Semiconductor device and manufacturing method thereof

Abstract

To provide a semiconductor device which can protect ink, and a method for manufacturing the same.SOLUTION: A semiconductor device includes a resin layer, ink and a film. The ink is provided on the upper surface of the resin layer. The film coats the resin layer and the ink. Surface roughnesses of the film are different between a first region where the ink is provided and a second region where the ink is not provided.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present embodiment relates to a semiconductor device and a manufacturing method thereof. [Background technology]

[0002] A logo, product name, country of origin, information code, etc. may be displayed on the exterior of a semiconductor device. The information code may be, for example, a barcode. Examples of display methods include laser marking and ink marking.

[0003] Ink marks are printed on the shielding film of a semiconductor package using, for example, an inkjet printer, but there is a risk that the ink will disappear or become faded due to organic solvents or physical friction. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] U.S. Patent No. 9,805,224 Summary of the Invention [Problem to be solved by the invention]

[0005] A semiconductor device capable of protecting ink and a method for manufacturing the same are provided. [Means for solving the problem]

[0006] The semiconductor device according to this embodiment includes a resin layer, ink, and a film. The ink is provided on the upper surface of the resin layer. The film covers the resin layer and the ink. The film has different surface roughness between a first region where the ink is provided and a second region where the ink is not provided. [Brief explanation of the drawings]

[0007] [Figure 1]1 is a cross-sectional view showing an example of the configuration of a semiconductor device according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view showing an example of the configuration of an ink cartridge and its surroundings according to the first embodiment. [Figure 3A] 3 is a photograph showing an example of the surface of a film according to the first embodiment. [Figure 3B] 3 is a photograph showing an example of the surface of a film according to the first embodiment. [Figure 3C] 3 is a photograph showing an example of the surface of a film according to the first embodiment. [Figure 4A] 6 is a graph showing an example of a success rate of reading a barcode according to the first embodiment. [Figure 4B] 6 is a graph showing an example of a success rate of reading a barcode according to the first embodiment. [Figure 4C] 6 is a graph showing an example of a success rate of reading a barcode according to the first embodiment. [Figure 5A] 4 is an enlarged photograph showing an example of a surface in an area where ink is provided according to the first embodiment. [Figure 5B] 4 is an enlarged photograph showing an example of a surface in an area where ink is provided according to the first embodiment. [Figure 5C] 4 is an enlarged photograph showing an example of a surface in an area where ink is provided according to the first embodiment. [Figure 6] 4 is an enlarged photograph showing an example of a surface in an area where ink is not applied according to the first embodiment. [Figure 7] 6 is a graph showing an example of measurement results of skewness on the surface of the film according to the first embodiment. [Figure 8A] 3A to 3C are cross-sectional views showing an example of a method for manufacturing the semiconductor device according to the first embodiment. [Figure 8B] 8B is a cross-sectional view showing an example of the method for manufacturing the semiconductor device, subsequent to FIG. 8A. [Figure 9] FIG. 1 is a cross-sectional view showing an example of the configuration of a semiconductor device according to a first comparative example. [Figure 10] FIG. 10 is a cross-sectional view showing an example of the configuration of an ink cartridge and its surroundings according to a second comparative example. [Figure 11] FIG. 10 is a cross-sectional view showing an example of the configuration of an ink cartridge and its surroundings according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to these embodiments. In the following embodiments, the up-down direction of a semiconductor substrate indicates the relative direction when the surface on which the semiconductor element is provided is the upper side, and may differ from the up-down direction according to gravitational acceleration. The drawings are schematic or conceptual, and the proportions of each part are not necessarily the same as those in reality. In the specification and drawings, elements similar to those described above with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted as appropriate.

[0009] (First embodiment) 1 is a cross-sectional view showing an example of the configuration of a semiconductor device 1 according to the first embodiment. The semiconductor device 1 includes a wiring substrate 10, semiconductor chips 30 to 33, bonding wires 90, a sealing resin 91, ink 100, and a film 110. The semiconductor device 1 is, for example, a package of a NAND flash memory.

[0010] The wiring board 10 may be a printed circuit board or an interposer including a wiring layer (not shown) and an insulating layer (not shown). The wiring layer may be made of a low-resistance metal such as copper (Cu), nickel (Ni), or an alloy thereof. The insulating layer may be made of an insulating material such as glass epoxy resin. The wiring board 10 may have a multilayer wiring structure formed by stacking multiple wiring layers and multiple insulating layers. The wiring board 10 may have through electrodes that penetrate from its front surface to its back surface, like an interposer, for example.

[0011] The wiring board 10 has a ground line 11. The ground line 11 electrically connects a metal bump 13 provided on the lower surface of the wiring board 10 to the film 110. The metal bump 13 is provided to electrically connect the wiring board 10 to other components (not shown).

[0012] The semiconductor chip 30 is, for example, a memory chip including a NAND flash memory. The semiconductor chip 30 has a semiconductor element (not shown) on its surface (top surface). The semiconductor element may be, for example, a memory cell array and its peripheral circuit (CMOS circuit). The memory cell array may be a three-dimensional memory cell array in which a plurality of memory cells are arranged three-dimensionally. Furthermore, a semiconductor chip 31 is bonded onto the semiconductor chip 30 via an adhesive layer (not shown). A semiconductor chip 32 is bonded onto the semiconductor chip 31 via an adhesive layer. A semiconductor chip 33 is bonded onto the semiconductor chip 32 via an adhesive layer. The semiconductor chips 31 to 33 are, for example, memory chips including a NAND flash memory, similar to the semiconductor chip 30. The semiconductor chips 30 to 33 may be the same memory chip. In the figure, the semiconductor chips 30 to 33 are stacked as four memory chips. However, the number of stacked semiconductor chips may be three or less, or five or more.

[0013] The bonding wires 90 are connected to arbitrary pads on the wiring board 10 and the semiconductor chips 30 to 33. To connect with the bonding wires 90, the semiconductor chips 30 to 33 are stacked with a shift by the amount of the pads.

[0014] Furthermore, the semiconductor chips 30 to 33 and the bonding wires 90 are sealed with a sealing resin 91. As a result, the semiconductor device 1 is configured such that the plurality of semiconductor chips 30 to 33 are mounted on the wiring board 10 as one semiconductor package.

[0015] The ink 100 is provided on the surface F91 (upper surface) of the sealing resin 91. When viewed from the top of the paper in FIG. 1, the ink 100 displays, for example, a logo, product name, country of origin, and information code (see FIGS. 3A to 3C). The information code includes, for example, a barcode. The ink 100 is printed using, for example, an inkjet printer. The ink 100 may be any ink that can change from a liquid or semi-solid state to a solid state.

[0016] The film 110 covers the sealing resin 91 and the ink 100. The film 110 is provided on the ink 100 and on the sealing resin 91 in an area where the ink 100 is not provided. As shown in FIG. 1 , the ink 100 is not exposed and is covered by the film 110. This makes it possible to protect the ink 100. The film 110 is made of a material that is higher than the ink 100 in at least one of hardness, abrasion resistance, chemical resistance, oil resistance, heat resistance, and flame retardancy.

[0017] Moreover, the film 110 is preferably made of a conductive material such as a metal. The film 110 is electrically connected to the ground line of the mounting substrate via the ground line 11 and the metal bump 13, so that the film 110 functions as a shielding film that blocks electromagnetic waves.

[0018] 2 is a cross-sectional view showing an example of the configuration of the ink 100 and its surroundings according to the first embodiment. FIG. 2 is an enlarged view of the dashed frame D shown in FIG.

[0019] Ink 100 is applied to region R1. Ink 100 is not applied to region R2.

[0020] The ink 100 contains a resin and a pigment 101. The resin is, for example, a UV (Ultraviolet) curable resin. The color of the ink 100 differs depending on the type of pigment 101 used to color it. Differences between different types of ink 100 will be described later with reference to FIGS. 3A to 3C.

[0021] The film 110 includes a film 111 , a film 112 , and a film 113 .

[0022] The film 111 has higher adhesion to the sealing resin 91 than the film 112. The film 111 is made of, for example, stainless steel such as SUS304.

[0023] The film 112 has high conductivity and is made of, for example, copper (Cu).

[0024] The film 113 protects the film 112 from oxidation, etc. The film 113 is made of, for example, stainless steel such as SUS304.

[0025] Next, the differences in the types of ink 100 will be described.

[0026] 3A to 3C are photographs showing an example of the surface F110 of the film 110 according to the first embodiment. As shown in Fig. 3A to 3C, characters and a barcode are displayed on the surface F110 using ink 100. The barcode is, for example, a two-dimensional barcode.

[0027] 3A to 3C show photographs of characters and a barcode printed using black ink, green ink, and white ink, respectively. The pigment 101 of the black ink is, for example, carbon black. The pigment 101 of the white ink is, for example, titanium(IV) oxide.

[0028] Note that differences in the color of the ink 100 do not appear on the surface F110 because the ink 100 is covered by the film 110. Differences in the appearance of the printed content appear due to the degree of light reflection on the surface F110.

[0029] 3A to 3C, the visibility of the printed content is highest when black ink is used, and the visibility of the printed content decreases in the order of black ink, green ink, and white ink.

[0030] In the example shown in FIGS. 3A to 3C, the surface F110 in the region R2 where the ink 100 (characters and barcodes) is not provided is a rough, matte surface.

[0031] 3C, the surface F110 in the region R1 where the ink 100 (characters and barcode) is provided is also matte. Because both regions R1 and R2 are matte, the visibility of the printed content is low.

[0032] In the example shown in FIGS. 3A and 3B, the surface of face F110 in region R1 where ink 100 (characters and barcodes) is provided is relatively smooth. Light is reflected specularly to a certain extent in region R1, making region R1 appear shiny. The surface of face F110 in region R2 outside region R1 is rough, causing light to be diffusely reflected in region R2. Region R2, which is the background, appears dark, while region R1, which is the printed content, appears bright, increasing the difference in brightness (gloss difference) between regions R1 and R2. This improves the visibility of the printed content.

[0033] The surface condition will be described in detail later with reference to FIGS. 5A to 5C and 6.

[0034] 4A to 4C are graphs showing examples of the success rate of barcode reading according to the first embodiment. The vertical axis of the graph represents the success rate of barcode reading. The horizontal axis of the graph represents the barcode size. To evaluate the readability of the barcode, the success rate of reading was measured for several barcode sizes of 2.0 mm, 2.5 mm, 3.0 mm, and 4.0 mm. The success rate of barcode reading was measured after the film 110 was formed.

[0035] 4A to 4C show graphs in which characters and a barcode are printed using black ink, green ink, and white ink, respectively.

[0036] The success rate of barcode reading is measured using a barcode reader, which converts an image captured by a built-in camera into a binary image of black and white using an internal processing device, and then reads the barcode from the binary image.

[0037] As shown in FIG. 4A, when black ink is used as ink 100, the reading success rate is 100% for barcode sizes of 2.5 mm or more.

[0038] As shown in FIG. 4B, when green ink is used as ink 100, the reading success rate is 100% for a barcode size of 4.0 mm.

[0039] As shown in FIG. 4C, when white ink is used as ink 100, the reading success rate is 0% for all barcode sizes between 2.0 mm and 4.0 mm.

[0040] Regardless of the ink color used, the larger the barcode size, the higher the success rate of reading. When comparing barcodes of the same size, the success rate is highest when black ink is used. The success rate of reading decreases in the order of black ink, green ink, and white ink. This trend in success rate of reading is the same as the trend in the visibility of printed content.

[0041] Next, differences in the surface state of the surface F110 depending on the type of ink 100 will be described.

[0042] 5A to 5C are enlarged photographs showing examples of a surface F110 in a region R1 where the ink 100 is applied according to the first embodiment.

[0043] 5A to 5C show photographs of characters and a barcode printed using black ink, green ink, and white ink, respectively.

[0044] The reflection characteristics of the surface F110 are affected by the surface condition of the surface F110. More specifically, the reflection characteristics of the surface F110 are affected by the surface roughness of the surface F110. The surface roughness of the surface F110 can be affected by, for example, the particle diameter (size) and density (concentration) of the pigment 101.

[0045] The particle diameter of the black ink pigment 101 is relatively small. As shown in Fig. 5A, the unevenness caused by the pigment 101 is not clearly visible, and the surface F110 in the region R1 is relatively smooth.

[0046] The particle diameter of the green ink pigment 101 is approximately the same as the particle diameter of the white ink pigment 101, which will be described later. However, the concentration of the green ink pigment 101 is lower than the concentration of the white ink pigment 101. As shown in FIG. 5B, the surface F110 in region R1 has both relatively smooth portions and rough, uneven portions (bumps).

[0047] The particle diameter of the white ink pigment 101 is relatively large. The concentration of the white ink pigment 101 is relatively high. Therefore, as shown in Figure 5C, unevenness due to the pigment 101 exists on the surface F110 in region R1, and the surface F110 in region R1 has a matte finish.

[0048] FIG. 6 is an enlarged photograph showing an example of a surface F110 in the region R2 where the ink 100 is not provided according to the first embodiment.

[0049] 6, the surface F110 in the region R2 is a rough, matte surface. This is because the outer surface of the sealing resin 91 is rough, as will be described later with reference to FIG. 8A. The outer surface includes the top surface (surface F91) and the side surfaces.

[0050] 7 is a graph showing an example of the measurement results of skewness on the surface F110 of the film 110 according to the first embodiment. The horizontal axis of the graph represents the type of ink. The vertical axis of the graph represents skewness (Rsk). Skewness is one of the roughness parameters.

[0051] The skewness was measured using a laser (non-contact) method. The skewness shown in FIG. 7 was measured based on the standard described in JIS B0601:2001 (ISO 4287:1997). The skewness was measured at the ink portion and the mold rough surface portion of the surface F110. That is, the skewness was measured after the film 110 was formed. The ink portion corresponds to the region R1 where the ink 100 is applied. The mold rough surface portion corresponds to the region R2 where the ink 100 is not applied.

[0052] Note that surface roughness may vary depending on the measurement position. Therefore, the skewness shown in Fig. 7 is, for example, an average value measured at multiple measurement positions. The skewness shown in Fig. 7 is an average value measured at 10 arbitrary positions.

[0053] The skewness of the surface F110 in the mold rough surface portion is within the range of approximately 0.3 to approximately 0.4, and is almost constant regardless of the type of ink 100. On the other hand, the skewness of the surface F110 in the ink portion varies within the range of approximately -0.3 to approximately 0.4 depending on the type of ink 100.

[0054] When black ink is used as ink 100, the difference in skewness of surface F110 between the mold rough surface portion and the ink portion is approximately 0.6. When green ink is used as ink 100, the difference in skewness of surface F110 between the mold rough surface portion and the ink portion is approximately 0.2. When white ink is used as ink 100, the difference in skewness of surface F110 between the mold rough surface portion and the ink portion is approximately 0.05 or less.

[0055] As shown in Figures 3A to 3C, 4A to 4C, and 7, the greater the difference in skewness of surface F110, the higher the visibility or reading success rate. In other words, there is a strong correlation between the difference in skewness and the visibility or reading success rate. The difference in skewness of film 110 between region R1 where ink 100 is applied and region R2 where ink 100 is not applied is preferably 0.2 or more. The greater this difference, the better, with a difference of 0.3 to 0.6 being more preferable, and a difference of 0.6 or more being even more preferable. In the first embodiment, the skewness of the film 110 in region R1 is preferably at least 0.2 lower than the skewness of the film 110 in region R2. More preferably, it is 0.3 to 0.6 lower, and even more preferably, it is 0.6 or lower. This can improve the visibility of the printed content or the ease of removing the barcode.

[0056] Next, a method for forming the ink 100 and the film 110 will be described.

[0057] 8A and 8B are cross-sectional views showing an example of a method for manufacturing the semiconductor device 1 according to the first embodiment.

[0058] First, the semiconductor chips 30 to 33 are stacked on the wiring substrate 10, and bonding wires 90 are formed to electrically connect the wiring substrate 10 and the semiconductor chips 30 to 33. Then, as shown in Fig. 8A, a sealing resin 91 is formed to cover the semiconductor chips 30 to 33 and the bonding wires 90 (see Fig. 1).

[0059] The surface F91 of the sealing resin 91 is formed to have a rough surface (matte). The surface condition of the surface F91 may be affected by, for example, the surface condition of a release film provided between the sealing resin 91 and a mold when the sealing resin 91 is formed. For example, a release film with a rough surface is used, and the pattern of the rough surface of the release film is transferred to the surface F91. Note that the surface condition of the surface F91 may also be affected by the type of filler and resin in the sealing resin 91, in addition to the release film.

[0060] In order to improve the adhesion between the sealing resin 91 and the ink 100, the sealing resin 91 may be subjected to O2 plasma treatment before the ink 100 is formed.

[0061] Next, as shown in FIG. 8B, ink 100 is applied to the upper surface (surface F91) of the sealing resin 91. The ink 100 is formed by printing, for example, a logo, letters, an information code, or the like using an inkjet printer. The ink 100 may be any ink that can change from a liquid or semi-solid state to a solid state. The ink 100 is temporarily cured with, for example, ultraviolet light, and then cured with heat.

[0062] 2, a film 110 is formed to cover the sealing resin 91 and the ink 100. The film 110 is formed by, for example, sputtering. Thereafter, metal bumps 13 are provided, thereby completing the semiconductor device 1 shown in FIG.

[0063] As described above, according to the first embodiment, the film 110 covers the sealing resin 91 and the ink 100. As a result, the ink 100 can be protected.

[0064] The surface color of the film 110 is substantially the same between the region R1 where the ink 100 is provided and the region R2 where the ink 100 is not provided. However, the reflection characteristics (reflectance) of the surface of the film 110 differ between the region R1 where the ink 100 is provided and the region R2 where the ink 100 is not provided, which can improve the recognizability of characters and the readability of barcodes.

[0065] Furthermore, the surface roughness of the film 110 differs between the region R1 where the ink 100 is provided and the region R2 where the ink 100 is not provided. In the first embodiment, the surface roughness of the film 110 in the region R1 is smaller than the surface roughness of the film 110 in the region R2.

[0066] Furthermore, light is more likely to be reflected specularly in one of regions R1 and R2, while it is more likely to be reflected diffusely in the other. This leads to a difference in reflectance. The difference in reflectance affects the recognizability of characters and the readability of barcodes. Therefore, it is preferable that the difference in reflectance of the film 110 between region R1, where the ink 100 is provided, and region R2, where the ink 100 is not provided, is 30% or more. In the first embodiment, the reflectance of the film 110 in region R1 is 30% or more higher than the reflectance of the film 110 in region R2. More preferably, the difference should be 40% or more.

[0067] In the first embodiment, the case where the colors of the ink 100 (pigment 101) are black, green, and white has been described. However, rather than the color of the ink 100, the surface state of the surface F100 after the ink 100 has hardened has an effect on the surface state and reflection characteristics of the surface F110.

[0068] If the surface F91 of the sealing resin 91 is rough, the components of the ink 100, such as the pigment 101, are selected so that the surface of the ink 100 (surface F100) is smooth. This causes a certain degree of specular reflection of light from the surface F110 in the region R1. Because the surface F110 in the region R2 is rough and matte, light is diffusely reflected from the surface F110 in the region R2. As a result, the background region R2 appears dark, and the printed content region R1 appears bright. Increasing the contrast between the brightness of the regions R1 and R2 can improve the visibility of the printed content and the readability of the barcode.

[0069] The average particle size of the pigment 101 contained in the ink 100 is preferably, for example, approximately 100 nm or less. The average particle size of the carbon black used in the black ink is, for example, several tens of nm.

[0070] The concentration of pigment 101 contained in ink 100 is preferably 10% or less, and more preferably 5% or less. Furthermore, ink 100 may not contain pigment 101. In other words, the concentration of pigment 101 may be zero. In this case, the color of ink 100 is colorless and transparent, or the base color of components other than pigment 101.

[0071] 2 is a multilayer film, but the film 110 may also be a single layer film.

[0072] (Comparative Example) 9 is a cross-sectional view showing an example of the configuration of a semiconductor device 1a according to a first comparative example. The first comparative example differs from the first embodiment in that a mark 100a is provided instead of the ink 100.

[0073] In the first comparative example, the mark 100a is a laser mark, which is formed by irradiating the package surface with laser light to scrape or melt the surface.

[0074] Here, semiconductor packages are required to be smaller and thinner. To achieve this, for example, it is possible to thin the wiring substrate 10 and the semiconductor chips 30-33, as well as the sealing resin 91. However, thinning the sealing resin 91 results in a thinner sealing resin 91 on the semiconductor chips 30-33 and on the bonding wires 90. In FIG. 6, thickness T1 indicates the thickness of the sealing resin 91 on the bonding wires 90. Thickness T2 indicates the thickness of the sealing resin 91 on the semiconductor chips 30-33. If the thicknesses T1 and T2 are thin, the semiconductor chips 30-33 may be damaged by laser light passing through the sealing resin 91, or the bonding wires 90 and the semiconductor chips 30-33 may be exposed by laser engraving the sealing resin 91. The thickness of the sealing resin 91 cannot be made as thin as possible due to the need to suppress transmission of laser light and to provide an engraving margin for the mark 100a.

[0075] 10 is a cross-sectional view showing an example of the configuration of ink 100b and its surroundings according to Comparative Example 2. Comparative Example 2 differs from the first embodiment in that ink 100b is provided on a film 110.

[0076] In the second comparative example, the ink 100b is an ink mark. Compared to a laser mark, an ink mark has less of an effect on the bonding wires 90 and the semiconductor chips 30 to 33 in the semiconductor package. Therefore, by using the ink mark, the sealing resin 91 can be made thinner, making it easier to make the semiconductor package thinner.

[0077] However, there is a possibility that the ink 100b may disappear or the printed surface may chip or become thin due to organic solvents or mechanical friction. Also, there is a possibility that the ink 100b may discolor during high-temperature testing. Furthermore, the outer surface of a semiconductor package may be required to be flame-retardant, and it may be difficult to make the ink 100b flame-retardant.

[0078] In contrast, in the first embodiment, the ink 100, which is an ink mark, is formed on the semiconductor package, and then the film 110 is formed. This covers the ink 100. As a result, the ink 100 can be protected from physical friction, chemicals, oil, and the like. Furthermore, since the ink 100 can be printed to a thin thickness, the thickness of the sealing resin 91 is significantly reduced relative to the thickness of the ink 100, allowing for a thinner semiconductor package overall. The thickness of the ink 100 is, for example, 4 μm or more. Therefore, compared to the first and second comparative examples, the semiconductor package can be made thinner by making the sealing resin 91 thinner, and the ink 100 can be protected.

[0079] In addition, since the ink 100 is not exposed on the surface of the package, there is no need to consider discoloration of the ink 100. In addition, since the ink 100 is covered with a non-flammable film 110 (for example, a metal film), there is no need to consider the flame retardancy of the ink 100.

[0080] (Variation) The modified example differs from the first embodiment in that the surface F110 of the film 110 in the region R2 where the ink 100 is not provided is mirror-finished.

[0081] 8A, for example, by using a release film with a mirror-like surface, it is possible to form the sealing resin 91 having the mirror-like surface F91. As a result, the surface F110 of the film 110 in the region R2 also has a mirror-like surface.

[0082] In the modified example, the reading success rate is highest when white ink is used. In the modified example, the tendency of the relationship between visibility or reading success rate and ink type is opposite to that in the first embodiment.

[0083] When white ink is used, the surface of face F110 in region R1, where ink 100 (characters and barcodes) is applied, is rough, causing light to be diffusely reflected in region R1. The surface of face F110 in region R2 outside region R1 is mirror-like, causing a certain degree of regular reflection of light in region R2, making region R2 appear shiny. Region R2, which is the background, appears bright, while region R1, which is the printed content, appears dark, increasing the contrast (gloss difference) between regions R1 and R2. This improves the visibility of the printed content.

[0084] In a variant, the surface roughness of the membrane 110 in the region R1 is greater than the surface roughness of the membrane 110 in the region R2.

[0085] In a modified example, the reflectance of the film 110 in the region R1 is at least 30% lower, preferably at least 40% lower, than the reflectance of the film 110 in the region R2.

[0086] When the surface F91 of the sealing resin 91 is mirror-finished, the components of the ink 100, such as the pigment 101, are selected so that the surface of the ink 100 (surface F100) is rough. Note that the surface roughness of the surface F110 may be caused by additives in the ink 100, not limited to the pigment 101.

[0087] The larger the average particle size of the pigment in the ink 100, the more preferable it is. The average particle size of the pigment 101 contained in the ink 100 is, for example, approximately 300 nm or more. The average particle size of titanium (IV) oxide used in the white ink is, for example, around 300 nm.

[0088] The higher the pigment concentration of the ink 100, the better.

[0089] Furthermore, if the film 110 is thick, the concave portions of the roughened surface of the ink 100 may be filled with the constituent materials of the film 110, or the convex portions of the roughened surface of the ink 100 may be rounded by the adhesion of the constituent materials of the film 110. In other words, the roughness of the surface of the ink 100 may become dull. The rounding of the concave portions of the surface of the ink 100 may reduce the difference in the light reflectivity of the surface F110 between the region R1 where the ink 100 is applied and the region R2 where the ink 100 is not applied. As a result, the visibility of the printed text and the readability of the barcode may decrease. Therefore, it is preferable that the film 110 be thin.

[0090] As in the modified example, the surface F110 of the film 110 in the region R2 where the ink 100 is not provided may be mirror-finished. Depending on the surface condition of the surface F91 of the sealing resin 91, the ink 100 to be used may be changed.

[0091] The semiconductor device 1 according to the modified example can achieve the same effects as those of the first embodiment.

[0092] (Second embodiment) 11 is a cross-sectional view showing an example of the configuration of the ink 100 and its surroundings according to the second embodiment. The second embodiment differs from the first embodiment in that the film 112 is exposed.

[0093] The film 113 is provided on the film 112. The film 113 has a different color than the film 112.

[0094] The film 112 is exposed from the film 113 in a region R1 where the ink 100 is provided. The film 112 is not exposed from the film 113 in a region R2 where the ink 100 is not provided.

[0095] Film 112 may be darkened by oxidation or other treatment, which increases the difference in brightness or color between film 112 and film 113. As a result, it is possible to improve the identifiability of printed content and the readability of barcodes.

[0096] As described above, the film 112 is made of, for example, copper, and the film 113 is made of, for example, stainless steel, which is resistant to oxidation.

[0097] In the second embodiment, the difference in color between the film 112 and the film 113 can improve the recognizability of characters and the readability of barcodes.

[0098] Other configurations of the semiconductor device 1 according to the second embodiment are similar to the corresponding configurations of the semiconductor device 1 according to the first embodiment, and therefore detailed description thereof will be omitted.

[0099] Next, a method for manufacturing the film 110 will be described.

[0100] After the ink 100 is applied (see FIG. 8B), the film 110 is formed as shown in FIG. 2. The film 110 is formed by sequentially forming films 111, 112, and 113. Forming the film 110 also includes forming a film 112 that covers the sealing resin 91 and the ink 100, and forming a film 113 that covers the film 112 and has a color different from that of the film 112.

[0101] 11, the film 113 is selectively removed from the region R1 where the ink 100 is to be applied. The film 113 may be removed, for example, by polishing the film 113 until the film 112 in the region R1 where the ink 100 is to be applied is exposed. The film 113 may also be removed by etching using a mask, or by thin film removal using a laser.

[0102] Next, a process is performed to oxidize the exposed film 112. The oxidation process is, for example, a heat treatment.

[0103] As in the second embodiment, the visibility of the printed content and the readability of the barcode may be improved by using different colors or contrasts between the multiple films 112 and 113.

[0104] The semiconductor device 1 according to the second embodiment can achieve the same effects as the first embodiment.

[0105] Depending on the surface condition of the face F110 in the region R2, the exposed surface of the film 112 shown in FIG. 11 may be mirror-finished to increase the contrast between the films 112 and 113.

[0106] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention described in the claims and their equivalents. [Explanation of symbols]

[0107] 1 semiconductor device, 30-33 semiconductor chip, 90 bonding wire, 91 sealing resin, 100 ink, 101 pigment, 110 film, 112 film, 113 film, F91 surface, F110 surface, R1 region, R2 region

Claims

1. A resin layer; ink provided on the upper surface of the resin layer; a film that covers the resin layer and the ink; Equipped with The semiconductor device, wherein the surface roughness of the film differs between a first region where the ink is provided and a second region where the ink is not provided. Semiconductor device.

2. The semiconductor device according to claim 1 , wherein the surface roughness of said film in said first region is smaller than the surface roughness of said film in said second region.

3. 2. The semiconductor device according to claim 1, wherein a difference in skewness of the film between the first region where the ink is provided and the second region where the ink is not provided is 0.2 or more.

4. 2. The semiconductor device according to claim 1, wherein a difference in reflectance of said film between a first region where said ink is provided and a second region where said ink is not provided is 30% or more.

5. 2. The semiconductor device according to claim 1, wherein the average particle diameter of the pigment contained in the ink is 100 nm or less.

6. 2. The semiconductor device according to claim 1, wherein the average particle diameter of the pigment contained in the ink is 300 nm or more.

7. 2. The semiconductor device according to claim 1, wherein the concentration of the pigment contained in the ink is 10% or less.

8. The semiconductor device according to claim 1 , wherein the ink does not contain a pigment.

9. The membrane comprises: A first membrane; a second film disposed on the first film and having a color different from that of the first film; and 2 . The semiconductor device according to claim 1 , wherein the first film is exposed from the second film in a first region where the ink is provided, and is not exposed from the second film in a second region where the ink is not provided.

10. The semiconductor device according to claim 1 , wherein the film has at least one of hardness, abrasion resistance, oil resistance, heat resistance, and flame retardancy higher than the ink.

11. The semiconductor device according to claim 1 , wherein said film is conductive.

12. providing ink on the top surface of the resin layer; forming a film that covers the resin layer and the ink; It is equipped with A method for manufacturing a semiconductor device, wherein the surface roughness of the film differs between a first region where the ink is provided and a second region where the ink is not provided.

13. forming the film forming a first film that covers the resin layer and the ink; forming a second film covering the first film and having a different color from the first film; It is equipped with After forming the first film and the second film, selectively removing the second film in the first region where the ink is to be applied; The method for manufacturing a semiconductor device according to claim 12, further comprising:

14. 14. The method for manufacturing a semiconductor device according to claim 13, further comprising the step of: selectively removing said second film, and then oxidizing said exposed first film.

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