Semiconductor device and vehicle

Abstract

To improve positioning accuracy between a case and a cooler while suppressing generation of metal powder.SOLUTION: A semiconductor device (1) includes a resin portion (3) covering a periphery of a semiconductor element (6), and a cooler (10) arranged below the semiconductor element. The cooler includes a top plate (11) attached to a lower surface of the resin portion. The resin portion includes a protrusion (39) that protrudes downward from a lower surface of an outer peripheral edge. The protrusion includes a first linear portion (39a) extending in a predetermined direction in a plan view, and a first curved portion (39c) connected to the first linear portion and curved so as to be convex in a direction away from the first linear portion. The top plate has a notch (15) that is engageable with the protrusion. The resin portion and the top plate are bonded via an adhesive (B).SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device and a vehicle. [Background technology]

[0002] 2. Description of the Related Art Semiconductor modules have substrates on which semiconductor elements such as IGBTs (Insulated Gate Bipolar Transistors), power MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), and FWDs (Free Wheeling Diodes) are mounted, and are used in inverter devices and the like.

[0003] In this type of semiconductor device, for example, in Patent Documents 1 to 3, a semiconductor element is placed on an insulating substrate (which may also be called a laminated substrate), and a metal wiring plate for wiring (which may also be called a terminal connection portion, lead frame, or external electrode) is placed on the upper surface electrode of the semiconductor element. The semiconductor element is surrounded by a case, and a cooler (e.g., a heat sink) is attached to the underside of the case.

[0004] Specifically, in Patent Document 1, a protrusion is provided on the bottom of the outer frame of the device, and the protrusion is inserted into an insertion hole in the heat dissipation fin. In Patent Document 2, a protrusion is provided on the bottom of the frame body, and the protrusion is inserted into an insertion hole formed on the placement surface of the heat sink. In Patent Document 3, a convex locking portion is provided on the bottom of the frame member, and the locking portion engages with an engaging portion on the circuit board. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 62-7145 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-123659 [Patent Document 3] Japanese Patent Application Laid-Open No. 2005-354118 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in order to assemble the case and the cooler that constitute a part of the semiconductor module, alignment is required. For example, as mentioned above, a configuration has been disclosed in which a positioning protrusion is provided on the case side and an engaging hole or notch is provided on the cooler side, and alignment is achieved by mating them together.

[0007] However, the protrusions on the case and the holes or notches on the cooler are often expected to be made of metal. In this case, the metal materials may rub against each other when they are engaged, generating metal powder. While ensuring sufficient clearance between the components is one way to prevent this, this is not desirable from the perspective of positioning accuracy.

[0008] The present invention has been made in consideration of these points, and one of its objects is to provide a semiconductor device and a vehicle that can improve the positioning accuracy between the case and the cooler while suppressing the generation of metal powder. [Means for solving the problem]

[0009] A semiconductor device according to one embodiment of the present invention comprises a resin part that covers the periphery of a semiconductor element and a cooler that is arranged below the semiconductor element, the cooler having a top plate attached to the underside of the resin part, the resin part having a protrusion that protrudes downward from the underside of the outer periphery, the protrusion including a first straight portion that extends in a predetermined direction in a planar view, and a first curved portion that is connected to the first straight portion and curves so as to be convex in a direction away from the first straight portion, the top plate having a notch that can engage with the protrusion, and the resin part and the top plate are joined via an adhesive. [Effects of the Invention]

[0010] According to the present invention, it is possible to improve the positioning accuracy between the case and the cooler while suppressing the generation of metal powder. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a plan view of a semiconductor device according to an embodiment of the present invention as viewed from above; [Figure 2] FIG. 2 is a plan view in which the sealing resin in FIG. 1 is omitted. [Figure 3] FIG. 3 is a partial enlarged view of one phase of FIG. 2. [Figure 4] 2 is a cross-sectional view of the semiconductor device shown in FIG. 1 taken along line XX. [Figure 5] 2 is a cross-sectional view of the semiconductor device shown in FIG. 1 taken along line YY. [Figure 6] 1 is an equivalent circuit diagram of a semiconductor device according to an embodiment of the present invention; [Figure 7] FIG. 1 is a schematic perspective view of a cooler according to an embodiment of the present invention. [Figure 8] FIG. 8 is a schematic exploded perspective view of the cooler shown in FIG. 7. [Figure 9] FIG. 2 is a rear view of the semiconductor device according to the present embodiment. [Figure 10] FIG. 10 is an enlarged view of the periphery of part A in FIG. 9. [Figure 11] FIG. 10 is an enlarged view of the vicinity of part B in FIG. 9. [Figure 12] FIG. 5 is a cross-sectional view of a semiconductor device according to a modified example, corresponding to FIG. [Figure 13] FIG. 6 is a cross-sectional view of a semiconductor device according to a modified example, corresponding to FIG. 5. [Figure 14] 11 is a partially enlarged view of a semiconductor device according to a modified example, corresponding to FIG. 10. FIG. [Figure 15] FIG. 10 is a plan view of a semiconductor device according to another modified example. [Figure 16] FIG. 16 is a cross-sectional view of the semiconductor device shown in FIG. [Figure 17] 1 is a schematic plan view showing an example of a vehicle to which a semiconductor device of the present invention is applied; DETAILED DESCRIPTION OF THE INVENTION

[0012] Semiconductor devices to which the present invention can be applied will be described below. Fig. 1 is a plan view of a semiconductor device according to this embodiment as viewed from above. Fig. 2 is a plan view in which the sealing resin of Fig. 1 is omitted. Fig. 3 is a partial enlarged view focusing on one phase of Fig. 2. Fig. 4 is a cross-sectional view of the semiconductor device shown in Fig. 1 taken along line XX. Fig. 5 is a cross-sectional view of the semiconductor device shown in Fig. 1 taken along line YY. Fig. 6 is an equivalent circuit diagram of the semiconductor device according to this embodiment.

[0013] In the following figures, the longitudinal direction of the semiconductor module (cooler or metal wiring board) is defined as the X direction, the lateral direction of the semiconductor module (cooler or metal wiring board) as the Y direction, and the height direction (thickness direction of the board) as the Z direction. The longitudinal direction of the semiconductor module indicates the direction in which multiple wiring boards are arranged. The X, Y, and Z axes shown in the figures are perpendicular to each other and form a right-handed system. In some cases, the X direction may be referred to as the left-right direction, the Y direction as the front-back direction, and the Z direction as the up-down direction. Furthermore, the +Z direction may be referred to as the up direction, and the -Z direction as the down direction. The +Z side may be referred to as the high position, and the -Z side as the low position. These directions (front-back, left-right, up-down, and down) and height are terms used for convenience of explanation, and their correspondence with the X, Y, and Z directions may change depending on the mounting orientation of the semiconductor module. For example, the heat dissipation side (cooler side) of the semiconductor module will be referred to as the bottom side, and the opposite side will be referred to as the top side. In this specification, a plan view refers to the top or bottom of a semiconductor module viewed from the Z direction. The aspect ratios and relative sizes of components in each drawing are merely schematic diagrams and may not necessarily match. For ease of explanation, the relative sizes of components may be exaggerated.

[0014] A semiconductor device 100 according to this embodiment is applied to a power conversion device such as an inverter for an industrial or automotive motor. As shown in Figures 1 to 5, the semiconductor device 100 is configured by placing a semiconductor module 1 on the upper surface of a cooler 10. Note that the cooler 10 has an optional configuration relative to the semiconductor module 1.

[0015] The cooler 10 is for dissipating heat from the semiconductor module 1 to the outside, and is formed in a rectangular shape when viewed from above. The detailed configuration of the cooler 10 will be described later.

[0016] The semiconductor module 1 includes a plurality of (three in this embodiment) semiconductor units 2, a case 3 that houses the plurality of semiconductor units 2, and a sealing resin 4 that is poured into the case 3.

[0017] The semiconductor unit 2 includes a laminated substrate 5 and a semiconductor element 6 disposed on the laminated substrate 5. In this embodiment, three semiconductor units 2 are arranged side by side in the X direction. The three semiconductor units 2 constitute, for example, a U phase, a V phase, and a W phase from the positive side in the X direction, and together form a three-phase inverter circuit. The semiconductor units 2 may also be called power cells.

[0018] The laminated substrate 5 is formed of, for example, a DCB (Direct Copper Bonding) substrate, an AMB (Active Metal Brazing) substrate, or a metal-based substrate. The laminated substrate 5 is formed by laminating an insulating plate 50, a heat sink 51, and a plurality of wiring boards 52, and is formed into a rectangular shape as a whole in a plan view.

[0019] Specifically, the insulating plate 50 is formed as a plate-like body having an upper surface and a lower surface, and has a rectangular shape in plan view that is long in the X direction. The insulating plate 50 may be formed from a ceramic material such as aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), aluminum oxide (Al2O3), and zirconium oxide (ZrO2).

[0020] The insulating plate 50 may be formed of, for example, a thermosetting resin such as an epoxy resin or a polyimide resin, or a composite material in which a thermosetting resin is filled with glass or a ceramic material. The insulating plate 50 is preferably flexible and may be formed of, for example, a material containing a thermosetting resin. The insulating plate 50 may also be called an insulating layer or an insulating film.

[0021] The heat sink 51 has a predetermined thickness in the Z direction and a rectangular shape in plan view that is long in the Y direction. The heat sink 51 is formed of a metal plate with good thermal conductivity, such as copper or aluminum. The heat sink 51 is disposed on the lower surface of the insulating plate 50. The lower surface of the heat sink 51 is the surface to be attached to the cooler 10 to which the semiconductor module 1 is attached, and also functions as a heat dissipation surface (heat dissipation area) for dissipating heat from the semiconductor module 1. The heat sink 51 is bonded to the upper surface of the cooler 10 via a bonding material (not shown) such as solder. The heat sink 51 may be disposed on the upper surface of the cooler 10 via a thermally conductive material such as thermal grease or thermal compound.

[0022] The multiple wiring boards 52 (three in this embodiment) each have a predetermined thickness and are formed in the shape of an electrically independent island (for example, rectangular in plan view). The three wiring boards 52 are arranged on the upper surface of the insulating plate 50. Note that the shape, number, and placement of the wiring boards 52 are not limited to these and can be changed as appropriate. These wiring boards 52 may be formed from a metal plate with good thermal conductivity, such as copper or aluminum. The wiring boards 52 may also be called a circuit layer or a circuit pattern.

[0023] A semiconductor element 6 is disposed on the upper surface of a predetermined wiring board 52 via a bonding material (not shown) such as solder. The bonding material may be any conductive material, such as solder or a sintered metal material. The semiconductor element 6 is formed of a semiconductor substrate such as silicon (Si) and has a rectangular shape in a plan view.

[0024] In addition, the semiconductor element 6 may be composed of a wide bandgap semiconductor element (which may also be called a wide bandgap semiconductor element) formed from a wide bandgap semiconductor substrate such as silicon carbide (SiC), gallium nitride (GaN), diamond, etc., in addition to the silicon mentioned above.

[0025] The semiconductor element 6 may be a switching element such as an IGBT (Insulated Gate Bipolar Transistor) or a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), or a diode such as an FWD (Free Wheeling Diode).

[0026] In this embodiment, the semiconductor element 6 is configured by an RC (Reverse Conducting)-IGBT element that combines the functions of an IGBT (Insulated Gate Bipolar Transistor) element and an FWD (Free Wheeling Diode) element (see, for example, FIG. 9).

[0027] The semiconductor element 6 is not limited to this, and may be configured by combining the above-mentioned switching elements, diodes, etc. For example, an IGBT element and an FWD element may be configured separately. Furthermore, the semiconductor element 6 may be an RB (Reverse Blocking)-IGBT or the like that has sufficient withstand voltage against reverse bias.

[0028] The shape, number, and location of the semiconductor elements 6 can be changed as appropriate. For example, in this embodiment, two semiconductor elements 6 are arranged per phase. Furthermore, as shown in FIG. 6, one of the two semiconductor elements 6 may form an upper arm, and the other semiconductor element 6 may form a lower arm.

[0029] The semiconductor element 6 configured in this manner has an upper surface and a lower surface in the XY plane, and electrodes are formed on each surface. For example, a main electrode 60 and a control electrode 61 are formed on the upper surface of the semiconductor element 6, and a main electrode (not shown) is also formed on the lower surface of the semiconductor element 6. The main electrode 60 on the upper surface and the main electrode on the lower surface are electrodes through which a main current flows, and are formed in a rectangular shape in plan view having an area that occupies most of the upper surface of the semiconductor element 6. On the other hand, the control electrode 61 is formed in a rectangular shape in plan view that is sufficiently smaller than the main electrode 60. For example, in this embodiment, multiple (five) control electrodes 61 are arranged side by side, biased towards one side of the semiconductor element 6. The arrangement of the electrodes is not limited to this and can be changed as appropriate.

[0030] For example, if the semiconductor element 6 is a MOSFET element, the main electrode on the upper surface side may be called a source electrode, and the main electrode on the lower surface side may be called a drain electrode. Also, if the semiconductor element 6 is an IGBT element, the main electrode on the upper surface side may be called an emitter electrode, and the main electrode on the lower surface side may be called a collector electrode.

[0031] The control electrode 61 may also include a gate electrode. The gate electrode is an electrode for controlling a gate for turning on and off the main current. The control electrode 61 may also include an auxiliary electrode. For example, the auxiliary electrode may be an auxiliary source electrode or an auxiliary emitter electrode that is electrically connected to the main electrode on the upper surface side and serves as a reference potential for the gate potential. The auxiliary electrode may also be a temperature sensing electrode that measures the temperature of the semiconductor element. Such electrodes (main electrode 60 and control electrode 61) formed on the upper surface of the semiconductor element 6 may be collectively referred to as upper surface electrodes, and electrodes formed on the lower surface of the semiconductor element 6 may be referred to as lower surface electrodes.

[0032] Furthermore, the semiconductor element 6 in this embodiment may be a so-called vertical switching element in which functional elements such as transistors are formed in the thickness direction of a semiconductor substrate, or may be a horizontal switching element in which these functional elements are formed in the surface direction.

[0033] The upper surface (main electrode 60) of the semiconductor element 6 and the upper surface of the other wiring board 52 are electrically connected by a metal wiring board 7. The metal wiring board 7 constitutes a main current wiring member and functions as part of the path of the main current flowing inside the semiconductor module 1 (main current path).

[0034] The metal wiring board 7 is formed as a plate-like body having an upper surface and a lower surface. The metal wiring board 7 is formed from a metal such as copper, a copper alloy, an aluminum alloy, or an iron alloy. The metal wiring board 7 is formed into a predetermined shape, for example, by press working. Note that the shape of the metal wiring board 7 shown below is merely an example and can be modified as appropriate. The metal wiring board 7 may also be called a lead frame.

[0035] The metal wiring board 7 according to this embodiment has a crank shape that is bent multiple times when viewed from the side. Specifically, the metal wiring board 7 includes a first bonding portion 70, a second bonding portion 71, and a connecting portion 72. The first bonding portion 70 is bonded to the upper surface of the semiconductor element 6 via a bonding material (not shown). The second bonding portion 71 is bonded to the upper surface of another wiring board 52 via a bonding material (not shown). The bonding material may be any conductive material, such as solder or a sintered metal material. The connecting portion 72 connects the first bonding portion 70 and the second bonding portion 71.

[0036] The shape, number, and arrangement of the metal wiring boards 7 described above are merely examples, and are not limited to these and can be changed as appropriate. In this embodiment, the semiconductor elements 6, the metal wiring boards 7, and main terminals described below may form, for example, an inverter circuit as shown in FIG. 6, as will be described in detail later.

[0037] The laminated substrate 5, the semiconductor element 6, and the metal wiring board 7 are surrounded by a case 3. The case 3 has a cylindrical or frame shape that is rectangular in plan view. The case 3 is formed of, for example, a thermoplastic resin. Examples of the thermoplastic resin include polyphenylene sulfide (PPS) resin, polybutylene terephthalate (PBT) resin, polybutylene succinate (PBS) resin, polyamide (PA) resin, polyether ether ketone (PEEK) resin, and acrylonitrile butadiene styrene (ABS) resin. An inorganic filler may be mixed into the resin to improve strength and / or functionality. The case 3 is formed by injection molding using such a thermoplastic resin. The case 3 may also be called a resin case or a resin part.

[0038] The internal space defined by the case 3 is filled with a sealing resin 4. The sealing resin 4 may be filled up to the top end of the case 3. This seals the various components (three semiconductor units 2 (the laminated substrate 5 and the semiconductor element 6), the metal wiring board 7, the wiring member W, etc.) arranged inside the case 3.

[0039] The sealing resin 4 may be made of, for example, a thermosetting resin. The sealing resin 4 preferably contains at least one of epoxy resin, silicone resin, phenol resin, and melamine resin. For example, epoxy resin mixed with inorganic filler is suitable for the sealing resin 4 in terms of insulation, heat resistance, and heat dissipation.

[0040] The case 3 is formed in a rectangular frame shape with an opening 3a in the center. More specifically, the case 3 has a pair of side walls 30 facing each other in the X direction and a pair of side walls 31 facing each other in the Y direction, and the ends of each side wall 30 are connected to form the rectangular frame shape. The pair of side walls 31 are longer than the pair of side walls 30.

[0041] The pair of side walls 31 are connected by two partition walls 32 extending in the Y direction. This divides the interior space of the case 3 into three spaces aligned in the X direction. A semiconductor unit 2 and a metal wiring board 7 are housed in each space. That is, three semiconductor units 2 and metal wiring boards 7 are housed in the space defined by the frame-shaped case 3. The lower end of the case 3 is adhered to the upper surface of the cooler 10 (top plate 11, described later) via adhesive B. The adhesive B is preferably an epoxy-based or silicone-based adhesive, for example. The detailed structure of the case 3 will be described later.

[0042] The case 3 is provided with main terminals for external connection (P terminal 80, N terminal 81, M terminal 82) and a control terminal 83 for control. Of a pair of side walls 31 facing each other in the short side direction (Y direction) of the case 3, recesses 33 and 34 that are rectangular in plan view are formed in the side wall 31 located on the negative side in the Y direction.

[0043] A P terminal 80 (a nut portion 80a, which will be described later) is disposed in the recess 33. One P terminal 80 is disposed for each phase. An end portion of the P terminal 80 (a tip end of a plate-like portion 80b, which will be described later) is connected to a predetermined wiring board 52 via a bonding material such as solder.

[0044] The P terminal 80 is formed by integrally molding or connecting a nut portion 80a and a plate-shaped portion 80b. The nut portion 80a is formed as a square nut with a predetermined thickness. A screw hole 80c is formed in the center of the nut portion 80a, penetrating in the thickness direction. The nut portion 80a is provided on one end (base end) side of the plate-shaped portion 80b.

[0045] The plate-shaped portion 80b has a flat plate shape with an upper surface and a lower surface. The plate-shaped portion 80b has an elongated shape that is long in the Y direction in a plan view. The other end (tip) of the plate-shaped portion 80b is joined to a predetermined wiring board 52 via a joining material (not shown).

[0046] Similarly, N terminals 81 (nut portions 81a described later) are arranged in recesses 34. One N terminal 81 is arranged for each phase. An end portion (a tip end of plate-shaped portion 81b) of N terminal 81 is connected to a predetermined wiring board 52 via a bonding material such as solder.

[0047] The N terminal 81 is formed by integrally molding or connecting a nut portion 81a and a plate-like portion 81b. The nut portion 81a is formed as a square nut with a predetermined thickness. A screw hole 81c is formed in the center of the nut portion 81a, penetrating in the thickness direction. The nut portion 81a is provided on one end (base end) side of the plate-like portion 81b.

[0048] The plate-shaped portion 81b has a flat plate shape with an upper surface and a lower surface. The plate-shaped portion 81b has an elongated shape that is long in the Y direction in a plan view. The other end (tip) of the plate-shaped portion 81b is joined to a predetermined wiring board 52 via a joining material (not shown).

[0049] Of a pair of side walls 31 facing each other in the short-side direction (Y direction) of the case 3, the side wall 31 on the positive side in the Y direction has a recess 35 that is rectangular in plan view. M terminals 82 (nut portions 82a, described later) are arranged in the recess 35. One M terminal 82 is arranged for each phase. An end of the M terminal 82 (the tip of the plate-shaped portion 82b) is connected to a predetermined wiring board 52 via a bonding material such as solder.

[0050] The M terminal 82 is formed by integrally molding or connecting a nut portion 82a and a plate-shaped portion 82b. The nut portion 82a is formed as a square nut with a predetermined thickness. A screw hole 82c is formed in the center of the nut portion 82a, penetrating in the thickness direction. The nut portion 82a is provided on one end (base end) side of the plate-shaped portion 82b.

[0051] The plate-shaped portion 82b has a flat plate shape with an upper surface and a lower surface. The plate-shaped portion 82b has an elongated shape that is long in the Y direction in a plan view. The other end (tip) of the plate-shaped portion 82b is joined to a predetermined wiring board 52 via a joining material (not shown).

[0052] The P terminal 80 may be called a positive terminal (input terminal), the N terminal 81 a negative terminal (output terminal), and the M terminal 82 an intermediate terminal (output terminal). These terminals constitute a metal wiring plate through which a main current flows. One end of the P terminal 80, the N terminal 81, and the M terminal 82 constitute main terminals connectable to an external conductor. As described above, one end of each of the P terminal 80, the N terminal 81, and the M terminal 82 is joined to a predetermined wiring plate 52 via a joining material (not shown). The P terminal 80, the N terminal 81, and the M terminal 82 correspond to P, N, and M in FIG. 6.

[0053] These main terminals are formed from metal materials such as copper, copper alloy, aluminum alloy, iron alloy, etc. The shape, arrangement, number, etc. of these terminals are not limited to those described above and can be changed as appropriate.

[0054] Furthermore, a pair of pillars 36 protruding perpendicularly in the Z direction are formed on the upper surface of the side wall on the positive side in the Y direction. The pillars 36 have an elongated shape that is long in the X direction in plan view, along the opening 3a. Two pillars 36 are arranged per phase, and are lined up in the X direction. Furthermore, a step 31a that is one step lower than the upper surface of the side wall 31 is formed on the inside of the pillars 36 (negative side in the Y direction) and along the opening 3a.

[0055] A plurality of control terminals 83 are embedded in the pillar portion 36. Five control terminals 83 are embedded in each pillar portion 36. One end of each control terminal 83 protrudes from the upper surface of the pillar portion 36 and extends upward in the Z direction. The other end of each control terminal 83 is exposed on the upper surface of the step portion 31a. Five control terminals 83 are arranged per semiconductor element 6, and ten control terminals 83 are arranged per phase. These control terminals 83 are provided corresponding to the control electrodes 61. The number of control terminals 83 arranged is not limited to this and can be changed as appropriate.

[0056] The control terminal 83 is formed from a metal material such as copper, copper alloy, aluminum alloy, iron alloy, etc. The control terminal 83 is integrally molded (insert molded) so as to be embedded in the case 3.

[0057] A positioning pin 37 extending along the Z direction is provided on the upper surface of the side wall 30. The positioning pin 37 is provided on the upper surface of the side wall 30 on the negative side in the X direction, adjacent to the negative side of the column portion 36 in the X direction. The positioning pin 37 is also provided on the upper surface of the side wall 30 on the positive side in the X direction, adjacent to the positive side of the column portion 36 in the X direction.

[0058] These two positioning pins 37 are made of, for example, a metal material, and function as positioning pins when attaching a control board (not shown).

[0059] Furthermore, a plurality of through holes 38 are formed along the outer periphery of the case 3. The through holes 38 are holes for inserting screws (not shown) for fixing the semiconductor device 100. The through holes 38 extend all the way to the cooler 10.

[0060] The corresponding control electrodes 61 and control terminals 83 are electrically connected by wiring members W. Conductor wires (bonding wires) are used for the wiring members W. The conductor wires can be made of any one of gold, copper, aluminum, gold alloys, copper alloys, and aluminum alloys, or a combination thereof. It is also possible to use materials other than conductor wires as the wiring members. For example, ribbons can be used as the wiring members.

[0061] Next, the detailed structure of the cooler will be described with reference to Fig. 7 to Fig. 9. Fig. 7 is a schematic perspective view of the cooler according to this embodiment. Fig. 8 is a schematic exploded perspective view of the cooler shown in Fig. 7. Fig. 9 is a rear view of the semiconductor device according to this embodiment. Note that in Fig. 8, for convenience of explanation, the multiple fins are shown as rectangular parallelepipeds.

[0062] 7 to 9, the cooler 10 is formed into an integrated box shape by joining a top plate 11 and a bottom plate 12. The cooler 10 is made of a metal with good heat dissipation properties. The cooler 10 may be made of, for example, aluminum, an aluminum alloy, copper, or a copper alloy.

[0063] The top plate 11 has a rectangular shape in a plan view and is formed of a plate-like body of a predetermined thickness. The outer shape of the top plate 11 corresponds to the outer shape of the case 3. The longitudinal direction of the top plate 11 extends in the left-right direction (X direction) of the semiconductor device 100, and the lateral direction of the top plate 11 extends in the front-rear direction (Y direction) of the semiconductor device 100. The top plate 11 has one surface (bottom surface) and the other surface (top surface). One surface forms a heat dissipation surface that dissipates heat from the semiconductor element 6. The other surface forms a bonding surface for the laminated substrate 5.

[0064] A plurality of fins 13 are provided on the lower surface of the top plate 11. The plurality of fins 13 are arranged along the longitudinal direction of the top plate 11. More specifically, the plurality of fins 13 are arranged at positions corresponding to directly below the three semiconductor units 2.

[0065] For example, pin fins, which are multiple square column-shaped pins (square pins) arranged at a predetermined pitch with spaces between them, can be used as the fins 13. The multiple fins 13 may be formed, for example, from the same metal material as the top plate 11. The multiple fins 13 may be provided integrally with the top plate 11, or may be provided on the top plate 11 by, for example, brazing, implanting, cutting, or plastic processing.

[0066] A peripheral wall 14 that surrounds the outer periphery of the multiple fins 13 is provided on the underside of the top plate 11. The peripheral wall 14 protrudes a predetermined height from the upper surface of the bottom plate 12 toward the positive side in the Z direction. The peripheral wall 14 is formed in a frame shape that is larger than the outer shape of the assembly formed by the multiple fins 13. The protruding height of the peripheral wall 14 is preferably equal to the protruding height of the fins 13. The peripheral wall 14 may be provided integrally with the top plate 11. The top plate 11 may also be called a cooling case.

[0067] Additionally, a plurality of through holes 11a are formed along the outer periphery of the top plate 11. The through holes 11a are arranged to correspond to the through holes 38 formed in the case 3. Additionally, the top plate 11 may be provided at its four corners with cylindrical portions 11b that protrude to the same height as the fins 13 and the peripheral wall portion 14.

[0068] The bottom plate 12 has the same rectangular shape as the top plate 11 in a plan view, and is disposed directly below and facing the top plate 11 with a gap therebetween equal to the height of the peripheral wall portion 14. The bottom plate 12 is preferably formed from the same aluminum alloy as the top plate 11. A plurality of through holes 12a are formed in the bottom plate 12 along the outer periphery. The through holes 12a are arranged to correspond to the through holes 38 formed in the case 3 and the through holes 11a formed in the top plate 11. In other words, the through holes 38, 11a, and 12a are arranged so as to overlap in a plan view.

[0069] The top plate 11 is joined to the tips (lower ends) of the peripheral wall 14 and the plurality of fins 13 by brazing or the like. This closes the lower opening of the cooling case. In this manner, a flow path for the refrigerant is formed by the space surrounded by the top plate 11, bottom plate 12, the plurality of fins 13, and peripheral wall 14. For example, cooling water is used as the refrigerant, and its physical properties can be changed as appropriate.

[0070] Furthermore, an inlet 12b and an outlet 12c for the refrigerant for the cooler 10 are formed at predetermined locations on the bottom plate 12. The inlet 12b and the outlet 12c are formed as through holes that penetrate the bottom plate 12 in the thickness direction. Specifically, the inlet 12b and the outlet 12c are arranged to face each other diagonally with the multiple fins 13 sandwiched between them in the Y direction.

[0071] Further, the inlet 12b and the outlet 12c have an elongated hole shape that is long in the X direction in a plan view. For example, the shapes of the inlet 12b and the outlet 12c are elliptical, being short on the short side of the cooler 10 and long on the long side. Note that the shapes and locations of the inlet 12b and the outlet 12c are not limited to this and can be changed as appropriate.

[0072] The semiconductor module 1 and the cooler 10 are joined together using an adhesive or the like. In this case, when combining the semiconductor module 1 and the cooler 10, it is important to align the case 3 and the cooler 10 (top plate 11). For example, in the past, alignment was achieved by fitting a columnar metal part (positioning pin) integrally molded on the case 3 side with a hole or notch formed on the cooler 10 side.

[0073] However, the positioning pins on the case 3 are often made of a metal material to ensure rigidity. Furthermore, a metal material with good thermal conductivity is used for the cooler 10 from the perspective of cooling performance. Therefore, when positioning the cooler 10, the metal materials may rub against each other, generating metal powder. In particular, metal powder can cause short circuits in surrounding electrical wiring and electrical devices. Furthermore, if metal powder gets mixed into the cooler 10, it can contaminate the internal refrigerant flow path, leading to rust and other problems.

[0074] On the other hand, it is possible to ensure sufficient clearance between the metal materials to prevent them from coming into contact with each other, but if too much clearance is ensured, the original positioning function cannot be fully exerted, and the positioning accuracy of the entire device may not be ensured.

[0075] Therefore, the present inventors focused on the materials of the case 3 and the cooler 10 and came up with the present invention with the aim of improving the positioning accuracy between the case 3 and the cooler 10 while suppressing the generation of metal powder. For example, in this embodiment, a protrusion 39 made of the same material (resin material) as the case body is provided on the case 3, and this protrusion is fitted into a notch 15 provided on the cooler 10, thereby realizing positioning between the case 3 and the cooler 10. The protrusion may be made of, for example, a thermoplastic resin. Alternatively, the protrusion may be made of a thermosetting resin. Furthermore, the protrusion may be made of resin mixed with an inorganic filler. The protrusion may be formed integrally with the case body. This enables highly accurate positioning of the case 3 and the cooler 10 without generating metal powder.

[0076] Here, a detailed structure of the semiconductor device according to this embodiment will be described with reference to Fig. 9 to Fig. 11. Fig. 10A is an enlarged view of the periphery of part A in Fig. 9, and Fig. 10B is a side view seen from arrow A1 in Fig. 9A. Similarly, Fig. 11A is an enlarged view of the periphery of part B in Fig. 9, and Fig. 11B is a side view seen from arrow B1 in Fig. 9A.

[0077] 9 to 11, in this embodiment, case 3 is formed with protrusions 39 that protrude downward from the bottom surfaces of side walls 30 that form a rectangular frame. As shown in particular in Fig. 10A, protrusions 39 have a flat shape that is long in the X direction in plan view. Specifically, protrusions 39 include a pair of linear portions 39a, 39b that extend vertically (in the X direction) from the outer surfaces of side walls 30 in plan view, and arc portion 39c that is connected to linear portions 39a, 39b and curves in an arc shape.

[0078] That is, the protrusion 39 may include a J-shaped portion in plan view, having a straight portion 39a and an arc portion 39c. The arc portion 39c may be semicircular. The length of the straight portion 39a may be longer than the diameter of the arc portion 39c.

[0079] More specifically, the protrusion 39 has a U-shape in plan view, with a pair of opposing straight portions 39a, 39b connected to both ends of an arc portion 39c. That is, the protrusion 39 may include a U-shape having two parallel straight portions 39a, 39b and a semicircular arc portion 39c connected therebetween. Note that the arc portion 39c is not limited to an arc shape and may have any shape as long as it includes a portion that curves convexly in a direction away from the straight portions 39a, 39b (toward the inside of the module). The arc portion 39c may also be referred to as a curved portion.

[0080] Furthermore, a notch 15 that can engage with the protrusion 39 is formed in the top plate 11 corresponding to the protrusion 39. In plan view, the notch 15 has a complementary shape that forms a predetermined gap D1 with respect to the protrusion 39. Specifically, the notch 15 includes a pair of straight line portions 15a, 15b that extend vertically (in the X direction) from the outer surface of the top plate 11 in plan view, and an arc portion 15c that is connected to the straight line portions 15a, 15b and curves in an arc shape.

[0081] Arc portion 15c may be semicircular. That is, notch 15 may include a J-shaped portion having straight portion 15a and arc portion 15c. Notch 15 has straight portion 15a extending parallel to straight portion 39a of protrusion 39 with a predetermined gap D1 formed therebetween, straight portion 15b extending parallel to straight portion 39b with a predetermined gap D1 formed therebetween, and arc portion 15c extending concentrically with arc portion 39c of protrusion 39 with a predetermined gap D1 formed therebetween. Arc portion 15c may be semicircular.

[0082] More specifically, notch 15 has a U-shape in plan view, with a pair of opposing linear portions 15a, 15b connected to both ends of arc portion 15c. That is, notch 15 may include a U-shape with two parallel linear portions 15a, 15b and a semicircular arc portion 15c connected therebetween. Furthermore, linear portion 15a on the positive side in the Y direction may be longer in the X direction than linear portion 15b on the negative side in the Y direction.

[0083] The straight portion 15a faces the straight portion 39a with a predetermined gap D1 therebetween. The straight portion 15b faces the straight portion 39b with a predetermined gap D1 therebetween. The two straight portions 15a, 15b may be called second straight portions. The arc portion 15c faces the arc portion 39c with a predetermined gap D1 therebetween. The arc portion 15c is not limited to an arc shape and may have any shape as long as it includes a portion that is curved so as to be convex in a direction away from the straight portions 15a, 15b (toward the inside of the module). The arc portion 15c may be called a curved portion (second curved portion).

[0084] The predetermined gap D1 between the protrusion 39 and the notch 15 may be, for example, 0 or more and 0.2% or less of the length in the longitudinal direction (X direction) of the semiconductor module 1. More preferably, it may be greater than 0 and 0.1% or less of the length in the longitudinal direction (X direction) of the semiconductor module 1.

[0085] In this embodiment, the case 3 and the cooler 10 are positioned by fitting the resin protrusion 39 and the metal notch 15, which makes it less likely for metal powder to be generated than when two metal materials are fitted together. This makes it possible to set the gap D1 between the protrusion 39 and the notch 15 more precisely than in the conventional case where two metal materials are fitted together. This makes it possible to improve the positioning accuracy of the case 3 and the cooler 10.

[0086] Furthermore, since the protrusion 39 includes the arc portion 39c and the notch 15 includes the arc portion 15c, the arc portions 39c and 15c are fitted together using the centers of the circles of the respective arc portions 39c and 15c as reference points, thereby enabling highly accurate positioning of the case 3 and the cooler 10 in the XY plane. Since the protrusion 39 includes the linear portion 39a and the notch 15 includes the linear portion 15a, when the protrusion 39 and the notch 15 are engaged, the side of the linear portion 39a comes into contact with the side of the linear portion 15a, thereby restricting relative rotation of the case 3 and the cooler 10 around the Z axis. In other words, the single protrusion 39 allows highly accurate positioning in the XY plane and around the Z axis.

[0087] 10B, the tip of the protrusion 39 protrudes downward (in the -Z direction) from the lower surface of the top plate 11. This allows the case 3 and the cooler 10 (top plate 11) to be properly fitted together. The tip of the protrusion 39 is also located above (in the +Z direction) the lower surface of the bottom plate 12. In other words, the tip of the protrusion 39 does not protrude downward (in the -Z direction) from the lower surface of the bottom plate 12. This prevents the protrusion 39 from getting in the way when assembling external equipment below the bottom plate 12.

[0088] Furthermore, a tapered inclined surface 39d (which may also be called a tapered surface or a chamfer) is formed at the tip of the protrusion 39. Since the tip of the protrusion 39 is tapered in this manner, even if there is some misalignment when the protrusion 39 and the notch 15 are mated (engaged), the inclined surface 39d serves as a guide surface, allowing the case 3 and the cooler 10 (top plate 11) to be properly mated.

[0089] 4, 5, and 9, the case 3 has skirt portions 30a, 31b that extend downward with a predetermined thickness along the outer surfaces of the side walls 30, 31. The skirt portions 30a, 31b cover at least a portion of the outer surface of the top plate 11. As shown in particular in FIG. 9, the skirt portions 30a, 31b extend in a predetermined direction (X direction or Y direction) along the sides of the cooler 10. Furthermore, the side surfaces of the cooler 10 (top plate 11 and / or bottom plate 12) are recessed inward at locations corresponding to the skirt portions 30a, 31b.

[0090] More specifically, as described above, the cooler 10 has through holes 11a and 12a formed therein for fastening external equipment. In a plan view, the cooler 10 has the peripheries of the through holes 11a and 12a protruding outward, and recesses 10a recessed inward are formed on the side surfaces between the through holes 11a and 12a. The skirt portions 30a and 31b are formed on the side walls between the through holes 38 (at locations corresponding to the recesses 10a), but are not formed on the side walls around the through holes 38. This ensures strength when fastening external equipment and prevents damage to the semiconductor device 100. The recesses 10a may be formed on either or both of the side surfaces of the top plate 11 and the bottom plate 12.

[0091] As shown in FIG. 10 , the skirt portion 30a on the positive side in the X direction has a portion that is continuous with the protrusion 39. Specifically, the skirt portion 30a extends perpendicularly from the end of the linear portion 39b of the protrusion 39 on the outer surface side. That is, at one end of the skirt portion 30a, the protrusion 39 is formed so as to be continuous with the skirt portion 30a and extend inward (toward the negative side in the X direction in FIG. 10 ). The tip of the protrusion 39 protrudes downward from the lower end of the skirt portion 30a. Furthermore, the lower end of the skirt portion 30a is located higher (on the +Z side) than the lower surface of the tabletop 11. That is, the lower end of the skirt portion 30a does not protrude downward from the lower surface of the tabletop 11.

[0092] A gap D2 is formed between the skirt portion 30a and the side surface of the cooler 10 (top plate 11). An adhesive B is further interposed in the gap D2. The gap D2 is larger than the gap D1 between the protrusion 39 and the notch 15. The gap D2 between the skirt portion 30a and the cooler 10 (top plate 11) may be, for example, 1.2 times or more and 10 times or less the gap D1. More preferably, the gap D2 may be 1.5 times or more and 5.0 times or less the gap D1.

[0093] Because the skirt portion 30a covers the outer surface of the top plate 11, it is possible to prevent the adhesive B between the case 3 and the top plate 11 from spilling out from the outer surface of the case 3. Furthermore, excess adhesive B can be stored in the gap D2 between the skirt portion 30a and the cooler 10. That is, the skirt portions 30a and 31b function as a wall that restricts the flow of the adhesive B. Furthermore, because the lower end of the skirt portion 30a does not protrude below the underside of the top plate 11, it is possible to prevent damage to the skirt portion 30a when handling the side of the cooler 10.

[0094] Further, the notch 15 is formed at the end of a portion (recess 10a) recessed inward of the cooler 10. As shown in Fig. 10A in particular (as well as Figs. 11A and 14A described later), a step E is provided on the side surface of the cooler 10 at the location of the notch 15 (the location where the notch 15 is formed). That is, a step E that is offset in the X direction is provided between the side surface of the cooler 10 where the recess 10a is not formed and the side surface of the recess 10a.

[0095] Furthermore, in this embodiment, notch 15 is formed not only in top plate 11 but also in bottom plate 12. Notch 15 in bottom plate 12 is formed in the same shape at a location directly below notch 15 in top plate 11. Notch 15 in bottom plate 12 may be called a second notch. Furthermore, the tip of protrusion 39 may be located below the lower surface of top plate 11 and above the upper surface of bottom plate 12. That is, protrusion 39 may engage with notch 15 in top plate 11 but not engage with notch 15 in bottom plate 12. Therefore, for example, when connecting an external device, the semiconductor module 1 and the external device can be positioned by engaging a positioning guide of the external device with notch 15 (second notch) in bottom plate 12.

[0096] The notch 15 in the bottom plate 12 is used to align the top plate 11 and the bottom plate 12 when assembling the cooler 10. That is, by arranging the notch 15 in the top plate 11 and the notch 15 in the bottom plate 12 so that they overlap in a plan view, the top plate 11 and the bottom plate 12 can be positioned with high precision. Therefore, the protrusion 39 does not need to engage with the notch 15 in the bottom plate 12. Furthermore, in this way, the notch 15 according to this embodiment is used not only for positioning the case 3 and the cooler 10, but also for positioning the cooler 10 itself when assembling it (assembling the top plate 11 and the bottom plate 12).

[0097] As described above, the top plate 11 has a rectangular shape in plan view corresponding to the case 3, and the notches 15 are formed on each of a pair of side surfaces facing each other in the longitudinal direction of the top plate 11. Furthermore, the notches 15 of the top plate 11 (bottom plate 12) are arranged symmetrically with respect to the Y axis (at the same location in the X direction).

[0098] On the other hand, the protrusion 39 on the case 3 side is formed only on one of a pair of side walls 30 facing each other in the longitudinal direction (the side wall 30 on the positive side in the X direction). As described above, the protrusion 39 has a flat shape that is long in the X direction, and therefore can be positioned by itself in the XY plane and around the Z axis.

[0099] 11A and 11B, a notch 15 is formed on the other side wall 30, but no protrusion 39 is formed. Therefore, for example, when connecting an external device, the semiconductor module 1 and the external device can be positioned by engaging a positioning guide of the external device with the notch 15 on the other side wall 30. The end of the skirt portion 30a provided on the other side wall 30 is positioned so as to overlap the notch 15 in a side view. Since a portion of the notch 15 is covered by the skirt portion 30a, the adhesive B is prevented from spilling out around portion B as well.

[0100] As described above, according to this embodiment, by fitting the resin protrusion 39 and the metal notch 15 together, it is possible to improve the positioning accuracy between the case 3 and the cooler 10 while suppressing the generation of metal powder.

[0101] Next, modified examples will be described with reference to Fig. 12 to Fig. 16. Fig. 12 is a cross-sectional view of a semiconductor device according to a modified example, corresponding to Fig. 4. Fig. 13 is a cross-sectional view of a semiconductor device according to a modified example, corresponding to Fig. 5. Fig. 14 is a partially enlarged view of a semiconductor device according to a modified example, corresponding to Fig. 10. Fig. 15 is a plan view of a semiconductor device according to another modified example. Fig. 16 is a cross-sectional view of the semiconductor device shown in Fig. 15.

[0102] In the above embodiment, the cooler 10 is described as a closed type formed by joining the top plate 11 and the bottom plate 12. However, the cooler 10 is not limited to this configuration and can be modified as appropriate. For example, as shown in FIGS. 12 to 14, the bottom plate 12 may be omitted, and the multiple fins 13 may be exposed to the outside. In this case, as shown in FIG. 14, the tip of the protrusion 39 is preferably located higher than the bottom surface of the top plate 11 (on the +Z side). In other words, the tip of the protrusion 39 remains inside the top plate 11 in the thickness direction and does not protrude below the bottom surface of the top plate 11. This prevents the tip of the protrusion 39 from interfering with the assembly of a cover that covers the multiple fins.

[0103] Although the above embodiment has been described with reference to a case in which the semiconductor module 1 includes a case 3 molded into a frame shape, the present invention is not limited to this configuration. For example, the configurations shown in FIGS. 15 and 16 may be used. The semiconductor module 1 shown in FIGS. 15 and 16 is a fully molded module and does not include a laminated substrate 5. Instead, independent metal wiring plates 90 are bonded to the upper and lower surfaces of the semiconductor element 6, respectively. That is, the semiconductor element 6 is sandwiched between at least two metal wiring plates 90. The semiconductor element 6, the metal wiring plates 90, and other components such as the control terminal 83 and the wiring members W are covered and sealed with a molded resin 91. That is, the molded resin 91 serves as the case 3 and the sealing resin 4. In this case, the above-described protrusion 39 and skirt portions 30a and 31b may be formed in the molded resin 91. The molded resin 91 is formed, for example, by transfer molding. The molded resin 91 may also be referred to as a resin portion.

[0104] A vehicle to which the present invention is applied will be described with reference to Fig. 17. Fig. 17 is a schematic plan view showing an example of a vehicle to which the semiconductor device of the present invention is applied. Vehicle 101 shown in Fig. 17 is, for example, a four-wheeled vehicle equipped with four wheels 102. Vehicle 101 may be, for example, an electric vehicle in which the wheels are driven by a motor or the like, or a hybrid vehicle that uses power from an internal combustion engine in addition to a motor.

[0105] The vehicle 101 includes a drive unit 103 that applies power to the wheels 102, and a control device 104 that controls the drive unit 103. The drive unit 103 may be configured with at least one of an engine, a motor, or a hybrid of an engine and a motor, for example.

[0106] The control device 104 controls (for example, controls power) the above-described drive unit 103. The control device 104 includes the above-described semiconductor device 100. The semiconductor device 100 may be configured to control power to the drive unit 103.

[0107] Furthermore, in the above embodiment, the number and locations of the semiconductor elements 6 are not limited to the above configuration, and can be changed as appropriate.

[0108] Furthermore, in the above-described embodiment, the number and layout of the wiring boards are not limited to the above-described configuration, and can be changed as appropriate.

[0109] In the above embodiment, the laminated substrate 5 and the semiconductor element 6 are configured to be rectangular or square in plan view, but are not limited to this configuration. These elements may be configured to be polygonal shapes other than those described above.

[0110] Furthermore, although the present embodiment and modifications have been described, other embodiments may be combinations of the above-described embodiments and modifications in whole or in part.

[0111] Furthermore, the present embodiment is not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified within the scope of the spirit of the technical idea. Furthermore, if the technical idea can be realized in a different way due to technological advances or derived other technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea.

[0112] The features of the above embodiment are summarized below. The semiconductor device according to the above embodiment comprises a resin part that covers the periphery of a semiconductor element and a cooler that is arranged below the semiconductor element, the cooler having a top plate attached to the underside of the resin part, the resin part having a protrusion that protrudes downward from the underside of the outer periphery, the protrusion including a first straight portion that extends in a predetermined direction in a planar view, and a first curved portion that is connected to the first straight portion and curves so as to be convex in a direction away from the first straight portion, the top plate having a notch that can engage with the protrusion, and the resin part and the top plate are joined via an adhesive.

[0113] Furthermore, in the semiconductor device according to the above embodiment, the resin part includes a rectangular frame-shaped resin case that houses the semiconductor element, the protrusion part protrudes downward from the bottom surface of the side wall that forms the rectangular frame of the resin case, and the bottom surface of the resin case and the top surface of the top plate are joined via the adhesive.

[0114] In the semiconductor device according to the above embodiment, the protruding portion has a U-shape in plan view, with the pair of first linear portions facing each other connected to both ends of the first curved portion having an arc shape.

[0115] In the semiconductor device according to the above embodiment, the notch has a complementary shape in plan view that forms a predetermined gap with respect to the protrusion.

[0116] In addition, in the semiconductor device according to the above embodiment, the notch is formed by connecting a second straight portion that faces the first straight portion with a predetermined gap therebetween, and a second curved portion that faces the first curved portion with a predetermined gap therebetween.

[0117] In the semiconductor device according to the above embodiment, the protrusion is provided on a side edge of the resin portion, and the notch is provided on a side edge of the top plate.

[0118] In the semiconductor device according to the above embodiment, the tip of the protrusion protrudes downward from the lower surface of the top plate.

[0119] In the semiconductor device according to the above embodiment, the tip of the protrusion is located higher than the lower surface of the top plate.

[0120] In addition, in the semiconductor device according to the above embodiment, the resin portion further has a skirt portion extending downward along the outer surface of the side wall to a predetermined thickness, and the skirt portion covers at least a portion of the outer surface of the top plate.

[0121] Furthermore, in the semiconductor device according to the above embodiment, the skirt portion has a portion that is connected to the protrusion portion, the lower end of the skirt portion is located higher than the underside of the top plate, and the tip of the protrusion portion protrudes downwardly below the lower end of the skirt portion.

[0122] In addition, in the semiconductor device according to the above embodiment, the side surface of the cooler is recessed inward at a location corresponding to the skirt portion, and the gap between the skirt portion and the side surface of the cooler is larger than the gap between the protrusion portion and the notch.

[0123] In the semiconductor device according to the above embodiment, the notch is located at the end of the inwardly recessed portion, and there is a step on the side surface of the cooler at the location of the notch.

[0124] Furthermore, in the semiconductor device according to the above embodiment, the top plate has a rectangular shape in a plan view corresponding to the resin portion, the notch is formed on each of a pair of side surfaces opposing each other in the longitudinal direction of the top plate, and the protrusion portion is formed on only one of a pair of side walls opposing each other in the longitudinal direction.

[0125] In the semiconductor device according to the above embodiment, the end of the skirt portion provided on the other side wall is provided at a position that overlaps the notch in a side view.

[0126] In the semiconductor device according to the above embodiment, the adhesive is interposed in the gap between the skirt portion and the cooler.

[0127] In the semiconductor device according to the above embodiment, a positioning pin is provided on the upper surface of the resin portion, standing upward at a position directly above the protrusion.

[0128] In addition, in the semiconductor device according to the above embodiment, the underside of the top plate is provided with a plurality of fins arranged at least in a position corresponding to directly below the semiconductor element, and a peripheral wall portion surrounding the outer periphery of the plurality of fins.

[0129] In addition, in the semiconductor device according to the above embodiment, the cooler further has a bottom plate arranged below and facing the top plate, to whose upper surface the plurality of fins and the ends of the peripheral wall portion are joined, and the bottom plate has a second notch of the same shape at a location corresponding to directly below the notch in the top plate.

[0130] In the semiconductor device according to the above embodiment, the tip of the protrusion is located higher than the lower surface of the bottom plate.

[0131] Furthermore, the vehicle according to the above embodiment includes the above semiconductor device. [Industrial Applicability]

[0132] As described above, the present invention has the effect of being able to improve the positioning accuracy between the case and the cooler while suppressing the generation of metal powder, and is particularly useful for electrical semiconductor devices and vehicles. [Explanation of symbols]

[0133] 1: Semiconductor module 2: Semiconductor unit 3: Case (resin part, resin case) 3a: opening 4: Sealing resin (resin part) 5:Laminated substrate 6: Semiconductor elements 7: Metal wiring board 10:Cooler 10a: recess 11: Top plate 11a:Through hole 11b: Cylindrical part 12: Bottom plate 12a: Through hole 12b: Entrance 12c: Outlet 13: Finn 14: Peripheral wall part 15: Notch, second notch 15a: Straight section (second straight section) 15b: Straight section (second straight section) 15c: Arc section (second curved section) 30: Side wall 30a: Skirt section 31: Side wall 31a: Stepped section 31b: Skirt part 32: Partition wall 33: Recess 34: Recess 35: Recess 36:Column part 37: Locating pin 38:Through hole 39:Protrusion 39a: Straight section (first straight section) 39b: Straight section (first straight section) 39c: Arc section (first curved section) 39d: Inclined surface 50: Insulating plate 51: Heat sink 52: Wiring board 60: Main electrode 61: Control electrode 70: 1st joint 71:Second joint 72:Connection part 80 :P terminal 80a: Nut part 80b: Plate-shaped part 80c: screw hole 81 :N terminal 81a: Nut part 81b: Plate-shaped part 81c: screw hole 82 :M terminal 82a: Nut part 82b: Plate-shaped part 82c: screw hole 83: Control terminal 90: Metal wiring board 91: Molded resin (resin part) 100: Semiconductor device 101: Vehicle 102 :Wheel 103: Drive unit 104: Control device B: Adhesive D1: Gap D2: Gap E: Step W: Wiring material

Claims

1. a resin portion that covers the periphery of the semiconductor element; a cooler disposed below the semiconductor element, the cooler has a top plate attached to a lower surface of the resin portion, the resin portion has a protrusion that protrudes downward from a lower surface of an outer circumferential edge, The protrusion is a first linear portion extending in a predetermined direction in a plan view; a first curved portion that is connected to the first straight portion and curves convexly in a direction away from the first straight portion, the top plate has a notch that can be engaged with the protrusion, The resin portion and the top plate are joined together via an adhesive.

2. the resin portion includes a rectangular frame-shaped resin case that houses the semiconductor element, the protrusion protrudes downward from a bottom surface of a side wall that forms a rectangular frame of the resin case, The semiconductor device according to claim 1 , wherein the bottom surface of said resin case and the top surface of said top plate are joined together via said adhesive.

3. 3. The semiconductor device according to claim 1, wherein the protrusion has a U-shape in plan view, with a pair of the first linear portions facing each other being connected to both ends of the first curved portion that is arc-shaped.

4. 4. The semiconductor device according to claim 1, wherein the notch has a complementary shape in plan view that forms a predetermined gap with respect to the protrusion.

5. 5. The semiconductor device according to claim 4, wherein the notch is formed by connecting a second straight portion that faces the first straight portion with a predetermined gap therebetween and a second curved portion that faces the first curved portion with a predetermined gap therebetween.

6. the protrusion is provided on a side edge of the resin portion, 6. The semiconductor device according to claim 1, wherein the notch is provided in a side edge portion of the top plate.

7. 7. The semiconductor device according to claim 1, wherein a tip of said protrusion protrudes downward from a lower surface of said top plate.

8. 7. The semiconductor device according to claim 1, wherein a tip of said protrusion is located higher than a lower surface of said top plate.

9. the resin portion further includes a skirt portion extending downward along an outer surface of the side wall with a predetermined thickness, The semiconductor device according to claim 1 , wherein the skirt portion covers at least a portion of an outer surface of the top plate.

10. the skirt portion has a portion that is continuous with the protrusion portion, The lower end of the skirt portion is located higher than the lower surface of the top plate, 10. The semiconductor device according to claim 9, wherein a tip of said protrusion protrudes downward beyond a lower end of said skirt portion.

11. a side surface of the cooler is recessed inward at a location corresponding to the skirt portion; 11. The semiconductor device according to claim 9, wherein a gap between the skirt portion and the side surface of the cooler is larger than a gap between the protrusion and the notch.

12. The semiconductor device according to claim 11 , wherein the notch is located at an end of an inwardly recessed portion, and a step is formed on a side surface of the cooler at the location of the notch.

13. the top plate has a rectangular shape in a plan view corresponding to the resin portion, The notches are formed on each of a pair of side surfaces that face each other in the longitudinal direction of the top plate, 13. The semiconductor device according to claim 9, wherein the protrusion is formed on only one of a pair of side walls opposed to each other in the longitudinal direction.

14. The semiconductor device according to claim 13 , wherein an end of the skirt portion provided on the other side wall is provided at a position overlapping the notch in a side view.

15. 15. The semiconductor device according to claim 9, wherein the adhesive is present in a gap between the skirt portion and the cooler.

16. 16. The semiconductor device according to claim 1, wherein a positioning pin is provided on the upper surface of the resin portion at a position directly above the protrusion, the positioning pin standing upward.

17. The underside of the top plate is a plurality of fins disposed at least at locations corresponding to directly below the semiconductor element; The semiconductor device according to claim 1 , further comprising a peripheral wall portion surrounding an outer periphery of the plurality of fins.

18. the cooler further includes a bottom plate disposed below the top plate and facing the top plate, and to which the plurality of fins and an end portion of the peripheral wall portion are joined on an upper surface, 18. The semiconductor device according to claim 17, wherein said bottom plate has a second notch of the same shape at a location corresponding to a location immediately below said notch in said top plate.

19. The semiconductor device according to claim 18 , wherein a tip of said protrusion is located higher than a lower surface of said bottom plate.

20. A vehicle comprising the semiconductor device according to any one of claims 1 to 19.

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