Adhesive Electronic Control Unit

Abstract

To provide a bonded and sealed electronic control unit in which a plastic housing, a base and a printed circuit board are assembled at low cost.SOLUTION: An apparatus includes a housing (an upper housing 102 and a lower housing (or cover or baseplate)), a circuit board 110, a sealant 140 and a baseplate 104. The housing has a shelf 122 and a flange 124 along an open side. The circuit board is disposed on the shelf of the housing and inside the flange of the housing, and secured to the housing. The sealant is dispensed (i) through the open side of the housing and along a gap between the flange and the circuit board. The baseplate is compressed to the housing thereby causing the sealant to flow between the baseplate and the circuit board and between the baseplate and the flange.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates generally to automotive control assemblies, and more particularly to methods and / or apparatus for mounting adhesive electronic control units. [Background technology]

[0002] Manufacturers typically specify the level of sealing for a fully assembled electronic module. One or more connectors are typically included on the electronic module to provide electrical contact between the printed circuit board within the module and the vehicle harness outside the module. Potential leak paths between the connectors and the electronic module housing are typically sealed with applied seals or gaskets.

[0003] Current electronic module designs use a plastic housing and base, or a rubber gasket, to seal the base to the housing. Electronic modules also use potting or adhesive compounds on the outside of the housing to fill gaps. This design approach is expensive and has other drawbacks.

[0004] It may be desirable to implement an adhesive electronic control unit. Summary of the Invention

[0005] The present invention extends to aspects relating to an apparatus including a housing, a circuit board, a sealant, and a substrate. The housing may include a shelf and a flange along an open side. The circuit board may be (i) disposed on the shelf of the housing and inside the flange of the housing, and (ii) secured to the housing. The sealant may be applied (i) through the open side of the housing and (ii) along the gap between the flange and the circuit board. The substrate is compressed into the housing, thereby allowing the sealant to flow (i) between the substrate and the circuit board and (ii) between the substrate and the flange.

[0006] In some embodiments of the above device aspects, the sealant is cured to bond together the circuit board, the housing, and the substrate as the electronic control unit.

[0007] In some embodiments of the above device aspects, a connector is assembled to the circuit board to create a subassembly before the circuit board is disposed on the shelf.

[0008] In some embodiments of the above device aspects, the interface between the connector and the housing is free of sealant.

[0009] In some embodiments of the above device aspects, the connector is welded to the housing.

[0010] In some embodiments of the above device aspects, the plate is (i) disposed between the connector and the housing, and (ii) welded to the connector.

[0011] In some embodiments of the above device aspects, the housing is secured to the substrate only by a sealant.

[0012] In some embodiments of the above device aspects, one or more fasteners are configured to secure the housing to the substrate outside the sealant.

[0013] In some embodiments of the above apparatus aspects, the substrate is aligned with the housing with the sealant already applied prior to compression of the substrate into the housing.

[0014] In some embodiments of the above device aspects, the sealant is applied as a continuous bead around the periphery of the circuit board.

[0015] In some embodiments of the above device aspects, the sealant provides only a minimal seal against fluid penetration into the interior of the housing.

[0016] The present invention also extends to a second aspect of a method for assembling an electronic control unit, the method comprising the steps of: securing a circuit board to a housing, (i) the housing having a shelf and a flange along an open side, and (ii) the circuit board disposed on the shelf and inside the flange; applying a sealant (i) through the open side of the housing and (ii) along the gap between the flange and the circuit board; and compressing the board into the housing, thereby causing the sealant to flow between (i) the board and the circuit board and (ii) between the board and the flange.

[0017] In some embodiments of the second method aspect above, the sealant is allowed to cure to bond the circuit board, the housing, and the substrate together as an electronic control unit.

[0018] In some embodiments of the second method aspect above, the connector is assembled to the circuit board to create a subassembly before the circuit board is disposed on the shelf.

[0019] In some embodiments of the second method aspect above, the interface between the connector and the housing is free of said sealant.

[0020] In some embodiments of the second method aspect above, the housing is secured to the substrate only by the sealant.

[0021] Some embodiments of the second method aspect above include securing the housing to the substrate outside the sealant using one or more fasteners.

[0022] Some embodiments of the second method aspect above include aligning the substrate with the housing, with the sealant already applied, prior to compressing the substrate into the housing.

[0023] In some embodiments of the second method aspect above, the sealant is applied as a continuous bead around the periphery of the circuit board.

[0024] In some embodiments of the second method aspect above, the sealant provides only a minimal seal against fluid penetration into the interior of the housing. [Brief explanation of the drawings]

[0025] Embodiments of the invention will become apparent from the following detailed description, the appended claims, and the drawings. [Figure 1] 1 is a schematic diagram illustrating a perspective view of an apparatus, according to an example embodiment of the present invention. [Figure 2] 1 is a schematic diagram illustrating subassemblies of an apparatus according to an example embodiment of the present invention. [Figure 3] 1 is a schematic diagram illustrating an upper housing of a device, according to an example embodiment of the present invention. [Figure 4] 1 is a schematic diagram illustrating a partially assembled device, according to an example embodiment of the present invention. [Figure 5] 1 is a simplified diagram illustrating a substrate of a device, according to an example embodiment of the present invention. [Figure 6] 1 is a schematic diagram illustrating a helical spring of a device, according to an example embodiment of the present invention. [Figure 7] 1 is a schematic diagram showing a cross-sectional view of a device during assembly, according to an example embodiment of the present invention. [Figure 8] 1 is a schematic diagram illustrating a partial cross-sectional view of an apparatus after a substrate has been secured to an upper housing, according to an example embodiment of the present invention. [Figure 9] 1 is a schematic diagram showing a full cross-section of an assembled device according to an example embodiment of the present invention. [Figure 10] 1 is a schematic diagram showing a side view of an assembled device, according to an example embodiment of the present invention. [Figure 11] 1 is a flow diagram of a method for assembling a device, according to an example embodiment of the present invention. [Figure 12] 1 is a schematic diagram illustrating a perspective view of another apparatus, according to an example embodiment of the present invention. [Figure 13] 13 is a schematic diagram illustrating a perspective view of the substrate of FIG. 12, according to an example embodiment of the present invention. [Figure 14] 13 is a schematic diagram showing a side view of the assembled device of FIG. 12, in accordance with an example embodiment of the present invention. [Figure 15] 1 is a schematic diagram illustrating a portion of yet another apparatus, according to an example embodiment of the present invention. [Figure 16] 16 is a schematic diagram showing a cross-sectional view of a portion of the apparatus of FIG. 15, in accordance with an example embodiment of the present invention. [Figure 17] 16 is a schematic diagram illustrating a perspective view of the assembled device of FIG. 15, in accordance with an example embodiment of the present invention. [Figure 18] 1 is a schematic diagram illustrating a portion of another apparatus, according to an example embodiment of the present invention. [Figure 19] 1 is a diagram illustrating a spring-loaded weld, according to an example embodiment of the present invention. [Figure 20] 10 is a diagram illustrating another spring-loaded weld, according to an example embodiment of the present invention. [Figure 21] 10 is a diagram illustrating another spring-loaded weld according to an example embodiment of the present invention. [Figure 22] 10 is a schematic diagram illustrating a portion of yet another apparatus, according to an example embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0026] Embodiments of the present invention include providing an adhesive electronic control unit that (i) can be more cost-effective, (ii) can have improved sealing performance, (iii) can have improved mechanical transfer function performance, (iv) can have improved electromagnetic compatibility performance, (v) can be less expensive than a similar housing in which the connector is overmolded into the housing, (vi) can have a larger footprint for electronic components, (vii) can simplify assembly line manufacturing, (viii) can provide a robust seal between the housing and the connector, (ix) can provide no movement between the connector and the housing during welding, (x) can provide spring-loaded welds, (xi) can provide a robust housing assembly, and / or (xii) can be assembled without screws.

[0027] In various embodiments of the invention, a connector with corresponding pins may be assembled to a printed circuit board. The resulting subassembly may be secured (e.g., welded and / or glued) to a box housing having four closed sides. The subassembly secured to the housing generally forms a five-sided housing. The connector may be completely enclosed in the housing.

[0028] The various components of the electronic control unit can be held together using a sealant that bonds with the housing, subassemblies (e.g., printed circuit board and connectors), and board. The sealant generally seals the electronic control unit and provides bonding (or fastening) between the components. Because a significant perimeter portion of the printed circuit board is bonded between the housing and board, in various embodiments, typical fasteners used to attach the printed circuit board can be omitted. In other embodiments, some fasteners and / or fastener locations may be reduced and / or shifted so as not to interfere with module performance.

[0029] 1, a schematic diagram illustrating a perspective view of a device 100 is shown, in accordance with an example embodiment of the present invention. In various embodiments, device 100 may implement an electronic control unit (or module). Device 100 generally comprises an upper housing 102, a lower housing (or cover or board) 104, and a subassembly 106.

[0030] The upper housing 102 may be implemented as a non-conductive enclosure. While mated with the lower housing 104 and the subassembly 106, the upper housing 102 may be configured to provide an environmentally sealed enclosure. The enclosure may protect the components and devices of the subassembly 106. The upper housing 102 is generally constructed of a plastic or resin-based material. In various embodiments, plastic materials may include, but are not limited to, polyamide (nylon), polybutylene terephthalate (PBT), polypropylene, polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS), and / or various alloys and / or fillers of resin. Other materials may be implemented to meet the criteria of a particular application.

[0031] The lower housing 104 may be implemented as a conductive board. The lower housing 104 is generally configured to provide mechanical support, thermal cooling, and electrical grounding for the device 100. In various embodiments, the lower housing 104 may be constructed of a die-cast aluminum board. In another example, the board 104 may be implemented as a stamped steel board. Implementing the board 104 from a metal material can help dissipate heat generated by the circuitry within the device 100. The board 104 is generally configured to provide a mounting footprint for the device 100. In one example, the board 104 may be implemented with an RCM8 mounting footprint to simplify testing. However, other footprints may be implemented to meet the design criteria of a particular application.

[0032] A subassembly (or electrical assembly) 106 may implement the electronic components of device 100. The subassembly 106 may be operable to perform one or more electrical functions. The electrical functions may include, but are not limited to, providing a ground path for all electrical components within device 100 to the exterior of device 100, transmitting electrical inputs from various circuits within the vehicle to electronic components mounted within device 100, monitoring the performance of electronic sensors within the vehicle, and / or transmitting vehicle acceleration changes to electronic components mounted within device 100. In various embodiments, the subassembly 106 generally comprises a plate with one or more integrated connectors mounted to one or more printed circuit boards. The plate may be shaped to form five sides of the assembly 100 while secured to the upper housing 102. The printed circuit board may include electrical circuitry configured to perform the electrical functions.

[0033] Referring to FIG. 2 , a schematic diagram illustrating an implementation of a subassembly 106 is shown, in accordance with an example embodiment of the present invention. The subassembly 106 generally comprises one or more connectors 108, one or more printed circuit boards 110, a plate 112, and a plurality of electrical wires 114. In various embodiments, the plate 112 may be integrally formed with the connector 108 to provide a sealing surface. In other embodiments, the plate 112 may be formed separately from the connector 108 and then joined together as part of the connector 108. The electrical wires 114 may provide a plurality of electrical connections between the pins and / or sockets of the connector 108 and the printed circuit board 110. The electrical wires 114 may also provide mechanical support that holds the printed circuit board 110 approximately perpendicular to the plate 112.

[0034] In example embodiments, connector 108 generally includes a 72-pin connector and a 52-pin connector for providing electrical connection to printed circuit board 110. In one example, connector 108 may be implemented as a 1.8 mm pitch Nano connector. Other numbers of connectors, pins, and / or sockets may be implemented to meet the criteria of a particular application.

[0035] Referring to Figure 3, a schematic diagram illustrating an implementation of the upper housing 102 is shown, in accordance with an example embodiment of the present invention. The upper housing 102 is generally configured as a multi-sided (e.g., four-sided) enclosure. The side of the upper housing 102 that will be adjacent to the substrate 106 may be an open side 120. The side of the upper housing 102 that will receive the subassembly 106 may be an open connector side 126. The open side 120 and the open connector side 126 may be adjacent sides. The other four sides of the upper housing 102 may form closed sides of the enclosure.

[0036] A shelf 122 may be located on the three closed sides adjacent to the open side 120. The shelf 122 may be disposed within the upper housing 102. The shelf 122 may be configured to receive the printed circuit board 110 while the subassembly 106 is secured to the upper housing 102.

[0037] Flanges 124 may be formed on the three closed sides adjacent to the open side 120. The outer surfaces of the flanges 124 may be flat to mate with the substrate 104. The height of the flanges 124 may be greater than both the thickness of the printed circuit board 110 and the wires 114 protruding through the printed circuit board 110.

[0038] Open connector side 126 may have an interface 130 shaped to receive plate 112 of subassembly 106. In various embodiments, plate 112 of subassembly 106 may be configured to completely cover open connector side 126 of upper housing 102.

[0039] A support surface 128 may be formed inside the upper housing 102. There may be a gap between the support surface 128 and the plane established by the flange 124 to allow room for the printed circuit board 110.

[0040] 4, a schematic diagram showing a partially assembled device 100 is shown in accordance with an example embodiment of the present invention. The subassembly 106 and upper housing 102 may be secured together to form a five-sided box, with connectors 108 on the outside of the box. A plate 112 may be joined to the upper housing 102 by welding and / or adhesive. The five-sided box is generally closed on all sides except for open side 120.

[0041] The printed circuit board 110 may be disposed on the shelf 122 with one side of the printed circuit board 110 facing inward and another side facing outward through the open side 120. A continuous bead of sealant 140 may be applied (or placed) around the periphery of the open side 120. The continuous bead of sealant 140 may overlap at least the flange 124 and the printed circuit board 110. In various embodiments, the bead of sealant 140 may also overlap the plate 112 of the subassembly 106. In some embodiments, the sealant 140 may be a room temperature vulcanizing (RTV) type sealant. Other types of sealants may be implemented to meet the design criteria of a particular application.

[0042] 5, a schematic diagram illustrating the implementation of the substrate 104 is shown in accordance with an example embodiment of the present invention. The substrate 104 generally has a larger area than the open side 120 of the upper housing 102. A spring 142a may be attached to the side of the substrate 104 that faces the printed circuit board 110. The spring 142a may be welded or riveted to the substrate 104.

[0043] In various embodiments, the spring 142a may be implemented as a contact spring. The contact spring 142a may be formed of a conductive material (e.g., metal). The contact spring 142a may provide an electrical path from the printed circuit board 110 to the substrate 104. The substrate 104 may also include multiple (e.g., three) holes that are used to secure the device 100 in place within a vehicle (or structure). The conductive features of the substrate 104 may allow an electrical path from the printed circuit board 110 through the contact spring 142a, to the vehicle structure, and finally to the vehicle power ground.

[0044] 6, a schematic diagram illustrating the implementation of a helical spring 142b is shown according to an example embodiment of the present invention. The helical spring 142b may be implemented in place of the contact spring 142a. The helical spring 142b may be formed of a conductive material (e.g., metal). The helical spring 142b may provide an electrical path from the printed circuit board 110 to the substrate 104.

[0045] 7, a schematic diagram showing a cross-section of device 100 during assembly is shown in accordance with an example embodiment of the present invention. During assembly, upper housing 102, with subassemblies 106 already attached, can be flipped over so that its open side 120 faces upward. With upper housing 102 flipped over, the peripheral edge of printed circuit board 110 can rest on ledge 122 and inside flange 124. A portion of printed circuit board 110 can also rest on support surface 128.

[0046] A gap 150 may be present between the outer edge of the printed circuit board 110 and the flange 124. A sealant bead 140 may overlap the inner portion of the flange, the gap 150, and the outer portion of the printed circuit board 110.

[0047] The substrate 104 may be aligned with the upper housing 102 after the sealant bead 140 is applied. The spring 142 (contact spring 142a or helical spring 142b) may be aligned with the support surface 128.

[0048] 8, a schematic diagram illustrating a partial cross-section of device 100 after substrate 104 has been secured to upper housing 102 is shown in accordance with an example embodiment of the present invention. After substrate 104 is aligned with upper housing 102, substrate 104 can be pressed down toward upper housing 102.

[0049] The downward movement of substrate 104 can compress sealant 140. This compression can force sealant 140 into gap 150. The sealant 140 within gap 150 can help secure printed circuit board 110 in place. Because sealant 140 is flexible during most of the assembly process, the tolerances between printed circuit board 110 and flange 124 can be looser than typical designs.

[0050] This compression also causes the sealant 140 to flow laterally across the printed circuit board 110, the flange 124, and the inner surface of the substrate 104. The laterally flowing sealant 140 can increase the surface area over which mechanical bonds can be formed between the substrate 104 and the upper housing 102, and between the substrate 104 and the printed circuit board 110.

[0051] Springs 142 may contact printed circuit board 110 on support surface 128. Support surface 128 may help prevent printed circuit board 110 from flexing downward due to the continuous force exerted by springs 142 and / or shocks and vibrations experienced by device 100.

[0052] 9, a schematic diagram showing a full cross section of the device 100 when assembled is shown in accordance with an example embodiment of the present invention. The printed circuit board 110 may be captured along the periphery of the sealant 140. The component side of the printed circuit board 110 may face the interior 152 of the upper housing 102. The sealant 140 generally adheres to the component as shown.

[0053] In various embodiments, the base plate 104 may include a flange 154 that surrounds the upper housing 102. The flange 154 may limit outward side-to-side movement of the sealant 140 during assembly. The flange 154 may also provide protection for the sealant 140 during normal operation in the vehicle. The compressed sealant 140 and optional flange 154 generally provide minimal sealing against fluid penetration into the interior 152 of the upper housing 102.

[0054] Referring to FIG. 10 , a schematic diagram showing a side view of assembled device 100 is shown in accordance with an example embodiment of the present invention. While sealant 140 cures, assembly 100 can be oriented as shown in FIG. 10 . Once curing is complete, device 100 can be ready for testing. Device 100 can be rotated 180 degrees so that upper housing 102 is on top of substrate 104, as shown in FIG. 1 . Upper housing 102 on top of substrate 104 may be the normal orientation while assembly 100 is installed in a vehicle / structure. In one example, device 100 with enclosed printed circuit board 110 can implement a sealed, bonded electronic control unit that can meet international standards for intrusion protection. Ingress standards may include, but are not limited to, the IP67 ingress protection rating specified in International Electrotechnical Commission (IEC) standard 60529, Protection Ratings by Enclosures (IP Code), Ed. 2.2 (Geneva: International Electrotechnical Commission, 2013), which classifies the degree of protection provided in electrical enclosures against the ingress of solid objects (including body parts such as hands and fingers), dust, accidental contact, and water. IP Codes may include, but are not limited to, light water spray (e.g., IP53), complete immersion to a depth of 1 meter for 30 minutes (e.g., IP67 / 68), and sealing against pressures up to 6 psi (e.g., IP68). Prior to conducting the water spray and / or immersion tests, a differential pressure may be specified with the module preheated to 85°C.

[0055] Referring to FIG. 11 , a flow diagram of a method 180 for assembling device 100 is shown in accordance with an example embodiment of the present invention. Method (or process) 180 may be performed in a typical manufacturing facility using typical assembly equipment and techniques. Method 180 generally includes step (or state) 182, step (or state) 184, step (or state) 186, step (or state) 188, step (or state) 190, step (or state), and step (or state) 194. The order of steps 182-194 is shown as a representative example. Other order of steps may be implemented to meet the criteria of a particular application.

[0056] In step 182, the connector 108 and corresponding components 112 and 114 may be assembled with the printed circuit board 110 to form the subassembly 106. In various embodiments, electrical testing of the subassembly 106 may be included in step 182. The subassembly 106 may then be secured to the upper housing 102 in step 184. In various embodiments, the subassembly 106 may be secured to the upper housing 102 using typical welding techniques. In other embodiments, the subassembly 106 may be glued to the upper housing 102 with a commercially available adhesive. Once the upper housing 102 and subassembly 106 are joined, a five-sided box may be formed. The upper housing 102 with the attached subassembly 106 may then be oriented with the open side 120 / rear side of the printed circuit board 110 facing upward.

[0057] In step 186, a continuous bead of sealant 140 may be applied onto upper housing 102 and printed circuit board 110 (and optionally plate 112). In step 188, springs 142 may be attached to board 104. In various embodiments, step 188 may occur before, simultaneously with, or after any one or more of steps 182-186.

[0058] In step 190, the substrate 104 may be aligned with the upper housing 102, which has the sealant 140 already applied. In step 192, the substrate 104 may be compressed against the sealant 140 and the upper housing 102. The substrate 104 may close the open side 120 of the five-sided box. This compression may cause the sealant 140 to flow into the gap 150 (see FIG. 8 ) and spread across the printed circuit board 110. In step 194, the sealant 140 may be hardened by a curing process while the substrate 104 and upper housing 102 are held together. The cured sealant 140 generally bonds the substrate 104, upper housing 102, and printed circuit board 110 together. The curing process may include, but is not limited to, heat curing, moisture curing, ultraviolet light curing, and / or chemical curing. Once curing is complete, the device 100 may optionally be tested.

[0059] During the curing process, the substrate 104 and upper housing 102 may be held together by one or more mechanisms. In various embodiments, snap-fit ​​features and / or threaded fasteners may be used to maintain the spatial relationship between the upper housing 102 and the substrate 104 while the sealant 140 is still flexible.

[0060] Referring to FIG. 12 , a schematic diagram showing a perspective view of another device 200 is shown, in accordance with an example embodiment of the present invention. Device 200 may be a variation of device 100. Device (or module) 200 is generally comprised of subassembly 106, an upper housing 202, and a lower housing (or cover or substrate) 204. Upper housing 202 may be a variation of upper housing 102. Substrate 204 may be a variation of substrate 104. In some variations, upper housing 202 may include multiple optional tabs 206 (one tab visible in the figure) distributed across the lower edge of upper housing 202. In some configurations, upper housing 202 may also include multiple optional sockets 207 (two sockets visible in the figure) distributed across the outer periphery of upper housing 202.

[0061] The tabs 206 may be configured to engage openings in the lower housing 204 to provide a snap fit that provides a clamping force to the sealant 140 applied between the upper and lower housings 202, 204. When engaged, the tabs 206 may hold the upper and lower housings 202, 204 aligned while the sealant 140 cures. In some embodiments, the tabs 206 may be implemented without the sockets 207. In other embodiments, both the tabs 206 and the sockets 207 may be implemented.

[0062] The socket 207 may be configured to receive a threaded fastener (e.g., a screw). While the upper housing 202 and the substrate 204 are aligned with one another, the threaded fastener may be inserted into a hole in the substrate 204 and secured to the threads within the socket 207 in the upper housing 204. Alternatively, the threaded fastener may be inserted into the socket 207 and secured to the threads in the substrate 204. In some embodiments, the socket 207 may be implemented without the tabs 206. The threaded fastener may be tightened before, during, or after the upper housing 202 and the substrate 204 are compressed together. When fully tightened, the threaded fastener may hold the upper housing 202 and the lower housing 204 aligned while the sealant 140 cures.

[0063] 13, a schematic diagram showing a perspective view of substrate 204 is shown in accordance with an example embodiment of the present invention. Substrate 204 is generally configured with multiple optional sockets 208 and multiple optional openings 210. Sockets 208 are generally implemented in a configuration where upper housing 202 includes sockets 207. Openings 210 may be implemented in a configuration where upper housing 202 includes tabs 206.

[0064] Socket 208 may be configured to receive a threaded fastener (e.g., a screw) used to securely assemble upper housing 202 to substrate 204. In some embodiments, socket 208 may include threads for securing a threaded fastener inserted into socket 207 in upper housing 202. In other embodiments, socket 208 may be a smooth bore that allows a threaded fastener to pass through and thread into socket 207 in upper housing 202.

[0065] 14, a schematic diagram showing a side view of an assembled device 200 is shown in accordance with an example embodiment of the present invention. When the upper housing 202 is assembled to the substrate 204, tabs 206 (if implemented) on the upper housing 202 can engage with openings 210 in the substrate 204 to provide a snap fit that holds the upper housing 202 to the substrate 204. Threaded fasteners 212 (if implemented) can be used to secure the upper housing 202 to the substrate 204.

[0066] A predefined amount of torque may be applied to the threaded fasteners 212 to achieve a desired clamping force between the upper housing 202 and the base plate 204. In one example, the threaded fasteners 212 may be tightened (torqued) to provide a clamping force of 67 N per thread. Other torque amounts may be applied to meet the design criteria of a particular application.

[0067] 15, a schematic diagram illustrating an implementation of a portion of device 300 is shown, in accordance with an example embodiment of the present invention. Device 300 may be a variation of device 100 and / or device 200. Device (or module) 300 generally consists of subassembly 306, upper housing 302, lower housing (or cover or substrate), not shown, and weld ring (or welded portion) 332.

[0068] Upper housing 302 may be a variation of upper housing 102 and / or upper housing 202. Depending on the variation, upper assembly 302 may include open side 320, open connector side 326, interface 330, housing weld rib 334, shelf 122 (not shown), flange 124 (not shown), and support surface 128 (not shown). Open side 320 may be a variation of open side 120. Open connector side 326 may be a variation of open connector side 126. Interface 330 may be a variation of interface 130. In various embodiments, upper housing 302 may include tabs 206 and / or sockets 207 (shown in FIG. 12 ).

[0069] Subassembly 306 may be a variation of subassembly 106. Subassembly 306 generally consists of one or more connectors 108, one or more printed circuit boards 110, electrical wires 114, and plate 312. Printed circuit board 110 may be connected to pins and / or sockets in connector 108 by electrical wires 114.

[0070] Plate 312 may be a variation of plate 112. Plate 312 may include connector weld ribs 336. In various embodiments, plate 312 may be integrally formed with connector 108 to provide a sealing surface. In other embodiments, plate 312 may be formed separately from connector 108 and later joined together.

[0071] Open connector side 326 may have an interface 330 shaped to receive plate 312 of subassembly 306. In various embodiments, plate 312 of subassembly 306 may be configured to completely cover open connector side 326 of upper housing 302.

[0072] A weld ring 332 may be configured to pass around the connector 108 and physically connect to the housing weld rib 334 and the connector weld rib 336. The weld ring 332 may be attached to the weld ribs 334 and 336 after the subassembly 306 is positioned in the upper housing 302. The upper housing 302 may support the plate 312 from the welding forces applied in the welding process.

[0073] Housing weld ribs 334 may face outward from upper housing 302. Housing weld ribs 334 may follow the periphery along three sides of interface 330. Housing weld ribs 334 are generally configured to be welded to weld ribs 332.

[0074] A connector weld rib 336 may be formed around the periphery of the plate 312. The connector rib 336 may face away from the upper housing 302. The connector weld rib 336 is generally configured to be welded to the weld ring 332.

[0075] 16, a schematic diagram showing a cross-section of a portion of apparatus 300 is shown in accordance with an example embodiment of the present invention. Plate 312 may be disposed at interface 330 (FIG. 15) of upper housing 302. Weld ring 332 may be in physical contact with weld ribs 334-336.

[0076] Weld ring 332 and weld ribs 334-336 generally prevent any relative movement between upper housing 302 and plate 312 during the welding process. During the welding process, only weld ring 332 and weld ribs 334-336 can move because weld ribs 334 on upper housing 302 and weld ribs 336 on plate 312 can interlock. Because the welding laser light only penetrates weld ring 332, plate 312 can be made from a material that is not readily transparent to the welding laser light.

[0077] 17, a schematic diagram showing a perspective view of a portion of assembled device 300 is shown in accordance with an example embodiment of the present invention. A weld ring 332 may provide a permanent connection between plate 312 and upper housing 302.

[0078] Weld ring 322 and weld ribs 334-336 may provide a structurally sound interface between upper housing 302 and subassembly 306. Aside from weld ribs 334-336, there is no other movement that upper housing 302 and subassembly 306 may undergo. When welded in place, weld ring 322 generally seals subassembly 306 to upper housing 302. If a non-sealed version of assembly 300 is designed, weld ring 322 may be omitted without losing any functionality.

[0079] Referring to FIG. 18 , a schematic diagram illustrating a portion of another device 400 is shown, in accordance with an example embodiment of the present invention. Device 400 may be a variation of device 100, device 200, and / or device 300. Device (or module) 400 generally includes an upper housing 402, a subassembly (not shown), and a substrate (not shown). Upper housing 402 may be a variation of upper housings 102, 202, and / or 302. The subassembly may be a variation of subassembly 106 and / or 306. The subassembly may include a plate 412. Plate 412 may be a variation of plates 112 and / or 312. Device 400 generally exhibits a spring-loaded design that may include flexible features to allow a snug fit between upper housing 402 and plate 412. In various embodiments, upper housing 402 may be laser-opaque. In other embodiments, upper housing 402 may be laser-transparent.

[0080] The plate 412 generally includes a tab 440 and a flexible member 442. The tab 440 and the flexible member 442 may extend around three sides of the plate 412 that contact the upper housing 402.

[0081] Upper housing 402 is generally configured with a groove (or slot) 444, a corner 446, an optional protrusion 448, and another optional protrusion 450. Groove 444, corner 446, protrusion 448, and protrusion 450 may extend around the three sides of upper housing that contact plate 412. Groove 444 may be shaped such that tab 440 of plate 412 can be inserted into groove 444.

[0082] Referring to FIG. 19 , a schematic diagram illustrating spring-loaded welding is shown, in accordance with an example embodiment of the present invention. The spring-loaded design of FIG. 19 generally includes tabs 442 on the plate 412 that are inserted into grooves 444 along three sides of the upper housing 402. In some embodiments, the illustrated design may not include protrusions 448. The free end of the flexible member 442 may generally extend from protrusion 450 (shown) or, if implemented, protrusion 448 (not shown). The flexible member 442 may bend until it contacts protrusion 450. While bending, the flexible member 442 may also press against corner 446 to provide a preload (or interference) point 460. The preload point 460 generally provides a snug fit between the plate 412 and the upper housing 402. A welding laser beam 462 may be used to weld the flexible member 442 to the protrusion 450 on the upper housing 402. A welding laser beam 462 can be passed through flexible member 442. The resulting weld can meet sealing criteria between components 402 and 412 and can enhance mechanical retention.

[0083] Referring to FIG. 20 , a schematic diagram illustrating another spring-loaded weld is shown, in accordance with an example embodiment of the present invention. The spring-loaded design of FIG. 20 generally includes tabs 442 on plate 412 that are inserted into grooves 444 along three sides of upper housing 402. The free end of flexible member 442 may generally extend against protrusions 448 and 450. Flexible member 442 may bend until it contacts protrusions 448 and 450. While bending, flexible member 442 may press against protrusion 448, providing a preload point 460. A welding laser beam 462 may be used to weld flexible member 442 to protrusion 450. Welding laser beam 462 may be passed through flexible member 442. The resulting weld may meet sealing criteria between components 402 and 412 and may enhance mechanical retention.

[0084] Referring to FIG. 21 , a schematic diagram illustrating yet another spring-loaded weld is shown, in accordance with an example embodiment of the present invention. The spring-loaded design of FIG. 21 generally includes tabs 442 on a plate 412 that are inserted into grooves 444 along three sides of the upper housing 402. In some embodiments, the illustrated design may not include a protrusion 450. The free end of the flexible member 442 may generally extend against the protrusion 448, or, if implemented, against the protrusion 450. The flexible member 442 may bend until it contacts the protrusion 448 and the outer edge of the upper housing 402. While bending, the flexible member 442 may press against the protrusion 448, providing a preload point 460. A welding laser beam 462 may be used to weld the flexible member 442 to the outer edge of the upper housing 402. The welding laser beam 462 may be passed through the upper housing 402. The resulting weld can meet sealing criteria between components 402 and 412 and can enhance mechanical retention.

[0085] Referring to FIG. 22 , a schematic diagram illustrating a portion of device 400a is shown in accordance with an example embodiment of the present invention. Device 400a may be a variation of device 100, device 200, device 300, and / or device 400. Device (or module) 400a generally includes an upper housing 402a, a subassembly (not shown), and a substrate (not shown). Upper housing 402a may be a variation of upper housing 102, 202, 302, and / or 402. The subassembly may be a variation of subassembly 106 and / or 306. The subassembly may include plate 412a. Plate 412a may be a variation of plate 112, 312, and / or 412. Device 400a generally exhibits a spring-loaded design in which flexible features may be present on upper housing 402a to allow for a snug fit between upper housing 402a and plate 412a. In various embodiments, the upper housing 402a may be laser transmissive.

[0086] The plate 412a generally includes a protrusion 452. The protrusion 452 may extend around three sides of the plate 412a that contact the upper housing 402a.

[0087] The upper housing 402a is generally comprised of a groove 444 (see FIG. 18), a flange 454, and a cross member 456. The groove 444, flange 454, and cross member 456 may extend around three sides of the upper housing 402a that contact the plate 412a. The groove 444 may be shaped such that the protrusion 452 of the plate 412a can be inserted into the groove 444.

[0088] When the plate 412a and protrusion 452 are fitted to the upper housing 402a, the free end of the cross member 456 may bend against the plate 412a and by the protrusion 452. During bending, the cross member 456 may press against a corner of the protrusion 452 to create a preload (or interference) point 460. The preload point 460 provides a nearly flush fit between the plate 412a and the upper housing 402a. A welding laser beam 462 may be used to weld the cross member 456 to the protrusion 452. The welding laser 462 may be passed through the cross member 456. The resulting weld may meet sealing criteria between the components 402a and 412a and may enhance mechanical retention.

[0089] A preload design generally eliminates relative movement between the connector and the upper housing. A preload design can provide a structurally robust interface between the upper housing and the connector. In various embodiments, the sole function of the weld can be for sealing. If a non-sealed module is desired, the welding process can be omitted.

[0090] The device 100 / 200 / 300 / 400 / 400a generally offers several advantages over conventional designs. Specifically, the device eliminates the need for screws and therefore the need for sealing around corresponding screw pockets. Furthermore, the upper housing does not require metal inserts to fit the screws. Mechanical fastening of the printed circuit board to the upper housing can be achieved by a sealant. The assembly can pass IP67 testing and higher sealing standards.

[0091] Fasteners may be included outside the sealed area if implemented to hold the upper housing and substrate together over the life of the assembly. Fasteners may include, but are not limited to, tabs and apertures, and may include threads and / or press-fit designs for complete assembly.

[0092] Because the substrate can be made of a conductive material (e.g., metal), the electromagnetic compatibility (EMC) performance of the device can be enhanced. The mating connector / substrate can be welded to the upper housing, thereby forming a sealed module and holding the connector in place. Method 180 can also be used to weld or adhere a plastic type substrate to the upper housing.

[0093] The design and assembly techniques for the device 100 / 200 / 300 / 400 / 400a may have the advantage of being cost-effective and enhancing the performance of the module (in terms of sealing, mechanical transfer function, and EMC performance). Welding / bonding the subassembly to the upper housing avoids applying sealant to the connector plate to housing interface. Larger part and assembly tolerances may be possible, as the applied sealant can mitigate component variations. Also, only one sealant application operation is required to seal the entire module.

[0094] Metal-type boards can improve the Mechanical Transfer Function (MTF) compared to ECU designs with plastic housings and covers. The device can be less expensive than similar housings where the connectors are overmolded onto the housing. The absence of fasteners that penetrate the printed circuit board or the interior of the enclosure allows for more area for electronic components on the printed circuit board.

[0095] Method 180 may allow for a simpler assembly line because the connector, once attached to the upper housing, may be completely sealed to the upper housing. Welding / bonding the subassembly to the upper housing may provide a robust seal between the upper housing and the connector and plate. The finished device may be mechanically strong because the connector and plate, once welded / bonded to the upper housing, may become structural components therein.

[0096] The functions and structures shown in the diagrams of Figures 1-22 can be designed, modeled, emulated, and / or simulated using one or more conventional general-purpose processors, digital computers, microprocessors, microcontrollers, distributed computing resources, and / or similar computing devices programmed according to the teachings herein, as would be apparent to one skilled in the art. The relevant software, firmware, coding, routines, instructions, opcodes, microcode, and / or program modules may have already been prepared by skilled programmers based on the teachings of this disclosure and as would be apparent to one skilled in the art. The software is generally embodied in one medium or several media, such as non-transitory storage media, and may be executed serially or in parallel by one or more of the processors.

[0097] The terms "may" and "generally," when used herein in conjunction with "is (are)" and the verb, are intended to convey the intention that the detailed description is considered exemplary and broad enough to encompass both the specific examples presented in this disclosure as well as alternatives that may be derived based on this disclosure. The terms "may" and "generally," when used herein, should not be construed as necessarily implying the desirability or possibility of omitting the corresponding element.

[0098] While the present invention has been particularly shown and described with reference to embodiments thereof, workers skilled in the art will recognize that various changes in form and details can be made therein without departing from the scope of the invention.

Claims

1. a circuit board (110); a housing (102) capable of accommodating the circuit board (110); a cover (104) provided to cover the open surface of the housing (102); a seal (140) that seals the housing (102) and the cover (104); The housing (102) includes a shelf (122) on which the circuit board (110) is placed at the edge of the open surface, and a housing flange (124) provided on the outside of the shelf (122), The cover (104) includes a cover flange (154) surrounding the housing (102), the cover flange (154) being disposed on the opposite side of the housing flange (124) from the side on which the circuit board (110) is located; The sealing material (140) is positioned at least in the upper portion of the gap (150) between the outer edge of the circuit board (110) and the inner wall of the housing flange (124), and by pressing the cover (104) against the housing (102), the sealing material (140) penetrates into the interior of the gap (150), between the upper surface of the housing flange (124) and the surface of the cover (104) facing the housing (102), and between the surface of the circuit board (110) facing the cover (104) and the surface of the cover (104) facing the housing (102).

2. 2. The device of claim 1, wherein the encapsulant (140) seals the circuit board (110), the housing (102), and the cover (104).

3. The device according to claim 1, wherein the circuit board (110) is provided with a connector that can be connected to an external terminal.

4. 4. The device of claim 3, wherein the sealant (140) is absent at the interface between the connector and the housing.

5. 4. The device of claim 3, wherein the connector is welded to the housing.

6. 4. The device of claim 3, further comprising a plate disposed between the connector and the housing and welded to the connector.

7. 2. The apparatus of claim 1, wherein the housing (102) is secured to the cover (104) only by the sealant (140).

8. 2. The apparatus of claim 1, further comprising fasteners securing the housing (102) to the cover (104) outside the seal (140).

9. 2. The apparatus of claim 1, wherein the cover (104) is aligned with the housing (102) with the sealing material (140) already applied before pressing the cover (104) against the housing (102).

10. The apparatus of claim 9, wherein the encapsulant (140) is applied as a continuous bead along a periphery of the circuit board (110).

11. The apparatus of claim 10, wherein the seal (140) provides a seal against fluid penetration into the interior of the housing (102).

12. The device according to any one of claims 1 to 11, further comprising springs (142a, 142b) provided on a surface of the cover (104) facing the circuit board (110).

13. 12. The apparatus of any one of claims 1 to 11, further comprising a support member (128) disposed between the housing (102) and the circuit board (110).

14. springs (142a, 142b) provided on a surface of the cover (104) facing the circuit board (110); 12. The device of claim 1, further comprising a support member (128) positioned between the housing (102) and the circuit board (110) and aligned with the springs (142a, 142b).

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