Hard Transaction Card

Abstract

The transaction card may be made of a hard material such as glass, stone, ceramic, etc. The transaction card may have a first hard layer having a first exterior surface and a first interior surface with a pocket in the first exterior surface of the first hard layer. The transaction card may have a second hard layer having a second exterior surface and a second interior surface. A bonding layer may be located between the first hard layer and the second hard layer may affix the first hard layer to the second interior layer. The integrated circuit chip may be affixed within the pocket of the first hard layer. A rim may extend from the first exterior surface of the first hard layer, around a first edge of the first hard layer and a second edge of the second hard layer, and onto the second exterior surface of the second hard layer.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to and benefit of co-pending U.S. patent application Ser. No. 17 / 494,408, entitled "RIGID TRANSACTION CARD," filed October 5, 2021, the entire contents of which are incorporated by reference as if set forth herein. [Background technology]

[0002] Transaction cards are used for payments in a variety of situations. For transaction accounts targeted at the affluent or luxury market, companies may sell transaction cards that are made from non-traditional materials or have non-traditional designs, allowing them to market and promote the transaction account as a premium or luxury service. [Brief explanation of the drawings]

[0003] Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals indicate corresponding parts throughout the several views.

[0004] [Figure 1] 1 depicts an example of an assembled transaction card according to various embodiments of the present disclosure. [Figure 2] 1 depicts a cross-sectional view of a transaction card according to various embodiments of the present disclosure. [Figure 3] 1 depicts an exploded view of an exemplary configuration of a transaction card. [Figure 4] 1 depicts an exploded view of an exemplary configuration of a transaction card. [Figure 5] 1 depicts an exploded view of an exemplary configuration of a transaction card. [Figure 6] 1 depicts an exploded view of an exemplary configuration of a transaction card. [Figure 7]1 is a flowchart providing an example of a process for manufacturing a transaction card according to various embodiments of the present disclosure. [Figure 8A] 8 illustrates an example of a metal sheet used in the manufacturing process described by the flowchart of FIG. 7. [Figure 8B] 8 illustrates an example of a metal sheet used in the manufacturing process described by the flowchart of FIG. 7. [Figure 9A] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. [Figure 9B] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. [Figure 9C] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. [Figure 9D] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. [Figure 9E] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. [Figure 9F] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. [Figure 9G] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. [Figure 9H] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. [Figure 9I] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. [Figure 9J] 8A and 8B provide an illustration of the individual parts of the manufacturing process described by the flow chart of FIG. 7, using the metal sheet illustrated in FIGS. 8A and 8B. DETAILED DESCRIPTION OF THE INVENTION

[0005] Various approaches are disclosed for creating transaction cards using multiple layers of rigid material. A transaction card can be assembled from several layers of rigid material. These layers can be bonded together using a binder or other bonding material (e.g., glue, cement, or other adhesive). The edges of the transaction card can be covered with a rim, such as a metal band. The binder material and metal band can provide structural integrity in the event that one or more of the layers of rigid material break, crack, or split. The rim or metal band can also prevent the layers of rigid material from breaking, cracking, or splitting in response to an impact (e.g., if the transaction card is dropped and lands edge-first on a hard surface).

[0006] The following discussion provides a general description of transaction cards and methods for their manufacture. While the following discussion provides illustrative examples of various embodiments of the present disclosure, the use of the following illustrative examples is not intended to exclude other implementations consistent with the disclosed principles.

[0007] 1 depicts an example of an assembled transaction card 100 according to various embodiments of the present disclosure. In this example, transaction card 100 is made of several transparent layers, allowing one to see through to the body of transaction card 100. Transaction card 100 may have a rim 103 along the edge of transaction card 100, which may help prevent the transaction card from cracking or shattering if dropped or dropped on a solid surface. Rim 103 may also provide additional structural integrity to transaction card 100 by holding the layers of transaction card 100 together. Transaction card 100 may also include antenna 106, processing chip 109, and / or magnetic stripe 113.

[0008] The antenna 106 can be used to provide wireless communication between the processing chip 109 and the contactless payment terminal. The antenna 106 can also be used to provide power from the payment terminal to the processing chip 109. In some implementations, the antenna 106 can be physically coupled to the processing chip 109, while in other implementations, the antenna 106 can be inductively coupled to the processing chip 109. Although depicted separately from the processing chip 109, in some implementations the antenna can be included in or integrated with the processing chip 109 to form a single unit.

[0009] Processing chip 109 may represent any integrated circuit chip that can be used to secure or process payments using transaction card 100. Examples of processing chip 109 include integrated circuit chips that implement various versions of the Europay, Mastercard, and VISA (EMV) standards for smart payment cards. In some implementations, processing chip 109 is coupled to antenna 106 and provides contactless payments using near-field communication (NFC), ultra-wide band (UWB), or similar low-power, short-range wireless communication standards. However, in other implementations, processing chip 109 may include an integrated antenna 106.

[0010] The magnetic stripe 113 may include any band of magnetic material capable of storing data. The data stored on the magnetic stripe 113 may include, for example, information such as the account number of a payment account associated with the transaction card 100, the expiration date of the payment account, a card verification value (CVV) or card verification code (CSC), a service code, and the like.

[0011] 2 depicts a cross-sectional view of a transaction card 100 according to various embodiments of the present disclosure. Several layers are depicted in this cross-sectional view. These layers may include an upper rigid layer 203 and a lower rigid layer 206. A bonding layer 209 is disposed between the upper rigid layer 203 and the lower rigid layer 206. The processing chip 109 is disposed within a pocket 213 on the outer surface of the upper rigid layer 203 such that the surface of the processing chip 109 is flush with the surface of the upper rigid layer 203. The processing chip 109 may be secured within the pocket 213 using any suitable adhesive. The antenna 106 and magnetic stripe 113 may be disposed within the bonding layer 209 between the upper rigid layer 203 and the lower rigid layer 206.

[0012] The upper rigid layer 203 and the lower rigid layer 206 can be formed from a number of rigid materials. For example, the upper rigid layer 203 or the lower rigid layer 206 can be formed from chemically strengthened glass, which has increased strength as a result of the manufacturing process. Examples of chemically strengthened glass include glass sold under the trademark GORILLA GLASS®, alkali aluminosilicate glass, and the like. The use of chemically strengthened glass, when combined with the transparent-translucent bonding layer 209, allows for the production of a transparent or translucent transaction card 100. As another example, the upper rigid layer 203 or the lower rigid layer 206 can be formed from a ceramic material, including a transparent ceramic material such as aluminum oxynitride, also known as transparent aluminum. In some embodiments, the upper rigid layer 203 or the lower rigid layer 206 can be formed from stone, such as black onyx, red onyx, or other stone.

[0013] The bonding layer 209 is a layer containing a bonding medium that bonds the upper rigid layer 203 and the lower rigid layer 206. Any suitable bonding medium can be used for the bonding layer 209. Examples of bonding mediums include various types of adhesives, such as adhesives, laminates, cements, etc. Some bonding mediums are preferred for particular configurations. For example, if a transparent or translucent transaction card 100 is manufactured using transparent or translucent materials for the upper rigid layer 203 and the lower rigid layer 206, a transparent or translucent adhesive, adhesive laminate, or other adhesive or bonding medium can be used. If an opaque material is used for the upper rigid layer 203 or the lower rigid layer 206, other bonding mediums can be used for the bonding layer 209.

[0014] The location of bonding layer 209 between upper rigid layer 203 and lower rigid layer 206 provides additional structural integrity to transaction card 100. If transaction card 100 were constructed from a single rigid layer and the single rigid layer were to crack, shatter, or split, transaction card 100 could separate into multiple pieces. If this occurred in a person's hand, wallet, or pocket, such separation could result in the pieces becoming individually severed, creating a safety hazard. The placement of bonding layer 209 between upper rigid layer 203 and lower rigid layer 206 allows the card to remain whole even if upper rigid layer 203 or lower rigid layer 206 is damaged. For example, rather than shattering, upper rigid layer 203 or lower rigid layer 206 may crack but remain adhered to bonding layer 209.

[0015] 2, the rim 103 extends from the outer surface of the upper rigid layer 203 around the edge of the transaction card 100 to the outer surface of the lower rigid layer 206. As a result, the rim 103 acts like a clamp to hold the upper and lower rigid layers 203 and 206 together, preventing them from separating from the transaction card 100 in the event of a failure of the bonding medium in the bonding layer 209, which may occur due to wear and tear over the life of the transaction card 100. Additionally, the rim 103 acts as a shock absorber in the event that the transaction card 100 is dropped or otherwise caused by an edge striking a surface, thereby preventing the upper or lower rigid layer 203 or 206 from shattering or cracking due to the impact.

[0016] FIG. 3 depicts an exploded view of one exemplary configuration of transaction card 100. Starting from the top and proceeding to the bottom of FIG. 3, processing chip 109 is shown positioned within pocket 213 on the outer surface of upper rigid layer 203. Processing chip 109 may be secured within pocket 213 using any suitable adhesive. Antenna 106 may be positioned below upper rigid layer 203. Antenna 106 may include a coil below processing chip 109, thereby inductively coupling antenna 106 to processing chip 109. Bonding layer 209 is located below upper rigid layer 203 and antenna 106. Magnetic stripe 113 may be positioned below bonding layer 209. At the bottom is lower rigid layer 206. Surrounding upper rigid layer 203 and lower rigid layer 206 is rim 103. Although the rim 103 is depicted as two pieces for illustrative purposes, it is understood that the rim 103 is a single piece, as depicted in cross section in FIG.

[0017] FIG. 4 depicts an exploded view of another exemplary configuration of transaction card 100. Starting from the top and proceeding to the bottom of FIG. 4 , processing chip 109 is shown positioned within pocket 213 on the outer surface of upper rigid layer 203. Processing chip 109 may be secured within pocket 213 using any suitable adhesive. The bottom of pocket 213 in upper rigid layer 203 may have a plurality of holes 403. Antenna 106 may be positioned below upper rigid layer 203. Antenna 106 may be physically coupled to processing chip 109 by threading wires through individual ones of holes 403 located at the bottom of the pocket. Bonding layer 209 is located below upper rigid layer 203 and antenna 106. Magnetic stripe 113 may be located below bonding layer 209. At the bottom is lower rigid layer 206. Surrounding the upper and lower rigid layers 203, 206 is a rim 103. While the rim 103 is depicted as two pieces for illustrative purposes, it is understood that the rim 103 is a single piece, as depicted in cross section in FIG.

[0018] FIG. 5 depicts an exploded view of another exemplary configuration of transaction card 100. Starting from the top and proceeding to the bottom of FIG. 5, processing chip 109 is shown positioned within pocket 213 on the outer surface of upper rigid layer 203. Processing chip 109 may be secured within pocket 213 using any suitable adhesive. In contrast to the examples depicted in FIGS. 3 and 4, an antenna is not positioned below upper rigid layer 203. In the example depicted in FIG. 5, processing chip 109 may include an integrated antenna 106. A bonding layer 209 is located below upper rigid layer 203 and antenna 106. Magnetic stripe 113 may be positioned below bonding layer 209. At the bottom is lower rigid layer 206. Surrounding upper rigid layer 203 and lower rigid layer 206 is rim 103. Although the rim 103 is depicted as two pieces for illustrative purposes, it is understood that the rim 103 is a single piece, as depicted in cross section in FIG.

[0019] FIG. 6 depicts an exploded view of another exemplary configuration of transaction card 100. Starting from the top and proceeding to the bottom of FIG. 6 , processing chip 109 is shown positioned within pocket 213 on the outer surface of upper rigid layer 203. Processing chip 109 may be secured within pocket 213 using any suitable adhesive. The bottom of pocket 213 in upper rigid layer 203 may have a plurality of holes 403. Antenna 106 may be positioned below upper rigid layer 203. Antenna 106 may be physically coupled to processing chip 109 by threading wires through individual ones of holes 403 located at the bottom of the pocket. Bonding layer 209 is located below upper rigid layer 203 and antenna 106. Below bonding layer 209 is lower rigid layer 206. Magnetic stripe 113 may be positioned on the outer surface of lower rigid layer 206. In some embodiments, the outer surface of the lower rigid layer 206 may include a channel 603. In these embodiments, the magnetic stripe 113 may rest within the channel 603 such that the surface of the magnetic stripe 113 is flush with the outer surface of the lower rigid layer 206. Surrounding the upper rigid layer 203 and the lower rigid layer 206 is a rim 103. While the rim 103 is depicted as two pieces for illustrative purposes, it is understood that the rim 103 is a single piece, as depicted in the cross-sectional view of FIG.

[0020] 3-6 depict example implementations according to various embodiments of the present disclosure, other configurations are within the scope of the present disclosure. For example, the implementation depicted in FIG. 3 or 5 may be modified to position magnetic stripe 113 on the outside of transaction card 100 rather than between upper rigid layer 203 and lower rigid layer 206. As another example, the relative positions of magnetic stripe 113, antenna 106, and bonding layer 209 between upper rigid layer 203 and lower rigid layer 206 may be switched without affecting the functionality of various embodiments of the present disclosure.

[0021] Referring now to FIG. 7 , a flowchart is shown providing an example of a process for manufacturing a transaction card 100, according to various embodiments of the present disclosure. While the flowchart of FIG. 7 depicts an exemplary series of operations, it is understood that the order of the operations may differ from that depicted. For example, operations depicted by two or more blocks shown in succession may be performed concurrently or with partial concurrence. As another example, operations depicted by two or more blocks may be performed in a different sequence than that depicted. Furthermore, in some embodiments, one or more of the blocks depicted in the flowchart of FIG. 7 may be skipped or omitted. It is understood that all such variations are within the scope of the present disclosure.

[0022] Beginning at block 703, the lower rigid layer 206 of the transaction card 100 may be placed into a first recess in a first metal sheet. According to various embodiments of the present disclosure, the metal sheet may have multiple recesses, allowing the transaction card 100 to be mass produced on an assembly line.

[0023] Next, at block 706, the magnetic stripe 113 may be placed on the lower rigid layer 206 of the transaction card 100. In some implementations, the magnetic stripe 113 may be affixed to the lower rigid layer 206 using an adhesive. In other implementations, the magnetic stripe 113 may have an adhesive backing that causes the magnetic stripe 113 to self-adhere when placed in contact with the lower rigid layer 206. In some implementations, the placement of the magnetic stripe 113 may be omitted (e.g., for embodiments of the transaction card 100 that are not manufactured to include a magnetic stripe 113).

[0024] Next, in block 709, bonding layer 209 can be placed on lower rigid layer 206. The bonding medium that forms bonding layer 209 can be deposited using any number of techniques. For example, an adhesive or similar adhesive can be sprayed onto lower rigid layer 206. As another example, an adhesive sheet can be placed on lower rigid layer 206.

[0025] Proceeding to block 713, the antenna 106 may be disposed on the bonding layer 209. This step may be omitted in embodiments using a processing chip 109 that includes an integrated antenna 106. Additionally, the antenna placement in block 713 may occur earlier. For example, the magnetic strip 113 and antenna 106 may be disposed between the lower rigid layer 206 and the bonding layer 209.

[0026] Proceeding to block 716, the upper rigid layer 203 may be disposed on the antenna 106 and / or bonding layer 209. For example, if the antenna 109 was not disposed on the bonding layer 209 in block 713 (e.g., because a processing chip 109 with an integrated antenna 106 was used), the upper rigid layer 203 may be disposed directly on the bonding layer 209. As another example, if the antenna 109 was disposed below the bonding layer 209, the upper rigid layer 203 may be disposed directly on the bonding layer 209. However, if the antenna 109 had previously been disposed on the bonding layer 209, a portion of the upper rigid layer 203 would be in contact with the antenna 106 and another portion of the upper rigid layer 203 would be in contact with the bonding layer 209, resulting in the upper rigid layer 203 being disposed on both the antenna 106 and the bonding layer 209.

[0027] Next, in block 719, the treatment chip 109 can be affixed to the upper rigid layer 203. For example, an adhesive can be deposited in the pocket 213 of the upper rigid layer 203. The treatment chip 109 can then be placed in the pocket 213. The adhesive in the pocket 213 can then affix the treatment chip 109 to the upper rigid layer 203. In some embodiments, the placement of the treatment chip 109 can occur before fusing the first metal sheet and the second metal sheet to improve adhesion of the treatment chip 109 to the upper rigid layer 203 or to adhere the treatment chip 109 to the upper rigid layer 203. However, in other embodiments, the affixing of the treatment chip 109 to the upper rigid layer 203 can occur after the first metal sheet is fused to the second metal sheet.

[0028] Next, at block 723, a second metal sheet may be placed over the first metal sheet, the second metal sheet having second recesses corresponding to the first recesses of the first metal sheet. As will be discussed below, the first metal sheet and the second metal sheet may be fused together to form the rim 103 of the transaction card 100 that surrounds all of the layers of the transaction card 100.

[0029] Referring now to block 726, the first metal sheet and the second metal sheet may be fused together to form a fused metal sheet. For example, heat and pressure may be used to fuse the two metal sheets together. The heat and pressure used to fuse the two metal sheets together may also cause the bonding medium of bonding layer 209 to adhere upper rigid layer 203 to lower rigid layer 206 in those embodiments using a heat or pressure activated bonding medium.

[0030] The fused metal sheet may then be cut along the edges of the recess at block 729 to remove the transaction card 100, leaving behind the rim 103 formed by fusing the metal sheet at block 726. The cutting may be performed using a variety of tools, including die cutters, laser cutters, rotary cutters, etc. Once the transaction card 100 is cut from the metal sheet, it may be engraved or embossed as desired by the issuer of the transaction card 100.

[0031] 8A illustrates an example of a metal sheet 800 used in the manufacturing process described by the flowchart of FIG. 7. As shown, the metal sheet 800 may include one or more recesses 803. Each recess 803 corresponds to the shape and dimensions of the upper rigid layer 203 and / or lower rigid layer 206 of the transaction card 100. Each recess 803 also has a lip 806 that extends onto the outer surface of the upper rigid layer 203 and / or lower rigid layer 206 when the upper rigid layer 203 or lower rigid layer 206 is positioned within the recess 803. The bottom of the recess 803 may form a hollow cavity or opening.

[0032] 8B depicts a second view of metal sheet 800 used in the manufacturing process described by the flowchart of FIG. 7, where a partial cross-sectional view showing recess 803 in metal sheet 800 is depicted in accordance with various embodiments of the present disclosure. As shown, recess 803 matches the shape and dimensions of upper rigid layer 203 and / or lower rigid layer 206 of transaction card 100. Recess 803 also has a lip 806 that extends onto the outer surface of upper rigid layer 203 and / or lower rigid layer 206 when upper rigid layer 203 or lower rigid layer 206 is disposed within recess 803. The bottom of recess 803 may form a hollow cavity or opening.

[0033] 9A-9J provide illustrations of individual portions of the manufacturing process described by the flowchart of FIG. 7 for producing transaction card 100 using metal sheet 800 illustrated in FIGS. 8A and 8B.

[0034] 9A shows a first metal sheet 800a being placed on an assembly line conveyor belt 900 in an exemplary embodiment of the present disclosure. As shown, an industrial robot or machine can place the metal sheet 800a on the assembly line conveyor belt 900.

[0035] 9B illustrates an exemplary approach for placing the lower rigid layer 206 within the recesses 803 of the first metal sheet 800, as described above in block 703 of FIG. 7. As shown, an industrial robot or machine can place an individual lower rigid layer 206 into each recess 803 of the first metal sheet 800.

[0036] 9C illustrates an exemplary technique for placing magnetic stripes 113 on lower rigid layer 206, as previously described in block 706 of FIG. 7. As depicted, each magnetic stripe 113 is individually placed by an industrial robot. However, other techniques, such as rollers, can also be used to apply magnetic stripes 113.

[0037] 9D illustrates an exemplary approach for disposing bonding layer 209 over lower rigid layer 206 and magnetic stripe 113, as described above in block 709 of FIG. 7. For example, one or more drops of adhesive or similar adhesive may be deposited by an industrial robot or machine, and as the adhesive or adhesive spreads under pressure, it will form bonding layer 209. As another example, an industrial robot or machine may be used to deposit individual sheets of laminate, adhesive laminate, or other adhesive.

[0038] Figure 9E illustrates an exemplary technique for placing antenna 106 on bonding layer 209, as described above in block 713 of Figure 7. As illustrated, an industrial robot or machine can place antenna 106 on bonding layer 209.

[0039] Figure 9F illustrates an exemplary approach for placing the upper rigid layer 203 on the antennas 106 and / or bonding layer 209, as described above in block 716 of Figure 7. As shown, an industrial robot or machine can place an individual upper rigid layer 206 on each antenna 106 and / or bonding layer 209.

[0040] 9G illustrates an example of placing processing chips 109 into pockets 213 of each upper rigid layer 203, as described above in block 719 of FIG. 7. As shown here, each processing chip 109 is placed directly into pocket 213 by an industrial robot or machine without first depositing an adhesive in pocket 213. This can be done if the processing chip 109 is self-adhesive (e.g., because the processing chip 109 has an adhesive on its backing). If adhesive is first deposited into pocket 213, additional stations along conveyor belt 900 may be desirable.

[0041] Figure 9H illustrates an example of placing a second metal sheet 800b on top of a first metal sheet 800a, as previously described in block 723 of Figure 7. As shown, an industrial robot or machine can place the second metal sheet 800b on top of the first metal sheet 800a on a conveyor belt 900 of an assembly line.

[0042] 9I illustrates an example of fusing a first metal sheet 800a to a second metal sheet 800b, as described above in block 726 of FIG. 7. As shown, a heat press 903 can be used to apply heat and / or pressure to the metal sheet 800, the upper rigid layer 203, and the lower rigid layer 206. This can fuse the first metal sheet 800a to the second metal sheet 800b. This can also, in some embodiments, allow the bonding medium of the bonding layer 209 to adhere the first metal sheet 800a to the second metal sheet 800b.

[0043] Figure 9J illustrates an example of cutting the fused metal sheet to remove individual transaction cards 100, as previously described in block 729 of Figure 7. While Figure 9J illustrates the use of a cutting die, other cutting tools may be used in accordance with various embodiments of the present disclosure.

[0044] Disjunctive language such as the phrase "at least one of X, Y, or Z," unless otherwise specified, is understood in conjunction with the context as generally used to indicate that an item, term, etc. can be either X, Y, or Z, or any combination thereof (e.g., X; Y; Z; X or Y; X or Z; Y or Z; X, Y, or Z; etc.). Thus, such disjunctive language generally does not and should not imply that at least one of X, at least one of Y, or at least one of Z must each be present in a particular embodiment.

[0045] Various embodiments of the present disclosure are described in the following clauses: The following clauses describe some embodiments of the present disclosure, although other embodiments of the present disclosure are also described above.

[0046] Clause 1 - A transaction card comprising: a first rigid layer having a first exterior surface and a first interior surface, the first rigid layer comprising a pocket within the first exterior surface of the first rigid layer; a second rigid layer having a second exterior surface and a second interior surface; a bonding layer between the first rigid layer and the second rigid layer, the bonding layer comprising a bonding medium bonding the first interior surface of the first rigid layer to the second interior surface of the second interior layer; an integrated circuit chip attached within the pocket of the first rigid layer; and a metal band extending from the first exterior surface of the first rigid layer, surrounding a first edge of the first rigid layer and a second edge of the second rigid layer, onto the second exterior surface of the second rigid layer.

[0047] Clause 2 - The transaction card of clause 1, further comprising a magnetic stripe attached to the second rigid layer and positioned between the first rigid layer and the second rigid layer.

[0048] Clause 3 - The transaction card of clause 1 or clause 2, further comprising an antenna positioned between the first rigid layer and the second rigid layer, the antenna inductively coupled to the integrated circuit chip.

[0049] Clause 4 - A transaction card as described in any one of clauses 1 to 3, further comprising an antenna positioned between the first rigid layer and the second rigid layer, the antenna connected to the integrated circuit chip via a contact pad.

[0050] Clause 5 - A transaction card according to any one of clauses 1 to 4, wherein the integrated circuit chip further comprises an antenna.

[0051] Clause 6 - The transaction card of any one of clauses 1 to 5, wherein the first hard layer and the second hard layer comprise chemically strengthened glass.

[0052] Clause 7 - A method comprising the steps of: placing a first rigid layer of a transaction card within a first recess of a first metal sheet; placing a bonding layer on the first rigid layer of the transaction card, the bonding layer comprising a bonding medium; placing a second rigid layer on the bonding layer; placing a second metal sheet on the first metal sheet; and fusing the first metal sheet with the second metal sheet to form a fused metal sheet.

[0053] Clause 8 - The method of clause 7, further comprising the step of disposing an antenna between the first rigid layer and the second rigid layer.

[0054] Clause 9 - The method of clause 7 or clause 8, further comprising the step of attaching an integrated circuit chip within the pocket of the second rigid layer.

[0055] Clause 10 - The method of any one of clauses 7 to 9, further comprising the step of cutting the fused metal sheet at the boundary of the second recess.

[0056] Clause 11 - The method of any one of clauses 7 to 10, further comprising the step of affixing a magnetic stripe to an inner surface of the first rigid layer of the transaction card.

[0057] Clause 12 - The method of any one of clauses 7 to 11, further comprising the step of applying a magnetic stripe to an outer surface of the first rigid layer.

[0058] Clause 13 - The method of any one of clauses 7 to 12, wherein the first hard layer and the second hard layer comprise chemically strengthened glass.

[0059] Clause 14 - A transaction card manufactured by a process including the steps of: disposing a first rigid layer of the transaction card within a first recess of a first metal sheet; disposing a bonding layer on the first rigid layer of the transaction card, the bonding layer comprising a bonding medium; disposing a second rigid layer on the bonding layer; disposing a second metal sheet on the first metal sheet; and fusing the first metal sheet together with the second metal sheet to form a fused metal sheet.

[0060] Clause 15 - A transaction card manufactured by the process of clause 14, further comprising the step of disposing an antenna between the first rigid layer and the second rigid layer.

[0061] Clause 16 - A transaction card manufactured by the process of clause 14 or 15, further comprising the step of attaching an integrated circuit chip within a pocket in the second rigid layer.

[0062] Clause 17 - A transaction card manufactured by the process of any one of clauses 14 to 16, further comprising the step of cutting the fused metal sheet at the boundary of the second recess.

[0063] Clause 18 - A transaction card manufactured by the process of any one of clauses 14 to 17, further comprising the step of applying a magnetic stripe to an inner surface of the first rigid layer of the transaction card.

[0064] Clause 19 - A transaction card manufactured by the process of any one of clauses 14 to 18, further comprising the step of applying a magnetic stripe to an outer surface of the first rigid layer.

[0065] Clause 20 - A transaction card manufactured by the process of any one of clauses 14 to 19, wherein the first and second rigid layers comprise chemically strengthened glass.

[0066] It should be emphasized that the above-described embodiments of the present disclosure are merely possible examples of implementations presented for a clear understanding of the principles of the present disclosure. Many variations and modifications can be made to the above-described embodiments without substantially departing from the spirit and principles of the present disclosure. All such modifications and variations are intended to be included herein within the scope of the present disclosure and protected by the following claims.

Claims

1. a first rigid layer having a first exterior surface and a first interior surface, the first rigid layer comprising a pocket within the first exterior surface of the first rigid layer; a second rigid layer having a second exterior surface and a second interior surface; a bonding layer between the first and second rigid layers, the bonding layer including a bonding medium that attaches the first interior surface of the first rigid layer to the second interior surface of the second rigid layer; an integrated circuit chip attached within the pocket of the first rigid layer; a metal band extending from the first exterior surface of the first rigid layer, surrounding a first edge of the first rigid layer and a second edge of the second rigid layer, and onto the second exterior surface of the second rigid layer.

2. The transaction card of claim 1 , further comprising a magnetic stripe attached to the second rigid layer and positioned between the first rigid layer and the second rigid layer.

3. 3. The transaction card of claim 1 or claim 2, further comprising an antenna positioned between the first rigid layer and the second rigid layer, the antenna inductively coupled to the integrated circuit chip.

4. 10. The transaction card of claim 1, further comprising an antenna positioned between the first rigid layer and the second rigid layer, the antenna connected to the integrated circuit chip via a contact pad.

5. The transaction card of claim 1 , wherein the integrated circuit chip further comprises an antenna.

6. The transaction card of claim 1 , wherein the first and second rigid layers comprise chemically strengthened glass.

7. placing a first rigid layer of a transaction card within a first recess of a first metal sheet; placing a bonding layer over the first rigid layer of the transaction card, the bonding layer comprising a bonding medium; disposing a second hard layer on the bonding layer; placing a second metal sheet over the first metal sheet; fusing the first metal sheet together with the second metal sheet to form a fused metal sheet.

8. The method of claim 7 further comprising disposing an antenna between the first rigid layer and the second rigid layer.

9. 9. The method of claim 7 or claim 8, further comprising the step of attaching an integrated circuit chip within the pocket of the second rigid layer.

10. The method of claim 7 further comprising cutting the fused metal sheet at a boundary of the first recess.

11. The method of claim 7 , further comprising the step of affixing a magnetic stripe to an inner surface of the first rigid layer of the transaction card.

12. The method of claim 7 further comprising applying a magnetic stripe to an outer surface of the first rigid layer.

13. The method of claim 7 , wherein the first hard layer and the second hard layer comprise chemically strengthened glass.

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