RFID Media and the RFID Media Continuum

Abstract

To simplify the structure of an RFID medium having a substrate with a thermosensitive coloring layer.SOLUTION: An RFID medium provided herein comprises a substrate, a thermosensitive coloring layer formed on a surface of the substrate and configured to develop color with heat, an antenna formed on a back surface of the substrate, and an IC chip connected to the antenna, where the antenna and the IC chip are connected by a UV-curable conductive material.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an RFID medium and an RFID medium continuum. [Background technology]

[0002] In the fields of product manufacturing, logistics, sales, etc., product-related information and product management information are visibly printed on labels or tags and used integrally with the products. For this purpose, for example, labels with a heat-sensitive coloring layer that changes color when heated and thermal printers (also called thermal printers) are used to print on the labels.

[0003] Furthermore, RFID media such as RFID labels and RFID tags that support RFID (Radio Frequency Identification) technology, which transmits and receives information through contactless communication, are becoming widespread (see Patent Document 1). With such RFID media, the above-mentioned information can not only be visibly printed, but can also be stored in a built-in IC chip.

[0004] A substrate with a thermosensitive coloring layer is easily affected by heat. Therefore, if the manufacturing process of an RFID medium includes a process that involves heat (a thermal process), a method is adopted in which the thermosensitive coloring layer is laminated after the thermal process to prevent heat from entering the substrate.

[0005] In particular, in the case of RFID labels, which involve heat when connecting an IC chip to an antenna, a method is used in which an RFID inlay equipped with an antenna and an IC chip is manufactured in advance, and a substrate equipped with a thermosensitive coloring layer is laminated onto the RFID inlay. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-97321 Summary of the Invention [Problem to be solved by the invention]

[0007] In recent years, there has been an increasing need for RFID media such as RFID labels and RFID tags, and the range of applications can be further expanded by making them printable using general-purpose thermal printers.

[0008] However, in the case of RFID media that require an RFID inlay, the range of application is sometimes limited due to factors such as the laminate structure and the physical properties of the inlay substrate, etc. For this reason, further improvements in RFID media are desired.

[0009] Therefore, an object of the present invention is to simplify the structure of an RFID medium having a substrate with a thermosensitive coloring layer. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a display device comprising: a substrate; a thermosensitive coloring layer formed on the surface of the substrate and which changes color when heated; an antenna formed on the back surface of the substrate; and an IC chip connected to the antenna, wherein the antenna and the IC chip are connected by a conductive material which is hardened by ultraviolet light. and a pressure-sensitive adhesive portion for attaching to an adherend is provided on the back surface of the base material, the pressure-sensitive adhesive portion including a first pressure-sensitive adhesive layer that has a predetermined adhesive strength and is attached to the base material, and a second pressure-sensitive adhesive layer that has an adhesive strength weaker than that of the first pressure-sensitive adhesive layer and is attached to the adherend. , an RFID medium is provided. [Effects of the Invention]

[0011] According to the above-described embodiment, the RFID medium has an antenna on the back surface of the substrate with a thermosensitive coloring layer, and the antenna and IC chip are connected by a conductive material that hardens when exposed to ultraviolet light. Therefore, no heat is applied to the substrate with the thermosensitive coloring layer during the process of mounting the antenna and IC chip on the substrate.

[0012] Furthermore, this RFID medium has an antenna and IC chip formed directly on the substrate with a thermosensitive coloring layer. This eliminates the need for an RFID inlay, which was previously manufactured to prevent heat from penetrating the substrate. This simplifies the structure of the RFID medium with a substrate with a thermosensitive coloring layer. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view of an RFID label according to an embodiment of the present invention, viewed from the front side. [Figure 2] FIG. 2 is a plan view of the RFID label according to this embodiment as viewed from the back side. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view illustrating an RFID label as a modified example. [Figure 5] FIG. 5 is a plan view of the continuous RFID label according to this embodiment as viewed from the back side. [Figure 6] FIG. 6 is a schematic diagram illustrating a label roll formed by winding a continuous RFID label body. [Figure 7] FIG. 7 is a plan view of a continuous RFID label shown as the first modification, viewed from the back side. [Figure 8] FIG. 8 is a schematic diagram illustrating a state in which RFID labels obtained by cutting from a continuous RFID label strip are stacked together, as shown in Modification 1. In FIG. [Figure 9] FIG. 9 is a plan view of a continuous RFID label shown as the second modification, viewed from the back side. [Figure 10] FIG. 10 is a plan view of a continuous RFID label shown as the third modification, viewed from the back side. [Figure 11] FIG. 11 is a cross-sectional view illustrating the RFID tag according to this embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0015] In this embodiment, the RFID medium is a medium incorporating an antenna pattern and an IC chip compatible with RFID (Radio Frequency Identification) technology, which transmits and receives information through contactless communication, and on which information about an item is stored and visibly printed, and includes RFID tags and RFID labels that are attached to items. The RFID medium also includes forms such as cards and wristbands incorporating an RFID-compliant antenna pattern and IC chip.

[0016] [RFID label configuration] Hereinafter, an RFID label 1 that is attached to an article will be described as an example of an RFID medium.

[0017] Fig. 1 is a plan view of an RFID label 1 according to an embodiment of the present invention as seen from the front side. Fig. 2 is a plan view of the RFID label 1 according to the embodiment as seen from the back side. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1.

[0018] 1 to 3 is referred to as the "label width direction." Also, the Y direction intersecting the X direction is referred to as the "label pitch direction."

[0019] The RFID label 1 includes a substrate 10, an antenna 11 formed as a predetermined pattern on one surface of the substrate, and an IC chip 12 connected to the antenna 11. In this embodiment, the antenna 11 and the IC chip 12 are connected by an anisotropic conductive material 14 that is cured by ultraviolet light.

[0020] 2, on the surface of the substrate 10 on which the antenna 11 is formed, marks 13 are printed on both ends in the label width direction of the substrate 10. The marks 13 are used to detect the RFID label 1 by an optical sensor or the like provided in the printer when the printer prints on the RFID label 1.

[0021] 3, a thermosensitive coloring layer 15 that changes color when heated is formed on the surface of the substrate 10 opposite to the surface on which the antenna 11 is formed. Although not shown, the thermosensitive coloring layer 15 includes, in order from the substrate 10 side, an undercoat layer, a thermosensitive layer, an overcoat layer, etc., and forms a printable surface that can be printed on by a printer equipped with a so-called direct thermal type print head.

[0022] In this embodiment, the surface of the substrate 10 on which the thermosensitive coloring layer 15 is formed is referred to as the front side of the RFID label 1, and the surface on which the antenna 11 is formed is referred to as the back side of the RFID label 1.

[0023] In the RFID label 1, the surface of the thermosensitive coloring layer 15 is subjected to a release treatment to prevent the adhesive from adhering to the surface. As an example of the release treatment, in this embodiment, a release agent such as silicone is applied. That is, a release layer 16 made of the release agent is formed on the surface of the thermosensitive coloring layer 15.

[0024] An adhesive part 17 for attaching the RFID label 1 to an adherend is formed on the surface of the substrate 10 on which the antenna 11 is formed.

[0025] In this embodiment, the adhesive portion 17 is formed by an adhesive layered on the surface of the base material 10 on which the antenna 11 is formed.

[0026] Next, each part of the RFID label 1 will be described.

[0027] Materials that can be used as the substrate 10 include paper substrates such as cardboard, fine paper, medium-quality paper, and coated paper obtained by forming a coating layer on any of these.

[0028] When applied to the RFID label 1, the thickness of the substrate 10 can be set to 10 μm or more and 300 μm or less.

[0029] When the substrate 10 is a paper substrate, a paper substrate having a thickness of 50 μm or more and 260 μm or less within the above range can be used, and a paper substrate having a thickness of 80 μm can be used in particular.

[0030] In addition to the paper substrate, in this embodiment, a single-layer resin sheet made of a single resin such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, or polyethylene naphthalate, or a multi-layer resin sheet made by laminating multiple such single-layer sheets, can be used.

[0031] When the substrate 10 is a resin sheet, a resin sheet having a thickness of 25 μm or more and 200 μm or less within the above range, and especially 10 μm or more and 200 μm or less, can be used.

[0032] The material and thickness of the substrate 10 can be appropriately selected within the above range depending on the application.

[0033] The antenna 11 is formed in the RFID label 1 in the X direction shown in Figures 1 to 3. The antenna 11 can be formed of a conductive sheet containing a conductive material. The conductive sheet can be a metal foil, and in particular, an aluminum or copper sheet.

[0034] In this embodiment, as shown in Figure 2, the antenna 11 comprises a loop portion 31, an IC chip connection portion 32 on which the IC chip 12 is mounted, meanders 33 and 34 extending symmetrically from the loop portion 31 in the width direction (X direction) of the label, and capacitor hats 35 and 36 connected to the ends of the meanders 33 and 34.

[0035] In this embodiment, the antenna 11 is, for example, a UHF band RFID antenna designed to have an antenna length and antenna wire width compatible with the UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz).

[0036] Additionally, the antenna 11 may be designed to have a pattern compatible with specific frequency bands such as microwaves (1 to 30 GHz, particularly around 2.4 GHz) and the HF band (3 MHz to 30 MHz, particularly around 13.56 MHz) depending on the RFID specifications.

[0037] The thickness of the metal foil that can form the antenna 11 can be set in consideration of the thickness of the RFID label 1, manufacturing costs, etc., and is preferably 3 μm or more and 50 μm or less. In this embodiment, from the viewpoint of reducing manufacturing costs, it is preferable to use an aluminum foil with a thickness of 7 μm, for example.

[0038] Although not shown in the drawings, the antenna 11 is adhered to the substrate 10 by a laminating adhesive layer made of, for example, an acrylic, urethane, silicone, or rubber-based adhesive or bonding agent.

[0039] The IC chip 12 is a semiconductor package designed to be capable of communicating with a reader (not shown) or a printer equipped with a reader.

[0040] The IC chip 12 is electrically and mechanically connected to an IC chip connection portion 32 provided in a part of the loop portion 31 of the antenna 11 by an anisotropic conductive material 14 that is hardened by ultraviolet light.

[0041] <Effects> The RFID label 1 has an antenna 11 on the back surface of a substrate 10 having a thermosensitive coloring layer 15, and the antenna 11 and IC chip 12 are connected by an anisotropic conductive material 14 that is cured by ultraviolet light. In other words, the antenna 11 and IC chip 12 can be directly mounted on the substrate 10 having the thermosensitive coloring layer 15 without going through a heating process.

[0042] This eliminates the need for a pre-fabricated RFID inlay, which was previously required to prevent heat from entering the substrate with the thermosensitive coloring layer during the RFID label manufacturing process, thereby simplifying the structure of the RFID label having a substrate with a thermosensitive coloring layer.

[0043] Furthermore, since the RFID label 1 has a release layer 16 formed on the surface of the thermosensitive coloring layer 15, even when multiple RFID labels 1 are stacked on top of each other and the adhesive portion 17 formed on the back surface of the RFID label 1 is stuck to the surface of the RFID label 1, the RFID labels 1 can be easily peeled off from each other.

[0044] Therefore, before the RFID label 1 is attached to an adherend, it is not necessary to provide a separator to cover the adhesive portion 17 to prevent the adhesive portion 17 from accidentally sticking.

[0045] [RFID label variations] Next, a modified example of the RFID label will be described below. Fig. 4 is a cross-sectional view illustrating an RFID label 2 shown as a modified example.

[0046] The RFID label 2 has a tack material 20 instead of the adhesive portion 17 of the RFID label 1 .

[0047] The tack material 20 has a tack substrate 21 and adhesive layers 22 and 23 laminated on both sides of the tack substrate 21 .

[0048] The tack material 20 is attached to the substrate 10 with the adhesive layer 22 facing the surface of the substrate 10 on which the antenna 11 is formed. This allows the adhesive layer 23 to function as an adhesive portion for use with an adherend.

[0049] Furthermore, by using the tack material 20, it is not necessary to perform the step of laminating the adhesive portion on the base material 10 consecutively to the series of steps of mounting the antenna 11 and the IC chip 12 on the base material 10.

[0050] In addition, in order to prevent the base material 10 and the tack material 20 from separating during the handling stage before the RFID label 2 is attached to the adherend, it is preferable to set the adhesive layer 22 attached to the base material 10 to have strong adhesion and the adhesive layer 23 attached to the adherend to have an adhesive strength weaker than that of the adhesive layer 22.

[0051] [RFID Label Continuum] Next, the RFID medium continuum will be described.

[0052] The RFID medium continuum includes a plurality of RFID media, each of which is connected to another via a separation section. In this embodiment, an RFID label continuum 100 to which RFID labels 1 are connected will be described as an example of the RFID medium continuum.

[0053] FIG. 5 is a plan view of the continuous RFID label strip 100 according to this embodiment, viewed from the back side.

[0054] The continuous RFID label strip 100 is formed by connecting a plurality of RFID labels 1 to one another via separation sections 110. The RFID labels 1 are connected to one another in the label pitch direction (Y direction) of the RFID labels 1.

[0055] 5, the width direction (X direction) of the RFID label 1 corresponds to the width direction of the continuous RFID label body 100, and the label pitch direction (Y direction) corresponds to the longitudinal direction of the continuous RFID label body 100.

[0056] The RFID label continuum 100 has a plurality of marks 13 printed on its side edges 111, 112. The marks 13 are formed at intervals corresponding to the length of the RFID label 1 in the label pitch direction (hereinafter referred to as the pitch).

[0057] The marks 13 are used by an optical sensor or the like provided in the printer to detect each RFID label 1 when the printer prints on the continuous RFID label strip 100. In this embodiment, the marks 13 are printed in advance at positions corresponding to the perforations formed as the separation portions 110, in this embodiment, adjacent to the perforations.

[0058] The mark 13 is printed on the substrate 10 before the step of forming the antenna 11 on the substrate 10 or after the step of forming the antenna 11 on the substrate 10 and before the adhesive portion 117 is formed.

[0059] If the mark 13 is formed near the boundary between the RFID labels 1, it becomes easier for the printer to measure the boundary between the RFID labels 1 and the print area on the RFID label 1 based on the mark 13.

[0060] In this embodiment, the separation portion 110 is a perforation formed along the width direction (X direction) of the continuous RFID label strip 100. This makes it easier to separate the RFID label 1 at the separation portion 110.

[0061] In this embodiment, after the adhesive portion 117 is formed on the continuous RFID label strip 100, perforations are formed as the tear-off portions 110.

[0062] 5, in this embodiment, an area including the IC chip 12 is cut out in some of the RFID labels 1, and an opening H is formed. The opening H makes it possible to remove any IC chip 12 that is found to be defective during an inspection process or the like when the continuous RFID label strip 100 is manufactured (hereinafter referred to as a defective chip).

[0063] The RFID label 1 with the hole H formed therein does not have an IC chip 12, and therefore cannot be read by a printer equipped with a reader for the IC chip 12. This allows the printer to avoid printing on the RFID label 1 whose IC chip 12 cannot be read.

[0064] Therefore, it is possible to prevent an RFID label 1 having a defective chip from being erroneously printed and then used.

[0065] FIG. 6 is a schematic diagram illustrating a label roll 200 formed by winding the continuous RFID label strip 100. As shown in FIG.

[0066] In this embodiment, the release layer 116 is formed on the surface of the continuous RFID label strip 100, so that even if the adhesive portion 117 formed on the back surface sticks to the surface when the continuous RFID label strip 100 is wound, it can be easily peeled off. Therefore, the continuous RFID label strip 100 can be provided as a label roll 200 without using a separator temporarily attached to the adhesive portion 117.

[0067] [RFID Label Continuum Variation 1] FIG. 7 is a plan view of a continuous RFID label strip 101 shown as a first modification, viewed from the back side.

[0068] The RFID label continuum 101 is cut at the cutting section 110 to obtain the RFID labels 3 .

[0069] On the back surface of the continuous RFID label strip 101, an adhesive portion 117 that will become the adhesive portion 17 of each RFID label 3 is formed.

[0070] Furthermore, a non-adhesive portion 121 is formed in the region including the separation portion 110. The non-adhesive portion 121 is a region that has been processed to eliminate the adhesiveness of the adhesive portion 117, and in the present embodiment, as an example, the non-adhesive portion 121 is coated with silicone.

[0071] 8 is a schematic diagram illustrating a state in which RFID labels 3 obtained by cutting from a continuous RFID label web 101 are stacked. In FIG. 8, the non-adhesive portions 121 represented by dots on the front side of the RFID label 3 are shown for the purpose of explanation, and in this embodiment, they are formed on the back side of the RFID label 3.

[0072] In the continuous RFID label strip 101, a non-adhesive portion 121 is formed in the region including the cut-off portion 110. Therefore, the non-adhesive portion 121 is formed on both opposing side edges of the RFID label 3 obtained by cutting it off from the continuous RFID label strip 101.

[0073] 8, even when multiple RFID labels 3 are stacked on top of each other, the side edges of the RFID labels 3 do not stick together, and therefore a user can easily separate the RFID labels 3 by lifting up the side edges of the RFID labels 3. This improves the ease of handling of the RFID labels 3 from the RFID label continuum 101 until they are affixed to the adherend.

[0074] [RFID Label Continuum Variation 2] FIG. 9 is a plan view of a continuous RFID label strip 102 shown as a second modification, viewed from the back side.

[0075] The RFID label string 102 is cut at the cutting section 110 to obtain the RFID label 4 .

[0076] A plurality of notches 131 are formed in the widthwise opposing side edges 111, 112 of the continuous RFID label strip 102, cutting inward in the widthwise direction of the continuous RFID label strip 102. Each of the plurality of notches 131 is formed at intervals corresponding to the pitch of the RFID labels 4.

[0077] In this embodiment, a release layer 116 is formed on the entire front surface of the continuous RFID label strip 102. In addition, adhesive portions 117 corresponding to the adhesive portions 17 of the individual RFID labels 1 are formed on the entire back surface of the continuous RFID label strip 102.

[0078] The notches 131 are used to detect each RFID label 1 by an optical sensor or the like provided in the printer when the printer prints on the continuous RFID label strip 102.

[0079] In this embodiment, the notch 131 is formed at a position corresponding to the separation portion 110. If the notch 131 is formed at the boundary between the RFID labels 1, the notch 131 becomes the starting point for separation when the RFID label 1 is separated from the RFID label continuum 102. This makes it easier for the user to separate the RFID label 1.

[0080] Furthermore, if the notches 131 are formed at the boundaries between the RFID labels 1, the printer can easily measure the boundaries of the RFID labels 1 and the print areas of the RFID labels 1 based on the notches 131.

[0081] As shown in Figure 9, when the cutout portion 131 is formed at a position corresponding to the separation portion 110, the cutout portion 131 forms the corner cut portion 10c of the RFID label 4 after the RFID label 4 is individually separated from the RFID label continuum 102.

[0082] [RFID Label Continuum Variation 3] FIG. 10 is a plan view of a continuous RFID label strip 103 shown as the third modification, viewed from the back side.

[0083] The RFID label continuum 103 is cut at the cutting section 110 to obtain the RFID labels 5 .

[0084] The non-adhesive portion 121 and the cutout portion 131 may be used together. That is, on the back surface of the continuous RFID label strip 103, the cutout portion 131 is formed at a position corresponding to the tear-off portion 110, and the non-adhesive portion 121 is formed by silicone coating at a position overlapping the tear-off portion 110.

[0085] As a result, even when a plurality of RFID labels 5 are stacked on top of each other, the side edges of the RFID labels 5 do not stick together, and the user can lift up the side edges of the RFID labels 5 and easily separate them.

[0086] Therefore, the handling of the RFID label 5 can be improved from the time it is cut off from the continuous RFID label strip 103 until it is attached to an adherend.

[0087] [RFID tag configuration] Next, an RFID tag 6 that is attached to an article and used will be described as an example of an RFID medium.

[0088] 11 is a cross-sectional view illustrating an RFID tag 6 according to this embodiment. The RFID tag 6 includes a substrate 10, an antenna 11 formed as a predetermined pattern on one surface of the substrate, and an IC chip 12 connected to the antenna 11. In this embodiment, the antenna 11 and the IC chip 12 are connected by an anisotropic conductive material 14 that is cured by ultraviolet light.

[0089] 11, a thermosensitive coloring layer 15 that changes color when heated is formed on the surface of the substrate 10 opposite to the surface on which the antenna 11 is formed. A back surface substrate 41 is laminated on the surface of the substrate 10 on which the antenna 11 is formed via an adhesive 40 for lamination.

[0090] <Effects> The RFID tag 6 has an antenna 11 on the back surface of a substrate 10 having a thermosensitive coloring layer 15, and the antenna 11 and IC chip 12 are connected by an anisotropic conductive material 14 that is cured by ultraviolet light. In other words, the antenna 11 and IC chip 12 can be directly mounted on the substrate 10 having the thermosensitive coloring layer 15 without going through a heating process.

[0091] This eliminates the need for a pre-fabricated RFID inlay, which was previously required to prevent heat from entering the substrate with the thermosensitive coloring layer during the RFID tag manufacturing process, thereby simplifying the structure of the RFID tag having a substrate with a thermosensitive coloring layer.

[0092] The RFID tag 6 can be provided as a series of interconnected RFID tags, similar to an RFID label.

[0093] [Other embodiments] Although the embodiments of the present invention have been described above, the above embodiments merely illustrate some of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above embodiments.

[0094] In this embodiment, the antenna 11 may be formed by adhering a metal foil to the substrate 10, or may be printed on a predetermined area of ​​the substrate 10 using conductive ink.

[0095] In the RFID label string 100 shown in FIG. 5, the mark 13 may be formed on only one of the side edges 111 and 112.

[0096] 9 or the continuous RFID label body 103 shown in FIG. 10, the notch 131 may be formed in only one of the side edge portions 111, 112. In the continuous RFID label body 102 shown in FIG.

[0097] Alternatively, the cutout portion 131 can be formed by cutting out the pattern of the antenna 11 using a flexible die formed on the same die roll as the die roll used to cut out the pattern of the antenna 11.

[0098] The notch 131 may also be formed in the substrate 10 before the antenna 11 is formed.

[0099] The shape of the notch 131 is not limited to the triangular shape shown in FIGS. 9 and 10, as long as it can be detected by a sensor mounted on the printer.

[0100] In this embodiment, the perforation does not have to be formed at a position corresponding to the tear-off portion 110 .

[0101] In the continuous RFID label strip 101 shown in Fig. 7 or the continuous RFID label strip 103 shown in Fig. 10, the non-adhesive portion 121 may be a region where the adhesive portion 117 is not formed, instead of being processed to eliminate the adhesiveness of the adhesive portion 117. In other words, the back surface of the substrate 10 may be exposed.

[0102] In addition, in the continuous RFID label strip 101 shown in FIG. 7 or the continuous RFID label strip 103 shown in FIG. 10, only the non-adhesive portion 121 may be formed in the tear-off portion 110, and no perforations may be formed.

[0103] As described above, if no perforations are formed in the RFID label strips 100, 101, 102, and 103, the RFID labels 1, 3, 4, and 5 can be cut off from the RFID label strips 100, 101, 102, and 103, for example, by a cutter provided in a printer.

[0104] The marks 13 may be printed at intervals corresponding to the pitch of the RFID labels 4, and are not limited to the positions shown in FIG. 5 or FIG.

[0105] The thermosensitive coloring layer 15 may be a recording layer made of a thermal rewritable recording material that can develop and erase color by heat. [Explanation of symbols]

[0106] 1,2,3,4,5 RFID Label 6. RFID tags 10 Base material 10c Corner cut part 11 Antenna 12 IC chip 13 marks 14 Anisotropic conductive materials 15 Thermosensitive coloring layer 16 Release layer 17 Adhesive part 20 Tack material 21 Tack base material 22 adhesive layer 23 Adhesive layer 31 Loop section 32 IC chip connection part 33,34 Meander 35,36 Capacitor Hat 40 Laminating adhesive 41 Back side substrate 100, 101, 102, 103 RFID label continuum 110 Separation part 111 Side edge 116 Release layer 117 Adhesive part 121 Non-adhesive part 131 Notch 200 label rolls H open hole

Claims

1. A substrate; a heat-sensitive coloring layer formed on the surface of the substrate, which changes color when heated; an antenna formed on the rear surface of the substrate; an IC chip connected to the antenna, the antenna and the IC chip are connected by a conductive material that hardens when exposed to ultraviolet light; An adhesive portion for attaching to an adherend is provided on the back surface of the substrate, The adhesive portion is a tack material including a first adhesive layer that has a predetermined adhesive strength and is attached to the base material, and a second adhesive layer that has an adhesive strength weaker than that of the first adhesive layer and is attached to the adherend. RFID medium.

2. The RFID medium according to claim 1, The substrate is paper. RFID medium.

3. The RFID medium according to claim 1, The substrate is a resin sheet. RFID medium.

4. The RFID medium according to any one of claims 1 to 3, A release layer is formed on the surface of the thermosensitive coloring layer. RFID medium.

5. The RFID medium according to any one of claims 1 to 3, A back surface side substrate is laminated on the back surface of the substrate. RFID medium.

6. A substrate, a heat-sensitive coloring layer formed on the surface of the substrate, which changes color when heated; an antenna formed on the rear surface of the substrate; an IC chip connected to the antenna, a plurality of RFID media in which the antenna and the IC chip are connected by a conductive material that is hardened by ultraviolet light, and each of the RFID media is connected to each other via a separation portion; The separation portion is a perforation formed along a width direction intersecting a connecting direction of the RFID medium, and has a non-adhesive portion in a predetermined area including the separation portion. RFID media continuum.

7. 7. The RFID medium continuum according to claim 6, Notches are formed in at least one side edge of the RFID medium continuous body, the notches being cut inward in the width direction of the RFID medium continuous body at intervals corresponding to the pitch of the RFID media. RFID media continuum.

8. 8. The RFID medium continuum according to claim 7, The notch is formed at a position corresponding to the cut-off portion. RFID media continuum.

9. The RFID medium continuum according to any one of claims 6 to 8, An area including the IC chip is cut out from a part of the RFID medium. RFID media continuum.

Images