Light-emitting device manufacturing method

Abstract

[Problem] To provide a light-emitting device that is highly manufacturable and has a structure suitable for increasing the density of light-emitting elements, and a method for manufacturing a light-emitting device. [Solution] A light-emitting device according to the present technology comprises a substrate, a drive element, light-emitting elements, and an interlayer insulating layer. The substrate has a substrate front surface and a substrate back surface opposite the substrate front surface. The drive element is mounted on a first mounting surface on the substrate front surface side of the substrate. The light-emitting elements are mounted on a second mounting surface on the substrate front surface side of the substrate, the second mounting surface having a distance from the substrate front surface different from that of the first mounting surface. The interlayer insulating layer is made of an insulating material and is formed between the drive element and the light-emitting elements.

Description

[Technical Field]

[0001] The present technology relates to a light-emitting device that can be used in a display or the like, and a method for manufacturing the light-emitting device. [Background technology]

[0002] Light-emitting devices used in displays and the like generally have a structure in which light-emitting elements and a driving element that drives the light-emitting elements are mounted on a substrate. As an example of a structure in which light-emitting elements and a driving element are mounted on one surface of a substrate, Patent Document 1 discloses a mounting substrate in which light-emitting elements and a driving IC are mounted on one surface of the mounting substrate.

[0003] Furthermore, as a structure in which light-emitting elements and driving elements are mounted on the front and back surfaces of a substrate, Patent Document 2 discloses a display device in which light-emitting elements and control components are mounted on the front and back surfaces of a printed circuit board, respectively. Furthermore, Patent Document 3 discloses a light-emitting device in which light-emitting elements and driver ICs are mounted on the front and back surfaces of a substrate, respectively. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-197544 [Patent Document 2] Japanese Patent Application Publication No. 9-223820 [Patent Document 3] Japanese Patent Application Laid-Open No. 2014-149489 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in a configuration in which light-emitting elements and driving elements are mounted on one surface of a substrate as described in Patent Document 1, it is necessary to arrange the driving elements between the light-emitting elements, making it difficult to mount the light-emitting elements at a high density. Also, in a configuration in which light-emitting elements and driving elements are mounted on the front and back surfaces of a substrate as described in Patent Documents 2 and 3, the mounting process becomes complicated.

[0006] In view of the above circumstances, an object of the present technology is to provide a light emitting device having excellent productivity and a structure suitable for increasing the density of light emitting elements, and a method for manufacturing the light emitting device. [Means for solving the problem]

[0007] In order to achieve the above object, a light emitting device according to an embodiment of the present technology includes a substrate, a driving element, a light emitting element, and an interlayer insulating layer. The substrate has a substrate front surface and a substrate back surface opposite to the substrate front surface. The driving element is mounted on a first mounting surface on the front surface side of the substrate. The light emitting element is mounted on a second mounting surface on the front surface side of the substrate, the second mounting surface being at a different distance from the front surface of the substrate than the first mounting surface. The interlayer insulating layer is made of an insulating material and is formed between the driving element and the light-emitting element.

[0008] The direction in which light is emitted from the light emitting element is defined as a light emitting direction, and the first mounting surface may be located on the opposite side of the light emitting direction from the second mounting surface.

[0009] The light emitting device may further include a black matrix disposed on the front surface side of the substrate, absorbing incident light, and having openings facing the light emitting elements.

[0010] The light emitting device may further include a protective layer that covers the light emitting element, and the black matrix may be disposed on the protective layer.

[0011] The black matrix may be disposed on the second mounting surface.

[0012] The second mounting surface may be further away from the surface of the substrate than the first mounting surface.

[0013] The interlayer insulating layer may be stacked on the substrate surface, have a first layer surface on the substrate surface side, and a second layer surface opposite the first layer surface, and the first mounting surface may be the substrate surface, and the second mounting surface may be the second layer surface.

[0014] The first mounting surface may be further away from the surface of the substrate than the second mounting surface.

[0015] The light emitting device may further include a protective layer laminated on the substrate surface, the interlayer insulating layer being laminated on the protective layer and having a first layer surface on the substrate surface side and a second layer surface opposite the first layer surface, the protective layer having a third layer surface on the substrate surface side and a fourth layer surface opposite the third layer surface, the first mounting surface being the second layer surface, and the second mounting surface being the fourth layer surface.

[0016] The light emitting device may further include a first wiring disposed on the first mounting surface and connected to the driving element, and a second wiring connecting the driving element and the light emitting element.

[0017] The second wiring may be disposed on the first mounting surface, the second mounting surface, and in the interlayer insulating layer.

[0018] The second wiring may be disposed in the interlayer insulating layer and may not be disposed on the second mounting surface. Light-emitting device.

[0019] A black matrix that absorbs incident light and has openings facing the light emitting elements may be disposed on the second mounting surface.

[0020] A sealing body that seals the light emitting element may be provided on the second mounting surface.

[0021] The second wiring may be disposed in the interlayer insulating layer and not on the first mounting surface.

[0022] The interlayer insulating layer may shield the driving element from the light emitting element.

[0023] The driving element may be a thin film transistor.

[0024] The driving element may be an integrated circuit.

[0025] In order to achieve the above object, a manufacturing method for a light-emitting device according to one embodiment of the present technology includes mounting a driving element on a first mounting surface on the surface side of a substrate having a surface and a back surface opposite the surface of the substrate, connecting the driving element to a first wiring, inspecting the driving element, and if an error has occurred in the driving element, repairing the driving element that has occurred in the error, mounting a light-emitting element on a second mounting surface on the surface side of the substrate that is a different distance from the surface of the substrate than the first mounting surface, connecting the light-emitting element to a second wiring, inspecting the light-emitting element, and if an error has occurred in the light-emitting element, repairing the light-emitting element that has occurred in the error.

[0026] In order to achieve the above object, a manufacturing method for a light-emitting device according to one embodiment of the present technology includes mounting a light-emitting element on a second mounting surface on the surface side of a substrate having a surface and a back surface opposite the surface of the substrate, connecting the light-emitting element to a second wiring, inspecting the light-emitting element, and if an error has occurred in any of the light-emitting elements, repairing the light-emitting element that has occurred in the error, mounting a driving element on a first mounting surface on the surface side of the substrate that is a different distance from the surface of the substrate than the second mounting surface, connecting the driving element to a first wiring, inspecting the driving element, and if an error has occurred in any of the driving elements, repairing the driving element that has occurred in the error. [Brief explanation of the drawings]

[0027] [Figure 1] 1 is a cross-sectional view of a light emitting device according to a first embodiment of the present technology. [Figure 2] FIG. 2 is an exploded cross-sectional view of the light emitting device. [Figure 3]FIG. 2 is a plan view of the light emitting device. [Figure 4] FIG. 2 is a plan view of a partial configuration of the light emitting device. [Figure 5] 4 is a schematic diagram of a second wiring included in the light emitting device. FIG. [Figure 6] 4 is a schematic diagram showing the distances from the surface of the substrate to the first mounting surface and the second mounting surface of the light emitting device. FIG. [Figure 7] 3A to 3C are schematic diagrams illustrating the operation of the light emitting device. [Figure 8] 3A to 3C are schematic diagrams illustrating a method for manufacturing the light emitting device. [Figure 9] 3A to 3C are schematic diagrams illustrating a method for manufacturing the light emitting device. [Figure 10] 3A to 3C are schematic diagrams illustrating a method for manufacturing the light emitting device. [Figure 11] FIG. 10 is a cross-sectional view of a light emitting device according to a comparative example of the present technology. [Figure 12] FIG. 2 is a plan view of the light emitting device. [Figure 13] 3 is a schematic diagram showing the relationship between the thickness of a protective film and black matrix openings in the light emitting device according to the first embodiment of the present technology. FIG. [Figure 14] FIG. 10 is a cross-sectional view of a light emitting device according to a modified example of the first embodiment of the present technology. [Figure 15] FIG. 10 is a cross-sectional view of a light emitting device according to a modified example of the first embodiment of the present technology. [Figure 16] FIG. 10 is a cross-sectional view of a light emitting device according to a modified example of the first embodiment of the present technology. [Figure 17] FIG. 10 is a cross-sectional view of a light emitting device according to a modified example of the first embodiment of the present technology. [Figure 18] FIG. 10 is a cross-sectional view of a light emitting device according to a modified example of the first embodiment of the present technology. [Figure 19] FIG. 10 is a cross-sectional view of a light emitting device according to a modified example of the first embodiment of the present technology. [Figure 20] FIG. 10 is a cross-sectional view of a light emitting device according to a second embodiment of the present technology. [Figure 21] FIG. 2 is an exploded cross-sectional view of the light emitting device. [Figure 22]4 is a schematic diagram showing the distances from the surface of the substrate to the first mounting surface and the second mounting surface of the light emitting device. FIG. [Figure 23] 3A to 3C are schematic diagrams illustrating the operation of the light emitting device. DETAILED DESCRIPTION OF THE INVENTION

[0028] A light emitting device according to each embodiment of the present technology will be described. The light emitting device according to each embodiment of the present technology is a light emitting device that can be used as a backlight for a display panel or a display.

[0029] (First embodiment) A light emitting device according to a first embodiment of the present technology will be described.

[0030] [Structure of light-emitting device] The structure of the light emitting device according to this embodiment will be described. FIG. 1 is a cross-sectional view of a light emitting device 100 according to this embodiment, and FIG. 2 is an exploded cross-sectional view of the light emitting device 100. FIG. 3 is a plan view of the light emitting device 100, and FIG. 4 is a plan view of a portion of the configuration of the light emitting device 100. In each drawing of this disclosure, the light emitting direction of the light emitting device 100 is defined as the Z direction, a direction perpendicular to the Z direction is defined as the X direction, and a direction perpendicular to the X and Z directions is defined as the Y direction. The X and Y directions are directions along the layer plane direction of each layer of the light emitting device 100, and the Z direction is a direction along the stacking direction of each layer of the light emitting device 100.

[0031] As shown in FIGS. 1 and 2, the light emitting device 100 includes a substrate 101, a driving element 102, an interlayer insulating layer 103, a light emitting element 104, a protective layer 105, a black matrix 106, a first wiring 107, and a second wiring 108.

[0032] The substrate 101 supports each layer of the light emitting device 100. As shown in Fig. 2, the substrate 101 has a substrate front surface 101a and a substrate back surface 101b opposite to the substrate front surface 101a. The material of the substrate 101 is not particularly limited, but can be, for example, glass or an organic material.

[0033] The driving element 102 drives the light-emitting element 104. The driving element 102 may be a thin film transistor (TFT) or an integrated circuit. The driving element 102 is mounted on a first mounting surface S1 as shown in FIG. 2. As shown in FIG. 1, the first mounting surface S1 may be a substrate surface 101a. Although FIG. 1 shows one driving element 102, the light-emitting device 100 may include a plurality of driving elements 102 arranged in a matrix. Alternatively, the light-emitting device 100 may include one driving element 102.

[0034] The interlayer insulating layer 103 is formed between the driving element 102 and the light-emitting element 104, and insulates the driving element 102 from the light-emitting element 104. The interlayer insulating layer 103 can be laminated on the substrate surface 101a of the substrate 101 and on the driving element 102. As shown in FIG. 2, the surface of the interlayer insulating layer 103 facing the substrate surface 101a is referred to as the first layer surface 103a, and the surface opposite the first layer surface 103a is referred to as the second layer surface 103b. The material of the interlayer insulating layer 103 can be any insulating material, but a material with high light-blocking properties is preferred, and the interlayer insulating layer 103 preferably has a light transmittance of 1% or less at the emission wavelength of the light-emitting element 104.

[0035] The light-emitting element 104 emits light. The light-emitting element 104 may be a semiconductor light-emitting element such as an LED (light emitting diode) or an LD (laser diode), and may operate as a light source for a pixel (each of R, G, and B pixels) of a display or a backlight. The emission wavelength of the light-emitting element 104 is not particularly limited, and may be visible light, ultraviolet light, infrared light, or the like, and each light-emitting element 104 may emit light at a different wavelength. As shown in FIG. 2, the light-emitting element 104 is mounted on a second mounting surface S2. As shown in FIG. 1, the second mounting surface S2 may be the second-layer surface 103b of the interlayer insulating layer 103. The light-emitting device 100 may include a plurality of light-emitting elements 104 arranged in a matrix, or may include a single light-emitting element 104.

[0036] The protective layer 105 covers the light-emitting element 104 and protects it. The protective layer 105 can be laminated on the interlayer insulating layer 103 and the light-emitting element 104. As shown in FIG. 2, the surface of the protective layer 105 facing the substrate surface 101a is referred to as a third-layer surface 105a, and the surface opposite the first-layer surface 105a is referred to as a fourth-layer surface 105b. The material of the protective layer 105 can be any insulating material, and a material that is highly optically transparent to the wavelength of light emitted by the light-emitting element 104 is preferred.

[0037] The black matrix 106 absorbs incident light. The black matrix 106 may be formed on the protective layer 105. As shown in Fig. 3, the black matrix 106 has an opening 106a. The opening 106a faces the light emitting element 104 and is formed so that the black matrix 106 does not block the light emitted from the light emitting element 104.

[0038] The first wiring 107 is a wiring connected to the driving element 102. The first wiring 107 is disposed on the substrate surface 101a, i.e., on the first mounting surface S1, as shown in Figure 1. The first wiring 107 is made of any conductive material.

[0039] The second wiring 108 is a wiring that connects the driving element 102 and the light-emitting element 104. FIG. 5 is a schematic diagram showing the second wiring 108. As shown in FIG. 5, the second wiring 108 has a first portion 108a, a second portion 108b, and a third portion 108c. The first portion 108a is connected to the light-emitting element 104 and is disposed on the second-layer surface 103b of the interlayer insulating layer 103, i.e., on the second mounting surface S2. The second portion 108b is connected to the driving element 102 and is disposed on the substrate surface 101a, i.e., on the first mounting surface S1. The third portion 108c connects the first portion 108a and the second portion 108b and is disposed in the interlayer insulating layer 103. The second portion 108b is disposed on the substrate surface 101a, spaced apart from the first wiring 107. The second wiring 108 is made of any conductive material.

[0040] [About the first and second mounting surfaces] As described above, the driving element 102 is disposed on the first mounting surface S1, and the light-emitting element 104 is disposed on the second mounting surface S2. Both the first mounting surface S1 and the second mounting surface S2 are surfaces on the substrate surface 101a side of the substrate 101, and are surfaces parallel to the layer planes (XY planes) of each layer. Here, the second mounting surface S2 can be further away from the substrate surface 101a than the first mounting surface S1. Figure 6 is a schematic diagram showing the distances between the first mounting surface S1 and the second mounting surface S2 and the substrate surface 101a.

[0041] As shown in the figure, if the distance between the first mounting surface S1 and the substrate surface 101a is distance D1 and the distance between the second mounting surface S2 and the substrate surface 101a is distance D2, distance D2 can be greater than distance D1. In the above configuration, the first mounting surface S1 is flush with the substrate surface 101a, so distance D1 is 0, but the first mounting surface S1 may be a surface separated from the substrate surface 101a. In this case, distance D1 is greater than 0 and less than distance D2.

[0042] The light emitting device 100 has the above-described configuration. As shown in Figures 1 and 4, the light emitting device 100 may have a configuration in which 12 light emitting elements 104 are connected to one driving element 102. The number of light emitting elements 104 connected to one driving element 102 is not particularly limited, and may be any number equal to or greater than one.

[0043] [Light-emitting device operation] The operation of the light emitting device 100 will be described. Fig. 7 is a schematic diagram showing the operation of the light emitting device 100. When a drive signal is supplied to the drive element 102 from the outside via the first wiring 107, the drive element 102 generates a drive signal for each light emitting element 104 and supplies the drive signal to each light emitting element 104 via the second wiring 108. When each light emitting element 104 receives the drive signal from the drive element 102, it emits light L as shown in Fig. 7. The light L passes through the protective layer 105 from the light emitting element 104 and is emitted through the opening 106a (see Fig. 2) in the black matrix 106.

[0044] 7, the direction in which light L is emitted from light emitting device 100 is defined as light emission direction D. In this manner, light emitting device 100 can have a top emission structure in which light L is emitted in the direction opposite to substrate 101.

[0045] With regard to the relationship between the light emission direction D and the first mounting surface S1 and second mounting surface S2, the first mounting surface S1 is located on the opposite side of the second mounting surface S2 in the light emission direction D. This prevents the light L emitted from the light emitting element 104 from being blocked by the driving element 102, thereby improving the degree of freedom in the size and arrangement of the driving element 102.

[0046] [Method of manufacturing a light-emitting device] The following describes a method for manufacturing the light emitting device 100. Figures 8 to 10 are schematic diagrams showing a method for manufacturing the light emitting device 100. First, as shown in Figure 8, the driving element 102 is mounted on the substrate surface 101a (first mounting surface S1) on which the first wiring 107 is formed, and the driving element 102 and the first wiring 107 are connected.

[0047] After mounting the driving element 102, the driving element 102 is inspected to detect any errors in the driving element 102. Errors include malfunctions of the driving element 102 itself and faulty connections between the driving element 102 and the first wiring 107. If an error occurs in a driving element 102, the driving element 102 is repaired. Repair of the driving element 102 may involve reconnecting the driving element 102 to the first wiring 107, or replacing the driving element 102 with another driving element 102.

[0048] 9, an interlayer insulating layer 103 is laminated on the substrate surface 101a and the driving element 102, and a through hole 103c for the second wiring 108 is formed. Then, as shown in Fig. 10, the light emitting element 104 is mounted on the second layer surface 103b (second mounting surface S2) of the interlayer insulating layer 103. Furthermore, the second wiring 108 is formed using the through hole 103c, and the light emitting element 104 and the driving element 102 are connected by the second wiring 108.

[0049] After mounting the light emitting element 104, the light emitting element 104 is inspected to detect any errors in the light emitting element 104. Errors include malfunction of the light emitting element 104 itself, a faulty connection between the light emitting element 104 and the second wiring 108, and a faulty connection between the driving element 102 and the second wiring 108. When an error occurs in a light emitting element 104, the light emitting element 104 is repaired. Repair of the light emitting element 104 may involve reconnecting the light emitting element 104 to the second wiring 108, or replacing the light emitting element 104 with another light emitting element 104.

[0050] After inspecting the light emitting element 104, a protective layer 105 and a black matrix 106 are formed as shown in Fig. 1, thereby completing the manufacture of the light emitting device 100. Note that the light emitting device 100 can also be manufactured by a manufacturing method different from the above-described manufacturing method.

[0051] [Effects of the light-emitting device] The effects of light emitting device 100 will be described in comparison with a comparative example. Fig. 11 is a cross-sectional view of light emitting device 300 according to the comparative example, and Fig. 12 is a plan view of a portion of the configuration of light emitting device 300. As shown in these figures, light emitting device 300 includes substrate 301, driving element 302, light emitting element 304, protective layer 305, black matrix 306, and wiring 307. Substrate 301 has substrate surface 301a and substrate back surface 301b, and driving element 302 and light emitting element 304 are mounted on substrate surface 301a.

[0052] In the structure of the light emitting device 300, the driving elements 302 and the light emitting elements 304 are both mounted on the substrate surface 301a, so it is necessary to prevent interference between the driving elements 302 and the light emitting elements 304, making it difficult to pack the light emitting elements 304 closely together, as shown in Figure 12. In particular, if the driving elements 302 and the light emitting elements 304 are at different heights, mounting defects are likely to occur, making packing even more difficult. Furthermore, the size of the driving elements 302 is also limited.

[0053] In contrast, in the light emitting device 100 according to this embodiment, the driving element 102 is mounted on the first mounting surface S1, and the light emitting element 104 is mounted on the second mounting surface S2, so there is no need to prevent interference between the driving element 102 and the light emitting element 104, and the light emitting elements 104 can be mounted at high density (see FIG. 4). Furthermore, the size of the driving element 102 can be increased, and it becomes possible to control multiple light emitting elements 104 with one driving element 102.

[0054] Furthermore, in the light emitting device 100, as described above, the driving element 102 can be inspected after being mounted, and the light emitting element 104 can be mounted after repairing the driving element 102. On the other hand, in the light emitting device 300, the driving element 302 and the light emitting element 304 are inspected simultaneously, so when an error occurs, it is difficult to determine whether the driving element 302 or the light emitting element 304 is the cause.

[0055] If only the driving element 302 is mounted, inspected, and then repaired before mounting the light-emitting element 304, it is possible to repair the error in the driving element 302. However, in this case, there is a possibility that a new error will occur in the connection of the driving element 302 due to heat or the like generated when the light-emitting element 304 is mounted. In contrast, in the light-emitting device 100, the light-emitting element 104 can be mounted after repairing the driving element 102, and the mounting surfaces of the driving element 102 and the light-emitting element 104 are spaced apart, making it easy to identify the cause of the error and perform repairs.

[0056] Furthermore, in the light-emitting device 100, the protective layer 105 that covers the light-emitting element 104 can be made thinner. In the light-emitting device 300, the protective layer 305 needs to cover the light-emitting element 304 and the driving element 302, and therefore needs to be made thicker to match the driving element 302, which is generally thicker. On the other hand, in the light-emitting device 100, the protective layer 105 only needs to cover the light-emitting element 104, and therefore the protective layer 105 can be made thinner. This thinner protective layer 105 makes it possible to reduce the size of the opening 106a in the black matrix 106. FIG. 13 is a schematic diagram showing the relationship between the thickness of the protective layer 105 and the size of the opening 106a.

[0057] The black matrix 106 deteriorates when the light intensity of the light L incident from the light-emitting element 104 is high. For this reason, openings 106a are provided in areas where the light intensity of the light L is above a threshold, and the black matrix 106 is formed only in areas where the light intensity is below the threshold. FIG. 13(a) is a schematic diagram of a case where the protective layer 105 is thick, and FIG. 13(b) is a schematic diagram of a case where the protective layer 105 is thin. As shown in these figures, when the spacing between the light-emitting elements 104 is equal, a thinner protective layer 105 narrows the range of incidence of light L above a predetermined intensity onto the fourth-layer surface 105b, allowing the size of the openings 106a to be reduced. This increases the area ratio of the fourth-layer surface 105b covered by the black matrix 106, thereby improving the black ratio.

[0058] Furthermore, in the light emitting device 100, an interlayer insulating layer 103 is provided between the driving element 102 and the light emitting element 104. Therefore, the interlayer insulating layer 103 suppresses optical waveguiding, in which light emitted from the light emitting element 104 reaches the driving element 102, and it is possible to reduce malfunction of the driving element 102 due to optical waveguiding. In particular, by making the interlayer insulating layer 103 have an optical transmittance of 1% or less at the emission wavelength of the light emitting element 104, it is possible to further reduce malfunction of the driving element 102 due to optical waveguiding.

[0059] [Variations] Modifications of the light emitting device 100 according to this embodiment will be described below. Figures 14 to 20 are cross-sectional views of the light emitting device 100 according to the modifications.

[0060] 14, the second wiring 108 may be connected to the back surface of the light-emitting element 104, may not have the first portion 108a (see FIG. 5), and may have only the second portion 108b and the third portion 108c. That is, the second wiring 108 may be disposed on the first mounting surface S1 and in the interlayer insulating layer 103, but may not be disposed on the second mounting surface S2. In this configuration, the second wiring 108 is not present on the second-layer surface 103b, and the second wiring 108 cannot be seen through the openings 106a of the black matrix 106, thereby improving the image quality of the light-emitting device 100.

[0061] 15, the black matrix 106 may be disposed on the second-layer surface 103b (second mounting surface S2). As shown in FIG. 14, the second wiring 108 does not have the first portion 108a, so that the black matrix 106 can be disposed on the second-layer surface 103b. In this configuration, the black matrix 106 can be formed adjacent to the periphery of the light-emitting element 104, which further increases the black ratio and improves image quality.

[0062] 16, a sealant 109 may be provided instead of the protective layer 105. The sealant 109 covers and seals each of the light-emitting elements 104. Any insulating material may be used as the material for the sealant 109, and a material that has high optical transparency to the emission wavelength of the light-emitting element 104 is preferable. As shown in FIG. 15, by disposing the black matrix 106 on the second layer surface 103b, the sealant 109 can be provided instead of the protective layer 105, thereby improving material efficiency.

[0063] 17, the second wiring 108 may be connected to the upper surface of the driving element 102, and may have only the third portion 108c, without having the first portion 108a and the second portion 108b (see FIG. 5). That is, the second wiring 108 may be disposed in the interlayer insulating layer 103, and not disposed on the first mounting surface S1 or the second mounting surface S2. This configuration makes it possible to reduce the wiring density on the substrate surface 101a, and improve the yield of the light-emitting device 100.

[0064] 18, a black matrix 106 may be disposed on the second layer surface 103b (second mounting surface S2) in the configuration of FIG. 17. This configuration also makes it possible to further increase the black ratio and improve image quality compared to the configuration of FIG. 17. Furthermore, as shown in FIG. 19, a sealing body 109 can be provided in place of the protective layer 105 in the configuration of FIG. 17. This configuration also makes it possible to improve material efficiency compared to the configuration of FIG. 17.

[0065] The second wiring 108 may not have the second portion 108b (see FIG. 5), but may have only the first portion 108a and the third portion 108c. That is, the second wiring 108 may be disposed on the second mounting surface S2 and in the interlayer insulating layer 103, but not on the first mounting surface S1.

[0066] As described above, the light emitting device 100 can have various configurations. Note that the protective layer 105 and the sealing body 109 do not necessarily have to be provided in each of the above configurations. Also, although the substrate surface 101a is the first mounting surface S1 and the second layer surface 103b is the second mounting surface S2, this is not limitative. The first mounting surface S1 is the surface of the substrate 101 facing the substrate surface 101a, and the second mounting surface S2 is the surface of the substrate 101 facing the substrate surface 101a, and the second mounting surface S2 may be any surface that is farther away from the substrate surface 101a than the first mounting surface S1.

[0067] (Second embodiment) A light emitting device according to a second embodiment of the present technology will be described.

[0068] [Structure of light-emitting device] The structure of the light emitting device according to this embodiment will be described. Fig. 20 is a cross-sectional view of a light emitting device 200 according to this embodiment, and Fig. 21 is an exploded cross-sectional view of the light emitting device 200. The light emitting device 200 has a bottom emission structure instead of the top emission structure of the light emitting device 100 according to the first embodiment.

[0069] As shown in FIGS. 20 and 21, the light emitting device 200 includes a substrate 201, a driving element 202, an interlayer insulating layer 203, a light emitting element 204, a protective layer 205, a black matrix 206, a first wiring 207, and a second wiring 208.

[0070] The substrate 201 supports each layer of the light-emitting device 200. As shown in Fig. 21, the substrate 201 has a substrate front surface 201a and a substrate back surface 201b opposite to the substrate front surface 201a. The material of the substrate 201 is not particularly limited, but may be, for example, glass or an organic material.

[0071] The driving element 202 drives the light-emitting element 204. The driving element 202 may be a thin film transistor (TFT) or an integrated circuit. The driving element 202 is mounted on a first mounting surface S1 as shown in FIG. 21. As shown in FIG. 20, the first mounting surface S1 may be a second-layer surface 203b of the interlayer insulating layer 203. Although FIG. 20 shows one driving element 202, the light-emitting device 200 may include a plurality of driving elements 202 arranged in a matrix. Alternatively, the light-emitting device 200 may include one driving element 202.

[0072] The interlayer insulating layer 203 is formed between the driving element 202 and the light-emitting element 204, and insulates the driving element 202 from the light-emitting element 204. The interlayer insulating layer 203 can be laminated on the protective layer 205 and the light-emitting element 204. As shown in FIG. 21 , the surface of the interlayer insulating layer 203 facing the substrate surface 201a is referred to as a first layer surface 203a, and the surface opposite the first layer surface 203a is referred to as a second layer surface 203b. The material of the interlayer insulating layer 203 can be any insulating material, but a material with high light-blocking properties is preferred, and the interlayer insulating layer 203 preferably has a light transmittance of 1% or less at the emission wavelength of the light-emitting element 204.

[0073] The light emitting element 204 emits light. The light emitting element 204 may be a semiconductor light emitting element such as an LED (light emitting diode) or an LD (laser diode), and may be used as a light source for display pixels (each of R, G, and B pixels) or a backlight. The emission wavelength of the light emitting element 204 is not particularly limited, and may be visible light, ultraviolet light, infrared light, or the like, and each light emitting element 204 may emit light at a different wavelength. As shown in FIG. 21, the light emitting element 204 is mounted on a second mounting surface S2. As shown in FIG. 20, the second mounting surface S2 may be a fourth layer surface 205b of the protective layer 205. The light emitting device 200 may include a plurality of light emitting elements 204 arranged in a matrix. Alternatively, the light emitting device 200 may include a single light emitting element 204.

[0074] The protective layer 205 covers the light-emitting element 204 and protects it. The protective layer 205 can be laminated on the substrate surface 201a and the black matrix 206. As shown in FIG. 21 , the surface of the protective layer 205 facing the substrate surface 201a is referred to as a third-layer surface 205a, and the surface opposite the third-layer surface 205a is referred to as a fourth-layer surface 205b. The material of the protective layer 205 can be any insulating material, and a material that is highly transparent to the wavelength of light emitted by the light-emitting element 204 is preferred.

[0075] The black matrix 206 absorbs incident light. The black matrix 206 can be formed on the substrate surface 201a. As shown in Fig. 21, the black matrix 206 has an opening 206a. The opening 206a faces the light emitting element 204 and is formed so that the black matrix 206 does not block the light emitted from the light emitting element 204.

[0076] The first wiring 207 is a wiring connected to the driving element 202. The first wiring 207 is disposed on the second layer surface 203a, i.e., on the first mounting surface S1, as shown in Fig. 20. The second wiring 207 is made of any conductive material.

[0077] The second wiring 208 is a wiring that connects the driving element 202 and the light-emitting element 204. As shown in FIG. 21 , the second wiring 208 has a first portion 208a, a second portion 208b, and a third portion 208c. The first portion 208a is connected to the driving element 202 and is disposed on the second-layer surface 203b, i.e., on the first mounting surface S1. The second portion 208b is connected to the light-emitting element 204 and is disposed on the fourth-layer surface 205b, i.e., on the second mounting surface S2. The third portion 208c connects the first portion 208a and the second portion 208b and is disposed in the interlayer insulating layer 203. The first portion 208a is provided on the second-layer surface 203b, spaced apart from the first wiring 207. The second wiring 208 is made of any conductive material.

[0078] [About the first and second mounting surfaces] In the second embodiment, the driving element 202 is also arranged on the first mounting surface S1, and the light emitting element 204 is arranged on the second mounting surface S2. The first mounting surface S1 and the second mounting surface S2 are both surfaces on the substrate surface 201a side of the substrate 201, and are surfaces parallel to the layer planes (XY planes) of each layer. Here, contrary to the first embodiment, the first mounting surface S1 can be farther away from the substrate surface 201a than the second mounting surface S2.

[0079] 22 is a schematic diagram showing the distance between the first mounting surface S1 and the second mounting surface S2 and the substrate surface 201a. As shown in the figure, if the distance between the first mounting surface S1 and the substrate surface 201a is distance D1 and the distance between the second mounting surface S2 and the substrate surface 201a is distance D2, then distance D1 can be greater than distance D2.

[0080] The light emitting device 200 has the above-described configuration. In the light emitting device 200, the number of light emitting elements 204 connected to one driving element 202 is not particularly limited, and can be any number equal to or greater than one.

[0081] [Light-emitting device operation] The operation of the light emitting device 200 will be described. Fig. 23 is a schematic diagram showing the operation of the light emitting device 200. In the light emitting device 200, when a drive signal is supplied from the outside to the drive element 202 via the first wiring 207, the drive element 202 generates a drive signal for each light emitting element 204 and supplies the drive signal to each light emitting element 204 via the second wiring 208. When each light emitting element 204 receives the drive signal from the drive element 202, it emits light L as shown in Fig. 23. The light L passes from the light emitting element 204 through the protective layer 205 and the substrate 201, and is emitted through the opening 206a of the black matrix 206 (see Fig. 21).

[0082] 23, the direction in which light L is emitted from light emitting device 200 is defined as light emission direction D. In this manner, light emitting device 200 can have a bottom emission structure in which light L is emitted in the same direction as substrate 201.

[0083] With regard to the relationship between the light emission direction D and the first mounting surface S1 and second mounting surface S2, the first mounting surface S1 is located on the opposite side of the second mounting surface S2 in the light emission direction D. This prevents the light L emitted from the light emitting element 204 from being blocked by the driving element 202, thereby improving the degree of freedom in the size and arrangement of the driving element 202.

[0084] [Method of manufacturing a light-emitting device] A method for manufacturing the light emitting device 200 will now be described. In the method for manufacturing the light emitting device 200, similar to the method for manufacturing the light emitting device 100, the driving element 202 and the light emitting element 204 can be mounted in different processes and inspected separately. Specifically, the light emitting element 204 is mounted on the fourth layer surface 205b (see FIG. 20), which is the second mounting surface S2, and connected to the second wiring 208, and then the light emitting element 204 is inspected to detect any errors in the light emitting element 204. If an error occurs in the light emitting element 204, the light emitting element 204 is repaired.

[0085] Next, an interlayer insulating layer 203 is laminated, and a driving element 202 is mounted on the second layer surface 203b, which is the first mounting surface S1, and connected to the first wiring 207. Thereafter, the driving element 202 is inspected to detect any errors in the driving element 202. If an error occurs in the driving element 202, the driving element 202 is repaired.

[0086] The light emitting device 200 can be manufactured in the above manner. Note that the light emitting device 200 can also be manufactured by a manufacturing method different from the above-described manufacturing method.

[0087] [Effects of the light-emitting device] The light emitting device 200 has the same effects as the light emitting device 100. That is, since the driving element 202 is mounted on the first mounting surface S1 and the light emitting element 204 is mounted on the second mounting surface S2, it is possible to mount the light emitting element 204 at high density and also possible to increase the size of the driving element 202.

[0088] Furthermore, in light-emitting device 200, it is possible to mount drive element 202 after repairing light-emitting element 204, and the mounting surfaces of drive element 202 and light-emitting element 204 are spaced apart, making it easy to identify the cause of an error and perform repairs. Also, in light-emitting device 200, it is possible to reduce the thickness of protective layer 205 that covers light-emitting element 204, so it is possible to reduce the size of opening 206a in black matrix 206 and improve the black ratio.

[0089] Furthermore, in the light-emitting device 200, an interlayer insulating layer 203 is provided between the driving element 202 and the light-emitting element 204, which suppresses light waveguiding from the light-emitting element 204 to the driving element 202, thereby making it possible to reduce malfunction of the driving element 202 due to light waveguiding.

[0090] [Variations] In the light emitting device 200, the second layer surface 203b is the first mounting surface S1, and the fourth layer surface 205b is the second mounting surface S2, but the present invention is not limited to this. The first mounting surface S1 is the surface of the substrate 201 facing the substrate surface 201a, and the second mounting surface S2 is the surface of the substrate 201 facing the substrate surface 201a, and the first mounting surface S1 may be any surface that is farther away from the substrate surface 201a than the second mounting surface S2.

[0091] (About this disclosure) The effects described in this disclosure are merely examples and are not limiting, and other effects may also be present. The description of multiple effects above does not necessarily mean that these effects are exhibited simultaneously. It means that at least one of the effects described above can be obtained depending on the conditions, etc., and effects not described in this disclosure may also be exhibited. Furthermore, at least two of the characteristic features described in this disclosure can be arbitrarily combined.

[0092] The present technology can also be configured as follows.

[0093] (1) a substrate having a substrate front surface and a substrate back surface opposite to the substrate front surface; a driving element mounted on a first mounting surface on the front surface side of the substrate; a light emitting element mounted on a second mounting surface on the front surface side of the substrate, the second mounting surface being at a different distance from the front surface of the substrate than the first mounting surface; an interlayer insulating layer made of an insulating material and formed between the driving element and the light-emitting element; A light emitting device comprising: (2) The light emitting device according to (1) above, The direction in which light emitted from the light emitting element is emitted is defined as a light emitting direction, and the first mounting surface is located on the opposite side of the light emitting direction from the second mounting surface. Light-emitting device. (3) The light-emitting device according to (1) or (2), The substrate further includes a black matrix disposed on the front surface side of the substrate, absorbing incident light, and having an opening facing the light emitting element. Light-emitting device. (4) The light-emitting device according to (3) above, a protective layer covering the light-emitting element; The black matrix is ​​disposed on the protective layer. Light-emitting device. (5) The light-emitting device according to (3) above, The black matrix is ​​disposed on the second mounting surface. Light-emitting device. (6) The light emitting device according to any one of (1) to (5) above, The second mounting surface is farther from the surface of the substrate than the first mounting surface. Light-emitting device. (7) The light emitting device according to (6) above, the interlayer insulating layer is laminated on the substrate surface, and has a first layer surface on the substrate surface side and a second layer surface on the opposite side to the first layer surface; the first mounting surface is the surface of the substrate, The second mounting surface is the second layer surface. Light-emitting device. (8) The light emitting device according to any one of (1) to (5) above, The first mounting surface is farther from the surface of the substrate than the second mounting surface. Light-emitting device. (9) The light-emitting device according to (8) above, Further comprising a protective layer laminated on the surface of the substrate; the interlayer insulating layer is laminated on the protective layer and has a first layer surface on the substrate surface side and a second layer surface on the opposite side to the first layer surface; the protective layer has a third layer surface on the substrate surface side and a fourth layer surface on the opposite side to the third layer surface, the first mounting surface is the second layer surface; The second mounting surface is the fourth layer surface. Light-emitting device. (10) The light emitting device according to any one of (1) to (9) above, a first wiring disposed on the first mounting surface and connected to the driving element; a second wiring that connects the driving element and the light-emitting element; The light emitting device further comprises: (11) The light-emitting device according to (10) above, The second wiring is disposed on the first mounting surface, the second mounting surface, and in the interlayer insulating layer. Light-emitting device. (12) The light-emitting device according to (10) above, The second wiring is disposed in the interlayer insulating layer and is not disposed on the second mounting surface. Light-emitting device. (13) The light-emitting device according to (12) above, A black matrix that absorbs incident light and has openings facing the light emitting elements is disposed on the second mounting surface. Light-emitting device. (14) The light-emitting device according to (12) above, A sealing body that seals the light emitting element is provided on the second mounting surface. Light-emitting device. (15) The light-emitting device according to (10) above, The second wiring is disposed in the interlayer insulating layer and is not disposed on the first mounting surface. Light-emitting device. (16) The light emitting device according to any one of (1) to (15) above, The interlayer insulating layer shields the driving element from the light emitting element. Light-emitting device. (17) The light emitting device according to any one of (1) to (16) above, The driving element is a thin film transistor. Light-emitting device. (18) The light emitting device according to any one of (1) to (16) above, The driving element is an integrated circuit Light-emitting device. (19) a substrate having a substrate surface and a substrate back surface opposite to the substrate surface, a driving element is mounted on a first mounting surface on the substrate surface side, and the driving element and a first wiring are connected; Inspecting the driving elements, and if any driving elements have an error, repairing the driving elements having the error; a light emitting element is mounted on a second mounting surface on the front surface side of the substrate, the second mounting surface being at a different distance from the front surface of the substrate than the first mounting surface, and the light emitting element is connected to a second wiring; The light emitting elements are inspected, and if any light emitting element has an error, the light emitting element having the error is repaired. A method for manufacturing a light-emitting device. (20) a substrate having a substrate surface and a substrate back surface opposite to the substrate surface, a light emitting element is mounted on a second mounting surface on the substrate surface side, and the light emitting element and a second wiring are connected; Inspecting the light emitting elements, and if any light emitting element has an error, repairing the light emitting element having the error; a driving element is mounted on a first mounting surface on the substrate surface side of the substrate, the first mounting surface being at a different distance from the substrate surface than the second mounting surface, and the driving element is connected to a first wiring; Inspect the above drive elements, and if any drive elements have errors, repair the drive elements that have errors. A method for manufacturing a light-emitting device. [Explanation of symbols]

[0094] 100, 200...light-emitting device 101, 201... PCB 102, 202...Drive elements 103, 203...Interlayer insulating layer 104, 204...light emitting element 105, 205…protective layer 106, 206...Black matrix 107, 207...1st wiring 108, 208…Second wiring 109...Sealing body

Claims

1. a substrate having a substrate surface and a substrate back surface opposite to the substrate surface, a driving element is mounted on a first mounting surface on the substrate surface side, and the driving element is connected to a first wiring; Inspecting the driving elements, and if any driving element has an error, repairing the driving element having the error; a light emitting element is mounted on a second mounting surface on the front surface side of the substrate, the second mounting surface being more distant from the front surface of the substrate than the first mounting surface, and the light emitting element is connected to a second wiring; Inspecting the light emitting elements, and if any light emitting elements have an error, repairing the light emitting elements having the error; A black matrix for absorbing incident light is formed adjacent to the periphery of the light emitting element on the second mounting surface. A method for manufacturing a light-emitting device.

2. A method for manufacturing the light emitting device according to claim 1, comprising: The second wiring connects the driving element and the light-emitting element, is disposed in an interlayer insulating layer formed between the driving element and the light-emitting element, and is not disposed on the second mounting surface. A method for manufacturing a light-emitting device.

3. A method for manufacturing a light emitting device according to claim 2, comprising: The interlayer insulating layer shields the driving element from the light emitting element. A method for manufacturing a light-emitting device.

4. A method for manufacturing the light emitting device according to claim 1, comprising: The driving element is a thin film transistor. A method for manufacturing a light-emitting device.

5. A method for manufacturing the light emitting device according to claim 1, comprising: The driving element is an integrated circuit A method for manufacturing a light-emitting device.

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