Element substrate and recording head

Abstract

To provide an element substrate that can suppress decrease in yield in manufacturing process and cost increase, and to provide a recording head.SOLUTION: An element substrate includes VH wiring and GNDH wiring which are provided in the identical layer.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an element substrate for a printhead that performs printing by ejecting liquid, and to a printhead. [Background technology]

[0002] In recent years, the number of heating elements mounted on printheads has been increasing in line with the trend toward faster printing speeds and higher image quality. As a result, the area of ​​the element substrate on which the circuits that drive these heating elements are mounted has increased, and it has become important to optimize the placement of heating elements and the wiring layout when the shape of the element substrate becomes a parallelogram or trapezoid in order to mount multiple element substrates on a printhead.

[0003] Patent document 1 discloses a liquid ejection head that uses an element substrate that has a positive side wiring (VH wiring) layer and a negative side wiring (GNDH wiring) layer for passing current through a heat generating element, with the VH wiring layer and the GNDH wiring layer facing each other. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-137705 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the configuration of Patent Document 1, different power supply wiring (VH wiring and GNDH wiring) face each other over a wide area, which may increase the frequency of interlayer short circuits caused by foreign matter during wiring generation, raising concerns about a decrease in yield. In addition, there is a concern that costs will increase because one layer is used for each of the VH wiring and GNDH wiring.

[0006] Therefore, the present invention provides an element substrate and a printhead that can suppress a decrease in yield and an increase in cost in the manufacturing process. [Means for solving the problem]

[0007] Therefore, the element substrate of the present invention includes a plurality of arranged heat generating elements and To generate heat an electrical wiring for supplying electricity, the electrical wiring including a first electrical wiring layer and a second electrical wiring layer overlapping the first electrical wiring layer; a third electrical wiring layer overlapping the first electrical wiring layer; the first electrical wiring layer has a first wiring connected to one connection portion of the heat generating element and a second wiring connected to the other connection portion of the heat generating element, the second electrical wiring layer has a third wiring connected to the first wiring and a fourth wiring connected to the second wiring, the third electrical wiring layer has a fifth wiring connected to the first wiring and a sixth wiring connected to the second wiring, the first electrical wiring layer has a first wiring group in which at least one pair of the first wiring and the second wiring is provided in parallel, and the second electrical wiring layer has a second wiring group in which at least one pair of the third wiring and the fourth wiring is provided in parallel, The third electrical wiring layer has a third wiring group in which at least one pair of the fifth wiring and the sixth wiring is provided in parallel, and any two of the first wiring group, the second wiring group, and the third wiring group have the same wiring arrangement, and the remaining wiring group intersects with any two of the wiring groups when viewed from a viewpoint on a line perpendicular to the first electrical wiring layer. It is characterized by: [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an element substrate and a printhead that can suppress a decrease in yield and an increase in cost in the manufacturing process. [Brief explanation of the drawings]

[0009] [Figure 1] 1(a) is a plan view showing the element substrate, and FIG. 1(b) is an enlarged view showing part b. [Figure 2] FIG. 2(a) is a plan view of the heating element, and FIG. 2(b) is a cross-sectional view taken along line IIb-IIb. [Figure 3] (a) is a plan view of the element substrate, and (b) is an enlarged view of the electrical wiring layer. [Figure 4] (a) is a plan view of the element substrate, and (b) is an enlarged view of the electrical wiring layer. [Figure 5] FIG. 10 illustrates through holes between electrical wiring layers. [Figure 6]1A and 1B are diagrams for explaining wiring resistance and showing simulation results of voltage drop; [Figure 7] (a) is a plan view of the element substrate, and (b) is an enlarged view of the electrical wiring layer. [Figure 8] (a) is a plan view of the element substrate, and (b) is an enlarged view of the electrical wiring layer. [Figure 9] FIG. 2 is a diagram showing a power supply wiring layer. DETAILED DESCRIPTION OF THE INVENTION

[0010] (First embodiment) A first embodiment to which the present invention can be applied will be described below with reference to the drawings. The following focuses on an inkjet print head that ejects ink for printing, but this embodiment can also be applied to print heads that eject any liquid.

[0011] FIG. 1(a) is a plan view showing an element substrate 100 according to this embodiment, and FIG. 1(b) is an enlarged view showing portion b in FIG. 1(a). The element substrate 100 has a parallelogram shape in plan view and includes a plurality of heating elements 101 arranged in multiple rows, a drive circuit 203 for driving the heating elements 101, and electrode pads 201 for transmitting drive current to the heating elements 101. The element substrate 100 further includes an ejection port forming member 108 in which a plurality of ejection ports 109 corresponding to the heating elements 101 are formed in rows along the direction of arrow S. In the printhead, a plurality of element substrates 100 are arranged in the direction of arrow S. The drive circuit 203 is connected to the electrode pads 201 and generates a drive current for the heating elements 101 in response to a print signal supplied from outside the printhead via the electrode pads 201.

[0012] The element substrate 100 has a liquid supply channel 301 and a liquid recovery channel 302 extending in the direction of arrow S. The liquid supply channel 301 and the liquid recovery channel 302 each have a plurality of openings 300 (supply ports 300a, recovery ports 300b). The liquid supply channel 301 has a plurality of supply ports 300a that can supply liquid to the heating elements 101, and the liquid recovery channel 302 has a plurality of recovery ports 300b that can recover liquid from the heating elements 101. Liquid supplied from the supply ports 300a of the liquid supply channel 301 to the pressure chambers 107 is heated by the heating elements 101 to generate bubbles, and is then ejected from the ejection ports 109. Liquid supplied from the supply ports 300a but not ejected is recovered by the recovery ports 300b of the liquid recovery channel 302. The ink recovered by the recovery ports 300b is supplied again to the liquid ejection head via a tank (not shown) or the like provided in the recording apparatus. In this manner, the liquid circulates within the recording apparatus. The supply port 300a and the recovery port 300b are through-holes that penetrate the substrate 114 (see FIG. 2(b) described later) of the element substrate 100. By sandwiching the heat generating element 101 between the supply port 300a and the recovery port 300b in this manner, refilling after ejection can be performed relatively quickly.

[0013] Fig. 2(a) is an enlarged plan view of the peripheral area of ​​one heat generating element 101 on the element substrate of the print head of this embodiment, and Fig. 2(b) is a cross-sectional view taken along line IIb-IIb in Fig. 2(a). The heat generating element 101 is provided opposite the ejection port 109, and a plurality of connecting members 102 are provided to connect the heat generating element 101 to electrical wiring 103.

[0014] In the following, the direction of current flowing through the heating elements 101 is referred to as the X direction, and the direction perpendicular to the X direction is referred to as the Y direction. The direction perpendicular to the X and Y directions is referred to as the Z direction. The Y direction is the direction in which the heating elements 101 and the ejection ports 109 are arranged. The Z direction is the direction perpendicular to the surface on which the ejection ports are formed, and is the direction in which liquid is ejected.

[0015] The element substrate 100 includes a substrate 114 and an ejection port forming member 108. The substrate 114 includes a base material 113 made of Si and an insulating film 104 formed on the base material 113. On the substrate 114, there are provided heating elements 101 that generate thermal energy for ejecting liquid, a protective film 105, and an anti-cavitation film 106. The heating elements 101 are formed of a TA compound such as TASiN. The insulating film 104 is formed of an insulator such as SiO. The ejection port forming member 108 is provided on the surface of the substrate 114 on which the heating elements 101 are formed. The ejection port forming member 108 has ejection ports 109 corresponding to each heating element 101, and together with the substrate 114, forms pressure chambers 107 for each ejection port 109.

[0016] Electrical wiring 103 for supplying current to the heating elements 101 is embedded in an insulating film 104 provided on a substrate 114. The electrical wiring 103 electrically connects a drive circuit 203 and the heating elements 101 via a connecting member 102. The electrical wiring 103 is made of aluminum and has a film thickness (dimension in the Z direction) of approximately 0.4 to 1.2 μm. The supplied current causes the heating elements 101 to generate heat, and the heated heating elements 101 heat the liquid in the pressure chambers 107, generating bubbles. These bubbles cause the liquid near the ejection ports 109 to be ejected from the ejection ports 109, thereby performing printing. The heating elements 101 are covered with a protective film 105 made of SiN. The protective film 105 may be made of SiO or SiC. The protective film 105 is covered with a cavitation-resistant film 106 made of TA or Ir. The electrical wiring 103 is made of a metal, and may be made of one of Al, Cu, Ag, Au, PT, W, Ni, and Co, or an alloy containing any of these.

[0017] The connection members 102 are positioned at intervals along the Y direction. When viewed from a direction perpendicular to the surface on which the heating element 101 is provided, the connection members 102 are covered by the heating element 101. The connection members 102 connect the electrical wiring 103 and the heating element 101 near both ends of the heating element 101 in the X direction. Therefore, current flows through the heating element 101 in the X direction. The heating element 101 has connection regions 110 at each of its one end and the other end to which multiple connection members 102 are connected. The connection members 102 are plugs that extend in the Z direction from near the ends of the electrical wiring 103. In this embodiment, the connection members 102 have a roughly square cross section, but the corners may be rounded, and the cross section is not limited to a square, and may be other shapes such as rectangular, circular, or elliptical.

[0018] The connecting member 102 is made of tungsten, but may also be made of titanium, platinum, cobalt, nickel, molybdenum, tantalum, silicon, or a compound thereof. The connecting member 102 may be formed integrally with the electrical wiring 103. That is, the connecting member 102 may be formed integrally with the electrical wiring 103 by cutting out a portion of the electrical wiring 103 in the thickness direction.

[0019] The electrical wiring 103 is provided in the insulating film 104 and is connected to the heating element 101 by the connecting member 102. In this way, electrical connection is made to the heating element 101 from the back side, so there is no need for electrical wiring to cover the front side of the heating element 101. In a configuration in which the electrical wiring 103 is connected to the front side of the heating element 101, electrical wiring with a film thickness of approximately 0.6 to 1.2 μm is laminated on the heating element 101. For this reason, it was necessary to provide a relatively thick protective film to ensure coverage for the step of approximately 0.6 to 1.2 μm.

[0020] In contrast, in this embodiment, electrical wiring on the surface side of the heating element 101 is not required. Because the film thickness of the heating element 101 is approximately 0.01 to 0.05 μm, the step is significantly smaller than in the above-described configuration. Therefore, sufficient coverage can be ensured with a protective film 105 approximately 0.15 to 0.3 μm thick, allowing for a thinner protective film 105 and significantly improving the efficiency of heat transfer to the ink. This allows for both reduced power consumption and improved image quality due to stabilized bubbling. Improvements in the patterning accuracy and reliability of the cavitation-resistant film 106, as well as improvements in the adhesion and processing accuracy of the ejection port forming member 108 to the substrate 114, can be expected, resulting in not only higher image quality but also advantages in manufacturing.

[0021] To obtain more uniform ejection characteristics, precision is required for variations in bubbling and resistance values, so it is preferable that the base (lower region) of the heating element 101 is flat. Conventionally, it has been difficult to arrange wiring patterns and the like directly below and around the heating element without creating steps. In the configuration of this embodiment, the electrical wiring 103 of each layer and the base portion of the heating element 101 are flattened by processing such as CMP. As a result, as shown in FIG. 2(b), the contact surface of the connecting member 102 with the heating element 101 and the contact surface of the insulating film 104 with the heating element 101 are provided on the same plane.

[0022] In this way, by planarizing the base (lower region) of the heating resistor layer, it becomes possible to pass electrical wiring 103, such as signal wiring and power wiring, through the insulating film 104 directly below the heating elements 101, i.e., between a central region 122 (described later) and the substrate 113, and in the periphery thereof. Furthermore, since it becomes possible to arrange transistors in this region, the area of ​​the element substrate 100 can be reduced, which enables the cost of the print head to be reduced and the density of the ejection ports 109 to be increased. In this embodiment, as shown in FIG. 2(b), a drive circuit 203 and a field oxide film 132 are formed in the interface region between the insulating film 104 and the substrate 113, which is made of Si.

[0023] This configuration makes it possible to multi-layer the electrical wiring 103 while suppressing the influence on the characteristics of the heating element 101. Also, by allocating multiple wiring layers to the electrical wiring 103, it becomes possible to significantly reduce the power wiring resistance.

[0024] In this embodiment, the electrical wiring 103 is configured as three layers that are different in distance from the heating elements 101 in a direction perpendicular to the plane of the element substrate 100. The electrical wiring layers are electrical wiring layer 103a, which is the farthest from the heating elements 101, electrical wiring layer 103b, which is the next farthest from the heating elements 101, and electrical wiring layer 103c, which is the closest to the heating elements 101. The electrical wiring layer 103a is assigned as a signal wiring layer and a logic power supply wiring layer for driving the heating elements 101. The electrical wiring layer 103b is assigned as a signal wiring layer and a logic power supply wiring layer for driving the heating elements 101, and as a wiring layer for supplying current to the heating elements 101. The electrical wiring layer 103c is assigned as a wiring layer for supplying current to the heating elements 101.

[0025] In conventional element substrates, a VH wiring layer, which includes positive (one side) wiring for passing current through the heat-generating elements, and a GNDH wiring layer, which includes negative (other side) wiring, are arranged opposite each other. However, in this configuration, the VH wiring and the GNDH wiring face each other over a large area, which may increase the frequency of interlayer shorts caused by foreign matter, resulting in a decrease in yield. Furthermore, since one layer is used for each of the VH wiring and the GNDH wiring, this increases costs. Therefore, in this embodiment, the VH wiring and the GNDH wiring are arranged in the same layer. It is sufficient that at least one pair of VH wiring and a GNDH wiring are arranged in parallel in the same layer. The electrical wiring layers in this embodiment are described in detail below.

[0026] FIG. 3(a) is a plan view showing the element substrate 100, and FIG. 3(b) is an enlarged view of the electrical wiring layer 103b in part b of FIG. 3(a). The electrical wiring layer 103b includes signal wiring (not shown) and logic power supply wiring (not shown) for driving the heating elements 101, as well as power supply wiring (a group of electrical wiring) for supplying current to the heating elements 101. The power supply wiring for supplying current to the heating elements 101 includes VH wiring 103b1, which is power supply wiring connected to the inlet side of the current flowing through the heating elements 101, and GNDH wiring 103b2, which is wiring connected to the outlet side of the current flowing through the heating elements 101. These are alternately arranged in the X direction as shown in FIG. 3(b). In the electrical wiring layer 103b, multiple pairs of VH wiring 103b1 and GNDH wiring 103b2 are laid out over the entire area of ​​the element substrate 100. When the element substrate 100 is a parallelogram as in this embodiment, the power supply wiring is connected along the oblique side of the outer shape of the element substrate 100 in the section L in the figure.

[0027] 4(a) is a plan view showing the element substrate 100, and FIG. 4(b) is an enlarged view of the electrical wiring layer 103c at part b in FIG. 4(a). The electrical wiring layer 103c includes power wiring for supplying current to the heating elements 101. The power wiring for supplying current to the heating elements 101 includes VH wiring 103c1, which is power wiring connected to the inlet side of the current flowing through the heating elements 101, and GNDH wiring 103c2, which is power wiring connected to the outlet side of the current flowing through the heating elements 101. These are alternately arranged in the Y direction as shown in FIG. 4(b). In the electrical wiring layer 103c, multiple pairs of VH wiring 103c1 and GNDH wiring 103c2 are laid out over the entire area of ​​the element substrate 100.

[0028] The VH wiring 103c1 and the GNDH wiring 103c2 are connected to the heat generating element 101 via the connecting member 102. The VH wiring 103b1 and the VH wiring 103c1 are connected by through-hole wiring in different layers at a location where they intersect and overlap when viewed from the front of the element substrate 100 (when viewed from the perspective of a line perpendicular to the electrical wiring layer). Similarly, the GNDH wiring 103b2 and the GNDH wiring 103c2 are connected by through-hole wiring in different layers at a location where they intersect and overlap when viewed from the front of the element substrate 100.

[0029] 5 is a diagram showing a cross section taken along line VV in FIG. 4(b). A through-hole 50 is formed between the VH wiring 103b1 and the VH wiring 103c1, and the VH wiring 103b1 and the VH wiring 103c1 are connected by through-hole wiring formed in the through-hole. Here, the connection between the VH wiring 103b1 and the VH wiring 103c1 has been described as an example, but the same applies to the GNDH wiring 103b2 and the GNDH wiring 103c2. In this embodiment, the electrical wiring layer 103c is routed in the X direction, and the electrical wiring layer 103b is routed in the Y direction.

[0030] Here, the thickness (wiring thickness) of the electrical wiring layer 103c is 0.8 to 1.2 μm, and the thickness of the electrical wiring layer 103b is 0.3 to 0.6 μm, with the electrical wiring layer 103c being thicker than the electrical wiring layer 103b. For a substrate such as the element substrate 100 that is longer in the X direction than in the Y direction, routing wiring with a thicker thickness and a larger cross-sectional area along the longitudinal direction (X direction) can reduce voltage drop due to wiring resistance more than routing wiring with a thicker thickness in the lateral direction (Y direction). Therefore, in this embodiment, the electrical wiring layer 103c routed in the X direction (the longitudinal direction) is made thicker than the electrical wiring layer 103b routed in the Y direction to reduce voltage drop.

[0031] 6(a) to 6(c) are diagrams explaining the wiring resistance from the heating element drive electrode 600 to the heating elements 101 and showing the results of a simulation of the voltage drop caused by the wiring resistance. Here, the voltage drop was simulated when a total of four rows (AD rows) of 32 heating elements 101 were simultaneously driven. FIG. 6(b) shows the simulation results for a case in which the electrical wiring layer 103c having a thickness similar to that of this embodiment was routed in the longitudinal direction (X direction), while FIG. 6(c) shows the simulation results for a case in which the electrical wiring layer 103c was routed in the lateral direction (Y direction). With the shape of the element substrate 100 and the arrangement of the heating elements 101 in this embodiment, it can be seen that the voltage drop values ​​are high at positions 601 (data number 0) and 604 (data number 32) where the heating elements 101 are located, which are the farthest from the heating element drive electrode 600.

[0032] Here, we compare the simulation results of the electrical wiring layer 103c with the thickness shown in Fig. 6(b) in the longitudinal direction (X direction) with the simulation results of the electrical wiring layer 103c with the thickness shown in Fig. 6(c) in the lateral direction (Y direction). Comparing the values ​​at position 601 (data number 0) and position 604 (data number 32), we see that the voltage drop is smaller when the electrical wiring layer 103c shown in Fig. 6(b) is routed in the longitudinal direction (X direction).

[0033] In this way, the VH wiring and GNDH wiring are arranged in the same layer. This allows the opposing area of ​​different power supply wiring between layers to be reduced (only the points where the power supply wiring intersect face each other). This makes it possible to suppress the frequency of interlayer leakage caused by foreign matter that occurs during wiring creation, etc., and to realize a reduction in yield in the manufacturing process. In addition, because the VH wiring and GNDH wiring are routed alternately in the same layer, the number of wiring layers can be reduced, thereby suppressing cost increases.

[0034] (Second embodiment) A second embodiment to which the present invention can be applied will be described below with reference to the drawings. Note that the basic configuration of this embodiment is the same as that of the first embodiment, so only the characteristic configuration will be described below.

[0035] Fig. 7(a) is a plan view showing the element substrate 100 in this embodiment, and Fig. 7(b) is an enlarged view of the electrical wiring layer 103b in part b of Fig. 7(a). The element substrate 100 in this embodiment has a rectangular outer shape as shown in Fig. 7(a). That is, since the outer shape of the element substrate 100 is a rectangle extending in the X and Y directions, the power supply wiring is connected along the Y direction in the section L in the figure, and the VH wiring 103b1 and the GNDH wiring 103b2 are arranged alternately in the X direction.

[0036] Fig. 8(a) is a plan view showing the element substrate 100, and Fig. 8(b) is an enlarged view of the electrical wiring layer 103c in part b of Fig. 8(a). The VH wiring 103c1 and the GNDH wiring 103c2 are alternately arranged in the Y direction as shown in Fig. 8(b). These are similarly laid out over the entire area of ​​the element substrate 100.

[0037] The power supply VH wiring 103b1 and the VH wiring 103c1 have through-holes where they intersect and overlap, and the power supply VH wiring 103b1 and the VH wiring 103c1 are connected by the through-hole wiring. Similarly, the GNDH wiring 103b2 and the GNDH wiring 103c2 have through-holes where they intersect and overlap, and the GNDH wiring 103b2 and the GNDH wiring 103c2 are connected by the through-hole wiring.

[0038] (Third embodiment) A third embodiment to which the present invention can be applied will be described below with reference to the drawings. Note that the basic configuration of this embodiment is the same as that of the first embodiment, so only the characteristic configuration will be described below.

[0039] 9 is a diagram showing the power supply wiring layers in this embodiment. The element substrate 100 of this embodiment includes an electrical wiring layer 103a that is farthest from the heating elements 101, an electrical wiring layer 103b that is next farthest from the heating elements 101, an electrical wiring layer 103c that is closer to the heating elements 101 than the electrical wiring layer 103b, and an electrical wiring layer 103d that is closest to the heating elements 101. The power supply wiring layer 103a, the electrical wiring layer 103b, and the electrical wiring layer 103c are the same as those in the first and second embodiments. The electrical wiring layer 103d has electrical wiring of the same shape and arrangement (same configuration) as the electrical wiring layer 103c. In other words, the VH wiring 103c1 of the electrical wiring layer 103c overlaps with the VH wiring 103d1 of the electrical wiring layer 103d, and the GNDH wiring 103c2 of the electrical wiring layer 103c overlaps with the GNDH wiring 103d2 of the electrical wiring layer 103d. In this way, by configuring the VH wiring and the GNDH wiring to overlap, the area where the VH wiring and the GNDH wiring face each other is reduced, making it possible to suppress leakage that occurs when foreign matter gets mixed between layers.

[0040] A through-hole is provided between the VH wiring 103c1 of the electrical wiring layer 103c and the VH wiring 103d1 of the electrical wiring layer 103d, and the VH wiring 103c1 and the VH wiring 103d1 are connected by the through-hole wiring. Also, a through-hole is provided between the GNDH wiring 103c2 of the electrical wiring layer 103c and the GNDH wiring 103d2 of the electrical wiring layer 103d, and the GNDH wiring 103c2 and the GNDH wiring 103d2 are connected by the through-hole wiring. [Explanation of symbols]

[0041] 50 through holes 100 Element substrate 101 Heating element 102 connecting member 103 Electrical Wiring 103a Electrical wiring layer 103b Electrical wiring layer 103c Electrical wiring layer 103d Electrical wiring layer 104 insulating film 105 Protective film 109 Discharge port 203 Drive circuit

Claims

1. A plurality of arranged heating elements; and an electrical wiring for supplying electricity for generating heat from the heating element, an element substrate in which the electrical wiring is provided in a first electrical wiring layer, a second electrical wiring layer overlapping the first electrical wiring layer, and a third electrical wiring layer overlapping the first electrical wiring layer; the first electrical wiring layer has a first wiring connected to one of the connection portions of the heat generating element and a second wiring connected to the other of the connection portions of the heat generating element; the second electrical wiring layer has a third wiring connected to the first wiring and a fourth wiring connected to the second wiring, the third electrical wiring layer has a fifth wiring connected to the first wiring and a sixth wiring connected to the second wiring, the first electrical wiring layer has a first wiring group in which at least one pair of the first wiring and the second wiring is provided in parallel, the second electrical wiring layer has a second wiring group in which at least one pair of the third wiring and the fourth wiring is provided in parallel, the third electrical wiring layer has a third wiring group in which at least one pair of the fifth wiring and the sixth wiring is provided in parallel, An element substrate characterized in that any two of the first wiring group, the second wiring group, and the third wiring group have the same wiring arrangement, and the remaining wiring group intersects with any two of the wiring groups when viewed from the perspective of a line that intersects perpendicularly with the first electrical wiring layer.

2. An element substrate as described in Claim 1, characterized in that the wiring thickness of any two of the wiring groups and the remaining wiring group are different.

3. In the first electrical wiring layer, a plurality of pairs of the first wiring and the second wiring are provided, and the first wiring and the second wiring are wired alternately; 3. The element substrate according to claim 1, wherein the second electrical wiring layer includes multiple pairs of the third wiring and the fourth wiring, and the third wiring and the fourth wiring are arranged alternately.

4. The external shape is a parallelogram, 4. The element substrate according to claim 1, wherein the first wiring group and the second wiring group are provided along sides of an outer shape of the element substrate.

5. The outer shape is rectangular, 4. The element substrate according to claim 1, wherein the first wiring group and the second wiring group are provided along sides of an outer shape of the element substrate.

6. the wirings of the first wiring group and the wirings of the second wiring group are provided over the entire area of ​​the element substrate, 6. An element substrate according to claim 1, wherein the wiring thickness of one of the first wiring group and the second wiring group extending in the longitudinal direction of the element substrate is thicker than the wiring thickness of the other wiring group extending in the lateral direction.

7. 7. An element substrate according to claim 1, wherein a through hole is provided between the first electrical wiring layer and the second electrical wiring layer, and the wiring of the first wiring group and the wiring of the second wiring group are connected by through hole wiring passing through the through hole.

8. 8. The element substrate according to claim 1, wherein the electrical wiring is made of a metal, and is made of one of Al, Cu, Ag, Au, Pt, W, Ni, and Co, or an alloy containing any of them.

9. a plurality of supply ports capable of supplying liquid to the heat generating element; 9. The element substrate according to claim 1, further comprising a plurality of recovery ports capable of recovering the liquid from the heat generating elements.

10. 10. The element substrate according to claim 1, further comprising a plurality of electrodes for transmitting external power to said heat generating element.

11. A recording head comprising the element substrate according to any one of claims 1 to 10.

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