Light emitting device manufacturing method, light emitting device

Abstract

To achieve a highly reliable light-emitting device in which stray bonding material is suppressed.SOLUTION: A manufacturing method of a light-emitting device includes steps of: preparing a mounting substrate having a mounting surface, a first metal pattern arranged on a mounting surface side, a second metal pattern arranged inside of the first metal pattern on the mounting surface side, and a third metal pattern arranged outside of the first metal pattern on the mounting surface side; arranging a light-emitting element over the mounting surface of the mounting substrate; applying a bonding material to the first metal pattern; and bonding a sealing member to at least the first metal pattern of the mounting substrate via the bonding material, the sealing member including a fourth metal pattern arranged with a width greater than or equal to a width of the first metal pattern.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a light-emitting device, and to a light-emitting device. [Background technology]

[0002] Patent Document 1 discloses a technique for joining a substrate and a lid using a solder material. Patent Document 1 discloses a technique for capturing protruding solder material with a third metal film and a fourth metal film provided at the tip of the protruding solder material, which are provided between a first metal film provided on the substrate and a second metal film provided on the lid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2017-54856 Summary of the Invention [Problem to be solved by the invention]

[0004] There is still room for improvement in the method of suppressing the extrusion of the bonding material and improving the reliability of the device. [Means for solving the problem]

[0005] A light emitting device according to one embodiment can be manufactured by a manufacturing method including the steps of: preparing a mounting substrate having a mounting surface, a first metal pattern provided on the mounting surface side, a second metal pattern provided inside the first metal pattern on the mounting surface side, and a third metal pattern provided outside the first metal pattern on the mounting surface side; arranging a light emitting element on the mounting surface of the mounting substrate; applying a bonding material to the first metal pattern; and bonding a sealing member having a fourth metal pattern with a width equal to or greater than the width of the first metal pattern to at least the first metal pattern of the mounting substrate via the bonding material.

[0006] A light emitting device according to one embodiment comprises a mounting substrate having a mounting surface, a first metal pattern provided on the mounting surface side, a second metal pattern provided inside the first metal pattern on the mounting surface side, and a third metal pattern provided outside the first metal pattern on the mounting surface side, a light emitting element arranged on the mounting surface, and a sealing member having a fourth metal pattern with a width equal to or greater than that of the first metal pattern and bonded to at least the first metal pattern of the mounting substrate via a bonding material.

[0007] In at least one of the one or more inventions disclosed in the embodiments, a highly reliable light emitting device in which the protrusion of the bonding material is suppressed is realized. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a light emitting device according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 3 is a perspective view of the light emitting device according to the embodiment in a state where a sealing member is not mounted. [Figure 4] FIG. 4 is a top view of the light emitting device according to the embodiment in a state where a sealing member is not mounted. [Figure 5] FIG. 5 is a top view of the mounting substrate according to the embodiment. [Figure 6] FIG. 6 is a bottom view of the sealing member according to the embodiment. [Figure 7] FIG. 7 is a partial cross-sectional view taken along the line VII-VII in FIG. [Figure 8] FIG. 8 is a diagram showing an example of the bonding position of the metal pattern of the mounting substrate and the metal pattern of the sealing member according to the embodiment. [Figure 9] FIG. 9 is a diagram showing another example of the bonding position between the metal pattern of the mounting substrate and the metal pattern of the sealing member according to the embodiment. [Figure 10]FIG. 10 is a diagram showing another example of the bonding position between the metal pattern of the mounting substrate and the metal pattern of the sealing member according to the embodiment. [Figure 11] FIG. 11 is an image showing the state of bonding in a light emitting device serving as a comparative example. [Figure 12] FIG. 12 is an image showing the state of bonding in another light emitting device serving as a comparative example. [Figure 13] FIG. 13 is an image showing the state of bonding in the light emitting device according to the embodiment. [Figure 14] FIG. 14 is an image showing the state of bonding in another light emitting device according to the embodiment. [Figure 15] FIG. 15 is an image showing the state of bonding in another light emitting device according to the embodiment. [Figure 16A] FIG. 16A is a top view for explaining a method for manufacturing a sealing member according to an embodiment. [Figure 16B] FIG. 16B is a cross-sectional view taken along line XVIB-XVIB in FIG. 16A. [Figure 16C] FIG. 16C is a top view for explaining the method for manufacturing the sealing member according to the embodiment. [Figure 16D] FIG. 16D is a cross-sectional view taken along the line XVID-XVID in FIG. 16C. [Figure 16E] FIG. 16E is a top view for explaining the method for manufacturing the sealing member according to the embodiment. [Figure 16F] FIG. 16F is an enlarged view of the area enclosed by the dashed line in FIG. 16E. [Figure 16G] FIG. 16G is a top view for explaining the method for manufacturing the sealing member according to the embodiment. [Figure 16H] FIG. 16H is a cross-sectional view taken along the line XVIH-XVIH in FIG. 16G. [Figure 16I] FIG. 16I is a top view for explaining the method for manufacturing the sealing member according to the embodiment. [Figure 17] FIG. 17 is an image showing the state of bonding at the thin portion of the light emitting device according to the embodiment. [Figure 18] FIG. 18 is an image showing the state of bonding in a portion other than the thin portion of the light emitting device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been rounded, chamfered, corner-cut, rounded, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygonal base are included in the interpretation of "polygon" described in this specification and claims.

[0010] The same applies to words that describe specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0011] Furthermore, in this specification or claims, descriptions such as up and down, left and right, front and back, front and back, front and back, etc. merely describe relationships such as relative positions, orientations, directions, etc., and do not necessarily correspond to the relationships during use.

[0012] In addition, directions such as the X direction, Y direction, and Z direction may be indicated using arrows in the drawings, and the directions of these arrows are consistent among multiple drawings relating to the same embodiment.

[0013] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. A "component" refers to an object that is physically handled as a single unit. An object that is physically handled as a single unit can also be said to be an object that is handled as a single part in the manufacturing process. On the other hand, a "part" refers to an object that does not need to be physically handled as a single unit. For example, the term "part" is used when referring to a portion of a component.

[0014] The distinction between "component" and "part" above does not indicate a conscious intention to limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this does not mean that the applicant recognizes that treating this component as a single physical unit is essential for the application of the present invention.

[0015] Furthermore, in this specification or claims, when there are multiple elements of a certain type and they need to be distinguished from one another, the elements may be prefixed with "first" or "second." Furthermore, the objects distinguished between the specification and the claims may differ. Therefore, even if the claims describe elements with the same prefixes as the specification, the objects identified by these elements may not be the same between the specification and the claims.

[0016] For example, if there are elements in this specification that are distinguished by the notation "first," "second," and "third," and the elements marked "first" and "third" in this specification are described in the claims, the elements may be distinguished by the notation "first" and "second" in the claims for clarity. In this case, the elements marked "first" and "second" in the claims refer to the elements marked "first" and "third" in this specification, respectively. Note that this rule is not limited to elements, and can be applied rationally and flexibly to other objects as well.

[0017] Hereinafter, a description will be given of an embodiment of the present invention. Specific embodiments of the present invention will be described with reference to the drawings. It should be noted that the embodiments of the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments do not disclose the only embodiments in which the present invention can be realized, but disclose exemplary embodiments. It should be noted that the sizes and positional relationships of components shown in the drawings may be exaggerated for ease of understanding.

[0018] <Embodiment> A light emitting device 1 according to an embodiment will now be described. FIGS. 1 to 10 are diagrams illustrating the light emitting device 1. FIG. 1 is a perspective view of the light emitting device 1. FIG. 2 is a cross-sectional view of the light emitting device 1 taken along the line II-II in FIG. 1. FIG. 3 is a perspective view of the light emitting device 1 without a sealing member 70 mounted thereon. FIG. 4 is a top view corresponding to FIG. 3. FIG. 5 is a top view of the mounting substrate 10. FIG. 6 is a bottom view of the sealing member 70. FIG. 7 is a partial cross-sectional view of the portion surrounded by the dashed line taken along the line VII-VII in FIG. 6. FIGS. 8 to 10 are schematic diagrams each showing an example of bonding between the mounting substrate 10 and the sealing member 70. In FIGS. 8 to 10, only the bonding portion 90 is hatched for ease of viewing.

[0019] The light emitting device 1 includes a plurality of components, including a mounting substrate 10, one or more light emitting elements 20, a submount 30, one or more protection elements 40, a temperature measuring element 50, wiring 60, and a sealing member 70.

[0020] The light emitting device 1 may include other components. For example, it may include a light emitting element other than the light emitting element 20, a submount other than the submount 30, a lens, a MEMS (Micro Electro Mechanical Systems), etc. Furthermore, the light emitting device 1 may not include some of the multiple components listed here. First, each component will be described.

[0021] (Mounting board 10) The mounting substrate 10 has an upper surface 11, a lower surface, and one or more outer surfaces. The shape of the mounting substrate 10 is a plate. The shape of the mounting substrate 10 is a rectangular parallelepiped. However, the shape of the mounting substrate 10 does not have to be a plate, and does not have to be a rectangular parallelepiped.

[0022] When viewed from above, the outer edge of the mounting substrate 10 has a rectangular shape. This rectangle can have long and short sides. In the illustrated mounting substrate 10, the long side of this rectangle is oriented in the same direction as the X direction, and the short side is oriented in the same direction as the Y direction. However, when viewed from above, the outer edge of the mounting substrate 10 does not have to have a rectangular shape.

[0023] When viewed from above, the length of the long side of the outer edge of the mounting substrate 10 is 3 mm or more and 15 mm or less. When viewed from above, the length of the short side of the outer edge of the mounting substrate 10 is 1 mm or more and 6 mm or less. However, the size of the outer edge of the mounting substrate 10 is not limited to these.

[0024] Other components are mounted on the upper surface 11 of the mounting board 10. The upper surface 11 can be referred to as the mounting surface. The mounting board 10 has a first mounting area 13 and a second mounting area 15 on the upper surface 11 side (mounting surface side). When viewed from above, the first mounting area 13 is surrounded by the second mounting area 15. The first mounting area 13 is provided on the upper surface 11. The second mounting area 15 is provided on the upper surface 11.

[0025] One or more wiring patterns 14 are provided on the mounting surface of the mounting board. The one or more wiring patterns 14 are provided in the first mounting area 13. The wiring patterns 14 are electrically connected to wiring patterns provided on the lower surface of the mounting board 10 via wiring that passes through the inside of the mounting board 10. Note that a wiring pattern electrically connected to the wiring pattern 14 may be provided on a surface other than the lower surface of the mounting board 10. For example, the upper surface 11 of the mounting board 10 may be extended to the outside of the second mounting area 15, and this wiring pattern may be provided outside the second mounting area 15.

[0026] The mounting substrate 10 can be provided with a plurality of wiring patterns 14. The plurality of wiring patterns 14 are arranged side by side in one direction on the upper surface of the mounting substrate 10. In the illustrated mounting substrate 10, the plurality of wiring patterns 14 are arranged side by side in the X direction.

[0027] A plurality of metal patterns 16 for bonding are provided in the second mounting area 15. The metal patterns 16 surround the first mounting area 13. The plurality of metal patterns 16 include a first metal pattern 16A, a second metal pattern 16B, and a third metal pattern 16C. The second metal pattern 16B is provided inside the first metal pattern 16A. The third metal pattern 16C is provided outside the first metal pattern 16A.

[0028] Each of the multiple metal patterns 16 is arranged in a ring shape when viewed from above. In the illustrated mounting substrate 10, the metal patterns 16 are arranged in a rectangular ring shape. Each metal pattern 16 has a predetermined width. As illustrated, the metal patterns 16 are arranged with a constant width except at the corners. For a rectangular ring-shaped metal pattern 16, the width of the metal pattern 16 at the corners is greater than or equal to the constant width outside the corners and less than the value obtained by multiplying this constant width by square root of 2. Hereinafter, the term "constant" includes a state in which a constant size is maintained except for localized portions. Furthermore, when describing a width, the size is specified excluding portions that locally increase or decrease depending on the shape of the pattern. For example, when a rectangular ring-shaped pattern has a width of 100 μm, this does not necessarily mean that the width at the corners is 100 μm, since the width at the corners varies up to square root of 2. For example, a description that the width of a certain pattern is 100 μm or more or 100 μm or less does not apply to cases where the maximum width is 100 μm or more or 100 μm or less in a localized portion, but the width is less than 100 μm or exceeds 100 μm excluding such localized portion.

[0029] The first metal pattern 16A is formed with a width of 100 μm or more and less than 200 μm. The first metal pattern 16A is formed with a thickness (vertical dimension) of 0.1 μm or more and 50 μm or less. The second metal pattern 16B is formed with a width of more than 50 μm and 100 μm or less. The second metal pattern 16B is formed with a thickness of 0.1 μm or more and 50 μm or less. The third metal pattern 16C is formed with a width of more than 50 μm and 100 μm or less. The third metal pattern 16C is formed with a thickness of 0.1 μm or more and 50 μm or less.

[0030] The second metal pattern 16B is provided at a position that is 30 μm or more and 200 μm or less away from the first metal pattern 16A. The second metal pattern 16B is provided at a fixed distance from the first metal pattern 16A. As a specific example, this distance can be set to 50 μm±5 μm.

[0031] The third metal pattern 16C is provided at a position spaced apart from the first metal pattern 16A by a distance of 30 μm to 200 μm. The third metal pattern 16C is provided at a fixed distance from the first metal pattern 16A. As a specific example, this distance can be set to 50 μm±5 μm.

[0032] The width of first metal pattern 16A is equal to or greater than the width of second metal pattern 16B. The width of first metal pattern 16A is equal to or greater than the width of third metal pattern 16C. The width of second metal pattern 16B and the width of third metal pattern 16C are the same.

[0033] The width from second metal pattern 16B to third metal pattern 16C is 500 μm or less. More specifically, the width from second metal pattern 16B to third metal pattern 16C can be considered as the sum of the width of first metal pattern 16A, the width of second metal pattern 16B, the width of third metal pattern 16C, the distance from first metal pattern 16A to second metal pattern 16B, and the distance from first metal pattern 16A to third metal pattern 16C.

[0034] The mounting substrate 10 can be formed using ceramic as the main material. Examples of ceramic include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. However, the mounting substrate 10 may also be formed from a material other than ceramic.

[0035] Here, the term "main material" refers to the material that accounts for the largest proportion of mass or volume in the target structure. Note that when the target structure is formed from a single material, that material is the main material. In other words, when a material is the main material, it means that the proportion of that material can be 100%.

[0036] (Light-emitting element 20) The light-emitting element 20 has a light-emitting surface from which light is emitted. The light-emitting element 20 has an upper surface, a lower surface, and multiple side surfaces. The side surfaces of the light-emitting element 20 can be used as light-emitting surfaces. However, other surfaces may also be used as light-emitting surfaces. Furthermore, multiple surfaces may also be used as light-emitting surfaces.

[0037] A semiconductor laser element can be used as the light emitting element 20. Note that the light emitting element 20 is not limited to a semiconductor laser element, and a light emitting diode or the like may also be used.

[0038] For example, a light emitting element that emits blue light, a light emitting element that emits green light, or a light emitting element that emits red light can be used as the light emitting element 20. Note that a light emitting element that emits light of another color or emission peak wavelength may also be used as the light emitting element 20. For example, a light emitting element that emits infrared light may also be used as the light emitting element 20.

[0039] Here, blue light refers to light whose peak emission wavelength is in the range of 420 nm to 494 nm, green light refers to light whose peak emission wavelength is in the range of 495 nm to 570 nm, and red light refers to light whose peak emission wavelength is in the range of 605 nm to 750 nm.

[0040] Here, a semiconductor laser element, which is an example of the light-emitting element 20, will be described. When viewed from above, the semiconductor laser element has a rectangular outer shape with one opposite side as the long side and the other opposite side as the short side. Light (laser light) emitted from the semiconductor laser element has a divergence. Furthermore, divergent light is emitted from the emitting end face of the semiconductor laser element. The emitting end face of the semiconductor laser element can be said to be the light emitting surface of the light-emitting element 20.

[0041] Light emitted from a semiconductor laser element forms an elliptical far-field pattern (FFP) in a plane parallel to the light-emitting end facet. FFP is the shape and light intensity distribution of the emitted light at a position away from the light-emitting end facet.

[0042] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis or the light passing through the optical axis. Also, in the light intensity distribution of the FFP, the light with peak intensity is called the light traveling along the optical axis or the light passing through the optical axis. 2 The light having the above intensity is called the main part of the light.

[0043] The shape of the FFP of light emitted from a semiconductor laser element is an ellipse in a plane parallel to the light emitting end face, with the stacking direction being longer than the direction perpendicular to the stacking direction. The stacking direction is the direction in which multiple semiconductor layers including the active layer are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the in-plane direction of the semiconductor layers. The long axis direction of the elliptical shape of the FFP can also be called the fast axis direction of the semiconductor laser element, and the short axis direction can also be called the slow axis direction of the semiconductor laser element.

[0044] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The angle at which light with this light intensity spreads is defined as the light spread angle of the semiconductor laser element. The light spread angle is 1 / e of the peak light intensity. 2 In the description of this specification, when simply referring to the "spread angle of light," it is assumed that the spread angle is 1 / e of the peak light intensity. 2The divergence angle of light at a light intensity of 1000 nm is defined as the divergence angle of light in the fast axis direction.

[0045] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements that contain nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those that contain InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductors.

[0046] (Submount 30) The submount 30 has an upper surface and a lower surface. Other components are placed on the upper surface of the submount 30. The submount 30 can be considered an example of a mounting member on which one or more components are placed. The upper surface of the submount 30 is rectangular. The submount 30 is configured in the shape of a rectangular parallelepiped. The upper surface of the submount 30 can be rectangular in shape with short sides and long sides.

[0047] The submount 30 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide as a main material. A wiring region made of a conductive material is provided on the upper surface of the submount 30. The wiring region can be formed of a metal film. An example of the metal film is Ti / Pt / Au.

[0048] (protective element 40) The protective element 40 is intended to prevent a specific element (e.g., a light-emitting element) from being destroyed by excessive current flowing through it. An example of the protective element 40 is a Zener diode. A Zener diode made of Si can be used. The shape of the protective element 40 is approximately square when viewed from above. However, the shape of the protective element 40 is not limited to this.

[0049] (Temperature measuring element 50) The temperature measuring element 50 is an element used as a temperature sensor for measuring the ambient temperature. For example, a thermistor can be used as the temperature measuring element 50. The shape of the temperature measuring element 50 is approximately square when viewed from above. However, the shape of the temperature measuring element 50 is not limited to this.

[0050] (Wiring 60) The wiring 60 is made of a conductor having a linear shape. The wiring 60 is joined to other components at both ends of the linear portion. The wiring 60 is used for electrical connection between two components. For example, a metal wire can be used as the wiring 60. Examples of metals include gold, aluminum, silver, and copper.

[0051] (Sealing member 70) The sealing member 70 has an upper portion 71 and a side wall portion 72. The upper portion 71 has an upper surface 71A and a lower surface 71B. The side wall portion 72 has one or more inner surfaces 72A, one or more outer surfaces 72B, and a lower surface 72C. The side wall portion 72 has a frame-like shape. The sealing member 70 has a concave surface 73.

[0052] A lower surface 72C of the side wall portion 72 is lower than a lower surface 71B of the upper portion 71. When viewed from below, the lower surface 71B of the upper portion is surrounded by an inner surface 72A of the side wall portion 72. When viewed from above, the upper surface 71A of the upper portion is surrounded by an outer surface 72B of the side wall portion 72.

[0053] A part of the outer edge of the concave surface 73 intersects with a part of the outer edge of the upper surface of the upper part 71. Another part of the outer edge of the concave surface 73 forms part of the outer edge of the sealing member 70 when viewed from above. Another part of the outer edge of the upper surface of the upper part 71 forms part of the outer edge of the sealing member 70 when viewed from above. The concave surface 73 is formed along one side of the outer edge of the upper surface of the upper part 71.

[0054] The sealing member 70 has a rectangular outer shape when viewed from above. The upper surface of the upper portion 71 has a rectangular outer shape with long and short sides when viewed from above. The concave surface 73 connects the outer surface of the side wall portion 72 and the upper surface of the upper portion 71. When viewed from above, the concave surface 73 is outside the frame defined by one or more inner surfaces of the side wall portion 72. The concave surface 73 is formed along the long side of the upper surface of the upper portion 71.

[0055] A metal pattern 74 is provided on a lower surface 72C of the sealing member 70. The metal pattern 74 is provided in an annular shape on the annular lower surface 72C. In the illustrated sealing member 70, a rectangular annular metal pattern 74 is provided on a rectangular annular lower surface 72C.

[0056] The metal pattern 74 has a thin portion 74A that is thinner than other portions. The metal pattern 74 may be provided with a plurality of thin portions 74A. In the rectangular-annular metal pattern 74, the thin portions 74A are provided in areas along each side of the rectangle. The area along a side refers to the portion that includes the side and where the metal pattern 74 is formed with a predetermined width from the side. The thin portion 74A is provided at a position that passes through the center of the side.

[0057] The thin portion 74A is provided along the width of the metal pattern 74. The thin portion 74A is provided in the width direction from the inner edge to the outer edge forming the ring shape. Instead of the metal pattern 74 having the thin portion 74A, it is also possible to use a plurality of metal patterns separated by portions corresponding to the thin portion 74A.

[0058] The metal pattern 74 is provided on the lower surface 72C with a width smaller than the width of the lower surface 72C. The metal pattern 74 is spaced from the inner edge of the lower surface 72C of the sealing member 70 by a distance of 50 μm or more. Furthermore, the metal pattern 74 is spaced from the inner edge of the lower surface 72C by a distance less than 50% of the width of the lower surface 72C.

[0059] The metal pattern 74 is spaced 50 μm or more from the outer edge of the lower surface 72C of the sealing member 70. The metal pattern 74 is also spaced from the outer edge of the lower surface 72C by a distance less than 50% of the width of the lower surface 72C.

[0060] When the metal pattern 74 is used as a bonding region, it is preferable that the metal pattern 74 be separated from the inner edge of the lower surface 72C of the sealing member 70 by a distance of 50 μm to 150 μm, and that the width of the metal pattern 74 be 100 μm or more. In this case, the maximum width of the metal pattern 74 is the width of the lower surface 72C minus the distance from the inner edge of the sealing member 70 to the metal pattern 74. As will be described in detail later, by separating the metal pattern 74 by a predetermined distance from the inner edge of the sealing member 70 in this manner, it is possible to prevent the metal pattern 74 from extending onto the lower surface 71B or the inner surface 72A, and to prevent unnecessary metal patterns from being formed on the lower surface 71B or the inner surface 72A.

[0061] (Light-emitting device 1) Next, the light emitting device 1 including the above-mentioned components will be described. In the light emitting device 1, one or more light emitting elements 20 are mounted on a submount 30. The one or more light emitting elements 20 are mounted on the upper surface of the submount 30. Each of the one or more light emitting elements 20 is arranged with its light emitting surface facing sideways. In the illustrated light emitting device 1, the upper surface of the submount 30 is parallel to the X and Y directions.

[0062] The light emitting surface of the light emitting element 20 is disposed near a side surface of the submount 30. The light emitting element 20 is disposed close enough so that the majority of the light emitted from the light emitting element 20 does not strike the top surface of the submount 30. This side surface is the side surface that intersects with the long side of the top surface of the submount 30.

[0063] The light emitting device 1 may include a plurality of light emitting elements 20. Hereinafter, when the plurality of light emitting elements 20 are individually specified and described, they will be distinguished as a first light emitting element, a second light emitting element, etc. The light emitting device 1 may include a plurality of light emitting elements 20 each emitting light of a different color.

[0064] The illustrated light emitting device 1 includes a first light emitting element 20A, a second light emitting element 20B, and a third light emitting element 20C. The first light emitting element 20A, the second light emitting element 20B, and the third light emitting element 20C are each disposed on the upper surface of a submount 30.

[0065] The first light-emitting element 20A emits a first light having a peak wavelength at a first wavelength, the second light-emitting element 20B emits a second light having a peak wavelength at a second wavelength different from the first wavelength, and the third light-emitting element 20C emits a third light having a peak wavelength at a third wavelength different from the first and second wavelengths. For example, the first light-emitting element 20A emits red light, the second light-emitting element 20B emits green light, and the third light-emitting element 20C emits blue light.

[0066] The plurality of light-emitting elements 20 are arranged side by side with their light-emitting surfaces facing the same direction. Note that the same direction here includes the case where the angle formed by the light-emitting surfaces of adjacent light-emitting elements 20 is within a range of ±5 degrees. In the illustrated light-emitting device 1, the direction (first direction) in which the plurality of light-emitting elements 20 are arranged is the same as the X direction.

[0067] The light emitted from the light emitting surface of the light emitting element 20 includes light traveling in a direction perpendicular to the light emitting surface. In the light emitting device 1, the direction perpendicular to the light emitting surface is parallel to the upper surface of the submount 30. Note that "parallel" here includes cases where the direction is within a range of ±3 degrees. When the light emitting element 20 is a semiconductor laser element, the light traveling along the optical axis of the semiconductor laser element can be light traveling in a direction perpendicular to the light emitting surface.

[0068] The light emitted from the light emitting surface of the light emitting element 20 includes light traveling in a direction (second direction) perpendicular to the first direction in a top view. In the light emitting device 1, the second direction is parallel to the upper surface of the submount 30. Note that the term "parallel" here includes cases where the second direction is within a range of ±3 degrees.

[0069] In the illustrated light emitting device 1, the direction perpendicular to the light emitting surface is the same as the Y direction. The light emitting element 20 is a semiconductor laser element, and the optical axis of the light emitted from the semiconductor laser element is the same as the Y direction.

[0070] In top view, the length of the upper surface of the submount 30 in the second direction is shorter than the length in the first direction. In the illustrated light emitting device 1, the first light emitting element 20A, the second light emitting element 20B, and the third light emitting element 20C are arranged in this order in the first direction. In other words, the second light emitting element 20B is arranged between the first light emitting element 20A and the third light emitting element 20C.

[0071] The plurality of light emitting elements 20 are arranged at equal intervals in the first direction. The intervals between the light emitting elements 20 are measured based on the center of the light emitting surface of each light emitting element 20.

[0072] In the light emitting device 1, one or more protection elements 40 are mounted on the submount 30. The one or more protection elements 40 are mounted on the upper surface of the submount 30.

[0073] The light emitting device 1 can include a plurality of protective elements 40. Hereinafter, when the plurality of protective elements 40 are individually specified and described, they will be distinguished as a first protective element, a second protective element, and so on.

[0074] The protective element 40 is provided to protect the light-emitting element 20. The light-emitting device 1 can include the same number of protective elements 40 as the number of light-emitting elements 20. The illustrated light-emitting device 1 includes a first protective element 40A, a second protective element 40B, and a third protective element 40C arranged on the upper surface of the submount 30. The first protective element 40A is the protective element 40 associated with the first light-emitting element 20A, i.e., the protective element 40 provided to protect the first light-emitting element 20A. The second protective element 40B is the protective element 40 associated with the second light-emitting element 20B. The third protective element 40C is the protective element 40 associated with the third light-emitting element 20C.

[0075] In top view, the first protective element 40A is disposed between the first light-emitting element 20A and the second light-emitting element 20B. In top view, the second protective element 40B and the third protective element 40C are disposed between the second light-emitting element 20B and the third light-emitting element 20C. By disposing the protective elements 40 in this manner, the submount 30 can be made smaller.

[0076] In the light emitting device 1, the temperature measuring element 50 is mounted on the submount 30. The temperature measuring element 50 is mounted on the upper surface of the submount 30. When viewed from above, the temperature measuring element 50 is disposed between the first light emitting element 20A and the second light emitting element 20B. The first protection element 40A and the temperature measuring element 50 are spaced apart in the second direction.

[0077] In the light emitting device 1, the wiring 60 is bonded to the wiring region of the submount 30 and the light emitting element 20 mounted on the submount 30. The wiring 60 is bonded to the light emitting element 20 mounted on the submount 30 and the protection element 40 mounted on the submount 30. The wiring 60 is bonded to the wiring region of the submount 30 and the temperature measuring element 50 mounted on the submount 30.

[0078] In the light emitting device 1, the submount 30 is disposed on the upper surface 11 of the mounting substrate 10. The submount 30 is bonded to the mounting substrate 10 with an adhesive. The submount 30 is disposed in the first mounting region 13 of the mounting substrate 10.

[0079] Note that one or more light-emitting elements 20 may be disposed on the mounting surface of the mounting substrate 10 without the submount 30. In this case, for example, it is conceivable to provide a mounting substrate in a shape in which the submount 30 is disposed on the mounting substrate 10.

[0080] The light emitting element 20 emits light that travels laterally relative to the upper surface of the mounting substrate 10. The light that travels in the second direction from the light emitting element 20 travels in a direction away from the wiring pattern 14.

[0081] In the first direction, the length from one end to the other of the one or more wiring patterns 14 is 90% or more and 110% or less of the length from one end to the other of the submount 30. By making these two lengths approximately equal, the light emitting device 1 can be manufactured in a compact size.

[0082] In the light emitting device 1, the sealing member 70 is disposed on the mounting substrate 10. The sealing member 70 is bonded to the mounting substrate 10 in the second mounting region 15. A lower surface 71B of the sealing member 70 is bonded to an upper surface 11 of the mounting substrate 10. The lower surface 71B of the sealing member 70 and the upper surface 11 of the mounting substrate 10 can each be considered a bonding surface. A metal pattern 74 of the sealing member 70 is bonded to a metal pattern 16 in the second mounting region 15.

[0083] The sealing member 70 is bonded to the first metal pattern 16A of the mounting substrate 10 via a bonding material. Furthermore, the sealing member 70 is bonded to the second metal pattern 16B and the third metal pattern 16C via a bonding material. For example, the sealing member 70 can be bonded to the mounting substrate 10 by using solder such as AuSn as the bonding material to bond the metal pattern 74 and the metal pattern 16 with the bonding material.

[0084] The metal pattern 74 of the sealing member 70 has a width equal to or greater than the width of the first metal pattern 16A of the mounting substrate 10. Preferably, the width of the metal pattern 74 is greater than the width of the first metal pattern 16A. This stabilizes the bonding between the metal pattern 74 of the sealing member 70 and the multiple metal patterns 16 of the mounting substrate 10.

[0085] In top view, the first metal pattern 16A is located between the inner edge and outer edge of the metal pattern 74. In top view, the metal pattern 74 covers the first metal pattern 16A. The sealing member 70 is bonded to the mounting substrate 10 so that the center of the width of the metal pattern 74 and the center of the width of the first metal pattern 16A overlap in top view. The overlapping of the centers here does not have to be exact, as long as they are substantially aligned, and some deviation is acceptable. For example, even if the ideal design is aligned, some error usually occurs during actual manufacturing.

[0086] The light emitting device 1 is manufactured without the bonding material protruding from the bonding surface of the sealing member 70. Here, the bonding material that bonds the mounting substrate 10 and the sealing member 70 and is in a hardened state is referred to as a bonding portion 90. In the light emitting device 1, the bonding portion 90 is formed so as not to protrude from the lower surface 72C.

[0087] 8 to 10 are diagrams showing an example of the positional relationship when the metal pattern 16 of the mounting substrate 10 is bonded to the metal pattern 74 of the sealing member 70. In a plan view perpendicular to the bonding surface, the entire first metal pattern 16A of the mounting substrate 10 overlaps with the metal pattern 74 of the sealing member 70.

[0088] 8, in a plan view perpendicular to the bonding surface, metal pattern 74 does not overlap second metal pattern 16B or third metal pattern 16C. The width of metal pattern 74 is smaller than the distance from second metal pattern 16B to third metal pattern 16C. The width of metal pattern 74 is equal to or less than the length of the line segment connecting the midpoint of the distance from first metal pattern 16A to second metal pattern 16B and the midpoint of the distance from first metal pattern 16A to third metal pattern 16C.

[0089] 9, the width of metal pattern 74 does not exceed the distance from second metal pattern 16B to third metal pattern 16C, and is greater than the length of the line segment connecting the midpoint of the distance from first metal pattern 16A to second metal pattern 16B and the midpoint of the distance from first metal pattern 16A to third metal pattern 16C.

[0090] As shown in Figure 10, in a plan view perpendicular to the bonding surface, metal pattern 74 overlaps a portion of second metal pattern 16B. Metal pattern 74 does not overlap the entire second metal pattern 16B. Furthermore, in a plan view perpendicular to the bonding surface, metal pattern 74 overlaps a portion of third metal pattern 16C. Metal pattern 74 does not overlap the entire third metal pattern 16C. The width of metal pattern 74 is greater than the distance from second metal pattern 16B to third metal pattern 16C.

[0091] 11 to 15 are images showing the state of bonding in the light emitting device of the comparative example and the state of bonding in the light emitting device 1. Fig. 11 and Fig. 12 are images showing the state of bonding in the light emitting device of the comparative example, and Fig. 13 to Fig. 15 are images showing the state of bonding in the light emitting device according to the embodiment.

[0092] The light emitting devices of the comparative examples shown in Figures 11 and 12 have two metal patterns on the mounting substrate. These two metal patterns correspond to the first metal pattern 16A of the light emitting device 1 according to the embodiment and the third metal pattern 16C provided outside the first metal pattern 16A. In the light emitting devices shown in Figures 11 and 12, an adhesive material is applied to the first metal pattern 16A or a metal pattern equivalent thereto to bond it to the sealing member. In the light emitting devices shown in Figures 13 to 15, an adhesive material is applied to the first metal pattern 16A to bond it to the sealing member.

[0093] In the comparative example of Figure 11, the width of the metal pattern corresponding to first metal pattern 16A is 150 μm, the width of the metal pattern corresponding to third metal pattern 16C is 50 μm, and the distance between the two metal patterns is 75 μm. In the comparative example of Figure 12, the width of the metal pattern corresponding to first metal pattern 16A is 150 μm, the width of the metal pattern corresponding to third metal pattern 16C is 50 μm, and the distance between the two metal patterns is 50 μm. In the comparative examples of Figures 11 and 12, the width of the metal pattern of the sealing member is 240 μm.

[0094] 13, the width of first metal pattern 16A is 200 μm, the width of second metal pattern 16B is 50 μm, the width of third metal pattern 16C is 50 μm, the distance from first metal pattern 16A to second metal pattern 16B is 50 μm, and the distance from first metal pattern 16A to third metal pattern 16C is 50 μm. Furthermore, the width of metal pattern 74 is 240 μm. In the light emitting device 1 of FIG. 13, the relationship between the bonding positions of metal pattern 16 and metal pattern 74 is as shown in FIG. 8.

[0095] 14, the width of first metal pattern 16A is 150 μm, the width of second metal pattern 16B is 75 μm, the width of third metal pattern 16C is 75 μm, the distance from first metal pattern 16A to second metal pattern 16B is 50 μm, and the distance from first metal pattern 16A to third metal pattern 16C is 50 μm. Furthermore, the width of metal pattern 74 is 240 μm. In the light emitting device 1 of FIG. 14, the relationship between the bonding positions of metal pattern 16 and metal pattern 74 is as shown in FIG. 9.

[0096] 15, the width of first metal pattern 16A is 100 μm, the width of second metal pattern 16B is 100 μm, the width of third metal pattern 16C is 100 μm, the distance from first metal pattern 16A to second metal pattern 16B is 50 μm, and the distance from first metal pattern 16A to third metal pattern 16C is 50 μm. Furthermore, the width of metal pattern 74 is 240 μm. In the light emitting device 1 of FIG. 15, the relationship between the bonding positions of metal pattern 16 and metal pattern 74 is as shown in FIG. 10.

[0097] In the light-emitting device of FIG. 11, circular adhesive material protrudes from the inner edge of the sealing member. Also, circular adhesive material protrudes from the outer edge of the sealing member, but the number of protruding circular adhesive material is smaller than that of the inner edge. In the light-emitting device of FIG. 12, no adhesive material protrudes from the outer edge of the sealing member, but circular adhesive material protrudes from the inner edge of the sealing member. Thus, in the light-emitting device of the comparative example provided with two metal patterns, protrusion to the outer edge can be suppressed to a certain extent compared to protrusion to the inner edge. On the other hand, in the light-emitting device 1 of FIGS. 13 to 15, it can be seen that the adhesive material does not protrude from either the inner or outer edge of the sealing member 70. Thus, by providing the first metal pattern 16A, the second metal pattern 16B, and the third metal pattern 16C, protrusion of the adhesive material from the inner and outer edges of the sealing member 70 can be suppressed.

[0098] 13 to 15, the bonding material is bonded annularly to the annular first metal pattern 16A. The bonding material is not bonded annularly to the annular second metal pattern 16B, but is bonded only partially. The bonding material is not bonded annularly to the annular third metal pattern 16C, but is bonded only partially. In other words, the sealing member 70 is bonded to the first metal pattern 16A, the second metal pattern 16B, and the third metal pattern 16C via the bonding material, but is not necessarily bonded to the entire area of ​​these metal patterns 16.

[0099] By bonding the mounting substrate 10 and the sealing member 70, an internal closed space is defined by the mounting substrate 10 and the sealing member 70. It can be said that the mounting substrate 10 and the sealing member 70 form a package. It can also be said that the light emitting element 20 is disposed in the internal space of the package. Note that the package may be formed, for example, by bonding a flat sealing member having an upper portion to a mounting substrate in which the substrate and sidewall portion are integrated.

[0100] Light emitted from one or more light-emitting elements 20 passes through the side wall 72 of the package and is emitted from the outer surface. Light emitted from one or more light-emitting elements 20 passes through the side wall 72 of the sealing member 70. Light emitted from one or more light-emitting elements 20 is incident on one inner surface (first inner surface) of the side wall 72 and is emitted from one outer surface (first outer surface).

[0101] In the illustrated light emitting device 1, light emitted from the first light emitting element 20A, the second light emitting element 20B, and the third light emitting element 20C enters the first inner surface of the side wall portion 72 and is emitted from the first outer surface of the side wall portion 72.

[0102] Note that the light emitted from one or more light-emitting elements 20 may be emitted from the upper surface of the upper portion 71 and travel upward, instead of being emitted from the outer surface of the package and traveling laterally. For example, a reflecting mirror may be provided, and the light emitted from one or more light-emitting elements 20 may be reflected by the reflecting mirror to travel upward and be emitted from the upper surface of the upper portion 71.

[0103] The concave surface 73 is formed along one side of the top surface of the upper portion 71, the side opposite the side that intersects with the first outer surface. This side is the long side of the rectangular top surface. The concave surface 73 is the outer surface of the side wall portion 72, and connects the outer surface (second outer surface) located opposite the first outer surface to the top surface of the upper portion 71. By providing the concave surface 73 on the second outer surface side rather than the first outer surface side, the light emission surface can be identified based on the concave surface 73, and the orientation of the light emitting device 1 can be determined.

[0104] (Method of manufacturing light emitting device 1) Here, a description will be given of a method for manufacturing the light emitting device 1. The light emitting device 1 can be manufactured by mounting the components in the order described above in (Light emitting device 1).

[0105] The manufacturing method of the light emitting device 1 includes a step of preparing a mounting substrate 10 (first step), a step of arranging one or more components including a light emitting element 20 on the mounting substrate 10 (second step), and a step of bonding a sealing member 70 to the mounting substrate 10 (third step).

[0106] In a first step, a mounting substrate 10 is prepared, on whose mounting surface a first metal pattern 16A, a second metal pattern 16B, and a third metal pattern 16C are provided. In a second step, one or more light-emitting elements 20 are arranged on the mounting surface of the mounting substrate 10. The one or more light-emitting elements 20 may be arranged via a submount 30, and a protective element 40 may be arranged on the mounting surface. A temperature measuring element 50 may also be arranged on the mounting surface. For electrical connection, wiring 60 is joined to the light-emitting elements 20, the mounting substrate 10, etc.

[0107] In the third step, a bonding material is applied to the first metal pattern 16A of the mounting substrate 10. Then, the sealing member 70 is bonded to the mounting substrate 10 via the bonding material applied to the first metal pattern 16A. By the bonding process, the sealing member 70 is bonded to the first metal pattern 16A, the second metal pattern 16B, and the third metal pattern 16C of the mounting substrate 10.

[0108] Here, a method for manufacturing the sealing member 70 used in the third step will be further described. 16A to 16I are diagrams illustrating a method for manufacturing the sealing member 70 provided with the metal pattern 74. FIG.

[0109] The manufacturing method of the sealing member 70 having the metal pattern 74 includes the steps of: placing an embedding substrate 101 having a plurality of recesses (step 4); embedding the sealing member 70 (hereinafter referred to as the base material 80) without the metal pattern 74 into each of the plurality of recesses (step 5); placing a mask member 102 on the plurality of base materials 80 (step 6); and providing the metal pattern 74 on the plurality of base materials 80 (step 7).

[0110] In the fourth step, the fitting substrate 101 is set (see FIGS. 16A and 16B). The fitting substrate 101 can be set by placing a fitting plate with multiple through holes on a base substrate and fixing it with screws or the like. Recesses are formed by the flat surface of the base substrate and the through holes in the fitting plate. The fitting substrate 101 provides multiple recesses aligned in the row direction in plan view, spanning multiple rows. The fitting substrate 101 shown in the figure has multiple recesses arranged in a matrix.

[0111] In the fifth step, a base material 80 is fitted into each of the multiple recesses of the fitting substrate 101 (see Figures 16C and 16D). One base material 80 is fitted into one recess. The base material 80 is fitted with the upper surface 71A of the upper part 71 facing the flat surface of the recess. The base material 80 is fitted into the recess of the fitting substrate 101 so that the lower surface 72C of the base material 80 faces upward. At this stage, no metal pattern 74 is provided on the lower surface 72C of the base material 80. Hereinafter, to avoid confusion between top and bottom, the surface corresponding to the upper surface 71A of the upper part 71 will be referred to as the first surface, the surface corresponding to the lower surface 71B of the upper part 71 will be referred to as the second surface, and the surface corresponding to the lower surface 72C of the side wall portion 72 will be referred to as the third surface.

[0112] In a sixth step, a mask member 102 is placed on the plurality of base materials 80 (see FIGS. 16G and 16H). FIGS. 16E and 16F are views showing the mask member 102.

[0113] The mask member 102 can be formed using, for example, metal as a material. The mask member 102 has a plurality of first portions 103, a second portion 104 surrounding the plurality of first portions 103, and a plurality of connection portions 105 connecting the first portions 103 and the second portions 104. Except for the portion connected by the connection portions 105, the first portions 103 and the second portions 104 are separated from each other, and through holes 106 are formed therein.

[0114] The mask member 102 has a shape in which a plurality of imaginary through holes, ignoring the connection portions 105, are provided in the second portion 104, a first portion 103 is arranged in each of these through holes, and linear connection portions 105 are provided in various locations to connect these first portions 103 to the second portion 104.

[0115] The mask member 102 is placed so that the plurality of first portions 103 correspond to the base material 80 fitted into the plurality of recesses. The mask member 102 is placed so that the through-hole 106 is positioned directly above the third surface 72C of the base material 80.

[0116] One first portion 103 can be connected to the second portion 104 by two or more connecting portions 105. The two or more connecting portions 105 include a connecting portion 105 that connects one side of the outer edge of the first portion 103 (hereinafter referred to as the first side) to one side of the second portion 104 opposite the first side, and a connecting portion 105 that connects a side of the outer edge of the first portion 103 opposite the first side (hereinafter referred to as the second side) to one side of the second portion 104 opposite the second side. In other words, the two or more connecting portions 105 include connecting portions 105 that connect each of the opposing sides of the first portion 103 to the second portion 104.

[0117] More preferably, the two or more connecting portions 105 include a connecting portion 105 that connects a side of the outer edge of the first portion 103 that is different from the first side and the second side (hereinafter referred to as the third side) to a side of the second portion 104 that faces the third side, and a connecting portion 105 that connects a side of the outer edge of the first portion 103 that is opposite the third side (hereinafter referred to as the fourth side) to a side of the second portion 104 that faces the fourth side. By having four connecting portions 105, the force that holds the first portion 103 to the second portion 104 is increased.

[0118] The width of connecting portion 105 connected to the side of first portion 103 in the direction along this side is 50 μm or more and 200 μm or less. This width should be the minimum width sufficient to stably hold first portion 103. Furthermore, if it is desired to provide metal pattern 74 directly below connecting portion 105 and form metal pattern 74 in a connected shape, it is better not to make this width too large.

[0119] The distance from the first portion 103 to the second portion 104 (the width of the through hole 106) is smaller than the width from the inner edge to the outer edge of the third surface 72C of the sealing member 70. The width of the through hole 106 can be 100 μm or more and 340 μm or less. One or more through holes 106 are formed between the second portion 104 and one of the first portions 103 so as to surround the first portion 103, except for the portion where the connection portion 105 is connected to the first portion 103. The one or more through holes 106 are formed at a constant width from the outer edge of the first portion 103.

[0120] The shape of the first portion 103 is larger than the shape defined by the inner edge of the third surface 72C (hereinafter referred to as the first shape). The mask member 102 is placed so that the first portion 103 covers the second surface 71B of the base material 80 in a top view. The mask member 102 is placed so that the first portion 103 covers a portion of the third surface 72C along the inner edge of the third surface 72C of the base material 80 in a top view. The first portion 103 covers the third surface 72C in a range of 30 μm to 150 μm from the outer edge of the first shape. By ensuring a width of 30 μm or more from the inner edge of the third surface 72C, the mask member 102 can more easily cover the first shape even if some misalignment occurs during the manufacturing process.

[0121] The combined shape of the first portion 103 and the through hole 106 provided to surround this first portion 103 is smaller than the shape defined by the outer edge of the third surface 72C (hereinafter referred to as the second shape). In a top view, the mask member 102 is placed so that the second portion 104 covers a portion of the third surface 72C along the outer edge of the third surface 72C of the base material 80. The second portion 104 covers the third surface 72C in an area ranging from 30 μm to 150 μm from the outer edge of the second shape.

[0122] The direction in which the connection portion 105 connected to the first side extends from the first portion 103 to the second portion 104 is parallel to and opposite to the direction in which the connection portion 105 connected to the second side extends from the first portion 103 to the second portion 104.

[0123] The direction in which the connecting portion 105 connected to the third side extends from the first portion 103 to the second portion 104 is parallel to and opposite to the direction in which the connecting portion 105 connected to the fourth side extends from the first portion 103 to the second portion 104.

[0124] The direction in which the connecting portion 105 connected to the first side extends from the first portion 103 to the second portion 104 and the direction in which the connecting portion 105 connected to the third side extends from the first portion 103 to the second portion 104 are not parallel to each other but form a predetermined angle other than 0 degrees or 180 degrees. This predetermined angle is between 45 degrees and 135 degrees. Alternatively, this predetermined angle is an angle range in which the value obtained by dividing 360 degrees by the number of sides in the shape of the first portion 103 varies within a range of ±1 / 2 of this value. For example, if the first portion 103 has a rectangular shape, the number of sides is four, and the range of ±45 degrees, which is half of 90 degrees, is between 45 degrees and 135 degrees. In the illustrated mask member 102, this predetermined angle is 90 degrees.

[0125] In a seventh step, the metal pattern 74 is provided on the base material 80 through the through-holes 106 formed in the mask member 102. The metal pattern 74 is formed on the surface of the base material 80 by, for example, sputtering. This results in the sealing member 70 having the metal pattern 74 formed thereon (see FIG. 16I).

[0126] The shape of the metal pattern 74 formed in the base material 80 depends on the shape of the through-hole 106. By adjusting the width of the connection portion 105 and the film-forming conditions when forming the metal pattern 74, the metal pattern 74 can also be provided directly below the connection portion 105, thereby forming a continuous metal pattern 74. The portion of the metal pattern 74 formed directly below the connection portion 105 can become the thin portion 74A of the sealing member 70. After the seventh step, the sealing member 70 shown in FIG. 6 is manufactured.

[0127] This manufacturing method allows the metal patterns 74 to be formed on multiple base materials 80 at once, thereby improving the productivity of the sealing member 70. This effect can be said to be an effect that can occur in conjunction with or independently of suppressing bonding material overflow and improving device reliability. In other words, the manufacturing method for the sealing member 70 may be established as an invention that does not necessarily require the effects of suppressing bonding material overflow and improving device reliability.

[0128] 17 and 18 are cross-sectional images showing the bonding between the mounting substrate 10 and the sealing member 70 in the light emitting device 1. Fig. 17 is an image of a cross section passing through the thin portion 74A of the sealing member 70, and Fig. 18 is an image of a cross section passing through a portion of the sealing member 70 that is not the thin portion 74A. As both figures show, bonding portion 90 is formed between the first metal pattern 16A and the metal pattern 74 both in the thin portion 74A and in the portion that is not the thin portion 74A, and stable bonding is achieved in both cases.

[0129] The joints 90 are provided between the first metal pattern 16A and the metal pattern 74, between the first metal pattern 16A and the second metal pattern 16B, and between the first metal pattern 16A and the third metal pattern 16C. The joints 90 may also be provided between the second metal pattern 16B and the metal pattern 74. The joints 90 may also be provided between the third metal pattern 16C and the metal pattern 74.

[0130] Although the above describes various embodiments of the present invention, the light-emitting device according to the present invention is not strictly limited to the light-emitting device of each embodiment. In other words, the present invention can be realized without being limited to the external shape and structure of the light-emitting device disclosed in each embodiment. The present invention can be applied without necessarily including all necessary and sufficient components. For example, if the claims do not recite some of the components of the light-emitting device disclosed in the embodiments, the claims allow for the design freedom of those components by those skilled in the art, such as substitution, omission, modification of shape, and change of material, and specify that the invention described in the claims applies. [Industrial Applicability]

[0131] The light emitting device described in each embodiment can be used in head-mounted devices, head-mounted displays, projectors, vehicle headlights, lighting, displays, and the like. [Explanation of symbols]

[0132] 1. Light-emitting device 10 Mounting board 11 Top side 13 First Implementation Area 14 Wiring Pattern 15 Second implementation area 16 Metal Pattern 16A First metal pattern 16B Second metal pattern 16C Third metal pattern 20 Light-emitting element 20A First light-emitting element 20B Second light-emitting element 20C Third light-emitting element 30 Submount 40 Protection element 40A First Protection Element 40B Second protection element 40C Third protection element 50 Temperature measuring element 60 Wiring 70 Sealing member 71 Upper 71A Top 71B Bottom side 72 Side wall 72A Inner side 72B External surface 72C Bottom 73 Concave 74 Metal Pattern 74A Thin part 80 Base material 90 Joint 101 Insertion substrate 102 Mask material 103 Part 1 104 Part 2 105 Connection 106 Through hole

Claims

1. preparing a mounting substrate having a mounting surface, a first metal pattern provided on the mounting surface side, a second metal pattern provided inside the first metal pattern on the mounting surface side, and a third metal pattern provided outside the first metal pattern on the mounting surface side; a step of arranging a light emitting element on the mounting surface of the mounting substrate; applying a bonding material to the first metal pattern; a step of bonding a sealing member having a fourth metal pattern provided with a width larger than that of the first metal pattern to at least the first metal pattern of the mounting substrate via the bonding material; A method for manufacturing a light emitting device, comprising:

2. 2. The manufacturing method according to claim 1, wherein the mounting substrate has the first metal pattern having a width of 100 μm or more and less than 200 μm, the second metal pattern having a width of more than 50 μm and less than 100 μm, and the third metal pattern having a width of more than 50 μm and less than 100 μm.

3. 3. The manufacturing method according to claim 1, wherein the second metal pattern is spaced apart from the first metal pattern by a distance of 30 μm to 200 μm, and the third metal pattern is spaced apart from the first metal pattern by a distance of 30 μm to 200 μm.

4. 4. The manufacturing method according to claim 1, wherein the sum of the width of the first metal pattern, the width of the second metal pattern, the width of the third metal pattern, the distance from the first metal pattern to the second metal pattern, and the distance from the first metal pattern to the third metal pattern is 500 μm or less.

5. The step of joining the sealing member includes:

5. The manufacturing method according to claim 1, wherein the fourth metal pattern is arranged so as to overlap the entire first metal pattern and also overlap a portion of the second metal pattern and a portion of the third metal pattern, and the sealing member and the mounting substrate are joined together.

6. a mounting substrate having a mounting surface, a first metal pattern provided on the mounting surface side, a second metal pattern provided inside the first metal pattern on the mounting surface side, and a third metal pattern provided outside the first metal pattern on the mounting surface side; a light-emitting element disposed on the mounting surface; a sealing member having a fourth metal pattern provided with a width larger than a width of the first metal pattern and bonded to at least the first metal pattern of the mounting substrate via a bonding material; A light emitting device comprising:

7. 7. The light emitting device according to claim 6, wherein the mounting substrate has the first metal pattern having a width of 100 μm or more and less than 200 μm, the second metal pattern having a width of more than 50 μm and less than 100 μm, and the third metal pattern having a width of more than 50 μm and less than 100 μm.

8. The light emitting device according to claim 6 , wherein the width of the second metal pattern is the same as the width of the third metal pattern.

9. 9. The light emitting device according to claim 6, wherein the second metal pattern is separated from the first metal pattern by a distance of 30 μm or more and 200 μm or less, and the third metal pattern is separated from the first metal pattern by a distance of 30 μm or more and 200 μm or less.

10. 10. The light-emitting device according to claim 6, wherein the sum of the width of the first metal pattern, the width of the second metal pattern, the width of the third metal pattern, the distance from the first metal pattern to the second metal pattern, and the distance from the first metal pattern to the third metal pattern is 500 μm or less.

11. 11. The light-emitting device according to claim 6, wherein the sealing member has a fourth metal pattern that is wider than the first metal pattern, and the fourth metal pattern is arranged so as to overlap all of the first metal pattern and also overlap part of the second metal pattern and part of the third metal pattern, and is bonded to the mounting substrate.

12. a bonding portion interposed between the mounting substrate and the sealing member, the bonding portion being formed by hardening a bonding material; 12. The light emitting device according to claim 11, wherein the joints are provided between the first metal pattern and the fourth metal pattern, between the first metal pattern and the second metal pattern, and between the first metal pattern and the third metal pattern.

13. the sealing member has a joining surface; the fourth metal pattern is provided on the bonding surface with a width smaller than that of the bonding surface; The light emitting device according to claim 12 , wherein the bonding portion is formed so as not to protrude from the bonding surface.

14. A light-emitting device as described in any one of claims 6 to 13, wherein the fourth metal pattern has a thin portion.

Images