Laser processing machine and correction program

Abstract

The present invention relates to a laser processing machine and a correction program that can automatically correct the orientation of a workpiece. [Solution] The system includes a chuck that can grip a long workpiece and rotate the workpiece in a circumferential direction around the workpiece's longitudinal axis, an imaging device that images one longitudinal end face of the workpiece gripped by the chuck, a memory unit that stores information about the reference orientation of the workpiece at the start of processing, a detection unit that detects the current orientation of the workpiece from the end face image captured by the imaging device, and a correction unit that calculates the amount of deviation of the current orientation from the reference orientation and corrects the amount of rotation of the workpiece based on the calculated amount of deviation.

Description

[Technical Field]

[0001] The present invention relates to a laser processing machine and a correction program. [Background technology]

[0002] Conventionally, there has been known a laser processing machine that carries a long workpiece into a chuck on a conveyor, and while the workpiece is held by the chuck, cuts one longitudinal end of the workpiece with a laser to manufacture a product (a portion cut from the workpiece) (see, for example, Patent Document 1). In the laser processing machine described in Patent Document 1, a laser is irradiated onto the workpiece from above while the workpiece is rotated by the chuck, thereby performing a predetermined laser processing on a predetermined surface of the workpiece. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] European Patent No. 2827206 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the laser processing machine of Patent Document 1 does not always grip the workpiece in the correct orientation, and there is a problem that if the workpiece is gripped in the wrong orientation, processing defects may occur. That is, the workpieces handled by the laser processing machine of Patent Document 1 are long and tend to roll, so there is a risk that the workpiece will roll when being carried in by a conveyor, and therefore the workpiece may be gripped in the chuck in an orientation different from the specified orientation. In this case, there is a problem that the specified laser processing cannot be performed on the specified surface of the workpiece.

[0005] One aspect of the present invention relates to a laser processing machine and a correction program that can automatically correct the orientation of a workpiece. [Means for solving the problem]

[0006] A laser processing machine according to one aspect of the present invention comprises a chuck capable of holding a long workpiece and rotating the workpiece in a circumferential direction around the longitudinal axis of the workpiece, an imaging device that images one longitudinal end face of the workpiece held by the chuck, a memory unit that stores information about the reference orientation of the workpiece at the start of processing, a detection unit that detects the current orientation of the workpiece from the end face image captured by the imaging device, and a correction unit that calculates the amount of deviation of the current orientation from the reference orientation and corrects the amount of rotation of the workpiece based on the calculated amount of deviation.

[0007] A correction program according to one embodiment of the present invention causes a laser processing machine to perform an imaging process of imaging one longitudinal end face of a long workpiece held in a chuck capable of holding the workpiece and rotating the workpiece in a circumferential direction around the longitudinal axis of the workpiece, a detection process of detecting the current orientation of the workpiece from the end face image captured by executing the imaging process, and a correction process of calculating the amount of deviation of the current orientation from the reference orientation of the workpiece at the start of processing and correcting the amount of rotation of the workpiece based on the calculated amount of deviation.

[0008] According to one embodiment of the laser processing machine and correction program of the present invention, the amount of deviation between the reference orientation and the current orientation of the workpiece can be calculated, and the amount of rotation of the workpiece can be corrected based on the calculated amount of deviation, thereby automatically correcting the orientation of the workpiece. [Effects of the Invention]

[0009] According to the laser processing machine and the correction program according to one aspect of the present invention, the orientation of the workpiece can be automatically corrected. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic front view showing a laser processing machine according to an embodiment of the present invention; [Figure 2]1 is a block diagram showing a part of a laser processing machine according to an embodiment of the present invention; [Figure 3] FIG. 2 is a schematic view showing a state in which the chuck according to the embodiment grips a workpiece. [Figure 4] 1A to 1C are schematic diagrams showing examples of types of shapes of one end face in the longitudinal direction of a workpiece. [Figure 5] Figure 5(a) is a diagram showing an example of the reference orientation and reference surface of a workpiece having a rectangular frame shape, Figure 5(b) is a diagram showing an example of the reference orientation and reference surface of a workpiece having an L-shape, and Figure 5(c) is a diagram showing an example of the reference orientation and reference surface of a workpiece having a U-shape. [Figure 6] FIG. 6(a) is a schematic diagram showing the state in which the reference orientation and current orientation of the workpiece are aligned, and FIG. 6(b) is a schematic diagram showing the state in which the workpiece has been rotated from the state shown in FIG. 6(a) in accordance with the machining program. [Figure 7] Figure 7(a) is a schematic diagram showing a state in which the reference orientation and current orientation of the workpiece do not match, and Figure 7(b) is a schematic diagram showing a state in which the workpiece has been rotated from the state in Figure 7(a) in accordance with the machining program. DETAILED DESCRIPTION OF THE INVENTION

[0011] Preferred embodiments for carrying out the present invention will be described below with reference to the drawings. Note that the following embodiments do not limit the inventions according to the claims, and not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention. Furthermore, in the present embodiments, the scale and dimensions of each component may be exaggerated, and some components may be omitted.

[0012] [Laser processing machine overview] The laser processing machine according to this embodiment is a processing machine that cuts a long workpiece such as a pipe with a laser and delivers the cut portion as a product. The product has been subjected to laser processing (cutting, drilling, marking, engraving, etc.) according to a processing program.

[0013] Fig. 1 is a schematic front view showing a laser processing machine according to this embodiment, and Fig. 2 is a block diagram showing a part of the laser processing machine according to this embodiment. As shown in Figures 1 and 2, the laser processing machine 1 is equipped with a chuck 10 that can hold a long workpiece W and rotate the workpiece W in a circumferential direction around the longitudinal axis of the workpiece W, an imaging device 50 that images one longitudinal end face of the workpiece W held by the chuck 10, a memory unit 71 that stores information about the reference orientation of the workpiece W at the start of processing, a detection unit 51b that detects the current orientation of the workpiece W from the end face image captured by the imaging device 50, and a correction unit 72d that calculates the amount of deviation of the current orientation from the reference orientation and corrects the amount of rotation of the workpiece W based on the calculated amount of deviation.

[0014] In this specification, the "reference orientation of the workpiece W" refers to the correct circumferential orientation of the workpiece W at the start of processing. Furthermore, the "current orientation of the workpiece W" refers to the circumferential orientation of the workpiece W when it is gripped by the chuck 10. In a structure in which a laser is irradiated from one direction (from above in this embodiment), as in the laser processing machine according to this embodiment, if the reference orientation and the current orientation of the workpiece W match, laser processing can be performed in accordance with the processing program (predetermined laser processing can be performed on a predetermined surface of the workpiece W). However, if the reference orientation and the current orientation of the workpiece W do not match, laser processing cannot be performed in accordance with the processing program (predetermined laser processing cannot be performed on a predetermined surface of the workpiece W). For this reason, the laser processing machine according to this embodiment is configured to perform a correction process, which will be described later, when the reference orientation and the current orientation of the workpiece W do not match.

[0015] In this specification, of the two longitudinal ends of the workpiece W, the end that is imaged by the imaging device 50 (the left end of the workpiece W shown in Figure 1) will be described as the "one longitudinal end," and the opposite end (the right end of the workpiece W shown in Figure 1) will be described as the "other longitudinal end."

[0016] [Overall configuration of laser processing machine] As shown in Figures 1 and 2, the laser processing machine 1 includes a chuck 10, a support table 20 that supports the chuck 10, a loading device 30 that can load a workpiece W into the chuck 10, a laser irradiation device 40 that laser processes the workpiece W held by the chuck 10, an imaging device 50, an unloading device 60 that can unload a product P obtained by laser processing by the laser irradiation device 40, and a control device 70.

[0017] [Chuck configuration] As shown in FIG. 1, the chuck 10 has a first chuck 10A capable of gripping the other end of the workpiece W in the longitudinal direction, and a second chuck 10B capable of gripping the middle portion of the workpiece W in the longitudinal direction.

[0018] FIG. 3 is a schematic diagram showing a state in which the chuck according to this embodiment grips a workpiece. As shown in Figures 2 and 3, the first chuck 10A and the second chuck 10B have a fixed portion 11, a rotating portion 12 configured to be rotatable relative to the fixed portion 11, a motor 13 that rotates the rotating portion 12, and a rotary encoder 14 that can measure the amount of rotation (rotation angle) of the motor 13.

[0019] The rotating part 12 has a plurality of claws 12a (four in this embodiment) capable of gripping the workpiece W. The claws 12a are provided in a circumferential direction centered on the rotation axis of the rotating part 12. The motor 13 is a servomotor, and is configured to rotate based on a rotation command received from a chuck control part 72a (described later) of the control device 70. The motor 13 of the first chuck 10A and the motor 13 of the second chuck 10B are configured to rotate synchronously. The rotary encoder 14 is attached to the motor 13, and is configured to transmit the amount of rotation (rotation angle) of the motor 13 to the control device 70.

[0020] The first chuck 10A and the second chuck 10B are provided opposite each other in a direction along the rotation axis of the rotating part 12 (X direction in FIG. 1). The first chuck 10A is configured to move in a direction along the rotation axis of the rotating part 12 (X direction in FIG. 1) based on a chuck movement command received from a chuck control part 72a (described later) of the control device 70. In other words, the first chuck 10A is configured to be able to approach or move away from the second chuck 10B, and is configured to be able to move the workpiece W along the longitudinal direction of the workpiece W.

[0021] The structure of the chuck 10 itself can be a known structure, and therefore a detailed description thereof will be omitted.

[0022] [Loading equipment configuration] As shown in FIG. 1, the carry-in device 30 is provided in front of the chuck 10 and the support table 20. A plurality of carry-in devices 30 (three in this embodiment) are provided along the direction along the rotation axis of the rotating part 12 of the chuck 10 (X direction in FIG. 1). As the carry-in device 30, for example, a conveyor can be used. The carry-in device 30 preferably has a length in the front-rear direction (Y direction in FIG. 1) that allows a plurality of workpieces W (for example, five) to be placed thereon. The carry-in device 30 carries the workpiece W into the chuck 10 when an automatic operation start button displayed on an operation display unit 73 of the control device 70 (described later) is operated.

[0023] It should be noted that a known configuration can also be adopted for the carry-in device 30, and therefore a detailed description thereof will be omitted.

[0024] [Configuration of laser irradiation device] As shown in FIGS. 1 and 2, the laser irradiation device 40 has an oscillator 41 capable of generating a laser beam, and a laser head 42 connected to the oscillator 41 via a cable (not shown).

[0025] The oscillator 41 is configured to generate a laser beam based on a laser irradiation command received from a laser control unit 72b (described later) of the control device 70, and to supply the generated laser beam to the laser head 42. The laser head 42 is provided on the opposite side of the second chuck 10B from the first chuck 10A and above the workpiece W held by the chuck 10. The laser head 42 is configured to irradiate the laser beam supplied from the oscillator 41 toward the workpiece W. The laser head 42 is configured to be movable in the front-to-rear direction (Y direction in FIG. 1) and the up-down direction (Z direction in FIG. 1), and is configured to move based on a head movement command received from a laser control unit 72b (described later) of the control device 70.

[0026] It should be noted that a known configuration can also be adopted for the laser irradiation device 40, and therefore a detailed description thereof will be omitted.

[0027] [Configuration of imaging device] 1 and 2, the imaging device 50 has an apparatus main body 51 and a storage box 52 that stores the apparatus main body 51. The apparatus main body 51 has an imaging unit 51a that captures an image of the end face of the workpiece W, a detection unit 51b, and a switching unit 51c that can switch between a stored state in which the imaging unit 51a is stored in the storage box 52 and an exposed state in which the imaging unit 51a is exposed from the storage box 52.

[0028] The imaging unit 51a is a camera capable of capturing an end face image of the workpiece W. Specifically, the imaging unit 51a is an AI camera having a detection unit 51b. The detection unit 51b is configured to detect the current orientation of the workpiece W from the end face image of the workpiece W. Furthermore, the detection unit 51b is configured to detect the shape of the workpiece W based on the end face image captured by the imaging unit 51a and the trained model. Specifically, the detection unit 51b is configured to recognize the characteristics of the shape of the workpiece W from the end face image of the workpiece W, and to identify the shape of the workpiece W based on the recognized characteristics.

[0029] FIG. 4 is a schematic diagram showing an example of the shape of one end face in the longitudinal direction of a workpiece. The trained model was generated by learning the types and characteristics of the shape of one end face in the longitudinal direction of the workpiece W. Types of shapes of one end face in the longitudinal direction of the workpiece W include, for example, a square frame shape, a circular frame shape, an L-shape, an approximately L-shape, a U-shape, an approximately U-shape, an H-shape, a rectangle, an elongated hole shape, and an elliptical frame shape (see Figure 4). The trained model can also distinguish between shapes of the same type but with different orientations.

[0030] The switching unit 51c is configured to be extendable in the vertical direction (Z direction in FIG. 1), and is configured to switch between a stored state and an exposed state by extending and contracting. The upper end of the switching unit 51c is attached inside the storage box 52, and the imaging unit 51a is attached to the lower end of the switching unit 51c. The imaging unit 51a may be configured to be rotatable (swivelable) around a connection with the switching unit 51c. A known driving mechanism such as an electric cylinder or a rack and pinion can be used as the switching unit 51c.

[0031] The storage box 52 is large enough to store the imaging unit 51a and the switching unit 51c. The entire bottom surface of the storage box 52 or a part of the bottom surface is configured to be openable and closable. According to the imaging device 50 of this embodiment, the imaging unit 51a can be stored in the storage box 52 when not capturing an end face image, thereby protecting the imaging unit 51a from dust.

[0032] The imaging device 50 having the above configuration is configured to capture an end face image of the workpiece W based on an imaging command received from an imaging control unit 72c of the control device 70, which will be described later, and to detect the current orientation and shape of the workpiece W. Specifically, when the imaging device 50 receives an imaging command from the imaging control unit 72c, the storage box 52 opens its bottom, the switching unit 51c changes the imaging unit 51a from a stored state to an exposed state, and the imaging unit 51a captures an end face image of the workpiece W. The detection unit 51b detects the current orientation and shape of the workpiece W from the end face image of the workpiece W. The current orientation and shape of the workpiece W detected by the detection unit 51b are transmitted to the control device 70. When imaging of the end face image of the workpiece W is completed, the switching unit 51c changes the imaging unit 51a from an exposed state to a stored state, and the storage box 52 closes its bottom.

[0033] [Configuration of the unloading device] As shown in Figure 1, the carrying-out device 60 has a first carrying-out device 61 that carries out the product P obtained by laser processing by the laser irradiation device 40, and a second carrying-out device 62 that further carries out the product P carried out by the first carrying-out device 61.

[0034] The first carry-out device 61 extends in a direction along the rotation axis of the rotating part 12 of the chuck 10 (X direction in FIG. 1), and is configured to carry out the product P from the chuck 10 side to the non-chuck 10 side. The second carry-out device 62 is provided in front of the first carry-out device 61, and is configured to carry out the product P carried out by the first carry-out device 61 forward. A plurality of second carry-out devices 62 (two in this embodiment) are provided in the direction along the rotation axis of the rotating part 12 of the chuck 10. For example, conveyors can be used as such first carry-out device 61 and second carry-out device 62.

[0035] It should be noted that a known configuration can also be adopted for the unloading device 60, and therefore a detailed description thereof will be omitted.

[0036] [Control device configuration] As shown in FIG. 2, the control device 70 has a memory unit 71 having at least a RAM (Random Access Memory) and a ROM (Read Only Memory), a control unit 72 having at least a CPU (Central Processing Unit), and an operation display unit 73 that accepts input operations by an operator to the control device 70.

[0037] Figure 5(a) is a diagram showing an example of the reference orientation and reference surface of a workpiece having a rectangular frame shape, Figure 5(b) is a diagram showing an example of the reference orientation and reference surface of a workpiece having an L-shape, and Figure 5(c) is a diagram showing an example of the reference orientation and reference surface of a workpiece having a U-shape. The memory unit 71 is configured to store information on the reference orientation of the workpiece W at the start of processing. Specifically, as shown in Fig. 5, the memory unit 71 is configured to store information on the reference orientation for each shape of the workpiece W. Fig. 5 shows, as examples, an example of the reference orientation of a workpiece having a rectangular frame shape (see Fig. 5(a)), an example of the reference orientation of a workpiece having an L-shape (see Fig. 5(b)), and an example of the reference orientation of a workpiece having a U-shape (see Fig. 5(c)).

[0038] The memory unit 71 is also configured to store information on the reference plane RP in the reference orientation of the workpiece W. Specifically, as shown in FIG. 5, the memory unit 71 is configured to store a predetermined surface of the circumferential surface of the workpiece W as the reference plane RP. The reference plane RP is a surface that serves as a reference when calculating the amount of deviation of the current orientation of the workpiece W from the reference orientation. The type of shape of the workpiece W, the reference orientation of each workpiece W, and the reference plane RP of each workpiece W to be stored in the memory unit 71 can be arbitrarily set by the worker. Note that the reference orientation for each type of shape of the workpiece W is not limited to one, and multiple reference orientations may be set. In other words, multiple reference orientations may be set for one type of shape.

[0039] The storage unit 71 is configured to store a processing program and a correction program. The processing program is a program for causing the laser processing machine 1 to execute a process for performing laser processing on the workpiece W. The processing program defines operations to be executed by the chuck 10 and the laser irradiation device 40. The correction program is a program for causing the laser processing machine 1 to execute the following processes: an imaging process for capturing an image of one longitudinal end face of the workpiece W held by the chuck 10, which is capable of gripping a long workpiece W and rotating the workpiece W in a circumferential direction about the longitudinal axis of the workpiece W; a detection process for detecting the current orientation of the workpiece W from the end face image captured by executing the imaging process; and a correction process for calculating the amount of deviation of the current orientation of the workpiece W from a reference orientation of the workpiece W at the start of processing and correcting the amount of rotation of the workpiece W based on the calculated amount of deviation.

[0040] The control unit 72 includes a chuck control unit 72a that controls the chuck 10, a laser control unit 72b that controls the laser irradiation device 40, an imaging control unit 72c that controls the imaging device 50, and a correction unit 72d.

[0041] The chuck control unit 72a is configured to send a rotation command to the motor 13 of the chuck 10 based on the machining program. The rotation command includes the amount of rotation (rotation angle), rotation speed, rotation direction, etc. The chuck control unit 72a is also configured to control the amount of rotation (rotation angle) of the motor 13 based on the amount of rotation (rotation angle) of the motor 13 received from the rotary encoder 14. Specifically, the chuck control unit 72a is configured to send a rotation command to the motor 13 until the measurement value of the rotary encoder 14 reaches a specified value of the machining program.

[0042] The chuck control unit 72a is configured to send a chuck movement command to the first chuck 10A of the chuck 10 based on the machining program. The chuck movement command includes a movement amount, a movement speed, a movement direction, etc.

[0043] The laser control unit 72b is configured to send a laser irradiation command to the oscillator 41 of the laser irradiation device 40 based on the processing program. The laser irradiation command includes laser output and the like. The laser control unit 72b is also configured to send a head movement command to the laser head 42 of the laser irradiation device 40 based on the processing program. The head movement command includes the amount of movement, the movement speed, the movement direction and the like.

[0044] In this way, the chuck control unit 72a controls the motor 13 and the first chuck 10A, and the laser control unit 72b controls the oscillator 41 and the laser head 42, thereby making it possible to perform predetermined laser processing on a predetermined surface of the workpiece W. The chuck control unit 72a and the laser control unit 72b automatically transmit commands when the workpiece W has been loaded onto the chuck 10. Whether or not the workpiece W has been loaded onto the chuck 10 is determined by material detection sensors (not shown) provided near the first chuck 10A and the second chuck 10B, respectively.

[0045] The imaging control unit 72c is configured to send an imaging command to the imaging device 50 based on the correction program and cause the imaging device 50 to perform imaging processing and detection processing. The imaging control unit 72c automatically sends an imaging command when the chuck 10 grips the workpiece W. Whether or not the chuck 10 grips the workpiece W is determined by material detection sensors (not shown) provided near the first chuck 10A and the second chuck 10B, respectively.

[0046] The correction unit 72d is configured to calculate the amount of deviation of the current orientation from the reference orientation of the workpiece W. Specifically, the correction unit 72d is configured to calculate the angle difference between the reference plane RP in the reference orientation and the reference plane RP in the current orientation as the amount of deviation of the current orientation from the reference orientation of the workpiece W. The correction unit 72d calculates the amount of deviation in the forward rotation direction (left rotation) and the amount of deviation in the reverse rotation direction (right rotation).

[0047] Furthermore, the correction unit 72d is configured to correct the amount of rotation of the workpiece W based on the amount of deviation of the current orientation of the workpiece W from the reference orientation. Specifically, the correction unit 72d is configured to correct the amount of rotation of the workpiece W by correcting the initial measurement value of the rotary encoder 14 based on the amount of deviation of the current orientation of the workpiece W from the reference orientation. The initial measurement value of the rotary encoder 14 is the amount of rotation (rotation angle) of the motor 13 before machining starts. Before machining starts, the motor 13 is not rotating, so the initial measurement value of the rotary encoder 14 is 0°. Note that the correction unit 72d corrects the amount of rotation of the workpiece W based on the amount of deviation in the forward rotation direction or the amount of deviation in the reverse rotation direction that results in a smaller amount of rotation of the motor 13.

[0048] The operation display unit 73 is a touch screen. The operation display unit 73 is configured to receive input operations from an operator to the control device 70 and to display a setting screen, an automatic operation start button, etc. The control device 70 may have an operation unit configured with a keyboard, a mouse, a touchpad, a joystick, etc., and a display unit configured with a display.

[0049] [Laser processing method] First, the worker places the workpiece W on the carry-in device 30. Next, the worker operates the automatic operation start button displayed on the operation display unit 73. When the automatic operation start button is operated, the carry-in device 30 carries the workpiece W into the chuck 10, and the chuck 10 grips the workpiece W carried in from the carry-in device 30. When the chuck 10 grips the workpiece W, the motor 13 of the chuck 10 rotates according to the processing program, and the first chuck 10A of the chuck 10 moves according to the processing program. When the workpiece W is positioned by the chuck 10, the laser head 42 of the laser irradiation device 40 moves according to the processing program and irradiates the workpiece W with a laser supplied from the oscillator 41. The laser processing machine 1 can continuously manufacture products P whose predetermined surfaces have been subjected to predetermined laser processing by repeating the positioning of the workpiece W by the chuck 10 and the irradiation of the laser by the laser irradiation device 40 according to the processing program. The manufactured products P are carried out by the carry-out device 60.

[0050] [Correction method] Next, a method for correcting the amount of rotation of the workpiece W will be described with reference to Figures 6 and 7. Figure 6(a) is a schematic diagram showing a state in which the reference orientation and current orientation of the workpiece match, and Figure 6(b) is a schematic diagram showing a state in which the workpiece has been rotated from the state of Figure 6(a) in accordance with the machining program. Figure 7(a) is a schematic diagram showing a state in which the reference orientation and current orientation of the workpiece do not match, and Figure 7(b) is a schematic diagram showing a state in which the workpiece has been rotated from the state of Figure 7(a) in accordance with the machining program.

[0051] In the following explanation, an example will be given in which the shape of one end face in the longitudinal direction of the workpiece W is L-shaped, the information of the reference orientation and reference plane RP stored in the memory unit 71 is the information shown in Figure 5(b), and the machining program specifies a process of rotating the motor 13 (workpiece W) from the initial position until the measurement value of the rotary encoder 14 becomes 180°.

[0052] As shown in FIGS. 5(b) and 6(a), when the chuck 10 grips the workpiece W carried in from the carry-in device 30, if the reference orientation and current orientation of the workpiece W match, the laser can be irradiated onto a predetermined surface of the workpiece W, as shown in FIG. 6(b). On the other hand, as shown in FIGS. 5(b) and 7(a), when the chuck 10 grips the workpiece W carried in from the carry-in device 30, if the reference orientation and current orientation of the workpiece W do not match, the laser will be irradiated onto a surface of the workpiece W other than the predetermined surface, as shown in FIG. 7(b). In this way, when the reference orientation and current orientation of the workpiece W do not match, the predetermined laser processing cannot be performed on the predetermined surface of the workpiece W, so the amount of rotation of the workpiece W must be corrected. A method for correcting the amount of rotation of the workpiece W will be described in detail below.

[0053] When the chuck 10 grips the workpiece W carried in from the carry-in device 30, the imaging unit 51a of the imaging device 50 captures an image of the end face of the workpiece W. In addition, the detection unit 51b of the imaging device 50 detects the current orientation and shape of the workpiece W from the image of the end face of the workpiece W. The current orientation and shape of the workpiece W detected by the detection unit 51b are transmitted to the control device 70.

[0054] When the current orientation and shape of the workpiece W are received from the imaging device 50, the correction unit 72d of the control device 70 calculates the angular difference between the reference plane RP in the reference orientation and the reference plane RP in the current orientation as the deviation amount of the current orientation of the workpiece W from the reference orientation. In the examples shown in Figures 5(b) and 6(a), the angular difference between the reference plane RP in the reference orientation and the reference plane RP in the current orientation is 0°. In the examples shown in Figures 5(b) and 7(a), the angular difference between the reference plane RP in the reference orientation and the reference plane RP in the current orientation is 90° (forward rotation direction) or -270° (reverse rotation direction).

[0055] 5(b) and 6(a), the angular difference between the reference plane RP in the reference orientation and the reference plane RP in the current orientation is 0°, so the correction unit 72d does not correct the amount of rotation of the workpiece W. On the other hand, in the examples shown in Fig. 5(b) and 7(a), the angular difference between the reference plane RP in the reference orientation and the reference plane RP in the current orientation is not 0°, so the correction unit 72d corrects the amount of rotation of the workpiece W.

[0056] Specifically, the correction unit 72d corrects the initial measurement value of the rotary encoder 14 based on the angular difference between the reference plane RP in the reference orientation and the reference plane RP in the current orientation, thereby correcting the amount of rotation of the workpiece W. At this time, the correction unit 72d uses the angular difference between the forward rotation direction and the reverse rotation direction that reduces the amount of rotation of the motor 13. In the examples shown in Figures 5(b) and 7(a), the angular difference in the forward rotation direction is 90° and the angular difference in the reverse rotation direction is -270°, so the angular difference in the forward rotation direction of 90° is used.

[0057] Because the angular difference between the reference plane RP in the reference orientation and the reference plane RP in the current orientation is 90°, the correction unit 72d corrects the initial measurement value of the rotary encoder 14 to 90°. Then, when the motor 13 (workpiece W) is rotated from the initial position until the measurement value of the rotary encoder 14 becomes 180°, the motor 13 will rotate by 90° (180°-90°), and it will be possible to irradiate the predetermined surface of the workpiece W with the laser. In this way, in the laser processing machine 1 according to this embodiment, by correcting the amount of rotation of the workpiece W, it is possible to irradiate the predetermined surface of the workpiece W with the laser.

[0058] [Advantages of the laser processing machine according to this embodiment] The laser processing machine 1 of this embodiment comprises a chuck 10 that can hold a long workpiece W and rotate the workpiece W in a circumferential direction around the longitudinal axis of the workpiece W, an imaging device 50 that images one longitudinal end face of the workpiece W held by the chuck 10, a memory unit 71 that stores information about the reference orientation of the workpiece W at the start of processing, a detection unit 51b that detects the current orientation of the workpiece W from the end face image captured by the imaging device 50, and a correction unit 72d that calculates the amount of deviation of the current orientation from the reference orientation and corrects the amount of rotation of the workpiece W based on the calculated amount of deviation.

[0059] With a laser processing machine 1 having such a configuration, the amount of deviation between the reference orientation and the current orientation of the workpiece W can be calculated, and the amount of rotation of the workpiece W can be corrected based on the calculated amount of deviation, thereby automatically correcting the orientation of the workpiece W.

[0060] In the laser processing machine 1 according to this embodiment, the memory unit 71 stores a predetermined surface of the circumferential surface of the workpiece W as a reference surface RP, and the correction unit 72d calculates the angular difference between the reference surface RP in the reference orientation and the reference surface RP in the current orientation as the amount of deviation. With the laser processing machine 1 having such a configuration, the angular difference between the reference surface RP in the reference orientation and the reference surface RP in the current orientation can be calculated, and the amount of rotation of the workpiece W can be corrected based on the calculated angular difference, so that the orientation of the workpiece W can be automatically corrected.

[0061] In the laser processing machine 1 according to this embodiment, the chuck 10 has a rotary encoder 14, and the correction unit 72d corrects the initial measurement value of the rotary encoder 14 based on the amount of deviation, thereby correcting the amount of rotation of the workpiece W. With the laser processing machine 1 having such a configuration, it is not necessary to rewrite the processing program every time the workpiece W is laser processed, thereby reducing the burden on the operator.

[0062] In the laser processing machine 1 according to this embodiment, the storage unit 71 stores information on the reference orientation for each shape of the workpiece W. The laser processing machine 1 having such a configuration can handle multiple types of workpiece W, thereby improving convenience.

[0063] In the laser processing machine 1 according to this embodiment, the imaging device 50 includes an imaging unit 51a that captures an end face image and a detection unit 51b, and the detection unit 51b detects the shape of the workpiece W based on the end face image captured by the imaging unit 51a and the trained model. According to the laser processing machine 1 having such a configuration, the shape of the workpiece W is detected based on the end face image captured by the imaging unit 51a and the trained model, and therefore the shape of the workpiece W can be accurately identified.

[0064] [Variations] The laser processing machine and correction program according to the present invention are not limited to the above-described embodiment, and various modifications can be made within the scope of the technical concept of the present invention.

[0065] In the above-described embodiment, the correction unit 72d corrects the initial measurement value of the rotary encoder 14, thereby performing a series of operations from correcting the rotation amount of the workpiece W to laser processing, but this is not limited to this. For example, the processing program may be executed after the correction of the rotation amount of the workpiece W is completed. Also, the processing program may be rewritten without correcting the initial measurement value of the rotary encoder 14.

[0066] In the above-described embodiment, the storage unit 71 is configured to store information on the reference orientation for each shape of the workpiece W, but the present invention is not limited to this, and the storage unit 71 may be configured to store only one type of shape.

[0067] In the above-described embodiment, a configuration has been described in which the imaging device 50 has the detection unit 51b, but the present invention is not limited to this, and the control device 70 may have the detection unit 51b. Also, a configuration has been described in which the detection unit 51b detects the shape of the workpiece W using a trained model, but the present invention is not limited to this, and the detection unit 51b may not use a trained model, or may continue to perform machine learning.

[0068] It is clear from the claims that the above-mentioned modifications are included within the scope of the present invention. [Explanation of symbols]

[0069] 1: Laser processing machine 10: Zipper 10A: First chuck 10B: Second chuck 11: Fixed part 12: Rotating part 12a: Claw part 13: Motor 14: Rotary encoder 20: Support stand 30: Loading device 40: Laser irradiation device 41: Oscillator 42: Laser head 50: Imaging device 51: Device body 51a: Imaging unit 51b: detection unit 51c: Switching section 52: Storage box 60: Unloading device 61: 1st unloading device 62:Second unloading device 70: Control device 71: Storage section 72: Control unit 72a: Chuck control section 72b: Laser control unit 72c: Imaging control unit 72d: Correction section 73: Operation display section P:Product RP: Reference plane W: Work

Claims

1. a chuck capable of gripping a long workpiece and rotating the workpiece in a circumferential direction around a longitudinal axis of the workpiece; an imaging device that images one end surface in the longitudinal direction of the workpiece gripped by the chuck; a memory unit for storing information on the reference orientation of the workpiece at the start of processing; a detection unit that detects a current orientation of the workpiece from an end face image captured by the imaging device; a correction unit that calculates a deviation amount of the current orientation with respect to the reference orientation and corrects a rotation amount of the workpiece based on the calculated deviation amount; Equipped with Laser processing machine.

2. The storage unit stores a predetermined surface of the peripheral surface of the workpiece as a reference surface, The correction unit calculates, as the deviation amount, an angular difference between the reference plane in the reference orientation and the reference plane in the current orientation.

2. The laser processing machine according to claim 1.

3. the chuck has a rotary encoder; The correction unit corrects the rotation amount of the workpiece by correcting the initial measurement value of the rotary encoder based on the deviation amount.

3. The laser processing machine according to claim 1 or 2.

4. The storage unit stores information on the reference orientation for each shape of the workpiece.

3. The laser processing machine according to claim 1 or 2.

5. the imaging device includes an imaging unit that captures the end face image and the detection unit, The detection unit detects the shape of the workpiece based on the end face image captured by the imaging unit and a trained model.

5. The laser processing machine according to claim 4.

6. an imaging process for imaging one end surface in the longitudinal direction of the workpiece gripped by a chuck that is capable of gripping a long workpiece and rotating the workpiece in a circumferential direction around the longitudinal axis of the workpiece; a detection process for detecting a current orientation of the workpiece from an end face image captured by executing the imaging process; a correction process for calculating a deviation amount of the current orientation of the workpiece relative to a reference orientation of the workpiece at the start of machining, and correcting a rotation amount of the workpiece based on the calculated deviation amount; The laser processing machine executes Correction program.

Images