Liquid ejection head and liquid ejection device

Abstract

To improve structural reliability of a liquid discharge head.SOLUTION: A liquid discharge head 1K includes: a first substrate 220; and a second substrate 230. The first substrate 220 has a discharge port 3, a liquid chamber, and an energy generating element. The second substrate 230 is joined to a second surface 202a on an opposite side of a first surface 201a of the first substrate. The first substrate 220 has a projection region 210 projecting in a plane direction orthogonal to a first axis direction (z-axis direction) from an end of the second substrate 230. A terminal 10 to be electrically connected to the energy generating element is provided on the second surface 202a of the projection region 210. A support member 401 is joined to the first surface 201a of the first substrate 220. The support member 401 has an opening 402 at a position opposed to a formation region of the discharge port 3. The support member 401 is fixed to a frame 403.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a liquid ejection head that ejects liquid from an ejection port, and a liquid ejection apparatus. [Background technology]

[0002] In a liquid ejection device that ejects liquid to form an image, in order to achieve high resolution of the image to be formed, the multiple ejection ports provided in the liquid ejection head and the energy generating elements that eject liquid from the ejection ports are densely arranged on a substrate. If power is supplied to each of the energy generating elements arranged in such a high density via electrical wiring that is densely formed on the substrate, ion migration may occur in the electrical wiring, which may reduce the electrical reliability of the liquid ejection device.

[0003] To avoid such problems, the liquid ejection head shown in Patent Document 1 has a configuration in which multiple terminals for electrical connection are arranged on both ends of the chip, and power is supplied to each terminal via wires bonded to it. In the liquid ejection head disclosed in Patent Document 1, the portion where the terminals are arranged is configured like a canopy in order to expose the terminals for electrical connection on the substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-110743 Summary of the Invention [Problem to be solved by the invention]

[0005] It is known that liquid ejection performance of a liquid ejection head can be improved by thinning the ejection ports and the flow paths (liquid chambers) near the ejection ports. However, thinning the flow paths also leads to thinning the substrate on which the terminals are located. For this reason, in a configuration in which terminals are located on eave-shaped portions formed by a substrate protruding from both ends of a liquid ejection chip, as in Patent Document 1, the eave-shaped portions are prone to breakage due to the thinning of the substrate, resulting in a problem of reduced structural reliability of the liquid ejection head.

[0006] An object of the present disclosure is to provide a technique that can improve the structural reliability of a liquid ejection head. [Means for solving the problem]

[0007] The present disclosure provides a method for Discharge A discharge port and a liquid chamber communicating with the discharge port ,before The liquid in the liquid chamber is discharged from the discharge port. Discharge in the first axial direction a first substrate having an energy generating element that generates energy to cause the ejection port to eject a liquid; and a second surface of the first substrate opposite to the first surface on which the ejection port is formed. and a common flow path that is in fluid communication with the individual flow paths and the liquid chambers. a second substrate, wherein the first substrate comprises: The aforementioned A protruding region protruding from an end of the second substrate in a plane direction perpendicular to the first axis direction is formed. It has the second surface of the protruding region teeth A liquid ejection head provided with terminals electrically connected to the energy generating elements, an opening at a position facing the region where the ejection ports are formed, The first surface and Joined, The first substrate is supported in a range exceeding the protruding region of the first substrate. a support member; The support member is supported by a portion that overlaps the outer edge of the support member in the first axial direction. fixed Support Frame and To prepare It is characterized by: [Effects of the Invention]

[0008] According to the present disclosure, it is possible to improve the structural reliability of the liquid ejection head. [Brief explanation of the drawings]

[0009] [Figure 1]FIG. 1 is a perspective view schematically illustrating an example of an inkjet recording apparatus. [Figure 2] FIG. 2 is an external perspective view showing the configuration of a head module. [Figure 3] 3A and 3B are diagrams showing the double-sided structure of the liquid ejection chip. [Figure 4] FIG. 2 is a diagram showing the internal structure of the liquid ejection chip. [Figure 5] FIG. 2 is a perspective view of a part of the liquid ejection chip as seen from the opening side of the connection flow channel. [Figure 6] FIG. 2 is a cross-sectional view showing the peripheral configuration of the liquid ejection chip according to the first embodiment. [Figure 7] 3A and 3B are a plan view and a bottom view showing a part of the head module. [Figure 8] FIG. 4 is a cross-sectional view showing another example of the peripheral configuration of the liquid ejection chip according to the first embodiment. [Figure 9] FIG. 10 is a cross-sectional view showing the peripheral configuration of a liquid ejection chip according to a second embodiment. [Figure 10] FIG. 10 is a cross-sectional view showing the peripheral configuration of a liquid ejection chip according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a liquid ejection head and a liquid ejection device according to the present disclosure will be described in detail based on embodiments with reference to the drawings. In the following embodiments, an inkjet recording head and an inkjet recording device that eject ink will be described as examples of the liquid ejection head and the liquid ejection device, but the present disclosure is not limited thereto. The liquid ejection head and the liquid ejection device according to the present disclosure can be applied to devices such as printers, copiers, facsimiles with communication systems, and word processors with printer units, as well as industrial recording devices combined with various processing devices. For example, they can also be used in applications such as the production of biochips and the printing of electronic circuits.

[0011] The present embodiment described below is a specific example of the present disclosure and includes various technically preferable characteristic elements. However, the present embodiment does not limit the present disclosure according to the claims, and not all combinations of characteristic elements shown in the present embodiment are necessarily essential to the solution of the present disclosure.

[0012] [First embodiment] (Liquid discharge device) FIG. 1 is a perspective view schematically illustrating an example of an inkjet recording apparatus (hereinafter simply referred to as a recording apparatus) 101 as a liquid ejection apparatus according to the present disclosure. The recording apparatus 101 shown in FIG. 1 is a so-called full-line recording apparatus that records an image by ejecting ink (liquid) from a recording unit (liquid ejection unit) 1 arranged at a fixed position while continuously transporting a recording medium 111 in the y-axis direction using a transport unit 110. Note that the y, x, and z axes shown in each drawing referred to in the following description indicate coordinate axes in the liquid ejection apparatus, with the z axis representing the first axis, the y axis representing the second axis, and z representing the third axis. The axes are mutually orthogonal. The z axis (first axis) indicates the direction in which ink is ejected from the liquid ejection unit 1, the y axis (second axis) indicates the direction in which the recording medium is transported, and the x axis (third axis) indicates the direction in which ejection openings are arranged in the liquid.

[0013] The liquid ejection unit 1 has a configuration in which liquid ejection heads (printing heads) in which ejection ports (also called nozzles) capable of ejecting ink are arranged across the entire width of the printing medium 111 are arranged along the conveyance direction (y-axis direction) of the printing medium for each of a plurality of ink colors. The printing apparatus 101 in this embodiment is capable of forming a full-color image by ejecting four colors of ink: black (K), yellow (Y), magenta (M), and cyan (C). Therefore, the liquid ejection unit 1 includes a liquid ejection head 1K for ejecting black ink, a liquid ejection head 1Y for ejecting yellow ink, a liquid ejection head 1M for ejecting magenta ink, and a liquid ejection head 1C for ejecting cyan ink.

[0014] Each liquid ejection head corresponding to the ejection of each ink color shown in Figure 1 has a configuration in which two head modules are combined. For example, the head module 1K for ejecting black ink has a configuration in which a head module 1Ka and a head module 1Kb are arranged along the x-axis direction (third axis direction) that is perpendicular to the transport direction (y-axis direction). The head module 1Ka and the head module 1Kb have the same configuration. The same is true for the ejection modules corresponding to the ejection of other ink colors.

[0015] (Head module configuration) Fig. 2 is an external perspective view showing the configuration of a head module used in a liquid ejection head in this embodiment. The head module shown in Fig. 2 shows one of two head modules provided in each of the recording heads 1K, 1Y, 1M, and 1C shown in Fig. 1. Here, as an example, head module 1Ka used in recording head (liquid ejection head) 1K is shown, but the head modules provided in the other recording heads 1Y, 1M, and 1C also have a similar configuration.

[0016] The head module 1Ka has a plurality of liquid ejection chips 2 arranged on one surface (top surface in FIG. 2) of the head main body 4. In this example, four liquid ejection chips 2 are arranged in a staggered pattern along the x-axis direction. Each liquid ejection chip 2 has an ejection port surface (first surface) 201a in which a plurality of ejection ports 3 for ejecting ink are formed. Ink ejected from the ejection ports 3 is supplied to the liquid ejection chip 2 from an ink tank (not shown) via a common supply port (not shown) of the head main body 4. The liquid ejection chip 2 is supported by a frame 403 and a support member 401 provided on one surface of the head main body 4. The support structure of the liquid ejection chip 2 by the frame 403 and the support member 401 will be described in detail later.

[0017] (Double-sided structure of liquid ejection chip) Figure 3 shows the double-sided structure of the liquid ejection chip 2 shown in Figure 2, where Figure 3(a) is a plan view of the liquid ejection chip 2 from the first surface side (the ejection port surface 201a side), and Figure 3(b) is a view of the liquid ejection chip 2 from the surface 204a side opposite the ejection port surface 201a.

[0018] 3(a), the ejection port surface 201a of the liquid ejection chip 2 is formed on a nozzle substrate 201. The nozzle substrate 201 has a plurality of ejection ports 3 that eject ink arranged along the longitudinal direction (x-axis direction) of the nozzle substrate 201 to form an ejection port array. In this example, a plurality of ejection port arrays are arranged side by side in the y-axis direction.

[0019] A nozzle substrate 201 of the liquid ejection chip 2 has multiple substrates, which will be described later, stacked on top of one another. In the liquid ejection chip 2, a surface 204a (FIG. 3(b)) opposite to the ejection port surface 201a is formed by a flow path forming substrate 204, which will be described later. The flow path forming substrate 204 has a connection flow path 15 formed therein for supplying and recovering ink to the liquid ejection chip 2. The connection flow path 15 communicates with a common supply port (not shown) formed in the head main body 4, and the common supply port is connected to an ink tank (not shown). As a result, ink supplied from the ink tank is supplied into the liquid ejection chip 2 via the connection flow path 15.

[0020] 3(b), a plurality of terminals 10 are arranged on the liquid ejection chip 2. These terminals 10 are arranged on both ends of the liquid ejection chip 2 in order to reduce the density of wiring (not shown) inside the liquid ejection chip 2. An electric board for supplying the power and signals required to eject ink from the ejection ports 3 is arranged on the head main body 4, and this electric board and the terminals 10 are electrically connected.

[0021] (Internal structure of the liquid ejection chip) 4A and 4B are diagrams showing the internal structure of the liquid ejection chip 2, with Fig. 4A being a cross-sectional perspective view showing a cross section taken along line BB in Fig. 3, and Fig. 4B being a partially enlarged view of Fig. 4A. As shown in Fig. 4A, the liquid ejection chip 2 has a structure in which a nozzle substrate 201, a liquid chamber substrate 202, a liquid supply substrate 203, a damper substrate 302, and a flow path forming substrate 204 are sequentially stacked. In this embodiment, a first substrate 220 is formed by a stacked substrate including the nozzle substrate 201 and the liquid chamber substrate 202, and a second substrate 230 is formed by a stacked substrate including the liquid supply substrate 203 and the flow path forming substrate 204.

[0022] FIG. 4(b) is an enlarged perspective view showing a portion of FIG. 4(a). A nozzle substrate 201, on which a plurality of ejection ports 3 are formed, and a liquid chamber substrate 202, which is bonded to the nozzle substrate 201, form a plurality of liquid chambers 5, each of which communicates with the ejection ports 3. A vibration plate 212, which constitutes a part of the liquid chamber substrate 202, is provided as a deformable wall surface in each of the plurality of liquid chambers 5. The liquid chambers 5 form flow paths that communicate with the ejection ports 3. To achieve high ejection and circulation performance, these flow paths are preferably thinned to a dimension (hereinafter referred to as "thickness") of 200 μm or less in the ink ejection direction (z-axis direction). The vibration plate 212 is provided with a plurality of energy generating elements 6, each corresponding to a corresponding one of the plurality of liquid chambers. The energy generating elements 6 deform the vibration plate 212 to pressurize the ink in the liquid chambers 5, causing the ink to be ejected from the ejection ports 3.

[0023] A liquid supply substrate 203 is bonded to a surface (second surface) 202a of the liquid chamber substrate 202 located on the opposite side to the surface bonded to the nozzle substrate 201. A plurality of individual supply channels 7 and a plurality of individual recovery channels 8 are formed in the liquid supply substrate 203, each communicating with a respective one of the plurality of liquid chambers 5. A portion of the liquid supplied from the individual supply channels 7 to the liquid chambers 5 is ejected from the ejection ports 3 by driving the energy generating elements 6, and the remaining liquid flows into the individual recovery channels 8. Furthermore, when the energy generating elements 6 are not driven, all of the liquid supplied into the liquid chambers 5 flows into the individual recovery channels 8.

[0024] The individual supply channels 7 are each connected to a common supply communication channel 17 formed by a damper substrate 302. One surface (the upper surface in FIG. 4(a)) of a damper member 300 provided on the damper substrate 302 faces the individual supply channels 7. The other surface (the lower surface in FIG. 4(a)) of the damper member 300 faces a damper region 301 formed by a recess in the channel-forming substrate 204. The common supply communication channel 17 is connected to a common supply channel 27 formed in the channel-forming substrate 204. The common supply channel 27 is connected to a connection channel 15 (see FIG. 3) formed in the channel-forming substrate 204, and ink supplied from an external ink tank (not shown) is supplied to the common supply channel 27 via the connection channel 15.

[0025] Furthermore, the multiple individual recovery channels 8 each communicate with a common recovery connecting channel 18 formed by a damper substrate 302. One surface (the upper surface in FIG. 4(b)) of a damper member 300 provided on this damper substrate 302 faces the individual recovery channels 8. Furthermore, the other surface (the lower surface in FIG. 4(b)) of this damper member 300 faces a damper region 301 formed by a recess in the channel-forming substrate 204. The common recovery channel 28 communicates with a connecting channel 15 formed in the channel-forming substrate 204, and ink that flows into the common recovery channel 28 is recovered via the connecting channel 15 to an externally provided ink tank.

[0026] The nozzle substrate 201, liquid chamber substrate 202, liquid supply substrate 203, and flow path forming substrate 204 can each be formed from a silicon substrate or the like. Furthermore, although each of these substrates is formed from an individual substrate in this embodiment, this is not limitative and each substrate can also be formed integrally. Furthermore, the damper member 300 is formed from an elastic material. For example, a resin material such as polyimide or polyamide can be used as the elastic material.

[0027] The arrows in FIG. 4(b) indicate the flow of ink in the liquid ejection chip 2 configured as described above. That is, ink that flows into the common supply channel 27 from the external ink tank via the connection channel 15 flows into the individual supply channels 7 via the common supply communicating channel 17 and is then supplied to the liquid chamber 5. A portion of the ink supplied to the liquid chamber 5 is ejected from the ejection port 3 when the energy generating element 6 is driven, and the remaining liquid flows into the individual recovery channel 8. Furthermore, when the energy generating element 6 is not driven, all of the liquid supplied to the liquid chamber 5 flows into the individual recovery channel 8. The ink that flows into the individual recovery channel 8 flows into the common recovery channel 28 via the common recovery communicating channel 18, and is then recovered into the external ink tank via the connection channel 15.

[0028] (Structure of Electrical Connection Portion of Liquid Discharge Chip) Next, the structure of the electrical connection portion of the liquid ejection chip in this embodiment will be described with reference to FIGS.

[0029] FIG. 5 is a perspective view of a part of the liquid ejection chip 2 as seen from the opening side of the connection flow path 15 formed in the flow path forming substrate 204. As shown in FIG.

[0030] The nozzle substrate (ejection port substrate) 201 and liquid chamber substrate 202, which form part of the liquid ejection chip 2, have the same shape in a plane direction perpendicular to the ink ejection direction (z-axis direction), and are joined so that their respective ends coincide in the plane direction. The nozzle substrate 201 and liquid chamber substrate 202 constitute a first substrate 220 that includes the ejection ports 3, liquid chambers 5, vibration plate 212, energy generating elements 6, etc. shown in Figure 4.

[0031] The first substrate 220 is bonded to one surface (the lower surface in FIG. 5 ) of the liquid supply substrate 203. In this embodiment, the liquid supply substrate 203 is formed to have a size and shape such that at least a portion of the region around the edge of the first substrate 220 is exposed. That is, in the planar direction, the liquid supply substrate 203 is formed to have a smaller dimension in at least one direction than the first substrate 220. For example, in the liquid ejection chip 2 shown in FIG. 5( a ), the liquid supply substrate 203 and the first substrate 220 are both rectangular, and the dimension of the liquid supply substrate 203 in the y-axis direction, which is parallel to the planar direction, is smaller than the dimension of the first substrate in the y-axis direction. Therefore, the region around the edge of the first substrate 220 in the y-axis direction becomes a protruding region 210 that protrudes like an eave from two opposing sides of the liquid supply substrate 203 and is exposed to the outside. Hereinafter, this protruding region 210 will also be referred to as an eave portion 210.

[0032] Furthermore, as shown in FIG. 5(b), the peripheral regions of the ends of the first substrate 220 in the y-axis and x-axis directions can be configured to form protruding regions (eaves portions) 210 that protrude in an eave-like manner from three or more sides of the liquid supply substrate 203. The eave portions 210 are provided with a plurality of terminals 10 that form electrical connections between the energy generating elements 6 provided on the liquid chamber substrate 202 and the outside. The total thickness of the nozzle substrate 201 and liquid chamber substrate 202 that constitute the first substrate 220 is preferably 200 μm or less, taking into account the ink ejection and circulation efficiency. Therefore, there are concerns about the structural reliability of the eave portions 210 themselves, which constitute part of the first substrate 220. Therefore, each head module that constitutes the liquid ejection head of this embodiment has the following configuration around the liquid ejection chip 2.

[0033] (Peripheral configuration of liquid ejection chip) 6 and 7, the peripheral configuration of the liquid ejection chip 2 will be described in detail. Note that, here, the peripheral configuration of the liquid ejection chip 2 provided in the head module 1Ka used in the liquid ejection head 1K that ejects black ink will be described as an example, but the other head modules also have a similar configuration.

[0034] FIG. 6 is a cross-sectional view showing the peripheral configuration of the liquid ejection chip 2 provided in each head module of the liquid ejection head 1K according to this embodiment, showing a portion of the cross section taken along line AA in FIG. 2. As shown in FIG. 6, the periphery of the liquid ejection chip 2 in the head module 1Ka mainly includes a flexible substrate 404, a support member 401, and a frame 403. The flexible substrate 404 is disposed adjacent to the canopy portion 210 of the liquid ejection chip 2 in the planar direction. The flexible substrate 404 is electrically connected to terminals 10 provided on one surface (the lower surface in FIG. 6) of the canopy portion 210, and the connection portion is covered with a sealing material 406. FIG. 6 shows an example in which the flexible substrate 404 and the terminals 10 are electrically connected using bonding wires 405, but this is not limiting. The present disclosure is also applicable to liquid ejection heads in which the flexible substrate 404 and the terminals 10 are electrically connected by other connection methods.

[0035] Furthermore, the ejection port surface 201a of the liquid ejection chip 2 and one surface (upper surface in FIG. 6) of the flexible substrate 404 are fixed to a support member 401 via an adhesive (not shown). Furthermore, the support member 401 is fixed to a frame 403 fixed to the head main body 4 (FIG. 2(a)) via a peripheral sealing material 407. Therefore, the liquid ejection chip 2 and the flexible substrate 404 are supported and fixed to the frame 403 via the support member 401. In addition, an opening 402 is formed in the support member 401 at a position facing the formation area of ​​the ejection port 3 to enable ejection of ink from the ejection port 3.

[0036] FIG. 7(a) is a plan view of a portion of the head module 1Ka seen from the ejection port surface 201a side, and FIG. 7(b) is a bottom view of the same portion of the head module 1Ka seen from the flow path forming substrate 204 side. As shown in FIG. 7(a), the support member 401 is formed so as to overlap the ejection port surface 201a and the eaves portion 210 of the first substrate 220 in the planar direction. Therefore, the eaves portion 210 of the first substrate 220 is supported and reinforced by the support member 401. Therefore, even if the eaves portion 210 is formed on the end of the thinned first substrate 220, the support member 401 functions as a reinforcing member for the eaves portion 210, significantly reducing the possibility of the eaves portion 210 being damaged by external force. For example, damage to the eaves portion due to impacts when wiping the ejection port surface 201a is suppressed, ensuring high structural reliability for the head module 1Ka.

[0037] The end of the support member 401 is bonded to the frame 403 via a peripheral sealant 407. The frame 403 has a framework structure that supports the end of the support member 401. In this embodiment, the frame 403 is made of a single member. Configuring the frame 403 to support multiple support members using a single member is preferable in terms of ensuring the flatness of the multiple ejection port surfaces 201a. However, it is also possible to form the frame 403 separately for each support member 401. Furthermore, the surface of the ejection port surface 201a is treated with a water-repellent coating to prevent ink from adhering, but it is preferable to remove the water-repellent coating from the adhesive portion of the adhesive portion to improve the adhesive strength of the adhesive.

[0038] The material of the sealant 406 that seals the electrical connections, such as the terminals 10, bonding wires 405, and flexible substrate 404, is not particularly limited. However, in many cases, the sealant 406 is thermosetting and has a higher linear expansion coefficient than the liquid ejection chip 2. Therefore, after the sealant 406 hardens, the thermal contraction of the sealant 406 may pull the eaves portion 210 in the direction opposite to the ink ejection direction. Therefore, the support member 401 must function as a reinforcing member that can suppress deformation of the eaves portion 210 due to the thermal contraction of the sealant 406 and deformation of the eaves portion 210 due to external forces as described above. Furthermore, the support member 401 must be made of a material that does not deform due to heat applied when adhering to the liquid ejection chip 2. To meet these requirements, it is preferable to use a material with high elasticity and a low linear expansion coefficient, such as alumina or titanium. Specifically, the support member 401 is preferably made of a material with a linear expansion coefficient of 20 ppm / °C or less.

[0039] Furthermore, the support member 401 preferably has a thickness of 100 μm or more to provide sufficient reinforcement for the overhanging portion 210. On the other hand, in order to suppress errors in the landing of ink droplets on the recording medium 111, it is preferable to narrow the distance (hereinafter referred to as the paper distance) between the ejection port surface 201a and the recording medium 111 (FIG. 1). For this reason, the thickness of the support member 401 adjacent to the ejection port surface 201a is preferably 300 μm or less. In other words, the thickness of the support member 401 is preferably 100 μm or more and 300 μm or less.

[0040] 6 shows an example in which the sealing material 406 is disposed only around the electrical connection parts such as the terminals 10, bonding wires, and flexible substrate 404. However, the sealing material 406 may be disposed over the entire area from the liquid ejection chip 2 to the frame 403, as shown in FIG.

[0041] As described above, in this embodiment, the eave portion 210 of the first substrate 220 is reinforced by the support member 401. Therefore, even when the first substrate 220 has a thinned configuration, it is possible to suppress damage to the eave portion 210, and good structural reliability can be ensured for the liquid ejection head.

[0042] (Second embodiment) Next, a second embodiment of the present disclosure will be described. Figure 9 is a cross-sectional view showing the peripheral configuration of a liquid ejection chip 2 provided in a head module of a liquid ejection head in the second embodiment, and shows a part of the cross section taken along line AA in Figure 2, similar to Figure 6. In Figure 9, the same components as those in the first embodiment are given the same reference numerals, and their description will be omitted.

[0043] The head module 1Ka in this embodiment differs from that in the first embodiment in the cross-sectional shape of the support member 401A that supports the liquid ejection chip 2. A step 421 is formed on one surface (the bottom surface in FIG. 9) of the support member 401A in this embodiment at the outer periphery of the opening 402, with the region inside the step 421 (first region) being a thin-walled portion 411 and the region outside the step 421 (second region) being a thick-walled portion 412. As in the first embodiment, the support member 401A is bonded to the end of the frame 403 via a peripheral sealant 407. The surface (the top surface in FIG. 9) of the support member 401A is formed to be flat.

[0044] The liquid ejection chip 2 is adhered to the thin portion 411 of the support member 401, and the flexible substrate 404 and the frame 403 are adhered to the thick portion 412. The thickness of the thin portion 411 is preferably 100 μm or more and 300 μm or less, similar to the thickness of the support member 401 in the first embodiment. Furthermore, the thick portion 412 should have a thickness exceeding 300 μm if electrical connection between the flexible substrate 404 and the terminal 10 is possible.

[0045] As described above, in this embodiment, by forming the thick portion 412 in the support member 401A, it is possible to increase the strength of the support member 401 and more firmly support the eave portion 210 of the first substrate 220. This makes it possible to further improve the structural reliability of the liquid ejection head. Furthermore, in the support member 401, the thin portion 411 to which the liquid ejection chip 2 is bonded has the same thickness as in the first embodiment. Therefore, the distance in the z-axis direction between the surface of the thin portion 411 (the upper surface in FIG. 9) and the ejection orifice surface 201a of the liquid ejection chip is the same as in the first embodiment. This makes it possible to improve the structural reliability of the liquid ejection head without increasing the distance between the recording medium and the ejection orifice surface 201a (paper distance).

[0046] Note that support member 401A having thin portion 411 and thick portion 412 as described above can be configured from multiple or a single plate material. For example, support member 401A having step portion 421 can be formed by joining two plate materials with openings of different sizes. Support member 401A having step portion 421 can also be formed by cutting or etching a single plate material.

[0047] (Third embodiment) Next, a third embodiment of the present disclosure will be described. Fig. 10 is a cross-sectional view showing the peripheral configuration of a liquid ejection chip 2 provided in a head module of a liquid ejection head in the third embodiment, and shows a part of the cross section taken along line AA in Fig. 2, similar to Fig. 6. In Fig. 10, the same components as those in the second embodiment are given the same reference numerals, and their description will be omitted.

[0048] As in the second embodiment described above, support member 401B in this embodiment has a thin portion 411 and a thick portion 412. However, support member 401B in this embodiment has a step portion 422 provided at the end of the surface (upper surface in FIG. 10) of thick portion 412, and the portion outside step portion 422 is thin portion 413. One surface (upper surface in FIG. 10) of thin portion 413 is bonded to frame 403 via peripheral sealing material 407.

[0049] In the liquid ejection head of this embodiment, the surface (outermost surface) located furthest forward in the ink ejection direction (z-axis direction) is formed only by the end surface of the frame 403 in the z-axis direction. This improves the dimensional accuracy and flatness of the outermost surface of the liquid ejection head compared to a configuration in which multiple support members 401 form the outermost surface. As a result, a cap (not shown) for protecting the ejection port surface 201a of the liquid ejection head when recording is stopped or the like can be brought into contact with the outermost surface of the liquid ejection head without uneven contact, thereby improving the adhesion of the cap to the liquid ejection head. Improved adhesion of the cap makes it possible to more reliably suppress the increase in viscosity of the ink inside the liquid ejection head.

[0050] Furthermore, in this embodiment, a step 422 is formed at the end of the support member 401 to provide a thin portion 413, and the thin portion 413 is used to fix the frame 403, making it possible to reduce the amount of protrusion in the ink ejection direction of the frame 403, which forms the outermost surface of the liquid ejection head. As a result, it is possible to prevent an increase in the distance between the liquid ejection head and the recording medium (paper distance).

[0051] (Other embodiments) In the above embodiments, examples have been shown in which one liquid ejection head is configured with two head modules, but it is also possible to configure one liquid ejection head with a single head module or three or more head modules. Furthermore, in the above embodiments, a liquid ejection device (recording device) equipped with four liquid ejection heads corresponding to four ink colors has been shown, but the number of liquid ejection heads mounted on a recording device is not particularly limited. Furthermore, the present disclosure is also applicable to a single recording head having rows of ejection openings corresponding to each of multiple ink colors. [Explanation of symbols]

[0052] 1K, 1Y, 1M, 1C liquid ejection head 3 outlet 5 Liquid chamber 6 Energy generating element 10 terminals 201 Nozzle substrate 201a Discharge port surface (first surface) 202 Liquid chamber substrate 203 Liquid Supply Board 204 Flow path forming substrate 202a 2nd page 210 Eave (protruding area) 220 First board 402 Aperture 401 Support member 403 Frame

Claims

1. a first substrate having an ejection port for ejecting liquid, a liquid chamber communicating with the ejection port, and an energy generating element for generating energy for ejecting the liquid in the liquid chamber from the ejection port in a first axial direction; a second substrate laminated on a second surface of the first substrate opposite to a first surface on which the ejection ports are formed, the second substrate having individual flow paths in liquid communication with the liquid chambers and a common flow path in communication with the individual flow paths, the first substrate has a protruding region that protrudes from an end of the second substrate in a planar direction perpendicular to the first axis direction, and a terminal that is electrically connected to the energy generating element is provided on the second surface of the protruding region; a support member that has an opening at a position facing a region of the first substrate in which the ejection ports are formed, that is bonded to the first surface of the first substrate, and that supports the first substrate in a range that exceeds the protruding region of the first substrate; a frame that fixes and supports the support member by a portion that overlaps with an outer edge of the support member in the first axial direction; A liquid ejection head comprising:

2. the support member has a dimension larger than the first substrate in at least one direction of a second axis direction parallel to the planar direction and a third axis direction parallel to the planar direction and perpendicular to the second axis direction, 2. The liquid ejection head according to claim 1, wherein the opening of the support member has a smaller dimension in the second axis direction and the third axis direction than the first substrate.

3. A liquid ejection head as described in claim 1 or 2, characterized in that the support member has a first region joined to the first surface of the first substrate and a second region located outside the first region, and the thickness of the second region in the first axial direction is greater than the thickness of the first region in the first axial direction.

4. A liquid ejection head as described in any one of claims 1 to 3, characterized in that the frame is joined to a thin portion formed at the end of the support member in the planar direction, and the end face of the frame in the first axial direction forms the outermost surface of the liquid ejection head.

5. 2. The liquid ejection head according to claim 1, wherein a water-repellent treatment is applied only to an area of ​​the first surface of the first substrate that faces the opening of the support member.

6. 4. The liquid ejection head according to claim 1, wherein the support member has a linear expansion coefficient of 20 ppm / [deg.] C. or less.

7. 7. The liquid ejection head according to claim 1, wherein the support member has a thickness in the first axis direction of 100 [mu]m or more and 300 [mu]m or less.

8. A liquid ejection head as described in claim 3, characterized in that the thickness of the first region in the first axial direction is 100 μm or more and 300 μm or less, and the thickness of the second region in the first axial direction is greater than 300 μm.

9. the first substrate includes an ejection port substrate in which the plurality of ejection ports are formed, and a liquid chamber substrate bonded to the ejection port substrate and forming liquid chambers corresponding to the plurality of ejection ports between the first substrate and the ejection port substrate, 9. The liquid ejection head according to claim 1, wherein the first surface is formed by the ejection port substrate, and the second surface is formed by the liquid chamber substrate.

10. 10. The liquid ejection head according to claim 9, wherein the sum of the thickness of the liquid chamber substrate in the first axial direction and the thickness of the ejection port substrate in the first axial direction is 200 [mu]m or less.

11. A liquid ejection head according to any one of claims 9 or 10, characterized in that the second substrate includes a liquid supply substrate bonded to the second surface of the liquid chamber substrate and having a plurality of individual supply flow paths formed thereon that supply liquid to each of the plurality of liquid chambers.

12. 12. The liquid ejection head according to claim 11, wherein the liquid supply substrate includes a plurality of individual recovery flow paths that recover the liquid supplied to each of the plurality of liquid chambers.

13. The liquid ejection head according to claim 12, wherein the second substrate is joined to the liquid supply substrate and includes a common supply flow path that supplies liquid to the plurality of individual supply flow paths.

14. 14. The liquid ejection head according to claim 13, wherein the liquid supply substrate includes a common recovery flow path that recovers liquid from a plurality of the individual recovery flow paths.

15. A liquid ejection head according to any one of claims 1 to 14, a conveying means for conveying a recording medium relative to the liquid ejection head; A liquid ejection device comprising:

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