Inertial sensor manufacturing method

Abstract

To reduce variations in gaps between a micro-vibrator and a plurality of electrodes surrounding the micro-vibrator while preventing the micro-vibrator from being damaged in an inertial sensor using the micro-vibrator having an irregular shape.SOLUTION: An asymmetrical first alignment mark 24 is formed on a micro vibrator 2, and a second alignment mark 43 corresponding to the first alignment mark 24 and having an asymmetrical shape is formed on a mounting substrate. When the micro-vibrator 2 is mounted on the mounting substrate, the alignment using the first alignment mark 24 and the second alignment mark 43 is enabled. A plurality of electrode parts 53 of the mounting substrate are formed on the basis of the numerical values obtained by the outer dimension measurement of the micro-vibrator 2 and are arranged apart from each other.SELECTED DRAWING: Figure 11G

Description

[Technical Field]

[0001] The present invention relates to an inertial sensor using a micro-vibrator having a three-dimensional curved surface. of Regarding the manufacturing method. [Background technology]

[0002] In recent years, the development of autonomous driving systems for vehicles has progressed, and these types of systems require highly accurate self-position estimation technology. For example, for so-called Level 3 autonomous driving, development is underway on a self-position estimation system equipped with a GNSS (Global Navigation Satellite System) and an IMU (Inertial Measurement Unit). The IMU is a six-axis inertial force sensor consisting of, for example, a three-axis gyro sensor and a three-axis acceleration sensor. In order to realize so-called Level 4 or higher autonomous driving in the future, an IMU with even higher sensitivity than currently available will be required.

[0003] The BRG (Bird-bath Resonator Gyroscope) is considered to be a promising gyro sensor for realizing such a highly sensitive IMU. It is made up of a micro-vibrator with a roughly hemispherical three-dimensional curved surface that vibrates in wine-glass mode and is mounted on a mounting board. This micro-vibrator has a Q value that indicates the state of vibration of 10. 6 This is expected to result in higher sensitivity than conventional methods.

[0004] An example of an inertial sensor using this type of micro-vibrator is described in Patent Document 1. In this inertial sensor, a micro-vibrator having a roughly hemispherical three-dimensional curved surface is bonded to a substrate that serves as a base, and a plurality of electrodes are arranged on the substrate to surround the micro-vibrator, with plating formed on the surfaces of these electrodes that face the micro-vibrator. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] U.S. Patent No. 10,612,925 Summary of the Invention [Problem to be solved by the invention]

[0006] This type of microvibrator is formed into a three-dimensional curved shape by using a plate made of a reflow material and a mold, heating and softening the plate while depressurizing the mold cavity. However, the microvibrator formed by this process may have an unintended shape in the portion facing the multiple electrodes of the base substrate or in the support portion joined to the base. For example, the rim portion of the microvibrator facing the multiple electrodes may not be perfectly circular, or the support portion may be misaligned from the center of the rim portion. If a microvibrator with such an irregular shape is used, when the microvibrator is joined to the base substrate, variations in the gap between the microvibrator and the multiple electrodes may occur, resulting in a decrease in capacitance and ultimately a decrease in sensor accuracy.

[0007] In the inertial sensor described in Patent Document 1, after bonding the micro-vibrator to a base substrate, the gaps between the micro-vibrator and the multiple electrodes are filled with plating, and then part of the plating is removed by etching, thereby reducing variation in the gaps between the micro-vibrator and the multiple electrodes. However, inertial sensors manufactured using this process, the micro-vibrator may be damaged during the plating etching process, which could reduce sensor accuracy.

[0008] In view of the above, the present invention aims to reduce the variation in the gap between the micro-vibrator and the multiple electrodes surrounding it in an inertial sensor that uses an irregularly shaped micro-vibrator, while suppressing damage to the micro-vibrator. [Means for solving the problem]

[0009] In order to achieve the above object, a manufacturing method of an inertial sensor according to claim 1 includes preparing a micro-vibrator (2) having a curved surface portion (21) having a hemispherical three-dimensional curved surface and a support portion (22) extending from the curved surface portion toward the inside of the hemispherical shape; Regarding the overall outer shape including the rim (211) which is the end of the curved surface of the micro-vibrator opposite to the support part and the support part, The method includes measuring the external dimensions of the prepared micro-vibrator, preparing a mounting substrate (3) having a plurality of electrode portions (53) on which the micro-vibrator is mounted, and mounting the micro-vibrator on the mounting substrate with the micro-vibrator surrounded by the plurality of electrode portions at a distance, and in preparing the mounting substrate, a plurality of electrode portions are formed at positions spaced a predetermined distance from the rim (211), which is the end of the curved portion of the micro-vibrator opposite the support portion, based on the external dimension values ​​of the micro-vibrator obtained by measurement.

[0010] According to this method, the external dimensions of a prepared micro-vibrator are measured, and based on the obtained external dimensions, a mounting substrate is prepared on which a plurality of electrodes are formed and positioned at a predetermined distance from a rim, which is the end of the curved surface of the micro-vibrator opposite the support post.The micro-vibrator whose external dimensions have been measured is then mounted on the mounting substrate equipped with such a plurality of electrodes.As a result, even if the rim of the micro-vibrator has an irregular shape that is different from a perfect circle, such as an ellipse, it can be mounted on a mounting substrate equipped with a plurality of electrodes that matches the rim, making it possible to manufacture an inertial sensor with reduced variation in the distance between the rim and the plurality of electrodes.

[0015] The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and the specific components described in the embodiments described below. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 2 is a top view layout diagram showing the inertial sensor of the first embodiment. [Figure 2] FIG. 1 is a perspective view showing a micro-vibrator according to a first embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4]4 is a diagram showing the micro-vibrator of FIG. 3 as viewed from the mounting surface side. [Figure 5A] 10A and 10B are cross-sectional views showing a member preparation step in the process of forming a micro-vibrator having a three-dimensional curved surface. [Figure 5B] FIG. 5B is a cross-sectional view showing the step of forming the microvibrator subsequent to FIG. 5A. [Figure 5C] FIG. 5C is a cross-sectional view showing the microvibrator forming step subsequent to FIG. 5B. [Figure 6] 5 is a diagram showing another example of the shape of the micro-vibrator, and corresponds to FIG. 4. FIG. [Figure 7] FIG. 2 is a top view layout diagram showing a mounting board for the inertial sensor according to the first embodiment. [Figure 8] FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. [Figure 10A] 3A to 3C are cross-sectional views illustrating a manufacturing process of the inertial sensor of the first embodiment. [Figure 10B] FIG. 10B is a cross-sectional view showing a manufacturing step subsequent to FIG. 10A. [Figure 10C] FIG. 10C is a cross-sectional view showing a manufacturing step subsequent to FIG. 10B. [Figure 10D] FIG. 10D is a cross-sectional view showing a manufacturing step subsequent to FIG. 10C. [Figure 10E] FIG. 10B is a cross-sectional view showing a manufacturing step subsequent to FIG. 10D. [Figure 10F] FIG. 10F is a cross-sectional view showing a manufacturing step subsequent to FIG. 10E. [Figure 10G] FIG. 10C is a cross-sectional view showing a manufacturing step subsequent to FIG. 10F. [Figure 10H] FIG. 10C is a cross-sectional view showing a manufacturing step subsequent to FIG. 10G. [Figure 10I] FIG. 10C is a cross-sectional view showing a manufacturing step subsequent to FIG. 10H. [Figure 11A] FIG. 10F is a cross-sectional view showing another cross section in the step of FIG. 10E. [Figure 11B] FIG. 10C is a cross-sectional view showing another cross section in the step of FIG. 10F. [Figure 11C] FIG. 10C is a cross-sectional view showing another cross section in the step of FIG. 10G. [Figure 11D] FIG. 10C is a cross-sectional view showing another cross section in the step of FIG. 10H. [Figure 11E] FIG. 10B is a cross-sectional view showing another cross section in the step of FIG. 10I. [Figure 11F] 10I and 11E. FIG. [Figure 11G] FIG. 11F is an explanatory diagram of the alignment between the microvibrator and the mounting substrate in the step of FIG. [Figure 11H] FIG. 11B is a diagram showing an example of alignment using an alignment mark in the step of FIG. 11G. [Figure 12] 10A and 10B are diagrams showing modified examples of alignment marks on the micro-vibrator. [Figure 13] 13A and 13B are diagrams showing modified examples of alignment marks on a mounting board corresponding to FIG. 12. [Figure 14] 10A and 10B are explanatory diagrams illustrating alignment between a microvibrator and a mounting substrate according to a modified example of the first embodiment. [Figure 15] FIG. 5 is a diagram showing a micro-vibrator in an inertial sensor according to a second embodiment, and corresponds to FIG. 4. [Figure 16] 10A and 10B are explanatory diagrams illustrating alignment between the micro-vibrator and the mounting substrate in the second embodiment. [Figure 17] 10A and 10B are explanatory diagrams of alignment between the micro-vibrator and the mounting substrate in the inertial sensor of the third embodiment. [Figure 18] 10A and 10B are diagrams illustrating a modified example of alignment between the micro-vibrator and the mounting substrate in the inertial sensor of the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following embodiments, parts that are identical or equivalent to each other will be denoted by the same reference numerals.

[0018] (First embodiment) An inertial sensor 1 of a first embodiment will be described with reference to the drawings. The inertial sensor 1 of this embodiment has a micro-vibrator 2 (described below) that vibrates in a wine-glass mode, and is suitable for application to various devices that utilize the vibration characteristics of the micro-vibrator 2, such as gyro sensors such as BRGs and clock devices. In this specification, a case in which the inertial sensor 1 is applied to a BRG will be described as a representative example, but the inertial sensor 1 is not limited to this application, and can, of course, also be applied to other applications, such as inertial sensors other than gyro sensors.

[0019] In Fig. 1, the outline of the portion of the mounting substrate 3, which overlaps with the micro-oscillator 2 and cannot be seen, is shown by a dashed line. In Fig. 2, to make it easier to understand the configuration of the micro-oscillator 2, which will be described later, the portion of the outline of the micro-oscillator 2 that cannot be seen from the angle shown in Fig. 2 is shown by a dashed line. In Figs. 4 and 6, although they do not show cross sections, a first alignment mark 24, which will be described later, is hatched. In Fig. 7, although it does not show a cross section, a second alignment mark 43, which will be described later, is hatched.

[0020] For ease of explanation, the direction along the left-right direction on the paper as shown in FIG. 1 will be referred to as the "x direction," the direction perpendicular to the x direction on the paper as the "y direction," and the direction normal to the xy plane as the "z direction." The x, y, and z directions in FIG. 1 and subsequent figures correspond to the x, y, and z directions in FIG. 1, respectively. In addition, in this specification, "up" refers to the direction along the z direction in the figure and refers to the side indicated by the arrow, and "down" refers to the side opposite to the top. Furthermore, in this specification, the state in which the inertial sensor 1 or the mounting substrate 3 is viewed from above in the z direction, as shown in FIG. 1, for example, may be referred to as a "top view."

[0021] [Basic configuration] As shown in FIG. 1 , the inertial sensor 1 of this embodiment includes a micro-vibrator 2 and a mounting substrate 3, with a portion of the micro-vibrator 2 bonded to the mounting substrate 3. The inertial sensor 1 detects an angular velocity applied to the inertial sensor 1 based on a change in capacitance between the thin-walled micro-vibrator 2, which is capable of vibrating in a wine-glass mode, and a plurality of electrode portions 53 (described later) on the mounting substrate 3. When the inertial sensor 1 forms a BRG, during operation, an electrostatic attraction is generated between some of the plurality of electrode portions 53 and the micro-vibrator 2, causing the micro-vibrator 2 to vibrate in the wine-glass mode. When an external Coriolis force is applied to the BRG while the micro-vibrator 2 is vibrating, the micro-vibrator 2 is displaced, changing the position of the node of its vibration mode. The BRG detects the change in the node of the vibration mode using the capacitance between the micro-vibrator 2 and the plurality of electrode portions 53, thereby enabling detection of the angular velocity acting on the BRG.

[0022] 2, the micro-vibrator 2 includes a curved surface portion 21 including the contour of a three-dimensional curved surface in the shape of an elliptical hemisphere, and a support portion 22 extending from the apex side of the imaginary hemisphere formed by the curved surface portion 21 toward the inside of the hemisphere. The support portion 22 is, for example, a cylindrical recess with a bottom. The micro-vibrator 2 has, for example, a curved surface portion 21 that has a bowl-shaped three-dimensional curved surface, and the Q value of the vibration is 10 5 That's all.

[0023] The end of the curved surface portion 21 opposite the support portion 22 is the rim 211, which has a generally elliptical cylindrical shape, as shown in FIGS. 2 and 3 . In other words, the rim 211 has an outer shape that is different from a perfect circle, such as an elliptical shape, when viewed from above. The micro-vibrator 2 is mounted on the mounting substrate 3 with the rim 211 facing the surface 2a of the mounting substrate 3 with a plurality of electrode portions 53 (described later). As shown in FIG. 4 , for example, the micro-vibrator 2 has a first alignment mark 24 formed on the mounting surface 22b of the support portion 22, which is the surface that faces and is bonded to the mounting substrate 3. In this embodiment, the micro-vibrator 2 is mounted so that the distances between the plurality of electrode portions 53 are generally equal by using the first alignment mark 24 and a corresponding second alignment mark 43 (described later) formed on the mounting substrate 3. Mounting the micro-vibrator 2 on the mounting substrate 3 using the alignment mark will be described later.

[0024] The micro-vibrator 2 is a hollow part in which the curved surface portion 21 including the rim 211 does not come into contact with other components when mounted on the mounting substrate 3. The micro-vibrator 2 has a structure in which the hollow rim 211 can vibrate in wine glass mode when mounted on the mounting substrate 3.

[0025] 3, the micro-vibrator 2 has a surface with a larger outer diameter as the front surface 2a and a back surface 2b on the opposite side, with a front surface electrode 23 covering part or all of both surfaces. The surface of the support 22 of the micro-vibrator 2 facing the back surface 2b serves as a mounting surface 22b that faces the mounting substrate 3. In this embodiment, for example, the surface of the bottom of the support 22 opposite the mounting surface 22b serves as an adsorption surface 22a that is used to adsorb and transport the micro-vibrator 2.

[0026] The surface electrode 23 may be, for example, but not limited to, a laminated film of a conductive material, such as Cr (chromium) or Ti (titanium), and an appropriate conductive material, such as Au (gold) or Pt (platinum), from the base side, or a single layer film of a conductive material, such as TiN (titanium nitride), that adheres well to the substrate. The surface electrode 23 is formed on the front surface 2a and the back surface 2b of the micro-vibrator 2 by any suitable film formation method, such as sputtering, vapor deposition, or atomic layer deposition (ALD). In this embodiment, the surface electrode 23 is formed on at least the mounting surface 22b and the front surface 2a of the rim 211, and these portions are electrically connected. The surface electrode 23 may be a solid film covering the entire front and back surfaces of the micro-vibrator 2, or may be patterned to have the above-described configuration and cover a portion of the front and back surfaces.

[0027] The micro-vibrator 2 is made of materials such as quartz, glass containing additives such as borosilicate glass, metallic glass, silicon, and ceramic. The micro-vibrator 2 is not limited to the aforementioned materials, and may be made of any material as long as it can form the curved surface portion 21 and the support portion 22, which have a three-dimensional curved shape, and can vibrate in wine glass mode. The micro-vibrator 2 is formed, for example, by processing a thin-walled base material made of the above-mentioned materials through a forming process described below, resulting in a thin member on the order of micrometers, with the curved surface portion 21 and the support portion 22 having thicknesses of 10 μm to 100 μm. The micro-vibrator 2 has a millimeter-sized shape, with the height dimension being 2.5 mm and the outer diameter of the rim 211 on the surface 2a side being 5 mm, with the height direction being the thickness direction of the mounting substrate 3.

[0028] The micro-vibrator 2 has a first alignment mark 24 attached to the mounting surface 22b of the support 22. The first alignment mark 24 is used for alignment with the mounting substrate 3. The first alignment mark 24 is formed by any method, such as laser processing. As shown in FIG. 4, the first alignment mark 24 has an asymmetric shape so that its orientation when mounted on the mounting substrate 3 is determined to be unique. For example, consider the orientation of the micro-vibrator 2 when the micro-vibrator 2 is rotated around a virtual line that is normal to the mounting surface 22b and passes through the center of the mounting surface 22b as the rotation axis. In this case, if the alignment mark has a point-symmetric or line-symmetric shape, there will be at least two or more orientations of the micro-vibrator 2 in which the alignment mark will be the same. On the other hand, if the alignment mark has an asymmetric shape, there will be only one orientation of the micro-vibrator 2 in which the alignment mark will be the same, so the orientation of the micro-vibrator 2 when mounted on the mounting substrate 3 can be uniquely determined. The first alignment marks 24 may have any shape as long as they correspond to the second alignment marks 43 on the mounting substrate 3 and have an asymmetric shape, and are not limited to the example shown in FIG. 4, but may be modified as appropriate.

[0029] The micro-vibrator 2 is formed, for example, by the following process.

[0030] First, as shown in FIG. 5A, a quartz plate 20, a mold M for forming the three-dimensional curved surface, and a cooling body C for cooling the mold M are prepared. The mold M includes, for example, a recess M1 that provides a space for forming the three-dimensional curved surface in the quartz plate 20, and a support M2 that extends in the depth direction of the recess M1 at the center of the recess M1 and supports a portion of the quartz plate 20 during processing. The mold M has a through-hole M11 for decompression formed in the bottom surface of the recess M1. The cooling body C includes a fitting portion C1 into which the mold M is fitted and an exhaust port C11 on the bottom surface of the fitting portion C1, and serves to cool the mold M when processing the quartz plate 20. The quartz plate 20 is arranged to cover the entire recess M1 of the mold M.

[0031] Next, as shown in FIG. 5B , a flame F is blown from a torch T toward the quartz plate 20 to melt the quartz plate 20. At this time, a vacuum is drawn from the recess M1 of the mold M through the exhaust port C11 of the cooling body C by a vacuum mechanism (not shown). As a result, the melted portion of the quartz plate 20 is stretched toward the bottom of the recess M1, and its central peripheral region is supported by the support portion M2. After that, by stopping the heating of the quartz plate 20 and allowing it to cool, the quartz plate 20 is formed with a curved portion 201 having a substantially hemispherical three-dimensional curved shape and a recessed portion 202 that is supported by the support portion M2 and has a recessed shape near the center of the curved portion 201. Furthermore, the portion of the quartz plate 20 located outside the recess M1 is located at the outer peripheral edge of the curved portion 201, forming a flat edge portion 203.

[0032] Next, the recess M1 of the mold M is returned to normal pressure, the processed quartz plate 20 is removed, and the quartz plate 20 is sealed with a sealant E made of any curable resin material, as shown in FIG. 5C, for example. Thereafter, for example, the sealant E is polished and CMPed from the surface on the edge 203 side to the portion shown by the dashed line in FIG. 5C, and the edge 203 is removed along with the sealant E. As a result, the quartz plate 20 has a shape including a curved surface portion 21 having an annular curved surface and support portions 22 recessed from the apex of the curved surface portion 21. CMP is an abbreviation for chemical mechanical polishing.

[0033] Then, all of the sealing material E is removed by any method, such as heating or dissolving using a chemical solution, and the quartz plate 20 is removed. Next, a laser beam is irradiated onto the rear bottom surface of the recessed portion 202 of the removed quartz plate 20, thereby forming a first alignment mark 24. Finally, surface electrodes 23 are formed on both the front and rear surfaces of the processed quartz plate 20 by a film formation process, such as sputtering or vapor deposition. The surface electrodes 23 may be patterned by a known method, such as using a mask (not shown), if necessary.

[0034] The micro-vibrator 2 is manufactured by, for example, the manufacturing process described above, but is not limited to this manufacturing method example and may be changed as appropriate. For example, the heat source for melting the quartz plate 20 shown in Fig. 5B may be a heater that can heat the quartz plate 20 over an area equivalent to that when the flame F is used, instead of the flame F from the torch T.

[0035] 5C, the micro-vibrator 2 has the first alignment mark 24 formed thereon, but the timing of this formation is arbitrary. For example, the first alignment mark 24 may be formed before the step shown in FIG. 5A, a quartz plate 20 having the first alignment mark 24 may be prepared, and a three-dimensional curved surface shape may be formed by the steps shown in FIG. 5B and thereafter. In this case, the first alignment mark 24 may be distorted during the softening step of heating the quartz plate 20. However, as long as the shape is asymmetrical, this does not particularly hinder alignment with the mounting substrate 3, and the distortion may be utilized for positioning with the mounting substrate 3.

[0036] Furthermore, the micro-vibrator 2 is not limited to the shape BR shown in the figure, as long as the curved surface portion 21 has a three-dimensional, bowl-like curved shape and is capable of vibrating in wine glass mode. For example, the support portion 22 may be a columnar shape other than a cylindrical recess with a bottom, and as shown in Fig. 6, its center may be located at a position different from the center position CP of the rim 211 (hereinafter, for convenience, this state will be referred to as "axis offset"). Note that the center position CP of the rim 211 refers to the point located at the center of the ellipse formed by the outer shape of the rim 211.

[0037] As described above, the micro-vibrator 2 is formed by a method in which the curved surface portion 201 does not come into contact with the mold M in the process of forming the three-dimensional curved shape, but in this case, the shape of the three-dimensional curved surface and the position of the support portion 22 relative to the curved surface portion 21 do not always remain the same. For this reason, before the mounting substrate 3 is formed, the external dimensions of the micro-vibrator 2 are measured for its entire external shape, including the rim 211 and the support portion 22, using an optical method such as a laser microscope or a white light interference microscope. The external dimension values ​​of the micro-vibrator 2 obtained by this external dimension measurement are used to form the groove 41, inner frame portion 51, multiple electrode portions 53, second alignment mark 43, etc. of the mounting substrate 3.

[0038] 7, the mounting substrate 3 includes a lower substrate 4 and an upper substrate 5, which are bonded together. For example, the mounting substrate 3 can be obtained by anodic bonding the upper substrate 5, which is made of silicon (Si), a semiconductor material, to the lower substrate 4, which is made of borosilicate glass, an insulating material. The mounting substrate 3 includes, for example, on the upper substrate 5 side, a ring-shaped inner frame 51, a plurality of electrode portions 53 arranged at a distance from one another to surround the inner frame 51, and a plurality of outer frame portions 54 arranged at a distance from one another to surround the electrode portions 53. The mounting substrate 3 also includes, for example, on the lower substrate 4 side, a ring-shaped groove 41 surrounding the inner frame 51 while separating the inner frame 51 from the plurality of electrode portions 53, and a plurality of bridge wirings 42 spanning the inside and outside of the groove 41.

[0039] 8 and 9, the groove 41 is a groove provided between the inner frame portion 51 and the plurality of electrode portions 53, and is formed by wet etching or the like. The groove 41 has a dimension corresponding to the outer diameter of the rim 211 of the micro-vibrator 2, for example, and is provided so that the rim 211 does not come into contact with the mounting substrate 3 when the micro-vibrator 2 is mounted on the mounting substrate 3.

[0040] The plurality of bridge wirings 42 are made of a conductive material such as Al (aluminum), and are arranged to pass between the plurality of electrode portions 53, but are electrically independent of the plurality of electrode portions 53. As shown in FIG. 9 , the plurality of bridge wirings 42 straddle the grooves 41 in the lower substrate 4, and are electrically connected to the inner frame portion 51 at one end and the outer frame portion 54 at the other end. The number of bridge wirings 42 is, for example, the same as the number of outer frame portions 54, but the number is arbitrary. The bridge wirings 42 are ultimately electrically connected to the surface electrodes 23 of the micro-vibrator 2 joined to the region surrounded by the inner frame portion 51, and function as wiring for applying a voltage to the surface electrodes 23.

[0041] The inner frame portion 51 has, for example, a circular ring shape when viewed from above, and is sized so that its outer and inner wall surfaces do not come into contact with the micro-vibrator 2 as shown in Fig. 8. In the area of ​​the mounting substrate 3 surrounded by the inner frame portion 51, second alignment marks 43 corresponding to the first alignment marks 24 of the micro-vibrator 2 are formed.

[0042] The second alignment mark 43 is paired with the first alignment mark 24 formed on the micro-vibrator 2 and is used to align the micro-vibrator 2 with the mounting substrate 3. The second alignment mark 43 is formed at a position corresponding to the first alignment mark 24 of the micro-vibrator 2, such as within an area of ​​the mounting substrate 3 surrounded by the inner frame portion 51. The second alignment mark 43 has an asymmetric shape like the first alignment mark 24 and is formed on the lower substrate 4 by any method such as etching or laser processing. For example, the second alignment mark 43 has an outer shape similar to that of the first alignment mark 24 but is larger in planar size than the first alignment mark 24. Note that the size relationship between the first alignment mark 24 and the second alignment mark 43 in planar sizes may be reversed, or they may not be similar to each other.

[0043] The bonding member 52 is a conductive material used to bond the micro-vibrator 2 and the mounting substrate 3, and electrically connects the inner frame portion 51 connected to the bridge wiring 42 with the surface electrode 23 of the micro-vibrator 2. The bonding member 52 is a conductive paste material made of a conductive material such as AuSn (gold tin), Ag (silver), or Au, and is applied to the area surrounded by the inner frame portion 51 using a syringe or the like.

[0044] The multiple electrode sections 53 are arranged at intervals from one another at positions on the outer periphery of the groove 41, surrounding the inner frame section 51 along the outer shape of the rim 211. For example, as shown in Fig. 7, the multiple electrode sections 53 have a shape obtained by dividing a single elliptical annular frame having an inner diameter larger than the outer dimensions of the rim 211 of the micro-vibrator 2 when viewed from above. For example, the multiple electrode sections 53 are configured by equally dividing an elliptical annular frame surrounding the inner frame section 51 at predetermined intervals, but this is not limited thereto, and the number, arrangement, shape, and the like can be changed as appropriate depending on the shape, outer dimensions, and the like of the micro-vibrator 2.

[0045] As shown in FIG. 8 , for example, an electrode film 531 is formed on the upper surface of each of the plurality of electrode portions 53. For example, wires (not shown) are connected to the electrode films 531 of the plurality of electrode portions 53, and the plurality of electrode portions 53 are electrically connected to an external circuit board (not shown) or the like, thereby enabling control of the potential. As shown in FIG. 1 and FIG. 8 , for example, when the micro-vibrator 2 is mounted, each of the plurality of electrode portions 53 is spaced a predetermined distance from the rim 211 of the micro-vibrator 2, and each forms a capacitor with the micro-vibrator 2. In other words, the mounting substrate 3 can detect the electrostatic capacitance between itself and the micro-vibrator 2 via the plurality of electrode portions 53, or generate electrostatic attraction between itself and the micro-vibrator 2, causing the micro-vibrator 2 to vibrate in wine glass mode.

[0046] The outer frame portion 54 is configured, for example, by dividing a frame body surrounding the inner frame portion 51 in a top view into multiple portions, and as shown in FIGS. 7 and 9 , each portion has an electrode film 541 made of Al or the like on its upper surface. The multiple outer frame portions 54 are, for example, electrically connected to the inner frame portion 51 via different bridge wirings 42, and wires (not shown) are connected to the electrode films 541. This electrically connects the multiple outer frame portions 54 to an external circuit board (not shown), and enables potential control and voltage detection of the surface electrodes 23 of the microvibrator 2 via the outer frame portions 54 using an external power source (not shown). Note that the number of outer frame portions 54 is not limited to the example shown in FIG. 7 where four are formed, and the number, arrangement, shape, dimensions, etc. of the outer frame portions 54 can be changed as appropriate depending on the number of bridge wirings 42, etc.

[0047] The above is the basic configuration of the inertial sensor 1 of this embodiment. This inertial sensor 1 is formed by measuring the outer dimensions of the micro-vibrator 2, and then aligning the micro-vibrator 2 using alignment marks on the mounting substrate 3 formed based on the numerical values ​​of the outer dimensions, and then mounting the micro-vibrator 2 on the mounting substrate 3. Therefore, even if the outer shape of the rim 211 is not a perfect circle when viewed from above, or if there is an axial misalignment, that is, even if the micro-vibrator 2 is distorted, the variation in the distance between the rim 211 and the multiple electrode portions 53 is reduced.

[0048] [Manufacturing method] Next, a method for manufacturing the inertial sensor 1 of this embodiment will be described. Here, the manufacturing process of the mounting substrate 3 and the mounting process of the micro-vibrator 2 will be mainly described.

[0049] 11G, in order to make it easier to understand the alignment between the micro-vibrator 2 and the mounting substrate 3, components other than the electrode portion 53, the outline of the rim 211, the first alignment mark 24, and the second alignment mark 43 are omitted. In addition, in FIG. 11G, the outlines of the rim 211 and the first alignment mark 24 are indicated by dashed lines, and the first alignment mark 24 is hatched, although this does not show a cross section.

[0050] First, for example, as shown in Fig. 10A, a lower substrate 4 made of heat-resistant borosilicate glass is prepared. Then, the outer dimensions of the micro-vibrator 2 are measured in advance by optical measurement, and an etching mask EM is formed on the surface of the lower substrate 4 according to the outer dimensions of the rim 211 and the support portion 22. Then, by any etching method, such as wet etching using buffered hydrofluoric acid, a frame-shaped groove 41 is formed that follows the outer shape of the rim 211, as shown in Fig. 10B. After the groove 41 is formed, the etching mask EM is removed from the lower substrate 4.

[0051] Next, a metal film 40 spanning the grooves 41 is formed by sputtering on the surface of the lower substrate 4 where the grooves 41 are formed. The metal film 40 is made of Al, for example, with a thickness of about 0.1 μm. Then, for example, a photoresist is applied by spin coating and patterned by photolithography etching to form a resist film R, as shown in FIG. 10C. This resist film R has a pattern shape that covers the region of the metal film 40 from the inner frame portion 51 to the planned position for forming the outer frame portion 54. Next, for example, an etching solution is used to remove the portions of the metal film 40 that are exposed by the resist film R, and the resist film R is then removed with a remover, thereby forming a plurality of bridge wirings 42 spanning the grooves 41, as shown in FIG. 10D.

[0052] Next, as shown in Fig. 10E, for example, a Si substrate (upper substrate 5) made of Si is prepared and anodically bonded to the borosilicate glass lower substrate 4. At this time, the interface between the lower substrate 4 and the upper substrate 5 is also bonded at a cross section other than the portion where the bridge wiring 42 is formed, as shown in Fig. 11A, for example.

[0053] 10F and 11B, a plurality of electrode films 531, 541 are formed on the upper substrate 5 using, for example, a method similar to that used for the bridge wiring 42. Subsequently, a resist film R having a pattern shape that covers only the areas that will become the inner frame portion 51, the plurality of electrode portions 53, and the outer frame portion 54 is formed on the surface of the upper substrate 5 on which the electrode films 531, 541 are formed, for example, by photolithography etching, as shown in FIGS. 10G and 11C. This resist film R can be configured in a predetermined pattern shape that corresponds to the outer shape of the micro-vibrator 2, for example, by using the outer dimensions of the micro-vibrator 2 and a maskless exposure machine to perform pattern exposure and development on the photoresist.

[0054] Thereafter, for example, trench etching is performed by DRIE on the portion of the upper substrate 5 exposed from the resist film R to partially expose the lower substrate 4, and as shown in FIGS. 10H and 11D, the inner frame portion 51, the plurality of electrode portions 53, and the outer frame portion 54 are separated. As a result, the upper substrate 5 has a configuration including the inner frame portion 51, the plurality of electrode portions 53, and the outer frame portion 54. Furthermore, the grooves 41 formed in the lower substrate 4 are exposed from the upper substrate 5 by this partitioning process of the upper substrate 5. DRIE is an abbreviation for Deep Reactive Ion Etching.

[0055] Then, the resist film R is removed with, for example, a stripping liquid to expose the inner frame portion 51, the plurality of electrode portions 53, and the outer frame portion 54, as shown in Figures 10I and 11E. As a result of these steps, the mounting substrate 3 having the above-described structure is obtained.

[0056] Although the above describes an example in which a maskless exposure machine is used in patterning the upper substrate 5, the present invention is not limited to this. For example, a reticle (not shown) may be created based on the external dimensions of the micro-vibrator 2, and a resist film R having a pattern shape may be formed using this. Furthermore, one mounting substrate 3 shown in FIG. 7 and other figures may be obtained by, for example, forming areas on a wafer that will become multiple mounting substrates 3 having the above structure, and then dividing the wafer into individual pieces by dicing or the like. In other words, the manufacturing of the mounting substrate 3 can be handled at the wafer level.

[0057] The mounting substrate 3 manufactured by the above process is suction-fixed to a mounter device (not shown), and as shown in FIG. 11F, a bonding member 52 is placed within the area surrounded by the inner frame portion 51 by a method such as syringe application. Then, for example, the micro-vibrator 2 is transported while being suction-fixed to the suction surfaces 22a of the support portions 22 by a suction jig J of a transport device (not shown). At this time, for example, a part of the imaging device P1 is inserted between the mounting surface 22b of the micro-vibrator 2 and the inner frame portion 51 of the mounting substrate 3, so that the first alignment mark 24 on the mounting surface 22b and the second alignment mark 43 on the mounting substrate 3 can be imaged.

[0058] 11G, the orientation of the micro-oscillator 2 relative to the mounting substrate 3 is determined using the first alignment mark 24 and the second alignment mark 43. Specifically, for example, the orientation of the first alignment mark 24 of the micro-oscillator 2 arranged above the mounting substrate 3 is defined as direction D1, and the orientation of the second alignment mark 43 of the suction-fixed mounting substrate 3 is defined as direction D2. In this case, for example, when the angle θ formed between the directions D1 and D2 is greater than 0°, for example, the orientation of the rim 211 of a micro-oscillator 2 having an elliptical outer shape in top view will be misaligned with respect to the multiple electrode portions 53 of the mounting substrate 3. If this continues, the micro-oscillator 2 will not be able to be mounted on the mounting substrate 3, or even if it can be mounted, there will be significant variation in the spacing between the rim 211 and the multiple electrode portions 53.

[0059] First, while checking the relationship between the directions D1 and D2 of the alignment marks 24 and 43 using, for example, an imaging device P1, the orientation of the micro-oscillator 2 is adjusted using a transport device (not shown) so that the directions D1 and D2 are aligned. Next, as shown in FIG. 11H, for example, the position of the micro-oscillator 2 is adjusted so that the first alignment mark 24 is contained within the outline of the second alignment mark 43 in a top view. At this time, for example, the distances between the outlines of the first alignment mark 24 and the second alignment mark 43 at both ends in the x direction are defined as x1 and x2, and the distances between the ends in the y direction are defined as y1 and y2. The position of the micro-oscillator 2 relative to the mounting substrate 3 is then adjusted so that x1, x2, y1, and y2 are predetermined values ​​(for example, but not limited to, x1 = x2, y1 = y2, etc.). As a result, as shown in FIG. 11G, the micro-oscillator 2 and the mounting substrate 3 are aligned in a top view, and the distances between the rim 211 and the plurality of electrode portions 53 become approximately equal.

[0060] The alignment of the first alignment mark 24 and the second alignment mark 43 can be achieved, for example, by capturing an image using an imaging device P1 and extracting feature points by edge detection using known image processing technology, thereby adjusting the relative positions.

[0061] Finally, for example, the micro-vibrator 2 is lowered toward the mounting substrate 3 that has been heated by a heating mechanism of a mounter device (not shown), and the mounting surface 22b of the support part 22 is brought into contact with the bonding member 52. Thereafter, the mounting substrate 3 is cooled, and the bonding member 52 is solidified, thereby bonding the micro-vibrator 2 to the mounting substrate 3.

[0062] The inertial sensor 1 of this embodiment can be manufactured through the above steps. After molding the micro-vibrator 2, its outer dimensions are measured, and a mounting substrate 3 having multiple electrode portions 53 arranged along the outer shape of the rim 211 is fabricated based on the obtained outer dimension values. Then, by aligning the micro-vibrator 2 and the mounting substrate 3 using the alignment marks 24, 43 and bonding them together, it is possible to reduce variations in the spacing between the rim 211 and the multiple electrode portions 53 even when using a micro-vibrator 2 whose outer shape of the rim 211 is not a perfect circle. Furthermore, even when an axial misalignment occurs in a micro-vibrator 2, it is possible to fabricate a mounting substrate 3 having an inner frame portion 51 and multiple electrode portions 53 that are aligned with the positional relationship between the rim 211 and the support portion 22, thereby reducing variations in the spacing between the rim 211 and the multiple electrode portions 53, as described above. Furthermore, unlike the prior art, there is no need for a step of plating to fill the gaps between the rim 211 of the micro-vibrator 2 and the multiple electrode portions 53, and an etching step to separate them, so scratches on the micro-vibrator 2 due to etching are suppressed.

[0063] According to this embodiment, a micro-oscillator 2 having a first alignment mark 24 is mounted on a mounting substrate 3 having a second alignment mark 43 that pairs with the first alignment mark 24. Even when the micro-oscillator 2 has an irregular shape, such as when the outer shape of the rim 211 is not a perfect circle or when there is axial misalignment, the alignment marks 24 and 43 allow the micro-oscillator 2 and the mounting substrate 3 to be positioned. Furthermore, direct bonding between the rim 211 of the micro-oscillator 2 and the multiple electrode portions 53 and subsequent separation are not required, which reduces damage to the micro-oscillator 2. Therefore, even when the inertial sensor 1 has an irregular micro-oscillator 2, damage to the micro-oscillator 2 is reduced. Furthermore, the multiple electrode portions 53 of the mounting substrate 3 are spaced apart along the outer shape of the rim 211 of the micro-oscillator 2, reducing variation in the distance between the rim 211 and the multiple electrode portions 53.

[0064] (Variation) The inertial sensor 1 may have, for example, a plurality of alignment marks 24, 43 provided on the micro-oscillator 2 and the mounting substrate 3, respectively. For example, as shown in FIG. 12, the micro-oscillator 2 has first alignment marks 24a to 24f provided on the mounting surface 22b, with the first alignment marks 24a to 24f forming a single asymmetric mark as a whole. As shown in FIG. 13, the mounting substrate 3 has second alignment marks 43a to 43e provided at positions corresponding to the first alignment marks 24a to 24e, with the second alignment marks 43a to 43e forming a single asymmetric mark as a whole. Then, as shown in FIG. 14, the position and orientation of the micro-oscillator 2 are adjusted so that the corresponding first alignment marks 24a to 24e are located near the corresponding second alignment marks 43a to 43e. This allows the micro-vibrator 2 and the mounting substrate 3 to be aligned so that the gaps between the rim 211 and the plurality of electrode portions 53 are approximately equal.

[0065] 12 and 14, the first alignment marks 24a to 24f are hatched, although they are not cross-sectional views. In addition, in Fig. 14, the outline of the support column 22 and the outline of the first alignment marks 24a to 24f are indicated by dashed lines.

[0066] 13, the second alignment marks 43a to 43e are preferably all arranged outside the bonding region R1 of the region surrounded by the inner frame portion 51 of the mounting substrate 3 where the mounting surface 22b of the micro-vibrator 2 is bonded, i.e., outside the post 22 after bonding. In other words, the second alignment marks 43a to 43e are preferably arranged outside the portion of the mounting substrate 3 that faces the first alignment marks 24a to 24f, more preferably outside the portion that faces the bottom surface (mounting surface 22b) of the post 22. This is because when the bonding member 52 is applied to the mounting substrate 3, the second alignment marks 43a to 43e are not hidden by the bonding member 52, making it easier to align the micro-vibrator 2 and the mounting substrate 3.

[0067] Note that the multiple first alignment marks 24 and second alignment marks 43 may each have a symmetrical shape as long as they are configured to form a single alignment mark that is asymmetric as a whole. Furthermore, the number and arrangement of the multiple first alignment marks 24 and second alignment marks 43 are not limited to those shown in the drawings and may be changed as appropriate. For example, the multiple first alignment marks 24 and second alignment marks 43 may be arranged in symmetrical positions as a whole, while each mark or some of the marks may have an asymmetrical shape. Furthermore, the multiple first alignment marks 24 and second alignment marks 43 may each have a symmetrical shape, while the multiple marks as a whole may be arranged asymmetrically.

[0068] This modification also provides the inertial sensor 1 with the same effects as those of the first embodiment. In addition, even after the bonding member 52 is placed on the mounting substrate 3, it is possible to easily align the irregular micro-vibrator 2 with the mounting substrate 3.

[0069] (Second embodiment) The inertial sensor 1 of the second embodiment will be described with reference to the drawings. In Fig. 16, similar to Fig. 1, the outline of the part of the mounting substrate 3 that is covered by the micro-vibrator 2 is indicated by a broken line.

[0070] 15, the inertial sensor 1 of this embodiment differs from the first embodiment in that the micro-vibrator 2 does not have a first alignment mark 24 formed thereon, and the support column 22 has a shape that allows alignment with the mounting substrate 3. This difference will be mainly described in this embodiment.

[0071] In the present embodiment, the micro-vibrator 2 has a bottom 221, which is a bottom surface portion of the support 22 including the mounting surface 22b, and the outer shape of the mounting surface 22b, i.e., the bottom 221, is not point-symmetric, with the support 22 itself serving as a positioning portion used for alignment with the mounting substrate 3. The outer shape of the bottom 221 can be formed, for example, by making the outer shape of the upper surface of the support M2 of the mold M not point-symmetric, and is not limited to the outer shape shown in FIG. 15. By orienting the bottom 221 of the support 22 in a predetermined direction when the micro-vibrator 2 is mounted on a mounting substrate 3 oriented in a predetermined direction, the spacing between the rim 211 and the plurality of electrode portions 53 is approximately uniform, as shown in FIG. 16, for example.

[0072] In this embodiment, the mounting substrate 3 may have a second alignment mark 43 corresponding to the shape of the bottom 221, or the shape of the inner wall surface of the inner frame portion 51 may be a shape that follows the outer shape of the bottom 221.

[0073] The inertial sensor 1 of this embodiment also provides the same effects as those of the first embodiment.

[0074] (Third embodiment) The inertial sensor 1 of the third embodiment will be described with reference to the drawings.

[0075] The inertial sensor 1 of this embodiment differs from the first embodiment in that neither the micro-vibrator 2 nor the mounting substrate 3 has alignment marks, and when the micro-vibrator 2 is mounted on the mounting substrate 3, the distance variation between the rim 211 and the electrode portion 53 is adjusted to be equal to or less than a predetermined value. This difference will be mainly described in this embodiment.

[0076] 17 , for example, the micro-vibrator 2 and the mounting substrate 3 are imaged by the imaging device P1 while the micro-vibrator 2 is placed on the mounting substrate 3 while being held by suction. Then, for example, using a known image recognition technique, feature points of the rim 211 of the micro-vibrator 2 are extracted, and the distance to the nearest electrode 53 for each of the extracted feature points is calculated. Next, the position and orientation of the micro-vibrator 2 are adjusted by a conveying device (not shown) so that the distance between each feature point and the nearest electrode 53 is approximately the same. The bonding material 52 is then solidified, bonding the micro-vibrator 2 and the mounting substrate 3. This results in an inertial sensor 1 in which the variation in the distance between the rim 211 and the plurality of electrodes 53 is reduced, even though the micro-vibrator 2 has an irregular shape and does not have the first alignment mark 24, and the mounting substrate 3 does not have the second alignment mark 43.

[0077] The inertial sensor 1 of this embodiment also provides the same effects as those of the first embodiment.

[0078] (Variation) When aligning the micro-vibrator 2 with the mounting substrate 3, instead of measuring the distance between the rim 211 and the plurality of electrode portions 53, the capacitance may be measured and adjusted so that the variation in capacitance between each of the electrode portions 53 and the rim 211 is within a predetermined range.

[0079] 18, for example, a contact portion J1 of a chucking jig J used to chucking and transport the micro-vibrator 2, which contacts the surface electrode 23, is made of a metal material. Meanwhile, a probe P2 is brought into contact with the electrode films 531 of the plurality of electrode portions 53, and with the micro-vibrator 2 mounted on the mounting substrate 3, a voltage is applied to the surface electrode 23 and the plurality of electrode portions 53, and the capacitance of each electrode portion 53 is measured. Then, the position and orientation of the micro-vibrator 2 are adjusted by a transport device (not shown) so that the variation in the measured capacitance is within a predetermined range, and then the bonding material 52 is solidified to bond the micro-vibrator 2 to the mounting substrate 3.

[0080] This modification also provides the inertial sensor 1 that can achieve the same effects as those of the third embodiment.

[0081] (Other embodiments) Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and modifications within the scope of equivalents. In addition, various combinations and forms, as well as other combinations and forms including only one element, more than one, or less than one, are also within the scope and spirit of the present disclosure.

[0082] It goes without saying that in each of the above embodiments, the elements constituting the embodiments are not necessarily essential unless they are specifically stated as essential or are clearly considered essential in principle. Furthermore, in each of the above embodiments, when numerical values ​​such as the number, values, amounts, and ranges of the components of the embodiments are mentioned, they are not limited to the specific numbers unless they are specifically stated as essential or are clearly limited to a specific number in principle. Furthermore, in each of the above embodiments, when the shapes, positional relationships, etc. of the components are mentioned, they are not limited to the shapes, positional relationships, etc., unless they are specifically stated or are clearly limited to a specific shape, positional relationship, etc. in principle.

[0083] (Features of the present invention) [Claim 1] A method for manufacturing an inertial sensor, comprising: A micro-vibrator (2) is provided, which has a curved surface portion (21) having a hemispherical three-dimensional curved surface and a support portion (22) extending from the curved surface portion toward the inside of the hemispherical shape; Measuring the outer dimensions of the prepared micro-vibrator; preparing a mounting substrate (3) having a plurality of electrode portions (53) and on which the micro-vibrator is mounted; and mounting the micro-vibrator on the mounting substrate in a state in which the micro-vibrator is surrounded by a plurality of the electrode portions at a distance from each other, In preparing the mounting substrate, a method for manufacturing an inertial sensor includes forming a plurality of electrode portions at positions spaced a predetermined distance from a rim (211), which is the end of the curved portion of the micro-vibrator opposite the support portion, based on the external dimensions of the micro-vibrator obtained by measurement. [Claim 2] 2. The method for manufacturing an inertial sensor according to claim 1, wherein the forming of the plurality of electrode portions is performed by patterning using a maskless exposure machine based on external dimension values ​​of the micro-vibrator obtained by measurement. [Claim 3] 2. The method for manufacturing an inertial sensor according to claim 1, wherein forming the plurality of electrode portions comprises creating a mask based on the measured external dimensions of the micro-vibrator, and performing patterning using the mask. [Claim 4] 4. The method for manufacturing an inertial sensor according to claim 1, wherein, when mounting the micro-vibrator on the mounting substrate, a distance between the rim of the micro-vibrator and the plurality of electrode portions of the mounting substrate is measured, and the micro-vibrator and the mounting substrate are aligned. [Claim 5] In preparing the micro-vibrator, a first alignment mark (24) is provided on a mounting surface (22b) of the support portion that faces the mounting substrate; In preparing the mounting substrate, the mounting substrate is provided with a second alignment mark (43) that forms a pair with the first alignment mark; 4. The method for manufacturing an inertial sensor according to claim 1, wherein, when mounting the micro-vibrator on the mounting substrate, the first alignment mark and the second alignment mark are used to align the micro-vibrator with the mounting substrate. [Claim 6] 4. The method for manufacturing an inertial sensor according to claim 1, wherein, when mounting the micro-vibrator on the mounting substrate, a capacitance between the rim of the micro-vibrator and the plurality of electrode portions of the mounting substrate is measured, and the micro-vibrator and the mounting substrate are aligned. [Claim 7] An inertial sensor, a micro-vibrator (2) having a curved surface portion (21) having a hemispherical three-dimensional curved surface and a support portion (22) extending from the curved surface portion toward the inside of the hemispherical shape; a mounting substrate (3) having a plurality of electrode portions (53) and to which a part of the micro-vibrator is connected; the end of the curved surface portion opposite to the support portion is a rim (211), the surface of the mounting substrate to which the support portion is bonded is a bonding surface, the micro-vibrator has a first alignment mark (24) used for alignment with the mounting substrate, and when viewed from a normal direction to the bonding surface, the outer shape of the rim is a shape other than a perfect circle, or the support portion is formed at a position other than the center of the curved surface, the mounting substrate has a second alignment mark (43) that forms a pair with the first alignment mark, An inertial sensor, wherein the plurality of electrode portions are arranged apart from one another along the outer shape of the rim. [Claim 8] 8. The inertial sensor according to claim 7, wherein the first alignment mark is formed on the support column. [Claim 9] 9. The inertial sensor according to claim 7, wherein a plurality of the first alignment marks and a plurality of the second alignment marks are formed and are arranged asymmetrically as a whole. [Claim 10] 10. The inertial sensor according to claim 7, wherein the second alignment mark is arranged in an area of ​​the mounting substrate that is outside an area facing the first alignment mark. [Claim 11] the rim has an outer shape that is different from a perfect circle when viewed in a normal direction to a surface of the mounting substrate to which the support portion is joined, 11. The inertial sensor according to claim 7, wherein the plurality of electrode portions are arranged along an outer shape of the rim. [Claim 12] An inertial sensor, a micro-vibrator (2) having a curved surface portion (21) having a hemispherical three-dimensional curved surface and a support portion (22) extending from the curved surface portion toward the inside of the hemispherical shape; a mounting substrate (3) having a plurality of electrode portions (53) and to which a part of the micro-vibrator is connected; The end of the curved surface portion opposite to the support portion is a rim (211), and the surface of the mounting substrate to which the support portion is bonded is a bonding surface, and when viewed from a normal direction to the bonding surface, the micro-vibrator has an outer shape of the rim that is different from a perfect circle, or the support portion is formed at a position different from the center of the curved surface, The inertial sensor comprises a mounting surface (22b) of the support portion facing the mounting board, the mounting surface (22b) having an asymmetrical outer shape and serving as an alignment portion (221) used for alignment with the mounting board. [Explanation of symbols]

[0084] 2 Micro vibrator 21 Curved part 211 Rim 22 Pillar section 221 Alignment part (bottom) 22b Mounting surface 24 First alignment mark 3 Mounting board 43 Second alignment mark 53 Electrode section

Claims

1. A method for manufacturing an inertial sensor, comprising: A micro-vibrator (2) is prepared, which has a curved surface portion (21) having a hemispherical three-dimensional curved surface and a support portion (22) extending from the curved surface portion toward the inside of the hemispherical shape; Measuring the outer dimensions of the prepared micro-vibrator with respect to the overall outer shape including the rim (211) which is the end of the curved surface portion of the micro-vibrator opposite to the support portion and the support portion; preparing a mounting substrate (3) having a plurality of electrode portions (53) and on which the micro-vibrator is mounted; and mounting the micro-vibrator on the mounting substrate in a state in which the micro-vibrator is surrounded by a plurality of the electrode portions at a distance from each other, In preparing the mounting substrate, a method for manufacturing an inertial sensor includes forming a plurality of electrode portions at positions spaced a predetermined distance from a rim (211), which is the end of the curved portion of the micro-vibrator opposite the support portion, based on the external dimensions of the micro-vibrator obtained by measurement.

2. 2. The method for manufacturing an inertial sensor according to claim 1, wherein the formation of the plurality of electrode portions is performed by patterning using a maskless exposure machine based on external dimension values ​​of the micro-vibrator obtained by measurement.

3. 2. The method for manufacturing an inertial sensor according to claim 1, wherein the formation of the plurality of electrode portions comprises creating a mask based on the measured external dimensions of the micro-vibrator, and performing patterning using the mask.

4. 4. The method for manufacturing an inertial sensor according to claim 1, wherein, when mounting the micro-vibrator on the mounting substrate, a distance between the rim of the micro-vibrator and the plurality of electrode portions of the mounting substrate is measured, and the micro-vibrator and the mounting substrate are aligned.

5. In preparing the micro-vibrator, a first alignment mark (24) is provided on a mounting surface (22b) of the support portion that faces the mounting substrate; In preparing the mounting substrate, the mounting substrate is provided with a second alignment mark (43) that forms a pair with the first alignment mark; 4. The method for manufacturing an inertial sensor according to claim 1, wherein when mounting the micro-vibrator on the mounting substrate, the first alignment mark and the second alignment mark are used to align the micro-vibrator with the mounting substrate.

6. 4. The method for manufacturing an inertial sensor according to claim 1, wherein, when mounting the micro-vibrator on the mounting substrate, a capacitance between the rim of the micro-vibrator and the plurality of electrode portions of the mounting substrate is measured, and the micro-vibrator and the mounting substrate are aligned.

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