Packaging material, packaging bag, and packaging body

Abstract

To provide a packing material capable of exhibiting anti-electrostaticity on both main surfaces.SOLUTION: This packing material comprises a base material and a sealant layer provided on the base material. The sealant layer includes a first resin layer containing ionomer composed of a potassium ion and anionic resin and low-density polyethylene. A content of the potassium ion ionomer in the first resin layer is 7-25 mass%. A distance X from the main surface of the base material opposite to the sealant layer side to the main surface of the first resin layer on the base material side is 9-100 μm or less. A distance Y from the main surface of the sealant layer opposite to the base material side to the main surface of the first resin layer opposite to the base material side is 15-100 μm or less.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a packaging material, a packaging bag, and a package, and in particular to a packaging material and the like that has excellent antistatic properties. [Background technology]

[0002] For example, general-purpose packaging bags are prepared by heat-sealing a packaging material in which a base material and a sealant layer made of a polymer material are laminated. Polymer materials generally have excellent insulating properties and are therefore prone to static electricity. Therefore, packaging materials such as those described above prepared using polymer materials tend to attract dust and dirt on their surfaces if left as is, which can cause a deterioration in product quality.

[0003] Therefore, in order to prevent the packaging bag from becoming statically charged, various methods have been studied for imparting antistatic properties to the packaging material itself. For example, methods have been proposed to improve the antistatic properties of packaging materials by using a polymer material in which a conductive compound or an antistatic agent is kneaded, or by applying a polymer containing an antistatic agent to the surface of a conventional packaging material.

[0004] When a low-molecular-weight compound is used as an antistatic agent, there is a concern that the antistatic properties of the packaging material will decrease over time due to, for example, bleed-out of the low-molecular-weight compound. Furthermore, when a polymer containing an antistatic agent is applied to the surface of the packaging material, there is a concern that the polymer will contaminate the packaged item. To alleviate these concerns, packaging materials employing a conductive layer of, for example, an ionic conductive resin have been proposed (see, for example, Patent Documents 1 to 3). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2006-513056 [Patent Document 2] Japanese Patent Application Laid-Open No. 2008-074028 [Patent Document 3] Patent No. 6034527 Summary of the Invention [Problem to be solved by the invention]

[0006] The present disclosure aims to provide a packaging material that can exhibit static-proof properties on both main surfaces. The present disclosure also aims to provide a packaging bag and a package that suppress adhesion of packaged items to the inner surface. [Means for solving the problem]

[0007] One aspect of the present disclosure provides a packaging material having a substrate and a sealant layer provided on the substrate, wherein the sealant layer includes an ionomer composed of potassium ions and an anionic resin, and a first resin layer containing low-density polyethylene, wherein the content of the potassium ion ionomer in the first resin layer is 7 to 25 mass %, a distance X from a main surface of the substrate opposite to the sealant layer side to a main surface of the first resin layer facing the substrate is 9 to 100 μm or less, and a distance Y from the main surface of the sealant layer opposite to the substrate side to a main surface of the first resin layer opposite to the substrate side is 15 to 100 μm or less.

[0008] The packaging material has a sealant layer including a first resin layer containing a predetermined amount of potassium ions, and the first resin layer is positioned at a predetermined position on a plane parallel to the stacking direction of the packaging material, thereby enabling the packaging material to exhibit excellent static-proofing properties on both main surfaces.

[0009] The anionic resin in the resin layer may include an ethylene-(meth)acrylic acid copolymer.

[0010] The first resin layer may have a thickness of 5 to 40 μm. When the thickness of the first resin layer is within the above range, the antistatic properties are more excellent.

[0011] In a cross section parallel to the thickness direction of the first resin layer, the concentration of the potassium ion ionomer in the main surface of the first resin layer may be greater than the concentration of the potassium ion ionomer in a central portion in the thickness direction of the first resin layer. By having the potassium ions in the first resin layer concentrated toward the main surface of the first resin layer, the static-proof properties of the main surface of the packaging material can be further improved.

[0012] The packaging material may have the distance X of 50 μm or less.

[0013] The content of the potassium ion ionomer in the sealant layer may be 7 to 25% by mass.

[0014] The sealant layer may have a thickness of 20 to 100 μm.

[0015] The thickness of the first resin layer is 5 to 40 μm, and the density of the resin constituting the first resin layer is 0.90 to 0.95 g / cm 3 The resin constituting the first resin layer may have a melt flow rate of 2 to 13 g / min.

[0016] The sealant layer may include the first resin layer, the second resin layer, and the sealing layer in this order from the substrate side, and the second resin layer may contain a potassium ion ionomer.

[0017] The sealant layer may include, from the substrate side, the first resin layer, the second resin layer, and the sealing layer in this order, the second resin layer having a thickness of 3 to 16 μm, the sealing layer having a thickness of 4 to 50 μm, and the total thickness of the second resin layer and the sealing layer being 15 μm or more.

[0018] The density of the resin constituting the first resin layer is 0.90 to 0.95 g / cm 3 and the density of the resin constituting the second resin layer is 0.90 to 0.95 g / cm 3 and the density of the resin constituting the sealing layer is 0.90 to 0.95 g / cm 3 It may be.

[0019] The resin constituting the first resin layer may have a melt flow rate of 2 to 13 g / min, the resin constituting the second resin layer may have a melt flow rate of 2 to 13 g / min, and the resin constituting the sealing layer may have a melt flow rate of 2 to 13 g / min.

[0020] The packaging material may further include a barrier layer between the substrate and the sealant layer.

[0021] The peel strength between the barrier layer and the sealant layer may be 1.0 N / 15 mm or more.

[0022] The packaging material may have a haze value of 20% or less.

[0023] The packaging material may have a static decay time of 5.0 seconds or less.

[0024] The packaging material may be sandwiched between a metal plate and a metal weight, rubbed 10 times, and then when dried bonito flakes are sprinkled on the packaging material, the area of ​​the packaging material to which dried bonito flakes adhere may be 15% or less by area.

[0025] One aspect of the present disclosure provides a packaging bag formed by bonding packaging materials, the packaging materials being the packaging material described above.

[0026] The packaging bag is formed by laminating the above-mentioned packaging materials together, and therefore static electricity is suppressed.

[0027] One aspect of the present disclosure provides a package in which a packaged item is contained in a storage section of a packaging bag formed by bonding packaging materials together, wherein the packaging material is the packaging material described above, and the packaged item is dried bonito flakes, granules, or powder.

[0028] The packaging body is formed by laminating the above-mentioned packaging materials, and therefore static electricity is suppressed, which can prevent the packaged item from adhering to the inner surface, etc. Similarly, the packaging body is formed by laminating the above-mentioned packaging materials, and therefore static electricity is suppressed, which can prevent dust and the like from adhering to the surface of the packaging bag. [Effects of the Invention]

[0029] According to the present disclosure, it is possible to provide a packaging material that can exhibit static-proof properties on both main surfaces. According to the present disclosure, it is also possible to provide a packaging bag and a package that suppress adhesion of packaged items to the inner surface. [Brief explanation of the drawings]

[0030] [Figure 1] FIG. 1 is a schematic cross-sectional view showing an example of a packaging material. [Figure 2] FIG. 2 is a schematic cross-sectional view showing an example of a packaging material. [Figure 3] FIG. 3 is a schematic cross-sectional view showing an example of a packaging material. [Figure 4] FIG. 4 is a schematic cross-sectional view showing an example of a packaging material. [Figure 5] FIG. 5 is a perspective view showing an example of a packaging bag. DETAILED DESCRIPTION OF THE INVENTION

[0031] Embodiments of the present disclosure will be described below with reference to the drawings where appropriate. However, the following embodiments are merely examples for explaining the present disclosure and are not intended to limit the present disclosure to the following content. In the description, the same elements or elements having the same functions will be designated by the same reference numerals, and redundant explanations will be omitted where appropriate. Furthermore, positional relationships such as up, down, left, and right will be based on the positional relationships shown in the drawings unless otherwise specified. Furthermore, the dimensional ratios of the drawings are not limited to those shown in the drawings.

[0032] Unless otherwise specified, the materials exemplified in this specification can be used singly or in combination of two or more. When multiple substances corresponding to each component are present in the composition, the content of each component in the composition means the total amount of the multiple substances present in the composition, unless otherwise specified.

[0033] One embodiment of the packaging material includes a substrate and a sealant layer provided on the substrate. The sealant layer includes a potassium ion ionomer composed of potassium ions and an anionic resin, and a first resin layer containing low-density polyethylene. The content of the potassium ion ionomer in the first resin layer is 7 to 25% by mass, and the distance X from a main surface of the substrate opposite the sealant layer to a main surface of the first resin layer facing the substrate is 9 to 100 μm or less, and the distance Y from the main surface of the sealant layer opposite the substrate to a main surface of the first resin layer opposite the substrate is 15 to 100 μm or less.

[0034] The packaging material of the present disclosure includes a first resin layer containing a predetermined amount of the potassium ion ionomer, which allows, for example, electrical charges generated in the packaging material due to friction or the like to flow into the first resin layer, thereby suppressing charging in the surface layer of the packaging material. Furthermore, by arranging the first resin layer at a predetermined distance from both main surfaces of the packaging material in a cross section parallel to the lamination direction of the packaging material, electrical charges generated in the packaging material can be prevented from building up and easily guided to the first resin layer. Therefore, the packaging material of the present disclosure has excellent antistatic properties and is useful as a packaging material and packaging bag for packaging items that are easily charged with static electricity.

[0035] FIG. 1 is a schematic cross-sectional view showing an example of a packaging material. The cross-section shown in FIG. 1 is a cross-section parallel to the stacking direction of the layers constituting the packaging material 101. The packaging material 101 has a substrate 20 and a sealant layer 40. The sealant layer 40 includes a first resin layer 2 and a sealing layer 6. In the packaging material 101, both main surfaces of the first resin layer 2 are positioned a distance X from the outer surface of the substrate 20 and a distance Y from the outer surface of the sealing layer 6. The packaging material 101 is shown as an example in which the substrate 20 and the first resin layer 2, and the first resin layer 2 and the sealing layer 6 are stacked so as to be in direct contact with each other, and therefore the distance X corresponds to the thickness of the substrate 20, and the distance Y corresponds to the thickness of the sealing layer 6. However, in a modified example, the substrate 20, the first resin layer 2, and the sealing layer 6 may be laminated via an adhesive layer, in which case the distance X corresponds to the sum of the thickness of the substrate 20 and the thickness of the adhesive layer provided between the substrate 20 and the first resin layer 2, and the distance Y corresponds to the sum of the thickness of the sealing layer 6 and the thickness of the adhesive layer provided between the sealing layer 6 and the first resin layer 2.

[0036] The upper limit of the distance X in the packaging material 101 is 100 μm or less, but may be, for example, 90 μm or less, 80 μm or less, 70 μm or less, 60 μm or less, or 50 μm or less. When the upper limit of the distance X is within the above range, the static prevention properties of the outer surface of the packaging material 101 on the substrate 20 side, and of the outer surface of the bag when the packaging material 101 is used to form a packaging bag or package, can be further improved. The lower limit of the distance X in the packaging material 101 is 9 μm or more, but may be, for example, 12 μm or more, 15 μm or more, 20 μm or more, or 32 μm or more. When the lower limit of the distance X is within the above range, the static prevention properties can be further stabilized.

[0037] The upper limit of distance Y in packaging material 101 is 100 μm or less, but may be, for example, 90 μm or less, 80 μm or less, 70 μm or less, 60 μm or less, 50 μm or less, or 40 μm or less. By setting the upper limit of distance Y within the above range, it is possible to further improve the static prevention properties of the inner surface of packaging material 101 on the substrate 20 side, and of the inner surface of the bag (i.e., the inner wall of the storage section, the surface that comes into contact with the packaged item) when a packaging bag or package is formed using the packaging material 101. The lower limit of distance Y in packaging material 101 is 15 μm or more, but may be, for example, 20 μm or more, or 30 μm or more. By setting the lower limit of distance Y within the above range, it is possible to further stabilize the static prevention properties.

[0038] The distance X and the distance Y in this specification can be measured using a microscopic Fourier transform infrared spectrophotometer (microscopic FT-IR spectrophotometer) on a cross section parallel to the lamination direction of the packaging material.

[0039] A flexible substrate can be used for the substrate 20. Examples of flexible substrates include biaxially oriented polypropylene (OPP), polyethylene terephthalate (PET), oriented polyamide (OPA), solid polypropylene (CPP), linear low-density polyethylene (LLDPE), low-density polyethylene (LDPE), and nylon (Ny). A substrate that has been subjected to static-proofing treatment can also be used for the substrate 20, but in the packaging material of the present disclosure, even a substrate that has not been subjected to static-proofing treatment can exhibit sufficient compatibility for practical use.

[0040] The upper limit of the thickness of the substrate 20 is 100 μm or less, but may be, for example, 90 μm or less, 80 μm or less, 70 μm or less, 60 μm or less, or 50 μm or less. The lower limit of the thickness of the substrate 20 may be, for example, 10 μm or more, 15 μm or more, 20 μm or more, 25 μm or more, or 30 μm or more.

[0041] The sealant layer 40 includes a first resin layer 2 and a sealing layer 6 .

[0042] The sealant layer 40 contains a potassium ion ionomer because it includes the first resin layer 2. The potassium ions that make up the potassium ion ionomer are present in large amounts in the first resin layer 2 located at a predetermined position in the sealant layer 40, but potassium ions may also be present in layers other than the first resin layer 2. This configuration makes it easier to guide charges generated on the outer surface of the sealant layer 40 to the first resin layer 2. When potassium ions are present in parts of the sealant layer 40 other than the first resin layer 2, it is desirable that the potassium ion content in the first resin layer 2 be greater than the potassium ion content in layers other than the first resin layer 2.

[0043] The content of the potassium ion ionomer in the sealant layer 40 may be, for example, 7 to 25 mass %, 9 to 20 mass %, or 10 to 20 mass %.

[0044] The thickness of the sealant layer may be, for example, 20 to 100 μm, 40 to 50 μm, or 70 to 90 μm.

[0045] The first resin layer 2 contains a potassium ion ionomer composed of potassium ions and an anionic resin, and low-density polyethylene. By containing the potassium ion ionomer, the first resin layer 2 can attract electric charges generated on the surface of the packaging material 101, thereby suppressing charging on the surface of the packaging material 101. The potassium ions may be counter ions of the anionic resin.

[0046] Anionic resins include, for example, carboxylato groups (-COO - ), and sulfonato group (-SO3 -) and a resin having at least one functional group selected from the group consisting of (meth)acrylic acid, (meth)acrylic acid, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer, (meth)acrylic acid copolymer,

[0047] The potassium ion ionomer is composed of potassium ions and an anionic resin. Examples of the potassium ionomer that can be used include the ENTIRA AS series (e.g., MK 400) manufactured by Dow Mitsui Polychemicals Co., Ltd.

[0048] The content of the potassium ion ionomer in the first resin layer 2 is 7 to 25% by mass. The lower limit of the content of the potassium ion ionomer may be, for example, 9% by mass or more, or 10% by mass or more, based on the total amount of the first resin layer 2. When the lower limit of the content of the potassium ion ionomer is within the above range, the static-proof properties of the packaging material 101 can be further improved. The upper limit of the content of the potassium ion ionomer may be, for example, 25% by mass or less, 20% by mass or less, or 15% by mass or less, based on the total amount of the first resin layer 2. When the upper limit of the content of the potassium ion ionomer is within the above range, the film formability of the first resin layer 2 during production of the packaging material 101 can be further improved, and a first resin layer 2 with reduced film defects and the like can be obtained.

[0049] The potassium ion ionomer content in this specification refers to a value measured by infrared total reflection absorption spectroscopy (ATR, also known as ATR-FTIR). If the potassium ion ionomer is known, a calibration curve can be prepared using the corresponding potassium ion ionomer as a standard sample. If the potassium ion ionomer constituting the first resin layer is not identified, the structure of the anionic resin constituting the ionomer can be determined from the results of H-NMR and C-NMR spectra by nuclear magnetic resonance spectroscopy and mass analysis by matrix-assisted laser desorption / ionization mass spectrometry for the resin component constituting the first resin layer, and a calibration curve can be prepared using a corresponding polymer standard sample.

[0050] The distribution of the potassium ion ionomer concentration in the first resin layer 2 may be uniform or localized in some locations in a cross section parallel to the thickness direction of the first resin layer 2, but it is preferable that, in a cross section parallel to the thickness direction of the first resin layer 2, the potassium ion ionomer concentration on the main surface of the first resin layer 2 is higher than the potassium ion ionomer concentration in the central portion in the thickness direction of the first resin layer 2. By achieving such a distribution of the potassium ion ionomer concentration, after charges generated on the surface layer of the packaging material 101 are introduced into the first resin layer 2, the charges can be quickly diffused in the in-plane direction of the first resin layer 2, and antistatic performance can be more effectively exhibited.

[0051] The thickness of the first resin layer 2 is 5 to 40 μm. The lower limit of the thickness of the first resin layer 2 may be, for example, 7 μm or more, or 10 μm or more. When the lower limit of the thickness of the first resin layer 2 is within the above range, the static prevention properties on the surface of the packaging material 101 can be further improved. The upper limit of the thickness of the first resin layer 2 may be, for example, 30 μm or less, 25 μm or less, 20 μm or less, or 15 μm or less. When the upper limit of the thickness of the first resin layer 2 is within the above range, the static prevention properties can be further stabilized.

[0052] The density of the resin constituting the first resin layer 2 is, for example, 0.90 to 0.95 g / cm3 The upper limit of the density of the resin constituting the first resin layer 2 may be 0.94 g / cm 3 or less than 0.93 g / cm 3 The upper limit of the density of the resin constituting the first resin layer 2 within the above range allows adjustment of the potassium ion ionomer distribution. The lower limit of the density of the resin constituting the first resin layer 2 is 0.91 g / cm 3 or more, or 0.92 g / cm 3 The lower limit of the density of the resin constituting the first resin layer 2 may be within the above range, thereby enabling adjustment of the potassium ion ionomer distribution. In this specification, the term "resin constituting the first resin layer" refers not only to the potassium ion ionomer but also to the entire resin component.

[0053] The density in this specification means a value measured in accordance with the pycnometer method described in JIS K 7112:1999 "Method for measuring density and specific gravity of plastics - non-foamed plastics."

[0054] The melt flow rate of the resin constituting the first resin layer 2 may be 2 to 13 g / min. The upper limit of the melt flow rate of the resin constituting the first resin layer 2 may be, for example, 12 g / min or less, 9 g / min or less, or 6 g / min or less. When the upper limit of the melt flow rate of the resin constituting the first resin layer 2 is within the above range, the potassium ion ionomer distribution can be adjusted. The lower limit of the melt flow rate of the resin constituting the first resin layer 2 may be, for example, 3 g / min or more, or 4 g / min or more. When the upper limit of the melt flow rate of the resin constituting the first resin layer 2 is within the above range, the potassium ion ionomer distribution can be adjusted.

[0055] The melt flow rate in this specification refers to a value measured in accordance with the mass measurement method (temperature: 190°C, load: 2.16 kg) described in JIS K 7210-1:2014 "Plastics - Determination of melt mass flow rate (MFR) and melt volume flow rate (MVR) of thermoplastics - Part 1: Standard test method."

[0056] The first resin layer 2 has a thickness of 5 to 40 μm, and the density of the resin constituting the first resin layer 2 is 0.90 to 0.95 g / cm 3 The resin constituting the first resin layer 2 may have a melt flow rate of 2 to 13 g / min.

[0057] The sealing layer 6 is a layer that can be bonded by placing parts of the sealing layer 6 of the packaging material 101 facing each other when forming a packaging bag by laminating packaging materials 101 together, or by preparing multiple packaging materials and placing the sealing layers 6 of each facing each other by heat and pressure bonding, and is a layer that forms the surface that forms the inner wall of the containing section of the packaging bag. Examples of materials for the sealing layer 6 include linear low-density polyethylene (LLDPE) and low-density polyethylene (LDPE). From the viewpoint of suppressing deterioration of sealing performance, it is desirable that the sealing layer 6 does not contain potassium ion ionomer.

[0058] The thickness of the sealing layer 6 may be 4 to 70 μm, or 4 to 50 μm. The lower limit of the thickness of the sealing layer 6 may be, for example, 6 μm or more, 8 μm or more, 10 μm or more, 15 μm or more, or 20 μm or more. When the lower limit of the thickness of the sealing layer 6 is within the above range, the static prevention effect can be more stabilized. The upper limit of the thickness of the sealing layer 6 may be, for example, 70 μm or less, 65 μm or less, 50 μm or less, 40 μm or less, or 30 μm or less. When the upper limit of the thickness of the sealing layer 6 is within the above range, the static prevention effect can be more stabilized.

[0059] The density of the resin constituting the sealing layer 6 is, for example, 0.90 to 0.95 g / cm 3 The upper limit of the density of the resin constituting the sealing layer 6 may be 0.94 g / cm 3 or less than 0.93 g / cm 3 The upper limit of the density of the resin constituting the sealing layer 6 within the above range can further stabilize the anti-static effect and improve the sealing strength. The lower limit of the density of the resin constituting the sealing layer 6 is 0.91 g / cm 3 or more, or 0.92 g / cm3 The density of the resin constituting the sealing layer 6 may be equal to or greater than this range. When the lower limit of the density of the resin constituting the sealing layer 6 is within the above range, the static prevention effect can be more stabilized and the sealing strength can be improved. In this specification, the term "resin constituting the sealing layer" refers not only to the potassium ion ionomer but also to the entire resin component.

[0060] The resin constituting the sealing layer 6 may have a melt flow rate of 2 to 13 g / min. The upper limit of the melt flow rate of the resin constituting the sealing layer 6 may be, for example, 12 g / min or less, 10 g / min or less, or 9 g / min or less. When the upper limit of the melt flow rate of the resin constituting the sealing layer 6 is within the above range, the static prevention effect can be more stable and the seal strength can be improved. The lower limit of the melt flow rate of the resin constituting the sealing layer 6 may be, for example, 4 g / min or more, or 7 g / min or more. When the lower limit of the melt flow rate of the resin constituting the sealing layer 6 is within the above range, the static prevention effect can be more stable and the seal strength can be improved.

[0061] In a modified example of the packaging material 101, the substrate 20, the first resin layer 2, and the seal layer 6 may be laminated via an adhesive layer. The adhesive layer may be, for example, a cured adhesive. The adhesive may be at least one selected from the group consisting of ether-based adhesives and ester-based adhesives.

[0062] The upper limit of the haze value of the packaging material 101 may be, for example, 20% or less, 18% or less, 16% or less, or 15% or less. When the upper limit of the haze value is within the above range, the transparency of the packaging material can be improved. The lower limit of the haze value of the packaging material 101 is not particularly limited, but is generally 10% or more, or 12% or more.

[0063] The haze value in this specification refers to a value measured in accordance with the method described in JIS K 7136:2000 "Method for determining haze of plastics - transparent materials."

[0064] The packaging material 101 described above has excellent antistatic properties and anti-static performance. The static charge decay time of the packaging material 101 can be, for example, 30.0 seconds or less, 10.0 seconds or less, 5.0 seconds or less, 3.0 seconds or less, 2.0 seconds or less, 1.5 seconds or less, or 1.0 second or less.

[0065] In this specification, the charge decay time refers to a value measured by the following method. Specifically, a voltage of ±10 kV is applied to the packaging material in a direction perpendicular to the thickness direction of the packaging material for 30 seconds, and the charge amount on the packaging material is measured over time starting immediately after the voltage application. The charge decay time is defined as the elapsed time until the charge amount on the packaging material decays by 10% from the value immediately after the voltage application. Note that the distance between the packaging material and the electrode (voltage distance) during the voltage application is set to 15 mm.

[0066] Packaging material 101 has excellent antistatic properties, and therefore adhesion of powder such as dried bonito flakes is suppressed. When packaging material 101 is sandwiched between a metal plate and a metal weight and rubbed 10 times, and then dried bonito flakes are sprinkled on the material, the area of ​​adhesion of the dried bonito flakes can be, for example, 15 area % or less, 10 area % or less, 5 area % or less, or 0 area % or less.

[0067] The sealant layer 40 may include other layers in addition to the first resin layer 2 and the sealing layer 6. Examples of other layers include a second resin layer. The second resin layer may be formed of, for example, LDPE, LLDPE, or the like. Even when the sealant layer 40 includes other layers, the end of the sealant layer 40 opposite the substrate side is prepared to become the sealing layer 6. Furthermore, when the sealant layer 40 includes other layers, it is preferable that the end of the sealant layer 40 facing the substrate side be prepared to become the first resin layer 2.

[0068] Fig. 2 is a schematic cross-sectional view showing an example of a packaging material. The packaging material 102 shown in Fig. 2 differs from the packaging material 101 shown in Fig. 1 in that the sealant layer 40 has a three-layer structure. The differences between the packaging material 102 and the packaging material 101 will be described below. In the packaging material 102, the sealant layer 40 includes a first resin layer 2, a second resin layer 4, and a seal layer 6, in this order.

[0069] In the packaging material 102, the distance Y from the main surface of the sealant layer 40 opposite the substrate 20 side to the main surface of the first resin layer 2 opposite the substrate 20 side corresponds to the total thickness of the second resin layer 4 and the seal layer 6. The range of the distance Y is the same as that described for the packaging material 101. In a modified example of the packaging material 102, when the layers are laminated via an adhesive layer, the distance Y means a thickness including the thickness of the adhesive layer.

[0070] In the packaging material 102, the second resin layer 4 may contain a potassium ion ionomer. When the second resin layer 4 contains a potassium ion ionomer, the charge generated on the outer surface of the sealant layer 40 is more easily guided to the first resin layer 2. When the second resin layer 4 contains a potassium ion ionomer, the content of the potassium ion ionomer in the first resin layer 2 is preferably greater than the content of the potassium ion ionomer in the second resin layer 4.

[0071] The thickness of the second resin layer 4 may be 2 to 16 μm, or 3 to 16 μm. The lower limit of the thickness of the second resin layer 4 may be, for example, 4 μm or more, 5 μm or more, or 8 μm or more. When the lower limit of the thickness of the second resin layer 4 is within the above range, the static prevention effect can be more stabilized. The upper limit of the thickness of the second resin layer 4 may be, for example, 14 μm or less, 12 μm or less, or 10 μm or less. When the upper limit of the thickness of the second resin layer 4 is within the above range, the static prevention effect can be more stabilized.

[0072] The density of the resin constituting the second resin layer 4 is, for example, 0.90 to 0.95 g / cm 3 The upper limit of the density of the resin constituting the second resin layer 4 may be 0.94 g / cm3 or less than 0.93 g / cm 3 The upper limit of the density of the resin constituting the second resin layer 4 may be 0.91 g / cm or less. When the upper limit of the density of the resin constituting the second resin layer 4 is within the above range, the static prevention effect can be stabilized. The lower limit of the density of the resin constituting the second resin layer 4 may be 0.91 g / cm or less. 3 or more, or 0.92 g / cm 3 If the lower limit of the density of the resin constituting the second resin layer 4 is within the above range, the static prevention effect can be stabilized.

[0073] The melt flow rate of the resin constituting the second resin layer 4 may be 2 to 13 g / min. The upper limit of the melt flow rate of the resin constituting the second resin layer 4 may be, for example, 12 g / min or less, 9 g / min or less, 7 g / min or less, or 4 g / min or less. When the upper limit of the melt flow rate of the resin constituting the second resin layer 4 is within the above range, the static-proof effect can be stabilized. The lower limit of the melt flow rate of the resin constituting the second resin layer 4 may be, for example, 3 g / min or more, or 4 g / min or more. When the lower limit of the melt flow rate of the resin constituting the second resin layer 4 is within the above range, the static-proof effect can be stabilized.

[0074] In the packaging material 102, for example, the thickness of the second resin layer 4 may be 3 to 16 μm, the thickness of the sealing layer 6 may be 4 to 50 μm, and the total thickness of the second resin layer 4 and the sealing layer 6 may be 15 μm or more.

[0075] In the packaging material 102, for example, the density of the resin constituting the first resin layer 2 is 0.90 to 0.95 g / cm 3 and the density of the resin constituting the second resin layer 4 is 0.90 to 0.95 g / cm 3 and the density of the resin constituting the sealing layer 6 is 0.90 to 0.95 g / cm 3 It may be.

[0076] In the packaging material 102, for example, the melt flow rate of the resin constituting the first resin layer 2 may be 2 to 13 g / min, the melt flow rate of the resin constituting the second resin layer 4 may be 2 to 13 g / min, and the melt flow rate of the resin constituting the sealing layer 6 may be 2 to 13 g / min.

[0077] The packaging material may have other layers in addition to the substrate and the sealant layer. Examples of the other layers include a barrier layer. The barrier layer may be, for example, a gas barrier layer. Examples of the gas barrier layer include a transparent vapor deposition film and an EVOH film. Examples of the transparent vapor deposition film that can be used include GL film manufactured by Toppan Printing Co., Ltd. When the packaging material has other layers, the other layers are provided between the substrate and the sealant layer.

[0078] In another embodiment of the packaging material, in addition to the substrate and sealant layer, a barrier layer is further provided between the substrate and the sealant layer. The packaging material according to this embodiment differs from the above-described packaging materials 101 and 102 in that it has a barrier layer. In the following description, a description of the common configuration will be omitted.

[0079] Fig. 3 is a schematic cross-sectional view showing an example of a packaging material. Packaging material 111 differs from packaging material 101 shown in Fig. 1 in that a barrier layer 30 is provided between a substrate 20 and a sealant layer 40. Differences between packaging material 111 and packaging material 101 will be described below. Packaging material 111 has a substrate 20, a barrier layer 30, and a sealant layer 40 in this order.

[0080] In the packaging material 111, the distance X from the main surface of the substrate 20 opposite the sealant layer 40 side to the main surface of the first resin layer 2 on the substrate 20 side corresponds to the total thickness of the substrate 20 and the barrier layer 30. The range of the distance X is the same as that described for the packaging material 101. In a modified example of the packaging material 111, when each layer is laminated via an adhesive layer, the distance X means a thickness including the thickness of the adhesive layer.

[0081] In the packaging material 111, the barrier layer 30 may contain potassium ions. When the barrier layer 30 contains potassium ions, charges generated on the outer surface of the base material 20 are more easily guided to the first resin layer 2. When the barrier layer 30 contains potassium ions, the potassium ion content of the first resin layer 2 is preferably greater than the potassium ion content of the barrier layer 30. From the viewpoint of maintaining high barrier performance, it is desirable that the barrier layer 30 does not contain potassium ions.

[0082] The barrier layer 30 is a layer having gas barrier properties. Examples of the barrier layer 30 include metal foils and vapor-deposited films made of inorganic materials. More specific examples of the barrier layer 30 include aluminum foils, aluminum vapor-deposited films, and inorganic vapor-deposited films such as silica vapor-deposited films and alumina vapor-deposited films. Silica vapor-deposited films and alumina vapor-deposited films are preferred as the barrier layer 30.

[0083] In this specification, "gas barrier properties" refers to an oxygen permeability of 10 cc / m 2 ·day·atm or less.

[0084] The upper limit of the oxygen permeability of the barrier layer 30 is, for example, 10.00 cc / m 2 ·day · atm or less, 5.00cc / m 2 ·day·atm or less, 3.00cc / m 2 ·day·atm or less, 1.00cc / m 2 ·day·atm or less, 0.50cc / m 2 ·day·atm or less, 0.25cc / m 2 ·day·atm or less, or 0.10cc / m 2 The lower limit of the oxygen permeability of the barrier layer 30 is not particularly limited, but is preferably 0.04 cc / m 2 ·day·atm or more, or 0.05cc / m 2 ·day·atm or more may be acceptable.

[0085] The oxygen permeability in this specification is a value measured in accordance with ASTM F1927-98(2004) under conditions of a temperature of 30°C and a relative humidity (RH) of 70%.

[0086] The barrier layer 30 preferably also has excellent water vapor permeability. The upper limit of the water vapor permeability of the barrier layer 30 is, for example, 10.00 g / m 2 ·day or less, 5.00g / m 2 ·day or less, 3.00g / m 2 ·day or less, 1.00g / m 2 ·day or less, 0.50g / m 2 ·day or less or 0.30g / m 2 The lower limit of the water vapor permeability of the barrier layer 30 is not particularly limited, but may be, for example, 0.10 g / m 2 day or more, or 0.20 g / m 2 · days or more is allowed.

[0087] The water vapor permeability in this specification is a value measured in accordance with ASTM F1249-01 under conditions of a temperature of 40°C and a relative humidity (RH) of 90%.

[0088] The thickness of the barrier layer 30 may be adjusted appropriately depending on the material, etc., and may be, for example, 5 to 30 μm. When the barrier layer 30 includes a metal foil, the thickness of the barrier layer 30 may be, for example, 6 to 9 μm or 9 to 30 μm. When the barrier layer 30 includes a vapor-deposited film, the thickness of the barrier layer 30 may be, for example, 9 to 15 μm or 15 to 30 μm. The barrier layer 30 can be formed by, for example, dry lamination, extrusion lamination, vacuum deposition, sputtering, ion plating, plasma vapor deposition (CVD), etc.

[0089] The lower limit of the peel strength between the barrier layer 30 and the sealant layer 40 may be, for example, 0.5 N / 15 mm or more, 1.0 N / 15 mm or more, 2.0 N / 15 mm or more, or 5.0 N / 15 mm or more. When the lower limit of the peel strength is within the above range, the functionality of the packaging material can be improved. The upper limit of the peel strength between the barrier layer 30 and the sealant layer 40 may be, for example, 20.0 N / 15 mm or less, 15.0 N / 15 mm or less, 10.0 N / 15 mm or less, or 8.0 N / 15 mm or less. When the upper limit of the peel strength is within the above range, the functionality of the packaging material can be improved.

[0090] The peel strength in this specification means the peel strength measured in accordance with the method described in JIS K 6854-1:1999 "Adhesives - Test method for peel strength - Part 1: 90 degree peel".

[0091] Fig. 4 is a schematic cross-sectional view showing an example of a packaging material. Packaging material 112 shown in Fig. 4 differs from packaging material 111 shown in Fig. 3 in that the sealant layer has a three-layer structure. Differences between packaging material 112 and packaging material 111 will be described below. In packaging material 102, sealant layer 40 includes a first resin layer 2, a second resin layer 4, and a seal layer 6, in this order.

[0092] In the packaging material 112, the distance Y from the main surface of the sealant layer 40 opposite the substrate 20 side to the main surface of the first resin layer 2 opposite the substrate 20 side corresponds to the total thickness of the second resin layer 4 and the seal layer 6. The range of the distance Y is the same as that described for the packaging material 111. In a modified example of the packaging material 112, when the layers are laminated via an adhesive layer, the distance Y means a thickness including the thickness of the adhesive layer.

[0093] The second resin layer 4 in the packaging material 112 can be applied with the same explanation as for the packaging material 102 .

[0094] The above-described packaging materials 101, 102, 111, and 112 can be manufactured, for example, by the following methods. That is, they can be manufactured directly by forming and laminating each layer using an extrusion coating method or a coextrusion method, or they can be manufactured by preparing each layer using an extrusion coating method and then laminating them with an adhesive. An extruder or the like can be used for the extrusion coating method, coextrusion method, and the like. The first resin layer 2 can be formed by preparing a mixture in advance by mixing potassium ions, an anionic resin, and low-density polyethylene in a predetermined ratio, and then molding the mixture using the above-described method. The thickness of each layer can be controlled by adjusting the nozzle diameter, extrusion speed, stretching speed, and the like of the extruder.

[0095] Specific examples of packaging materials are shown below. In each example, the left end corresponds to the substrate 20, and the right end corresponds to the sealing layer 6 side that constitutes the sealant layer 40, and the layers are laminated in this order from left to right.

[0096] (1) Biaxially oriented polypropylene film / adhesive layer / sealant layer (2) Transparent vapor-deposited OPP film / adhesive layer / sealant layer (3) Transparent vapor-deposited PET film / adhesive layer / sealant layer (4) Transparent vapor-deposited Ny film / adhesive layer / sealant layer (5) Biaxially oriented polypropylene film / first adhesive layer / transparent vapor-deposited PET film / second adhesive layer / sealant layer (6) PET film / first adhesive layer / transparent vapor-deposited PET film / second adhesive layer / sealant layer (7) Polyvinylidene chloride coated (K-coated) stretched polypropylene film / first adhesive layer / Ny film / second adhesive layer / sealant layer (8) Biaxially oriented polypropylene film / first adhesive layer / EVOH film / second adhesive layer / sealant layer

[0097] One embodiment of the packaging bag is a packaging bag formed by bonding packaging materials together, and the packaging material is the packaging material described above. FIG. 5 is a perspective view showing an example of the packaging bag. The packaging bag 200 is formed by bonding a pair of packaging materials 100 together, and the packaging material 100 may be the packaging materials 101, 102, 111, and 112 described above. The packaging bag 200 has a sealed portion 202 formed by bonding the peripheral edges of a pair of approximately rectangular film-like packaging materials 100 together, and a storage portion 204 formed between the pair of packaging materials 100 by the sealed portion 202. That is, the side edges, bottom edge, and top edge of the packaging bag 200 are sealed by the sealed portion 202. The packaging bag 200 has a storage portion 204 in which the packaged item is stored in an unsealed portion (sheet portion) surrounded by the sealed portion 202. Note that the sealed portion 202 at the bottom edge may be sealed after the packaged item is filled into the storage portion 204.

[0098] The pair of packaging materials 100 are overlapped so that the surfaces of the sealing layers 6 of the packaging materials shown in Figures 1 to 4 face each other. The pair of film-like packaging materials 100 may be bonded together with an adhesive at the sealing portion 202. It is not essential that the pair of packaging materials 100 constituting the packaging bag 200 have the same layer structure, and the pair of packaging materials 100 may be different from each other. For example, the pair of packaging materials 100 may be the above-mentioned packaging material 111 and packaging material 112.

[0099] The packaging bag 200 is formed by bonding together the above-described packaging materials 100, and therefore can be suitably used for packaging items that are prone to static electricity. That is, the packaged items may be dried bonito flakes, granules, or powder. That is, one embodiment of the package is a package in which the packaged items are housed in a housing portion of a packaging bag formed by bonding together packaging materials, and the packaging materials are the above-described packaging materials. The packaged items are dried bonito flakes, granules, or powder.

[0100] The above-mentioned package can be manufactured, for example, by the following method. One embodiment of the manufacturing method of the package includes the steps of accommodating an item to be packaged in the accommodating portion of the above-mentioned packaging bag, and sealing the packaging bag.

[0101] Although several embodiments have been described above, the descriptions of the common configurations can be applied to each other, and the present disclosure is not limited to the above-described embodiments. [Example]

[0102] The present disclosure will be described in more detail with reference to examples and comparative examples, but the present disclosure is not limited to the following examples.

[0103] In the following examples and comparative examples, the following materials were used.

[0104] [Potassium ions and ionic resins] MK440: Ethylene-(meth)acrylic acid copolymer (potassium ionomer (Entira AS series, manufactured by Dow Mitsui Polychemicals Co., Ltd.)) [Low-density polyethylene] LF580: Low-density polyethylene (LDPE, manufactured by Japan Polyethylene Co., Ltd.) 0540F: Low-density polyethylene (LLDPE, manufactured by Ube Maruzen Polyethylene Co., Ltd.) 071EB: Low-density polyethylene (LLDPE, manufactured by Ube Maruzen Polyethylene Co., Ltd.)

[0105] Example 1 A biaxially oriented polypropylene film (OPP#20, thickness: 20 μm) was prepared as the substrate, and a polyethylene (PET) film (manufactured by Toppan Printing Co., Ltd., product name: GLAE#12, thickness: 12 μm) having a vapor-deposited layer of alumina was prepared as the barrier layer. An adhesive was applied to the substrate, and a barrier layer was laminated to form a laminate A having a substrate, a first adhesive layer, and a barrier layer in this order. The thickness of the first adhesive layer was 1 μm.

[0106] Next, 10 parts by mass of MK440 as potassium ions and an ionic resin, and 90 parts by mass of LF580 as low-density polyethylene were weighed and mixed in a container to obtain a mixture for forming a first resin layer. LF580 was prepared for forming the second resin layer, and 0540F was prepared for forming the seal layer. Using a Neelam laminator, the sealant layer was formed by extruding the laminate B, which had the first resin layer, second resin layer, and seal layer in this order, under the conditions of a cylinder temperature of 160 to 255°C and a temperature below the die of 255°C.

[0107] An adhesive was applied to the barrier layer side of the laminate A formed as described above, and the first resin layer side of the laminate B was laminated on top of that, thereby preparing a packaging material comprising a base material, a first adhesive layer, a barrier layer, a second adhesive layer, a first resin layer, a second resin layer, and a seal layer in this order.

[0108] <Evaluation of packaging materials> The packaging material obtained as described above was measured and evaluated according to the following methods for the thickness of each layer, the density of the resin constituting each layer, the melt flow rate, the haze value, the barrier properties, the peel strength between the barrier layer and the sealant layer, the electrostatic decay time as a packaging material, and an adhesion test for dried bonito flakes. The results are shown in Table 2. In Table 2, "-" indicates that no measurement was performed.

[0109] [Thickness of each layer] The packaging material was cut along a cross section parallel to the lamination direction using a diamond cutter to obtain a cut surface. An observation image of the cross section was obtained using a microscopic Fourier transform infrared spectrophotometer (microscopic FT-IR spectrophotometer), and the thickness of each layer was measured from the observation image. The thickness was measured at 10 arbitrary points within the observation screen, and the average value was taken as the thickness of each layer.

[0110] [Density of resin constituting each layer] The density of the resin in each layer was measured in accordance with the method described in JIS K 7112:1999 "Method for measuring density and specific gravity of plastics - non-foamed plastics."

[0111] [Melt flow rate of resin constituting each layer] The melt flow rate of the resin in each layer was measured according to the method described in JIS K 7210-1:2014 "Plastics - Determination of melt mass-flow rate (MFR) and melt volume-flow rate (MVR) of thermoplastics - Part 1: Standard test method" (temperature: 190°C, load: 2.16 kg).

[0112] [Haze value of packaging material] The haze value was measured in accordance with the method described in JIS K 7136:2000 "Determination of haze of plastics - transparent materials."

[0113] [Barrier properties of packaging materials] The water vapor permeability and oxygen permeability were measured under conditions of a temperature of 30°C and a relative humidity (RH) of 70%. The oxygen permeability was measured in accordance with ASTM F1927-98 (2004), and the water vapor permeability was measured in accordance with ASTM F1249-01.

[0114] [Peel strength between barrier layer and sealant layer] The peel strength was measured in accordance with the method described in JIS K 6854-1:1999 "Adhesives - Test method for peel adhesion strength - Part 1: 90-degree peeling." For the measurement, a commercially available tensile testing device (Shimadzu Corporation, product name: Shimadzu Autograph AGS-X) was used, and the tensile speed was set to 300 mm / min.

[0115] [Static charge decay time as packaging material] The charge decay time of the packaging material was measured by applying a voltage of ±10 kV for 30 seconds to the packaging material obtained as described above in a direction perpendicular to the thickness direction of the packaging material, and measuring the charge on the packaging material over time starting immediately after the voltage application.The charge decay time was defined as the time elapsed until the charge on the packaging material had decayed by 10% from the value immediately after the voltage application.The distance between the packaging material and the electrode (voltage distance) during the voltage application was set to 15 mm.

[0116] [Dried bonito adhesion test for packaging materials] The degree of adhesion of dried bonito flakes to the packaging material was evaluated. The packaging material was sandwiched between a metal plate and a metal weight and rubbed 10 times, after which dried bonito flakes were sprinkled on it. The packaging material was then stood upright in a vertical position, and any dried bonito flakes that had fallen off due to their own weight were removed. The packaging material was then turned vertically and returned to a vertical position. The area of ​​dried bonito flakes adhering to the surface of the packaging material was photographed, and the area of ​​adhesion was measured based on the area of ​​the main surface of the packaging material. The results were evaluated according to the following criteria. A: The adhesion area is 0% (no bonito flakes are attached). B: The adhesion area is more than 0 area % and 5 area % or less. C: The adhesion area is more than 5% and 10% or less.

[0117] (Examples 2 to 4 and Comparative Examples 1 to 7) Packaging materials were prepared in the same manner as in Example 1, except that the components and thickness of each layer were changed as shown in Table 1. In Comparative Example 1, a packaging material was prepared without providing a first resin layer, and in Comparative Example 6, a packaging material was prepared without providing a first adhesive layer or a barrier layer. For each of the resulting packages, the thickness of each layer, the density of the resin constituting each layer, the melt flow rate, the peel strength between the barrier layer and the sealant layer, as well as the electrostatic decay time as a packaging material, the dried bonito adhesion test, the haze value, and the barrier properties were evaluated in the same manner as in Example 1. The results are shown in Table 2.

[0118] [Table 1]

[0119] [Table 2] [Industrial Applicability]

[0120] According to the present disclosure, it is possible to provide a packaging material that can exhibit static-proof properties on both main surfaces. According to the present disclosure, it is also possible to provide a packaging bag and a package that suppress adhesion of packaged items to the inner surface. [Explanation of symbols]

[0121] 2...first resin layer, 4...second resin layer, 6...sealing layer, 20...substrate, 30...barrier layer, 40...sealant layer, 100, 101, 102, 111, 112...packaging material, 200...packaging bag, 202...sealing portion, 204...containing portion.

Claims

1. A substrate and a sealant layer provided on the substrate, the sealant layer includes, from the substrate side, a first resin layer, a second resin layer, and a sealing layer in this order; the first resin layer contains a potassium ion ionomer composed of potassium ions and an anionic resin, and low-density polyethylene; the content of the potassium ion ionomer in the first resin layer is 7 to 25% by mass, the second resin layer contains a potassium ion ionomer, a distance X from a main surface of the substrate opposite to the sealant layer side to a main surface of the first resin layer on the substrate side of 9 to 100 μm; The packaging material, wherein a distance Y from a main surface of the sealant layer opposite to the substrate side to a main surface of the first resin layer opposite to the substrate side is 15 to 100 μm.

2. 2. The packaging material of claim 1, wherein the anionic resin comprises an ethylene-(meth)acrylic acid copolymer.

3. 3. The packaging material according to claim 1, wherein the first resin layer has a thickness of 5 to 40 μm.

4. The packaging material according to any one of claims 1 to 3, wherein the distance X is 50 µm or less.

5. The packaging material according to any one of claims 1 to 4, wherein the content of the potassium ion ionomer in the sealant layer is 7 to 25 mass%.

6. The packaging material according to any one of claims 1 to 5, wherein the sealant layer has a thickness of 20 to 100 µm.

7. The thickness of the first resin layer is 5 to 40 μm, and the density of the resin constituting the first resin layer is 0.90 to 0.95 g / cm ３ and The packaging material according to any one of claims 1 to 6, wherein the resin constituting the first resin layer has a melt flow rate of 2 to 13 g / min.

8. the sealant layer includes, from the substrate side, the first resin layer, the second resin layer, and the sealing layer in this order, The packaging material according to any one of claims 1 to 7, wherein the thickness of the second resin layer is 3 to 16 μm, the thickness of the sealing layer is 4 to 50 μm, and the total thickness of the second resin layer and the sealing layer is 15 μm or more.

9. The density of the resin constituting the first resin layer is 0.90 to 0.95 g / cm ３ and the density of the resin constituting the second resin layer is 0.90 to 0.95 g / cm ３ and the density of the resin constituting the sealing layer is 0.90 to 0.95 g / cm ３ The packaging material according to claim 8,

10. The packaging material according to claim 8 or 9, wherein the resin constituting the first resin layer has a melt flow rate of 2 to 13 g / min, the resin constituting the second resin layer has a melt flow rate of 2 to 13 g / min, and the resin constituting the seal layer has a melt flow rate of 2 to 13 g / min.

11. The packaging material according to any one of claims 1 to 10, further comprising a barrier layer between the substrate and the sealant layer.

12. The packaging material according to claim 11, wherein the peel strength between the barrier layer and the sealant layer is 1.0 N / 15 mm or more.

13. The packaging material according to any one of claims 1 to 12, which has a haze value of 20% or less.

14. The packaging material according to any one of claims 1 to 13, wherein the static charge decay time is 5.0 seconds or less.

15. The packaging material according to any one of claims 1 to 14, which is sandwiched between a metal plate and a metal weight, rubbed 10 times, and then, when dried bonito flakes are sprinkled on the packaging material, the area of ​​the packaging material to which dried bonito flakes adhere is 15 area% or less.

16. A packaging bag formed by bonding packaging materials, A packaging bag, wherein the packaging material is the packaging material according to any one of claims 1 to 15.

17. A package in which an item to be packaged is accommodated in a storage section of a packaging bag formed by bonding packaging materials, The packaging material is the packaging material according to any one of claims 1 to 15, The package, wherein the packaged item is dried bonito flakes, granules, or powder.

Images