RFID devices

Abstract

To provide an RFID device that can change the performance after exposure to an external stimulus or event.SOLUTION: An RFID device 100 comprises: an RFID chip 110; and a first conductive structure 120 and a second conductive structure 130 that are formed from multiple conductive materials configured to move between a first operating condition and a second operating condition when exposed to an event or other stimuli. The second conductive structure is initially operatively coupled to the first conductive structure in the first operating condition. However, after exposure to the event, the first conductive structure is altered to change the behavior of the RFID device. The RFID device is attachable to a substrate, such as a garment or a fabric. The event may be a single or multiple occurrence event, such as washing, stretching, heating, or exposure of the RFID device to electrical signals.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Patent Application No. 62 / 954,965, filed December 30, 2019, the entire contents of which are incorporated herein by reference. [Background technology]

[0002] The present invention relates generally to radio frequency identification (RFID) devices having multiple conductors and methods of fabricating the same. More specifically, the multiple antennas can change composition and / or structure to modify the performance of the RFID device in response to an externally applied event. Accordingly, this specification makes specific reference thereto. However, it should be understood that aspects of the present invention may be applied to other similar applications, devices, and methods of fabrication as well.

[0003] Generally described, RFID uses electromagnetic energy to stimulate a transponder (known as an RFID "tag" or transponder) to identify itself and, in some cases, provide additional information and / or data stored on the tag. RFID tags and / or labels typically contain a combination of an antenna and analog and / or digital electronics, which may include, for example, semiconductor devices commonly referred to as "chips," communication electronics, data memory, and control logic. A typical RFID tag has a microprocessor electrically connected to the antenna and functions as a transponder, providing information stored in the chip memory in response to radio frequency interrogation signals received from a reader, also known as an interrogator. The reader / interrogator, in turn, converts radio waves from the RFID device into a form usable by a computer. In the case of passive RFID devices, the energy of the interrogation signal also provides the energy necessary to operate the RFID tag device.

[0004] RFID tags can be incorporated into or attached to any object or item that a user wishes to subsequently identify and / or track, such as a product, equipment, person, vehicle, machinery, livestock, etc. In some cases, the RFID tag can be attached to the exterior of the item by clip, adhesive, tape, or other means, and in other cases, the RFID tag can be inserted into the item such as included in packaging or is located within the container of the item or items.

[0005] RFID tags are typically manufactured with a unique identification number, which is generally a simple serial number of a few bytes with a check digit appended. This identification number is usually integrated into the RFID tag during manufacturing. Users cannot change this serial / identification number, and manufacturers guarantee that each RFID tag's serial number is unique since it is used only once. Such read-only RFID tags are usually permanently affixed to the item to be identified and / or tracked, and once affixed, the tag's serial number is linked to the host item in a computer database. When used to track or manage inventory, a microprocessor stores the unique identification data associated with the inventory on the RFID tag, allowing operators to retrieve the stored data using an external receiver / reader to process or track inventory.

[0006] One difficulty associated with manufacturing RFID devices is the need to provide a degree of flexibility and durability to the RFID device without damaging the RFID device. Historically, antenna structures used with RFID devices have been formed from conductive materials (e.g., copper, silver, or aluminum) and configured in a variety of structures, which may be printed or disposed on an object such as a carrier. Unfortunately, such RFID antenna structures have not always been particularly flexible or durable when subjected to flex forces. Therefore, it would be advantageous to provide an RFID antenna structure that is both durable and flexible, and RFID antenna structures formed from a variety of different conductive materials with one or more conductor configurations would also allow the RFID device to perform differently in the application of external events.

[0007] Thus, there is a long-felt need in the art for RFID devices and RFID antennas that are relatively flexible and durable when exposed to bending forces, and for RFID devices that have multiple conductors such that the RFID device permanently or reversibly alters the performance of the RFID device.

[0008] Thus, the present invention discloses an RFID device having more than one RFID antenna structure that, when combined, can alter the performance of the RFID device. More specifically, an RFID device includes multiple RFID antenna structures that comprise more than one material and that alter the performance of the RFID device after exposure to an external stimulus or event, such as, but not limited to, washing, stretching, heating, or exposure to a received electrical signal. Summary of the Invention [Means for solving the problem]

[0009] The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed invention. This summary is not extensive, and it is not intended to identify key / critical elements or to delineate the scope. Its sole purpose is to present some concepts in a simple form as a prelude to the more detailed description that is presented later.

[0010] Described herein are RFID devices including a first conductive structure, a second conductive structure, and an RFID chip operably coupled to the first conductive structure. In some embodiments, the first conductive structure is fabricated in a first configuration from a first conductive material, and the second conductive structure is fabricated in a second configuration from a second conductive material. In some embodiments, when the RFID device is in a first operating condition, the first conductive structure and the second conductive structure are in conductive communication with each other. Alternatively, in some embodiments, the first and second conductive structures can be initially ohmically or reactively coupled to each other, with or without a mechanical bond.

[0011] In some embodiments, upon exposure to an external event or stimulus, including but not limited to washing, stretching, heating, or exposure to a received electrical signal, the conductive communication between the first and second conductive structures is interrupted and the RFID device is reconfigured to a second operating condition. Depending on the materials used to construct the first and second conductive structures and the characteristics of the external event or stimulus, the change between the first and second operating conditions can be permanent or reversible. Additionally, the change from the first operating condition to the second operating condition can occur after a single external event or, alternatively, multiple or series of events, depending on the construction of the first and second conductive structures and the manner in which the conductive structures are attached to a substrate such as clothing, packaging, or other article.

[0012] In yet other embodiments, an RFID device includes a first conductive structure, a second conductive structure, and an RFID chip. In some embodiments, the first conductive structure is fabricated in a first configuration from a first conductive material, and the second conductive structure is preferably fabricated in a second configuration from a second conductive material. Also, in some embodiments, the second conductive structure is non-mechanically coupled to the first conductive structure, e.g., via a magnetic field, a capacitive field, or a combination of these fields, and both the first and second conductive structures are disposed on a substrate, such as a wearable item or textile.

[0013] In some embodiments, the first conductive structure may be substantially circular in shape when in the first operating condition, but will deform when exposed to an external event or other stimulus such that the RFID device moves from the first operating condition to the second operating condition.

[0014] In yet other embodiments, an RFID device includes a first conductive structure, a second conductive structure, and an RFID chip. In some embodiments, the first conductive structure is fabricated in a first structural configuration and the second conductive structure is fabricated in a second structural configuration. Also, in some embodiments, the first and second conductive structures can be separately attached to a substrate, where a particular mounting environment modifies the connection between the first and second conductive structures to respond differently to external events or stimuli, regardless of whether the first and second conductive structures are fabricated from the same conductive material. For example, and without limitation, when attached to the substrate, the first conductive structure can be elastically encapsulated in the substrate, and the second conductive structure can be rigidly encapsulated or otherwise attached to the substrate. Alternatively, as a further non-limiting example, the first and second conductive structures can be non-encapsulated and coupled to a common base substrate to respond differently to external events or other stimuli.

[0015] To the accomplishment of the foregoing and related ends, certain illustrative aspects of the disclosed invention are described in this specification by reference to the following description and the accompanying drawings. These aspects are, however, inclusive of but a few of the various ways in which the principles disclosed herein can be employed and are intended to include all such aspects and their equivalents. Other advantages and novel features will become apparent from the following detailed description when considered in conjunction with the drawings. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a perspective view of a plurality of conductive materials for use with an RFID device according to the disclosed architecture. [Figure 2] 1 illustrates a schematic diagram of an RFID device including a first conductive structure constructed from a first conductive material, an RFID chip, and a second conductive structure constructed from a second conductive material, all according to the disclosed architecture. [Figure 3] 1 is a schematic diagram of an RFID device according to the disclosed architecture, including a first conductive structure, an RFID chip, and a second conductive structure, where the first conductive structure includes a shunt for initially connecting the first and second conductive structures. [Figure 4] 1 is a schematic diagram of an RFID device including a first conductive structure having a first operating condition, an RFID chip, and a second conductive structure having a second operating condition, all according to the disclosed architecture. [Figure 5A] 1 is a graphical representation of a first conductive structure of an RFID device having a resistance that is altered after exposure of the first conductive structure of the RFID device to multiple repeated external events in accordance with the disclosed architecture. [Figure 5B] 10 is a graphical representation of a second conductive structure of an RFID device having an unchanged resistance after exposure to multiple repeated external events according to the disclosed architecture. [Figure 6A] 10 is an alternative graphical representation of the resistance of a first conductive structure of an RFID device as altered by the disclosed architecture after exposure to multiple repeated events. [Figure 6B] 10 is an alternative graphical representation of the resistance of a second conductive structure of an RFID device as altered by the disclosed architecture after exposure to multiple repeated events. [Figure 7A] 1 is a schematic diagram of an RFID device operating in a first operating condition according to the disclosed architecture; [Figure 7B] 1 is a schematic of an RFID device operating in a second operating condition according to the disclosed architecture. [Figure 8] 1 is a schematic diagram of an RFID device including a first conductive structure constructed from a first conductive material, an RFID chip, and a second conductive structure constructed from a second conductive material according to the disclosed architecture. [Figure 9A] 1 is a schematic diagram of an RFID device including a first conductive structure configured in a substantially circular configuration in a first operating condition according to the disclosed architecture; [Figure 9B] 1 is a schematic diagram of an RFID device in which the disclosed architecture causes the first conductive structure to deform in response to an external event (or some other stimulus) causing the RFID device to operate in a second operating condition. [Figure 10A] 1 is a schematic diagram of an alternative embodiment of an RFID device, in which a first conductive structure partially overlaps a second conductive structure in a first operating condition according to the disclosed architecture. [Figure 10B] FIG. 10 is a schematic diagram of an alternative embodiment of an RFID device, wherein the first conductive structure no longer overlaps the second conductive structure in response to an event that causes the RFID device to operate in a second operating condition according to the disclosed architecture. [Figure 11] 1 is a schematic diagram of an RFID device including a first conductive structure and a second conductive structure composed of the same conductive material and separately attached to a substrate according to the disclosed architecture. [Figure 12]FIG. 1 is a schematic diagram of an alternative embodiment of an RFID device including a first conductive structure, an RFID chip, and a second conductive structure, wherein the first and second conductive structures are composed of the same conductive material and separately attached to a substrate according to the disclosed architecture. DETAILED DESCRIPTION OF THE INVENTION

[0017] The present invention will now be described with reference to the drawings, wherein like reference numerals are used throughout the drawings to refer to like elements. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding thereof. However, it will be apparent that the present invention may be practiced without such specific details. In other instances, well-known structures and devices are shown in block diagram form to facilitate description.

[0018] As noted above, there exists a long-felt need in the art for an RFID tag or device that can be attached to clothing, textiles, or wearable articles that can be subjected to bending forces and that includes an antenna structure formed from a number of conductive materials and elements in a variety of configurations. More specifically, the RFID device can include more than one conductive material and / or configuration that can alter (reversibly or permanently) the performance of the RFID device in relation to an external event or other stimulus, including, but not limited to, washing, stretching, etc.

[0019] Referring first to the drawings, Figure 1 illustrates a perspective view of several conductive materials and potential configurations for use with an RFID device, including, by way of non-limiting example, (a) a wire 10 made from copper or other conductive material, (b) a conductive foil material 20 that is cut or etched (e.g., laser or die) including, but not limited to, aluminum or copper, (c) a printed conductor 30 such as a matrix coating (e.g., ink) of particles of copper, silver, graphene, or other inorganic or organic conductive materials or combinations thereof, or (d) a metal mesh 40. While several conductive materials and configurations can independently adapt to some degree to events or external stimuli, using two or more conductors as part of a common antenna structure provides greater flexibility to an RFID device.

[0020] FIG. 2 illustrates a schematic diagram of an RFID device 100 having multiple conductors. More specifically, RFID device 100 includes an RFID chip 110, a first conductive structure 120, and a second conductive structure 130. As best illustrated in FIG. 7A , when second conductive structure 130 is in a first operating condition 100A, RFID chip 110 is operably coupled to first conductive structure 120 and RFID chip 110 is operably coupled to second conductive structure 130. The initial coupling between first conductive structure 120 and second conductive structure 130 can vary. In some embodiments, the initial coupling between first conductive structure 120 and second conductive structure 130 is a conductive coupling.

[0021] In some embodiments, the first conductive structure 120 is fabricated from a first conductive material, and the second conductive structure 130 is fabricated from a different conductive material. Also, in some embodiments, the first conductive structure 120 is configured in a first configuration, and the second conductive structure 130 is preferably configured in a different configuration. For example, the first conductive structure 120 can be a pair of printed areas of conductive ink, such as printed conductor 30 in FIG. 1 , and the second conductive structure 130 can be wire 10 (also shown in FIG. 1 ). Also, the wire of the second conductive structure 130 is conductively coupled to the pair of printed areas of the first conductive structure 120 because the wire overlaps a portion of the pair of printed areas of conductive ink. Alternatively, in some embodiments, coupling can be via capacitance.

[0022] 3 illustrates a schematic diagram of an RFID device 100 including an RFID chip 110, a first conductive structure 120, and a second conductive structure 130, where the first conductive structure 120 further includes a shunt element 122 for initially connecting the first conductive structure 120 to the second conductive structure 130. More specifically, when the RFID device 100 is in a first operating condition, the shunt element 122 of the first conductive structure 120 overlaps a portion of the second conductive structure 130.

[0023] 2 and 3, the first conductors 120 and the second conductors 130 may be fabricated from different materials and / or have different configurations, so that they may have different responses to external events. For example, exposure to an external event (or a series of external events) may cause the RFID device 100 to change from a first operating condition to a second operating condition. The change in operating condition may be permanent or reversible, depending on the materials used to construct each conductive structure, the configuration of the conductive structures, the type of external event, the number of external events, and / or a combination thereof.

[0024] As previously mentioned, the external event can be a single event or a series of events including, but not limited to, washing, stretching, heating, receiving an electrical signal, etc. For example, if the first conductive structure 120 is water-soluble, such as a conductive ink with a water-soluble binder, the conductive ink can be removed by a washing event, thereby altering the properties of the RFID device 100. More specifically, as the first conductive structure 120 is washed and removed (or partially removed), the performance of the RFID device 100 can be reversibly or permanently altered.

[0025] FIG. 4 illustrates a schematic diagram of an RFID device 100 including an RFID chip 110, a first conductive structure 120 having a first operating condition, and a second conductive structure 130 having a second operating condition, with the ability to change performance in response to the removal of the first conductive structure 120. Before the first conductive structure 120 is removed, the overall antenna configuration of the first conductive structure 120 and the second conductive structure 130 becomes longer. In other words, the first conductive structure 120 and the second conductive structure 130 function as a series RFID antenna with two tuning states based on the characteristics of the first and second conductive structures 120, 130. In this manner, the RFID device 100 functions under a first operating condition with a frequency of f1, for example, in the 902 MHz to 928 MHz range (100A in FIG. 7A). When the first conductive structure 120 is removed, the overall antenna configuration becomes shorter, and the optimal frequency shifts to f2 under a second operating condition. The f2 frequency is a band in which RFID systems do not operate, so the effect of the change would be to prevent or reduce the range of operation in the 902-928 MHz band.

[0026] FIG. 5A illustrates a graphical representation of a first conductive structure of an RFID device having a resistance that changes after the first conductive structure of the RFID device is exposed to multiple repeated external events, and FIG. 5B illustrates a graphical representation of a second conductive structure of the RFID device having a resistance that does not change after being exposed to the same multiple repeated external events. More specifically, FIGS. 5A and 5B visualize how key operating parameters, such as the resistance of the material of the first conductive structure 120 compared to the resistance of the material of the second conductive structure 130, change upon exposure to an external event. In this particular example, a single event, such as cleaning the RFID device 100, can cause the first conductive structure 120 to move from a low resistance to a higher resistance (shown in FIG. 5A), while the second conductive structure 130 remains relatively unaffected after exposure to the first event (shown in FIG. 5B). As best shown in FIGS. 5A and 5B, after the first event, the resistance remains relatively the same with repeated events, such as additional cleaning cycles.

[0027] FIG. 6A shows an alternative graphical representation of the resistance of a first conductive structure of an RFID device as it changes after being exposed to multiple repeated events, and FIG. 6B shows an alternative graphical representation of the resistance of a second conductive structure of an RFID device as it changes after being exposed to the same multiple repeated events. More specifically, FIGS. 6A and 6B illustrate alternative changes in resistance patterns for the material of the first conductive structure 120 and the material of the second conductive structure 130 in response to multiple identical or similar events, such as multiple cleaning cycles. In this particular example, and as best shown in FIG. 6A , the resistance of the material of the first conductive structure 120 remains relatively low after exposure to the first two events, increases with the third event, and then levels off with the fourth event. For comparison, as best shown in FIG. 6B , the resistance of the second conductive structure 130 gradually increases over the first three events and remains flat with the fourth event.

[0028] 7A illustrates a schematic diagram of an RFID device 100 operating under a first operating condition 100A, and FIG. 7B illustrates a schematic diagram of an RFID device 100 operating under a second operating condition 100B. More specifically, FIGS. 7A and 7B illustrate how first and second conductive structures 120, 130 having different materials and morphologies can be used to modify the behavior or performance of the RFID device 100 in response to an external event. In this particular case, the second conductive structure 130 (illustrated as a wire antenna) initially contacts the first conductive structure 120 (illustrated as a pair of printed conductors). For example, the second conductive structure 130 can be sewn to a substrate such as a fabric, while the first conductive structure 120 can be attached to the surface of the substrate.

[0029] When the RFID device is in the first operating condition 100A, the first conductive structure 120 and the second conductive structure 130 are ohmically or reactively coupled to each other. Alternatively, the first conductive structure 120 and the second conductive structure 130 can be coupled by a mechanical bond. If the textile is part of a garment that stretches when worn, the RFID device is in the first operating condition 100A, for example, while the garment is hanging in a store. When in the first operating condition 100A, the frequency would have to be tuned for maximum range in the relatively light dielectric loading environment of the RFID device (as best shown in FIG. 4A ).

[0030] Alternatively, if the external event were to cause the garment carrying the RFID device to stretch, the first conductive structure 120 and the second conductive structure 130 would stretch and pull apart as the garment is worn, which in turn would move the RFID device to the second operating condition 100B. The presence of a dielectric material associated with a human would also reduce the operating frequency of the RFID device 100 from its optimal value when the RFID device is in the first operating condition 100A, as shown in FIG. 4B . However, the RFID device in the second operating condition 100B would have an effectively shorter overall antenna structure that is more suitable for operation when near a human. As previously mentioned, the change from functionality in the first operating condition to functionality in the second operating condition can occur in response to a single event. In this example, if the wires of the second conductive structure 130 were mechanically bonded to the printed ink of the first conductive structure 120, the ink could be torn and distorted by the garment stretching event, resulting in an irreversible change in the operational performance of the RFID device 100. Alternatively, the wires of the second conductive structure 130 can slide freely over the printed ink of the first conductive structure 120, making the process reversible.

[0031] 8-9B illustrate schematic diagrams of an alternative embodiment of an RFID device 200 including an RFID chip 210, a first conductive structure 220, and a second conductive structure 230. More specifically, the RFID device 200 uses two separate antenna elements fabricated from different materials that couple via a magnetic field, a capacitive field, or a combination of these fields. The second conductive structure 230 is operably coupled to the first conductive structure 220 when the RFID device 200 is in a first operating condition, as best shown in FIG. 9A , and the initial coupling between the first conductive structure 220 and the second conductive structure 230 is typically a non-mechanical coupling 240, such as a magnetic field, a capacitive field, or a combination of these fields. The RFID chip 210 is also operably coupled to the first conductive structure 220 and / or the second conductive structure 230, and the first and second conductive structures 220, 230 are typically disposed on a substrate, such as a fabric used in clothing.

[0032] As previously mentioned, the first conductive structure 220 is typically fabricated from a first conductive material, and the second conductive structure 230 is fabricated from a different conductive material. Additionally, the first and second conductive structures 220, 230 have different morphologies with different mechanical properties. For example, the first conductive structure 220 can be a stretchable conductive loop, and the second conductive structure 230 can be a relatively stiff wire. An external event, such as the application of a force, such as stretching, will alter the bond 240.

[0033] For example, in an undeformed first operating condition 200A, the first conductive structure 220A of the RFID device may be substantially circular in shape with an initial bond 240A, as best shown in FIG. 9A. In response to the stretching event described above, the first conductive structure 220 may be deformed, as best shown in FIG. 9B. In a second operating condition 200B, the deformed first conductive structure 220B of the RFID device may be configured as a loop variation between a circular and an elliptical shape. When the deformed first conductive structure 220B is pulled away from the second conductive structure 230, the deformation of the first conductive structure 220B creates a deformation bond 240B, thereby altering the performance of the RFID device 200 as described above.

[0034] 10A illustrates a schematic diagram of an alternative embodiment of an RFID device in which the first conductive structure 220 partially overlaps the second conductive structure 230 under a first operating condition 200A, and FIG. 10B illustrates a schematic diagram of an alternative embodiment of an RFID device in which the first conductive structure 220 no longer overlaps the second conductive structure 230 in response to an event, causing the RFID device to operate under a second operating condition 200B. Each of the first and second conductive structures 220, 230 may further include an RFID chip 210 operably coupled thereto. More specifically, the first conductive structure 220 may be configured as a generally U-shaped single element, and under the first operating condition 200A, the first conductive structure 220 may include a bridge that partially overlaps the second conductive structure 230 in the form of a wire for the RFID device. In response to an external event such as tension, the first conductive structure 220 moves away from the second conductive structure 230, so that the two conductive structures no longer overlap with the RFID device in the second operating condition 200B, thereby reducing the coupling between the first and second conductive structures 220, 230.

[0035] In an alternative embodiment, as shown in Figures 11 and 12, an RFID device 300 uses two separate antenna elements fabricated from the same material, but each having a different configuration that is encapsulated or attached to a substrate in a different manner. More specifically, the RFID device 300 includes an RFID chip 310 operably coupled to a first conductive structure 320, and a second conductive structure 330 operably coupled to the first conductive structure 320 when in a first operating condition. The initial coupling between the first conductive structure 320 and the second conductive structure 330 is typically a non-mechanical coupling, such as a magnetic field, a capacitive field, or a combination of these fields. Because the first and second conductive structures 320, 330 are separately attached to a substrate 340, such as a fabric used in clothing, the first and second conductive structures 320, 330 respond differently to events.

[0036] In this particular embodiment, the first and second conductive structures 320, 330 are generally fabricated from the same conductive material. However, the first and second conductive structures 320, 330 have different configurations with different mechanical properties. For example, the first conductive structure 320 can be a conductive loop movably attached to the substrate 340, and the second conductive structure 330 can be a wire that is initially relatively rigidly attached to the substrate 340, as best shown in FIG. 11 . Alternatively, the first conductive structure 320 can be a conductive loop immovably attached to the substrate 340, and the second conductive structure 330 can be a dipole antenna element attached to the substrate 340 in a relatively freely moving manner, as best shown in FIG. 12 . Events such as the application of a force, such as stretching, will alter the coupling between the first and second conductive structures 320, 330.

[0037] 11 , the loops of the first conductive structure 320 can be resiliently encapsulated within a first encapsulation portion 342, which can be attached to a substrate 340. The material of the first encapsulation portion 342 is preferably a stretchable material that allows the first conductive structure 320 to move on or within the substrate 340 when exposed to an event such as stretching. The wires of the second conductive structure 330 are relatively rigidly encapsulated within a second encapsulation portion 344, which can also be attached to the substrate 340. When the RFID device 300 is deformed, exposed to heat, or some other external event occurs, the loops of the first conductive structure 320 can move or change shape or position relative to the wires of the second conductive structure 330, thereby changing the coupling between the first and second conductive structures 320, 330, which, as previously described, alters the performance of the RFID device 300.

[0038] As illustrated in FIG. 12 , the first and second conductive structures 320, 330 can be non-encapsulated and attached to the substrate 340 so that they respond differently to external events, such as stretching. For example, the dipole antenna structure of the second conductive structure 330 can be sewn to the fabric of the substrate 340 so that it can move relatively freely as the fabric stretches. In comparison, the loop antenna of the first conductive structure 320 can be adhesively bonded to the fabric of the substrate 340, so that it does not move unless sufficient force is applied to irreversibly separate the first conductive structure 320 from the fabric. As previously mentioned, the purpose of changing or tuning the performance of the RFID device 300 in response to an event can be to retune the RFID device 300. Examples of these purposes include operating better near the user, maintaining short-range reading capabilities that allow the user to scan the item themselves while reducing long-range reading capabilities to protect consumer privacy, or completely shutting down the RFID device 300.

[0039] What has been described above includes examples of the claimed subject matter. Of course, it is not possible to describe every conceivable combination of elements or methodologies in order to describe the claimed subject matter, but one of ordinary skill in the art will recognize that many additional combinations and permutations of the claimed subject matter are possible. Accordingly, it is intended that the claimed subject matter embrace all such changes, modifications, and variations that fall within the spirit and scope of the appended claims. Also, to the extent the term "includes" is used in the detailed description or the claims, it is intended that such term be inclusive in the same manner as the term "comprising," as "comprising" is interpreted when used as a transitional term in the claims.

Claims

1. a first conductive structure; a second conductive structure operatively coupled to the first conductive structure in a first operating state; an RFID chip operably coupled to the second conductive structure; Substrate and Equipped with the second conductive structure is sewn to the substrate, and the first conductive structure is attached to a surface of the substrate; the first conductive structure comprises a pair of printed areas of conductive ink; the second conductive structure comprises a wire; An RFID device wherein the wires of the second conductive structure are conductively coupled to the pair of printed areas of the first conductive structure by overlapping portions of the pair of printed areas of the conductive ink.

2. The RFID device of claim 1 , wherein the first conductive structure is made from a first conductive material and the second conductive structure is made from a different conductive material.

3. The RFID device of claim 1 , wherein the first conductive structures have a first configuration and the second conductive structures have a different configuration.

4. 10. The RFID device of claim 1, wherein the first conductive structure comprises a shunt element.

5. The RFID device of claim 1 , wherein exposure to an event causes the RFID device to change from a first operational state to a second operational state.

6. The RFID device of claim 5 , wherein the change from the first operating state to the second operating state is reversible.

7. The RFID device of claim 6 , wherein the change from the first operational state to the second operational state is permanent.

8. The RFID device of claim 5 , wherein the event includes at least one of washing, stretching, heating, and receiving an electrical signal.

9. The RFID device of claim 1 , wherein upon removal of the first conductive structure, a performance level of the RFID device changes.

10. The RFID device of claim 1 , wherein the first conductive structure is water soluble.

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