Substrate transport device, substrate transport method, and substrate processing system

Abstract

To provide a substrate conveying device, a substrate conveying method, and a substrate processing system that can convey a substrate to a conveyance position in a processing chamber with high position accuracy by using a planar motor.SOLUTION: A substrate conveying device conveying a substrate has: a conveying part 20 having a substrate holding part 50 that holds the substrate and a base 30 that has a magnet therein and moves the substrate holding part; a planar motor having a main body part, a plurality of electromagnetic coils arranged inside the main body part, and a linear driving part that supplies power to the electromagnetic coils and magnetically floats and linearly drives the base; a substrate detection sensor 60 that detects the substrate when the substrate held by the substrate holding part passes therethrough; and a conveyance control part 70 that operates the actual position of the substrate held by the substrate holding part based on detection data from the substrate detection sensor, calculates a correction value for a set logical position, and corrects a conveyance position of the substrate based on the correction value.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a substrate transport apparatus, a substrate transport method, and a substrate processing system. [Background technology]

[0002] For example, in a semiconductor manufacturing process, when processing semiconductor wafers, which are substrates, a substrate processing system is used that includes multiple processing chambers, a vacuum transfer chamber connected to the processing chambers, and a substrate transfer device installed in the vacuum transfer chamber.

[0003] Conventionally, transfer robots with articulated arms have been used as such substrate transfer devices (see, for example, Patent Document 1). However, the technology using transfer robots has problems such as gas intrusion through the vacuum seal and limitations on the movement of the transfer robot, so a substrate transfer device using a planar motor that utilizes magnetic levitation has been proposed as a technology that can solve these problems (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-168866 [Patent Document 2] Special Publication No. 2018-504784 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a substrate transfer apparatus, a substrate transfer method, and a substrate processing system that can transfer a substrate to a transfer position within a processing chamber with high positional accuracy using a planar motor. [Means for solving the problem]

[0006] A substrate transfer device according to one aspect of the present disclosure is provided in a transfer chamber connected to a processing chamber for processing a substrate, and transfers a substrate to a substrate placement section of the processing chamber. Department, inside The substrate holder has a magnet in the holder, and moves the substrate holder. Two base and a link mechanism connecting each of the bases to the substrate holder. a planar motor having a main body constituting the bottom wall of the transfer chamber, a plurality of electromagnetic coils arranged within the main body, and a linear drive unit that supplies power to the electromagnetic coils to magnetically levitate and linearly drive the base; a substrate detection sensor that is provided in the transfer chamber at a position corresponding to a substrate inlet / outlet to the processing chamber, and through which the substrate held in the substrate holding unit passes when being transferred to the substrate placement unit of the processing chamber and detects the substrate as it passes; and a transfer control unit that moves the base along the surface of the main body while magnetically levitating it based on detection data from the substrate detection sensor, calculates a correction value for a set logical position, corrects the transfer position of the substrate on the substrate placement unit in the processing chamber based on the correction value, and controls the linear drive unit so that the substrate is transferred to the corrected transfer position. [Effects of the Invention]

[0007] According to the present disclosure, there are provided a substrate transfer apparatus, a substrate transfer method, and a substrate processing system that can transfer a substrate to a transfer position within a processing chamber with high positional accuracy using a planar motor. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic plan view showing a substrate processing system according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view illustrating a transport unit and a planar motor in an example of a substrate transport device. [Figure 3] FIG. 1 is a perspective view illustrating the driving principle of a planar motor. [Figure 4] FIG. 10 is a side view for explaining the wafer detection sensor. [Figure 5] FIG. 2 is a block diagram for explaining a control system of the substrate transport device. [Figure 6] FIG. 10 is a plan view showing the logical center of the wafer on the end effector and the physical center of the wafer actually placed thereon. [Figure 7] 10 is a flowchart illustrating an example of a wafer transfer sequence in a transfer control unit. [Figure 8] FIG. 10 is a plan view showing a transport unit in another example of a substrate transport apparatus. [Figure 9] FIG. 10 is a side view showing a transport unit in another example of the substrate transport apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the accompanying drawings. FIG. 1 is a schematic plan view showing a substrate processing system according to an embodiment.

[0010] The substrate processing system 100 of this embodiment performs processing continuously on a plurality of substrates. The processing of the substrates is not particularly limited, and various processing such as film formation processing, etching processing, ashing processing, and cleaning processing can be cited. Although the substrate is not particularly limited, the following description will be given taking as an example a case where a semiconductor wafer (hereinafter simply referred to as a wafer) is used as the substrate.

[0011] As shown in FIG. 1, the substrate processing system 100 is a cluster structure (multi-chamber type) system and includes multiple processing devices 110, a vacuum transfer chamber 120, a load lock chamber 130, an atmospheric transfer chamber 140, a substrate transfer device 150, and a control unit 160.

[0012] The vacuum transfer chamber 120 has a rectangular planar shape, its interior is depressurized to a vacuum atmosphere, and multiple processing chambers 110 are connected to opposing wall sections on the long side via gate valves G. Two load lock chambers 130 are connected to one wall section on the short side of the vacuum transfer chamber 120 via gate valves G1. An atmospheric transfer chamber 140 is connected to the opposite side of the two load lock chambers 130 from the vacuum transfer chamber 120 via gate valves G2. In FIG. 1, the arrangement direction of the processing chambers 110 is the X direction, and the direction perpendicular to the X direction is the Y direction.

[0013] A substrate transfer device 150 in the vacuum transfer chamber 120 transfers a substrate, i.e., a wafer W, into and out of the processing chamber 110 and the load lock chamber 130. The substrate transfer device 150 includes a transfer unit 20 having an end effector 50, which is a wafer holder that actually holds the wafer W, and a wafer detection sensor 60. Details of the substrate transfer device 150 will be described later.

[0014] The processing chamber 110 and the vacuum transfer chamber 120 communicate with each other by opening the gate valve G, allowing the substrate transfer device 150 to transfer the wafer W therebetween, and are isolated from each other by closing the gate valve G. In addition, the load lock chamber 130 and the vacuum transfer chamber 120 communicate with each other by opening the gate valve G1, allowing the substrate transfer device 150 to transfer the wafer W therebetween, and are isolated from each other by closing the gate valve G1.

[0015] The processing chamber 110 has a mounting table 111 on which a wafer W is placed, and with the interior depressurized to a vacuum atmosphere, the wafer W placed on the mounting table 111 is subjected to a desired process (film formation process, etching process, ashing process, cleaning process, etc.).

[0016] The load lock chamber 130 has a mounting table 131 on which a wafer W is placed, and controls the pressure between atmospheric pressure and vacuum when transferring the wafer W between the atmospheric transfer chamber 140 and the vacuum transfer chamber 120.

[0017] The atmospheric transfer chamber 140 has an atmospheric atmosphere, and for example, a downflow of clean air is generated. A load port (not shown) is provided on a wall surface of the atmospheric transfer chamber 140. The load port is configured to be connected to a carrier (not shown) containing a wafer W or an empty carrier. For example, a FOUP (Front Opening Unified Pod) or the like can be used as the carrier.

[0018] An atmospheric transfer device (not shown) for transferring a wafer W is provided inside the atmospheric transfer chamber 140. The atmospheric transfer device removes a wafer W accommodated in a load port (not shown) and places it on a mounting table 131 in the load lock chamber 130, or removes a wafer W placed on the mounting table 131 in the load lock chamber 130 and places it in the load port. The load lock chamber 130 and the atmospheric transfer chamber 140 are communicated with each other by opening a gate valve G2, allowing the wafer W to be transferred by the atmospheric transfer device, and are isolated by closing the gate valve.

[0019] The control unit 160 is configured as a computer and includes a main control unit with a CPU, an input device, an output device, a display device, and a storage device (storage medium). The main control unit controls the operation of each component of the substrate processing system 100. For example, it controls the processing of wafers W in each processing chamber 110, the opening and closing of gate valves G, G1, and G2, etc. The control of each component by the main control unit is performed based on a processing recipe, which is a control program stored in a storage medium (hard disk, optical disk, semiconductor memory, etc.) built into the storage device.

[0020] In this embodiment, the control unit 160 controls a transfer control unit 70 that is part of the substrate transfer device 150. The transfer control unit 70 will be described together with the description of the substrate transfer device 150 below.

[0021] Next, an example of the operation of the substrate processing system 100 will be described. Here, as an example of the operation of the substrate processing system 100, an operation will be described in which a wafer W accommodated in a carrier attached to a load port is processed in the processing chamber 110 and then accommodated in an empty carrier attached to the load port. The following operation is executed based on a processing recipe of the control unit 160.

[0022] First, a wafer W is removed from a carrier connected to a load port by an atmospheric transfer device (not shown) in the atmospheric transfer chamber 140, and the gate valve G2 is opened to load the wafer W into the load lock chamber 130, which is in an atmospheric atmosphere. After the gate valve G2 is closed, the load lock chamber 130 into which the wafer W has been loaded is placed in a vacuum state corresponding to that of the vacuum transfer chamber 120. Next, the corresponding gate valve G1 is opened, and the wafer W in the load lock chamber 130 is removed by the end effector 50 of the transfer unit 20, and the gate valve G1 is closed. Next, the gate valve G corresponding to one of the processing chambers 110 is opened, and the end effector 50 loads the wafer W into that processing chamber 110 and places it on the mounting table 111. After the end effector 50 is retracted from that processing chamber 110 and the gate valve G is closed, processing such as film formation is performed in that processing chamber 110.

[0023] After processing in the processing chamber 110 is completed, the corresponding gate valve G is opened, and the end effector 50 of the transfer unit 20 removes the wafer W from that processing chamber 110. Then, after closing the gate valve G, the gate valve G1 is opened, and the wafer W held by the end effector 50 is transferred to the load lock chamber 130. Thereafter, the gate valve G1 is closed, and the load lock chamber 130 into which the wafer W has been transferred is filled with the atmosphere. Thereafter, the gate valve G2 is opened, and the wafer W is removed from the load lock chamber 130 by an atmospheric transfer device (not shown), and stored in a carrier (neither of which is shown) of a load port.

[0024] The above processing is performed simultaneously in parallel on a plurality of wafers W, and processing is completed for all wafers W in the carrier.

[0025] In the above description, a parallel transfer is performed in which the substrate transfer device 150 transfers a wafer W to one of the processing chambers 110, and while the wafer W is being transferred in that processing chamber 110, another wafer W is transferred to another processing chamber 110. However, the present invention is not limited to this. For example, a serial transfer may be performed in which one wafer W is transferred sequentially to multiple processing chambers 110.

[0026] [Example of a substrate transport device] Next, an example of a substrate transport apparatus will be described in detail with reference to Figure 1 mentioned above as well as Figures 2 to 5. Figure 2 is a cross-sectional view illustrating the transport unit and planar motor of the substrate transport apparatus, Figure 3 is a perspective view illustrating the driving principle of the planar motor, Figure 4 is a side view illustrating the wafer detection sensor, and Figure 5 is a block diagram illustrating the control system of the substrate transport apparatus.

[0027] As shown in FIG. 1, the substrate transfer device 150 includes a planar motor (linear unit) 10, a transfer unit 20, a wafer detection sensor 60, and a transfer control unit .

[0028] The planar motor (linear unit) 10 linearly drives the transport unit 20. The planar motor (linear unit) 10 has a main body 11 formed by the bottom wall 121 of the vacuum transport chamber 120, a plurality of electromagnetic coils 12 arranged throughout the interior of the main body 11, and a linear drive unit 13 that individually supplies power to the plurality of electromagnetic coils 12 to linearly drive the transport unit 20. The linear drive unit 13 is controlled by a planar motor control unit 72 of the transport control unit 70. A magnetic field is generated by supplying a current to the electromagnetic coils 12.

[0029] The transfer unit 20 has an end effector 50, which is a wafer holder that holds the wafer W, and a base 30. Although one transfer unit 20 is shown in the figure, two or more transfer units 20 may be used.

[0030] As shown in FIG. 3 , the base 30 is configured with a plurality of permanent magnets 35 arranged therein and is driven by the planar motor (linear unit) 10. Driving the base 30 moves the end effector 50. The base 30 is configured to magnetically levitate from the surface of the main body 11 by orienting the current supplied to the electromagnetic coils 12 of the planar motor (linear unit) 10 so that the magnetic field generated thereby repels the permanent magnets 35. Levitation of the base 30 is stopped by stopping the current to the electromagnetic coils 12, and the base 30 is placed on the floor of the vacuum transfer chamber 120, i.e., on the surface of the main body 11 of the planar motor 10. Furthermore, by individually controlling the current supplied from the linear drive unit 13 to the electromagnetic coils 12 using the planar motor control unit 72, the base 30 can be moved along the surface of the main body 11 of the planar motor 10 while magnetically levitating, and its position can be controlled. The amount of levitation can also be controlled by controlling the current.

[0031] The wafer detection sensor 60 has two sensor element units 61 provided in the vacuum transfer chamber 120 at portions corresponding to the wafer loading / unloading ports of each processing chamber 110. As shown in Fig. 4, the sensor element unit 61 has, for example, a light emitting element 61a and a light receiving element 61b arranged in the vertical direction, constituting an optical sensor, and detects the wafer W when it passes between the light emitting element 61a and the light receiving element 61b. Furthermore, as shown in Fig. 5, the wafer detection sensor 60 has a measurement unit 62 that receives a signal from the sensor element unit 61 and performs measurement.

[0032] The transfer control unit 70 has a calculation unit 71 and the above-mentioned planar motor control unit 72. The calculation unit 71 acquires a signal from the measurement unit 62 of the wafer detection sensor 60, calculates the actual position of the wafer W on the end effector 50, and calculates a correction value for the logical position of the wafer based on the calculation result. The planar motor control unit 72 corrects the transfer position of the wafer W on the mounting table 111 of the processing chamber 110 based on the correction value, and controls the linear drive unit 13 so that the wafer W is transferred to the corrected transfer position.

[0033] In the substrate transport device 150 configured in this manner, the planar motor control unit 72 controls the current supplied from the linear drive unit 13 of the planar motor (linear unit) 10 to the electromagnetic coil 12 to generate a magnetic field that repels the permanent magnet 35, thereby magnetically levitating the base 30. The amount of levitation at this time can be controlled by controlling the current.

[0034] In the magnetically levitated state, the current supplied from the linear drive unit 13 to the electromagnetic coils 12 can be individually controlled to move the base 30 along the surface of the main body 11 of the planar motor 10 (the floor of the vacuum transfer chamber 120), thereby controlling its position. This allows the transfer unit 20 to move and rotate.

[0035] When the transfer unit 20 loads the wafer W into the processing chamber 110, the base 30 is moved with the wafer W placed on the end effector 50 so that the end effector 50 is positioned corresponding to the processing chamber 110. After the gate valve G is opened, the base 30 is further moved to insert the end effector 50 into the processing chamber 110, and the wafer W is transferred to the mounting table 111 in the processing chamber 110.

[0036] At this time, the transfer control unit 70 controls the position of the base 30 based on the position data stored therein, and transfers the wafer W to a target position on the mounting table 111 in the processing chamber 110. However, the wafer W may be placed on the end effector 50 at a position that is shifted from the preset position.

[0037] 6, the transfer control unit 70 sets the position of the center of the wafer W placed on the end effector 50 as the logical center O1, and the transfer control unit 70 controls the position of the center M of the base 30, which is the center of linear drive, based on this. However, there are cases where the position of the physical center O2 of the wafer W actually placed on the end effector 50 is shifted from the position of the logical center O1. The example of FIG. 6 shows a state in which the physical center O2 of the wafer W placed on the end effector 50 is shifted by x in the X direction and by y in the Y direction from the logical center O1.

[0038] Since the linear drive using the planar motor 10 does not have a central axis like conventional transfer robots, it is not possible to perform transfer correction using the central axis as a reference point. Therefore, if the wafer W is placed at a misaligned position on the end effector 50, even if the transfer position of the wafer W is controlled by the transfer control unit 70, the wafer W will be placed at a position misaligned from the transfer destination position on the mounting table 111.

[0039] As mentioned above, substrate transport using planar motors solves the problems of gas intrusion through vacuum seals and the limited movement of transfer robots, which are problems associated with technologies using transfer robots. However, in recent years, as device miniaturization has become more demanding, the requirements for substrate (wafer) placement accuracy on the mounting table in the processing chamber have become stricter in order to improve uniformity and characteristics. Furthermore, substrate (wafer) processing includes high-temperature and low-temperature processes, and in such cases, differences in thermal expansion tend to increase the positional deviation of the substrate on the end effector, as described above. As a result, the positional deviation of the substrate from the transfer destination due to the positional deviation on the end effector becomes a problem.

[0040] For this reason, in this embodiment, the sensor element unit 61 of the wafer detection sensor 60 is provided in a portion of the vacuum transfer chamber 120 corresponding to the wafer loading / unloading port of each processing chamber 110, and the sensor element unit 61 detects the position of the wafer W during the process of transferring the wafer W on the end effector 50 to the mounting table 111 of the processing chamber 110. Then, based on the detection data, the calculation unit 71 of the transfer control unit 70 calculates the actual position of the wafer W on the end effector 50, and calculates a correction value for the logical position of the wafer based on the calculation result. The planar motor control unit 72 corrects the transfer position of the wafer W on the mounting table 111 of the processing chamber 110 based on the correction value. Then, the linear drive unit 13 is controlled to transfer the wafer W to the corrected transfer position.

[0041] An example of a sequence performed by the transport control unit 70 at this time is shown in FIG. First, a command for the center coordinates (X, Y) of the wafer W, which is the transfer destination position, is given to the linear drive unit 13 (step ST1). The transfer destination position is a position on the mounting table 111 in the processing chamber 110.

[0042] Next, the linear drive unit 13 is operated based on the command (step ST2). This moves the base 30 of the transfer unit 20, and the wafer W on the end effector 50 is transferred accordingly. Specifically, the wafer W is transferred in the X direction while being held by the end effector 50 to a position corresponding to the target processing chamber 110, and then transferred in the Y direction toward the target processing chamber 110.

[0043] Next, the wafer W is detected by the wafer detection sensor 60 (step ST3). Specifically, the two sensor element units 61 detect the passing wafer W, and the measurement unit 62 measures the detection signal.

[0044] Next, the physical center position O2 of the wafer W on the end effector 50 is calculated based on the detection data of the wafer detection sensor 60, and a correction value (x, y) from the logical center O1 is calculated (step ST4).

[0045] Next, the center coordinates of the wafer W at the transfer position of the wafer W are corrected to (X+x, Y+y) based on the correction value (x, y) (step ST5). The linear drive unit 13 is controlled to transfer the wafer W based on the corrected transfer position.

[0046] This allows the wafer W to be transferred to a predetermined transfer position on the mounting table 111 in the processing chamber 110 with high positional accuracy.

[0047] The wafer detection sensor 60 (sensor element portion 61) is arranged for each processing chamber 110, and performs the same position correction every time a wafer W is transferred to each processing chamber 110.

[0048] Such position correction can be performed in the same manner whether the wafer W is transferred in parallel or serially.

[0049] [Another example of a substrate transport device] Next, another example of a substrate transfer device will be described. In this example, the configuration of the transfer unit is different from that of the above example. Fig. 8 is a plan view showing the transfer unit of the substrate transfer device of this example, and Fig. 9 is a side view showing the transfer unit of the substrate transfer device of this example. Note that Fig. 8(a) and (b) show different postures of the transfer unit.

[0050] The transport unit 20' of this example has two bases 31 and 32, a link mechanism (links 41, 42), and an end effector 50.

[0051] Similar to the base 30 in the above example, the bases 31 and 32 are configured with an array of multiple permanent magnets 35 (see FIG. 3) therein, and move the end effector 50 via a link mechanism (links 41 and 42). By orienting the current supplied to the electromagnetic coil 12 of the planar motor (linear unit) 10 in such a way that the magnetic field generated thereby repels the permanent magnets 35, the bases 31 and 32 are magnetically levitated from the surface of the main body 11.

[0052] Links 41 and 42 constituting the link mechanism connect the two bases 31 and 32 to the end effector 50. Specifically, one end of link 41 is rotatably connected to base 31 via a vertical rotation shaft 43. The other end of link 41 is rotatably connected to end effector 50 via a vertical rotation shaft 45. One end of link 42 is rotatably connected to base 32 via a vertical rotation shaft 44. The other end of link 42 is rotatably connected to end effector 50 via a vertical rotation shaft 46.

[0053] The link mechanism may also be configured so that the link angles move in conjunction with each other. For example, the link mechanism may include an angle interlocking mechanism (not shown) that interlocks the link 41 so that the angle between the extension direction of the end effector 50 (the direction perpendicular to the line connecting the rotation shafts 45 and 46) and the angle between the extension direction of the end effector 50 and the link 42 are equal to each other. The angle interlocking mechanism (not shown) is configured, for example, with gears, belts, etc. As a result, the link mechanism can extend or retract while maintaining the orientation of the end effector 50 by changing the distance between the rotation shafts 43 and 44 (i.e., the distance between the bases 31 and 32).

[0054] In this example, the end effector 50 is connected to a link mechanism (links 41, 42). The two bases 31, 32 and the end effector 50 are connected via the link mechanism (links 41, 42), so that the end effector 50 can be positioned at the retracted position shown in Fig. 8(a) and the advanced position shown in Fig. 8(b).

[0055] 8(a), the distance between the bases 31 and 32 is D1, which uniquely determines the extension distance H1 of the end effector 50. Also, the distance between the bases 31 and 32 is D2, which uniquely determines the extension distance H2 of the end effector 50.

[0056] The interval between bases 31 and 32 is the distance between the reference position of base 31 and the reference position of base 32, which in this example is the distance between rotation axis 43 and rotation axis 44. The extension distance is the distance between the line connecting rotation axis 43 of base 31 and rotation axis 44 of base 32 and the center of wafer W placed on end effector 50. Stoppers 47 and 48 limit the rotation angle of links 41 and 42 and are provided as needed.

[0057] In the transport unit 20' configured in this manner, the planar motor control unit 72 controls the current supplied from the linear drive unit 13 of the planar motor (linear unit) 10 to the electromagnetic coil 12 to generate a magnetic field that repels the permanent magnet 35, thereby causing the bases 31 and 32 to be magnetically levitated. In this magnetically levitated state, the current supplied to the electromagnetic coil 12 is individually controlled, allowing the bases 31 and 32 to move along the surface of the main body 11 of the planar motor 10 (the floor of the vacuum transport chamber 120) and their positions to be controlled. This allows the transport unit 20' to move and rotate.

[0058] Furthermore, the extension distance of the end effector 50 can be changed by controlling the current supplied to the electromagnetic coil 12 so that the distance between the bases 31 and 32 is the desired distance. For example, when accessing the processing chamber 110 or the load lock chamber 130, the distance between the bases 31 and 32 is narrowed to increase the extension distance of the end effector 50, as shown in FIG. 8(b). This allows the end effector 50 to be inserted into the processing chamber 110 or the load lock chamber 130 while the bases 31 and 32 remain on the surface of the main body 11 of the planar motor 10 (the floor surface of the vacuum transfer chamber 120). Furthermore, for example, when moving and rotating the transfer unit 20′ within the vacuum transfer chamber 120, the distance between the bases 31 and 32 is widened to decrease the extension distance of the end effector 50, as shown in FIG. 8(a). This allows the end effector 50 holding the wafer W to be brought closer to the bases 31 and 32, reducing sagging and vibration of the link mechanism (links 41 and 42) and reducing displacement of the wafer W during transportation.

[0059] In this example, as in the above example, the sensor element unit 61 of the wafer detection sensor 60 is provided in the vacuum transfer chamber 120 at a position corresponding to the wafer loading / unloading port of each processing chamber 110, and the sensor element unit 61 detects the position of the wafer W during the process of transferring the wafer W on the end effector 50 to the mounting table 111 of the processing chamber 110. Then, based on the detection data, the calculation unit 71 of the transfer control unit 70 calculates the actual position of the wafer W on the end effector, and calculates a correction value for the logical position of the wafer based on the calculation result. The planar motor control unit 72 corrects the transfer position of the wafer W on the mounting table 111 of the processing chamber 110 based on the correction value, and controls the linear drive unit 13 so that the wafer W is transferred to the corrected transfer position.

[0060] This allows the wafer W to be transferred to a predetermined transfer position on the mounting table 111 in the processing chamber 110 with high positional accuracy.

[0061] <Other applications> Although the embodiments have been described above, the disclosed embodiments should be considered to be illustrative and not restrictive in all respects. The above embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0062] For example, in the above embodiments, examples of one and two bases are shown as examples of the transport unit of the substrate processing system, but three or more bases may be used. Also, when a link mechanism is used between the base and the end effector, a multi-joint link mechanism may be used, and a link mechanism that displaces horizontally and a link mechanism that changes in height may be combined.

[0063] In the above embodiment, the wafer is transferred to a destination position on the mounting table in the processing chamber, but this is not limitative.

[0064] Furthermore, in the above embodiment, an optical sensor having a sensor element portion including a light emitting element and a light receiving element is used as the wafer detection sensor, but the present invention is not limited to this.

[0065] Furthermore, although the case where a semiconductor wafer is used as the substrate has been described, the substrate is not limited to a semiconductor wafer and may be other substrates such as an FPD (flat panel display) substrate, a quartz substrate, or a ceramic substrate. [Explanation of symbols]

[0066] 10; Planar motor 11;Main body 12; Electromagnetic coil 13: Linear drive unit 20,20´;Transport unit 30, 31, 32; base 35; Permanent magnet 41, 42; Link 50: End effector (substrate holding part) 60: Wafer detection sensor 61: Sensor element section 62; Measurement department 70: Transport control unit 71; Arithmetic section 72: Planar motor control unit 100; Substrate processing system 110 Processing chamber 120: Vacuum transfer chamber 130 Load lock chamber 140: Atmospheric transport chamber 150: Substrate transport device 160;Control section W: Semiconductor wafer (substrate)

Claims

1. A substrate transfer device is provided in a transfer chamber connected to a processing chamber for performing a substrate processing, and transfers a substrate to a substrate placement part of the processing chamber, a transport unit including a substrate holder for holding a substrate, two bases having magnets therein and for moving the substrate holder, and a link mechanism for connecting each of the bases to the substrate holder; a planar motor including a main body constituting a bottom wall of the transfer chamber, a plurality of electromagnetic coils arranged within the main body, and a linear drive unit that supplies power to the electromagnetic coils and magnetically levitates and linearly drives the base; a substrate detection sensor provided in the transfer chamber at a position corresponding to a substrate loading / unloading port to the processing chamber, the substrate passing through when the substrate held by the substrate holder is transferred to the substrate placement section of the processing chamber, and detecting the substrate as it passes through; a transport control unit that controls a position of the base by individually controlling currents supplied from the linear drive unit to the plurality of electromagnetic coils to move the base along the surface of the main body unit while magnetically levitating the base, calculates an actual position of the substrate held by the substrate holder based on detection data from the substrate detection sensor, calculates a correction value for a set logical position, corrects a transport position of the substrate on the substrate mounting unit in the processing chamber based on the correction value, and controls the linear drive unit so that the substrate is transported to the corrected transport position; A substrate transport device comprising:

2. 2. The substrate transport device according to claim 1, wherein the transport control unit calculates the physical center of the substrate held by the substrate holding unit as the actual position of the substrate, and calculates a correction value for the logical center of the substrate as the logical position.

3. A substrate transfer method in which a substrate is transferred to a substrate placement part of a processing chamber connected to the processing chamber by a substrate transfer device provided in the processing chamber, the method comprising: the substrate transport device comprises a transport unit having a substrate holding part for holding a substrate, two bases each having a magnet therein for moving the substrate holding part, and a link mechanism for connecting each of the bases to the substrate holding part; a main body forming the bottom wall of the transport chamber, a plurality of electromagnetic coils arranged in the main body, and a planar motor having a linear drive part that supplies power to the electromagnetic coils and magnetically levitates and linearly drives the base; and a substrate detection sensor provided in the transport chamber at a position corresponding to a substrate loading / unloading port for the processing chamber; controlling a position of the base by individually controlling the currents supplied from the linear drive unit to the plurality of electromagnetic coils to move the base along the surface of the main body in a state in which the base is magnetically levitated; detecting the substrate with the substrate detection sensor during a process of transporting the substrate held by the substrate holding unit to the substrate placement unit of the processing chamber; calculating an actual position of the substrate held by the substrate holder based on detection data from the substrate detection sensor, and calculating a correction value for a set logical position; correcting a transfer position of the substrate on the substrate mounting part in the processing chamber based on the correction value, and controlling the linear drive unit so that the substrate is transferred to the corrected transfer position; A substrate transport method comprising:

4. 4. The substrate transport method according to claim 3, further comprising calculating a physical center of the substrate held by the substrate holder as the actual position of the substrate, and calculating a correction value for the logical center of the substrate as the logical position.

5. a processing chamber having a substrate placement part for placing a substrate thereon, the processing chamber performing processing on the substrate placed on the substrate placement part; a transfer chamber connected to the processing chamber; a substrate transfer device provided inside the transfer chamber and configured to transfer the substrate to a substrate placement portion of the processing chamber; Equipped with The substrate transport device a transport unit including a substrate holder for holding a substrate, two bases having magnets therein and for moving the substrate holder, and a link mechanism for connecting each of the bases to the substrate holder; a planar motor including a main body constituting a bottom wall of the transfer chamber, a plurality of electromagnetic coils arranged within the main body, and a linear drive unit that supplies power to the electromagnetic coils and magnetically levitates and linearly drives the base; a substrate detection sensor provided in the transfer chamber at a position corresponding to a substrate loading / unloading port to the processing chamber, the substrate passing through when the substrate held by the substrate holder is transferred to the substrate placement section of the processing chamber, and detecting the substrate as it passes through; a transport control unit that controls a position of the base by individually controlling currents supplied from the linear drive unit to the plurality of electromagnetic coils to move the base along the surface of the main body unit while magnetically levitating the base, calculates an actual position of the substrate held by the substrate holder based on detection data from the substrate detection sensor, calculates a correction value for a set logical position, corrects a transport position of the substrate on the substrate mounting unit in the processing chamber based on the correction value, and controls the linear drive unit so that the substrate is transported to the corrected transport position; A substrate processing system comprising:

6. 6. The substrate processing system of claim 5, wherein the transport control unit calculates the physical center of the substrate held by the substrate holding unit as the actual position of the substrate, and calculates a correction value for the logical center of the substrate as the logical position.

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