Display device, light-emitting device and electronic device

Abstract

Provided is a display device making it possible to miniaturize a pixel pitch while securing a light emitting area.　The display device comprises an oxide layer including a plurality of first electrodes and a separation portion that electrically separates the adjacent first electrodes, a second electrode facing one surface of the oxide layer, and an organic light emitting layer provided between the oxide layer and the second electrode.

Description

[Technical Field]

[0001] The present disclosure relates to a display device, a light-emitting device, and an electronic device. [Background technology]

[0002] In recent years, organic electroluminescence (EL) display devices (hereinafter simply referred to as "display devices") have become widespread. Display devices with various configurations have been proposed. Patent Document 1 discloses a display device including a plurality of first electrodes, a second electrode, an organic layer provided between the plurality of first electrodes and the second electrodes, and a partition wall (insulating layer) provided between adjacent first electrodes. It also discloses that the plurality of first electrodes are formed by patterning a transparent conductive material layer such as an ITO layer using well-known patterning techniques such as lithography and etching. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 105433 Brochure Summary of the Invention [Problem to be solved by the invention]

[0004] However, the transparent conductive material such as ITO that constitutes the first electrode is a material that is difficult to etch (a so-called difficult-to-etch material), and therefore, in the display device described in Patent Document 1, it is difficult to reduce the pixel pitch while ensuring the light-emitting area.

[0005] An object of the present disclosure is to provide a display device, a light-emitting device, and an electronic device that can reduce the pixel pitch while ensuring a light-emitting area. [Means for solving the problem]

[0006] In order to solve the above problems, Display device according to the first aspect of the present disclosure teeth, containing the first oxide A plurality of first electrodes and a second oxide obtained by adding an impurity to the first oxide. Separation part have an oxide layer; a second electrode facing one surface of the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with 、 The separator is provided between the first electrodes adjacent in the in-plane direction, and electrically separates the first electrodes adjacent in the in-plane direction. A display device according to a second aspect of the present disclosure is , an oxide layer having a plurality of first electrodes including a first oxide and a separating portion including a second oxide having a composition ratio different from that of the first oxide; a second electrode facing one surface of the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with The separator is provided between the first electrodes adjacent in the in-plane direction, and electrically separates the first electrodes adjacent in the in-plane direction. A display device according to a third aspect of the present disclosure includes: an oxide layer having a plurality of first electrodes and separators; a second electrode facing one surface of the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with The crystallinity of the first electrode is higher than the crystallinity of the separation portion, The separator is provided between the first electrodes adjacent in the in-plane direction, and electrically separates the first electrodes adjacent in the in-plane direction.

[0007] Light-emitting device according to the fourth aspect of the present disclosure teeth, containing the first oxide A plurality of first electrodes and a second oxide obtained by adding an impurity to the first oxide. Separation part have an oxide layer; a second electrode facing the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with 、 The separator is provided between the first electrodes adjacent in the in-plane direction, and electrically separates the first electrodes adjacent in the in-plane direction. A light emitting device according to a fifth aspect of the present disclosure , an oxide layer having a plurality of first electrodes including a first oxide and a separating portion including a second oxide having a composition ratio different from that of the first oxide; a second electrode facing the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with The separator is provided between the first electrodes adjacent in the in-plane direction, and electrically separates the first electrodes adjacent in the in-plane direction. A light emitting device according to a sixth aspect of the present disclosure , an oxide layer having a plurality of first electrodes and separators; a second electrode facing the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with The crystallinity of the first electrode is higher than the crystallinity of the separation portion, The separator is provided between the first electrodes adjacent in the in-plane direction, and electrically separates the first electrodes adjacent in the in-plane direction.

[0008] Electronic device according to a seventh aspect of the present disclosure teeth, According to the first aspect of the present disclosure display device , a display device according to a second aspect of the present disclosure or Display device according to a third aspect of the present disclosure Equipped with 。 [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram showing an example of the overall configuration of a display device according to a first embodiment of the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view showing an example of the configuration of the display device according to the first embodiment of the present disclosure. [Figure 3] FIG. 3 is a plan view showing an example of the configuration of the oxide layer. [Figure 4] 4A, 4B, 4C, and 4D are process diagrams for explaining an example of a method for manufacturing a display device according to the first embodiment of the present disclosure. [Figure 5] 5A, 5B, and 5C are process diagrams for explaining an example of a manufacturing method for the display device according to the first embodiment of the present disclosure. [Figure 6] FIG. 6 is a cross-sectional view showing an example of the configuration of a display device according to a second embodiment of the present disclosure. [Figure 7] 7A, 7B, and 7C are process diagrams for explaining an example of a method for manufacturing a display device according to the second embodiment of the present disclosure. [Figure 8] 8A and 8B are process diagrams for explaining an example of a method for manufacturing a display device according to the second embodiment of the present disclosure. [Figure 9] FIG. 9 is a cross-sectional view showing an example of the configuration of a display device according to a third embodiment of the present disclosure. [Figure 10] 10A, 10B, and 10C are process diagrams for explaining an example of a method for manufacturing a display device according to the third embodiment of the present disclosure. [Figure 11] 11A, 11B, and 11C are process diagrams for explaining an example of a method for manufacturing a display device according to the third embodiment of the present disclosure. [Figure 12] FIG. 12 is a cross-sectional view showing an example of the configuration of a display device according to a modified example. [Figure 13] FIG. 13 is a plan view illustrating an example of a schematic configuration of a module. [Figure 14] 14A and 14B are front and rear views showing an example of the external appearance of a digital still camera. [Figure 15] FIG. 15 is a perspective view showing an example of the appearance of a head-mounted display. [Figure 16] FIG. 16 is a perspective view showing an example of the appearance of a television device. DETAILED DESCRIPTION OF THE INVENTION

[0010] Embodiments of the present disclosure will be described in the following order: In all drawings of the following embodiments, the same or corresponding parts are denoted by the same reference numerals. 1. First Embodiment 1.1 Display Device Configuration 1.2 Display device manufacturing method 1.3 Effects 2. Second Embodiment 2.1 Display Device Configuration 2.2 Display device manufacturing method 2.3 Effects 3 Third Embodiment 3.1 Display Device Configuration 3.2 Display device manufacturing method 3.3 Effects 4. Variations 5. Application Examples

[0011] <1 First Embodiment> [1.1 Display Device Configuration] 1 is a schematic diagram showing an example of the overall configuration of a display device 10 according to a first embodiment of the present disclosure. The display device 10 has a display area 110A and a peripheral area 110B provided on the periphery of the display area 110A. Within the display area 110A, a plurality of sub-pixels 100R, 100G, and 100B are two-dimensionally arranged in a specified arrangement pattern, such as a matrix. From the viewpoint of achieving high resolution in the display device 10, the pixel pitch of the sub-pixels 100 is preferably 10 μm or less.

[0012] The sub-pixel 100R displays red, the sub-pixel 100G displays green, and the sub-pixel 100B displays blue. In the following description, when the sub-pixels 100R, 100G, and 100B are not particularly distinguished from one another, they are referred to as sub-pixels 100. A combination of adjacent sub-pixels 100R, 100G, and 100B constitutes one pixel. FIG. 1 shows an example in which a combination of three sub-pixels 100R, 100G, and 100B arranged in the row direction (horizontal direction) constitutes one pixel.

[0013] The peripheral region 110B is provided with a signal line driving circuit 111 and a scanning line driving circuit 112, which are drivers for displaying video. The signal line driving circuit 111 supplies a signal voltage of a video signal corresponding to luminance information supplied from a signal supply source (not shown) to selected sub-pixels 100 via signal lines 111A. The scanning line driving circuit 112 is configured with a shift register or the like that sequentially shifts (transfers) a start pulse in synchronization with an input clock pulse. When writing a video signal to each sub-pixel 100, the scanning line driving circuit 112 scans the sub-pixels 100 row by row and sequentially supplies a scanning signal to each scanning line 112A.

[0014] The display device 10 is an example of a light-emitting device. The display device 10 may be a microdisplay. The display device 10 is suitable for use in a display device for VR (Virtual Reality), MR (Mixed Reality), or AR (Augmented Reality), an electronic viewfinder (EVF), a small projector, or the like.

[0015] 2 is a cross-sectional view showing an example of the configuration of a display device 10 according to a first embodiment of the present disclosure. The display device 10 includes a drive substrate 11A, a first insulating layer 12A, a plurality of reflective layers 13, an insulating portion 13C, a second insulating layer 12B, an oxide layer 14, an organic layer 15, a second electrode 16, a protective layer 17, a color filter 18, a filled resin layer 19, and a counter substrate 11B. The oxide layer 14 includes a plurality of first electrodes 14A and a separating portion 14B. The reflective layer 13 and the second electrode 16 may form a resonator structure.

[0016] The display device 10 is a top-emission display device. The counter substrate 11B side is the top side (display surface side), and the drive substrate 11A side is the bottom side. In the following description, of the layers constituting the display device 10, the surface that is the top side of the display device 10 is referred to as the first surface, and the surface that is the bottom side of the display device 10 is referred to as the second surface.

[0017] The display device 10 includes a plurality of light-emitting elements 10A. Each light-emitting element 10A is composed of a first electrode 14A, an organic layer 15, and a second electrode 16. The light-emitting element 10A is a white OLED or a white Micro-OLED (MOLED). The colorization method used in the display device 10 is a method using a white OLED and a color filter 18. However, the colorization method is not limited to this, and an RGB coloring method or the like may also be used.

[0018] (Drive board) The drive substrate 11A is a so-called backplane, and drives the plurality of light-emitting elements 10A. A drive circuit and a power supply circuit (neither of which are shown) are provided on a first surface of the drive substrate 11A. The drive circuit includes a sampling transistor and a drive transistor that control the driving of the plurality of light-emitting elements 10A. The power supply circuit supplies power to the plurality of light-emitting elements 10A.

[0019] The drive substrate 11A may be made of, for example, glass or resin with low moisture and oxygen permeability, or may be made of a semiconductor that facilitates the formation of transistors and the like. Specifically, the drive substrate 11A may be a glass substrate, a semiconductor substrate, a resin substrate, or the like. Examples of glass substrates include high strain point glass, soda glass, borosilicate glass, forsterite, lead glass, and quartz glass. Examples of semiconductor substrates include amorphous silicon, polycrystalline silicon, and single crystal silicon. Examples of resin substrates include at least one selected from the group consisting of polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.

[0020] (First insulating layer) The first insulating layer 12A is provided on the first surface of the drive substrate 11A and covers the drive circuit, power supply circuit, etc. The first insulating layer 12A includes a plurality of contact plugs 12A1. Each contact plug 12A1 connects the light emitting element 10A to the reflective layer 13. The first insulating layer 12A may further include a plurality of wirings (not shown).

[0021] The first insulating layer 12A includes, for example, an organic material or an inorganic material. The organic material includes, for example, at least one selected from the group consisting of polyimide, acrylic resin, etc. The inorganic material includes, for example, at least one selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, etc.

[0022] (Second insulating layer) The second insulating layer 12B is provided on the first surface of the plurality of reflective layers 13 and the insulating portion 13C, and covers the plurality of reflective layers 13. That is, the second insulating layer 12B is provided between the oxide layer 14 and the plurality of reflective layers 13. The second insulating layer 12B includes a plurality of contact plugs 12B1. Each contact plug 12B1 connects the light-emitting element 10A and the reflective layer 13. Examples of materials that can be used to form the second insulating layer 12B include the same materials as those used to form the first insulating layer 12A.

[0023] (reflective layer) The plurality of reflective layers 13 are provided on a first surface of the first insulating layer 12A. The plurality of reflective layers 13 are provided at positions corresponding to the plurality of sub-pixels 100, respectively. The plurality of reflective layers 13 face the second surface (the other surface) of the oxide layer 14 with the second insulating layer 12B sandwiched therebetween. The plurality of reflective layers 13 face the plurality of first electrodes 14A, respectively. The reflective layer 13 reflects light emitted from the organic layer 15. The reflective layer 13 includes a first metal layer 13A and a second metal layer 13B. However, the first metal layer 13A is provided as needed and may not be provided. A groove 13D is provided between adjacent reflective layers 13.

[0024] (First metal layer) The first metal layer 13A is provided on the first surface of the first insulating layer 12A. The first metal layer 13A is an underlayer for improving the crystal orientation of the second metal layer 13B when the second metal layer 13B is formed. By improving the crystal orientation of the second metal layer 13B, it is possible to reduce the unevenness of the surface (first surface) of the second metal layer 13B. The second surface of the first metal layer 13A is connected to a contact plug 12A1 provided in the first insulating layer 12A.

[0025] The first metal layer 13A contains, for example, at least one metal element selected from the group consisting of titanium (Ti) and tantalum (Ta), and may contain the at least one metal element as a constituent element of an alloy.

[0026] (Second metal layer) The second metal layer 13B is provided on the first surface of the first metal layer 13A. The second metal layer 13B functions as a reflective layer that reflects light emitted from the organic layer 15. The first surface of the second metal layer 13B is connected to a contact plug 12B1 provided in the second insulating layer 12B.

[0027] The second metal layer 13B contains at least one metal element selected from the group consisting of aluminum (Al), silver (Ag), chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), magnesium (Mg), iron (Fe), and tungsten (W). The second metal layer 13B may contain the at least one metal element as a constituent element of an alloy. Specific examples of the alloy include an aluminum alloy or a silver alloy. Specific examples of the aluminum alloy include AlNd and AlCu. From the viewpoint of improving reflectance, the second metal layer 13B preferably contains at least one metal element selected from the group consisting of aluminum (Al) and silver (Ag) among the above metal elements.

[0028] (insulation part) The insulating portion 13C is provided in the groove 13D between adjacent reflective layers 13, filling the groove 13D. The insulating portion 13C electrically separates and spatially separates the adjacent reflective layers 13. Examples of materials that can be used to form the insulating portion 13C include the same materials as those used to form the first insulating layer 12A.

[0029] (oxide layer) FIG. 3 is a plan view showing an example of the configuration of oxide layer 14. Oxide layer 14 is provided on the first surface of second insulating layer 12B. Oxide layer 14 contains a metal oxide. The metal oxide contains at least one selected from the group consisting of an oxide containing indium, an oxide containing tin, and an oxide containing zinc. As described above, oxide layer 14 includes a plurality of first electrodes 14A and separators 14B.

[0030] (first electrode) The plurality of first electrodes 14A are two-dimensionally arranged in a predetermined arrangement pattern, such as a matrix, on the first surface of the second insulating layer 12B. Each first electrode 14A is provided in a portion corresponding to a subpixel 100. The first electrode 14A is an anode. When a voltage is applied between the first electrode 14A and the second electrode 16, holes are injected from the first electrode 14A into the organic layer 15. The first electrode 14A is a transparent electrode that transmits light emitted from the organic layer 15. The second surface of the first electrode 14A is connected to a contact plug 12B1 provided in the second insulating layer 12B. In order to improve luminous efficiency, it is preferable that the first electrode 14A be made of a material with a high work function and high transmittance.

[0031] The first electrode 14A includes a first oxide. The first oxide is a transparent conductive oxide (TCO). The transparent conductive oxide includes at least one selected from the group consisting of transparent conductive oxides containing indium (hereinafter referred to as "indium-based transparent conductive oxides"), transparent conductive oxides containing tin (hereinafter referred to as "tin-based transparent conductive oxides"), and transparent conductive oxides containing zinc (hereinafter referred to as "zinc-based transparent conductive oxides").

[0032] Examples of indium-based transparent conductive oxides include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), and fluorine-doped indium oxide (IFO). Among these transparent conductive oxides, indium tin oxide (ITO) is particularly preferred. This is because indium tin oxide (ITO) has a particularly low work function barrier for hole injection into the organic layer 15, allowing the driving voltage of the display device 10 to be particularly low. Examples of tin-based transparent conductive oxides include tin oxide, antimony-doped tin oxide (ATO), and fluorine-doped tin oxide (FTO). Examples of zinc-based transparent conductive oxides include zinc oxide, aluminum-doped zinc oxide (AZO), boron-doped zinc oxide, and gallium-doped zinc oxide (GZO).

[0033] (separation part) The separators 14B are provided between adjacent first electrodes 14A in the in-plane direction. The separators 14B surround the entire periphery of the first electrodes 14A. The separators 14B have, for example, a lattice shape. Each separator 14B electrically separates adjacent first electrodes 14A in the in-plane direction. In this specification, the in-plane direction means the direction along the first surface (display surface) of the display device 10 or the first surface of the drive substrate 11A. The electrical resistance of the separators 14B is higher than the electrical resistance of the first electrodes 14A. The separators 14B are preferably insulating parts.

[0034] The separating portion 14B includes a second oxide, which is an insulating material. The second oxide is an insulating oxide. The insulating oxide includes at least one selected from the group consisting of an insulating oxide containing indium (hereinafter referred to as an "indium-based insulating oxide"), an insulating oxide containing tin (hereinafter referred to as a "tin-based insulating oxide"), and an insulating oxide containing zinc (hereinafter referred to as a "zinc-based insulating oxide"). The second oxide may be an insulating oxide obtained by adding impurities (ions) to the first oxide. The impurities can change the transparent conductive oxide into an insulating oxide by adding them. Specifically, for example, the impurities include at least one selected from the group consisting of oxygen (O), sulfur (S), and nitrogen (N).

[0035] The first oxide contained in the first electrode 14A and the second oxide contained in the separator 14B may be made of the same constituent material (constituent elements), but the composition ratio of the first oxide to the second oxide may be different. Alternatively, the first oxide contained in the first electrode 14A and the second oxide contained in the separator 14B may be made of the same material in part, but different in the remainder. In order to make the electrical resistance of the first electrode 14A lower than that of the separator 14B, it is preferable that the crystallinity of the first electrode 14A be higher than that of the separator 14B. The first electrode 14A and the separator 14B may have different optical properties, such as transmittance.

[0036] (Second electrode) The second electrode 16 corresponds to the first surface of the oxide layer 14, sandwiching the organic layer 15. The second electrode 16 is provided as a common electrode for all subpixels 100 in the display area 110A. The second electrode 16 is a cathode. When a voltage is applied between the first electrode 14A and the second electrode 16, electrons are injected from the second electrode 16 into the organic layer 15. The second electrode 16 is a transparent electrode that is transparent to light generated in the organic layer 15. Here, the transparent electrode also includes a semi-transparent reflective layer. In order to increase luminous efficiency, it is preferable that the second electrode 16 be made of a material that is as transparent as possible and has a small work function.

[0037] The second electrode 16 is composed of, for example, at least one layer of a metal layer and a transparent electrode. More specifically, the second electrode 16 is composed of a single layer film of a metal layer or a transparent electrode, or a laminated film of a metal layer and a transparent electrode. When the second electrode 16 is composed of a laminated film, the metal layer may be provided on the organic layer 15 side, or the transparent electrode may be provided on the organic layer 15 side. However, from the viewpoint of having a layer having a low work function adjacent to the organic layer 15, it is preferable that the metal layer be provided on the organic layer 15 side.

[0038] The metal layer contains at least one metal element selected from the group consisting of magnesium (Mg), aluminum (Al), silver (Ag), calcium (Ca), and sodium (Na). The metal layer may contain at least one of the metal elements as a constituent element of an alloy. Specific examples of the alloy include an MgAg alloy, an MgAl alloy, and an AlLi alloy. The transparent electrode contains a transparent conductive oxide. Examples of the transparent conductive oxide include the same materials as those used for the first electrode 14A described above.

[0039] (organic layer) The organic layer 15 is provided between the oxide layer 14 and the second electrode 16. The organic layer 15 is provided as an organic layer common to all the sub-pixels 100 in the display region 110A. The organic layer 15 is configured to be capable of emitting white light.

[0040] The organic layer 15 has a structure in which a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are stacked in this order from the oxide layer 14 toward the second electrode 16. However, the structure of the organic layer 15 is not limited to this, and layers other than the light-emitting layer may be provided as needed.

[0041] The hole injection layer is a buffer layer that increases the efficiency of hole injection into the light-emitting layer and suppresses leakage. The hole transport layer is a buffer layer that increases the efficiency of hole transport into the light-emitting layer. The light-emitting layer generates light by recombining electrons and holes when an electric field is applied. The light-emitting layer is an organic light-emitting layer containing an organic light-emitting material. The electron transport layer is a layer that increases the efficiency of electron transport into the light-emitting layer. An electron injection layer may be provided between the electron transport layer and the second electrode 16. This electron injection layer increases the efficiency of electron injection.

[0042] (protective layer) The protective layer 17 is provided on the first surface of the second electrode 16 and covers the plurality of light emitting elements 10A. The protective layer 17 isolates the light emitting elements 10A from the outside air and prevents moisture from entering the light emitting elements 10A from the external environment. In addition, when the second electrode 16 is made of a metal layer, the protective layer 17 may have a function of preventing oxidation of the metal layer.

[0043] The protective layer 17 includes, for example, an inorganic material with low moisture absorption. The inorganic material includes, for example, at least one of silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiNO), titanium oxide (TiO), and aluminum oxide (AlO). The protective layer 17 may have a single-layer structure or a multi-layer structure. In the case of a multi-layer structure, internal stress in the protective layer 17 can be alleviated. The protective layer 17 may be made of a polymer resin. The polymer resin includes at least one selected from the group consisting of thermosetting resins, ultraviolet-curing resins, and the like.

[0044] (Color filter) The color filter 18 is provided on the first surface of the protective layer 17. The color filter 18 is, for example, an on-chip color filter (OCCF). The color filter 18 includes, for example, a red filter, a green filter, and a blue filter. The red filter, the green filter, and the blue filter are provided facing the light-emitting element 10A for the red sub-pixel 100R, the light-emitting element 10A for the green sub-pixel 100G, and the light-emitting element 10A for the blue sub-pixel 100B, respectively. This forms the sub-pixels 100R, 100G, and 100B.

[0045] White light emitted from each light-emitting element 10A in each of the sub-pixels 100R, 100G, and 100B passes through the red, green, and blue filters, respectively, and is thereby emitted as red, green, and blue light from the display surface. A light-shielding layer (not shown) may be provided between the color filters of each color, i.e., between the sub-pixels. The color filter 18 is not limited to an on-chip color filter, but may be provided on one main surface of the counter substrate 11B.

[0046] (Filled resin layer) The filled resin layer 19 is provided between the color filter 18 and the counter substrate 11B. The filled resin layer 19 functions as an adhesive layer that bonds the color filter 18 and the counter substrate 11B. The filled resin layer 19 includes, for example, at least one type selected from the group consisting of a thermosetting resin, an ultraviolet-curing resin, and the like.

[0047] (opposing substrate) The counter substrate 11B is disposed opposite the drive substrate 11A. More specifically, the counter substrate 11B is disposed so that the second surface of the counter substrate 11B faces the first surface of the drive substrate 11A. The counter substrate 11B and the filled resin layer 19 seal the light emitting element 10A, the color filter 18, and the like. The counter substrate 11B is made of a material such as glass that is transparent to the colored light emitted from the color filter 18.

[0048] [1.2 Display device manufacturing method] Hereinafter, an example of a method for manufacturing the display device 10 according to the first embodiment of the present disclosure will be described with reference to FIGS. 4A to 4D and 5A to 5C.

[0049] First, a drive circuit, a power supply circuit, etc. are formed on a first surface of the drive substrate 11A using, for example, thin film formation technology, photolithography technology, etching technology, etc. Next, a first insulating layer 12A is formed on the first surface of the drive substrate 11A by, for example, CVD (Chemical Vapor Deposition) so as to cover the drive circuit, the power supply circuit, etc. At this time, a plurality of contact plugs 12A1 are formed in the first insulating layer 12A.

[0050] Next, a first metal layer 13A is formed on the first surface of the first insulating layer 12A by, for example, sputtering. Subsequently, a second metal layer 13B is formed on the first surface of the first metal layer 13A by, for example, sputtering (see FIG. 4A). Next, a resist mask with a predetermined pattern is formed on the first surface of the second metal layer 13B, and then the first metal layer 13A and the second metal layer 13B are dry-etched through the resist mask. As a result, a plurality of reflective layers 13 separated by grooves 13D are formed on the first surface of the first insulating layer 12A (see FIG. 4B).

[0051] Next, an insulating layer is formed in the grooves 13D between adjacent reflective layers 13 and on the first surfaces of the plurality of reflective layers 13, for example, by CVD. Next, the insulating layer formed on the first surface of each reflective layer 13 is removed, for example, by etch-back or CMP (Chemical Mechanical Polishing). This forms insulating portions 13C in the grooves 13D between adjacent reflective layers 13. Next, a second insulating layer 12B is formed on the first surfaces of the plurality of reflective layers 13 and insulating portions 13C, for example, by CVD. At this time, a plurality of contact plugs 12B1 are formed in the second insulating layer 12B.

[0052] Next, a transparent conductive oxide layer 14C is formed on the first surface of the second insulating layer 12B by, for example, sputtering (see FIG. 4C). Next, a resist mask 51 having a predetermined pattern is formed on the first surface of the transparent conductive oxide layer 14C (see FIG. 4D). The resist mask 51 has openings 51A in the portions corresponding to the spaces between adjacent subpixels 100. Next, ions are implanted into the transparent conductive oxide layer 14C through the openings 51A of the resist mask 51. The portions of the transparent conductive oxide layer 14C into which the ions are implanted become highly resistive. This results in the formation of an oxide layer 14 having a plurality of first electrodes 14A and separators 14B (see FIG. 5A). The ions to be implanted are, for example, at least one selected from the group consisting of oxygen (O), sulfur (S), and nitrogen (N). Next, the resist mask 51 is removed from the first surface of the oxide layer 14.

[0053] Next, a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are stacked in this order on the first surface of the oxide layer 14 by, for example, vapor deposition, to form the organic layer 15 (see FIG. 5B). Next, a second electrode 16 is formed on the first surface of the organic layer 15 by, for example, vapor deposition or sputtering. This results in the formation of a plurality of light-emitting elements 10A on the first surface of the second insulating layer 12B (see FIG. 5C).

[0054] Next, a protective layer 17 is formed on the first surface of the second electrode 16, for example, by CVD or vapor deposition, and then a color filter 18 is formed on the first surface of the protective layer 17, for example, by photolithography. Note that a planarization layer may be formed above, below, or both above and below the color filter 18 to smooth out unevenness in the protective layer 17 or unevenness due to differences in the film thickness of the color filter 18 itself. Next, the color filter 18 is covered with a filling resin layer 19, for example, using the ODF (One Drop Fill) method, and then the counter substrate 11B is placed on the filling resin layer 19. Next, the filling resin layer 19 is cured by applying heat or irradiating it with ultraviolet light, for example, to bond the driving substrate 11A and the counter substrate 11B together via the filling resin layer 19. This seals the display device 10. The display device 10 shown in FIGS. 1 and 2 is thus obtained.

[0055] [1.3 Action and Effects] As described above, the display device 10 according to the first embodiment includes an oxide layer 14, which includes a plurality of first electrodes 14A and separators 14B that electrically separate adjacent first electrodes 14A. The separators 14B can be formed by implanting ions into the transparent conductive oxide layer 14C through a resist mask. This allows for electrical separation between adjacent first electrodes 14A without etching the transparent conductive oxide, which is a difficult-to-etch material. This allows for a finer pixel pitch (for example, 10 μm or less) while maintaining a sufficient light-emitting area.

[0056] In conventional display devices, a partition wall (insulating layer) is provided between adjacent first electrodes, whereas in the display device 10 according to the first embodiment, a separator 14B is provided instead of the partition wall (insulating layer). Therefore, in the display device 10 according to the first embodiment, it is possible to miniaturize the sub-pixels 100. Furthermore, it is possible to eliminate characteristic degradation (for example, edge leakage, burn-in, and heat resistance) caused by the partition wall.

[0057] Because transparent conductive oxide is a difficult-to-etch material, attempting to fabricate first electrodes by etching the transparent conductive oxide layer at the resist resolution limit may result in short circuits between adjacent first electrodes. For this reason, conventional display devices require etching the transparent conductive oxide layer at a size larger than the resist resolution limit. In contrast, the display device 10 according to the first embodiment can separate adjacent first electrodes 14A by implanting ions into the transparent conductive oxide layer 14C through a resist mask. This allows the transparent conductive oxide layer 14C to be processed at the resist resolution limit. In other words, it is possible to form separation portions 14B at the resist resolution limit.

[0058] <2. Second embodiment> [2.1 Display Device Configuration] 6 is a cross-sectional view showing an example of the configuration of a display device 20 according to a second embodiment of the present disclosure. The display device 20 includes an oxide layer 24 instead of the oxide layer 14 (see FIG. 2). The plurality of reflective layers 13 are adjacent to the second surfaces of the plurality of first electrodes 14A. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0059] (oxide layer) The oxide layer 24 is provided on the first surfaces of the plurality of reflective layers 13 so as to follow the shape of the grooves 13D. The oxide layer 24 includes a separation portion 24B instead of the separation portion 14B (see FIG. 2).

[0060] (separation part) The separation portion 24B has a recess 24B1 and a covering portion 24B2. However, the configuration of the separation portion 24B is not limited to this, and the separation portion 24B does not necessarily have to have the covering portion 24B2. The recess 24B1 has a recessed shape relative to the first surface of the first electrode 14A. In the second embodiment, the first surface (main surface) of the reflective layer 13 faces the organic layer 15 with the first electrode 14A sandwiched therebetween. The recess 24B1 is provided in a groove 13D between adjacent reflective layers 13. The recess 24B1 may follow the shape of the groove 13D. An insulating portion 13C is provided in the recess 24B1.

[0061] The covering portion 24B2 covers the peripheral portion of the first surface (main surface) of the reflective layer 13. Here, the peripheral portion of the first surface of the reflective layer 13 refers to an area having a predetermined width extending inward from the peripheral edge of the first surface of the reflective layer 13. When the separation portion 24B has the covering portion 24B2, the insulation between the sub-pixels 100 can be further improved. From the viewpoint of improving the insulation between the sub-pixels 100, the groove 13D preferably has a depth equal to or greater than the thickness of the reflective layer 13.

[0062] In all other respects, the separation section 24B is similar to the separation section 14B in the first embodiment.

[0063] [2.2 Display device manufacturing method] Hereinafter, an example of a method for manufacturing the display device 20 according to the second embodiment of the present disclosure will be described with reference to FIGS. 4B, 7A to 7C, 8A, and 8B.

[0064] First, the steps up to patterning of the first metal layer 13A and the second metal layer 13B are performed in the same manner as in the manufacturing method of the display device 10 according to the first embodiment. As a result, a plurality of reflective layers 13 separated by grooves 13D are formed on the first surface of the first insulating layer 12A (see FIG. 4B).

[0065] Next, a transparent conductive oxide layer 24C is formed on the first surface of the plurality of reflective layers 13 by, for example, sputtering so as to follow the shape of the grooves 13D between adjacent reflective layers 13 (see FIG. 7A). Next, a resist mask 61 having a predetermined pattern is formed on the first surface of the transparent conductive oxide layer 24C (see FIG. 7B). The resist mask 61 has openings 61A in the areas of the grooves 13D. The width W1 of the openings 61A may be the same as or wider than the width W2 of the grooves 13D. If the width W1 of the openings 61A is wider than the width W2 of the grooves 13D, the separation portions 24B having the covering portions 24B2 are formed in a subsequent ion implantation process. On the other hand, if the width W1 of the openings 61A is equal to the width W2 of the grooves 13D, the separation portions 24B not having the covering portions 24B2 are formed in a subsequent ion implantation process.

[0066] Next, ions are implanted into the transparent conductive oxide layer 24C through the openings 61A in the resist mask (see FIG. 7B). The portions of the transparent conductive oxide layer 14C into which the ions have been implanted become highly resistive. As a result, an oxide layer 24 having a plurality of first electrodes 14A and separation portions 24B is formed (see FIG. 7C). The ions to be implanted are, for example, at least one selected from the group consisting of oxygen (O), sulfur (S), and nitrogen (N). Next, the resist mask 61 is removed from the first surface of the oxide layer 24.

[0067] Next, an insulating layer is formed in the recesses 24B1 between adjacent reflective layers 13 and on the first surfaces of the plurality of reflective layers 13, for example, by CVD. Next, the insulating layer formed on the first surface of each reflective layer 13 is removed, for example, by etch-back or CMP. This forms insulating portions 13C in the recesses 24B1 between adjacent reflective layers 13 (see FIG. 8A). Next, a hole injection layer, a hole transport layer, an emitting layer, and an electron transport layer are stacked in this order on the first surface of the oxide layer 24, for example, by vapor deposition, to form the organic layer 15 (see FIG. 8B).

[0068] The subsequent steps are carried out in the same manner as in the manufacturing method of the display device 10 of the first embodiment. As a result, the display device 20 shown in FIG.

[0069] [2.3 Action and Effects] As described above, the display device 20 according to the second embodiment includes the oxide layer 24, which includes a plurality of first electrodes 14A and separators 24B. Therefore, the same effects as those of the display device 10 according to the first embodiment can be obtained.

[0070] The separating portion 24B has a recess 24B1 and a covering portion 24B2. The recess 24B1 is provided in the groove 13D, and the covering portion 24B2 covers the peripheral edge portion of the first surface of the reflective layer 13. This makes it possible to increase the resistance of the recess 24B1 and its surrounding area.

[0071] Since dry etching of the transparent conductive oxide is not required, the etching depth of the underlying layer can be reduced, which reduces the step between the sub-pixels 100 and suppresses leakage between the first electrode 14A and the second electrode 16 via the organic layer 15.

[0072] <3 Third embodiment> [3.1 Display Device Configuration] FIG. 9 is a cross-sectional view showing an example of the configuration of a display device 30 according to a third embodiment of the present disclosure. The display device 30 includes an oxide layer 34 instead of the oxide layer 24 (see FIG. 2). In the third embodiment, the same components as those in the second embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0073] (oxide layer) The oxide layer 34 is provided on the first surfaces of the plurality of reflective layers 13 so as to follow the shape of the grooves 13D. The oxide layer 34 includes a first electrode 34A and a separator 34B.

[0074] The first electrode 34A includes a third oxide. The third oxide may be a transparent conductive oxide obtained by adding a first impurity (first ion) and a second impurity (second ion) to the first oxide. The first impurity increases the resistance of the transparent conductive oxide and can change the transparent conductive oxide into an insulating oxide when added. Specifically, for example, the first impurity includes at least one selected from the group consisting of oxygen (O), sulfur (S), and nitrogen (N). The second impurity decreases the resistance of the insulating oxide and can change the insulating oxide into a transparent conductive oxide when added. Specifically, for example, the second impurity includes at least one selected from the group consisting of hydrogen (H), lithium (Li), magnesium (Mg), and cesium (Cs). The first electrode 34A is similar to the first electrode 14A in the first embodiment in all other respects.

[0075] The separation portion 34B is a recessed portion, which is similar to the recessed portion 24B1 of the separation portion 24B in the second embodiment.

[0076] [3.2 Display device manufacturing method] Hereinafter, an example of a method for manufacturing the display device 30 according to the third embodiment of the present disclosure will be described with reference to FIG. 7A, FIGS. 10A to 10C, and FIGS. 11A to 11C.

[0077] First, the steps up to the formation of the transparent conductive oxide layer 24C are performed in the same manner as in the manufacturing method of the display device 20 according to the second embodiment. As a result, the transparent conductive oxide layer 24C is formed on the first surfaces of the plurality of reflective layers 13 so as to follow the shapes of the grooves 13D between the adjacent reflective layers 13 (see FIG. 7A).

[0078] Next, ions are implanted into the transparent conductive oxide layer 24C (see FIG. 10A). This increases the resistance of the transparent conductive oxide layer 24C, turning it into an insulating oxide layer 34C (see FIG. 10B). The first ions to be implanted are, for example, at least one selected from the group consisting of oxygen (O), sulfur (S), and nitrogen (N).

[0079] Next, an insulating layer is formed in the grooves 13D between adjacent reflective layers 13 and on the first surfaces of the plurality of reflective layers 13, for example, by CVD. Next, the insulating layer formed on the first surface of each reflective layer 13 is removed, for example, by etch-back or CMP. As a result, insulating portions 13C are formed in the grooves 13D between adjacent reflective layers 13 (see FIG. 10C).

[0080] Next, ions are implanted into the first surface (the surface on which the insulating oxide layer 34C and insulating portions 13C are formed) of the laminate obtained as described above (see FIG. 11A). As a result, ions are implanted into the first portions of the insulating oxide layer 34C that cover the first surfaces of the first electrodes 34A, reducing the resistance of the first portions and transforming them into a transparent conductive oxide layer. On the other hand, ions are not implanted into the second portions of the insulating oxide layer 34C that are provided in the grooves 13D, and the second portions remain as the insulating oxide layer 34C. Therefore, an oxide layer 34 including multiple first electrodes 34A and separators 34B is formed (see FIG. 11B). The second ions to be implanted are, for example, at least one selected from the group consisting of hydrogen (H), lithium (Li), magnesium (Mg), and cesium (Cs).

[0081] Next, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are stacked in this order on the first surface of the oxide layer 34 by, for example, vapor deposition to form the organic layer 15 (see FIG. 11C).

[0082] The subsequent steps are carried out in the same manner as in the manufacturing method of the display device 10 of the first embodiment. As a result of the above, the display device 30 shown in FIG.

[0083] [3.3 Action and Effects] As described above, the display device 30 according to the third embodiment includes the oxide layer 34, which includes a plurality of first electrodes 14A and separators 34B. Therefore, the same effects as those of the display device 10 according to the first embodiment can be obtained.

[0084] <4 Variations> (Variation 1) In the second embodiment, an example (see FIG. 6) in which the insulating portion 13C is provided in the recess 24B1 of the oxide layer 24 has been described, but as shown in FIG. 12, the insulating portion 13C does not have to be provided in the recess 24B1. In this case, the organic layer 15 and the second electrode 16 may be provided so as to follow the shape of the recess 24B1, and the protective layer 17 may fill the recess 24B1. Alternatively, the organic layer 15 may be provided so as to follow the shape of the recess 24B1, and the second electrode 16 may fill the recess 24B1.

[0085] Similarly, in the third embodiment, insulating portion 13C may not be provided in recessed separation portion 34B. In this case, organic layer 15 and second electrode 16 may be provided to follow the shape of separation portion 34B, and protective layer 17 may fill separation portion 34B. Alternatively, organic layer 15 may be provided to follow the shape of separation portion 34B, and second electrode 16 may fill separation portion 34B.

[0086] (Variation 2) In the first to third embodiments, examples in which the present disclosure is applied to a display device have been described, but the present disclosure is not limited thereto and can be applied to light-emitting devices other than display devices. Examples of light-emitting devices other than display devices include, but are not limited to, lighting devices. In this case, the number of light-emitting elements included in the light-emitting device such as a lighting device may be plural or singular.

[0087] < 5 Application Examples > (electronic equipment) The display devices 10, 20, and 30 according to the first to third embodiments and their modifications can be used in various electronic devices. The display devices 10, 20, and 30 are incorporated into various electronic devices, for example, as a module as shown in FIG. 13 . They are particularly suited to devices requiring high resolution, such as electronic viewfinders for video cameras and single-lens reflex cameras, or head-mounted displays, which are used with magnification close to the eyes. This module has an exposed area 210 on one short side of the drive substrate 11A that is not covered by the counter substrate 11B or the like. External connection terminals (not shown) are formed in this area 210 by extending the wiring of the signal line drive circuit 111 and the scanning line drive circuit 112. A flexible printed circuit (FPC) 220 for signal input / output may be connected to this external connection terminal.

[0088] (Example 1) 14A and 14B show an example of the appearance of a digital still camera 310. This digital still camera 310 is an interchangeable lens single-lens reflex type, and has an interchangeable taking lens unit (interchangeable lens) 312 located approximately in the center of the front of a camera main body 311, and a grip part 313 on the left front side for the photographer to hold.

[0089] A monitor 314 is provided at a position shifted to the left from the center on the back of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking through the electronic viewfinder 315, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 312 and determine the composition. Any of the display devices 10, 20, and 30 can be used as the electronic viewfinder 315.

[0090] (Example 2) 15 shows an example of the appearance of a head-mounted display 320. The head-mounted display 320 has, for example, ear hooks 322 on both sides of a glasses-shaped display unit 321 for wearing on the user's head. Any of the display devices 10, 20, and 30 can be used as the display unit 321.

[0091] (Example 3) 16 shows an example of the appearance of a television device 330. This television device 330 has, for example, an image display screen unit 331 including a front panel 332 and a filter glass 333, and this image display screen unit 331 is configured by any of the display devices 10, 20, and 30.

[0092] The above provides a specific description of the first to third embodiments of the present disclosure and their variations. However, the present disclosure is not limited to the above-described first to third embodiments and their variations, and various modifications based on the technical concept of the present disclosure are possible.

[0093] For example, the configurations, methods, steps, shapes, materials, and numerical values, etc., given in the first to third embodiments and their variations described above are merely examples, and different configurations, methods, steps, shapes, materials, and numerical values, etc., may be used as needed.

[0094] The configurations, methods, steps, shapes, materials, numerical values, and the like of the above-described first to third embodiments and their modified examples can be combined with one another without departing from the spirit of the present disclosure.

[0095] Unless otherwise specified, the materials exemplified in the first to third embodiments and their modifications can be used singly or in combination of two or more.

[0096] The present disclosure may also employ the following configuration. (1) an oxide layer including a plurality of first electrodes and a separation portion that electrically separates adjacent first electrodes; a second electrode facing one surface of the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; A display device comprising: (2) a plurality of reflective layers facing the other surface of the oxide layer; The display device according to (1), wherein the plurality of reflective layers face the plurality of first electrodes, respectively. (3) The display device according to (2), wherein the plurality of reflective layers are adjacent to the plurality of first electrodes, respectively. (4) the reflective layer has a main surface facing the organic light-emitting layer with the first electrode interposed therebetween; the separation portion has a recessed portion that is recessed relative to the main surface, The display device according to (2) or (3), wherein a groove is provided between the adjacent reflective layers, and the recess is provided within the groove. (5) The display device according to (4), wherein the separation section further includes a covering section that covers a peripheral edge of the main surface. (6) The display device according to (4) or (5), wherein the groove has a depth equal to or greater than the thickness of the reflective layer. (7) The display device according to any one of (4) to (6), further comprising an insulating portion provided in the recess. (8) The display device according to any one of (4) to (6), wherein the organic light-emitting layer conforms to the recess. (9) The display device according to (2), further comprising an insulating layer provided between the oxide layer and the plurality of reflective layers. (10) The display device according to any one of (1) to (9), wherein the electrical resistance of the separator is higher than the electrical resistance of the first electrode. (11) The display device according to any one of (1) to (10), wherein the separating portion is an insulating portion. (12) The display device according to any one of (1) to (11), wherein the first electrode includes a transparent conductive oxide. (13) The display device according to (12), wherein the transparent conductive oxide comprises at least one selected from the group consisting of transparent conductive oxides containing indium, transparent conductive oxides containing tin, and transparent conductive oxides containing zinc. (14) The display device according to any one of (1) to (13), wherein the first electrode is a transparent electrode. (15) the first electrode comprises a transparent conductive oxide; The display device according to any one of (1) to (11), wherein the separating portion includes an insulating oxide. (16) the first electrode comprises a first oxide; The display device according to any one of (1) to (11), wherein the separation portion includes a second oxide in which an impurity is added to the first oxide. (17) the first electrode comprises a first oxide; the separator includes a second oxide; The display device according to any one of (1) to (11), wherein the first oxide and the second oxide have different composition ratios. (18) The display device according to any one of (1) to (17), wherein the crystallinity of the first electrode is higher than the crystallinity of the separation portion. (19) an oxide layer including a plurality of first electrodes and a separation portion that electrically separates adjacent first electrodes; a second electrode facing the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; A light emitting device comprising: (20) An electronic device comprising the display device according to any one of (1) to (19). [Explanation of symbols]

[0097] 10, 20, 30 Display device (light-emitting device) 10A light emitting element 11A drive board 11B Opposing substrate 12A First insulating layer 12A Second insulating layer 13 Reflective layer 13A First Metal Layer 13B Second Metal Layer 13C Insulation 13D groove 14, 24, 34 oxide layer 14A, 34A First electrode 14B, 24B, 34B separation section 24B1 Recess 24B2 Covering part 15 Organic layer 16 Second electrode 17 Protective layer 18 Color Filters 19 Filled resin layer 100R, 100G, 100B subpixels 110A display area 110B Surrounding area 111 Signal line driver circuit 111A signal line 112 Scanning line driving circuit 112A scan line 310 Digital still cameras (electronic devices) 320 Head-mounted display (electronic device) 330 Television equipment (electronic equipment)

Claims

1. An oxide layer having a plurality of first electrodes including a first oxide and a separation portion including a second oxide obtained by adding an impurity to the first oxide; a second electrode facing one surface of the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with The separator is provided between the first electrodes adjacent to each other in an in-plane direction, and electrically separates the first electrodes adjacent to each other in the in-plane direction.

2. An oxide layer having a plurality of first electrodes including a first oxide and a separation portion including a second oxide having a composition ratio different from that of the first oxide; a second electrode facing one surface of the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with The separator is provided between the first electrodes adjacent to each other in an in-plane direction, and electrically separates the first electrodes adjacent to each other in the in-plane direction.

3. an oxide layer having a plurality of first electrodes and separators; a second electrode facing one surface of the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with the crystallinity of the first electrode is higher than the crystallinity of the separation portion; The separator is provided between the first electrodes adjacent to each other in an in-plane direction, and electrically separates the first electrodes adjacent to each other in the in-plane direction.

4. a plurality of reflective layers facing the other surface of the oxide layer; The display device according to claim 1 , wherein the plurality of reflective layers face the plurality of first electrodes, respectively.

5. The display device according to claim 4 , wherein the plurality of reflective layers are adjacent to the plurality of first electrodes, respectively.

6. the reflective layer has a main surface facing the organic light-emitting layer with the first electrode interposed therebetween; the separation portion has a recessed portion that is recessed relative to the main surface, The display device according to claim 4 , wherein a groove is provided between adjacent ones of the reflective layers, and the recess is provided in the groove.

7. The display device according to claim 6 , wherein the separator further includes a covering portion that covers a peripheral edge of the main surface.

8. The display device according to claim 6 , wherein the groove has a depth equal to or greater than the thickness of the reflective layer.

9. The display device according to claim 6 , further comprising an insulating portion provided in the recess.

10. The display device according to claim 4 , further comprising an insulating layer provided between the oxide layer and the plurality of reflective layers.

11. The display device according to claim 1 , wherein the separation portion has a higher electrical resistance than the first electrode.

12. The display device according to claim 1 , wherein the separating portion is an insulating portion.

13. 3. The display device according to claim 1, wherein the first oxide is a transparent conductive oxide.

14. 14. The display device according to claim 13, wherein the transparent conductive oxide comprises at least one selected from the group consisting of transparent conductive oxides containing indium, transparent conductive oxides containing tin, and transparent conductive oxides containing zinc.

15. The display device according to claim 1 , wherein the first electrode is a transparent electrode.

16. the first oxide is a transparent conductive oxide, 3. The display device according to claim 1, wherein the second oxide is an insulating oxide.

17. An oxide layer having a plurality of first electrodes including a first oxide and a separation portion including a second oxide obtained by adding an impurity to the first oxide; a second electrode facing the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with The light-emitting device includes a light-emitting element, wherein the separator is provided between the first electrodes adjacent to each other in an in-plane direction, and electrically separates the first electrodes adjacent to each other in the in-plane direction.

18. An oxide layer having a plurality of first electrodes including a first oxide and a separation portion including a second oxide having a composition ratio different from that of the first oxide; a second electrode facing the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with The light-emitting device includes a light-emitting element, wherein the separator is provided between the first electrodes adjacent to each other in an in-plane direction, and electrically separates the first electrodes adjacent to each other in the in-plane direction.

19. an oxide layer having a plurality of first electrodes and separators; a second electrode facing the oxide layer; an organic light-emitting layer provided between the oxide layer and the second electrode; Equipped with the crystallinity of the first electrode is higher than the crystallinity of the separation portion; The light-emitting device includes a light-emitting element, wherein the separator is provided between the first electrodes adjacent to each other in an in-plane direction, and electrically separates the first electrodes adjacent to each other in the in-plane direction.

20. An electronic device comprising the display device according to claim 1 .

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