221] Step S15 Under the control of the control unit 9, the hand driving unit 34 of the transport mechanism 4 moves the hand 33. In this way, the transport mechanism 4 transports the substrate W.

[0222] The following operation example will be specifically described. An example of the operation of the transport mechanism 4 to take the substrate W from the shelf 22 of the carrier C An example of the operation of the transport mechanism 4 transporting the substrate W from the carrier C to the mount 6 An example of the operation of the transport mechanism 4 placing the substrate W on the shelf 45 of the placement unit 6

[0223] <<Example of Operation in Which the Transport Mechanism 4 Takes a Substrate W from the Shelf 22 of the Carrier C>> 30(a) to 30(d) are diagrams schematically showing an example of the operation of the transport mechanism 4 to take the substrate W from the shelf 22 of the carrier C.

[0224] 30(a), the hand 33 does not support the substrate W. The hand 33 moves to a position facing the carrier C. The hand 33 is adjusted to a height position HA determined by the control unit 9.

[0225] See Figure 30(b). The hand 33 enters between two shelves 22 adjacent in the vertical direction Z at a height position HA determined by the control unit 9. At this time, the hand 33 moves horizontally. Specifically, the hand 33 moves in the front-to-rear direction X. The first direction F1 in which the rod 36 extends coincides with the movement direction of the hand 33. In other words, the hand 33 enters between two shelves 22 adjacent in the vertical direction Z while maintaining the first direction F1 as the movement direction of the hand 33.

[0226] The hand 33 advances between two shelves 22 adjacent in the vertical direction Z by an insertion amount KA determined by the control unit 9, and then stops.

[0227] In the procedure up to this point, the hand 33 moves at the second velocity VA2 and the second acceleration AA2.

[0228] 30(c), the hand 33 moves upward and passes between the first shelf 23 and the second shelf 24 included in one shelf 22. In this way, the hand 33 picks up one substrate W from one shelf 22.

[0229] See Figure 30(d). With the hand 33 supporting the substrate W, the hand 33 retreats and moves out of the carrier C. From this step, the hand 33 moves at a first velocity VA1 and a first acceleration AA1.

[0230] In the above-described operation example, if the substrate W placed on the shelf 22 belongs to the first substrate W1, the hand 33 enters between two shelves 22 adjacent in the vertical direction Z at a first height position HA1. If the substrate W placed on the shelf 22 belongs to the second substrate W2, the hand 33 enters between two shelves 22 adjacent in the vertical direction Z at a second height position HA2. If the substrate W placed on the shelf 22 belongs to the third substrate W3, the hand 33 enters between two shelves 22 adjacent in the vertical direction Z at a third height position HA3. If the substrate W placed on the shelf 22 is a normal diameter substrate WN, the hand 33 advances a first insertion amount KA1 between two shelves 22 adjacent in the vertical direction Z and then stops. When the substrate W placed on the shelf 22 is a large-diameter substrate WL, the hand 33 advances by the second insertion amount KA2 between two shelves 22 adjacent in the vertical direction Z, and then stops.

[0231] 31(a) and 31(b) are diagrams showing the relationship between the substrate W placed on the shelf 22 and the insertion height HA of the hand 33. In FIG. 31(a), the first substrate W1 is placed on the shelf 22. In FIG. 31(b), the second substrate W2 or the third substrate W3 is placed on the shelf 22.

[0232] The first substrate W1 bends more than the second substrate W2 and the third substrate W3. Specifically, the first substrate W1 curves downward in a convex shape. As described above, the first height position HA1 is lower than the second height position HA2 and the third height position HA3. Therefore, the hand 33 can enter between two shelves 22 adjacent in the vertical direction Z without interfering with the first substrate W1.

[0233] The amount of deflection of the second substrate W2 or the third substrate W3 is smaller than that of the first substrate W1. As described above, the second height position HA2 and the third height position HA3 are both higher than the first height position HA1. Therefore, the hand 33 can enter between two shelves 22 adjacent in the vertical direction Z without interfering with the second substrate W2 or the third substrate W3.

[0234] <<Example of Operation in Which the Transport Mechanism 4 Transports the Substrate W from the Carrier C to the Receiving Unit 6>> With the hand 33 supporting the substrate W, the hand 33 moves from the carrier C to the receiver 6. As a result, the transport mechanism 4 transports the substrate W from the carrier C to the receiver 6. When the transport mechanism 4 transports the substrate W from the carrier C to the receiver 6, the hand 33 moves at a first velocity VA1 and a first acceleration AA1.

[0235] <<Example of Operation in Which the Transport Mechanism 4 Places the Substrate W on the Shelf 45 of the Mounting Unit 6>> 32(a) to 32(d) are diagrams schematically showing an example of the operation of the transport mechanism 4 to take the substrate W from the shelf 45 of the receiver 6. FIG.

[0236] 32(a), the hand 33 supports the substrate W. The hand 33 moves to a position facing the mounting unit 6. The hand 33 is adjusted to a height position HB determined by the control unit 9.

[0237] 32(b), the hand 33 enters between two shelves 45 adjacent in the vertical direction Z at a height position HB determined by the control unit 9. The hand 33 advances between the two shelves 45 adjacent in the vertical direction Z by an insertion amount KB determined by the control unit 9, and then stops.

[0238] In the procedure up to this point, the hand 33 moves at a first velocity VA1 and a first acceleration AA1.

[0239] 32(c), the hand 33 moves downward and passes between the first shelf 46 and the second shelf 47 included in one shelf 45. As a result, the hand 33 places one substrate W on one shelf 45. The hand 33 then moves away from the substrate W on the shelf 45.

[0240] The substrate W is guided by the first inclined surface 51 and the second inclined surface 55 of the shelf 45. As a result, when the substrate W is placed on the shelf 45, the substrate W is positioned at a predetermined position. Even if the position at which the hand 33 places the substrate W on the shelf 45 varies, the shelf 45 adjusts the position of the substrate W so that the variation in the position of the substrate W is reduced.

[0241] 32(d), the hand 33 retracts and moves out of the receiver 6 while not supporting the substrate W. From this step, the hand 33 moves at a second velocity VA2 and a second acceleration AA2.

[0242] In the above-described operation example, if the substrate W supported by the hand 33 belongs to the first substrate W1, the hand 33 enters between two shelves 45 adjacent in the vertical direction Z at a first height position HB1. If the substrate W supported by the hand 33 belongs to the second substrate W2, the hand 33 enters between two shelves 45 adjacent in the vertical direction Z at a second height position HA2. If the substrate W supported by the hand 33 belongs to the third substrate W3, the hand 33 enters between two shelves 45 adjacent in the vertical direction Z at a third height position HA3. If the substrate W supported by the hand 33 belongs to the normal diameter substrate WN, the hand 33 advances a first insertion amount KB1 between two shelves 45 adjacent in the vertical direction Z and then stops. When the substrate W supported by the hand 33 is a large-diameter substrate WL, the hand 33 advances between two shelves 45 adjacent in the vertical direction Z by a second insertion amount KB2.

[0243] The operation by which the transport mechanism 4 takes the substrate W from the shelf 45 of the receiver 6 is substantially the same as the operation by which the transport mechanism 4 takes the substrate W from the shelf 22 of the carrier C. The operation by which the transport mechanism 4 places the substrate W on the shelf 22 of the carrier C is substantially the same as the operation by which the transport mechanism 4 places the substrate W on the shelf 45 of the receiver 6.

[0244] <Operation example of the transport mechanism 8> FIG. 33 is a flowchart showing the procedure of the control by the control unit 9 and the operation of the transport mechanism 8.

[0245] Step S21 The control unit 9 determines the height position of the hand 33 when the hand 61 of the transport mechanism 8 is inserted into the receiver 6. Specifically, the control unit 9 determines the height position of the hand 61 when the hand 61 of the transport mechanism 8 is inserted between two shelves 45 adjacent in the vertical direction Z. Hereinafter, the height position of the hand 61 when the hand 61 of the transport mechanism 8 is inserted between two shelves 45 adjacent in the vertical direction Z is abbreviated as the "height position HC." The control unit 9 changes the height position HC depending on the shape of the substrate W that the transport mechanism 8 picks up from the shelf 45 or the substrate W that the transport mechanism 8 places on the shelf 45.

[0246] Specifically, when the substrate W that the transport mechanism 8 picks up from the shelf 45 or the substrate W that the transport mechanism 8 places on the shelf 45 is the first substrate W1, the control unit 9 determines the height position HC to be the first height position HC1. When the substrate W that the transport mechanism 8 picks up from the shelf 45 or the substrate W that the transport mechanism 8 places on the shelf 45 is the second substrate W2, the control unit 9 determines the height position HC to be the second height position HC2. When the substrate W that the transport mechanism 8 picks up from the shelf 45 or the substrate W that the transport mechanism 8 places on the shelf 45 is the third substrate W3, the control unit 9 determines the height position HC to be the third height position HC3. The second height position HC2 is higher than the first height position HC1. The third height position HC3 is higher than the first height position HC1. The third height position HC3 is the same as the second height position HC2.

[0247] Step S22 The control unit 9 determines the insertion amount of the hand 61 of the transport mechanism 8 when the hand 61 is inserted between two shelves 45 adjacent in the vertical direction Z. The insertion amount of the hand 61 inserted between two shelves 45 adjacent in the vertical direction Z corresponds to the movement amount of the hand 61 in the front-to-rear direction X when the hand 61 of the transport mechanism 8 is inserted between two shelves 45 adjacent in the vertical direction Z. Hereinafter, the insertion amount of the hand 61 inserted between two shelves 45 adjacent in the vertical direction Z will be abbreviated as "insertion amount KC." The control unit 9 changes the insertion amount KC depending on the shape of the substrate W that the transport mechanism 8 takes from the shelf 45 or the substrate W that the transport mechanism 8 places on the shelf 45.

[0248] When the substrate W that the transport mechanism 8 takes from the shelf 45 or the substrate W that the transport mechanism 8 places on the shelf 45 is a normal diameter substrate WN, the control unit 9 determines the insertion amount KC to be a first insertion amount KC1. When the substrate W that the transport mechanism 8 takes from the shelf 45 or the substrate W that the transport mechanism 8 places on the shelf 45 is a large diameter substrate WL, the control unit 9 determines the insertion amount KC to be a second insertion amount KC2. The second insertion amount KC2 is greater than the first insertion amount KC1.

[0249] Step S23 The control unit 9 determines the flow rate of the gas supplied to the suction unit 68. Hereinafter, the flow rate of the gas supplied to the suction unit 68 will be abbreviated as "flow rate M." The control unit 9 changes the flow rate M depending on the shape of the substrate W transported by the transport mechanism 8.

[0250] Specifically, when the transport mechanism 8 transports the first substrate W1, the control unit 9 adjusts the flow rate M to a first flow rate M1. When the transport mechanism 8 transports the second substrate W2, the control unit 9 adjusts the flow rate M to a second flow rate M2. When the transport mechanism 8 transports the third substrate W3, the control unit 9 adjusts the flow rate M to a third flow rate M3. The second flow rate M2 is greater than the first flow rate M1. The third flow rate M3 is greater than the first flow rate M1.

[0251] Step S24 The control unit 9 determines the processing unit 7 that will process the substrate W. More specifically, the control unit 9 determines, depending on the shape of the substrate W, the processing unit 7 that will process the substrate W to be either the first processing unit 7A or the second processing unit 7B.

[0252] Specifically, when the substrate W is the first substrate W1, the control unit 9 determines that the substrate W is to be processed in the first processing unit 7A. When the substrate W is the second substrate W2, the control unit 9 determines that the substrate W is to be processed in the second processing unit 7B. When the substrate W is the third substrate W3, the control unit 9 determines that the substrate W is to be processed in the second processing unit 7B.

[0253] Step S25 The control unit 9 determines the movement speed and acceleration of the hand 61 of the transport mechanism 8. Hereinafter, the movement speed of the hand 61 of the transport mechanism 8 is abbreviated as "movement speed VB." Hereinafter, the acceleration of the hand 61 of the transport mechanism 8 is abbreviated as "acceleration AB." The control unit 9 changes the movement speed VB depending on whether the transport mechanism 8 is supporting a substrate W. The control unit 9 changes the acceleration AB depending on whether the transport mechanism 8 is supporting a substrate W.

[0254] When the control unit 9 determines the moving speed VB and the acceleration AB, the control unit 9 may refer to the detection result of the board detection unit 89 as appropriate.

[0255] Specifically, when the transport mechanism 8 supports the substrate W, the control unit 9 determines the moving speed VB to be a first speed VB1. When the transport mechanism 8 does not support the substrate W, the control unit 9 determines the moving speed VB to be a second speed VB2. The second speed VB2 is greater than the first speed VB1. For example, the first speed VB1 is 50% or less of the second speed VB2.

[0256] When the transport mechanism 8 supports the substrate W, the control unit 9 determines the acceleration AB to be the first acceleration AB1. When the transport mechanism 8 does not support the substrate W, the control unit 9 determines the acceleration AB to be the second acceleration AB2. The second acceleration AB2 is greater than the first acceleration AB1. For example, the first acceleration AB1 is 70% or less of the second acceleration AB2.

[0257] Step S26 The control unit 9 controls the transport mechanism 8 (specifically, the hand driving unit 62) based on the determined height position HC, insertion amount KC, flow rate M, processing unit 7, movement speed VB, and acceleration AB. The determined processing unit 7 is specifically one of the first processing unit 7A and the second processing unit 7B.

[0258] Step S27 Under the control of the control unit 9, the hand driving unit 62 of the transport mechanism 8 moves the hand 61. As a result, the transport mechanism 8 transports the substrate W.

[0259] The following operation example will be specifically described. An example of the operation of the transport mechanism 8 to take the substrate W from the shelf 45 of the mounting section 6 Operation example of the transport mechanism 8 transporting the substrate W from the receiver 6 to the processing unit 7 An example of an operation in which the transport mechanism 8 transfers the substrate W to the substrate holder 91 of the processing unit An example of the operation of the transfer mechanism 8 to take the substrate W from the substrate holder 91 of the processing unit 7 An example of the operation in which the transport mechanism 8 delivers the substrate W to the shelf 45 of the mounting section 6

[0260] <<Example of Operation in Which the Transport Mechanism 8 Takes the Substrate W from the Shelf 45 of the Mounting Unit 6>> 34(a) to 34(d) and 35(a) to 35(d) are diagrams schematically showing an example of the operation of the transport mechanism 8 to take the substrate W from the shelf 45 of the receiver 6. In FIG.

[0261] See Figure 34(a). The hand 61 is not holding a substrate W. The suction adjustment unit 73 is not supplying gas to the suction unit 68. The suction unit 68 is not blowing out gas. The suction unit 68 is not sucking the substrate W. The second receiving unit 83 is located at the retracted position. The hand 61 moves to a position facing the mounting unit 6. The hand 61 is adjusted to a height position HC determined by the control unit 9.

[0262] 34(b), the hand 61 enters between two shelves 45 adjacent in the vertical direction Z at a height position HC determined by the control unit 9. The hand 61 advances between the two shelves 45 adjacent in the vertical direction Z by an insertion amount KC determined by the control unit 9, and then stops. When the hand 61 stops, the first receiving portion 82 and the second receiving portion 83 do not overlap with the substrate W placed on the shelf 45 in a plan view.

[0263] 34(c), the hand 61 moves downward. The first receiving portion 82 and the second receiving portion 83 pass beside the substrate W placed on one shelf 45 and move to a position lower than the substrate W placed on the shelf 45. The suction portion 68 approaches the upper surface 17 of the substrate W.

[0264] 34(d), the hand 61 moves slightly in the horizontal direction. As a result, the first receiving portion 82 moves to a position where it overlaps with the substrate W placed on the shelf 45 in a plan view. The second receiving portion 83 remains not overlapping with the substrate W placed on the shelf 45 in a plan view.

[0265] In the procedure up to this point, the hand 61 moves at the second velocity VB2 and the second acceleration AB2.

[0266] See Figure 35(a). The suction adjustment unit 73 supplies gas to the suction unit 68 at a flow rate M determined by the control unit 9. The suction unit 68 flows the gas along the upper surface 17 of the substrate W. This causes the suction unit 68 to suck the substrate W upward. The substrate W floats upward. The substrate W separates from the shelf 45. The upper surface 17 of the substrate W comes into contact with the contact unit 74. In this way, the hand 61 picks up one substrate W from the shelf 45. The hand 61 holds the substrate W.

[0267] 35(b), the hand 61 moves upward. From this procedure, the hand 61 moves at a first velocity VB1 and a first acceleration AB1.

[0268] 35(c), the receiving portion driving portion 86 moves the second receiving portion 83 from the retracted position to the fall-off prevention position, whereby both the first receiving portion 82 and the second receiving portion 83 overlap with the substrate W being sucked by the suction portion 68 in plan view.

[0269] Therefore, even if the substrate W separates from the contact portion 74 and falls downward, the receiving portion 81 receives the substrate W. That is, there is no risk that the hand 61 will drop the substrate W.

[0270] 35(d), the hand 61, while holding the substrate W, retracts and exits the platform 6.

[0271] In the above-described operational example, if the substrate W placed on the shelf 45 belongs to the first substrate W1, the hand 61 enters between two shelves 45 adjacent in the vertical direction Z at a first height position HC1. Furthermore, the suction adjustment unit 73 supplies gas to the suction unit 68 at a first flow rate M1. If the substrate W placed on the shelf 45 belongs to the second substrate W2, the hand 61 enters between two shelves 45 adjacent in the vertical direction Z at a second height position HC2. Furthermore, the suction adjustment unit 73 supplies gas to the suction unit 68 at a second flow rate M2. If the substrate W placed on the shelf 45 belongs to the third substrate W3, the hand 61 enters between two shelves 45 adjacent in the vertical direction Z at a third height position HC3. Furthermore, the suction adjustment unit 73 supplies gas to the suction unit 68 at a third flow rate M3. When the substrate W placed on the shelf 45 belongs to the third substrate W3, the hand 61 enters between two shelves 45 adjacent in the vertical direction Z at a third height position HC3. Furthermore, the suction adjustment unit 73 supplies gas to the suction unit 68 at a third flow rate M3. When the substrate W placed on the shelf 45 is a normal diameter substrate WN, the hand 61 advances a first insertion amount KC1 between the two shelves 45 adjacent in the vertical direction Z and then stops. When the substrate W placed on the shelf 45 is a large diameter substrate WL, the hand 61 advances a second insertion amount KC2 between the two shelves 45 adjacent in the vertical direction Z and then stops.

[0272] <<Example of Operation in Which the Transport Mechanism 8 Transports the Substrate W from the Platform 6 to the Processing Unit 7>> The hand 61 holds a substrate W. Specifically, the suction adjustment unit 73 supplies gas to the suction unit 68 at a flow rate M determined by the control unit 9. When the substrate W held by the hand 61 is the first substrate W1, the suction adjustment unit 73 supplies gas to the suction unit 68 at a first flow rate M1. When the substrate W held by the hand 61 is the second substrate W2 or the third substrate W3, the suction adjustment unit 73 supplies gas to the suction unit 68 at a second flow rate M2. The suction unit 68 flows gas along the upper surface 16 of the substrate W. The suction unit 68 sucks the substrate W.

[0273] The second receiving portion 83 is located in the fall-off prevention position. Both the first receiving portion 82 and the second receiving portion 83 overlap with the substrate W sucked by the suction portion 68 in a plan view.

[0274] The hand 61 moves from the mounting section 6 to the processing unit 7 determined by the control section 9. As a result, the transport mechanism 8 transports the substrate W to the processing unit 7 determined by the control section 9. If the substrate W held by the hand 61 is the first substrate W1, the transport mechanism 8 transports the substrate W to the first processing unit 7A. If the substrate W held by the hand 61 is the second substrate W2 or the third substrate W3, the transport mechanism 8 transports the substrate W to the second processing unit 7B.

[0275] When the transport mechanism 8 transports the substrate W from the receiver 6 to the processing unit 7, the hand 61 moves at a first velocity VB1 and a first acceleration AA1.

[0276] <<Example of Operation in Which the Transfer Mechanism 8 Transfers the Substrate W to the Substrate Holder 91 of the Processing Unit 7>> 36(a) to 36(f) are diagrams schematically illustrating an example of the operation of the transport mechanism 8 to transfer the substrate W to the substrate holding part 91 of the processing unit 7. Note that the operation of the transport mechanism 8 to transfer the substrate W to the substrate holding part 91 is the same whether the substrate holding part 91 is the first substrate holding part 91A or the second substrate holding part 91B.

[0277] 36(a), the hand 61 holds the substrate W. Specifically, the suction adjustment unit 73 supplies gas to the suction unit 68 at a flow rate M determined by the control unit 9. The suction unit 68 causes the gas to flow along the upper surface 16 of the substrate W. The suction unit 68 sucks the substrate W.

[0278] The second receiving portion 83 is located in the fall-off prevention position. The hand 61 has entered the inside of the processing unit 7. The hand 61 is located above the substrate holding portion 91. The lift pins 116 are located in the upper position.

[0279] See Figure 36(b). The suction adjustment unit 73 stops the supply of gas to the suction unit 68. The suction unit 68 stops suctioning the substrate W. The substrate W falls downward. The receiving unit 81 receives the substrate W. More specifically, the first receiving unit 82 and the second receiving unit 83 receive the lower surface 16 of the substrate W. In this way, the suction unit 68 stops suctioning the substrate W, causing the substrate W to be placed on the first receiving unit 82 and the second receiving unit 83.

[0280] See Figure 36(c). The hand 61 moves slightly downward. This causes the first receiving portion 82 and the second receiving portion 83 to transfer the substrate W to the lift pins 116. The lift pins 116 receive the substrate W from the receiving portion 81. The lift pins 116 support the substrate W at an upper position. The first receiving portion 82 and the second receiving portion 83 move to a position lower than the substrate W supported by the lift pins 116. The first receiving portion 82 and the second receiving portion 83 move away from the substrate W supported by the lift pins 116.

[0281] In the procedure up to this point, the hand 61 moves at a first velocity VB1 and a first acceleration AB1.

[0282] 36(d), the receiving portion driver 86 moves the second receiving portion 83 from the fall-off prevention position to the retracted position. As a result, the second receiving portion 83 moves to a position where it does not overlap with the substrate W supported by the lift pins 116 in plan view. The first receiving portion 82 remains overlapping with the substrate W supported by the lift pins 116 in plan view.

[0283] 36(e). The hand 61 moves slightly in the horizontal direction. As a result, both the first receiving portion 82 and the second receiving portion 83 move to positions where they do not overlap with the substrate W supported by the lift pins 116 in a plan view. From this procedure, the hand 61 moves at a second velocity VB2 and a second acceleration AB2.

[0284] 36(f), the hand 61 moves upward. The first receiving portion 82 and the second receiving portion 83 pass beside the substrate W supported by the lift pins 116 and move to a position higher than the substrate W supported by the lift pins 116.

[0285] Thereafter, although not shown, the hand 61 retracts and exits the processing unit 7 without holding the substrate W.

[0286] <<Example of Operation in Which the Transfer Mechanism 8 Takes the Substrate W from the Substrate Holder 91 of the Processing Unit 7>> 37(a) to 37(f) are diagrams schematically illustrating an example of the operation in which the transport mechanism 8 takes the substrate W from the substrate holding part 91 of the processing unit 7. Note that the operation in which the transport mechanism 8 takes the substrate W from the substrate holding part 91 is the same whether the substrate holding part 91 is the first substrate holding part 91A or the second substrate holding part 91B.

[0287] Refer to Figure 37(a). The hand 61 is not holding the substrate W. The suction adjustment part 73 is not supplying gas to the suction part 68. The suction part 68 is not flowing gas along the upper surface 16 of the substrate W. The suction part 68 is not sucking the substrate W. The second receiving part 83 is located in the retracted position. The hand 61 has entered the interior of the processing unit 7. The hand 61 is located above the substrate holding part 91. The lift pins 116 support the substrate W at an upper position. The first receiving part 82 and the second receiving part 83 do not overlap the substrate W supported by the lift pins 116 in a plan view.

[0288] 37(b), the hand 61 moves slightly downward. The first receiving portion 82 and the second receiving portion 83 pass beside the substrate W supported by the lift pins 116, and move to a position lower than the substrate W supported by the lift pins 116. The suction portion 68 approaches the upper surface 17 of the substrate W.

[0289] 37(c). The hand 61 moves slightly in the horizontal direction. As a result, the first receiving portion 82 moves to a position where it overlaps with the substrate W supported by the lift pins 116 in plan view. The second receiving portion 83 remains not overlapping with the substrate W supported by the lift pins 116 in plan view.

[0290] 37(d), the receiving portion driving portion 86 moves the second receiving portion 83 from the retracted position to the fall-off prevention position, whereby both the second receiving portion 83 and the first receiving portion 82 overlap with the substrate W being sucked by the suction portion 68 in plan view.

[0291] In the procedure up to this point, the hand 61 moves at the second velocity VB2 and the second acceleration AB2.

[0292] See Figure 37(e). The suction adjustment unit 73 supplies gas to the suction unit 68 at a flow rate M determined by the control unit 9. The suction unit 68 flows the gas along the upper surface 17 of the substrate W. This causes the suction unit 68 to suck the substrate W upward. The substrate W floats upward. The substrate W separates from the lift pins 116. The upper surface 17 of the substrate W comes into contact with the contact unit 74. In this way, the hand 61 picks up one substrate W from the lift pins 116. The hand 61 holds the substrate W.

[0293] See Figure 37(f). With the hand 61 holding the substrate W, the hand 61 moves upward.

[0294] From this procedure, the hand 61 moves at a first velocity VB1 and a first acceleration AB1.

[0295] Thereafter, although not shown, the hand 61 retracts while still holding the substrate W, and exits the processing unit 7 .

[0296] <<Example of Operation in Which the Transport Mechanism 8 Transfers the Substrate W to the Shelf 45 of the Mounting Unit 6>> 38(a) to 38(d) and 39(a) to 39(d) are diagrams schematically showing an example of the operation in which the transport mechanism 8 places the substrate W on the shelf 45 of the receiver 6. In FIG.

[0297] Refer to Figure 38(a). The hand 61 holds the substrate W. The suction adjustment unit 73 supplies gas to the suction unit 68 at a flow rate M determined by the control unit 9. The suction unit 68 flows gas along the upper surface 16 of the substrate W. The suction unit 68 sucks the substrate W. The second receiving unit 83 is located in the fall prevention position. The hand 61 moves to a position facing the mounting unit 6. The hand 61 is adjusted to a height position HC determined by the control unit 9.

[0298] 38(b), the hand 61 enters between two shelves 45 adjacent in the vertical direction Z at a height position HC determined by the control unit 9. The hand 61 advances between the two shelves 45 adjacent in the vertical direction Z by an insertion amount KC determined by the control unit 9, and then stops.

[0299] See Figure 38(c). The suction adjustment unit 73 stops the supply of gas to the suction unit 68. The suction unit 68 stops suctioning the substrate W. The substrate W falls downward. The receiving unit 81 receives the substrate W. More specifically, the first receiving unit 82 and the second receiving unit 83 receive the lower surface 16 of the substrate W. In this way, the suction unit 68 stops suctioning the substrate W, causing the substrate W to be placed on the first receiving unit 82 and the second receiving unit 83.

[0300] See Figure 38(d). The hand 61 moves slightly downward. This causes the first receiving portion 82 and the second receiving portion 83 to deliver the substrate W to the shelf 45. The shelf 45 receives the substrate W from the receiving portion 81. The shelf 45 supports the substrate W. The first receiving portion 82 and the second receiving portion 83 move to a position lower than the substrate W supported by the shelf 45. The first receiving portion 82 and the second receiving portion 83 move away from the substrate W supported by the shelf 45.

[0301] In the procedure up to this point, the hand 61 moves at a first velocity VB1 and a first acceleration AB1.

[0302] 39(a), the receiving portion drive portion 86 moves the second receiving portion 83 from the fall prevention position to the retracted position. As a result, the second receiving portion 83 moves to a position where it does not overlap with the substrate W supported by the shelf 45 in a plan view. The first receiving portion 82 remains overlapping with the substrate W supported by the shelf 45 in a plan view.

[0303] 39(b), the hand 61 moves slightly in the horizontal direction. As a result, both the first receiving portion 82 and the second receiving portion 83 move to positions where they do not overlap with the substrate W supported by the shelf 45 in a plan view. From this procedure, the hand 61 moves at a second velocity VB2 and a second acceleration AB2.

[0304] 39(c), the hand 61 moves upward. The first receiving portion 82 and the second receiving portion 83 pass beside the substrate W supported on the shelf 45 and move to a position higher than the substrate W supported on the shelf 45.

[0305] 39(d), the hand 61 retracts and moves out of the platform 6 without holding the substrate W.

[0306] <Example of Operation of First Processing Unit 7A> Figure 40 is a flowchart showing the procedure of an example operation of the first processing unit 7A. Figure 41 is a timing chart showing an example operation of the first processing unit 7A. t31-t35, t37-t39, and t41-t44 shown in Figure 41 correspond to the times when steps S31-S35, S37-S39, and S41-S44 shown in Figure 40 are executed, respectively. The operation of each element described below is controlled by the control unit 9. Some of the example operation described below overlaps with the description of the example operation of the transport mechanism 8 described above.

[0307] Step S31 (time t31): The lift pin 116 rises. The lift pins 116 move to the up position.

[0308] Step S32 (time t32): The lift pins 116 receive the substrate W from the transfer mechanism 8. The transport mechanism 8 delivers one substrate W (specifically, the first substrate W1) to the lift pins 116. More specifically, the transport mechanism 8 delivers the substrate W to the lift pins 116. The lift pins 116 receive the substrate W from the transport mechanism 8. The lift pins 116 support the substrate W in the upper position.

[0309] Step S33 (time t33): The first air outlet 105 starts blowing out gas. First air outlet adjustment unit 111 starts supplying gas to first air outlet 105. First air outlet 105 starts blowing out gas. First air outlet 105 blows out gas upward. Second air outlet adjustment unit 112 has not yet started supplying gas to second air outlet 106. Second air outlet 106 does not blow out gas.

[0310] Step S34 (time t34): The lift pins 116 transfer the substrate W to the fixed pins 103. The lift pins 116 move from the upper position to the lower position. As a result, the lift pins 116 lower the substrate W from the upper position and hand over the substrate W to the fixed pins 103. The fixed pins 103 receive the substrate W from the lift pins 116. The fixed pins 103 support the substrate W. The lift pins 116 move away from the substrate W supported by the fixed pins 103.

[0311] Step S35 (time t35): The position adjusting pins 113 adjust the position of the substrate W. The position adjustment pins 113 move from the retracted position to the adjustment position, whereby the position adjustment pins 113 come into contact with the substrate W supported by the fixed pins 103, and adjust the position of the substrate W in the horizontal direction.

[0312] Step S36: The position of the substrate W is checked. It is checked whether the position of the substrate W is in a predetermined position. Specifically, the substrate detection unit 127 detects the substrate W. The substrate detection unit 127 outputs the detection result of the substrate detection unit 127 to the control unit 9. The control unit 9 determines whether the substrate W is in the predetermined position. If the control unit 9 determines that the substrate W is in the predetermined position, the process proceeds to step S37. If the control unit 9 determines that the substrate W is not in the predetermined position, the process does not proceed to step S37, but executes abnormality processing. The abnormality processing includes, for example, returning to step S35. The abnormality processing includes, for example, notifying the user that an abnormality has occurred.

[0313] Step S37 (time t36): The second air outlet 106 starts blowing out gas. Second air outlet adjustment unit 112 starts supplying gas to second air outlet 106. Second air outlet 106 starts blowing out gas. Second air outlet 106 blows out the gas upward. The flow rate of the gas blown out from second air outlet 106 is greater than the flow rate of the gas blown out from first air outlet 105.

[0314] Step S38 (time t38): The position adjustment pin 113 moves away from the substrate W. The position adjustment pin 113 moves from the adjustment position to the retracted position, thereby separating the position adjustment pin 113 from the substrate W.

[0315] Step S39 (time t39): Treat the substrate W (supply the treatment liquid to the substrate W). The first rotation drive unit 92A rotates the first substrate holding unit 91A and the substrate W. The processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103. Even when the processing liquid supply unit 121 supplies the processing liquid to the substrate W, the first blowing outlet 105 blows out gas, and the second blowing outlet 106 blows out gas at a flow rate greater than that of the first blowing outlet 105.

[0316] After the predetermined time has elapsed, the substrate processing is completed, and the process proceeds to step S40.

[0317] Step S40: Check the position of the substrate W It is checked again whether the substrate W is at a predetermined position. This step S40 is substantially the same as step S36.

[0318] Step S41 (time t41): The second air outlet 106 stops blowing out gas. The second air outlet adjustment unit 112 stops the supply of gas to the second air outlet 106. The second air outlet 106 stops blowing out the gas.

[0319] Step S42 (time t42): The lift pins 116 remove the substrate W from the fixed pins 103. The lift pins 116 move from the lower position to the upper position, whereby the lift pins 116 take the substrate W from the fixed pins 103. Furthermore, the lift pins 116 lift the substrate W to the upper position.

[0320] Step S43 (time t43): The first air outlet 105 stops blowing out gas. The first airflow adjustment unit stops the supply of gas to the first airflow outlet 105. The first airflow outlet 105 stops blowing out the gas.

[0321] Step S44 (time t44): The lift pins 116 deliver the substrate W to the transport mechanism 8. The transport mechanism 8 removes the substrate W from the lift pins 116. Thereafter, the transport mechanism 8 unloads the substrate W to the outside of the first processing unit 7A.

[0322] <Example of Operation of Second Processing Unit 7B> An example of the operation of the second processing unit 7B is similar to the example of the operation of the first processing unit 7A except that steps S33, S35-S38, and S40-S41 are omitted. An example of the operation of the second processing unit 7B will be briefly described below.

[0323] The lift pins 116 move to the upper position. The lift pins 116 receive one substrate W (specifically, the second substrate W2 or the third substrate W3) from the transport mechanism 8. The lift pins 116 deliver the substrate W to the lower surface contact pins 135. The lower surface contact pins 135 support the substrate W. The edge contact pins 133 come into contact with the edge 20 of the substrate W supported by the lower surface contact pins 135. In this way, the edge contact pins 133 hold the substrate W.

[0324] The substrate W is processed while being held by the edge contact pins 133. Specifically, the second rotation drive unit 92B rotates the second substrate holding unit 91B and the substrate W. When the second rotation drive unit 92B rotates the second substrate holding unit 91B, the edge contact pins 133 hold the edge 20 of the substrate W so that the substrate W does not slip relative to the edge contact pins 133. The processing liquid supply unit 121 supplies a processing liquid to the substrate W held by the edge contact pins 133 .

[0325] When processing on the substrate W is completed, the edge contact pins 133 move away from the substrate W. The lift pins take the substrate W from the lower surface contact pins 135. The transport mechanism 8 takes the substrate W from the lift pins .

[0326] <Effects of the embodiment> The substrate processing apparatus 1 includes a transport mechanism 8 that transports the substrate W. The transport mechanism 8 includes a hand 61. The hand 61 includes a base portion 65 and a suction portion 68. The suction portion 68 is attached to the base portion 65. The suction portion 68 causes a gas to flow along the upper surface 17 of the substrate W. The suction portion 68 sucks the substrate W upward without coming into contact with the substrate W. Therefore, the hand 61 can support the substrate W suitably.

[0327] The transport mechanism 8 includes a hand drive unit 62 that moves the hand 61. Therefore, the transport mechanism 8 can transport the substrate W supported by the hand 61 in an appropriate manner.

[0328] The hand 61 further includes a first receiving portion 82 and a second receiving portion 83. The first receiving portion 82 and the second receiving portion 83 are supported by the base portion 65. The first receiving portion 82 and the second receiving portion 83 are disposed below the substrate W that is sucked by the suction portion 68. The first receiving portion 82 and the second receiving portion 83 can receive the lower surface 16 of the substrate W. Therefore, even if the substrate W falls downward from the suction portion 68, the first receiving portion 82 and the second receiving portion 83 can receive the substrate W. In other words, there is no risk that the transport mechanism 8 will drop the substrate W.

[0329] The hand 61 includes a receiving portion driving unit 86. The receiving portion driving unit 86 moves the second receiving portion 83 relative to the base portion 65. The receiving portion driving unit 86 moves the second receiving portion 83 closer to the first receiving portion 82 and moves the second receiving portion 83 away from the first receiving portion 82. Therefore, the hand 61 can pick up and place the substrate W without the first receiving portion 82 and the second receiving portion 83 interfering with the substrate W.

[0330] As described above, the substrate processing apparatus 1 can transport the substrate W appropriately.

[0331] When the transport mechanism 8 transports the substrate W, at least a part of the first receiving portion 82 and at least a part of the second receiving portion 83 are positioned in a position that overlaps, in a plan view, with the substrate W being sucked by the suction portion 68. Therefore, when the transport mechanism 8 transports the substrate W, the first receiving portion 82 and the second receiving portion 83 can reliably prevent the substrate W from falling off the hand 61.

[0332] The substrate processing apparatus 1 includes a platform 6 on which a substrate W is placed. The transport mechanism 8 places the substrate W on the first receiving portion 82 and the second receiving portion 83 by stopping the suction of the substrate W by the suction portion 68, and then places the substrate on the mounting portion 6. Therefore, when the transport mechanism 8 places the substrate W on the mounting portion 6, there is no risk that the hand 61 will damage the substrate W. For example, when the transport mechanism 8 places the substrate W on the mounting portion 6, there is no risk that the hand 61 will press the substrate W against the mounting portion 6. Therefore, the transport mechanism 8 can properly mount the substrate W on the mounting portion 6.

[0333] The substrate processing apparatus 1 includes a processing unit 7 that processes a substrate W. The processing unit 7 includes a substrate holding part 91 that holds the substrate W. The transport mechanism 8 places the substrate W on the first receiving part 82 and the second receiving part 83 by stopping the suction of the substrate W by the suction part 68, and then places the substrate W on the substrate holding part 91. Therefore, when the transport mechanism 8 places the substrate W on the substrate holding part 91, there is no risk that the hand 61 will damage the substrate W. Therefore, the transport mechanism 8 can properly place the substrate W on the substrate holding part 91.

[0334] The second receiving portion 83 can move between a drop-out prevention position and a retracted position by moving relative to the base portion 65. When the second receiving portion 83 is in the drop-out prevention position, at least a portion of the second receiving portion 83 overlaps with the substrate W being sucked by the suction portion 68 in a plan view. Therefore, when the second receiving portion 83 is in the drop-out prevention position, the second receiving portion 83 can reliably prevent the substrate W from dropping off from the hand 61. When the second receiving portion 83 is in the retracted position, the substrate W can pass between the first receiving portion 82 and the second receiving portion 83 in the vertical direction Z in a horizontal position. Therefore, the hand 61 can pick up and place the substrate W without the first receiving portion 82 and the second receiving portion 83 interfering with the substrate W.

[0335] The receiver driving unit 86 includes an actuator 87 that moves the second receiver 83 to the fall-prevention position and the retracted position. Therefore, the second receiver 83 can be suitably moved to the fall-prevention position and the retracted position. The receiver driving unit 86 includes an elastic member 88 that urges the second receiver 83 from the retracted position toward the fall-prevention position. When the actuator 87 is disconnected from its power source, only the elastic force of the elastic member 88 acts on the second receiver 83. As a result, the second receiver 83 moves to the fall-prevention position by the elastic force of the elastic member 88. Therefore, even when the actuator 87 is disconnected from the power source, the second receiver 83 can suitably prevent the substrate W from falling off the hand 61.

[0336] When the receiving portion driving portion 86 includes an electric motor as the actuator 87, the control portion 9 can easily control the movement speed of the second receiving portion 83. This makes it possible to prevent the second receiving portion 83 from damaging the substrate W, even if the second receiving portion 83 comes into contact with the substrate W while it is moving. For example, when the second receiving portion 83 moves from the retracted position to the drop-out prevention position, the electric motor can decelerate the movement speed of the second receiving portion 83 just before the second receiving portion 83 reaches the drop-out prevention position. This makes it possible to reduce the impact that the second receiving portion 83 imparts to the substrate W, even if the second receiving portion 83 comes into contact with the substrate W when it reaches the drop-out prevention position.

[0337] The first receiving portion 82 is fixed to the base portion 65. Therefore, the structure in which the base portion 65 supports the first receiving portion 82 can be simplified.

[0338] The hand 61 includes a first contact portion 75. The first contact portion 75 is fixed to the base portion 65. The first contact portion 75 comes into contact with the upper surface 17 of the substrate W that is sucked by the suction portion 68. Therefore, the first contact portion 75 can keep the substrate W that is sucked by the suction portion 68 in a predetermined position.

[0339] The hand 61 includes a first wall portion 78. The first wall portion 78 is connected to the first contact portion 75. The first wall portion 78 extends downward from the first contact portion 75, passing along the side of the substrate W that is sucked by the suction portion 68. The first receiving portion 82 is connected to the first wall portion 78. This simplifies the structures of the first contact portion 75, the first wall portion 78, and the first receiving portion 82.

[0340] The substrate transport method of the transport mechanism 8 includes the steps of transporting the substrate W, placing the substrate W on the receiving part 81, and transferring the substrate W to the receiver 6. In the step of transporting the substrate W, the suction part 68 attached to the base part 65 causes a gas to flow along the upper surface 17 of the substrate W, thereby sucking the substrate W upward without contacting the substrate W. Furthermore, in the step of transporting the substrate W, the hand driving part 62 moves the base part 65 to transport the substrate W. In the step of placing the substrate W on the receiver 81, the suction part 68 stops suctioning the substrate W, thereby placing the substrate W on the receiver 81. The receiver 81 is supported by the base part 65 and is disposed below the suction part 68. In the step of transferring the substrate to the receiver 6, the substrate W is transferred from the receiving part 81 to the receiver 6. Therefore, there is no risk of the transport mechanism 8 damaging the substrate W when placing the substrate W on the receiver 6. Therefore, the transport mechanism 8 can properly place the substrate W on the receiver 6.

[0341] As described above, according to the substrate transport method, the substrate W can be transported appropriately.

[0342] The substrate transport method of the transport mechanism 8 includes the steps of transporting the substrate W, placing the substrate W on the receiving part 81, and transferring the substrate W to the substrate holding part 91 of the processing unit 7. The step of transferring the substrate W to the substrate holding part 91 involves transferring the substrate W from the receiving part 81 to the substrate holding part 91. Therefore, when the transport mechanism 8 places the substrate W on the substrate holding part 91, there is no risk of the transport mechanism 8 damaging the substrate W. Therefore, the transport mechanism 8 can properly place the substrate W on the substrate holding part 91.

[0343] As described above, according to the substrate transport method, the substrate W can be transported appropriately.

[0344] The substrate processing apparatus 1 includes a transport mechanism 4 that transports substrates, a transport mechanism 8 that transports substrates, and a platform 6 on which a substrate W to be transported between the transport mechanism 4 and the transport mechanism 8 is placed. Therefore, the transport mechanism 4 can suitably transport the substrate W to the transport mechanism 8 via the platform 6. The transport mechanism 8 can also suitably transport the substrate W to the transport mechanism 4 via the platform 6.

[0345] The transport mechanism 8 includes a hand 61. The hand 61 includes a suction unit 68. Therefore, the hand 61 can suitably support the substrate W. Therefore, the transport mechanism 8 can transport the substrate W appropriately.

[0346] The receiver 6 has a first inclined surface 51 and a second inclined surface 55. The first inclined surface 51 contacts the first side portion 18 of the substrate W. The second inclined surface 55 is arranged at a position facing the first inclined surface 51 in the horizontal direction. The second inclined surface 55 contacts the second side portion 19 of the substrate W. The distance ET in the horizontal direction between the upper end 51T of the first inclined surface 51 and the upper end 55T of the second inclined surface 55 is larger than the diameter D of the substrate W. Therefore, even if the position of the substrate W placed on the receiver 6 by the transport mechanisms 4 and 8 varies, the receiver 6 can properly receive the substrate W.

[0347] A horizontal distance EB between the lower end 51B of the first inclined surface 51 and the lower end 55B of the second inclined surface 55 is narrower than the distance ET. Therefore, the first inclined surface 51 and the second inclined surface 55 can suitably guide the substrate W to a predetermined position.

[0348] The horizontal distance E2 between the first inclined surface 51 and the second inclined surface 55 decreases downward. Therefore, the first inclined surface 51 and the second inclined surface 55 can suitably guide the substrate W to a predetermined position.

[0349] The first inclined surface 51 includes an upper inclined surface 52. The first angle θ1 of the upper inclined surface 52 is relatively large. Therefore, the upper inclined surface 52 can guide the substrate W in an appropriate manner.

[0350] The first inclined surface 51 includes a lower inclined surface 53. The second angle θ2 of the lower inclined surface 53 is relatively small. Therefore, the lower inclined surface 53 can support the substrate W suitably.

[0351] The substrate processing apparatus 1 includes a first processing unit 7A for processing a substrate. The transport mechanism 8 transports a substrate W to the first processing unit 7A. The first processing unit 7A includes a first substrate holding part 91A. The first substrate holding part 91A includes a first plate 101, fixing pins 103, and a gas outlet 104. The fixing pins 103 protrude upward from an upper surface 102 of the first plate 101. The fixing pins 103 come into contact with a lower surface 16 of the substrate W. The fixing pins 103 place the substrate W at a position higher than the upper surface 102 of the first plate 101. The gas outlet 104 is formed in the upper surface 102 of the first plate 101. The gas outlet 104 blows gas between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103. The gas outlet 104 sucks the substrate W downward. Therefore, the first substrate holding part 91A can hold the substrate W suitably.

[0352] The substrate processing apparatus 1 includes a carrier mounting section 3 on which a carrier C is mounted. The carrier C accommodates a plurality of substrates W. The transport mechanism 4 transports the substrates to the carrier C mounted on the carrier mounting section 3. Therefore, the transport mechanism 4 can suitably transport the substrates W from the carrier C to the transport mechanism 8. The transport mechanism 4 can suitably transport the substrates W from the transport mechanism 8 to the carrier C.

[0353] The substrate processing apparatus 1 includes a first processing unit 7A for processing a substrate W. The first processing unit 7A includes a first plate 101, fixing pins 103, and a gas outlet 104. Therefore, the first processing unit 7A can hold the substrate W in a suitable manner.

[0354] The suction adjustment unit 73 adjusts the flow rate of the gas supplied to the suction unit 68. Thus, the suction adjustment unit 73 can adjust the suction force of the suction unit 68.

[0355] The substrate processing apparatus 1 includes a control unit 9. The control unit 9 controls the first processing unit 7A and the transport mechanism 8. Specifically, the control unit 9 controls the suction adjustment unit 73. The control unit 9 changes the flow rate of gas supplied to the suction unit 58 in accordance with the shape of the substrate W transported by the transport mechanism 8. Therefore, the suction unit 68 can suck the substrate W with an appropriate suction force regardless of the shape of the substrate W. Therefore, the transport mechanism 8 can transport the substrate W appropriately.

[0356] The control unit 9 changes the flow rate of gas supplied to the suction unit 68 in accordance with the thickness of the main portion 13 of the substrate W. Therefore, the suction unit 68 can suck the substrate W with an appropriate suction force regardless of the thickness of the main portion 13 of the substrate W. Therefore, the transport mechanism 8 can transport the substrate W suitably regardless of the thickness of the main portion 13 of the substrate W.

[0357] The substrates W include a first substrate W1 and a second substrate W2. When the transport mechanism 8 transports the first substrate W1, the control unit 9 adjusts the flow rate M to a first flow rate M1. When the transport mechanism 8 transports the second substrate W2, the control unit 9 adjusts the flow rate M to a second flow rate M2 that is greater than the first flow rate M1. Thus, the suction unit 68 can suck the first substrate W1 and the second substrate W2 with an appropriate suction force. Therefore, whether the substrate W transported by the transport mechanism 8 is the first substrate W1 or the second substrate W2, the transport mechanism 8 can transport the substrate W appropriately.

[0358] The substrates W include a first substrate W1 and a third substrate W3. When the transport mechanism 8 transports the third substrate W3, the control unit 9 adjusts the flow rate M to a third flow rate M3 that is greater than the first flow rate M1. This allows the suction unit 68 to suck the first substrate W1 and the third substrate W3 with an appropriate suction force. Therefore, whether the substrate W transported by the transport mechanism 8 is the first substrate W1 or the third substrate W3, the transport mechanism 8 can transport the substrate W appropriately.

[0359] The transport mechanism 8 transports the substrate W between the receiver 6 and the processing unit 7. The transport mechanism 8 includes a hand 61 and a hand drive unit 62. The hand 61 includes a base unit 65 and a suction unit 68. The control unit 9 controls the hand drive unit 62. As a result, when the transport mechanism 8 is transporting the substrate W, the control unit 9 moves the hand 61 at a first speed VB1. When the transport mechanism 8 is not transporting the substrate W, the control unit 9 moves the hand 61 at a second speed VB2 that is higher than the first speed VB1. When the transport mechanism 8 is transporting the substrate W, the movement speed VB of the hand 61 is relatively small. Therefore, when the transport mechanism 8 is transporting the substrate W, the suction unit 68 can properly suck the substrate W. For example, there is no risk that the hand 61 will drop the substrate W when the transport mechanism 8 is transporting the substrate W. Therefore, the transport mechanism 8 can properly transport the substrate W. The movement speed VB of the hand 61 is relatively high when the transport mechanism 8 is not transporting a substrate W. Therefore, when the transport mechanism 8 is not transporting a substrate W, the movement time of the hand 61 can be shortened.

[0360] The first speed VB1 is equal to or less than 50% of the second speed. Therefore, when the transport mechanism 8 is transporting the substrate W, the suction part 68 can more appropriately suck the substrate W. When the transport mechanism 8 is not transporting the substrate W, the movement time of the hand 61 can be further shortened.

[0361] The control unit 9 moves the hand 61 at a first acceleration AB1 when the transport mechanism 8 is transporting a substrate W. The control unit 9 moves the hand 61 at a second acceleration AB2 that is greater than the first acceleration AB1 when the transport mechanism 8 is not transporting a substrate W. When the transport mechanism 8 is transporting a substrate W, the acceleration AB of the hand 61 is relatively small. Therefore, when the transport mechanism 8 is transporting a substrate W, the suction unit 68 can more appropriately suck the substrate W. When the transport mechanism 8 is not transporting a substrate W, the acceleration AB of the hand 61 is relatively large. Therefore, when the transport mechanism 8 is not transporting a substrate W, the movement time of the hand 61 can be further shortened.

[0362] The present invention is not limited to the embodiments, and can be modified as follows.

[0363] In the above-described embodiment, the shelf 22 comes into contact with the lower surface 16 of the substrate W. However, this is not limited to this. For example, the shelf 22 may come into contact with at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the shelf 22 may come into contact with the edge 20 of the substrate W from obliquely below.

[0364] In the above-described embodiment, the hand 33 comes into contact with the lower surface 16 of the substrate W. However, this is not limited to this. For example, the hand 33 may come into contact with at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the hand 33 may come into contact with the edge 20 of the substrate W from diagonally below.

[0365] In the above-described embodiment, the shelf 45 comes into contact with the lower surface 16 of the substrate W. However, this is not limited to this. For example, the shelf 45 may come into contact with at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the shelf 45 may come into contact with the edge 20 of the substrate W from obliquely below.

[0366] In the above-described embodiment, the contact portion 74 comes into contact with the upper surface 17 of the substrate W. However, this is not limited to this. For example, the contact portion 74 may come into contact with at least one of the upper surface 17 of the substrate W and the edge 20 of the substrate W. For example, the contact portion 74 may come into contact with the edge 20 of the substrate W from obliquely above.

[0367] In the above-described embodiment, the first receiving portion 82 can receive the lower surface 16 of the substrate W. However, this is not limited to this. For example, the first receiving portion 82 may receive at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the first receiving portion 82 may receive the edge 20 of the substrate W from diagonally below.

[0368] In the above-described embodiment, the second receiving portion 83 can receive the lower surface 16 of the substrate W. However, this is not limited to this. For example, the second receiving portion 83 may receive at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the second receiving portion 83 may receive the edge 20 of the substrate W from diagonally below.

[0369] In the above-described embodiment, the fixing pin 103 comes into contact with the lower surface 16 of the substrate W. However, this is not limited to this. For example, the fixing pin 103 may come into contact with at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the fixing pin 103 may come into contact with the edge 20 of the substrate W from diagonally below.

[0370] In the embodiment described above, the first receiving portion 82 is fixed to the base portion 65. However, this is not limited to this. That is, the first receiving portion 82 may be movable relative to the base portion 65. In this modified embodiment, the hand 61 may further include a drive unit (second receiving portion drive unit) that moves the first receiving portion 82 relative to the base portion 65.

[0371] In the above-described embodiment, the suction unit 68 causes the gas to flow along the upper surface 17 of the substrate W. The suction unit 68 sucks the substrate W upward. However, this is not limited to this. The suction unit 68 may cause the gas to flow along the lower surface 16 of the substrate W. The suction unit 68 may also suck the substrate W downward.

[0372] In the above-described embodiment, the hand 33 does not include a suction unit. However, this is not limited to this. The hand 33 may include a suction unit that flows gas along a first surface of the substrate W. Here, the first surface is either the upper surface or the lower surface of the substrate W. The hand 33 of the transport mechanism 4 may include a suction unit that sucks the substrate W. Furthermore, the transport mechanism 4 may include a receiving unit to prevent the substrate W from falling off the hand 33.

[0373] In the above-described embodiment, the control unit 9 changes the height positions HA, HB, HC depending on whether the substrate W is the first substrate W1, the second substrate W2, or the third substrate W3. However, this is not limited to this. For example, the control unit 9 may change the height positions HA, HB, HC depending on the thickness of the main portion 13 of the substrate W. For example, the control unit 9 may increase the height positions HA, HB, HC as the thickness of the main portion 13 of the substrate W increases.

[0374] In the above-described embodiment, the control unit 9 determines the processing unit 7 for processing the substrate W to be either the first processing unit or the second processing unit, depending on whether the substrate W is the first substrate W1, the second substrate W2, or the third substrate W3. However, this is not limited to this. For example, the control unit 9 may determine the processing unit 7 for processing the substrate W to be either the first processing unit or the second processing unit, depending on the thickness of the main portion 13 of the substrate W. For example, the control unit 9 may transport a substrate W whose main portion 13 has a first thickness to the first processing unit 7A, and transport a substrate W whose main portion 13 has a second thickness greater than the first thickness to the second processing unit 7B. For example, the control unit 9 may process a substrate W whose main portion 13 has a first thickness in the first processing unit 7A, and process a substrate W whose main portion 13 has a second thickness greater than the first thickness in the second processing unit 7B.

[0375] In the above-described embodiment, the control unit 9 changes the flow rate M depending on whether the substrate W is the first substrate W1, the second substrate W2, or the third substrate W3. However, this is not limited to this. For example, the control unit 9 may change the flow rate M depending on the thickness of the main portion 13 of the substrate W. For example, the control unit 9 may increase the flow rate M as the thickness of the main portion 13 of the substrate W increases.

[0376] In the above-described embodiment, the movement speed VA may be further subdivided. For example, the movement speed VA may be divided into a horizontal movement speed VAH, a vertical movement speed VAZ, and a rotation speed VAR. Here, the horizontal movement speed VAH is the movement speed of the hand 33 in the horizontal direction. The vertical movement speed VAZ is the movement speed of the hand 33 in the upward direction Z. The rotation speed VAR is the movement speed of the hand 33 around the rotation axis A1. In step S25, the control unit 9 may individually determine the horizontal movement speed VAH, the vertical movement speed VAZ, and the rotation speed VAR.

[0377] In the above-described embodiment, the acceleration AA may be further subdivided. For example, the acceleration AA may be divided into a horizontal acceleration AAH, a vertical acceleration AAZ, and a rotational acceleration AAR. Here, the horizontal acceleration AAH is the acceleration of the hand 33 in the horizontal direction. The vertical acceleration AAZ is the acceleration of the hand 33 in the upward direction Z. The rotational acceleration AAR is the acceleration of the hand 33 around the rotation axis A1. In step S25, the control unit 9 may individually determine the horizontal acceleration AAH, the vertical acceleration AAZ, and the rotational acceleration AAR.

[0378] In the above-described embodiment, the movement speed VB may be further subdivided. For example, the movement speed VB may be divided into a horizontal movement speed VBH, a vertical movement speed VBZ, and a rotation speed VBR. Here, the horizontal movement speed VBH is the movement speed of the hand 61 in the horizontal direction. The vertical movement speed VBZ is the movement speed of the hand 61 in the upward direction Z. The rotation speed VBR is the movement speed of the hand 61 around the rotation axis A2. In step S25, the control unit 9 may individually determine the horizontal movement speed VBH, the vertical movement speed VBZ, and the rotation speed VBR.

[0379] In the above-described embodiment, the acceleration AB may be further subdivided. For example, the acceleration AB may be divided into a horizontal acceleration ABH, a vertical acceleration ABZ, and a rotational acceleration ABR. Here, the horizontal acceleration ABH is the acceleration of the hand 61 in the horizontal direction. The vertical acceleration ABZ is the acceleration of the hand 61 in the upward direction Z. The rotational acceleration ABR is the acceleration of the hand 61 around the rotation axis A2. In step S25, the control unit 9 may individually determine the horizontal acceleration ABH, the vertical acceleration ABZ, and the rotational acceleration ABR.

[0380] In the above-described embodiment, the number of first air outlets 105 formed in the first plate 101 is one. However, this is not limited to this. The number of first air outlets 105 formed in the first plate 101 may be multiple.

[0381] In the embodiment described above, the lift pins 116 receive the substrate W from the transport mechanism 8 (step S32), and then the first blowing ports 105 start blowing gas (step S33). However, this is not limiting. For example, the first blowing ports 105 may start blowing gas before the lift pins 116 receive the substrate W from the transport mechanism 8. According to this modified embodiment, the lift pins 116 can receive the substrate W from the transport mechanism 8 while the first blowing ports 105 are blowing gas.

[0382] In the embodiment described above, the first blowing ports 105 stop blowing gas (step S43), and then the lift pins 116 deliver the substrate W to the transport mechanism 8 (step S44). However, this is not limited to this. For example, the first blowing ports 105 may stop blowing gas after the lift pins 116 deliver the substrate W to the transport mechanism 8. According to this modified embodiment, the lift pins 116 can deliver the substrate W to the transport mechanism 8 while the first blowing ports 105 are blowing gas.

[0383] In this modified embodiment, the flow rate of the gas blown out from the first blowout port 105 is preferably smaller than the flow rate of the gas supplied to the suction part 68 of the transfer mechanism 8. According to this, when the transport mechanism 8 takes the substrate W from the lift pins 116, the suction portion 68 can easily suck the substrate W. In other words, when the transport mechanism 8 takes the substrate W from the lift pins 116, the hand 61 can easily hold the substrate W.

[0384] In the above-described embodiment, the lift pins 116 receive the substrate W from the transport mechanism 8. However, this is not limited to this. The fixed pins 103 may receive the substrate W from the transport mechanism 8. In other words, the transport mechanism 8 may directly transfer the substrate W to the fixed pins 103 without using the lift pins 116.

[0385] In the above-described embodiment, the lift pins 116 deliver the substrate W to the transport mechanism 8. However, this is not limited to this. The fixed pins 103 may deliver the substrate W to the transport mechanism 8. In other words, the transport mechanism 8 may take the substrate W directly from the fixed pins 103 without using the lift pins 116.

[0386] In the above-described embodiment, the first outlet 105 of the first processing unit 7A may discharge pure water in addition to gas.

[0387] 42 is a diagram schematically showing the configuration of a first processing unit 141 in the modified embodiment. Note that the same components as those in the first processing unit 7A of the embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0388] The first processing unit 141 in the modified embodiment includes a deionized water supply part 142. The deionized water supply part 142 ejects deionized water onto the substrate W through the first outlet 105.

[0389] The pure water supply unit 142 includes a pipe 143. The pipe 143 supplies pure water to the first outlet 105. The pipe 143 has a first end and a second end. The first end of the pipe 143 is connected to a pure water supply source 144. The second end of the pipe 143 is connected to the first outlet 105.

[0390] The first processing unit 141 includes a flow rate adjuster 145. The flow rate adjuster 145 is provided on the pipe 143. The flow rate adjuster 145 adjusts the flow rate of the pure water supplied to the substrate W by the pure water supply unit 142. That is, the flow rate adjuster 145 adjusts the flow rate of the pure water discharged from the first blow-out port 105. The flow rate adjuster 145 is controlled by the control unit 9.

[0391] The first blowing outlet 105 may blow out gas and pure water simultaneously. Alternatively, the first blowing outlet 105 may blow out pure water without blowing out gas. This more effectively prevents the pure water blown out from the first blowing outlet 105 from hitting the lower surface 16 at the center of the substrate W, causing the lower surface 16 at the center of the substrate W to bend downward. This more effectively prevents the substrate W from coming into contact with the upper surface 102 of the first plate 101.

[0392] When the processing liquid is supplied to the substrate W (step S39), the first blow-out port 105 may blow out both gas and pure water at the same time. Alternatively, when the processing liquid is supplied to the substrate W (step S39), the first blow-out port 105 may eject pure water without blowing out gas. This more effectively prevents the substrate W from coming into contact with the upper surface 102 of the first plate 101 when the processing liquid supply unit 121 supplies the processing liquid to the substrate W.

[0393] In this modified embodiment, it is preferable not to fill the space between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 with pure water (to make it liquid-tight). This is because gas is allowed to flow in the space between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103, and an appropriate suction force is applied to the substrate W supported by the fixing pins 103.

[0394] In the above-described embodiment, the first outlet 105 may also discharge the treatment liquid in addition to the gas.

[0395] 43 is a diagram schematically showing the configuration of a first processing unit 151 in the modified embodiment. Note that the same components as those in the first processing unit 7A of the embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0396] The processing liquid supply unit 121 includes a pipe 153. The pipe 153 supplies the processing liquid to the first outlet 105. The pipe 153 has a first end and a second end. The first end of the pipe 153 is connected to a processing liquid supply source 154. The second end of the pipe 153 is connected to the first outlet 105.

[0397] The first processing unit 141 includes a flow rate adjuster 155. The flow rate adjuster 155 is provided on the pipe 153. The flow rate adjuster 155 adjusts the flow rate of the processing liquid supplied to the substrate W by the processing liquid supply unit 121. That is, the flow rate adjuster 155 adjusts the flow rate of the processing liquid discharged from the first blow-out port 105. The flow rate adjuster 155 is controlled by the control unit 9.

[0398] When the processing liquid is supplied to the substrate W (step S39), the first blow-out port 105 may blow out gas and pure water at the same time. This allows the processing liquid to be supplied to the lower surface 16 of the substrate W. Therefore, the lower surface 16 of the substrate W can be processed in an appropriate manner.

[0399] In this modified embodiment, it is preferable not to fill the space between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 with treatment water (to make it liquid-tight) in order to apply an appropriate suction force to the substrate W supported by the fixing pins 103.

[0400] In the above-described embodiment, the control unit 9 determines the shape of the substrate W based on the detection result of the barcode reader 31. However, this is not limitative. Four modified embodiments are exemplified below.

[0401] The substrate processing apparatus 1 may include a substrate information detection unit that reads substrate information attached to the substrate W, and the control unit 9 may determine the shape of the substrate W based on the detection result of the substrate information detection unit. Here, the substrate information attached to the substrate W is, for example, an identification code printed on the substrate W. The substrate information detection unit is, for example, a reader.

[0402] The substrate processing apparatus 1 may include an imaging unit that captures an image of the substrate W, and the control unit 9 may determine the shape of the substrate W based on the detection result of the imaging unit. The imaging unit is, for example, a one-dimensional image sensor or a two-dimensional image sensor.

[0403] The control unit 9 may acquire information about the shape of the substrate W from an external device of the substrate processing apparatus 1. The external device of the substrate processing apparatus 1 is, for example, a host computer. Before the control unit 9 acquires the information from the external device, the control unit 9 may, for example, transmit the detection result of the barcode reader 31 to the external device. Before the control unit 9 acquires the information from the external device, the control unit 9 may, for example, transmit the detection result of the substrate detection units 38, 89, 127 to the external device.

[0404] Here, the information regarding the shape of the substrate W may be information that directly indicates the shape of the substrate W. The information that directly indicates the shape of the substrate W is, for example, information that directly indicates whether the substrate W belongs to the first substrate W1, the second substrate W2, or the third substrate W3. When the control unit 9 acquires information that directly indicates the shape of the substrate W, the control unit 9 does not perform step S2 of determining the shape of the substrate W. The information regarding the shape of the substrate W may also be information that directly indicates whether the substrate W belongs to the first substrate W1, the second substrate W2, or the third substrate W3. The information regarding the shape of the substrate W may also be information that indirectly indicates the shape of the substrate W. When the control unit 9 acquires information that indirectly indicates the shape of the substrate W, the control unit 9 performs step S2 of determining the shape of the substrate W based on the information that indirectly indicates the shape of the substrate W.

[0405] The substrate processing apparatus 1 may include an input unit that can input information related to the shape of the substrate, and the control unit 9 may acquire the information input to the input unit. The information related to the shape of the substrate input to the input unit may be information that directly indicates the shape of the substrate W, or may be information that indirectly indicates the shape of the substrate W.

[0406] In the above-described embodiment, the control unit 9 executes step S11 for determining the height positions HA and HB, step S12 for determining the insertion amounts KA and KB, and step S13 for determining the movement speed VA and acceleration AA. However, this is not limited to this. For example, at least one of steps S11, S12, and S13 may be omitted. For example, the control unit 9 may not execute at least one of steps S11, S12, and S13.

[0407] In the above-described embodiment, the control unit 9 executes step S21 for determining the height position HC, step S22 for determining the insertion amount KC, step S23 for determining the flow rate M, step S24 for determining the processing unit 7, and step S25 for determining the movement speed VB and the acceleration AB. However, this is not limited to this. For example, at least one of steps S21, S22, S23, S24, and S25 may be omitted. For example, the control unit 9 may not execute at least one of steps S21, S22, S23, S24, and S25.

[0408] In the above-described embodiment, the structures of the transport mechanisms 4 and 8 have been exemplified. However, the present invention is not limited to this. For example, the transport mechanism 4 may include an articulated arm supported by the vertical movement unit 34c and supporting the hand 33, instead of the rotating unit 34d and the advancing / retreating unit 34e. For example, the transport mechanism 4 may omit the rail 34a and the horizontal movement unit 34b and include a fixedly installed platform or support that supports the vertical movement unit 34c. For example, the transport mechanism 8 may include an articulated arm supported by the vertical movement unit 62b and supporting the hand 61, instead of the rotating unit 62c and the advancing / retreating unit 62d.

[0409] In the above-described embodiment, the processing block 5 is provided with one transport mechanism. However, this is not limited to this. The processing block 5 may be provided with two or more transport mechanisms. For example, multiple transport mechanisms may be installed in the transport space 41 of the processing block 5. For example, the multiple transport mechanisms may be arranged side by side in the front-rear direction X. The number of processing units 7 may be increased depending on the number of transport mechanisms in the processing block 5. The number of processing units 7 arranged side by side in the front-rear direction X may be changed as appropriate.

[0410] The above-described embodiment and each modified embodiment may be further modified as appropriate by replacing or combining each configuration with the configuration of another modified embodiment. [Explanation of symbols]

[0411] 1... Substrate processing equipment 2... Indexer section 3 ... Carrier placement area 4...Transport mechanism (second transport mechanism) 5... Processing block 6 ... Placement section (first position, second position) 7 ... Processing unit (1st position, 2nd position) 7A: First treatment unit 7B: Second processing unit 8...Transport mechanism (first transport mechanism) 9...Control section 11... Board body 12 ... Periphery of the substrate 13... Main part of the board 14 ... Recessed portion of the substrate 15 ... protective plate 16... Bottom of the board 17...Top surface of board 18 ... First side of the board 19 ... second side of the board 20...Edge of board 22 … Shelf 23 … 1st shelf 24 … Second shelf 31...Barcode reader 33...Hand 34 ... Hand drive unit 35 … Connection part 36 ... Rod 37 ... Contact area 38 ... Substrate detection unit 45 … shelf 46 ... 1st shelf 47 ... Second shelf 51 … 1st slope 51T: Top of the first slope 51B ... Lower end of first inclined surface 51M: Midpoint of the first slope 52 … Upward slope 53 … Downward slope 55…Second slope 56 … Upper slope 57 … Downward slope 61...Hand 62 ... Hand drive unit 64 … Connection part 65 ... base 66 ... Branch 68 … Suction part 69... Suction pad 71 ... Gas supply line 72...Gas supply source 73 … Suction adjustment section 74 … Contact area 75 … 1st contact part 76…Second contact part 77 … Wall part 78 … 1st wall section 79 … 2nd wall part 80 … Third wall section 81 ... Receiving part 82 ... First receiving part 83 ... Second receiving part 86 ... Receiving part drive part 87... Actuator 88 ... Elastic member 89 ... Substrate detection unit 91... Board holding part 91A...First board holding part 91B...Second board holding part 92 ... Rotation drive unit 92A ... First rotary drive unit 92B ... Second rotary drive unit 93...Guard 101...1st plate 102…Top surface 103 ... Fixed pin (support part) 104 ... Gas outlet 105 … 1st outlet 106 … 2nd outlet 107 ... First gas supply path 108 ... Second gas supply path 109 ... Gas supply source 111 … 1st blowout adjustment section 112...Second blowout adjustment section 113 ... Position adjustment pin (position adjustment part) 114 ... Shaft 116 ... Lift pin (lifting part) 121 ... Processing liquid supply unit 122 ... nozzle 123 ... Piping 124 ... Processing liquid supply source 125 … Flow rate adjustment section 127 ... Substrate detection unit 131 ... Second plate 132 …Top surface 133 ... Edge contact pin (edge ​​contact part) 134 … Small piece part 135 … Bottom contact pin 136 ... Shaft 141 ... First treatment unit 142 … Pure water supply section 143 ... Piping 144 … Pure water supply source 145 … Flow rate adjustment section 151 ... First processing unit 153 ... Piping 154 ... Processing liquid supply source 155 … Flow rate adjustment section A1, A2, A3, A4, A5, A6 … Rotation axis C... Carrier (1st position, 2nd position) D: Diameter of the board D1: Diameter of normal diameter substrate D2: Large diameter board E1: Distance between the first shelf 23 and the second shelf 24 arranged horizontally E2: Distance between the first shelf 46 and the second shelf 47 arranged horizontally (distance between the first inclined surface and the second inclined surface in the horizontal direction) ET: Horizontal distance between the top of the first inclined plane and the top of the second inclined plane EB: Horizontal distance between the bottom of the first inclined surface and the bottom of the second inclined surface EM: Distance between the midpoint of the first inclined plane and the midpoint of the second inclined plane in the horizontal direction F1 … 1st direction F2…Second direction F3 … 3rd direction F4 … 4th direction HA, HB, HC … Height position HA1, HB1, HC1 ... First height position HA2, HB2, HC2 … 2nd height position HA3, HB3, HC3 ... Third height position J: Center of the board KA, KB... Insertion amount KA1, KB1 ... First insertion amount KA2, KB2 ... Second insertion amount L1: Total length of the two rods in the second direction L2: Length of the rod in the first direction L3: Length of one rod in the second direction T1, T2, T3... Main part thickness of the board T4, T5, T6... Thickness of the board periphery VA, VB … Movement speed VA1, VB1 … 1st movement speed VA2, VB2…Second movement speed AA, AB… Acceleration AA1, AB1 ... First acceleration AA2, AB2 … 2nd acceleration M…Flow rate M1 … 1st flow rate M2…Second flow rate M3 … 3rd flow rate W: Substrate W1: First board W2: Second board W3: Third board WN: Normal diameter substrate WD: Large diameter substrate X…Anteroposterior direction Y: Width direction Z…Vertical direction θ1 … angle of upper inclined surface θ2 … Angle of the lower inclined surface

Claims

1. A substrate processing apparatus, a first transport mechanism that transports the substrate between a first position and a second position; a placement section for placing a substrate; a control unit that controls the first transport mechanism; Equipped with The first transport mechanism Hand and a hand driving unit that moves the hand; Equipped with The hand A base portion; a suction unit attached to the base unit, which causes a gas to flow along a first surface of the substrate and sucks the first surface of the substrate without coming into contact with the substrate; Equipped with When the first transport mechanism transports a substrate between the substrate receiving unit and the substrate receiving unit, the control unit changes the height position of the hand when inserting the hand into the substrate receiving unit in accordance with the thickness of a main portion of the substrate located inside a peripheral portion of the substrate. Substrate processing equipment.

2. In the substrate processing apparatus according to claim 1, The substrate is a first substrate having a recess formed by a main portion of the substrate located inside a peripheral edge portion of the substrate being recessed further than the peripheral edge portion of the substrate, and not having a glass protective plate; a second substrate not having the recess; Including, When the first transport mechanism transports the first substrate between the first transport mechanism and the placement unit, the control unit determines a height position of the hand when inserting the hand into the placement unit to be a first height position; When the first transport mechanism transports the second substrate between the first transport mechanism and the mounting unit, the control unit determines a height position of the hand when inserting the hand into the mounting unit to a second height position; The second height position is higher than the first height position. Substrate processing equipment.

3. In the substrate processing apparatus according to claim 1, The substrate is a first substrate having a recess formed by a main portion of the substrate located inside a peripheral edge portion of the substrate being recessed further than the peripheral edge portion of the substrate, and not having a glass protective plate; a third substrate having the recess and a glass protective plate; Including, When the first transport mechanism transports the first substrate between the first transport mechanism and the placement unit, the control unit determines a height position of the hand when inserting the hand into the placement unit to be a first height position; When the first transport mechanism transports the third substrate between the first transport mechanism and the placement unit, the control unit determines a height position of the hand when inserting the hand into the placement unit to be a third height position; The third height position is higher than the first height position. Substrate processing equipment.

4. In the substrate processing apparatus according to any one of claims 1 to 3, The control unit moves the hand at a first speed when the first transport mechanism is transporting a substrate, and moves the hand at a second speed higher than the first speed when the first transport mechanism is not transporting a substrate. Substrate processing equipment.

5. In the substrate processing apparatus according to claim 4, The first speed is equal to or less than 50% of the second speed. Substrate processing equipment.

6. In the substrate processing apparatus according to claim 4 or 5, The control unit moves the hand at a first acceleration when the first transport mechanism is transporting a substrate, and moves the hand at a second acceleration greater than the first acceleration when the first transport mechanism is not transporting a substrate. Substrate processing equipment.

7. A substrate processing apparatus according to any one of claims 1 to 6, The placement unit is Shelves adjacent to each other in the vertical direction, Equipped with The control unit determines a height position of the hand when the hand is inserted between the adjacent shelves. Substrate processing equipment.

8. A substrate processing apparatus according to any one of claims 1 to 7, When the first transport mechanism transports a substrate between the substrate receiving unit and the substrate receiving unit, the control unit determines the insertion amount of the hand when inserting the hand into the substrate receiving unit according to the diameter of the substrate. Substrate processing equipment.

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