Resin molding device and method for manufacturing resin molded product

Abstract

To provide a resin supplying device capable of preventing a release film placed in a cavity of a mold from being stretched and torn. [Solution] The resin molding device includes a lower mold, an upper mold, and a mold clamping mechanism that clamps the lower mold and the upper mold together. One of the lower mold and the upper mold has a cavity that houses a workpiece to be resin molded, and includes a first block that forms the side surface of the cavity and a second block that forms the bottom surface of the cavity. The resin molding device further includes a vertical movement mechanism that moves the first block up and down relative to the second block. The first block has a through hole that communicates with the bottom surface of the cavity and extends horizontally to allow a release film to pass through. By moving the first block using the vertical movement mechanism, the second block is positioned within the through hole, and the release film positioned within the through hole is positioned on the bottom surface of the cavity.

Description

[Technical Field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a mold used for resin molding. In this mold, a release film is set on the parting surface of the upper mold. A cavity is formed on the parting surface, and the release film is sucked by air through suction holes formed in the upper mold so that it adheres closely to the bottom and side surfaces of the cavity. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-046017 Summary of the Invention [Problem to be solved by the invention]

[0004] In the mold of Patent Document 1, the release film covers the entire bottom and side surfaces of the cavity, making it relatively easy to release the resin molded product formed in the cavity from the cavity. However, because the cavity is deep, if the release film is sucked so that it adheres closely to the bottom and side surfaces of the cavity, the release film may stretch and tear. Furthermore, the release film may stretch and tear due to the pressure of the resin when the resin is injected into the cavity. If the release film tears, molding defects may occur.

[0005] An object of the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can prevent a release film placed in a cavity of a mold from stretching and breaking. [Means for solving the problem]

[0006] A resin molding apparatus according to one aspect of the present invention includes a lower mold, an upper mold arranged opposite the lower mold, and a mold clamping mechanism that clamps the lower mold and the upper mold together. One of the lower mold and the upper mold has a cavity that accommodates a workpiece to be resin molded, and includes a first block that forms the side surface of the cavity and a second block that forms the bottom surface of the cavity. The resin molding apparatus further includes a vertical movement mechanism that moves the first block vertically relative to the second block. The first block has a through hole that communicates with the bottom surface of the cavity and extends horizontally through which a release film passes. By moving the first block by the vertical movement mechanism, the second block is positioned within the through hole, and the release film positioned within the through hole is positioned on the bottom surface of the cavity.

[0007] A method for manufacturing a resin molded product according to another aspect of the present invention is a method for manufacturing a resin molded product using the resin molding apparatus described above. One or more pins, movable to protrude from the second block, are provided on one of the lower and upper dies, which has the cavity, for releasing the workpiece from the cavity after resin molding. This manufacturing method includes clamping the lower and upper dies together with the clamping mechanism, resin molding the workpiece, releasing clamping by the clamping mechanism after resin molding the workpiece, controlling the up-down movement mechanism after releasing clamping by the clamping mechanism to move the first block away from the second block, and, in a state where the first block and the second block are separated, moving the pin to protrude from the second block, thereby releasing the workpiece from the cavity.

[0008] A method for manufacturing a resin molded product according to yet another aspect of the present invention is a method for manufacturing a resin molded product using the above-mentioned resin molding apparatus. One or more pins that move to protrude from the second block are provided on one of the lower mold and the upper mold, which has the cavity, for releasing the workpiece from the cavity after resin molding. The second block is formed with a suction hole that is connected to a suction source and for adsorbing the release film. This manufacturing method includes clamping the lower mold and the upper mold together with the mold clamping mechanism, resin molding the workpiece, releasing the clamping mechanism after resin molding the workpiece, stopping the suction of the release film by the suction source after releasing the mold clamping mechanism, and moving the pins to protrude from the second block while the suction is stopped, thereby releasing the workpiece from the cavity.

[0009] A method for manufacturing a resin molded product according to yet another aspect of the present invention includes using the above-mentioned resin molding device to sandwich the workpiece between the lower mold and the upper mold, clamping the lower mold and the upper mold with the mold clamping mechanism, and resin molding the workpiece while the lower mold and the upper mold are clamped by the mold clamping mechanism, thereby manufacturing a resin molded product. [Effects of the Invention]

[0010] According to the present invention, a resin molding apparatus and a method for manufacturing a resin molded product are provided that can prevent a release film placed in a cavity of a mold from stretching and breaking. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view schematically showing a resin molding apparatus according to an embodiment. [Figure 2A] FIG. [Figure 2B] Cross-sectional view taken along line IIB-IIB in Figure 2A. [Figure 3] FIG. 2 is a vertical cross-sectional view of a molding mechanism according to an embodiment, viewed from the front side. [Figure 4]FIG. 4 is an exploded perspective view of a portion of a lower mold according to an embodiment. [Figure 5] FIG. 2 is a bottom view of a first block according to an embodiment. [Figure 6A] 3A to 3C are diagrams illustrating a flow of a method for manufacturing a resin molded product according to an embodiment. [Figure 6B] FIG. 6 is another diagram illustrating the flow of the method for manufacturing a resin molded product according to the embodiment. [Figure 6C] FIG. 10 is yet another diagram illustrating the flow of the method for manufacturing a resin molded product according to the embodiment. [Figure 6D] FIG. 10 is yet another diagram illustrating the flow of the method for manufacturing a resin molded product according to the embodiment. [Figure 6E] FIG. 10 is yet another diagram illustrating the flow of the method for manufacturing a resin molded product according to the embodiment. [Figure 6F] FIG. 10 is yet another diagram illustrating the flow of the method for manufacturing a resin molded product according to the embodiment. [Figure 6G] FIG. 10 is yet another diagram illustrating the flow of the method for manufacturing a resin molded product according to the embodiment. [Figure 6H] FIG. 10 is yet another diagram illustrating the flow of the method for manufacturing a resin molded product according to the embodiment. [Figure 7] FIG. 10 is a front view of a first block according to a modified example. [Figure 8] FIG. 10 is a plan view of a first block according to another modified example. DETAILED DESCRIPTION OF THE INVENTION

[0012] An embodiment of the present invention will be described in detail below with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. Furthermore, for ease of understanding, each drawing is drawn in a schematic manner with objects appropriately omitted or exaggerated.

[0013] <1. Overall configuration of resin molding equipment> FIG. 1 is a plan view schematically illustrating a resin molding apparatus 100 according to the present embodiment. The resin molding apparatus 100 resin-moldes a workpiece W1, which is a molding target, using a resin material T. In this description, the workpiece W1 has the structure shown in FIGS. 2A and 2B. FIG. 2A is a bottom view of the resin-molded workpiece W1, and FIG. 2B is a cross-sectional view taken along line IIB-IIB in FIG. 2A (in FIG. 2B, the bottom side of the workpiece W1 is shown on the bottom, and the top side of the workpiece W1 is shown on the top). In this example, the workpiece W1 includes a substrate 30 and an electronic component 31, such as a semiconductor chip, mounted on the substrate 30. The workpiece W1 is processed so that the electronic component 31 is covered with a molded resin 35 after resin molding. The workpiece W1 further includes an exposed member 32 having an exposed surface 32a that remains exposed from the molded resin 35 and is not covered with the molded resin 35 even after resin molding. Hereinafter, the workpiece W1 that has been resin-molded (i.e., covered with mold resin 35) will be referred to as workpiece W2 to distinguish it from the workpiece W1 before resin molding (i.e., not including mold resin 35). Although not limited thereto, the resin molding apparatus 100 is suitable for processing (exposed molding) the workpiece W1 that includes the exposed member 32. An example of such a workpiece W1 is a power module as the electronic component 31 equipped with a heat sink as the exposed member 32.

[0014] The resin molding apparatus 100 includes an in-module M1, a mold module M2, and an out-module M3. These modules M1 to M3 are connected in this order as an integrated device. While two mold modules M2 are shown in FIG. 1, only one mold module M2 or three or more mold modules M2 may be provided. The mold module M2 includes a molding mechanism 2. The molding mechanism 2 performs resin molding using resin material T to seal electronic components 31 included in the workpiece W1 with mold resin 35 and process the workpiece W1 into a resin-molded product, workpiece W2. In this embodiment, exposed molding is performed, and in the workpiece W2 after resin molding, exposed surfaces 32a of exposed members 32 loaded on the electronic components 31 are exposed from the mold resin 35. The in-module M1 includes an in-magazine 7 that stores multiple workpieces W1 before resin molding, and a resin supply mechanism 70. The resin supply mechanism 70 is a device that supplies resin material T. The outer module M3 includes an outer magazine 8 that stores a plurality of resin-molded workpieces W2.

[0015] The in-module M1 further includes an alignment mechanism 71 disposed adjacent to the in-magazine 7, and a transport mechanism 72 that transports the workpiece W1 from the in-magazine 7 to the alignment mechanism 71. The transport mechanism 72 includes, for example, an actuator, and pushes the workpiece W1 out of the in-magazine 7 and delivers it to the alignment mechanism 71. The alignment mechanism 71 is a mechanism that aligns the workpiece W1 and has a turntable 71a that can rotate in a horizontal plane. The workpiece W1 pushed out of the in-magazine 7 by the transport mechanism 72 is placed on the turntable 71a. Although not limited thereto, in the example of FIG. 1, two workpieces W1 can be mounted on the turntable 71a at the same time. When the workpiece W1 is set on the turntable 71a, the turntable 71a rotates and aligns the workpiece W1 so that it is in a position suitable for pickup by the loader 5, which will be described later.

[0016] The resin molding apparatus 100 further includes a guide G extending in the left-right direction, and a loader 5 and an unloader 6 that move along the guide G. In the description of this embodiment, unless otherwise specified, the terms front (front face), rear (rear face), left, right, top, and bottom are defined as shown in FIGS. 1, 3, 4, 6A to 6H, 7, and 8. The guide G is a rail along which the loader 5 and the unloader 6 travel. The guide G is provided linearly along the rear side of the resin molding apparatus 100, spanning the in-module M1, mold modules M2, M2, and out-module M3. The molding mechanism 2, the conveying mechanism 72, the alignment mechanism 71, the resin supply mechanism 70, the in-magazine 7, and the out-magazine 8 are disposed on the front side of the guide G.

[0017] The loader 5 is a loading mechanism that loads the workpiece W1 and resin material T into the molding die 20. One molding die 20 is provided for each molding mechanism 2. The loader 5 is equipped with a pickup mechanism (not shown) that picks up the workpiece W1 and is movable in the front-to-rear direction and can be raised and lowered in the up-and-down direction. The loader 5 moves along guides G between the in-module M1 and the mold modules M2. This allows the loader 5 to access the alignment mechanism 71 and resin supply mechanism 70 in the in-module M1, as well as the molding die 20 in the mold module M2. The loader 5 receives the workpiece W1 from the alignment mechanism 71 using the pickup mechanism (multiple pairs of claws in this embodiment), transports it to the molding die 20, and places it on the lower die 22 (see FIG. 3). The loader 5 also has a shutter that holds and receives the resin material T supplied from the resin supply mechanism 70 located below. Then, the loader 5 transports the received resin material T to the molding die 20, opens the shutter, and supplies the resin material T to the pot 23a of the lower die 22 (see FIG. 3).

[0018] The molding die 20 is a metal mold that resin-moldes the workpiece W1 using the resin material T. The molding die 20 has an upper die 21 and a lower die 22. Note that FIG. 1 mainly shows the portion of the molding mechanism 2 below the upper die 21. The molding mechanism 2 further includes a clamping mechanism 24 (see FIG. 3). When the loader 5 places the workpiece W1 and the resin material T at a predetermined position within the lower die 22, the clamping mechanism 24 clamps the upper die 21 and the lower die 22 together. The upper die 21 and the lower die 22 are heated, and the resin material T in the pot 23a melts. The molten resin material T is pushed by the plunger 23 from within the pot 23a into a cavity C1 (see FIGS. 6D and 6E) formed between the upper die 21 and the lower die 22, and hardens while covering the electronic components 31 on the workpiece W1. This resin-moldes the workpiece W1, producing the workpiece W2. Although the transfer molding process has been described above as an example, other molding methods such as compression molding may also be used.

[0019] The unloader 6 is an unloading mechanism that unloads the workpiece W2 from the molding die 20 after resin molding. The unloader 6 is equipped with a pickup mechanism (not shown) that picks up the workpiece W2, and is capable of moving back and forth in the front-to-rear direction and of moving up and down in the up-and-down direction. The unloader 6 moves along guide G between the outer module M3 and the mold modules M2, M2. This allows the unloader 6 to access the outer magazine 8 in the outer module M3 and the molding die 20 in the mold module M2. The unloader 6 receives the workpiece W2 from the lower mold 22 using the pickup mechanism (multiple pairs of claws in this embodiment), transports it to the outer magazine 8, and stores it there.

[0020] The resin molding apparatus 100 includes a control unit 1 that controls the operation of each unit. The control unit 1 includes a central processing unit (CPU), read only memory (ROM), random access memory (RAM), non-volatile memory, etc., and the operation of each unit is performed by the CPU executing a control program stored in the non-volatile memory and / or ROM. The resin molding apparatus 100 also includes user interface devices such as an input device and a display device, which are realized as a touch panel 9 in this embodiment. The control unit 1 and touch panel 9 can be located at any position, not limited to the positions shown in FIG. 1.

[0021] <2. Configuration of molding mechanism> The configuration of the forming mechanism 2 according to this embodiment will be described in detail with reference to Fig. 3. Fig. 3 is a vertical cross-sectional view of the forming mechanism 2 as viewed from the front side.

[0022] The molding mechanism 2 is a mechanism for resin-molding the workpiece W1 using a molding die 20. As shown in FIG. 3 , the molding mechanism 2 includes the molding die 20 (upper die 21 and lower die 22), an upper platen 25 that supports the upper die 21 from above, and a lower platen 26 that supports the lower die 22 from below. The upper die 21 is held hanging down from the upper platen 25, and the lower die 22 is fixed to the lower platen 26. The upper die 21 and the lower die 22 are arranged vertically opposite each other by the upper and lower platens 25, 26. The upper platen 25 is a fixed platen, and the lower platen 26 is a movable platen that moves vertically. A mold clamping mechanism 24 is arranged below the lower platen 26. The control unit 1 controls a drive source (not shown), such as a servo motor, included in the mold clamping mechanism 24 to raise and lower the lower platen 26. The mold clamping mechanism 24 is fixed on a pedestal 19 (fixed platen).

[0023] A cavity C11 is formed in the lower surface of the upper mold 21, and a cavity C12 is formed in the upper surface of the lower mold 22. Although not limited thereto, both of the cavities C11 and C12 are substantially rectangular in plan view and have a depth in the vertical direction. As shown in FIG. 3, when the workpiece W1 is set in the lower mold 22, the electronic component 31 and the exposed member 32 included in the workpiece W1 are accommodated in the cavity C12, and the lower surface (exposed surface 32a) of the exposed member 32 is aligned with the bottom surface of the cavity C12. Meanwhile, when the workpiece W1 is set in the lower mold 22, an edge of the substrate 30 included in the workpiece W1 is placed on the upper surface of the lower mold 22. A portion of the substrate 30 is not accommodated inside the cavity C12 and is positioned outside the cavity C12. When the lower platen 26 rises and the upper mold 21 and the lower mold 22 are closed (clamped), the edge of the substrate 30 is sandwiched between the lower surface of the upper mold 21 and the upper surface of the lower mold 22. Furthermore, when the molds are clamped, a cavity C1 is formed between the upper mold 21 and the lower mold 22 by the cavities C11 and C12 (see FIG. 6D). The cavity C1 is a space in which the workpiece W1 is placed and resin molding is performed. Although not limited thereto, in this embodiment, two workpieces W1 are resin-sealed by one molding mechanism 2, and one cavity C11, C12 is formed in the upper mold 21 and the lower mold 22 for each workpiece W1. That is, two cavities C11 are formed in the upper mold 21, and two cavities C12 are formed in the lower mold 22.

[0024] A pot 23a for temporarily storing resin material T is formed between the two cavities C12 on the upper surface of the lower mold 22. Typically, multiple pots 23a are formed on the lower mold 22. The molding mechanism 2 has a heater (not shown) for heating the molding die 20. When the heater is heated, the resin material T placed in the pot 23a melts. The molding mechanism 2 further has a plunger 23 for supplying the molten resin material T from the pot 23a into the cavity C1. The plunger 23 is controlled by the control unit 1 to extrude the resin material T from the pot 23a. The extruded resin material T passes through a guide path (not shown) formed in at least one of the upper mold 21 and the lower mold 22 and reaches the cavity C1. Within the cavity C1, the resin material T spreads to fill gaps where no components of the workpiece W1 are placed and hardens in that state. This produces the workpiece W2.

[0025] FIG. 4 is an exploded perspective view of a portion of the lower mold 22. As shown in FIGS. 3 and 4, the lower mold 22 includes a first block 41 that forms the side surface of the cavity C12 and a second block 42 that forms the bottom surface of the cavity C12. The number of second blocks 42 is the same as the number of cavities C12. The same applies to the through holes C13, insertion holes C14, supply roll 51, take-up roll 52, set of suction holes 42a, and set of ejector pins 60, which will be described later. The lower mold 22 also includes a holder base 43 that supports the second block 42 from below. The second block 42 is fixed to the holder base 43. The holder base 43 has multiple rods 29 on the side opposite the second block 42. The rods 29 contact the base 28 to support the holder base 43 from below. The holder base 43 is fixed to the base 28 at its edge with bolts, and the base 28 is fixed on the lower platen 26. Therefore, the vertical position of the second block 42 is fixed relative to the lower platen 26. As a result, when the lower platen 26 moves up and down, the second block 42, together with the holder base 43, also moves up and down by the same amount.

[0026] As shown in FIG. 4, the first block 41 has a generally rectangular parallelepiped outer shape, with upper and lower surfaces substantially parallel to the horizontal plane and a thickness in the vertical direction. In FIG. 4, the internal structure of the first block 41, which is not visible from the outside, is partially shown by dotted lines for reference. The cavity C12 is formed in the upper surface of the first block 41, and the bottom surface (depth) of the cavity C12 does not reach the bottom surface of the first block 41. In addition to the cavity C12, the first block 41 further has a through-hole C13 that communicates with the bottom side of the cavity C12. In a plan view, the bottom surface of the cavity C12 is located inside the contour line of the upper surface of the through-hole C13. The through-hole C13 extends horizontally and is a space through which the release film F2 passes horizontally inside the first block 41. The through-hole C13 penetrates the first block 41 in the front-rear direction. The bottom surface (depth) of the through hole C13 also does not reach the bottom surface of the first block 41. Therefore, in front and rear views, the through hole C13 is entirely surrounded by the first block 41. As a result, although the first block 41 has a hollow structure with many cavities (cavities C12, through holes C13, and insertion holes C14, which will be described later), a solid frame is formed, and thus strength is maintained.

[0027] FIG. 5 is a bottom view of the first block 41. In FIG. 5, the position of the through hole C13, which is not visible in bottom view, is indicated by a dotted line for reference. In addition to the cavity C12 and the through hole C13, the first block 41 further has an insertion hole C14 that communicates with the bottom side of the through hole C13. The bottom surface of the insertion hole C14 is located inside the outline of the bottom surface of the through hole C13 in bottom view. The bottom surface of the cavity C12 is located inside the outline of the bottom surface of the insertion hole C14 in bottom view. Both the through hole C13 and the insertion hole C14 are approximately rectangular in plan view and have depth in the vertical direction. The outer shape of the second block 42 is roughly rectangular, has upper and lower surfaces that are approximately parallel to the horizontal plane, and has thickness in the vertical direction. The second block 42 is inserted from below into the insertion hole C14 of the first block 41, and then passes through the insertion hole C14 in the vertical direction and is inserted into the through hole C13. In a plan view, the second block 42 is larger than the portion where the cavity C12 and the through hole C13 communicate (i.e., larger than the bottom surface of the cavity C12), and the second block 42 is not disposed inside the cavity C12.

[0028] The molding mechanism 2 has a vertical movement mechanism 40 that moves the first block 41 in the vertical direction relative to the second block 42. The vertical movement mechanism 40 causes the second block 42 to enter the through hole C13 so that the release film F2 disposed in the through hole C13 is aligned with the bottom surface of the cavity C12. The movement of the first block 41 by the vertical movement mechanism 40 causes the second block 42 to be disposed in the through hole C13, and the release film F2 to be disposed on the bottom surface of the cavity C12. More specifically, in this embodiment, when the vertical movement mechanism 40 lowers the first block 41, the second block 42 rises relative to the first block 41 and enters deeper (higher) into the through hole C13, bringing the two blocks 41, 42 closer to each other. When the upper surface of the second block 42 reaches the upper surface of the through hole C13 (i.e., the bottom surface of the cavity C12), the second block 42 comes into contact with the first block 41 with the release film F2 sandwiched therebetween, and the two blocks 41, 42 cannot move any closer to each other. In other words, when the upper surface of the second block 42 reaches the upper surface of the through hole C13, the two blocks 41, 42 reach the closest position, in which they are in the closest proximity state. In the closest proximity state, the upper surfaces of the through hole C13 and the second block 42 are at the same height, and no gap is formed above the second block 42 within the through hole C13. Therefore, in the closest proximity state, the release film F2 is pushed up from below by the second block 42 and arranged along the bottom surface of the cavity C12. On the other hand, when the vertical movement mechanism 40 raises the first block 41, the first block 41 and the second block 42 move apart. As a result, the upper surface of the through hole C13 is positioned higher than the upper surface of the second block 42, and a gap is formed within the through hole C13 above the second block 42. When the blocks 41, 42 are in the farthest apart state, the second block 42 is positioned outside the through hole C13.

[0029] In this embodiment, the bottom surface of the cavity C12 is located inside the contour line of the upper surface of the second block 42 (the surface of the second block 42 that forms the bottom surface of the cavity C12) in a plan view (see FIGS. 3 and 4). Therefore, in the closest position, the second block 42 covers the entire bottom surface of the cavity C12 via the release film F2. Also, in this embodiment, the release film F2 is placed on the upper surface of the second block 42 so as to cover the entire bottom surface of the cavity C12 in the closest position. Therefore, the release film F2 is firmly brought into contact with both the entire bottom surface of the workpiece W1 before resin molding and the entire bottom surface of the workpiece W2 after resin molding, which are placed in the cavity C12. As a result, the releasability of the workpiece W2 from the lower mold 22 after resin molding is ensured over the entire bottom surface of the workpiece W2. In this embodiment, the side surfaces of the cavity C12, and therefore the side surfaces of the workpieces W1 and W2 placed in the cavity C12, are not covered with the release film F2. In addition, in the closest state, the exposed surface 32a of the exposed member 32 is in contact with the release film F2 pushed up by the second block 42. As a result, resin leakage (flash) onto the exposed surface 32a during resin molding is prevented.

[0030] The forming mechanism 2 further includes a drive source 45 for driving the vertical movement mechanism 40. The drive source 45 is controlled by the control unit 1. In this embodiment, the drive source 45 is configured by a servo motor (hereinafter also designated by the reference symbol 45), although this is not limited thereto. In this embodiment, the vertical movement mechanism 40 is realized as a ball screw driven by the servo motor 45 and a rod attached to the tip of the ball screw. Preferably, a plurality of vertical movement mechanisms 40 are provided to stably support the first block 41, and the plurality of vertical movement mechanisms 40 are driven synchronously by the drive source 45.

[0031] The rod of the vertical movement mechanism 40 extends vertically, and the first block 41 is connected to the upper part of the rod. The lower part of the ball screw of the vertical movement mechanism 40 is connected to the output shaft of a servo motor 45. The servo motor 45 is fixed to the lower platen 26. As a result, when the lower platen 26 moves up and down, not only the second block 42 and the holder base 43 but also the first block 41 moves up and down by the same amount via the vertical movement mechanism 40. When the vertical movement mechanism 40 is driven by the servo motor 45, the first block 41 moves up and down. Meanwhile, the vertical movement mechanism 40 extends vertically through the holder base 43 without interfering with the holder base 43. Therefore, when the vertical movement mechanism 40 is driven, the first block 41 moves up and down, but the holder base 43 and the second block 42 fixed thereto do not move up and down. As a result, the vertical movement mechanism 40 can move the first block 41 and the second block 42 closer to or farther apart in the vertical direction. The vertical movement mechanism 40 passes through not only the holder base 43 but also the lower platen 26, the base 28, an ejector plate 61 and a pin plate 65 (to be described later) without interference.

[0032] Referring again to FIG. 1, the mold module M2 includes a supply roll 51 disposed behind the molding die 20 and a take-up roll 52 disposed in front of the molding die 20. The supply roll 51 is a roll around which the release film F2 is wound, and unwinds the release film F2 so as to feed it into the through hole C13. The take-up roll 52 takes up the release film F2 that has been peeled off from the workpiece W2 after resin molding and passed through the through hole C13. The width of the release film F2 is wider than the width of the second block 42 (the length in the left-right direction in FIGS. 3 and 4) and slightly narrower than the width of the through hole C13. Therefore, the release film F2 is accommodated within the through hole C13 without being bent in the width direction (left-right direction) and is transported while spreading out in a plane within the through hole C13. This allows the release film F2 to be supplied and collected with a simple configuration. The width of the release film F2 does not necessarily have to be wider than the left-right width of the second block 42, but it is preferable that the release film F2 be large enough to cover the suction holes 42a formed in the second block 42.

[0033] 3 and 4, suction holes 42a for adsorbing the release film F2 are formed in the second block 42. The suction holes 42a penetrate the second block 42 in the vertical direction. Although not limited to this, in the present embodiment, a plurality of suction holes 42a are formed in one second block 42. The suction holes 42a are connected to a suction source 44 controlled by the control unit 1. When the suction source 44 sucks air from inside the suction holes 42a, negative pressure is created inside the suction holes 42a, and the release film F2 is adsorbed to the upper surface of the second block 42.

[0034] In this embodiment, the release film F2 is disposed in a planar manner within the through-hole C13, covering the bottom surface of the cavity C12 but not the side surface of the cavity C12. That is, even when suction is performed by the suction source 44, the release film F2 does not deform along the shape of the cavity C12 and does not expand three-dimensionally. Therefore, even if the cavity C12 has a certain depth or more, the release film F2 disposed within the cavity C12 is prevented from stretching and tearing due to the pressure of the resin material T when the molten resin material T is injected into the cavity C12. Consequently, molding defects due to tearing of the release film F2 are also prevented.

[0035] The lower mold 22 is provided with an ejector pin 60 for releasing the workpiece W2 from the cavity C12 after resin molding. The ejector pin 60 is inserted from below into a hole that penetrates the second block 42 in the vertical direction, and is moved by the control unit 1 so as to protrude from the upper surface of the second block 42. Typically, one or more ejector pins 60 are provided per second block 42. In this embodiment, the ejector pin 60 is moved by a drive source of the mold clamping mechanism 24 that raises and lowers the lower platen 26.

[0036] More specifically, the ejector pins 60 are fixed between a pin plate 65 and an ejector plate 61 and protrude upward from the pin plate 65 and the ejector plate 61. The pin plate 65 is fixed on the ejector plate 61. A stopper 62 extending downward from the ejector plate 61 is fixed to the ejector plate 61. A lower portion of the stopper 62 is inserted into a space 28a formed inside the base 28. The stopper 62 is biased downward by a spring 64 also disposed in the space 28a so as to contact the lower surface of the space 28a. A rod 63 extending upward from the base 19 is disposed below the stopper 62 at a position overlapping the stopper 62 in a plan view. The rod 63 is inserted into a hole that passes through the lower platen 26 in the vertical direction. When the mold clamping mechanism 24 raises the lower platen 26, the stopper 62 also rises along with the base 28, and the ejector plate 61 to which the stopper 62 is fixed and the ejector pins 60 fixed to the ejector plate 61 also rise. When the lower platen 26 rises above a predetermined height, the stopper 62 moves away from the rod 63 (see FIGS. 6D to 6F). On the other hand, when the mold clamping mechanism 24 lowers the lower platen 26, the stopper 62, the ejector plate 61, and the ejector pins 60 also descend until the lower platen 26 reaches the predetermined height, and the stopper 62 moves closer to the rod 63. However, when the lower platen 26 descends to the predetermined height, the stopper 62 comes into contact with the rod 63 and cannot descend any further (see FIG. 6G). Therefore, when the mold clamping mechanism 24 further lowers the lower platen 26 below a predetermined height position, the height position of the stopper 62 remains unchanged, and therefore the stopper 62 rises relative to the lower platen 26 (see FIG. 6H). At this time, in the space 28a of the base 28, the spring 64 contracts due to pressure from the rod 63, and the stopper 62 rises relatively. As a result, the ejector pin 60, which is fixed to the stopper 62 via the ejector plate 61, rises relative to the second block 42, which is supported on the lower platen 26 via the rod 29. This causes the ejector pin 60 to protrude from the upper surface of the second block 42.Preferably, a plurality of sets of the stopper 62, the rod 63 and the spring 64 are provided to stably support the ejector plate 61.

[0037] In this embodiment, a release film F1 is placed in the cavity C11 of the upper mold 21. Like the release film F2, the release film F1 is unwound from a supply roll (not shown) and taken up by a take-up roll (not shown). The release film F1 unwound from the supply roll is sent below the cavity C11 and covers the top of the workpieces W1 and W2 set in the cavity C11. After the resin molding, the release film F1 is peeled off from the top of the workpiece W2 and then collected by the take-up roll. Like the release film F2, the release film F1 is adsorbed to the lower surface (surface) of the upper mold 21 by a suction source (not shown) through suction holes (not shown) formed in the upper mold 21.

[0038] <3. Manufacturing method for resin molded products> Next, with reference to Figures 6A to 6H, the flow of a method for manufacturing a resin molded product using the resin molding apparatus 100 will be described, focusing on the molding process in the molding mechanism 2. Figures 6A to 6H are vertical cross-sectional views of the molding mechanism 2 as seen from the front side, showing only the left side portion. When an operator performs a predetermined operation via the touch panel 9, the resin molding apparatus 100 starts manufacturing a resin molded product (workpiece W2).

[0039] First, as shown in FIG. 6A, the control unit 1 controls the mold clamping mechanism 24 to lower the lower platen 26, thereby opening the upper mold 21 and the lower mold 22 (opening the mold). In this state, the control unit 1 controls the drive source 45 to drive the vertical movement mechanism 40, which raises the first block 41 relative to the second block 42 until the second block 42 reaches the outside of the through hole C13. As a result, the release film F2 is not pushed up by the second block 42 within the through hole C13, and a gap is formed between the release film F2 and the upper surface of the through hole C13, releasing the release film F2. In this state, the control unit 1 drives the supply roll 51 and the take-up roll 52 to feed the release film F2, which is unwound from the supply roll 51, into the through hole C13, and position the unused portion of the release film F2 below the cavity C12. Similarly, the control unit 1 also drives the supply roll and take-up roll for the upper mold 21, and positions the unused portion of the release film F1 below the cavity C11. Note that it is also possible to drive only the take-up roll 52 to supply and take up the release film F2. The same applies to the take-up roll for the upper mold 21.

[0040] Next, as shown in FIG. 6B, the control unit 1 drives the vertical movement mechanism 40 using the drive source 45 to lower the first block 41 relative to the second block 42 until the first block 41 reaches the closest position. In the closest position, the upper portion of the second block 42 is positioned within the through-hole C13, and the upper surface of the second block 42 reaches the upper surface of the through-hole C13 (i.e., the bottom surface of the cavity C12). As a result, the release film F2 is pushed up by the second block 42 so as to be aligned with the bottom surface of the cavity C12. At this time, the release film F2 is sandwiched between the first block 41 and the second block 42 and firmly held by the lower mold 22 in a state where it cannot move up and down. After lowering the first block 41, the control unit 1 drives the suction source 44 to create a negative pressure within the suction hole 42a, and the release film F2 is adsorbed to the upper surface of the second block 42. Also, a suction source (not shown) for the upper die 21 is driven, causing the release film F1 to deform three-dimensionally and come into close contact with the inner surfaces (side and bottom surfaces) of the cavity C11.

[0041] Next, as shown in Fig. 6C, the control unit 1 controls the loader 5 to set the workpiece W1 in the cavity C12. In this state, the exposed surface 32a of the exposed member 32 included in the workpiece W1 contacts the release film F2. The control unit 1 also controls the loader 5 to supply the resin material T into the pot 23a (not shown in Fig. 6C).

[0042] 6D, the control unit 1 causes the mold clamping mechanism 24 to raise the lower platen 26, and closes (clamps) the upper mold 21 and the lower mold 22 so that the edge of the workpiece W1 is sandwiched between them. As a result, a cavity C1 is formed between the upper mold 21 and the lower mold 22. The workpiece W1 is firmly sandwiched within the cavity C1 between the upper mold 21 and the lower mold 22. In addition, the release film F2, which is arranged along the bottom surface of the cavity C12, adheres to the bottom surface of the workpiece W1 and, ultimately, to the exposed surface 32a of the exposed member 32.

[0043] Next, as shown in FIG. 6E, while the upper mold 21 and the lower mold 22 are clamped, the control unit 1 resin-moldes the workpiece W1 to produce a resin-molded product, workpiece W2. More specifically, the control unit 1 melts the resin material T in the pot 23a using the heater and extrudes the molten resin material T into the cavity C1 using the plunger 23. The resin material T spreads to fill the gaps in the cavity C1, and after a predetermined time has passed, a workpiece W2 conforming to the shape of the cavity C1 is produced. At this time, the release film F2 is in close contact with the entire exposed surface 32a of the exposed member 32, preventing resin leakage (flash) onto the exposed surface 32a.

[0044] When the above resin molding is completed, the control unit 1 releases the clamping mechanism 24, lowers the lower platen 26, and opens the upper mold 21 and the lower mold 22 (opens the mold), as shown in Fig. 6F. At this time, the workpiece W2 remains housed in the cavity C12 of the lower mold 22 and descends together with the lower mold 22. Because the release film F1 is present on the surface of the upper mold 21, the workpiece W2 is released from the upper mold 21 by the mold opening.

[0045] After the mold clamping is released, the control unit 1 drives the vertical movement mechanism 40 using the drive source 45 to raise the first block 41 relative to the second block 42, as shown in FIG. 6G. That is, the control unit 1 controls the vertical movement mechanism 40 to move the first block 41 away from the second block 42. At this time, the release film F2, which is adsorbed to the upper surface of the second block 42, descends together with the second block 42 relative to the first block 41 and separates from the bottom surface of the cavity C12. As a result, the release film F2 is peeled off from the bottom surface of the workpiece W2 placed in the cavity C12. At this time, a gap is formed within the through hole C13 above the release film F2 adsorbed to the upper surface of the second block 42. In this state, the control unit 1 stops the suction source 44 from adsorbing the release film F2. The operation of FIG. 6G can be performed while the lower platen 26 is being lowered.

[0046] Next, as shown in FIG. 6H , the control unit 1 controls the ejector pins 60 to protrude from the second block 42 while the first block 41 and the second block 42 are separated from each other. More specifically, the control unit 1 lowers the lower platen 26, and thus the second block 42, whose vertical position relative to the lower platen 26 is fixed, by the mold clamping mechanism 24. Meanwhile, the ejector pins 60 descend to a predetermined height as the lower platen 26 descends. However, even if the lower platen 26 continues to descend, the stopper 62 prevents the ejector pins 60 from descending any further. As a result, the ejector pins 60 rise relative to the second block 42 and protrude from the upper surface of the second block 42. The ejector pins 60 protruding from the upper surface of the second block 42 enter the cavity C12 and push up the bottom surface of the workpiece W2, thereby releasing the workpiece W2 from the lower mold 22.

[0047] When the ejector pins 60 protrude, they not only push up the workpiece W2 but also the release film F2. However, at this time, a gap exists above the release film F2 within the through-holes C13. Therefore, when the release film F2 is pushed up by the ejector pins 60, it can escape further upward within this gap. As a result, the release film F2 is prevented from being torn due to being pushed up by the ejector pins 60. Furthermore, in this embodiment, the above-described protrusion of the ejector pins 60 is performed in a state where the suction source 44 has stopped adsorbing the release film F2. Therefore, when the release film F2 is pushed up by the ejector pins 60, no resistance due to the suction force is applied to the release film F2. As a result, the release film F2 is less likely to be torn.

[0048] The workpiece W2 released from the lower mold 22 is removed from the molding die 20 by the unloader 6, and after unnecessary resin such as culls and runners is removed by a removal mechanism (not shown), the workpiece W2 is transported to the out-magazine 8. This completes the operation for manufacturing a resin molded product.

[0049] <4. Features> In the above embodiment, the cavity C12 for accommodating the workpieces W1 and W2 is formed in the lower mold 22. The lower mold 22 includes a first block 41 and a second block 42. The first block 41 forms the side surfaces of the cavity C12, and the second block 42 forms the bottom surface of the cavity C12. The first block 41 is formed with a horizontally extending through-hole C13 that communicates with the bottom surface of the cavity C12 and allows a release film F2 to pass through. The first block 41 is also moved vertically relative to the second block 42 by the vertical movement mechanism 40. As the first block 41 is moved by the vertical movement mechanism 40, the second block 42 is positioned within the through-hole C13, and the release film F2 positioned within the through-hole C13 is positioned on the bottom surface of the cavity C12. With this configuration, the release film F2 covers the bottom surface of the cavity C12 but does not cover the side surfaces of the cavity C12. Therefore, the release film F2 does not deform along the shape of the cavity C12 and does not expand three-dimensionally. Therefore, even if the cavity C12 has a certain depth or more, the release film F2 placed in the cavity C12 is prevented from stretching and breaking. Consequently, molding defects due to breaking of the release film F2 are also prevented.

[0050] <5. Variations> Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment and various modifications are possible without departing from the spirit of the present invention. The gist of the following modifications can be combined as appropriate.

[0051] <5-1> In the above embodiment, the lower mold 22 is divided into the first block 41 and the second block 42, but a similar configuration can also be adopted for the upper mold 21 instead of or in addition to the lower mold 22. That is, the upper mold 21 may be configured to be generally symmetrical in the vertical direction to the above-mentioned lower mold 22. In this case, the ejector pins 60 are also similarly arranged in the upper mold 21 so as to be symmetrical in the vertical direction to the above-mentioned configuration.

[0052] <5-2> In the above embodiment, the cavity C1 was formed by the cavity C11 of the upper mold 21 and the cavity C12 of the lower mold 22, but one of the cavity C11 of the upper mold 21 and the cavity C12 of the lower mold 22 may be omitted, and the cavity C1, which is the molding space, may be formed by only the other.

[0053] <5-3> The first block 41 may be formed by assembling a plurality of divided parts. For example, the first block 41 may be formed by assembling a plurality of parts 41a and 41b connected in the vertical direction, as shown in Fig. 7. In this case, the workability of the first block 41 may be improved.

[0054] <5-4> As shown in Fig. 8, multiple rows of first blocks 41 may be arranged in the front-rear direction. In this case, these first blocks 41 may be configured as a single unit, or multiple separate first blocks 41 may be assembled and fixed together. Furthermore, the combination of multiple rows of first blocks 41 may be configured by assembling multiple parts that are separated in the left-right direction, as shown by the dotted lines in Fig. 8. In this case, the cavity C12, the through hole C13, the insertion hole C14, and the pot 23a are formed in separate components.

[0055] <5―5> In the above embodiment, after the mold clamping is released, the suction source 44 stops suctioning the release film F2, but this suctioning of the release film F2 may be stopped simultaneously with or before the mold clamping is released.

[0056] <5―6> In the above embodiment, when the release film F2 is fed from the supply roll 51 into the through hole C13, the first block 41 is raised relative to the second block 42 by the vertical movement mechanism 40 until the second block 42 reaches the outside of the through hole C13. However, it is sufficient that the first block 41 is raised to an extent that a gap is formed above the second block 42 within the through hole C13, and the second block 42 does not have to reach the outside of the through hole C13.

[0057] <5-7> In the above embodiment, the release film F2 was adsorbed onto the upper surface of the second block 42 after the first block 41 was lowered, but the release film F2 may also be adsorbed onto the upper surface of the second block 42 before or simultaneously with the lowering of the first block 41.

[0058] <6. Notes> <Technology 1> (composition) Lower mold and an upper mold disposed opposite the lower mold; a mold clamping mechanism that clamps the lower mold and the upper mold together; A resin molding apparatus comprising: One of the lower mold and the upper mold has a cavity in which a workpiece to be resin-molded is accommodated, and includes a first block that forms a side surface of the cavity and a second block that forms a bottom surface of the cavity; the resin molding device further includes a vertical movement mechanism that moves the first block vertically relative to the second block, the first block has a through-hole that communicates with the bottom side of the cavity and extends horizontally to allow a release film to pass through; the second block is disposed in the through hole by the movement of the first block by the vertical movement mechanism, and the release film disposed in the through hole is disposed on the bottom surface of the cavity. Resin molding equipment.

[0059] (Effects, etc.) In this resin molding device, the release film covers the bottom surface of the cavity in which the workpiece is housed, but does not cover the side surfaces of the cavity. Therefore, the release film does not deform to fit the shape of the cavity and does not expand three-dimensionally. Therefore, even if the cavity is deep enough, the release film placed in the cavity is prevented from stretching and tearing.

[0060] <Technology 2> (composition) The lower mold and the upper mold, whichever has the cavity, are provided with one or more pins that are movable so as to protrude from the second block and are used to release the work from the cavity after resin molding. The resin molding device according to technology 1.

[0061] (Effects, etc.) In this resin molding device, the release film covers the bottom surface of the cavity, but even if the side surface of the cavity is not covered, the workpiece after resin molding is poked by a pin protruding from the second block, making it easy to release the workpiece from the cavity.

[0062] <Technology 3> (composition) a drive source for driving the vertical movement mechanism; Further provided with The resin molding device according to Technology 1 or 2.

[0063] (Effects, etc.) In this resin molding device, the vertical movement mechanism receives power from the drive source and can move the first block vertically relative to the second block.

[0064] <Technology 4> (composition) the bottom surface of the cavity is located inside a contour line of a surface of the second block that forms the bottom surface of the cavity in a plan view. The resin molding device according to any one of techniques 1 to 3.

[0065] (Effects, etc.) In this resin molding device, the second block can cover the entire bottom surface of the cavity. This makes it easy to release the resin-molded workpiece from the second block. Furthermore, when the bottom surface of the workpiece is brought into contact with the second block for exposed molding, resin leakage (flash) onto the exposed surface can be prevented.

[0066] <Technology 5> (composition) a supply roll that unwinds the release film so as to feed it into the through hole; a take-up roll that takes up the release film that has been peeled off from the workpiece after resin molding and passed through the through-holes; The resin molding device according to any one of techniques 1 to 4, further comprising:

[0067] (Effects, etc.) In this resin molding device, the release film can be smoothly fed into the through-hole and recovered from the through-hole.

[0068] <Technology 6> (composition) a control unit that controls the up-and-down movement mechanism to move the first block so as to separate from the second block after releasing the clamping mechanism by the clamping mechanism after the resin molding of the workpiece, and controls the pin to protrude from the second block in a state where the first block and the second block are separated from each other. The resin molding device according to Technology 2 further comprises:

[0069] (Effects, etc.) In this resin molding device, the workpiece is poked by the pin through the release film while the first block and the second block are separated, i.e., while a gap exists above the release film in the through-hole. Therefore, when the release film is poked by the pin, it can escape within the gap. This prevents the release film from being torn by the pin.

[0070] <Technology 7> (composition) A method for manufacturing a resin molded product using the resin molding apparatus according to technique 2 or 6, The lower mold and the upper mold are clamped together by the mold clamping mechanism, and resin molding of the workpiece is performed. After the resin molding of the workpiece, the clamping mechanism is released from the clamping mechanism; After releasing the mold clamping mechanism, the up-down movement mechanism is controlled to move the first block away from the second block; With the first block and the second block spaced apart, the pin is moved to project from the second block, thereby releasing the workpiece from the cavity. A method for manufacturing a resin molded product, comprising:

[0071] (Effects, etc.) In this method for manufacturing a resin molded product, the workpiece is poked by a pin through the release film while the first block and the second block are separated from each other, i.e., while a gap exists above the release film in the through-hole. Therefore, when poked by the pin, the release film can escape within the gap. This prevents the release film from being torn by the pin.

[0072] <Technology 8> (composition) A method for manufacturing a resin molded product using the resin molding apparatus according to technique 2 or 6, the second block has a suction hole formed therein, the suction hole being connected to a suction source and adapted to adsorb the release film; The manufacturing method includes: The lower mold and the upper mold are clamped together by the mold clamping mechanism, and resin molding of the workpiece is performed. After the resin molding of the workpiece, the clamping mechanism is released from the clamping mechanism; After releasing the mold clamping mechanism, the suction source stops adsorbing the release film, With the suction stopped, the pin is moved to project from the second block, and the workpiece is released from the cavity. A method for manufacturing a resin molded product, comprising:

[0073] (Effects, etc.) In this method for manufacturing resin molded products, the workpiece is poked by the pin through the release film while the suction source is stopped. Therefore, when the release film is poked by the pin, no resistance due to the suction force is applied to the release film. As a result, tearing of the release film due to the pin poking is prevented.

[0074] <Technology 9> (composition) Using the resin molding device according to any one of techniques 1 to 6, clamping the lower mold and the upper mold by the mold clamping mechanism so as to sandwich the workpiece between the lower mold and the upper mold; While the lower mold and the upper mold are clamped by the mold clamping mechanism, the workpiece is resin molded to manufacture a resin molded product. A method for manufacturing a resin molded product, comprising:

[0075] (Effects, etc.) In this method for producing a resin molded product, molding defects due to tearing of the release film are prevented. [Explanation of symbols]

[0076] 100 Resin molding equipment 1. Control section 2 Molding mechanism 5 Loader 6 Unloader 7 In Magazine 8 Out Magazine 9 Touch Panel 19 Pedestal 20 mold 21 Upper mold 22 Lower mold 23 Plunger 23a Pot 24 Mold clamping mechanism 25 Upper platen 26 Lower platen 28 Foundation 29 Rod 30 boards 31 Electronic Components 32 Exposed parts 32a Exposed surface 35 Molding resin 40 Up and down movement mechanism 41 Block 1 42 Block 2 42a Suction hole 44 Suction source 43 Holder base 45 Drive source (servo motor) 51 Supply Roll 52 Winding roll 60 Ejector pin 61 Ejector plate 62 Stopper 63 Rod 64 Spring 65 pin plate 70 Resin supply mechanism 71 Alignment mechanism 71a Turntable 72 Transport mechanism C1, C11, C12 cavities C13 through hole C14 insertion hole F1, F2 release film M1 In-Module M2 Molded Module M3 Out Module G Guide W1 Workpiece (molding object) W2 Workpiece (plastic molded product) T Resin material

Claims

1. Lower mold and an upper mold disposed opposite the lower mold; a mold clamping mechanism that clamps the lower mold and the upper mold together; A resin molding apparatus comprising: one of the lower mold and the upper mold has a cavity in which a workpiece to be resin-molded is accommodated, and includes a first block that forms a side surface of the cavity and a second block that forms a bottom surface of the cavity; the resin molding device further includes a vertical movement mechanism that moves the first block vertically relative to the second block, the first block has a through-hole that communicates with the bottom surface side of the cavity and extends horizontally to allow a release film to pass through; The movement of the first block by the vertical movement mechanism causes the second block to enter the through hole, whereby the second block is disposed in the through hole, the second block forms the bottom surface of the cavity, and the release film disposed in the through hole is pressed by the second block, and the release film is disposed along the bottom surface of the cavity. Resin molding equipment.

2. The lower mold and the upper mold, whichever has the cavity, are provided with one or more pins that are movable so as to protrude from the second block and are used to release the work from the cavity after resin molding. The resin molding device according to claim 1 .

3. a drive source for driving the vertical movement mechanism; Further provided with The resin molding device according to claim 1 .

4. the bottom surface of the cavity is located inside a contour line of a surface of the second block that forms the bottom surface of the cavity in a plan view. The resin molding device according to claim 1 .

5. a supply roll that unwinds the release film so as to feed it into the through hole; a take-up roll that takes up the release film that has been peeled off from the workpiece after resin molding and passed through the through-holes; The resin molding apparatus according to claim 1 , further comprising:

6. a control unit that controls the up-and-down movement mechanism to move the first block so as to separate from the second block after releasing the clamping mechanism by the clamping mechanism after the resin molding of the workpiece, and controls the pin to protrude from the second block in a state where the first block and the second block are separated from each other. The resin molding apparatus according to claim 2 , further comprising:

7. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 2 or 6, The lower mold and the upper mold are clamped together by the mold clamping mechanism, and resin molding of the workpiece is performed. After the resin molding of the workpiece, the clamping mechanism is released from the clamping mechanism; After releasing the mold clamping mechanism, the up-down movement mechanism is controlled to move the first block away from the second block; With the first block and the second block spaced apart, the pin is moved to project from the second block, thereby releasing the workpiece from the cavity. A method for manufacturing a resin molded product, comprising:

8. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 2 or 6, the second block has a suction hole formed therein, the suction hole being connected to a suction source and adapted to adsorb the release film; The manufacturing method includes: The lower mold and the upper mold are clamped together by the mold clamping mechanism, and resin molding of the workpiece is performed. After the resin molding of the workpiece, the clamping mechanism is released from the clamping mechanism; After releasing the mold clamping mechanism, the suction source stops adsorbing the release film, With the suction stopped, the pin is moved to project from the second block, and the workpiece is released from the cavity. A method for manufacturing a resin molded product, comprising:

9. Using the resin molding device according to any one of claims 1 to 6, clamping the lower mold and the upper mold by the mold clamping mechanism so as to sandwich the workpiece between the lower mold and the upper mold; While the lower mold and the upper mold are clamped by the mold clamping mechanism, the workpiece is resin molded to manufacture a resin molded product. A method for manufacturing a resin molded product, comprising:

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