Near field wireless communication device manufacturing method and near field wireless communication device

Abstract

To provide an improved method for manufacturing a short-range wireless communication device and the short-range wireless communication device.SOLUTION: A manufacturing method of the present invention includes: forming a first placement layer provided with a first opening; embedding a coil in an edge of the first placement layer so as to surround the first opening, and fitting a chip into the first opening, wherein the chip and the coil are welded; stacking and placing a second placement layer on a back surface of the first placement layer, attaching a shielding layer so as to cover the chip, in a second opening that is provided in the second placement layer and overlaps the first opening in a vertical direction; and stacking and placing a first covering layer on a front surface of the first placement layer, and pressing a laminated structure consisting of the first placement layer, the second placement layer, and the first covering layer into an integral structure by adopting a lamination thermoforming process. A short-range wireless communication device made by a technical aspect of an embodiment of the present invention has an integral structure and is less likely to delaminate between layers and break.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] FIELD Embodiments of the present invention relate to the technical field of communications, and more particularly to a method for manufacturing a short-range wireless communication device and a short-range wireless communication device. [Background technology]

[0002] Near Field Communication (NFC) is a short-range, high-frequency wireless communication technology that allows electronic devices to exchange data when they are in close proximity to each other. It has been widely applied in mobile payments, electronic tickets, access control, mobile identity verification, and anti-counterfeiting.

[0003] However, communication devices using conventional NFC technology still have some problems. Figure 1 is a cross-sectional structural diagram of a conventional near-field communication device. As shown in Figure 1, in the conventional near-field communication device, a coated paper 01 and an antenna 03 are bonded together using an adhesive 02, and a release paper 04 and the antenna 03 are also bonded together using an adhesive 02. A chip 05 is bonded to the surface of the antenna 03 using the adhesive 02, and an electrical connection is established, thereby forming a single overall structure. Therefore, during use by a user, improper operation or use may cause delamination in the near-field communication device, which may impair the data exchange function. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention provides a method for manufacturing a short-range wireless communication device and the short-range wireless communication device, so that the short-range wireless communication device has an integrated structure and is free from delamination and damage during use. [Means for solving the problem]

[0005] According to one aspect of the present invention, forming a first mounting layer having a first opening; a coil is embedded in an edge of the first mounting layer so as to surround the first opening, and a chip is fitted into the first opening, and the chip and the coil are welded together; placing a second mounting layer on the back surface of the first mounting layer, and attaching a shielding layer to cover the chip in a second opening provided in the second mounting layer and overlapping the first opening in a vertical direction; and placing a first cover layer on the front surface of the first mounting layer, and employing a laminating thermoforming process to press the laminated structure consisting of the first mounting layer, the second mounting layer, and the first cover layer into an integral structure.

[0006] Preferably, the material of the shielding layer is a nanocrystalline material.

[0007] Preferably, the method for manufacturing the first mounting layer includes: screen printing a complete sheet of material to form a plurality of side frames of the same size arranged in an array; and punching each of the side frames to form a plurality of the first openings arranged in an array to obtain the first mounting layer.

[0008] Preferably, the method for manufacturing the second mounting layer includes: screen printing a complete sheet of material to form a plurality of side frames of the same size arranged in an array; and punching each of the side frames to form a plurality of the second openings arranged in an array to obtain the second mounting layer.

[0009] Preferably, the size of the first opening is smaller than the size of the second opening.

[0010] Preferably, after pressing the laminated structure consisting of the first mounting layer, the second mounting layer, and the first covering layer into an integral structure, The method further includes stacking complete sheets of material on the side of the first covering layer away from the first mounting layer and on the side of the second mounting layer away from the first mounting layer so that the surface of the near-field communication device is flat, thereby forming a second covering layer.

[0011] Preferably, after forming the second coating layer, screen printing a complete sheet of material to form a plurality of side frames of the same size arranged in an array; screen printing each of the side frames to form a third coating layer having a mark pattern of the near field communication device as an outer surface of the near field communication device; The method further includes employing a laminating thermoforming process to press the laminated structure with the second and third coating layers stacked together into a unitary structure.

[0012] Preferably, the materials of the first mounting layer, the second mounting layer, the first covering layer, the second covering layer and the third covering layer are all acrylonitrile-butadiene-styrene copolymer.

[0013] Preferably, after pressing the laminated structure in which the second coating layer and the third coating layer are stacked into an integral structure, The method further includes forming the near field communication device by adhering an attachment layer to the side of the second covering layer away from the second mounting layer, for adhering and fixing the near field communication device to the surface of a target device that is a device that requires reading and writing information.

[0014] According to another aspect of the present invention, there is provided a short-range wireless communication device manufactured by the method for manufacturing a short-range wireless communication device according to any embodiment of the first aspect. [Effects of the Invention]

[0015] In one embodiment of the present invention, a coil is embedded in the edge of a first mounting layer having a first opening, a chip is placed in the first opening, and the chip and the coil are welded together. A second mounting layer having a second opening is placed on the back surface of the first mounting layer, and a shielding layer is attached to the second opening to cover the chip. The first cover layer, the first mounting layer, and the second mounting layer are laminated and pressed together using a laminating thermoforming process, whereby the laminated structure melts to a certain extent when heated, forming a single unit after pressing. This effectively prevents delamination and damage to the near-field communication device due to improper operation or use, and protects the data exchange function of the near-field communication device.

[0016] It should be understood that the content described in this section is not intended to identify key or critical features of embodiments of the invention, nor is it intended to limit the scope of the invention. Other features of the invention will become more readily apparent from the following specification. [Brief explanation of the drawings]

[0017] In the following, in order to more clearly explain the technical aspects of the embodiments of the present invention, we will briefly introduce the drawings that need to be used in the description of the embodiments. The drawings in the following description are only some embodiments of the present invention, and it is obvious to those skilled in the art that other drawings can be further obtained according to these drawings without performing any creative work.

[0018] [Figure 1] FIG. 1 is a cross-sectional view of a short-range wireless communication device according to a conventional technique. [Figure 2] 5 is a schematic diagram illustrating a flow of a method for manufacturing a near-field communication device according to an embodiment of the present invention. [Figure 3] 3A to 3C are structural schematic diagrams illustrating steps in a method for manufacturing a short-range wireless communication device according to an embodiment of the present invention. [Figure 4] 10A to 10C are schematic diagrams illustrating a flow of a method for manufacturing another short-range wireless communication device according to an embodiment of the present invention. [Figure 5]1 is a schematic diagram of the structure of a sheet material after printing according to an embodiment of the present invention. [Figure 6] 3A and 3B are schematic diagrams illustrating the structure of a sheet material after punching according to an embodiment of the present invention. [Figure 7] 10A to 10C are schematic diagrams illustrating a flow of a method for manufacturing another short-range wireless communication device according to an embodiment of the present invention. [Figure 8] 1 is a schematic diagram of a stacked structure of a near-field communication device according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0019] In order to allow those skilled in the art to better understand the aspects of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, and do not represent all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without any creative work shall fall within the protection scope of the present invention.

[0020] It should be noted that the terms "first," "second," and the like in the specification and claims of the present invention, as well as in the drawings, are not necessarily used to describe a particular order or sequence, but are merely used to distinguish between similar objects. It should be understood that the data used in this manner may be substituted where appropriate, so that the embodiments of the present invention described herein may be practiced in orders other than those illustrated or described herein. Furthermore, the terms "comprise" and "have," and any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or apparatus of a series of steps or units, and are not necessarily limited to those steps or units explicitly recited, but may include other steps or units not explicitly recited or inherent to the process, method, product, or apparatus.

[0021] An embodiment of the present invention provides a method for manufacturing a short-range wireless communication device. Figure 2 is a schematic flow diagram of the method for manufacturing a short-range wireless communication device according to an embodiment of the present invention, and Figure 3 is a structural schematic diagram of each step in the method for manufacturing a short-range wireless communication device according to an embodiment of the present invention. This embodiment is applicable to manufacturing a short-range wireless communication device, and the method for manufacturing the short-range wireless communication device specifically includes the following steps:

[0022] In S110, a first mounting layer 11 having a first opening 12 formed therein is formed.

[0023] Specifically, a first opening is provided in the first mounting layer so that other components can be mounted therein. Exemplarily, the first opening may be provided at any position other than the edge of the first mounting layer, and is not limited thereto. For example, in this embodiment, referring to the structural schematic diagram corresponding to step S110 in FIG. 3, the first opening is provided at the center of the first mounting layer.

[0024] In S120, the coil 13 is embedded in the edge of the first mounting layer 11 so as to surround the first opening 12, and the chip 14 is fitted into the first opening 12, and the chip 14 and the coil 13 are welded together.

[0025] Specifically, a coil is provided at the edge position of the first mounting layer, wrapping around one circumference of the edge, and a connecting wire is provided at the end of the one circumference close to the first opening, and the connecting wire extends toward and passes through the first opening. For example, in this embodiment, the coil is embedded in the first mounting layer using an ultrasonic wire embedding method, i.e., the insulating outer sheath wrapped around the surface of the coil is melted to fix the coil wound around the edge of the surface of the first mounting layer to the surface of the first mounting layer.

[0026] By placing the chip in the first opening and welding it to the connecting wire passing through the first opening, an electrical connection is established between the chip and the coil, allowing the chip to output data through the coil or external data to be written to the chip through the coil, thereby realizing data exchange.

[0027] In S130, a second mounting layer 21 is stacked on the back surface of the first mounting layer 11, and a shielding layer 23 is attached to cover the chip 14 in a second opening 22 provided in the second mounting layer 21 and overlapping the first opening 12 in the vertical direction.

[0028] Specifically, the second mounting layer has second openings on the back surface of the first mounting layer, the second openings being the same size as the first mounting layer, and each second opening corresponds one-to-one with each first opening, with a vertical overlapping area. A shielding layer is attached within the second opening so as to cover the chip in the overlapping area between the second opening and the first opening, thereby reducing the impact of external magnetic fields on data exchange on the chip. For example, see FIG. 3. In this embodiment, the second opening is located at the center of the second mounting layer, and the size of the first opening is smaller than the size of the second opening, so that the second opening completely surrounds the first opening and the shielding layer completely covers the chip. The material of the shielding layer is a nanocrystalline material.

[0029] In S140, the first covering layer 30 is laminated on the front surface of the first mounting layer 11, and a laminating thermoforming process is used to press the laminated structure consisting of the first mounting layer 11, the second mounting layer 21 and the first covering layer 30 into an integral structure.

[0030] The first covering layer is a complete film layer without any openings, and by providing the first covering layer on the front surface of the first mounting layer, the surface of the first mounting layer on which the coil and chip are provided can be made flat, thereby minimizing the impact of the coil and chip on the appearance of the near-field wireless communication device. For example, the first mounting layer, the second mounting layer, and the first covering layer are all made of acrylonitrile butadiene styrene copolymer (ABS), also known as ABS resin. ABS resin is a thermoplastic polymer structural material that is strong, has good toughness, and is easily processable. By pressing the laminated structure consisting of the first mounting layer, the second mounting layer, and the first covering layer using a lamination thermoforming process, the laminated structure melts to a certain extent when heated, and can then be pressed to form an integrated structure. The integrated structure thus formed effectively prevents delamination of the near field communication device during use due to improper handling or use, making the near field communication device less susceptible to damage.

[0031] In addition, as the laminated thermoforming process heats and melts the laminated structure, the ABS resin material at the position corresponding to the coil fixed to the surface of the first mounting layer also melts, thereby embedding the coil into the surface of the first mounting layer and making the first mounting layer flatter.

[0032] In this embodiment, a coil is embedded in the edge of a first mounting layer having a first opening, a chip is placed in the first opening, and the chip and the coil are welded together. A second mounting layer having a second opening is placed on the back surface of the first mounting layer, and a shielding layer is attached to the second opening to cover the chip. The first cover layer, first mounting layer, and second mounting layer are stacked and pressed together using a laminating thermoforming process. The laminated structure melts to a certain extent when heated, forming a single unit after pressing. This effectively prevents delamination and damage to the near-field communication device due to improper operation or use, and protects the data exchange function of the near-field communication device.

[0033] 4 is a schematic diagram of a flow of another method for manufacturing a short-range wireless communication device according to an embodiment of the present invention. Based on the above embodiment, as shown in FIG. 4, the method for manufacturing the short-range wireless communication device includes:

[0034] In S211, one complete sheet of material is screen printed to form a plurality of side frames of the same size arranged in an array.

[0035] Screen printing is a method of obtaining a pattern by rubbing printing ink onto a screen stencil. A complete sheet material is a complete, unapertured film layer. For example, the sheet materials used in this embodiment are all ABS resin. FIG. 5 is a schematic diagram of the structure of a printed sheet material according to an embodiment of the present invention. Referring to FIG. 5, multiple side frames of the same size arranged in an array are printed on the sheet material, and the area surrounded by each side frame is the area where one near-field communication device is formed. Therefore, multiple near-field communication devices can be simultaneously manufactured on one complete sheet material. The side frames may be configured in any shape according to actual needs and are not limited herein. For example, in this embodiment, the side frames formed by screen printing are rectangular.

[0036] In S212, punching is performed on each side frame to form a plurality of first openings arranged in an array, thereby obtaining a first mounting layer.

[0037] The punching step uses a punching die to punch along a closed curve, and the punched portion is scrap, thereby forming a first mounting layer having first openings arranged in an array. For example, see the corresponding structural diagram of step S110 in Figure 3. In this embodiment, the shape of the first openings is a rectangle that matches the shape of the chip.

[0038] In S220, a coil is embedded in the edge of the first mounting layer surrounding the first opening, and a chip is fitted into the first opening, whereby the chip and the coil are welded together.

[0039] In S230, a second mounting layer having a second opening that overlaps the first opening in the vertical direction is stacked on the back surface of the first mounting layer, and a shielding layer is attached to the second opening so as to cover the chip.

[0040] In S240, a first cover layer is placed on the front surface of the first mounting layer, and a lamination thermoforming process is employed to press the laminated structure consisting of the first mounting layer, the second mounting layer and the first cover layer into a unitary structure.

[0041] Preferably, in consideration of the above embodiments, the manufacturing method of the second placement layer in step S130 includes:

[0042] In S131, one complete sheet of material is screen printed to form a plurality of side frames of the same size arranged in an array.

[0043] Specifically, still referring to Figure 5, a screen printing method is used to print and form multiple side frames on one complete sheet material, and the size of the complete sheet material used in this step and the size of the complete sheet material used when manufacturing the first mounting layer are the same, and the format and size of the formed side frames and the side frames printed and formed when manufacturing the first mounting layer are both the same.

[0044] In S132, punching is performed on each side frame to form a plurality of second openings arranged in an array, thereby obtaining a second mounting layer.

[0045] Similarly to the manufacturing process of the first mounting layer, second openings 22 are formed in each side frame by punching to obtain the second mounting layer. For example, FIG. 6 is a schematic diagram of the structure of the sheet material after punching according to an embodiment of the present invention. In this embodiment, the shape of the second openings 22 is rectangular to match the shape of the shielding layer.

[0046] 7 is a schematic diagram of a flow of another method for manufacturing a short-range wireless communication device according to an embodiment of the present invention. Based on the above embodiments, as shown in FIG. 7, the method for manufacturing the short-range wireless communication device includes:

[0047] In S310, a first mounting layer having a first opening is formed.

[0048] In S320, a coil is embedded in the edge of the first mounting layer surrounding the first opening, and a chip is fitted into the first opening, whereby the chip and the coil are welded together.

[0049] In S330, a second mounting layer having a second opening that overlaps the first opening in the vertical direction is stacked on the back surface of the first mounting layer, and a shielding layer is attached to the second opening so as to cover the chip.

[0050] In S340, a first covering layer is placed on the front surface of the first mounting layer, and a laminating thermoforming process is employed to press the laminated structure consisting of the first mounting layer, the second mounting layer and the first covering layer into a unitary structure.

[0051] In S350, complete sheets of material are stacked on the side of the first covering layer away from the first mounting layer and on the side of the second mounting layer away from the first mounting layer so that the surface of the near-field communication device is flat, thereby forming a second covering layer.

[0052] Specifically, a complete sheet material is provided on the front and back of the integrated structure formed by pressing the first covering layer, the first mounting layer, and the second mounting layer, and then the second covering layer is formed to further encase the already formed integrated structure and make the surface more flat. Furthermore, the integrated structure formed by pressing the multi-layer structure using a laminating thermoforming process further improves the reliability of the near-field wireless communication device during use and is less likely to undergo delamination.

[0053] In S360, one complete sheet of material is screen printed to form a plurality of side frames of the same size arranged in an array.

[0054] Specifically, another complete sheet of material is taken and the same side frame as that described in any of the above examples is formed on its surface by screen printing.

[0055] In S370, screen printing is performed on each side frame to form a third coating layer having a mark pattern of the near field communication device as the outer surface of the near field communication device.

[0056] Specifically, a screen printing process is used to print and form a marking pattern on each side frame, and the third covering layer is formed as the outer surface of the near field communication device. For example, in order to improve the appearance of the finished near field communication device, the sheet material used for the third covering layer may be a color similar to the appearance of the corresponding electronic device, so as to reduce the protruding feeling when attached to the electronic device of the near field communication device.

[0057] In S380, a laminating thermoforming process is employed to press the laminated structure with the second and third coating layers superposed one on top of the other into a unitary structure.

[0058] For example, the second and third coating layers are both made of acrylonitrile-butadiene-styrene copolymer, and after the second and third coating layers are applied to the integrated structure consisting of the first, first, and second coating layers, another lamination thermoforming process is used to press the laminated structure into an integrated structure, thereby effectively preventing delamination and damage during use of the finished near-field wireless communication device, and preventing discoloration at the edges of the formed integrated structure, resulting in a more beautiful appearance.

[0059] In S390, an attachment layer is attached to the side of the second covering layer away from the second mounting layer to attach and fix the near-field wireless communication device to the surface of a target device that requires information reading and writing, thereby forming a near-field wireless communication device.

[0060] For example, the provided attachment layer may be a double-sided tape, one side of which is attached to the surface of the second covering layer away from the second mounting layer, and the other side of which is attached to the surface of the target device when in use, thereby fixing the near-field wireless communication device to the surface of the target device and realizing information reading and writing and data exchange.

[0061] In each of the above embodiments, the short-range wireless communication device includes a first covering layer, a first mounting layer, a second mounting layer, a second covering layer, and a third covering layer. The first covering layer, the first mounting layer, and the second mounting layer are intermediate materials for the short-range wireless communication device, and the second covering layer and the third covering layer are surface materials for the short-range wireless communication device. The intermediate materials and surface materials used to synthesize the short-range wireless communication device are both made of acrylonitrile-butadiene-styrene copolymer, but there are certain differences in the process parameters. For example, when synthesizing the surface material, the heat engine presses at a pressure of 10 to 11 MPa for 35 minutes, the refrigerator presses at a pressure of 13 MPa for 15 minutes, and the temperature during the pressing process must be maintained at 120 to 140°C, preferably at 130°C. Meanwhile, when synthesizing the intermediate material, the heat engine presses at a pressure of 8 to 10 MPa for 35 minutes, the refrigerator presses at a pressure of 13 MPa for 15 minutes, and the temperature during the pressing process must be maintained at 140 to 150°C, preferably at 148°C.

[0062] In one possible embodiment, the selected complete sheet material is a black ABS film layer, measuring 292 x 475 x 0.15 mm. After screen printing, a plurality of side frames measuring 35 x 45 mm are formed on the sheet material in a 6 x 12 layout. When forming the first mounting layer, the screen-printed sheet material is punched to form a first opening measuring 5 x 8 mm in each side frame. Coils are embedded into the edges of each side frame of the first mounting layer using ultrasonic wire embedding, measuring 21 x 21 mm. Chips are welded into the first openings, measuring 5 x 8 mm. When forming the second mounting layer, the screen-printed sheet material is punched to form a second opening measuring (23.5 ± 0.05) x (23.5 ± 0.05) mm in each side frame. A nanocrystalline shielding material is attached to the second opening in the second mounting layer, measuring 23.5 x 23.5 mm. A complete sheet of material measuring 292 x 475 x 0.15 mm serves as the first covering layer, placed on the front of the first mounting layer. The first covering layer, first mounting layer, and second mounting layer are pressed together using a laminating thermoforming process to form an integrated structure. Complete sheets of material are then placed on the upper and lower layers of the integrated structure, respectively, to form second covering layers, resulting in a combined structure thickness of 0.82 mm. A marking pattern for a near-field communication device is formed as a third covering layer at the center of each border on the complete sheet of material printed with side frames using a screen printing method, with the marking pattern misalignment limited to ±0.3 mm. After the second and third covering layers are added, the laminated structure is pressed again using a laminating thermoforming process to form an integrated structure. The back of the integrated structure is provided with double-sided tape as an adhesive layer to form a finished short-range wireless communication device, the size of which can be set according to the actual needs of the user and is not limited herein, for example, the size of the finished product may be 28 x 28 mm.

[0063] After the finished short-range wireless communication device is manufactured and obtained, data is burned into the short-range wireless communication device according to the user's requirements, and then the processes of quality control, packaging, incoming quality control, antenna radio frequency detection, insertion of instructions, packaging, and sealing are carried out.

[0064] The near field communication device manufactured by the method for manufacturing a near field communication device according to the embodiment of the present invention employs a nanocrystalline shielding material as a shielding layer, which can effectively improve the data read / write distance and frequency of the near field communication device in a metallic environment. The following example analyzes the data read / write distance and frequency of the near field communication device according to the embodiment of the present invention in comparison with those of other cases.

[0065] For the short-range wireless communication device according to the embodiment of the present invention, its standard frequency is set to 13.56MHz, and when the short-range wireless communication device is in a non-metallic environment, i.e., when there is no external magnetic field, the frequency of the short-range wireless communication device is 13.21MHz, and the data read / write distance can reach 27mm, and when the short-range wireless communication device is in a metallic environment, i.e., when there is an external magnetic field, the frequency of the short-range wireless communication device is 13.92MHz, and the data read / write distance is 20mm. It can be seen from this that by increasing the nanocrystalline shielding material, even when there is an external magnetic field, the data read / write distance can still reach 20mm, and the frequency does not change significantly, so as to meet the requirements of users.

[0066] For a conventional short-range wireless communication device, when the device is in a non-metallic environment, the frequency of the device is 12.25 MHz and the data read / write distance can reach 28 mm, while when the device is in a metallic environment, the frequency of the device is 14.35 MHz and the data read / write distance is 17 mm. As can be seen, the frequency of the short-range wireless communication device in the prior art fluctuates greatly under the influence of an external magnetic field, and the data read / write distance is obviously reduced.

[0067] When the nanocrystalline shielding material employed in the present embodiment is replaced with a ferrite material, the following test results can be obtained.

[0068] [Table 1]

[0069] Among them, the card reader used is model ACR122U. As can be seen, when ferrite material is used as a shielding material, the frequency of the near field communication device fluctuates and changes significantly, and there is a large difference in the data read / write distance between the case without metal and the case with metal, indicating that the ferrite material has a poor shielding effect against external magnetic fields.

[0070] For short-range wireless communication devices that use ferrite material as a shielding layer, whether they are in a metallic environment or not and the strength of the external magnetic field will all have a certain impact on the frequency and data read / write distance of the short-range wireless communication device. The following are the test results.

[0071] [Table 2]

[0072] Among them, environment 1# is a case where there is no metal environment, environment 2# is a case where there are metal parts in the short-range wireless communication device, i.e., in environment 2#, the external magnetic field is weak, and environment 3# is a case where the short-range wireless communication device is interposed between the metal and the card reader, i.e., in environment 3#, the external magnetic field is strong.

[0073] As can be seen from the above, short-range wireless communication devices using ferrite materials as shielding layers have a very large frequency fluctuation in a strong magnetic field and a significantly reduced data read / write distance, which means that the ferrite materials have a poor shielding effect against external magnetic field interference.

[0074] An embodiment of the present invention further provides a short-range wireless communication device. Figure 8 is a schematic diagram of the laminated structure of a short-range wireless communication device according to an embodiment of the present invention. The short-range wireless communication device 001 is manufactured by the manufacturing method of a short-range wireless communication device according to any of the above embodiments, and has an integrated structure formed by pressing using a lamination thermoforming process, making it less susceptible to delamination and damage during use. Furthermore, the use of a nanocrystalline shielding material as a shielding layer can effectively reduce interference with data exchange caused by external magnetic fields when the short-range wireless communication device is in a metal environment, so that the short-range wireless communication device maintains a stable frequency and a large data read / write distance.

[0075] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions are possible based on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. forming a first mounting layer having a first opening; a coil is embedded in an edge of the first mounting layer so as to surround the first opening, a chip is fitted in the first opening, and the chip and the coil are welded together; a second mounting layer is laminated on the back surface of the first mounting layer, and a shielding layer is attached to cover the chip in a second opening provided in the second mounting layer and overlapping the first opening in a vertical direction, the size of the first opening being smaller than the size of the second opening; placing a first cover layer on the front surface of the first mounting layer, and pressing the laminated structure consisting of the first mounting layer, the second mounting layer, and the first cover layer into a unitary structure using a laminating thermoforming process; forming a second covering layer by stacking complete sheets of material on a side of the first covering layer away from the first mounting layer and on a side of the second mounting layer away from the first mounting layer so that the surface of the near-field communication device is flat; screen printing one complete sheet material to form a plurality of side frames of the same size arranged in an array, screen printing each of the side frames to form a third covering layer having a marking pattern of the near field communication device as an outer surface of the near field communication device, and employing a laminating thermoforming process to press the laminated structure of the second covering layer and the third covering layer into an integral structure.

2. A method for manufacturing a short-range wireless communication device.

2. the material of the shielding layer is a nanocrystalline material; 2. The method for manufacturing a short-range wireless communication device according to claim 1.

3. The method for manufacturing the first mounting layer includes: screen printing a complete sheet of material to form a plurality of side frames of the same size arranged in an array; punching each of the side frames to form a plurality of the first openings arranged in an array to obtain the first mounting layer; 2. The method for manufacturing a short-range wireless communication device according to claim 1.

4. The method for manufacturing the second mounting layer includes: screen printing a complete sheet of material to form a plurality of side frames of the same size arranged in an array; punching each of the side frames to form a plurality of the second openings arranged in an array, thereby obtaining the second mounting layer; 4. The method for manufacturing a short-range wireless communication device according to claim 3.

5. the first mounting layer, the second mounting layer, the first covering layer, the second covering layer, and the third covering layer are all made of an acrylonitrile-butadiene-styrene copolymer; 2. The method for manufacturing a short-range wireless communication device according to claim 1.

6. After pressing the laminated structure in which the second coating layer and the third coating layer are stacked together into an integral structure, and forming the near field communication device by adhering an attachment layer to a side of the second cover layer away from the second mounting layer, the attachment layer being used to attach and fix the near field communication device to a surface of a target device that is a device that needs to read and write information.

2. The method for manufacturing a short-range wireless communication device according to claim 1.

7. A short-range wireless communication device manufactured by the method for manufacturing a short-range wireless communication device according to any one of claims 1 to 6. A short-range wireless communication device.

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