Induction heating conditioner

Abstract

To obtain an induction heating cooker that allows greater flexibility in the installation of sensors.SOLUTION: An induction heating cooker has an induction heating coil substrate with an induction heating coil with conductors wound on an insulating substrate, and a sensor installed on the induction heating coil substrate at a position that does not contact the conductors of the induction heating coil.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] This technology relates to an induction cooking device that performs cooking by induction heating a cooking vessel placed on a top plate, and in particular to the installation of a sensor that detects physical quantities such as temperature. [Background technology]

[0002] An induction heating cooker, a type of heating device, supplies a high-frequency current to a flatly wound induction heating coil. In an induction heating cooker, a high-frequency magnetic field generated in the induction heating coil by electromagnetic induction generates eddy currents in a metal cooking utensil, which then heats the cooking utensil itself and the food being cooked with the Joule heat generated by the eddy currents. The induction heating coil is made by spirally winding a litz wire and bonding it to an insulating plate (see, for example, Patent Document 1). This increases the number of manufacturing steps required for bonding the induction heating coil, and requires strict temperature control, etc. Therefore, an induction heating coil has been proposed in which a copper thin film wire is wound around an insulating layer (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2015 / 029441 [Patent Document 2] Japanese Patent Publication No. 2022-043697 Summary of the Invention [Problem to be solved by the invention]

[0004] An induction cooker has various sensors for detecting physical quantities, such as a temperature sensor for detecting the temperature of the cooking vessel and the object to be heated placed on the top plate. Here, the sensors of the induction cooker should be installed in a position that allows for as accurate detection as possible.

[0005] However, as in Patent Document 1, if a sensor is to be installed between induction heating coils made of spirally wound litz wire, the structure for installing the sensor becomes complicated. This requires time for processing and assembling the parts. In addition, the location where the sensor is installed is restricted by the shape of the induction heating coil, and it is difficult to change the shape of the induction heating coil. This makes it difficult to install the sensor in a position where it can accurately detect physical quantities.

[0006] Therefore, an object of the present invention is to provide an induction heating cooker in which a sensor can detect physical quantities more accurately. [Means for solving the problem]

[0007] The induction heating cooker according to the present disclosure includes an induction heating coil substrate having an induction heating coil in which a conductor is wound on an insulating substrate, and a sensor installed on the induction heating coil substrate at a position not in contact with the conductor of the induction heating coil. a sensor connection unit that electrically connects a control device that controls the device and the sensor; Equipped with The sensor connection part is disposed on the surface of the induction heating coil substrate opposite to the surface on which the induction heating coil is provided, and on the induction heating coil substrate, the sensor connection part is disposed on the outer periphery side of the induction heating coil, and the sensor and the sensor connection part are connected by pattern wiring on the induction heating coil substrate. It is something. [Effects of the Invention]

[0008] According to the induction heating cooker of the present disclosure, the sensor is installed on the surface of the induction heating coil substrate so as not to come into contact with the conductive induction heating coil. Since the induction heating coil can be configured to match the position of the sensor so as not to come into contact with the sensor, the sensor can be installed in a position where detection can be performed more accurately. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view of an induction heating cooker according to a first embodiment. [Figure 2] 2 is a diagram illustrating the internal configuration of a main body case 1 of the induction heating cooker according to the first embodiment. FIG. [Figure 3] 1 is a schematic diagram showing an internal configuration of an induction heating cooker according to a first embodiment. [Figure 4]1 is a diagram illustrating a configuration of an induction heating unit 100 in an induction heating cooker according to a first embodiment. [Figure 5] 1 is a perspective view of an induction heating unit 100 according to a first embodiment, as viewed from the front. [Figure 6] 1 is a diagram showing the positional relationship between an induction heating unit 100 and a top plate 10 according to the first embodiment. [Figure 7] 1 is a diagram illustrating the configuration of an induction heating coil substrate 110 according to the first embodiment. [Figure 8] 1 is a diagram showing an induction heating coil substrate 110 according to the first embodiment as viewed from the front side. [Figure 9] 3 is a diagram illustrating the wiring relationship on the front and back surfaces of the induction heating coil substrate 110 according to the first embodiment. FIG. [Figure 10] 1 is a perspective view of the induction heating unit 100 according to the first embodiment, as viewed from the back side. [Figure 11] FIG. 10 is a view of an induction heating coil substrate 110 according to a second embodiment as viewed from the front side. [Figure 12] FIG. 10 is a view of an induction heating unit 100 according to a third embodiment as viewed from the front. [Figure 13] FIG. 10 is a diagram illustrating the configuration of an induction heating coil substrate 110 according to a fourth embodiment. [Figure 14] FIG. 10 is a view of an induction heating coil substrate 110 according to a fifth embodiment as viewed from the front side. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an induction cooking device according to an embodiment will be described with reference to the drawings. The present disclosure is not limited to the embodiments described below. In addition, the dimensional relationships between components in the following drawings, including FIG. 1, may differ from the actual relationships. Furthermore, in the following description, terms indicating directions are used as appropriate to facilitate understanding, but these terms are for explanatory purposes and do not limit the present disclosure. Examples of terms indicating directions include "up," "down," "right," "left," "front," and "rear." The induction cooking device also includes a multi-purpose cooking device having multiple types of heating means.

[0011] Embodiment 1 Fig. 1 is a perspective view of an induction heating cooker according to embodiment 1. As shown in Fig. 1, the induction heating cooker according to embodiment 1 is a cooking cooker that uses electromagnetic induction to heat a cooking container and an object to be heated (food to be cooked), which are heating targets. A main body case 1 of the induction heating cooker houses equipment that performs cooking. Here, with regard to the installed induction heating cooker, particularly in plate-like members such as various boards described below, the surface facing upward is referred to as the front surface, and the surface opposite the front surface is referred to as the back surface.

[0012] A top plate 10, which serves as a baking tray, is placed on top of the main body case 1, and a metal cooking container containing an object to be heated is placed on it. The top plate 10 is made of, for example, crystallized glass, which is transparent to infrared rays. The top plate 10 in the first embodiment corresponds to the induction heating unit 100 described below, and has two heating areas 11, which are regions where the cooking container and the object to be heated (hereinafter referred to as the object to be heated) placed on the surface of the top plate 10 can be induction heated. The boundaries of the heating areas 11 are indicated to the user by a circular pattern printed on the top plate 10.

[0013] The induction cooking appliance in the first embodiment also has an operation display panel 30 on the front upper surface for operating and displaying various cooking condition settings, alarms, and abnormality information. Furthermore, the induction cooking appliance in the first embodiment has a grill cooking appliance 20 on the lower left side when viewed from the front. The grill cooking appliance 20 is installed on the left side of the front of the induction cooking appliance, and has a grill door 21 for opening and closing a grill chamber (not shown).

[0014] FIG. 2 is a diagram illustrating the internal configuration of the main body case 1 of the induction heating cooker of the first embodiment. In FIG. 2, the top plate 10 is removed. The main body case 1 of the induction heating cooker has an air intake port 40 at the rear for taking in air from the outside to be sent to the grill chamber of the grill cooker 20, etc. The main body case 1 also has an exhaust port 41 for discharging smoke and other gases generated from the heated objects in the grill chamber together with the air. When a fan (not shown) installed in the main body case 1 is driven, air is taken into the main body case 1 from the air intake port 40, passes through the fan, and is discharged from the exhaust port 41. Here, part of the air taken in from the air intake port 40 is also used to cool the induction heating unit 100, which will be described later.

[0015] Moreover, the induction heating cooker in the first embodiment has two induction heating units 100. The induction heating units 100 have induction heating coils 112, which will be described later, and inductively heat an object to be heated placed on the heating area 11 of the top plate 10. The induction heating units 100 will be described later. Here, the number of induction heating units 100 included in the induction heating cooker is not limited to two.

[0016] Fig. 3 is a schematic diagram showing the internal configuration of the induction cooking appliance according to the first embodiment. Fig. 3 shows the internal configuration of the induction cooking appliance as seen from the right side. An operation board 31 displays information on the operation display panel 30 and processes instructions entered through operations. A control box 50 is also installed inside the main body case 1. The control box 50 houses a filter board 51, an inverter board 52, a control device, and the like. These boards have components such as semiconductor integrated circuits, resistors, capacitors, and transistors fixed thereto, and have circuits formed by wiring the components together with copper foil.

[0017] The filter substrate 51 is an insulating substrate having a filter circuit. The filter circuit converts AC power supplied from a commercial power source (not shown) via a power cord 56 into DC power and rectifies it. The inverter substrate 52 is an insulating power control substrate having an inverter circuit. The inverter circuit converts the DC power converted by the filter substrate 51 into AC power of a predetermined frequency based on the control of the control device and supplies the AC power to the induction heating unit 100 via lead wires 60 and a terminal block 170. The lead wires 60 are twisted wires with an insulating coating. The terminal block 170 will be described later. A switching element 53 and a heat sink 54 are installed on the upper side of the inverter substrate 52. The switching element 53 is a part of the inverter circuit and is a power control element that performs DC-AC conversion by switching operation. Here, the switching element 53 is, for example, an IGBT (insulated gate bipolar transistor) capable of high-speed switching operation. Furthermore, aluminum heat sink 54 dissipates heat generated by, for example, the switching operation of switching element 53. The control device performs heating control in the induction heating cooker. As will be described later, an electrical signal from sensor 180 is input to the control device via sensor terminal 190 and sensor lead wire 63.

[0018] The induction heating unit 100 described above is supported from the backside by an elastic spring 131, and is pressed against the backside of the top plate 10 by the elastic force of the spring 131, thereby being fixed in place. As will be described later, the induction heating coil substrate 110 on which the induction heating coil 112 is formed is fixed in place at a fixed distance by a spacer 160. This makes it possible to prevent damage caused by contact between the induction heating coil substrate 110 and the top plate 10.

[0019] Fig. 4 is a diagram illustrating the configuration of the induction heating unit 100 in the induction heating cooker according to embodiment 1. Fig. 4 is an exploded view of the induction heating unit 100. The induction heating unit 100 according to embodiment 1 has an induction heating coil substrate 110, ferrite 120, a holding member 130, a magnetic shielding member 140, a fixing screw 150, and a spacer 160.

[0020] The induction heating coil substrate 110 has an induction heating coil 112 and a coil connection portion 113. The substrate, made of an insulating material, is a printed circuit board on which the induction heating coil 112 is formed, and is heat-resistant because it receives radiant heat from the object to be heated. The induction heating coil 112 generates a magnetic field based on power supplied from the inverter substrate 52 via the coil connection portion 113 and lead wires 60, generating eddy currents through electromagnetic induction. The induction heating coil 112 and the coil connection portion 113 in the first embodiment are formed by forming a thin film conductor such as copper foil on the printed circuit board. This eliminates the need for a jig for winding copper wire during manufacturing, and allows for a high degree of freedom in the coil shape that can be fabricated. Here, the coil connection portion 113 in the first embodiment has multiple coil connection portions 113 (an outer terminal coil connection portion 113A and an inner terminal coil connection portion 113B). The coil connection portions 113 serve as pads for connecting wiring. Each coil connection portion 113 is formed at the same position on both the front and back surfaces of the printed circuit board. As will be described later, a terminal block 170, which serves as a connection part for connecting a lead wire 60, is mounted on the coil connection portion 113. Here, the induction heating coil 112 and the like may be protected by applying a solder resist to the induction heating coil substrate 110. The induction heating coil substrate 110 will be described in detail later.

[0021] The ferrite 120 is a magnetic material that guides the magnetic flux generated by the magnetism in the induction heating coil 112 through the top plate 10 to the object to be heated located above the induction heating unit 100, thereby suppressing magnetic flux leakage downward from the induction heating coil 112. By suppressing magnetic flux leakage, the ferrite 120 prevents the control device in the control box 50 from malfunctioning due to magnetism. The holding member 130 is a member that holds the ferrite 120 by sandwiching it between itself and the induction heating coil substrate 110. The holding member 130 is also fixed to the induction heating coil substrate 110 with fixing screws 150, suppressing warping of the induction heating coil substrate 110 due to heat. The holding member 130 has a coil connection through-hole 132 and a sensor terminal through-hole 133, as described below.

[0022] 5 is a perspective view of the induction heating unit 100 according to the first embodiment, seen from the front. The magnetic shielding member 140 is a plate-shaped member made of non-magnetic metal that prevents the magnetism generated in the induction heating coil 112 from leaking outside the heating area 11. For this reason, the magnetic shielding member 140 covers the outer periphery of the induction heating unit 100, leaving the induction heating coil 112 exposed. The magnetic shielding member 140 also sandwiches the holding member 130 and the induction heating coil substrate 110, preventing warping of the induction heating coil substrate 110. Here, the magnetic shielding member 140 is not a component that necessarily needs to be attached.

[0023] The fixing screws 150 secure the induction heating coil substrate 110, the holding member 130, and the magnetic shielding member 140. By fastening the induction heating coil substrate 110, the holding member 130, and the magnetic shielding member 140 together with the fixing screws 150, no adhesive is needed to secure the induction heating coil substrate 110 when manufacturing the induction heating unit 100, facilitating assembly and other processes.

[0024] FIG. 6 is a diagram showing the relative positions of the induction heating unit 100 and the top plate 10 according to the first embodiment. The spacer 160 is an elastic member such as rubber that maintains a constant distance between the induction heating coil substrate 110 and the top plate 10. While not particularly limited, the distance between the induction heating coil substrate 110 and the top plate 10 is, for example, approximately 3 mm to approximately 4 mm. By leaving a certain distance between the induction heating coil substrate 110 and the top plate 10 rather than closely contacting them, a space is secured for a sensor 180 (described later) to be installed on the surface of the induction heating coil substrate 110. Furthermore, by providing a gap between the induction heating coil substrate 110 and the top plate 10, the influence of heat from the heated object on the induction heating coil 112 can be reduced. Furthermore, the air flowing in from the air intake 40 passes over the induction heating coil 112, thereby cooling the induction heating coil 112. The spacer 160 can stabilize the distance between the sensor 180 installed on the induction heating coil substrate 110 and the top plate 10, thereby improving the accuracy of temperature detection.

[0025] In the induction heating coil substrate 110 of the first embodiment, the terminal block 170 is mounted on the coil connection portion 113 on the back surface side of the induction heating coil substrate 110, and electrically connects the lead wire 60 to the terminal block 170. The coil connection portion 113 and the terminal block 170 are fixed by soldering.

[0026] FIG. 7 is a diagram illustrating the configuration of the induction heating coil substrate 110 according to the first embodiment. FIG. 7 shows a cross section of the induction heating coil substrate 110 taken along line BB in FIG. 8, which will be described later. The sensor 180 is a means for detecting a physical quantity. The sensor 180 converts the detected physical quantity into an electrical signal. Here, the sensor 180 in the first embodiment is a temperature sensor that detects the temperature of an object to be heated. The sensor 180 is attached to the surface of the induction heating coil substrate 110. The sensor 180 in the first embodiment is a thermistor that comes into contact with the back surface of the top plate 10 and detects the temperature via the top plate 10. However, the present invention is not limited to this, and the sensor 180 may also be an infrared temperature sensor that detects the temperature without contact.

[0027] In addition, in the first embodiment, the sensor 180 on the front surface of the induction heating coil substrate 110 and the sensor connection section 117 formed on the back surface of the induction heating coil substrate 110 are electrically connected via the sensor vias 118 and the sensor connection pattern wires 119 made of thin-film conductors. Therefore, an electrical signal related to the physical quantity detected by the sensor 180 is sent to the sensor connection section 117 via the sensor vias 118 and the sensor connection pattern wires 119 made of thin-film conductors. The electrical signal is then sent to the control device via the sensor lead wire 63 connected to a sensor terminal 190 installed on the sensor connection section 117. The sensor terminal 190 is not particularly limited, but can be, for example, a connector or a socket. The sensor connection section 117 and the sensor terminal 190 are fixed together with solder.

[0028] 8 is a view of the induction heating coil substrate 110 according to the first embodiment as seen from the front. As described above, the induction heating coil substrate 110 has the induction heating coil 112 and the coil connection part 113. The induction heating coil 112 is a thin-film conductor formed by winding from the inside to the outside, with the start of the coil winding located approximately at the center of the induction heating coil substrate 110. The outer end, which is the end of the winding of the induction heating coil 112, is electrically connected to the outer end coil connection part 113A. In addition, a coil via 115 is provided at the start of the coil winding.

[0029] FIG. 9 is a diagram illustrating the wiring relationship on the front and back surfaces of the induction heating coil substrate 110 according to the first embodiment. In FIG. 9, the wiring pattern on the front surface is drawn with dotted lines, and the wiring pattern on the back surface is drawn with solid lines. In the induction heating coil substrate 110 according to the first embodiment, the inner end portion, which is the winding start point of the induction heating coil 112, is electrically connected to the inner end coil connection portion 113B on the back surface. Here, the inner end coil connection portion 113B is disposed on the outer periphery of the induction heating coil substrate 110. Therefore, in the first embodiment, the inner end portion of the induction heating coil 112 on the front surface of the induction heating coil substrate 110 is electrically connected to the inner end coil connection portion 113B on the back surface via a coil via 115 and a coil connection pattern line 116 made of a thin-film conductor formed on the back surface of the induction heating coil substrate 110. The coil connection portion 113 is located outer than the induction heating coil 112, and the outer end coil connection portion 113A and the inner end coil connection portion 113B are disposed side by side along the same side. By arranging the outer end coil connection portion 113A and the inner end coil connection portion 113B side by side, the work of connecting the lead wire 60 can be carried out efficiently.

[0030] As described above, the sensor 180 on the front surface of the induction heating coil substrate 110 and the sensor connection part 117 formed on the back surface of the induction heating coil substrate 110 are electrically connected via the sensor vias 118 and the sensor connection pattern wire 119 made of a thin-film conductor. A sensor terminal 190 is provided on the sensor connection part 117. As the sensor connection part 117 is located on the back surface of the induction heating coil substrate 110 and on the outer periphery side of the induction heating coil 112, the task of connecting the sensor lead wire 63 to the sensor connection part 117 can be easily performed.

[0031] 10 is a perspective view of the induction heating unit 100 according to embodiment 1, as seen from the back side. The holding member 130 has a coil connection portion through-hole 132 corresponding to the terminal block 170. The holding member 130 also has a sensor terminal through-hole 133 corresponding to the sensor terminal 190. This allows the terminal block 170 and the sensor terminal 190 to be exposed at the bottom of the induction heating unit 100.

[0032] As described above, according to the induction heating cooker of the first embodiment, the sensor 180 is installed on the surface of the induction heating coil substrate 110 so as not to come into contact with the induction heating coil 112, which is a thin-film conductor. In the induction heating cooker of the first embodiment, the induction heating coil 112 is made of a thin-film conductor, which increases the degree of freedom in winding. Therefore, after positioning the sensor 180, the induction heating coil 112 can be configured so as not to come into contact with the sensor 180, which increases the degree of freedom in the installation position of the sensor 180.

[0033] Furthermore, in the induction heating cooker according to the first embodiment, the sensor connection part 117 is provided on a surface other than the surface of the induction heating coil substrate 110. This reduces the effect of heat from the object to be heated on the sensor connection part 117. Furthermore, the induction heating cooker can be easily assembled. By arranging the sensor connection part 117 on the outer periphery of the induction heating coil substrate 110, the sensor lead wire 63 can be easily attached and routed. By connecting the sensor connection part 117 and the sensor via 118 with the sensor connection pattern wire 119, production efficiency can be improved and costs can be reduced.

[0034] Furthermore, in the first embodiment, sensor 180 is a temperature sensor that is installed so as to avoid the thin-film conductor of induction heating coil 112, and therefore can detect the temperature at a position closer to the object to be heated. If sensor 180 is a thermistor, it will come into contact with the object to be heated at a position closer to the object on top plate 10 on which the object to be heated is placed, allowing for more accurate temperature detection. If sensor 180 is an infrared sensor, it can detect the temperature without contact.

[0035] Embodiment 2 FIG. 11 is a view of an induction heating coil substrate 110 according to the second embodiment, viewed from the front. In the first embodiment, the induction heating coil 112 is a single coil formed by winding a thin-film conductor. In the induction heating unit 100 of the induction heating cooker according to the second embodiment, a plurality of induction heating coils 112 made of thin-film conductors are arranged on the surface of the induction heating coil substrate 110. A plurality of sensors 180 are installed corresponding to the induction heating coils 112 at positions where the thin-film conductors that will become the induction heating coils 112 are not attached. Therefore, the plurality of sensors 180 can detect the temperatures corresponding to the induction heating coils 112, and the control device can perform control based on the detected temperatures. This improves the cooking performance of the induction heating cooker. In the second embodiment, a plurality of induction heating coils 112 are arranged on the surface of the induction heating coil substrate 110. By individually controlling each induction heating coil 112, heating control such as generating convection in the cooking vessel can be performed.

[0036] Embodiment 3 FIG. 12 is a front view of the induction heating unit 100 according to the third embodiment. As shown in FIG. 12, the induction heating coil 112 is a coil in which a thin-film conductor is formed on a substrate. Therefore, the sensor 180 can be positioned and the shape of the induction heating coil 112 can be changed to avoid the sensor 180. This allows the sensor 180 to be installed at a desired position on the induction heating coil substrate 110, increasing the degree of freedom in the installation position of the sensor 180. This also increases the degree of freedom in the shape of the induction heating coil 112, thereby increasing the density of the induction heating coil 112. This not only improves the detection accuracy of the sensor 180, but also improves heating efficiency. Furthermore, the sensor 180 can be used for purposes other than detecting the temperature of the object to be heated, such as detecting the ambient temperature around the induction heating coil 112, thereby improving safety.

[0037] Embodiment 4 Fig. 13 is a diagram illustrating the configuration of an induction heating coil substrate 110 according to embodiment 4. Fig. 13 shows a cross section of the induction heating coil substrate 110 taken along line BB in Fig. 8 described in embodiment 1. In the above-described embodiment 1, a sensor connection portion 117 was provided on the back surface of the induction heating coil substrate 110, and sensor vias 118 and sensor terminals 190 were electrically connected by thin-film conductor sensor connection pattern wires 119 and the sensor connection portion 117.

[0038] However, this is not limiting. For example, as shown in Fig. 13, the sensor connection portion 117 may not be provided on the back surface of the induction heating coil substrate 110, and the sensor connection pattern line 119 and the sensor terminal 190 may be connected by a sensor lead wire 191. This allows the sensor terminal 190 to be installed in any position.

[0039] Embodiment 5. Fig. 14 is a view of induction heating coil substrate 110 according to embodiment 5 as seen from the front. In induction heating coil substrate 110 according to embodiment 1, magnetic shielding member 140 is attached to the upper side of induction heating coil substrate 110 so as to surround the outer periphery of induction heating coil 112. In the induction heating cooker according to embodiment 5, as shown in Fig. 14, magnetic shielding pattern 141 made of a thin-film conductor is formed on the surface of induction heating coil substrate 110 according to embodiment 2 so as to surround the outer periphery of induction heating coil 112. For this reason, induction heating coil substrate 110 does not need to have magnetic shielding member 140.

[0040] Various aspects of the present disclosure are summarized below as appendices.

[0041] (Appendix 1) an induction heating coil substrate having an induction heating coil in which a conductor is wound on an insulating substrate; a sensor installed on the induction heating coil substrate at a position not in contact with the conductor of the induction heating coil; An induction heating cooker comprising: (Appendix 2) a sensor connection unit that electrically connects a control device that controls the device and the sensor; 2. The induction heating cooker according to claim 1, wherein the sensor connection portion is disposed on a surface of the induction heating coil substrate opposite to a surface on which the induction heating coil is provided. (Appendix 3) 3. The induction heating cooker according to claim 2, wherein the sensor connection portion is disposed on the induction heating coil substrate on an outer circumferential side of the induction heating coil. (Appendix 4) 4. The induction heating cooker according to claim 3, wherein the sensor and the sensor connection part are connected by pattern wiring on the induction heating coil substrate. (Appendix 5) 5. The induction heating cooker according to any one of Supplementary Note 1 to Supplementary Note 4, wherein the sensor is a temperature sensor that detects the temperature of an object to be heated. (Appendix 6) 6. The induction heating cooker according to claim 5, wherein the sensor is a thermistor. (Appendix 7) 6. The induction heating cooker according to claim 5, wherein the sensor is an infrared sensor. (Appendix 8) 8. The induction heating cooker according to claim 1, wherein a plurality of the sensors are disposed on the induction heating coil substrate. [Explanation of symbols]

[0042] 1 main body case, 10 top plate, 11 heating area, 20 grill cooker, 21 grill door, 30 operation display panel, 31 operation board, 40 air intake port, 41 air exhaust port, 50 control box, 51 filter board, 52 inverter board, 53 switching element, 54 heat sink, 56 power cord, 60 lead wire, 63, 191 sensor lead wire, 100 induction heating unit, 110 induction heating coil board, 112 induction heating coil, 113 coil connection portion, 113A outer terminal coil connection portion, 113B inner terminal coil connection portion, 115 coil via, 116 coil connection pattern wire, 117 sensor connection portion, 118 sensor via, 119 sensor connection pattern wire, 120 ferrite, 130 holding member, 131 spring, 132 coil connection portion through hole, 133 Sensor terminal through hole, 140 magnetic shielding material, 141 magnetic shielding pattern, 150 fixing screw, 160 spacer, 170 terminal block, 180 sensor, 190 sensor terminal.

Claims

1. an induction heating coil substrate having an induction heating coil in which a conductor is wound on an insulating substrate; a sensor installed on the induction heating coil substrate at a position not in contact with the conductor of the induction heating coil; a sensor connection unit that electrically connects a control device that controls the device and the sensor; Equipped with the sensor connection portion is disposed on a surface of the induction heating coil substrate opposite to a surface on which the induction heating coil is provided, In the induction heating coil substrate, the sensor connection portion is disposed on an outer circumferential side of the induction heating coil, The induction heating cooker is configured such that the sensor and the sensor connection section are connected by pattern wiring on the induction heating coil substrate.

2. 2. The induction heating cooker according to claim 1, wherein the sensor is a temperature sensor that detects the temperature of an object to be heated.

3. 3. The induction heating cooker according to claim 2, wherein the sensor is a thermistor.

4. 3. The induction heating cooker according to claim 2, wherein the sensor is an infrared sensor.

5. The induction heating cooker according to any one of claims 1 to 4, wherein a plurality of the sensors are provided on the induction heating coil substrate.

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