Laser processing device and laser processing method

Abstract

To provide a laser processing device and a laser processing method having preferable work efficiency in laser processing using liquid.SOLUTION: A laser head 10 emits laser light. A liquid tank 1 includes containers 1F, 1S, 1T separated from each other so as to be able to individually store permeation suppression liquid LI. The containers 1F, 1S, 1T respectively support workpieces WO1, WO2, WO3 to be processed by the laser head 10. Each of the containers 1F, 1S, 1T individually includes a liquid level adjustment mechanism 47. The liquid level of the permeation suppression liquid LI in each of the containers 1F, 1S, 1T is individually adjusted.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a laser processing apparatus and a laser processing method. [Background technology]

[0002] Laser processing devices that use water are disclosed in, for example, Japanese Patent Laid-Open Publication Nos. 8-132270 (Patent Document 1) and 62-168692 (Patent Document 2).

[0003] In Patent Document 1, laser processing is performed with the lower part of the workpiece immersed in cooling water in a water tank on the processing table. This allows the entire workpiece to be cooled from below, enabling stable processing.

[0004] In Patent Document 2, a workpiece supported by a pin holder is laser-cut with water placed in a mounting box for the pin holder. The water in the water tank cools the workpiece during laser cutting and prevents dust from scattering. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 8-132270 [Patent Document 2] Japanese Patent Application Publication No. 168692 / 1983 Summary of the Invention [Problem to be solved by the invention]

[0006] A series of processing steps in a laser processing device is carried out in the following order: loading the workpiece into the laser processing device, processing it with the laser processing device, and then unloading it from the laser processing device. Therefore, the processing operation is interrupted when loading or unloading the workpiece into or from the laser processing device. Therefore, the efficiency of laser processing using liquids is poor.

[0007] An object of the present disclosure is to provide a laser processing apparatus and a laser processing method that enable efficient operation in laser processing using a liquid. [Means for solving the problem]

[0008] The laser processing apparatus of the present disclosure includes a laser head, a liquid vat, a first liquid level adjustment mechanism, and a second liquid level adjustment mechanism. The laser head emits a laser beam. The liquid vat has a first container and a second container separated from each other so that they can store liquid individually, and each of the first container and the second container can support a workpiece to be processed by the laser head. The first liquid level adjustment mechanism adjusts the level of the liquid stored in the first container. The second liquid level adjustment mechanism operates independently of the first liquid level adjustment mechanism and adjusts the level of the liquid stored in the second container.

[0009] The laser processing method of the present disclosure is a laser processing method for processing a workpiece using laser light, and includes the following steps.

[0010] A liquid is stored in each of the first and second containers, which are separated from each other. With a workpiece supported in each of the first and second containers, the liquid levels in the first and second containers are adjusted independently of each other. [Effects of the Invention]

[0011] According to the present disclosure, it is possible to realize a laser processing apparatus and a laser processing method that enable efficient operation in laser processing using a liquid. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a perspective view showing a configuration of a laser processing apparatus according to an embodiment; [Figure 2] 2 is a cross-sectional perspective view showing the internal configuration of a container used in the laser processing apparatus of FIG. 1. FIG. [Figure 3] 2 is a cross-sectional view showing the configuration of a processing head used in the laser processing device of FIG. 1. [Figure 4] 2 is a cross-sectional view showing the configuration of a laser beam blocking member used in the laser processing apparatus of FIG. 1. [Figure 5] 2 is a cross-sectional view showing the configuration of a liquid level adjusting mechanism and the like used in the laser processing apparatus of FIG. 1. [Figure 6] FIG. 10 is a perspective view illustrating the configuration of a partition wall that can be attached to and detached from a container. [Figure 7] FIG. 6 is a functional block diagram of the controller shown in FIG. 5. [Figure 8] FIG. 10 is a cross-sectional view showing how the partition wall is removed and the workpiece is processed. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the specification and drawings, the same or corresponding components are designated by the same reference numerals, and redundant explanations will not be repeated. In addition, in the drawings, configurations may be omitted or simplified for the sake of convenience.

[0014] In the following description, the term "planar view" refers to a view seen from a direction perpendicular to the plane on which the plurality of mounting portions 2c are located. Also, the term "planar shape" refers to a shape in plan view.

[0015] <Configuration of laser processing equipment> The configuration of the laser processing device in this embodiment will be described with reference to FIGS.

[0016] Fig. 1 is a perspective view showing the configuration of a laser processing apparatus in one embodiment. Fig. 2 is a cross-sectional perspective view showing the internal configuration of a container used in the laser processing apparatus of Fig. 1. Figs. 3, 4, and 5 are cross-sectional views showing the configurations of a processing head, a laser beam blocking member, and a liquid level adjustment mechanism used in the laser processing apparatus of Fig. 1. Fig. 6 is a perspective view for explaining the configuration of a partition that can be attached and detached from the container.

[0017] 1, a laser processing apparatus 20 of this embodiment processes a workpiece WO (WO1 to WO3) using a laser beam. The workpiece WO (WO1 to WO3) is made of, for example, a steel material.

[0018] The laser processing apparatus 20 has a liquid vat 1. The liquid vat 1 has, for example, a rectangular planar shape. The liquid vat 1 has, for example, three containers 1F, 1S, and 1T. The number of containers included in the liquid vat 1 is not limited to three, and may be two or four or more, as long as there is more than one container.

[0019] Each of the containers 1F, 1S, and 1T has a rectangular shape with a longitudinal side (X direction) and a lateral side (Y direction) in a plan view. The planar shape of each of the containers 1F, 1S, and 1T is not limited to a rectangular shape and may be a square shape. The three containers 1F, 1S, and 1T are arranged side by side in the X direction, for example, in the order of container 1F, container 1S, and container 1T.

[0020] The longitudinal (X-direction) sides of each of the containers 1F, 1S, and 1T are aligned along a straight line in a plan view. The lateral (Y-direction) sides are located between the container 1F and the container 1S, and between the container 1S and the container 1T.

[0021] The vessels 1F, 1S, and 1T can support the workpieces WO1, WO2, and WO3, respectively.

[0022] The laser processing device 20 has a drive mechanism 25. The drive mechanism 25 moves the laser head 10 in the X direction (longitudinal direction of the liquid vat 1), the Y direction (transverse direction of the liquid vat 1), and the Z direction (vertical direction). The drive mechanism 25 mainly has a pair of left and right support bases 21, an X-direction movable base 22, a Y-direction movable base 23, and the laser head 10.

[0023] The pair of left and right support bases 21 are arranged to sandwich the liquid vat 1 in the Y direction. Each of the pair of left and right support bases 21 extends in the X direction. The X-direction movable base 22 extends in the Y direction and is arranged to straddle the pair of left and right support bases 21. The X-direction movable base 22 is driven in the X direction along the support bases 21 by an X-axis motor (not shown).

[0024] The Y-direction movable table 23 is supported by, for example, a rack and pinion mechanism so as to be movable in the Y direction relative to the X-direction movable table 22. The Y-direction movable table 23 is driven in the Y direction by a Y-axis motor (not shown).

[0025] The laser head 10 is supported by, for example, a rack and pinion mechanism so as to be movable in the Z direction relative to the Y-direction movable base 23. The laser head 10 is driven in the Z direction by a Z-axis motor (not shown).

[0026] The driving mechanism 25 allows the laser head 10 to move over each of the multiple containers 1F, 1S, and 1T. This allows the laser head 10 to process the workpieces WO (WO1 to WO3) supported on each of the multiple containers 1F, 1S, and 1T. The laser processing apparatus 20 may have multiple Y-direction movable tables 23, and each Y-direction movable table 23 may have a laser head 10. The laser processing apparatus 20 may also have multiple laser heads 10 on one Y-direction movable table 23. In other words, the laser processing apparatus 20 may have multiple laser heads 10.

[0027] The operation panel 30 receives input of processing conditions such as the shape, material, and processing speed of the workpiece WO (WO1 to WO3). The operation panel 30 has a display, switches, an alarm, etc. The display shows a screen for inputting processing conditions, a screen showing the operating status of the laser processing device 20, etc.

[0028] 2, the internal configuration of each of the multiple containers 1F, 1S, and 1T is the same as that of the other multiple containers. A cutting pallet 2, a sludge tray 3, and a liquid level adjustment tank 4 are arranged in each of the multiple containers 1F, 1S, and 1T.

[0029] Each of the containers 1F, 1S, and 1T has a rectangular bottom wall 1a and four side walls 1b extending from the four sides of the bottom wall 1a. Each of the containers 1F, 1S, and 1T has a cylindrical shape with a bottom that opens upward. Each of the containers 1F, 1S, and 1T has an opening at its upper end and an internal space extending from the opening into the interior of each of the containers 1F, 1S, and 1T.

[0030] Each of the multiple containers 1F, 1S, and 1T is configured to store a liquid (permeation suppression liquid LI: Figure 4) inside. Pallet support portions 1c are provided on the side walls 1b. Pallet support portions 1c protrude laterally from the wall surfaces of the side walls 1b toward the internal spaces of each of the multiple containers 1F, 1S, and 1T.

[0031] The level adjustment tanks 4 are independently disposed within the internal space of each of the multiple containers 1F, 1S, and 1T. In other words, the level adjustment tank 4 disposed in the internal space of container 1F, the level adjustment tank 4 disposed in the internal space of container 1S, and the level adjustment tank 4 disposed in the internal space of container 1T are independent by being separated from one another. The level adjustment tanks 4 disposed in each of containers 1F, 1S, and 1T have a box shape with an opening at the bottom. Through this opening, the internal space of the level adjustment tank 4 is connected to the internal spaces of each of the multiple containers 1F, 1S, and 1T.

[0032] The level adjustment tank 4 is configured so that gas can be stored in the internal space of the level adjustment tank 4. It is possible to supply gas to or discharge gas from the internal space of the level adjustment tank 4. By supplying gas to the internal space of the level adjustment tank 4, the permeation inhibitor liquid LI in the level adjustment tank 4 can be pushed out of the level adjustment tank 4. Furthermore, by discharging gas from the internal space of the level adjustment tank 4, it is possible to introduce the permeation inhibitor liquid LI from the outside to the inside of the level adjustment tank 4. This makes it possible to individually adjust the liquid levels in each of the multiple containers 1F, 1S, and 1T.

[0033] In this way, since a liquid level adjustment tank 4 is individually arranged in each of the multiple containers 1F, 1S, and 1T, it is possible to independently adjust the liquid level of the permeation inhibition liquid LI in each of the multiple containers 1F, 1S, and 1T.

[0034] The sludge tray 3 is placed above the level adjustment tank 4. The sludge tray 3 has a box shape with an opening at the top end. The sludge tray 3 is capable of storing sludge generated when the workpiece WO (Fig. 5) is cut by laser processing. The sludge generated during laser processing falls from the workpiece WO and is stored inside the sludge tray 3 through the opening at the top end of the sludge tray 3.

[0035] The cutting pallet 2 is supported by each of the containers 1F, 1S, and 1T via a pallet support portion 1c. The cutting pallet 2 is disposed within the internal space of each of the containers 1F, 1S, and 1T, above the sludge tray 3. The cutting pallet 2 has a plurality of first support plates 2a and a plurality of second support plates 2b. The plurality of first support plates 2a and the plurality of second support plates 2b are arranged vertically and horizontally to form a lattice pattern.

[0036] The cutting pallet 2 has a mounting portion 2c that supports the underside of the workpiece WO (FIG. 5). The mounting portion 2c of the cutting pallet 2 is formed, for example, by the upper ends of each of the multiple second support plates 2b. The mounting portion 2c is located lower than the upper end of the liquid tank 1 (the upper end of the side wall 1b). The upper end of each of the containers 1F, 1S, and 1T is located higher than the upper surface of the workpiece WO when the workpiece WO is placed on the mounting portion 2c. This allows the liquid level of the permeation suppression liquid LI to be higher than the upper surface of the workpiece WO when the containers 1F, 1S, and 1T are filled with the permeation suppression liquid LI with the workpiece WO placed on the mounting portion 2c.

[0037] 3, the laser head 10 mainly includes a head main body 5 and a condenser lens 6a. The head main body 5 includes a main body portion 5a.

[0038] The main body 5a has a hollow cylindrical shape. The condenser lens 6a is housed inside the main body 5a. The condenser lens 6a condenses the laser light RL onto the workpiece WO. The laser light RL condensed by the condenser lens 6a is emitted from a laser emission port 5aa of the main body 5a toward the workpiece WO.

[0039] The laser light RL used in the laser processing apparatus 20 of this embodiment has a wavelength of any of visible light, near-infrared light, mid-infrared light, and far-infrared light, and has a wavelength of 0.7 μm or more and 10 μm or less. This laser light RL is laser light whose light source is, for example, a fiber laser, or may be laser light whose light source is a solid-state laser containing YAG (Yttrium Aluminum Garnet). A fiber laser is a type of solid-state laser that uses an optical fiber as an amplification medium. In a fiber laser, the core at the center of the optical fiber is doped with the rare earth element Yb (ytterbium). The laser light RL emitted from a fiber laser is near-infrared light having a wavelength of approximately 1.06 μm. Fiber lasers have lower running and maintenance costs than carbon dioxide lasers.

[0040] The main body 5a has a gas outlet 5aa and a gas supply unit 5ab. Assist gas is supplied from the gas supply unit 5ab into the main body 5a. The assist gas supplied into the main body 5a is blown out from the gas outlet 5aa toward the workpiece WO. The gas outlet 5aa also serves as a laser emission outlet 5aa.

[0041] The head main body 5 may further include an outer nozzle 5b. The outer nozzle 5b is attached to the main body 5a so as to surround the periphery of the gas outlet 5aa of the main body 5a. A clearance space is provided between the inner circumferential surface of the outer nozzle 5b and the outer circumferential surface of the main body 5a.

[0042] The outer nozzle 5b has a gas outlet 5ba and a gas supply unit 5bb. The gas outlet 5ba and the gas supply unit 5bb are each connected to the gap space. The gas outlet 5ba is disposed on the outer periphery of the gas outlet 5aa and has a circular ring shape.

[0043] A secondary gas (shield gas) is supplied from the gas supply unit 5bb to the gap space between the main body 5a and the outer nozzle 5b. The secondary gas supplied into the gap space is blown out from the gas outlet 5ba toward the workpiece WO. As a result, the secondary gas is blown out from the gas outlet 5ba on the outer circumferential side of the assist gas blown out from the gas outlet 5aa.

[0044] As described above, the laser head 10 has gas outlets 5aa and 5ba. The gas outlets 5aa and 5ba may include a gas outlet 5aa that blows out an assist gas and a gas outlet 5ba that blows out a secondary gas. The gas outlets 5aa and 5ba form a double nozzle structure.

[0045] As shown in FIG. 4, the laser head 10 has a light-shielding cover 7. The light-shielding cover 7 surrounds the periphery of the laser emission port 5aa (gas outlet 5aa). The light-shielding cover 7 is made of, for example, a rubber sheet. The light-shielding cover 7 has a peripheral wall portion 7a, a first upper plate 7b, and a second upper plate 7c. The peripheral wall portion 7a has a cylindrical shape that surrounds the outer periphery of the head main body 5.

[0046] A first upper plate 7b and a second upper plate 7c are attached to the upper part of the peripheral wall portion 7a. One or more first holes 7ba are formed in the first upper plate 7b. The second upper plate 7c is disposed above the first upper plate 7b with a gap 7d therebetween.

[0047] The second upper plate 7c is provided with one or more second holes 7ca. The internal space 7e of the peripheral wall portion 7a, located below the first upper plate 7b, is connected to the external space of the light-shielding cover 7 through the first hole 7ba and the second hole 7ca. Therefore, gas in the internal space 7e of the light-shielding cover 7 escapes to the outside of the light-shielding cover 7 through the first hole 7ba and the second hole 7ca, as indicated by the dashed arrows in FIG. 4. Therefore, even if the liquid level of the permeation suppression liquid LI reaches a position higher than the lower end 7L of the peripheral wall portion 7a of the light-shielding cover 7 during laser processing, this structure allows the gas in the internal space 7e to escape to the outside of the light-shielding cover 7 through the first hole 7ba and the second hole 7ca.

[0048] The first hole 7ba, the gap 7d, and the second hole 7ca form a labyrinth structure for the laser light. Specifically, as shown by the solid arrow in Fig. 4, the laser light emitted from the laser emission port 5aa of the laser head 10 and reflected by the workpiece WO passes through the first hole 7ba and then travels linearly through the gap 7d, but does not reach the second hole 7ca. The second hole 7ca is located, for example, more inward than the first hole 7ba in the radial direction from the head body 5.

[0049] The laser light that passes through the first hole 7ba and enters the gap 7d is repeatedly reflected (multiple-reflected) between the first upper plate 7b and the second upper plate 7c and is absorbed by the light-shielding cover 7. This prevents the laser light from leaking from the inside of the light-shielding cover 7 to the outside.

[0050] As shown in Fig. 5, the container 1F and the container 1S are connected to each other. Also, although not shown in Fig. 5, the container 1T is connected to the container 1S. The connection structure between the container 1T and the container 1S is almost the same as the connection structure between the container 1F and the container 1S.

[0051] A side wall 1ba is located between the container 1F and the container 1S as the side wall 1b. The container 1F and the container 1S are separated from each other by the side wall 1ba. Similarly, a side wall similar to the side wall 1ba is located between the container 1S and the container 1T. The container 1S and the container 1T are separated from each other by the side wall located between them.

[0052] Each of containers 1F, 1S, and 1T is provided with a liquid supply unit 34, a liquid level detection sensor 41, a liquid level adjustment mechanism 47, and a liquid discharge unit (not shown). Below, the liquid supply unit 34, liquid level detection sensor 41, liquid level adjustment mechanism 47, and liquid discharge unit provided in container 1F will be described using container 1F as an example.

[0053] The liquid supply unit 34 of the container 1F supplies the permeation suppression liquid LI (FIG. 4) to the interior of the container 1F. The liquid supply unit 34 has a supply pipe 36 and a supply valve 31. The supply valve 31 is attached to the supply pipe 36. Opening the supply valve 31 starts the supply of the permeation suppression liquid LI to the internal space of the container 1F, and closing the supply valve 31 stops the supply of the permeation suppression liquid LI to the internal space of the container 1F.

[0054] The liquid level detection sensor 41 of the container 1F has a function of detecting the liquid level of the permeation suppression liquid LI stored in the container 1F. The liquid level detection sensor 41 is, for example, a guide pulse type level sensor.

[0055] The liquid level adjustment mechanism 47 of the container 1F adjusts the liquid level of the permeation inhibitor liquid LI in the container 1F based on the detection result of the liquid level detection sensor 41. The liquid level adjustment mechanism 47 has a liquid level adjustment tank 4, a gas pipe 37, a pressurization valve 32, and a decompression valve 33.

[0056] A gas pipe 37 is connected from the outside of container 1F to the level adjustment tank 4 inside container 1F. A pressurization valve 32 and a decompression valve 33 are attached to the gas pipe 37. By opening the pressurization valve 32, gas is supplied into the level adjustment tank 4, and by closing the pressurization valve 32, the supply of gas into the level adjustment tank 4 is stopped. By opening the decompression valve 33, gas inside the level adjustment tank 4 is discharged to the outside, and by closing the decompression valve 33, the discharge of gas from inside the level adjustment tank 4 is stopped.

[0057] The liquid discharge part (not shown) of the container 1F has an overflow pipe, a liquid storage tank, a liquid discharge pipe, and a discharge valve.

[0058] An overflow pipe is attached to the container 1F. When the liquid level of the permeation inhibition liquid LI in the container 1F reaches or exceeds a predetermined level, the permeation inhibition liquid LI in the container 1F is discharged through the overflow pipe into a liquid storage tank. The liquid storage tank is located outside the liquid tank 1.

[0059] A liquid discharge pipe is attached to the container 1F. A discharge valve is attached to the liquid discharge pipe. By opening the discharge valve, the permeation inhibitor liquid LI in the container 1F is discharged into the liquid storage tank, and by closing the discharge valve, the discharge of the permeation inhibitor liquid LI from the container 1F is stopped.

[0060] The liquid supply unit 34, liquid level detection sensor 41, liquid level adjustment mechanism 47, and liquid discharge unit provided in each of container 1S and container 1T have the same configuration as those provided in container 1F. Therefore, the same elements are given the same reference numerals, and their description will not be repeated.

[0061] Each of the containers 1F, 1S, and 1T is configured to be able to store the permeation suppression liquid LI at least up to a height position HL of the mounting portion 2c. Each of the containers 1F, 1S, and 1T is also able to store the permeation suppression liquid LI up to a position PL that is higher than the upper surfaces US1 and US2 of the workpieces WO (WO1, WO2, and WO3) placed on the mounting portion 2c. The liquid levels of the permeation suppression liquid LI in each of the containers 1F, 1S, and 1T can be controlled independently of one another using a liquid level adjustment mechanism 47 provided independently for each container.

[0062] The transmission suppression liquid LI stored in each of the containers 1F, 1S, and 1T absorbs light and suppresses the transmission of laser light. The transmission suppression liquid LI suppresses the transmission of light with a wavelength of 0.7 μm or more and 10 μm or less, for example.

[0063] The transmittance of the transmission suppression liquid LI in the wavelength range of 0.7 μm to 10 μm is, for example, 10% / cm or less. Furthermore, the transmittance of the transmission suppression liquid LI in the wavelength range of 0.7 μm to 10 μm is preferably, for example, 5% / cm or less. Furthermore, the transmittance of the transmission suppression liquid LI in the wavelength range of 0.7 μm to 10 μm is more preferably, for example, 3% / cm or less.

[0064] The transmission suppression liquid LI contains an additive that absorbs or scatters light in the wavelength range of 0.7 μm to 10 μm in order to suppress the transmission of light in the wavelength range of 0.7 μm to 10 μm. This additive contains, for example, carbon. The additive is preferably black. The transmission suppression liquid LI is, for example, an aqueous solution in which carbon is added to water. The transmission suppression liquid LI is, for example, an aqueous solution in which 0.1 volume % of India ink is added to water. In this specification, water may be tap water or pure water. The India ink is prepared by dispersing carbon black in an aqueous solution of glue or other water-soluble resin, and the carbon black content is 4.0 to 20.0 wt %, preferably 5.0 to 10.0 wt %, of the total amount. The India ink is, for example, the commercially available "Kuretake Koinoku Ink Drop BA7-18."

[0065] The permeation suppression liquid LI preferably contains a rust inhibitor. The rust inhibitor is a corrosion inhibitor that suppresses corrosion of steel materials and the like. The rust inhibitor is, for example, water-soluble. Examples of the rust inhibitor that may be used include a precipitated film-type inhibitor, a passive inhibitor, and an oxygen-scavenging inhibitor.

[0066] The permeation suppression liquid LI preferably contains a water displacement agent (water-removing agent). The water displacement agent improves the water-removal properties of the workpiece WO. The water displacement agent is a solvent for removing a liquid, such as water, from the surface of a substance that has been wetted with the liquid. The water displacement agent may act to repel liquids, such as water, by forming a monomolecular thin film on the surface of the substance, for example.

[0067] The laser processing device 20 further includes a controller 50 and a processing start switch 52. The processing start switch 52 issues a command to start laser processing by the laser processing device 20 when operated externally by, for example, an operator. The processing start switch 52 may be provided on the operation panel 30 (FIG. 1). The processing start switch 52 may be a touch panel provided on the operation panel 30.

[0068] The processing start switch 52 is connected to the controller 50. The controller 50 receives a processing start signal from the processing start switch 52. The controller 50 is connected to the liquid level detection sensors 41 of the containers 1F, 1S, and 1T. The controller 50 receives signals indicating the liquid levels of the permeation suppression liquid LI in each of the containers 1F, 1S, and 1T detected by the liquid level detection sensors 41 of the containers 1F, 1S, and 1T.

[0069] The controller 50 controls each part based on the acquired processing start signal. The controller 50 controls the supply valve 31, the pressure valve 32, the pressure reduction valve 33, and the discharge valve in each of the containers 1F, 1S, and 1T to open and close. The controller 50 controls the drive mechanism 25 (FIG. 1) so that the laser head 10 moves in the X, Y, and Z directions. The controller 50 controls the laser emission from the laser head 10.

[0070] The controller 50 controls the opening and closing of the pressurization valve 32 or the decompression valve 33 based on the detection result of the liquid level detection sensor 41. This adjusts the amount of gas stored in the liquid level adjustment tank 4, and the liquid level of the permeation inhibitor liquid LI stored in each of the containers 1F, 1S, and 1T. In this way, the controller 50 controls the opening and closing of the pressurization valve 32 or the decompression valve 33 to adjust the liquid level of the permeation inhibitor liquid LI stored in each of the containers 1F, 1S, and 1T.

[0071] The liquid level adjustment mechanisms 47 of the containers 1F, 1S, and 1T operate independently of each other under the control of the controller 50. This allows the liquid levels of the permeation inhibitor liquid LI stored inside the containers 1F, 1S, and 1T to be individually adjusted.

[0072] The controller 50 controls the laser head 10 and the drive mechanism 25 (FIG. 1). As a result, each of the workpieces WO1, WO2, and WO3 supported on each of the containers 1F, 1S, and 1T is laser processed by the laser head 10. Furthermore, during laser processing (when the laser head 10 emits laser light), the controller 50 moves the laser head 10 along a predetermined movement trajectory for each of the workpieces WO1, WO2, and WO3.

[0073] The controller 50 is, for example, a processor, and may be a CPU (Central Processing Unit).

[0074] 5, the side wall 1ba between the container 1F and the container 1S has a lower wall LP and an upper wall UP, and the upper wall UP may be detachable from the lower wall LP. The configuration of the side wall 1ba will be described below with reference to FIG.

[0075] As shown in FIG. 6, the lower wall LP is connected to the bottom wall 1a and rises upward in the Z direction from the bottom wall 1a. Both ends of the side wall 1ba in the Y direction are connected to the side wall 1bb extending in the X direction. The height position of the upper end of the lower wall LP is lower than the height position of the upper end of the side wall 1bb. Each of the side wall 1bb and the lower wall LP has a pallet support portion 1c. The side wall 1bb, the lower wall LP, and the bottom wall 1a are included in the main body of the liquid tank 1.

[0076] The upper wall UP is detachable from the lower wall LP. The upper wall UP is disposed on the upper end of the lower wall LP. The upper wall UP is a partition wall that separates the container 1F from the container 1S, and is configured to be detachable from the main body of the liquid vat 1 (side wall 1bb, lower wall LP, bottom wall 1a).

[0077] The upper wall UP and the main body of the liquid vat 1 are configured to engage with each other when the upper wall UP is attached to the main body. Specifically, the main body has a clamping portion SA, and the upper wall UP has a clamping portion SB. The clamping portion SA and the clamping portion SB are each made up of two plate members that face each other with a gap between them.

[0078] The clamping portion SA of the main body is attached to the side wall 1bb above the lower wall LP. Each of the two plate members constituting the clamping portion SA of the main body protrudes from the side wall 1bb toward the inside of the liquid vat 1. The end portion of the upper wall UP in the Y direction can be inserted into the gap between the two plate members constituting the clamping portion SA of the main body.

[0079] The clamping portion SB of the upper wall UP is located below the upper wall UP. Each of the two plate members constituting the clamping portion SB protrudes downward from the upper wall UP. The upper end of the lower wall LP can be inserted into the gap between the two plate members constituting the clamping portion SB of the upper wall UP.

[0080] Both ends of the upper wall UP in the Y direction are inserted into the clamping portions SA, and the upper end of the lower wall LP is inserted into the clamping portion SB, whereby the upper wall UP engages with and is attached to the main body of the liquid vat 1.

[0081] The engagement between the main body of the liquid vat 1 and the upper wall UP prevents the permeation inhibiting liquid LI from flowing from one of the containers 1F and 1S to the other. A sealing member such as a packing may be disposed at the engagement portion between the main body of the liquid vat 1 and the upper wall UP.

[0082] In the laser processing operation, it is sufficient if the difference in liquid level between the container 1F and the container 1S can be maintained for several hours. For this reason, the engagement portion between the main body of the liquid vat 1 and the upper wall UP does not need to be a complete liquid seal.

[0083] 5, the height position of the upper end of the lower wall LP is set to a position lower than the height position HL of the mounting portion 2c of the cutting pallet 2. The height position of the upper end of the upper wall UP attached to the main body of the liquid vat 1 is set to a position higher than the liquid level 1L of the permeation suppression liquid LI during laser cutting (a position higher than the upper surface of the workpiece WO1), which will be described in detail later, and is approximately the same as the height position of the upper end of the side wall 1b (1bb) along the X direction, for example.

[0084] The side wall 1b separating the container 1S and the container 1T may have the same configuration as the side wall 1ba having the lower wall LP and the upper wall UP as described above.

[0085] <Controller function block> Next, the functional blocks of the controller 50 shown in FIG. 5 will be described with reference to FIG.

[0086] Fig. 7 is a functional block diagram of the controller shown in Fig. 5. As shown in Fig. 7, the controller 50 has a first liquid level determination unit 51a, a first liquid level output unit 52a, a second liquid level determination unit 51b, and a second liquid level output unit 52b.

[0087] The first liquid level determination unit 51a acquires a detection signal from the first liquid level detection sensor 41. The first liquid level detection sensor 41 is, for example, a liquid level detection sensor provided in the container 1F. The first liquid level determination unit 51a determines, for example, the liquid level of the permeation suppression liquid LI in the container 1F based on the detection signal from the first liquid level detection sensor 41. The first liquid level determination unit 51a outputs a signal indicating the determination result to the first liquid level output unit 52a.

[0088] The first liquid level output unit 52a calculates, for example, a target liquid level of the permeation suppression liquid LI in the container 1F based on a signal indicating the determination result obtained from the first liquid level determination unit 51a. The first liquid level output unit 52a outputs a control signal to the first liquid level adjustment mechanism 47 to control the first liquid level adjustment mechanism 47 so that the calculated target liquid level is reached.

[0089] The first liquid level adjustment mechanism 47 is, for example, a liquid level adjustment mechanism 47 provided in the container 1F. The first liquid level adjustment mechanism 47 can adjust, for example, the liquid level of the permeation suppression liquid LI in the container 1F.

[0090] The second liquid level determination unit 51b acquires a detection signal from the second liquid level detection sensor 41. The second liquid level detection sensor 41 is, for example, a liquid level detection sensor provided in the container 1S. The second liquid level determination unit 51b determines, for example, the liquid level of the permeation suppression liquid LI in the container 1S based on the detection signal from the second liquid level detection sensor 41. The second liquid level determination unit 51b outputs a signal indicative of the determination result to the second liquid level output unit 52b.

[0091] The second liquid level output unit 52b calculates, for example, a target liquid level of the permeation suppression liquid LI in the container 1S based on a signal indicating the determination result obtained from the second liquid level determination unit 51b. The second liquid level output unit 52b outputs a control signal to the second liquid level adjustment mechanism 47 to control the second liquid level adjustment mechanism 47 so that the calculated target liquid level is reached.

[0092] The second liquid level adjustment mechanism 47 is, for example, a liquid level adjustment mechanism 47 provided in the container 1S. The second liquid level adjustment mechanism 47 can adjust, for example, the liquid level of the permeation inhibitor liquid LI in the container 1S.

[0093] The controller 50 having the above configuration can independently adjust the liquid levels of the permeation suppression liquid LI in the two containers (for example, containers 1F and 1S).

[0094] In addition, when the liquid levels of the permeation suppression liquid LI in each of the three containers 1F, 1S, and 1T are adjusted independently, the controller 50 additionally includes a third liquid level determination unit and a third liquid level output unit. The third liquid level determination unit acquires a detection signal from a liquid level detection sensor 41 provided in the container 1T. The third liquid level determination unit determines the liquid level of the permeation suppression liquid LI in the container 1T based on the detection signal from the liquid level detection sensor 41 provided in the container 1T. The third liquid level output unit calculates a target liquid level of the permeation suppression liquid LI in the container 1T based on a signal indicating the determination result acquired from the third liquid level determination unit. The third liquid level output unit adjusts the liquid level of the permeation suppression liquid LI in the container 1T to the calculated target liquid level by controlling a liquid level adjustment mechanism 47 provided in the container 1T.

[0095] <Laser processing method> Next, a laser processing method using the laser processing device 20 in this embodiment will be described with reference to FIGS.

[0096] As shown in Fig. 1, permeation suppression liquid LI is supplied into each of the containers 1F, 1S, and 1T of the laser processing apparatus 20. At this time, as shown in Fig. 5, the controller 50 controls the supply valves 31 of each of the containers 1F, 1S, and 1T to open. As a result, the permeation suppression liquid LI is supplied individually into the interior of each of the containers 1F, 1S, and 1T from the supply pipes 36 of each of the containers 1F, 1S, and 1T.

[0097] At this time, the controller 50 detects the liquid level of the permeation suppression liquid LI in each of the containers 1F, 1S, and 1T using the liquid level detection sensor 41 in each of the containers 1F, 1S, and 1T. When the controller 50 determines, based on the detection result of the liquid level detection sensor 41, that the liquid level of the permeation suppression liquid LI in each of the containers 1F, 1S, and 1T has reached the desired liquid level SL, it controls the supply valves 31 of each of the containers 1F, 1S, and 1T to close. At this time, the permeation suppression liquid LI is supplied to a position SL that is lower than the height position HL of the mounting portion 2c of the cutting pallet 2, for example.

[0098] As shown in FIG. 1, workpieces WO1, WO2, and WO3 are then loaded into containers 1F, 1S, and 1T, respectively. The workpieces WO1, WO2, and WO3 are loaded using, for example, a crane. The planar size of each of the workpieces WO1, WO2, and WO3 is within the range of the planar size of each of the containers 1F, 1S, and 1T. In this state, the laser processing operation by the laser processing device 20 is initiated.

[0099] 5, the laser processing operation in the laser processing apparatus 20 is started, for example, by operating a processing start switch 52. When the laser processing operation is started, the controller 50 controls the laser processing apparatus 20 so as to laser process each of the workpieces WO1, WO2, and WO3 in turn.

[0100] 1, the laser head 10 first laser processes a workpiece WO1 held in, for example, a container 1F. After laser processing of the workpiece WO1 is completed, the laser head 10 moves to laser process a workpiece WO2 held in a container 1S. After laser processing of the workpiece WO2 is completed, the laser head 10 moves to laser process a workpiece WO3 held in a container 1T.

[0101] When laser processing each of the workpieces WO1, WO2, and WO3, the liquid level of the permeation suppression liquid LI in each of the containers 1F, 1S, and 1T is raised. As shown in Figure 4, laser processing is performed with the liquid level of the permeation suppression liquid LI higher than the upper surfaces of the workpieces WO1, WO2, and WO3. After laser processing of each of the workpieces WO1, WO2, and WO3 is completed, the liquid level of the permeation suppression liquid LI in the containers 1F, 1S, and 1T is lowered.

[0102] Between the container 1F and the container 1S, and between the container 1S and the container 1T, an upper wall UP is attached to the main body of the liquid tank 1. Therefore, the liquid levels of the permeation inhibiting liquid LI in the containers 1F, 1S, and 1T can be adjusted individually.

[0103] After laser processing of the workpiece WO1 in the container 1F is completed and the level of the permeation suppression liquid LI in the container 1F is lowered, the processed workpiece WO1 is unloaded from the container 1F. The workpiece WO1 in the container 1F is unloaded between laser processing steps in other containers. That is, the unloading is performed at least at any one of the following times: when the level of the permeation suppression liquid LI in the container 1S (or container 1T) rises, when the workpiece WO2 in the container 1S (or workpiece WO3 in the container 1T) is being laser processed, and when the level of the permeation suppression liquid LI in the container 1S (or container 1T) drops.

[0104] After laser processing of the workpiece WO2 in the container 1S is completed and the level of the permeation suppression liquid LI in the container 1S is lowered, the processed workpiece WO2 is unloaded from the container 1S. The workpiece WO2 in the container 1S is unloaded between laser processing steps in other containers. That is, the unloading is performed at least at any one of the following times: when the level of the permeation suppression liquid LI in the container 1T rises, when the workpiece WO3 is laser processed in the container 1T, and when the level of the permeation suppression liquid LI in the container 1T drops.

[0105] After laser processing of the workpiece WO3 on the container 1T is completed and the liquid level of the permeation suppression liquid LI in the container 1T is lowered, the processed workpiece WO3 is carried out from the container 1T.

[0106] In this way, the process from when each of the workpieces WO1, WO2, and WO3 is carried into the respective containers 1F, 1S, and 1T until the processed workpiece WO3 is carried out of the container 1T is considered one turn, and the laser processing operation is completed when this one turn is completed. Alternatively, the laser processing operation may be completed after the above one turn is repeated multiple times. Thus, after a workpiece is carried out of one container, new workpieces may be carried into the same container while laser processing is being performed in another container, thereby allowing laser processing in multiple containers to be performed continuously.

[0107] As described above, the laser processing of this embodiment is performed in the following order for each container: carrying in the workpiece, raising the level of the permeation suppression liquid LI, laser processing the workpiece, lowering the level of the permeation suppression liquid LI, and carrying out the workpiece. Below, the raising of the level of the permeation suppression liquid LI, laser processing, and lowering of the level of the permeation suppression liquid LI will be specifically described.

[0108] When processing each of the workpieces WO1, WO2, and WO3, the controller 50 raises the liquid level of the permeation suppression liquid LI stored in each of the containers 1F, 1S, and 1T to a target liquid level PL, as shown in Fig. 5. At this time, the controller 50 adjusts the liquid level of the permeation suppression liquid LI based on the detection results of the liquid level detection sensors 41 in each of the containers 1F, 1S, and 1T.

[0109] The target liquid level PL of the permeation suppression liquid LI is equal to or higher than the height position HL of the mounting portion 2c. In this embodiment, the target liquid level PL of the permeation suppression liquid LI is adjusted to a position PL higher than the upper surfaces of the workpieces WO1, WO2, and WO3, for example. As a result, the entirety of each of the workpieces WO1, WO2, and WO3 is submerged (immersed) in the permeation suppression liquid LI during laser processing.

[0110] When raising the level of the permeation inhibition liquid LI to the target liquid level PL, the controller 50 controls the liquid level adjustment mechanism 47. Specifically, the controller 50 controls the pressure valve 32 to open, for example. This supplies gas into the liquid level adjustment tank 4, and the liquid levels of the permeation inhibition liquid LI stored in each of the containers 1F, 1S, and 1T are adjusted to rise to the target liquid level PL.

[0111] When the liquid level detection sensor 41 detects that the liquid level of the permeation suppression liquid LI has reached the target liquid level PL, processing of the workpieces WO1, WO2, and WO3 begins. During laser processing of the workpieces WO1, WO2, and WO3, laser light is irradiated from the laser head 10 toward the workpieces WO1, WO2, and WO3. Assist gas is also blown out from the laser head 10 toward the workpieces WO1, WO2, and WO3.

[0112] Furthermore, when laser processing the workpieces WO1, WO2, and WO3, the controller 50 controls the drive mechanism 25. This causes the laser head 10 to move, for example, along the shape of the product.

[0113] As shown in Figure 4, the blowing force of the assist gas pushes away the permeation suppression liquid LI at the processing points of the workpieces WO1, WO2, and WO3. As a result, the upper surfaces of the workpieces WO1, WO2, and WO3 are exposed from the permeation suppression liquid LI at the processing points of the workpieces WO1, WO2, and WO3.

[0114] Laser light is irradiated onto the upper surfaces of the workpieces WO1, WO2, and WO3 exposed from the permeation suppression liquid LI. The workpieces WO1, WO2, and WO3 are processed by this laser light irradiation. As a result, the workpieces WO1, WO2, and WO3 are cut, for example. The laser light that penetrates the workpieces WO1, WO2, and WO3 by cutting them is incident on the permeation suppression liquid LI stored below the workpieces WO1, WO2, and WO3.

[0115] During laser processing, the liquid level of the permeation suppression liquid LI is higher than the lower end 7L of the light-shielding cover 7. Therefore, the assist gas blown out from the laser head 10 is blocked by the permeation suppression liquid LI and does not escape to the outside of the light-shielding cover 7 from between the lower end 7L of the light-shielding cover 7 and the upper surface of the workpiece WO. However, the assist gas blown out from the laser head 10 escapes from the inside of the light-shielding cover 7 to the outside through the first hole 7ba in the first upper plate 7b and the second hole 7ca in the second upper plate 7c. Therefore, the blowing out of the assist gas prevents the gas pressure inside the light-shielding cover 7 from increasing.

[0116] The sludge generated when cutting the workpieces WO1, WO2, and WO3 by laser processing sinks into the permeation suppression liquid LI and accumulates in the sludge tray 3 (Figure 5). Sludge is, for example, particles of iron oxide formed when molten iron solidifies. By performing laser processing while the workpieces WO1, WO2, and WO3 are immersed in the permeation suppression liquid LI in this way, the sludge generated during processing is prevented from scattering around.

[0117] 5, when the above laser processing is completed, the controller 50 lowers the liquid level of the permeation suppression liquid LI stored in the liquid tank 1 to a position lower than the bottom surfaces of the workpieces WO1, WO2, and WO3 based on the detection result of the liquid level detection sensor 41. As a result, the entire workpieces WO1, WO2, and WO3 are exposed from the permeation suppression liquid LI.

[0118] When the liquid level of the permeation inhibitor liquid LI is lowered to a position lower than the bottom surfaces of the workpieces WO1, WO2, and WO3, the controller 50 controls the pressure reducing valve 33 to open, as shown in FIG. 5. This reduces the amount of gas stored in the liquid level adjustment tank 4, causing the permeation inhibitor liquid LI to flow into the liquid level adjustment tank 4. This lowers the liquid level of the permeation inhibitor liquid LI in the liquid tank 1. At this time, the controller 50 detects the liquid level of the permeation inhibitor liquid LI in the liquid tank 1 using the liquid level detection sensor 41. When the controller 50 determines that the liquid level of the permeation inhibitor liquid LI in the liquid tank 1 has reached the desired liquid level SL, it controls the pressure reducing valve 33 to close.

[0119] After the series of laser processing operations is completed, the cutting pallet 2 and the sludge tray 3 are removed from each of the containers 1F, 1S, and 1T. After this, the sludge in the sludge tray 3 is removed.

[0120] As described above, laser processing is performed using the laser processing device 20 of this embodiment.

[0121] <Effects of this embodiment> Next, the effects of this embodiment will be described in comparison with a comparative example.

[0122] In a comparative example in which the liquid tank of a laser processing device consists of a single container, the laser processing operation is performed in the following order: loading the workpiece into the single container, laser processing, and unloading. In this comparative example, the laser processing is interrupted when loading and unloading the workpiece into and from the container. This results in poor efficiency of the laser processing operation.

[0123] Furthermore, in the comparative example described above, when a black permeation suppression liquid is used and the liquid level of the permeation suppression liquid is raised to a position higher than the upper surface of the workpiece during laser processing, the workpiece cannot be unloaded unless the liquid level of the permeation suppression liquid is lowered below the upper surface of the workpiece. This is because the worker performing the unloading operation gets wet with the liquid and the black permeation suppression liquid prevents the worker from seeing where they are standing. Because the workpiece cannot be unloaded until the liquid level of the permeation suppression liquid is lowered below the upper surface of the workpiece, the efficiency of the laser processing operation in the comparative example is poor.

[0124] In contrast, in this embodiment, as shown in FIG. 1, the laser processing apparatus 20 has multiple (e.g., three) containers 1F, 1S, and 1T. Furthermore, the liquid level adjustment mechanisms 47 provided in each of the multiple containers 1F, 1S, and 1T are controlled and operated independently of each other. This allows the liquid level of the permeation suppression liquid LI to be adjusted individually in each of the multiple containers 1F, 1S, and 1T for laser processing. Therefore, when a workpiece WO (e.g., workpiece WO1 or WO3) is being loaded or unloaded into or from one of the multiple containers (e.g., container 1F or 1T), laser processing can be performed in another of the multiple containers (e.g., container 1S). This reduces the interruption time of laser processing, thereby improving the efficiency of laser processing operations compared to the comparative example.

[0125] Furthermore, when the liquid level of the permeation suppression liquid LI is lowered in one of the multiple containers (e.g., container 1S), the workpiece can be carried in or out of another of the multiple containers (e.g., containers 1F and 1T), which further improves the efficiency of the laser processing operation compared to the comparative example.

[0126] In this embodiment, as shown in FIG. 6, the liquid vat 1 has an upper wall UP that separates the container 1F from the container 1S. The upper wall UP is configured to be detachable from the main body of the liquid vat 1 (including the side wall 1bb, the lower wall LP, and the bottom wall 1a). As a result, when the upper wall UP is attached to the main body of the liquid vat 1, the liquid level of the permeation suppression liquid LI can be adjusted individually in each of the containers 1F and 1S, as shown in FIG. 5. For example, in the container 1F, the liquid level of the permeation suppression liquid LI can be adjusted to a position 1L higher than the top surface of the workpiece WO1, and in the container 1S, the liquid level of the permeation suppression liquid LI can be adjusted to a position 2L lower than the top surface of the workpiece WO2. As described above, this allows, for example, laser processing of the workpiece WO1 to be performed in the container 1F, and also allows the workpiece WO2 to be loaded or unloaded from the container 1S.

[0127] Furthermore, when the upper wall UP is removed from the main body of the liquid vat 1, one workpiece WO can be placed across multiple containers (for example, container 1F and container 1S) as shown in Figure 8. This makes it possible to laser process large (long) workpieces WO.

[0128] In this embodiment, as shown in Figure 6, the lower end and both side ends of the upper wall UP can each engage with the main body of the liquid vat 1. Specifically, the end of the upper wall UP in the Y direction can be inserted into the gap between the two plate members that make up the clamping section SA of the main body. Furthermore, the upper end of the lower wall LP can be inserted into the gap between the two plate members that make up the clamping section SB of the upper wall UP. This allows the upper wall UP to be firmly supported by the main body of the liquid vat 1. Furthermore, leakage of the permeation inhibiting liquid LI from one of the two containers (e.g., containers 1F and 1S) to the other is prevented.

[0129] 5, in this embodiment, the height position of the upper end of the upper wall UP is higher than the upper surfaces of the workpieces WO1, WO2, and WO3 supported by the containers 1F, 1S, and 1T, respectively. This makes it possible to individually adjust the liquid level of the permeation suppression liquid LI in each of the containers 1F, 1S, and 1T, even if the liquid level of the permeation suppression liquid LI in each of the containers 1F, 1S, and 1T becomes higher than the upper surfaces of the workpieces WO1, WO2, and WO3 during laser processing.

[0130] 5, in this embodiment, the controller 50 independently controls the liquid level adjustment mechanism 47 provided in the container 1F, the liquid level adjustment mechanism 47 provided in the container 1S, and the liquid level adjustment mechanism 47 provided in the container 1T. This makes it possible to independently adjust the liquid level of the permeation suppression liquid LI stored inside each of the containers 1F, 1S, and 1T and perform laser processing.

[0131] 5, the laser processing device 20 in this embodiment has a liquid level detection sensor 41 that detects the liquid level in the container 1F, a liquid level detection sensor 41 that detects the liquid level in the container 1S, and a liquid level detection sensor 41 that detects the liquid level in the container 1T. This makes it possible to individually detect the liquid levels in the multiple containers 1F, 1S, and 1T.

[0132] 5, in this embodiment, the liquid level 2L of the permeation suppression liquid LI in the container 1S supporting the workpiece WO2 not undergoing laser processing is lower than the upper surface US2 of the workpiece WO2 supported in the container 1S. Furthermore, the liquid level of the permeation suppression liquid LI in the container 1F supporting the workpiece WO1 undergoing laser processing is higher than the upper surface US1 of the workpiece WO1 supported in the container 1F. This makes it easy to remove the workpiece WO2 not undergoing laser processing. Furthermore, since the laser light irradiated during laser processing is absorbed by the permeation suppression liquid LI or the like in the workpiece WO1 undergoing laser processing, leakage to the outside of the laser processing apparatus 20 is suppressed.

[0133] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0134] 1 liquid tank, 1F, 1S, 1T container, 1a bottom wall, 1b, 1ba, 1bb side wall, 1c pallet support portion, 2 cutting pallet, 2a first support plate, 2b second support plate, 2c placing portion, 3 sludge tray, 4 liquid level adjustment tank, 5 head main body, 5a main body portion, 5aa, 5ba gas outlet, 5ab, 5bb gas supply portion, 5b outer nozzle, 6a condenser lens, 7 light-shielding cover, 7L lower end, 7a peripheral wall portion, 7b first upper plate, 7ba first hole, 7c second upper plate, 7ca second hole, 7d gap, 7e internal space, 10 laser head, 20 laser processing device, 21 support base, 22 X-direction movable base, 23 Y-direction movable base, 25 drive mechanism, 30 operation panel, 31 supply valve, 32 pressure valve, 33 Pressure reducing valve, 34 Liquid supply section, 36 Supply piping, 37 Gas piping, 41 Liquid level detection sensor, 47 Liquid level adjustment mechanism, 50 Controller, 51a 1st liquid level judgment section, 51b 2nd liquid level judgment section, 52 Processing start switch, 52a 1st liquid level output section, 52b 2nd liquid level output section, LI Transmission suppressing liquid, LP Lower wall, RL Laser light, SA, SB Gripping part, UP upper wall, US1, US2 upper surface, WO, WO1, WO2, WO3 workpiece.

Claims

1. a laser head that emits laser light; a liquid tank having a first container and a second container separated from each other so as to be able to store liquids individually, and capable of supporting a workpiece to be processed by the laser head in each of the first container and the second container; a first liquid level adjustment mechanism that adjusts the liquid level of the liquid stored in the first container; a second liquid level adjustment mechanism that operates independently of the first liquid level adjustment mechanism and adjusts the liquid level of the liquid stored in the second container, the liquid tank has a main body and a partition wall separating the first container and the second container; The partition is configured to be detachable from the main body, A laser processing device, wherein the height position of the upper end of the partition is higher than the upper surfaces of the workpieces supported in each of the first container and the second container.

2. The laser processing device according to claim 1 , wherein each of the bottom end and both side ends of the partition wall is engageable with the main body.

3. 3. The laser processing apparatus according to claim 1, further comprising a controller that independently controls the adjustment of the liquid level in the first container by the first liquid level adjustment mechanism and the adjustment of the liquid level in the second container by the second liquid level adjustment mechanism.

4. a first liquid level detection sensor that detects the liquid level in the first container; The laser processing device according to claim 1 , further comprising: a second liquid level detection sensor that detects a liquid level of the liquid in the second container.

5. A laser processing method for processing a workpiece using laser light, comprising: storing a liquid in each of a first container and a second container separated from each other; and adjusting the liquid level in the first container and the liquid level in the second container independently of each other while a workpiece is supported in each of the first container and the second container, the liquid tank has a main body and a partition wall separating the first container and the second container; The partition is configured to be detachable from the main body, A laser processing method, wherein the height position of the upper end of the partition wall is higher than the upper surfaces of the workpieces supported in each of the first container and the second container.

6. 6. The laser processing method according to claim 5, wherein in the step of independently adjusting the liquid levels in the first container and the second container, the liquid level in the first container supporting a workpiece not undergoing laser processing is lower than the top surface of the workpiece supported in the first container, and the liquid level in the second container supporting a workpiece undergoing laser processing is higher than the top surface of the workpiece supported in the second container.

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