Photosensitive resin composition, partition wall, organic electroluminescent device, and image display device

Abstract

The present invention provides a photosensitive resin composition which is capable of achieving a good balance between level difference control and inkjet coatability. A photosensitive resin composition according to the present invention contains (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound and (D) a liquid repellent agent, and is characterized in that: the photopolymerization initiator (A) contains a photopolymerization initiator represented by general formula (I); and the liquid repellent agent (D) contains an acrylic resin (D1) that contains a fluorine atom and a repeating unit represented by general formula (II).

Description

[Technical Field]

[0001] The present invention relates to a photosensitive resin composition, a partition wall formed by curing the photosensitive resin composition, an organic electroluminescent device including the partition wall, and an image display device including the organic electroluminescent device. [Background technology]

[0002] Conventionally, organic electroluminescent elements included in organic electroluminescent displays and the like have been manufactured by forming partition walls (banks) on a substrate and then laminating various functional layers within the area surrounded by the partition walls. As a method for easily forming such partition walls, a photolithography method using a photosensitive resin composition is known.

[0003] Furthermore, a method for laminating various functional layers within an area surrounded by partition walls includes first preparing an ink containing a material for forming the functional layer and then injecting the prepared ink into the area surrounded by partition walls. Among these methods, the inkjet method is often adopted because it is easy to accurately inject a predetermined amount of ink into a predetermined location.

[0004] Furthermore, when forming a functional layer using ink, it may be necessary to impart ink-repellent (liquid-repellent) properties to the partition walls in order to prevent the ink from adhering to the partition walls or to prevent the inks injected between adjacent regions from mixing with each other.

[0005] When forming an organic light-emitting layer using an inkjet method, it is difficult to control the film thickness of the organic light-emitting layer. The film thickness of the organic light-emitting layer is often thicker at the edges adjacent to the partition walls than at the center, resulting in non-uniform light emission, reduced light-emitting efficiency, and a shortened lifespan of the organic electroluminescent display. To solve this problem, Patent Document 1 proposes a method in which a pixel region is divided into first and second partition walls of different heights, and the organic light-emitting layer is applied in a linear pattern on the second partition wall, thereby controlling the film thickness uniformly within the pixel region located within the second partition wall. Another proposed method for forming the first and second partition walls is to simultaneously form the first and second partition walls of different heights using masks with different transmittances (half-tone masks).

[0006] On the other hand, Patent Document 2 describes that by using a photosensitive resin composition containing a specific alkali-soluble resin, it is possible to form partition walls having both a fine line pattern and fine contact holes, and in particular, by using a specific photopolymerization initiator, it is possible to impart sufficient ink repellency to the partition walls. Furthermore, Patent Document 3 describes that by using a photosensitive resin composition containing a specific polymer and a specific photopolymerization initiator, it is possible to form spacers with desired elastic properties. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] International Publication No. 2009 / 147838 [Patent Document 2] International Publication No. 2013 / 069789 [Patent Document 3] Japanese Patent Application Laid-Open No. 2015-184411 Summary of the Invention [Problem to be solved by the invention]

[0008] When forming an organic light-emitting layer by an inkjet method using partition walls with different heights, it is necessary to control the difference in height (step) between the first and second partition walls and inkjet coating properties. Although Patent Document 1 describes that an organic light-emitting layer having a uniform thickness can be applied by controlling the liquid repellency of the first and second partitions, it does not describe a specific method for controlling the step, nor does it describe how to achieve both the step and inkjet coating properties. Furthermore, the inventors of the present invention have found that it is difficult to achieve both control of step height and inkjet coating properties with the photosensitive resin composition described in Patent Document 2. Patent Document 3 does not describe anything about liquid repellent agents, and it is unclear what characteristics would be exhibited when a liquid repellent agent is used.

[0009] Therefore, an object of the present invention is to provide a photosensitive resin composition that can achieve both control of step height and inkjet coating properties. The present invention also provides partition walls formed by curing a photosensitive resin composition, an organic electroluminescent device having the partition walls, and an image display device including the organic electroluminescent device. [Means for solving the problem]

[0010] As a result of intensive research, the present inventors have found that the above-mentioned problems can be solved by using a specific photopolymerization initiator and a specific liquid repellent agent in combination in a photosensitive resin composition containing a photopolymerization initiator, an alkali-soluble resin, a photopolymerizable compound, and a liquid repellent agent, and have thus completed the present invention. That is, the gist of the present invention is as follows.

[0011] [1] A photosensitive resin composition containing (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, and (D) a liquid repellent agent, The (A) photopolymerization initiator contains a photopolymerization initiator represented by the following general formula (I): A photosensitive resin composition, characterized in that the liquid repellent agent (D) comprises an acrylic resin (D1) containing a repeating unit represented by the following general formula (II) and a fluorine atom: [ka] (In formula (I), R 1a represents an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent. R 2a represents an alkyl group. R 3a represents a monovalent substituent. n represents 0 or 1. h represents an integer of 0 to 2. [ka] (In formula (II), R 11 each independently represents a hydrogen atom or a methyl group, R 12 represents an alkyl group having 2 to 6 carbon atoms which may have a substituent, and which may be interrupted by one or more of -O-, -C(=O)-, -S-, and -NH-. * indicates a bond.) [2] In the formula (I), R 3a R 4a -O-(However, R 4a represents an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent; and h is 1. [3] The photosensitive resin composition according to [1] or [2], wherein the content of the photopolymerization initiator represented by the general formula (I) is 80 to 100 mass % based on the total amount of the photopolymerization initiator. [4] The photosensitive resin composition according to any one of [1] to [3], wherein the content of the alkali-soluble resin (B) relative to 100 parts by mass of the photopolymerizable compound (C) is 200 parts by mass or less. [5] The photosensitive resin composition according to any one of [1] to [4], wherein the acrylic resin (D1) has a fluoroalkyl group and / or a fluoroalkylene group. [6] The photosensitive resin composition according to any one of [1] to [5], wherein the alkali-soluble resin (B) contains a resin having a partial structure represented by the following general formula (i) or (iii): [ka] (In formula (i), R a represents a hydrogen atom or a methyl group, and R b represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) may be further substituted with any substituent. * represents a bond.) [ka] (In formula (iii), R e represents a hydrogen atom or a methyl group, and γ represents a single bond, —CO—, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (iii) may be further substituted with any substituent. * represents a bond.) [7] The photosensitive resin composition according to any one of [1] to [6], which is used for forming partition walls. [8] The photosensitive resin composition according to [7], which is used for forming partition walls having steps in a single step by photolithography. [9] A partition wall obtained by curing the photosensitive resin composition according to any one of [1] to [8].

[10] An organic electroluminescent device comprising the partition wall according to [9].

[11] An image display device comprising the organic electroluminescent device according to

[10] . [Effects of the Invention]

[0012] According to the present invention, it is possible to provide a photosensitive resin composition that can achieve both control of step height and inkjet coating properties. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view showing an example of a substrate provided with partition walls having steps. [Figure 2] FIG. 2 is a cross-sectional view showing an example of a substrate provided with partition walls having steps. DETAILED DESCRIPTION OF THE INVENTION

[0014] The present invention will be described in detail below. The following description is an example of an embodiment of the present invention, and the present invention is not limited to these unless it exceeds the gist of the present invention. In the present invention, "(meth)acrylic" means "acrylic and / or methacrylic". In the present invention, the term "total solid content" means all components other than the solvent in the photosensitive resin composition. In the present invention, a numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the lower and upper limits. In the present invention, "A and / or B" means one or both of A and B, and specifically means A, B, or A and B. In the present invention, the term "(co)polymer" refers to both a homopolymer and a copolymer, and the term "polybasic acid (anhydride)" refers to a polybasic acid and / or a polybasic acid anhydride. In the present invention, the weight average molecular weight means the weight average molecular weight (Mw) calculated in terms of polystyrene by GPC (gel permeation chromatography). In the present invention, the acid value refers to the acid value calculated as the effective solid content, and is calculated by neutralization titration.

[0015] In the present invention, the partition material refers to a bank material, a wall material, and a wall material, and similarly, the partition wall refers to a bank, a wall, and a wall. In the present invention, the light-emitting portion (pixel portion) refers to a portion that emits light when electrical energy is applied.

[0016] [1] Photosensitive resin composition The photosensitive resin composition of the present invention contains (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, and (D) a liquid repellent, wherein the (A) photopolymerization initiator contains a photopolymerization initiator represented by general formula (I) described below, and the (D) liquid repellent contains an acrylic resin (D1) containing a repeating unit represented by general formula (II) described below and a fluorine atom. The photosensitive resin composition of the present invention may further contain other components as necessary, such as an ultraviolet absorber or a polymerization inhibitor.

[0017] In the present invention, the partition wall is used to partition, for example, a functional layer (organic layer, light-emitting portion) in an active-drive organic electroluminescent element, and is used to form pixels including the functional layer and the partition wall, for example, by ejecting and drying ink, which is a material for constituting the functional layer, into the partitioned region (pixel region).

[0018] [1-1] Components and composition of photosensitive resin composition The components constituting the photosensitive resin composition of the present invention and the composition thereof will be described below. The photosensitive resin composition of the present invention contains (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, and (D) a liquid repellent agent.

[0019] [1-1-1] Component (A): Photopolymerization initiator The photosensitive resin composition of the present invention contains (A) a photopolymerization initiator, which is a compound that polymerizes the ethylenically unsaturated bond of (C) a photopolymerizable compound by the application of actinic rays.

[0020] The photopolymerization initiator (A) in the photosensitive resin composition of the present invention contains a photopolymerization initiator represented by the following general formula (I) (hereinafter, sometimes referred to as "photopolymerization initiator (a1)").

[0021] [ka]

[0022] (In formula (I), R1a represents an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent. R 2a represents an alkyl group. R 3a represents a monovalent substituent. n represents 0 or 1. h represents an integer of 0 to 2.

[0023] Since the photopolymerization initiator (a1) has a sulfide skeleton, it has a moderate curing property on the surface and is easy to form the desired step. Therefore, it is thought that it is easy to uniformly apply the organic light-emitting layer in a line shape on the second partition wall adjacent to the pixel region. In addition, the radical generation site R 2a is an alkyl group, and the mobility of the generated radicals is high, so that the liquid repellent agent can be sufficiently retained even on the side surface of the linear first partition wall adjacent to the second partition wall, and it is thought that this can prevent the ink from running onto the first partition wall during application.

[0024] (R 1a ) R in the above formula (I) 1a The alkyl group in may be linear, branched, or cyclic, or may be a combination of these. The number of carbon atoms in the alkyl group is not particularly limited, but is usually 1 or more, and preferably 20 or less, more preferably 10 or less, even more preferably 6 or less, and even more preferably 2 or less. For example, 1 to 20 is preferred, 1 to 10 is more preferred, 1 to 6 is even more preferred, and 1 to 2 is particularly preferred. Furthermore, by keeping the number of carbon atoms below the upper limit, internal curability tends to be enhanced.

[0025] Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, an isopentyl group, a hexyl group, a cyclopentyl group, a cyclohexyl group, a cyclopentylmethyl group, a cyclopentylethyl group, a cyclohexylmethyl group, and a cyclohexylethyl group. Among these, from the viewpoint of internal curability, a methyl group, a hexyl group, an isopentyl group, a cyclopentylmethyl group, and a cyclohexylmethyl group are preferred, and a methyl group is more preferred.

[0026] Examples of the substituent that the alkyl group may have include an aromatic ring group, a hydroxyl group, and a carboxyl group, and from the viewpoint of ease of synthesis, an unsubstituted alkyl group is preferred.

[0027] R in the above formula (I) 1a Examples of the aromatic ring group in the formula (I) include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is not particularly limited, but is preferably 4 or more, more preferably 5 or more, and preferably 30 or less, more preferably 20 or less, and even more preferably 12 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 5 to 12 is even more preferred. By setting the number at or above the lower limit, solubility in solvents tends to be good. On the other hand, by setting the number at or below the upper limit, internal curability tends to be high.

[0028] Examples of the aromatic ring group include a phenyl group, a naphthyl group, a pyridyl group, and a furyl group. Among these, from the viewpoint of developability, a phenyl group and a naphthyl group are preferred, and a phenyl group is more preferred. Examples of the substituent that the aromatic ring group may have include a hydroxyl group and an alkyl group, and from the viewpoint of developability, an alkyl group is preferred. Among these, from the viewpoint of internal hardening, R 1a is preferably an alkyl group which may have a substituent.

[0029] (R 2a ) R in the above formula (I) 2a The alkyl group in may be linear, branched, or cyclic, or may be a combination of these. The number of carbon atoms in the alkyl group is not particularly limited, but is usually 1 or more, and preferably 5 or less, more preferably 3 or less, and even more preferably 2 or less. For example, 1 to 5 is preferred, 1 to 3 is more preferred, and 1 to 2 is even more preferred. By keeping the number of carbon atoms below the upper limit, internal curability tends to be enhanced.

[0030] Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, and a pentyl group. Among these, a methyl group is preferred from the viewpoint of internal curability.

[0031] (R 3a ) R in the above formula (I) 3a The monovalent substituent in R is not particularly limited, but from the viewpoint of developability, 4a -O-, R 4a -(C=O)- is preferred.

[0032] R 4a Examples of the alkyl group include an alkyl group which may have a substituent and an aromatic ring group which may have a substituent. R 4a The alkyl group in the formula (I) may be linear, branched, or cyclic, or may be a combination thereof. The number of carbon atoms in the alkyl group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 8 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 8 is preferred, 1 to 5 is more preferred, 1 to 3 is even more preferred, and 2 to 3 is particularly preferred. Synthesis tends to be easier when the number is equal to or greater than the lower limit. Furthermore, developability tends to be better when the number is equal to or less than the upper limit.

[0033] Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, and a pentyl group. Among these, from the viewpoint of developability, a methyl group and an ethyl group are preferred, and an ethyl group is more preferred. Examples of the substituent that the alkyl group may have include a hydroxyl group and a carboxyl group, and from the viewpoint of developability, a hydroxyl group is preferred.

[0034] R 4aExamples of the aromatic ring group in include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is not particularly limited, but is usually 4 or more, preferably 5 or more, and preferably 30 or less, more preferably 20 or less, and even more preferably 12 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 5 to 12 is even more preferred. By setting the number at or above the lower limit, synthesis tends to be easier. Furthermore, by setting the number at or below the upper limit, developability tends to be better. Examples of the aromatic ring group include a phenyl group, a naphthyl group, a thienyl group, a furyl group, a benzothienyl group, and a benzofuryl group. Among these, from the viewpoint of sensitivity, a benzothienyl group and a benzofuryl group are preferred, and a benzofuryl group is more preferred. Examples of the substituent that the aromatic ring group may have include an alkyl group, a hydroxyl group, and a carboxyl group, and from the viewpoint of synthesis, it is preferably unsubstituted.

[0035] R in the above formula (I) 3a As the monovalent substituent in the above, from the viewpoint of proper internal curing, R 4a R is a hydroxyl-substituted ethyl group 4a -O-, R 4a R is a benzofuryl group 4a -(C=O)- is preferred, and R 4a R is a hydroxyl-substituted ethyl group 4a -O- is more preferred.

[0036] (n) In the above formula (I), n represents 0 or 1. From the viewpoint of appropriate internal curability, n is preferably 1. From the viewpoint of ease of synthesis, n is preferably 0.

[0037] (h) In the above formula (I), h represents an integer of 0 to 2. From the viewpoint of developability, h is preferably 0 or 1, and more preferably 1. If h is an integer greater than or equal to 1, R 3aThe substitution position of is not particularly limited, but from the viewpoint of synthesis, the o-position or p-position is preferred, and the p-position is more preferred.

[0038] Specific examples of known compounds as the photopolymerization initiator (a1) include the following.

[0039] [ka]

[0040] Among these, the compound represented by formula (a1-3) is preferred from the viewpoint of appropriate internal curability.

[0041] The photopolymerization initiator (A) in the photosensitive resin composition of the present invention may further contain a photopolymerization initiator other than the photopolymerization initiator (a1) (hereinafter, may be referred to as "other photopolymerization initiator (a2)"). As the other photopolymerization initiator (a2), a photopolymerization initiator commonly used in this field can be used, such as a hexaarylbiimidazole-based photopolymerization initiator, an acylphosphine oxide-based photopolymerization initiator, an oxime ester-based photopolymerization initiator other than the photopolymerization initiator (a1), a triazine-based photopolymerization initiator, an acetophenone-based photopolymerization initiator, or a benzophenone-based photopolymerization initiator.

[0042] As the hexaarylbiimidazole-based photopolymerization initiator, from the viewpoints of absorbance, sensitivity, and matching with the absorption wavelength of the ultraviolet absorber, a hexaarylbiimidazole-based compound represented by the following general formula (1-1) and / or the following general formula (1-2) is preferred.

[0043] [ka]

[0044] In the above formula, R 11 ~R 13represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a halogen atom; m, n, and l each independently represent an integer of 0 to 5;

[0045] R 11 ~R 13 The number of carbon atoms in the alkyl group is not particularly limited as long as it is 1 to 4, but from the viewpoint of sensitivity, it is preferably 1 to 3, more preferably 1 to 2. The alkyl group may be either linear or cyclic. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, and an isopropyl group, and among these, a methyl group and an ethyl group are preferred.

[0046] R 11 ~R 13 The number of carbon atoms in the alkoxy group is not particularly limited as long as it is 1 to 4, but from the viewpoint of sensitivity, it is preferably 1 to 3, more preferably 1 to 2. The alkyl group portion of the alkoxy group may be either linear or cyclic. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, an isopropyloxy group, and a butoxy group, and among these, a methoxy group and an ethoxy group are preferred.

[0047] Also, R 11 ~R 13 Examples of the halogen atom include a chlorine atom, an iodine atom, a bromine atom, and a fluorine atom. Among these, from the viewpoint of ease of synthesis, a chlorine atom and a fluorine atom are preferred, and a chlorine atom is more preferred. Among these, R 11 ~R 13 are each independently preferably a halogen atom, more preferably a chlorine atom.

[0048] m, n, and l each independently represent an integer of 0 to 5, but from the viewpoint of ease of synthesis, it is preferable that at least one of m, n, and l is an integer of 1 or more, and it is more preferable that one of m, n, and l is 1 and the remaining two are 0.

[0049] Examples of the hexaarylbiimidazole compounds represented by general formula (1-1) and / or general formula (1-2) include 2,2'-bis(o-chlorophenyl)-4,5,4',5'-tetraphenylbiimidazole, 2,2'-bis(o-methylphenyl)-4,5,4',5'-tetraphenylbiimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(o,p-dichlorophenyl)biimidazole, 2,2'-bis(o,p-dichlorophenyl)-4,4',5,5'-tetra(o,p -dichlorophenyl)biimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(p-fluorophenyl)biimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(o,p-dibromophenyl)biimidazole, 2,2'-bis(o-bromophenyl)-4,4',5,5'-tetra(o,p-dichlorophenyl)biimidazole, and 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(p-chloronaphthyl)biimidazole. Among these, hexaphenylbiimidazole compounds are preferred, and it is more preferred that the o-position of the benzene ring bonded to the 2,2'-position on the imidazole ring is substituted with a methyl group, a methoxy group, or a halogen atom, and the benzene rings bonded to the 4,4',5,5'-positions on the imidazole ring are unsubstituted or substituted with a halogen atom or a methoxy group.

[0050] As the other photopolymerization initiator (a2), either a hexaarylbiimidazole compound represented by general formula (1-1) or a hexaarylbiimidazole compound represented by general formula (1-2) may be used, or both may be used in combination. When used in combination, the ratio thereof is not particularly limited.

[0051] Examples of the acylphosphine oxide photopolymerization initiator include 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0052] Examples of oxime ester photopolymerization initiators other than the photopolymerization initiator (a1) include 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime)ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime), compounds described in Japanese Patent Application Laid-Open No. 2004-534797, compounds described in Japanese Patent Application Laid-Open No. 2000-80068, and compounds described in International Publication No. Examples of compounds include compounds described in JP-A-12 / 45736, compounds described in JP-A-2006-36750, compounds described in JP-A-2008-179611, compounds described in WO-P2009 / 131189, compounds described in JP-A-2012-526185, compounds described in JP-A-2012-519191, compounds described in WO-P2006 / 18973, and compounds described in WO-P2008 / 78678.

[0053] Examples of the triazine-based photopolymerization initiator include 2,4,6-tris(monochloromethyl)-s-triazine, 2,4,6-tris(dichloromethyl)-s-triazine, 2,4,6-tris(trichloromethyl)-s-triazine, 2-methyl-4,6-bis(trichloromethyl)-s-triazine, 2-n-propyl-4,6-bis(trichloromethyl)-s-triazine, 2-(α,α,β-trichloroethyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-phenyl-4,6-bis(trichloromethyl)- s-Triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(3,4-epoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-chlorophenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-[1-(p-methoxyphenyl)-2,4-butadienyl]-4,6-bis(trichloromethyl)-s-triazine, 2-styryl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxystyryl)-4,6-bis (Trichloromethyl)-s-triazine, 2-(p-methoxy-m-hydroxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(pi-propyloxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-ethoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-ethoxyca (bornylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-phenylthio-4,6-bis(trichloromethyl)-s-triazine, 2-benzylthio-4,6-bis(trichloromethyl)-s-triazine, 2,4,6-tris(dibromomethyl)-s-triazine, 2,4,6-tris(tribromomethyl)-s-triazine, 2-methyl-4,6-bis(tribromomethyl)-s-triazine, 2-methoxy-4,6-bis(tribromomethyl)-s-triazine, 2-(4-methoxyphenyl)-4,Examples include halomethylated s-triazine derivatives such as 6-bis(trichloromethyl)-s-triazine, and among these, bis(trihalomethyl)-s-triazines are preferred from the viewpoint of sensitivity.

[0054] Examples of the acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, 1-hydroxy-1-(p-dodecylphenyl)ketone, 1-hydroxy-1-methylethyl-(p-isopropylphenyl)ketone, 1-trichloromethyl-(p-butylphenyl)ketone, α-hydroxy-2-methylphenylpropanone, 2-methyl-1[4-(methylthio)phenyl]propanone, and 2-methyl-1[4-(methylthio)phenyl]propanone. ]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 4-dimethylaminoethyl benzoate, 4-dimethylaminoisoamyl benzoate, 4-diethylaminoacetophenone, 4-dimethylaminopropiophenone, 2-ethylhexyl-1,4-dimethylaminobenzoate, 2,5-bis(4-diethylaminobenzal)cyclohexanone, and 4-(diethylamino)chalcone. Examples of the benzophenone-based photopolymerization initiator include benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2-carboxybenzophenone, 2-chlorobenzophenone, 4-bromobenzophenone, and Michler's ketone.

[0055] The content of the (A) photopolymerization initiator in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.5% by mass or more, more preferably 1% by mass or more, even more preferably 1.5% by mass or more, particularly preferably 2% by mass or more, and is preferably 10% by mass or less, more preferably 8% by mass or less, even more preferably 6% by mass or less, and particularly preferably 4% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and for example, 0.5 to 10% by mass is preferred, 1 to 8% by mass is more preferred, 1.5 to 6% by mass is more preferred, and 2 to 4% by mass is particularly preferred. By setting the content at or above the lower limit, a coating film is formed without film loss during development, and sufficient ink repellency tends to be achieved. Furthermore, by setting the content at or below the upper limit, a desired pattern shape tends to be more easily formed.

[0056] The content of the photopolymerization initiator (a1) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.5% by mass or more, more preferably 1% by mass or more, even more preferably 1.5% by mass or more, particularly preferably 2% by mass or more, and is preferably 10% by mass or less, more preferably 8% by mass or less, even more preferably 6% by mass or less, and particularly preferably 4% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and are, for example, preferably 0.5 to 10% by mass, more preferably 1 to 8% by mass, even more preferably 1.5 to 6% by mass, and particularly preferably 2 to 4% by mass. By setting the content at or above the lower limit, breakdown tends to be more easily suppressed and second partition walls tend to be more easily formed. Furthermore, by setting the content at or below the upper limit, it tends to be easier to control the level difference.

[0057] The content of the photopolymerization initiator (a1) in the photopolymerization initiator (A) is not particularly limited, but is preferably 20% by mass or more, more preferably 40% by mass or more, even more preferably 60% by mass or more, even more preferably 70% by mass or more, particularly preferably 80% by mass or more, and is usually 100% by mass or less. For example, it is preferably 20 to 100% by mass, more preferably 40 to 100% by mass, even more preferably 60 to 100% by mass, even more preferably 70 to 100% by mass, and particularly preferably 80 to 100% by mass. By ensuring that the content is equal to or greater than the lower limit, breakage is more easily suppressed and the second partition walls tend to be more easily formed.

[0058] The blending ratio of the (A) photopolymerization initiator to the (C) photopolymerizable compound in the photosensitive resin composition is preferably 1 part by mass or more, more preferably 2 parts by mass or more, and even more preferably 3 parts by mass or more, per 100 parts by mass of the (C) photopolymerizable compound. It is also preferably 200 parts by mass or less, more preferably 100 parts by mass or less, even more preferably 50 parts by mass or less, even more preferably 20 parts by mass or less, particularly preferably 10 parts by mass or less, and most preferably 8 parts by mass or less. The upper and lower limits can be arbitrarily combined. For example, 1 to 200 parts by mass is preferred, 1 to 100 parts by mass is more preferred, 2 to 50 parts by mass is more preferred, 2 to 20 parts by mass is even more preferred, 3 to 10 parts by mass is particularly preferred, and 3 to 8 parts by mass is most preferred. Setting the blending ratio at or above the lower limit tends to achieve appropriate sensitivity. Setting the blending ratio at or below the upper limit tends to facilitate the formation of a desired pattern shape.

[0059] A sensitizer may be used in combination with the photopolymerization initiator. The sensitizer improves sensitivity and at the same time reduces light transmittance into the interior of the photosensitive resin composition, which tends to increase the taper angle.

[0060] As the sensitizer, sensitizers commonly used in this field can be used. Sensitizers transfer the energy they absorb to the photopolymerization initiator or exchange electrons with the photopolymerization initiator, thereby efficiently promoting the radical polymerization reaction. Examples of such sensitizers include unsaturated ketones such as chalcone derivatives and dibenzalacetone; 1,2-diketone compounds such as benzil and camphorquinone; polymethine dyes such as benzoin compounds, fluorene compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, and oxonol derivatives; acridine compounds, azine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, and azulenium compounds. compounds, squarylium compounds, porphyrin compounds, tetraphenylporphyrin compounds, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxalylporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds, pyrylium compounds, thiopyrylium compounds, tetraphyrin compounds, annulene compounds, spiropyran compounds, spirooxazine compounds, thiospiropyran compounds, metal arene complexes, organic ruthenium complexes, and benzophenone compounds. These may be used alone or in combination of two or more.

[0061] Among these, thioxanthone compounds and benzophenone compounds are preferred from the viewpoint of improving sensitivity and increasing the taper angle.

[0062] Examples of thioxanthone compounds include thioxanthone, 2-methylthioxanthone, 4-methylthioxanthone, 2,4-dimethylthioxanthone, 2-ethylthioxanthone, 4-ethylthioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, 4-chlorothioxanthone, and 2,4-dichlorothioxanthone. Among these, 2,4-diethylthioxanthone is preferred from the viewpoints of improving sensitivity and increasing the taper angle.

[0063] Examples of benzophenone compounds include benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, and 4,4'-bis(ethylmethylamino)benzophenone. Among these, 4,4'-bis(diethylamino)benzophenone is preferred from the viewpoints of improving sensitivity and increasing the taper angle.

[0064] When the photosensitive resin composition contains a sensitizer, the content of the sensitizer in the photosensitive resin composition is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, even more preferably 0.8% by mass or more, particularly preferably 1% by mass or more, and most preferably 1.2% by mass or more, based on the total solid content of the photosensitive resin composition. It is also preferably 10% by mass or less, more preferably 7% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. The upper and lower limits can be arbitrarily combined. For example, 0.1 to 10% by mass is preferred, 0.3 to 10% by mass is more preferred, 0.5 to 7% by mass is even more preferred, 0.8 to 7% by mass is even more preferred, 1 to 5% by mass is particularly preferred, and 1.2 to 3% by mass is most preferred. Setting the content at or above the lower limit tends to improve sensitivity and increase the taper angle. Setting the content at or below the upper limit tends to facilitate the formation of a desired pattern.

[0065] [1-1-2] Component (B): Alkali-soluble resin The photosensitive resin composition of the present invention contains (B) an alkali-soluble resin. The alkali-soluble resin is not particularly limited as long as it is a resin that can be developed with an alkaline developer. Examples of the alkali-soluble resin include various resins containing a carboxy group and / or a hydroxyl group. Among these, a resin having a carboxy group is preferred from the viewpoints of obtaining partition walls with an appropriate taper angle, suppressing outflow of the liquid repellent agent due to thermal melting of the partition wall surface during post-baking, and maintaining ink repellency.

[0066] [Alkali-soluble resin (b) having an ethylenic double bond] In the photosensitive resin composition of the present invention, the alkali-soluble resin (B) preferably contains an alkali-soluble resin (b) having an ethylenic double bond (hereinafter, sometimes abbreviated as "alkali-soluble resin (b)"). By containing the alkali-soluble resin (b) having an ethylenic double bond, sensitivity increases and the ink repellency of the resulting partition walls tends to increase by suppressing outflow of the liquid repellent agent during development.

[0067] The specific structure of the alkali-soluble resin (b) having an ethylenic double bond is not particularly limited, but from the viewpoint of solubility in development, an epoxy(meth)acrylate resin (b1) and / or an acrylic copolymer resin (b2) is preferred, and from the viewpoint of reducing outgassing, an epoxy(meth)acrylate resin (b1) is more preferred. The epoxy (meth)acrylate resin (b1) will be described in detail below.

[0068] [Epoxy (meth)acrylate resin (b1)] The epoxy (meth)acrylate resin (b1) is a resin obtained by adding an acid or ester compound having an ethylenically unsaturated bond (ethylenic double bond) to an epoxy resin, and then adding a polybasic acid or its anhydride. For example, a resin obtained by ring-opening addition of a carboxy group of an acid having an ethylenically unsaturated bond to the epoxy group of the epoxy resin, thereby adding an ethylenically unsaturated bond to the epoxy resin via an ester bond (—COO—), and then adding one carboxy group of a polybasic acid anhydride to the resulting hydroxyl group. Another example is a resin obtained by simultaneously adding a polyhydric alcohol when adding the polybasic acid anhydride. Furthermore, a resin obtained by reacting a compound having a further reactive functional group with the carboxy group of the resin obtained by the above reaction is also included in the epoxy (meth)acrylate resin (b1). As described above, epoxy (meth)acrylate resins do not substantially have epoxy groups in their chemical structure, and are not limited to "(meth)acrylates." However, since epoxy compounds (epoxy resins) are used as raw materials and "(meth)acrylates" are a representative example, they are named as such according to convention.

[0069] Here, the term "epoxy resin" refers to raw material compounds before they are thermoset to form a resin, and the epoxy resin can be appropriately selected from known epoxy resins. Furthermore, the epoxy resin can be a compound obtained by reacting a phenolic compound with an epihalohydrin. The phenolic compound is preferably a compound having a divalent or more than divalent phenolic hydroxyl group, and may be a monomer or a polymer. Specific examples include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, biphenyl novolac epoxy resins, trisphenol epoxy resins, epoxidized products of polymers of phenol and dicyclopentane, dihydroxylfluorene type epoxy resins, dihydroxylalkyleneoxylfluorene type epoxy resins, diglycidyl ethers of 9,9-bis(4'-hydroxyphenyl)fluorene, and diglycidyl ethers of 1,1-bis(4'-hydroxyphenyl)adamantane, and those having an aromatic ring in the main chain can be preferably used.

[0070] Among these, from the viewpoint of cured film strength, bisphenol A type epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, epoxidized products of polymers of phenol and dicyclopentadiene, and epoxidized products of 9,9-bis(4'-hydroxyphenyl)fluorene are preferred, with bisphenol A type epoxy resins being more preferred.

[0071] Examples of the acid having an ethylenically unsaturated bond include (meth)acrylic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, pentaerythritol tri(meth)acrylate succinic anhydride adduct, pentaerythritol tri(meth)acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta(meth)acrylate succinic anhydride adduct, dipentaerythritol penta(meth)acrylate phthalic anhydride adduct, dipentaerythritol penta(meth)acrylate tetrahydrophthalic anhydride adduct, and a reaction product of (meth)acrylic acid and ε-caprolactone. Among these, (meth)acrylic acid is preferred from the viewpoint of sensitivity.

[0072] Examples of polybasic acids (anhydrides) include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, and anhydrides thereof. These may be used alone or in combination of two or more. Among these, from the viewpoint of reducing residues in pixel areas after development, succinic anhydride, maleic anhydride, and itaconic anhydride are preferred, and succinic anhydride is more preferred.

[0073] The use of polyhydric alcohols increases the molecular weight of the epoxy (meth)acrylate resin (b1), allowing for the introduction of branches into the molecule, which tends to balance the molecular weight and viscosity. Furthermore, the introduction rate of acid groups into the molecule can be increased, which tends to make it easier to balance sensitivity, adhesion, and other properties. Examples of polyhydric alcohols include trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol. These may be used alone or in combination of two or more.

[0074] The acid value of the epoxy (meth)acrylate resin (b1) is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, even more preferably 40 mgKOH / g or more, even more preferably 60 mgKOH / g or more, and is preferably 200 mgKOH / g or less, more preferably 180 mgKOH / g or less, even more preferably 150 mgKOH / g or less, even more preferably 120 mgKOH / g or less, and particularly preferably 100 mgKOH / g or less. The upper and lower limits can be arbitrarily combined, for example, 10 to 200 mgKOH / g is preferred, 10 to 180 mgKOH / g is more preferred, 20 to 150 mgKOH / g is more preferred, 40 to 120 mgKOH / g is even more preferred, and 60 to 100 mgKOH / g is particularly preferred. By setting the acid value at or above the lower limit, residues are likely to be reduced. Furthermore, by setting the content to the upper limit or less, outgassing during light emission from the device tends to be reduced.

[0075] The weight-average molecular weight (Mw) of the epoxy (meth)acrylate resin (b1) is not particularly limited, but is preferably 1,000 or more, more preferably 2,000 or more, even more preferably 3,000 or more, even more preferably 4,000 or more, particularly preferably 5,000 or more, particularly preferably 6,000 or more, and most preferably 7,000 or more, and is preferably 30,000 or less, more preferably 20,000 or less, even more preferably 15,000 or less, and particularly preferably 10,000 or less. The upper and lower limits can be arbitrarily combined, and are preferably 1,000 to 30,000, more preferably 2,000 to 30,000, even more preferably 3,000 to 20,000, even more preferably 4,000 to 20,000, particularly preferably 5,000 to 15,000, particularly preferably 6,000 to 15,000, and most preferably 7,000 to 10,000. By setting the Mw to be equal to or greater than the lower limit, outgassing during device light emission tends to be reduced. Furthermore, by making the content equal to or less than the upper limit, there is a tendency for residue to be reduced.

[0076] When the alkali-soluble resin (B) contains an epoxy (meth)acrylate resin (b1), the content of the epoxy (meth)acrylate resin (b1) contained in the alkali-soluble resin (B) is not particularly limited, but is preferably 30% by mass or more, more preferably 50% by mass or more, even more preferably 70% by mass or more, even more preferably 80% by mass or more, particularly preferably 90% by mass or more, and is usually 100% by mass or less. The upper and lower limits can be arbitrarily combined. For example, 30 to 100% by mass is preferred, 50 to 100% by mass is more preferred, 70 to 100% by mass is more preferred, 80 to 100% by mass is even more preferred, and 90 to 100% by mass is particularly preferred. Setting the content at or above the lower limit tends to reduce outgassing.

[0077] The epoxy (meth)acrylate resin (b1) can be synthesized by a conventionally known method. Specifically, a method can be used in which the epoxy resin is dissolved in an organic solvent, and the acid or ester compound having an ethylenically unsaturated bond is added in the presence of a catalyst and a thermal polymerization inhibitor to cause an addition reaction, and then a polybasic acid or an anhydride thereof is added to continue the reaction.

[0078] Examples of organic solvents include methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate. Examples of catalysts include tertiary amines such as triethylamine, benzyldimethylamine, and tribenzylamine; quaternary ammonium salts such as tetramethylammonium chloride, methyltriethylammonium chloride, tetraethylammonium chloride, tetrabutylammonium chloride, and trimethylbenzylammonium chloride; phosphorus compounds such as triphenylphosphine; and stibines such as triphenylstibine. Examples of thermal polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, and methylhydroquinone. These may be used alone or in combination of two or more.

[0079] The acid or ester compound having an ethylenically unsaturated bond can be used in an amount that is preferably 0.7 to 1.3 chemical equivalents, more preferably 0.9 to 1.1 chemical equivalents, per chemical equivalent of the epoxy group of the epoxy resin. The temperature during the addition reaction is preferably 60 to 150°C, more preferably 80 to 120°C. The polybasic acid (anhydride) can be used in an amount that is preferably 0.1 to 1.2 chemical equivalents, more preferably 0.2 to 1.1 chemical equivalents, per chemical equivalent of the hydroxyl group generated by the addition reaction.

[0080] From the viewpoint of outgassing during device light emission, the epoxy (meth)acrylate resin (b1) preferably contains at least one selected from the group consisting of an epoxy (meth)acrylate resin (b1-1) containing a partial structure represented by the following general formula (i) (hereinafter may be referred to as "epoxy (meth)acrylate resin (b1-1)"), an epoxy (meth)acrylate resin (b1-2) containing a partial structure represented by the following general formula (ii) (hereinafter may be referred to as "epoxy (meth)acrylate resin (b1-2)"), and an epoxy (meth)acrylate resin (b1-3) containing a partial structure represented by the following general formula (iii) (hereinafter may be referred to as "epoxy (meth)acrylate resin (b1-3)").

[0081] Among these, from the viewpoint of reducing outgassing during device light emission, the epoxy (meth)acrylate resin (b1) preferably contains an epoxy (meth)acrylate resin (b1-1) containing a partial structure represented by the following general formula (i), and more preferably an epoxy (meth)acrylate resin (b1-1) containing a partial structure represented by the following general formula (i): One of the reasons for this is presumed to be that the resin has a rigid main skeleton, making it less susceptible to thermal decomposition.

[0082] [ka]

[0083] In formula (i), R a represents a hydrogen atom or a methyl group, and Rb represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) may be further substituted with any substituent. * represents a bond.

[0084] (R b ) In the formula (i), R b represents a divalent hydrocarbon group which may have a substituent. Examples of the divalent hydrocarbon group include a divalent aliphatic group, a divalent aromatic ring group, and a group in which one or more divalent aliphatic groups are linked with one or more divalent aromatic ring groups.

[0085] The divalent aliphatic group may be linear, branched, or cyclic. Among these, linear groups are preferred from the viewpoint of development solubility, while cyclic groups are preferred from the viewpoint of reducing penetration of the developer into the exposed area. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 20 is preferred, 3 to 15 is more preferred, and 6 to 10 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. By setting the number at or below the upper limit, residue tends to be reduced.

[0086] Examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group, and an n-heptylene group. Among these, a methylene group is preferred from the viewpoint of reducing residues. Examples of the divalent branched aliphatic group include a structure in which the above-mentioned divalent linear aliphatic group has a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, or tert-butyl group as a side chain. The number of rings in the divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 5 is even more preferred. By setting the number at or above the lower limit, the film residual rate tends to be improved. On the other hand, by setting the number at or below the upper limit, the residue tends to be reduced. Examples of divalent cyclic aliphatic groups include groups in which two hydrogen atoms have been removed from a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, from the viewpoint of development adhesion, groups in which two hydrogen atoms have been removed from an adamantane ring are preferred.

[0087] Examples of the substituent that the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0088] Examples of the divalent aromatic ring group include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 20 is preferred, 5 to 15 is more preferred, and 6 to 10 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0089] The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring, each of which has two free valences. The aromatic heterocycle in the divalent aromatic heterocyclic group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, an indole ring, a carbazole ring, a pyrroloimidazole ring, a pyrrolopyrazole ring, a pyrrolopyrrole ring, a thienopyrrole ring, a thienothiophene ring, a furopyrrole ring, a furofuran ring, a thienofuran ring, a benzisoxazole ring, a benzisothiazole ring, a benzimidazole ring, a pyridine ring, a pyrazine ring, a pyridazine ring, a pyrimidine ring, a triazine ring, a quinoline ring, an isoquinoline ring, a cinnoline ring, a quinoxaline ring, a phenanthridine ring, a perimidine ring, a quinazoline ring, a quinazolinone ring, and an azulene ring, each of which has two free valences. Among these, from the viewpoint of photocurability, a benzene ring or a naphthalene ring having two free valences is preferred, and a benzene ring having two free valences is more preferred.

[0090] Examples of the substituent that the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, a propoxy group, and a glycidyl ether group. Among these, from the viewpoint of curability, unsubstituted groups are preferred.

[0091] Examples of the group in which one or more divalent aliphatic groups are linked to one or more divalent aromatic ring groups include groups in which one or more of the above-mentioned divalent aliphatic groups are linked to one or more of the above-mentioned divalent aromatic ring groups. The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced.

[0092] Examples of groups formed by linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include groups represented by the following formulae (iA) to (iF). Among these, the group represented by the following formula (iA) is preferred from the viewpoints of skeletal rigidity and film hydrophobicity. * in the chemical formula represents a bond.

[0093] [ka]

[0094] As described above, the benzene ring in formula (i) may be further substituted with any substituent. Examples of the substituent on the benzene ring in formula (i) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more, as long as it is chemically permissible. From the viewpoint of curability, it is preferred that the group is unsubstituted.

[0095] From the viewpoint of development solubility, the partial structure represented by the formula (i) is preferably a partial structure represented by the following formula (i-1).

[0096] [ka]

[0097] In formula (i-1), R a and R b has the same meaning as in formula (i). 1represents a divalent hydrocarbon group having 1 to 4 carbon atoms which may have a substituent. * represents a bond. The benzene ring in formula (i-1) may be further substituted with any substituent.

[0098] (R 1 ) In the general formula (i-1), R 1 represents a divalent hydrocarbon group having 1 to 4 carbon atoms which may have a substituent. Examples of the divalent hydrocarbon group include an alkylene group and an alkenylene group.

[0099] The alkylene group may be straight-chain or branched, but is preferably straight-chain from the viewpoint of development solubility. The number of carbon atoms is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 4 or less, more preferably 3 or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 4 is preferred, 1 to 3 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, the residual film ratio tends to be high. Furthermore, by setting the number at or below the upper limit, the amount of outgassing during device light emission tends to be low.

[0100] Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. From the viewpoint of reducing outgassing, a methylene group or an ethylene group is preferred, and an ethylene group is more preferred.

[0101] The alkenylene group may be linear or branched, but is preferably linear from the viewpoint of development solubility. The number of carbon atoms is not particularly limited, but is usually 2 or more, preferably 4 or less, and more preferably 3 or less. For example, 2 to 4 is preferred, and 2 to 3 is more preferred. By setting the number of carbon atoms at or above the lower limit, the residual film ratio tends to be high. Furthermore, by setting the number of carbon atoms at or below the upper limit, the amount of outgassing generated during device light emission tends to be low.

[0102] Specific examples of the alkenylene group include an ethenylene group, a propenylene group, and a butyrenylene group, and from the viewpoint of outgassing, an ethenylene group is preferred.

[0103] The substituent that the divalent hydrocarbon group having 1 to 4 carbon atoms may have is not particularly limited, but examples thereof include a halogen atom, an alkoxy group, a benzoyl group, and a hydroxyl group, and from the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0104] Among these, from the viewpoint of reducing outgassing, R 1 is preferably a divalent alkylene group having 1 to 4 carbon atoms, more preferably a methylene group or an ethylene group, and even more preferably an ethylene group.

[0105] The partial structure represented by the formula (i-1) contained in one molecule of the epoxy (meth)acrylate resin (b1-1) may be of one type or two or more types.

[0106] The number of partial structures represented by the formula (i) contained in one molecule of the epoxy (meth)acrylate resin (b1-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, and is preferably 10 or less, and even more preferably 8 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 8 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0107] The number of partial structures represented by the formula (i-1) contained in one molecule of the epoxy (meth)acrylate resin (b1-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, and is preferably 10 or less, and even more preferably 8 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 8 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0108] Specific examples of the epoxy (meth)acrylate resin (b1-1) are listed below.

[0109] [ka]

[0110] [ka]

[0111] [ka]

[0112] [ka]

[0113] [ka]

[0114] [ka]

[0115] [ka]

[0116] In another embodiment, the epoxy (meth)acrylate resin (b1) is preferably an epoxy (meth)acrylate resin (b1-2) containing a partial structure represented by the following formula (ii), from the viewpoint of development adhesion.

[0117] [ka]

[0118] In formula (ii), R c R each independently represents a hydrogen atom or a methyl group. drepresents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. * represents a bond.

[0119] (R d ) In the formula (ii), R d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. The cyclic hydrocarbon group may be an aliphatic cyclic group or an aromatic cyclic group.

[0120] The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 4 to 30 is more preferred, 6 to 20 is even more preferred, and 8 to 15 is particularly preferred. By setting the carbon atom number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the carbon atom number at or below the upper limit, residue tends to be reduced. Examples of the aliphatic ring in the aliphatic cyclic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, an adamantane ring is preferred from the viewpoint of development adhesion.

[0121] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 4 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 5 is more preferred, and 3 to 4 is even more preferred. By setting the number at or above the lower limit, residue tends to be reduced. Also, by setting the number at or below the upper limit, development adhesion tends to be improved. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, even more preferably 10 or more, and particularly preferably 12 or more. It is also preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 40 is more preferred, 8 to 30 is more preferred, even more preferably 10 to 20, and particularly preferably 12 to 15. By setting the number to be equal to or greater than the lower limit, residue tends to be reduced. Furthermore, by setting the number to be equal to or less than the upper limit, development adhesion tends to be improved. Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. Among these, a fluorene ring is preferred from the viewpoint of patterning properties.

[0122] The divalent hydrocarbon group in the divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is not particularly limited, and examples thereof include a divalent aliphatic group, a divalent aromatic ring group, and a group in which one or more divalent aliphatic groups are linked to one or more divalent aromatic ring groups.

[0123] The divalent aliphatic group may be linear, branched, or cyclic. Among these, linear groups are preferred from the viewpoint of development solubility, while cyclic groups are preferred from the viewpoint of reducing penetration of the developer into the exposed area. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, and preferably 25 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 25 is preferred, 3 to 20 is more preferred, and 6 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. By setting the number at or below the upper limit, residue tends to be reduced.

[0124] Examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group, and an n-heptylene group. Among these, a methylene group is preferred from the viewpoint of residue. Examples of the divalent branched aliphatic group include a structure in which the above-mentioned divalent linear aliphatic group has a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, or tert-butyl group as a side chain. The number of rings in the divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. Examples of the divalent cyclic aliphatic group include groups in which two hydrogen atoms have been removed from a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, or an adamantane ring. Among these, from the viewpoint of development adhesion, groups in which two hydrogen atoms have been removed from an adamantane ring are preferred.

[0125] Examples of the substituent that the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0126] Examples of the divalent aromatic ring group include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, and preferably 30 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 6 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0127] The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring, each of which has two free valences. The aromatic heterocycle in the divalent aromatic heterocyclic group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, an indole ring, a carbazole ring, a pyrroloimidazole ring, a pyrrolopyrazole ring, a pyrrolopyrrole ring, a thienopyrrole ring, a thienothiophene ring, a furopyrrole ring, a furofuran ring, a thienofuran ring, a benzisoxazole ring, a benzisothiazole ring, a benzimidazole ring, a pyridine ring, a pyrazine ring, a pyridazine ring, a pyrimidine ring, a triazine ring, a quinoline ring, an isoquinoline ring, a cinnoline ring, a quinoxaline ring, a phenanthridine ring, a perimidine ring, a quinazoline ring, a quinazolinone ring, and an azulene ring, each of which has two free valences. Among these, from the viewpoint of photocurability, a benzene ring or a naphthalene ring having two free valences is preferred, and a benzene ring having two free valences is more preferred.

[0128] Examples of the substituent that the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. Among these, from the viewpoint of curability, unsubstituted groups are preferred.

[0129] Examples of the group in which one or more divalent aliphatic groups are linked to one or more divalent aromatic ring groups include groups in which one or more of the above-mentioned divalent aliphatic groups are linked to one or more of the above-mentioned divalent aromatic ring groups. The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced.

[0130] Examples of the group formed by linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include groups represented by the above formulae (iA) to (iF). Among these, the group represented by the above formula (iC) is preferred from the viewpoint of reducing residues.

[0131] The bonding mode of the cyclic hydrocarbon group as a side chain to these divalent hydrocarbon groups is not particularly limited, but examples include a mode in which one hydrogen atom of an aliphatic group or aromatic ring group is substituted with the side chain, and a mode in which one carbon atom of an aliphatic group is included to form the cyclic hydrocarbon group as a side chain.

[0132] From the viewpoint of adhesion during development, the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-1):

[0133] [ka]

[0134] In formula (ii-1), R c has the same meaning as in formula (ii). α represents a monovalent cyclic hydrocarbon group which may have a substituent. n is an integer of 1 or more. The benzene ring in formula (ii-1) may be further substituted with an arbitrary substituent. * represents a bond.

[0135] (R α ) In the formula (ii-1), R α represents an optionally substituted monovalent cyclic hydrocarbon group. The cyclic hydrocarbon group may be an aliphatic cyclic group or an aromatic cyclic group.

[0136] The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 6 is preferred, 1 to 4 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 4 to 30 is more preferred, 6 to 20 is even more preferred, and 8 to 15 is particularly preferred. By setting the carbon atom number at or above the lower limit, development adhesion tends to be improved. By setting the carbon atom number at or below the upper limit, residue tends to be reduced. Examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, an adamantane ring is preferred from the viewpoint of development adhesion.

[0137] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 5 or more, more preferably 6 or more, and preferably 30 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 6 to 15 is even more preferred. By setting the number to be equal to or greater than the lower limit, development adhesion tends to be improved. By setting the number to be equal to or less than the upper limit, residue tends to be reduced. Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Among these, a fluorene ring is preferred from the viewpoint of development adhesion.

[0138] Examples of the substituent that the cyclic hydrocarbon group may have include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, amyl, and isoamyl; alkoxy groups having 1 to 5 carbon atoms, such as methoxy and ethoxy; hydroxyl; nitro; cyano; and carboxyl. From the viewpoint of ease of synthesis, unsubstituted cyclic hydrocarbon groups are preferred.

[0139] n represents an integer of 1 or more, preferably 2 or more, and preferably 3 or less. For example, 1 to 3 is preferred, and 1 to 2 is more preferred. By setting n to be equal to or greater than the lower limit, development adhesion tends to be improved. On the other hand, by setting n to be equal to or less than the upper limit, residue tends to be reduced.

[0140] Among these, R is the best from the viewpoint of strong film hardness and electrical properties. α is preferably a monovalent aliphatic cyclic group, more preferably an adamantyl group.

[0141] As described above, the benzene ring in formula (ii-1) may be further substituted with any substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, unsubstituted rings are preferred.

[0142] Specific examples of the partial structure represented by the formula (ii-1) are listed below.

[0143] [ka]

[0144] [ka]

[0145] [ka]

[0146] [ka]

[0147] [ka]

[0148] From the viewpoint of adhesion during development, the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-2):

[0149] [ka]

[0150] In formula (ii-2), R c has the same meaning as in formula (ii). βrepresents a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (ii-2) may be further substituted with any substituent. * represents a bond.

[0151] (R β ) In the formula (ii-2), R β represents a divalent cyclic hydrocarbon group which may have a substituent. The cyclic hydrocarbon group may be an aliphatic cyclic group or an aromatic cyclic group.

[0152] The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, and 2 to 5 is more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 35 or less, and even more preferably 30 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 35 is more preferred, and 8 to 30 is even more preferred. By setting the carbon atom number at or above the lower limit, development adhesion tends to be improved. By setting the carbon atom number at or below the upper limit, residue tends to be reduced. Examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, an adamantane ring is preferred from the viewpoint of development adhesion.

[0153] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, and more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and even more preferably 10 or more. It is also preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 30 is more preferred, 8 to 20 is more preferred, and 10 to 15 is particularly preferred. By setting it to be equal to or greater than the lower limit, development adhesion tends to be improved. By setting it to be equal to or less than the upper limit, residue tends to be reduced. Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Among these, a fluorene ring is preferred from the viewpoint of development adhesion.

[0154] Examples of the substituent that the cyclic hydrocarbon group may have include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, amyl, and isoamyl; alkoxy groups having 1 to 5 carbon atoms, such as methoxy and ethoxy; hydroxyl; nitro; cyano; and carboxy. Of these, unsubstituted groups are preferred from the viewpoint of ease of synthesis.

[0155] Among these, from the viewpoint of hardening property, R β is preferably a divalent aliphatic ring group, and more preferably a divalent adamantane ring group. In another embodiment, from the viewpoint of development adhesion, R βis preferably a divalent aromatic ring group, more preferably a divalent fluorene ring group.

[0156] As described above, the benzene ring in formula (ii-2) may be further substituted with any substituent. Examples of the substituent on the benzene ring in formula (ii-2) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, non-substitution is preferred.

[0157] Specific examples of the partial structure represented by the formula (ii-2) are listed below.

[0158] [ka]

[0159] [ka]

[0160] [ka]

[0161] [ka]

[0162] From the viewpoint of curability, the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-3):

[0163] [ka]

[0164] In formula (ii-3), R c and R d has the same meaning as in formula (ii). 1has the same meaning as in formula (i-1). * represents a bond.

[0165] The partial structure represented by the formula (ii-3) contained in one molecule of the epoxy (meth)acrylate resin (b1-2) may be of one type or two or more types.

[0166] The number of partial structures represented by the formula (ii) contained in one molecule of the epoxy (meth)acrylate resin (b1-2) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 20 is preferred, 1 to 15 is more preferred, and 3 to 10 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0167] In yet another embodiment, the epoxy (meth)acrylate resin (b1) is preferably an epoxy (meth)acrylate resin (b1-3) containing a partial structure represented by the following general formula (iii), from the viewpoint of reducing outgassing during device light emission:

[0168] [ka]

[0169] In formula (iii), R e represents a hydrogen atom or a methyl group, and γ represents a single bond, -CO-, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (iii) may be further substituted with an arbitrary substituent. * represents a bond.

[0170] (γ) In the formula (iii), γ represents a single bond, —CO—, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent.

[0171] The alkylene group may be linear or branched, but is preferably linear from the viewpoint of developer solubility, and branched from the viewpoint of developer adhesion. The number of carbon atoms is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 6 or less, more preferably 4 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 6 are preferred, and 2 to 4 are more preferred. By setting the number at or above the lower limit, developer adhesion tends to improve. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0172] Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a hexylene group, and a heptylene group. From the viewpoint of achieving both development adhesion and development solubility, a methylene group, an ethylene group, and a propylene group are preferred, and a dimethylmethylene group (2,2-propylene group) is more preferred.

[0173] Examples of the substituent that the alkylene group may have include an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of achieving both excellent developer adhesion and developer solubility, the alkylene group is preferably unsubstituted.

[0174] Examples of the divalent cyclic hydrocarbon group include a divalent aliphatic ring group and a divalent aromatic ring group.

[0175] The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, and 2 to 5 is more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 35 or less, and even more preferably 30 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 35 is more preferred, and 8 to 30 is even more preferred. By setting the carbon atom number at or above the lower limit, development adhesion tends to be improved. By setting the carbon atom number at or below the upper limit, residue tends to be reduced. Examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, an adamantane ring is preferred from the viewpoint of development adhesion.

[0176] The number of rings in the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to improve. Also, by setting the number at or below the upper limit, residue tends to be reduced. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and even more preferably 10 or more, and is preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 30 is more preferred, 8 to 20 is more preferred, and 10 to 15 is particularly preferred. By setting the number to be equal to or greater than the lower limit, development adhesion tends to be improved. Furthermore, by setting the number to be equal to or less than the upper limit, residue tends to be reduced. Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Among these, a fluorene ring is preferred from the viewpoint of development adhesion.

[0177] Examples of the substituent that the cyclic hydrocarbon group may have include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, amyl, and isoamyl; alkoxy groups having 1 to 5 carbon atoms, such as methoxy and ethoxy; hydroxyl; nitro; cyano; and carboxyl. From the viewpoint of ease of synthesis, unsubstituted cyclic hydrocarbon groups are preferred.

[0178] Among these, from the viewpoint of reducing residues, γ is preferably an alkylene group which may have a substituent, and more preferably dimethylmethylene.

[0179] As described above, the benzene ring in formula (iii) may be further substituted with any substituent. Examples of the substituent on the benzene ring in formula (iii) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, non-substitution is preferred.

[0180] From the viewpoint of development solubility, the partial structure represented by the formula (iii) is preferably a partial structure represented by the following formula (iii-1):

[0181] [ka]

[0182] In formula (iii-1), R e and γ have the same meaning as in formula (iii). 1 has the same meaning as in formula (i-1). * represents a bond. The benzene ring in formula (iii-1) may be further substituted with any substituent.

[0183] The number of partial structures represented by the formula (iii) contained in one molecule of the epoxy (meth)acrylate resin (b1-3) is not particularly limited, but is preferably 1 or more, more preferably 5 or more, even more preferably 10 or more, and is preferably 18 or less, even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 18 is preferred, 5 to 18 is more preferred, and 10 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0184] The number of partial structures represented by the formula (iii-1) contained in one molecule of the epoxy (meth)acrylate resin (b1-3) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, and is preferably 18 or less, even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 18 is preferred, 3 to 18 is more preferred, and 5 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0185] Specific examples of the epoxy (meth)acrylate resin (b1-3) are listed below.

[0186] [ka]

[0187] [ka]

[0188] [ka]

[0189] [Acrylic copolymer resin (b2)] From the viewpoint of curability, the acrylic copolymer resin (b2) preferably has an ethylenic double bond in the side chain.

[0190] Among the acrylic copolymer resins (b2), from the viewpoint of solubility in development, acrylic copolymer resins (b2-1) containing a partial structure represented by the following general formula (I) are preferred.

[0191] [ka]

[0192] In formula (I), R A and R B Each independently represents a hydrogen atom or a methyl group. * represents a bond.

[0193] From the viewpoint of developability, the partial structure represented by the formula (I) is preferably a partial structure represented by the following general formula (I-1).

[0194] [ka]

[0195] In formula (I-1), R A and R B has the same meaning as in formula (I). 1 has the same meaning as that in the above formula (i-1).

[0196] From the viewpoint of sensitivity, the partial structure represented by the formula (I) is preferably a partial structure represented by the following formula (I-2).

[0197] [ka]

[0198] In formula (I-2), R A and R B has the same meaning as that in formula (I) above.

[0199] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I), the content of the partial structure represented by the general formula (I) contained in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 5 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, even more preferably 50 mol% or more, particularly preferably 70 mol% or more, and most preferably 80 mol% or more. It is also preferably 99 mol% or less, more preferably 97 mol% or less, and even more preferably 95 mol% or less. The upper and lower limits can be arbitrarily combined. For example, 5 to 99 mol% is preferred, 20 to 99 mol% is more preferred, 30 to 97 mol% is more preferred, 50 to 97 mol% is even more preferred, 70 to 95 mol% is particularly preferred, and 80 to 95 mol% is most preferred. By setting the content at or above the lower limit, residue tends to be reduced. Furthermore, by setting the content at or below the upper limit, development adhesion tends to be improved.

[0200] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I-1), the content of the partial structure represented by the general formula (I-1) contained in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 1 mol% or more, more preferably 5 mol% or more, even more preferably 8 mol% or more, even more preferably 10 mol% or more, and is preferably 99 mol% or less, more preferably 60 mol% or less, even more preferably 40 mol% or less, even more preferably 30 mol% or less, and particularly preferably 20 mol% or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 99 mol% is preferred, 1 to 60 mol% is more preferred, 5 to 40 mol% is more preferred, even more preferably 8 to 30 mol%, and particularly preferably 10 to 20 mol%. Setting the content at or above the lower limit tends to increase sensitivity and reduce residue. Setting the content at or below the upper limit tends to improve development adhesion.

[0201] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I-2), the content of the partial structure represented by the general formula (I-2) contained in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, even more preferably 40 mol% or more, particularly preferably 50 mol% or more, and most preferably 70 mol% or more. It is also preferably 99 mol% or less, more preferably 95 mol% or less, even more preferably 90 mol% or less, and particularly preferably 85 mol% or less. The upper and lower limits can be arbitrarily combined. For example, 10 to 99 mol% is preferred, 20 to 99 mol% is more preferred, 30 to 95 mol% is more preferred, 40 to 95 mol% is even more preferred, 50 to 90 mol% is particularly preferred, and 70 to 85 mol% is most preferred. Setting the content at or above the lower limit tends to increase sensitivity. Setting the content at or below the upper limit tends to improve developability.

[0202] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I), other partial structures that may be contained therein are not particularly limited. However, from the viewpoint of development adhesion, it is preferable that the acrylic copolymer resin (b2-1) contains, for example, a partial structure represented by the following general formula (I'):

[0203] [ka]

[0204] In the above formula (I'), R D represents a hydrogen atom or a methyl group, and R E represents an alkyl group which may have a substituent, an aryl group (aromatic ring group) which may have a substituent, or an alkenyl group which may have a substituent.

[0205] (R E ) In the formula (I'), R E represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or an alkenyl group which may have a substituent. RE The alkyl group in the formula (I) may be a linear, branched, or cyclic alkyl group. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, and even more preferably 5 or more, and is preferably 20 or less, more preferably 18 or less, more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 20 is preferred, 1 to 18 is more preferred, 3 to 16 is more preferred, 3 to 14 is even more preferred, and 5 to 12 is particularly preferred. By setting the number of carbon atoms at or above the lower limit, film strength tends to increase and development adhesion tends to improve. Furthermore, by setting the number of carbon atoms at or below the upper limit, residue tends to be reduced.

[0206] Examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group. Among these, from the viewpoint of film strength, the dicyclopentanyl group and the dodecanyl group are preferred, and the dicyclopentanyl group is more preferred. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0207] R E Examples of the aryl group (aromatic ring group) in the formula (I) include a monovalent aromatic hydrocarbon ring group and a monovalent aromatic heterocyclic group. The number of carbon atoms is preferably 4 or more, more preferably 6 or more, and is preferably 24 or less, more preferably 22 or less, even more preferably 20 or less, and particularly preferably 18 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 24 is preferred, 4 to 22 is more preferred, 6 to 20 is even more preferred, and 6 to 18 is particularly preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced. The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a single ring or a fused ring, and examples thereof include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. The aromatic heterocyclic group in the aromatic heterocyclic group can be a single ring or a condensed ring, for example, can be enumerated as furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, pyrazole ring, imidazole ring, oxadiazole ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, cinnoline ring, quinoxaline ring, phenanthridine ring, perimidine ring, quinazoline ring, quinazolinone ring, azulene ring.Among these, from the viewpoint of curability, benzene ring group, naphthalene ring group are preferred, and benzene ring group is more preferred. Examples of the substituent that the aryl group may have include a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0208] R EThe alkenyl group in the formula (I) may be a linear, branched, or cyclic alkenyl group. The number of carbon atoms is preferably 2 or more, and is preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, it is preferably 2 to 22, more preferably 2 to 20, even more preferably 2 to 18, even more preferably 2 to 16, and particularly preferably 2 to 14. By setting it to be equal to or greater than the lower limit, development adhesion tends to be improved. On the other hand, by setting it to be equal to or less than the upper limit, residue tends to be reduced.

[0209] Examples of the alkenyl group include ethenyl, propenyl, butenyl, and cyclohexenyl groups. Among these, from the viewpoint of curability, ethenyl and propenyl groups are preferred, and ethenyl is more preferred. Examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0210] Among these, from the viewpoint of developability, R E As the alkyl group, an alkyl group or an alkenyl group is preferable, an alkyl group is more preferable, and a dicyclopentanyl group is even more preferable.

[0211] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I'), the content of the partial structure represented by the general formula (I') contained in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 0.5 mol% or more, more preferably 1 mol% or more, even more preferably 1.5 mol% or more, and particularly preferably 2 mol% or more. It is also preferably 90 mol% or less, more preferably 70 mol% or less, even more preferably 50 mol% or less, even more preferably 30 mol% or less, and particularly preferably 10 mol% or less. The upper and lower limits can be arbitrarily combined, and for example, 0.5 to 90 mol% is preferred, 0.5 to 70 mol% is more preferred, 1 to 50 mol% is more preferred, even more preferably 1.5 to 30 mol%, and particularly preferably 2 to 10 mol%. By setting the content at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the content at or below the upper limit, residue tends to be reduced.

[0212] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I) above, it preferably further contains a partial structure represented by the following general formula (I″) from the viewpoints of heat resistance and film strength.

[0213] [ka]

[0214] In the above formula (I″), R F represents a hydrogen atom or a methyl group, and R G represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, a hydroxyl group, a carboxy group, a halogen atom, an alkoxy group which may have a substituent, a thiol group, or an alkylsulfide group which may have a substituent, and t represents an integer of 0 to 5.

[0215] (R G ) In the formula (I″), R Grepresents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, a hydroxyl group, a carboxy group, a halogen atom, an alkoxy group which may have a substituent, a thiol group, or an alkyl sulfide group which may have a substituent. R G The alkyl group in the formula (I) may be a linear, branched, or cyclic alkyl group. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, and even more preferably 5 or more, and is preferably 20 or less, more preferably 18 or less, more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 20 is preferred, 1 to 18 is more preferred, 3 to 16 is more preferred, 3 to 14 is even more preferred, and 5 to 12 is particularly preferred. By setting the number of carbon atoms at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number of carbon atoms at or below the upper limit, residue tends to be reduced.

[0216] Examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group. Among these, from the viewpoint of development adhesion, the dicyclopentanyl group and the dodecanyl group are preferred, and the dicyclopentanyl group is more preferred. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0217] R GThe alkenyl group in the formula (I) may be a linear, branched, or cyclic alkenyl group. The number of carbon atoms is preferably 2 or more, and is preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, it is preferably 2 to 22, more preferably 2 to 20, even more preferably 2 to 18, even more preferably 2 to 16, and particularly preferably 2 to 14. By setting it to be equal to or greater than the lower limit, development adhesion tends to be improved. On the other hand, by setting it to be equal to or less than the upper limit, residue tends to be reduced.

[0218] Examples of the alkenyl group include ethenyl, propenyl, butenyl, and cyclohexenyl groups. Among these, from the viewpoint of curability, ethenyl and propenyl groups are preferred, and ethenyl is more preferred. Examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0219] R G Examples of the halogen atom in the compound include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these, a fluorine atom is preferred from the viewpoint of ink repellency.

[0220] R G The alkoxy group in the formula (I) may be a linear, branched, or cyclic alkoxy group. The number of carbon atoms is preferably 1 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. For example, it is preferably 1 to 20, more preferably 1 to 18, even more preferably 1 to 16, even more preferably 1 to 14, and particularly preferably 1 to 12. By setting it to be equal to or greater than the lower limit, development adhesion tends to be improved. On the other hand, by setting it to be equal to or less than the upper limit, residue tends to be reduced.

[0221] Examples of the substituent that the alkoxy group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0222] R G The alkyl sulfide group in the formula (I) includes linear, branched, and cyclic alkyl sulfide groups. The number of carbon atoms is preferably 1 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. For example, it is preferably 1 to 20, more preferably 1 to 18, even more preferably 1 to 16, even more preferably 1 to 14, and particularly preferably 1 to 12. By setting it to be equal to or greater than the lower limit, development adhesion tends to be improved. On the other hand, by setting it to be equal to or less than the upper limit, residue tends to be reduced.

[0223] Examples of alkyl sulfide groups include methyl sulfide, ethyl sulfide, propyl sulfide, and butyl sulfide groups. Among these, methyl sulfide and ethyl sulfide groups are preferred from the viewpoint of developability. Examples of the substituent that the alkyl group in the alkyl sulfide group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0224] Among these, from the viewpoint of developability, R G As the alkyl group, a hydroxy group or a carboxy group is preferred, and a carboxy group is more preferred.

[0225] (t) In the formula (I″), t represents an integer of 0 to 5. From the viewpoint of developability, t is preferably an integer of 0 to 2, more preferably 0 to 1, and even more preferably 0.

[0226] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I"), the content of the partial structure represented by the general formula (I") contained in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 1 mol% or more, more preferably 2 mol% or more, even more preferably 3 mol% or more, and particularly preferably 5 mol% or more. It is also preferably 90 mol% or less, more preferably 70 mol% or less, even more preferably 50 mol% or less, even more preferably 30 mol% or less, particularly preferably 20 mol% or less, and most preferably 10 mol% or less. The upper and lower limits can be arbitrarily combined, and for example, it is preferably 1 to 90 mol%, more preferably 1 to 70 mol%, more preferably 2 to 50 mol%, even more preferably 2 to 30 mol%, particularly preferably 3 to 20 mol%, and most preferably 5 to 10 mol%. By setting the content at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the content at or below the upper limit, residue tends to be reduced.

[0227] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I) above, it preferably further contains a partial structure represented by the following general formula (I''') from the viewpoint of developability.

[0228] [ka]

[0229] In the above formula (I'''), R H represents a hydrogen atom or a methyl group.

[0230] When the acrylic copolymer resin (b2-1) contains a partial structure represented by the general formula (I""), the content of the partial structure represented by the general formula (I"') contained in the acrylic copolymer resin (b2-1) is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 30 mol% or more, and is preferably 90 mol% or less, more preferably 80 mol% or less, even more preferably 70 mol% or less, and particularly preferably 50 mol% or less. The upper and lower limits can be arbitrarily combined, and for example, is preferably 5 to 90 mol%, more preferably 5 to 80 mol%, even more preferably 10 to 70 mol%, and particularly preferably 30 to 50 mol%. By setting the content at or above the lower limit, residue tends to be reduced. On the other hand, by setting the content at or below the upper limit, development adhesion tends to be improved.

[0231] The acid value of the acrylic copolymer resin (b2) is not particularly limited, but is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, even more preferably 20 mgKOH / g or more, and even more preferably 25 mgKOH / g or more. It is also preferably 100 mgKOH / g or less, more preferably 80 mgKOH / g or less, even more preferably 60 mgKOH / g or less, and even more preferably 40 mgKOH / g or less. The upper and lower limits can be arbitrarily combined, and for example, it is preferably 5 to 100 mgKOH / g, more preferably 10 to 80 mgKOH / g, even more preferably 20 to 60 mgKOH / g, and even more preferably 25 to 40 mgKOH / g. By setting the acid value at or above the lower limit, residue tends to be reduced. Furthermore, by setting the acid value at or below the upper limit, development adhesion tends to be improved.

[0232] The weight-average molecular weight (Mw) of the acrylic copolymer resin (b2) is not particularly limited, but is preferably 1,000 or more, more preferably 2,000 or more, even more preferably 3,000 or more, even more preferably 4,000 or more, and particularly preferably 5,000 or more. It is also preferably 30,000 or less, more preferably 20,000 or less, even more preferably 15,000 or less, and even more preferably 10,000 or less. It is particularly preferably 8,000 or less. The upper and lower limits can be arbitrarily combined. For example, 1,000 to 30,000 is preferred, 2,000 to 20,000 is more preferred, 3,000 to 15,000 is even more preferred, 4,000 to 10,000 is even more preferred, and 5,000 to 8,000 is particularly preferred. By setting the Mw at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the Mw at or below the upper limit, residue tends to be reduced.

[0233] When the alkali-soluble resin (B) contains an acrylic copolymer resin (b2), the content of the acrylic copolymer resin (b2) contained in the alkali-soluble resin (B) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more. It is usually preferably 100% by mass or less, more preferably 80% by mass or less, and even more preferably 50% by mass or less. The upper and lower limits can be arbitrarily combined, and for example, 5 to 100% by mass is preferred, more preferably 10 to 100% by mass, more preferably 15 to 80% by mass, and particularly preferably 20 to 50% by mass. Setting the content at or above the lower limit tends to improve developer solubility. Setting the content at or below the upper limit tends to increase the taper angle.

[0234] The alkali-soluble resin (B) may contain either the epoxy (meth)acrylate resin (b1) or the acrylic copolymer resin (b2) alone or both. Furthermore, the alkali-soluble resin (B) may contain an alkali-soluble resin other than the alkali-soluble resin (b).

[0235] The content of the alkali-soluble resin (B) in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and are, for example, preferably 5 to 90% by mass, more preferably 10 to 90% by mass, more preferably 20 to 70% by mass, even more preferably 30 to 60% by mass, and particularly preferably 40 to 50% by mass. Setting the content at or above the lower limit tends to improve developability. Setting the content at or below the upper limit tends to reduce outgassing during device light emission.

[0236] When the photosensitive resin composition of the present invention contains an epoxy (meth)acrylate resin (b1), the content of the epoxy (meth)acrylate resin (b1) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and is preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 70% by mass is even more preferred, 30 to 60% by mass is even more preferred, and 40 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, developability tends to be improved. Furthermore, by setting the content at or below the upper limit, outgassing during device light emission tends to be reduced.

[0237] Furthermore, when the photosensitive resin composition of the present invention contains an acrylic copolymer resin (b2), the content of the acrylic copolymer resin (b2) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and is preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 70% by mass is even more preferred, 30 to 60% by mass is even more preferred, and 40 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, developability tends to be improved. By setting the content at or below the upper limit, outgassing during device light emission tends to be reduced.

[0238] Furthermore, the total content of the (B) alkali-soluble resin and (C) photopolymerizable compound in the total solid content of the photosensitive resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, even more preferably 50% by mass or more, particularly preferably 70% by mass or more, even more particularly preferably 80% by mass or more, and most preferably 90% by mass or more, and is preferably 99% by mass or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less. The upper and lower limits can be arbitrarily combined. For example, 5 to 99% by mass is preferred, 10 to 99% by mass is more preferred, 30 to 99% by mass is even more preferred, 50 to 97% by mass is even more preferred, 70 to 97% by mass is particularly preferred, 80 to 95% by mass is particularly preferred, and 90 to 95% by mass is most preferred. Setting the content at or above the lower limit tends to improve curability. Setting the content at or below the upper limit tends to reduce outgassing during device light emission.

[0239] The blending ratio of the alkali-soluble resin (B) to the photopolymerizable compound (C) in the photosensitive resin composition is preferably 50 parts by mass or more, more preferably 60 parts by mass or more, even more preferably 70 parts by mass or more, and particularly preferably 80 parts by mass or more, per 100 parts by mass of the photopolymerizable compound (C). It is also preferably 400 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, and particularly preferably 120 parts by mass or less. The total upper and lower limits can be arbitrarily combined. For example, 50 to 400 parts by mass is preferred, 60 to 300 parts by mass is more preferred, 70 to 200 parts by mass is more preferred, and 80 to 120 parts by mass is particularly preferred. By setting the blending ratio at or above the lower limit, development adhesion tends to be improved. By setting the blending ratio at or below the upper limit, curing properties tend to be improved.

[0240] [1-1-3](C) component; Photopolymerizable compound The photosensitive resin composition of the present invention contains a photopolymerizable compound (C). It is believed that the inclusion of the photopolymerizable compound (C) results in high sensitivity. The photopolymerizable compound used herein means a compound having one or more ethylenically unsaturated bonds (ethylenic double bonds) in the molecule, but is preferably a compound having two or more ethylenically unsaturated bonds in the molecule from the viewpoints of polymerizability, crosslinkability, and the resulting ability to increase the difference in developer solubility between exposed and unexposed areas. Furthermore, it is more preferable that the unsaturated bond is derived from a (meth)acryloyloxy group, i.e., a (meth)acrylate compound.

[0241] In the photosensitive resin composition of the present invention, it is particularly desirable to use a polyfunctional ethylenic monomer having two or more ethylenically unsaturated bonds per molecule. The number of ethylenically unsaturated groups in the polyfunctional ethylenic monomer is not particularly limited, but is preferably two or more, more preferably three or more, even more preferably four or more, and particularly preferably five or more, and is preferably 15 or less, more preferably 10 or less, even more preferably eight or less, and particularly preferably seven or less. The upper and lower limits can be arbitrarily combined; for example, 2 to 15 is preferred, 3 to 10 is more preferred, 4 to 8 is even more preferred, and 5 to 7 is particularly preferred. Setting the number at or above the lower limit tends to improve polymerizability and result in high sensitivity. Setting the number at or below the upper limit tends to result in better developability. Examples of photopolymerizable compounds include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids; and esters obtained by esterification reactions between polyhydric hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds and unsaturated carboxylic acids and polybasic carboxylic acids.

[0242] Examples of esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters of aliphatic polyhydroxy compounds such as ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and glycerol acrylate; methacrylic acid esters in which the acrylate of these compounds is replaced with methacrylate; itaconic acid esters in which the acrylate of these compounds is replaced with itaconate; crotonate esters in which the acrylate of these compounds is replaced with crotonate; and maleic acid esters in which the acrylate of these compounds is replaced with maleate.

[0243] Examples of esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters and methacrylic acid esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethacrylate, and pyrogallol triacrylate. Esters obtained by the esterification reaction of polyvalent hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds with unsaturated carboxylic acids and polybasic carboxylic acids are not necessarily single compounds, but examples thereof include condensates of acrylic acid, phthalic acid, and ethylene glycol; condensates of acrylic acid, maleic acid, and diethylene glycol; condensates of methacrylic acid, terephthalic acid, and pentaerythritol; and condensates of acrylic acid, adipic acid, butanediol, and glycerin.

[0244] Other useful examples of the photopolymerizable compound that can be used in the photosensitive resin composition of the present invention include urethane (meth)acrylates such as those obtained by reacting a polyisocyanate compound with a hydroxyl group-containing (meth)acrylic acid ester or a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth)acrylic acid ester; epoxy acrylates such as the addition reaction product of a polyfunctional epoxy compound with a hydroxyl group-containing (meth)acrylic acid ester or (meth)acrylic acid; acrylamides such as ethylenebisacrylamide; allyl esters such as diallyl phthalate; and vinyl group-containing compounds such as divinyl phthalate. Examples of urethane (meth)acrylates include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, and UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U-10PA, U-33H, UA-53H, UA-32P, and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-306H, UA-510H, and UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.), UV-1700B, UV-7600B, UV-7605B, UV-7630B, and UV7640B (manufactured by Nippon Synthetic Chemical Industry Co., Ltd.).

[0245] Among these, from the viewpoint of an appropriate taper angle and sensitivity, it is preferable to use ester (meth)acrylates or urethane (meth)acrylates as the (C) photopolymerizable compound, and it is more preferable to use dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, 2-tris(meth)acryloyloxymethylethyl phthalate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, a dibasic acid anhydride adduct of dipentaerythritol penta(meth)acrylate, or a dibasic acid anhydride adduct of pentaerythritol tri(meth)acrylate. These may be used alone or in combination of two or more.

[0246] In the photosensitive resin composition of the present invention, the molecular weight of the photopolymerizable compound (C) is not particularly limited, but from the viewpoints of sensitivity, ink repellency, and taper angle, it is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, still more preferably 300 or more, particularly preferably 400 or more, and most preferably 500 or more, and is preferably 1000 or less, more preferably 700 or less. The upper and lower limits can be arbitrarily combined, and for example, 100 to 1000 is preferred, 150 to 1000 is more preferred, 200 to 1000 is even more preferred, 300 to 700 is even more preferred, 400 to 700 is particularly preferred, and 500 to 700 is most preferred. The number of carbon atoms in the (C) photopolymerizable compound is not particularly limited, but from the viewpoints of sensitivity, ink repellency, and taper angle, it is preferably 7 or more, more preferably 10 or more, even more preferably 15 or more, still more preferably 20 or more, and particularly preferably 25 or more, and is preferably 50 or less, more preferably 40 or less, even more preferably 35 or less, and particularly preferably 30 or less. The upper and lower limits can be arbitrarily combined; for example, 7 to 50 is preferred, 10 to 50 is more preferred, 15 to 40 is even more preferred, 20 to 35 is even more preferred, and 25 to 30 is particularly preferred. From the viewpoints of sensitivity, ink repellency, and taper angle, ester (meth)acrylates, epoxy (meth)acrylates, and urethane (meth)acrylates are preferred, and among these, trifunctional or higher ester (meth)acrylates such as pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate dipentaerythritol hexa(meth)acrylate, and dipentaerythritol penta(meth)acrylate, and adducts of acid anhydrides to trifunctional or higher ester (meth)acrylates such as 2,2,2-tris(meth)acryloyloxymethylethyl phthalate and dibasic acid anhydride adducts of dipentaerythritol penta(meth)acrylate are more preferred.

[0247] The content of the (C) photopolymerizable compound in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 80% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, even more preferably 55% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and for example, 5 to 80% by mass is preferred, 10 to 70% by mass is more preferred, 20 to 60% by mass is even more preferred, 30 to 55% by mass or more is even more preferred, and 40 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, appropriate internal curing properties tend to be achieved. By setting the content at or below the upper limit, developability tends to be improved.

[0248] [1-1-4] Component (D): Liquid repellent The liquid repellent agent (D) in the photosensitive resin composition of the present invention contains an acrylic resin (D1) containing a repeating unit represented by the following general formula (II) and a fluorine atom.

[0249] [ka]

[0250] (In formula (II), R 11 each independently represents a hydrogen atom or a methyl group, R 12 represents an alkyl group having 2 to 6 carbon atoms which may have a substituent, and may be interrupted by one or more of -O-, -C(=O)-, -S-, and -NH-. * represents a bonding site.)

[0251] R 12 The number of carbon atoms in the alkyl group is usually 2 or more, preferably 4 or more, and usually 6 or less, preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 2 to 6 is preferred, and 4 to 5 is more preferred. By setting the number at or above the lower limit, synthesis becomes easier. On the other hand, by setting the number at or below the upper limit, the degree of freedom of the ethylenically unsaturated bond increases, which tends to improve curability and liquid repellency. Also, R 12 The alkyl group may be interrupted by one or more of -O-, -C(=O)-, -S-, and -NH-. In another embodiment, it may be interrupted by -O-, -C(=O)-, or -NH-, and in yet another embodiment, it may be interrupted by -OC(=O)-NH-.

[0252] R 12 When has a substituent, examples of the substituent include a hydroxyl group and an alkoxy group having 1 to 3 carbon atoms. It is preferably unsubstituted or substituted with a hydroxyl group, and more preferably unsubstituted.

[0253] R 12 As the group, groups represented by -(C2H4)2-NHCOO-(C2H4)2- and -(CH)2-CHOH-(CH2)- are preferred in terms of liquid repellency, and a group represented by -(C2H4)2-NHCOO-(C2H4)2- is more preferred.

[0254] Since the inclusion of the acrylic resin (D1) can impart ink repellency (liquid repellency) to the surface of the resulting partition wall, it is believed that when an organic electroluminescent device is produced by an inkjet method, adhesion of ink to the partition wall can be prevented and mixing of inks injected between adjacent regions can be prevented.

[0255] By using a liquid repellent agent having an ethylenically unsaturated group such as that represented by general formula (II), it is possible to accelerate the crosslinking reaction on the surface of the formed coating film when the film is exposed to light, and it is thought that the liquid repellent agent is less likely to flow out during development treatment, and as a result, the resulting partition walls can exhibit high ink repellency.

[0256] The resin containing fluorine atoms tends to be oriented on the surface of the partition wall, thereby preventing ink bleeding and color mixing. More specifically, the group having a fluorine atom repels ink, and tends to prevent ink bleeding and color mixing caused by ink passing over the partition wall and entering an adjacent region.

[0257] The acrylic resin (D1) preferably has either or both of a fluoroalkyl group and a fluoroalkylene group, and more preferably either or both of a perfluoroalkyl group and a perfluoroalkylene ether chain. By having either or both of a fluoroalkyl group and a fluoroalkylene group, or either or both of a perfluoroalkyl group and a perfluoroalkylene ether chain, the fluorine atom-containing resin tends to be more easily oriented on the surface of the partition wall, exhibiting higher ink repellency and further preventing ink bleeding and color mixing.

[0258] Examples of perfluoroalkyl groups include perfluorobutyl groups, perfluorohexyl groups, and perfluorooctyl groups. Examples of perfluoroalkylene ether chains include -CF2-O-, -(CF2)2-O-, -(CF2)3-O-, -CF2-C(CF3)O-, -C(CF3)-CF2-O-, and divalent groups having these repeating units.

[0259] The acrylic resin (D1) may contain structural units other than the repeating unit represented by general formula (II) and the structural unit containing a fluorine atom, such as a structural unit containing an epoxy group, a structural unit containing a carboxy group, or a structural unit having an alkylene oxide chain.

[0260] As commercially available products of the acrylic resin (D1), fluorine-containing organic compounds available under the trade names "Megafac (registered trademark; the same applies hereinafter) RS-72-K" and "Megafac RS-90" manufactured by DIC Corporation can be used.

[0261] The fluorine atom content in the acrylic resin (D1) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and even more preferably 25% by mass or more, in the acrylic resin (D1). Also, it is preferably 50% by mass or less, and more preferably 35% by mass or less. The upper and lower limits can be arbitrarily combined, and for example, it is preferably 1 to 50% by mass, more preferably 10 to 50% by mass, even more preferably 20 to 35% by mass, and even more preferably 25 to 35% by mass. By ensuring that the content is equal to or greater than the lower limit, a high contact angle is easily ensured, and by ensuring that the content is equal to or less than the upper limit, leakage into pixel areas tends to be suppressed.

[0262] The molecular weight of the acrylic resin (D1) is not particularly limited, and may be a low-molecular-weight compound or a high-molecular-weight compound. High-molecular-weight compounds are preferred because they suppress fluidity due to post-baking and can prevent leakage from the partition walls. From this perspective, the weight-average molecular weight of the acrylic resin (D1) is preferably 100 or more, more preferably 500 or more, and is preferably 100,000 or less, more preferably 10,000 or less. The upper and lower limits can be arbitrarily combined, and are, for example, preferably 100 to 100,000, more preferably 500 to 10,000.

[0263] The acrylic resin (D1) may be used alone or in combination of two or more kinds.

[0264] In the present invention, a liquid repellent other than the acrylic resin (D1) may be used in combination as the liquid repellent (D).

[0265] The content of the (D) liquid repellent agent in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, and particularly preferably 0.2% by mass or more, based on the total solid content of the photosensitive resin composition. It is also preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less. The upper and lower limits can be arbitrarily combined. For example, it is preferably 0.01 to 5% by mass, more preferably 0.05 to 5% by mass, even more preferably 0.1 to 3% by mass, and particularly preferably 0.2 to 1% by mass. By setting the content at or above the lower limit, ink repellency tends to be improved. Furthermore, by setting the content at or below the upper limit, it tends to be easier to obtain a uniform coating film when applying ink to pixel portions after partition wall formation.

[0266] The content of the acrylic resin (D1) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.2% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and for example, are preferably 0.01 to 5% by mass, more preferably 0.1 to 3% by mass, and even more preferably 0.2 to 1% by mass. By setting the content at or above the lower limit, ink repellency tends to be improved. Furthermore, by setting the content at or below the upper limit, a uniform coating film tends to be obtained more easily when applying ink to pixel portions after partition wall formation.

[0267] [1-1-5] (E) Chain transfer agent The photosensitive resin composition of the present invention may contain (E) a chain transfer agent. By including a chain transfer agent, radical deactivation due to oxygen inhibition or the like near the surface is improved, thereby improving surface curability and tending to increase the taper angle. In addition, by increasing surface curability, outflow of the liquid repellent agent can be suppressed, and the liquid repellent agent is easily fixed near the surface of the partition wall, tending to increase the contact angle. Examples of chain transfer agents include mercapto group-containing compounds and carbon tetrachloride, with mercapto group-containing compounds being more preferred because they tend to have a high chain transfer effect. Mercapto group-containing compounds have a low SH bond energy, which makes bond cleavage more likely to occur and chain transfer reactions more likely to occur, which tends to improve surface curability.

[0268] Among the chain transfer agents, mercapto group-containing compounds having an aromatic ring and aliphatic mercapto group-containing compounds are preferred from the viewpoint of taper angle and surface curability.

[0269] As the mercapto group-containing compound having an aromatic ring, a compound represented by the following general formula (E-1) is preferably used from the viewpoint of the taper angle.

[0270] [ka]

[0271] In formula (E-1), Z represents -O-, -S-, or -NH-; R 61 , R 62 , R 63 and R 64 each independently represents a hydrogen atom or a monovalent substituent. Of these, from the viewpoint of the taper angle, Z is preferably -S- or -NH-, and more preferably -NH-. Also, from the viewpoint of taper angle, R 61 , R 62 , R 63 and R 64 are each independently preferably a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, more preferably a hydrogen atom.

[0272] Examples of mercapto group-containing compounds having an aromatic ring include 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 3-mercapto-1,2,4-triazole, 2-mercapto-4(3H)-quinazoline, β-mercaptonaphthalene, and 1,4-dimethylmercaptobenzene, and from the viewpoint of the taper angle, 2-mercaptobenzothiazole and 2-mercaptobenzimidazole are preferred.

[0273] As the aliphatic mercapto group-containing compound, from the viewpoint of surface curability, hexanedithiol, decanedithiol, or a compound represented by the following general formula (E-2) is preferably used.

[0274] [ka]

[0275] In formula (E-2), m represents an integer of 0 to 4, and n represents an integer of 2 to 4. 71 and R 72 each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. X represents an n-valent group.

[0276] In the general formula (E-2), m is preferably 1 or 2 from the viewpoint of ease of synthesis. Furthermore, n is preferably 3 or 4 from the viewpoint of surface curability. R 71 and R 72 From the viewpoint of surface curability, the alkyl group in R is preferably one having 1 to 3 carbon atoms. 71 and R 72 At least one of, for example, R 72 is preferably a hydrogen atom, in which case, R 71 is preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.

[0277] When n is 2, from the viewpoint of surface curability, X is preferably an alkylene group having 1 to 6 carbon atoms which may have an ether bond or a branched portion. Among these, from the viewpoints of surface curability and ease of synthesis, an alkylene group having 1 to 6 carbon atoms is more preferred, and an alkylene group having 4 carbon atoms is even more preferred.

[0278] When n is 3, from the viewpoints of surface curability and ease of synthesis, X is preferably a structure represented by the following general formula (E-2-1) or (E-2-2).

[0279] [ka]

[0280] In formula (E-2-1), R 73 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a methylol group. 73 Among these, an ethyl group is preferred from the viewpoint of the taper angle.

[0281] [ka]

[0282] In formula (E-2-2), R 74 represents an alkylene group having 1 to 4 carbon atoms. 74Among these, an ethylene group is preferred from the viewpoint of the taper angle.

[0283] When n is 4, X is preferably a structure represented by the following general formula (E-2-3).

[0284] [ka]

[0285] Examples of aliphatic mercapto group-containing compounds include butanediol bis(3-mercaptopropionate), butanediol bisthioglycolate, ethylene glycol bis(3-mercaptopropionate), ethylene glycol bisthioglycolate, trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tristhioglycolate, trishydroxyethyl tristhiopropionate, pentaerythritol tetrakis(3-mercaptopropionate), ... Examples of suitable mercaptobutyrates include erythritol tris(3-mercaptopropionate), butanediol bis(3-mercaptobutyrate), ethylene glycol bis(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), and 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione.

[0286] Among these, trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), and 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione are preferred, and pentaerythritol tetrakis(3-mercaptopropionate) and pentaerythritol tetrakis(3-mercaptobutyrate) are more preferred.

[0287] These may be used alone or in combination of two or more.

[0288] Among these, from the viewpoint of enhancing ink repellency, it is preferable to use a photopolymerization initiator system in which one or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole are combined with a photopolymerization initiator. For example, 2-mercaptobenzothiazole may be used, 2-mercaptobenzimidazole may be used, or 2-mercaptobenzothiazole and 2-mercaptobenzimidazole may be used in combination. In another embodiment, from the viewpoint of surface curability, it is preferable to use one or more selected from the group consisting of pentaerythritol tetrakis(3-mercaptopropionate) and pentaerythritol tetrakis(3-mercaptobutyrate).

[0289] When the photosensitive resin composition of the present invention contains a chain transfer agent (E), its content is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.025% by mass or more, even more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, and particularly preferably 1% by mass or more, based on the total solid content of the photosensitive resin composition. It is also preferably 5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less. The upper and lower limits can be arbitrarily combined. For example, 0.01 to 5% by mass is preferred, 0.025 to 5% by mass is more preferred, 0.05 to 4% by mass is even more preferred, 0.1 to 4% by mass is even more preferred, and 1 to 3% by mass is particularly preferred. By setting the content at or above the lower limit, the taper angle tends to be higher, the surface curability tends to be higher, and the ink repellency tends to be higher. By setting the content at or below the upper limit, it tends to be easier to form a desired pattern.

[0290] When a mercapto group-containing compound having an aromatic ring and an aliphatic mercapto group-containing compound are used in combination as a chain transfer agent, the content of the aliphatic mercapto group-containing compound is preferably 10 parts by mass or more, more preferably 50 parts by mass or more, even more preferably 80 parts by mass or more, and preferably 400 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, and particularly preferably 150 parts by mass or less, per 100 parts by mass of the mercapto group-containing compound having an aromatic ring. The upper and lower limits can be arbitrarily combined, and for example, 10 to 400 parts by mass is preferred, 10 to 300 parts by mass is more preferred, 50 to 200 parts by mass is even more preferred, and 80 to 150 parts by mass is particularly preferred. Setting the content at or above the lower limit tends to increase ink repellency. Setting the content at or below the upper limit tends to increase sensitivity.

[0291] The compounding ratio of the (E) chain transfer agent to the (D) photopolymerization initiator in the photosensitive resin composition is preferably 10 parts by mass or more, more preferably 25 parts by mass or more, even more preferably 50 parts by mass or more, and particularly preferably 80 parts by mass or more, per 100 parts by mass of the (D) photopolymerization initiator. It is also preferably 500 parts by mass or less, more preferably 400 parts by mass or less, even more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, and particularly preferably 150 parts by mass or less. The upper and lower limits can be arbitrarily combined. For example, 10 to 500 parts by mass is preferred, 10 to 400 parts by mass is more preferred, 25 to 300 parts by mass is more preferred, 50 to 200 parts by mass is even more preferred, and 80 to 150 parts by mass is particularly preferred. Setting the content at or above the lower limit tends to result in a high taper angle, high surface curability, and high ink repellency. Setting the content at or below the upper limit tends to facilitate the formation of a desired pattern.

[0292] [1-1-6] UV absorbers The photosensitive resin composition of the present invention may contain an ultraviolet absorber. The ultraviolet absorber is added for the purpose of controlling the photocuring distribution by absorbing specific wavelengths of the light source used for exposure. The inclusion of an ultraviolet absorber tends to provide effects such as improving the taper angle shape after development and reducing residues remaining in unexposed areas after development. As the ultraviolet absorber, for example, a compound having an absorption maximum in the wavelength range of 250 nm to 400 nm can be used from the viewpoint of inhibiting light absorption by the photopolymerization initiator. Examples of ultraviolet absorbers include benzotriazole compounds, triazine compounds, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and its derivatives, dinaphthalene compounds, phenanthroline compounds, and dyes. These ultraviolet absorbents may be used alone or in combination of two or more.

[0293] Among these, from the viewpoint of increasing the taper angle, benzotriazole compounds and / or hydroxyphenyltriazine compounds are preferred, and benzotriazole compounds are particularly preferred.

[0294] Among the benzotriazole compounds, the benzotriazole compounds represented by the following general formula (Z1) are preferred in terms of the tapered shape.

[0295] [ka]

[0296] In the above formula (Z1), R 1e and R 2e R each independently represents a hydrogen atom, an alkyl group which may have a substituent, a group represented by the following general formula (Z2), or a group represented by the following general formula (Z3). 3e represents a hydrogen atom or a halogen atom.

[0297] [ka]

[0298] In the above formula (Z2), R 4e represents an alkylene group which may have a substituent, and R 5e represents an alkyl group which may have a substituent.

[0299] [ka]

[0300] In the above formula (Z3), R 6e represents an alkylene group which may have a substituent, and R 7e represents a hydrogen atom or a methyl group.

[0301] (R 1e and R 2e ) In the formula (Z1), R 1e and R2e each independently represents a hydrogen atom, an alkyl group which may have a substituent, a group represented by general formula (Z2), or a group represented by general formula (Z3). The alkyl group may be a linear, branched, or cyclic alkyl group. The number of carbon atoms is preferably 1 or more, more preferably 2 or more, and even more preferably 4 or more, and is preferably 10 or less, more preferably 6 or less, and even more preferably 4 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 6 is more preferred, and 4 to 6 is even more preferred.

[0302] Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, and a tert-butyl group. Of these, a tert-butyl group is preferred. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group.

[0303] (R 3e ) In the formula (Z1), R 3e represents a hydrogen atom or a halogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these, from the viewpoint of synthesis, R 3e is preferably a hydrogen atom.

[0304] (R 4e ) In the formula (Z2), R 4e represents an alkylene group which may have a substituent. The alkylene group may be a linear, branched, or cyclic alkylene group. The number of carbon atoms is usually 1 or more, preferably 2 or more, and is preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 6 is preferred, 1 to 4 is more preferred, and 2 to 3 is even more preferred.

[0305] Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. Of these, an ethylene group is preferred. Examples of the substituent that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group.

[0306] Among these, R 4e is preferably an ethylene group.

[0307] (R 5e ) In the formula (Z2), it represents an alkyl group which may have a substituent. The alkyl group may be a linear, branched, or cyclic alkyl group. The number of carbon atoms is preferably 4 or more, more preferably 5 or more, and even more preferably 7 or more, and is preferably 15 or less, more preferably 10 or less, and even more preferably 9 or less. The upper and lower limits can be arbitrarily combined; for example, 5 to 15 is preferred, 5 to 10 is more preferred, and 7 to 9 is even more preferred.

[0308] Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a hepsyl group, an octyl group, and a nonyl group. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. Among these, from the viewpoint of tapered shape, R 5e is preferably a heptyl group, an octyl group, or a nonyl group.

[0309] (R 6e ) In the formula (Z3), R 6e represents an alkylene group which may have a substituent. The alkylene group may be a linear, branched, or cyclic alkylene group. The number of carbon atoms is usually 1 or more, preferably 2 or more, and is preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 6 is preferred, 1 to 4 is more preferred, and 2 to 3 is even more preferred.

[0310] Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. Of these, an ethylene group is preferred. Examples of the substituent that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group.

[0311] Among these, from the viewpoint of tapered shape, R 1e is a tert-butyl group, R 2e is a group represented by the formula (Z2) (where R 4e is an ethylene group, and R 5e is an alkyl group having 7 to 9 carbon atoms, R 3e is a hydrogen atom, or R 1e is a hydrogen atom, R 2e is a group represented by the formula (Z3) (where R 6e is an ethylene group, and R7e is a methyl group), R 3e is a hydrogen atom, and R 1e is a tert-butyl group, R 2e is a group represented by the formula (Z2) (where R 4e is an ethylene group, and R 5e is an alkyl group having 7 to 9 carbon atoms, R 3e is a hydrogen atom is more preferred.

[0312] Examples of benzotriazole compounds include 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, a mixture of octyl-3[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(3,5-di-t-amyl-2-hydroxyphenyl)- 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]heptyl propionate, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]octyl propionate, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]nonyl propionate, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, and 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol. Among these, from the viewpoints of taper angle and exposure sensitivity, heptyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, octyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, nonyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, and mixtures thereof are preferred.

[0313] Commercially available benzotriazole compounds include, for example, Sumisorb (registered trademark, the same applies hereinafter) 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical Co., Ltd.), JF77, JF78, JF79, JF80, JF83 (manufactured by Johoku Chemical Industry Co., Ltd.), TINUVIN (registered trademark, the same applies hereinafter) PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 384-2, TINUVIN 326, TINUVIN 900, TINUVIN 928, TINUVIN 1130 (manufactured by BASF), EVERSORB 70, EVERSORB 71, EVERSORB 72, EVE Examples of suitable acrylic resins include RSORB73, EVERSORB74, EVERSORB75, EVERSORB76, EVERSORB234, EVERSORB77, EVERSORB78, EVERSORB80, and EVERSORB81 (manufactured by Taiwan Yongguang Chemical Industry Co., Ltd.), Tomisorb (registered trademark, the same applies hereinafter) 100, and Tomisorb 600 (manufactured by API Corporation), SEESORB (registered trademark, the same applies hereinafter) 701, SEESORB702, SEESORB703, SEESORB704, SEESORB706, SEESORB707, and SEESORB709 (manufactured by Shipro Chemical Co., Ltd.), and RUVA-93 (manufactured by Otsuka Chemical Co., Ltd.).

[0314] Examples of triazine compounds include 2-[4,6-di(2,4-xylyl)-1,3,5-triazin-2-yl]-5-octyloxyphenol, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, a reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and (2-ethylhexyl)glycidic acid ester, and 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine. Among these, hydroxyphenyltriazine compounds are preferred from the viewpoints of taper angle and exposure sensitivity. Examples of commercially available triazine compounds include TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, and TINUVIN 479 (manufactured by BASF).

[0315] Other examples of ultraviolet absorbers include benzophenone compounds such as Sumisorb 130 (manufactured by Sumitomo Chemical Co., Ltd.), EVERSORB 10, EVERSORB 11, EVERSORB 12 (manufactured by Taiwan Yongguang Chemical Industry Co., Ltd.), Tomisorb 800 (manufactured by API Corporation), SEESORB 100, SEESORB 101, SEESORB 101S, SEESORB 102, SEESORB 103, SEESORB 105, SEESORB 106, SEESORB 107, and SEESORB 151 (manufactured by Shipro Chemical Co., Ltd.); benzoate compounds such as Sumisorb 400 (manufactured by Sumitomo Chemical Co., Ltd.) and phenyl salicylate; cinnamic acid derivatives such as 2-ethylhexyl cinnamate, 2-ethylhexyl p-methoxycinnamate, isopropyl methoxycinnamate, and isoamyl methoxycinnamate; and α-naphthol. , β-naphthol, α-naphthol methyl ether, α-naphthol ethyl ether, naphthalene derivatives such as 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene; anthracene and its derivatives such as anthracene and 9,10-dihydroxyanthracene; and dyes such as azo dyes, benzophenone dyes, aminoketone dyes, quinoline dyes, anthraquinone dyes, diphenylcyanoacrylate dyes, triazine dyes, and p-aminobenzoic acid dyes. Among these, from the viewpoint of exposure sensitivity, cinnamic acid derivatives and naphthalene derivatives are preferably used, and cinnamic acid derivatives are particularly preferred.

[0316] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the content of the ultraviolet absorber in the photosensitive resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, based on the total solid content of the photosensitive resin composition, and is preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. The upper and lower limits can be arbitrarily combined, and for example, 0.01 to 15% by mass is preferred, 0.05 to 15% by mass is more preferred, 0.1 to 10% by mass is even more preferred, 0.5 to 5% by mass is even more preferred, and 1 to 3% by mass is particularly preferred. By setting the content at or above the lower limit, the taper angle tends to be larger. On the other hand, by setting the content at or below the upper limit, the sensitivity tends to be higher.

[0317] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the blending ratio relative to the (D) photopolymerization initiator is preferably 1 part by mass or more, more preferably 10 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, per 100 parts by mass of the (D) photopolymerization initiator, and is preferably 500 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, particularly preferably 150 parts by mass or less. The upper and lower limits can be arbitrarily combined; for example, 10 to 500 parts by mass is preferred, 30 to 300 parts by mass is more preferred, 50 to 200 parts by mass is even more preferred, and 80 to 150 parts by mass is particularly preferred. By setting the blending ratio at or above the lower limit, the taper angle tends to be larger. On the other hand, by setting the blending ratio at or below the upper limit, the sensitivity tends to be higher.

[0318] [1-1-7] Polymerization inhibitor The photosensitive resin composition of the present invention may contain a polymerization inhibitor. It is believed that the inclusion of a polymerization inhibitor inhibits radical polymerization, thereby making it possible to increase the taper angle of the resulting partition walls. Examples of the polymerization inhibitor include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, and 2,6-di-tert-butyl-4-cresol (BHT). Among these, from the viewpoint of polymerization inhibition ability, methylhydroquinone and methoxyphenol are preferred, and methylhydroquinone is more preferred.

[0319] The polymerization inhibitor may be used alone or in combination of two or more. Usually, when the alkali-soluble resin (B) is produced, a polymerization inhibitor may be contained in the resin, and this may be used as the polymerization inhibitor contained in the photosensitive resin composition of the present invention. Alternatively, in addition to the polymerization inhibitor contained in the resin, a polymerization inhibitor identical to or different from the polymerization inhibitor may be added during the production of the photosensitive resin composition.

[0320] When the photosensitive resin composition of the present invention contains a polymerization inhibitor, the content of the polymerization inhibitor in the photosensitive resin composition is preferably 0.0005% by mass or more, more preferably 0.001% by mass or more, even more preferably 0.01% by mass or more, and preferably 0.3% by mass or less, more preferably 0.2% by mass or less, and even more preferably 0.1% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and for example, 0.0005 to 0.3% by mass is preferred, 0.001 to 0.2% by mass is more preferred, and 0.01 to 0.1% by mass is even more preferred. By setting the content at or above the lower limit, the taper angle tends to be higher. Meanwhile, by setting the content at or below the upper limit, high sensitivity tends to be maintained.

[0321] [1-1-8] Amino compounds The photosensitive resin composition of the present invention may contain an amino compound to promote thermal curing. When the photosensitive resin composition of the present invention contains an amino compound, the content of the amino compound in the photosensitive resin composition is preferably 40% by mass or less, more preferably 30% by mass or less, based on the total solid content of the photosensitive resin composition. It is also preferably 0.5% by mass or more, more preferably 1% by mass or more. The upper and lower limits can be arbitrarily combined, and for example, 0.5 to 40% by mass is preferred, and 1 to 30% by mass is more preferred. By setting the content at or below the upper limit, storage stability tends to be maintained. By setting the content at or above the lower limit, sufficient thermosetting properties tend to be ensured.

[0322] Examples of the amino compound include amino compounds having, as a functional group, a methylol group or at least two alkoxymethyl groups obtained by condensing a methylol group with an alcohol having 1 to 8 carbon atoms. Specific examples include melamine resins obtained by polycondensing melamine with formaldehyde, benzoguanamine resins obtained by polycondensing benzoguanamine with formaldehyde, glycoluril resins obtained by polycondensing glycoluril with formaldehyde, urea resins obtained by polycondensing urea with formaldehyde, resins obtained by copolycondensing two or more of melamine, benzoguanamine, glycoluril, urea, and the like with formaldehyde, and modified resins obtained by condensing the methylol groups of the above-mentioned resins with alcohol. These may be used alone or in combination of two or more. Of the amino compounds, melamine resins and modified resins thereof are preferred, and modified resins in which the degree of modification of methylol groups is 70% or more are more preferred, and modified resins in which the degree of modification is 80% or more are particularly preferred.

[0323] Examples of melamine resins and modified resins thereof as amino compounds include Cymel (registered trademark, the same applies hereinafter) 300, 301, 303, 350, 736, 738, 370, 771, 325, 327, 703, 701, 266, 267, 285, 232, 235, 238, 1141, 272, 254, 202, 1156, and 1158 manufactured by Cytec Corporation, and Nikalac (registered trademark, the same applies hereinafter) MW-390, MW-100LM, MX-750LM, MW-30M, MX-45, and MX-302 manufactured by Sanwa Chemical Co., Ltd. Examples of benzoguanamine resins and modified resins thereof include Cymel 1123, 1125, and 1128 manufactured by Cytec Corporation. Examples of glycoluril resins and modified resins thereof include Cymel 1170, 1171, 1174, and 1172 manufactured by Cytec Co., Ltd., and Nikalac MX-270 manufactured by Sanwa Chemical Co., Ltd. Examples of urea resins and modified resins thereof include UFR (registered trademark, the same applies hereinafter) 65 and 300 manufactured by Cytec Co., Ltd., and Nikalac MX-290 manufactured by Sanwa Chemical Co., Ltd.

[0324] [1-1-9] Colorants The photosensitive resin composition of the present invention may contain a colorant for the purpose of coloring the partition walls. Known colorants such as pigments and dyes can be used as the colorant. When using a pigment, a known dispersant or dispersion aid may be used in combination so that the pigment does not aggregate and remains stable in the photosensitive resin composition. Coloring the ink-repellent partition walls black is particularly effective in achieving clear pixel display. Examples of black colorants include black dyes, black pigments, carbon black, and titanium black. Mixing an organic pigment to achieve black coloring is also effective in providing low conductivity. The content of the colorant is preferably 60% by mass or less, and more preferably 40% by mass or less, of the total solid content of the photosensitive resin composition, from the viewpoints of plate-making properties and color properties. In another embodiment, when a colorant is contained in the photosensitive resin composition, the curability of the partition walls decreases, the liquid repellency of the partition walls decreases, and outgassing tends to occur easily. Therefore, the content of the colorant in the photosensitive resin composition is desirably low, and for example, is preferably 20 mass % or less, more preferably 10 mass % or less, particularly preferably 5 mass % or less, and most preferably 0 mass % relative to the total solid content of the photosensitive resin composition.

[0325] [1-1-10] Coating improvers, development improvers The photosensitive resin composition of the present invention may contain a coating property improver or a development improver in order to improve the coating property or the development solubility. As the coating property improver or development improver, for example, known surfactants can be used. The surfactant can be used for the purpose of improving the coatability of the photosensitive resin composition as a coating liquid and the developability of the coating film, and among these, fluorine-based surfactants or silicone-based surfactants are preferred. In particular, silicone surfactants are preferred, and polyether-modified silicone surfactants are more preferred, because they have the effect of removing residues of the photosensitive resin composition from unexposed areas during development and also have the function of exhibiting wettability.

[0326] As the fluorine-based surfactant, a compound having a fluoroalkyl or fluoroalkylene group at least at any one of the terminal, main chain, and side chain is suitable. Specific examples include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, octaethylene glycol di(1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di(1,1,2,2-tetrafluorobutyl) ether, hexapropylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecyl sulfonate, 1,1,2,2,8,8,9,9,10,10-decafluorododecane, and 1,1,2,2,3,3-hexafluorodecane. Examples of commercially available products include "BM-1000" and "BM-1100" manufactured by BM Chemie, "Megafac F470," "Megafac F475," "Megafac F554," and "Megafac F559" manufactured by DIC Corporation, "FC430" manufactured by 3M Japan, and "DFX-18" manufactured by Neos.

[0327] Examples of silicone surfactants include "DC3PA," "SH7PA," "DC11PA," "SH21PA," "SH28PA," "SH29PA," "8032Additive," and "SH8400" manufactured by Dow Corning Toray Co., Ltd., and "BYK (registered trademark, the same applies hereinafter) 323" and "BYK330" manufactured by BYK-Chemie. The surfactant may contain other surfactants in addition to the fluorine-based surfactant and the silicone-based surfactant, and examples of the other surfactants include nonionic, anionic, cationic, and amphoteric surfactants.

[0328] Examples of nonionic surfactants include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkylphenyl ethers, polyoxyethylene alkyl esters, polyoxyethylene fatty acid esters, glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythritol fatty acid esters, polyoxyethylene pentaerythritol fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, sorbitol fatty acid esters, and polyoxyethylene sorbitol fatty acid esters. Commercially available products of these surfactants include polyoxyethylene surfactants such as "Emulgen (registered trademark, the same applies hereinafter) 104P" and "Emulgen A60" manufactured by Kao Corporation.

[0329] Examples of anionic surfactants include alkyl sulfonates, alkyl benzene sulfonates, alkyl naphthalene sulfonates, polyoxyethylene alkyl ether sulfonates, alkyl sulfates, alkyl sulfate ester salts, higher alcohol sulfate ester salts, aliphatic alcohol sulfate ester salts, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkyl phosphate ester salts, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphate salts, and special polymer surfactants. Among these, special polymer surfactants are preferred, and special polycarboxylic acid polymer surfactants are more preferred. Examples of anionic surfactants include alkyl sulfate ester salts such as Kao Corporation's "EMAL (registered trademark) 10," alkyl naphthalene sulfonates such as Kao Corporation's "PELEX (registered trademark) NB-L," and special polymer surfactants such as Kao Corporation's "HOMOGENOL (registered trademark) L-18" and "HOMOGENOL L-100."

[0330] Examples of cationic surfactants include quaternary ammonium salts, imidazoline derivatives, and alkylamine salts. Examples of amphoteric surfactants include betaine compounds, imidazolium salts, imidazolines, and amino acids. Among these, quaternary ammonium salts are preferred, and stearyltrimethylammonium salts are more preferred. Examples of cationic surfactants or benign surfactants include alkylamine salts such as "Acetamine (registered trademark) 24" manufactured by Kao Corporation, and quaternary ammonium salts such as "Quatamine (registered trademark, the same applies hereinafter) 24P" and "Quatamine 86W" manufactured by Kao Corporation. The surfactant may be used alone or in combination of two or more. For example, a combination of a silicone surfactant / a fluorine surfactant, a combination of a silicone surfactant / a special polymer surfactant, or a combination of a fluorine surfactant / a special polymer surfactant may be used. Among these, a combination of a silicone surfactant / a fluorine surfactant is preferred. Examples of this silicone surfactant / fluorine surfactant combination include "BYK-300" or "BYK-330" manufactured by BYK / "DFX-18" manufactured by Neos, "BYK-300" or "BYK-330" manufactured by BYK / "S-393" manufactured by AGC Seimi Chemical, "BYK-300" or "BYK-330" manufactured by BYK / "F-554" or "F-559" manufactured by DIC, "KP340" manufactured by Shin-Etsu Silicones / "F-478" or "F-475" manufactured by Dow Corning Toray Co., Ltd. / "DS-401" manufactured by Daikin, and "L-77" manufactured by NUC / "FC4430" manufactured by 3M Japan Ltd. As the development improver, known development improvers including, for example, organic carboxylic acids or anhydrides thereof can also be used. When the photosensitive resin composition of the present invention contains a coatability improver or a development improver, the contents of the coatability improver and the development improver are each preferably 20% by mass or less, and more preferably 10% by mass or less, of the total solid content of the photosensitive resin composition, from the viewpoint of sensitivity.

[0331] [1-1-11] Silane coupling agents The photosensitive resin composition of the present invention may contain a silane coupling agent to improve adhesion to the substrate. Examples of the silane coupling agent that can be used include epoxy-based, methacrylic-based, amino-based, and imidazole-based silane coupling agents. From the viewpoint of improving adhesion, epoxy-based and imidazole-based silane coupling agents are particularly preferred. When the photosensitive resin composition of the present invention contains a silane coupling agent, the content of the silane coupling agent is preferably 20 mass % or less, and more preferably 15 mass % or less, of the total solid content of the photosensitive resin composition, from the viewpoint of adhesion.

[0332] [1-1-12] Phosphate-based adhesion improver The photosensitive resin composition of the present invention may contain a phosphoric acid-based adhesion promoter to improve adhesion to a substrate. As the phosphoric acid-based adhesion promoter, (meth)acryloyloxy group-containing phosphates are preferred, and among them, those represented by the following general formulas (Va), (Vb), and (Vc) are preferred.

[0333] [ka]

[0334] In the above general formulas (Va), (Vb), and (Vc), R 8 represents a hydrogen atom or a methyl group, r and r' are integers of 1 to 10, and s is 1, 2, or 3.

[0335] When the photosensitive resin composition of the present invention contains a phosphoric acid-based adhesion improver, its content is not particularly limited, but is preferably 0.1 mass% or more, more preferably 0.2 mass% or more, even more preferably 0.3 mass% or more, and preferably 5 mass% or less, more preferably 3 mass% or less, and even more preferably 1 mass% or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and for example, 0.1 to 5 mass% is preferred, 0.2 to 3 mass% is more preferred, and 0.3 to 1 mass% is more preferred. By setting the content at or above the lower limit, adhesion to the substrate tends to be improved. Furthermore, by setting the content at or below the upper limit, surface curability tends to be improved.

[0336] [1-1-13] Inorganic fillers The photosensitive resin composition of the present invention may contain an inorganic filler for the purpose of improving the strength of the cured product and also for the purpose of improving the flatness and taper angle of the coating film by appropriate interaction with the alkali-soluble resin (forming a matrix structure). Examples of inorganic fillers include talc, silica, alumina, barium sulfate, magnesium oxide, and those surface-treated with various silane coupling agents.

[0337] The average particle size of the inorganic filler is preferably 0.005 to 20 μm, more preferably 0.01 to 10 μm. Here, the average particle size is a value measured using a laser diffraction / scattering particle size distribution analyzer manufactured by Beckman Coulter, Inc., or the like. Among inorganic fillers, silica sol and modified silica sol are preferred because they tend to have excellent dispersion stability and an excellent effect of improving the taper angle. When the photosensitive resin composition of the present invention contains an inorganic filler, the content thereof is, from the viewpoint of sensitivity, preferably 5% by mass or more, more preferably 10% by mass or more, and preferably 80% by mass or less, more preferably 70% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and are, for example, preferably 5 to 80% by mass, more preferably 10 to 70% by mass.

[0338] [1-1-14] Solvent The photosensitive resin composition of the present invention usually contains a solvent, and is used in a state in which the above-mentioned components are dissolved or dispersed in the solvent. The solvent is not particularly limited, and examples thereof include the organic solvents described below.

[0339] Glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol t-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethyl pentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, tripropylene glycol methyl ether; ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dipropyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dipropyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dipropyl ether, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ... Glycol dialkyl ethers such as ethylene glycol dibutyl ether and dipropylene glycol dimethyl ether; glycol alkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, 3-methyl-3-methoxybutyl acetate, and 3-methoxy-1-butyl acetate;Glycol diacetates such as ethylene glycol diacetate, 1,3-butylene glycol diacetate, and 1,6-hexanol diacetate; alkyl acetates such as cyclohexanol acetate; ethers such as amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, diamyl ether, ethyl isobutyl ether, and dihexyl ether; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, and diisopropyl ketone. Ketones such as isobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methyl hexyl ketone, methyl nonyl ketone, and methoxymethyl pentanone; monohydric or polyhydric alcohols such as methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, methoxymethyl pentanol, glycerin, and benzyl alcohol; n-pentane aliphatic hydrocarbons such as n-octane, diisobutylene, n-hexane, hexene, isoprene, dipentene, and dodecane; alicyclic hydrocarbons such as cyclohexane, methylcyclohexane, methylcyclohexene, and bicyclohexyl; aromatic hydrocarbons such as benzene, toluene, xylene, and cumene; amyl formate, ethyl formate, ethyl acetate, butyl acetate, propyl acetate, amyl acetate, methyl isobutyrate, ethylene glycol acetate, ethyl propionate, propyl propionate, butyl butyrate, isobutyl butyrate, and methyl isobutyrate. linear or cyclic esters such as butyl, ethyl caprylate, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, and γ-butyrolactone; alkoxycarboxylic acids such as 3-methoxypropionic acid and 3-ethoxypropionic acid; halogenated hydrocarbons such as butyl chloride and amyl chloride; ether ketones such as methoxymethylpentanone;Nitriles such as acetonitrile and benzonitrile; tetrahydrofurans such as tetrahydrofuran, dimethyltetrahydrofuran, and dimethoxytetrahydrofuran;

[0340] Examples of commercially available solvents that fall under the above category include mineral spirits, Balsol #2, Apco #18 Solvent, Apco Thinner, Socal Solvent No. 1 and No. 2, Solvesso #150, Shell TS28 Solvent, Carbitol, ethyl carbitol, butyl carbitol, methyl cellosolve, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve acetate, and diglyme (all of which are trade names).

[0341] The solvent can dissolve or disperse each component in the photosensitive resin composition and is selected depending on the method of use of the photosensitive resin composition of the present invention, but from the viewpoint of coatability, a solvent having a boiling point at atmospheric pressure (1013.25 hPa) of preferably 60 to 280° C., more preferably 70 to 260° C. For example, propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate are preferred.

[0342] The solvent may be used alone or in combination of two or more kinds. The solvent is preferably used so that the total solids content in the photosensitive resin composition is preferably 10% by mass or more, more preferably 15% by mass or more, even more preferably 18% by mass or more, and preferably 90% by mass or less, more preferably 50% by mass or less, even more preferably 40% by mass or less, and particularly preferably 30% by mass or less. The upper and lower limits can be arbitrarily combined, and for example, 10 to 90% by mass is preferred, 10 to 50% by mass is more preferred, 15 to 40% by mass is even more preferred, and 18 to 30% by mass is particularly preferred. By setting the content at or above the lower limit, a coating film tends to be obtained even with a high thickness. Furthermore, by setting the content at or below the upper limit, appropriate coating uniformity tends to be obtained.

[0343] [1-2] Method for preparing photosensitive resin composition The photosensitive resin composition of the present invention is prepared by mixing the above-mentioned components with a mixer. The prepared photosensitive resin composition may be filtered using a membrane filter or the like to make it homogeneous.

[0344] [2] Partition wall and its forming method The photosensitive resin composition of the present invention can be suitably used to form partition walls, particularly partition walls for partitioning an organic layer (light-emitting portion) of an organic electroluminescent element. The partition walls of the present invention can be obtained by curing the photosensitive resin composition of the present invention. The method for forming partition walls using the photosensitive resin composition of the present invention is not particularly limited, and any conventionally known method can be used. For example, the method for forming partition walls includes a coating step of applying the photosensitive resin composition onto a substrate to form a photosensitive resin composition layer, and an exposure step of exposing the photosensitive resin composition layer to light. A specific example of the method for forming such partition walls is photolithography.

[0345] In the photolithography method, a photosensitive resin composition is applied to the entire surface of a region of a substrate where partition walls are to be formed to form a photosensitive resin composition layer. The formed photosensitive resin composition layer is exposed to light according to a predetermined partition wall pattern, and then the exposed photosensitive resin composition layer is developed to form partition walls on the substrate.

[0346] In the photolithography method, in the coating step of coating a substrate with a photosensitive resin composition, the photosensitive resin composition is coated onto the substrate on which partition walls are to be formed using a contact transfer type coating device such as a roll coater, a reverse coater, or a bar coater, or a non-contact type coating device such as a spinner (rotary coating device) or a curtain flow coater, and the solvent is removed by drying as necessary to form a photosensitive resin composition layer.

[0347] Next, in the exposure step, the photosensitive resin composition is irradiated with active energy rays such as ultraviolet rays and excimer laser light using a negative mask, and the photosensitive resin composition layer is partially exposed according to the partition wall pattern. For exposure, a light source that emits ultraviolet rays such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, or a carbon arc lamp can be used. The exposure dose varies depending on the composition of the photosensitive resin composition, but is, for example, 10 to 400 mJ / cm. 2 The degree is preferable.

[0348] Next, in the development step, the photosensitive resin composition layer exposed according to the partition wall pattern is developed with a developer to form a partition wall pattern. The development method is not particularly limited, and an immersion method, a spray method, or the like can be used. Specific examples of developers include organic developers such as dimethylbenzylamine, monoethanolamine, diethanolamine, and triethanolamine, as well as aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. An antifoaming agent or a surfactant can also be added to the developer.

[0349] The developed barrier rib pattern is then post-baked to heat and harden, thereby obtaining barrier ribs. The post-baking is preferably performed at 150 to 250° C. for 15 to 60 minutes.

[0350] After forming the partition walls, a cleaning process can be performed to clean the unexposed areas. The cleaning method is not particularly limited, and examples include plasma irradiation, excimer light irradiation, and UV irradiation. With excimer light irradiation and UV irradiation, active oxygen generated by the light irradiation can decompose and remove organic matter adhering to the pixel area.

[0351] The substrate used for forming the partition walls is not particularly limited and may be appropriately selected depending on the type of organic electroluminescent device to be manufactured using the substrate on which the partition walls are formed. Suitable substrate materials include glass and various resin materials. Specific examples of resin materials include polyesters such as polyethylene terephthalate; polyolefins such as polyethylene and polypropylene; polycarbonates; poly(meth)methacrylic resins; polysulfones; and polyimides. Among these substrate materials, glass and polyimide are preferred because of their excellent heat resistance. Depending on the type of organic electroluminescent device to be manufactured, a transparent electrode layer such as ITO or ZnO may be previously provided on the surface of the substrate on which the partition wall is to be formed.

[0352] The photosensitive resin composition of the present invention has excellent controllability over surface curability and internal curability, and therefore can be suitably used to form partition walls having a step. Here, the partition wall having a step means a partition wall having a first partition wall and a second partition wall that have different heights, for example, a partition wall in which the first partition wall is taller than the second partition wall. The use of a partition wall with a step tends to make it possible to make the thickness of the organic layer (light-emitting portion) uniform. In addition, the provision of a second partition wall between pixels ensures insulation between pixels, making it possible to suppress light emission from areas other than the pixel portion.

[0353] The height of the step, i.e., the difference in height between the upper surface of the first barrier rib and the upper surface of the second barrier rib, is preferably 0.7 μm or more, more preferably 0.8 μm or more, and even more preferably 0.9 μm or more. It is also preferably 1.3 μm or less, more preferably 1.2 μm or less, and even more preferably 1.1 μm or less. The upper and lower limits can be arbitrarily combined, and are, for example, preferably 0.7 to 1.3 μm, more preferably 0.8 to 1.2 μm, and even more preferably 0.9 to 1.1 μm. By setting the content to the lower limit or more, inkjet coating properties in a line shape tend to be ensured, while by setting the content to the upper limit or less, insulation between pixels tends to be ensured.

[0354] An example of a substrate having partition walls with steps is shown in Figures 1 and 2. Figure 1 is a plan view, and Figure 2 is a cross-sectional view taken along line XX in Figure 1. Partition walls 2 with steps are provided on a substrate 1, and the open areas in the partition walls 2, i.e., the areas partitioned by the partition walls 2, form pixel sections 3. The partition walls 2 have an upper surface 11 of a first partition wall and an upper surface of a second partition wall, and a step 13 is formed by the difference in height between the upper surface 11 of the first partition wall and the upper surface 12 of the second partition wall.

[0355] An example of a method for forming a partition wall having a step is a method using a negative halftone mask in the exposure step of the photolithography method described above. An example of a negative halftone mask is one in which the portion corresponding to the pixel portion 3 is a light-shielding portion (0% light transmittance), the portion corresponding to the top surface 11 of the first partition wall is an opening with the highest average light transmittance (fully transparent opening), and the portion corresponding to the top surface 12 of the second partition wall is an opening with a lower average light transmittance than the fully transparent opening (intermediate transparent opening). This method creates a difference in the remaining film rate due to the difference in average light transmittance between the fully transparent opening and the intermediate transparent opening, i.e., the difference in exposure dose, thereby forming a step. By using a half-tone mask in this way, it is possible to form partition walls having steps in a single process by photolithography, which allows the first and second partition walls to be continuous with no clear boundary between them.

[0356] [3] Organic electroluminescent device The organic electroluminescent device of the present invention comprises the partition wall of the present invention. Various organic electroluminescent devices are manufactured using a substrate having a partition wall pattern manufactured by the method described above. Although the method for forming an organic electroluminescent device is not particularly limited, the organic electroluminescent device is preferably manufactured by forming a partition wall pattern on a substrate by the method described above, and then injecting ink into areas on the substrate surrounded by the partition walls to form organic layers such as pixels. The types of organic electroluminescent devices include bottom emission types and top emission types. A bottom-emission type is fabricated, for example, by forming a partition wall on a glass substrate on which a transparent electrode is laminated, and laminating a hole transport layer, a light-emitting layer, an electron transport layer, and a metal electrode layer in an opening surrounded by the partition wall.A top-emission type is fabricated, for example, by forming a partition wall on a glass substrate on which a metal electrode layer is laminated, and laminating an electron transport layer, a light-emitting layer, a hole transport layer, and a transparent electrode layer in an opening surrounded by the partition wall. Examples of the light-emitting layer include organic electroluminescent layers such as those described in Japanese Patent Application Laid-Open No. 2009-146691 and Japanese Patent No. 5734681. Quantum dots such as those described in Japanese Patent No. 5653387 and Japanese Patent No. 5653101 may also be used.

[0357] The solvent used to form the ink for forming the organic layer can be water, an organic solvent, or a mixture thereof. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Examples of organic solvents include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, and 3-phenoxytoluene. The ink can also contain, for example, a surfactant, an antioxidant, a viscosity modifier, and an ultraviolet absorber.

[0358] The inkjet method is preferred as a method for injecting ink into the region surrounded by the partition wall, as it allows for easy injection of a small amount of ink into a predetermined location. The ink used to form the organic layer is selected appropriately depending on the type of organic electroluminescent device to be manufactured. When injecting ink by the inkjet method, the viscosity of the ink is not particularly limited as long as the ink can be smoothly ejected from the inkjet head, but is preferably 4 to 20 mPa·s, and more preferably 5 to 10 mPa·s. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, etc.

[0359] [4] Image display device The image display device of the present invention includes the organic electroluminescent element of the present invention. The type and structure of the image display device are not particularly limited as long as it includes the organic electroluminescent element of the present invention, and it can be assembled according to a conventional method using, for example, an active-drive organic electroluminescent element. For example, the image display device of the present invention can be formed by a method such as that described in "Organic EL Display" (Ohmsha, published August 20, 2004, by Tokito Shizuo, Adachi Chinaya, and Murata Hideyuki). For example, an organic electroluminescent element that emits white light may be combined with a color filter to display an image, or organic electroluminescent elements that emit different colors of light, such as RGB, may be combined to display an image. [Example]

[0360] The present invention will be described below with reference to specific examples, but the present invention is not limited to the following examples as long as the gist of the invention is not exceeded. The components of the photosensitive resin compositions used in the following examples and comparative examples are as follows:

[0361] <Photopolymerization initiator> a-1: A compound having the following chemical structure

[0362] [ka]

[0363] a-2: BASF IRGACURE OXE-01 a-3: BASF IRGACURE OXE-02 a-4: PBG-305 manufactured by Changzhou Strong Electronics New Materials Co., Ltd. a-5: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole manufactured by Hodogaya Chemical Co., Ltd.

[0364] <Alkali-soluble resin> b-1: Alkali-soluble resin having the following structural unit (a mixture of epoxy (meth)acrylate resin (solid acid value 80 mg KOH / g, polystyrene equivalent weight average molecular weight (Mw) measured by GPC) 8000, m and n are 1 to 20).

[0365] [ka]

[0366] In the above formula, * represents a monovalent group represented by the following formula or a bond to a hydrogen atom.

[0367] [ka] b-2: An alkali-soluble resin having the following structural unit (epoxy (meth)acrylate resin ("ZCR-8029H" manufactured by Nippon Kayaku Co., Ltd. (weight average molecular weight Mw = 7000, acid value = 62 mgKOH / g)). It has a partial structure represented by the following formula (C1).

[0368] [ka]

[0369] <Photopolymerizable compound> c-1: Dipentaerythritol hexaacrylate (DPHA) manufactured by Nippon Kayaku Co., Ltd.

[0370] <Liquid repellent> d-1: Megafac RS-72-K manufactured by DIC Corporation (acrylic resin containing a repeating unit represented by general formula (II) and a fluorine atom) d-2: Megafac RS-78 manufactured by DIC Corporation (acrylic resin containing no repeating units represented by general formula (II) and containing ethylenically unsaturated groups and fluorine atoms) d-3: Megafac F-559 manufactured by DIC Corporation (an acrylic resin containing fluorine atoms but not containing a repeating unit represented by general formula (II) or an ethylenically unsaturated group) <Additives> e-1: Nippon Kayaku KAYAMER PM-21 <Chain transfer agent> f-1: 2-mercaptobenzimidazole (Tokyo Chemical Industry Co., Ltd.)

[0371] <Preparation of Photosensitive Resin Composition> The photosensitive resin compositions of Examples 1 to 3 and Comparative Examples 1 to 5 were prepared by using each component in the blending ratio shown in Table 1, and stirring the components until homogeneous using propylene glycol monomethyl ether acetate so that the total solid content of the photosensitive resin composition was 19 mass %. The blending ratio (mass %) of each component in Table 1 means the value of the solid content of each component in the total solid content of the photosensitive resin composition.

[0372] [Table 1]

[0373] The photosensitive resin compositions of Examples 1 to 3 and Comparative Examples 1 to 5 were used to evaluate their performance by the methods described below.

[0374] <Preparation and evaluation of contact angle measurement substrates> Each photosensitive resin composition was applied onto a glass substrate using a spinner so that the thickness after heat curing would be 1.5 μm. The composition was then dried by heating on a hot plate at 95°C for 2 minutes to obtain a coated substrate. Next, the resulting coating was exposed to light at an exposure dose of 60 mJ / cm using an exposure machine MA-1100 manufactured by Dai Nippon Kaken Co., Ltd. without using a photomask. 2 The entire surface was exposed to light at a wavelength of 365 nm with an intensity of 40 mW / cm 2 The substrate was then spray-developed with a 2.38% by mass aqueous solution of TMAH (tetramethylammonium hydroxide) at 24°C for 60 seconds, and then washed with pure water for 10 seconds. The substrate was then heat-cured in an oven at 230°C for 30 minutes to obtain a fully coated substrate for contact angle measurement.

[0375] The contact angle was measured using a contact angle measuring device, Drop Master 500, manufactured by Kyowa Interface Science Co., Ltd., under conditions of 23°C and 50% humidity. 0.7 μL of propylene glycol methyl ether acetate was dropped onto the contact angle measurement substrate, and the contact angle was measured after 1 second. The measurement results are shown in Table 1. A larger contact angle indicates higher ink repellency.

[0376] <Bulkhead with step and evaluation> Using each photosensitive resin composition, partition walls were formed and their performance was evaluated by the methods described below.

[0377] (Formation of partition wall) Each photosensitive resin composition was applied to a glass substrate having an ITO film formed on its surface using a spinner so that the resulting coating would have a thickness of 1.5 μm after heat curing. The coating was then dried by heating on a hot plate at 95°C for 2 minutes to obtain a coated substrate. The resulting coating was exposed to light using a photomask (a photomask in which linear fully transparent openings with an opening width of 20 μm and linear intermediate transparent openings with an opening width of 60 μm were arranged alternately next to each other, with 60 μm x 240 μm covering portions arranged at 70 μm intervals within the intermediate transparent openings) at an exposure gap of 10 μm using an MA-1100 exposure machine manufactured by Dai-Nippon Kaken Co., Ltd. The intermediate transparent openings were made of a thin film of Cr oxide with a light transmittance of 5% at a wavelength of 365 nm. The intensity at a wavelength of 365 nm during exposure was 40 mW / cm. 2 , exposure dose 60 mJ / cm 2 The process was carried out in air. Next, the substrate was spray-developed with a 2.38% by mass aqueous solution of TMAH (tetramethylammonium hydroxide) at 24°C for 60 seconds, and then washed with pure water for 1 minute. These operations removed unnecessary portions, and the substrate on which a pattern was formed was then heated and cured in an oven at 230°C for 30 minutes to obtain a partition wall substrate with steps.

[0378] (measuring the thickness of the partition wall) For the partition substrate having the above-described step, the film thickness of the cured film (first partition) corresponding to the completely transparent opening and the cured film (second partition) corresponding to the intermediate transparent opening were measured using a three-dimensional non-contact surface shape measurement system, Micromap MM3500-M100, manufactured by Ryoka Systems Co., Ltd.

[0379] (Evaluation of steps) The difference in film thickness (step, ΔH) between the first and second barrier ribs was calculated and evaluated according to the following criteria. The results are shown in Table 1. A: Step height ΔH is 0.9 μm or more and 1.1 μm or less B: Step ΔH is 0.7 μm or more and less than 0.9 μm, or more than 1.1 μm and less than 1.3 μm C: Step ΔH is less than 0.7 μm or exceeds 1.3 μm The step ranges A and B are preferable, and A is more preferable.

[0380] (Inkjet coating suitability evaluation) For the partition substrate having the step, inkjet coating was performed on the pixel regions corresponding to the covering portions using a Fujifilm DMP-2831. A solvent (isoamyl benzoate) was used alone as the ink, and 180 pL was applied per pixel region. The presence or absence of ink breakage (the phenomenon in which the ink overcomes the first partition wall) and whether the ink could be applied in a line were evaluated according to the following criteria. The higher the ink repellency of the partition wall, the more likely it is that breakage will be suppressed. Furthermore, the more appropriate the step, the better the line application tends to be.

[0381] (Breakdown assessment) A: The ink could be applied within the pixel area and did not overflow outside the first partition wall. B: The ink overflowed from within the pixel area, climbing over the first partition wall (breakdown).

[0382] (Line-shaped inkjet coating) A: The ink was applied in a continuous line on the second partition wall across multiple pixel regions. B: The ink was interrupted between multiple pixel areas, making it impossible to apply it in a line.

[0383] As is clear from the comparison between Examples 1 to 3 and Comparative Examples 1 and 2 in Table 1, in Examples 1 to 3, the step, which is the difference in height between the first partition wall and the second partition wall, was ensured to be within an appropriate range, and the line-shaped coating properties after inkjet coating were good and no breakage occurred. In Comparative Example 1, the second partition wall could not be formed, and although line-shaped application was possible during inkjet application, breakage occurred. In Comparative Example 2, the thickness of the second partition wall was large, and the ink coating property in a line shape was insufficient. In Comparative Example 3, the partition walls could not be formed. In Comparative Examples 4 and 5, the contact angle on the surface of the first partition wall was low, causing breakage during inkjet coating, and line-shaped coating was not possible.

[0384] When applying ink by inkjet printing, it is important to fix a liquid-repellent agent to the surface of the partition walls and ensure the liquid-repellent properties of the partition walls in order to prevent the ink from breaking out of the first partition walls. However, if the degree of curing of the coating film after UV exposure is insufficient, part of the film surface will dissolve during the subsequent development process, causing the liquid-repellent agent to flow into the developer, and the liquid-repellent properties of the partition walls will deteriorate. The use of an oxime ester photopolymerization initiator, which mainly uses i-rays, as the photopolymerization initiator improves the degree of surface hardening of the coating film, making it useful as a method for ensuring liquid repellency on the partition wall surface. However, when the first and second partition walls are exposed simultaneously using a mask with openings of different transmittances, a so-called half-tone mask, and each partition wall is formed through a development and thermal curing process, the degree of surface hardening of the second partition wall tends to be excessively high, making it difficult to control the difference in level with the first partition wall.

[0385] The photopolymerization initiator contained in the photosensitive resin composition of Comparative Example 2 had a carbazole skeleton, which resulted in an excessively high degree of surface hardening of the second partition walls, resulting in a thick film thickness. As a result, during inkjet coating, a predetermined amount of ink remained within the pixel region and was unable to flow onto the second partition walls, resulting in insufficient line-shape coating. In Comparative Example 3, a biimidazole-based photopolymerization initiator was used in combination with a chain transfer agent to improve the curability of the surface. However, the photocurability was insufficient, and the partition walls were washed away by the developer in the development step, failing to be formed.

[0386] The photopolymerization initiators contained in the photosensitive resin compositions of Example 1 and Comparative Example 1 both have a sulfide skeleton, and therefore do not exhibit particularly high surface curability. However, the photopolymerization initiator contained in the photosensitive resin composition of Comparative Example 1 has a phenylcarbonyl group as the radical-generating site, which is thought to result in low mobility of the generated radicals and weak internal curability. Therefore, it is presumed that the portions corresponding to the side walls of the first partition wall were excessively developed with the developer during development, preventing the retention of the liquid repellent agent on the side walls, which resulted in the breakage during inkjet coating. It is also thought that the low internal curability prevented the formation of the second partition wall.

[0387] The photopolymerization initiator contained in the photosensitive resin composition of Example 1 has a methylcarbonyl group as the radical generation site, which is thought to increase the mobility of the generated radicals and enhance internal curing. Therefore, it is presumed that the developability of the portion corresponding to the sidewall of the first partition wall during development is also adequate, allowing the liquid repellent agent to be sufficiently retained on the sidewall, thereby suppressing breakage. Furthermore, it is thought that the moderately high internal curing ability allowed the formation of second partition walls of the desired thickness and also improved line-shape applicability. Even when the photopolymerization initiator represented by general formula (I) and other photopolymerization initiators were used as in Example 3, the step, which is the difference in height between the first and second partition walls, was ensured to be within an appropriate range, and the contact angle on the surface of the first partition wall and the line-like coating properties were also good. However, the step was in a more preferable range in Example 1. This is thought to be because the photosensitive resin composition of Example 1 had a higher ratio of the photopolymerization initiator represented by general formula (I) to the total photopolymerization initiators, resulting in higher internal curing properties.

[0388] To ensure the liquid repellency of the partition wall surface, it is also important to use an acrylic resin containing a repeating unit represented by general formula (II) and a fluorine atom as the liquid repellent agent. If the repeating unit represented by general formula (II) is not present, the liquid repellent agent is difficult to fix to the surface of the coating film after exposure to ultraviolet light and tends to flow into the developer during development, resulting in a deterioration in the liquid repellency of the partition wall surface. In Comparative Example 4, an acrylic resin containing an ethylenically unsaturated group and a fluorine atom was used as the liquid repellent agent. However, since the number of crosslinking groups was small, the liquid repellent agent was difficult to fix to the surface of the coating film after exposure to UV light and flowed into the developer in the development treatment, which reduced the contact angle on the partition wall surface and presumably prevented liquid repellency from being ensured. In Comparative Example 5, the liquid repellent agent did not have the repeating unit represented by general formula (II) and also did not have an ethylenically unsaturated group, so the contact angle on the partition wall surface was low and liquid repellency could not be ensured. [Explanation of symbols]

[0389] 1 board 2. Bulkhead with steps 3 Pixel section 11 Top of the first bulkhead 12 Top surface of second bulkhead 13 Steps

Claims

1. A photosensitive resin composition comprising (A) a photopolymerization initiator, (B) an alkali-soluble resin, (C) a photopolymerizable compound, and (D) a liquid repellent agent, The photopolymerization initiator (A) contains a photopolymerization initiator represented by the following general formula (I): a blending ratio of the alkali-soluble resin (B) to the photopolymerizable compound (C) is 120 parts by mass or less per 100 parts by mass of the photopolymerizable compound (C); the photopolymerizable compound (C) is an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, The liquid repellent (D) contains an acrylic resin (D1) containing a repeating unit represented by the following general formula (II) and a fluorine atom, A photosensitive resin composition, wherein the alkali-soluble resin (B) contains a partial structure represented by formula (iii): 【Chemistry 1】 (In formula (I), R １ａ represents an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent. R ２ａ represents an alkyl group. R ３ａ represents a monovalent substituent. n represents 0 or 1. h represents an integer of 0 to 2. 【Chemistry 2】 (In formula (II), R １１ each independently represents a hydrogen atom or a methyl group, R １２ represents an alkyl group having 2 to 6 carbon atoms which may have a substituent, and which may be interrupted by one or more of -O-, -C(=O)-, -S-, and -NH-. * indicates a bond.) 【Transformation 3】 (In formula (iii), R e represents a hydrogen atom or a methyl group, and γ represents a single bond, —CO—, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (iii) may be further substituted with any substituent. * represents a bond.)

2. In the formula (I), R ３ａ is R ４ａ -O- (where R ４ａ represents an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent; and h is 1.

3. The photosensitive resin composition according to claim 1 or 2, wherein the content of the photopolymerization initiator represented by the general formula (I) is 80 to 100 mass% based on the total photopolymerization initiator.

4. The photosensitive resin composition according to any one of claims 1 to 3, wherein the acrylic resin (D1) has a fluoroalkyl group and / or a fluoroalkylene group.

5. The photosensitive resin composition according to any one of claims 1 to 4, wherein the alkali-soluble resin (B) further contains a resin having a partial structure represented by the following general formula (i): 【Chemistry 4】 (In formula (i), R ａ represents a hydrogen atom or a methyl group, R ｂ represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) may be further substituted with any substituent. * represents a bond.)

6. The photosensitive resin composition according to any one of claims 1 to 5, which is used for forming partition walls.

7. The photosensitive resin composition according to claim 6 , which is used for forming partition walls having steps in a single step by photolithography.

8. A partition wall obtained by curing the photosensitive resin composition according to any one of claims 1 to 7.

9. An organic electroluminescent device comprising the partition wall according to claim 8 .

10. An image display device comprising the organic electroluminescent device according to claim 9.

Images