Contact connection device and unit device

Abstract

To provide a contact connection device in which the reliability of electrical connection with first contact means is increased in one end region of a contact spring and a required space is reduced.SOLUTION: A contact connection device 1 forms at least one first contact means 3 and at least one second contact means 5, and an electrical connection portion in which at least one contact spring 10, 10A arranged between the corresponding first contact means and the second contact means can be released between the first contact means and the corresponding second contact means. At least one of the contact means is a conductive through connection portion 3A in a printed wiring board 4, at least partially accepts a first end region 12 of the corresponding contact spring, and is electrically and mechanically connected via a solder connection 7 at the upper edge portion 3.1 and / or the lower edge portion 3.2 of the through connection portion.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a contact-and-connect device according to the preamble of the independent claim.The subject of the invention also relates to a unit device equipped with such a contact-and-connect device. [Background technology]

[0002] The prior art discloses contacting devices having at least one releasable electrical connection between two contact means, which is formed by a contact spring that makes electrical contact with a first contact means at one end region and with a second contact means at the other end region. The first contact means is arranged, for example, on a printed circuit board of a control unit, and the second contact means is, for example, part of a sensor or actuator. For mechanically or electrically secure contact, a contact plate is arranged, for example, on the printed circuit board side or on the sensor side, on which the end regions of the contact spring are supported.

[0003] Patent Document 1 discloses a brake device for a vehicle brake system, which includes at least one pressure sensor for measuring brake pressure and an electronic control circuit for evaluating the measured value and generating a control signal. To simplify and fully automatically assemble the brake device, the electronic control circuit is accommodated in a housing that is placed over the at least one pressure sensor, and the electrical connection between the pressure sensor and the electronic control circuit is formed by a spring contact pin, whose end faces are supported by a spring force on opposing contact surfaces that correspond to the pressure sensor and the electronic control circuit.

[0004] Patent Document 2 discloses a unit arrangement of the aforementioned type, including a first electronic circuit unit, a second electronic circuit unit, and a contacting device of the aforementioned type for electrically connecting the first electronic circuit unit and the second electronic circuit unit. The contacting device includes at least one first contact means having a tapered notch, at least one second contact means having a contact surface, and at least one contact spring arranged between the corresponding first contact means and the corresponding second contact means, the contact spring forming a releasable electrical connection between the corresponding first contact means and the corresponding second contact means. The contact spring is configured as a compression coil spring, the end region of which is tightly wound for axial reinforcement and is thereby configured to be stress-resistant. In this case, the first end region of the contact spring is configured as a tapered end region, and this end region is at least partially received in and supported within the tapered notch of the first contact means. The second end region of the contact spring bears against a contact surface of the second contact means. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] German Patent Publication No. 19917941 [Patent Document 2] German Patent Publication No. 102010063709 Summary of the Invention [Effects of the Invention]

[0006] The contacting device with the features of independent claim 1 and the unit arrangement with the features of independent claim 12 each have the advantage that one end region of the contact spring is more reliably connected to the first contact means and requires less space, while the other end region of the contact spring and its electrical connection to the second contact means remain intact, making the other end region fully compatible with contact formation techniques known from the prior art. Furthermore, the contact spring is transformed from a mechanical component, for example integrated into a housing structure of an electronic circuit unit, into an electrical component that is soldered to a printed circuit board.

[0007] According to an embodiment of the present invention, there is provided a contacting device having at least one first contact means and at least one second contact means, and at least one contact spring arranged between the corresponding first contact means and the corresponding second contact means, which contact spring forms a releasable electrical connection between the corresponding first contact means and the corresponding second contact means, wherein at least one releasable electrical connection is formed between two contact means, and at least one of the contact means is configured as an electrically conductive feed-through in the printed circuit board, which feed-through at least partially receives a first end region of a corresponding contact spring, and wherein the corresponding contact spring is electrically and mechanically connected to an upper edge and / or a lower edge of the feed-through via a solder connection.

[0008] Furthermore, a unit device is proposed, which comprises a first electronic circuit unit, a second electronic circuit unit, and a contact-connection device for electrically connecting the first electronic circuit unit and the second electronic circuit unit to each other.

[0009] According to an embodiment of the present invention, a releasable electrical connection can be produced between a printed circuit board of a first electronic circuit unit and a second electronic circuit unit in which electronic sensors and / or actuators are integrated.

[0010] An embodiment of the present invention combines feedthrough technology with soldering technology for electrically and mechanically connecting a contact spring to a first contact means on a printed circuit board. A conductive feedthrough having a hole with an appropriate diameter is arranged on the printed circuit board as a first contact formation, for at least partially receiving the corresponding end region of the contact spring. Furthermore, the upper and lower edges of the feedthrough form a contact surface for gripping the printed circuit board and creating the solder connection. Thus, the required contact surface on the printed circuit board, formed by the edges of the feedthrough, can be reduced. In a preferred embodiment, the feedthrough is copper-coated. To mount at least one contact spring on the printed circuit board, the contact spring is at least partially inserted into the feedthrough of the printed circuit board after applying solder paste to the printed circuit board. In parallel, another electrical component to be soldered to the printed circuit board can be mounted. The mounting sequence can be selected arbitrarily. The solder connection is then created, for example, by reflow soldering or wave soldering. After soldering, at least one contact spring is fixed in a generally vertical position. The through-connection and solder connection eliminate "loose" contact springs, simplifying the assembly of the contact-connection device or unit device. The second contact means of at least one releasable electrical connection is configured, for example, as a contact surface on which a corresponding contact spring having a second end region is supported. Optionally, the second contact means forms a tapered receptacle that at least partially receives the second end region of the contact spring. This allows small deviations from the vertical alignment of the contact spring with respect to the surface of the printed circuit board to be compensated for.

[0011] Advantageous improvements of the contact-connection device according to independent claim 1 and the unit device according to independent claim 12 are possible by the measures and embodiments set out in the dependent claims.

[0012] Particularly preferably, at least one contact spring is configured as a coil spring, in which case the first and second end regions of each contact spring can each have a smaller diameter than the cylindrical intermediate portion. This allows at least one contact spring to have three distinct regions, with the first end region forming a contact spring insertion or feed-through insertion region that holds the contact spring perpendicular to the printed circuit board surface before soldering. The diameter of the first end region is preferably selected so that this first end region is more easily inserted into the feed-through, but also so that the contact spring can be held as perpendicular as possible to the printed circuit board surface. The second end region is based on the requirements of the second contact means. The cylindrical intermediate portion has a natural spring effect that compensates for mechanical tolerances and allows the contact force with which the second end region of the contact spring rests on the second contact means to be adjusted.

[0013] In a preferred embodiment of the contacting device, the first end region of at least one contact spring has a cylindrical block section on which the spring coils are tightly wound. In this case, the cylindrical block section only penetrates into the feedthrough or passes through the feedthrough. The block section allows the first end region to be more easily guided into the feedthrough. In addition to or alternatively to the cylindrical block section, the first end region of at least one contact spring has a feedthrough structure or a feedthrough wire that passes through the feedthrough. In the configuration as a feedthrough wire, the hole of the feedthrough can be smaller.

[0014] According to another preferred embodiment of the contacting device, a locking means is arranged in the first end region of at least one contact spring, which locks on the lower edge of the feed-through. The locking means can have, for example, a locking hook or a spring-resilient locking structure. In the form of a spring-resilient locking structure, this locking structure can be combined with a feed-through structure. In the inserted state, the spring-resilient locking structure grips the printed circuit board and supports the lower edge of the feed-through.

[0015] In another preferred embodiment of the contact-connecting device, the first transition region between the cylindrical intermediate section and the second end region of the at least one contact spring has a conical block section on which the spring coils are tightly wound, which allows the second end region of the at least one contact spring to be inserted more easily into the guide channel and abuts against a tapered section of the guide channel to define the maximum length through which the second end region extends.

[0016] In another preferred embodiment of the contacting device, the second transition region between the cylindrical middle section and the first end region of at least one contact spring has a conical block section, on which the spring coils are tightly wound. Furthermore, the conical block section of the second transition region has a chamfered edge, which improves the structure of the solder connection. Additionally or alternatively, the second transition region between the cylindrical middle section and the first end region of at least one contact spring has a flat transition coil as the last coil, which is aligned perpendicular to the central axis of the feedthrough and parallel to the surface of the printed circuit board. This makes it easier to achieve perpendicular alignment of the contact spring to the printed circuit board.

[0017] In a preferred embodiment of the unit device, the first electronic unit is configured as a control unit with at least one printed circuit board and a housing, the housing of the control unit being configured as a guide device with at least one guide passage through which a corresponding contact spring of the contact-connection device passes, and the second electronic unit further comprises at least one actuator and / or at least one sensor with at least one second contact means to be electrically connected to the first electronic unit or the control unit via the contact-connection device. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a schematic perspective partial cross-sectional view of a part of an embodiment of a unit arrangement according to the invention, which comprises an embodiment of a contact-connecting device according to the invention, with a first embodiment of a contact spring; [Figure 2] 2 is a schematic cross-sectional view of a part of a second embodiment of a contact spring for the contact-making device according to the invention shown in FIG. 1; [Figure 3] 2 is a schematic partial cross-sectional view of a third embodiment of a contact spring for the contact-making device according to the invention shown in FIG. 1; [Figure 4] 3 is a schematic partial cross-sectional view of a fourth embodiment of a contact spring for the contact-connecting device according to the invention shown in FIG. 1; [Figure 5] 3 is a schematic partial cross-sectional view of a fifth embodiment of a contact spring for the contact-making device according to the invention shown in FIG. 1; [Figure 6] 3 is a schematic partial cross-sectional view of a sixth embodiment of a contact spring for the contact-connecting device according to the invention shown in FIG. 1; [Figure 7] 1. FIG. 5 is a schematic partial cross-sectional view of a seventh embodiment of a contact spring for the contact-making device according to the invention shown in FIG. [Figure 8]8 is a schematic cross-sectional view of an embodiment of a feedthrough for a contacting device according to the invention shown in FIG. 7 after application of solder paste; [Figure 9] 9 is a schematic plan view of the feedthrough shown in FIG. 8 after solder pasting in a first mold. [Figure 10] 9 is a schematic plan view of the feedthrough shown in FIG. 8 after solder pasting in a second mold. DETAILED DESCRIPTION OF THE INVENTION

[0019] DETAILED DESCRIPTION OF THE INVENTION An embodiment of the invention is described in detail below, which is illustrated in the drawings, in which components or elements performing the same or similar functions are provided with the same reference numerals.

[0020] As shown in FIG. 1, the illustrated embodiment of a unit device 40 according to the present invention comprises a first electronic circuit unit 20, a second electronic circuit unit 30 and a contact connection device 1, which electrically connects the first electronic circuit unit 20 and the second electronic circuit unit 30 to each other.

[0021] As can be further seen from Figures 1 to 7, the illustrated embodiments of the contacting device 1 according to the invention each comprise at least one first contact means 3, at least one second contact means 5 and at least one contact spring 10 arranged between the corresponding first contact means 3 and the corresponding second contact means 5, which contact spring 10 forms a releasable electrical connection between the corresponding first contact means 3 and the corresponding second contact means 5. In this case, at least one releasable electrical connection is formed between the contact means 3, 5, at least one of these contact means 3, 5 being configured as an electrically conductive feedthrough 3A in the printed circuit board 4, which feedthrough 3A at least partially receives the first end region 12 of a corresponding contact spring 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, and the corresponding contact spring 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G is electrically and mechanically connected to the upper edge 3.1 and / or the lower edge 3.2 of the feedthrough 3A via a solder connection 7.

[0022] In the illustrated embodiment of the unit arrangement 40, the first electronic circuit unit 20 is configured as a control unit 20A with at least one printed circuit board 4 and a housing 22. In this case, the housing 22 of the control unit 20A forms a guide device 22A with at least one guide passage 24, which is passed through by a corresponding contact spring 10 of the contact-connection device 1. The second electronic circuit unit 30 comprises at least one actuator and / or at least one sensor 30A with at least one second contact means 5.

[0023] 1, the illustrated part of the unit device 40 and the contact-connection device 1 in the illustrated embodiment comprises a control unit 20A with a printed circuit board 4 and a housing 22 in which two first contact means 3 configured as feed-throughs 3A are embedded, a sensor 30A with two second contact means 5 configured as contact surfaces 5A, and two contact springs 10A, which connect the first contact means 3 configured as feed-throughs 3A to the second contact means 5 configured as contact surfaces 5A, respectively. Of course, the contact-connection device 1 may comprise more or fewer than two contact springs 10 with corresponding first and second contact means 3, 5.

[0024] As can be further seen from Figures 1 to 7, at least one contact spring 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G is each configured as a coil spring in the illustrated embodiment, in which case the first end region 12 and the second end region 14 of at least one contact spring 10 have a smaller diameter than the cylindrical intermediate portion 15.

[0025] As can be seen from Fig. 1, the second end regions 14 of the two contact springs 10A in the illustrated first embodiment each have a cylindrical block section 14A, in which the spring coils are tightly wound. Furthermore, the first transition region 16 between the cylindrical intermediate portion 15 and the second end region 14 of the illustrated two contact springs 10A has a conical block section 16A, in which the spring coils are tightly wound. This allows the contact springs 10A to taper from the larger diameter of the cylindrical intermediate portion 15 to the smaller diameter of the cylindrical block section 14A of the second end region. As can be seen from Fig. 1, the first end regions 12 of the illustrated two contact springs 10A each have a cylindrical block section 12A, in which the spring coils are tightly wound. In this case, the cylindrical block section 12A or first end region 12 of each contact spring 10A passes through the illustrated feedthrough 3A in the printed circuit board.

[0026] 1, the second transition region 17 between the cylindrical intermediate portion 15 and the first end region 12 of the illustrated contact spring 10A each has a conical block section 17A in which the spring coils are tightly wound. Furthermore, the solder connection 7 between the illustrated contact spring 10A and the corresponding feedthrough 3A is formed between the second transition region 17 of the corresponding contact spring 10A and the upper edge 3.1 of the corresponding feedthrough 3A, so that the hardened solder wax 8 at least partially covers the upper edge 3.1 of the feedthrough 3A and the coils of the conical block section 17A of the second transition region 17.

[0027] As can also be seen from Figure 2, the second embodiment of the contact spring 10B generally corresponds to the first embodiment of the contact spring 10A shown in Figure 1. However, unlike the first embodiment, the second transition region 17 between the cylindrical intermediate portion 15 and the first end region 12 of the illustrated contact spring 10B has a conical block section 17B with chamfered edges, in which the spring coils are tightly wound to form a smooth frustoconical peripheral surface.

[0028] As can be seen further from FIG. 3 , the third embodiment of the contact spring 10C generally corresponds to the first embodiment of the contact spring 10A shown in FIG. 1 . However, unlike the first embodiment, the first end region 12 of the contact spring 10C, configured as a block section 12B, is shorter than the first end region 12 of the contact spring 10A, configured as a block section 12A shown in FIG. 1 , and does not completely penetrate the feedthrough 3A but only extends into it. The second transition region 17 between the cylindrical intermediate portion 15 and the first end region 12 of the illustrated contact spring 10C also has a conical block section 17A, similar to the first embodiment of the contact spring 10A shown in FIG. 1 . Alternatively, the second transition region 17 between the cylindrical intermediate portion 15 and the first end region 12 of the illustrated contact spring 10C may have a conical block section 17B with a chamfered edge, similar to the second embodiment of the contact spring 10B shown in FIG. 2 . As can be further seen from Figure 3, the solder connection 7 of the illustrated third embodiment of the contact spring 10C is formed between the second transition region 17 and the first end region of the contact spring 10C and the upper edge 3.1 of the through-connection portion 3A, so that the hardened solder wax 8 at least partially covers the upper edge 3.1 of the through-connection portion 3A, the windings of the conical block section 17A of the second transition region 17, and the windings of the cylindrical block region 12B of the first end region 12.

[0029] As can be further seen from Figure 4, the fourth embodiment of the contact spring 10D generally corresponds to the third embodiment of the contact spring 10C shown in Figure 3. Unlike the third embodiment, the second transition region 17 between the central intermediate portion 15 and the first end region 12 of the contact spring 10D of the fourth embodiment shown has a flat transitional winding 17C as the last winding, which is aligned perpendicular to the central axis of the feed-through 3A and parallel to the surface of the printed circuit board 4. As can be further seen from Figure 4, the solder connection 7 of the illustrated fourth embodiment of the contact spring 10D is configured between the second transition region 17 and the first end region of the contact spring 10D and the upper edge 3.1 of the feedthrough 3A, so that the hardened solder wax 8 at least partially covers the upper edge 3.1 of the feedthrough 3A, the transition winding 17C of the second transition region 17, and the winding of the cylindrical block region 12B of the first end region 12. Optionally, the first end region 12 of the illustrated contact spring 10D may have a longer block section 12A that passes completely through the feedthrough 3A, similar to the first embodiment of the contact spring 10A of Figure 1.

[0030] As can be seen further in Fig. 5, the fifth embodiment of the contact spring 10E generally corresponds to the third embodiment of the contact spring 10C shown in Fig. 3. Unlike the third embodiment of the contact spring 10C shown in Fig. 3, a locking means 18 is arranged in the first end region 12 of the illustrated contact spring 10, which locks on the lower edge 3.2 of the feedthrough 3A. In the illustrated fifth embodiment of the contact spring 10E, the locking means 18 has a locking hook 18A. As in the third embodiment, the solder connection 7 of the illustrated fifth embodiment of the contact spring 10E is formed between the second transition region 17 and the first end region of the contact spring 10E and the upper edge 3.1 of the feedthrough 3A, so that the hardened solder wax 8 at least partially covers the upper edge 3.1 of the feedthrough 3A, the turns in the second transition region 17, and the turns in the cylindrical block region 12B of the first end region 12. Alternatively, the second transition region 17 between the cylindrical intermediate portion 15 and the first end region 12 of the illustrated contact spring 10E may have a conical block section 17B with chamfered edges, similar to the second embodiment of the contact spring 10B of FIG. 2.

[0031] As can be seen from FIG. 6 , in the sixth embodiment of the contact spring 10F, the first end region is not configured as a cylindrical block region 12A, 12B, but as a feed-through structure 12C with an integral, resilient locking structure 18B as the locking means 18. As can be further seen from FIG. 6 , the feed-through profile 12C with the integral, resilient locking structure 18B is bent out of the wire of the contact spring 10F. The feed-through profile 12C has a U-shaped section that clips onto the printed circuit board 4 in the feed-through 3A and supports the upper and lower edges 3.1, 3.2 of the feed-through 3A. Furthermore, the feed-through profile 12C has a triangular end section that is compressed when inserted into the feed-through 3A and expands again when ejected from the feed-through 3A to lock onto the lower edge 3.2 of the feed-through 3A. In the illustrated sixth embodiment of the contact spring 10F, the first solder connection 7 is formed between the first end region 12 of the corresponding contact spring 10F and the upper edge 3.1 of the feedthrough 3A, so that the hardened solder wax 8 at least partially covers the upper edge 3.1 of the feedthrough 3A and the wire of the first end region 12 in the section that rests on the upper edge 3.1 of the feedthrough 3A. The second and third solder connections 7 are formed between the first end region 12 of the corresponding contact spring 10F and the lower edge 3.2 of the feedthrough 3A, so that the hardened solder wax 8 at least partially covers the lower edge 3.2 of the feedthrough 3A and the wire of the first end region 12 in the two sections that rest on the lower edge 3.2 of the feedthrough 3A. Alternatively, only the first solder connection 7 between the first end region of the corresponding contact spring 10F and the upper edge 3.1 of the through-connection portion 3A, or only the second and third solder connections 7 between the first end region of the corresponding contact spring 10F and the lower edge 3.2 of the through-connection portion 3A, may be formed.

[0032] 7 further shows that the first end region 12 of the seventh embodiment of the contact spring 10G shown has a cylindrical block region 12B and a through-plug wire 12D, which passes through the through-connection 3A of the printed circuit board 4. Unlike the other embodiments, the holes in the through-connection 3A of the seventh embodiment of the contact spring 10G shown have a smaller diameter than the other embodiments, which matches the diameter of the through-plug wire 12D. In the seventh embodiment of the contact spring 10G shown, the solder connection 7 is formed between the corresponding first end region of the contact spring 10G and the upper edge 3.1 of the through-connection 3A, so that the hardened solder wax 8 at least partially covers the upper edge 3.1 of the through-connection 3A and the lower winding of the first end region 12. The second transition region 17 between the cylindrical intermediate portion 15 and the first end region 12 of the illustrated contact spring 10G has a conical block section 17A, similar to the first embodiment of the contact spring 10A shown in Figure 1. Alternatively, the second transition region 17 between the cylindrical intermediate portion 15 and the first end region 12 of the illustrated contact spring 10G may have a conical block section 17B with a chamfered edge, similar to the second embodiment of the contact spring 10B in Figure 2.

[0033] In the embodiment shown in FIGS. 1 to 5 and 7 , to mount at least one contact spring 10A, 10B, 10C, 10D, 10E, 10G on the printed wiring board 4, as shown in FIGS. 8 to 10 , solder paste 9 is first applied to the upper edge 3.1 of the feedthrough 3A. In this case, the solder paste 9 is preferably applied so that it does not cover the hole of the feedthrough 3A, but only the edge 3.1 surrounding the hole of the feedthrough 3A. As can be seen further in FIG. 9 , the solder paste 9 is applied in a number of narrow annular segments, for example, four in this case. Alternatively, as can be seen further in FIG. 10 , the solder paste is applied in a number of wide annular segments, for example, eight in this case. Then, at least one contact spring 10, 10A, 10B, 10C, 10D, 10E, 10G is at least partially inserted into the feedthrough 3A of the printed wiring board. In parallel, other electrical components to be soldered are mounted on the printed circuit board. The mounting order can be selected arbitrarily. The solder connection 7 can then be produced, for example, by reflow soldering or wave soldering. After soldering, at least one contact spring 10, 10A, 10B, 10C, 10D, 10E, 10G is fixed approximately vertically by the solder connection 7. In the embodiment shown in FIG. 6, the solder paste 9 is applied to the upper edge 3.1 and the lower edge 3.2 of the feedthrough 3A, so that the contact spring 10F is fixed approximately vertically by three solder connections.

[0034] After the mounting and soldering process, the printed circuit board 4 is mounted in the housing 22, which at the same time forms a guide device 22A with a plurality of guide channels 24. In this case, the free second end regions 14 of the contact springs 10A, 10B, 10C, 10D, 10E, 10F, 10G are inserted into the guide channels 24 in the housing 22 provided for this purpose. From this, the second end regions 14 of the contact springs 10A, 10B, 10C, 10D, 10E, 10F, 10G protruding from the housing 22 are assembled with the second electronic circuit unit 30, and the second contact means 5 of this second electronic circuit unit 30 are pressed against the second end regions 14 of the contact springs 10A, 10B, 10C, 10D, 10E, 10F, 10G, thereby again following the standard process for producing electrical contacts. [Explanation of symbols]

[0035] 1 Contact connection device 3. First contact method 3A feedthrough 3.1 Upper edge 3.2 Lower edge 4. Printed wiring board 5 Secondary contact method 7 Solder joints 8. Soldering wax 9. Solder paste 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G Contact spring 12 first end region 12A, 12B Cylindrical block section, block area 12C Penetration structure, penetration outline 12D Through-Plug Wire 14 Second end region 14A Cylindrical Block Section 15 Cylindrical middle section 16 First Transition Zone 16A Conical Block Segment 17 Second Transition Zone 17A, 17B Conical block section 17C Transitional Stroke 18 Locking means 18A Locking hook 18B Locking structure 20 First electronic circuit unit 20A control unit 22 Housing 22A Guide device 24 Guide passage 30 Second electronic circuit unit 30A sensor 40 Unit Equipment

Claims

1. A contact-connection device (1) comprising at least one first contact means (3) and at least one second contact means (5), and at least one contact spring (10, 10A, 10B, 10C, 10D, 10E, 10F, 10G) arranged between a corresponding first contact means (3) and a corresponding second contact means (5), wherein the contact spring (10, 10A, 10B, 10C, 10D, 10E, 10F, 10G) forms a releasable electrical connection between the corresponding first contact means (3) and the corresponding second contact means (5), at least one releasable electrical connection is formed between the contact means (3, 5), at least one of the contact means (3, 5) being configured as an electrically conductive feedthrough (3A) in the printed circuit board (4), which feedthrough (3A) at least partially receives a first end region (12) of a corresponding contact spring (10, 10A, 10B, 10C, 10D, 10E, 10F, 10G), wherein the corresponding contact spring (10, 10A, 10B, 10C, 10D, 10E, 10F, 10G) is electrically and mechanically connected to an upper edge (3.1) of the feedthrough (3A) via a solder connection (7); At least one of the contact springs (10, 10A, 10B, 10C, 10D, 10E, 10F, 10G) is configured as a coil spring, in which case the first end region (12) and the second end region (14) of each of the contact springs (10, 10A, 10B, 10D, 10C, 10E, 10F, 10G) each have a smaller diameter than the cylindrical intermediate portion (15), a second transition region (17) between the cylindrical intermediate portion (15) and the first end region (12) of at least one of the contact springs (10, 10A, 10B, 10C, 10E, 10F, 10G) has a conical block section (17A, 17B) in which a spring coil is tightly wound, The contact-connection device (1) is characterized in that the solder wax (8) of the solder connection (7) at least partially covers the upper edge (3.1) of the through-connection (3A) and the windings of the conical block section (17A, 17B) tapering from the cylindrical middle part (15) towards the first end region (12).

2. 2. The contacting device according to claim 1, wherein the first end region (12) of at least one of the contact springs (10, 10A, 10B, 10C, 10D, 10E, 10G) has a cylindrical block section (12A, 12B) on which a spring coil is tightly wound, the cylindrical block section (12A, 12B) penetrating into or passing through the feedthrough (3A).

3. 3. The contact-connecting device according to claim 1, wherein the first end region (12) of at least one of the contact springs (10, 10F, 10G) has a through-insertion structure (12C) or a through-insertion wire (12D), the through-insertion structure (12C) or the through-insertion wire (12D) passing through the through-connection portion (3A).

4. 4. The contact connection device (1) according to claim 1, wherein a locking means (18) is arranged in the first end region (12) of at least one of the contact springs (10, 10E, 10F, 10G), which locks onto the lower edge (3.2) of the through-connection portion (3A).

5. 5. The contact-connection device (1) according to claim 4, characterized in that the locking means (18) comprise a locking hook (18A) or a spring-resilient locking structure (18B).

6. 6. The contacting and connecting device (1) according to claim 1, wherein the second end region (14) of at least one of the contact springs (10, 10A, 10B, 10C, 10D, 10E, 10F, 10G) has a cylindrical block section (14A) in which the spring coils are tightly wound.

7. 7. The contact-connection device (1) according to claim 1, wherein a first transition region (16) between the cylindrical intermediate portion (15) and the second end region (14) of at least one of the contact springs (10, 10A, 10B, 10C, 10D, 10E, 10F, 10G) has a conical block section (16A) in which a spring coil is tightly wound.

8. 8. The contact-connection device (1) according to claim 1, wherein the conical block section (17B) of the second transition region (17) is configured with a chamfered edge.

9. 8. The contact connection device (1) according to claim 1, wherein the second transition region (17) between the central intermediate portion (15) and the first end region (12) of at least one of the contact springs (10, 10D) has a flat transition winding (17C) as a final winding, the transition winding (17C) being aligned perpendicular to the central axis of the feedthrough (3A) and parallel to the surface of the printed circuit board (4).

10. A unit device (40) having a first electronic circuit unit (20), a second electronic circuit unit (30), and a contact connection device (1) that electrically connects the first electronic circuit unit (20) and the second electronic circuit unit (30) to each other, A unit device (40) characterized in that the contact-connection device (1) is constructed in accordance with any one of claims 1 to 9.

11. 11. A unit device (40) according to claim 10, characterized in that the first electronic circuit unit (20) is configured as a control unit (20A) having at least one printed circuit board (4) and a housing (22), and in this case the housing (22) of the control unit (20A) is configured as a guide device (22A) having at least one guide passage (24), which is passed through by a correspondingly arranged contact spring (10, 10A, 10B, 10C, 10D, 10E, 10F, 10G) of the contact connection device (1).

12. 12. A unit device (40) according to claim 10 or 11, characterized in that the second electronic circuit unit (30) has at least one actuator and / or at least one sensor (30A) with at least one second contact means (5).

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