Semiconductor cooling mechanism

Abstract

To provide a semiconductor cooling mechanism that effectively improves the temperature lowering effect. [Solution] The conditioned air outlet of the non-contact cooling system is connected to the conditioned air inlet of the cooling pad body and is used to deliver conditioned air to the cooling pad body. The cooling patch system includes a cold pack module and a cooling host. The inside of the cooling pad body has a plurality of temperature-reducing air holes, which are connected to the conditioned air inlet. The cold pack module includes a cold pack bag and a cold air conduction block. The cold air conduction block includes a cold air conduction section and a cold air conduction section, with the cold air conduction section located outside the cold pack bag and the cold air conduction section located inside the cold pack bag. A cold storage material is contained within the cold pack bag, and the low-temperature end surface of the cooling host is attached to the cold air conduction section, and the cooling host conducts cold air to the cold storage material via the cold air conduction block. The cold pack module is located inside the cooling pad body, and the contact surface of the cold pack bag avoids the temperature-reducing air holes.

Description

[Technical Field]

[0001] The present invention relates to the technical field of semiconductor cooling, and more particularly to semiconductor cooling mechanisms. [Background technology]

[0002] Based on the relationship between environmental temperature and the human body's thermal balance, living environments above 35°C and working environments above 32°C are generally considered high-temperature environments. High-temperature environments can cause abnormal changes in human physiological functions, particularly thermoregulation, water and salt metabolism, and blood circulation. For example, excessive sweating increases the strain on the cardiovascular system. When high temperatures exceed the human body's endurance limits, mild cases can lead to reduced concentration and work efficiency, while severe cases can cause heatstroke and, in more serious cases, sudden death, endangering the personal safety of workers and potentially causing unnecessary economic losses.

[0003] People who work long periods of time in outdoor environments without air conditioning, especially in high-temperature environments, such as police officers working in the scorching heat of summer, construction workers working under the blazing sun, and maintenance workers performing maintenance work at high altitudes, often have to continue working for a certain period of time while overcoming various discomforts caused by high temperatures. When working in a high-temperature environment while wearing ordinary clothing, people sweat, and the sweat is transferred to the surface of the clothing through diffusion and conduction, and some heat is lost through evaporation of the sweat. However, because the evaporation sources for sweat are limited, the amount of heat lost is also limited. In particular, when working in a high-temperature environment for a certain period of time, ordinary clothing is not effective in reducing body temperature within a certain period of time.

[0004] To address these issues, existing technologies have introduced cooling clothing to regulate body temperature. However, currently available cooling clothing typically uses a single cooling method—either air or liquid—and therefore has very limited cooling effect on the human body. For example, the Chinese invention patent "Temperature Control and Dehumidification Device for Portable Protective Clothing Microspace" (Publication Number CN117045006A) uses a hybrid air supply method to regulate the temperature and humidity inside the protective clothing, creating a comfortable environment inside the clothing. This allows the user's comfort inside the protective clothing to be adjusted through hybrid air supply and parallel adjustment of humidity and heat inside the protective clothing while maintaining the protective clothing's protective effect. In addition, the Chinese utility model patent "Phase Change Cooling Clothing with Excellent Cooling Effect" (Publication Number CN220343733U) uses a water pump to pump ice water into a liquid circulation line and then into an ice water bag, so that the ice water absorbs heat from the body during circulation, thereby achieving the cooling effect of the cooling clothing. Therefore, there is a need for cooling clothing that can effectively enhance the cooling effect. Summary of the Invention [Problem to be solved by the invention]

[0005] The objective of the present invention is to provide a semiconductor cooling mechanism that can effectively improve the cooling effect by combining liquid cooling and air cooling to achieve the purpose of cooling, and overcome the defects in the prior art. [Means for solving the problem]

[0006] To achieve this goal, the technical solutions adopted by the present invention are as follows:

[0007] A semiconductor cooling mechanism comprising a cooling pad body, a cooling patch system, and a non-contact temperature reducing system; a conditioned air inlet is provided in the cooling pad body, a conditioned air outlet of the non-contact temperature reduction system is connected to the conditioned air inlet, and the non-contact temperature reduction system is used to deliver conditioned air to the cooling pad body; The cooling patch system includes a cold pack module and a cooling host, the conditioned air inlet is located on the cooling pad body, and a plurality of cooling air vents are opened inside the cooling pad body, and the cooling air vents are connected to the conditioned air inlet; the cold pack module includes a cold pack bag and a cold air conduction block, the cold air conduction block includes a cold air conduction part and a cold air transfer part, the cold air conduction part is arranged outside the cold pack bag, the cold air transfer part is arranged inside the cold pack bag, a cold storage material is accommodated inside the cold pack bag, the low-temperature end surface of the semiconductor cooling sheet of the cooling host is attached to the cold air conduction part, the cooling host transfers cold air to the cold storage material via the cold air conduction block, the cold pack module is arranged inside the cooling pad body, and the contact surface of the cold pack bag avoids the temperature-lowering air hole, a semiconductor cooling mechanism.

[0008] Preferably, the cross-sectional area of ​​the cold air transfer portion is equal to or greater than the cross-sectional area of ​​the cold air conduction portion.

[0009] Preferably, the cold air conducting portion is protruded from the center of the outer side of the cold air transmitting portion.

[0010] Preferably, the cold pack module further comprises a plastic pressure plate fitted around the cold air conducting part and attached to the outer surface of the cold air conducting part. The inner wall of the cold pack bag is attached to the outer surface of the plastic pressure plate.

[0011] Preferably, a plurality of parallel protrusions are provided on the rear side of the cool air transfer part, and the plastic pressure plate is attached to the outer surface of the cool air transfer part via the protrusions.

[0012] Preferably, a plurality of escape prevention grooves recessed inward are arranged on the rear side of the cool air transfer part, and the plastic pressure plate is attached to the outer surface of the cool air transfer part through the escape prevention grooves.

[0013] Preferably, the escape prevention groove includes a communicating portion and a protruding portion that communicate in this order from the outside to the inside, and the height of the protruding portion is greater than the height of the communicating portion.

[0014] Preferably, there are at least two escape prevention grooves, each located on either side of the cool air conducting portion.

[0015] Preferably, the cooling host is disposed outside the cooling pad body, and the cooling host is located outside the cooling pad body. The cold air conducting part penetrates the cooling pad body and is then attached to the cold end surface of the cooling host.

[0016] Preferably, the cooling host comprises a cooling shell, the semiconductor cooling sheet, a radiator, and a heat dissipation fan, and the semiconductor cooling sheet, the radiator, and the heat dissipation fan are all mounted within the cooling shell. The semiconductor cooling sheet has a high temperature end surface and a low temperature end surface, the high temperature end surface is attached to the radiator, and a plurality of heat dissipation channels are formed in the radiator, and the outlet of the heat dissipation fan faces the inlet of the heat dissipation channels. The cooling shell has an air inlet, a heat dissipation outlet, and a cold air conduction outlet, which is located on the inner wall of the cooling shell and is used to accommodate the cold air conduction part while avoiding the cold end surface of the semiconductor cooling sheet. The air inlet is disposed adjacent to the inlet of the heat dissipation fan, and the heat dissipation outlet is disposed adjacent to the outlet of the heat dissipation channel.

[0017] Preferably, the heat dissipation fan is a centrifugal fan, and the air inlet and the heat dissipation outlet are both located on the outer wall of the cooling shell.

[0018] Preferably, the heat dissipation fan is an axial fan, the air inlet is located on the bottom wall of the cooling shell, and the heat dissipation outlet is located on the top wall of the cooling shell.

[0019] Preferably, the cooling pad body includes an exhaust layer, an air duct layer, and a heat insulating outer layer, which are arranged in this order from inside to outside. The exhaust layer has a plurality of the temperature-reducing air holes arranged therein, and the regulated air inlet and the temperature-reducing air holes communicate with each other via the air duct layer.

[0020] Preferably, the regulated air inlet is located at the bottom of the cooling pad body, and the diameter of the cooling air holes is gradually reduced from top to bottom.

[0021] Preferably, the air duct layer is a 3D support structure having a plurality of intertwined support ribs disposed within the 3D support structure.

[0022] Preferably, a windbreak strip is protruded from the edge of the air duct layer and surrounds the air retention cavity, and the windbreak strip is provided with air supply notches that communicate with the adjusted air inlets. A plurality of support blocks are protruded from the inside of the air duct layer, and the surfaces of the support blocks abut against the outside of the exhaust layer.

[0023] Preferably, an auxiliary heat dissipation outlet is opened at the upper edge of the cooling pad body, and the regulated air inlet and the auxiliary heat dissipation outlet communicate with each other through the air duct layer. The cooling host is disposed within the cooling pad body, the cooling host is located within the air duct layer, and the cold air conducting part penetrates the exhaust layer and is then attached to the cold end surface of the cooling host. The cooling host comprises a semiconductor cooling element and a heat dissipation element arranged in order from the inside to the outside, the semiconductor cooling element having a high-temperature end face and a low-temperature end face, the low-temperature end face being attached to the cold air conduction part, and the high-temperature end face being attached to the heat dissipation element. A plurality of vertically extending heat conduction channels are formed in the heat dissipation element, and the air duct layer, the heat conduction channels, and the auxiliary heat dissipation outlet are sequentially connected to each other.

[0024] Preferably, the cooling host further comprises an attachment shell and an attachment cover. The mounting shell and the mounting cover together enclose a mounting cavity for mounting the semiconductor cooling element and the heat dissipation element, the mounting shell being located inside the semiconductor cooling element and the mounting cover being located outside the heat dissipation element. The mounting cavity has an avoidance opening at both the top and bottom, and the avoidance opening at the bottom of the mounting cavity is used to avoid the entrance of the heat conduction channel, and the avoidance opening at the top of the mounting cavity is used to avoid the exit of the heat conduction channel. A cold conduction mounting port is provided at the center of the mounting shell, and the cold conduction mounting port is used to accommodate the cold conduction part while avoiding the cold end surface of the semiconductor cooling element.

[0025] Preferably, the air duct layer comprises an inner alignment layer and an outer alignment layer, and the inner alignment layer is located inside the outer alignment layer. The oriented inner layer is a 3D support structure having a plurality of intertwined support ribs disposed within the 3D support structure. A windproof rib is protruded from the inner edge of the outer orientation layer, and the outer orientation layer and the inner orientation layer together surround the air storage cavity via the windproof rib. The windproof rib has an air intake notch on its side surface that communicates with the regulated air inlet, and an upper portion of the windproof rib has a heat dissipation notch on its top surface that communicates with the auxiliary heat dissipation outlet. The heat-dissipating element has a heat-conducting channel positioned above the heat-dissipating notch.

[0026] Preferably, an orientation rib located on top of the windproof rib protrudes from the inner edge of the orientation outer layer, the windproof rib and the orientation rib together surround a heat dissipation cavity, the air storage cavity and the heat dissipation cavity communicate with each other through the heat dissipation notch, and the outlet of the heat dissipation cavity communicates with the auxiliary heat dissipation outlet.

[0027] Preferably, the heat dissipation cavity has a Y-shape, and the outlets of the heat dissipation cavity are located on both sides of the top of the alignment outer layer. The auxiliary heat dissipation outlet is disposed adjacent to the outlet of the heat dissipation cavity.

[0028] Preferably, the cooling pad body further includes an air-permeable mesh inner layer, and the air-permeable mesh inner layer, the exhaust layer, the air duct layer, and the heat-insulating outer layer are arranged in this order from the inside to the outside.

[0029] Preferably, the cooling pad body further includes a fixing belt connected to the insulating outer layer.

[0030] Preferably, at least two cooling patch systems are provided. [Effects of the Invention]

[0031] The technical solution provided by the present invention may include the following beneficial effects:

[0032] 1. When the semiconductor cooling mechanism of this solution is operating, the conditioned air acts on the cooling pad body, and the low-temperature fluid formed by the cold storage material and the airflow formed by the conditioned air are used together to remove heat from the human body, creating a dual flow field of low-temperature fluid and low-temperature airflow around the human body. The wearer can feel the conditioned airflow while in direct contact with the cold pack bag containing the cold storage material, which further enhances the coolness felt by the wearer and allows the wearer to feel a stronger cooling effect, further helping to satisfy the wearer's usage experience.

[0033] 2. The cold pack module of this solution comprises a cold pack bag and a cold conduction block, and the cold conduction block comprises a cold conduction part and a cold transfer part. The cold transfer part of the cold conduction block is in direct contact with the cold storage material in the cold pack bag, thereby reducing the heat loss during the process of the cold storage material passing through pipes etc. entering and leaving the cold pack bag, and more efficiently transferring the cold air generated by the semiconductor cooling sheet of the cooling host directly to the cold storage material, improving the conversion rate of the cooling host. [Brief explanation of the drawings]

[0034] [Figure 1] 1 is a schematic structural diagram of a semiconductor cooling mechanism according to the present invention; [Figure 2] FIG. 2 is a cross-sectional view of a cold pack module in the semiconductor cooling mechanism of the present invention. [Figure 3] 1 is a schematic structural diagram of a cool air conduction block in a semiconductor cooling mechanism of the present invention. [Figure 4] 1 is a schematic structural diagram of a first embodiment of a contact-type cooling pad in a semiconductor cooling mechanism of the present invention; [Figure 5] 1 is a partial exploded view of a first embodiment of a contact-type cooling pad in a semiconductor cooling mechanism of the present invention. [Figure 6] 1 is a schematic structural diagram of a second embodiment of a contact-type cooling pad in a semiconductor cooling mechanism of the present invention; [Figure 7] FIG. 10 is a partial structural exploded view of a second embodiment of a contact-type cooling pad in a semiconductor cooling mechanism of the present invention. [Figure 8] 1 is a schematic structural diagram of an embodiment of an air duct layer in a semiconductor cooling mechanism of the present invention; [Figure 9] 10 is a schematic structural diagram of another embodiment of the air duct layer in the semiconductor cooling mechanism of the present invention. FIG. [Figure 10] 10 is a schematic structural diagram of a third embodiment of a contact-type cooling pad in a semiconductor cooling mechanism of the present invention. FIG. [Figure 11] FIG. 10 is a partial structural exploded view of a third embodiment of a contact-type cooling pad in a semiconductor cooling mechanism of the present invention. [Figure 12]1 is a structural exploded view of an embodiment of a non-contact temperature decreasing system in a semiconductor cooling mechanism of the present invention. [Figure 13] 1 is a structural exploded view of an embodiment of a non-contact temperature decreasing system in a semiconductor cooling mechanism of the present invention. [Figure 14] 1 is a structural exploded view of an embodiment of a non-contact temperature decreasing system in a semiconductor cooling mechanism of the present invention. [Figure 15] 1 is a structural exploded view of an embodiment of a non-contact temperature decreasing system in a semiconductor cooling mechanism of the present invention. [Figure 16] 1 is a schematic partial structural view of a semiconductor cooling mechanism according to the present invention;

[0035] In the above diagram, the arrows indicate the direction of air flow. DETAILED DESCRIPTION OF THE INVENTION

[0036]

[0023] The embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, in which the same or similar reference numerals throughout the drawings represent the same or similar elements, or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are illustrative and are used only to explain the present invention, and should not be construed as limiting the present invention.

[0037] The present technical solution provides a semiconductor cooling mechanism, which includes a cooling pad body 11, a cooling patch system, and a non-contact cooling system 2.

[0038] A conditioned air inlet is opened in the cooling pad main body 11, and the conditioned air outlet 212 of the non-contact temperature reduction system 2 is connected to the conditioned air inlet, and the non-contact temperature reduction system 2 is used to transport conditioned air to the cooling pad main body 11.

[0039] The cooling patch system includes a cold pack module 12 and a cooling host 13, the conditioned air inlet is located in the cooling pad body 11, and a plurality of cooling air vents 1111 are opened inside the cooling pad body 11, and the cooling air vents 1111 are connected to the conditioned air inlet.

[0040] The cold pack module 12 includes a cold pack bag 121 and a cold air conduction block 122, the cold air conduction block 122 includes a cold air conduction portion 1221 and a cold air transmission portion 1222, the cold air conduction portion 1221 is arranged outside the cold pack bag 121, the cold air transmission portion 1222 is arranged inside the cold pack bag 121, a cold storage material is contained in the cold pack bag 121, the low temperature end surface of the semiconductor cooling sheet 132 of the cooling host 13 is attached to the cold air conduction portion 1221, the cooling host 13 transmits cold air to the cold storage material through the cold air conduction block 122, the cold pack module 12 is arranged inside the cooling pad body 11, and the contact surface 1211 of the cold pack bag 121 avoids the temperature-lowering air holes 1111.

[0041] Currently available cooling clothing typically uses a single cooling method, either air or liquid, resulting in very limited cooling effects on the human body. Therefore, to enhance the cooling effect of existing wearable cooling products, this technical solution proposes a semiconductor cooling mechanism that combines cold compresses and air cooling by using a cooling material (such as water or gel that can store and dissipate cold air) to achieve the cooling purpose, further enhancing the wearer's satisfaction with the usage experience. Furthermore, because the wearable product of this solution is designed in the form of a cooling pad, it can be worn alone or flexibly combined with products such as backpacks and car seat cushions, making it applicable to a wider range of scenarios and further improving the applicability of cooling pads.

[0042] 1 to 16, the main body of the semiconductor cooling mechanism of the present solution includes a cooling pad main body 11 worn on the human body, a cooling patch system (i.e., a cold pack module 12 for storing a cold storage material and a cooling host 13 for transmitting cold air to the cold storage material), and a non-contact temperature-reducing system 2 for generating conditioned air. When the semiconductor cooling mechanism of the present solution is operating, the conditioned air acts on the cooling pad main body 11, and the low-temperature fluid formed by the cold storage material and the airflow formed by the conditioned air are used in combination to remove heat from the human body, creating a dual flow field of low-temperature fluid and low-temperature airflow around the human body. This allows the wearer to feel the flow of conditioned air under the condition that they are in direct contact with the cold pack bag 121 containing the cold storage material, thereby further enhancing the coolness felt by the wearer and allowing the wearer to feel a stronger temperature-reducing effect, further helping to satisfy the wearer's usage experience.

[0043] In addition, in the cold pack module 12 of this technical solution, the cold air transmission part 1222 of the cold air conduction block 122 is in direct contact with the cold storage material in the cold pack bag 121, thereby reducing the heat loss in the process of the cold storage material passing through pipes, etc., entering and exiting the cold pack bag 121, and the cold air generated by the semiconductor cooling sheet 132 in the cooling host 13 is more efficiently transmitted directly to the cold storage material, thereby improving the conversion rate of the cooling host 13.

[0044] In one embodiment, in order to make the semiconductor cooling mechanism of the present solution more convenient to wear, the regulated air outlet 212 of the non-contact temperature reducing system 2 and the regulated air inlet of the cooling pad body 11 are detachably connected via a hollow elastic band.

[0045] In this solution, the inside of the cooling pad body 11 refers to the side that comes into direct contact with the wearer's body surface. The cool air conduction block 122 of this solution may be an aluminum block.

[0046] Preferably, the cross-sectional area of ​​the cold air transfer portion 1222 is equal to or greater than the cross-sectional area of ​​the cold air transfer portion 1221 .

[0047] As shown in FIG. 3, this not only reduces the space occupied by the cooling host 13, but also increases the contact surface 1211 of the cold compress bag 121, thereby improving the cooling effect of the cold compress bag 121.

[0048] Preferably, the cool air conduction part 1221 is protruded from the outer central part of the cool air transfer part 1222. In this way, the cool air conduction part 1221 helps transfer cool air uniformly.

[0049] Preferably, the cold pack module 12 further includes a plastic pressure plate 123 fitted around the cold air conducting part 1221 and attached to the outer surface of the cold air conducting part 1222. The inner wall of the cold pack bag 121 is attached to the outer surface of the plastic pressure plate 123 .

[0050] In order to achieve a sealed installation between the cold pack bag 121 and the cold air conduction block 122, in this solution, a plastic pressure plate 123 is further installed in the cold pack module 12, and as shown in Figure 2, the inner wall of the cold pack bag 121 and the outer surface of the plastic pressure plate 123 are pressed and fixed to improve the sealing performance of the cold pack bag 121.

[0051] The plastic pressure plate 123 of this solution is formed by injection molding onto the outer surface of the cool air transfer part 1222.

[0052] Preferably, a plurality of parallel protrusions 12221 are protruded from the rear side of the cool air transfer part 1222, and the plastic pressure plate 123 is attached to the outer surface of the cool air transfer part 1222 via the protrusions 12221.

[0053] In a preferred embodiment of this technical solution, in order to improve the sealing performance of the cold pack bag 121 by improving the adhesion between the plastic pressure plate 123 and the cold air conduction block 122, this solution further provides a plurality of parallel protrusions 12221 on the rear side of the cold air transmission part 1222, as shown in Figure 3, which increases the contact area between the cold air transmission part 1222 and the plastic pressure plate 123, thereby improving the adhesion between the plastic pressure plate 123 and the cold air conduction block 122.

[0054] Preferably, the cross-sectional shape of the ridge 12221 is triangular.

[0055] Preferably, a plurality of anti-escape grooves 12222 recessed inward are arranged on the rear side of the cool air transfer part 1222, and the plastic pressure plate 123 is attached to the outer surface of the cool air transfer part 1222 through the anti-escape grooves 12222.

[0056] In another preferred embodiment of the present technical solution, in order to improve the sealing performance of the cold pack bag 121 by improving the adhesion between the plastic pressure plate 123 and the cold air conduction block 122, the present solution further arranges a plurality of anti-escape grooves 12222 recessed inward on the rear side of the cold air transmission part 1222, as shown in FIG. 3, which not only increases the contact area between the cold air transmission part 1222 and the plastic pressure plate 123, but also effectively prevents the plastic pressure plate 123 from separating from the rear side of the cold air transmission part 1222, thereby improving the adhesion between the plastic pressure plate 123 and the cold air conduction block 122.

[0057] Preferably, the escape prevention groove 12222 includes a communication portion 12222a and a protrusion 12222b that are connected in order from the outside to the inside, and the height of the protrusion 12222b is greater than the height of the communication portion 12222a, which further helps to prevent separation between the plastic pressure plate 123 and the rear surface of the cool air transfer portion 1222.

[0058] Preferably, the cross-sectional shape of the protrusion 12222b is any one of a circle, an ellipse, a rectangle, a triangle, and a trapezoid.

[0059] Preferably, there are at least two escape prevention grooves 12222, each located on either side of the cold air conduction part 1221. This further helps to improve the adhesion between the plastic pressure plate 123 and the cold air conduction block 122.

[0060] Preferably, the cooling host 13 is disposed outside the cooling pad body 11 , and the cooling host 13 is located outside the cooling pad body 11 . The cold air conducting part 1221 passes through the cooling pad body 11 and is then attached to the low temperature end surface of the cooling host 13 .

[0061] The cooling host 13 of this solution may be an external cooling host. Specifically, the cold pack module 12 and the cooling host 13 may be respectively disposed inside and outside the cooling pad body 11, and the cold air conduction part 1221 is attached to the low-temperature end surface of the cooling host 13 after penetrating the cooling pad body 11, so that the contact surface 1211 of the cold pack module 12 and the cooling air hole 1111 inside the cooling pad body 11 face the wearer, ensuring that the cold storage material and conditioned air can effectively act on the human body.

[0062] Preferably, the cooling host 13 comprises a cooling shell 131, a semiconductor cooling sheet 132, a radiator 133, and a heat dissipation fan 134, and the semiconductor cooling sheet 132, the radiator 133, and the heat dissipation fan 134 are all mounted within the cooling shell 131. The semiconductor cooling sheet 132 has a high-temperature end surface and a low-temperature end surface, and the high-temperature end surface is attached to the radiator 133. A plurality of heat dissipation channels 1331 are opened in the radiator 133, and the outlet of the heat dissipation fan 134 faces the inlet of the heat dissipation channel 1331. The cooling shell 131 has an air inlet 1311, a heat dissipation outlet 1312, and a cold air conduction outlet 1313. The cold air conduction outlet 1313 is located on the inner wall of the cooling shell 131 and is used to avoid the low-temperature end surface of the semiconductor cooling sheet 132 and accommodate the cold air conduction part 1221. The air inlet 1311 is disposed adjacent to the inlet of the heat dissipation fan 134 , and the heat dissipation outlet 1312 is disposed adjacent to the outlet of the heat dissipation channel 1331 .

[0063] In the external cooling host of the above embodiment, the cooling host 13 includes a cooling shell 131, a semiconductor cooling sheet 132, a radiator 133, and a heat dissipation fan 134. As shown in FIGS. 4 to 7, the cooling host 13 employs a semiconductor cooling method to transfer cool air to the cool air conduction unit 1221. Specifically, the semiconductor cooling sheet 132 utilizes the Peltier effect. The Peltier effect refers to the phenomenon in which, when a direct current flows through a galvanic couple made of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end dissipates heat. In other words, the semiconductor cooling sheet 132 is made of two semiconductor materials and forms a high-temperature end and a low-temperature end. The low-temperature end continuously absorbs heat to achieve cooling, and the high-temperature end continuously dissipates heat. In this technical solution, the cooling device uses the semiconductor cooling sheet 132 as a cold storage material, eliminating the need for a complex mechanical cooling structure and effectively simplifying the overall structure of the cooling host 13, thereby reducing the overall volume of the cooling host 13, thereby facilitating low-noise cooling and being safe, reliable, convenient, and practical, with low manufacturing costs and a wide range of applications. Furthermore, the low-temperature end of the semiconductor cooling sheet 132 is provided with a low-temperature end face, and the high-temperature end of the semiconductor cooling sheet 132 is provided with a high-temperature end face, which are attached to the cold air conduction part 1221 and the high-temperature end face and the radiator 133, respectively, which are helpful in directly and effectively transferring heat and cold, thereby improving the cooling effect of the cooling host 13.

[0064] Specifically, the heat dissipation process of the cooling host 13 of this solution is as follows: outside air enters the cooling shell 131 through the air inlet 1311, and then enters the heat dissipation channel 1331 of the radiator 133 through the guidance of the heat dissipation fan 134, carries the heat in the heat dissipation channel 1331 to the heat dissipation outlet 1312, and is then discharged from the cooling host 13.

[0065] Preferably, the heat dissipation fan 134 is a centrifugal fan, and the air inlet 1311 and the heat dissipation outlet 1312 are both located on the outer wall of the cooling shell 131 .

[0066] In the above embodiment, preferably, as shown in Figures 4 to 5, the heat dissipation fan 134 is a centrifugal fan, and the air inlet 1311 and the heat dissipation outlet 1312 are arranged on the outer wall of the cooling shell 131 opposite to the cold end surface of the semiconductor cooling sheet 132, which helps the heat dissipation airflow to affect the cold air transfer effect of the cooling host 13.

[0067] Preferably, the heat dissipation fan 134 is an axial fan, the air inlet 1311 is located at the bottom wall of the cooling shell 131 , and the heat dissipation outlet 1312 is located at the top wall of the cooling shell 131 .

[0068] In the above embodiment, more preferably, as shown in Figures 6 and 7, the heat dissipation fan 134 is an axial fan, and the heat dissipation outlet 1312 and the air inlet 1311 are located at the upper and lower ends of the cooling shell 131, respectively, to facilitate rapid heat dissipation.

[0069] Preferably, the cooling pad body 11 includes an exhaust layer 111, an air duct layer 112, and an insulating outer layer 113, which are arranged in this order from the inside to the outside. A plurality of the temperature-reducing air holes 1111 are arranged in the exhaust layer 111 , and the regulated air inlet and the temperature-reducing air holes 1111 communicate with each other via the air duct layer 1112 . In this solution, the structure of the cooling pad main body 11 is also optimized so that the wearer can feel the cooling effect of the conditioned air more directly. The arrangement of the air duct layer 112 allows for better storage of a large amount of conditioned air within the cooling pad main body 11, thereby increasing the air flow from the cooling air holes 1111 and helping to make the cooling effect more pronounced. The insulating outer layer 113 is primarily installed to prevent the loss of conditioned air from the outside of the cooling pad main body 11 and can also shield the wearer from the temperature of the external environment to some extent, further helping to enhance the cooling effect of the cooling pad. In one embodiment, the material of the insulating outer layer 113 may be, but is not limited to, polyester fiber.

[0070] Preferably, the regulated air inlet is located at the bottom of the cooling pad body 11, and the diameter of the cooling air holes 1111 gradually decreases from top to bottom.

[0071] In a preferred embodiment of the present technical solution, the conditioned air inlet is located at the bottom of the cooling pad body 11, so that the non-contact temperature-reducing system 2 is attached to the bottom of the cooling pad body 11, which is convenient for wearing on the human body. Based on the above wearing method, in order to ensure a uniform temperature-reducing effect of the cooling pad body 11, the present solution particularly reduces the hole diameter of the temperature-reducing air holes 1111 from top to bottom. A larger hole diameter can reduce the air resistance caused by the conditioned air flow generated by the non-contact temperature-reducing system 2, so that the conditioned air flow can more easily reach the top of the cooling pad body 11, which is equivalent to the air flow from the temperature-reducing air holes 1111 at the bottom of the cooling pad body 11, ensuring a uniform temperature-reducing effect.

[0072] Preferably, the air duct layer 112 is a 3D support structure having a plurality of intertwined support ribs disposed within the 3D support structure. In order to ensure the storage of the conditioned air flow by the air duct layer 112, in the first embodiment of the present technical solution, the air duct layer 112 is a 3D support structure, and as shown in Figure 8, the three-dimensional space of the air duct layer 112 is supported by a plurality of intertwined support ribs inside, which is helpful in storing a large amount of conditioned air while not affecting the air flow in the air duct layer 112 and avoiding an increase in air resistance.

[0073] Preferably, a windproof strip 1121 surrounding the air retention cavity is protruded from the edge of the air duct layer 112, and the windproof strip 1121 has an air intake notch 11211 that is connected to the adjusted air inlet. A plurality of support blocks 1122 are protruded from the inside of the air duct layer 112 , and the surfaces of the support blocks 1122 abut against the outside of the exhaust layer 111 . In order to ensure the storage of the conditioned air flow by the air duct layer 112, in the second embodiment of the technical solution, the air duct layer 112 is a 3D supporting structure, and as shown in FIG. 9, windproof strips 1121 are protruded from its edges, which can better realize the storage of a large amount of conditioned air and avoid the loss of air flow from places other than the cooling air holes 1111.

[0074] In the above embodiment, more preferably, a plurality of support blocks 1122 are protruded from the inside of the air duct layer 112, so that an effective storage space for the conditioned air can be effectively secured within the air duct layer 112.

[0075] Preferably, an auxiliary heat dissipation outlet is opened at the upper edge of the cooling pad body 11, and the regulated air inlet and the auxiliary heat dissipation outlet communicate with each other through the air duct layer 1112. The cooling host 13 is disposed in the cooling pad body 11, and the cooling host 13 is located in the air duct layer 112, and the cold air conduction part 1221 penetrates the exhaust layer 111 and is then attached to the low-temperature end surface of the cooling host 13. The cooling host 13 comprises a semiconductor cooling element 135 and a heat dissipation element 136 arranged in order from the inside to the outside, the semiconductor cooling element 135 has a high temperature end face and a low temperature end face, the low temperature end face is attached to the cold air conduction part 1221, and the high temperature end face is attached to the heat dissipation element 136. A plurality of vertically extending heat conduction channels are formed in the heat dissipation element 136, and the air duct layer 112, the heat conduction channels, and the auxiliary heat dissipation outlets are sequentially connected to each other.

[0076] The cooling host 13 of the present solution may be an internal cooling host. Specifically, as shown in Figures 10 and 11, the cooling host 13 includes a semiconductor cooling element 135 and a heat dissipation element 136 arranged in this order from the inside to the outside, and similarly employs a semiconductor cooling method to transmit cool air to the cool air conduction portion 1221. However, since the cooling host 13 of the present solution is disposed within the cooling pad body 11 and is located within the air duct layer 112, the solution of the present invention uses a portion of the conditioned air entering the air duct layer 112 to dissipate heat from the heat dissipation element 136, thereby structurally eliminating the need for a heat dissipation fan for the cooling host 13, thereby making the structure of the cooling host 13 more compact and reducing costs.

[0077] Specifically, the heat dissipation process of the cooling host 13 of this solution is as follows: the conditioned air generated by the non-contact temperature reduction system 2 enters the air duct layer 112 of the cooling pad main body 11 from the conditioned air inlet, a portion of the conditioned air passes through the temperature reduction air holes 1111 to form an exhaust flow inside the cooling pad main body 11, and the remaining portion of the conditioned air enters the heat conduction channel (not shown) of the heat dissipation element 136, carries the heat in the heat conduction channel to the heat dissipation auxiliary outlet, and is discharged from the cooling pad main body 11.

[0078] Preferably, the cooling host 13 further comprises a mounting shell 137 and a mounting cover 138 . The mounting shell 137 and the mounting cover 138 together surround a mounting cavity for mounting the semiconductor cooling element 135 and the heat dissipation element 136, with the mounting shell 137 located inside the semiconductor cooling element 135 and the mounting cover 138 located outside the heat dissipation element 136. The mounting cavity has an avoidance opening at both the top and bottom, and the avoidance opening at the bottom of the mounting cavity is used to avoid the entrance of the heat conduction channel, and the avoidance opening at the top of the mounting cavity is used to avoid the exit of the heat conduction channel. A cold conduction mounting port 1371 is provided at the center of the mounting shell 137 , and the cold conduction mounting port 1371 is used to accommodate the cold conduction part 1221 while avoiding the cold end surface of the semiconductor cooling element 135 .

[0079] In the internal cooling host of the above embodiment, in order to ensure effective attachment between the cooling host 13 and the cold air conduction part 1221, in this solution, a mounting shell 137 and a mounting cover 138 are further added inside the cold air host 13, where a cold air conduction mounting port 1371 is opened in the center of the mounting shell 137 to realize the mounting of the internal cooling host and the cold air conduction part 1221, and escape openings are opened at both the top and bottom of the mounting cavity surrounded by the mounting shell 137 and the mounting cover 138 to ensure that part of the conditioned air can effectively enter the heat conduction channel.

[0080] Preferably, the air duct layer 112 comprises an inner alignment layer 1123 and an outer alignment layer 1124 , and the inner alignment layer 1123 is located inside the outer alignment layer 1124 . The inner alignment layer 1123 is a 3D support structure having a plurality of intertwined support ribs disposed within the 3D support structure. A windproof rib 11241 is protruded from the inner edge of the outer alignment layer 1124, and the outer alignment layer 1124 and the inner alignment layer 1123 together surround the air storage cavity through the windproof rib 11241. An air inlet notch 11241a is formed on the side of the windproof rib 11241, which is connected to the regulated air inlet, and a heat dissipation notch 11241b is formed on the top of the windproof rib 11241, which is connected to the auxiliary heat dissipation outlet. The heat conduction channel of the heat dissipation element 136 is located above the heat dissipation notch 11241b.

[0081] In the above embodiment of the internal cooling host, the specific structure of the air duct layer 112 is also preferably optimized. Specifically, the conditioned air supply process in this embodiment is as follows: the conditioned air generated by the non-contact temperature reduction system 2 enters the cooling pad body 11 through the conditioned air inlet, passes through the inlet notch 11241a into the air storage cavity of the air duct layer 112, and then flows through the orientation inner layer 1123 and the temperature reduction air holes 1111 to form an exhaust flow inside the cooling pad body 11; and the remaining conditioned air passes through the heat dissipation notch 11241b into the heat conduction channel (not shown) of the heat dissipation element 136, carries the heat in the heat conduction channel to the auxiliary heat dissipation outlet, and is discharged from the cooling pad body 11. By optimizing the above structure, it is possible to effectively separate the conditioned air used to form the exhaust flow from the conditioned air that carries heat through the heat conduction channels, and to some extent prevent the conditioned air that carries heat from forming the exhaust flow through the cooling air holes 1111, thereby reducing the coolness felt by the wearer.

[0082] Preferably, an orientation rib 11242 located on top of the windproof rib 11241 is protruded from the inner edge of the orientation outer layer 1124, and the windproof rib 11241 and the orientation rib 11242 together surround a heat dissipation cavity, and the air storage cavity and the heat dissipation cavity are connected to each other through the heat dissipation notch 11241b, and the outlet of the heat dissipation cavity is connected to the auxiliary heat dissipation outlet.

[0083] In the above-mentioned embodiment of the internal cooling host, more preferably, an orientation rib 11242 is further protruded from the inner edge of the orientation outer layer 1124, and the windproof rib 11241 and the orientation rib 11242 together surround the heat dissipation cavity, playing the role of concentrating and discharging the conditioned air carrying heat.

[0084] Preferably, the heat dissipation cavity has a Y-shape, and the outlets of the heat dissipation cavity are located on both sides of the top of the alignment outer layer 1124 . The auxiliary heat dissipation outlet is disposed adjacent to the outlet of the heat dissipation cavity, thus helping to guide and discharge the heat-carrying conditioned air to both sides of the upper part of the cooling pad main body 11, and avoiding directly discharging the hot air flow from the wearer's body surface.

[0085] Preferably, the cooling pad body 11 further includes a breathable mesh inner layer 114, and the breathable mesh inner layer 114, the exhaust layer 111, the air duct layer 112, and the heat insulating outer layer 113 are arranged in order from the inside to the outside.

[0086] Preferably, the number of meshes in the breathable mesh inner layer 114 is 16 to 20. Furthermore, in order to improve the comfort of the wearer, in this solution, as shown in FIG. 11, a breathable mesh inner layer 114 having a mesh number of 16 to 20 is further arranged inside the exhaust layer 111 while achieving both the temperature-reducing effect and comfort of the cooling pad.

[0087] Preferably, the material of the breathable mesh inner layer 114 in this solution may be nylon, but is not limited to this.

[0088] Preferably, the cooling pad body 11 further includes a fixing belt 115 connected to the insulating outer layer 113 . Furthermore, in order to improve the stability of the cooling pad body 11 when worn and to enhance the stability of fitting to products such as backpacks and car seat cushions, in this solution, a fixing belt 115 is further provided on the cooling pad body 11. When the wearer wears the cooling pad body 11 of this solution alone, in order to improve the fit to the body surface, in this solution, the fixing belt 115 is particularly connected to the insulating outer layer 113, thereby ensuring that the cooling effect of the cooling pad is effectively transmitted to the body surface.

[0089] Preferably, at least five of the fixing belts 115 are arranged, with any three fixing belts 115 being evenly arranged on the top of the insulating outer layer 113, and the remaining two fixing belts 115 being arranged on each side of the insulating outer layer 113.

[0090] In a more preferred embodiment of the present technical solution, as shown in FIG. 16, the placement position of the fixing belt 115 is also optimized so that the cooling pad can be used in more suitable application scenarios.

[0091] Preferably, the non-contact temperature reducing system 2 includes a fixed shell 21 and a temperature reducing fan 22 , and the temperature reducing fan 22 is mounted within the fixed shell 21 . The fixed shell 21 has an air intake 211 and the conditioned air outlet 212, the inlet of the cooling fan 22 is located adjacent to the air intake 211, and the outlet of the cooling fan 22 is located adjacent to the conditioned air outlet 212, and the air intake 211 and the conditioned air outlet 212 are located on two different side walls of the fixed shell 21.

[0092] Specifically, the non-contact cooling system 2 of the present solution includes a fixed shell 21 and a cooling fan 22, and the cooling fan 22 is used to introduce air outside the cooling pad into the cooling pad main body 11 and transport conditioned air toward the cooling pad main body 11. In the present solution, the air inlet 211 and the conditioned air outlet 212 opened in the fixed shell 21 are arranged on two different side walls thereof, which helps a large amount of outside air to smoothly enter the non-contact cooling system 2.

[0093] Preferably, the air inlet 211 and the regulated air outlet 212 are located on two opposite side walls of the stationary shell 21, respectively. Alternatively, the air inlet 211 and the regulated air outlet 212 are located on two adjacent side walls of the fixed shell 21, respectively.

[0094] As shown in Figures 12 and 13, the air intake 211 and the conditioned air outlet 212 are located on two adjacent sides or two opposing sides of the fixed shell 21, respectively, which helps to reduce interference with the flow of intake air and further helps a large amount of outside air to smoothly enter the non-contact cooling system 2.

[0095] It should be noted that the number of air inlets 211 can be set according to the actual demand for the amount of conditioned air, but is not limited here.

[0096] Preferably, the temperature reducing fan 22 is either an axial fan or a centrifugal fan.

[0097] Preferably, the non-contact temperature reduction system 2 further includes an air direction plate 23 mounted within the fixed shell 21 and disposed between the outlet of the temperature reduction fan 22 and the regulated air outlet 212 .

[0098] In this solution, as shown in Figure 14, an air orientation plate 23 is further arranged in the non-contact cooling system 2 to ensure that the outside air flows in a fixed direction and increase the conversion rate of the conditioned air in the non-contact cooling system 2.

[0099] Preferably, the non-contact temperature reducing system 2 further includes a semiconductor cooling module 24 mounted within the fixed shell 21 and disposed at the outlet of the temperature reducing fan 22 . The semiconductor cooling module 24 comprises a semiconductor cooler, a cooling block 241, and a heat dissipation block 242, and the semiconductor cooler has opposing low-temperature and high-temperature end faces, with the low-temperature end face and the cooling block 241 attached to each other, and the high-temperature end face and the heat dissipation block 242 attached to each other. The fixed shell 21 further has a heat dissipation air outlet 213 . Both the cooling block 241 and the heat dissipation block 242 have heat exchange channels arranged therein, and the inlets of the heat exchange channels of the cooling block 241 and the heat dissipation block 242 are arranged close to the outlet of the high-temperature fan 22, the outlets of the heat exchange channels of the cooling block 241 are arranged close to the conditioned air outlet 212, and the outlets of the heat exchange channels of the heat dissipation block 242 are arranged close to the heat dissipation air outlet 213.

[0100] In a more preferred embodiment of the present technical solution, in order to further enhance the cooling effect of the cooling pad, the present solution may further add a semiconductor cooling module 24 to the non-contact cooling system 2, so that, as shown in FIG. 15 , the outside air entering the non-contact cooling system 2 is first cooled by the semiconductor cooling module 24, and then enters the cooling pad body 11 as cooled and conditioned air, thereby making the wearer's usage experience more satisfactory.

[0101] Preferably, the non-contact temperature reducing system 2 further includes an air directing cover 25 having a hollow structure. The air directing cover 25 is removably attached to the outside of the fixed shell 21, the regulated air outlet 212 is connected to the inlet of the air directing cover 25, and the regulated air outlet 212 is connected to the regulated air inlet through the air directing cover 25. The cross-sectional area of ​​the inlet of the air directing cover 25 is larger than the cross-sectional area of ​​the outlet of the air directing cover 25 .

[0102] In a more preferred embodiment of the present technical solution, an air directing cover 25 may be further arranged at the conditioned air outlet 212 of the fixed shell 21, and as shown in Figures 14 to 15, the inlet cross-sectional area and outlet cross-sectional area of ​​the air directing cover 25 are different, which can effectively increase the speed of the conditioned air entering the cooling pad body 11 and make the cooling experience brought by the air flow more intense.

[0103] Preferably, the non-contact cooling system 2 further includes an attachment bag 26, the fixed shell 21 is attached within the attachment bag 26, and a mesh surface is disposed on the attachment bag 26, and the mesh surface is disposed adjacent to the air intake port 211.

[0104] Preferably, the mesh number of the mesh surface is 6 to 10 meshes.

[0105] Preferably, at least two non-contact temperature reducing systems 2 are arranged, and the two non-contact temperature reducing systems 2 are arranged on both sides of the contact cooling pad 1, respectively. This increases the amount of conditioned air supplied, as shown in FIG. 16, and improves the sensation of coolness brought about by the flow of air formed by the conditioned air.

[0106] More specifically, at least two of the cooling patch systems are provided.

[0107] The technical principles of the present invention have been described above in conjunction with specific examples. These descriptions are intended to illustrate the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any manner. Based on the description in this specification, those skilled in the art can conceive of other specific embodiments of the present invention without any creative work, and all of these embodiments fall within the scope of protection of the present invention. [Explanation of symbols]

[0108] 11 Cooling pad body, 111 Exhaust Layer 1111 Cooling air hole 112 Air Duct Layer 1121 Windproof Strip 11211 Air supply notch 1122 Support Block 1123 Oriented inner layer 1124 Orientation outer layer 11241 Windproof rib 11241a Inlet notch 11241b Heat dissipation notch 11242 Orientation rib 113 Insulating outer layer 114 breathable mesh inner layer 115 Fixed Belt 12 Cold Compress Module 121 Cold compress bag 1211 Contact surface 122 Cold Conduction Block 1221 Cooling air conduction section 1222 Cooling air transmission section 12221 Convex strip 12222 Escape prevention groove 12222a Communication part 12222b Protrusion 123 Plastic pressure plate 13 Cooling Host 131 Cooling Shell 1311 Air inlet 1312 Heat dissipation outlet 1313 Cold air conduction outlet 132 Semiconductor cooling sheet 133 Radiator 1331 Heat Dissipation Channel 134 Heat dissipation fan 135 Semiconductor cooling element 136 Heat dissipation element 137 Mounting shell 1371 Cooling Conduction Mounting Port 138 Mounting cover 2. Non-contact cooling system 21 Fixed Shell 211 Air supply port 212 Regulated Air Outlet 22 Cooling fan 23 Air directing plate 24 Semiconductor cooling module 241 Cooling Block 242 Heat dissipation block 25 Air Orientation Cover 26 Mounting bag

Claims

1. A semiconductor cooling mechanism comprising a cooling pad body, a cooling patch system, and a temperature reduction system; a cooling pad main body having a cooling air inlet, a cooling air outlet of the cooling system communicating with the cooling air inlet, the cooling system being used to deliver cooling air to the cooling pad main body; The cooling patch system includes a cold pack module and a cooling host, the cooling air inlet is located on the cooling pad body, and a plurality of cooling air holes are opened inside the cooling pad body, and the cooling air holes are connected to the cooling air inlet, a semiconductor cooling mechanism comprising: a cold pack module including a cold pack bag and a cold air conduction block; the cold air conduction block including a cold air conduction section and a cold air transfer section; the cold air conduction section being disposed outside the cold pack bag; the cold air transfer section being disposed inside the cold pack bag; a cold storage material being accommodated inside the cold pack bag; a low-temperature end surface of a semiconductor cooling sheet of the cooling host being attached to the cold air conduction section; the cooling host transferring cold air to the cold storage material via the cold air conduction block; the cold pack module being disposed on the side of the cooling pad main body that comes into contact with the wearer's body;

2. 2. The semiconductor cooling mechanism according to claim 1, wherein a cross-sectional area of ​​the cold air transfer portion parallel to the cooling pad body is equal to or larger than a cross-sectional area of ​​the cold air transfer portion parallel to the cooling pad body.

3. 2. The semiconductor cooling mechanism according to claim 1, wherein the cool air conducting portion is protruded from the outer central portion of the cool air transmitting portion.

4. The cold compress module further includes a plastic pressure plate fitted to the outside of the cold air conduction part and attached to the outer surface of the cold air conduction part, 2. The semiconductor cooling mechanism according to claim 1, wherein the inner wall of the cold pack bag is attached to the outer surface of the plastic pressure plate.

5. 5. The semiconductor cooling mechanism according to claim 4, wherein a rear side of the cool air transfer part has a plurality of parallel protrusions, and the plastic pressure plate is attached to the outer surface of the cool air transfer part via the protrusions.

6. 5. The semiconductor cooling mechanism according to claim 4, wherein a plurality of escape prevention grooves recessed inward are arranged on the rear side of the cool air transfer part, and the plastic pressure plate is attached to the outer surface of the cool air transfer part through the escape prevention grooves.

7. 7. The semiconductor cooling mechanism according to claim 6, wherein the escape prevention groove comprises a communicating portion and a protruding portion that communicate in this order from the outside to the inside, and the height of the protruding portion is greater than the height of the communicating portion.

8. 7. The semiconductor cooling mechanism according to claim 6, wherein at least two escape prevention grooves are provided, and the two escape prevention grooves are located on both sides of the cool air conducting portion, respectively.

9. The cooling host is disposed outside the cooling pad body; the cooling host is located outside the cooling pad body; 2. The semiconductor cooling mechanism according to claim 1, wherein the cold air conducting part penetrates the cooling pad body and is then attached to the low-temperature end surface of the cooling host.

10. The cooling host comprises a cooling shell, the semiconductor cooling sheet, a radiator, and a heat dissipation fan, and the semiconductor cooling sheet, the radiator, and the heat dissipation fan are all mounted in the cooling shell; the semiconductor cooling sheet has a high temperature end surface and a low temperature end surface, the high temperature end surface is attached to the radiator, a plurality of heat dissipation channels are formed in the radiator, and outlets of the heat dissipation fan are directed toward the inlets of the heat dissipation channels; The cooling shell has an air inlet, a heat dissipation outlet, and a cold air conduction outlet, the cold air conduction outlet is located on an inner wall of the cooling shell, and the cold air conduction outlet is used to avoid a low-temperature end surface of the semiconductor cooling sheet and accommodate the cold air conduction part; 10. The semiconductor cooling mechanism according to claim 9, wherein the air inlet is disposed adjacent to the inlet of the heat dissipation fan, and the heat dissipation outlet is disposed adjacent to the outlet of the heat dissipation channel.

11. 11. The semiconductor cooling mechanism according to claim 10, wherein the heat dissipation fan is a centrifugal fan, and the air inlet and the heat dissipation outlet are both located on the outer wall of the cooling shell.

12. 11. The semiconductor cooling mechanism according to claim 10, wherein the heat dissipation fan is an axial fan, the air inlet is located at the bottom wall of the cooling shell, and the heat dissipation outlet is located at the top wall of the cooling shell.

13. The cooling pad body includes an exhaust layer, an air duct layer, and a heat insulating outer layer, which are arranged in this order from the inside to the outside.

2. The semiconductor cooling mechanism according to claim 1, wherein a plurality of said temperature-reducing air holes are arranged in said exhaust layer, and said regulated air inlet and said temperature-reducing air holes communicate with each other through said air duct layer.

14. 14. The semiconductor cooling mechanism according to claim 13, wherein the regulated air inlet is located at the bottom of the cooling pad body, and the diameter of the cooling air holes is gradually reduced from top to bottom.

15. The semiconductor cooling mechanism of claim 13, wherein the air duct layer is a 3D support structure, and a plurality of intertwined support ribs are disposed within the 3D support structure.

16. A windproof strip is protruded from the edge of the air duct layer, surrounding the air retention cavity, and the windproof strip has an air supply notch that communicates with the adjusted air inlet; 14. The semiconductor cooling mechanism according to claim 13, wherein a plurality of support blocks are protruded from the inside of the air duct layer, and the surfaces of the support blocks abut against the outside of the exhaust layer.

17. a heat dissipation auxiliary outlet is opened at the upper edge of the cooling pad body, and the regulated air inlet and the heat dissipation auxiliary outlet communicate with each other through the air duct layer; The cooling host is disposed in the cooling pad body, the cooling host is located in the air duct layer, and the cold air conduction part penetrates the exhaust layer and is then attached to the low-temperature end surface of the cooling host; The cooling host includes a semiconductor cooling element and a heat dissipation element arranged in this order from the inside to the outside, the semiconductor cooling element has a high-temperature end surface and a low-temperature end surface, the low-temperature end surface is attached to the cold air conduction part, and the high-temperature end surface is attached to the heat dissipation element, 14. The semiconductor cooling mechanism according to claim 13, wherein a plurality of vertically extending heat conduction channels are formed within the heat dissipation element, and the air duct layer, the heat conduction channels, and the auxiliary heat dissipation outlet are sequentially connected to each other.

18. The cooling host further comprises an attachment shell and an attachment cover; the mounting shell and the mounting cover together enclose a mounting cavity for mounting the semiconductor cooling element and the heat dissipation element, the mounting shell being located inside the semiconductor cooling element and the mounting cover being located outside the heat dissipation element; The mounting cavity has an upper and a lower opening for avoiding the heat conduction channel from entering the upper portion of the mounting cavity, and the upper opening for avoiding the heat conduction channel from exiting the upper portion of the mounting cavity.

18. The semiconductor cooling mechanism according to claim 17, wherein a cold conduction mounting port is provided in the center of the mounting shell, and the cold conduction mounting port is used to accommodate the cold conduction part while avoiding a cold end surface of the semiconductor cooling element.

19. the air duct layer comprises an inner alignment layer and an outer alignment layer, the inner alignment layer being located inside the outer alignment layer; the oriented inner layer is a 3D support structure, and a plurality of intertwined support ribs are disposed within the 3D support structure; a windproof rib protruding from an inner edge of the orientation outer layer, and the orientation outer layer and the orientation inner layer together surround an air storage cavity via the windproof rib; an air inlet notch communicating with the regulated air inlet is formed on a side surface of the windproof rib, and a heat dissipation notch communicating with the auxiliary heat dissipation outlet is formed on an upper portion of the windproof rib; 20. The semiconductor cooling mechanism of claim 18, wherein the heat conduction channel of the heat dissipation element is located above the heat dissipation notch.

20. 20. The semiconductor cooling mechanism of claim 19, wherein an orientation rib is protruded from an inner edge of the orientation outer layer and positioned above the windproof rib, the windproof rib and the orientation rib together surround a heat dissipation cavity, the air storage cavity and the heat dissipation cavity communicate with each other through the heat dissipation notch, and an outlet of the heat dissipation cavity communicates with the auxiliary heat dissipation outlet.

21. The heat dissipation cavity has a Y-shape, and outlets of the heat dissipation cavity are located on both sides of the top of the alignment outer layer; 21. The semiconductor cooling mechanism according to claim 20, wherein the auxiliary heat dissipation outlet is disposed adjacent to the outlet of the heat dissipation cavity.

22. 14. The semiconductor cooling mechanism according to claim 13, wherein the cooling pad body further comprises an air-permeable mesh inner layer, and the air-permeable mesh inner layer, the exhaust layer, the air duct layer, and the heat-insulating outer layer are arranged in this order from the inside to the outside.

23. The semiconductor cooling mechanism according to claim 13, wherein the cooling pad body further comprises a fixing belt connected to the insulating outer layer.

24. The semiconductor cooling mechanism according to claim 1 , wherein at least two cooling patch systems are provided.

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