Method for forming a multiphase thermal interface member, multiphase thermal interface member, and chip testing apparatus for multiphase thermal interface member

Abstract

To provide a method for forming a polyphase thermal interface member, for ensuring more complete heat conduction at a contact surface between a temperature control device and a temperature control object device and effectively improving heat transfer efficiency and to provide a polyphase thermal interface member, and a chip testing device for a polyphase thermal interface member.SOLUTION: A step of adding the thermal interface fluid material includes adding a thermal interface fluid material either between a temperature control device and a first heat conduction surface on a thermal interface solid component or between a second heat conduction surface and a temperature control object device to fill at least one storage space.SELECTED DRAWING: Figure 1B

Description

[Technical Field]

[0001] The present invention relates to a method for forming a multi-phase thermal interface member, a multi-phase thermal interface member, and a chip testing device for the multi-phase thermal interface member, and more particularly to a method for forming a multi-phase thermal interface member used in the field of chip heat dissipation or other temperature control fields, a multi-phase thermal interface member, and a chip testing device for the multi-phase thermal interface member. [Background technology]

[0002] Thermal interface materials (TIMs) are placed between temperature controlling devices and temperature controlled devices to reduce the thermal contact resistance between them. The main reason for placing thermal interface materials is that all solid surfaces have roughness and, in the case of thin objects (such as chips), warpage occurs.

[0003] For this reason, when the temperature control device and the temperature controlled device are brought into contact on their surfaces, it is not possible to achieve complete adhesion, and it is inevitable that some voids will be mixed in, resulting in very low thermal conductivity in areas where these voids exist. Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the field of chip testing, if a gap is formed between the chip and the temperature control device, the chip will become too hot, which will affect the test results and even cause the chip to burn out.

[0005] Therefore, in the chip testing industry, it is common to use a thermal interface material between the temperature controlling device and the temperature controlled device to fill the gap, thereby reducing the thermal contact resistance and improving the temperature control performance.

[0006] Furthermore, thermal interface materials currently commonly used in the industry are in the form of solids, such as indium alloy sheets, which exhibit excellent thermal conductivity and ductility, and have protrusions or elongated grooves formed on the surface in the shape of diamonds or the like.

[0007] Therefore, when the indium alloy sheet is compressed by a force, the indium alloy sheet is elastically deformed to fill the gap between the temperature controlling device and the temperature controlled device.

[0008] On the other hand, in order to more effectively absorb large voids caused by various surface roughness or warpage of the part, it is necessary to design the elongated grooves formed on a particular surface of the indium alloy sheet to have a larger height difference.

[0009] The objective is to increase the amount of compression so that the indium alloy sheet makes sufficient contact with the surface of the temperature controlling or temperature controlled device.

[0010] However, the greater the difference between the high and low points of the elongated grooves formed on a particular surface, the more likely it is that more or larger voids will be formed.

[0011] Furthermore, as a liquid thermal interface material in the prior art, for example, there is a method for applying a fluid thermal interface material (continuous application of a fluid thermal interface material) as disclosed in US2017027084A1. "FLUIDIC THERMAL INTERFACE MATERIAL DISPENSING" is one example.

[0012] This patent publication describes the use of a dispenser to apply a fluid thermal interface material to the contact surface between the thermal head and the chip.

[0013] However, this method makes it difficult to ensure that all voids between the temperature controlling device and the temperature controlled device are filled with the liquid thermal interface material.

[0014] In particular, when the temperature-controlled device is deformed and a locally convex warp is formed, the liquid thermal interface material is less likely to remain between the temperature control device and the temperature-controlled device.

[0015] Furthermore, regardless of the formulation of the liquid thermal interface material, although its thermal conductivity is lower than that of solid thermal interface materials such as indium alloy sheets, a certain degree of thermal conductivity can be ensured even in liquid form, making it useful for temperature control if the liquid can be applied without gaps to all voids caused by warping. However, in the U.S. Patent Publication US2017027084A1 "Continuous Application of Fluid Thermal Interface Material," which also uses a liquid, it is difficult to reliably fill all voids with the liquid thermal interface material, and some voids inevitably remain.

[0016] Furthermore, if a liquid thermal interface material leaks, it can easily contaminate electronic devices or cause short circuits.

[0017] The main objective of the present invention is to provide a multi-phase thermal interface member, a method for forming a multi-phase thermal interface member, and a chip testing device for a multi-phase thermal interface member, thereby ensuring more complete thermal conduction at the contact surface between a temperature control device and a temperature controlled device, and effectively improving the thermal conduction efficiency. [Means for solving the problem]

[0018] In view of the above problems, the present invention has the following configuration: That is, one aspect of the present invention is a method for forming a multi-phase thermal interface member, including the steps of providing a thermal interface solid component and adding a thermal interface fluid material, wherein the step of providing the thermal interface solid component includes providing a first thermal interface solid component having a first thermal conduction surface and a second thermal interface fluid material. 、 Second heat transfer surface and at least one through hole and the at least one through-hole penetrates through the first heat transfer surface and the second heat transfer surface;a thermal interface solid part between the temperature control device and the first thermal conduction surface, and a thermal interface fluid material between the second thermal conduction surface and the temperature controlled device; a thermal interface fluid material between the temperature control device and the first thermal conduction surface on the thermal interface solid part, and a thermal interface fluid material between the second thermal conduction surface and the temperature controlled device on the thermal interface solid part to fill at least one of the accommodating spaces; and a thermal interface fluid material that is liquid, gas, or colloidal in a room temperature environment, or a mixture of any two or three of these.

[0019] In the above aspect, when the second thermal conduction surface of the thermal interface solid part comes into contact with the temperature-controlled device, the thermal interface fluid material may be filled into at least one of the accommodating spaces of the second thermal conduction surface.

[0020] In addition, in the above aspect, the temperature control device may have a fluid supply module, which is used to apply the thermal interface fluid material to the first thermal conduction surface, and the thermal interface fluid material may be filled into at least one of the containing spaces of the first thermal conduction surface.

[0021] Another aspect of the present invention is a multi-phase thermal interface member comprising a thermal interface solid component and a thermal interface fluid material, the thermal interface solid component having a first thermal conduction surface. 、 Second heat transfer surface and at least one through hole and the at least one through-hole penetrates through the first heat transfer surface and the second heat transfer surface;At least one of the first heat conduction surface and the second heat conduction surface has at least one accommodating space, the thermal interface fluid material is filled in at least one of the accommodating spaces of at least one of the first heat conduction surface and the second heat conduction surface, the thermal interface solid part is solid in a room temperature environment, and the thermal interface fluid material is liquid, gas, or colloid in a room temperature environment, or a mixture of any two or three of these, is a multi-phase thermal interface member.

[0022] In the above aspect, the thermal interface solid part may further have an outer peripheral frame, and the outer peripheral frame may extend integrally from the first thermal conduction surface in a direction opposite to the second thermal conduction surface, or may extend integrally from the second thermal conduction surface in a direction opposite to the first thermal conduction surface, or may extend integrally from the first thermal conduction surface in a direction opposite to the second thermal conduction surface and also extend integrally from the second thermal conduction surface in a direction opposite to the first thermal conduction surface.

[0023] In the above aspect, the thermal interface solid part may further have a through-hole, which passes through the first thermal conduction surface and the second thermal conduction surface.

[0024] Another aspect of the present invention is a multiphase thermal interface member chip testing device comprising a temperature control device, a multiphase thermal interface member, and a socket, wherein the multiphase thermal interface member comprises a thermal interface solid component and a thermal interface fluid material, the thermal interface solid component having a first thermal conduction surface. 、 Second heat transfer surface and at least one through hole and the at least one through-hole penetrates through the first heat transfer surface and the second heat transfer surface;a thermal interface solid component for connecting the first thermal interface surface to the second thermal interface surface; a thermal interface fluid material filled in the at least one accommodating space of the first thermal interface surface and the second thermal interface surface; a socket for accommodating a chip to be tested; a first thermal interface surface of the thermal interface solid component for contacting the temperature control device; and a second thermal interface surface of the thermal interface solid component for contacting the chip to be tested on the socket.

[0025] In the above aspect, the device may further include a fluid application device, which applies the thermal interface fluid material to at least one of the chip under test, the thermal interface solid component, and the temperature control device.

[0026] In the above aspect, the temperature control device may have a fluid channel and a fluid supply module, one end of the fluid channel being connected to the fluid supply module and the other end being connected to the multi-phase thermal interface member, and the fluid supply module being used to supply the thermal interface fluid material, which may be applied to the thermal interface solid component via the fluid channel.

[0027] In the above-mentioned aspect, the thermal interface solid part may further have an outer peripheral frame, the outer peripheral frame extending integrally in a direction away from the first thermal conduction surface, the multi-phase thermal interface member may be connected to the temperature control device via the outer peripheral frame, and the thermal interface fluid material may be filled in the containing space of at least one of the first thermal conduction surfaces.

[0028] Based on the above, the present invention provides a multiphase thermal interface member that combines a thermal interface material (TIM) in a solid state and a fluid state, where the fluid state thermal interface material can be a liquid, a gas, or a colloid, or a mixture of any two or three of these. [Effects of the Invention]

[0029] Due to the properties of fluids, which can freely change shape, flow and split, the thermal interface fluid material can completely fill the gaps at the contact interface between the thermal interface solid part and the temperature control device or the temperature controlled device, thereby realizing temperature control over the entire surface of the contact interface and effectively improving the heat transfer efficiency.

[0030] In other words, the multi-phase thermal interface member chip testing device provided by the present invention uses the above-mentioned material for conducting heat between the temperature control device and the chip under test (temperature-controlled device) in the multi-phase thermal interface member, and the thermal interface fluid material in the multi-phase thermal interface member is used to fill the voids in the thermal interface solid part itself, the voids between the thermal interface solid part and the temperature control device, or the voids between the thermal interface solid part and the surface of the chip under test, thereby completely eliminating the problem of poor local temperature control caused by voids and achieving temperature control over the entire thermal contact surface, greatly improving the temperature control effect and efficiency.

[0031] In addition, the method for forming a multi-phase thermal interface member provided by the present invention mainly involves adding a thermal interface fluid material to at least one of the thermal interface solid parts, the part between the thermal interface solid part and the temperature controlling device, and the part between the thermal interface solid part and the temperature controlled device. This allows the fluid to flow while deforming arbitrarily, thereby filling the gaps that originally existed at the contact interface between the thermal interface solid part and the temperature controlling device or the temperature controlled device, eliminating the effect of uneven heat conduction, and significantly reducing the contact thermal resistance. [Brief explanation of the drawings]

[0032] [Figure 1A] 1 is a perspective view of a thermal interface solid part of a preferred embodiment of the multi-phase thermal interface member of the present invention. FIG. [Figure 1B] 1 is a cross-sectional view of a preferred embodiment of a multiphase thermal interface member of the present invention. [Figure 1C] 1 is a cross-sectional view of a thermal interface solid part of another preferred embodiment of the multi-phase thermal interface member of the present invention. [Figure 2A] 1 is a cross-sectional view of a first embodiment of a multiphase thermal interface component chip testing device of the present invention when a thermal interface fluid material is added. [Figure 2B] 1 is a cross-sectional view of a first embodiment of a chip testing device for a multiphase thermal interface material according to the present invention, in which the multiphase thermal interface material is brought into contact with a chip to be tested. [Figure 2C] 1 is a cross-sectional view of a first embodiment of the chip testing device for a multiphase thermal interface member of the present invention when testing a test target chip. [Figure 3] FIG. 2 is a cross-sectional view of a second embodiment of a multiphase thermal interface member chip testing apparatus of the present invention. [Figure 4] FIG. 10 is a cross-sectional view of a third embodiment of a multiphase thermal interface member chip testing apparatus of the present invention. [Figure 5A] FIG. 10 is a perspective view of a fourth embodiment of a multiphase thermal interface component chip testing apparatus of the present invention. [Figure 5B] FIG. 10 is a cross-sectional view of a multiphase thermal interface member in a fourth embodiment of a chip testing device for a multiphase thermal interface member of the present invention. [Figure 6] FIG. 10 is a cross-sectional view of a fifth embodiment of a multiphase thermal interface member chip testing apparatus of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0033] The present invention relates to a method for forming a multiphase thermal interface member, a multiphase thermal interface member, and a chip testing device for a multiphase thermal interface member. In the following description, identical components are designated by the same reference numerals. Furthermore, technically related components are designated by common reference numerals, such as those having the same first digit and only a different last digit. Furthermore, the drawings of the present invention are intended for general illustration only and are not necessarily drawn to scale. Furthermore, not all components are shown in the drawings, and components not necessary for understanding the invention are omitted as appropriate.

[0034] Please refer to Figures 1A and 1B simultaneously, where Figure 1A is a perspective view of a thermal interface solid part of a preferred embodiment of the multi-phase thermal interface member of the present invention, and Figure 1B is a cross-sectional view of a preferred embodiment of the multi-phase thermal interface member of the present invention.

[0035] As shown in FIGS. 1A and 1B, the multi-phase thermal interface member T in this embodiment mainly comprises a thermal interface solid part 2 and a thermal interface fluid material 3.

[0036] The thermal interface solid component 2 has a first thermal conduction surface 21 and a second thermal conduction surface 22 formed on the surface opposite to the first thermal conduction surface 21. The thermal interface solid component 2 is formed in a substantially flat plate shape as shown in FIG. 1A.

[0037] 1B, such as a heat sink, a cooler, or a heater. The second heat conduction surface 22 is used to contact a temperature-controlled device Oc, such as a central processing unit (CPU) or a graphics processor (GPU).

[0038] The thermal interface solid part 2 of this embodiment uses an indium alloy sheet, which is a phase-change metal sheet, and has excellent thermal conductivity and elongation, with a thermal conductivity of 50 to 80 W / m K. The thermal interface solid part 2 is solid in a room temperature environment and is not affected by external forces.

[0039] Furthermore, the first heat conduction surface 21 and the second heat conduction surface 22 of the thermal interface solid part 2 each have a plurality of square pyramidal truncated protrusions 25 arranged in a matrix over the entire surface, which are used to increase the amount by which the thermal interface solid part 2 can be compressed, thereby ensuring sufficient contact between the thermal interface solid part 2 and the surface of the temperature control device Mt or the temperature controlled device Oc.

[0040] Meanwhile, the plurality of protrusions 25 on the first heat conduction surface 21 and the second heat conduction surface 22 form a receiving space S on each of these surfaces, and the thermal interface fluid material 3 is received in this receiving space S.

[0041] The thermal interface fluid material 3 is liquid, gas, or colloidal in a room temperature environment, or a mixture of any two or three of these, and has fluidity and can be deformed arbitrarily.

[0042] Therefore, any shape can be filled into the containing space S. The liquid thermal interface fluid material 3 can be water, ethylene glycol solution, deionized water, electronic coolant (3M™ Fluorinert™), nanofluid, or the like.

[0043] Here, the nanofluid is composed of two components: nanoparticles and a base liquid. The nanoparticles may be metals, metal oxides, carbides, carbon nanotubes, graphene, etc. The metal nanoparticles are preferably magnesium.

[0044] The base fluid can be water, ethylene glycol, or oil, with the latter being preferably synthetic thermal oil (Therminol™).

[0045] Additionally, the gaseous thermal interface fluid material 3 may be helium, hydrogen, neon, other gases with better thermal conductivity than air, or evaporated gas from the liquid thermal interface fluid material 3 .

[0046] The colloidal thermal interface fluid material 3 can be a common thermally conductive adhesive or a thermally conductive paste.

[0047] In this embodiment, the thermal interface fluid material 3 is provided on both the first heat conduction surface 21 and the second heat conduction surface 22 of the thermal interface solid component 2 .

[0048] However, in other embodiments, the thermal interface fluid material 3 may be provided only on either the first heat transfer surface 21 or the second heat transfer surface 22 .

[0049] Furthermore, the thermal interface solid part 2 itself can be made of a porous material, such as a carbon nanotube sheet or a graphite sheet, and the thermal interface fluid material 3 can completely fill all the voids in the thermal interface solid part 2 .

[0050] Next, referring to Figure 1C, a cross-sectional view of another preferred embodiment of the thermal interface solid part of the multi-phase thermal interface member of the present invention is shown. The thermal interface solid part 2 of this embodiment has a plurality of through holes 24 penetrating the first thermal conduction surface 21 and the second thermal conduction surface 22.

[0051] Specifically, a thermal interface solid part 2 having an overall plate shape is formed by arranging hexagonal members in cross section that protrude toward the first heat conduction surface 21 and hexagonal members in cross section that protrude toward the second heat conduction surface 22 in a staggered pattern.

[0052] Then, a plurality of through holes 24 are formed by alternately forming through holes 24 slanted upward to the right and through holes 24 slanted downward to the right so as to connect the joint between the upper hexagonal member and the lower hexagonal member to the first heat conduction surface 21 and the second heat conduction surface 22 in the shortest distance.

[0053] In this way, the through hole 24 is formed so as to connect the first heat conduction surface 21 and the second heat conduction surface 22 over the shortest distance, which has the excellent effect of facilitating the movement of fluid between the first heat conduction surface 21 and the second heat conduction surface 22.

[0054] Therefore, by adding the thermal interface fluid material 3 to one side of the thermal interface solid part 2, the thermal interface fluid material 3 can flow between the first thermal conduction surface 21 and the second thermal conduction surface 22 through the through holes 24.

[0055] This allows the accommodation spaces S of the first heat conduction surface 21 and the second heat conduction surface 22 to be equally filled with the thermal interface fluid material 3, thereby achieving the purpose of eliminating voids on all contact surfaces of the thermal interface solid component 2.

[0056] 2A and 2B, Fig. 2A is a cross-sectional view of the first embodiment of the chip testing device for a multiphase thermal interface material of the present invention when a thermal interface fluid material is added, and Fig. 2B is a cross-sectional view of the first embodiment of the chip testing device for a multiphase thermal interface material of the present invention when the multiphase thermal interface material is brought into contact with a chip to be tested.

[0057] The chip testing device for the multiphase thermal interface member provided in this embodiment mainly includes a temperature control device Mt, a multiphase thermal interface member T, a socket Sc, and a fluid application device 4.

[0058] The temperature control device Mt may generally be a pressure head equipped with a heater, cooler, or heat sink, and the multi-phase thermal interface member T is implemented as described above.

[0059] The first heat conduction surface 21 is connected to the bottom surface of the temperature control device Mt, and the socket Sc, which is formed in a generally concave shape in cross section, is used to accommodate the test target chip C (temperature-controlled device Oc).

[0060] In addition, the fluid application device 4 in this embodiment is a spray device. Before testing, when the test target chip C is placed on the socket Sc, the fluid application device 4 moves above the test target chip C and starts applying the thermal interface fluid material 3.

[0061] Then, when the amount of application reaches a predetermined amount, the fluid application device 4 is moved from above the chip C to be tested.

[0062] Then, the temperature control device Mt moves downward, so that the second thermal conduction surface 22 of the multi-phase thermal interface member T comes into contact with the test target chip C to be tested on the socket Sc, and the thermal interface fluid material 3 is filled into the accommodating space S on the second thermal conduction surface 22, as shown in FIG. 2B.

[0063] The following description will be made with reference to Figure 2C, which is a cross-sectional view of the first embodiment of the chip testing device for multiphase thermal interface members of the present invention when testing a test target chip.

[0064] As shown in the figure, the temperature control device Mt applies a downward force to the multiphase thermal interface material T and the test chip C to ensure complete contact between the temperature control device Mt, the multiphase thermal interface material T, and the test chip C. At this time, the multi-phase thermal interface material T is deformed when compressed.

[0065] In addition, in FIGS. 2A to 2C, the test target chip C is depicted as being clearly warped in order to emphasize the effect of the present invention.

[0066] Therefore, at this warp W, there are still apparent voids G between the multi-phase thermal interface material T and the top surface of the chip under test C, but these voids G are filled with the thermal interface fluid material 3. This allows the present invention to actually fill all voids, thereby improving the effectiveness of heat conduction.

[0067] Furthermore, according to the configuration of the above embodiment, water and electronic coolant (3M™ Fluorinert™ Electronic Fluorine Liquid FC-3283) are used as the thermal interface fluid material 3, and the following simulation data can prove that the present invention actually has very clear effects.

[0068] The thermal interface solid part 2 is made of an indium alloy sheet with a thermal conductivity of 67 W / (m·K). The thermal conductivity of water is 0.613 W / (m·K), and the thermal conductivity of electronic coolant is 0.066 W / (m·K).

[0069] The results of computer simulation analysis show that when the warpage of test chip C is 0.01 mm, when a conventional solid thermal interface material (TIM) is simply used, there is an obvious gap between the conventional solid thermal interface material and test chip C. The temperature of test chip C is 119.76°C.

[0070] However, when the structure of the above embodiment is used and the electronic coolant is used as the thermal interface fluid material 3, the temperature of the chip under test C is 98.9°C.

[0071] Similarly, when the structure of the above embodiment uses water as the thermal interface fluid material 3, the chip under test C drops to 73.76°C.

[0072] From this, it can be seen that when the present invention is used for cooling purposes, the heat dissipation efficiency is clearly greatly improved, and the temperature of the temperature-controlled device Oc (test target chip C) can be significantly reduced, resulting in excellent effects.

[0073] Next, a description will be given with reference to Fig. 3. Here, Fig. 3 is a cross-sectional view of a second embodiment of the chip testing device for multiphase thermal interface components of the present invention.

[0074] In this embodiment, the thermal interface fluid material 3 is supplied to the thermal interface solid component 2 mainly via the fluid channel Mc.

[0075] 3, the temperature control device Mt of this embodiment includes a fluid channel Mc and a fluid supply module Mf. One end of the fluid channel Mc is connected to the fluid supply module Mf, and the other end is connected to the lower end surface of the temperature control device Mt, which is the bonding surface between the temperature control device Mt and the multi-phase thermal interface member T.

[0076] As described above, one end of the fluid channel Mc is connected to the fluid supply module Mf, but it extends horizontally from one end, then changes direction downward in a V-shape, and extends further. Therefore, the other end of the fluid channel Mc is close to the thermal interface solid part 2, which has the excellent effect of preventing the thermal interface fluid material 3 from splashing around when it is supplied.

[0077] The fluid supply module Mf is used to supply the thermal interface fluid material 3, which is supplied to the first heat transfer surface 21 of the thermal interface solid part 2 via the fluid channel Mc.

[0078] Furthermore, the socket Sc in this embodiment may have a fluid delivery channel Mcs, one end of which is connected to the fluid supply module Mf and the other end of which is connected to the second thermal conduction surface 22 of the thermal interface solid part 2, i.e., the bonding surface between the second thermal conduction surface 22 and the test target chip C.

[0079] That is, the shape of the fluid delivery channel Mcs is such that one end is connected to the fluid supply module Mf, but it extends downward to pass through the inside of the socket Sc where the thermal interface solid part 2 is located, and then it is turned horizontally, and the other end is connected to the joint surface between the second thermal conduction surface 22 and the test target chip C as described above.

[0080] Therefore, the thermal interface fluid material 3 is always maintained on the first heat conduction surface 21 and the second heat conduction surface 22, and even if the thermal interface fluid material 3 evaporates or overflows due to heat, the fluid supply module Mf can replenish the thermal interface fluid material 3 in real time.

[0081] However, the thermal interface fluid material 3 in this embodiment is not limited to being supplied to both sides, and may be supplied to only one side by providing a single fluid channel Mc or fluid delivery channel Mcs depending on the actual situation.

[0082] Meanwhile, the fluid channel Mc and the fluid delivery channel Mcs are not limited to hollow pipes, but can also be formed of capillary material, i.e., the thermal interface fluid material 3 is supplied by capillary action and applied to the first thermal conduction surface 21 and the second thermal conduction surface 22 of the thermal interface solid part 2.

[0083] Next, a description will be given with reference to Fig. 4. Here, Fig. 4 is a cross-sectional view of a third embodiment of a chip testing device for a multiphase thermal interface member of the present invention.

[0084] The main difference between this embodiment and the second embodiment described above is that in this embodiment, the temperature control device Mt is provided with a tubular fluid inlet channel Mc1 and a tubular fluid outlet channel Mc2 that both extend in the vertical direction.

[0085] Here, the fluid inlet channel Mc1 is used to supply the thermal interface fluid material 3 to the thermal interface solid part 2, and the fluid outlet channel Mc2 is used to exhaust the thermal interface fluid material 3 from the thermal interface solid part 2.

[0086] Therefore, this embodiment adopts this structure, which allows timely replacement of the thermal interface fluid material 3. For example, when the thermal interface solid part 2 is overheated, the thermal interface fluid material 3 can be circulated to cool or heat the thermal interface solid part 2 as needed, thereby achieving an excellent heat conduction effect.

[0087] Next, a description will be given with reference to Figures 5A and 5B, where Figure 5A is a perspective view of a fourth embodiment of the chip testing device for a multiphase thermal interface member of the present invention, and Figure 5B is a cross-sectional view of the multiphase thermal interface member in the fourth embodiment of the chip testing device for a multiphase thermal interface member of the present invention.

[0088] In this embodiment, the thermal interface solid part 2 further includes an outer peripheral frame 23 whose four sides extend integrally from the first heat conduction surface 21 in the direction opposite to the second heat conduction surface 22 .

[0089] In other words, the peripheral frame 23 protrudes upward along the outer periphery of the thermal interface solid part 2. In this way, the thermal interface solid part 2 forms a frame cover, and a containing space S is formed inside it. This allows the thermal interface fluid material 3 to be contained therein, thereby forming a multi-phase thermal interface member T.

[0090] In this embodiment, only the embodiment in which the first heat conduction surface 21 extends integrally in the direction opposite to the second heat conduction surface 22 has been described, but the following embodiments may also be used.

[0091] That is, it is also acceptable to employ an embodiment in which the second heat conduction surface 22 extends integrally in the opposite direction to the first heat conduction surface 21, or in which the first heat conduction surface 21 extends integrally in the opposite direction to the second heat conduction surface 22 and also extends integrally from the second heat conduction surface 22 in the opposite direction to the first heat conduction surface 21.

[0092] Furthermore, the thermal interface solid part 2 formed in a frame cover type is directly attached to the underside of the temperature control device Mt and is in close contact with the temperature control device Mt via the outer frame 23, preventing the multi-phase thermal interface member T from falling off.

[0093] In this way, the multi-phase thermal interface member T provided in this embodiment is fixed in a very simple and reliable manner, does not easily come loose, and the thermal interface fluid material 3 is unlikely to spill out to the surroundings.

[0094] Next, an embodiment of the present invention will be described with reference to Fig. 6. Here, Fig. 6 is a cross-sectional view of a fifth embodiment of a chip testing device for a multiphase thermal interface member of the present invention. The main difference between this embodiment and the above-described embodiments is the arrangement of the temperature control device Mt.

[0095] Furthermore, in order to apply the device of the present invention to test target chips C (temperature-controlled devices Oc) with different specifications or sizes, an adapter plate 5 is disposed on the underside of the temperature control device Mt in this embodiment.

[0096] The dimensions of the two end faces of the adapter plate 5 respectively fit the lower surface of the temperature control device Mt and the upper surface of the chip under test C. Therefore, they can be used as a conversion of the contact area (heat conduction area).

[0097] Furthermore, thermal interface solid parts 2 are arranged on both end surfaces (upper and lower surfaces in FIG. 6) of the adapter plate 5. The first heat conduction surface 21 and the second heat conduction surface 22 (reference numerals are omitted in FIG. 6) of each thermal interface solid part 2 are also filled with the thermal interface fluid material 3.

[0098] Furthermore, the temperature control device Mt in this embodiment is configured using an evaporator (not shown) and a heating rod (not shown), and can achieve both heating and cooling temperature control effects.

[0099] The above-described embodiment is merely an example for ease of explanation, and the technical scope of the present invention is defined by the claims and is not limited to the above-described embodiment. [Explanation of symbols]

[0100] 2. Thermal interface solid parts 3 Thermal interface fluid materials 4 Fluid application device 5 Adapter Plate 21 First heat transfer surface 22 Second heat transfer surface 23 Periphery frame 24 through holes 25 Protrusion C. Chip under test G void Mt Temperature Control Device Mc Fluid Channel Mc1 fluid entry channel Mc2 fluid outlet channel Mf Fluid Supply Module Mcs fluid delivery channel Oc Temperature controlled device S Storage Space T Multiphase thermal interface member W Warped part Sc socket

Claims

1. 1. A method of forming a multi-phase thermal interface member, comprising providing a thermal interface solid component and applying a thermal interface fluid material, the method comprising: The step of providing a thermal interface solid component includes: the thermal interface solid component having a first thermal conduction surface, a second thermal conduction surface, and at least one through hole; the at least one through-hole penetrates the first heat transfer surface and the second heat transfer surface; At least one of the first heat conduction surface and the second heat conduction surface has at least one accommodation space; the first heat transfer surface is adapted to be in contact with a temperature controlling device, and the second heat transfer surface is adapted to be in contact with a temperature controlled device; The step of adding the thermal interface fluid material includes adding the thermal interface fluid material between the temperature controlling device and the first heat transfer surface on the thermal interface solid part and between the second heat transfer surface and the temperature controlled device to fill at least one of the accommodating spaces; A method for forming a multi-phase thermal interface member, characterized in that the thermal interface fluid material is liquid, gaseous, or colloidal in a room temperature environment, or is a mixture of any two or three of these.

2. When the second heat transfer surface of the thermal interface solid part comes into contact with the temperature-controlled device, 10. The method of claim 1, wherein the thermal interface fluid material is filled into the receiving space of at least one of the second thermal conduction surfaces.

3. the temperature control device includes a fluid supply module; 2. The method of claim 1, wherein the fluid supply module is used to apply the thermal interface fluid material to the first thermal transfer surface, and the thermal interface fluid material fills the containing space of at least one of the first thermal transfer surfaces.

4. A multi-phase thermal interface member comprising a thermal interface solid component and a thermal interface fluid material, the thermal interface solid component has a first thermal conduction surface, a second thermal conduction surface, and at least one through hole; the at least one through-hole penetrates the first heat transfer surface and the second heat transfer surface; At least one of the first heat conduction surface and the second heat conduction surface has at least one accommodation space; the thermal interface fluid material is filled in at least one of the accommodating spaces on the first thermal conduction surface and the second thermal conduction surface; The thermal interface solid component is solid in a room temperature environment, and the thermal interface fluid material is liquid, gas, or colloid in a room temperature environment, or a mixture of any two or three of these.

5. The thermal interface solid part further comprises a peripheral frame; 5. The multi-phase thermal interface member of claim 4, wherein the peripheral frame extends integrally from the first thermal conduction surface in a direction opposite to the second thermal conduction surface, or from the second thermal conduction surface in a direction opposite to the first thermal conduction surface, or from the first thermal conduction surface in a direction opposite to the second thermal conduction surface and also from the second thermal conduction surface in a direction opposite to the first thermal conduction surface.

6. A multi-phase thermal interface material chip testing device comprising a temperature control device, a multi-phase thermal interface material, and a socket, the multi-phase thermal interface member comprises a thermal interface solid component and a thermal interface fluid material; the thermal interface solid component has a first thermal conduction surface, a second thermal conduction surface, and at least one through hole; the at least one through-hole penetrates the first heat transfer surface and the second heat transfer surface; At least one of the first heat conduction surface and the second heat conduction surface has at least one accommodation space; the thermal interface fluid material is filled in at least one of the receiving spaces on at least one of the first thermal conduction surface and the second thermal conduction surface; the socket is used to accommodate a chip under test; the first thermal conduction surface of the thermal interface solid part is adapted to contact the temperature control device; 10. A multi-phase thermal interface member chip testing device, comprising: a second thermal conduction surface of the thermal interface solid component that is used to contact the test target chip on the socket.

7. Further comprising a fluid application device, 7. The multi-phase thermal interface member chip testing device of claim 6, wherein the fluid application device applies the thermal interface fluid material to at least one of the chip under test, the thermal interface solid component, and the temperature control device.

8. the temperature control device includes a fluid channel and a fluid supply module; one end of the fluid channel communicates with the fluid supply module and the other end communicates with the multi-phase thermal interface member; 7. The multi-phase thermal interface component chip testing device of claim 6, wherein the fluid supply module is used to supply the thermal interface fluid material, which is applied to the thermal interface solid component through the fluid channel.

9. The thermal interface solid part further comprises a peripheral frame; the peripheral frame extends integrally in a direction opposite to the first heat transfer surface; 7. The chip testing device for a multi-phase thermal interface member according to claim 6, wherein the multi-phase thermal interface member is connected to the temperature control device via the peripheral frame, and the thermal interface fluid material is filled in the accommodating space of at least one of the first thermal conduction surfaces.

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