Ceiling-integrated floor panel structure and ceiling-integrated floor panel installation method

Abstract

To provide a ceiling integral floor panel structure and a construction method of a ceiling integral floor panel, capable of improving sound insulation properties while improving workability.SOLUTION: A ceiling integral floor panel structure comprises: a floor panel 11 constituting an upper story floor and having a small beam part 11b fixed on a girder 2 of a building A; a ceiling substrate 12 constituting a ceiling on a lower story and temporarily fixable to the floor panel 11; and height adjustment parts (height adjustment mechanisms 20) supporting the ceiling substrate 12 so as to be able to adjust a height position of the ceiling substrate 12 in which the temporal fixation to the floor panel 11 is released.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a ceiling-integrated floor panel structure in which the members constituting the floor of an upper floor and the members constituting the ceiling of a lower floor are integrally formed, and to a technique for a method of constructing a ceiling-integrated floor panel. [Background technology]

[0002] BACKGROUND ART Conventionally, a member in which a member constituting the floor of an upper floor and a member constituting the ceiling of a lower floor are integrated has been known, as described in Patent Document 1, for example.

[0003] Patent Document 1 describes a ceiling-cum-floor panel structure that includes a floor panel frame that supports floor panels on an upper floor and a ceiling support beam fixed to the floor panel frame to support ceiling panels on a lower floor. The ceiling-cum-floor panel structure is formed by transporting a ceiling-cum-floor panel frame material formed by previously integrating the floor panel frame and ceiling support beam in a factory or the like to a construction site, and then fixing the ceiling-cum-floor panel frame material to the construction location. This reduces manual labor at the construction site, thereby improving workability.

[0004] From the viewpoint of sound insulation, it is desirable to secure a certain degree of gap between the floor of the upper floor and the ceiling of the lower floor. Therefore, it is conceivable to form a relatively large distance between the floor panel and the ceiling panel. However, if the vertical dimension of the ceiling-cum-floor panel frame material becomes large, it becomes difficult to secure storage space and work space on-site, and it is thought that this may impair workability. Therefore, a ceiling-integrated floor panel structure and a construction method for ceiling-integrated floor panels that can improve workability while also improving sound insulation are desired. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 7-158189 Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention was made in consideration of the above-mentioned circumstances, and the problem it aims to solve is to provide a ceiling-integrated floor panel structure and a method for installing ceiling-integrated floor panels that can improve sound insulation while improving workability. [Means for solving the problem]

[0007] The problem to be solved by the present invention is as described above, and the means for solving this problem will now be described.

[0008] That is, in claim 1, a floor panel that constitutes the floor of the upper floor and has a small beam portion that is fixed to the main beam of the building, a ceiling substructure that constitutes the ceiling of the lower floor and can be temporarily fixed to the floor panel, and a height adjustment unit that supports the ceiling substructure so that the height position of the ceiling substructure that has been released from the temporary fixation to the floor panel can be adjusted. a vibration-isolating member having vibration-isolating properties, the vibration-isolating member being arranged to connect the ceiling substrate and the height adjustment unit; It is equipped with the following.

[0009] In claim 2, The building comprises: a floor panel that constitutes the floor of the upper floor and has a small beam portion that is fixed to the main beam of the building; a ceiling substructure that constitutes the ceiling of the lower floor and can be temporarily fixed to the floor panel; and a height adjustment unit that supports the ceiling substructure so that the height position of the ceiling substructure that has been released from temporary fixation to the floor panel can be adjusted, and the height adjustment unit is fixed to the main beam. It is something.

[0010] In claim 3, The floor panel has a panel portion that is fixed to the upper surface of the small beam portion and forms a floor base, and the small beam portion and the panel portion are made of wood-based material. It is something.

[0011] In claim 4, a ceiling-integrated floor panel installation process for installing a ceiling-integrated floor panel comprising a floor panel having a minor beam portion constituting the floor of an upper floor and a ceiling substructure constituting the ceiling of a lower floor and capable of being temporarily fixed to the floor panel by fixing the minor beam portion to the main beam of the building while the ceiling substructure is temporarily fixed to the floor panel; a temporary fixation release process for releasing the temporary fixation of the ceiling substructure to the floor panel; a height position adjustment process for adjusting the height position of the ceiling substructure using a height adjustment unit capable of adjusting the height position of the ceiling substructure; and a vibration-isolating member placement process for arranging a vibration-isolating member having vibration-isolating properties so as to connect the ceiling substructure and the height adjustment unit. It is equipped with the following.

[0012] In claim 5, the method includes a ceiling-integrated floor panel mounting step of mounting a ceiling-integrated floor panel including a floor panel having a small beam portion constituting the floor of an upper floor and a ceiling substructure constituting the ceiling of a lower floor and capable of being temporarily fixed to the floor panel by fixing the small beam portion to a main beam of a building in a state where the ceiling substructure is temporarily fixed to the floor panel; a temporary fixation releasing step of releasing the temporary fixation of the ceiling substructure to the floor panel; and a height position adjusting step of adjusting the height position of the ceiling substructure using a height adjusting unit capable of adjusting the height position of the ceiling substructure. The height adjustment unit is fixed to the main beam. It is something. [Effects of the Invention]

[0013] The present invention has the following effects.

[0014] According to claim 1, it is possible to improve the sound insulation while improving the workability.

[0015] In claim 2, This allows for improved workability and sound insulation, and also ensures a relatively large distance over which the height position of the ceiling substrate can be adjusted.

[0016] In claim 3, This makes it easier to fix the small beam portion and the panel portion together.

[0017] In claim 4, It is possible to improve sound insulation while improving workability.

[0018] In claim 5, This allows for improved workability and sound insulation, and also ensures a relatively large distance over which the height position of the ceiling substrate can be adjusted. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a bottom perspective view showing a ceiling-integrated floor panel structure according to one embodiment of the present invention. [Figure 2] FIG. 1 is a front view showing the ceiling-integrated floor panel structure. [Figure 3] An enlarged front view showing the ceiling-integrated floor panel structure. [Figure 4] 1 is a flowchart showing a method for installing ceiling-integrated floor panels. [Figure 5] FIG. 10 is a front view showing the ceiling-integrated floor panel installation process. [Figure 6] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0020] A ceiling-integrated floor panel structure 1 according to one embodiment of the present invention will be described below with reference to Figures 1 to 6. In the following description, the front-rear direction, left-right direction, and up-down direction will be defined based on the arrows in the figures.

[0021] The ceiling-integrated floor panel structure 1 according to this embodiment is a structure of ceiling-integrated floor panels 10 that form the floors of the upper floors and the ceilings of the lower floors of a steel-framed building A.

[0022] First, building A will be described below using FIGS. 1 to 3.

[0023] The columns and beams that make up the framework of Building A are made of steel members. Building A has multiple floors. Hereinafter, the upper floor of two adjacent floors will be referred to as the "upper floor" and the lower floor as the "lower floor."

[0024] The beams of building A include girders 2 that connect the columns together. The girders 2 are H-shaped steel frame members. Figures 1 and 2 show a pair of girders 2 that extend in the front-to-rear direction and are spaced apart in the left-to-right direction. The girders 2 are provided with gusset plates 3.

[0025] The gusset plate 3 is a member capable of connecting the main girder 2 and the secondary girder. The gusset plate 3 is formed in a generally plate shape with the plate surface facing in the front-to-rear direction. The gusset plate 3 is provided on each opposing surface of the pair of main girder 2. Furthermore, a plurality of gusset plates 3 are provided at intervals in the front-to-rear direction of each main girder 2. In this embodiment, a total of four gusset plates 3 are shown (see Figures 1 and 2).

[0026] 3, the gusset plate 3 has insertion holes 3a that penetrate in the front-rear direction and through which fasteners such as bolts can be inserted. A plurality of the insertion holes 3a (five in the illustrated example) are formed at intervals in the up-down direction.

[0027] Next, the details of the ceiling-integrated floor panel structure 1 will be described using Figures 1 to 3, 5 and 6. In the ceiling-integrated floor panel structure 1, the members constituting the floor of the upper floor (floor panel 11 described later) and the members constituting the ceiling of the lower floor (ceiling substrate 12 described later) can be attached to the target beam 2 in a state where they are temporarily fixed together (see Figures 2 and 5). Furthermore, in the ceiling-integrated floor panel structure 1, after the above members are attached, the temporary fixed state can be released and the height position of the members constituting the ceiling (ceiling substrate 12 described later) can be lowered (see Figure 6). The ceiling-integrated floor panel structure 1 according to this embodiment mainly comprises a ceiling-integrated floor panel 10 and a height adjustment mechanism 20.

[0028] The ceiling-integrated floor panel 10 shown in Figures 1 and 2 is formed by integrating the members (floor panel 11) that make up the floor of the upper floor and the members (ceiling substructure 12) that make up the ceiling of the lower floor. The ceiling-integrated floor panel 10 is placed between a pair of girders 2 that are adjacent to each other on the left and right. A plurality of ceiling-integrated floor panels 10 are provided in parallel in the horizontal direction (not shown). The ceiling-integrated floor panel 10 is fixed to the girders 2 via four gusset plates 3. The ceiling-integrated floor panel 10 comprises the floor panel 11 and the ceiling substructure 12.

[0029] The floor panel 11 constitutes the floor (floor base) of the upper floor. The floor panel 11 includes a panel portion 11a and a small beam portion 11b.

[0030] The panel portion 11a constitutes the upper portion of the floor panel 11. The panel portion 11a is formed in a generally board shape with the board surface facing up and down. The panel portion 11a is formed in a generally rectangular shape when viewed from above (bottom). The panel portion 11a is made of various wood-based materials such as plywood, particle board, and medium-density fiberboard (MDF). After the construction of the ceiling-integrated floor panel 10 is completed, a predetermined floor finishing material or the like is provided on the upper surface of the panel portion 11a.

[0031] The minor beam portion 11b constitutes the lower portion of the floor panel 11. The minor beam portion 11b is formed in a shape that is long in the left-right direction. The minor beam portion 11b is formed from a wood-based material. The panel portion 11a is fixed to the upper surface of the minor beam portion 11b. A pair of minor beam portions 11b are provided so as to be located at the front end and rear end of the panel portion 11a.

[0032] The minor beam portion 11b functions as a beam (minor beam) connecting the pair of main girders 2. Both left and right ends of the minor beam portion 11b are fixed to the upper portion of the gusset plate 3. The minor beam portion 11b and the gusset plate 3 are fixed together with fasteners such as bolts and nuts that pass through the minor beam portion 11b and the gusset plate 3 (upper insertion holes 3a).

[0033] By configuring the floor panel 11 with the panel portion 11a and the minor beam portion 11b as described above, a horizontal structural surface can be ensured without providing reinforcing materials such as horizontal braces. In addition, because the panel portion 11a and the minor beam portion 11b are made of wood-based materials, each portion can be easily fixed together.

[0034] The ceiling substructure 12 constitutes the ceiling of the lower floor. The ceiling substructure 12 is formed by combining long components in the front-to-back and left-to-right directions in a lattice pattern. The ceiling substructure 12 has an outer shape that is approximately rectangular when viewed from above (bottom). After the installation of the ceiling-integrated floor panel 10 is completed, a predetermined ceiling board or the like is installed on the underside of the ceiling substructure 12. The ceiling substructure 12 has a recess 12a.

[0035] 2 and 3 are portions recessed upward on the underside of both left and right ends of the ceiling substrate 12. The recesses 12a are formed by cutting out the lower portions of both left and right ends of the ceiling substrate 12. The recesses 12a are formed over the entire ceiling substrate 12 in the front-to-rear direction.

[0036] The ceiling substructure 12 is temporarily fixed to the floor panel 11 below the floor panel 11. In other words, the ceiling substructure 12 is fixed integrally to the floor panel 11 in a manner that allows it to be removed. The ceiling substructure 12 is temporarily fixed to the floor panel 11 using a predetermined fastener (not shown). Various fasteners such as nails, bolts and nuts, and predetermined metal fittings can be used as the fastener. Figures 2, 3, and 5 schematically show the state in which the ceiling substructure 12 is temporarily fixed to the floor panel 11. Note that although the above figures show the ceiling substructure 12 and the floor panel 11 spaced apart from each other, the ceiling substructure 12 and the floor panel 11 may also abut against each other.

[0037] The height adjustment mechanism 20 shown in Figures 1 to 3 supports the ceiling substructure 12 so that the height (vertical position) of the ceiling substructure 12, which has been released from its temporary fixation to the floor panel 11, can be adjusted. The height adjustment mechanism 20 is fixed to each of the four gusset plates 3. In other words, four height adjustment mechanisms 20 are provided for one ceiling-integrated floor panel 10. The height adjustment mechanism 20 comprises a plate 21, an anti-vibration hanger 22, and a stopper 23.

[0038] The plate 21 is a generally plate-shaped member with its plate surface facing the front-rear direction. When viewed from the front, the plate 21 is formed into a generally rectangular shape that is long in the vertical direction. The plate 21 is made of metal. The plate 21 is fixed to the lower portion of the front surface of each gusset plate 3 (see Figures 1 and 2). The plate 21 is fixed to the gusset plate 3 by, for example, welding. Note that instead of welding, the gusset plate 3 and the plate 21 may be fixed with fasteners such as bolts and nuts. The plate 21 has a long hole 21a.

[0039] The elongated holes 21a penetrate the plate 21 in the front-rear direction. The elongated holes 21a are formed to extend in the up-down direction. As shown in Fig. 3, the elongated holes 21a are provided so as to overlap with the insertion holes 3a (the three insertion holes 3a located on the lower side) of the gusset plate 3 in a front view.

[0040] The vibration-isolating suspender 22 connects the ceiling substructure 12 and the plate 21. The vibration-isolating suspender 22 is disposed between the ceiling substructure 12 and the plate 21. The vibration-isolating suspender 22 is an elastically deformable leaf spring that has vibration-isolating properties. The vibration-isolating suspender 22 is formed by appropriately bending a metal plate-shaped member that is long in the left-right direction. As shown in FIG. 3, the vibration-isolating suspender 22 is formed in a substantially S-shape when viewed from the front.

[0041] The vibration-isolating hangers 22 are installed so as to connect the four corners of the ceiling substrate 12 in a bottom view to the four plates 21 (see FIG. 1). That is, a total of four vibration-isolating hangers 22 are installed. The vibration-isolating hangers 22 are installed so as to be located on the opposing surfaces of the front and rear plates 21 (the rear surface side of the front plate 21 and the front surface side of the rear plate 21).

[0042] 3, the inner end portion of the vibration-isolating hanger 22 in the left-right direction (the end portion opposite the girder 2) is fixed to the underside of the recess 12a of the ceiling substrate 12. The vibration-isolating hanger 22 is fixed to the recess 12a by fasteners (not shown), such as nails or screws, that are inserted through holes formed in the vibration-isolating hanger 22, for example.

[0043] Furthermore, the vibration-isolating suspender 22 has fixing portions 22a at its outer left-right ends (the ends on the girder 2 side) that are fixed to the plate 21. The fixing portions 22a have insertion holes 22b that penetrate in the front-rear direction. The fixing portions 22a may be formed integrally with the vibration-isolating suspender 22, or may be formed separately from the vibration-isolating suspender 22.

[0044] The fasteners 23 secure the plate 21 and the vibration-isolating hanger 22. For example, bolts and nuts can be used as the fasteners 23. The plate 21 and the vibration-isolating hanger 22 are fastened together by the fasteners 23 inserted through the elongated holes 21a and the insertion holes 22b.

[0045] When the fastening by the stoppers 23 is released by loosening the bolts and nuts, for example, the height positions of the stoppers 23 and the vibration-isolating hanger 22 can be changed within the range of the elongated holes 21a. Furthermore, by fastening the stoppers 23 at a desired height position, the plate 21 and the vibration-isolating hanger 22 are fixed to each other at that position. In this way, the height adjustment mechanism 20 can adjust the height position of the vibration-isolating hanger 22.

[0046] In addition, by adjusting the height position using the height adjustment mechanism 20 while the vibration-proof hanger 22 is fixed to the ceiling substructure 12, the height position of the ceiling substructure 12, which has been released from temporary fixation, can be adjusted (see Figure 6).

[0047] Next, a method for installing the ceiling-integrated floor panel 10 will be described with reference to Figures 2 to 6. As shown in Figure 4, the method for installing the ceiling-integrated floor panel 10 includes a ceiling-integrated floor panel installation step (step S10), a temporary fixation release step (step S11), and a height position adjustment step (step S12).

[0048] The ceiling-integrated floor panel installation process (step S10) is a process of installing the ceiling-integrated floor panel 10 on the side of the girder 2. As shown in Figure 5, in the ceiling-integrated floor panel installation process, a worker moves the ceiling-integrated floor panel 10, which has been lifted by a predetermined crane (not shown), to the fixing point on the girder 2.

[0049] In the ceiling-integrated floor panel installation process, the ceiling base 12 of the ceiling-integrated floor panel 10 is temporarily fixed to the floor panel 11. This temporary fixing is performed, for example, at a specified factory. Also, in the ceiling-integrated floor panel installation process, the height adjustment mechanism 20 is fixed to the gusset plate 3. At this time, the stopper 23 and the vibration-isolating hanger 22 are located at the upper end of the elongated hole 21a of the plate 21.

[0050] In the ceiling-integrated floor panel installation process, a worker fixes both left and right ends of the minor beam portion 11b of the ceiling-integrated floor panel 10 to the upper portion of the gusset plate 3 using fasteners (see Figures 2 and 3). This attaches the ceiling-integrated floor panel 10 to the main beam 2 via the gusset plate 3.

[0051] Furthermore, in the ceiling-integrated floor panel installation process, the worker fixes the vibration-isolating hanger 22 to the recess 12a of the ceiling base 12. At this time, the worker adjusts the height position of the vibration-isolating hanger 22 as necessary so that the vibration-isolating hanger 22 can be fixed to the recess 12a.

[0052] The temporary fixation releasing step (step S11) is a step of releasing the temporary fixation of the ceiling substrate 12 to the floor panel 11 of the ceiling-integrated floor panel 10. The temporary fixation is released by removing the fasteners used for the temporary fixation.

[0053] When the temporary fixation is released, the restriction on downward movement of the ceiling substrate 12 by the stoppers is released. In this state, the ceiling substrate 12 is supported by the height adjustment mechanism 20.

[0054] The height position adjustment process (step S12) is a process of adjusting the height position of the ceiling substructure 12 using the height adjustment mechanism 20. As shown in FIG. 6, the worker can change the height position of the ceiling substructure 12 within the range of the elongated holes 21a of the plate 21 by releasing the fastening with the fasteners 23. The worker can also fix the ceiling substructure 12 at a desired height position by fastening with the fasteners 23. The worker can adjust the height position so that, for example, the underside of the ceiling substructure 12 is approximately flush with the underside of the ceiling substructure 12 of the adjacent ceiling-integrated floor panel 10.

[0055] FIG. 6 shows an example in which the ceiling substrate 12 is lowered so that the stopper 23 and the vibration-isolating hanger 22 are positioned at the lower end of the elongated hole 21 a of the plate 21 .

[0056] By carrying out the above-described steps, the installation of the ceiling-integrated floor panel 10 is completed. After the ceiling-integrated floor panel 10 is installed, the worker can install a predetermined ceiling board on the underside of the ceiling substrate 12. The worker can also install a predetermined floor finishing material on the upper surface of the panel portion 11a of the floor panel 11.

[0057] According to the ceiling-integrated floor panel structure 1 (construction method for the ceiling-integrated floor panel 10) of this embodiment, the ceiling-integrated floor panel 10 can be attached to the girder 2 side in a compact state in which the ceiling substrate 12 is temporarily fixed to the floor panel 11. This saves work space and makes the ceiling-integrated floor panel 10 easier to transport, improving workability. Furthermore, the ceiling-integrated floor panel 10 in the above-mentioned temporarily fixed, compact state makes it easy to secure storage space for the ceiling-integrated floor panel 10.

[0058] Furthermore, after the ceiling-integrated floor panel 10 is attached to the girder 2 side, the height position of the ceiling substrate 12 can be lowered by the height adjustment mechanism 20. This allows a relatively large distance to be secured between the floor panel 11 and the ceiling substrate 12, improving sound insulation between the upper and lower floors.

[0059] Furthermore, in this embodiment, the ceiling substrate 12 and the height adjustment mechanism 20 are connected via the vibration-isolating hanger 22. This can further improve sound insulation.

[0060] Furthermore, in this embodiment, the height adjustment mechanism 20 is provided on the girder 2 side (gusset plate 3). This makes it easier to ensure a large distance over which the height position of the ceiling substrate 12 can be adjusted. That is, for example, if the height adjustment mechanism 20 is provided on the ceiling-integrated floor panel 10 side, increasing the vertical dimension of the height adjustment mechanism 20 may hinder transportation and installation of the ceiling-integrated floor panel 10. On the other hand, if the height adjustment mechanism 20 is provided on the girder 2 side as in this embodiment, the dimension of the height adjustment mechanism 20 does not affect transportation and installation of the ceiling-integrated floor panel 10. Therefore, the vertical dimension of the height adjustment mechanism 20 can be increased to ensure a relatively large distance over which the height position of the ceiling substrate 12 can be adjusted.

[0061] As described above, the ceiling-integrated floor panel structure 1 according to one embodiment of the present invention is as follows: A floor panel 11 that constitutes the floor of the upper floor and has a small beam portion 11b fixed to the main beam 2 of the building A; A ceiling base 12 that constitutes the ceiling of the lower floor and can be temporarily fixed to the floor panel 11; a height adjustment unit (height adjustment mechanism 20) that supports the ceiling substrate 12 so as to adjust the height position of the ceiling substrate 12 after the temporary fixation to the floor panel 11 is released; It is equipped with the following.

[0062] This configuration improves workability and sound insulation. That is, the floor panel 11 and the ceiling substructure 12 (ceiling-integrated floor panel 10) can be attached to the girder 2 side in a compact state in which the ceiling substructure 12 is temporarily fixed to the floor panel 11. This saves work space and makes the ceiling-integrated floor panel 10 easier to transport, improving workability. In addition, the temporarily fixed state makes it easier to secure storage space for the ceiling-integrated floor panel 10. Furthermore, after the floor panel 11 and the ceiling substructure 12 are attached to the girder 2 side, the height position of the ceiling substructure 12 can be lowered by the height adjustment mechanism 20. This allows a relatively large distance to be secured between the floor panel 11 and the ceiling substructure 12, improving sound insulation between the upper and lower floors.

[0063] In addition, the ceiling-integrated floor panel structure 1 The ceiling base 12 and the height adjustment unit (height adjustment mechanism 20) are arranged to connect to each other, and the height adjustment unit is provided with a vibration-isolating member (vibration-isolating hanger 22) having vibration-isolating properties.

[0064] With this configuration, sound insulation can be further improved.

[0065] The height adjustment unit (height adjustment mechanism 20) It is fixed to the main beam 2.

[0066] This configuration makes it easy to form the height adjustment mechanism 20 long in the vertical direction, and ensures a relatively large distance over which the height position of the ceiling substrate 12 can be adjusted.

[0067] In addition, the floor panel 11 is The panel portion 11a is fixed to the upper surface of the small beam portion 11b and forms the floor base. The small beam portion 11b and the panel portion 11a are made of wood-based material.

[0068] This configuration makes it easier to fix the small beam portion 11b and the panel portion 11a together.

[0069] Furthermore, the method for installing the ceiling-integrated floor panel 10 according to one embodiment of the present invention is as follows: A ceiling-integrated floor panel installation process (step S10) is performed to install a ceiling-integrated floor panel 10, which includes a floor panel 11 having a small beam portion and constituting the floor of the upper floor, and a ceiling base 12 that can be temporarily fixed to the floor panel 11, by fixing the small beam portion 11b to a main beam 2 of the building A in a state where the ceiling base 12 is temporarily fixed to the floor panel 11; A temporary fixation releasing process (step S11) of releasing the temporary fixation of the ceiling base 12 to the floor panel 11; a height position adjustment step (step S12) of adjusting the height position of the ceiling substructure 12 using a height adjustment unit (height adjustment mechanism 20) that can adjust the height position of the ceiling substructure 12; It is equipped with the following.

[0070] This configuration improves workability while improving sound insulation. That is, the floor panel 11 and the ceiling substructure 12 (ceiling-integrated floor panel 10) can be attached to the girder 2 side in a compact state in which the ceiling substructure 12 is temporarily fixed to the floor panel 11. This prevents the work space from becoming too large and makes the ceiling-integrated floor panel 10 easier to transport, improving workability. Furthermore, in the temporarily fixed state, it is easy to ensure storage space for the ceiling-integrated floor panel 10. Furthermore, after the floor panel 11 and the ceiling substructure 12 are attached to the girder 2 side, the height position of the ceiling substructure 12 can be lowered by the height adjustment mechanism 20. This allows a relatively large distance to be secured between the floor panel 11 and the ceiling substructure 12, improving sound insulation between the upper and lower floors.

[0071] The vibration-isolating hanger 22 in this embodiment is one form of the vibration-isolating member according to the present invention. The height adjustment mechanism 20 according to this embodiment is one form of a height adjustment section according to the present invention.

[0072] Although one embodiment of the present invention has been described above, the present invention is not limited to the above configuration, and various modifications are possible within the scope of the invention described in the claims.

[0073] For example, in this embodiment, the ceiling substrate 12 and the height adjustment mechanism 20 are connected via the vibration-isolating hanger 22, but this is not limited to this. For example, the ceiling substrate 12 and the height adjustment mechanism 20 may be connected via a member that does not have vibration-isolating properties.

[0074] In addition, in this embodiment, an example has been shown in which the height adjustment mechanism 20 is fixed to the gusset plate 3, but this is not limited to this. For example, the height adjustment mechanism 20 may be fixed to the girder 2. Also, for example, the height adjustment mechanism 20 may be fixed to the ceiling-integrated floor panel 10.

[0075] In addition, in the present embodiment, the beam portion 11b and the panel portion 11a are formed of a wood-based material, but the present invention is not limited to this. Various materials, such as metal materials, can be used as the material for the beam portion 11b and the panel portion 11a.

[0076] In addition, in this embodiment, an example is shown in which no reinforcing material such as a horizontal brace is provided on the floor panel 11, but this is not limited to this form, and the floor panel 11 may be provided with a reinforcing material such as a horizontal brace.

[0077] In addition, in this embodiment, an example is shown in which the ceiling substructure 12 and the floor panel 11 are temporarily fixed at a designated factory, but this is not limited to such a form, and the ceiling substructure 12 and the floor panel 11 may be temporarily fixed at the construction site, for example.

[0078] Furthermore, in this embodiment, an example has been shown in which the vibration-isolating hanger 22 is fixed to the ceiling substructure 12 before the temporary fixation of the ceiling substructure 12 to the floor panel 11 is released (temporary fixation releasing process), but this is not limited to such an embodiment. For example, the vibration-isolating hanger 22 may be fixed to the ceiling substructure 12 after the temporary fixation releasing process has been carried out. [Explanation of symbols]

[0079] 1. Ceiling-integrated floor panel structure 2 girder 3 Gusset Plate 10 Ceiling-integrated floor panel 20 Height adjustment mechanism

Claims

1. a floor panel that constitutes the floor of the upper floor and has a small beam portion that is fixed to the main beam of the building; A ceiling base that constitutes the ceiling of the lower floor and can be temporarily fixed to the floor panel; a height adjustment unit that supports the ceiling substrate so as to be able to adjust the height position of the ceiling substrate after the temporary fixation to the floor panel is released; a vibration-isolating member having vibration-isolating properties, the vibration-isolating member being arranged to connect the ceiling substrate and the height adjustment unit; Equipped with Ceiling-integrated floor panel structure.

2. A floor panel that constitutes the floor of the upper floor and has a small beam portion fixed to the main beam of the building; A ceiling base that constitutes the ceiling of the lower floor and can be temporarily fixed to the floor panel; a height adjustment unit that supports the ceiling substrate so as to be able to adjust the height position of the ceiling substrate after the temporary fixation to the floor panel is released; Equipped with The height adjustment unit is fixed to the girder; Ceiling-integrated floor panel structure.

3. The floor panel is A panel portion is fixed to the upper surface of the small beam portion and forms a floor base, The beam portion and the panel portion are formed of wood-based materials.

3. A ceiling-integrated floor panel structure according to claim 1 or 2.

4. A ceiling-integrated floor panel installation process for installing a ceiling-integrated floor panel comprising a floor panel having a small beam portion constituting the floor of an upper floor and a ceiling substructure constituting the ceiling of a lower floor and capable of being temporarily fixed to said floor panel, by fixing said small beam portion to the main beam of the building while said ceiling substructure is temporarily fixed to said floor panel; a temporary fixation releasing step of releasing the temporary fixation of the ceiling substrate to the floor panel; a height position adjusting step of adjusting a height position of the ceiling substrate using a height adjusting unit capable of adjusting a height position of the ceiling substrate; a vibration-isolating member placement process of placing a vibration-isolating member having vibration-isolating properties so as to connect the ceiling substrate and the height adjustment unit; A method for installing a ceiling-integrated floor panel.

5. a ceiling-integrated floor panel installation process for installing a ceiling-integrated floor panel comprising a floor panel having a small beam portion constituting the floor of an upper floor and a ceiling base that can be temporarily fixed to the floor panel, by fixing the small beam portion to a main beam of a building in a state where the ceiling base is temporarily fixed to the floor panel; a temporary fixation releasing step of releasing the temporary fixation of the ceiling substrate to the floor panel; a height position adjusting step of adjusting a height position of the ceiling substrate using a height adjusting unit capable of adjusting a height position of the ceiling substrate; Equipped with The height adjustment unit is fixed to the girder; How to install ceiling-integrated floor panels.

Images