Tape laminate, microchannel chip, and microfluidic device

Abstract

A tape laminate is provided which, when used to seal a flow path, enables suppressing gas leakage and contamination while not being prone to peeling due to gas generation.　This tape laminate 1 is provided with: a first substrate 2; a first adhesive layer 3 which is provided on a primary surface 2a of the first substrate 2 and which contains a gas generating agent which generates gas with the application of light or heat; and a second adhesive layer 4 which is provided directly or indirectly on a primary surface 3a of the first adhesive layer 3 and which has through-holes 6.

Description

[Technical Field]

[0001] The present invention relates to a tape laminate containing a gas generating agent that generates gas when exposed to light or heat, and to a microchannel chip and a microfluidic device that use the tape laminate. [Background technology]

[0002] Conventionally, various tests and analyses have been attempted by controlling the delivery and reaction of various specimens or samples using a microchannel chip provided with a microchannel through which a liquid is delivered. As a method for delivering a liquid through a microchannel, for example, a method of delivering a liquid using gas generated by a gas generating material is known.

[0003] Patent Document 1 listed below discloses a micropump including a gas-generating material and a substrate having a microchannel formed therein for transporting a fluid. In Patent Document 1, a film-like gas-generating material is attached to the substrate. The document describes that when an external stimulus such as light or heat is applied to the gas-generating material, the generated gas is supplied to the microchannel, thereby transporting the fluid. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-108231 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when attempting to seal a flow path with a film-like gas generating material as in Patent Document 1, the surrounding sealing portion of the flow path may peel off when gas is generated, which can lead to problems such as gas leakage and external contamination.

[0006] An object of the present invention is to provide a tape laminate that, when used to seal a channel, is less likely to peel due to gas generation and can suppress gas leakage and contamination, as well as a microchannel chip and a microfluidic device that use the tape laminate. [Means for solving the problem]

[0007] The tape laminate of the present invention is characterized by comprising a first base material, a first pressure-sensitive adhesive layer provided on a main surface of the first base material and containing a gas generating agent that generates gas when exposed to light or heat, and a second pressure-sensitive adhesive layer provided directly or indirectly on the main surface of the first pressure-sensitive adhesive layer and having through holes.

[0008] In a specific aspect of the tape laminate according to the present invention, the second pressure-sensitive adhesive layer has opposing first and second main surfaces, and the through hole is arranged so as to extend from the first main surface to the second main surface.

[0009] In another specific aspect of the tape laminate according to the present invention, the second pressure-sensitive adhesive layer is laminated directly on a main surface of the first pressure-sensitive adhesive layer.

[0010] In yet another specific aspect of the tape laminate according to the present invention, the tape laminate further comprises a third pressure-sensitive adhesive layer provided on a main surface of the first pressure-sensitive adhesive layer, and a second substrate provided on the main surface of the third pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer being provided on the main surface of the second substrate, and the through hole being arranged so as to penetrate also through the third pressure-sensitive adhesive layer and the second substrate.

[0011] In yet another specific aspect of the tape laminate according to the present invention, the gas generating agent is a photoresponsive gas generating agent.

[0012] A microchannel chip according to the present invention comprises a substrate provided with a microchannel having a gas inlet, and the tape laminate of the present invention attached to the gas inlet of the substrate, and is characterized in that the through-hole of the tape laminate and the gas inlet of the substrate are arranged to overlap each other in a planar view.

[0013] The microfluidic device according to the present invention is characterized by comprising a microchannel chip configured according to the present invention and an irradiation unit that irradiates light or heat to a portion of the first adhesive layer that overlaps with the through-hole of the second adhesive layer in a planar view. [Effects of the Invention]

[0014] According to the present invention, it is possible to provide a tape laminate that, when used to seal a channel, is less likely to peel due to gas generation and can suppress gas leakage and contamination, as well as a microchannel chip and a microfluidic device that use the tape laminate. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a tape stack according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a schematic plan view showing the second pressure-sensitive adhesive layer of the tape stack according to the first embodiment of the present invention. [Figure 3] FIG. 3 is a schematic cross-sectional view showing a tape stack according to a second embodiment of the present invention. [Figure 4] FIG. 4 is a schematic cross-sectional view showing a tape stack according to a third embodiment of the present invention. [Figure 5] FIG. 5 is a schematic cross-sectional view showing a microchannel chip and a microfluidic device according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] The present invention will be clarified below by describing specific embodiments of the present invention with reference to the drawings.

[0017] [Tape laminate] (First embodiment) FIG. 1 is a schematic cross-sectional view showing a tape stack according to a first embodiment of the present invention.

[0018] 1, the tape laminate 1 includes a base material 2, a first pressure-sensitive adhesive layer 3, and a second pressure-sensitive adhesive layer 4. The first pressure-sensitive adhesive layer 3 is provided on a main surface 2a of the base material 2. The second pressure-sensitive adhesive layer 4 is provided on a main surface 3a of the first pressure-sensitive adhesive layer 3.

[0019] The second pressure-sensitive adhesive layer 4 has a first main surface 4a and a second main surface 4b that face each other. The first main surface 4a of the second pressure-sensitive adhesive layer 4 is disposed on the side of the first pressure-sensitive adhesive layer 3. A release film 5 is provided on the second main surface 4b of the second pressure-sensitive adhesive layer 4.

[0020] The first pressure-sensitive adhesive layer 3 contains a gas generating agent that generates gas when exposed to light or heat. The second pressure-sensitive adhesive layer 4 has a plurality of through holes 6. The through holes 6 are provided so as to extend from the first main surface 4a to the second main surface 4b of the second pressure-sensitive adhesive layer 4.

[0021] 2, in this embodiment, the planar shape of the through hole 6 is circular. However, in the present invention, the planar shape of the through hole 6 is not particularly limited, and may be substantially circular or substantially rectangular, including a rectangular shape. When the planar shape of the through hole 6 is substantially circular, the diameter of the through hole 6 may be, for example, 1 mm or more and 10 mm or less.

[0022] The number of through holes 6 in the second pressure-sensitive adhesive layer 4 may be one or more as in the present embodiment. The number of through holes 6 in the second pressure-sensitive adhesive layer 4 can be, for example, 1 or more and 25 or less. In addition, the ratio of the total area of ​​the through holes 6 to the area of ​​the second pressure-sensitive adhesive layer 4 excluding the through holes 6 in a plan view (total area of ​​the through holes 6 / area of ​​the second pressure-sensitive adhesive layer 4 excluding the through holes 6) can be, for example, 0.005 or more and 2 or less.

[0023] The area of ​​the entire through-hole 6 is, for example, 30 mm in plan view. 2 Over 8000mm 2 The area of ​​the second pressure-sensitive adhesive layer 4 excluding the through-holes 6 can be, for example, 100 mm 2 Over 7000mm 2 It can be as follows:

[0024] The area of ​​the tape stack 1 in plan view is, for example, 130 mm 2 More than 15000mm 2 The thickness of the entire tape stack 1 can be set to, for example, 0.01 mm or more and 1 mm or less.

[0025] The tape laminate 1 of this embodiment is used after peeling off the release film 5. The tape laminate 1 can be attached to an adherend from the second main surface 4b side of the second pressure-sensitive adhesive layer 4.

[0026] The tape stack 1 of this embodiment has the above-described configuration, so when used to seal a flow path, peeling due to gas generation is unlikely to occur, and gas leakage and contamination can be suppressed.

[0027] Conventionally, when a flow channel is sealed with a film-like gas generating material, the surrounding sealing portion of the flow channel may peel off when gas is generated, which can lead to problems such as contamination from the outside and gas leakage to the outside.

[0028] Furthermore, in order to prevent peeling of the flow channel sealing portion, it is necessary to design the flow channel to be sealed and the gas generating portion to be separated by a certain distance, which may lead to an increase in the size of the device.

[0029] In contrast, in the tape laminate 1 of this embodiment, the second pressure-sensitive adhesive layer 4 having through holes 6 is laminated on the main surface 3a of the first pressure-sensitive adhesive layer 3 containing a gas generating agent, so that the gas generated from the first pressure-sensitive adhesive layer 3 can be sent to the flow path via the through holes 6. On the other hand, the second main surface 4b of the second pressure-sensitive adhesive layer 4 is bonded to the substrate on which the flow path is provided, so that peeling of the flow path sealing portion can be suppressed.

[0030] In this case, the distance between the first adhesive layer 3 containing the gas generating agent and the flow path can be reduced, which allows the device to be made smaller when used in a microfluidic device or the like.

[0031] Hereinafter, each layer constituting the tape stack 1 and other tape stacks of the present invention will be described in detail.

[0032] base material; The substrate is not particularly limited as long as it supports the pressure-sensitive adhesive layer, and examples thereof include a resin film, a fiber, a nonwoven fabric, etc. Examples of the resin film include a film of polyester, a polyolefin, etc. The resin film is preferably a polyester film. Examples of the polyester include polyethylene terephthalate, polybutylene phthalate, etc., and polyethylene terephthalate is preferred.

[0033] The thickness of the substrate is not particularly limited, and can be, for example, 5 μm or more and 200 μm or less.

[0034] a first adhesive layer; The first adhesive layer includes an adhesive and a gas generating agent.

[0035] The adhesive is not particularly limited, and examples thereof include (meth)acrylic adhesives, rubber adhesives, silicone adhesives, urethane adhesives, and epoxy adhesives. Of these, silicone adhesives or (meth)acrylic adhesives are preferred, and (meth)acrylic adhesives are more preferred. These may be used alone or in combination. Note that meth(acrylic) refers to methacrylic or acrylic.

[0036] The content of the pressure-sensitive adhesive in the first pressure-sensitive adhesive layer is not particularly limited, and is preferably 20% by mass or more, more preferably 40% by mass or more, and preferably 95% by mass or less, more preferably 90% by mass or less. When the content of the pressure-sensitive adhesive in the first pressure-sensitive adhesive layer is within the above range, the adhesion to the second pressure-sensitive adhesive layer can be further improved.

[0037] A gas generating agent is a compound that generates gas when stimulated by light, heat, etc. As the gas generating agent, a photoresponsive gas generating agent or a heat-responsive gas generating agent can be used, and a photoresponsive gas generating agent is preferred.

[0038] The photoresponsive gas generating agent generates gas when irradiated with light. Examples of the photoresponsive gas generating agent include azo compounds and azide compounds.

[0039] Examples of the azo compound include 2,2'-azobis(N-cyclohexyl-2-methylpropionamide), 2,2'-azobis[N-(2-methylpropyl)-2-methylpropionamide], 2,2'-azobis(N-butyl-2-methylpropionamide), 2,2'-azobis[N-(2-methylethyl)-2-methylpropionamide], 2,2'-azobis(N-hexyl-2-methylpropionamide), 2,2'-azobis(N-propyl-2-methylpropionamide), and 2,2'-azobis(N-ethyl-2-methylpropionamide). propionamide), 2,2'-azobis{2-methyl-N-[1,1-bis(hydroxymethyl)-2-hydroxyethyl]propionamide}, 2,2'-azobis{2-methyl-N-[2-(1-hydroxybutyl)]propionamide}, 2,2'-azobis[2-methyl-N-(2-hydroxyethyl)propionamide], 2,2'-azobis[N-(2-propenyl)-2-methylpropionamide], 2,2'-azobis[2-(5-methyl-2-imidazoline-2-yl)propane]dihydrochloride, 2,2'-azobis 2,2'-Azobis[2-(2-imidazolin-2-yl)propane]dihydrochloride, 2,2'-Azobis[2-(2-imidazolin-2-yl)propane]disulfate dihydrate, 2,2'-Azobis[2-(3,4,5,6-tetrahydropyrimidin-2-yl)propane]dihydrochloride, 2,2'-Azobis{2-[1-(2-hydroxyethyl)-2-imidazolin-2-yl]propane}dihydrochloride, 2,2'-Azobis[2-(2-imidazolin-2-yl)propane], 2,2'-Azobis(2 -methylpropionamidine) hydrochloride, 2,2'-azobis(2-aminopropane) dihydrochloride, 2,2'-azobis[N-(2-carboxyacyl)-2-methyl-propionamidine], 2,2'-azobis{2-[N-(2-carboxyethyl)amidine]propane}, 2,2'-azobis(2-methylpropionamidoxime), dimethyl 2,2'-azobis(2-methylpropionate), dimethyl 2,2'-azobisisobutyrate, 4,4'-azobis(4-cyanocarbonic acid), 4,4'-azobis(4-cyanopentanoic acid), etc. These azo compounds may be used alone or in combination.

[0040] Examples of azide compounds include 3-azidomethyl-3-methyloxetane, terephthalazide, and polymers having an azide group. Specific examples of polymers having an azide group include glycidyl azide polymers. Glycidyl azide polymers can be obtained, for example, by ring-opening polymerization of p-tert-butylbenzazide and 3-azidomethyl-3-methyloxetane. These azide compounds may be used alone or in combination.

[0041] The content of the gas generating agent in the first pressure-sensitive adhesive layer is not particularly limited, and is preferably 5% by mass or more, more preferably 10% by mass or more, and preferably 75% by mass or less, more preferably 55% by mass or less. When the content of the gas generating agent is equal to or greater than the above-mentioned lower limit, gas can be generated more efficiently by applying a stimulus such as light or heat. When the content of the gas generating agent is equal to or less than the above-mentioned upper limit, adhesion to the second pressure-sensitive adhesive layer can be further improved.

[0042] The first pressure-sensitive adhesive layer may further contain a photosensitizer, a crosslinking agent, etc. The first pressure-sensitive adhesive layer may also contain other additives, such as a phenol-based, phosphorus-based, amine-based, or sulfur-based antioxidant, a benzotriazole-based or hydroxyphenyltriazine-based ultraviolet absorber, a halogenated flame retardant such as hexabromobiphenyl ether or decabromodiphenyl ether, a flame retardant such as ammonium polyphosphate or trimethyl phosphate, an inorganic filler such as calcium carbonate, talc, mica, clay, aerosil, silica, aluminum hydroxide, magnesium hydroxide, or silica sand, an antistatic agent, a stabilizer, a pigment, a dye, or a binder resin, provided that the effects of the present invention are not impaired.

[0043] The thickness of the first pressure-sensitive adhesive layer is not particularly limited, but is preferably 5 μm or more, more preferably 20 μm or more, and preferably 200 μm or less, more preferably 100 μm or less. When the thickness of the first pressure-sensitive adhesive layer is within the above range, the adhesion to the second pressure-sensitive adhesive layer can be further improved.

[0044] The method for forming the first pressure-sensitive adhesive layer is not particularly limited, and the first pressure-sensitive adhesive layer can be formed by, for example, a solution coating method. In the solution coating method, first, a solution for the first pressure-sensitive adhesive layer is prepared.

[0045] As a method for preparing the adhesive layer solution, for example, first, the above-mentioned adhesive and a gas generating agent are mixed in a solvent, thereby preparing a first adhesive layer solution.

[0046] The method for mixing the components is not particularly limited, and any known method can be used. For example, the components can be mixed by stirring with a magnetic stirrer at 200 rpm for 1 hour.

[0047] Examples of the solvent include cyclohexane, hexane, methylcyclohexane, toluene, heptane, ethyl acetate, n-butyl acetate, isobutyl acetate, isopropyl acetate, methyl acetate, propyl acetate, tetrahydrofuran, acetone, pentane, methyl isobutyl ketone, and methyl ethyl ketone.

[0048] The solid content concentration in the first pressure-sensitive adhesive layer solution is preferably 20% by mass to 80% by mass, and more preferably 30% by mass to 70% by mass.

[0049] Next, the first adhesive layer solution is uniformly applied to the substrate using a coating machine such as a knife coater, comma coater, or reverse coater, and then dried. This removes the solvent, yielding the first adhesive layer. The first adhesive layer may also be formed by transferring a layer formed on a release film onto the substrate.

[0050] a second adhesive layer; The second adhesive layer is made of an adhesive.

[0051] The adhesive is not particularly limited and can be appropriately selected depending on the type of adherend. Specifically, the adhesive may be, for example, a (meth)acrylic adhesive, a rubber adhesive, a silicone adhesive, a urethane adhesive, or an epoxy adhesive. Among them, a silicone adhesive or a (meth)acrylic adhesive is preferred, and a silicone adhesive is more preferred. These may be used alone or in combination.

[0052] The adhesive constituting the second adhesive layer may be the same type as the adhesive constituting the first adhesive layer, or a different type may be used. The adhesive constituting the second adhesive layer can be appropriately selected in consideration of the adhesiveness to the adherend. However, from the viewpoint of further improving the adhesion between the first adhesive layer and the second adhesive layer, it is preferable that the adhesives constituting the first adhesive layer and the second adhesive layer are composed of the same type of adhesive.

[0053] The second pressure-sensitive adhesive layer may contain a gas generating agent, but preferably does not substantially contain a gas generating agent. In this case, when used to seal a flow path, peeling due to gas generation can be made even less likely to occur. Note that "substantially does not contain a gas generating agent" means that the content of the gas generating agent in the second pressure-sensitive adhesive layer is 1% by mass or less. Note that the second pressure-sensitive adhesive layer may contain other additives similar to those in the first pressure-sensitive adhesive layer.

[0054] The thickness of the second pressure-sensitive adhesive layer is not particularly limited, but is preferably 5 μm or more, more preferably 20 μm or more, and preferably 200 μm or less, more preferably 100 μm or less. When the thickness of the second pressure-sensitive adhesive layer is within the above range, peeling due to gas generation can be made even less likely to occur when used to seal a flow path.

[0055] The second pressure-sensitive adhesive layer can be formed, for example, by a solution coating method, similar to the first pressure-sensitive adhesive layer. The method for forming through holes in the second pressure-sensitive adhesive layer is not particularly limited, and can be, for example, by cutting them out using laser processing, punching half-cutting, or the like. In this case, it is desirable to first form the second pressure-sensitive adhesive layer on a release film, and then form the through holes with release films attached to both sides. In this case, after the through holes are formed, the second pressure-sensitive adhesive layer can be transferred to the first pressure-sensitive adhesive layer to obtain a tape laminate.

[0056] Release film; By providing a release film, the pressure-sensitive adhesive layer can be protected until the tape laminate is attached to the adherend. The release film is preferably one that can be easily peeled off. However, the release film does not necessarily have to be provided.

[0057] The release film may be, for example, a film coated with silicone, etc. Specifically, the release film may be polyethylene terephthalate or polypropylene coated with silicone, etc.

[0058] The thickness of the release film is not particularly limited, and can be, for example, 5 μm or more and 100 μm or less.

[0059] (Second and third embodiments) FIG. 3 is a schematic cross-sectional view showing a tape stack according to a second embodiment of the present invention.

[0060] As shown in FIG. 3 , in the tape laminate 21, a third pressure-sensitive adhesive layer 27 and a substrate 28 are provided between the first pressure-sensitive adhesive layer 3 and the second pressure-sensitive adhesive layer 4. Specifically, the third pressure-sensitive adhesive layer 27 is provided on the main surface 3 a of the first pressure-sensitive adhesive layer 3. The substrate 28 is provided on the second main surface 27 b of the third pressure-sensitive adhesive layer 27. The second pressure-sensitive adhesive layer 4 is provided on the main surface 28 a of the substrate 28. In the tape laminate 21, the third pressure-sensitive adhesive layer 27 and the second pressure-sensitive adhesive layer 4 are provided on both sides of the substrate 28, thereby forming a double-sided tape 29. In the first embodiment, the second pressure-sensitive adhesive layer 4 constituted a non-support tape.

[0061] In the tape laminate 21, a through hole 26 is provided so as to extend from the second main surface 4b of the second pressure-sensitive adhesive layer 4 to the first main surface 27a of the third pressure-sensitive adhesive layer 27. Details of the shape and formation method of the through hole 26 are similar to those of the through hole 6 in the first embodiment. The first main surface 27a of the third pressure-sensitive adhesive layer 27 is in contact with the main surface 3a of the first pressure-sensitive adhesive layer 3. The first main surface 27a and second main surface 27b of the third pressure-sensitive adhesive layer 27 face each other.

[0062] The substrate 28 is not particularly limited as long as it can support the pressure-sensitive adhesive layer, and examples thereof include resin films, fibers, nonwoven fabrics, etc. Examples of resin films include films of polyester, polyolefin, etc. The resin film is preferably a polyester film. Examples of polyesters include polyethylene terephthalate, polybutylene phthalate, etc., with polyethylene terephthalate being preferred.

[0063] The thickness of the substrate 28 is not particularly limited, and can be, for example, 5 μm or more and 100 μm or less.

[0064] The adhesive constituting the third adhesive layer 27 is not particularly limited, and for example, a (meth)acrylic adhesive, a rubber-based adhesive, a silicone-based adhesive, a urethane-based adhesive, an epoxy-based adhesive, or the like can be used. Among these, a silicone-based adhesive or a (meth)acrylic adhesive is preferred, and a silicone-based adhesive is more preferred. These may be used alone or in combination.

[0065] The third pressure-sensitive adhesive layer 27 may contain a gas generating agent, but preferably does not substantially contain a gas generating agent. In this case, when used to seal a flow path, peeling due to gas generation can be made even less likely to occur. The third pressure-sensitive adhesive layer 27 may contain other additives similar to those of the first pressure-sensitive adhesive layer 3.

[0066] The adhesive constituting the third adhesive layer 27 may be the same type as or a different type from the adhesive constituting the second adhesive layer 4. However, from the viewpoint of further improving productivity, it is preferable that the adhesives constituting the second adhesive layer 4 and the third adhesive layer 27 are composed of the same type of adhesive.

[0067] Other points are the same as those in the first embodiment.

[0068] In the tape laminate 21 of the second embodiment, too, a double-sided tape 29 having through holes 26 is laminated on the main surface 3a of the first pressure-sensitive adhesive layer 3 containing a gas generating agent, so that the gas generated from the first pressure-sensitive adhesive layer 3 can be sent to the flow path via the through holes 26. On the other hand, the second main surface 4b of the second pressure-sensitive adhesive layer 4 is bonded to the substrate on which the flow path is provided, so that peeling of the flow path sealing portion can be suppressed.

[0069] In this case, the distance between the first adhesive layer 3 containing the gas generating agent and the flow path can be reduced, and therefore when used in a microfluidic device or the like, the device can be made smaller.

[0070] FIG. 4 is a schematic cross-sectional view showing a tape stack according to a third embodiment of the present invention.

[0071] As shown in Fig. 4, the tape laminate 31 does not have a third adhesive layer 27. In the tape laminate 31, a second adhesive layer 4 is provided on one side of a substrate 28, thereby forming a single-sided tape 39.

[0072] Furthermore, in the tape laminate 31, a through hole 36 is provided so as to penetrate from the second main surface 4b of the second pressure-sensitive adhesive layer 4 through the entire substrate 28. Details of the shape and formation method of the through hole 36 are the same as those of the through hole 6 in the first embodiment.

[0073] In the tape laminate 31 of the third embodiment, a single-sided tape 39 having through holes 36 is also laminated on the main surface 3a of the first pressure-sensitive adhesive layer 3 containing a gas generating agent, so that the gas generated from the first pressure-sensitive adhesive layer 3 can be sent to the flow path via the through holes 36. On the other hand, the second main surface 4b of the second pressure-sensitive adhesive layer 4 is bonded to the substrate on which the flow path is provided, so that peeling of the flow path sealing portion can be suppressed.

[0074] In this case, the distance between the first adhesive layer 3 containing the gas generating agent and the flow path can be reduced, and therefore when used in a microfluidic device or the like, the device can be made smaller.

[0075] [Microfluidic chips and microfluidic devices] FIG. 5 is a schematic cross-sectional view showing a microchannel chip and a microfluidic device according to one embodiment of the present invention.

[0076] As shown in FIG. 5 , the microfluidic device 41 includes a microchannel chip 42 and a light irradiation unit 43. The microchannel chip 42 includes a substrate 44 and the above-described tape laminate 1 of the present invention. The substrate 44 is provided with a microchannel 45. A gas inlet 46 is provided at the upstream end of the microchannel 45. In this embodiment, the tape laminate 1 is attached to the substrate 44 so as to seal the gas inlet 46. The tape laminate 1 is attached to the substrate 44 from the second main surface 4b of the second pressure-sensitive adhesive layer 4. In a plan view, the through holes 6 of the tape laminate 1 and the gas inlet 46 of the substrate 44 are arranged to overlap each other. In the present invention, it is desirable that all of the multiple through holes 6 of the tape laminate 1 are arranged to overlap the gas inlet 46 in a plan view; however, it is sufficient that at least one through hole 6 is arranged to overlap the gas inlet 46. In this embodiment, the first pressure-sensitive adhesive layer 3 contains a photoresponsive gas generating agent.

[0077] The light irradiation unit 43 is provided to irradiate the tape stack 1 with light. In this embodiment, gas is generated from the tape stack 1 by irradiating light from the light irradiation unit 43 in the direction indicated by arrow X. The gas generated from the tape stack 1 is sent into the microchannel 45 in the direction indicated by arrow Y. This allows the liquid Z placed in the microchannel 45 to be sent downstream. Note that a heat irradiation unit may be provided instead of the light irradiation unit 43 to generate gas from the tape stack 1 by heating.

[0078] As described above, the microfluidic device 41 and the microchannel chip 42 of this embodiment include the tape laminate 1. In the tape laminate 1, the second pressure-sensitive adhesive layer 4 having through-holes 6 is laminated on the main surface 3a of the first pressure-sensitive adhesive layer 3 containing a gas generating agent, so that the gas generated from the first pressure-sensitive adhesive layer 3 can be sent to the microchannel 45 through the through-holes 6. Meanwhile, the second main surface 4b of the second pressure-sensitive adhesive layer 4 is bonded to the substrate 44, so that peeling of the channel sealing portion can be suppressed.

[0079] In this case, the distance between the first adhesive layer 3 containing the gas generating agent and a flow path such as the microflow path 45 can be reduced, thereby enabling the microfluidic device 41 and the microflow path chip 42 to be made smaller.

[0080] The substrate 44 has a substantially rectangular plate shape. However, the shape of the substrate 44 is not particularly limited. The substrate 44 is composed of a substrate main body 44a and a cover member 44b provided on the substrate main body 44a. The substrate main body 44a is made of an injection-molded synthetic resin. The cover member 44b is made of elastomer, synthetic resin, tape, etc. However, the substrate main body 44a and the cover member 44b may be made of other materials. The substrate main body 44a may also be made by laminating multiple synthetic resin sheets, and the structure and material thereof are not particularly limited.

[0081] The microchannel 45 refers to a minute channel that generates a micro effect when transporting a fluid. In such a microchannel 45, the fluid is strongly affected by surface tension and behaves differently from a fluid flowing through a normal large-sized channel.

[0082] The cross-sectional shape and size of the microchannel 45 are not particularly limited as long as the micro effect described above is generated. For example, from the viewpoint of reducing flow resistance when a pump or gravity is used to flow a fluid through the microchannel 45, if the cross-sectional shape of the microchannel 45 is approximately rectangular (including square), the dimension of the smaller side is preferably 20 μm or more, more preferably 50 μm or more, and even more preferably 100 μm or more. From the viewpoint of further miniaturizing the microfluidic device 41, the dimension of the smaller side is preferably 5 mm or less, more preferably 1 mm or less, and even more preferably 500 μm or less.

[0083] Furthermore, when the cross-sectional shape of the microchannel 45 is approximately circular, the diameter (minor axis in the case of an ellipse) is preferably 20 μm or more, more preferably 50 μm or more, and even more preferably 100 μm or more. From the viewpoint of further miniaturizing the microfluidic device 41, the diameter (minor axis in the case of an ellipse) is preferably 5 mm or less, more preferably 1 mm or less, and even more preferably 500 μm or less.

[0084] On the other hand, for example, when effectively utilizing capillary action when flowing a fluid through microchannel 45, if microchannel 45 has a substantially rectangular (including square) cross-sectional shape, the dimension of the smaller side is preferably 5 μm or more, more preferably 10 μm or more, and even more preferably 20 μm or more. Also, the dimension of the smaller side is preferably 200 μm or less, and even more preferably 100 μm or less.

[0085] The microfluidic device 41 and the microchannel chip 42 can be used for various tests by controlling the delivery and reaction of various specimens or samples. For example, the gas generated from the tape laminate 1 can be used to merge and mix a sample containing nucleic acid with a reaction reagent such as a PCR reaction reagent. The gas can also be used to deliver the mixed liquid to a detection channel for testing. Alternatively, a liquid Z such as an extraction solution, a cleaning solution, or a recovery solution used to purify a test substance such as nucleic acid can be held in advance in the middle of the microchannel 45, and the gas generated from the tape laminate 1 can be used to deliver the held liquid Z.

[0086] The microfluidic device 41 and the microchannel chip 42 can also be used for cell culture. For example, a liquid culture medium reservoir and a cell adhesion portion are provided in the microchannel chip 42. Next, gas generated from the tape laminate 1 is used to transport the liquid culture medium from the liquid culture medium reservoir to the cell adhesion portion. With this configuration, cell culture can be performed in the microchannel chip 42. [Explanation of symbols]

[0087] 1, 21, 31...Tape stack 2,28…Base material 2a, 3a, 28a…main surface 3...First adhesive layer 4...Second adhesive layer 4a, 27a...first principal surface 4b, 27b...Second principal surface 5...Release film 6, 26, 36...Through holes 27...Third adhesive layer 29...Double-sided tape 39...Single-sided tape 41...Microfluidic Devices 42...Microfluidic chip 43...Light irradiation unit 44...Platform 44a...Board body 44b...Cover member 45...Microchannel 46...Gas inlet

Claims

1. a first substrate; a first pressure-sensitive adhesive layer provided on a main surface of the first base material, the first pressure-sensitive adhesive layer containing a gas generating agent that generates gas when exposed to light or heat; a second pressure-sensitive adhesive layer provided directly or indirectly on a main surface of the first pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer having through holes; A tape stack comprising:

2. the second pressure-sensitive adhesive layer has a first main surface and a second main surface facing each other, The tape stack according to claim 1 , wherein the through-hole is provided so as to extend from the first main surface to the second main surface.

3. The tape laminate according to claim 1 or 2, wherein the second pressure-sensitive adhesive layer is laminated directly on a main surface of the first pressure-sensitive adhesive layer.

4. a third pressure-sensitive adhesive layer provided on a main surface of the first pressure-sensitive adhesive layer; a second substrate provided on a main surface of the third pressure-sensitive adhesive layer; Furthermore, the second pressure-sensitive adhesive layer is provided on a main surface of the second substrate, The tape laminate according to claim 1 or 2, wherein the through-holes are provided so as to penetrate through the third pressure-sensitive adhesive layer and the second base material as well.

5. The tape laminate according to claim 1 or 2, wherein the gas generating agent is a photoresponsive gas generating agent.

6. a substrate provided with a microchannel having a gas inlet; The tape stack according to claim 1 or 2, attached to a gas inlet of the substrate; Equipped with The micro-channel chip is arranged so that the through-holes of the tape stack and the gas inlet ports of the substrate overlap each other in a plan view.

7. The microchannel chip according to claim 6 ; an irradiation unit that irradiates light or heat onto a portion of the first pressure-sensitive adhesive layer that overlaps with the through hole of the second pressure-sensitive adhesive layer in a plan view; A microfluidic device comprising:

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