disk device

Abstract

To provide a disk device capable of suppressing decreasing stability of positioning a magnetic head for the magnetic disk.SOLUTION: A disk device according to one embodiment includes a piezoelectric element and a flexure. The piezoelectric element includes a first electrode and a second electrode. The flexure includes a first portion and a second portion to which the second electrode is bonded. The first portion has a first surface to which the first electrode is bonded. The second portion has a second surface to which the magnetic head is bonded. The magnetic head has a third surface facing the first surface and the second surface. The first surface faces the end portion of the third surface in a first direction. The second surface faces the end portion of the third surface in a second direction. The distance between the first surface and the end portion of the third surface in the first direction is longer than the distance between the second surface and the end portion of the third surface in the second direction.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] An embodiment of the present invention relates to a disk drive. [Background technology]

[0002] A disk device such as a hard disk drive has a magnetic disk and a magnetic head that reads and writes information from and to the magnetic disk. The magnetic head is mounted on a flexible flexure. Furthermore, a piezoelectric element is attached to the flexure to adjust the position of the magnetic head by deforming the flexure. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 9,047,896 Summary of the Invention [Problem to be solved by the invention]

[0004] The piezoelectric element adjusts the position of the magnetic head relative to the magnetic disk by swinging a part of the flexure on which the magnetic head is mounted. If the swinging magnetic head comes into contact with the flexure, the adjustment of the position of the magnetic head may become unstable.

[0005] One example of a problem to be solved by the present invention is to provide a disk drive that can suppress a decrease in the stability of positioning of a magnetic head relative to a magnetic disk. [Means for solving the problem]

[0006] According to one embodiment, a disk drive includes a magnetic disk, a magnetic head, a piezoelectric element, and a flexure. The magnetic head is configured to read and write information from and to the magnetic disk. The piezoelectric element has a first electrode and a second electrode spaced apart from the first electrode. The flexure has a first portion to which the first electrode is bonded and a second portion to which the magnetic head and the second electrode are bonded, and is configured such that the second portion oscillates relative to the first portion when the piezoelectric element deforms to change the distance between the first electrode and the second electrode. The first portion has a first surface to which the first electrode is bonded. The second portion has a second surface to which the magnetic head is bonded. The magnetic head has a third surface facing the first surface and the second surface. In a direction along the second surface, the first electrode is spaced apart from the second electrode in a first direction along the second surface. The first surface faces an end of the third surface in the first direction, the second surface faces an end of the third surface in a second direction opposite the first direction, and the distance between the first surface and the end of the third surface in the first direction is longer than the distance between the second surface and the end of the third surface in the second direction. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is an exemplary perspective view showing an exploded HDD according to the first embodiment. [Figure 2] FIG. 2 is an exemplary plan view showing a portion of the HGA of the first embodiment. [Figure 3] FIG. 3 is an exemplary cross-sectional view showing a part of the HGA of the first embodiment taken along line F3-F3 in FIG. [Figure 4] FIG. 4 is an exemplary plan view showing a portion of the HGA according to the second embodiment. [Figure 5] FIG. 5 is an exemplary cross-sectional view showing a part of the HGA of the second embodiment taken along line F5-F5 in FIG. [Figure 6]FIG. 6 is an exemplary plan view showing a portion of an HGA according to the third embodiment. [Figure 7] FIG. 7 is an exemplary cross-sectional view showing a part of the HGA of the third embodiment taken along line F7-F7 in FIG. [Figure 8] FIG. 8 is an exemplary plan view showing a portion of an HGA according to the fourth embodiment. [Figure 9] FIG. 9 is an exemplary cross-sectional view showing a part of the HGA of the fourth embodiment taken along line F9-F9 in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] (First embodiment) A first embodiment will be described below with reference to FIGS. 1 to 3. In this specification, components according to the embodiment and descriptions of the components may be described using multiple expressions. The components and their descriptions are merely examples and are not limited by the expressions in this specification. The components may also be identified by names different from those in this specification. Furthermore, the components may also be described using expressions different from those in this specification.

[0009] 1 is an exemplary exploded perspective view showing a hard disk drive (HDD) 10 according to the first embodiment. The HDD 10 is an example of a disk device, and may also be called an electronic device, a storage device, an external storage device, or a magnetic disk device.

[0010] The HDD 10 includes a housing 11, multiple magnetic disks 12, a spindle motor 13, multiple magnetic heads 14, a head stack assembly (HSA) 15, a voice coil motor (VCM) 16, a ramp load mechanism 17, a flexible printed circuit board (FPC) 18, and a printed circuit board (PCB) 19. The VCM 16 is an example of an actuator.

[0011] The housing 11 has a base 21, an inner cover 22, and an outer cover 23. The base 21 is a container with a bottom, and has a bottom wall 25 and a side wall 26. The bottom wall 25 is formed in a substantially rectangular (quadrilateral) plate shape. The side wall 26 protrudes from the edge of the bottom wall 25.

[0012] The inner cover 22 is attached to the end of the side wall 26 by, for example, screws. The outer cover 23 covers the inner cover 22 and is airtightly fixed to the end of the side wall 26 by, for example, welding.

[0013] The interior of the housing 11 is sealed. Inside the housing 11, a magnetic disk 12, a spindle motor 13, a magnetic head 14, an HSA 15, a VCM 16, a ramp load mechanism 17, and an FPC 18 are arranged.

[0014] A ventilation hole 22a is provided in the inner cover 22. Furthermore, a ventilation hole 23a is provided in the outer cover 23. After components are attached inside the base 21 and the inner cover 22 and the outer cover 23 are attached to the base 21, air inside the housing 11 is evacuated through the ventilation holes 22a and 23a. Furthermore, the inside of the housing 11 is filled with a gas other than air.

[0015] The gas filled inside the housing 11 is, for example, a low-density gas with a density lower than air, an inert gas with low reactivity, or the like. For example, helium is filled inside the housing 11. Note that other fluids may also be filled inside the housing 11. Furthermore, the inside of the housing 11 may be kept at a vacuum, a low pressure close to a vacuum, or a negative pressure lower than atmospheric pressure.

[0016] The vent hole 23a of the outer cover 23 is closed by a seal 28. The seal 28 airtightly seals the vent hole 23a, preventing the fluid filled inside the housing 11 from leaking from the vent hole 23a.

[0017] The magnetic disk 12 is a disk-shaped recording medium having a magnetic recording layer provided on recording surfaces 12a, such as the upper and lower surfaces. The diameter of the magnetic disk 12 in the example of FIG. 1 is, for example, 3.5 inches, but is not limited to this example.

[0018] The spindle motor 13 supports and rotates a plurality of magnetic disks 12 stacked at intervals in the direction in which their recording surfaces 12a face. The plurality of magnetic disks 12 are held on a hub of the spindle motor 13 by, for example, clamp springs.

[0019] The magnetic head 14 includes, for example, a slider and a head element. The head element of the magnetic head 14 records and reproduces information on the recording layer of the magnetic disk 12. In other words, the magnetic head 14 reads and writes information from and to the magnetic disk 12. The magnetic head 14 is mounted on the HSA 15.

[0020] The HSA 15 is supported by a support shaft 31 disposed at a position separated from the magnetic disk 12. The HSA 15 is rotatable about a central axis Ax of the support shaft 31. The central axis Ax is an example of a rotation axis. The HSA 15 has an actuator block 35, a plurality of arms 36, and a plurality of head gimbal assemblies (HGA) 37.

[0021] The actuator block 35 is supported on the support shaft 31 via, for example, a bearing. The multiple arms 36 protrude from the actuator block 35 in a direction substantially perpendicular to the central axis Ax. The actuator block 35 and the multiple arms 36 are, for example, formed integrally.

[0022] The arms 36 are spaced apart in a direction along the central axis Ax. Each arm 36 is formed in a plate shape that can enter between adjacent magnetic disks 12. The arms 36 extend substantially parallel to one another.

[0023] The voice coil of the VCM 16 is provided on a protrusion that protrudes from the actuator block 35 on the opposite side of the arm 36. The VCM 16 has, for example, a pair of yokes, a voice coil disposed between the yokes, and a magnet provided on the yoke.

[0024] The VCM 16 rotates the HSA 15 around the central axis Ax. That is, the VCM 16 rotates (moves) the actuator block 35, the arm 36, and the HGA 37 as a unit. By rotating the HSA 15, the VCM 16 positions the HSA 15 at a desired position. The ramp load mechanism 17 holds the magnetic head 14, which has moved to the outermost periphery of the magnetic disk 12, at an unload position away from the magnetic disk 12.

[0025] The HGA 37 is attached to the tip of the corresponding arm 36 and protrudes from the arm 36. As a result, the multiple HGAs 37 are arranged at intervals in the direction along the central axis Ax. Each of the multiple HGAs 37 has a base plate 41, a load beam 42, and a flexure 43.

[0026] The base plate 41 and the load beam 42 are made of, for example, stainless steel. However, the materials of the base plate 41 and the load beam 42 are not limited to this example. The base plate 41 is formed in a plate shape and is attached to the tip of the arm 36. The load beam 42 is formed in a plate shape that is thinner than the base plate 41. The load beam 42 is attached to the tip of the base plate 41 and protrudes from the base plate 41.

[0027] Fig. 2 is an exemplary plan view showing a portion of the HGA 37 of the first embodiment. Fig. 3 is an exemplary cross-sectional view showing a portion of the HGA 37 of the first embodiment along line F3-F3 in Fig. 2.

[0028] As shown in the drawings, for convenience, the X-axis, Y-axis, and Z-axis are defined in this specification. The X-axis, Y-axis, and Z-axis are perpendicular to each other. The X-axis is aligned along the width of the HGA 37. The Y-axis is aligned along the length of the HGA 37. The Z-axis is aligned along the thickness of the HGA 37.

[0029] Furthermore, in this specification, the X direction, Y direction, and Z direction are defined. The X direction is a direction along the X axis, and includes the +X direction indicated by the X axis arrow and the -X direction opposite to the X axis arrow. The Y direction is a direction along the Y axis, and includes the +Y direction indicated by the Y axis arrow and the -Y direction opposite to the Y axis arrow. The Z direction is a direction along the Z axis, and includes the +Z direction indicated by the Z axis arrow and the -Z direction opposite to the Z axis arrow.

[0030] For example, the Y direction is a direction substantially perpendicular to the central axis Ax. The arm 36 extends in the +Y direction from the actuator block 35. The HGA 37 extends in the +Y direction from an end of the arm 36 in the +Y direction. That is, the Y direction is also the longitudinal direction of the arm 36 and the HGA 37. The Z direction is, for example, a direction along the central axis Ax.

[0031] The magnetic head 14 is disposed at the end of the HGA 37 in the +Y direction. The end of the HGA 37 in the -Y direction is attached to the arm 36. In this specification, the end includes not only the end of an element but also a portion in the vicinity of the end.

[0032] The flexure 43 is a flexible laminated substrate provided with wiring, and is formed in a long, thin strip shape. Note that the shape of the flexure 43 is not limited to this example. The flexure 43 has a gimbal portion 45 (elastic support portion).

[0033] The gimbal portion 45 is provided at the end of the flexure 43 in the +Y direction. The gimbal portion 45 is also located at the end of the HGA 37 in the +Y direction. The gimbal portion 45 is attached to the load beam 42 and is displaceable relative to the load beam 42. The magnetic head 14 is mounted on the gimbal portion 45.

[0034] The end of the flexure 43 in the -Y direction is connected to the FPC 18, for example, on the actuator block 35. As a result, the FPC 18 is electrically connected to the magnetic head 14 via the wiring of the flexure 43.

[0035] The HGA 37 further includes a pair of microactuators (MA) 47. The MA 47 is an example of a piezoelectric element. The MA 47 is, for example, a bulk type piezoelectric element. Note that the MA 47 may also be a bulk laminated type or a thin film type piezoelectric element. However, the MA 47 is not limited to this example.

[0036] The MA47 is mounted on the gimbal portion 45. The pair of MA47 are spaced apart from each other in the X direction. In the X direction, the magnetic head 14 is located between the pair of MA47. The MA47 can expand and contract substantially in the Y direction in response to an applied voltage. The pair of MA47 expand and contract individually, thereby deforming the gimbal portion 45. As a result, the MA47 moves the magnetic head 14 mounted on the gimbal portion 45.

[0037] The HGA 37 further includes, for example, another pair of MAs that connect the base plate 41 and the load beam 42. The pair of MAs expands and contracts individually to elastically bend the load beam 42 and move the magnetic head 14.

[0038] As described above, the HDD 10 of this embodiment adjusts the position of the magnetic head 14 using a so-called triple stage actuator (TSA) method, in which the magnetic head 14 is moved by the VCM 16, the MA 47, and the MA between the base plate 41 and the load beam 42.

[0039] 1 is, for example, a rigid board such as a glass epoxy board, and is a multilayer board or a build-up board, etc. The PCB 19 is disposed outside the housing 11 and attached to the bottom wall 25 of the base 21.

[0040] Various electronic components are mounted on the PCB 19, such as a relay connector connected to the FPC 18, an interface (I / F) connector connected to a host computer, and a controller that controls the operation of the HDD 10. The relay connector is electrically connected to the FPC 18 via a connector provided on the bottom wall 25.

[0041] The following provides a detailed description of the HGA 37. As shown in Fig. 3, the flexure 43 has a wiring layer 51 and a backing layer 52. The wiring layer 51 and the backing layer 52 are attached to each other by, for example, an adhesive.

[0042] The wiring layer 51 includes, for example, a base layer, a conductive layer, and a cover layer. The base layer and the cover layer are made of an insulator such as polyimide (PI). The conductive layer is made of a metal such as copper, and various patterns such as wiring and pads are formed on the base layer. The cover layer covers at least a portion of the base layer and the conductive layer. For example, the cover layer covers the wiring of the conductive layer. The cover layer also exposes the pads of the conductive layer to the outside of the wiring layer 51 through holes or cutouts provided in the cover layer.

[0043] The wiring layer 51 has two surfaces 51a and 51b. The surface 51a faces approximately in the -Z direction. The surface 51b is located opposite the surface 51a and faces approximately in the +Z direction. In this embodiment, the surfaces 51a and 51b have portions that face in a direction inclined with respect to the Z direction.

[0044] The surface 51a is formed, for example, by the cover layer of the wiring layer 51, pads of the metal layer exposed through the holes in the cover layer, and the base layer exposed through the holes in the cover layer. The surface 51b is formed, for example, by the base layer of the wiring layer 51. The magnetic head 14 and MA47 are mounted on the surface 51a. When the magnetic head 14 is positioned above the magnetic disk 12, the surface 51a faces the recording surface 12a. The surface 51b faces the backing layer 52. Note that the surfaces 51a and 51b are not limited to this example.

[0045] The backing layer 52 is a metal plate made of a metal such as stainless steel. The backing layer 52 has two surfaces 52a and 52b. The surface 52a faces approximately in the +Z direction. The surface 52b is located opposite the surface 52a and faces approximately in the -Z direction. In this embodiment, the surfaces 52a and 52b have portions that face in a direction inclined with respect to the Z direction.

[0046] The surface 52a faces the load beam 42. The surface 52b faces the surface 51b of the wiring layer 51. The surface 51b of the wiring layer 51 and the surface 52b of the backing layer 52 are attached to each other by, for example, an adhesive.

[0047] 2, the gimbal portion 45 has a base portion 61, a movable portion 62, an annular portion 63, and a pair of connecting portions 64. The base portion 61 is an example of a first portion. The movable portion 62 is an example of a second portion.

[0048] Each of the base portion 61, the movable portion 62, the annular portion 63, and the connecting portion 64 may have a part of the wiring layer 51 and a part of the backing layer 52. Note that, for example, the annular portion 63 and the connecting portion 64 may have only the backing layer 52 out of the wiring layer 51 and the backing layer 52.

[0049] The base 61 has a mounting surface 71, a front edge 72, and a flexible portion 73. The mounting surface 71 is an example of a first surface. The front edge 72 is an example of a first edge.

[0050] The mounting surface 71 is included in the surface 51a of the wiring layer 51. The mounting surface 71 has a pair of pads 75. The pads 75 are pads on the metal layer of the wiring layer 51. For simplicity, FIG. 3 shows the pads 75 on the mounting surface 71. However, the pads 75 are exposed, for example, through holes provided in a cover layer of the wiring layer 51. As shown in FIG. 2, the pair of pads 75 are spaced apart from each other, for example, in the X direction.

[0051] The leading edge 72 is provided, for example, at the end of the base 61 in the +Y direction. In this embodiment, the leading edge 72 is provided in the wiring layer 51 of the base 61. The leading edge 72 extends substantially in the X direction and faces substantially in the +Y direction. However, the leading edge 72 is not limited to this example.

[0052] The flexible portion 73 extends in the +Y direction from approximately the center of the front edge 72 in the X direction. That is, the length (width) of the flexible portion 73 in the X direction is shorter than the overall length (width) of the base portion 61 in the X direction. The flexible portion 73 is connected to the movable portion 62. Note that the movable portion 62 may be separate from the base portion 61.

[0053] The flexible portion 73 is formed thin and therefore easily elastically deformed. The elastic deformation of the flexible portion 73 allows the movable portion 62 to swing relative to the base portion 61. For example, the movable portion 62 can swing in the yawing direction Dy shown in FIG. 2 relative to the base portion 61. The yawing direction Dy is, for example, the direction of rotation around the Z axis. Note that the movable portion 62 may also be able to swing in a rolling direction around the Y axis and a pitching direction around the X axis relative to the base portion 61.

[0054] The movable part 62 is supported, for example, by a substantially hemispherical protrusion 42a provided on the load beam 42. The protrusion 42a abuts against a surface 52a of the backing layer 52 of the movable part 62. This allows the movable part 62 to swing in the yawing direction Dy, the rolling direction, and the pitching direction.

[0055] The movable portion 62 has a mounting surface 81 and a pair of rear edges 82. The mounting surface 81 is an example of a second surface. The rear edges 82 are an example of a second edge. The mounting surface 81 is included in the surface 51a of the wiring layer 51.

[0056] In this embodiment, the mounting surface 81 is a substantially flat surface extending along the XY plane. Therefore, the X direction and the Y direction are directions along the mounting surface 81. The -Y direction along the mounting surface 81 is an example of a first direction. The +Y direction along the mounting surface 81 is an example of a second direction.

[0057] For example, the movable part 62 including the mounting surface 81 may oscillate due to displacement of the gimbal part 45. In this case, the first direction and the second direction may be directions different from the direction perpendicular to the central axis Ax in response to the oscillation of the mounting surface 81.

[0058] The mounting surface 81 has a pair of pads 85 and a plurality of pads 86. The pads 85 and 86 are pads on the metal layer of the wiring layer 51. For simplicity, FIG. 3 shows the pads 85 and 86 on the mounting surface 81. However, the pads 85 and 86 are exposed through holes provided in a cover layer of the wiring layer 51, for example.

[0059] 2, the pair of pads 85 are spaced apart from each other in the X direction, for example. The distance between the pair of pads 85 is approximately equal to the distance between the pair of pads 75. One of the pair of pads 85 and the corresponding one of the pair of pads 75 are arranged with an interval in the Y direction.

[0060] The pads 86 are spaced apart in the +Y direction from the pair of pads 85 in the Y direction. The pads 86 are arranged in the X direction at intervals. As shown in Fig. 3, terminals of the magnetic head 14 are joined to the pads 86 by, for example, solder 88. That is, the magnetic head 14 is joined to the mounting surface 81 of the movable part 62.

[0061] 2, the pair of rear edges 82 are provided, for example, at the ends of the movable portion 62 in the -Y direction. In this embodiment, the rear edges 82 are provided in the wiring layer 51 of the movable portion 62. The pair of rear edges 82 are spaced apart from each other approximately in the X direction. The movable portion 62 is connected to the flexible portion 73 of the base 61 in a portion between the pair of rear edges 82 in the X direction.

[0062] The rear edges 82 extend substantially in the X direction and face substantially in the -Y direction. Each of the pair of rear edges 82 is spaced apart in the +Y direction from the front edge 72 of the base 61 in the Y direction. That is, a gap is provided between the front edge 72 of the base 61 and the rear edge 82 of the movable part 62.

[0063] The annular portion 63 is formed in a generally elliptical or generally polygonal ring shape that surrounds the base portion 61 and the movable portion 62. Note that the shape of the annular portion 63 is not limited to this example. The annular portion 63 has a front mounting portion 91, a rear mounting portion 92, and a pair of bridge portions 93.

[0064] The front mounting portion 91 is spaced apart from the movable portion 62 in the +Y direction in the Y direction. The backing layer 52 of the front mounting portion 91 is attached to the load beam 42 by, for example, welding. The rear mounting portion 92 is spaced apart from the base 61 in the -Y direction in the Y direction. The backing layer 52 of the rear mounting portion 92 is attached to the load beam 42 by, for example, welding. The base 61 and the movable portion 62 are located between the front mounting portion 91 and the rear mounting portion 92 in the Y direction.

[0065] The pair of bridge portions 93 connect, for example, both ends of the front mounting portion 91 in the X direction to both ends of the rear mounting portion 92 in the X direction. The base portion 61 and the movable portion 62 are located between the pair of bridge portions 93 in the X direction.

[0066] Each of the pair of connecting portions 64 connects a corresponding one of the pair of bridge portions 93 to the base portion 61. Each of the pair of connecting portions 64 is formed, for example, in a meandering band shape. Note that the shape of the connecting portions 64 is not limited to this example.

[0067] The base 61 can swing relative to the annular portion 63 as a result of the connecting portion 64 being elastically deformed. That is, the connecting portion 64 connects the annular portion 63 and the base 61 together so that the base 61 can swing relative to the annular portion 63.

[0068] As shown in FIG. 3, the slider of the magnetic head 14 has a mounting surface 101 and a bottom surface 102. The mounting surface 101 is an example of a third surface. The mounting surface 101 is a substantially flat surface along the XY plane and faces substantially in the +Z direction. The bottom surface 102 is located on the opposite side of the mounting surface 101 and faces substantially in the -Z direction. When the magnetic head 14 is positioned above the magnetic disk 12, the bottom surface 102 faces the recording surface 12a.

[0069] The mounting surface 101 faces the mounting surface 71 of the base 61 and the mounting surface 81 of the movable part 62. The mounting surface 71 faces an end 101a of the mounting surface 101 in the -Y direction. The mounting surface 81 faces an end 101b of the mounting surface 101 in the +Y direction.

[0070] The end 101a is closer to the central axis Ax than the end 101b. When the magnetic head 14 is positioned above the magnetic disk 12, an airflow generated by the rotation of the magnetic disk 12 flows into the gap between the magnetic disk 12 and the magnetic head 14 from the gap between the end of the bottom surface 102 in the -Y direction and the recording surface 12a. The airflow then flows out from the gap between the end of the bottom surface 102 in the +Y direction and the recording surface 12a. Therefore, the end 101a of the mounting surface 101 in the -Y direction can be referred to as the inflow end of the mounting surface 101. The end 101b can be referred to as the outflow end of the mounting surface 101. The airflow lifts the magnetic head 14 off the recording surface 12a.

[0071] The attachment surface 101 is attached to the mounting surface 81 by, for example, an adhesive 105. Therefore, when the movable part 62 swings relative to the base part 61, the magnetic head 14 also swings relative to the base part 61. The attachment surface 101 of the magnetic head 14 and the mounting surface 81 of the movable part 62 are arranged approximately parallel to each other.

[0072] Each of the pair of MA47 has a piezoelectric body 110, a first electrode 111, and a second electrode 112. The piezoelectric body 110 is formed in a substantially rectangular parallelepiped shape extending substantially in the Y direction. The piezoelectric body 110 has a mounting surface 110a. The mounting surface 110a faces the mounting surface 71 of the base 61 and the mounting surface 81 of the movable part 62.

[0073] The first electrode 111 is provided, for example, at an end of the mounting surface 110a in the -Y direction. The second electrode 112 is provided, for example, at an end of the mounting surface 110a in the +Y direction. That is, the first electrode 111 is spaced apart from the second electrode 112 in the -Y direction in the Y direction. The first electrode 111 and the second electrode 112 may be provided at other positions on the piezoelectric body 110.

[0074] The first electrode 111 is bonded to a pad 75 on the mounting surface 71 of the base 61 by, for example, a conductive adhesive 115. The second electrode 112 is bonded to a pad 85 on the mounting surface 81 of the movable part 62 by, for example, a conductive adhesive 116.

[0075] The adhesives 115 and 116 are, for example, epoxy adhesives with conductive fillers such as silver mixed in. Note that the first electrode 111 and the second electrode 112 may be joined to the pads 75 and 85 by, for example, solder instead of the adhesives 115 and 116.

[0076] 2, the flexible portion 73 of the base 61 is located between the pair of MAs 47 in the X direction. The MAs 47 extend across the front edge 72 of the base 61 and the rear edge 82 of the movable portion 62. The MAs 47 cover the gap between the front edge 72 and the rear edge 82.

[0077] When a voltage is applied to the first electrode 111 or the second electrode 112, the piezoelectric body 110 expands and contracts substantially in the Y direction. This changes the distance between the first electrode 111 bonded to the pad 75 and the second electrode 112 bonded to the pad 85.

[0078] For example, when one of the pair of MAs 47 expands and the other contracts, the movable part 62 swings in the yawing direction Dy relative to the base part 61. In this way, when the MAs 47 deform so as to change the distance between the first electrode 111 and the second electrode 112, the movable part 62 swings relative to the base part 61.

[0079] 3, the base 61 is bent relative to the movable part 62. As a result, the mounting surface 71 of the base 61 is inclined relative to the mounting surface 81 of the movable part 62 between the pad 75 and the movable part 62 and at the pad 75 so as to move away from the attachment surface 101 of the magnetic head 14 as it moves away from the movable part 62. In other words, the base 61 is bent relative to the movable part 62 so that the mounting surface 71 is inclined relative to the mounting surface 81.

[0080] The base portion 61, which is bent relative to the movable portion 62, extends from the movable portion 62 so as to approach the load beam 42 as it moves away from the movable portion 62. However, the base portion 61 is spaced apart from the load beam 42.

[0081] Since the mounting surface 71 is inclined with respect to the mounting surface 81, the distance between the mounting surface 71 and the end 101a of the attachment surface 101 becomes longer than the distance between the mounting surface 81 and the end 101b of the attachment surface 101. In other words, the mounting surface 71 faces the attachment surface 101 at a distance that is longer than the distance between the mounting surface 81 and the attachment surface 101.

[0082] The surface 52b of the backing layer 52 included in the base 61 faces the end 101a of the mounting surface 101, for example, via the wiring layer 51. The surface 52b of the backing layer 52 included in the movable part 62 faces the end 101b of the mounting surface 101, for example, via the wiring layer 51. The distance between the end 101a of the mounting surface 101 and the surface 52b of the backing layer 52 included in the base 61 is longer than the distance between the end 101b of the mounting surface 101 and the surface 52b of the backing layer 52 included in the movable part 62.

[0083] In the HDD 10 of this embodiment, first, the VCM 16 rotates the HSA 15 about the central axis Ax, thereby moving the magnetic head 14 closer to a desired position. By rotating the HSA 15, the VCM 16 rotates the base plate 41, load beam 42, and flexure 43 of the HSA 15, as well as the magnetic head 14, about the central axis Ax.

[0084] When the magnetic head 14 is moved close to the desired position, the MA between the base plate 41 and the load beam 42 bends the load beam 42, bringing the magnetic head 14 even closer to the desired position. In addition, the MA 47 expands and contracts to swing the magnetic head 14 and the movable part 62 in the yawing direction Dy, thereby adjusting the position of the magnetic head 14. Note that the movement of the magnetic head 14 is not limited to the above example.

[0085] When the magnetic head 14 and the movable part 62 swing in the yawing direction Dy, the end 101b of the attachment surface 101 facing the mounting surface 81 swings in the yawing direction Dy together with the mounting surface 81. In other words, the relative position between the end 101b and the mounting surface 81 remains almost unchanged. On the other hand, the end 101a of the attachment surface 101 facing the mounting surface 71 swings in the yawing direction Dy relative to the mounting surface 71.

[0086] If the end 101a of the attachment surface 101 comes into contact with the mounting surface 71, for example, friction will prevent the magnetic head 14 and the movable part 62 from swinging. However, in this embodiment, the mounting surface 71 is far away from the end 101a of the attachment surface 101, and therefore contact with the end 101a can be prevented.

[0087] 3, since the mounting surface 71 is inclined with respect to the mounting surface 81, the position of the pad 75 in the Z direction is different from the position of the pad 85. As a result, the MA47 is disposed so that the attachment surface 110a is inclined with respect to the mounting surface 81.

[0088] 2, each of the pair of connecting portions 64 is bent at a curved portion 64a. An edge E1 of the curved portion 64a extends substantially in the X direction. The edge E1 is a boundary (corner) between two adjacent faces that are inclined toward each other at the curved portion 64a of the bent connecting portion 64.

[0089] The ridge E2 of the bending portion between the base 61 and the movable portion 62 also extends substantially in the X direction. The ridge E2 of the bending portion between the base 61 and the movable portion 62 is located on an extension of the ridge E1 of the bending portion 64a. In other words, in the Y direction, the ridge E2 of the bending portion between the base 61 and the movable portion 62 and the ridge E1 of the bending portion 64a are located at substantially the same position.

[0090] In the HDD 10 according to the first embodiment described above, the flexure 43 has a base 61 and a movable portion 62. A first electrode 111 of the MA 47 is bonded to a mounting surface 71 of the base 61. A second electrode 112 of the MA 47 is bonded to the movable portion 62. When the MA 47 deforms to change the distance between the first electrode 111 and the second electrode 112, the movable portion 62 swings relative to the base 61. The magnetic head 14 is bonded to a mounting surface 81 of the movable portion 62. The magnetic head 14 has an attachment surface 101 facing the mounting surface 71 and the mounting surface 81. In the direction along the mounting surface 81, the first electrode 111 is spaced from the second electrode 112 in the −Y direction along the mounting surface 81. The mounting surface 71 faces an end 101a of the attachment surface 101 in the −Y direction. The mounting surface 81 faces an end 101b of the attachment surface 101 in the +Y direction, which is opposite to the -Y direction. The distance between the mounting surface 71 and the end 101a is longer than the distance between the mounting surface 81 and the end 101b. That is, a gap is provided between the mounting surface 71 of the base 61 and the attachment surface 101 of the magnetic head 14. This prevents the magnetic head 14 from coming into contact with the mounting surface 71 when the movable part 62 and the magnetic head 14 joined to the movable part 62 swing relative to the base 61, thereby preventing a decrease in the stability of the positioning of the magnetic head 14 with respect to the magnetic disk 12.

[0091] The mounting surface 71 has a pad 75 to which a first electrode 111 is bonded. At least a portion of the mounting surface 71 between the pad 75 and the movable part 62 is inclined with respect to the mounting surface 81 so as to move away from the attachment surface 101 as it moves away from the movable part 62. This provides a gap between the mounting surface 71 and the attachment surface 101, even between the pad 75 and the movable part 62. Therefore, in the HDD 10, when the movable part 62 and the magnetic head 14 swing relative to the base 61, the magnetic head 14 can be prevented from coming into contact with the mounting surface 71, and thus a decrease in the stability of the positioning of the magnetic head 14 with respect to the magnetic disk 12 can be prevented.

[0092] Between the pad 75 and the movable part 62, and at the pad 75, the mounting surface 71 is inclined with respect to the mounting surface 81 so as to move away from the attachment surface 101 the further it is from the movable part 62. In other words, the gap between the mounting surface 71 and the attachment surface 101 increases the further it is from the movable part 62. Therefore, in the HDD 10, when the movable part 62 and the magnetic head 14 swing relative to the base 61, the magnetic head 14 can be prevented from coming into contact with the mounting surface 71, and thus the stability of the positioning of the magnetic head 14 relative to the magnetic disk 12 can be prevented from decreasing.

[0093] The base portion 61 is bent relative to the movable portion 62 so that the mounting surface 71 is inclined relative to the mounting surface 81. This makes it possible to easily form the mounting surface 71 inclined relative to the mounting surface 81.

[0094] The flexure 43 has an annular portion 63 and a connecting portion 64. The annular portion 63 surrounds the base portion 61 and the movable portion 62. The connecting portion 64 connects the annular portion 63 and the base portion 61 so that the base portion 61 can swing relative to the annular portion 63. The connecting portion 64 bends at a bending portion 64a. An edge E2 of the bending portion between the base portion 61 and the movable portion 62 is located on an extension of an edge E1 of the bending portion 64a. In other words, the corner between the base portion 61 and the movable portion 62 bends at approximately the same position as the bending portion 64a. This prevents the connecting portion 64 from applying an elastic force to the base portion 61 that would straighten the bent base portion 61 and the movable portion 62.

[0095] The second electrode 112 is bonded to the mounting surface 81. The MA47 has an attachment surface 110a on which the first electrode 111 and the second electrode 112 are provided. The attachment surface 110a is inclined with respect to the mounting surface 81. This eliminates the need to incline the portion of the movable part 62 to which the second electrode 112 is bonded, and the flexure 43 can be easily manufactured.

[0096] The movable part 62 is connected to the base part 61 so as to be able to swing relative to the base part 61. The base part 61 has a front edge 72. The movable part 62 has a rear edge 82 that is spaced from the front edge 72 in the +Y direction in a direction along the mounting surface 81. The MA 47 extends across the front edge 72 and the rear edge 82. Compared to when the base part 61 and the movable part 62 are separated, the MA 47 can be more easily joined to the base part 61 and the movable part 62 by connecting the base part 61 and the movable part 62 to each other. In addition, a notch or a hole is provided in the flexure 43 so that the front edge 72 and the rear edge 82 that are spaced apart from each other are formed. This narrows the width of the portion (flexible part 73) where the base part 61 and the movable part 62 are connected, allowing the movable part 62 to swing easily relative to the base part 61.

[0097] The VCM 16 rotates the flexure 43 around the central axis Ax. An end 101a of the mounting surface 101 in the -Y direction is closer to the central axis Ax than an end 101b of the mounting surface 101 in the +Y direction. That is, the end 101a is located at a so-called inflow end where airflow flows into the gap between the magnetic disk 12 and the magnetic head 14. By swinging the inflow end, the HDD 10 can improve the positioning accuracy of the magnetic head 14 relative to the magnetic disk 12.

[0098] (Second embodiment) The second embodiment will be described below with reference to Figures 4 and 5. In the following description of the embodiments, components having the same functions as components already described are given the same reference numerals as the components already described, and further description may be omitted. Furthermore, components given the same reference numerals do not necessarily have all the same functions and properties, and may have different functions and properties according to each embodiment.

[0099] Fig. 4 is an exemplary plan view showing a part of the HGA 37 according to the second embodiment. Fig. 5 is an exemplary cross-sectional view showing a part of the HGA 37 according to the second embodiment along line F5-F5 in Fig. 4.

[0100] 4, the gimbal section 45 of the second embodiment has a movable section 200 instead of the movable section 62. The movable section 200 is substantially the same as the movable section 62 of the first embodiment, except for the points described below.

[0101] The movable section 200 of the second embodiment has a mounting section 201 and a pair of joint sections 202. The mounting section 201 and the two joint sections 202 may each have a part of the wiring layer 51 and a part of the backing layer 52.

[0102] The mounting portion 201 is a part of the movable portion 200 and has a mounting surface 81. The mounting surface 81 of the mounting portion 201 has a plurality of pads 86. The terminals of the magnetic head 14 are joined to the plurality of pads 86 by solder 88. Furthermore, the attachment surface 101 of the magnetic head 14 is attached to the mounting surface 81 by adhesive 105.

[0103] The pair of joints 202 are part of the movable part 200. Each of the pair of joints 202 has a corresponding one of the pair of rear edges 82. Furthermore, each of the pair of joints 202 has a joint surface 205. The joint surface 205 is included in the surface 51a of the wiring layer 51. For example, an end of the joint surface 205 in the +Y direction is connected to the mounting surface 81 of the mounting part 201.

[0104] 5, the bonding surface 205 of the bonding portion 202 is inclined relative to the mounting surface 81 so as to move away from the attachment surface 101 of the magnetic head 14 as it moves away from the mounting surface 81. In this embodiment, each of the pair of bonding portions 202 is bent relative to the mounting portion 201 so that the bonding surface 205 is inclined relative to the mounting surface 81.

[0105] The joint surface 205 of the joint 202 is inclined with respect to the mounting surface 81 so as to be, for example, approximately parallel to the mounting surface 71 of the base 61. Therefore, the angle between the mounting surface 71 of the base 61 and the joint surface 205 of the joint 202 is smaller than the angle between the mounting surface 71 and the mounting surface 81.

[0106] Each of the bonding surfaces 205 of the pair of bonding portions 202 has a corresponding one of the pair of pads 85. The second electrode 112 of the MA47 is bonded to the pad 85 by the adhesive 116. In other words, the second electrode 112 is bonded to the bonding surface 205.

[0107] In the HDD 10 of the second embodiment described above, the movable part 200 has a bonding surface 205 that is inclined with respect to the mounting surface 81 so as to become farther away from the attachment surface 101 as it moves away from the mounting surface 81. The second electrode 112 is bonded to the bonding surface 205. The angle between the mounting surface 71 and the bonding surface 205 is smaller than the angle between the mounting surface 71 and the mounting surface 81. In other words, the mounting surface 71 to which the first electrode 111 is bonded and the bonding surface 205 to which the second electrode 112 is bonded are inclined at a closer angle with respect to the mounting surface 81. This allows the MA 47 to be easily bonded to the flexure 43.

[0108] In the first and second embodiments, the mounting surface 71 is inclined with respect to the mounting surface 81 by bending the base 61 relative to the movable part 62. However, the mounting surface 71 is not limited to this example, and may be inclined with respect to the mounting surface 81 by, for example, thinning the thickness of the base 61 as it moves away from the movable part 62.

[0109] (Third embodiment) The third embodiment will be described below with reference to Figures 6 and 7. Figure 6 is an exemplary plan view showing a portion of an HGA 37 according to the third embodiment. Figure 7 is an exemplary cross-sectional view showing a portion of the HGA 37 of the third embodiment taken along line F7-F7 in Figure 6.

[0110] 6, the gimbal unit 45 of the third embodiment has a base 301 instead of the base 61, and a pair of connecting portions 302 instead of the pair of connecting portions 64. The base 301 and the connecting portions 302 are substantially the same as the base 61 and the connecting portions 64 of the first embodiment, except for the points described below.

[0111] The base 301 has a joint 311 and a riser 312. The joint 311 is an example of a portion of the first portion where a first joint surface is provided. The riser 312 is an example of a portion of the first portion where a first inclined surface is provided. The joint 311 and the riser 312 may each have a portion of the wiring layer 51 and a portion of the backing layer 52.

[0112] The joint portion 311 is a part of the base portion 301 and has a front edge 72. The joint portion 311 is bent relative to the rise portion 312. The connection portion 302 connects the annular portion 63 and the joint portion 311 so that the base portion 301 can swing relative to the annular portion 63.

[0113] The riser 312 is a part of the base 301, and is provided between the movable part 62 and the joint part 311. The riser 312 has a flexible part 73. The riser 312 is bent relative to the movable part 62.

[0114] The base 301 has a mounting surface 320 instead of the mounting surface 71. The mounting surface 320 is an example of a first surface. The mounting surface 320 is substantially the same as the mounting surface 71 of the first embodiment, except for the points described below. The mounting surface 320 has a bonding surface 321 and an inclined surface 322. The bonding surface 321 is an example of a first bonding surface. The inclined surface 322 is an example of a first inclined surface.

[0115] The bonding surface 321 is included in the bonding portion 311. The bonding surface 321 has a pair of pads 75. Therefore, the first electrode 111 of the MA47 is bonded to the pads 75 included in the bonding surface 321 by the adhesive 115. The bonding surface 321 is provided approximately parallel to the mounting surface 81 of the movable portion 62. Therefore, as shown in FIG. 7 , the bonding portion 311 extends approximately parallel to the movable portion 62 and also extends approximately parallel to the load beam 42. The bonding portion 311 is spaced apart from the load beam 42.

[0116] The inclined surface 322 is included in the riser 312. Therefore, the inclined surface 322 is provided between the joint surface 321 including the pad 75 and the movable portion 62. In this embodiment, the inclined surface 322 is included in the flexible portion 73. Note that the inclined surface 322 may be included in a portion of the riser 312 that is different from the flexible portion 73.

[0117] The inclined surface 322 is inclined with respect to the mounting surface 81 so as to move away from the attachment surface 101 of the magnetic head 14 as it moves away from the movable part 62. Therefore, the angle between the joining surface 321 and the mounting surface 81 is smaller than the angle between the inclined surface 322 and the mounting surface 81.

[0118] The riser 312 is bent relative to the movable part 62 so that the inclined surface 322 is inclined relative to the mounting surface 81. Furthermore, the joint 311 is bent relative to the riser 312 so that the joint surface 321 is inclined relative to the inclined surface 322. Note that the joint surface 321 and the inclined surface 322 are not limited to this example. For example, the thickness of the base 301 may be partially thinned to form the joint surface 321 and the inclined surface 322.

[0119] 6, each of the pair of connecting portions 302 is bent at a first bending portion 302a and a second bending portion 302b. An edge E3 of the first bending portion 302a and an edge E4 of the second bending portion 302b each extend substantially in the X direction.

[0120] Edge E5 of the bending portion between riser 312 and movable portion 62 is located on an extension of edge E3 of first bending portion 302a. In other words, edge E5 of the bending portion between riser 312 and movable portion 62 and edge E3 of first bending portion 302a are located at approximately the same position in the Y direction.

[0121] Edge E6 of the bending portion between joint 311 and riser 312 is located on an extension of edge E4 of second curved portion 302b. In other words, edge E6 of the bending portion between joint 311 and riser 312 and edge E4 of second curved portion 302b are located at approximately the same position in the Y direction.

[0122] In the HDD 10 of the third embodiment described above, the mounting surface 320 has an inclined surface 322 and a bonding surface 321. The inclined surface 322 is provided between the pad 75 and the movable portion 62, and is inclined with respect to the mounting surface 81 so as to move away from the attachment surface 101 as it moves away from the movable portion 62. The bonding surface 321 has the pad 75. The angle between the bonding surface 321 and the mounting surface 81 is smaller than the angle between the inclined surface 322 and the mounting surface 81. In other words, the bonding surface 321 having the pad 75 is formed so as to be nearly parallel to the mounting surface 81. This allows the MA 47 to be easily bonded to the flexure 43.

[0123] The riser 312 of the base 301, which has the inclined surface 322, is bent relative to the movable part 62 so that the inclined surface 322 is inclined relative to the mounting surface 81. The joint 311 of the base 301, which has the bonding surface 321, is bent relative to the riser 312 so that the bonding surface 321 is inclined relative to the inclined surface 322. This makes it easy to form the inclined surface 322 and the bonding surface 321. Furthermore, the joint 311 extends in a direction parallel to the load beam 42. This prevents the flexure 43 from coming into contact with the load beam 42.

[0124] The flexure 43 has an annular portion 63 and a connecting portion 302. The annular portion 63 surrounds the base portion 301 and the movable portion 62. The connecting portion 302 connects the annular portion 63 and the base portion 301 so that the base portion 301 can swing relative to the annular portion 63. The connecting portion 302 bends at a first bending portion 302a and a second bending portion 302b. An edge E5 of the bending portion between the rise portion 312 and the movable portion 62 is located on an extension of an edge E3 of the first bending portion 302a. An edge E6 of the bending portion between the joint portion 311 and the rise portion 312 is located on an extension of an edge E4 of the second bending portion 302b. In other words, the corner between the base portion 301 and the movable portion 62 bends at approximately the same position as the first bending portion 302a. Furthermore, the corner between the joining surface 321 and the inclined surface 322 bends at approximately the same position as the second bending portion 302b, which prevents the connecting portion 302 from applying an elastic force to the base portion 301 that would cause the bent base portion 301 to return to a straight shape.

[0125] (Fourth embodiment) The fourth embodiment will be described below with reference to Fig. 8 and Fig. 9. Fig. 8 is an exemplary plan view showing a portion of an HGA 37 according to the fourth embodiment. Fig. 9 is an exemplary cross-sectional view showing a portion of the HGA 37 of the fourth embodiment along line F9-F9 in Fig. 8.

[0126] 8, the gimbal section 45 of the fourth embodiment has a base section 301 and a pair of connecting sections 302, similar to the third embodiment. Furthermore, the gimbal section 45 of the fourth embodiment has a movable section 400 instead of the movable section 62. The movable section 400 is substantially the same as the movable section 62 of the first embodiment, except for the points described below.

[0127] The movable section 400 of the fourth embodiment has a mounting section 401, a pair of joint sections 402, and a pair of rise sections 403. The mounting section 401, the pair of joint sections 402, and the pair of rise sections 403 may each have a part of the wiring layer 51 and a part of the backing layer 52.

[0128] The mounting portion 401 is a part of the movable portion 400 and has a mounting surface 81. The mounting surface 81 of the mounting portion 401 has a plurality of pads 86. The terminals of the magnetic head 14 are joined to the plurality of pads 86 by solder 88. Furthermore, the attachment surface 101 of the magnetic head 14 is attached to the mounting surface 81 by adhesive 105.

[0129] The pair of joints 402 are part of the movable part 400. Each of the pair of joints 402 has a corresponding one of the pair of rear edges 82. The joints 402 are bent relative to the riser part 403.

[0130] The pair of risers 403 are part of the movable part 400. Each of the pair of risers 403 is provided between a corresponding one of the pair of joints 402 and the mounting part 401. The risers 403 are bent relative to the mounting part 401.

[0131] Each of the pair of bonding portions 402 has a bonding surface 405. The bonding surface 405 is an example of a second bonding surface. The bonding surface 405 is included in the surface 51a of the wiring layer 51. Each of the bonding surfaces 405 of the pair of bonding portions 402 has a corresponding one of the pair of pads 85. Therefore, the second electrode 112 of the MA47 is bonded to the pad 85 included in the bonding surface 405 by the adhesive 116.

[0132] 9, the joint surface 405 is provided substantially parallel to the mounting surface 81. Therefore, the joint portion 402 extends substantially parallel to the mounting portion 401 and also substantially parallel to the load beam 42. The joint portion 402 is spaced apart from the load beam 42.

[0133] In the Z direction perpendicular to the mounting surface 81, the bonding surface 321 of the base 301 and the bonding surface 405 of the movable part 400 are disposed at substantially the same position. In other words, the bonding surfaces 321 and 405 are disposed on the same plane. Therefore, in the Z direction, the distance between the bonding surface 321 and the bonding surface 405 is shorter than the distance between the bonding surface 405 and the mounting surface 81.

[0134] Each of the pair of risers 403 has an inclined surface 406. The inclined surface 406 is an example of a second inclined surface. The inclined surface 406 is provided between the mounting surface 81 and the bonding surface 405. For example, the end of the inclined surface 406 in the +Y direction is connected to the mounting surface 81. The end of the inclined surface 406 in the -Y direction is connected to the bonding surface 405.

[0135] The inclined surface 406 is inclined relative to the mounting surface 81 so as to move away from the attachment surface 101 of the magnetic head 14 as it moves away from the mounting surface 81. Therefore, the angle between the joining surface 405 and the mounting surface 81 is smaller than the angle between the inclined surface 406 and the mounting surface 81.

[0136] The first electrode 111 is bonded to the bonding surface 321 of the base 301, and the second electrode 112 is bonded to the bonding surface 405 of the movable part 400. As a result, the MA47 is disposed so that the attachment surface 110a is approximately parallel to the mounting surface 81.

[0137] In the Y direction, the position of the inclined surface 322 of the base part 301 and the position of the inclined surface 406 of the movable part 400 are different from each other. In this embodiment, in the Y direction, the inclined surface 406 is spaced apart from the inclined surface 322 in the +Y direction.

[0138] In the HDD 10 of the fourth embodiment described above, the movable part 400 has a bonding surface 405 and an inclined surface 406. The second electrode 112 is bonded to the bonding surface 405. The inclined surface 406 is provided between the mounting surface 81 and the mounting surface 405, and is inclined relative to the mounting surface 81 so as to move away from the attachment surface 101 as it moves away from the mounting surface 81. The angle between the bonding surface 405 and the mounting surface 81 is smaller than the angle between the inclined surface 406 and the mounting surface 81. In the Z direction perpendicular to the mounting surface 81, the distance between the bonding surface 321 and the bonding surface 405 is shorter than the distance between the bonding surface 405 and the mounting surface 81. In other words, the bonding surface 405 is formed so as to be nearly parallel to the bonding surface 321 and is provided at a closer position (height) in the Z direction. This allows the MA 47 to be easily bonded to the flexure 43.

[0139] In the above description, suppression is defined as, for example, preventing an event, action, or effect from occurring or reducing the magnitude of an event, action, or effect.

[0140] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0141] 10...Hard disk drive (HDD), 12...Magnetic disk, 14...Magnetic head, 16...Voice coil motor (VCM), 43...Flexure, 47...Microactuator (MA), 61,301...Base, 62,200,400...Moving part, 63...Annular part, 64,302...Connection part, 64a...Bent part, 71,320...Mounting surface, 72...Front edge, 7 5...pad, 81...mounting surface, 82...trailing edge, 101...mounting surface, 101a, 101b...end, 111...first electrode, 112...second electrode, 205...joint surface, 302a...first curved portion, 302b...second curved portion, 311...joint portion, 312...riser portion, 321...joint surface, 322...inclined surface, 405...joint surface, 406...inclined surface, Ax...central axis, E1 to E6...ridges.

Claims

1. A magnetic disk, a magnetic head configured to read and write information from and to the magnetic disk; a piezoelectric element having a first electrode and a second electrode spaced apart from the first electrode; a flexure having a first portion to which the first electrode is bonded and a second portion to which the magnetic head and the second electrode are bonded, wherein the piezoelectric element is deformed so as to change the distance between the first electrode and the second electrode, thereby causing the second portion to swing relative to the first portion; Equipped with the first portion has a first surface to which the first electrode is bonded; the second portion has a second surface to which the magnetic head is bonded; the magnetic head has a third surface facing the first surface and the second surface, the first electrode is spaced apart from the second electrode in a first direction along the second surface; the first surface faces an end of the third surface in the first direction; the second surface faces an end of the third surface in a second direction opposite the first direction; a distance between the first surface and an end of the third surface in the first direction is longer than a distance between the second surface and an end of the third surface in the second direction; Disk device.

2. the first surface has a pad to which the first electrode is bonded; At least a portion of the first surface between the pad and the second portion is inclined with respect to the second surface so as to become more distant from the third surface as it becomes more distant from the second portion.

2. The disk device according to claim 1.

3. Between the pad and the second portion, and in the pad, the first surface is inclined with respect to the second surface so as to move away from the third surface as it moves away from the second portion.

3. The disk device according to claim 2.

4. the first portion is bent relative to the second portion such that the first surface is inclined relative to the second surface; 4. The disk device according to claim 3.

5. the flexure has an annular portion surrounding the first portion and the second portion, and a connecting portion connecting the annular portion and the first portion so that the first portion can swing relative to the annular portion, The connection portion is bent at a bending portion, an edge of the bending portion between the first portion and the second portion is located on an extension line of the edge of the bending portion; 5. The disk device according to claim 4.

6. the second portion has a joining surface that is inclined with respect to the second surface so as to become more distant from the third surface as it becomes more distant from the second surface, the second electrode is bonded to the bonding surface; an angle between the first surface and the joining surface being smaller than an angle between the first surface and the second surface; 6. A disk device according to claim 3.

7. the first surface has a first inclined surface provided between the pad and the second portion and inclined with respect to the second surface so as to become more distant from the third surface as it becomes more distant from the second portion, and a first bonding surface having the pad; an angle between the first joint surface and the second surface is smaller than an angle between the first inclined surface and the second surface; 3. The disk device according to claim 2.

8. a portion of the first portion where the first inclined surface is provided is bent relative to the second portion such that the first inclined surface is inclined relative to the second surface; a portion of the first portion where the first bonding surface is provided is bent relative to a portion of the first portion where the first inclined surface is provided so that the first bonding surface is inclined to the first inclined surface; 8. The disk device according to claim 7.

9. the flexure has an annular portion surrounding the first portion and the second portion, and a connecting portion connecting the annular portion and the first portion so that the first portion can swing relative to the annular portion, the connecting portion is bent at a first bent portion and a second bent portion, an edge of a bending portion between a portion of the first portion where the first inclined surface is provided and the second portion is located on an extension line of an edge of the first bent portion, an edge of a bending portion between a portion of the first portion where the first bonding surface is provided and a portion of the first portion where the first inclined surface is provided is located on an extension line of an edge of the second bending portion; 9. The disk device according to claim 8.

10. the second portion has a second bonding surface to which the second electrode is bonded, and a second inclined surface that is provided between the second surface and the second bonding surface and is inclined with respect to the second surface so as to become more distant from the third surface as it becomes more distant from the second surface, an angle between the second joint surface and the second surface is smaller than an angle between the second inclined surface and the second surface; a distance between the first bonding surface and the second bonding surface in a direction perpendicular to the second surface is shorter than a distance between the second bonding surface and the second surface; 10. A disk device according to claim 7.

11. the second electrode is bonded to the second surface; the piezoelectric element has a mounting surface on which the first electrode and the second electrode are provided, the mounting surface is inclined relative to the second surface; 10. A disk device according to any one of claims 1 to 5 and claims 7 to 9.

12. the second portion is connected to the first portion so as to be pivotable relative to the first portion; the first portion has a first edge; the second portion has a second edge spaced apart from the first edge in the second direction along the second surface, the piezoelectric element extends across the first edge and the second edge; 10. A disk device according to any one of claims 1 to 5 and claims 7 to 9.

13. an actuator that rotates the flexure around a rotation axis; Further comprising: an end of the third surface in the first direction is closer to the rotation axis than an end of the third surface in the second direction; 10. A disk device according to any one of claims 1 to 5 and claims 7 to 9.

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