Image display device and image display method

Abstract

To enhance visibility of components and a mounted member in an image for displaying the mounted member with the components mounted thereon.SOLUTION: An image display device that displays an image G of a mounted member P with components E mounted thereon includes a display unit 14 that displays the image G and a control unit 11. The control unit 11 generates the image G based on design data 17 of the mounted member P. The control unit 11 changes a display form of components E that satisfy a predetermined condition among the components E included in the image G to a display form different from a display form of other components E, and displays them on the display unit 14.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to an image display device and an image display method. [Background technology]

[0002] A circuit board mounting state display device is known that displays the mounting state of a circuit board (mounted component) as a three-dimensional object and simultaneously displays the operating conditions of the mounting device to be used as a three-dimensional figure, allowing mounting data to be virtually and reliably confirmed and examined without having to prototype an actual board (Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-288256 Summary of the Invention [Problem to be solved by the invention]

[0004] When all components mounted on a mounting surface are displayed in 3D, depending on the position and shape of the components, the components or locations on the mounting surface that the user wants to view may be hidden behind other 3D displayed components and become difficult to see.

[0005] An object of the present invention is to improve the visibility of components and mounted members in an image displaying a mounted member on which components have been mounted. [Means for solving the problem]

[0006] An image display device that displays an image of a mount member on which components are mounted and the components mounted on the mount member includes a display unit that displays the image and a control unit, wherein the control unit generates the image based on design data of the mount member, and the control unit changes the display form of components included in the image that satisfy predetermined conditions to a display form that is different from the display form of other components and displays the changed form on the display unit. [Effects of the Invention]

[0007] According to the present invention, it is possible to improve the visibility of components and mounted members in a displayed image. [Brief explanation of the drawings]

[0008] [Figure 1] Image display device system configuration diagram [Figure 2] A block diagram showing the electrical configuration of an image display device. [Figure 3] FIG. 10 shows examples of images in which parts are displayed in different ways. [Figure 4] Flowchart of image generation and display processing [Figure 5] A side view illustrating interference during the mounting process [Figure 6] A diagram showing an example of a circuit board including shielding components [Figure 7] A diagram showing an example of changing the display format based on the height of a part. [Figure 8] Schematic diagram of a production line having multiple mounting devices [Figure 9] A diagram showing an example of the display of a board after it has passed through a mounting device [Figure 10] FIG. 10 is a diagram showing an example of displaying a board having a component with a quality problem. [Figure 11] FIG. 10 is a diagram showing an example of displaying a board having a component determined to be an error; [Figure 12] Figure showing examples of displaying or hiding parts [Figure 13] Figure showing an example of how the transparency is changed [Figure 14]A diagram showing an example of how the color can be changed DETAILED DESCRIPTION OF THE INVENTION

[0009] Embodiments of the present disclosure will be described below. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims. The embodiments of the present disclosure can be realized in various forms, such as an apparatus, a method, a computer program for implementing the functions of these apparatuses or methods, and a recording medium on which the computer program is recorded. <Embodiment 1> 1. Overall structure 1 is a diagram showing a schematic configuration of an image display system S including an image display device 10 according to this embodiment. The image display system S is a system that generates an image G of a substrate P (an example of a member to be mounted) based on design data 17 prior to production of the substrate P by a mounting device, and displays the generated image G.

[0010] Here, the components include passive components such as resistors, capacitors, and inductors, active components such as semiconductor devices, box-shaped shielding components that cover other components on the substrate P from above, and the like.

[0011] 1, the image display system S includes an image display device 10 and a database DB. The image display device 10 and the database DB are connected via a wired or wireless network N. The network N is, for example, the Internet, a LAN (Local Area Network), or the like.

[0012] 2 is a block diagram showing the electrical configuration of the image display device 10. The image display device 10 has a control unit 11, a display unit 14, and an input unit 15. The display unit 14 is a display device such as a commonly used display. The input unit 15 is an input device such as a commonly used keyboard, mouse, or touch panel. A user of the image display device 10 can use the input unit 15 to set predetermined conditions (described below) and change the display mode (described below) of the component E.

[0013] The control unit 11, the display unit 14, and the input unit 15 may be configured separately, or may be integrated into one device.

[0014] The database DB is a storage device that stores data. The database DB stores design data 17 of the substrate P. The design data 17 includes component data 17A related to the component E to be mounted, and mounting device data 17B related to the mounting device used in the process of mounting the component E on the substrate P (hereinafter referred to as the mounting process).

[0015] The component data 17A includes data relating to the external size and thickness of the substrate P, the type, external shape, and mounting point coordinates of the component E to be mounted on the substrate P. The mounting device data 17B includes data relating to the size and operating trajectory of the suction nozzle 34 (see FIG. 5) that picks up the component E when mounting the component E, and data relating to the size, arrangement, and operating trajectory of the backup pins 33 that support the substrate P from below.

[0016] The control unit 11 is a control device for the image display device 10. The control unit 11 has an arithmetic processing unit 12, a storage unit 13, and a communication unit 16. The communication unit 16 exchanges various types of data with a database DB.

[0017] The storage unit 13 stores the design data 17 acquired from the database DB via the communication unit 16 .

[0018] The arithmetic processing unit 12 is a so-called CPU (Central Processing Unit) that executes various types of arithmetic processing and controls each part of the image display device 10. The arithmetic processing unit 12 reads the design data 17 from the storage unit 13 and generates an image G of the board P on which the component E is mounted. 2. Display of parts in images

[0019] 3(a) to 3(c), the display form of a component E displayed in an image G will be described. The display form is the form in which the component E is displayed in an image G, and in this embodiment, is a two-dimensional display or a three-dimensional display. When the display form of a component E is a two-dimensional display, the component E is displayed planarly on the surface of the board P. The display form may be other than a two-dimensional display or a three-dimensional display. Other display forms will be described in the second and subsequent embodiments described below.

[0020] The component data 17A includes contour data of the board P and the component E, and coordinate data of the mounting point with a reference point on the board P as the origin. The contour data is, for example, three-dimensional CAD data. The calculation processing unit 12 can generate a two-dimensional model of the component E that does not include height information based on the component data 17A. When the display format is two-dimensional, the components E1 to E5 are displayed as contour lines projected onto the board P, as shown in image G1 in FIG. 3(a). In this embodiment, the initial setting of the display format is two-dimensional display.

[0021] Furthermore, the calculation processing unit 12 can also generate a three-dimensional model including height information based on the part data 17A. When the display format is three-dimensional display, the shapes of the parts E1 to E5 are displayed three-dimensionally (for example, as a rectangular parallelepiped) as shown in image G2 in Fig. 3(b).

[0022] It is not possible to read the height information of part E from image G1, which displays all parts in two dimensions. As described above, the initial setting for the display format is two-dimensional display, so if the specified conditions are not set or if there is no part E that meets the specified conditions, all parts will be displayed in two dimensions as in image G1.

[0023] In image G2, which displays all components in three dimensions, components located at the back of board P may overlap with components located at the front, making them difficult to see. For example, component E4 is hidden behind component E3 at the front, making it difficult for the user to find component E4 in image G2. Furthermore, because the area around component E4 is hidden by component E3, it is difficult for the user to recognize the state of the area around component E4 (such as its positional relationship and distance from other components) even when looking at image G2.

[0024] Image G3 is an image obtained by changing the display mode of certain parts (e.g., parts E4 and E5) that meet certain conditions from 2D to 3D, while maintaining the 2D display of the other parts (parts E1 to E3). In image G3, 2D parts E1 to E3 and 3D parts E4 and E5 are mixed together.

[0025] By changing the display format of only specific parts (parts E4 and E5) to 3D, the specific parts become easier to see in the image, and the user can easily find the specific parts in image G3. Also, because parts other than the specific parts are displayed in 2D, the specific parts are not hidden behind other parts, and the specific parts and their surrounding conditions can be easily confirmed.

[0026] Furthermore, because the outlines of the components E1 to E3, which are displayed in a two-dimensional manner, are drawn on the board P, the user can recognize from the image G3 the existence of the components E1 to E3 and the component shapes (the component outlines) projected onto the board P. Therefore, on the screen of the display unit 14 on which the image G3 is displayed, the user can easily select the two-dimensionally displayed components E1 to E3 and switch between two-dimensional and three-dimensional display.

[0027] 3. Flowchart The generation and display processing of image G executed by image display device 10 will be described with reference to the flowchart of FIG.

[0028] When the user performs an operation to start processing in the image display device 10, the generation and display processing of the image G is started.

[0029] The user inputs predetermined conditions into the image display device 10 using the input unit 15 (S10). The predetermined conditions for determining which of the mounted components E should have their display form changed can be set arbitrarily by the user. The predetermined conditions may be selected from conditions stored in the storage unit 13, or the user may set new conditions. Alternatively, the calculation processing unit 12 may automatically set the conditions.

[0030] Next, the arithmetic processing unit 12 reads the design data 17 stored in the storage unit 13 or the database DB (S20).

[0031] The arithmetic processing unit 12 refers to the design data 17 and determines whether or not there is a component E that satisfies a predetermined condition among the components E to be mounted. If the design data 17 includes a component E that satisfies the predetermined condition (S30: YES), the arithmetic processing unit 12 changes the display form of only the component E that satisfies the predetermined condition from the initial setting of 2D display to 3D display (S40). The display form of the component E that does not satisfy the predetermined condition remains 2D display.

[0032] The calculation processing unit 12 generates a two-dimensional model or a three-dimensional model of each component E by referring to the display form of each component E, and generates an image G in which each component E is placed at a mounting point on the board P (S50).

[0033] On the other hand, if the design data 17 does not include any component E that satisfies the predetermined conditions (S30: NO), the display format is not changed from the initial setting. In this case, the calculation processing unit 12 generates an image G in which all components E are displayed in two dimensions (S50).

[0034] The arithmetic processing unit 12 transmits the generated image G to the display unit 14 and displays it (S60), and the generation and display process of the image G is completed.

[0035] 4. Regarding specified conditions 5 is a schematic side view of the mounting device and substrate P in the mounting process. The substrate P is transported in a direction penetrating the paper (front-rear direction) by a pair of transport conveyors 35, and its displacement in the left-right direction is restricted between a pair of guide members 31. A nozzle 34 that sucks and holds the component E10 to be mounted is disposed above the mounting point. A backup device 36 that supports the substrate P from below is provided below the substrate P. The backup device 36 has a plate-shaped backup plate 32 and columnar backup pins 33 that stand on the upper surface of the backup plate 32. The backup plate 32 can move up and down integrally with the backup pins 33.

[0036] In the mounting process, the backup device 36 raises the backup pins 33 from the solid line position to the dotted line position to support the underside of the substrate P. After the underside of the substrate P is supported and raised by the backup pins 33, the nozzle 34 descends from the solid line position to the dotted line position to mount the component E10 on the substrate P.

[0037] Before component E10 is mounted, components E may already be mounted on the top or bottom surface of the board P. In the example of FIG. 5, components E11 to E16 are mounted before component E10. Depending on the positions of the already mounted components E11 to E16, the nozzle 34 and backup pin 33 may interfere with the already mounted components. In the example of FIG. 5, if the backup pin 33 is raised, it may interfere with the already mounted component E14. Furthermore, if the nozzle 34 is lowered, it may interfere with the already mounted component E12.

[0038] In this embodiment, in order to check whether or not there is interference when mounting the component E10, the predetermined condition is set as "a component that may interfere with members constituting the mounting device during the mounting process of the component E10."

[0039] When the predetermined conditions are set in this way, the calculation processing unit 12 refers to the coordinate data of the shapes and mounting points of the already mounted components E11 to E16 contained in the component data 17A, and the data of the shapes and movement trajectories of the nozzle 34 and backup pin 33 contained in the mounting device data 17B. Based on this data, the calculation processing unit 12 determines whether or not the nozzle 34 and the like will interfere with the already mounted components E11 to E16 during the mounting process of the component E10.

[0040] For example, if the distance between the nozzle 34 and the already mounted components E11 to E16 falls below a given value during the operation of the nozzle 34, it is determined that there is a risk of interference. Then, based on the determination result, the display format of components that are likely to interfere (components that satisfy a predetermined condition) is changed from 2D to 3D.

[0041] 5, in this embodiment, the components that satisfy the predetermined conditions are component E12 that may interfere with the nozzle 34 and component E14 that may interfere with the backup pin 33. The processing unit 12 changes the display format of these two components to a three-dimensional display. Note that the display format of component E10 to be mounted may also be changed to a three-dimensional display.

[0042] By setting the predetermined conditions as described above, the user can easily check from the image G any components that may interfere with members constituting the mounting device during the mounting process.

[0043] 5.Effects The image display device 10 of this embodiment changes the display mode of a component E that satisfies a predetermined condition to a display mode that differs from the display mode of other components E that do not satisfy the predetermined condition, and generates an image G, which is displayed on the display unit 14. A specific component E that satisfies the predetermined condition can be selectively made to stand out in the image G, thereby increasing its visibility. A user can easily confirm the existence and position of the specific component E from the image G.

[0044] Based on mounting device data 17B relating to the mounting device, image display device 10 of this embodiment determines whether backup pins 33 and nozzles 34, which are components of the mounting device, are likely to interfere with components E already mounted on substrate P. Processing unit 12 generates image G by changing the display form of components E that are likely to interfere.

[0045] This allows components E that may cause interference to be selectively highlighted in image G, making it easier for the user to recognize from image G the existence and position of components E that may cause interference in the mounting process.

[0046] In this embodiment, the display mode of a part E that satisfies a predetermined condition is changed from the initial setting of 2D display to 3D display. This makes it possible to easily confirm the 3D shape, including the height, of the 3D displayed part E in the image G. For the 2D displayed part E, the presence and 2D shape (external shape when viewed from above) of the part E can be confirmed from the image G. Furthermore, since the 2D displayed part E is also displayed in the image, the presence of the 2D displayed part E in the image can be easily recognized. Furthermore, the operation of selecting the 2D displayed part E and switching between the 2D display and the 3D display can be easily performed.

[0047] 6. Regarding specified conditions In the above description, the predetermined condition is "a component that may interfere with a member constituting the mounting device during the mounting process of component E10," but the user may set any predetermined condition according to the purpose. By setting any predetermined condition, the user can cause the image display device 10 to display an image G that is suitable for checking items that meet the user's purpose. Specific examples of the predetermined condition are described below.

[0048] 6.1 Part Types 6(a) and 6(b) are images showing a state in which a box-shaped shielding component E20 with an opening at the bottom is mounted on a substrate P so as to cover the component E21 mounted on the substrate P from above. The shielding component E20 is displayed in three dimensions in image G21 and in two dimensions in image G22. The shielding component E20 is a component that makes the component E21 less susceptible to the effects of electromagnetic waves from the external space.

[0049] In image G21, the height and three-dimensional shape of shielding component E20 can be read, but the component E located inside shielding component E20 cannot be seen. On the other hand, in image G22, the internal component E21 can be seen, but the height and three-dimensional shape of shielding component E20 cannot be read.

[0050] The user may define the predetermined condition by the type of component E. For example, the predetermined condition may be "a component whose type is a shield component." A "shield component" is an example of a type of component E. Under this condition, the display format of the shield component E20, of the components E20 and E21 mounted on the board P, is changed from two-dimensional display to three-dimensional display. This allows height information of the shield component E20 to be obtained from the image G displayed on the display unit 14. If the user wants to view the component E21 arranged inside the shield component E20, the user changes or deletes the predetermined condition so that the shield component E20 is not included in the predetermined condition. In addition, the transparency of the shield component E20, which will be described later, may be changed.

[0051] 6.2 Component Height If the height of a component is large, there is a high possibility that it will interfere with components of the mounting device (such as the nozzle 34 and backup pin 33). Therefore, by setting the predetermined condition to "a component whose height is greater than a threshold value," it is possible to selectively highlight component E in image G, which is likely to interfere and requires careful attention.

[0052] The image G31 in FIG. 7(a) shows a state where components E31 to E33 with different heights are mounted on the substrate P. In the image G31, the display forms of components E30 to E32 are all three-dimensional displays. Let the height of component E31 be H1, the height of component E32 be H2, the height of component E33 be H3, and the threshold value be H0. The user can set the threshold value H0 to any value. In the example of FIG. 7, it is assumed that the magnitude relationship between H1 to H3 and the threshold value H0 is H1 < H2 < H0 < H3.

[0053] The image G32 in FIG. 7(b) is an image when the display forms of components E31 to E33 are all two-dimensional displays. In the case of two-dimensional displays where all the mounted components E do not include height information, it is impossible to visually recognize from the image G32 which component has a height greater than the threshold value H0.

[0054] The image G33 in FIG. 7(c) is an image when a predetermined condition is set as "a component with a height greater than the threshold value H0". Only the component E33 with a height greater than the threshold value H0 has been changed to a three-dimensional display, and it is clearly understood from the image G33 that the component E33 is a component with a height greater than the threshold value H0 and has a high risk of interference.

[0055] 6.3 Components Mounted after Passing through the Mounting Device FIG. 8 is an example of a mounting line for mounting the component E on the substrate P by a plurality of mounting devices 41. The mounting line 40 has three mounting devices 41A to 41C. The mounting devices 41A to 41C are arranged side by side in a row, and the substrate P is conveyed from the upstream mounting device 41A to the downstream mounting device 41C by a conveying conveyor (not shown). The substrate P carried into the mounting device 41A passes through the mounting devices 41A to 41C in sequence, and the component E is mounted on each mounting device, and finally, it is carried out from the downstream mounting device 41C.

[0056] When the user wants to check the mounting state immediately after passing through a specific mounting device among the plurality of mounting devices 41A to 41C, a predetermined condition is set as "components mounted after passing through a specific mounting device among 41A to 41C". The images G41 to G43 generated under this condition are shown in FIG. 9.

[0057] In the mounting line 40 of FIG. 8, the first mounting apparatus 41A mounts the component E42, the second mounting apparatus 41B mounts the components E41 and E44, and the third mounting apparatus 41C mounts the components E43 and E45.

[0058] 9(a) shows an image G41 in which the predetermined condition is "components that have been mounted after passing through the first mounting device 41A." Only component E42, which has been mounted by the first mounting device 41A, is displayed in three dimensions, and components that have not yet been mounted at this point (E41, E43 to E45) are displayed in two dimensions.

[0059] Image G42 in Figure 9(b) shows the case where the predetermined condition is "components that have been mounted after the second mounting device 41B has passed." In addition to component E42, components E41 and E44 that were mounted by mounting device 41B are displayed in three dimensions. Components that have not yet been mounted at this point (E43 and E45) are displayed in two dimensions.

[0060] 9(c) shows an image G43 in which the predetermined condition is set to "components that have been mounted after passing through the third mounting device 41C." In image G43, there are no unmounted components, and all components E41 to E45 are displayed in three dimensions.

[0061] In this way, mounted components and unmounted components immediately after passing through a specific mounting device can be easily recognized from the images G41 to G43.

[0062] 6.4 User-selected parts The user can set the predetermined condition as "components selected by the user." In this case, the user arbitrarily selects one or more components E from among the components E to be mounted on the board P. The processing unit 12 changes the display format of the selected components E from two-dimensional display to three-dimensional display, and generates an image G. This allows the components E arbitrarily selected by the user to be selectively highlighted in the image G, allowing the user to easily visually recognize them.

[0063] 6.5 Parts with past quality issues In addition to the above-mentioned design data 17, database DB also stores past production performance data. The production performance data includes data on components E that failed to be mounted in past productions of board P. By referring to the production performance data, processing unit 12 can extract components E that have had quality problems in the past.

[0064] 10(a) is a diagram showing a situation in which the nozzle 34 interferes with the component E65 while the nozzle 34 is sucking and holding the component E64 and descending toward the mounting point. The component E65 is displaced by the interference with the nozzle 34, and moves to a position different from the position where it was originally to be mounted. In this case, the production performance data records the displaced component E65 and the component E64 that was to be mounted when the displacement occurred as components that have had quality problems in the past.

[0065] If the predetermined condition is "components that have had quality problems in the past," the calculation processing unit 12 refers to the production performance data, changes the display format of the corresponding components E64 and E65 to a three-dimensional display, and then generates image G61 shown in Fig. 10(b). This makes it possible to selectively highlight both the component E64 to be mounted, which has had quality problems in the past, and the misaligned component E65 in image G61, allowing the user to easily visually identify these components.

[0066] 6.6 Parts identified as errors by the data check function The calculation processing unit 12 has a data check function. The data check function is a function that checks whether the component E to be mounted can be mounted based on the specifications of the mounting device. For example, if an upper limit is set for the height of the component E that can be mounted by the mounting device, and if the mounting target includes a component E whose height exceeds the upper limit, an error is determined for that component E.

[0067] FIG. 11 shows image G71, which is generated when the predetermined condition is "a component determined to be an error by the data check function." Image G71 is generated when, of the components E71 to E74 to be mounted on the board P, the height of component E73 exceeds the upper limit set in the mounting device. The display format of only component E73 is changed from 2D to 3D, while the other components remain in 2D. This allows component E73, which was determined to be an error as a result of the data check, to be selectively highlighted in image G71, allowing the user to easily visually recognize the results of the data check from image G71.

[0068] <Embodiment 2> The second embodiment will be described with reference to Fig. 12. In the first embodiment, the display mode of the part E is changed between "two-dimensional display" and "three-dimensional display" (see Fig. 3). In the second embodiment, the display mode of the part E is changed between "display" and "hidden". Note that "hidden", which does not display the part E, is also included as one type of display mode. Apart from the difference in the display mode, the configuration is the same as that of the first embodiment.

[0069] In the second embodiment, the component E whose display mode is "display" may be displayed in any mode in the image G, not limited to two-dimensional or three-dimensional display. In contrast, the component E whose display mode is "non-display" is not displayed at all in the image G. The following description will be given of the case where the component E whose display mode is "display" is displayed in three dimensions.

[0070] 12(a) is an image generated when the display mode of all components E mounted on the board P is "display." The component E81 is a shield component. In this case, even if other components E are stored inside the shield component E81, the user cannot tell from the image G81 whether or not the other components E are present.

[0071] Image G82 in Fig. 12(b) is the image generated when the display mode of shield part E81 is changed from "display" to "non-display." Shield part E81 is no longer displayed in the image, and parts E82 and E83 stored inside shield part E81 become visible.

[0072] By changing the display mode from "display" to "non-display," as shown in image G82 in Figure 12(b), parts that were not displayed, such as parts E82 and E83 stored in the shield part E81 described above, which are hidden behind other parts, can be seen in image G82.

[0073] <Embodiment 3> A third embodiment will be described with reference to Fig. 13. In the third embodiment, the transparency of the displayed component E is changed. The configuration is the same as that of the first embodiment except that the change in the display mode is a change in transparency.

[0074] As shown in image G91 in FIG. 13(a), for example, if the transparency of shielding component E91 is 0% (not transparent), even if another component E is stored inside shielding component E91, the user cannot tell from image G91 whether or not component E is present. Note that the transparency can be changed arbitrarily between 0% and 100% (transparent). For example, if the transparency is specified to be 70%, the component is displayed semi-transparently, allowing the component itself to be seen, as well as other components and boards located behind the component.

[0075] For example, the display mode of the shield part E91 is changed to "transparency 70%" as shown in image G92 in Fig. 12(b). This causes the shield part E91 to be displayed semi-transparently, allowing the parts E92 and E93 stored inside to be seen through the shield part E91. <Embodiment 4> A fourth embodiment will be described with reference to Fig. 14. In the fourth embodiment, the color of the component E is changed. The configuration is the same as that of the first embodiment except that the change in the display mode is a change in color.

[0076] As shown in image G101 in Fig. 14(a), when the display form has not been changed, all parts E101 to E105 have the same color. When the display form of parts E104 and E105 is changed, the colors of these parts in the image are changed, as shown in image G102 in Fig. 14(b). This makes it possible to selectively highlight parts E104 and E105 whose display form has been changed.

[0077] <Other embodiments> (1) In the above embodiment, the component display system S is provided with both the storage unit 13 and the database DB, but it may be provided with only one of them.

[0078] (2) In the above embodiment, the initial setting of the display format is 2D display, and only part E that satisfies a predetermined condition is changed to 3D display. However, the initial setting may be 3D display, and the display may be changed to 2D display.

[0079] (3) For example, a certain area on the board P may be specified, and the predetermined condition may be "components mounted in a specific area on the board." Also, the display form may be changed by arbitrarily selecting components E displayed in the image G. Also, the predetermined condition may be "all components." In this case, an image G is generated and displayed in which the display form of all components has been changed.

[0080] (4) In the above embodiment, “shielded components” were used as an example of the type of component that can be applied under the specified conditions. However, this is not limited to shielded components, and various other types of components, such as resistors, transformers, and capacitors, may also be applied under the specified conditions.

[0081] (5) In the above embodiment, the predetermined condition is exemplified as "a component having a height greater than the threshold value H0." However, the predetermined condition may be "a component having a height smaller than the threshold value H0."

[0082] (6) In the above embodiment, the display format is changed for components that have been mounted after passing through a specific mounting device. However, the order in which components are mounted on the board P may also be the predetermined condition. For example, the predetermined condition may be "components mounted first to third" or "components mounted third to fourth."

[0083] (7) In the above embodiment, an error check was performed based on the upper limit of the height of component E that can be mounted by the mounting device. In addition to the upper limit of the height of component E, the error check may also determine whether component E can be mounted by the mounting device based on its weight, shape, material, surface condition, etc.

[0084] (8) In the above embodiment, the substrate P is given as an example of a mounted member, but the mounted member is not limited to a substrate. For example, the present invention can be applied to cases where components are mounted on a lead frame or a product housing, with these being used as mounted members. [Explanation of symbols]

[0085] 10 Image display device 11 Control section 14 Display section 17 Design Data 17A Parts Data 17B Mounting equipment data E parts P circuit board (an example of a "mounted component") G Image

Claims

1. An image display device that displays an image of a mount member on which a component is mounted and the component mounted on the mount member, a display unit that displays the image; a control unit, the control unit generates the image based on design data of the mounted component; the control unit changes a display form of a part that satisfies a predetermined condition among the parts included in the image to a display form that is different from a display form of other parts, and displays the part on the display unit; the design data includes part data relating to a part; the predetermined condition is a condition determined based on the part data, the design data includes mounting device data relating to a mounting device that mounts components on the mount target member, the control unit determines interference between components of the mounting device in a component mounting process and components already mounted on the target member based on the component data and the mounting device data; The image display device changes the display form of the already mounted component that is determined to be at risk of interference.

2. An image display device that displays an image of a mount member on which a component is mounted and the component mounted on the mount member, a display unit that displays the image; a control unit, the control unit generates the image based on design data of the mounted component; the control unit changes a display form of a part that satisfies a predetermined condition among the parts included in the image to a display form that is different from a display form of other parts, and displays the part on the display unit; The change in the display form is a change between displaying the part in two dimensions and displaying it in three dimensions in the generated image.

3. An image display method for displaying an image of a mount member on which a component is mounted, comprising: When changing the display mode of a part that satisfies a predetermined condition among the parts included in the image to a display mode different from the display mode of other parts and displaying the part on a display unit, determining whether or not there is interference between components of a mounting device in a mounting process of the component and a component already mounted on the mounted member; The image display method changes the display form of the already-mounted component that is determined to be at risk of interference.

4. An image display method for displaying an image of a mount member on which a component is mounted, comprising: When changing the display mode of a part that satisfies a predetermined condition among the parts included in the image to a display mode different from the display mode of other parts and displaying the part on a display unit, The image display method, wherein the change in the display form is a change between displaying the part in two dimensions and displaying it in three dimensions in the generated image.

Images