Manufacturing method of electronic components

Abstract

To provide a method for manufacturing an electronic part that can eliminate blocking of laminated chips bonded with an adhesive component.SOLUTION: A method for manufacturing an electronic part includes a preparation step of preparing a first elastic sheet 20 that exhibits adhesiveness at TA°C, a preparation step of preparing a second elastic sheet 40, a preparation step of preparing a laminate chip 13 in which ceramic layers containing a component (A) exhibiting adhesiveness at TB°C are laminated in a thickness direction, a clamping step of clamping a plurality of laminate chips 13 adjacent in a planar direction from above and below in a direction perpendicular to the planar direction using the first elastic sheet 20 and the second elastic sheet 40, and a separation step of pressing the laminate chip 13 through at least one of the first elastic sheet 20 and the second elastic sheet 40 while maintaining the laminate chip 13 at a temperature T°C satisfying TA≤T≤TB, thereby separating the adjacent laminate chips 13 from each other.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing an electronic component. [Background technology]

[0002] Multilayer ceramic capacitors are generally manufactured through the following steps (a) to (e). (a) A step of forming a ceramic green sheet by thinly spreading a slurry containing ceramic powder and an organic binder. (b) A step of printing electrodes on the surfaces of the ceramic green sheets and then laminating and integrating a plurality of the ceramic green sheets to form a laminate of ceramic green sheets. (c) A step of cutting the laminate of ceramic green sheets lengthwise and crosswise to form a plurality of laminate chips. (d) A firing step of firing the laminated chip to obtain a chip. (e) A step of forming external electrodes on the end faces of this chip to obtain a multilayer ceramic capacitor.

[0003] Patent Document 1 discloses a method for manufacturing ceramic chip components, which includes the steps of: attaching an adhesive tape composed of an expandable base film and an adhesive layer formed on at least one side of the base film to a laminate of ceramic green sheets, and fixing the laminate of ceramic green sheets onto a base via the adhesive tape; cutting the laminate of ceramic green sheets fixed onto the base with a guillotine blade to form a plurality of green chips; and expanding the base film of the adhesive tape to increase the spacing between adjacent green chips. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-49512 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above step (c), generally, a laminate of ceramic green sheets is temporarily fixed on a sheet fixing base using adhesive tape, and the laminate is cut with a guillotine blade, and then the laminate chips are removed from the adhesive tape. Since cutting with a guillotine blade is usually performed in a heated atmosphere, there is a problem that the heated laminate chips may adhere to each other due to adhesive components such as organic binders.

[0006] The problem of blocking, in which laminate chips adhere to each other due to adhesive components, is a major factor in reducing yield during the manufacture of multilayer ceramic capacitors. In recent years, there has been a demand for smaller multilayer ceramic capacitors, making blocking an even greater problem. Thus, a method for more reliably eliminating blocking is desired when manufacturing electronic components such as multilayer ceramic capacitors.

[0007] The present invention has been made to solve the above-mentioned problems, and has as its object to provide a method for manufacturing electronic components that can eliminate blocking of laminated chips bonded with adhesive components. [Means for solving the problem]

[0008] The method for manufacturing an electronic component of the present invention includes a preparation step of preparing a first elastic sheet that exhibits adhesiveness at TA°C, a preparation step of preparing a second elastic sheet, and a laminate chip in which ceramic layers containing component (A) that exhibits adhesiveness at TB°C are stacked in the thickness direction; a clamping step of using the first elastic sheet and the second elastic sheet to clamp multiple laminate chips adjacent in the planar direction from above and below in a direction perpendicular to the planar direction; and a separation step of pressing the laminate chips through at least one of the first elastic sheet or the second elastic sheet while maintaining the laminate chips at a temperature T°C such that TA≦T≦TB, thereby separating adjacent multiple laminate chips from each other. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a method for manufacturing an electronic component that can eliminate blocking of a laminated chip bonded with an adhesive component. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic cross-sectional view showing an example of a mother block. [Figure 2] FIG. 2 is a schematic cross-sectional view showing a state in which a mother block held on a first elastic sheet is cut. [Figure 3] FIG. 3 is a schematic cross-sectional view showing a state in which a laminated chip is sandwiched between a first elastic sheet and a second elastic sheet. [Figure 4] FIG. 4 is a schematic cross-sectional view showing how a stacked chip sandwiched between a first elastic sheet and a second elastic sheet is moved to a break stage. [Figure 5] FIG. 5 is a schematic cross-sectional view showing an example of the separating step. DETAILED DESCRIPTION OF THE INVENTION

[0011] The method for manufacturing an electronic component of the present invention will be described below. Note that the present invention is not limited to the following configurations, and may be modified as appropriate without departing from the gist of the present invention. Furthermore, a combination of multiple individual preferred configurations described below also constitutes the present invention. Hereinafter, the method for manufacturing an electronic component of the present invention may be referred to as the manufacturing method of the present invention.

[0012] As an embodiment of the method for manufacturing an electronic component of the present invention, a multilayer ceramic capacitor will be described as an example. Note that the present invention can also be applied to multilayer ceramic electronic components other than multilayer ceramic capacitors. Examples of such multilayer ceramic electronic components include inductors, piezoelectric elements, thermistors, etc.

[0013] The method for manufacturing an electronic component of the present invention is characterized in that a laminate chip is sandwiched between a first elastic sheet and a second elastic sheet, and adjacent laminate chips are separated from each other by pressing the laminate chip through at least one of the first elastic sheet or the second elastic sheet while maintaining the laminate chip at a predetermined temperature T°C. Here, the first elastic sheet exhibits adhesiveness at TA°C, and the ceramic layer constituting the laminate chip contains a component (A) that exhibits adhesiveness at TB°C, and TA≦T≦TB.

[0014] First, the preparation step of preparing the first elastic sheet will be described.

[0015] The first elastic sheet has a layer of a temperature-sensitive adhesive that becomes adhesive when heated and loses its adhesiveness when cooled. The temperature (TA °C) at which the first elastic sheet becomes adhesive is not particularly limited, but in the manufacturing method of the present invention, it is preferably 30 °C or higher. More preferably, it is 40 °C or higher and 120 °C or lower. TA °C is preferably less than 65 °C, for example. The first elastic sheet becomes adhesive at TA °C or higher, and the first elastic sheet can hold the laminate chip. Note that the "temperature (TA °C) at which adhesiveness becomes adhesive" refers to the temperature at which adhesiveness changes rapidly, and the first elastic sheet may be slightly adhesive even below the temperature (TA °C) at which adhesiveness becomes adhesive.

[0016] The temperature at which the heat-sensitive adhesive exhibits adhesiveness is the lowest temperature at which the laminated chip can be attached to the first elastic sheet.

[0017] Examples of the temperature-sensitive adhesive include side-chain crystalline polymers.

[0018] The structure of the first elastic sheet is not particularly limited, but it is preferable that a layer of a temperature-sensitive adhesive is provided on a substrate, such as polyethylene terephthalate (PET).

[0019] The thickness of the substrate is not particularly limited, but is preferably 10 μm or more and 200 μm or less. The thickness of the heat-sensitive adhesive layer is not particularly limited, but is preferably 5 μm or more and 40 μm or less. The planar shape of the first elastic sheet is not particularly limited as long as it is larger than the stack chips to be separated.

[0020] Next, the preparation step of preparing the second elastic sheet will be described. The second elastic sheet may or may not have adhesive properties. The thickness of the second elastic sheet is not particularly limited, but is preferably 30 μm or more and 10,000 μm or less. The planar shape of the second elastic sheet is not particularly limited as long as it is larger than the stack chips to be separated. The second elastic sheet preferably has a hardness of 20° or more and 70° or less, where the hardness here means the hardness measured with a type A durometer conforming to JIS K 6253. The material from which the second elastic sheet is formed is not particularly limited.

[0021] Next, a preparation step for preparing a stacked chip will be described. The laminated chip is formed by laminating ceramic layers containing component (A) that exhibits adhesiveness at TB°C in the thickness direction. The laminated chip is produced by cutting a mother block, which is an assembly of multiple integrated laminated chips, into individual pieces.

[0022] The structure of the mother block will be described below with reference to Fig. 1. Fig. 1 is a schematic cross-sectional view showing an example of a mother block. As shown in Figure 1, the mother block 10 is composed of multiple laminated ceramic layers 11, with layered internal electrodes 12 embedded inside. The ceramic layers 11 can be formed by laminating dielectric sheets containing ceramic powder such as barium titanate and a component (A) that exhibits adhesiveness at TB°C, and a metal paste that will become the internal electrodes 12 is printed in a predetermined shape on some of the dielectric sheets. A certain margin is left between the internal electrodes 12, and the shortest distance is 10 µm.

[0023] Examples of the component (A) that exhibits adhesiveness at TB°C include organic binders. The organic binder is used to adjust the dispersibility of the ceramic powder. Examples of the organic binder include acrylic resins and polyvinyl butyral.

[0024] Organic binders and the like develop adhesive properties when heated. The temperature (TB°C) at which component (A) develops adhesive properties is preferably 50°C or higher, and more preferably 60°C or higher and 120°C or lower. In the manufacturing method of the present invention, the temperature TB°C at which component (A) develops adhesive properties is higher than the temperature TA°C at which the first elastic sheet develops adhesive properties. Preferably, the difference between TA and TB is 20°C or higher. The difference between TA and TB is, for example, 70°C or lower.

[0025] The temperature at which component (A) exhibits adhesive properties is the lowest temperature at which laminate chips are bonded together by component (A).

[0026] The dielectric sheet is prepared by mixing ceramic powder such as barium titanate with component (A) such as an organic binder, a plasticizer, and an organic solvent using a ball mill or the like to obtain a slurry, which is then coated on the surface of a resin film and dried.

[0027] The method for applying the slurry is not particularly limited, but methods such as gravure coating, bar coating, spray coating, spin coating, air knife coating, roll coating, blade coating, gate roll coating, and die coating can be used.

[0028] The thickness of the dielectric sheet can be, for example, 0.5 μm or more and 3.0 μm or less, and dielectric sheets of various thicknesses can be used.

[0029] The dielectric sheets are peeled off from the resin film, and typically 5 to 2000 sheets are stacked to produce a mother block. The thickness of the internal electrodes can be, for example, 0.2 μm to 5 μm. The top and bottom surfaces of the mother block are made of dielectric sheets called outer layers, on which no internal electrodes are printed.

[0030] In the manufacturing method of the present invention, the laminate chips are preferably obtained by cutting the mother block held on the first elastic sheet with a cutting blade from the side opposite to the first elastic sheet. This is because, by cutting the mother block held on the first elastic sheet, the laminate chips are obtained adjacent to each other in a plane direction perpendicular to the thickness direction of the ceramic layer on the first elastic sheet, and can proceed directly to the clamping step.

[0031] The operation of cutting the mother block held on the first elastic sheet with the cutting blade will be described below with reference to FIG. 2 is a schematic cross-sectional view showing a state in which a mother block held on a first elastic sheet is cut. As shown in FIG. 2, after a first elastic sheet 20 is attached to one main surface of a mother block 10, the first elastic sheet 20 and the mother block 10 are placed on a cutting stage 30 with the first elastic sheet 20 facing downward. The cutting stage 30 is heated to a constant temperature, which is preferably higher than the TB°C, for example, 70°C or higher and 120°C or lower. Heating the cutting stage 30 softens the component (A) contained in the ceramic layer 11, making the mother block 10 easier to cut, and also develops adhesiveness in the first elastic sheet 20, allowing the mother block 10 to be held by the first elastic sheet 20.

[0032] The method for fixing the first elastic sheet 20 to the cutting stage 30 is not particularly limited, but the first elastic sheet 20 can be held on the cutting stage 30 by providing suction holes (not shown) in the thickness direction of the cutting stage 30 and sucking the first elastic sheet 20 through the suction holes from the underside of the cutting stage 30.

[0033] Next, the cutting blade CB is moved in the vertical direction VD and inserted into the mother block 10 from the side opposite the first elastic sheet 20. The vertical direction VD is parallel to the thickness direction. The edges of the mother block 10 are cut off, and the mother block 10 is cut while checking the positions of the exposed internal electrodes 12 and the cutting lines CL. After cutting, the position of the cutting blade CB or the cutting stage 30 is shifted in the horizontal direction HD by one laminate chip, and the mother block 10 is further cut. The horizontal direction HD is parallel to the surface direction. The above steps are repeated to cut from one end of the mother block 10 to the other. Then, the cutting stage 30 is rotated 90° in the horizontal direction HD to change the orientation of the mother block 10, and cutting is performed in the same manner to separate the mother block 10 into laminate chips.

[0034] The cutting blade CB may be a guillotine blade or the like that is normally used for cutting mother blocks. The cutting blade CB preferably has a cutting edge thickness of 0.03 mm or more and 0.08 mm or less.

[0035] The laminated chips separated by the procedure shown in FIG. 2 are preferably held by the first elastic sheet, and therefore do not shift in position or fly apart even when cut with a cutting blade.

[0036] Next, a clamping step is carried out in which a plurality of stacked chips adjacent in the planar direction are clamped from above and below in a direction perpendicular to the planar direction using a first elastic sheet and a second elastic sheet.

[0037] The procedure for sandwiching the laminate chip between the first elastic sheet and the second elastic sheet is not particularly limited. The laminate chips separated by the procedure shown in Fig. 2 are placed on the first elastic sheet adjacent to each other in a plane perpendicular to the thickness direction of the ceramic layer. Therefore, after preparing the laminate chip by the procedure shown in Fig. 2, it is preferable to bond a second elastic sheet to the other main surface of the laminate chip on the first elastic sheet. The laminate chips are preferably placed on the first elastic sheet adjacent to each other in a plane perpendicular to the thickness direction of the ceramic layer, but the cut surfaces of the laminate chips may be in contact with the first elastic sheet and the second elastic sheet.

[0038] 3 is a schematic cross-sectional view showing a state in which a laminate chip is sandwiched between a first elastic sheet and a second elastic sheet. As shown in FIG. 3, the sandwiching step can be performed by bonding a second elastic sheet 40 to the upper surface of the laminate chip 13 on the first elastic sheet 20. The sandwiching step can also be carried out by placing the laminate chip 13 on the second elastic sheet 40 and bonding the first elastic sheet 20 to the upper surface of the laminate chip 13 .

[0039] Next, a separation step is performed in which adjacent chips are separated from each other by pressing the chips via at least one of the first elastic sheet and the second elastic sheet while maintaining the chips at a temperature T°C where TA≦T≦TB. The separation step will be described below with reference to FIGS. 4 and 5.

[0040] Fig. 4 is a schematic cross-sectional view showing a state in which the laminated chip sandwiched between the first elastic sheet and the second elastic sheet is moved to a breaking stage, and Fig. 5 is a schematic cross-sectional view showing an example of a separating step. 4, it is preferable to move the first elastic sheet 20, the second elastic sheet 40, and the laminate chip 13 from the cutting stage 30 to the breaking stage 50 before the separating step. At that time, the first elastic sheet 20, the second elastic sheet 40, and the laminate chip 13 can be placed on the breaking stage 50 after rotating them 180° in the vertical direction VD so that the second elastic sheet 40 faces downward. The first elastic sheet 20, the second elastic sheet 40, and the laminate chip 13 may also be placed on the breaking stage 50 with the first elastic sheet 20 facing downward without rotating them in the vertical direction VD.

[0041] As shown in Fig. 5, the separation step can be performed by rotating and moving the roller 60 in the plane direction (horizontal direction HD) of the first elastic sheet 20 to press the laminate chip 13 via the first elastic sheet 20. The size of the roller 60 is not particularly limited, but it is preferable that the diameter be 2 mm or more and 100 mm or less. The pressing pressure by the roller 60 can be, for example, 0.1 MPa or more and 1.0 MPa or less. The movement speed of the roller 60 can be, for example, 10 mm / s or more and 200 mm / s or less.

[0042] The roller may be reciprocating. Alternatively, after pressing from one direction, the first elastic sheet, the laminate chip, and the second elastic sheet may be rotated 90° horizontally and pressed from the other direction. The pressing can be performed by means other than a roller, but it is preferable to perform the pressing by a roller.

[0043] 5, the laminate chips are pressed via the first elastic sheet, but the laminate chips may be pressed via the second elastic sheet. In this case, when the first elastic sheet, the second elastic sheet, and the laminate chips are moved from the cutting stage to the breaking stage, the first elastic sheet should be placed directly on the breaking stage.

[0044] By pressing the laminate chips via the first elastic sheet or the second elastic sheet, the laminate chips are pressed downward, creating gaps between adjacent laminate chips and separating the laminate chips bonded with component (A). At this time, the laminate chips are maintained at a temperature T°C, where TA≦T≦TB. This temperature T°C is above the temperature (TA°C) at which the first elastic sheet becomes adhesive, so the laminate chips are held by the first elastic sheet, but below the temperature (TB°C) at which component (A) becomes adhesive, so the laminate chips do not adhere to each other. In the separating step, it is preferable to press the laminate chips via the first elastic sheet.

[0045] The method for maintaining the temperature of the laminated chip at T°C in the separation step is not particularly limited. For example, a heater (not shown) can be placed in contact with the second elastic sheet, and the laminated chip can be maintained at T°C by the heat of the heater. The breaking stage itself may be heated, or the breaking stage may be heated by a heater or the like, or a heater may be embedded in a roller for heating, or a heater may be installed above the laminated chip in the thickness direction to heat the laminated chip.

[0046] After separating the laminate chips in the above-mentioned separation step, the laminate chips are separated from the second elastic sheet, and the first elastic sheet is cooled, etc., to separate the laminate chips from the first elastic sheet. The laminate chips are then fired, and a functional paste such as an external electrode paste is applied to the end surfaces to form functional films such as external electrodes, and the resulting product is fired to obtain a multilayer ceramic capacitor, etc. Alternatively, the external electrode paste may be applied to the end surfaces of the laminate chips and fired simultaneously with the laminate chips.

[0047] The present specification discloses the following:

[0048] <1> a preparation step of preparing a first elastic sheet that exhibits adhesiveness at TA°C; a preparation step of preparing a second elastic sheet; a preparation step of preparing a laminated chip in which ceramic layers containing a component (A) that exhibits adhesiveness at TB°C or higher are laminated in the thickness direction; a clamping step of clamping the plurality of laminated chips adjacent to each other in a planar direction from above and below in a direction perpendicular to the planar direction using the first elastic sheet and the second elastic sheet; and a separation step of separating adjacent plurality of the laminated chips from each other by pressing the laminated chips via at least one of the first elastic sheet or the second elastic sheet while maintaining the laminated chips at a temperature T°C such that TA≦T≦TB.

[0049] <2> The pressing is performed by a roller. <1> A method for manufacturing the electronic component according to claim 1.

[0050] <3> a heater is brought into contact with the second elastic sheet, and the separating step is carried out while the stacked chip is maintained at T°C by the heater. <1> or <2> A method for manufacturing the electronic component according to claim 1.

[0051] <4> The mother block held on the first elastic sheet is cut from the side opposite to the first elastic sheet with a cutting blade, thereby dividing the mother block into a plurality of adjacent laminated chips. <1> ~ <3> 10. A method for manufacturing an electronic component according to any one of the preceding claims.

[0052] <5> In the separating step, the first elastic sheet is pressed. <1> ~ <4> 10. A method for manufacturing an electronic component according to any one of the preceding claims.

[0053] <6> The difference between TA and TB is 20°C or more and 70°C or less <1> ~ <5> 10. A method for manufacturing an electronic component according to any one of the preceding claims.

[0054] <7> TA is 40℃ or higher and 120℃ or lower <1> ~ <6> 10. A method for manufacturing an electronic component according to any one of the preceding claims. [Example]

[0055] Hereinafter, examples will be given that more specifically disclose the method for manufacturing electronic components of the present invention, but the present invention is not limited to these examples.

[0056] Example 1 Barium titanate powder, an organic binder (component (A)) that develops adhesiveness at 65°C, a plasticizer, and an organic solvent were mixed to obtain a slurry. The slurry was then coated onto a resin film and dried to obtain a dielectric sheet. One hundred of the obtained dielectric sheets were stacked to obtain a mother block. A first elastic sheet (a sheet manufactured by Nitta Corporation, 115 μm thick) that develops adhesiveness at 45°C was attached to one main surface of the mother block, and the mother block and first elastic sheet were placed on a cutting stage with the first elastic sheet side facing downwards. The cutting stage was heated to 90°C, and the mother block was cut using a 0.03 mm thick cutting blade to obtain laminate chips measuring 0.6 mm x 0.3 mm (0603 size). Next, a second elastic sheet with a hardness of 20° and a thickness of 2000 μm was attached to the other main surface of the mother block that had been singulated into the laminated chip. The mother block was flipped upside down while sandwiched between the first elastic sheet and the second elastic sheet, and the mother block was moved from the cutting stage to the breaking stage. At this time, the first elastic sheet, mother block, and second elastic sheet were placed on the breaking stage with the second elastic sheet side facing down. While the breaking stage was heated to the temperature shown in Table 1, a roller having a diameter of 6 mm was pressed onto the first elastic sheet at a pressure of 0.5 MPa and a speed of 100 mm / s to separate the laminate chips.

[0057] Example 2 A mother block was produced and separated in the same manner as in Example 1, except that the organic binder was changed to one that exhibits adhesive properties at 50°C and the first elastic sheet was changed to one that exhibits adhesive properties at 30°C, and a roller was pressed against the mother block to separate the laminated chips.

[0058] The laminated chips pressed against the roller in Examples 1 and 2 were evaluated according to the following procedure. (Retention effect) The ratio of the number of laminate chips that had detached from the first elastic sheet to the total number of laminate chips was calculated. The number of laminate chips that had detached from the first elastic sheet was determined by visually counting the number of laminate chips remaining on the second elastic sheet when the first elastic sheet was lifted up. The laminate chips remaining on the second elastic sheet were laminate chips that had detached from the first elastic sheet. Evaluation was performed according to the following criteria. The results are shown in Tables 1 and 2. Good (Good): The number of laminate chips that came off the first elastic sheet was 0.1% or less. △ (Acceptable): The number of laminate chips that came off the first elastic sheet was more than 0.1% and 10% or less × (Fail) More than 10% of the laminate chips have come off the first elastic sheet

[0059] (Loosening effect) The percentage of laminate chips that were bonded to each other was calculated relative to the total number of laminate chips. The number of laminate chips that were bonded to each other was determined by removing all the laminate chips from the first elastic sheet and the second elastic sheet, sifting them through a nylon mesh sieve, and counting the number of laminate chips that remained on the sieve. All of the laminate chips that remained on the sieve were bonded to each other. Evaluation was performed according to the following criteria. The results are shown in Tables 1 and 2. Good: The percentage of stacked chips that are bonded together is 0.1% or less. △ (Acceptable): The percentage of laminated chips that are bonded together is more than 0.1% and 10% or less. × (Fail) - The percentage of stacked chips that are bonded together is more than 10%

[0060] [Table 1]

[0061] [Table 2]

[0062] As shown in Table 1, in Example 1, which used a first elastic sheet that exhibits adhesive strength at 45°C and an organic binder that exhibits adhesiveness at 65°C, adhesion between the laminate chips did not occur when the temperature of the laminate chips was above 45°C and below 65°C, and most of the laminate chips did not detach from the first elastic sheet. In particular, when the temperature of the laminate chips was above 50°C and below 60°C, adhesion between the laminate chips did not occur and the laminate chips did not detach from the first elastic sheet. As shown in Table 2, in Example 2, which used a first elastic sheet that exhibits adhesive strength at 30°C and an organic binder that exhibits adhesiveness at 50°C, adhesion between the laminate chips did not occur at temperatures above 30°C and below 50°C, and most of the laminate chips did not detach from the first elastic sheet. In particular, at a laminate chip temperature of 45°C, adhesion between the laminate chips did not occur, and the laminate chips did not detach from the first elastic sheet. [Explanation of symbols]

[0063] 10 Mother Block 11 ceramic layer 12 Internal electrode 13 Stacked chip 20 First elastic sheet 30 Cut Stage 40 Second elastic sheet 50 Break Stage 60 Laura CB Push Cutting Blade CL Cutting Line VD Up and down direction of cutting blade HD horizontal

Claims

1. a preparation step of preparing a first elastic sheet that exhibits adhesiveness at TA°C; a preparation step of preparing a second elastic sheet; a preparation step of preparing a laminate chip in which ceramic layers containing a component (A) that exhibits adhesiveness at TB°C are laminated in the thickness direction; a clamping step of clamping the plurality of stacked chips adjacent to each other in a planar direction from above and below in a direction perpendicular to the planar direction using the first elastic sheet and the second elastic sheet; a separation process for separating adjacent stacked chips from each other by pressing the stacked chips via at least one of the first elastic sheet or the second elastic sheet while maintaining the stacked chips at a temperature T°C such that TA≦T≦TB.

2. 2. The method for manufacturing an electronic component according to claim 1, wherein the pressing is performed by a roller.

3. 3. The method for manufacturing an electronic component according to claim 1, wherein the separating step is carried out while a heater is brought into contact with the second elastic sheet and the laminated chip is maintained at T[deg.] C. by the heater.

4. 3. The method for manufacturing an electronic component according to claim 1, wherein the mother block held on the first elastic sheet is separated into a plurality of adjacent laminated chips by cutting the mother block held on the first elastic sheet with a cutting blade from the side opposite the first elastic sheet.

5. 3. The method for manufacturing an electronic component according to claim 1, wherein the first elastic sheet is pressed in the separating step.

6. 3. The method for manufacturing an electronic component according to claim 1, wherein the difference between TA and TB is 20° C. or more and 70° C. or less.

7. 3. The method for producing an electronic component according to claim 1, wherein TA is 40° C. or higher and 120° C. or lower.

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