Film-forming composition, laminate obtained by applying the film-forming composition, fingerprint authentication sensor using the laminate, and method for forming a cured film

Abstract

To provide a film formation composition capable of forming a cured film which is excellent in developability, can suppress curing shrinkage even if the thickness of the cured film is increased, and has high hardness.SOLUTION: A film formation composition comprises: a siloxane polymer; a photopolymerizable compound having two or more radically polymerizable unsaturated double bonds; a polymerization initiator; a curing agent; a photoacid generator; a curing catalyst; and an organic solvent, The siloxane polymer contains: a silane-based compound (A) containing an organic group containing an amide bond, a carboxylic acid moiety or a carboxylic ester moiety or both of them in a molecule; a silane-based compound (B) having a radically polymerizable unsaturated double bond; and a silane-based compound (C) having an epoxy group in the molecule as constituent monomers. A molar ratio [the silane-based compound (A):the silane based compound (B)] between the silane-based compound (A) and the silane-based compound (B) is 1:0.8 to 2.4, and a molar ratio [the silane-based compound (C) / the whole of the constituent monomers constituting the siloxane polymer] of the silane-based compound (C) to the whole of the constituent monomers constituting the siloxane polymer is 7 to 50.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a film-forming composition, a laminate formed by applying the film-forming composition, a fingerprint authentication sensor using the laminate, and a method for forming a cured film. [Background technology]

[0002] In recent years, fingerprint authentication has been used for security purposes, and many mobile devices, such as smartphones, are equipped with this function.

[0003] Sensors with such fingerprint authentication functions often use silicon compounds as bonding pads. For example, Patent Document 1 discloses a bonded structure characterized in that an SiO2 film is formed on Si, a BPSG film or a PSG film is formed on the SiO2 film, a SiN film is formed on the BPSG film or the PSG film, a Poly-Si film is formed on the SiN film, and an Al-based wire is bonded onto the Poly-Si film. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-105291 Summary of the Invention [Problem to be solved by the invention]

[0005] The above-mentioned bonding pad (corresponding to the Poly-Si film in Patent Document 1) is sometimes formed by photolithography, and therefore, the film-forming composition for forming the bonding pad is required to have excellent developability.

[0006] Furthermore, in fingerprint authentication applications, the bonding pads may be located close to the surface, and therefore the cured coating is required to have high hardness in order to prevent unexpected scratches.

[0007] In order to achieve such high hardness, methods that have been considered include using a polyfunctional photopolymerizable compound as the film-forming composition that forms the bonding pad, and heat-curing the film-forming composition at high temperatures. However, these methods have had problems such as curing shrinkage and the generation of cracks.

[0008] On the other hand, fingerprint authentication applications require excellent light-collecting performance, and to achieve this light-collecting performance, the bonding pad needs to be thick (for example, 10 μm or more).

[0009] Therefore, there has been a demand for a film-forming composition that has excellent developability, can suppress cure shrinkage, and can form a cured film with high hardness, even when the film thickness is increased.

[0010] Therefore, an object of the present invention is to provide a film-forming composition that has excellent developability, can suppress cure shrinkage, and can form a cured film with high hardness, even when the film thickness of the cured film is increased. [Means for solving the problem]

[0011]

[0006] As a result of extensive investigations, the present inventors have focused on the siloxane polymer in a film-forming composition containing a siloxane polymer, a photopolymerizable compound having two or more radically polymerizable unsaturated double bonds, a polymerization initiator, a curing agent, a photoacid generator, a curing catalyst, and an organic solvent. They have found that the siloxane polymer contains, as constituent monomers, a silane compound (A) containing an organic group having an amide bond and a carboxylic acid moiety (described below) in the molecule, a silane compound (B) having a radically polymerizable unsaturated double bond, and a silane compound (C) having an epoxy group in the molecule, and that by setting the blending amounts of the silane compound (A) and the silane compound (B) within a predetermined range and setting the blending amount of the silane compound (C) relative to the total blending amount of the constituent monomers constituting the siloxane polymer within a predetermined range, it is possible to form a cured film that has excellent developability, suppresses cure shrinkage, and has high hardness, even when the film thickness is increased, and have thereby completed the present invention.

[0012] Specifically, the present invention provides a film-forming composition comprising a siloxane polymer, a photopolymerizable compound having two or more radically polymerizable unsaturated double bonds, a polymerization initiator, a curing agent, a photoacid generator, a curing catalyst, and an organic solvent, wherein the siloxane polymer contains, as constituent monomers, a silane compound (A) containing an organic group having an amide bond and a carboxylic acid moiety, a carboxylic acid ester moiety, or both, in the molecule, a silane compound (B) having a radically polymerizable unsaturated double bond, and a silane compound (C) having an epoxy group in the molecule, wherein the molar ratio of the silane compound (A) to the silane compound (B) [the silane compound (A):the silane compound (B)] is 1:0.8 to 2.4, and the molar ratio of the silane compound (C) to all the constituent monomers constituting the siloxane polymer [the silane compound (C) / all the constituent monomers constituting the siloxane polymer] is 7 to 50.

[0013] In the film-forming composition of the present invention, the siloxane polymer preferably further contains, as a constituent monomer, at least one silane compound (D) selected from the group consisting of tetraalkoxysilanes and bis(trialkoxysilyl)alkanes, and / or at least one silane compound (E) selected from the group consisting of alkyltrialkoxysilanes, dialkyldialkoxysilanes, cycloalkyltrialkoxysilanes, vinyltrialkoxysilanes, and phenyltrialkoxysilanes. The molar ratio of the silane compound (D) to the silane compound (E) [the silane compound (D):the silane compound (E)] is preferably 1:0.1-10. The present invention also provides a laminate having a cured film of the above-described film-forming composition on a substrate. The present invention also provides a fingerprint authentication sensor comprising the above laminate. The present invention also provides a method for forming a cured coating, comprising: a coating step of coating a substrate with the above-described coating composition; an exposure step of irradiating exposed areas with active energy rays to form a cured coating; and a development step of dissolving and removing the coating liquid in unexposed areas with a developer. [Effects of the Invention]

[0014] The present invention can provide a film-forming composition that has excellent developability, suppresses cure shrinkage, and is capable of forming a cured film with high hardness, even when the film thickness of the cured film is increased. DETAILED DESCRIPTION OF THE INVENTION

[0015] The film-forming composition of the present invention contains a siloxane polymer, a photopolymerizable compound having two or more radically polymerizable unsaturated double bonds, a polymerization initiator, a curing agent, a photoacid generator, a curing catalyst, and an organic solvent. The siloxane polymer contains, as constituent monomers, a silane compound (A) containing an organic group having an amide bond and a carboxylic acid moiety, a carboxylic acid ester moiety, or both, in the molecule; a silane compound (B) having a radically polymerizable unsaturated double bond; and a silane compound (C) having an epoxy group in the molecule. The molar ratio of the silane compound (A) to the silane compound (B) [silane compound (A):silane compound (B)] is 1:0.8 to 2.4, and the molar ratio of the silane compound (C) to all the constituent monomers constituting the siloxane polymer [silane compound (C) / total constituent monomers constituting the siloxane polymer] is 7 to 50.

[0016] The film-forming composition of the present invention has not only a carboxylic acid moiety or a carboxylic acid ester moiety, or both, in the siloxane polymer, but also a specific equivalent of an amide bond, thereby providing good developability even in thick films (10 μm or more), and by having a specific equivalent ratio of radically polymerizable unsaturated double bonds and epoxy groups, it is possible to impart to the cured film high hardness and suppression of cure shrinkage, even in thick films. However, the present invention should not be construed as being limited to the above mechanism.

[0017] (siloxane polymer) The siloxane polymer contains, as constituent monomers, a silane compound (A) containing an organic group having an amide bond and a carboxylic acid moiety or a carboxylic acid ester moiety, or both, in the molecule; a silane compound (B) having a radically polymerizable unsaturated double bond; and a silane compound (C) having an epoxy group in the molecule.

[0018] <Silane compound (A)> The silane compound (A) contains an organic group having an amide bond and a carboxylic acid moiety or a carboxylic acid ester moiety, or both, in the molecule. The phrase "containing an organic group having an amide bond and a carboxylic acid moiety or a carboxylic acid ester moiety, or both, in the molecule" means that the silane molecule contains either a combination of an amide bond and a carboxylic acid moiety (amic acid structure), or an amide bond and a carboxylic acid ester moiety (amic acid ester structure), or both. As the silane compound (A), a hydrolyzable organosilane disclosed in WO 2011 / 105368 and its production method can be appropriately selected and used.

[0019] The silane compound (A) is preferably a reaction product obtained by reacting aminopropyltriethoxysilane with succinic anhydride, hexahydrophthalic anhydride, or itaconic acid, and more preferably a reaction product obtained by reacting aminopropyltriethoxysilane with succinic anhydride. Specifically, it has a structure represented by the following chemical formula (1). [ka]

[0020] <Silane Compound (B)> The silane compound (B) has a radically polymerizable unsaturated double bond. Examples of the silane compound (B) include 3-(meth)acryloyloxypropylsilane compounds such as 3-(meth)acryloyloxypropylmethyldimethoxysilane, 3-(meth)acryloyloxypropyltrimethoxysilane, 3-(meth)acryloyloxypropylethyldiethoxysilane, and 3-(meth)acryloyloxypropyltriethoxysilane; and allylsilane compounds such as allyltrimethoxysilane and allyltriethoxysilane. Among these, 3-methacryloyloxypropyltrimethoxysilane is preferred from the viewpoints of high hydrolysis reactivity and crosslink density.

[0021] <Molar ratio of siloxane compound (A) to silane compound (B)> In the siloxane polymer, the molar ratio of the silane compound (A) to the silane compound (B) [the silane compound (A):the silane compound (B)] is 1:0.8 to 2.4.

[0022] If the molar ratio [the silane compound (A):the silane compound (B)] is less than 1:0.8, the cured film will not be able to adhere sufficiently to the substrate or the ITO electrode, resulting in poor developability (thicker lines in the L / S developability test described below). If the molar ratio exceeds 1:2.4, the uncured film will have insufficient solubility in a developer, particularly in a dilute alkaline developer (unable to form appropriate spaces in the L / S developability test described below).

[0023] The molar ratio of the silane compound (A) to the silane compound (B) [the silane compound (A):the silane compound (B)] is preferably 1:1.0 to 2.0, more preferably 1:1.5 to 1.8.

[0024] <Siloxane Compound (C)> The siloxane compound (C) has an epoxy group in the molecule. Examples of the siloxane compound (C) include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane, and 2-(3,4-epoxycyclohexyl)ethylmethyldiethoxysilane. Among these, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and 3-glycidoxypropyltrimethoxysilane are preferred from the viewpoint of crosslink density and high hydrolysis reactivity.

[0025] <Molar ratio of siloxane compound (C)> The molar ratio of the siloxane compound (C) to all of the constituent monomers constituting the siloxane polymer [the silane compound (C) / all of the constituent monomers constituting the siloxane polymer] is 7-50.

[0026] If the molar ratio of the siloxane compound (C) is less than 7, cure shrinkage occurs when the film-forming composition is cured. If the molar ratio of the siloxane compound (C) is more than 50, the solubility of the uncured film in a developer, particularly in a dilute alkaline developer, becomes insufficient (an appropriate space cannot be formed in the L / S developability test described below).

[0027] The molar ratio of the siloxane compound (C) to all of the constituent monomers constituting the siloxane polymer is preferably 15-35.

[0028] The molar ratio of the silane compound (A) to the siloxane compound (C) [the silane compound (A):the siloxane compound (C)] is preferably 1:0.1 to 1.0, more preferably 1:0.2 to 0.7, and even more preferably 1:0.3 to 0.6, from the viewpoint of providing favorable adhesion between the cured coating and the substrate or ITO electrode.

[0029] <Silane Compound (D) and Silane Compound (E)> The siloxane polymer preferably further contains, as a constituent monomer, at least one silane compound (D) selected from the group consisting of tetraalkoxysilanes and bis(trialkoxysilyl)alkanes, and / or at least one silane compound (E) selected from the group consisting of alkyltrialkoxysilanes, dialkyldialkoxysilanes, cycloalkyltrialkoxysilanes, vinyltrialkoxysilanes, and phenyltrialkoxysilanes.

[0030] The silane compound (D) is at least one selected from the group consisting of tetraalkoxysilanes and bis(trialkoxysilyl)alkanes.

[0031] Examples of the tetraalkoxysilane include tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetraisopropoxysilane, tetra-n-butoxysilane, tetraisobutoxysilane, ethoxytrimethoxysilane, dimethoxydiethoxysilane, and methoxytriethoxysilane.

[0032] Examples of the bis(trialkoxysilyl)alkane include bis(trimethoxysilyl)methane, bis(triethoxysilyl)methane, 1,2-bis(trimethoxysilyl)ethane, and 1,2-bis(triethoxysilyl)ethane.

[0033] Among these, from the viewpoint of versatility, tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetraisopropoxysilane, tetra-n-butoxysilane, tetraisobutoxysilane, bis(triethoxysilyl)methane, and 1,2-bis(triethoxysilyl)ethane are preferred, and tetramethoxysilane, tetraethoxysilane, and tetraisopropoxysilane are more preferred.

[0034] The silane compound (E) is at least one selected from the group consisting of alkyltrialkoxysilanes, dialkyldialkoxysilanes, cycloalkyltrialkoxysilanes, vinyltrialkoxysilanes, and phenyltrialkoxysilanes. The silane compound (E) is preferably an alkyltrialkoxysilane having a saturated hydrocarbon group, and is preferably a phenyltrialkoxysilane having an unsaturated hydrocarbon group.

[0035] Examples of the alkyltrialkoxysilane include methyltrimethoxysilane, methyltriethoxysilane, methyltri-n-propoxysilane, methyltriisopropoxysilane, methyltri-n-butoxysilane, methyltriisobutoxysilane, methyltri-sec-butoxysilane, methyltri-tert-butoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, ethyltri-n-propoxysilane, ethyltriisopropoxysilane, ethyltri-n-butoxysilane, ethyltriisobutoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, and n-propyltriethoxysilane. Examples of such silane include isopropyltri-n-propoxysilane, n-propyltriisopropoxysilane, n-propyltri-n-butoxysilane, n-propyltriisobutoxysilane, n-propyltri-sec-butoxysilane, n-propyltri-tert-butoxysilane, isopropyltrimethoxysilane, isopropyltriethoxysilane, isopropyltri-n-propoxysilane, isopropyltriisopropoxysilane, isopropyltri-n-butoxysilane, isopropyltriisobutoxysilane, isopropyltri-sec-butoxysilane, and isopropyltri-tert-butoxysilane.

[0036] Examples of the dialkyldialkoxysilane include dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldi-n-n-propoxysilane, dimethyldiisopropoxysilane, dimethyldi-n-butoxysilane, dimethyldiisobutoxysilane, dimethyldi-sec-butoxysilane, dimethyldi-tert-butoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyldi-n-propoxysilane, diethyldiisopropoxysilane, diethyldi-n-butoxysilane, diethyldiisobutoxysilane, and diethyl Di-sec-butoxysilane, diethyl di-tert-butoxysilane, di-n-propyl dimethoxysilane, di-n-propyl diethoxysilane, di-n-propyl di-n-propoxysilane, di-n-propyl diisopropoxysilane, di-n-propyl di-n-butoxysilane, di-n-propyl diisobutoxysilane, di-n-propyl di-sec-butoxysilane, di-n-propyl di-tert-butoxysilane, diisopropyl dimethoxysilane, diisopropyl diethoxysilane, diisopropyl di-n-propoxysilane, di Diisopropyldiisopropoxysilane, Diisopropyldi-n-butoxysilane, Diisopropyldiisobutoxysilane, Diisopropyldi-sec-butoxysilane, Diisopropyldi-tert-butoxysilane, Di-n-butyldimethoxysilane, Di-n-butyldiethoxysilane, Di-n-butyldi-n-propoxysilane, Di-n-butyldiisopropoxysilane, Di-n-butyldi-n-butoxysilane, Di-n-butyldiisobutoxysilane, Di-n-butyldi-sec-butoxysilane, Di-n-butyldi-tert-butoxysilane silane, diisobutyldimethoxysilane, diisobutyldiethoxysilane, diisobutyldi-n-propoxysilane, diisobutyldiisopropoxysilane, diisobutyldi-n-butoxysilane, diisobutyldiisobutoxysilane, diisobutyldi-sec-butoxysilane, diisobutyldi-tert-butoxysilane, di-sec-butyldimethoxysilane, di-sec-butyldiethoxysilane, di-sec-butyldi-n-propoxysilane, di-sec-butyldiisopropoxysilane, di-sec-butyldi-n-butoxysilane,Examples of such silane include di-sec-butyldiisobutoxysilane, di-sec-butyldi-sec-butoxysilane, di-sec-butyldi-tert-butoxysilane, di-tert-butyldimethoxysilane, di-tert-butyldiethoxysilane, di-tert-butyldi-n-propoxysilane, di-tert-butyldiisopropoxysilane, di-tert-butyldi-n-butoxysilane, di-tert-butyldiisobutoxysilane, di-tert-butyldi-sec-butoxysilane, and di-tert-butyldi-tert-butoxysilane.

[0037] Examples of the cycloalkyltrialkoxysilane include cyclopentyltrimethoxysilane, cyclopentyltriethoxysilane, cyclopentyltri-n-propoxysilane, cyclopentyltriisopropoxysilane, cyclopentyltri-n-butoxysilane, cyclopentyltriisobutoxysilane, cyclopentyltri-sec-butoxysilane, cyclopentyltri-sec-butoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, cyclohexyltri-n-propoxysilane, cyclohexyltriisopropoxysilane, cyclohexyltri-n-butoxysilane, cyclohexyltriisobutoxysilane, cyclohexyltri-sec-butoxysilane, cyclohexyltri-tert-butoxysilane, and the like. Examples of the vinyltrialkoxysilane include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri-n-propoxysilane, vinyltriisopropoxysilane, vinyltri-n-butoxysilane, vinyltriisobutoxysilane, vinyltri-sec-butoxysilane, and vinyltri-tert-butoxysilane.

[0038] Examples of the phenyltrialkoxysilane include phenyltrimethoxysilane, phenyltriethoxysilane, phenyltri-n-propoxysilane, phenyltrisopropoxysilane, phenyltri-nn-butoxysilane, phenyltriisobutoxysilane, phenyltri-sec-butoxysilane, and phenyltri-tert-butoxysilane. Among these, at least one selected from the group consisting of methyltriethoxysilane, dimethyldimethoxysilane, cyclohexyltriethoxysilane, vinyltriethoxysilane, and phenyltriethoxysilane is preferred, and methyltriethoxysilane and phenyltriethoxysilane are more preferred.

[0039] The molar ratio of the silane compound (D) to the silane compound (E) [the silane compound (D):the silane compound (E)] is preferably 1:0.1-10. When the molar ratio of the silane compound (D) to the silane compound (E) is within the above range, it is possible to achieve both good adhesion of the cured film and good developability of the uncured film. The molar ratio of the silane compound (D) to the silane compound (E) is more preferably 1:1.2-3.

[0040] The molar ratio of the silane compound (A) to the silane compound (E) [the silane compound (A):the silane compound (E)] is preferably 1:0.1 to 5.0, from the viewpoints of adhesion between the cured film and the substrate or ITO electrode, and solubility of the uncured film in a developer. The molar ratio [the silane compound (A):the silane compound (E)] is more preferably 1:0.8-3.0, and even more preferably 1:1.0-2.5.

[0041] <Other silane compounds> The siloxane polymer may contain other silane compounds. Other silane compounds include silane compounds having a mercapto group, such as mercaptoalkyltrialkoxysilane compounds such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 2-mercaptoethyltrimethoxysilane.

[0042] The molar ratio of the silane compound (A) to the other silane compounds [the silane compound (A):the other silane compounds] is preferably 1:0.1-1.0, more preferably 1:0.2-0.7, and even more preferably 1:0.3-0.6, from the viewpoint of providing favorable adhesion between the cured coating and the substrate or the ITO electrode.

[0043] <Method for producing siloxane polymer> Next, a method for producing the siloxane polymer will be described. As a method for producing the siloxane polymer, for example, a method can be used in which the silane compound (A) and the silane compound (B) are mixed in an appropriate container, and then the silane compound (C), and, if necessary, the silane compound (D), the silane compound (E), and the other silane compounds are mixed, and water, a polymerization catalyst, and, if necessary, a reaction solvent are added to cause hydrolysis and condensation. After the condensation reaction, unnecessary by-products other than the siloxane polymer are removed by extraction, dehydration, solvent removal, or the like, thereby obtaining the siloxane polymer.

[0044] The amount of water is preferably such that the number of water molecules is the same as the number of all hydrolyzable substituents of the silane-based compounds placed in the container. The main silane compounds used in the present invention have three or four hydrolyzable substituents per molecule. Therefore, when a large amount of such silane compounds is contained, the amount of water may be simply set to an amount such that the number of water molecules is 3 to 4 times the total number of silane compound molecules charged in the container (in terms of molar ratio, total amount of silane compounds:water=1:3-4).

[0045] As the polymerization catalyst, for example, an acid catalyst such as acetic acid or hydrochloric acid, or a base catalyst such as ammonia, triethylamine, cyclohexylamine or tetramethylammonium hydroxide can be used. The amount of the polymerization catalyst is preferably such that the number of molecules of the polymerization catalyst is 0.05 to 0.2 times the number of all molecules of the silane-based compounds placed in the vessel (in terms of molar ratio, total amount of silane-based compounds:polymerization catalyst=1:0.05 to 0.2).

[0046] As the reaction solvent, lower alcohols such as ethanol, n-propyl alcohol, isopropyl alcohol, etc.; ketone compounds such as acetone and methyl ethyl ketone, etc.; and ester compounds such as ethyl acetate and n-propyl acetate, etc. are preferred, and among these, lower alcohols are more preferred, and ethanol and isopropyl alcohol are even more preferred from the viewpoints of being able to maintain an appropriate reaction temperature and being easy to distill off. The reaction temperature is preferably 60 to 80° C., and the reaction time is preferably about 2 to 24 hours so that the reaction proceeds sufficiently.

[0047] <Siloxane polymer> The siloxane polymer preferably has a weight-average molecular weight (Mw) of 1,000 to 10,000. If the weight-average molecular weight (Mw) is less than 1,000, the curability of the film-forming composition may decrease, while if the weight-average molecular weight (Mw) is more than 10,000, the solubility of the film-forming composition may decrease. The weight average molecular weight (Mw) of the siloxane polymer is more preferably 1,500 to 8,000, and even more preferably 2,000 to 4,000.

[0048] The weight average molecular weight (Mw) can be measured by dissolving the siloxane polymer to prepare a 0.02% by mass solution, passing the solution through a filter (GL Sciences, GL Chromatodisc, aqueous 25A, pore size 0.2 μm), and then using a semi-micro GPC / SEC analysis system (JASCO Corporation) consisting of a size exclusion chromatography and a refractive index detector under the following conditions: Column: KF-603, KF-604 (Showa Denko) RI detector: RI-4035 (JASCO Corporation) PDA detector: MD-4015 (JASCO Corporation) Eluent:THF Flow rate: 1.0ml / min Injection volume: 100μl

[0049] (Photopolymerizable compound having two or more radically polymerizable unsaturated double bonds) The film-forming composition of the present invention contains a photopolymerizable compound having two or more radically polymerizable unsaturated double bonds.

[0050] Examples of the photopolymerizable compound having two or more radically polymerizable unsaturated double bonds include ester compounds of divalent or higher hydroxyl group-containing compounds and (meth)acrylic acid, such as 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, diethylene glycol di(meth)acrylate, acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetrapropylene glycol di(meth)acrylate, bisphenol A di(meth)acrylate, tris(2-hydroxyethyl)isocyanuric acid di(meth)acrylate, trimethylolpropane tri(meth)acrylate, glycerin tri(meth)acrylate, pentaerythritol tri(meth)acrylate, tris(2-hydroxyethyl)isocyanuric acid tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and the like.

[0051] Among these, from the viewpoint of being able to increase the crosslink density and impart excellent hardness to the cured coating, compounds having three or more reactive functional groups, such as trimethylolpropane tri(meth)acrylate, glycerin tri(meth)acrylate, pentaerythritol tri(meth)acrylate, tris(2-hydroxyethyl)isocyanuric acid tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate, are preferred, with tris(2-hydroxyethyl)isocyanuric acid tri(meth)acrylate and dipentaerythritol hexa(meth)acrylate being more preferred.

[0052] (Polymerization initiator) The film-forming composition of the present invention contains a polymerization initiator. As the polymerization initiator, it is preferable to use a photopolymerization initiator that will result in a sufficient photocuring reaction when forming a cured coating by the photolithography method described below. Examples of such photopolymerization initiators include benzil, benzoin, benzophenone, camphorquinone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl-[4'-(methylthio)phenyl]-2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenyl carbonyl compounds such as phenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide; trihalomethanes such as 1,3-bis(trichloromethyl)-5-(2'-chlorophenyl)-1,3,5-triazine and 2-[2-(2-furanyl)ethylenyl]-4,6-bis(trichloromethyl)-1,3,5-triazine; imidazole dimers such as 2,2'-bis(2-chlorophenyl)-4,5,4',5'-tetraphenyl-1,2'-biimidazole; and thioxanthone compounds such as 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, and 2,4-dichlorothioxanthone. These photopolymerization initiators can be used alone or in combination of two or more, and can also be combined with any photosensitizer.

[0053] (organic solvent) The film-forming composition of the present invention contains an organic solvent. As the organic solvent, organic solvents such as alcohols, polyhydric alcohols and their derivatives, ketone-based organic solvents, and ester-based organic solvents can be used.

[0054] Examples of the alcohols include lower alcohols such as methanol, ethanol, n-propyl alcohol-n-, isopropyl alcohol, n-butyl alcohol, isobutyl alcohol, and sec-butyl alcohol.

[0055] Examples of the polyhydric alcohols include ethylene glycol, propylene glycol, 1,2-butanediol, 1,3-butanediol, diethylene glycol, and dipropylene glycol.

[0056] Examples of derivatives of the above polyhydric alcohols include glycol monoethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol monoisopropyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol monoisobutyl ether, ethylene glycol monophenyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol monoisopropyl ether, propylene glycol mono-n-butyl ether, propylene glycol monoisobutyl ether, propylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol monoisopropyl ether, diethylene glycol mono-n-butyl ether, diethylene glycol monoisobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol-n-propyl ether, dipropylene glycol isopropyl ether, dipropylene glycol-n-butyl ether, and dipropylene glycol isobutyl ether. Also, ethylene glycol monomethyl ether acetate, ethylene glycol monomethyl ether propionate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-propyl ether acetate, ethylene glycol monoisopropyl ether acetate, ethylene glycol mono-n-butyl ether acetate, ethylene glycol monoisobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol mono-n-propyl ether acetate, propylene glycol monoisopropyl ether acetate, propylene glycol mono-n-butyl ether acetate, propylene glycol monoisobutyl ether acetate, diethylene Examples of the glycol monoether acylate include glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-propyl ether acetate, diethylene glycol monoisopropyl ether acetate, diethylene glycol mono-n-butyl ether acetate, diethylene glycol monoisobutyl ether acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol mono-n-propyl ether acetate, dipropylene glycol monoisopropyl ether acetate, dipropylene glycol mono-n-butyl ether acetate, and dipropylene glycol monoisobutyl ether acetate.

[0057] Examples of the ketone organic solvent include acetone, methyl ethyl ketone, methyl-n-propyl ketone, methyl isopropyl ketone, methyl-n-butyl ketone, methyl isobutyl ketone, and cyclohexanone.

[0058] Examples of the ester-based organic solvent include ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-amyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, methyl lactate, ethyl lactate, and n-propyl lactate.

[0059] The organic solvents may be used alone or in combination of two or more kinds. From the viewpoint of the solubility of the siloxane polymer and coating suitability, polyhydric alcohol derivatives and ester-based organic solvents are preferred, and propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol monoisopropyl ether, propylene glycol mono-n-butyl ether, propylene glycol monoisobutyl ether, propylene glycol monomethyl ether acetate, n-propyl acetate, and isopropyl acetate are more preferred.

[0060] (hardening agent) The film-forming composition of the present invention contains a curing agent. Examples of the curing agent include aromatic amine curing agents, acid anhydrides, phenol novolac resin silicone curing agents, and the like. Of these, acid anhydrides are preferred, and examples thereof include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, dodecenylsuccinic anhydride, and benzophenonetetracarboxylic dianhydride.

[0061] (Photoacid generator) The film-forming composition of the present invention contains a photoacid generator. Examples of the photoacid generator include onium salt compounds, trichloromethyl-s-triazines, sulfonium salts, iodonium salts, quaternary ammonium salts, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds.

[0062] (curing catalyst) The film-forming composition of the present invention contains a curing catalyst. The curing catalyst includes chelate compounds of metals such as aluminum, zirconium, and titanium.

[0063] (Other ingredients) The film-forming composition of the present invention may contain additives within the range that does not impair the effects of the present invention. Examples of the additives that can be added include: crosslinking agents having a crosslinkable functional group such as a carbodiimide, isocyanate, or epoxy group or thiol group; fluorine-based or silicone-based surfactants; photosensitizers such as aromatic hydrocarbons, amino compounds, nitro compounds, quinones, and xanthones; polymerization inhibitors such as hydroquinone, methoquinone, hindered amines, hindered phenols, di-t-butylhydroquinone, 4-methoxyphenol, butylhydroxytoluene, and nitrosamine salts; and fillers such as inorganic metal oxides and organic fine particles.

[0064] (Content of each material in the film-forming composition) The photopolymerizable compound having two or more radically polymerizable unsaturated double bonds is preferably contained in an amount of 10 to 50 parts by mass relative to 100 parts by mass of the siloxane polymer. If the content of the photopolymerizable compound having two or more radically polymerizable unsaturated double bonds is less than 10 parts by mass relative to 100 parts by mass of the siloxane polymer, the curability of the cured film and the adhesion to the substrate or ITO electrode may be insufficient. If the content exceeds 50 parts by mass relative to 100 parts by mass of the siloxane polymer, the solubility of the uncured film in the developer may be insufficient.

[0065] The polymerization initiator is preferably contained in an amount of 0.5 to 40 parts by mass when the total amount of the siloxane polymer and the polymerizable monomer having two or more radically polymerizable unsaturated double bonds is taken as 100 parts by mass. If the content of the polymerization initiator is less than 0.5 parts by mass, the photopolymerizability may decrease, and unreacted components may remain in the exposed area of ​​the photolithography method. If the content of the polymerization initiator is more than 40 parts by mass, the storage stability of the film-forming composition may decrease. The amount of the polymerization initiator is more preferably 1 to 20 parts by mass when the total amount of the siloxane polymer and the polymerizable monomer having two or more radically polymerizable unsaturated double bonds is 100 parts by mass.

[0066] The content of each of the curing agent, photoacid generator, and curing catalyst is about 0.1 to 10 parts by mass relative to 100 parts by mass of the siloxane polymer. The content of the additive is, for example, about 0.1 to 10 parts by mass relative to 100 parts by mass of the siloxane polymer.

[0067] (Method of producing a film-forming composition) A method for producing the film-forming composition of the present invention can be used in which an organic solvent is charged into an appropriate container, and while stirring with, for example, a high-speed stirrer, the siloxane polymer, the photopolymerizable compound having two or more radically polymerizable unsaturated double bonds, the polymerization initiator, the curing agent, the photoacid generator, the curing catalyst, and other materials, as needed, are charged and mixed. The method for producing the film-forming composition of the present invention is not limited to the above method, and the order in which the materials are charged may be arbitrary. Furthermore, if a solid material is soluble in an organic solvent, it may be dissolved in advance before being charged, or if it can be dispersed in an organic solvent directly or with the aid of a dispersant or the like, it may be dispersed in advance before being charged.

[0068] (Physical properties of the film-forming composition) <Developability> The film-forming composition of the present invention has excellent developability. The developability can be determined, for example, by the following L / S developability test.

[0069] The film-forming composition was diluted (with propylene glycol monomethyl ether acetate) to a non-volatile component concentration of 45%, and then coated onto a glass substrate using a spin coater (MS-A100, manufactured by Mikasa Co., Ltd.) at 200 rpm for 60 seconds to form a cured film with a thickness of 10 μm. Next, after heating (pre-baking) at 80°C for 3 minutes, the film was exposed to 100 mJ / cm using a TPE-200SI ultraviolet parallel exposure device (manufactured by Technopost Co., Ltd.) equipped with a mask with lines and spaces engraved on it. 2 A portion of the film is immersed in a 1% Na2CO3 / 1% nonal solution used as a developer for 90 seconds, then washed with ion-exchanged water, heated (post-baked) at 150°C for 30 minutes, rinsed with water, and dried to prepare a test piece for evaluating the L / S developability of the film-forming composition. The L / S of this test piece is evaluated using a film thickness measuring device (Alpha-Step IQ Surface Profiler, manufactured by KLM-Tencor).

[0070] In the above L / S developability test, if both L (line) and S (space) are 40 μm or less, it can be determined that the developability is excellent.

[0071] <Cure shrinkage> The film-forming composition of the present invention can suppress cure shrinkage during curing. The above-mentioned cure shrinkage can be determined, for example, by the following stress measurement test.

[0072] The film-forming composition was diluted (with propylene glycol monomethyl ether acetate) to a non-volatile component concentration of 45%, and then coated onto a silicon wafer using a spin coater (MS-A100, manufactured by Mikasa Co., Ltd.) at 200 rpm for 60 seconds to form a cured film with a thickness of 10 μm. Next, after heating (pre-baking) at 80°C for 3 minutes, 100 mJ / cm 2 A portion is then immersed in a 1% Na2CO3 / 1% nonal solution used as a developer for 90 seconds, followed by heating (post-baking) at 150°C for 30 minutes, rinsing with water, and drying to prepare a test piece for measuring the stress of the cured film. The test piece is subjected to stress measurement using a thin film stress measurement device FLX-2320 (manufactured by Yamato Material Co., Ltd.).

[0073] In the above stress measurement test, if the stress is less than 10 MPa, it can be determined that cure shrinkage can be sufficiently suppressed.

[0074] <Hardness> The film-forming composition of the present invention can form a cured film with high hardness. The hardness of the cured coating can be determined, for example, by the following pencil scratch test.

[0075] The film-forming composition was diluted (with propylene glycol monomethyl ether acetate) to a non-volatile component concentration of 45%, and then coated onto a glass substrate using a spin coater (MS-A100, manufactured by Mikasa Co., Ltd.) at 200 rpm for 60 seconds to form a cured film with a thickness of 10 μm. Next, after heating (pre-baking) at 80°C for 3 minutes, 100 mJ / cm 2 A portion is immersed in a 1% Na2CO3 / 1% nonal solution used as a developer for 90 seconds, then heated (post-baked) at 150°C for 30 minutes, washed with water, and dried to prepare a test piece for measuring the hardness of the cured film. The test piece is subjected to a pencil scratch test (pencil hardness test) evaluation in accordance with JIS K 5600-5-4:1999.

[0076] In the pencil scratch test, if the hardness is 4H or more, it can be determined that the hardness is sufficient.

[0077] (Method for forming a cured film) A method for forming a cured coating using the coating composition of the present invention preferably includes a coating step of coating the coating composition onto a substrate, an exposure step of irradiating the exposed areas with active energy rays to form a cured coating, and a development step of dissolving and removing the coating liquid in the unexposed areas with a developer. Such a method for forming a cured coating is also an aspect of the present invention.

[0078] The coating method in the coating step, the active energy rays to be irradiated to the exposed area in the exposure step and the irradiation method therefor, and the developer for removing the coating liquid from the exposed area can be appropriately selected from those and methods used in conventional photolithography methods. For example, the film-forming composition is diluted so that the concentration of non-volatile components becomes 45%, and then coated using a spin coater. After heating (pre-baking) at 80°C for 3 minutes, the composition is heated at 100 mJ / cm using a mask aligner. 2 A test pattern is baked under the irradiation conditions, immersed in a developer for 1 minute, and then heated (post-baked) at 150°C for 30 minutes, to obtain a hardened film.

[0079] The pre-baking conditions are preferably 80 to 100° C. and 1 to 3 minutes. The above irradiation conditions are 20 to 120 mJ / cm 2 It is preferable that: The post-baking conditions are preferably 120 to 180° C. and 30 to 60 minutes.

[0080] Furthermore, the substrate is not limited as long as it is translucent, and conventionally known glass substrates and plastic substrates used in touch panels and fingerprint authentication sensors can be used as appropriate, and the substrate may also be a substrate having a transparent electrode formed on its surface. When a transparent electrode is provided on the surface, it is preferable to form a cured film of the film-forming composition of the present invention on the surface on which the transparent electrode is formed. A laminate having a cured film of the film-forming composition of the present invention on the above substrate is also an aspect of the present invention. The laminate can be suitably used as a fingerprint authentication sensor, and a fingerprint authentication sensor using the laminate is also one aspect of the present invention. [Example]

[0081] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, "%" means "% by mass" and "parts" means "parts by mass."

[0082] <Preparation of Silane Compound (A)> 20.00 g of aminopropyltriethoxysilane was placed in a 200 ml three-neck flask, and while cooling in a water bath, 9.04 g of powdered succinic anhydride was added and stirred at room temperature for 20 minutes. The resulting crude product was then concentrated to obtain the compound represented by the above chemical formula (1). This was used in the synthesis of the siloxane polymer described below.

[0083] The following materials were used in the synthesis of the siloxane polymer: <Silane Compound (B)> 3-Methacryloyloxypropyltrimethoxysilane (Tokyo Chemical Industry Co., Ltd.) <Silane Compounds (C)> 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (Tokyo Chemical Industry Co., Ltd.) 3-Glycidoxypropyltrimethoxysilane (Tokyo Chemical Industry Co., Ltd.) <Silane Compounds (D)> Tetraethoxysilane (Tokyo Chemical Industry Co., Ltd.) <Silane Compounds (E)> Phenyltrimethoxysilane (Tokyo Chemical Industry Co., Ltd.) Methyltriethoxysilane (Tokyo Chemical Industry Co., Ltd.)

[0084] (Synthesis of Siloxane Polymer) The crude product of the silane compound (A) and each material in the blending ratios shown in Table 1 were dissolved in acetone in a reaction vessel equipped with a stirrer, a reflux condenser, a thermometer, and a dropping funnel to prepare a homogeneous solution. Water and nitric acid were added dropwise thereto, and the mixture was mixed under reflux for 60 minutes, and then the resulting reaction solution was cooled to room temperature. Thereafter, 20.00 g of propylene glycol monomethyl ether acetate was added to the reaction solution, and the reaction by-products, ethanol, water, and hydrochloric acid, were distilled off under reduced pressure to obtain a solution of a hydrolysis condensate. Thereafter, propylene glycol diethyl ether was added to the hydrolysis-condensation product solution to obtain a hydrolysis-condensation product solution having a solids concentration of siloxane polymers 1 to 13 of 45 mass %. The weight average molecular weights (Mw) of the above siloxane polymers 1 to 13 were measured under the conditions described in this specification and were all within the range of 1,000 to 10,000.

[0085] [Table 1]

[0086] (Preparation of Film-Forming Compositions of Examples 1 to 9 and Comparative Examples 1 to 10) The hydrolysis condensation product solution of polysiloxane compounds 1 to 13 and the other materials in the blending ratios shown in Tables 2 and 3 were added to a container equipped with a high-speed stirrer and stirred to prepare a film-forming composition.

[0087] The following materials were used to prepare the film-forming compositions of the Examples and Comparative Examples. <Photopolymerizable compound having two or more radically polymerizable unsaturated double bonds> Tris(2-hydroxyethyl)isocyanuric acid triacrylate (abbreviated as THITA, manufactured by Tokyo Chemical Industry Co., Ltd.) Dipentaerythritol hexaacrylate (DPHA, manufactured by Tokyo Chemical Industry Co., Ltd.) <Curing agent> Hexahydrophthalic anhydride (manufactured by New Japan Chemical Co., Ltd.) <Crosslinking agent> Karenz MT PE-1 (thiol-based crosslinking agent, manufactured by Showa Denko Karenz Co., Ltd.) <Polymerization initiator> Bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (Omnirad819, manufactured by IGM Resins BV) <Photoacid generator> CPI-100P (manufactured by Sanyo Chemical Industries, Ltd.) <Hardening catalyst> K-KAT5218 (aluminum-based hardening catalyst, manufactured by Enomoto Kasei Co., Ltd.) ZC-700 (zirconium-based hardening catalyst, manufactured by Matsumoto Fine Chemical Co., Ltd.) <Other materials> BYK-307 (silicone-based surfactant, manufactured by BYK Co., Ltd.)

[0088] <L / S developability test> The coating compositions for film formation in each of the Examples and Comparative Examples were diluted with (propylene glycol monomethyl ether acetate) so that the concentration of the non-volatile component became 45%, and using a spin coater (MS-A100, manufactured by Mikasa Co., Ltd.), they were coated on a glass substrate under the coating conditions of 200 rpm for 60 seconds so that the thickness of the cured film became 10 μm. Next, after heat treatment (pre-baking) at 80°C for 3 minutes, using an ultraviolet parallel exposure apparatus TPE-200SI (manufactured by Technopost Co., Ltd.) equipped with a mask with lines and spaces engraved, they were baked under the irradiation conditions of 100 mJ / cm 2 Then, a part of them was immersed in a 1% Na2CO3 / 1% nonyl aqueous solution used as a developer for 90 seconds, washed with ion-exchanged water, heat-treated (post-baking) at 150°C for 30 minutes, washed with water, and dried to prepare test pieces for evaluating the L / S developability of the coating composition for film formation. This test piece was evaluated for L / S using a film thickness measuring device (Alpha-Step IQ surface profiler, manufactured by KLM-Tencor Co., Ltd.). The results are shown in Tables 2 and 3. In addition, in the L / S developability test, those in which both L (line) and S (space) were 40 μm or less were judged to have excellent developability. For the coating composition for film formation in Comparative Example 5, since it did not dissolve in the developer and could not be patterned, the evaluation was described as "-".

[0089] <Stress measurement test> Each of the film-forming compositions of the Examples and Comparative Examples was diluted with propylene glycol monomethyl ether acetate to a non-volatile component concentration of 45%, and then coated onto a silicon wafer using a spin coater (MS-A100, manufactured by Mikasa Co., Ltd.) at 200 rpm for 60 seconds to form a cured film having a thickness of 10 μm. Next, after heating (pre-baking) at 80°C for 3 minutes, 100 mJ / cm 2 A portion was immersed in a 1% Na2CO3 / 1% nonal solution used as a developer for 90 seconds, then heated (post-baked) at 150°C for 30 minutes, washed with water, and dried to prepare a test piece for measuring the stress of the cured film. The test pieces were subjected to stress measurement using a thin film stress measurement device FLX-2320 (manufactured by Yamato Material Co., Ltd.), and were evaluated according to the following criteria. The results are shown in Tables 2 and 3. (Evaluation criteria) ○: Stress is less than 10 MPa ×: Stress is 10 MPa or more

[0090] <Pencil hardness test> Each of the film-forming compositions of the Examples and Comparative Examples was diluted with propylene glycol monomethyl ether acetate to a non-volatile component concentration of 45%, and then coated onto a glass substrate using a spin coater (MS-A100, manufactured by Mikasa Co., Ltd.) at 200 rpm for 60 seconds to form a cured film having a thickness of 10 μm. Next, after heating (pre-baking) at 80°C for 3 minutes, 100 mJ / cm 2 A portion was immersed in a 1% Na2CO3 / 1% nonal solution used as a developer for 90 seconds, then heated (post-baked) at 150°C for 30 minutes, washed with water, and dried to prepare a test piece for measuring the hardness of the cured film. The test pieces were subjected to a pencil scratch test (pencil hardness test) in accordance with JIS K 5600-5-4: 1999. The results are shown in Tables 2 and 3. In addition, a hardness of 4H or more in a pencil hardness test was determined to be sufficient.

[0091] [Table 2]

[0092] [Table 3]

[0093] It was confirmed that the film-forming compositions of Examples 1 to 9 of the present invention were able to form cured films with excellent developability, suppressed cure shrinkage, and high hardness, even when the cured films had a thickness of 10 μm. In particular, Examples 4 and 5, which contained the silane compound (D) and the silane-based compound (E) at a predetermined molar ratio, exhibited extremely excellent developability. [Industrial Applicability]

[0094] The film-forming composition of the present invention has excellent developability, can suppress cure shrinkage, and can form cured films with high hardness, even when the film thickness is increased. Therefore, the film-forming composition of the present invention can be suitably used as an insulating film to be applied to a light-transmitting substrate such as a touch panel.

Claims

1. The composition contains a siloxane polymer, a photopolymerizable compound having two or more radically polymerizable unsaturated double bonds, a polymerization initiator, a curing agent, a photoacid generator, a curing catalyst, and an organic solvent, The siloxane polymer contains, as constituent monomers, a silane compound (A) containing an organic group having an amide bond and a carboxylic acid moiety or a carboxylic acid ester moiety or both in the molecule, a silane compound (B) having a radically polymerizable unsaturated double bond, and a silane compound (C) having an epoxy group in the molecule; the molar ratio of the silane compound (A) to the silane compound (B) [the silane compound (A):the silane compound (B)] is 1:0.8 to 2.4, the molar ratio of the silane compound (C) to the total constituent monomers constituting the siloxane polymer [the silane compound (C) / total constituent monomers constituting the siloxane polymer] is 7 to 50 mol %; A film-forming composition comprising:

2. 2. The film-forming composition according to claim 1, wherein the siloxane polymer further contains, as a constituent monomer, at least one silane-based compound (D) selected from the group consisting of tetraalkoxysilanes and bis(trialkoxysilyl)alkanes, and / or at least one silane-based compound (E) selected from the group consisting of alkyltrialkoxysilanes, dialkyldialkoxysilanes, cycloalkyltrialkoxysilanes, vinyltrialkoxysilanes, and phenyltrialkoxysilanes.

3. 3. The film-forming composition according to claim 2, wherein the molar ratio of the silane-based compound (D) to the silane-based compound (E) [the silane-based compound (D):the silane-based compound (E)] is 1:0.1 to 10.

4. A laminate comprising a substrate and a cured film of the film-forming composition according to any one of claims 1 to 3.

5. A fingerprint authentication sensor comprising the laminate according to claim 4.

6. 4. A method for forming a cured coating, comprising: a coating step of coating a substrate with the coating composition according to claim 1; an exposure step of irradiating exposed areas with active energy rays to form a cured coating; and a development step of dissolving and removing unexposed areas of the coating liquid with a developer.

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