Information processing system, information processing device, information processing method and program

Abstract

To easily predict an impedance trajectory in accordance with a temperature.SOLUTION: An information processing system 1 comprises: model generation means 282 that generates an impedance temperature variation model on the basis of impedance calculated for each frequency at each of the prescribed number of set temperatures; impedance trajectory prediction means 283 that predicts a first impedance trajectory at a non-set temperature on the basis of the impedance temperature variation model; and determination means 372 that determines an abnormal state of a circuit module 11 on the basis of a second impedance trajectory indicative of frequency dependence of impedance of the circuit module 11, and the first impedance trajectory.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to an information processing system, an information processing device, an information processing method, and a program. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there is known a technique for applying an AC voltage to an electric circuit, measuring the impedance, and determining the deterioration of an electric device based on the measured impedance.

[0003] For example, Patent Document 1 discloses a technology for determining deterioration by applying an AC voltage to a circuit module of an electrical device, measuring the impedance, and estimating the parameters of the circuit module represented as an equivalent circuit based on the measured impedance. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-21718 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the technology described in Patent Document 1, the parameters of the equivalent circuit include information about temperature, and in order to calculate the parameters of the equivalent circuit at various temperatures, it was necessary to calculate the impedance in advance by finely changing the temperature. As such, it required a large workload and was not easy to grasp in advance the impedance locus that shows the frequency dependency of the impedance according to the temperature of an electrical device.

[0006] In view of the above circumstances, an object of the present disclosure is to provide an information processing system, an information processing device, an information processing method, and a program that can easily predict the impedance locus of an electrical device according to the temperature. [Means for solving the problem]

[0007] An information processing system according to an embodiment of the present invention includes: a model generating means for generating an impedance temperature change model that outputs a temperature change of the impedance for each frequency based on the impedance of the circuit module calculated for each frequency at each of a predetermined number of set temperatures; an impedance locus prediction means for predicting a first impedance locus that indicates frequency dependency of impedance at an unset temperature different from the set temperature based on the impedance temperature change model; an impedance locus calculation means for calculating a second impedance locus that indicates the frequency dependency of the impedance of the circuit module; a determination means for determining an abnormal state of the circuit module based on the first impedance locus and the second impedance locus; Equipped with.

[0008] An information processing device according to an embodiment of the present invention includes: a model generating means for generating an impedance temperature change model that outputs a temperature change of the impedance for each frequency based on the impedance of the circuit module calculated for each frequency at each of a predetermined number of set temperatures; an impedance locus prediction means for predicting a first impedance locus that indicates frequency dependency of impedance at an unset temperature different from the set temperature based on the impedance temperature change model; Equipped with.

[0009] An information processing method according to an embodiment of the present invention includes: An information processing method executed by an information processing device, generating an impedance temperature change model that outputs a temperature change of the impedance for each frequency based on the impedance of the circuit module calculated for each frequency at each of a predetermined number of set temperatures; predicting a first impedance locus that indicates frequency dependency of impedance at an unset temperature that is different from the set temperature based on the impedance temperature change model; Includes:

[0010] A program according to an embodiment of the present invention includes: An information processing device a model generating means for generating an impedance temperature change model that outputs a temperature change of the impedance for each frequency based on the impedance of the circuit module calculated for each frequency at each of a predetermined number of set temperatures; an impedance locus prediction means for predicting a first impedance locus that indicates frequency dependency of impedance at an unset temperature different from the set temperature based on the impedance temperature change model; Function as. [Effects of the Invention]

[0011] According to the present disclosure, it is possible to provide an information processing system, an information processing device, an information processing method, and a program that can easily predict the impedance locus of an electrical device according to the temperature. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a diagram showing a schematic configuration of an information processing system according to an embodiment of the present invention. [Figure 2] FIG. 2 is a diagram showing a schematic configuration of the electrical device shown in FIG. [Figure 3] FIG. 3 is a block diagram showing a schematic configuration of the information processing device shown in FIGS. 1 and 2. [Figure 4] FIG. 3 is a block diagram showing a schematic configuration of the determination device shown in FIGS. 1 and 2. [Figure 5] FIG. 2 is a block diagram showing a schematic configuration of the terminal device shown in FIG. [Figure 6] 3 is a diagram showing an example of an impedance locus of the circuit module shown in FIG. 2 as it changes with temperature. FIG. [Figure 7]3 is a diagram showing another example of the impedance locus of the circuit module shown in FIG. 2 for each frequency. FIG. [Figure 8] FIG. 8 is a diagram showing absolute values ​​and angles of impedance extracted for each frequency from the impedance locus shown in FIG. 7. [Figure 9] FIG. 10 is a diagram showing an example of an impedance locus predicted using a temperature change model. [Figure 10] 10 is a flowchart showing an example of the operation of an information processing device according to an embodiment of the present invention. [Figure 11] 11 is a flowchart showing a detailed example of the operation of generating a temperature change model shown in FIG. 10. [Figure 12] 4 is a flowchart illustrating an example of an operation of the determination device according to one embodiment of the present invention. [Figure 13A] FIG. 10 is a diagram showing an example of test data that is an impedance locus of a circuit module in a normal state. [Figure 13B] FIG. 10 is a diagram showing an example of test data that is an impedance locus of a circuit module in an abnormal state. [Figure 14A] FIG. 13B is a diagram showing an example of a determination result using the test data shown in FIG. 13A. [Figure 14B] FIG. 13C is a diagram showing an example of a determination result using the test data shown in FIG. 13B. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an embodiment of the present invention will be described.

[0014] An information processing system 1 according to one embodiment of the present invention will be described with reference to Fig. 1. The information processing system 1 is a system that determines an abnormal state of a circuit module 11 (see Fig. 2) included in an electric device 10. The information processing system 1 may be a system that determines an abnormal state of the electric device 10 based on the state of the circuit module 11.

[0015] As shown in FIG. 1, the information processing system 1 includes an information processing device 20, a determination device 30, and a terminal device 40. In the example shown in FIGS. 1 and 2, the information processing device 20 is incorporated into an electric device 10 including a circuit module 11 that is the target of abnormal state determination. Although FIGS. 1 and 2 show a configuration in which one information processing device 20 and one determination device 30 are incorporated into one electric device 10, a configuration in which multiple information processing devices 20 are incorporated into one electric device 10, or a configuration in which multiple determination devices 30 are incorporated into one electric device 10, may also be used. Furthermore, a configuration in which one or more information processing devices 20 are incorporated into each of the multiple electric devices 10, or a configuration in which one or more determination devices 30 are incorporated into each of the multiple electric devices 10 may also be used.

[0016] The information processing device 20 and the determination device 30 can communicate with each other. Furthermore, the information processing device 20 and the determination device 30 can communicate with the terminal device 40 via a network 50. The network 50 may be a network capable of wireless communication or a network capable of wired communication. Alternatively, the network 50 may be a network including both a network capable of wireless communication and a network capable of wired communication.

[0017] The electric device 10 is a device for which the information processing system 1 determines whether an abnormal state exists. The electric device 10 may be any device that operates using electricity. The electric device 10 may be any device incorporating a DC circuit, such as a programmable logic controller (PLC) that can control devices installed in a plant, a sensor, an inverter, or a monitoring computer.

[0018] As shown in Fig. 2, the electric device 10 includes circuit modules 11-1 to 11-N and a base board 12. When there is no need to particularly distinguish between the circuit modules 11-1 to 11-N (N is a positive integer), they may be simply referred to as circuit modules 11. Fig. 2 shows a case where the electric device 10 includes N circuit modules 11-1 to 11-N, but the number of circuit modules 11 included in the electric device 10 may be any number.

[0019] The circuit module 11 includes a circuit for realizing a specific function. The circuit module 11 may be, for example, a power supply module, a CPU (Central Processing Unit) module, an I / O module, an analog input module, a digital input module, or a motor control module. The circuit module 11 may include, as circuit components, resistors, capacitors, inductors, diodes, transistors, transformers, or the like.

[0020] The circuit module 11 is connected to the base board 12 via a power supply line 13 and a GND (Ground) line 14. The power supply line 13 is a wiring to which a DC voltage generated by the circuit module 11 or a DC voltage supplied to the circuit module 11 is applied. For example, if the circuit module 11-1 is a power supply module, the circuit module 11-1 is connected to the base board 12 via the power supply line 13 to which the DC voltage generated by the circuit module 11-1 is applied. Furthermore, for example, if the circuit module 11-2 is a CPU module, the circuit module 11-2 is connected to the base board 12 via the power supply line 13 to which the DC voltage supplied to the circuit module 11-2 is applied.

[0021] The base board 12 is electrically connected to each circuit module 11. The circuit modules 11 may be electrically connected to one another via the base board 12. For example, the circuit modules 11-1 and 11-2 may be electrically connected via the base board 12. In FIG. 2, only the power supply line 13 and the GND line 14 are shown as wiring connecting the circuit module 11 and the base board 12, but a signal line may also be included as wiring connecting the circuit module 11 and the base board 12.

[0022] 1 and 2 is a device that predicts an impedance locus that indicates frequency dependency of impedance for a circuit module 11 as shown in Fig. 2 in order to determine an abnormal state of the electric device 10. The information processing device 20 may be incorporated into the electric device 10 in advance, or may be incorporated as an add-on device into the electric device 10 after shipment.

[0023] 1 and 2 is a device that determines an abnormal state of the circuit module 11 included in the electric device 10. The determination device 30 may also be a device that determines an abnormal state of the electric device 10 based on the abnormal state of the circuit module 11. The determination device 30 may be incorporated in the electric device 10 in advance, or may be incorporated as an add-on device in the electric device 10 after shipment.

[0024] 2, the information processing device 20 is installed inside the electrical device 10 so as to be able to detect the voltage and current of the power supply line 13 connecting the circuit module 11-1 and the base board 12. In this case, the information processing device 20 can determine whether the circuit module 11-1 is in an abnormal state. The configuration shown in FIG. 2 is an example, and the information processing device 20 may be installed so as to be able to detect the voltage and current of the power supply line 13 connecting other circuit modules 11 and the base board 12. Furthermore, multiple information processing devices 20 may be installed inside the electrical device 10.

[0025] 2 shows a configuration in which the information processing device 20 and the determination device 30 are installed inside the electrical device 10, but the installation locations of the information processing device 20 and the determination device 30 are not limited to inside the electrical device 10. If it is possible to detect the voltage and current of the power supply line 13 connecting the circuit module 11, which is the target for determining an abnormal state, and the base board 12, one or more of the information processing device 20 and the determination device 30 may be installed outside the electrical device 10.

[0026] 1 , the terminal device 40 is a device that receives a determination result from the determination device 30. The determination result may be a result of the determination device 30 determining that the circuit module 11 is in an abnormal state, or may be a result of the determination device 30 determining that the electrical device 10 is in an abnormal state.

[0027] The terminal device 40 may be a general-purpose computer or a computer dedicated to the information processing system 1. When the terminal device 40 is a general-purpose computer, the terminal device 40 may be, for example, a smartphone, a tablet terminal, a notebook PC (Personal Computer), a desktop PC, or a server. The terminal device 40 receives the status information from the determination device 30, so that the operator of the terminal device 40 can know the abnormal state of the circuit module 11 or the electric device 10 even in a remote location from the electric device 10.

[0028] (Hardware configuration of information processing device) 3, the hardware configuration of the information processing device 20 will be described. The information processing device 20 includes an AC voltage application unit 21, a voltage detection unit 22, a current detection unit 23, a temperature setting unit 24, a filter 25, a communication unit 26, a storage unit 27, and a control unit 28.

[0029] The AC voltage application unit 21 is a voltage application means capable of applying an AC voltage to the power supply line 13. When the AC voltage application unit 21 applies an AC voltage to the power supply line 13, an AC current flows through the power supply line 13. The AC voltage application unit 21 may be a current application means capable of flowing an AC current through the power supply line 13. When the AC voltage application unit 21 flows an AC current through the power supply line 13, an AC voltage is applied to the power supply line 13. In other words, the same phenomenon occurs on the power supply line 13 whether the AC voltage application unit 21 applies an AC voltage to the power supply line 13 or whether the AC voltage application unit 21 flows an AC current through the power supply line 13. Therefore, the ability of the AC voltage application unit 21 to apply an AC voltage to the power supply line 13 is synonymous with the ability of the AC voltage application unit 21 to flow an AC current through the power supply line 13. Hereinafter, the description will be made assuming that the AC voltage application unit 21 applies an AC voltage to the power supply line 13. However, the same effect can be obtained if the AC voltage application unit 21 passes an AC current through the power supply line 13. This is because an AC voltage is ultimately applied to the power supply line 13 in this case as well.

[0030] The AC voltage application unit 21 includes a signal generator capable of generating an AC voltage. The AC voltage application unit 21 is connected to the power supply line 13 to which the circuit module 11 to be judged is connected and to the GND line 14 to which the circuit module 11 is connected. The AC voltage application unit 21 is capable of applying an AC voltage to the power supply line 13 to which the circuit module 11 to be judged is connected.

[0031] The voltage detection unit 22 is a voltage detection means capable of detecting the voltage of the power supply line 13. The voltage detection unit 22 may be any type of voltage sensor. The voltage detection unit 22 is connected between the power supply line 13 to which the circuit module 11 to be judged is connected and the GND line 14 to which the circuit module 11 to be judged is connected. The voltage detection unit 22 detects the voltage of the power supply line 13 to which the circuit module 11 to be judged is connected.

[0032] The current detection unit 23 is a current detection means capable of detecting the current flowing through the power supply line 13. The current detection unit 23 may be a current sensor of any type. The current detection unit 23 is connected to the power supply line 13 to which the circuit module 11 to be judged is connected. The current detection unit 23 detects the current flowing through the power supply line 13 to which the circuit module 11 to be judged is connected.

[0033] The temperature setting unit 24 is a temperature setting means capable of setting the temperature (set temperature) of the environment in which the electric device 10 is installed. Specifically, the temperature setting unit 24 may be a temperature setting means capable of setting the set temperature of the environment in which the circuit module 11 included in the electric device 10 is installed. For example, the temperature setting unit 24 can change the set temperature of the environment in which the electric device 10 is installed by changing the temperature of a thermostatic bath that houses the electric device 10 by any method. The range in which the set temperature is changed may be a range that is expected as the set temperature of the environment in which the electric device 10 is installed. The range in which the set temperature is changed may be, for example, a range of 10°C to 60°C.

[0034] The filter 25 is a filter capable of attenuating signals of frequency components outside a predetermined frequency range. The filter 25 may be, for example, a band-pass filter or a low-pass filter. The filter 25 attenuates frequency components outside a predetermined frequency range of the voltage generated on the power supply line 13 to which the circuit module 11 to be evaluated is connected. Here, the predetermined frequency range is the frequency range of the AC voltage applied to the power supply line 13 by the AC voltage application unit 21. For example, when the AC voltage application unit 21 applies AC voltages of multiple frequencies between 10 Hz and 100 kHz to the power supply line 13, the predetermined frequency range is 10 Hz to 100 kHz. The filter 25 may be connected in parallel between the power supply line 13 to which the circuit module 11 to be evaluated is connected and the GND line 14 to which the circuit module 11 to be evaluated is connected. The filter 25 may also be arranged, for example, before or after the AC voltage application unit 21. When arranged before the AC voltage application unit 21, the filter 25 may be a low-pass filter.

[0035] When filter 25 is a band-pass filter, filter 25 may be configured to switch between a plurality of band-pass filters. In this case, filter 25 may switch between the band-pass filters to be used depending on the frequency of the AC voltage that AC voltage application unit 21 applies to power line 13.

[0036] When filter 25 is a low-pass filter and the low-pass filter is placed in the front stage of AC voltage application unit 21, filter 25 can be configured with one low-pass filter. In this case, filter 25 can be realized with a simple configuration.

[0037] The communication unit 26 is one or more communication interfaces for communicating with external devices wirelessly or via wires. The communication unit 26 includes a communication interface for communicating with the determination device 30. The communication unit 26 includes a communication interface for communicating with the terminal device 40 via the network 50.

[0038] The storage unit 27 is one or more memories. In this embodiment, the "memory" is, for example, a semiconductor memory, a magnetic memory, an optical memory, or the like, but is not limited to these and can be any memory. The storage unit 27 may function as, for example, a main storage device, an auxiliary storage device, or a cache memory. The storage unit 27 is, for example, built into the information processing device 20, but can also be configured to be externally connected to the information processing device 20 via any interface.

[0039] The control unit 28 is one or more processors. In this embodiment, the "processor" may be a general-purpose processor, a dedicated processor specialized for a specific process, or the like, but is not limited to these and may be any processor. The control unit 28 controls the overall operation of the information processing device 20. The operation of the information processing device 20 will be described in detail later.

[0040] (Hardware configuration of the determination device) 4, the hardware configuration of the determination device 30 will be described. The determination device 30 includes an AC voltage application unit 31, a voltage detection unit 32, a current detection unit 33, a filter 34, a communication unit 35, a storage unit 36, and a control unit 37. The hardware configurations of the AC voltage application unit 31, the voltage detection unit 32, the current detection unit 33, the filter 34, and the storage unit 36 ​​are the same as the hardware configurations of the AC voltage application unit 21, the voltage detection unit 22, the current detection unit 23, the filter 25, and the storage unit 27 described above, respectively.

[0041] The communication unit 35 is one or more communication interfaces for communicating with external devices wirelessly or via a wired connection. The communication unit 35 includes a communication interface for communicating with the information processing device 20. The communication unit 35 includes a communication interface for communicating with the terminal device 40 via the network 50.

[0042] The control unit 37 is one or more processors. The control unit 37 controls the overall operation of the determination device 30. The operation of the determination device 30 will be described in detail later.

[0043] In the above description, an example has been described in which the information processing device 20 and the determination device 30 are configured as separate entities, but the information processing device 20 and the determination device 30 may be configured as an integrated unit. In an example in which the information processing device 20 and the determination device 30 are configured as an integrated unit, the determination device 30 does not need to include the AC voltage application unit 31, the voltage detection unit 32, the current detection unit 33, the filter 34, the communication unit 35, and the storage unit 36, and may perform processing using the AC voltage application unit 21, the voltage detection unit 22, the current detection unit 23, the filter 25, the communication unit 26, and the storage unit 27 that are included in the information processing device 20.

[0044] The determination device 30 may further include a temperature measurement unit. In such a configuration, the temperature measurement unit is a temperature measurement means capable of measuring the temperature (measured temperature) of the environment in which the electric device 10 is installed. Specifically, the temperature measurement unit may be a temperature measurement means capable of setting the temperature of the environment in which the circuit module 11 included in the electric device 10 is installed. The temperature measurement unit may be a temperature sensor of any type.

[0045] (Hardware configuration of terminal device) 5, the hardware configuration of the terminal device 40 will be described. The terminal device 40 includes a communication unit 41, a storage unit 42, a display unit 43, and a control unit 44.

[0046] The communication unit 41 is one or more communication interfaces for communicating with external devices wirelessly or via a wired connection, and includes a communication interface for communicating with the information processing device 20 and the determination device 30 via a network 50.

[0047] The storage unit 42 is one or more memories. The storage unit 42 may function as, for example, a main storage device, an auxiliary storage device, or a cache memory. The storage unit 42 is, for example, built into the terminal device 40, but may also be configured to be externally connected to the terminal device 40 via any interface.

[0048] The display unit 43 is any display, and may be, for example, a liquid crystal display or an OEL (Organic Electro-luminescence) display.

[0049] The control unit 44 is one or more processors. The control unit 44 controls the overall operation of the terminal device 40. The operation of the terminal device 40 will be described in detail later.

[0050] (Software configuration of information processing device) The software configuration of the information processing device 20 will be described with reference to Fig. 3. One or more programs used to control the operation of the information processing device 20 are stored in the storage unit 27. When the one or more programs are read by the control unit 28, they cause the control unit 28 to function as impedance calculation means 281, model generation means 282, and impedance trajectory prediction means 283.

[0051] An overview of each means of the control unit 28 will be explained.

[0052] The impedance calculation means 281 is a means for calculating the impedance of the circuit module 11 for each frequency at each of a predetermined number of set temperatures based on the current and voltage of the power supply line 13 connected to the circuit module 11. The predetermined number is determined according to the type of function that approximates the relationship between the absolute value and argument of the impedance (complex number) and temperature, which will be described in detail later. For example, when a polynomial is used as the function, the predetermined number can be a number obtained by adding 1 or more to the degree of the function.

[0053] The model generation means 282 is means for generating an impedance temperature change model that outputs a temperature change in impedance for each frequency based on the impedance of the circuit module 11 calculated for each frequency at each of a predetermined number of set temperatures. The model generation means 282 may also be means for generating an impedance temperature change model based on the relationship between the temperature and the absolute value and argument of the impedance calculated by the impedance calculation means 281. Furthermore, the model generation means 282 may be means for generating an impedance temperature change model by approximating the relationship between the temperature and the absolute value and argument of the impedance calculated by the impedance calculation means 281 with a linear function, a nonlinear function, or a nonlinear model. The linear function may be a first-order function, and the nonlinear function may be any function (for example, a polynomial of any degree).

[0054] The impedance locus prediction means 283 is a means for predicting an impedance locus (first impedance locus) that indicates the frequency dependency of the impedance at an unset temperature that is different from the set temperature, based on the impedance temperature change model generated by the model generation means 282.

[0055] The operating characteristics of the circuit module 11 (load) of the electrical device 10 are determined by a combination of the power consumption of the load and the temperature of the environment in which the load is installed, so each means of the control unit 28 performs the operations described in detail below for each load.

[0056] (Operation of information processing device) The following describes the operation of the information processing device 20. In this embodiment, the case where the information processing device 20 predicts the impedance locus of the circuit module 11-1 will be described as an example.

[0057] The temperature setting unit 24 sets the temperature (set temperature) of the environment in which the circuit module 11-1 is installed. The temperature setting unit 24 sets the environment to each of a predetermined number of set temperatures, and the AC voltage application unit 21, the voltage detection unit 22, the current detection unit 23, the filter 25, and the impedance calculation means 281 perform the operations described below at each of the predetermined number of set temperatures.

[0058] Based on instructions from control unit 28, AC voltage application unit 21 applies AC voltages V of multiple frequencies to power supply line 13 while electrical device 10 is operating. When voltage V is applied to power supply line 13, an AC current I (hereinafter also simply referred to as "current I") flows through power supply line 13. The multiple frequencies applied by AC voltage application unit 21 may be frequencies that are set in advance as appropriate frequencies for measuring impedance Z of circuit module 11-1. For example, AC voltage application unit 21 applies AC voltages V of multiple frequencies within a frequency range of 10 Hz to 100 kHz to power supply line 13.

[0059] The impedance calculation means 281 calculates the impedance Z of the circuit module 11-1 for each of a predetermined number of set temperatures set by the temperature setting unit 24, based on the voltage V detected by the voltage detection unit 22 and the current I detected by the current detection unit 23, using the following formula (1): Z=V / I (1)

[0060] The impedance calculation means 281 may calculate the absolute value |Z| of the impedance Z of the circuit module 11-1 based on the amplitude |V| of the voltage V detected by the voltage detection unit 22 and the amplitude |I| of the current I detected by the current detection unit 23 using the following formula (2): |Z|=|V| / |I| (2)

[0061] In addition, the impedance calculation means 281 may calculate the phase θ of the impedance Z of the circuit module 11-1 based on the phase ArgV of the voltage V detected by the voltage detection unit 22 and the phase ArgI of the current I detected by the current detection unit 23 using the following formula (3): θ = ArgV - ArgI (3)

[0062] Fig. 6 is a diagram showing an example of an impedance locus indicating the frequency dependency of impedance at each of a predetermined number of set temperatures calculated by the impedance calculation means 281. In Fig. 6, the impedance locus is shown on a complex plane in which the horizontal axis indicates the real part of the impedance Re(Z) and the vertical axis indicates the imaginary part of the impedance -Im(Z). Furthermore, the points plotted in Fig. 6 are shown closer to black as the set temperature increases, and closer to white as the set temperature decreases.

[0063] As shown in Fig. 6, for example, when the set temperature is 15°C, the impedance changes with frequency, causing the impedance locus to form a circle on the complex plane. As the set temperature increases above 15°C, the impedance locus forms a larger circle on the complex plane, and at the highest set temperature of 60°C, the impedance locus forms the largest circle on the complex plane. In this way, the impedance locus depends on the set temperature.

[0064] Fig. 7 is a diagram showing another example of the impedance locus calculated by the impedance calculation means 281. In Fig. 7, the impedance locus is shown on a complex plane where the horizontal axis indicates the real part of the impedance Re(Z) and the vertical axis indicates the imaginary part of the impedance -Im(Z). In Fig. 7, points indicating impedance at the same frequency are shown with the same density. For example, the impedances indicated by points plotted in the range surrounded by the dashed line in Fig. 7 are all impedances at a frequency of 10 Hz, and take different values ​​depending on the set temperature.

[0065] The model generating means 282 generates an impedance temperature change model for estimating the temperature change of impedance for each frequency based on the impedance locus calculated by the impedance calculating means 281.

[0066] The inventors have found that when the frequency of the AC voltage V applied to the power line 13 is f, the absolute value of the impedance x T_f It was found that the distance from the origin to the point showing the impedance at temperature T and frequency f in FIG. 7 has the relationship shown in the following formula (4) with respect to the set temperature T. In formula (4), a f is x T_f ^ is the coefficient for the set temperature T at frequency f to calculate b f is x T_f ^ is the intercept for the set temperature T at frequency f to calculate x T_f The symbol ^ in ^ is x T_f The symbol above the symbol indicates the x T_f ^ = a f ×T+b f (4)

[0067] Furthermore, the inventors have found that when the frequency of the AC voltage V applied to the power supply line 13 is f, the deflection angle θ of the impedance T_f (In FIG. 7, the angle formed by the line connecting the origin and the point showing the impedance at temperature T and frequency f with the horizontal axis) has been found to have the relationship shown in the following formula (5) with respect to the set temperature T. In formula (5), c f is x T_f ^ is the coefficient for the set temperature T at frequency f to calculate d f is x T_f ^ is the intercept for the set temperature T at frequency f to calculate θ T_f The symbol ^ in ^ is θ T_f The symbol above the symbol indicates the θ T_f ^=c f ×T+d f (5)

[0068] The model generating means 282 calculates the absolute value x of the impedance indicated by the impedance locus calculated by the impedance calculating means 281. T_f and the angle θ T_fThe impedance temperature change model is generated based on the relationship between the absolute value and the argument of the impedance and the set temperature T. For this purpose, the model generation means 282 calculates the parameters of a function that approximates the relationship between the absolute value and the argument of the impedance and the set temperature (in this example, a f , b f , c f , and d f ) is calculated.

[0069] Specifically, first, the model generating means 282 calculates the absolute value x of the impedance at each set temperature T for each frequency f. T_f and the angle θ T_f Extract.

[0070] As an example, the model generating means 282 calculates the absolute value x of the impedance for two set temperatures T (for example, 20° C. and 50° C.). T_f and the angle θ T_f may be extracted.

[0071] As another example, the model generating means 282 may generate a model of the absolute value of the impedance x for more than two set temperatures T for each frequency. T_f and the angle θ T_f For example, as shown in FIG. 8, the model generating means 282 may extract the absolute value x 20_10 , x 21_10 , x 50_10 The model generating means 282 extracts the deflection angle θ at set temperatures of 20° C., 21° C., . . . , and 50° C. at a frequency of 10 Hz. 20_10 , θ 21_10 , , θ 50_10 Furthermore, the model generating means 282 extracts the absolute value x 20_100k , x 21_100k , x 50_100k The model generating means 282 extracts the argument θ at set temperatures of 20° C., 21° C., . . . , and 50° C. at a frequency of 100 kHz. 20_100k , θ 21_100k , , θ 50_100kExtract.

[0072] Although detailed description will be omitted, the model generating means 282 also generates the absolute value x for each frequency f other than 10 Hz and 100 kHz. T_f and the angle θ T_f may be extracted.

[0073] Then, for each frequency f, the model generating means 282 generates a temperature change model for a predetermined number of set temperatures T (two or more in this example) by using the set temperatures T and the impedance at the set temperatures T. Specifically, for each frequency f, the model generating means 282 generates a temperature change model for a predetermined number of set temperatures T (two or more in this example) by using the set temperatures T and the absolute value x of the impedance at the set temperatures T. T_f Using the coefficient a of Equation (4), for example, by the least squares method, f and intercept b f Furthermore, for each frequency f, the model generating means 282 calculates a relationship between the set temperature T and the argument θ of the impedance at the set temperature T for a predetermined number of set temperatures T (two or more in this example). T_f Using the coefficient c of Equation (5), for example, by the least squares method, f and intercept d f The model generating means 282 calculates the coefficient a f and intercept b f Equation (4) and the coefficient c f and intercept d f The temperature change model is represented by the following equation (5). The model generation means 282 uses machine learning to generate the coefficient a f , intercept b f , coefficient c f , and intercept d f may be calculated.

[0074] The storage unit 27 may store the temperature change model generated by the model generation means 282. Furthermore, the communication unit 26 may transmit the temperature change model generated by the model generation means 282 to one or more of the determination device 30 and the terminal device 40.

[0075] In the above example, the model generating means 282 calculates the absolute value x T_f and the angle θ T_f is generated by approximating the absolute value x T_f and the angle θ T_f may be generated by approximating the absolute value x T_f and the angle θ T_f A temperature change model may be generated by approximating the above with an arbitrary function of the set temperature T.

[0076] In addition, the absolute value x T_f and the angle θ T_f In the example where a temperature change model is generated by approximating x by a linear function of the set temperature T, the predetermined number is 2 or more. T_f and the angle θ T_f In an example in which a temperature change model is generated in which the impedance locus is approximated by a quadratic function of the set temperature T, the above-mentioned predetermined number is 3 or greater. The larger the predetermined number, the more accurately a temperature change model can be generated that can predict the impedance locus. Furthermore, the inventors have found that when the relationship between the absolute value and argument of the impedance and temperature is approximated by a linear function or a quadratic function, by setting the predetermined number to 5 or greater, it is possible to generate a temperature change model that can predict the impedance locus with a degree of accuracy desired in actual operation.

[0077] Also, the absolute value x T_f and the angle θ T_f To generate a temperature change model that approximates a quadratic function of the set temperature T, use the absolute value x T_f and the angle θ T_fAlthough this requires data at many set temperatures T compared to generating a temperature change model that approximates the impedance locus with a linear function of the set temperature T, it is possible to generate a temperature change model that predicts the impedance locus with high accuracy. Which function to use to approximate the temperature change model can be determined appropriately depending on the purpose, taking into account the workload of preparing data corresponding to the number of set temperatures T that are set to generate the temperature change model, the desired accuracy in predicting the impedance locus, etc.

[0078] The impedance locus prediction means 283 inputs an unset temperature into the temperature change model for each frequency generated by the model generation means 282, outputs the impedance at the unset temperature, and predicts the frequency dependency as an impedance locus (first impedance locus). The unset temperature is a temperature different from the set temperature when the temperature change model was generated. For example, the impedance locus prediction means 283 predicts the absolute value x T_f and the angle θ T_f The unset temperature is input into a temperature change model that approximates the temperature using a linear function, as shown in the above-mentioned formulas (4) and (5), and the impedance is output, and its frequency dependency can be predicted as the first impedance locus (see FIG. 9).

[0079] The storage unit 27 may store the first impedance locus predicted by the impedance locus prediction means 283. Furthermore, the communication unit 26 may transmit the first impedance locus predicted by the impedance locus prediction means 283 to one or more of the determination device 30 and the terminal device 40.

[0080] (Software configuration of the determination device) The software configuration of the determination device 30 will be described with reference to Fig. 4. One or more programs used to control the operation of the determination device 30 are stored in the storage unit 36. When the one or more programs are read by the control unit 37, the control unit 37 functions as an impedance locus calculation means 371 and a determination means 372.

[0081] The individual means of the control unit 37 will now be outlined.

[0082] The impedance locus calculation means 371 is a means for calculating an impedance locus (second impedance locus) that indicates the frequency dependency of the impedance of the circuit module 11.

[0083] The judgment means 372 is a means for judging an abnormal state of the circuit module 11 based on the impedance locus (second impedance locus) that indicates the frequency dependency of the impedance of the circuit module 11 calculated by the impedance locus calculation means 371 and the impedance locus (first impedance locus) predicted by the impedance locus prediction means 283.

[0084] (Operation of the determination device) The following describes the operation of the determination device 30. In this embodiment, the description will be given taking as an example a case where the determination device 30 determines whether the circuit module 11-1 is in an abnormal state.

[0085] The AC voltage application unit 31, voltage detection unit 32, current detection unit 33, and filter 34 of the determination device 30 operate in the same manner as the AC voltage application unit 21, voltage detection unit 22, current detection unit 23, and filter 25.

[0086] The impedance locus calculation means 371 calculates the impedance based on the voltage V and current I measured when AC voltages of multiple frequencies are applied to the circuit module 11-1. In this way, the impedance locus calculation means 371 calculates an impedance locus (second impedance locus) that indicates the frequency dependency of the impedance.

[0087] The determination means 372 then determines whether the circuit module 11-1 is in an abnormal state based on the impedance locus (second impedance locus) calculated by the impedance locus calculation means 371 and the impedance locus (first impedance locus) predicted by the impedance locus prediction means 283. Specifically, the determination means 372 may determine whether the circuit module 11-1 is in an abnormal state based on the difference between the first impedance locus and the second impedance locus.

[0088] For example, the determination means 372 may calculate a normality level that increases as the difference between the first impedance locus and the second impedance locus decreases, using a learning model trained by machine learning. The determination means 372 may then determine whether the normality level is equal to or greater than a threshold. If the determination means 372 determines that the normality level is equal to or greater than the threshold, it determines that the circuit module 11-1 is not in an abnormal state. If the determination means 372 determines that the normality level is less than the threshold, it determines that the circuit module 11-1 is in an abnormal state.

[0089] Similarly, the determining means 372 may determine the states of the circuit modules 11-2 to 11-N based on the temperature change models generated for the circuit modules 11-2 to 11-N, respectively.

[0090] Furthermore, the determination means 372 may determine whether the electric device 10 is in an abnormal state based on the states of one or more of the circuit modules 11-1 to 11-N included in the electric device 10. For example, if the determination means 372 determines that all of the one or more circuit modules 11 included in the electric device 10 are in a normal state, it determines that the electric device 10 is in a normal state. If the determination means 372 determines that any of the one or more circuit modules 11 included in the electric device 10 is in an abnormal state, it determines that the electric device 10 is in an abnormal state.

[0091] As described above, in a configuration in which the determination device 30 further includes a temperature measurement unit, the temperature measurement unit may measure the temperature (measured temperature) of the environment in which the circuit module 11-1 is installed when the AC voltage application unit 31, the voltage detection unit 32, the current detection unit 33, and the filter 34 are operating. The impedance locus calculation means 371 may then calculate an impedance locus (second impedance locus) at the measured temperature measured by the temperature measurement unit. In such a configuration, the determination means 372 may determine an abnormal state of the circuit module 11 based on the impedance locus (second impedance locus) that indicates the frequency dependency of the impedance of the circuit module 11, calculated by the impedance locus calculation means 371, and the impedance locus (first impedance locus) that is predicted by the impedance locus prediction means 283 when the measured temperature is the unset temperature.

[0092] As a result, for example, in the circuit module 11, when the difference between the change in impedance trajectory due to temperature change in a normal state and the change in impedance trajectory due to the progression of an abnormality is small (for example, when the difference between the impedance trajectory in a normal state when the environmental temperature is 30°C and the impedance trajectory in an abnormal state when the environmental temperature is 50°C is small), the occurrence of false detection can be suppressed by using the impedance trajectory (second impedance trajectory) at the measurement temperature measured by the temperature measurement unit.

[0093] (Software configuration of terminal device) The communication unit 41 receives the determination result determined by the determination device 30 from the determination device 30. The control unit 44 may cause the display unit 43 to display the received determination result. This allows the operator of the terminal device 40 to know the abnormal state of the electrical appliance 10 even in a remote location. The control unit 44 may also cause the storage unit 42 to store the received determination result.

[0094] The communication unit 41 receives the temperature change model generated by the information processing device 20 from the information processing device 20. The control unit 44 may cause the display unit 43 to display the received temperature change model, or may cause the storage unit 42 to store the same.

[0095] (Flowchart showing the operation of the information processing device) Next, the operation of the information processing device 20 according to one embodiment of the present invention will be described with reference to the flowchart shown in Fig. 10. The flowchart shown in Fig. 10 shows an information processing method executed by the information processing device 20 for generating a temperature change model of the impedance of the circuit module 11.

[0096] Step S101: The temperature setting unit 24 sets the set temperature of the environment in which the circuit module 11 is installed to one set temperature T out of a predetermined number of set temperatures T under the control of the control unit 28.

[0097] Step S102: Based on the control of the control unit 28, the AC voltage application unit 21 applies an AC voltage of one of the multiple frequencies f to be applied to the power line 13 to the power line 13 connected to the circuit module 11.

[0098] Step S103: The voltage detection unit 22 detects the voltage V of the power supply line 13. The current detection unit 23 detects the current I flowing through the power supply line 13.

[0099] Step S104: The control unit 28 calculates the impedance of the circuit module 11 that is the target of the determination, based on the voltage V detected by the voltage detection unit 22 and the current I detected by the current detection unit 23.

[0100] Step S105: The control unit 28 determines whether or not AC voltages of all frequencies f that are to be applied to the power line 13 have been applied to the power line 13. If it is determined that AC voltages of all frequencies have not been applied to the power line 13 (No in step S105), the control unit 28 proceeds to step S106. If it is determined that AC voltages of all frequencies have been applied to the power line 13 (Yes in step S105), the control unit 28 proceeds to step S107.

[0101] Step S106: The control unit 28 changes the frequency of the AC voltage to a frequency f of an AC voltage that has not yet been applied, among the multiple frequencies f of the AC voltages that are to be applied to the power line 13. After the frequency f is changed, the information processing device 20 returns to step S102.

[0102] Step S107: The control unit 28 generates an impedance locus that indicates the frequency dependency of the impedance of the circuit module 11 included in the electric device 10 at the set temperature.

[0103] Step S108: The control unit 28 determines whether or not the temperature setting unit 24 has set all the set temperatures of the environment in which the circuit module 11 is placed. If it is determined that all the set temperatures have not been set (No in step S108), the information processing device 20 proceeds to step S109. If it is determined that all the set temperatures have been set (Yes in step S108), the information processing device 20 proceeds to step S110.

[0104] Step S109: The temperature setting unit 24 changes the temperature of the environment in which the circuit module 11 is installed to a set temperature that has not yet been set among a predetermined number of set temperatures, based on the control of the control unit 28. When the set temperature is changed, the information processing device 20 returns to step S101.

[0105] Step S110: The control unit 28 generates an impedance temperature change model for estimating the temperature change of impedance for each frequency based on the frequency dependency of the impedance at a predetermined number of set temperatures.

[0106] Here, the details of the operation of the control unit 28 in step S110 to generate the impedance temperature change model will be described with reference to Fig. 11. Here, an example will be described in which the relationship between the absolute value and the argument and the temperature is approximated by a linear function.

[0107] Step S110-1: The control unit 28 uses the impedance locus for each of the predetermined number of set temperatures to extract the absolute value and argument of the impedance for each frequency at each of the predetermined number of set temperatures.

[0108] Step S110-2: The control unit 28 calculates the parameters of a function that approximates the relationship between the absolute value and argument of the impedance extracted in step S110-1 and the set temperature. In this example, the control unit 28 calculates the coefficient a f and intercept b f The control unit 28 also calculates the coefficient c in the formula (5) using the set temperature and the argument of the impedance at the set temperature. f and intercept d f is calculated as a parameter.

[0109] Returning to FIG. 10, the subsequent operations will now be described.

[0110] Step S111: The control unit 28 inputs an unset temperature, which is different from the set temperature, into the temperature change model for each frequency, and outputs the impedance at the unset temperature, thereby predicting an impedance locus (first impedance locus) that shows the frequency dependency of the impedance at the unset temperature.

[0111] After step S111, communication unit 26 may transmit the first impedance locus to one or more of determination device 30 and terminal device 40 under the control of control unit 28. Furthermore, storage unit 27 may store the first impedance locus under the control of control unit 28.

[0112] (Flowchart showing the operation of the determination device) Next, the operation of the determination device 30 according to one embodiment of the present invention will be described with reference to the flowchart shown in Fig. 12. The flowchart shown in Fig. 12 shows a determination method by which the determination device 30 determines whether the circuit module 11 is in an abnormal state.

[0113] Step S201: The AC voltage application unit 31 applies an AC voltage V to the power supply line 13 connected to the circuit module 11 under the control of the control unit 37.

[0114] Step S202: The voltage detection unit 32 detects the voltage of the power supply line 13. The current detection unit 33 detects the current flowing through the power supply line 13.

[0115] Step S203: The impedance calculation means 281 calculates the impedance of the circuit module 11 based on the voltage detected by the voltage detection unit 32 and the current detected by the current detection unit 33.

[0116] Step S204: The control unit 37 determines whether or not all of the AC voltages of the multiple frequencies that are to be applied to the power line 13 have been applied to the power line 13. If it is determined that AC voltages of all frequencies have not been applied to the power line 13 (No in step S204), the control unit 37 proceeds to step S205. If it is determined that AC voltages of all frequencies have been applied to the power line 13 (Yes in step S204), the control unit 37 proceeds to step S206.

[0117] Step S205: The control unit 37 changes the frequency of the AC voltage to a frequency f of an AC voltage that has not yet been applied, among the multiple frequencies f of the AC voltage to be applied to the power line 13. After the frequency f is changed, the determination device 30 returns to step S202.

[0118] Step S206: The control unit 37 generates an impedance locus (second impedance locus) that indicates the frequency dependency of the impedance in the circuit module 11.

[0119] Step S207: The control unit 37 calculates the normality level based on the impedance locus (second impedance locus) generated in step S206 and the impedance locus (first impedance locus) predicted by the information processing device 20.

[0120] Step S208: The control unit 37 determines whether the normality is equal to or greater than the threshold. If it is determined that the normality is equal to or greater than the threshold (Yes in step S208), the determination device 30 proceeds to step S209. If it is determined that the normality is less than the threshold (No in step S208), the determination device 30 proceeds to step S210.

[0121] Step S209: The control unit 37 determines that the circuit module 11 is not in an abnormal state.

[0122] Step S210: The control unit 37 determines whether the circuit module 11 is in an abnormal state.

[0123] After step S209 or step S210, the communication unit 35 may transmit the determination result for the circuit module 11 to the terminal device 40 under the control of the control unit 37. In addition, the storage unit 36 ​​may store the determination result for the circuit module 11 under the control of the control unit 37.

[0124] Furthermore, after step S209 or step S210, the control unit 37 may determine that the electric device 10 including the circuit module 11 is in an abnormal state based on the determination result of the circuit module 11. The communication unit 35 may transmit the determination result for the electric device 10 to the terminal device 40 under the control of the control unit 37. Furthermore, the storage unit 36 ​​may store the determination result for the electric device 10 under the control of the control unit 37.

[0125] (Verification results) Here, a description will be given of the verification results of the information processing system 1 of this embodiment. Specifically, the determination results performed by the determination device 30 of this embodiment using the impedance locus (first impedance locus) predicted by the information processing device 20 of this embodiment will be described with reference to FIGS. 13A, 13B, 14A, and 14B.

[0126] 13A is a diagram showing an example of normal test data indicating the impedance locus of a circuit module 11 confirmed to be in a normal state in this embodiment. FIG. 13B is a diagram showing an example of abnormal test data indicating the impedance locus of a circuit module 11 confirmed to be in an abnormal state in this embodiment.

[0127] The determination device 30 determined whether the circuit module 11 was in an abnormal state based on the impedance locus (first impedance locus) predicted by the information processing device 20 and the impedance locus (second impedance locus) calculated by the impedance locus calculation means 371 of the determination device 30, an example of which is shown in FIG. 13A. In this example, the threshold value is −0.15. As a result, as shown in FIG. 14A, the normality was calculated to be −0.15 or higher for all 40 pieces of normal test data, and accordingly, the circuit module 11 for all of the normal test data was determined to be in a normal state. In other words, it was confirmed that the information processing system 1 of this embodiment can obtain correct determination results.

[0128] Furthermore, the information processing system 1 determined the state of the circuit module 11 based on the impedance locus (first impedance locus) predicted by the information processing device 20 and the impedance locus (second impedance locus) calculated by the impedance locus calculation means 371 of the determination device 30, an example of which is shown in FIG. 13B. As a result, as shown in FIG. 14B, the normality level was calculated to be less than −0.15 for all 40 pieces of abnormal test data, and accordingly, the circuit module 11 for all of the abnormal test data was determined to be in an abnormal state. In other words, it was confirmed that the information processing system 1 of this embodiment can obtain correct determination results.

[0129] As described above, the information processing system 1 according to this embodiment includes a model generation unit 282 that generates an impedance temperature change model that outputs a temperature change in impedance for each frequency based on the impedance of the circuit module 11 calculated for each frequency at each of a predetermined number of set temperatures; an impedance locus prediction unit 283 that predicts a first impedance locus that indicates the frequency dependence of the impedance at an unset temperature different from the set temperature based on the impedance temperature change model; and a determination unit 372 that determines an abnormal state of the circuit module 11 based on a second impedance locus that indicates the frequency dependence of the impedance of the circuit module 11 and the first impedance locus. This allows the information processing system 1 to predict the impedance locus of the circuit module 11 according to the temperature without using an equivalent circuit. Furthermore, the information processing system 1 can predict the impedance locus at an arbitrary temperature using a temperature change model generated by calculating the impedance at a small number of set temperatures (e.g., five (two if a linear function is used, or three if a quadratic function is used)) rather than many set temperatures. Therefore, the information processing system 1 can easily predict the impedance locus without the need to set many set temperatures in advance. Accordingly, an abnormal state of the circuit module 11 can be easily determined.

[0130] The information processing device 20 according to the present embodiment also includes a model generation unit 282 that generates an impedance temperature change model that outputs a temperature change in impedance for each frequency based on the impedance of the circuit module 11 included in the electrical device 10, which is calculated for each frequency at each of a predetermined number of set temperatures, and an impedance locus prediction unit 283 that predicts a first impedance locus that indicates the frequency dependence of the impedance at an unset temperature different from the set temperature based on the impedance temperature change model. This allows the information processing system 1 to predict the impedance locus of the circuit module 11 according to the temperature without using an equivalent circuit. Furthermore, the information processing system 1 can predict the impedance locus at any temperature using a temperature change model generated by calculating the impedance at a small number of set temperatures (for example, five (two when a linear function is used, or three when a quadratic function is used)). Therefore, the information processing system 1 can easily predict the impedance locus without the need to set many set temperatures in advance.

[0131] Furthermore, the information processing device 20 according to this embodiment generates an impedance temperature change model based on the relationship between the absolute value and argument of the impedance and temperature, which allows the information processing device 20 to easily predict the impedance locus of the electric device 10 according to temperature with high accuracy.

[0132] (Variation) In addition, the information processing system 1 according to this embodiment may be combined with one or more of the configurations provided in the diagnostic system described in JP 2021-21718 A.

[0133] For example, the control unit 28 may further include a noise voltage detection means. In such a configuration, the noise voltage detection means may detect the magnitude of the noise voltage generated in the power line 13 while the electric device 10 is operating in an environment in which the electric device 10 is actually used, and store the detected magnitude in the storage unit 27. Alternatively, the magnitude of the noise voltage may be stored in advance in the storage unit 27 as a value determined according to the specifications of the electric device 10. Furthermore, the noise voltage detection means may calculate a value appropriate for the electric device 10 based on the noise voltages stored in the storage unit 27. In this case, the noise voltage detection means may calculate a value appropriate for the electric device 10 using a learning function based on the noise voltages stored in the storage unit 27, for example.

[0134] The control unit 37 may further include a noise voltage detection means. In such a configuration, the noise voltage detection means may detect the magnitude of the noise voltage generated on the power line 13 while the electric device 10 is operating in an environment in which the electric device 10 is actually used, and store the detected noise voltage in the storage unit 27. Alternatively, the magnitude of the noise voltage may be stored in advance in the storage unit 36 ​​as a value determined according to the specifications of the electric device 10. The noise voltage detection means may calculate a value appropriate for the electric device 10 based on the noise voltages stored in the storage unit 36. In this case, the noise voltage detection means may calculate a value appropriate for the electric device 10 using a learning function based on the noise voltages stored in the storage unit 27, for example.

[0135] The present disclosure has been described based on the drawings and examples, but those skilled in the art will be able to understand various aspects of the present disclosure based on the present disclosure. It should be noted that various variations and modifications can be easily made. It should be noted that the scope of the present disclosure includes all such modifications and variations. The functions contained in the above can be rearranged logically so as not to contradict each other, and multiple means or The steps can be combined into one or separated.

[0136] For example, the storage unit 42 of the terminal device 40 may store at least one of programs that cause the control unit 44 to function as the impedance calculation means 281, the model generation means 282, and the impedance trajectory prediction means 283. In this case, the terminal device 40 may execute the function of at least one of the means among the impedance calculation means 281, the model generation means 282, and the impedance trajectory prediction means 283, instead of the information processing device 20.

[0137] Furthermore, the storage unit 42 of the terminal device 40 may store at least one of a program that causes the control unit 44 to function as the impedance locus calculation means 371 and the determination means 372. In this case, the terminal device 40 may execute the function of at least one of the means of the impedance locus calculation means 371 and the determination means 372, instead of the information processing device 20.

[0138] In the above-described embodiment, one or more of the information processing device 20 and the determination device 30 may be configured integrally with the base board 12 of the electric device 10. [Explanation of symbols]

[0139] 1. Information Processing Systems 10 Electrical Equipment 11, 11-1, 11-2, 11-N circuit modules 12 Baseboard 13 Power Line 14 GND line 20 Information processing equipment 21 AC voltage application section 22 Voltage detection section 23 Current detection section 24 Temperature setting section 25 filters 26 Communications Department 27 Memory section 28 Control Unit 281 Impedance calculation method 282 Model Generation Method 283 Impedance trajectory prediction method 30 Information processing equipment 31 AC voltage application section 32 Voltage detection section 33 Current detection section 34 Filters 35 Communications Department 36 Memory section 37 Control Unit 371 Impedance locus calculation means 372 Judgment means 40 Terminal Equipment 41 Communications Department 42 Storage section 43 Display section 44 Control Unit 50 Network

Claims

1. a model generating means for generating an impedance temperature change model that outputs a temperature change of the impedance for each frequency based on the relationship between the absolute value and the argument of the impedance of the circuit module, which are calculated for each frequency at each of a predetermined number of set temperatures; an impedance locus prediction means for predicting a first impedance locus that indicates frequency dependency of impedance at an unset temperature different from the set temperature based on the impedance temperature change model; a determining means for determining an abnormal state of the circuit module based on a second impedance locus that indicates frequency dependency of the impedance of the circuit module and the first impedance locus; An information processing system comprising:

2. 2. The information processing system according to claim 1, wherein the model generating means generates the impedance temperature change model by approximating the relationship between the absolute value and the argument and the temperature with a linear function, a nonlinear function, or a nonlinear model.

3. a model generating means for generating an impedance temperature change model that outputs a temperature change of the impedance for each frequency based on the relationship between the absolute value and the argument of the impedance of the circuit module, which are calculated for each frequency at each of a predetermined number of set temperatures; an impedance locus prediction means for predicting a first impedance locus that indicates frequency dependency of impedance at an unset temperature different from the set temperature based on the impedance temperature change model; An information processing device comprising:

4. An information processing method executed by an information processing device, generating an impedance temperature change model that outputs a temperature change of the impedance for each frequency based on the relationship between temperature and the absolute value and argument of the impedance of the circuit module, which are calculated for each frequency at each of a predetermined number of set temperatures; predicting a first impedance locus that indicates frequency dependency of impedance at an unset temperature that is different from the set temperature based on the impedance temperature change model; An information processing method including:

5. An information processing device a model generating means for generating an impedance temperature change model that outputs a temperature change of the impedance for each frequency based on the relationship between the absolute value and the argument of the impedance of the circuit module, which are calculated for each frequency at each of a predetermined number of set temperatures; an impedance locus prediction means for predicting a first impedance locus that indicates frequency dependency of impedance at an unset temperature different from the set temperature based on the impedance temperature change model; A program that functions as a

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