Drawing device and drawing method

Abstract

To provide a drawing device that can appropriately focus, rotate, and expand / contract an electron beam.SOLUTION: A drawing device includes a charged particle source 110, a drawing unit 2, a stage 270 that holds a drawing target 300, a drive unit that moves the stage 270 in an in-plane direction and a vertical direction and has an actuator that moves the stage 270 vertically, a first measuring device 290 that measures the height position of the upper surface of the drawing target 300, and a control unit 3 that irradiates the stage 270 with a charged particle beam while moving the stage 270 in the in-plane direction, and controls the drive unit to move the stage 270 vertically such that the height of the position of the region is constant on the basis of the height position of the region of the drawing target 300 to be irradiated with the charged particle beam obtained before drawing of the drawing target 300 begins and the sensitivity coefficient of the actuator.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The embodiments relate to a drawing device and a drawing method. [Background technology]

[0002] For example, with the increasing integration of LSIs (Large Scale Integrated Circuits) and the like, semiconductor devices are becoming increasingly miniaturized year by year. Semiconductor devices are formed by using a reduction projection exposure apparatus to reduce and transfer onto a wafer a high-precision original pattern (a mask, or a reticle, particularly one used in a stepper or scanner; hereafter, collectively referred to as a mask) formed on quartz. The mask is drawn using a charged particle beam lithography apparatus that uses an electron beam or the like (hereafter, a charged particle beam lithography apparatus that uses an electron beam will be referred to as an "electron beam lithography apparatus"). Here, drawing refers to forming a desired pattern on an object (e.g., a mask) by irradiating the object with an electron beam or the like.

[0003] Known electron beam lithography devices include, for example, multi-beam electron beam lithography devices (hereinafter sometimes referred to as multi-beam lithography devices) that irradiate multiple electron beams at once. In these multi-beam lithography devices, for example, electron beams emitted from an electron gun pass through an aperture member (also referred to as a shaping aperture array substrate) that has multiple openings (holes), thereby forming multiple beams. Each electron beam that forms the multiple beams is blanked by a blanking plate. The electron beams that pass through the blanking plate are reduced in size by an optical system and irradiated onto a desired position on a mask to be lithographed (see, for example, Patent Document 1).

[0004] In electron beam lithography systems, the electron beam is focused on the mask surface using an objective lens. If the mask surface is uneven, the electron beam lithography system must perform dynamic focus correction (dynamic focusing) during lithography. Dynamic focusing causes the electron beam image on the mask surface to rotate from the desired image, and the magnification of the electron beam image fluctuates from the desired magnification, degrading the positional accuracy of the electron beam irradiated onto the mask. In particular, multi-beam lithography systems simultaneously irradiate a larger number of electron beams (e.g., hundreds of thousands) in a single irradiation compared to single-beam lithography systems. Therefore, rotation of the electron beam image and fluctuations in the magnification of the electron beam image across the entire multi-beam system can result in unacceptable positional errors. Therefore, multi-beam lithography systems are required to simultaneously perform dynamic focusing, rotation, and expansion / contraction adjustment of the electron beam according to the height of the beam irradiation position on the mask. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-261342 Summary of the Invention [Problem to be solved by the invention]

[0006] Therefore, an object of the embodiment is to provide a charged particle beam drawing apparatus that can keep the mask surface height constant and suppress positional errors within the mask surface. [Means for solving the problem]

[0007] A drawing apparatus according to an embodiment includes a charged particle source that emits a charged particle beam, a drawing unit that irradiates a drawing target with the charged particle beam, a stage that holds the drawing target, and a drive unit that moves the stage in an in-plane direction of the stage and in a direction perpendicular to an upper surface of the stage, the drive unit including an actuator that moves the stage in the vertical direction. ,vinegarand a control unit that irradiates the charged particle beam while moving the stage in an in-plane direction, and controls the drive unit to move the stage in a vertical direction so that the height of the region is constant based on the height position of the region of the drawing object to be irradiated with the charged particle beam, which is obtained before drawing on the drawing object begins, and the sensitivity coefficient of the actuator. [Effects of the Invention]

[0008] According to the embodiment, it is possible to provide a drawing apparatus and a drawing method that can keep the mask surface height constant and suppress positional errors within the mask surface. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a multi-beam writing apparatus according to the first embodiment. [Figure 2] FIG. 2 is a diagram showing an example of the relationship between the Z stage, mirror, holder, and XY coordinate detector on the XY plane. [Figure 3] FIG. 3 is a perspective view of the Z stage and the mirror. [Figure 4] FIG. 4 is a cross-sectional view showing an example of the Z stage and mirror in the YZ plane. [Figure 5] FIG. 5 is a cross-sectional view showing an example of the Z stage and mirror in the YZ plane. [Figure 6] FIG. 6 is a cross-sectional view showing an example of the Z stage and mirror in the YZ plane. [Figure 7] FIG. 7 is a cross-sectional view showing an example of the Z stage and mirror in the YZ plane. [Figure 8] FIG. 8 is a diagram showing an example of the relationship between the Z stage, the holder, and the mask in the YZ plane. [Figure 9] FIG. 9 is a flowchart of an example of the rendering method according to the first embodiment. [Figure 10] FIG. 10 is a flowchart of an example of the rendering method according to the first embodiment. [Figure 11]FIG. 11 is a partial schematic view of a multi-beam drawing apparatus according to a first modification of the first embodiment. [Figure 12] FIG. 12 is a diagram showing an example of the relationship between the X stage, the first Z driving unit, the second Z driving unit, the Z stage, and the holding unit in the YZ plane. [Figure 13] FIG. 13 is a diagram showing an example of the relationship between the X stage, the third Z driving unit, the Z stage, the fourth Z driving unit, and the holding unit in the YZ plane. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described with reference to the drawings. In the following description, components having substantially the same functions and configurations will be designated by the same reference numerals. Furthermore, each embodiment shown below exemplifies an apparatus or method for embodying the technical concept of the embodiment, and the technical concept of the embodiment does not limit the material, shape, structure, arrangement, etc. of the components to those described below. The technical concept of the embodiment can be modified in various ways within the scope of the claims.

[0011] <1> First embodiment 1 is a schematic diagram of a drawing apparatus using charged particle multi-beams according to the first embodiment. In this embodiment, a configuration using an electron beam as an example of the charged particle beam will be described. However, the charged particle beam is not limited to an electron beam, and other charged particle beams such as an ion beam may also be used.

[0012] The drawing apparatus 1 shown in FIG. 1 includes a drawing unit 2 that draws a desired pattern by irradiating an electron beam onto an object such as a mask or a wafer, and a control unit 3 that controls the drawing operation by the drawing unit 2.

[0013] The drawing unit 2 has an electron beam column (which may be simply referred to as a column) 100 and a drawing chamber (which may be simply referred to as a chamber) 200.

[0014] The electron beam lens barrel 100 and the writing chamber 200 form a sealed internal space. In order to avoid interference between the electron beam and gas molecules in the air, and to protect the electron gun, which is provided above the electron beam lens barrel 100 and becomes very hot, the writing apparatus 1 is provided with an exhaust mechanism (not shown) that exhausts gas from the electron beam lens barrel 100 and the writing chamber 200. The exhaust mechanism uses a vacuum pump, such as a turbomolecular pump.

[0015] Arranged within the electron beam column 100 are an electron gun 110, an illumination lens 120, a shaping aperture array substrate 130, a blanking plate 140, a reduction lens 150, a limiting aperture member 160, an objective lens 170, and a deflector 180.

[0016] An electron gun 110 (charged particle source) emits an electron beam 400 (charged particle beam).

[0017] The illumination lens 120 controls the electron beam 400 emitted from the electron gun 110 so that it illuminates the entire shaping aperture array substrate 130 almost perpendicularly. The illumination lens 120 is, for example, an electromagnetic lens.

[0018] The shaping aperture array substrate 130 forms a multibeam 500 of a predetermined shape from the electron beam 400. Specifically, openings (holes) are formed in a matrix at a predetermined arrangement pitch in the shaping aperture array substrate 130. Each opening is formed in the same rectangular or circular shape and size. For example, when a portion of the electron beam 400 passes through these multiple openings, a multibeam 500 consisting of multiple (e.g., hundreds of thousands) electron beams is formed.

[0019] The blanking plate 140 performs blanking control on the multi-beams 500 that have passed through the multiple openings in the shaping aperture array substrate 130. Specifically, the blanking plate 140 has multiple openings formed therein corresponding to the multiple beams 500 that have been formed. A pair of two electrodes (blankers: blanking deflectors) is disposed at each opening in the blanking plate 140. An amplifier (not shown) that applies a voltage is disposed at one of the two electrodes for each electron beam, and the other electrode is grounded. The electron beams that pass through each opening are independently deflected by the voltages applied to the pair of electrodes. Blanking is controlled by this deflection of the electron beams. In this way, the multiple blankers perform blanking control on the corresponding electron beams among the multiple beams 500 that have passed through the multiple openings in the shaping aperture array substrate 130.

[0020] The reduction lens 150 deflects the multi-beams 500 that were not deflected by the blanking plate 140 so that they form a crossover at the central opening formed in the limiting aperture member 160. The reduction lens 150 is, for example, an electromagnetic lens.

[0021] The limiting aperture member 160 has an opening (hole) in its center. The limiting aperture member 160 allows each electron beam that has been blanked by the blanking plate 140 to pass through the limiting aperture member 160 to pass through the central opening. The limiting aperture member 160 blocks each electron beam that has been blanked by the blanking plate 140 to prevent it from passing through the limiting aperture member 160. Blocking an electron beam by the limiting aperture member 160 in this manner is referred to as "turning off an electron beam," etc. Similarly, passing an electron beam through the limiting aperture member 160 is referred to as "turning on an electron beam," etc. In this manner, the limiting aperture member 160 blocks each electron beam that has been deflected to be turned off by the blanker of the blanking plate 140. The electron beam that passes through the limiting aperture member 160 from when the electron beam is turned on until when it is turned off constitutes one shot of electrons. Hereinafter, the multi-beams that have passed through the limiting aperture member 160 will be referred to as multi-beams 600.

[0022] The objective lens 170 adjusts the focus of the multi-beams 600 that have passed through the limiting aperture member 160 to form an image with a desired reduction ratio. The objective lens 170 is, for example, an electromagnetic lens.

[0023] The deflector 180 deflects each electron beam (the entire multi-beam 600) that has passed through the limiting aperture member 160 collectively in the same direction. As a result, the desired multi-beam 600 is irradiated onto a writing target 300 such as a mask, which will be described later. The deflector 180 is composed of a group of at least four electrodes.

[0024] In the writing chamber 200, a base 210, a Y driver 220, an X driver 240, a Z driver 260, a stage 270, a mirror 271, a holder 272, a canopy 273, and an earth pin 274 are arranged, for example, in this order, each of which is supported on the base 210. In addition, an XY coordinate detector 280 is provided on the side of the writing chamber 200, and a Z coordinate detector 290 is provided on the top surface of the writing chamber. These coordinate detectors have detection circuits.

[0025] Y driving section 220 provided on base 210 is a driving mechanism that moves stage 270 in the Y direction within the stage surface. Y driving section 220 includes, for example, a motor and an air bearing.

[0026] X driving section 240 is a driving mechanism that moves stage 270 in the X direction (direction perpendicular to the Y direction) within the stage surface. X driving section 240 includes, for example, a motor and an air bearing.

[0027] The Z driver 260 moves the stage 270 along the Z direction, which is perpendicular to the stage surface. The Z driver 260 can be configured with multiple highly responsive actuators, such as piezoelectric elements. In this case, it is possible to independently control each actuator. In other words, independently controlling each actuator allows for controlling the tilt of the stage 270 and performing balance adjustment. The Z driver 260 can also be a single actuator. Note that actuators with backlash, such as motors that convert lateral movement into vertical movement, are not suitable for use in the Z driver 260. Any actuator with high responsiveness (e.g., an operating speed of several tens of Hz or higher), sufficient stroke (e.g., several μm), and direct drive capability is sufficient; it is not limited to a piezoelectric actuator. The Z driver 260 is used to correct unevenness in the height of the drawing target object 300 during drawing. Therefore, the Y driver 220, X driver 240, and Z driver 260 constitute a drive unit that moves the stage 270 in the in-plane direction of the stage 270 and in the direction perpendicular to the top surface of the stage 270.

[0028] The mirror 271 is made up of a Y mirror 2711 for measuring the coordinate of the stage 270 in the Y direction (Y coordinate), and an X mirror 2712 for measuring the coordinate of the stage 270 in the X direction (X coordinate).

[0029] The XY coordinate detector 280 is a laser measurement mechanism for detecting the Y coordinate and the X coordinate of the stage 270. As shown in Fig. 2, the XY coordinate detector 280 includes a Y coordinate detector 281 for measuring the Y coordinate of the stage 270 and an X coordinate detector 282 for measuring the X coordinate of the stage 270. The Y coordinate detector 281 and the X coordinate detector 282 irradiate laser light toward a Y mirror 2711 and an X mirror 2712, respectively, and measure the distance based on the phase of the reflected laser light. A configuration including the XY coordinate detector 280 and the mirror 271 functions as a single measurement device for measuring the positional deviation in the in-plane direction of the stage 270 (the drawing target 300).

[0030] The Z coordinate detector 290 is a laser measurement mechanism for detecting the Z coordinate (hereinafter also referred to as "height position") of the drawing target 300 such as a mask. Specifically, the Z coordinate detector 290 measures the Z coordinate of the drawing target 300 by irradiating the drawing target 300 with laser light 293 in an oblique direction and receiving the laser light 293 reflected by the surface (top surface) of the drawing target 300.

[0031] The holder 272 is provided on the stage 270 and supports a drawing target 300 such as a mask. Examples of the drawing target 300 include a wafer and an exposure mask such as a mask blank onto which a pattern is transferred using a reduction projection exposure apparatus such as a stepper or scanner that uses an excimer laser as a light source, or an extreme ultraviolet exposure apparatus. As an example, the following description will be given using a mask as the drawing target.

[0032] A canopy 273 is provided on the stage 270 and includes a ground pin 274. The ground pin 274 contacts the mask 300 and is grounded via the canopy 273.

[0033] The control unit 3 includes a control circuit 310 , a deflection control circuit 320 , a stage position detection circuit 330 , a stage drive control circuit 340 , a sensitivity update circuit 350 , an angle determination circuit 360 , a map generation circuit 370 , and a storage unit 380 .

[0034] The control circuit 310 controls the entire control unit 3 .

[0035] The deflection control circuit 320 controls the electron gun 110 , the illumination lens 120 , the reduction lens 150 , the objective lens 170 , and the deflector 180 .

[0036] The stage position detection circuit 330 controls the XY coordinate detector 280 and the Z coordinate detector 290 .

[0037] The stage drive control circuit 340 controls the Y drive unit 220 , the X drive unit 240 , and the Z drive unit 260 .

[0038] Sensitivity update circuit 350 derives the sensitivity coefficient of the actuator in Z drive unit 260 based on the data stored in storage unit 380. Details will be described later.

[0039] Angle determination circuit 360 calculates the mirror angle of mirror 271. Details will be described later.

[0040] The map generation circuit 370 generates a Z map of the surface of the mask 300. Details will be described later.

[0041] The storage unit 380 is, for example, a non-volatile storage unit, and stores various data.

[0042] The control circuit 310, the deflection control circuit 320, the stage position detection circuit 330, the stage drive control circuit 340, the sensitivity update circuit 350, the angle determination circuit 360, and the map generation circuit 370 may be software executed by a computer.

[0043] FIG. 2 is a layout diagram showing an example of a stage 270, a mirror 271, a holder 272, a Y-coordinate detector 281, and an X-coordinate detector 282 on the XY plane.

[0044] 2, a mask placement area 275 for placing the mask 300 is provided on the stage 270. A plurality of (for example, three in FIG. 2) holders 272 are provided in the mask placement area 275.

[0045] Fig. 3 is a perspective view of the stage 270 and the mirror 271. Figs. 4 to 7 are cross-sectional views showing an example of the stage 270 and the mirror 271 in the YZ plane.

[0046] As shown in FIG. 4, it is preferable that the angle Θ (mirror angle) between the laser light reflecting surface of the Y mirror 2711 directed toward the Y coordinate detector 281 and the upper surface of the stage 270 is 90 degrees.

[0047] As shown in FIG. 5, when the mirror angle Θ of Y mirror 2711 is greater than 90 degrees, when stage 270 moves a distance dh1 in the Z direction, Z coordinate 2711B at which Y mirror 2711 reflects the Y coordinate detection laser light moves by a distance dh1 from Z coordinate 2711A, as shown in FIG. 6. At this time, the coordinate also moves in the Y direction by a distance dw1. The same is true when the mirror angle Θ of Y mirror 2711 is less than 90 degrees, as shown in FIG. 7. In this way, when the mirror angle Θ of Y mirror 2711 is greater or less than 90 degrees, the coordinate in the Y direction moves, even though stage 270 has moved only in the Z direction.

[0048] 4 to 7, the description focuses on Y mirror 2711. However, the same applies to X mirror 2712. Therefore, if the mirror angle Θ of Y mirror 2711 or X mirror 2712 is not 90 degrees, that is, if an installation error occurs in the measuring device including Y mirror 2711 and X mirror 2712, a positional deviation occurs in the in-plane direction based on the height position of stage 270.

[0049] Next, FIG. 8 shows an example of the stage 270, the holder 272, and the mask 300 in the YZ plane.

[0050] As shown in Fig. 8, the mask 300 placed on the holder 272 is bent downward at the center and upward at the ends. This bending varies, for example, due to changes in atmospheric pressure. In the case of Fig. 8, the distance between the Z coordinate (300A) of the center of the mask 300 and the Z coordinate (300B) of the end of the mask 300 is dh2.

[0051] As shown in FIG. 8, if the mask 300 is warped or has irregularities, it is necessary to adjust the focus of the multi-beam 600 according to the height of the irradiation position.

[0052] In the imaging device 1 according to this embodiment, the position of the stage 270 is controlled so that the height of the imaging position is constant.

[0053] An example of a drawing method using the drawing device 1 according to this embodiment will be described below. Fig. 9 is a flowchart of an example of the drawing method according to this embodiment.

[0054] [S1001] Before performing writing on mask 300, control circuit 310 measures the sensitivity of the actuator that drives Z drive unit 260. Here, a method for measuring the sensitivity of the actuator will be described with reference to FIG.

[0055] [S2001] When measuring the sensitivity of the actuator, a mask may be placed on the holder 272, or the mask 300 may not be placed on the holder 272. Also, a mark for measuring the sensitivity of the Z drive unit 260 may be provided on the mask 300, or may be provided directly on the stage 270.

[0056] The stage drive control circuit 340 operates the actuator to drive the stage 270 in the Z direction. The set value sv of the Z coordinate is stored in the storage unit 380, for example.

[0057] [S2002] The Z coordinate detector 290 measures the Z coordinate of a mark provided on the mask 300 or the stage 270. The Z coordinate detector 290 then stores the measured value Zmeas of the Z coordinate of the measured mark in the storage unit 380.

[0058] [S2003] The control circuit 310 determines whether or not all Z coordinates of the marks to be measured have been measured. If all Z coordinates of the marks to be measured have been measured, the control circuit 310 determines that the measurement is complete (S2003, YES) and proceeds to step S2004. If all Z coordinates have not been measured, the control circuit 310 returns to step S2001.

[0059] [S2004] Sensitivity update circuit 350 reads out Z coordinate setting value sv and measurement value Zmeas stored in storage unit 380, and calculates actuator sensitivity coefficient k. As an example, if the Z height when the Z coordinate is the setting value sv is Zmeas, and the Z height when the Z coordinate is the setting value sv+Δsv is Zmeas+ΔZmeas, then sensitivity update circuit 350 calculates k that satisfies ΔZmeas=k*Δsv and stores it in storage unit 380. Note that sensitivity update may be performed during drawing.

[0060] [S1002] The control circuit 310 measures the mirror angle of the mirror 271 .

[0061] Specifically, the stage drive control circuit 340 detects the stage position by scanning a reference mark on the stage 270 and detecting the mark position while moving the stage 270 using the Z drive unit 260. The stage position detection circuit 330 then detects fluctuations in the Y and X coordinates via the XY coordinate detector 280. The XY coordinate detector 280 stores, for example, the fluctuations in the Y and X coordinates in a storage unit 380. The angle determination circuit 360 then reads, for example, the Y and X coordinates stored in the storage unit 380, and calculates the mirror angles of the Y mirror 2711 and the X mirror 2712 based on their relationship with the Z coordinate. The angle determination circuit 360 then calculates a mirror angle coefficient f of the Y mirror 2711 and a mirror angle coefficient g of the X mirror 2712 based on the calculated mirror angles of the Y mirror 2711 and the X mirror 2712, and stores these in the storage unit 380.

[0062] [S1003] After these preliminary measurements are made, writing on the mask 300 begins.

[0063] [S1004] Control circuit 310 reads out sensitivity coefficient k of the actuator that constitutes Z driver 260, which is stored in storage unit 380.

[0064] [S1005] Control circuit 310 reads out mirror angle coefficient f of Y mirror 2711 and mirror angle coefficient g of X mirror 2712 stored in storage unit 380.

[0065] [S1006] The stage position detection circuit 330 acquires the height of the surface of the mask 300. Specifically, the stage drive control circuit 340 drives the Y driver 220 and the X driver 240. The stage position detection circuit 330 then detects the Z coordinate corresponding to the X and Y coordinates of a predetermined area of ​​the mask 300. The height of the surface of the mask 300 may also be acquired by reading a Z map (a map showing the correspondence between the Y coordinate, the X coordinate, and the Z coordinate) stored in the storage unit 380. In this case, the map generation circuit 370 generates a Z map of the surface of the mask 300 using previously detected data and stores it in the storage unit 380. Note that, at this time, because the eaves 273 are provided, the Z coordinate detector 290 cannot measure the height of the outer periphery of the mask 300. However, as shown in FIG. 11 , a Z coordinate detector 251 is provided on the X(Y) driver 240 instead of the Z coordinate detector 290, and the Z coordinate detector 251 measures the distance from the stage 270 to measure the height of the surface of the mask 300, thereby enabling real-time height measurement.

[0066] [S1007] Control circuit 310 corrects the height of stage 270 while drawing mask 300. Specifically, control circuit 310 dynamically controls stage drive control circuit 340 based on a previously determined sensitivity coefficient k and the Z coordinate of the mask surface so that the Z coordinate of the area of ​​mask 300 irradiated with the multi-beams remains constant. At this time, control circuit 310 determines an XY positional deviation based on mirror angle coefficient f and mirror angle coefficient g, and performs stage tracking by controlling the drive of Y driver 220 and X driver 240 so as to absorb the XY positional deviation.

[0067] In this way, the Z coordinate of the mask 300 can be controlled taking into consideration the tilt of the reflecting surface of the mirror 271, the deflection of the mask, and unevenness, as described above. As a result, the height of the mask surface at the writing position can be controlled to be constant.

[0068] [S1008] The control circuit 310 determines whether or not the drawing has finished, and repeats steps S1004 to S1008 until the drawing has finished.

[0069] In the drawing device 1 according to the embodiment described above, the Z coordinate of the area of ​​the mask 300 irradiated with the multi-beams can be kept constant by dynamically varying the Z coordinate of the stage 270 using a sensitivity coefficient k and the Z coordinate of the mask surface that have been determined in advance.

[0070] Furthermore, before drawing on the mask 300, the drawing apparatus 1 according to this embodiment calculates the mirror angle coefficient f of the Y mirror 2711 and the mirror angle coefficient g of the X mirror 2712, determines the positional deviation in the X and Y directions due to fluctuations in the Z coordinate, and controls the irradiation position using the deflector 180. This allows drawing with high positional accuracy even if the Z coordinate fluctuates.

[0071] <2> Second embodiment Next, a second embodiment will be described. In the first embodiment, the Z drive unit 260 has been described as being configured to be dynamically driven while drawing on the mask 300. However, in the second embodiment, another configuration for controlling the Z coordinate of the mask 300 will be described. Note that a description of the same configuration as in the first embodiment will be omitted.

[0072] A mechanism for adjusting the Z coordinate of the mask 300 will be described with reference to FIG.

[0073] As shown in FIG. 12, below the stage 270, a first Z driving section 261 and a second Z driving section 262 are provided as Z driving sections.

[0074] The first Z driving unit 261 is a driving mechanism that moves the stage 270 in the Z direction. For example, an ultrasonic motor can be used as the first Z driving unit 261. The first Z driving unit 261 is used to correct the thickness tolerance of the mask 300 within a range of, for example, several hundred μm, and is fixed during drawing. While the first Z driving unit 261 can correct large tolerances, it has poor responsiveness and cannot operate dynamically during drawing on the mask 300. For this reason, the first Z driving unit 261 is used as a static driving unit.

[0075] The second Z driving unit 262 is a driving mechanism that moves the stage 270 along the Z direction. One or more actuators (piezoelectric elements) can be used as the second Z driving unit 262. As in the first embodiment, the second Z driving unit 262 is used to correct the height of the mask 300 during drawing. The second Z driving unit 262 can be one that can correct the Z coordinate within a range of several μm or more, for example. By using a second Z driving unit 262 that has better responsiveness than the first Z driving unit 261, it can operate dynamically during drawing on the mask 300. Therefore, the second Z driving unit 262 is used as a dynamic driving unit.

[0076] The positions of the first Z driving unit 261 and the second Z driving unit 262 may be interchanged. The first Z driving unit 261 and the second Z driving unit 262 are controlled by a stage driving control circuit 340, respectively.

[0077] Still another mechanism for adjusting the Z coordinate of the mask 300 will be described with reference to FIG.

[0078] FIG. 13 is a diagram showing an example of the third Z driving unit 263, the stage 270, the fourth Z driving unit 264, and the holder 272 in the YZ plane.

[0079] 13, a third Z driving unit 263 is provided below the stage 270. Furthermore, a fourth Z driving unit 264 is provided above the stage 270, between the stage 270 and the holder 272. The third Z driving unit 263 is used as a static driving unit, similar to the first Z driving unit 261 described above. Furthermore, the fourth Z driving unit 264 is used as a dynamic driving unit, similar to the second Z driving unit 262 described above.

[0080] As described above, according to the drawing device 1 of this embodiment, by combining a static driving unit and a dynamic driving unit, it is possible to correct the Z coordinate of the surface of the mask 300 more flexibly than in the first embodiment.

[0081] Furthermore, in each of the above-described embodiments, the Z coordinate in the area required for operating Z driver 260 may be acquired and Z adjustment may be performed. For example, adjustment may be performed for each stripe.

[0082] Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be implemented in various modifications within the scope of the spirit thereof. Furthermore, the drawings do not show all components, and some components are not shown. Furthermore, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining the disclosed components. For example, even if some components are deleted from the disclosed components, the invention can still be extracted as long as the desired effect is obtained. [Explanation of symbols]

[0083] 1... lithography device 2... lithography unit 3... control unit 100... electron beam lens barrel 110... electron gun 120... illumination lens 130... shaping aperture array substrate 140... blanking plate 150... reduction lens 160... limiting aperture member 170... objective lens 180... deflector 200... lithography chamber 210... base 220... Y drive unit 240... X drive unit 251... Z coordinate detector 260, 261, 262, 263, 264... Z drive unit 270... stage 271... mirror 272... holder 273... eaves 274... earth pin 275... mask placement area 280... XY coordinate detector 281... Y coordinate detector 282... X coordinate detector 290... Z coordinate detector 293... laser light 300... mask 310... control circuit 320... Deflection control circuit 330... Stage position detection circuit 340... Stage drive control circuit 350... Sensitivity update circuit 360... Angle determination circuit 370... Map generation circuit 380... Memory unit 400... Electron beam 500... Multi-beam 600... Multi-beam 2711... Y mirror 2712... X mirror

Claims

1. a charged particle source that emits a charged particle beam; a drawing unit that irradiates a drawing target with the charged particle beam; a stage for holding the drawing object; a driving unit that moves the stage in an in-plane direction of the stage and in a direction perpendicular to an upper surface of the stage, the driving unit including an actuator that moves the stage in the vertical direction; a control unit that irradiates the charged particle beam while moving the stage in the in-plane direction, and controls the drive unit to move the stage in the vertical direction so that the height of the region to be irradiated with the charged particle beam on the drawing target is constant, based on a height position of the region to be irradiated with the charged particle beam, which is acquired before drawing on the drawing target is started, and a sensitivity coefficient of the actuator; A drawing device comprising:

2. a measuring device for measuring the position of the object to be drawn in the in-plane direction; 2. The imaging apparatus according to claim 1, wherein the control unit corrects a positional deviation occurring in the in-plane direction due to an installation error of the measuring device by moving the stage in the vertical direction.

3. The control unit determines and updates the sensitivity coefficient of the actuator.

3. The drawing device according to claim 1.

4. a stage holding an object to be drawn is moved in an in-plane direction of the stage while irradiating the object with a charged particle beam, and based on a height position of a region of the object to be drawn that is irradiated with the charged particle beam, which is acquired before drawing on the object to be drawn, and a sensitivity coefficient of an actuator that moves the stage in a direction perpendicular to an upper surface of the stage, a drive unit is controlled to move the stage in the vertical direction so that the height of the region remains constant.

Images