Isolator

Abstract

To provide an isolator having a high coupling coefficient.SOLUTION: An isolator according to an embodiment includes an isolator module, a magnetic member, and an insulating member. The isolator module includes a first coil and a second coil that are separated with respect to a first direction and face each other. The magnetic member is provided on the isolator module so as to overlap the first coil and the second coil when viewed in the first direction. The insulating member covers the isolator module and the magnetic member.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] FIELD OF THE INVENTION An embodiment of the present invention relates to an isolator. [Background technology]

[0002] 2. Description of the Related Art An isolator is known that transmits a signal from a transmitting circuit to a receiving circuit while isolating the transmitting circuit from the receiving circuit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-324020 [Patent Document 2] Japanese Patent Application Laid-Open No. 2009-141271 [Patent Document 3] Japanese Patent Application Laid-Open No. 2017-17175 [Patent Document 4] Special Publication No. 2014-522561 [Patent Document 5] Japanese Patent Application Publication No. 2017-538277 Summary of the Invention [Problem to be solved by the invention]

[0004] To provide an isolator with a high coupling coefficient. [Means for solving the problem]

[0005] An isolator according to an embodiment includes an isolator module, a magnetic member, and an insulating member. The isolator module includes a first coil and a second coil arranged facing each other and spaced apart in a first direction. The magnetic member is provided on the isolator module so as to overlap the first coil and the second coil when viewed in the first direction. The insulating member covers the isolator module and the magnetic member. The isolator module includes a first wiring board on which the first coil is provided and which has a first pad and a first wiring electrically connected to the first coil and the first pad, and a second wiring board on which the second coil is provided and which has a second pad and a second wiring electrically connected to the second coil and the second pad, the second wiring board having an area smaller than that of the first wiring board. The first pad is provided on the upper surface of the first wiring board in a first region outside the region where the first wiring board and the second wiring board overlap. The second pad is provided in a second region on the upper surface of the second wiring board. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 2 is a plan view showing an example of a planar layout of the isolator according to the first embodiment. [Figure 2] 2 is a cross-sectional view taken along line II-II in FIG. 1, showing an example of the cross-sectional structure of the isolator according to the first embodiment. [Figure 3] FIG. 2 is a perspective view showing an example of the structure of the isolator module according to the first embodiment. [Figure 4] FIG. 2 is a perspective view showing an example of the structure of a primary circuit of the isolator module according to the first embodiment. [Figure 5] FIG. 2 is a perspective view showing an example of the structure of a secondary circuit of the isolator module according to the first embodiment. [Figure 6] 6 is a cross-sectional view taken along line VI-VI in FIG. 3, showing an example of the cross-sectional structure of the isolator module according to the first embodiment. [Figure 7] FIG. 2 is a diagram showing an example of magnetic flux generated in the isolator according to the first embodiment. [Figure 8] FIG. 10 is a perspective view showing an example of the structure of an isolator module according to a second embodiment. [Figure 9] 9 is a cross-sectional view taken along line IX-IX in FIG. 8, showing an example of the cross-sectional structure of the isolator module according to the second embodiment. [Figure 10] FIG. 10 is a diagram showing an example of magnetic flux generated in the isolator according to the second embodiment. [Figure 11] FIG. 10 is a cross-sectional view showing an example of the cross-sectional structure of an isolator according to a third embodiment. [Figure 12] FIG. 10 is a cross-sectional view showing an example of the cross-sectional structure of an isolator according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, embodiments will be described with reference to the drawings. The dimensions and proportions of the drawings are not necessarily the same as those in reality.

[0008] In the following description, components having substantially the same functions and configurations are denoted by the same reference numerals. When elements having similar configurations are to be particularly distinguished from one another, different letters or numbers may be added to the end of the same reference numerals.

[0009] 1. First embodiment The isolator according to the first embodiment will be described.

[0010] FIG. 1 is a plan view showing an example of a planar layout of an isolator according to the first embodiment. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1, showing an example of a cross-sectional structure of the isolator according to the first embodiment. As shown in FIGS. 1 and 2, an isolator package 1 is a package including a digital isolator. The isolator package 1 includes a frame 10, semiconductor chips 20 and 30, an isolator module 40, and an insulating member 50. Note that the insulating member 50 is omitted from FIG. 1.

[0011] The frame 10 is a plate-shaped metal member. On the surface of the frame 10, the semiconductor chips 20 and 30 and the isolator module 40 are provided via insulating adhesive members 11, 12, and 13, respectively. The frame 10 functions as a substrate that supports the semiconductor chips 20 and 30 and the isolator module 40.

[0012] Hereinafter, a plane parallel to the plane of the frame 10 is referred to as the XY plane. Directions that intersect perpendicularly with each other within the XY plane are referred to as the X direction and the Y direction. A direction that intersects with the XY plane is referred to as the Z direction. Within the Z direction, the direction from the frame 10 toward the semiconductor chips 20 and 30 and the isolator module 40 is also referred to as the upward direction.

[0013] A circuit 21 is formed on the semiconductor chip 20. The circuit 21 includes a signal transmission / reception circuit and a modulation / demodulation circuit. The circuit 21 of the semiconductor chip 20 is electrically connected to the isolator module 40 via bonding wires 22a and 22b. The semiconductor chip 20 is electrically connected to pins 24 via bonding wires 23.

[0014] The semiconductor chip 30 is aligned with the semiconductor chip 20 in the X direction. A circuit 31 is formed on the semiconductor chip 30. The circuit 31 includes a signal transmission / reception circuit and a modulation / demodulation circuit. The circuit 31 of the semiconductor chip 30 is electrically connected to the isolator module 40 via bonding wires 32a and 32b. The semiconductor chip 30 is electrically connected to a pin 34 via a bonding wire 33.

[0015] The isolator module 40 is a module that functions as a digital isolator. The isolator module 40 is provided between the semiconductor chip 20 and the semiconductor chip 30. A transformer is mounted on the isolator module 40. The isolator module 40 is configured to transmit signals while isolating a transmitting circuit (primary circuit) from a receiving circuit (secondary circuit) using the transformer. The configuration of the isolator module 40 will be described in detail later.

[0016] The insulating member 50 includes, for example, an insulating resin. The frame 10, the semiconductor chips 20 and 30, the isolator module 40, and the bonding wires 22a, 22b, 23, 32a, 32b, and 33 are sealed by the insulating member 50. The pins 24 and 34 are fixed by the insulating member 50, but have portions exposed to the outside of the insulating member 50.

[0017] With the above configuration, the isolator package 1 can transmit signals between the pins 24 and 34 via the isolator module 40.

[0018] FIG. 3 is a perspective view showing an example of the structure of the isolator module according to the first embodiment. FIG. 4 is a perspective view showing an example of the structure of the primary circuit of the isolator module according to the first embodiment. FIG. 5 is a perspective view showing an example of the structure of the secondary circuit of the isolator module according to the first embodiment. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 3, showing an example of the cross-sectional structure of the isolator module according to the first embodiment. As shown in FIGS. 3, 4, 5, and 6, the isolator module 40 is composed of, for example, wiring boards 41 and 42, a magnetic member 43, and an insulating layer 44. Note that in FIGS. 3, 4, and 5, the conductive members in the wiring boards 41 and 42 are shown through the insulating members covering the conductive members.

[0019] Wiring board 41 is a printed wiring board corresponding to the primary circuit. For example, a flexible printed circuit (FPC) having flexibility can be used as the printed wiring board. The shape of wiring board 41 can be, for example, rectangular, but is not limited to rectangular and can be any shape. Conductive pads 411a and 411b, wiring layers 412a and 412b, vias 413a and 413b, and coils 414a and 414b are provided within wiring board 41. The outer shape of wiring board 41 is formed by laminating insulating layers 415, 416, 417, 418, and 419 in this order.

[0020] The pads 411a and 411b are provided in an insulating layer 416. Portions of insulating layers 417, 418, and 419 above the insulating layer 416 that overlap with the pads 411a and 411b when viewed in the Z direction are removed. As a result, the bonding wires 22a and 22b are electrically connected to the pads 411a and 411b, respectively.

[0021] The wiring layers 412a and 412b are provided in the insulating layer 416. The wiring layers 412a and 412b electrically connect the pad 411a to the lower end of the via 413a, and the pad 411b to the lower end of the via 413b, respectively.

[0022] The vias 413a and 413b extend in the Z direction so as to penetrate the insulating layer 417. Coils 414a and 414b are electrically connected to the upper ends of the vias 413a and 413b, respectively.

[0023] The coils 414a and 414b are provided within the insulating layer 418. When viewed in the Z direction, each of the coils 414a and 414b has a spirally wound shape and a predetermined inductance. Each of the coils 414a and 414b has a central end and an outer peripheral end. The central end of the coil 414a and the central end of the coil 414b are electrically connected to the upper end of the via 413a and the upper end of the via 413b, respectively. The outer peripheral end of the coil 414a and the outer peripheral end of the coil 414b are electrically connected to each other.

[0024] This forms a current path between the bonding wire 22a and the bonding wire 22b. The coils 414a and 414b are also called primary coils.

[0025] An insulating layer 44 is provided on the upper surface of insulating layer 419 of wiring board 41. Insulating layer 44 includes, for example, an insulating silicon paste material. Insulating layer 44 separates and insulates wiring board 41 from and against wiring board 42.

[0026] A wiring board 42 is provided on the upper surface of the insulating layer 44. The wiring board 42 is a printed wiring board corresponding to the secondary circuit. For example, a flexible printed wiring board having flexibility can be used as the printed wiring board. The shape of the wiring board 42 can be, for example, rectangular, but is not limited to rectangular and can be any shape. The area of ​​the wiring board 42 as viewed in the Z direction is, for example, smaller than the area of ​​the wiring board 41. By providing pads 411a and 411b in an area of ​​the wiring board 41 that does not overlap with the wiring board 42 as viewed in the Z direction, interference between the bonding wires 22a and 22b and the wiring board 42 is suppressed.

[0027] Conductive pads 421a and 421b, wiring layers 422a and 422b, vias 423a and 423b, and coils 424a and 424b are provided within wiring board 42. The exterior shape of wiring board 42 is formed by laminating insulating layers 425, 426, 427, 428, and 429 in this order. That is, insulating layer 425 of wiring board 42 is provided on the upper surface of insulating layer 44.

[0028] The pads 421a and 421b are provided in an insulating layer 428. Portions of an insulating layer 429 above the insulating layer 428 that overlap with the pads 421a and 421b when viewed in the Z direction are removed. As a result, the bonding wires 32a and 32b are electrically connected to the pads 421a and 421b, respectively.

[0029] The wiring layers 422a and 422b are provided in the insulating layer 428. The wiring layers 422a and 422b electrically connect the pad 421a to the upper end of the via 423a, and the pad 421b to the upper end of the via 423b, respectively.

[0030] The vias 423a and 423b extend in the Z direction so as to penetrate the insulating layer 427. Coils 424a and 424b are electrically connected to the lower ends of the vias 423a and 423b, respectively.

[0031] The coils 424a and 424b are provided within the insulating layer 426. When viewed in the Z direction, each of the coils 424a and 424b has a spirally wound shape and a predetermined inductance. Each of the coils 424a and 424b has a central end and an outer peripheral end. The central end of the coil 424a and the central end of the coil 424b are electrically connected to the lower end of the via 423a and the lower end of the via 423b, respectively. The outer peripheral end of the coil 424a and the outer peripheral end of the coil 424b are electrically connected to each other.

[0032] This forms a current path between the bonding wire 32a and the bonding wire 32b. The coils 424a and 424b are also called secondary coils.

[0033] The primary coil and the secondary coil are arranged facing each other and spaced apart in the Z direction, so that the primary coil and the secondary coil function as a transformer.

[0034] A magnetic member 43 is provided on the upper surface of the insulating layer 429 of the wiring board 42. The magnetic member 43 is a plate-shaped member having magnetic properties. For example, a ferrite sheet can be used as the magnetic member 43. The magnetic member 43 is provided so as to overlap the primary coil and the secondary coil when viewed in the Z direction. The magnetic member 43 may be provided across the entire upper surface of the wiring board 42, as long as it does not come into contact with the pads 421a and 421b and the bonding wires 32a and 32b.

[0035] According to the first embodiment, the magnetic member 43 is provided on the upper surface of the insulating layer 429 of the isolator module 40 so as to overlap the primary coil and the secondary coil in the isolator module 40 when viewed in the Z direction. This makes it possible to prevent magnetic flux generated when signals are transmitted and received via the isolator module 40 from extending across the magnetic member 43 to the outside of the isolator module 40. This will be described below with reference to FIG. 7.

[0036] 7 is a diagram showing an example of magnetic flux generated in the isolator according to the first embodiment. In FIG. 7, the magnetic flux φ generated in the isolator module 40 when the magnetic member 43 is provided and when it is not provided is indicated by solid and dashed arrows, respectively.

[0037] When the magnetic member 43 is not provided, the magnetic flux φ is formed without being significantly restricted by the boundary between the inside and outside of the isolator module 40. In particular, the magnetic flux φ is formed along the direction in which the primary coil and the secondary coil are aligned. Therefore, the rotation loop of the magnetic flux φ can reach outside the isolator module 40 at both ends along the Z direction.

[0038] According to the first embodiment, the magnetic member 43 blocks the magnetic flux φ on the upper surface of the isolator module 40. As a result, the rotation loop of the magnetic flux φ is formed so as to turn back at the magnetic member 43. Therefore, the magnetic flux φ can be converged without reaching at least the outside of the upper end of the isolator module 40. In other words, it is possible to reduce leakage magnetic flux that does not contribute to the transformer out of the magnetic flux φ generated in the isolator module 40. Therefore, it is possible to improve the coupling coefficient of the transformer.

[0039] 2. Second embodiment Next, an isolator according to a second embodiment will be described. The second embodiment differs from the first embodiment in that magnetic members are provided on surfaces other than the top surface of the isolator module in addition to the top surface. The following mainly describes the configuration that differs from the first embodiment. Descriptions of configurations equivalent to those of the first embodiment will be omitted as appropriate.

[0040] Fig. 8 is a perspective view showing an example of the structure of the isolator module according to the second embodiment. Fig. 9 is a cross-sectional view taken along line IX-IX in Fig. 8, showing an example of the cross-sectional structure of the isolator module according to the second embodiment. Figs. 8 and 9 correspond to Figs. 3 and 6 in the first embodiment, respectively.

[0041] 8 and 9, isolator module 40A is composed of, for example, wiring boards 41 and 42, a magnetic member 43A, and an insulating layer 44. Note that the configurations of wiring boards 41 and 42 and insulating layer 44 are the same as those in the first embodiment, and therefore description thereof will be omitted.

[0042] Magnetic member 43A is a plate-like member having magnetic properties. For example, a ferrite sheet can be used as magnetic member 43A. Magnetic member 43A is provided so as to cover the upper, side, and lower surfaces of the structure including wiring boards 41 and 42 and insulating layer 44. More specifically, magnetic member 43A is provided over the upper, side, and lower surfaces of the structure including wiring boards 41 and 42 and insulating layer 44 so as not to come into contact with pads 411a, 411b, 421a, and 421b and bonding wires 32a and 32b.

[0043] The magnetic member 43A may be a single continuous sheet or may be a laminate of multiple sheets. As shown in the examples of FIGS. 8 and 9 , it is preferable that the magnetic member 43A completely covers the entire structure including the wiring boards 41 and 42 and the insulating layer 44, except for areas that may interfere with the pads 411a, 411b, 421a, and 421b and the bonding wires 22a, 22b, 32a, and 32b. However, the configuration of the magnetic member 43A is not limited to this example. For example, when the magnetic member 43A is a laminate of multiple sheets, there may be gaps between the sheets. Furthermore, the magnetic member 43A does not necessarily have to be provided on all surfaces of the structure including the wiring boards 41 and 42 and the insulating layer 44. For example, the magnetic member 43A may be provided on the top surface of the structure including the wiring boards 41 and 42 and the insulating layer 44, as well as on at least one of the bottom surface and side surface.

[0044] According to the second embodiment, the magnetic member 43A is provided so as to cover each surface of the isolator module 40A. This can further improve the coupling coefficient of the transformer. This will be explained below with reference to FIG.

[0045] Fig. 10 is a diagram showing an example of magnetic flux generated in an isolator according to the second embodiment. Fig. 10 corresponds to Fig. 7 in the first embodiment. Fig. 10 shows magnetic flux φ generated in the isolator module 40A and external magnetic flux φex generated outside the isolator module 40A.

[0046] By providing the magnetic member 43A, the magnetic flux φ is blocked by the magnetic member 43A at multiple surfaces that form boundaries between the inside and outside of the isolator module 40A. This further improves the convergence of the magnetic flux φ. In particular, when the magnetic member 43A is provided on the top and bottom surfaces of the isolator module 40A, the magnetic member 43A can essentially loop the magnetic flux φ inside the isolator module 40A. This improves the coupling coefficient of the transformer.

[0047] Furthermore, the magnetic member 43A can block the external magnetic flux φex that flows from the outside to the inside of the isolator module 40A. This can suppress a deterioration in the coupling coefficient of the transformer due to coupling of the external magnetic flux φex with the magnetic flux φ. Note that the higher the coverage of the isolator module 40A with the magnetic member 43A, the more effectively it can suppress the effects of the external magnetic flux φex.

[0048] 3. Third embodiment Next, an isolator according to a third embodiment will be described. The third embodiment differs from the first and second embodiments in that a magnetic member is provided on the isolator package. The following mainly describes the configuration that differs from the first embodiment. Descriptions of the same configuration as the first embodiment will be omitted as appropriate.

[0049] Fig. 11 is a cross-sectional view showing an example of the cross-sectional structure of an isolator according to the third embodiment, which corresponds to Fig. 2 in the first embodiment.

[0050] 11, the isolator package 1B includes a frame 10, semiconductor chips 20 and 30, an isolator module 40, an insulating member 50, and a magnetic member 43B. Note that the configurations of the frame 10, the semiconductor chips 20 and 30, the isolator module 40, and the insulating member 50 are the same as those in the first embodiment, and therefore description thereof will be omitted.

[0051] The magnetic member 43B is a plate-shaped member having magnetism. For example, a ferrite sheet can be used as the magnetic member 43B. The magnetic member 43B is provided so as to overlap the isolator module 40 when viewed in the Z direction. More specifically, the magnetic member 43B is provided so as to overlap the primary coil and the secondary coil when viewed in the Z direction. The magnetic member 43B may be provided across the upper surface of the insulating member 50.

[0052] According to the third embodiment, the magnetic member 43B is provided on the upper surface of the insulating member 50 so as to overlap the primary coil and the secondary coil in the isolator module 40 when viewed in the Z direction. This prevents magnetic flux generated when signals are transmitted and received via the isolator module 40 from extending across the magnetic member 43B to the outside of the isolator package 1B. Therefore, similar to the first embodiment, the coupling coefficient of the transformer can be improved.

[0053] 4. Fourth embodiment Next, an isolator according to a fourth embodiment will be described. The fourth embodiment differs from the third embodiment in that magnetic components are provided on the top surface of the isolator package as well as on surfaces other than the top surface. The following mainly describes the configuration that differs from the third embodiment. Descriptions of configurations equivalent to those of the third embodiment will be omitted where appropriate.

[0054] Fig. 12 is a cross-sectional view showing an example of the cross-sectional structure of the isolator according to the fourth embodiment, which corresponds to Fig. 11 in the third embodiment.

[0055] 12, the isolator package 1C includes a frame 10, semiconductor chips 20 and 30, an isolator module 40, an insulating member 50, and a magnetic member 43C. Note that the configurations of the frame 10, the semiconductor chips 20 and 30, the isolator module 40, and the insulating member 50 are the same as those in the third embodiment, and therefore description thereof will be omitted.

[0056] The magnetic member 43C is a plate-like member having magnetic properties. For example, a ferrite sheet can be used as the magnetic member 43C. The magnetic member 43C is provided so as to cover the upper surface, side surfaces, and lower surface of the insulating member 50. More specifically, the magnetic member 43C is provided over the upper surface, side surfaces, and lower surface of the insulating member 50 so as not to come into contact with the pins 24 and 34.

[0057] The magnetic member 43C may be a single continuous sheet or may be a laminate of multiple sheets. As shown in the example of FIG. 12, it is preferable that the magnetic member 43C completely covers the insulating member 50 except for areas that may interfere with the pins 24 and 34, but the configuration of the magnetic member 43C is not limited to this example. For example, if the magnetic member 43C is a laminate of multiple sheets, there may be gaps between the sheets. Furthermore, the magnetic member 43C does not necessarily have to be provided on all surfaces of the insulating member 50. For example, the magnetic member 43C may be provided on at least one of the bottom surface and side surface of the insulating member 50 in addition to the top surface.

[0058] According to the fourth embodiment, the magnetic member 43C is provided so as to cover each surface of the isolator package 1C. This further improves the coupling coefficient of the transformer. Therefore, similar to the third embodiment, the coupling coefficient of the transformer can be improved.

[0059] Furthermore, the magnetic member 43C can block the external magnetic flux φex that flows from the outside to the inside of the isolator package 1C. This can suppress a deterioration in the coupling coefficient of the transformer due to coupling of the external magnetic flux φex with the magnetic flux φ. Note that the higher the coverage of the isolator package 1C with the magnetic member 43C, the more effectively it can suppress the effects of the external magnetic flux φex.

[0060] 5. Modifications, etc. Various modifications can be applied to the above-described first, second, third, and fourth embodiments.

[0061] In the above-described first, second, third, and fourth embodiments, examples have been described in which a flexible printed wiring board formed from a flexible substrate is used as a wiring board having a transformer, but the wiring board is not limited to a flexible printed wiring board, and a rigid printed wiring board formed from a hard substrate can also be used.

[0062] In addition, in the above-described first, second, third, and fourth embodiments, the coil used in the transformer has an eight-shaped configuration made up of two spirally wound conductors, but this is not limiting. The coil used in the transformer may be made up of a single spirally wound conductor, or a coil of any other shape may be used.

[0063] In the third and fourth embodiments described above, the isolator module 40 described in the first embodiment is provided in the isolator packages 1B and 1C, but this is not limiting. For example, the isolator module provided in the isolator packages 1B and 1C may be the isolator module 40A described in the second embodiment, or may be configured without a magnetic member.

[0064] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention described in the claims and their equivalents. [Explanation of symbols]

[0065] 1, 1B, 1C...Isolator package 10...Frame 11, 12, 13...Adhesive members 20,30...Semiconductor chips 21, 31...circuit 22a, 22b, 23a, 23b, 32a, 32b, 33a, 33b...Bonding wires 24,34...pin 40,40A...Isolator module 41,42...Wiring board 43, 43A, 43B, 43C...Magnetic members 50...insulating member 411a, 411b, 421a, 421b...Pads 412a, 412b, 422a, 422b...Wiring layer 413a, 413b, 423a, 423b... via 414a, 414b, 424a, 424b... Coils 44,415,416,417,418,419,425,426,427,428,429…insulating layer

Claims

1. an isolator module including a first coil and a second coil arranged so as to face each other and spaced apart from each other in a first direction; a magnetic member provided on the isolator module so as to overlap the first coil and the second coil when viewed in the first direction; an insulating member covering the isolator module and the magnetic member; Equipped with The isolator module comprises: a first wiring board on which the first coil is provided and which has a first pad and a first wiring electrically connected to the first coil and the first pad; a second wiring board having an area smaller than that of the first wiring board, the second coil being provided thereon, second pads, and second wiring electrically connected to the second coil and the second pads; and the first pad is provided on the upper surface of the first wiring board in a first region outside a region where the first wiring board and the second wiring board overlap; the second pad is provided in a second region on the top surface of the second wiring board; Isolator.

2. The magnetic member is When viewed in the first direction, the coil includes a first portion and a second portion sandwiching the first coil and the second coil. The isolator of claim 1 .

3. The magnetic member is a first portion overlapping the first coil and the second coil when viewed in the first direction; a third portion connected to the first portion and extending in the first direction; Including, The isolator of claim 1 .

4. the magnetic member covers the isolator module except for the first pad and the second pad. The isolator of claim 1 .

5. an isolator module including a first coil and a second coil arranged so as to face each other and spaced apart from each other in a first direction; an insulating member covering the isolator module; a magnetic member provided on the insulating member so as to overlap the first coil and the second coil when viewed in the first direction; Equipped with The isolator module comprises: a first wiring board on which the first coil is provided and which has a first pad and a first wiring electrically connecting the first coil and the first pad; a second wiring board having an area smaller than that of the first wiring board, the second coil being provided thereon, second pads, and second wiring electrically connected to the second coil and the second pads; and the first pad is provided on the upper surface of the first wiring board in a first region outside a region where the first wiring board and the second wiring board overlap; the second pad is provided in a second region on the top surface of the second wiring board; Isolator.

6. The magnetic member is When viewed in the first direction, the coil includes a first portion and a second portion sandwiching the first coil and the second coil. The isolator according to claim 5.

7. The magnetic member is a first portion overlapping the first coil and the second coil when viewed in the first direction; a third portion connected to the first portion and extending in the first direction; Including, The isolator according to claim 5.

8. The magnetic member covers the insulating member. The isolator according to claim 5.

9. The magnetic member has a sheet shape and contains ferrite. The isolator according to claim 1 or claim 5.

10. A first chip; A second chip; a first wiring electrically connecting the first chip and the first coil; a second wiring electrically connecting the second chip and the second coil; Further provided with the insulating member further covers the first chip, the second chip, the first wiring, and the second wiring; The isolator according to claim 1 or claim 5.

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