Microphones and Electronics

Abstract

To provide a thinned microphone, a packaging method to be used in manufacturing the microphone, and an electronic device.SOLUTION: A microphone 1 comprises: a die 11 on which a transducer is mounted; a frame 12 which has a vertically penetrating hole 12A and which holds the die 11 on a wall surface of the hole 12A with an adhesion layer 14 interposed therebetween; and a cover 13 attached to the frame 12 across a space above the die 11, where the lower surface of the die 11 substantially forms a part of the outer surface. Since the lower surface of the die 11 does not need to be held by a thick substrate as in the prior art, the microphone 1 can be thinned.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a thin microphone and a packaging method used in its manufacture. and an electronic device equipped with the microphone. Background technology

[0002] Microphones are used in mobile phones, smartphones, tablet computers, etc. These microphones are widely used. The device is constructed by placing the device on a substrate and attaching a cover. The substrate or cover has an opening. The sound waves enter through the opening and reach the diaphragm of the transducer. The ram vibrates, and the vibration is converted into an electrical signal and output (for example, Patent Documents 1 to 4). A microphone requires an acoustic space, which is the space surrounded by the substrate and cover, or the die. The space surrounded by the die and the board is the acoustic space. Electrodes for extracting electrical signals are formed on the die, and generally, the die and the electrodes are connected by wires. Such substrates include printed circuit boards and ceramic substrates. A ceramic substrate is often used. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US7166910B2 [Patent Document 2] US6781231B1 [Patent Document 3] US2005 / 0018864A1 [Patent Document 4] US7439616B2 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in such microphones, the die is mounted on a substrate, so the The microphone became thicker by the thickness of the microphone, making it difficult to make the microphone thinner.

[0005] Therefore, in the present invention, a thin microphone and a package used in the manufacture thereof are The present invention aims to provide a microphone-equipped electronic device using the microphone. [Means for solving the problem]

[0006] The concept of the present invention is as follows. [1] A die equipped with a transducer; a frame having a hole penetrating in the vertical direction, and holding the die on the wall surface of the hole via an adhesive layer; and, a cover attached to the frame so as to sandwich a space above the die; Equipped with A microphone wherein the underside of the die substantially forms part of the outer surface. [2] The microphone according to [1] above; a mounting substrate on which the microphone is mounted; An electronic device comprising: [3] A frame with a hole penetrating in the vertical direction is fitted with a datum with a transducer mounted in the hole. and holding the die on the wall surface of the hole in the frame via an adhesive layer. The first step is a second step of attaching a cover to the frame so as to surround a space above the die; A packaging method comprising:

[0007] The concept of the present invention is not limited to the above, but may be implemented in the following embodiments. This includes those that are specifically indicated. [Effects of the Invention]

[0008] According to the present invention, it is possible to reduce the thickness of the microphone and the electronic device. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a cross-sectional view schematically showing a microphone according to a first embodiment of the present invention. [Figure 2] 2 is an enlarged cross-sectional view of a portion where a cover is attached to the frame shown in FIG. 1. FIG. [Figure 3] FIG. 4 is a cross-sectional view schematically showing a microphone according to a second embodiment of the present invention. [Figure 4] FIG. 10 is a cross-sectional view schematically showing a microphone according to a third embodiment of the present invention. [Figure 5] FIG. 10 is a cross-sectional view schematically showing a microphone according to a fourth embodiment of the present invention. [Figure 6A] 1A-1D illustrate stages in a packaging method according to an embodiment of the present invention. [Figure 6B] FIG. 6B shows the next step in FIG. 6A. [Figure 6C] FIG. 6B shows the next step of FIG. 6B. [Figure 6D] FIG. 6D shows the next step in FIG. 6C. [Figure 7] 10A and 10B show a microphone according to another embodiment of the present invention, particularly showing the relationship between the die, the frame, and the cover. [Figure 8] 8 is a diagram showing a microphone according to another embodiment of the present invention, illustrating a relationship between the die, the frame, and the cover, which is different from that shown in FIG. 7. [Figure 9] 9 is a diagram showing a microphone according to another embodiment of the present invention, illustrating a relationship between the die, the frame, and the cover, which is different from that shown in FIGS. 7 and 8. FIG. [Figure 10] 10A and 10B show a microphone according to another embodiment of the present invention, in which electrodes for external connection are attached to the side surfaces of the frame. [Figure 11A] FIG. 10 is a bottom view of a frame with a cover in a microphone showing another embodiment of the present invention. [Figure 11B] FIG. 11B is a cross-sectional view of the frame with cover shown in FIG. 11A. [Figure 11C] 5A-5C illustrate stages of a packaging method according to another embodiment of the present invention. [Figure 11D] FIG. 11D shows the next step in FIG. 11C. [Figure 12] FIG. 1 is a diagram schematically illustrating a part of an electronic device according to an embodiment of the present invention. [Figure 13A] 1 is a diagram schematically illustrating an example of a microphone mounting portion on a mounting substrate in an electronic device according to an embodiment of the present invention. [Figure 13B] FIG. 10 is a diagram schematically illustrating another example of a microphone mounting portion on a mounting substrate in an electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0011] [Microphone according to the first embodiment] FIG. 1 is a cross-sectional view schematically showing a microphone according to a first embodiment of the present invention. The microphone 1 according to the first embodiment of the present invention includes a die 11 on which a transducer is mounted. The die 11 is attached to the wall of the hole 12A via an adhesive layer 14. The die 11 is held by a frame 12, and a cover attached to the frame 12 so as to sandwich a space above the die 11. The lower surface of the die 11 substantially constitutes a part of the outer surface.

[0012] The die 11 is equipped with a transducer, which may be, for example, a membrane. By providing a counter electrode, the vibration of the membrane caused by sound waves is converted into an electrical signal. 11 may be equipped with a signal processing circuit for processing the electrical signal from the transducer. .

[0013] The frame 12 has a structure that houses the die 11 and surrounds the periphery of the die 11. 2 has a hole (opening) 12A penetrating vertically to accommodate the die 11, and the hole 12 The opening shape of the hole 12A is endless, for example, an annular shape. As shown in FIG. 1, the outer peripheral surface of the frame 12 is On the other hand, the inner circumferential surface of the frame 12 has almost the same dimensions between the upper surface and the lower surface. However, the lower surface may be larger than the upper surface in plan view from the approximate center to the inner circumferential surface. This is because the wiring is provided inside the frame 12 and the terminal 17 on the inside of the wiring is This is because the die 11 is connected to the wiring 16 .

[0014] The frame 12 is made by, for example, stacking ceramic materials, applying conductive paste to the wiring portions, and baking it. The structure shown in Figure 1 has a multi-layer structure with conductive and non-conductive layers. In the frame 12, the inner terminal 17 and the outer terminal 18 are electrically connected by the internal wiring 19. For example, the terminal 17 is connected to the inner peripheral surface of the frame body 12 on which the adhesive layer 14 is provided. The outer terminal 18 is provided on the upper end of the surface on which the cover 13 is attached, parallel to the surface on which the cover 13 is attached. , provided on the surface to which the cover 13 is attached.

[0015] The cover 13 is attached to the top surface of the frame 12 and is a member that closes the opening at the top end of the frame 12. The cover 13 may be provided with an inlet / outlet 13A for sound waves at a predetermined position. Whether this is possible or not depends on the specifications.

[0016] The adhesive layer 14 is provided between the side wall of the die 11 and the inner peripheral surface of the frame 12. The die 11 is held in the frame 12 by the adhesive layer 14 provided between the upper and lower surfaces of the die 11. The adhesive layer 14 may be formed by curing an adhesive. The adhesive layer 14 may contain a filler, which may be a conductive filler, a non-conductive filler, or a non-conductive filler. The polymer may contain either one or both of the functional fillers.

[0017] The adhesive layer 23 is provided between the upper surface of the frame 12 and the cover 13, and adheres the cover 13 to the frame 12. In the adhesive layer 23, the conductive paste is hardened in the portion where the internal wiring is to be provided. The rest of the surface is made of a hardened non-conductive adhesive.

[0018] In the microphone 1 according to the first embodiment, the die 11 is attached from the side to the wall of the hole 12A that penetrates in the vertical direction. 14 Since the die 11 is held by the frame 12 via the die holder 14, there is no need to attach a thick substrate to the underside of the die 11 as in the past. Therefore, the undersides of the die 11 and frame 12 are attached facing the mounting surface 5 of an electronic device such as a mobile phone, smartphone, or tablet computer. In this way, because the microphone does not employ a configuration in which a die is mounted on a substrate as in the past, the microphone 1 can be made thinner by the thickness of the substrate.

[0019] The lower surface of the die 11 and the lower surface of the frame 12 are substantially flush with each other. The lower surface of the die 11 substantially forms a part of the outer surface. Here, "substantially" means that the adhesive may be hardened and adhere to the bottom surfaces of the die 11 and the frame 12. This means that the underside and the protective layer form the outer surface. The same applies to other embodiments.

[0020] Here, we will explain the difference between the "frame" 12 in the embodiment of the present invention and the "substrate" in a conventional microphone. The "substrate" in a conventional microphone is a plate-like component on which wiring is formed and which has a surface on which electronic components such as passive elements, active elements, and various chips are mounted, and this mounting surface is a surface perpendicular to the thickness direction. On the other hand, the "frame" 12 in the embodiment of the present invention does not have a plate shape, and the wall surface of the hole 12A has a step as shown in Figure 1, or is a cylindrical shape as shown in Figures 7 and 8 described below. The step is provided for arranging terminals for internal connection. The frame 12 has the die 11 of the microphone 1 mounted on its inner peripheral surface, which is a surface parallel to the thickness direction. 、 adhesive layer 14 Therefore, frame 12 does not have the function of mounting wiring or components, as in the case of the substrate of the conventional microphone described above.

[0021] The frame 12 has dimensions or an area that is a predetermined ratio of the dimensions or area of ​​the outer shape of the frame in a plan view. For example, if the size of the hole 12A is a×b (where a≦b), the frame The width of the frame 12 is a / 2 or less. In another example, the area of ​​the hole 12A when viewed from above the die 11 is equal to or less than the area of ​​the frame 1. The area occupied by the microphone 1 on the mounting surface 5 is 50% or more of the external area of ​​the microphone 1. That is, the height of the microphone 1 can be reduced while The footprint can be minimized relative to the die. When a terminal for internal connection is installed, it can be connected by wire bonding. The height of the wiring can be reduced. The same is true for the state.

[0022] Here, in order to provide an adhesive layer 14 between the die 11 and the frame 12, The hardened adhesive is applied to the underside of the body 12, especially to the underside of the boundary between the die 11 and the frame body 12 and its periphery. Some medication may remain.

[0023] In the microphone 1 according to the first embodiment, it is preferable that the cover 1 is 3, from below by the die 11 and adhesive layer 14, and from the side by the frame 12 and adhesive layer This space is called the package space, and the die 1 The cover 13 is separated from the cavity space on the opposite side of the membrane 1. The package space interacts with the space inside the cavity created by the membrane. For example, when sound waves enter the membrane from the cavity side, the package space is It functions as a back volume. Conversely, the sound waves are directed from the package space side to the membrane. When sound waves flow into the cavity, the space inside the cavity acts as a back volume. In some cases, air may flow in from both the package space side and the cavity side. The microphone exhibits directivity. The mounting surface 5 of the electronic device is provided with an inlet and outlet for sound waves. The inlet and outlet are not shown. In this case, the mounting surface 5 of the electronic device is provided on the cover 13 side. , this configuration is not shown in the figures.

[0024] In the microphone 1 according to the first embodiment, the frame 12 is The frame 12 has a hole (opening) 12A penetrating in the thickness direction. The width corresponds to the dimension between the inner periphery and the outer periphery, and the width corresponds to the underside of the frame body 12. It is not prohibited to have a part that protrudes inward from the surface. This protruding part forms a step, For example, a step may be provided for an internal connection, such as a pad for electrical connection between the die and the frame. A die mount on which the die can be placed to facilitate packaging In the frame 12, the wall surface of the through hole 12A has a step, so that the wire The height of the wiring can be reduced by bonding, so the height of microphone 1 can be lowered. While minimizing the footprint of microphone 1 relative to that of the die, Cut.

[0025] FIG. 2 is an enlarged cross-sectional view of a portion where a cover is attached to the frame shown in FIG. In the frame 12, the outer terminal 18 is connected to the upper end of a via as an internal wiring 19. The cover 13 has a via hole as the internal wiring 20, and the internal wiring 20 has a lower end at the inside thereof. A terminal 21 is provided, and a mounting terminal 22 is provided at the outer upper end of the internal wiring 20. Therefore, a connection portion 24 is formed between the terminal 18 on the outside of the frame body 12 and the terminal 21 of the cover 13. A conductive paste is applied to the upper surface of the frame 12 and the lower surface of the cover 13 to form an adhesive layer 23, which is a non-conductive adhesive. The frame 12 is covered by applying a conductive paste and a non-conductive adhesive thereto, and the conductive paste and the non-conductive adhesive are hardened. -We are closely following 13.

[0026] [Microphone according to the second embodiment] FIG. 3 is a cross-sectional view schematically showing a microphone according to a second embodiment of the present invention. The microphone 2 according to the second embodiment is similar to the microphone 1 according to the first embodiment. The die 11 has a lancer mounted thereon, and a hole 12A that penetrates vertically. A frame 12 holds the die 11 on its wall via an adhesive layer 14, and a space is sandwiched above the die 11. and a cover 13 attached to the frame 12 so that the lower surface of the die 11 is substantially the outer surface. It forms part of the surface.

[0027] In the microphone 2 according to the second embodiment, a die 11A on which a transducer is mounted and and another die 11B equipped with a signal processing circuit, and the die 11A and the other die 11B The die 11A and the other dies 11 are held by the frame 12 via the adhesive layer 14A. B and surrounds the die 11A and the other die 11B as a unit. Specifically, the frame 12 is configured to accommodate the die 11A and another die 11B. The adhesive layer 14B has a hole (hollow) 12A through which the die 11A is attached. The adhesive layer 14B is provided between the side of the other die 11B and the die 11A and the other die 11B. The side on which the adhesive layer 14B is provided is the side on which the die 11A and the other die 11B are integrated. The adhesive layer 14A is formed between a side surface of the die 11A and the inner peripheral surface of the frame 12. and between a side surface of the other die 11B and the inner peripheral surface of the frame 12. The die 11A and the other die 11B are held to the frame 12 by the adhesive layer 14A. 11A and another die 11B are electrically connected by wire 16A, and the other die 11B is The inner terminal 17 is electrically connected by a wire 16B. It is the same as the microphone 1 according to the first embodiment.

[0028] In the microphone 2 according to the second embodiment, the die 11A and the other die 11B are Since the die 11A and the other dies 11B are held by the wall surface of the hole 12A of the frame body 12 from both sides, Therefore, there is no need to attach a thick substrate to the bottom surface of the die 11A, etc. The die 11B and the underside of the frame 12 are used for mobile phones, smartphones, tablet computers, etc. The mounting surface 5 of the electronic device such as a computer is opposite to the mounting surface 5. Since the microphone does not use a structure in which a die is mounted on a substrate, it is thinner by the thickness of the substrate. Here, an adhesive layer 14B is provided between the die 11A and another die 11B. The adhesive layer 14A is formed between the die 11A and the frame 12 and between the other die 11B and the frame 12. In order to provide the die 11, the other die 11B, the lower surface of the frame 12, in particular, the die 11, In some cases, hardened adhesive may remain on the underside of the boundary between the die 11B and the frame 12 and around the boundary. do.

[0029] In the microphone 2 shown in FIG. 3, the wall surface of the hole 12A of the frame 12 and the outer peripheral surface of the die 11A An adhesive layer 14A is provided between the die 11A and the other die 11B, and an adhesive layer 14B is provided between the die 11A and the other die 11B. An adhesive layer 14A is provided between the wall surface of the hole 12A of the frame 12 and the outer peripheral surface of the other die 11B. This allows the die 11A and the other die 11B to be gathered together, and the die 11A and the other die 11B can be The components that make up the microphone 2, including the microphone 11B, are packaged.

[0030] [Microphone according to the third embodiment] FIG. 4 is a cross-sectional view schematically showing a microphone according to a third embodiment of the present invention. The microphone 4 according to the third embodiment includes one or more dies 11 (11A, 11B) and a frame. The die 11A and 11B are disposed in the frame 12, and the die 11B is disposed in the frame 12. 1A is fixed to the inner peripheral surface of the frame 12 via an adhesive layer 14A, and the die 11A and another die 11B and the other die 11B is fixed to the frame 12 via an adhesive layer 14A. The cover 13 is fixed to the wall of the hole 12A. The cover 13 defines a space above the dies 11A and 11B. The frame 12 is attached so that the

[0031] As shown in FIG. 4, the microphone 3 according to the third embodiment includes a plurality of dies. The die 11A is equipped with a transducer, and the other die 11B is equipped with a signal processing circuit. The electric signal converted by the transducer of the die 11A is transmitted through the wire 16A. The electric current is transmitted to another die 11B via the wire 16B, and then to the inner terminal 17. through the internal wiring 19, the terminal 18, the connection portion 24, the terminal 21, the internal wiring 20 and the terminal 22 ( 2) and output to the outside, similar to the second embodiment, so the description will not be repeated. do not have.

[0032] In the microphone 3 according to the third embodiment, the lower surface of the frame 12 is covered with the die 11A and other dies. The protective layer 15 is substantially flush with the bottom surface of the frame 12 and the die 11A and other components. They are provided on both sides of the lower surface of the die 11B.

[0033] The protective layer 15 is a layer that protects the bottom surfaces of the die 11A, the other die 11B, and the frame body 12. The protective layer 15 may be made up of only the adhesive layer 15A, or the protective layer 15 may be made up of the adhesive layer 15B. Filler 15B may be dispersed and disposed in adhesion layer 15A. Filler 15B is preferred. Alternatively, the protective layer 15 may be maintained in a constant state by having a constant size, for example, a spherical shape. , the thickness of the protective layer 15 is maintained within a certain range.

[0034] In the microphone 4, the protective layer 15 contains the filler 15B, so that the adhesive layer 1 Even if adhesive layer 15A is pressed, adhesive layer 15A is prevented from spreading and becoming thin. Control.

[0035] The filler 15B may be surface treated to improve wetting with the adhesive. For example, the surface may be treated with a silane coupling agent.

[0036] Preferably, the filler 15B is electrically conductive, so that the transducer and the signal To prevent external noise from being mixed into the signal in the processing circuit.

[0037] Here, the adhesive layer 15A is the same as either or both of the adhesive layers 14A and 14B. This allows the die 11A and the other die 11B to be bonded to the frame 12. The adhesive layer 15A can be used to hold the adhesive layer 14A and form the protective layer 15 at the same time. The adhesive layers 14A and 14B may be made of a material such as epoxy resin, silicone resin, or polyimide. Mido resins and the like.

[0038] The other configurations are the same as those of the first and second embodiments, and therefore the description will not be repeated.

[0039] [Microphone according to the fourth embodiment] FIG. 5 is a cross-sectional view schematically showing a microphone according to a fourth embodiment of the present invention. In the microphone 4 according to the fourth embodiment, the microphone 3 according to the third embodiment The mesh 30 is fixed to the protective layer 15. That is, the mesh 30 is in contact with the protective layer 15. Here, the fact that the protective layer 15 fixes the mesh 30 means that the lower surface of the protective layer 15 In the case where the mesh 30 is fixed on the side, a part of the mesh 30 overlaps with the protective layer 15 to provide protection. The mesh 30 is fixed in the protective layer 15, and the mesh 30 is fixed in the protective layer 15. In some cases, the entire or most of the mesh 30 is provided and the protective layer 15 fixes the mesh 30. It can be enjoyed.

[0040] As shown in the cross-sectional view of FIG. 5, the die 11A, the lower surface of the other die 11B, and the lower surface of the frame 12 The mesh 30 is fixed to the protective layer 15 so as to be disposed on the lower side of the protective layer 15. As a result, the protective layer 15 holds the mesh 30. The mesh 30 is arranged vertically and horizontally. Any crossed mesh or similar material may be used, and may be either metallic or non-metallic. The surface of the mesh 30 may be thinly coated with metal. The number of threads per inch is between 100 and several hundred. Then, the protective layer 15 and the mesh 30 are provided on the lower surfaces of the die 11A, the other die 11B and the frame body 12. Even if the microphone 4 is thin, it can be made thinner.

[0041] Preferably, the mesh 30 is electrically conductive and / or the protective layer 15 contains a conductive filler. This prevents external noise from being introduced into the signal in the transducer and signal processing circuit. In addition, when the protective layer 15 contains a conductive filler, the plating The shoe 30 may be non-conductive.

[0042] In the microphone 4, for example, the mesh 30 is in contact with the lower surface of the protective layer 15. Even if the protective layer 15 is placed and pressed from above, the presence of the mesh 30 does not make the protective layer 15 thin. and are suppressed.

[0043] The mesh 30 may be surface treated to improve wetting with adhesive. For example, the surface is treated with a silane coupling agent.

[0044] In the fourth embodiment, the protective layer 15 is made of the same material as the adhesive layers 14A and 14B. In this way, the die 11A and the other die 11B are attached to the frame 12 by the adhesive layer 14A. The formation of the protective layer 15 can be performed simultaneously. Since the steps are the same as those in the first, second and third embodiments, the description will not be repeated.

[0045] As described above, in the microphone according to each embodiment of the present invention, The die 11 with the sensor mounted thereon is placed in a frame 12 and held from the side by an adhesive layer 14. Die 11A is equipped with a transducer, and another die 11A is equipped with a signal processing circuit. B is fixed via an adhesive layer 14B, and the die 11A and the other die 11B are fixed in the frame 12. or they are arranged and held laterally via adhesive layers 14A, respectively. A cover 13 is attached to the top surface of the frame 12. 2 via an adhesive layer 14, or the die 11A and the other die 11B are held by a frame. The die 11 and 11A are laterally held by the body 12 via the adhesive layer 14A. The bottom surface of the other die 11B does not need to be supported by a thick substrate as in the conventional case. In the embodiment of the present invention, the microphone adopts a conventional structure in which a die is mounted on a substrate. Since no heat sink is used, the thickness can be reduced by the thickness of the substrate.

[0046] As in the first and second embodiments, the lower surface of the frame 12 and the die 11 (11A, 11B) The bottom surface of the ) is flush, and the bottom surface is The bottom surface may be in contact with the mounting surface 5 of an electronic device such as a computer. The adhesive may be partially cured and remain.

[0047] In one embodiment, sound waves flow into and out of a cavity in die 11 or die 11A. The mounting surface 5 is provided with an inlet / outlet (not shown) so that the cover 13 can be easily opened and closed. Unlike the above, the inlet / outlet 13A is not provided, so that the die 11 (11A, 11B), the frame 12, The space surrounded by the cover 13 and the adhesive layer 14 functions as a back volume.

[0048] In another embodiment, the inlet / outlet is not provided on the cavity side, and the cover is provided as shown in FIGS. By providing an inlet / outlet 13A on the die 13, the die 11 or die 11A on the attachment surface 5 side can be easily opened. The cavity acts as a back volume.

[0049] In yet another embodiment, a cavity provided in the die 11 or die 11A and a cavity in the cover 13 Sound waves flow in from both the inlet and outlet 13A. At this time, the microphone has directionality. do.

[0050] As in the third and fourth embodiments, the lower surface of the frame 12 and the die 11A and other die The lower surface of the die 11B is substantially flush with the lower surface of the frame 12, the die 11A and the other dies 1. A protective layer 15 is provided on the lower surface of 1B. By providing such a protective layer 15, The die 11A, the other die 11B and the frame 12 can be protected.

[0051] As in the third embodiment, the lower surface of the frame 12 and the lower surfaces of the die 11A and the other die 11B are The lower surface of the frame 12 and the lower surfaces of the die 11A and other dies 11B are substantially flush with each other. 15, which may contain the same material as the adhesive layer 14; The protective layer 15 holds the filler 15B, and the thickness of the protective layer 15 is increased by the filler 15B. The pressure is maintained within a certain range, and the die 11A and the other die 11B are integrated with the frame body 12. In particular, the filler 15B has conductivity, so that it can provide electromagnetic shielding. This prevents external noise from being mixed into the signals of the transducer and signal processing circuit. In addition, by providing a metal layer on either the front or back surface of the cover 13, the transducer This makes it possible to make it difficult for noise to occur in the electrical signals in the sensor and signal processing circuit.

[0052] As in the fourth embodiment, the lower surface of the frame 12 and the lower surfaces of the die 11A and the other die 11B are The lower surface of the frame 12 and the lower surfaces of the die 11A and other dies 11B are substantially flush with each other. 15, which may contain the same material as the adhesive layer 14; The protective layer 15 fixes the mesh 30, so that the die 11A and the other die 11B The mesh 30 is electrically conductive, so that the mesh 30 is electromagnetically This provides effective shielding, preventing external noise from reaching the transducer and signal processing circuit signals. In addition, a metal layer can be provided on either the front or back surface of the cover 13. This makes it difficult for noise to occur in the electrical signal in the transducer and signal processing circuit. It is possible.

[0053] As in the first embodiment, the electric signal from the die 11 is taken out to the outside via the frame 12. In addition, as in the second to fourth embodiments, The electrical signal from 11A is taken out to the outside via another die 11B and frame body 12. This allows for efficient packaging and wiring without using a substrate. As in the first, second, third and fourth embodiments, the microphone is inserted from above the frame body 12. An electric signal is taken out from the frame 12 through the cover 13. As will be described later, as shown in FIG. 9, the frame 12 Therefore, the electric signal is directly taken from the frame 12 to the outside of the microphone 1C without passing through the cover 13. As shown in FIG. 10, an electrical signal may be taken out from the side of the frame 12. That's fine.

[0054] In each embodiment of the present invention, the inlet and outlet of the sound wave are as shown in FIGS. 1, 3 to 5. Even if the cover 13 is provided with the inlet / outlet 13A, unlike the illustrated embodiment, the mounting surface 5 The inlet and outlet for the sound waves may be provided on the die 11 side or on both sides. In the case where the die 11 or 11A is provided on the lower surface side thereof, the inlet and outlet for the sound waves on the lower surface of the die 11 or 11A In the case of the mesh, the protective layer 15 is not provided, or the mesh in the part not covered by the protective layer 15 is left as it is. The presence of the mesh 30 makes it difficult for foreign objects to get into the package, In this embodiment, the cover 13 does not need to be provided with an opening as an inlet / outlet. There are also.

[0055] On the other hand, in the case where the inlet and outlet for the sound waves are provided in the cover 13, the opening in the cavity of the die 11 is There are also forms that do not require a port. Simply use a die with a closed cavity. The choice also depends on how the microphone is implemented.

[0056] [Packaging method] Next, regarding the packaging method according to the embodiment of the present invention, a fourth embodiment shown in FIG. A case where a microphone 4 according to the fourth embodiment is manufactured will be described as an example. 10A and 10B are diagrams showing a method for manufacturing the microphone 4 according to the embodiment, and also showing a packaging method. 6A to 6C, the upper part of each figure shows a cross section taken along line II, and the lower part of each figure shows a cross section taken along line II. The cross section along line II-II is shown in the figure. This is intended for the simultaneous production of multiple microphones, but for the production of a single microphone Although only one microphone is shown in the figure, the microphones are Then another microphone is manufactured next to it.

[0057] First, as shown in FIG. 6A, a mesh 41 is placed on a peelable film 42. The film 42 is preferably made of PET (polyethylene terephthalate). Other materials may be used, and various surface treatments may be applied. Surface treatments include Teflon ( Examples of coating methods include (registered trademark) coating, release agent treatment, and precious metal film formation treatment.

[0058] Next, between the die 43 equipped with the transducer and the die 44 equipped with the signal processing circuit The adhesive is applied in an appropriate amount to an appropriate location, for example, under the die 43. At the same time, or before or after that, the frame 45 and the die 44 are bonded to each other. Apply an appropriate amount to an appropriate location to provide adhesive between 3 and 44. For example, Apply adhesive to the bottom surfaces of the dies 43, 44 and the frame 45. If the adhesive is not enough, apply adhesive to the side of the die 43. If the mesh 41 is not open, adhesive may be applied to the mesh 41.

[0059] Next, as shown in FIG. 6B, the die 43 and die 44 are placed on the mesh 41 in close contact with each other. Since the frame 45 has a through opening (hole), as shown in FIG. As shown in FIG. 1, the frame 45 is attached to the metal plate 10 so as to surround the set of the die 43 and the die 44 with one of the through openings. Place it on top of Shell 41.

[0060] In this state, a pair of dies 43 and 44 are arranged in the opening of the frame 45 and are mutually Therefore, in this state, the dies 43 and 44 and the frame 45 are tightly attached to the mesh 4. 1 and film 42, adhesive is applied between die 43 and die 44, and between die 4 3 and the frame body 45, and between the die 44 and the frame body 45, and The adhesive and the adhesive between each die 43 or 44 and the inner peripheral surface of the frame 45 are hardened and bonded. The adhesive on the bottom surfaces of the dies 43 and 44 and the frame 45 is hardened to form a layer 46. By providing the protective layer 47, the protective layer 47 is provided on the lower surfaces of the dies 43 and 44 and the frame body 45, The mesh 41 is fixed to the protective layer 47 .

[0061] Before or after the adhesive hardens, the die 43 and the die 44 are bonded with a wire 48A. The die 44 and the terminal of the frame 45 are bonded with wires 48B. The frame 45 is provided with internal wiring 45a, and terminals are provided at each end of the internal wiring 45a. 45b and 45c are provided, so that an electrical signal from the die 43 is transmitted via a wire 48 A to the die 44, and then through the wire 48B and the internal wiring 45a of the frame 45. It can be taken out from terminal 45c via the same.

[0062] Next, as shown in FIG. 6D, the cover 49 is attached to the top surface of the frame 45. A terminal 49a for mounting is formed on the front surface, and a terminal 49c is formed on the back surface of the cover 49. An internal wiring (via) 49b is provided between the terminal 49a and the terminal 49c. 9 is electrically connected to the internal wiring 45a of the frame body 45. Specifically, the cover 49 is attached to the terminal 49c on the back surface of the cover 49. The conductive paste that forms the adhesive layer 50 is then coated with adhesive. Before the adhesive hardens, the cover 49 is placed on the frame 45. Even if the cover 49 covers the bumps, applying appropriate pressure to the cover 49 will displace the adhesive. A terminal 49c on the rear surface of the cover 49 and a terminal 45c of the frame body 45 are electrically connected. Here, conductive paste or adhesive is applied to prevent the bumps from being crushed too much and short-circuiting with the adjacent bumps. The upper surface of the frame 45 is adhered to the cover 49 by the adhesive layer 50. It adheres to the underside.

[0063] Here, a number of microphones are placed in an array on the film 42. The body 45 is not separate for each microphone, but is integrated. The same goes for the cover 49. Therefore, when the cover 49 is attached, the microphones are connected in an array. This is then divided by dicing to produce individual microphones. The array of dies is observed with a camera, an image is captured, and the image is Align the cover plate to position it.

[0064] Thereafter, the microphone is peeled off from the film 42. There are several ways to peel off the microphone. For example, as shown in Figure 6D, it is possible to manufacture individual microphones and then peel them off. In this case, foreign matter may enter the inside of the package through the holes in the mesh 41 during the process. This can prevent such things from happening.

[0065] Another time to do this is before wire bonding, after the adhesive has cured. This timing is set so that the film 42 can withstand the heat generated during wire bonding. This is effective when the temperature rises to, for example, 150°C due to the heat generated during wire bonding. When this timing is used, the dicing temperature is The microphone is fixed on the tape, and the holes in the mesh 41 are closed to prevent the cooling water from entering. It is necessary to

[0066] In the packaging method according to the embodiment of the present invention, the film 42 is used. The flexibility of the film 42 allows it to be easily peeled off by turning it over. Furthermore, even if the adhesive strength is the same, it can be easily peeled off with a weaker force. In this way, a microphone as shown in FIG. 5 can be manufactured.

[0067] In this way, referring to FIGS. 6A to 6D, the mesh is fixed to the protective layer and the package is formed. When no mesh is provided, the mesh is placed on the film. In the case where the protective layer is made of an adhesive layer and a filler as in the third embodiment, 6B and 6C without placing a mesh on the film in the state shown in FIG. 6A. When applying adhesive to the die and frame, if filler is mixed into the adhesive, In addition, when packaging only one die, the dies are integrated with adhesive. You don't have to.

[0068] In the packaging method according to the embodiment of the present invention, first, a frame body is provided with a transducer. The frame and the die are arranged so as to surround the sides of the mounted die, and the die is attached to the frame with an adhesive layer interposed therebetween. The die is held in place by the frame, and a cover is attached to the frame so as to enclose the space above the die. A die with a transducer mounted thereon is placed in a hole in a frame having a hole penetrating downward. a first step of holding the die on the wall surface of the hole in the frame through an adhesive layer; and a second step of attaching a cover to the frame so as to surround the space. This method eliminates the need to mount a die on a substrate, as in the past, and This allows the microphone 1 to be mounted on a thin surface. The occupied area can be minimized, i.e., the height of the microphone 1 can be reduced while The footprint of the microphone is minimized relative to that of the die. The wall surface has a step on which terminals for internal connection are arranged, or is cylindrical.

[0069] In the packaging method according to the embodiment of the present invention, first, a transducer-equipped Applying an adhesive to the bottom surface and / or side surface of at least one of the die and a frame surrounding the side of the die; Next, the die and the frame are arranged so as to surround the die, and a space is enclosed above the die. This packaging method does not require a die assembly as in the conventional method. This eliminates the need to install the microphone on a substrate, making it possible to make the microphone thinner.

[0070] Preferably, in the first step, a film is formed on the lower surface of the die and the frame or on the film facing the lower surface. An adhesive is applied, and the die and frame are placed against a film having peelability. By pressing the die against the film, the adhesive penetrates between the die and the frame, and the adhesive hardens. This allows for efficient packaging. can.

[0071] Preferably, in the first step, a mesh is placed on the film, and then a die is placed on the mesh. The mesh is then fixed to the bottom surfaces of the die and frame with adhesive. A protective layer made of a mesh can be provided, and the frame and the die can be integrated by the mesh and the protective layer. This allows the protective layer to be maintained at a constant thickness.

[0072] Preferably, the adhesive contains a filler, and in the first step, a die is applied to the film. The die and the frame are then placed on the bottom surface of the die and the frame. A protective layer can be provided and the protective layer can be maintained at a constant thickness.

[0073] Preferably, the filler or the mesh is electrically conductive. Electromagnetic shielding can be achieved.

[0074] Preferably, another die carrying a signal processing circuit is integrated with the die by adhesive, and the die and the other die are The sides of the die are surrounded by a frame, and a cover is attached to the frame so that a space is sandwiched between the die and other dies. This allows the conversion to an electrical signal by the transducer to be performed separately from the signal processing. It is possible to provide a low-cost microphone that can be used in various locations and has good performance.

[0075] In the embodiment of the present invention, the thickness of the adhesive layer 14 (14A, 14B) is several μm or more and several hundred μm or more. It is preferably 200 μm or less, and more preferably 100 μm or less. The mesh has a wire diameter of several tens of microns to several hundred microns, and the number of holes per inch is Therefore, even if the mesh 30 and the protective layer 15 are provided, the number of the micro-organisms is about 100 to several hundred. This allows for a thinner microphone.

[0076] In the microphones according to the first to fourth embodiments, the inner circumferential surface of the frame 12 is made up of an upper surface and a lower surface. The dimensions change stepwise between the inner circumferential surface and the inner circumferential surface. In this case, wiring by wire bonding is performed on the top surface of the frame 12. This allows wire bonding to be performed on the stepped portion, while the caliper for wire bonding is 7 is a micrograph showing another embodiment of the present invention. 1A, particularly showing the relationship between the die, the frame, and the cover. When the wiring 35 is substantially constant between the upper and lower surfaces, the wiring 35 is formed on the upper surface of the frame 12. The surface wiring 35 and the die 11 are connected by wires 16. On the lower surface, a conductive material is applied to the surface wiring 35 at a portion that will become the connection portion 24 that connects to the internal wiring 20. A conductive paste is applied to the other portions, and a non-conductive adhesive is applied to the other portions to form the adhesive layer 23. The conductive paste and non-conductive adhesive are hardened to form the frame. The body 12 is attached to the cover 13. If necessary, the cover 13 may have a lower part. The recess 13B is formed to separate the die 11 from the surface wiring 35. In the embodiment shown in FIG. 7, the frame 12 has a top surface on which a wire 16 is provided for connection. The surface wiring 35 is provided on the upper surface of the frame 12, and the inner terminal and the outer terminal are provided on both ends. The terminals may be connected by internal wiring. The same is true for the state.

[0077] In the microphones according to the first to fourth embodiments, the frame 12 is higher than the die 11. That is, the lower surface of the frame 12 is substantially flush with the lower surface of the die 11, and the upper surface of the frame 12 However, the frame 12 has approximately the same height as the die 11. That is, the lower surface of the frame 12 and the lower surface of the die 11 are substantially flush with each other, and the upper surface of the frame 12 is The surface and the top surface of the die 11 may be substantially flush with each other.

[0078] FIG. 8 shows a microphone 1B according to another embodiment of the present invention, particularly the die and the frame. 8 is a diagram showing a relationship different from that shown in FIG. 7 regarding the relationship between the cover and the surface arrangement on the upper surface of the frame body 12. The wiring 35 is provided, and the surface wiring 35 and the die 11 are connected by a wire 16. Cover 13 includes an upper portion 13C and a peripheral portion 13C extending downward from the outer peripheral edge of the upper portion 13C and having an inner peripheral surface. The recess 13B of the cover 13 is formed by an upper portion 13C and a peripheral portion 13D. The recess 13B of the cover 13 is formed by carving the frame 13B from the bottom side. The cover 13 faces a part of the body 12 and the die 11, and the inner circumferential surface of the cover 13, the adhesive layer 23, The frame 12, adhesive layer 14, and die 11 surround the package space. The cover 16 is provided to connect the die 11 to the surface wiring 35. The connecting portion 2 is connected to the internal wiring 20 on the surface wiring 35 at the lower surface of the peripheral portion 13D of the wiring 13. A conductive paste is applied to the area that will become the peripheral edge portion 13D. The non-conductive adhesive is applied, the cover 13 is attached to the frame 12, and the conductive paste and The non-conductive adhesive is cured to adhere the frame 12 to the cover 13. In FIG. Although the first embodiment is shown, the same applies to the other embodiments.

[0079] In the microphones according to the first to fourth embodiments, the cover 13 has an internal wiring 20. The outer periphery of the cover 13 overlaps the outer periphery of the frame body 12 in a plan view. However, the cover 13 does not have internal wiring, and the outer periphery of the cover 13 is closer to the outer periphery of the frame 12. Alternatively, the cover 13 may be positioned closer to the center in plan view.

[0080] FIG. 9 shows a microphone 1C according to another embodiment of the present invention, in particular the die and the frame. 9 is a diagram showing a relationship between the frame 12 and the cover that is different from that shown in FIGS. The internal wiring 19 is provided, and the inner peripheral surface of the frame 12 has a step. The inner end of the internal wiring 19 is located at the height of the die 11 and parallel to the upper and lower surfaces of the frame 12. The frame 12 is provided with a bonding pad as a surface wiring 35 on its upper surface. The upper end of the inner circumferential surface of the frame 12 has a shape that follows the edge of the cover 13. Therefore, the cover 13 is fixed to the fitting portion 12B by the adhesive. 9 is in close contact with the cover 2B, unlike the configurations shown in FIGS. The upper and lower surfaces of the die 13 can be made flat, and the electrical signal from the die 11 can be transmitted to the wire It can be taken out to the surface wiring 35 by using the internal wiring 19 of the frame body 12 via the ear 16. 9 shows the case of the first embodiment, but the same applies to the other embodiments.

[0081] In the packaging method, the location where the adhesive is applied is determined by the die, frame, etc., as described above. As shown in FIG. 6A, the film 42 may be formed on either or both of the lower surface and the side wall surface. However, how to apply it to each location depends on the package and the process. The setting is appropriate depending on the number and size of packaging. For example, In this case, adhesive is applied to a separate sheet in advance, and the die and frame are pressed onto the sheet. The pattern may then be transferred to the bottom surfaces of the die and frame.

[0082] FIG. 10 shows a microphone according to another embodiment of the present invention, in which an external This is a diagram showing a state in which electrodes for connection are attached. The die 11 has a die mounted with a laser and a hole 12A penetrating in the vertical direction. The die 11 is held by a frame 12 via an adhesive layer 14, and a space is sandwiched between the frame 12 and the die 11. and a cover 13 attached to the frame 12, and the lower surface of the die 11 is substantially the outer surface. The frame 12 is provided with internal wiring 19, and the wall surface of the hole 12A has a step. The step is formed at the height position of the die 11 and in the part parallel to the upper and lower surfaces of the frame 12. The inner terminal 17 of the internal wiring 19 is provided, and the side surface of the frame 12 is provided with a bonnet as a side surface wiring 36. In the embodiment shown in FIG. 10, the same structure as that shown in FIGS. This is a preferred implementation because it allows the microphone 1D to be thinner than the conventional implementation. The electric signal from the die 11 is transmitted from the die 11 through the wire 16 to the internal wiring of the frame 12. 19 can be used to take out the side wiring 36. FIG. 10 shows the case of the first embodiment. However, the same applies to other embodiments.

[0083] FIG. 11A shows another embodiment of the microphone according to the present invention. 11B is a cross-sectional view of the frame with cover shown in FIG. 11A, and FIG. 11C is a cross-sectional view of the frame with cover shown in FIG. 11C shows a stage of a packaging method according to another embodiment of the present invention. FIG.

[0084] As shown in FIGS. 11A and 11B, the frame body and the cover in the above-described embodiment are integrated. A method for packaging the die 11 using the frame 61 with cover will now be described. The frame body 61 with cover is made up of a cover part 61A which is the upper part, and a part below the periphery of the cover part 61A. The cover 61A has a side wall 61B extending downward from a predetermined position. The side wall portion 61B and the partition portion 61C form a storage portion 63 (63A, 63B As shown in FIG. 11B, the side wall portion 61B and the partition portion 61C are the inner surfaces. The wall surface has a step, and a plurality of electrodes 62 are provided on the surface of the step that is parallel to the upper and lower surfaces. Specific electrodes 62 are connected to each other by wiring (not shown). 63" corresponds to the "hole 12A" in the first to fourth embodiments. , 11B) is placed.

[0085] In the frame body 60 with cover as shown in FIGS. 11A and 11B, the storage section 63 (63A The die 11 (11A, 11B) is inserted into the die 11 (11A, 11B) from below. 1B) and the electrode 62 are integrated by applying pressure in the vertical direction. This results in a microphone 1E in which the die 11 (11A, 11B) is packaged. can be obtained.

[0086] Furthermore, if necessary, a contact between the wall surface of the side wall portion 61B and the die 11 (11A, 11B) may be provided. An adhesive layer 64 is provided between the wall surface of the partition portion 61C and the die 11 (11A, 11B). 4, the die 11 (11A, 11B) and the frame body 61 with the cover are integrated. 11D, the lower surface of the side wall portion 61B and the die 11 (11A 11B), a protective layer 65 may be provided on the underside of the protective layer 65. As shown in FIGS. The protective layer 65 may hold a filler or mesh. It may also be called a protective layer.

[0087] In the embodiment shown in FIGS. 11A to 11D, each of the two dies is housed in a housing 63 (63A, 63B), and there is a partition 61C between the die 11A and the die 11B. If there is no problem with the strength, the partition portion 61C can be omitted.

[0088] As shown in FIG. 11, the configuration in which a plurality of storage sections 63 (63A, 63B) are provided is The various types of packaging shown in FIGS. 3, 4, and 5 can be used. The same applies to the shape.

[0089] In the microphone 1E according to the embodiment shown in FIGS. 11C and 11D, the transducer The die 11 (11A, 11B) on which the die is mounted has holes (i.e., storage portions) that penetrate in the vertical direction. 63 (63A, 63B)), and the die 11 (11A, 11B) is attached to the wall surface of the hole by an adhesive layer. 64, the frame body (i.e., the side wall portion 61B) and the die 11 (11A, 11B) A cover (s) attached to the frame (i.e., the side wall portion 61B) so as to sandwich a space above the That is, the cover portion 61A is provided, and the lower surface of the die 11 (11A, 11B) is substantially It forms part of the surface.

[0090] [Electronic equipment] FIG. 12 is a diagram showing a part of an electronic device according to an embodiment of the present invention. The electronic device 70 includes: In a mounting substrate 71 such as a printed circuit board, a A sound hole 72 is provided for the microphone 1 to be attached in correspondence with the sound hole 72. The mounting substrate 71 is provided with an electronic element or device such as a capacitor, a resistor, an LSI, or an IC. Although not shown in FIG. 12, the electronic device 70 has a built-in mounting board 71. In order to do so, an exterior member for the device, which serves as a cover, is attached to the mounting substrate 71. This applies not only to microphones but also to other types of microphones. According to the device 70, the microphone 1 itself does not have a conventional substrate, so that the mounting Since it can be attached directly to the substrate 71, the electronic device 70 can be made thinner.

[0091] FIG. 13A shows a mounting example of an electronic device in which a microphone is mounted according to an embodiment of the present invention. 13A is a diagram showing an example of the mounting portion of the substrate. The pad 85 has an electrode pad 85A on the side thereof, and is mounted on a mounting substrate 81 such as a PCB. The electrode pad 85A is placed on the electrode 81A on the wiring, and the electrode pad 85A is fixed by the solder 86. The bottom surface of the microphone 85, i.e., the bottom surface of the die, is connected to the mounting electrode 81A. The microphone 85 faces the substrate 81. The exterior member 84 is attached. Here, the protrusion 84 extends from the edge of the opening 84A of the equipment exterior member 84. 84B extends toward the mounting substrate 81 and abuts against the mounting substrate 81, and sound from the opening 84A is The wave flows into the microphone 85 through the sound hole 82 of the mounting substrate 81. In addition to the microphone 85 according to each of the above-described embodiments, various microphones are also included in the device 1 as shown in FIG. The microphone 85 itself is equipped with electronic elements and devices. is directly attached to the mounting substrate 81 without having a substrate as in the prior art.

[0092] FIG. 13B shows a state in which a microphone is mounted on a mounting board in an electronic device according to an embodiment of the present invention. 13B is a diagram showing another example of the microphone 95. The upper surface has an electrode pad 95A, and the electrode pad 95A is mounted on a mounting substrate 91 such as a PCB. 95A is placed on the electrode 91A on the wiring, and the electrode pad 95A is connected to the electrode 91A by solder 96. The top surface of the microphone 95 faces the mounting substrate 91. An equipment exterior member 94 is attached to the opposite side of the mounting substrate 91 across the microphone 95. Here, the protrusion 94B extends from the edge of the opening 94A of the equipment exterior member 94 to the bottom of the microphone 95. The opening 94A extends to the lower surface of the die, that is, the lower surface of the die, and contacts the microphone 95. The sound waves flow into the microphone 95. The mounting substrate 95 has the same structure as that of each of the above-described embodiments. In addition to the microphone 95, various electronic elements and devices are installed as shown in Figure 12. According to this, the microphone 95 itself does not have a substrate like the conventional one. 91.

[0093] The embodiments of the present invention are not limited to the above-described matters and the forms shown in the drawings, but are within the scope of the appended claims. This also includes modifications made within the scope of the claims. [Explanation of symbols]

[0094] 1, 1A, 1B, 1C, 1D, 1E, 2, 3, 4: Microphone 5: Mounting surface 11, 11A, 11B: Die 12:Frame body 12A: Hole 12B: Fitting part 13: Cover 13A: Inflow / outlet 13B: Depression 13C: Upper 13D: Periphery 14,14A,14B: Adhesive layer 15:Protective layer 15A: Adhesive layer 15B: Filler 16, 16A, 16B: Wire 17: Terminal 18: Terminal 19: Internal wiring 20: Internal wiring 21: Terminal 22: Terminal 23: Adhesive layer 24: Connection 30:Mesh 35: Surface wiring 36: Side wiring 41: Mesh 42: Film 43,44: Die 45:Frame body 45a: Internal wiring 45b, 45c: Terminals 46: Adhesive layer 47:Protective layer 48A, 48B: Wire 49: Cover 49a: Terminal 49b: Internal wiring 49c: Terminal 50: Adhesive layer 61: Frame with cover 61A: Cover part 61B: Side wall part 61C: Partition 62: Electrode 63 (63A, 63B): Storage section 64: Adhesive layer 65: Protective layer 70:Electronic equipment 71: Mounting board 72: Sound hole 73: Electronic elements or devices 81, 91: Mounting board 81A, 91A: Electrode 82,92: Sound hole 84, 94: Equipment exterior materials 84A, 94A: Opening 84B, 94B:Protrusion 85,95:Microphone 85A, 95A: Electrode pads 86,96: Solder

Claims

1. A microphone, a frame body including an inner wall surface defining a through hole extending in a longitudinal direction; a die held in the through hole; a cover disposed opposite the die in the vertical direction so as to cover the through-hole; Including, the inner wall surface includes a support surface that faces an outer surface of the die in a lateral direction and supports the die; The inner wall surface further includes an extension surface extending straight in the vertical direction from the holding surface, The microphone is configured such that the frame and the die share a common outer plane extending in the laterally direction.

2. A microphone as claimed in claim 1, wherein the frame body is configured as a cylindrical body having the retaining surface and the extension surface as inner surfaces.

3. The microphone of claim 1 , wherein the inner wall surface includes, in addition to the extension surface, a flat surface that is offset in the lateral direction from the holding surface and extends in the longitudinal direction.

4. The microphone of claim 3 , wherein a step is formed by the holding surface and the flat surface.

5. 5. The microphone of claim 4, wherein the shoulder includes a terminal.

6. The microphone of claim 5 , wherein the terminals are configured to extract electrical signals from the die via wire bonding.

7. 6. The microphone of claim 5, wherein the terminals are electrically connected to internal wiring disposed within the frame.

8. 8. The microphone of claim 7, wherein the internal wiring is electrically connected to pads disposed on an outer surface of the frame.

9. the cover includes a via; The microphone of claim 5 , wherein the terminal is electrically connected to the via through a conductor.

10. A microphone as claimed in claim 9, wherein a first adhesive layer is formed between the upper surface of the frame body and the cover, and the first adhesive layer includes the conductor.

11. The microphone of claim 10 , wherein a second adhesive layer is formed between the support surface and the outer surface of the die.

12. the inner wall surfaces define an area in the common outer plane of a×b, where a≦b; 2. The microphone according to claim 1, wherein the frame has a width of a / 2 or less around the through hole.

13. 13. The microphone of claim 12, wherein the area is 50% or more of the outer area formed by the frame on the common outer plane.

14. The microphone of claim 1 , wherein the die includes a transducer.

15. 15. The microphone of claim 14, wherein the transducer includes a membrane and a counter electrode.

16. 15. The microphone of claim 14, wherein the cover includes an opening through which sound waves pass.

17. The microphone of claim 14 , wherein a package space is formed between the die and the cover.

18. 20. The microphone of claim 17, wherein the die has a cavity formed on an opposite side of the package volume.

19. 20. The microphone of claim 18, wherein the package space acts as a back volume when sound waves enter the cavity.

20. 20. The microphone of claim 18, wherein the cavity acts as a back volume when sound waves enter the package space.

21. A microphone as claimed in claim 1, wherein the frame body does not have surface wiring extending in the horizontal direction for mounting electronic components including the die.

22. A microphone according to any one of claims 1 to 21; a substrate on which the microphone is formed; Electronic devices, including:

Images