Optical vibration isolation device, optical device, and magnetic sensor fixing method

Abstract

To provide an optical vibration-proof device in which magnetic sensor for detecting a position of a lens for vibration compensation can be easily and accurately attached to a base member, and provide an optical device, and a magnetic sensor fixing method.SOLUTION: An optical vibration-proof device includes: a base member; a lens holding frame configured to be movable, relative to the base member, along a plane orthogonal to an optical axis; a magnetic material which integrally moves with the lens holding frame, and generates a magnetic field; a position detection Hall element 224 for detecting a change of the magnetic field according to the movement of the lens holding frame; and a sensor attachment member 240 which is fixed to the base member. The base member includes a positioning part 134, and positions the position detection Hall element 224 by a sensor attachment member 140 with the positioning part 134. The base member is constituted with a different member from the sensor attachment member 240.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to an optical vibration isolation device, an optical device, and a method for fixing a magnetic sensor, and more particularly to a technique for attaching a magnetic sensor that detects the position of a lens for vibration correction to a base member. [Background technology]

[0002] In general, in an optical vibration isolation device, a lens for vibration correction is moved in a plane perpendicular to the optical axis to suppress image blur caused by vibration of the optical device, such as camera shake during handheld photography.

[0003] Patent Document 1 describes a technique for positioning a magnetic sensor (Hall element) that detects the position of a lens for image stabilization.

[0004] The optical vibration-proof device described in Patent Document 1 comprises a lens holding frame that holds a lens for vibration correction, a base member that supports the lens holding frame so that it can be displaced along a plane perpendicular to the optical axis, and a flexible substrate on which a Hall element is mounted that detects changes in the magnetic field of a magnet provided in the lens holding frame, and the flexible substrate is positioned and fixed to one surface of the base member (the surface opposite the lens holding frame).

[0005] In addition, the Hall element mounted on the flexible substrate protrudes from the other surface (the surface on the lens holding frame side) of the lens holding frame through an opening formed in the base member, and the protruding portion of the Hall element is sandwiched between a pair of Hall element actuating portions and Hall element fixing portions formed integrally with the base member, around the periphery of the opening formed in the base member. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-157040 Summary of the Invention [Problem to be solved by the invention]

[0007] One embodiment of the technology disclosed herein provides an optical vibration isolation device, an optical device, and a magnetic sensor fixing method that enable a magnetic sensor that detects the position of a shake correction lens to be attached to a base member simply, accurately, and reliably so that it does not shift in position due to impact or the passage of time. [Means for solving the problem]

[0008] An optical vibration-proof device according to a first aspect of the present invention comprises a base member, a lens holding frame configured to be movable relative to the base member along a plane perpendicular to the optical axis, a magnetic body that moves integrally with the lens holding frame and generates a magnetic field, a magnetic sensor that detects changes in the magnetic field in response to movement of the lens holding frame, and a sensor mounting member fixed to the base member, wherein the base member has a positioning portion and the magnetic sensor is positioned relative to the positioning portion by the sensor mounting member, and the base member is composed of a separate member from the sensor mounting member.

[0009] In the optical vibration-proof device pertaining to the second aspect of the present invention, it is preferable that the magnetic sensor is mounted on a printed circuit board, and that the printed circuit board is fixed to the base member at a position between the lens holding frame and the base member.

[0010] In the optical vibration-proof device pertaining to the third aspect of the present invention, the positioning portion preferably has a relief portion that prevents interference with the printed circuit board when the magnetic sensor abuts against the positioning portion.

[0011] In the optical vibration-proof device according to the fourth aspect of the present invention, the printed circuit board is preferably a flexible printed circuit board.

[0012] In the optical vibration-proof device according to the fifth aspect of the present invention, it is preferable that the sensor mounting member and the base member each have a position restriction portion that allows direct position restriction.

[0013] In the optical vibration-proof device according to the sixth aspect of the present invention, it is preferable that the base member has a first pin and a second pin, the sensor mounting member has a first hole and a second hole formed therein, and the sensor mounting member is positioned on the base member by inserting the first pin and the second pin into the first hole and the second hole, respectively.

[0014] In the optical vibration-proof device according to the seventh aspect of the present invention, it is preferable that the sensor mounting member is formed with fastening holes through which fasteners are inserted, and that the sensor mounting member is fixed to the base member via fasteners that are inserted into the fastening holes and fixed to the base member.

[0015] In the optical vibration-proof device according to the eighth aspect of the present invention, it is preferable that the sensor mounting member also serves as a position restricting member that restricts the position of the magnetic sensor in the optical axis direction.

[0016] In the optical vibration-proof device according to the ninth aspect of the present invention, it is preferable that the sensor mounting member also serves as a fixing member for fixing the printed circuit board to the base member.

[0017] In the optical vibration-proof device according to the tenth aspect of the present invention, it is preferable that the sensor mounting member has an elastic portion, and that the magnetic sensor is urged by an elastic force generated in the elastic portion to abut against the positioning portion.

[0018] In the optical vibration-proof device according to the eleventh aspect of the present invention, it is preferable that the base member and the sensor mounting member are each molded from resin.

[0019] In the optical vibration-proof device according to the twelfth aspect of the present invention, the sensor mounting member is preferably a molded product made of a resin having higher molding flowability than the base member.

[0020] In the optical vibration-isolating device according to the thirteenth aspect of the present invention, it is preferable that the base member and the sensor mounting member are made of different materials.

[0021] In the optical vibration-proof device according to the fourteenth aspect of the present invention, the sensor mounting member is preferably made of a material having a lower elastic modulus than the base member.

[0022] In the optical vibration-proof device according to the fifteenth aspect of the present invention, the base member and the sensor mounting member are preferably made of materials having the same linear expansion coefficient.

[0023] In the optical vibration-proof device according to the sixteenth aspect of the present invention, the base member is preferably made of a material having higher rigidity than the sensor mounting member.

[0024] In the optical vibration-proof device according to the seventeenth aspect of the present invention, it is preferable that the sensor mounting member has a shape with a larger ratio of overall length to cross-sectional area than any other part of the base member.

[0025] In the optical vibration-proof device according to the eighteenth aspect of the present invention, the magnetic body is preferably a magnet provided in the lens holding frame.

[0026] An optical device according to a nineteenth aspect of the present invention includes the optical image stabilization device according to any one of the first to eighteenth aspects.

[0027] A twentieth aspect of the invention is a method for fixing a magnetic sensor in an optical vibration isolation device that includes a base member, a lens holding frame configured to be movable relative to the base member along a plane perpendicular to the optical axis, a magnetic body that moves integrally with the lens holding frame and generates a magnetic field, a magnetic sensor that detects changes in the magnetic field in response to movement of the lens holding frame, a printed circuit board on which the magnetic sensor is mounted, and a sensor mounting member fixed to the base member, and that moves the lens holding frame within a plane perpendicular to the optical axis, the method comprising: placing the printed circuit board on the surface of the base member facing the lens holding frame; placing the sensor mounting member on the base member with the printed circuit board sandwiched between them; and, when fixing the sensor mounting member, positioning the magnetic sensor using a positioning portion provided on the base member using the sensor mounting member; and fixing the sensor mounting member to the base member with the magnetic sensor positioned by the positioning portion. [Brief explanation of the drawings]

[0028] [Figure 1]FIG. 1 is a block diagram showing an embodiment of a digital camera equipped with an optical vibration isolation device. [Figure 2] FIG. 2 is a conceptual diagram of the movement of the shake correction lens. [Figure 3] FIG. 3 is a block diagram of the main functions realized by the camera microcomputer. [Figure 4] FIG. 4 is a front view of the optical vibration isolation device according to the present invention. [Figure 5] FIG. 5 is a rear view of the optical vibration isolation device shown in FIG. [Figure 6] FIG. 6 is a front view of the optical vibration isolation device with the lens holding frame exposed. [Figure 7] FIG. 7 is a front view of the base member. [Figure 8] FIG. 8 is a perspective view showing a first embodiment of the sensor mounting member. [Figure 9] FIG. 9 is a plan view of the sensor mounting member shown in FIG. [Figure 10] FIG. 10 is a plan view of the tip portion of the flexible printed circuit board. [Figure 11] FIG. 11 is a plan view showing a state in which a sensor attachment member is disposed at the tip portion of a flexible printed circuit board. [Figure 12] FIG. 12 is a diagram showing how the flexible printed circuit board is arranged on the base member. [Figure 13] FIG. 13 is a cross-sectional view taken along line 13-13 in FIG. [Figure 14] FIG. 14 is a plan view of the base member showing a state in which a flexible printed circuit board is disposed on the base member and two position-detecting Hall elements are positioned by two sensor mounting members. [Figure 15] FIG. 15 is a perspective view showing how the sensor mounting member is fixed to the base member by a fastener. [Figure 16] 16(A) and 16(B) are a plan view and a side view, respectively, of the sensor mounting member. [Figure 17] FIG. 17 is a perspective view showing a second embodiment of the sensor mounting member. [Figure 18] FIG. 18 is a plan view of the sensor mounting member shown in FIG. [Figure 19] FIG. 19 is a plan view showing a third embodiment of the sensor mounting member. [Figure 20] FIG. 20 is a plan view showing a fourth embodiment of the sensor mounting member. [Figure 21] FIG. 21 is a diagram showing another embodiment of the position detector for detecting the position of the lens holding frame. DETAILED DESCRIPTION OF THE INVENTION

[0029] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an optical vibration isolation device, an optical device, and a magnetic sensor fixing method according to the present invention will now be described with reference to the accompanying drawings.

[0030] [Optical device] FIG. 1 is a block diagram showing an embodiment of a digital camera, which is an optical device equipped with an optical image stabilization device according to the present invention.

[0031] The digital camera 1 shown in FIG. 1 is a digital camera with an integrated lens, and is equipped with an optical vibration isolation device 100 of a lens shift type.

[0032] As shown in FIG. 1, the digital camera 1 includes an imaging optical system 10, an image sensor 20, an image sensor driving unit 20A, an analog signal processing unit 22, a digital signal processing unit 24, a display unit 30, a memory unit 32, an operation unit 34, an angular velocity detection unit 40, a camera microcomputer 50, and the like.

[0033] The imaging optical system 10 is composed of multiple lens groups including a focus lens 12 and a vibration correction lens 14. For convenience, only the focus lens 12 and the vibration correction lens 14 are shown in Fig. 1. The imaging optical system 10 has a diaphragm 16 on its optical path.

[0034] The focus lens 12 is a focus adjustment lens that adjusts the focus of the imaging optical system 10 by moving back and forth along the optical axis z. The focus lens 12 is driven by a focus lens driver 12A. The focus lens driver 12A includes a voice coil motor as an actuator and a drive circuit for the voice coil motor. The focus lens driver 12A drives the voice coil motor in response to instructions from the camera microcomputer 50 to move the focus lens 12.

[0035] The image stabilization lens 14 is a lens for correcting image shake caused by camera shake or the like when taking pictures with the digital camera 1 held in hand, and moves within a plane perpendicular to the optical axis z to correct image shake.

[0036] FIG. 2 is a conceptual diagram of the movement of the shake correction lens 14. As shown in FIG.

[0037] As shown in FIG. 2, the vibration correction lens 14 moves freely within an xy plane that is perpendicular to the optical axis z.

[0038] The x-axis is set as an axis that passes through the center of the image sensor 20 and is parallel to the top and bottom sides of the image sensor 20. The y-axis is set as an axis that passes through the center of the image sensor 20 and is parallel to the left and right sides of the image sensor 20. The direction of the x-axis is the horizontal direction of the digital camera 1, and the direction of the y-axis is the vertical direction of the digital camera 1. The x-axis and y-axis are perpendicular to each other.

[0039] When correcting image shake, the shake correction lens 14 is moved in a direction that cancels the shake. The shake correction lens 14 is driven by the optical vibration-proof device 100. The optical vibration-proof device 100 will be described in detail later.

[0040] The diaphragm 16 is configured, for example, as an iris diaphragm. The diaphragm 16 is driven by a diaphragm driver 16A, and its opening size is variable. The diaphragm driver 16A includes a motor as an actuator and a drive circuit for the motor. The diaphragm driver 16A drives the motor in response to instructions from the camera microcomputer 50, and varies the opening size of the diaphragm 16.

[0041] The image sensor 20 is a part that receives a light image representing a subject image that passes through the imaging optical system 10 and converts it into an electrical signal (image signal). The image sensor 20 is configured as a known image sensor such as a CMOS (Complementary Metal-Oxide Semiconductor) type or a CCD (Charge Coupled Device) type.

[0042] The image sensor driving unit 20A drives the image sensor 20 in response to instructions from the camera microcomputer 50. By driving the image sensor 20 with the image sensor driving unit 20A, charges corresponding to the amount of received light accumulated in each pixel are read out as an image signal.

[0043] The analog signal processing unit 22 takes in the analog image signal for each pixel output from the image sensor 20 and performs predetermined signal processing (for example, correlated double sampling processing, amplification processing, etc.). The analog signal processing unit 22 includes an ADC (Analog to Digital Converter) and converts the analog image signal after the predetermined signal processing into a digital image signal and outputs it.

[0044] The digital signal processing unit 24 receives the digital image signal output from the analog signal processing unit 22 and performs predetermined signal processing (e.g., tone conversion processing, white balance correction processing, gamma correction processing, demosaic processing (also called "synchronization processing"), luminance / color difference conversion processing, etc.) to generate image data. The generated image data is output to the camera microcomputer 50.

[0045] The digital signal processor 24 also detects information about the brightness of the subject, which is necessary for exposure control, based on the captured image signal. The detected information about the brightness of the subject is output to the camera microcomputer 50.

[0046] Furthermore, the digital signal processor 24 detects information about the contrast of the subject, which is necessary for autofocus control, based on the captured image signal. The detected contrast information is output to the camera microcomputer 50.

[0047] The display unit 30 displays various types of information including images. The display unit 30 includes a display device such as a liquid crystal display or an organic EL display (EL: Electro Luminescent), and a drive circuit for the display device.

[0048] The display unit 30 displays not only captured images but also live view images. Live view is a function that displays images captured by the image sensor in real time. By displaying live view images, it is possible to capture images while checking them on the display unit 30. The display unit 30 is also used as a display screen for the user interface when performing various settings. The display on the display unit 30 is controlled by the camera microcomputer 50.

[0049] The storage unit 32 stores various data including image data. The storage unit 32 includes an internal memory and a control circuit that reads and writes data from and to the internal memory. The internal memory is, for example, a non-volatile memory such as an EEPROM (Electrically Erasable Programmable Read Only Memory). The reading and writing of data from and to the storage unit 32 is controlled by the camera microcomputer 50.

[0050] Alternatively, the storage unit 32 may be configured as an external memory such as a memory card, etc. In this case, the digital camera 1 is provided with a card slot or the like for inserting the memory card.

[0051] The operation unit 34 includes common operation means for a digital camera, such as a release button, power switch, imaging mode dial, shutter speed dial, exposure compensation dial, command dial, menu button, cross key, decision button, cancel button, erase button, and shake compensation switch, and outputs signals according to the operations to the camera microcomputer 50.

[0052] Here, the shake correction switch is a switch that turns the shake correction function on and off. When the shake correction switch is turned on, the shake correction function is turned on, and when the shake correction switch is turned off, the shake correction function is turned off.

[0053] The angular velocity detection unit 40 detects the angular velocities of the yaw direction (Yaw) and pitch direction (Pit) of the digital camera 1. The yaw direction (Yaw) is the rotation direction around the y-axis, as shown in FIG. 2, and is the rotation direction of the digital camera 1 in the horizontal direction. The pitch direction (Pit) is the rotation direction around the x-axis, as shown in FIG. 2, and is the rotation direction of the digital camera 1 in the vertical direction.

[0054] The angular velocity detection unit 40 includes a yaw direction angular velocity detection unit 40A and a pitch direction angular velocity detection unit 40B. An angular velocity signal indicating the angular velocity in the yaw direction (Yaw) detected by the yaw direction angular velocity detection unit 40A and an angular velocity signal indicating the angular velocity in the pitch direction (Pit) detected by the pitch direction angular velocity detection unit 40B are output to the camera microcomputer 50.

[0055] The camera microcomputer 50 functions as a control unit that controls the overall operation of the digital camera 1. The camera microcomputer 50 also functions as a calculation processing unit that calculates physical quantities necessary for controlling the digital camera 1.

[0056] The camera microcomputer 50 is a computer (microcomputer) equipped with a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory). The camera microcomputer 50 executes predetermined programs to realize various functions. The programs executed by the camera microcomputer 50 and various data required for control are stored in the ROM.

[0057] FIG. 3 is a block diagram showing the main functions realized by the camera microcomputer.

[0058] As shown in FIG. 3, the camera microcomputer 50 functions as a focus control unit 52, an exposure setting unit 54, an image sensor drive control unit 56, an aperture control unit 58, a shake correction control unit 60, a display control unit 62, a memory control unit 64, a shake detection unit 70, a shake correction amount calculation unit 90, etc.

[0059] The focus control unit 52 performs autofocus control, that is, detects the in-focus state and moves the focus lens 12 to adjust the focus.

[0060] The exposure setting unit 54 sets a shutter speed (exposure time) and an aperture value that will provide appropriate exposure based on the detection result of the brightness of the subject.

[0061] The image sensor drive control unit 56 controls the driving of the image sensor 20 via the image sensor drive unit 20A so that exposure is performed at the shutter speed set by the exposure setting unit 54.

[0062] The aperture control unit 58 controls the opening amount of the aperture 16 via the aperture drive unit 16A so that the aperture value set by the exposure setting unit 54 is achieved.

[0063] The display control unit 62 controls the display on the display unit 30. For example, when image data obtained by imaging is to be displayed on the display unit 30, the display control unit 62 converts the image data into a data format that can be displayed on the display unit 30 and outputs the converted image data to the display unit 30.

[0064] The storage control unit 64 controls the reading and writing of data from and to the storage unit 32. Image data obtained by imaging is stored in the storage unit 32 via the storage control unit 64. When the image data stored in the storage unit 32 is to be played back, the image data is read from the storage unit 32 via the storage control unit 64.

[0065] The shake detection unit 70 calculates the amount of shake of the digital camera 1 based on the detection results of the angular velocities in the yaw direction (Yaw) and the pitch direction (Pit) detected by the angular velocity detection unit 40. Specifically, the shake detection unit 70 integrates the angular velocity signal in the yaw direction (Yaw) output from the yaw direction angular velocity detection unit 40A to calculate the amount of shake in the yaw direction (Yaw). The shake detection unit 70 also integrates the angular velocity signal in the pitch direction (Pit) output from the pitch direction angular velocity detection unit 40B to calculate the amount of shake in the pitch direction (Pit).

[0066] The shake correction amount calculation unit 90 calculates the shake correction amount based on the shake amount in the yaw direction (Yaw) and the shake amount in the pitch direction (Pit) detected by the shake detection unit 70. The shake correction amount is calculated as the amount of movement of the shake correction lens 14 required to cancel out the detected shake. Specifically, the shake correction amount is calculated as the amount of movement of the shake correction lens 14 in the x-axis direction and y-axis direction required to cancel out the shake.

[0067] The shake correction control unit 60 controls the movement of the shake correction lens 14 based on the shake correction amount calculated by the shake correction amount calculation unit 90, and corrects image shake.

[0068] <Optical vibration isolation device> Fig. 4 is a front view of the optical vibration isolation device according to the present invention, and Fig. 5 is a rear view of the optical vibration isolation device shown in Fig. 4.

[0069] The optical vibration-proof device 100 includes a lens holding frame 110 that holds the shake correction lens 14, a base member 120 that supports the lens holding frame 110 so that it can move freely in a plane perpendicular to the optical axis, a rotation restriction unit 140 that restricts the rotation of the lens holding frame 110, a movable range restriction unit 160 that restricts the movable range of the lens holding frame 110, an x-axis direction drive unit 180 that drives the lens holding frame 110 in the x-axis direction, a y-axis direction drive unit 190 that drives the lens holding frame 110 in the y-axis direction, an x-axis direction position detection unit 210 that detects the position of the lens holding frame 110 in the x-axis direction, and a y-axis direction position detection unit 220 that detects the position of the lens holding frame 110 in the y-axis direction.

[0070] FIG. 6 is a front view of the optical vibration isolation device with the lens holding frame exposed.

[0071] The lens holding frame 110 has a cylindrical lens holding portion 110A and a flange portion 110B that protrudes outward from the lens holding portion 110A. The shake correction lens 14 is held on the inner periphery of the lens holding portion 110A.

[0072] FIG. 7 is a front view of the base member.

[0073] The base member 120 in this example is a molded product made of resin. As the material of the base member 120, for example, a glass fiber reinforced PC (Polycarbonate) resin containing glass fiber can be used, but the material is not limited to this and various resins can be used.

[0074] The base member 120 has a cylindrical lens barrel portion 120A, a fixed-side ball accommodating portion 128 that accommodates the ball 124, a fixed-side spring hook portion 130 on which one end of the spring 126 is hooked, and positioning portions 132 and 134 that are used to position a position-detecting hall element 214 in the x-axis direction and a position-detecting hall element 224 in the y-axis direction, which will be described later.

[0075] The lens barrel portion 120A, fixed-side ball receiving portion 128, fixed-side spring hook portion 130, and positioning portions 132, 134 are integrally molded from the same resin material to form the base member 120. The base member 120 has an opening 120B in the center.

[0076] The base member 120 includes a plurality of balls 124 that movably support the lens holding frame 110 , and a plurality of springs 126 that urge the lens holding frame 110 toward the base member 120 .

[0077] The fixed-side ball receiving portions 128 are provided on the surface facing the flange portion 110B of the lens holding frame 110. The fixed-side ball receiving portions 128 are formed as rectangular recesses, and are provided on the base member 120 at three locations.

[0078] The fixed-side spring hook portions 130 are formed by hook-shaped protrusions that extend radially outward, and are provided at four locations on the base member 120.

[0079] As shown in FIG. 6, the lens holding frame 110 is provided with a movable-side ball receiving portion 116 and a movable-side spring hook portion 112 corresponding to the fixed-side ball receiving portion 128 and the fixed-side spring hook portion 130 provided on the base member 120.

[0080] The movable ball receiving portion 116 is formed as a circular recess and is provided on the surface facing the base member 120 .

[0081] The movable-side spring hook portions 112 are formed by hook-shaped protrusions that extend radially outward, and are provided at four locations on the flange portion 110B.

[0082] The spring 126 is made up of a coil spring and is arranged parallel to the optical axis z. One end of the spring 126 is hooked on the fixed-side spring hook portion 130 of the base member 120, and the other end is hooked on the movable-side spring hook portion 112 of the lens holding frame 110. This biases the lens holding frame 110 towards the base member 120.

[0083] When the lens holding frame 110 is biased toward the base member 120, the balls 124 are sandwiched between the lens holding frame 110 and the base member 120. As a result, the lens holding frame 110 is supported movably relative to the base member 120.

[0084] The rotation regulating unit 140 includes a guide shaft 142 arranged perpendicular to the optical axis z, a swingable base member 144 that supports the guide shaft 142 so that it can swing freely, and a guide unit 114 that is integral with the lens holding frame 110 and guides the lens holding frame 110 along the guide shaft 142.

[0085] The guide shaft 142 is made of a round metal bar and is disposed perpendicular to the optical axis z.

[0086] The oscillating base member 144 has a bracket 146 that holds the guide shaft 142, an oscillating shaft 148 provided on the bracket 146, and an axial base member 150 that supports the oscillating shaft 148. The bracket 146 has a base 146A and a pair of arms 146B extending parallel to the base 146A, forming an overall U-shape. Both ends of the guide shaft 142 are supported by the pair of arms 146B. The oscillating shaft 148 is provided on the base 146A and disposed parallel to the guide shaft 142. The axial base member 150 is provided integrally with the base member 120 and rotatably supports both ends of the oscillating shaft 148. The oscillating shaft 148 supported by the axial base member 150 is disposed perpendicular to the optical axis z. This allows the guide shaft 142 to be oscillated about an axis perpendicular to the optical axis z.

[0087] The guide portion 114 is provided integrally with the flange portion 110B of the lens holding frame 110. The guide portion 114 has a guide groove 114A, into which the guide shaft 142 fits, on the surface facing the base member 120. The guide groove 114A is configured as a U-shaped groove, and is disposed perpendicular to the optical axis of the shake correction lens 14.

[0088] The guide shaft 142 fits into the guide groove 114A of the guide portion 114, thereby restricting the rotation of the lens retaining frame 110 around the optical axis. Furthermore, the guide shaft 142 fits into the guide groove 114A of the guide portion 114, thereby supporting the lens retaining frame 110 so that it can slide along the guide shaft 142. This allows the lens retaining frame 110 to be supported so that it can move within a plane perpendicular to the optical axis z. In other words, because the guide shaft 142 is supported so that it can swing about an axis perpendicular to the optical axis z, it does not hinder the movement of the lens retaining frame 110 even when the lens retaining frame 110 moves within a plane perpendicular to the optical axis z. This allows the lens retaining frame 110 to be supported so that it can move within a plane perpendicular to the optical axis z.

[0089] In this way, the lens holding frame 110 is supported so as to be movable within a plane perpendicular to the optical axis z, but may also be supported so as to be movable within a plane approximately perpendicular to the optical axis z as long as performance is not impaired.

[0090] 6, the movable range restricting portion 160 includes a movable range restricting hole 162 provided in the lens holding frame 110, and a stopper 164 that is inserted into the movable range restricting hole 162 and restricts the movable range of the lens holding frame 110. The stopper 164 is attached to the base member 120.

[0091] The movable range restriction holes 162 are an example of an opening. The movable range restriction holes 162 are provided in two locations on the flange portion 110B of the lens holding frame 110. Each movable range restriction hole 162 is disposed at a symmetrical position with respect to the optical axis of the shake correction lens 14.

[0092] The x-axis direction driver 180 is made up of a voice coil motor, and drives the lens holding frame 110 in the x-axis direction.

[0093] As shown in FIGS. 4 and 5, the voice coil motor constituting the x-axis direction driving unit 180 includes a pair of yokes 200A, 200B, a pair of x-axis direction driving magnets 182A, 182B, and an x-axis direction driving coil 184.

[0094] The pair of yokes 200A, 200B are made of magnetic metal plates such as steel plates. The pair of yokes 200A, 200B are attached to the front and back surfaces of base member 120 by screws 202A, 202B. The yokes 200A, 200B attached to base member 120 are spaced apart from each other in the direction of optical axis z and are arranged perpendicular to optical axis z.

[0095] The pair of x-axis direction drive magnets 182A, 182B are attached integrally to the corresponding yokes 200A, 200B. The pair of x-axis direction drive magnets 182A, 182B are arranged at predetermined positions on the base member 120 by attaching the yokes 200A, 200B to the base member 120. Specifically, the pair of x-axis direction drive magnets 182A, 182B are arranged on the x-axis (the centers of the x-axis direction drive magnets 182A, 182B are positioned on the x-axis), and are arranged facing each other with a certain gap in the direction of the optical axis z. The pair of x-axis direction drive magnets 182A, 182B are arranged at intermediate positions between the two stoppers 164 in the direction perpendicular to the x-axis direction (the y-axis direction).

[0096] The x-axis direction drive coil 184 is provided on the flange portion 110B of the lens holding frame 110. The x-axis direction drive coil 184 is disposed between a pair of x-axis direction drive magnets 182A, 182B. The x-axis direction drive coil 184 is also disposed on a straight line that passes through the center of the shake correction lens 14 and is parallel to the x-axis.

[0097] The x-axis direction driving section 180 configured as above moves the lens holding frame 110 in the x-axis direction by energizing the x-axis direction driving coil 184.

[0098] The y-axis direction driver 190 is made up of a voice coil motor, and drives the lens holding frame 110 in the y-axis direction.

[0099] The voice coil motor constituting the y-axis direction drive unit 190 includes a pair of yokes 200A, 200B, a pair of y-axis direction drive magnets 192A, 192B, and a y-axis direction drive coil 194.

[0100] The pair of yokes 200A, 200B are made of magnetic metal plates such as steel plates. The pair of yokes 200A, 200B are attached to the front and back surfaces of base member 120 by screws 202A, 202B. The yokes 200A, 200B attached to base member 120 are spaced apart from each other along optical axis z and are arranged perpendicular to optical axis z.

[0101] The pair of y-axis direction drive magnets 192A, 192B are attached integrally to the corresponding yokes 200A, 200B. The pair of y-axis direction drive magnets 192A, 192B are arranged at predetermined positions on the base member 120 by attaching the yokes 200A, 200B to the base member 120. Specifically, they are each arranged on the y-axis (the centers of the y-axis direction drive magnets 192A, 192B are positioned on the y-axis), and are arranged facing each other with a certain gap in the direction of the optical axis z. The pair of y-axis direction drive magnets 192A, 192B are arranged at intermediate positions between the two stoppers 164 in the direction perpendicular to the y-axis direction (x-axis direction).

[0102] The y-axis direction drive coil 194 is provided on the flange portion 110B of the lens holding frame 110. The y-axis direction drive coil 194 is disposed between a pair of y-axis direction drive magnets 192A, 192B. The y-axis direction drive coil 194 is also disposed on a straight line that passes through the center of the shake correction lens 14 and is parallel to the y-axis.

[0103] The y-axis direction driving section 190 configured as above moves the lens holding frame 110 in the y-axis direction by energizing the y-axis direction driving coil 194.

[0104] <<Position detection unit in the x-axis direction and position detection unit in the y-axis direction>> <Position detection section in the x-axis direction> 4 and 7, the x-axis direction position detection unit 210 detects the position of the lens holding frame 110 in the x-axis direction. The position detection unit 210 includes a magnet (magnetic body) 212 for detecting the position in the x-axis direction, and a Hall element 214 for detecting the position in the x-axis direction.

[0105] The position detection hall element 214 is a magnetic sensor that detects the magnetic field generated by the position detection magnet 212 in the x-axis direction.

[0106] In this example, the position detection hall element 214 is configured as a linear hall IC (IC: Integrated Circuit) with two hall elements built into a package, and has detection sensitivity to the x-axis movement of the position detection magnet 212 in the x-axis direction.

[0107] The magnet 212 for detecting position in the x-axis direction is provided on the flange portion 110B of the lens holding frame 110 (see FIG. 4), and the Hall element 214 for detecting position is fixed to the base member 120 (see FIG. 7).

[0108] The structure and method for fixing the position detection hall element 214 to the base member 120 will be described in detail later.

[0109] The x-axis position detection unit 210 detects the position of the position detection magnet 212 in the x-axis direction using a position detection hall element 214, and detects the position of the lens holding frame 110 in the x-axis direction (i.e., the position of the shake correction lens 14 in the x-axis direction).

[0110] <Y-axis direction position detection unit> The y-axis direction position detection section 220 detects the position of the lens holding frame 110 in the y-axis direction, and is configured similarly to the x-axis direction position detection section 210.

[0111] That is, the y-axis direction position detection unit 220 includes a magnet (magnetic body) 222 for detecting the position in the y-axis direction, and a Hall element 224 for detecting the position in the y-axis direction.

[0112] The position detection hall element 224 is a magnetic sensor that detects the magnetic field generated by the position detection magnet 222 in the y-axis direction, and has detection sensitivity to the movement of the position detection magnet 222 in the y-axis direction.

[0113] The magnet 222 for detecting position in the y-axis direction is provided on the flange portion 110B of the lens holding frame 110, and the Hall element 224 for detecting position is fixed to the base member 120.

[0114] The y-axis position detection unit 210 detects the position of the position detection magnet 222 in the y-axis direction using a position detection hall element 224, and detects the position of the lens holding frame 110 in the y-axis direction (i.e., the position of the shake correction lens 14 in the y-axis direction).

[0115] <Shake correction> A shake correction method using the optical vibration isolation device 100 (a drive control method for the optical vibration isolation device) will be described below.

[0116] When the shake correction function is turned on, shake correction is performed in digital camera 1. When the shake correction function is turned on, the amount of shake of digital camera 1 is detected by shake detection unit 70 shown in FIG. 3, and the amount of shake correction is calculated by shake correction amount calculation unit 90 based on the detection result. Then, based on the calculation result by shake correction amount calculation unit 90, the movement of shake correction lens 14 is controlled by shake correction control unit 60, and image shake is corrected. At this time, the movement of shake correction lens 14 is controlled based on a predetermined origin position, and the movement of shake correction lens 14 is controlled within a predetermined shake correction control range.

[0117] When the power of the digital camera 1 is turned off, the vibration correction lens 14 loses its holding force and falls freely. In this case, the vibration correction lens 14 is held by the stopper 164.

[0118] <Fixing structure of position detection hall element> As shown in FIG. 7, the Hall element 214 for detecting the position in the x-axis direction and the Hall element 224 for detecting the position in the y-axis direction are each packaged and mounted on a flexible printed circuit board 230.

[0119] This flexible printed circuit board 230 is fixed to the base member 120 by two sensor mounting members 240 , and as a result, the position detection hall elements 214 , 224 are fixed to the base member 120 .

[0120] First embodiment of sensor mounting member FIG. 8 is a perspective view showing a first embodiment of the sensor mounting member, and FIG. 9 is a plan view of the sensor mounting member shown in FIG.

[0121] The sensor mounting member 240 in this example is a molded product made of resin, and is made of a separate material from the base member 120. The material of the sensor mounting member 240 can be, for example, ABS resin, but is not limited to this, and various resins can be used.

[0122] However, it is preferable that the resin used for the sensor mounting member 240 has higher molding fluidity than the resin used for the base member 120. This is because, as will be described later, the sensor mounting member 240 has a shape with a larger ratio of overall length to cross-sectional area than any other part of the base member 120.

[0123] Furthermore, the base member 120 and the sensor mounting member 240 are preferably manufactured from different materials, and the sensor mounting member 240 is preferably made of a material with a lower elastic modulus than the base member 120, and further, the base member 120 is preferably made of a material with higher rigidity than the sensor mounting member 240.

[0124] In this example, the base member 120 is made of glass fiber reinforced PC resin containing glass fiber, and the sensor mounting member 240 is made of PC resin containing no glass fiber, so that the above material properties are satisfied.

[0125] Furthermore, the base member 120 and the sensor mounting member 240 are preferably made of materials with the same linear expansion coefficient. The sensor mounting member 240 is fixed to the base member 120, and by making both members from materials with the same linear expansion coefficient, dimensional changes (thermal stress) between them can be suppressed. The linear expansion coefficients of both members do not necessarily have to match perfectly; if the dimensional changes caused by the difference in linear expansion coefficients between them are sufficiently small compared to the detection error of the position detection Hall elements 214, 224, or are small enough not to affect the position detection accuracy of the position detection Hall elements 214, 224, the difference in linear expansion coefficients is acceptable.

[0126] 8 and 9, the sensor mounting member 240 has a U-shaped outer shape and a cantilevered elastic portion 242 extending toward the space in the center thereof. A protrusion 242A is formed at the tip of the elastic portion 242, which biases the position-detecting Hall element by the elastic force generated in the elastic portion 242.

[0127] The sensor mounting member 240 is also formed with a first positioning hole 245 and a second positioning hole 246, and further formed with fastening holes 247 and 248 through which fasteners (male screws) are inserted.

[0128] FIG. 10 is a plan view of the tip portion of the flexible printed circuit board, and FIG. 11 is a plan view showing a state in which a sensor attachment member is disposed on the tip portion of the flexible printed circuit board.

[0129] A Hall element 224 for detecting a position in the y-axis direction is mounted on the tip of the flexible printed circuit board 230 shown in FIG.

[0130] At the tip portion of the flexible printed circuit board 230, a third hole 235 and a fourth hole 236 corresponding to the first hole 245 and the second hole 246, respectively, for positioning the sensor mounting member 240, as well as fastening holes 237 and 238 corresponding to the fastening holes 247 and 248, respectively, of the sensor mounting member 240 are formed.

[0131] The third hole 235, the fourth hole 236, and the fastening holes 237, 238 formed in the flexible printed circuit board 230 are formed larger than the first hole 245, the second hole 246, and the fastening holes 247, 248 formed in the sensor mounting member 240. This is to allow the flexible printed circuit board 230 to move slightly with respect to the base member 120.

[0132] It goes without saying that the third hole 235, the fourth hole 236, and the fastening holes 237 and 238 similar to those described above are also formed in the portion of the flexible printed circuit board 230 where the x-axis position detection hall element 214 is mounted.

[0133] <Magnetic sensor fixing method> Next, we will explain a magnetic sensor fixing method in which a flexible printed circuit board 230 equipped with a Hall element 214 for position detection in the x-axis direction and a Hall element 224 for position detection in the y-axis direction is fixed to the base member 120 using two sensor mounting members 240, and the position detection Hall elements 214, 224 (magnetic sensors) are positioned and fixed.

[0134] FIG. 12 is a diagram showing how the flexible printed circuit board is arranged on the base member.

[0135] 11 and 12, a first pin 135 and a second pin 136 are integrally molded with the base member 120. The first and second positioning holes 245 and 246 formed in the sensor mounting member 240 and the first and second pins 135 and 136 formed in the base member 120 are position restriction parts that can directly restrict the positions of the sensor mounting member 240 and the base member 120.

[0136] The flexible printed circuit board 230 is movably arranged on one surface of the base member 120 (the surface facing the lens holding frame 110) with the third hole 235 and the fourth hole 236 formed in the flexible printed circuit board 230 loosely inserted into the first pin 135 and the second pin 136 of the base member 120, respectively.

[0137] Next, the first pin 135 and the second pin 136 of the base member 120 are inserted into the first hole 245 and the second hole 246 of the sensor mounting member 240, respectively, and the sensor mounting member 240 is positioned on the base member 120.

[0138] Thereafter, the sensor mounting member 240 is pressed into the flexible printed circuit board 230 .

[0139] FIG. 13 is a cross-sectional view taken along line 13-13 in FIG.

[0140] As shown in Figure 13, the elastic portion 242 of the sensor mounting member 240 has a tapered lower surface of the protruding portion 242A at its tip, and by pressing the sensor mounting member 240 toward the flexible printed circuit board 230, the position detection hall element 224 is pressed to the right in Figure 13 and moved together with the flexible printed circuit board 230.

[0141] At this time, one side of the package of the position detection Hall element 224 abuts against the two protrusions 134A, 134B of the positioning portion 134 of the base member 120, and the other side of the package abuts against the protrusion 242A at the tip of the elastic portion 242 of the sensor mounting member 240, and is pressed by the elastic force generated in the elastic portion 242.

[0142] As shown in Figures 12 and 13, the positioning portion 134 is formed with a recess 134C that avoids interference between the flexible printed circuit board 230 and the positioning portion 134 when the package of the position detection Hall element 224 abuts against the positioning portion 134 (two protrusions 134A, 134B).

[0143] The elastic portion 242 formed on the sensor mounting member 240 has a shape in which the ratio of its overall length to its cross-sectional area is large.

[0144] This is because, when using the elastic portion 242 as a spring as described above, a shape with a large ratio of overall length to cross-sectional area is advantageous in terms of spring characteristics. More specifically, the advantageous spring characteristics are, for example, that the spring displacement can be made large and changes in load due to displacement error are small.

[0145] Furthermore, the elastic portion 242 formed on the sensor mounting member 240 has a shape in which the ratio of its total length to its cross-sectional area is greater than the shape of any part of the base member 120 (for example, the fixed side spring hook portion 130, the first pin 135, the second pin 136, etc.).

[0146] One side of the package of the position-detection Hall element 224 (the side that abuts against the two protrusions 134A, 134B of the positioning portion 134) serves as a reference surface that is perpendicular to the y-axis direction, which is the detection direction of the position-detection Hall element 224, and this reference surface abuts against the two protrusions 134A, 134B of the positioning portion 134 that are integrally molded on the base member 120, thereby precisely positioning the position-detection Hall element 224 on the base member 120.

[0147] As a result, when the lens holding frame 110 (position detection magnet 222) moves left and right relative to the base member 120 in FIG. 13, the left and right position of the position detection magnet 222 can be detected with high precision.

[0148] Similarly, the Hall element 214 for detecting position in the x-axis direction can also be positioned on the base member 120 with high precision using the positioning portion 132 formed on the sensor mounting member 240 and the base member 120 .

[0149] Furthermore, by providing the positioning portions 132 and 134 integrally with the base member 120, the position detection hall elements 214 and 224 can be positioned with high precision relative to the base member 120, which serves as a reference for displacing the shake correction lens 14.

[0150] On the other hand, since the position-detecting Hall elements 214, 224 are brought into contact with the positioning portions 132, 134 using the two sensor mounting members 240 that are separate from the base member 120, when the spring force of the elastic portion 242 of the sensor mounting member 240 is used to bias the position-detecting Hall elements 214, 224, the sensor mounting member 240 can be configured as a separate part having a shape with a large ratio of overall length to cross-sectional area without being bound by processing restrictions such as molding conditions for the base member 120. This makes it possible to form the elastic portion 242 that has a long effective spring length and exhibits excellent spring characteristics, enabling stable positioning of the position-detecting Hall elements 214, 224.

[0151] Figure 14 is a plan view of the base member showing a state in which a flexible printed circuit board is placed on the base member and two position detection hall elements are positioned by two sensor mounting members.In the state shown in Figure 14, the sensor mounting member 240 has not yet been fixed to the base member 120.

[0152] FIG. 15 is a perspective view showing how the sensor mounting member is fixed to the base member with a fastener, and FIGS. 16(A) and 16(B) are a plan view and a side view, respectively, of the sensor mounting member.

[0153] As shown in Figures 15 and 16, two male screws 249A and 249B, which serve as fasteners, are threaded into screw holes 129A and 129B of the base member 120 through fastening holes 247 and 248 of the sensor mounting member 240, and the sensor mounting member 240 is fixed to the base member 120 with the flexible printed circuit board 230 sandwiched between them.

[0154] As a result, the flexible printed circuit board 230 (the position detection hall element mounted on the flexible printed circuit board 230) is also fixed to the base member 120. Note that the fastener for fixing the sensor attachment member 240 to the base member 120 is not limited to a combination of a male screw and a screw hole. Also, the flexible printed circuit board 230 is not shown in FIG. 15.

[0155] As fasteners that are highly accurate, strong, and easy to assemble, metal screws such as iron and stainless steel are usually used, but non-magnetic brass screws are used for the male screws 249A and 249B.

[0156] If a magnetic material is used as a fastener, there is a concern that it may disrupt the magnetic field of the magnet, causing position detection errors, or that the magnetic force of the magnet may hinder the movement of the lens holding frame. Therefore, it is desirable to use a non-magnetic material such as a non-magnetic metal or ceramic as a fastener, and when considering ease of assembly, it is most preferable to use screws made of a non-magnetic metal such as brass.

[0157] The two sensor mounting members 240 shown in FIG. 7 differ from those shown in FIG. 14 in that each is fixed to the base member 120 by two male screws 249A and 249B.

[0158] As shown in FIG. 7 and other figures, the sensor attachment member 240 also serves as a fixing member for fixing the flexible printed circuit board 230 to the base member 120.

[0159] Furthermore, since the position detection hall elements 214, 224 are also fixed in close contact with the surface of the base member 120, the sensor mounting member 240 also serves as a position restricting member that restricts the positions of the position detection hall elements 214, 224 (magnetic sensors) in the optical axis direction.

[0160] Second Embodiment of Sensor Mounting Member Fig. 17 is a perspective view showing a second embodiment of the sensor mounting member, and Fig. 18 is a plan view of the sensor mounting member shown in Fig. 17. In Fig. 17 and Fig. 18, parts that are common to the sensor mounting member 240 of the first embodiment shown in Fig. 8, Fig. 9, etc. are given the same reference numerals, and detailed description thereof will be omitted.

[0161] A sensor mounting member 250 of the second embodiment differs from the sensor mounting member 240 of the first embodiment in that an arch-shaped connecting portion 252 is integrally formed.

[0162] The connecting portion 252 connects the tips of a pair of mounting portions of the sensor mounting member 240 of the first embodiment, which has a U-shaped outer shape, and the sensor mounting member 250 as a whole has a frame-like shape with an elastic portion 242 and an opening in the center.

[0163] The sensor mounting member 250 of the second embodiment has increased rigidity compared to the sensor mounting member 240 of the first embodiment due to the connecting portion 252. As a result, for example, when the sensor mounting member 250 is pressed toward the flexible printed circuit board 230 during positioning of the position-detecting Hall element, only the elastic portion 242 deforms, and other portions do not deform.

[0164] Furthermore, the connecting portion 252 is formed in an arch shape, which prevents interference with the positioning portion 134 formed on the base member 120 .

[0165] Third embodiment of sensor mounting member Fig. 19 is a plan view showing a sensor mounting member according to a third embodiment. In Fig. 19, parts common to the sensor mounting member 240 according to the first embodiment shown in Figs. 8 and 9 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0166] In a sensor mounting member 260 of the third embodiment, the shape of an elastic portion 262 formed on the sensor mounting member 260 differs from the shape of the elastic portion 242 formed on the sensor mounting member 240 of the first embodiment.

[0167] The elastic portion 262 of the sensor mounting member 260 is bent in a hairpin shape, and its overall length is longer than the overall length of the elastic portion 242 formed in the sensor mounting member 240 .

[0168] As a result, the elastic portion 262, which functions as a spring that presses the position detection hall element 224, can have a long effective length, so that the load changes little in response to errors in the amount of displacement.In addition, since the internal stress is small, it exhibits excellent spring characteristics with little decrease in load due to "sagging" or the like, and can position the position detection hall element 224 more stably.

[0169] <Fourth embodiment of sensor mounting member> Fig. 20 is a plan view showing a fourth embodiment of the sensor mounting member. In Fig. 20, parts common to the sensor mounting member 240 of the first embodiment shown in Figs. 8 and 9 are given the same reference numerals, and detailed description thereof will be omitted.

[0170] The sensor mounting member 270 of the fourth embodiment, like the sensor mounting member 260 of the third embodiment shown in Figure 19, has an elastic portion 272 formed on the sensor mounting member 270 that has a different shape from the elastic portion 242 formed on the sensor mounting member 240 of the first embodiment.

[0171] The elastic portion 272 of the sensor mounting member 270 extends from a central member that connects the pair of mounting portions of the sensor mounting member 270 and is bent in a hairpin shape. The overall length of the elastic portion 272 is longer than the overall length of the elastic portion 262 formed in the sensor mounting member 260 of the third embodiment.

[0172] As a result, the elastic portion 272, which functions as a spring that presses the position detection hall element 224, exhibits excellent spring characteristics with a long effective length of the spring, and can position the position detection hall element 224 more stably.

[0173] Other Embodiments of Position Detection Unit FIG. 21 is a diagram showing another embodiment of the position detector for detecting the position of the lens holding frame.

[0174] The position detection unit shown in FIG. 21 includes a position detection magnet 211 and a position detection hall element 226.

[0175] The position detection magnet 211 is a two-pole magnet having a magnetized portion magnetized with two poles. The position detection magnet 211 is disposed in the lens holding frame 110.

[0176] The position detection Hall element 226 differs from the position detection Hall elements 214 and 224, which are configured as linear Hall ICs with two Hall elements built into a package, in that the position detection Hall element 226 is configured as a linear Hall IC with one Hall element built into a package.

[0177] When the position detection magnet 211 moves from the reference position shown in FIG. 21 to the left or right in FIG. 21 and the N pole of the position detection magnet 211 approaches, the output voltage of the position detection hall element 226 increases in accordance with the strength of the N pole, and when the S pole approaches, the output voltage decreases in accordance with the strength of the S pole. To descend.

[0178] 21 has sensitivity to the movement of the position detection magnet 211 in the left-right direction in FIG. 21, and can detect the movement position of the lens holding frame 110.

[0179] [others] In this embodiment, a case has been described in which a Hall element is used as a magnetic sensor for detecting a change in the magnetic field of a magnetic body, but the present invention is not limited to this, and for example, an MR (Magneto Resistive) sensor can also be applied.

[0180] The sensor mounting member in this example is a molded product made of resin, but is not limited to this and may be made of processed non-magnetic metal or ceramic.

[0181] In this embodiment, the base member and the sensor mounting member are made of different materials. However, this is not limiting. Even if the materials are the same, the sensor mounting member may be made of a separate component. For example, if the base member and the sensor mounting member are injection-molded from the same polycarbonate (PC) containing 30% glass fiber, if the mold used to mold the base member and the mold used to mold the sensor mounting member are different, the mold itself is smaller for the sensor mounting member, making it easier to receive injection pressure from the gate and control molding conditions such as temperature. This allows for the creation of relatively fine and complex structures with high precision compared to a larger mold used for the base member. For example, in the case of a spring, a thin and long spring can be constructed using a small part, resulting in a spring that is stress-stable and resistant to sagging.

[0182] Even in the case of a structure other than a spring, the shape of the structural part that applies the contact force is not subject to the processing restrictions of the base member, which is a large component, so a structure that applies a stable contact force can be realized.

[0183] As another example, even in the case of cutting, the smaller the processing size, the smaller the range of movement of the blade, allowing the selection of a processing machine more suitable for fine processing (a processing machine with a short blade movement distance).In this way, even if the material is the same, by configuring the sensor mounting member as a separate member, it is possible to create relatively fine part shapes with high precision without being restricted by the processing and molding conditions of the base member, and it is possible to apply a stable contact force to the positioning part initially and over time.

[0184] Furthermore, the sensor mounting member only needs to have at least a pressing portion that causes the magnetic sensor to abut against the positioning portion of the base member.

[0185] The substrate on which the magnetic sensor is mounted is not limited to a flexible printed circuit board, but may be a non-flexible printed circuit board.

[0186] Furthermore, in the above embodiment, a digital camera equipped with an optical vibration isolation device has been described, but the application of the optical vibration isolation device to optical devices is not limited to digital cameras, and can also be applied to other optical devices, including various imaging devices such as so-called silver halide cameras, television cameras, and video cameras, as well as lens devices used in imaging devices.

[0187] Furthermore, it goes without saying that the present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the present invention. [Explanation of symbols]

[0188] 1. Digital camera 10 Imaging optical system 12 Focus Lens 12A Focus lens drive unit 14 Image stabilization lens 16 apertures 16A Aperture drive unit 20 Image Sensor 20A Image sensor driver 21 Position detection magnet 22 Analog signal processing section 24 Digital Signal Processing Unit 30 Display section 32 Storage section 34 Control section 40 Angular velocity detection unit 40A Yaw direction angular velocity detector 40B Pitch direction angular velocity detection unit 50 Camera microcomputer 52 Focus control section 54 Exposure setting section 56 Image sensor drive control unit 58 Aperture control section 60 Image stabilization control unit 62 Display control unit 64 Memory control unit 70 Shake detection unit 90 Shake correction amount calculation unit 100 Optical vibration isolation device 110 Lens holding frame 110A Lens holder 110B flange 112 Movable side spring hook 114 Guide part 114A Guide groove 116 Movable side ball receiving section 120 Base material 120A Telescope tube 120B opening 124 balls 126 Spring 128 Fixed side ball receiving section 129A, 129B screw holes 130 Fixed side spring hook 132, 134 Positioning part 134A, 134B protrusion 134C Relief 135 First Pin 136 2nd pin 140 Rotation control part 142 Guide shaft 144 Swing base member 146 Bracket 146A base 146B Arm 148 Swing Axis 150 Shaft base member 160 Movable range control part 162 Movable range restriction hole 164 Stopper 180 x-axis direction drive unit 182A, 182B x-axis direction drive magnets 184 x-axis direction drive coil 190 y-axis drive unit 192A, 192B y-axis direction drive magnets 194 y-axis drive coil 200A, 200B Yoke 202A, 202B screws 210, 220 Position detection unit 211, 212, 222 Position detection magnets 214 Hall element for position detection 224, 226 Hall element for position detection 230 Flexible Printed Circuit Board 235 Hole 3 236 Hole 4 237, 238 Fastening holes 240, 250, 260, 270 Sensor mounting parts 242, 262, 272 Elastic part 242A Protrusion 245 Hole 1 246 Hole 2 247, 248 Fastening holes 249A, 249B male thread 252 Connecting part

Claims

1. A base member; a lens holding frame configured to be movable along a plane perpendicular to the optical axis relative to the base member; a magnetic body that moves integrally with the lens holding frame and generates a magnetic field; a magnetic sensor that detects a change in a magnetic field in response to movement of the lens holding frame; a sensor mounting member configured so that only the elastic portion is deformed and other portions are not deformed; the base member has a positioning portion, the sensor mounting member positions the magnetic sensor by bringing the magnetic sensor into contact with the positioning portion due to deformation of the elastic portion; Optical vibration isolation device.

2. The magnetic sensor is mounted on a printed circuit board, the printed circuit board is fixed to the base member at a position between the lens holding frame and the base member; 2. The optical vibration isolation device according to claim 1.

3. the positioning portion has a recess portion that prevents interference with the printed circuit board when the magnetic sensor contacts the positioning portion.

3. The optical vibration isolation device according to claim 2.

4. The printed circuit board is a flexible printed circuit board.

4. The optical vibration isolation device according to claim 2.

5. the base member has a first position restriction portion that restricts the position of the sensor mounting member relative to the base member, the sensor mounting member has a second position restricting portion that is restricted in position relative to the base member by the first position restricting portion; 5. The optical vibration isolation device according to claim 1.

6. the base member has a first pin and a second pin as the first position restriction portion, The sensor mounting member has a first hole and a second hole formed as the second position restriction portion, the sensor mounting member is positioned on the base member by inserting the first pin and the second pin into the first hole and the second hole, respectively; 6. The optical vibration isolation device according to claim 5.

7. The sensor mounting member is formed with a fastening hole through which a fastener is inserted, the sensor mounting member is fixed to the base member via a fastener that is inserted through the fastening hole and fixed to the base member; 7. The optical vibration isolation device according to claim 1.

8. the sensor mounting member also serves as a position restricting member that restricts the position of the magnetic sensor in the optical axis direction; 8. The optical vibration isolation device according to claim 1.

9. The sensor mounting member also serves as a fixing member for fixing the printed circuit board to the base member.

5. The optical vibration isolation device according to claim 2.

10. The sensor mounting member has an elastic portion, and an elastic force generated in the elastic portion biases the magnetic sensor to contact the positioning portion.

10. The optical vibration isolation device according to claim 1.

11. The base member and the sensor mounting member are each molded from resin.

11. The optical vibration isolation device according to claim 1.

12. the sensor mounting member is a molded product made of a resin having a higher molding fluidity than the base member; 12. The optical vibration isolation device according to claim 11.

13. The base member and the sensor mounting member are made of different materials.

13. The optical vibration isolation device according to claim 1.

14. The sensor mounting member is made of a material having a lower elastic modulus than the base member.

14. An optical vibration isolation device according to claim 1.

15. The base member and the sensor mounting member are made of materials having the same linear expansion coefficient.

15. The optical vibration isolation device according to claim 1.

16. The base member is made of a material having higher rigidity than the sensor mounting member.

16. An optical vibration isolation device according to claim 1.

17. the magnetic body is a magnet provided in the lens holding frame; 17. An optical vibration isolation device according to claim 1.

18. An optical device comprising the optical vibration isolation device according to any one of claims 1 to 17.

19. a magnetic sensor fixing method for an optical vibration isolation device comprising: a base member having a positioning portion; a lens holding frame configured to be movable relative to the base member along a plane perpendicular to the optical axis; a magnetic body that moves integrally with the lens holding frame and generates a magnetic field; a magnetic sensor that detects changes in the magnetic field in response to movement of the lens holding frame; a printed circuit board on which the magnetic sensor is mounted; and a sensor mounting member configured so that only an elastic portion is deformed and other portions are not deformed, wherein the lens holding frame is moved within a plane perpendicular to the optical axis, the printed circuit board is disposed on a surface of the base member facing the lens holding frame; deforming the elastic portion of the sensor mounting member, and urging the magnetic sensor mounted on the printed circuit board by an elastic force generated in the elastic portion; The magnetic sensor is pressed toward the positioning portion by the elastic force and moved together with the printed circuit board, and the magnetic sensor is positioned by contacting the positioning portion with the sensor mounting member. Magnetic sensor fixing method.

Images