Information processing device and 3D additive manufacturing device
The integration of an information processing device with an irradiation point output and melt condition output unit in 3D additive manufacturing devices allows users to monitor and adjust melting conditions, addressing the issue of defective products by ensuring proper powder melting, thus improving product quality.
Patent Information
- Application Number
- JP2023137116
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2023-08-25
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2043-08-25
Smart Images

Figure 0007821764000001 
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Abstract
Description
[Technical Field]
[0001] The present invention relates to an information processing device and a three-dimensional additive manufacturing device. [Background technology]
[0002] In recent years, 3D additive manufacturing technology, which creates objects by stacking thin layers of powdered metal material one by one, has been attracting attention, and many different 3D additive manufacturing technologies have been developed, depending on the powder material and manufacturing method.
[0003] In the modeling method used by conventional 3D additive manufacturing devices, for example, powder material is spread layer by layer on a base plate installed on the top surface of the stage. Next, only the two-dimensional structure corresponding to one cross section of the model is melted using a heating mechanism consisting of an electron beam or laser. The model is then formed by stacking layers of this powder material one by one in the height direction (Z direction).
[0004] Patent Document 1 describes a technology in which a detection unit is provided to detect reflected electrons generated when an electron beam is irradiated onto a powder material, and the state of the object is determined based on the information detected by this detection unit. [Prior art documents] [Patent documents]
[0005] [Patent Document 1] Patent Publication No. 2021-42410 Summary of the Invention [Problem to be solved by the invention]
[0006] In powder bed electron beam 3D additive manufacturing, it is important to properly set the melting conditions for melting the metal powder, such as the emission current value and scan speed. If the melting conditions are not appropriate, there may be insufficient or excessive melting, resulting in a defective product with poor strength and durability.
[0007] Checking the melt conditions is useful for users to identify the cause of defects in products, but conventional 3D additive manufacturing devices do not show how the melt conditions are changing, making it impossible for users to check the melt conditions.
[0008] The present invention has been made in view of the above circumstances, and has an object to enable a user to check melt conditions. [Means for solving the problem]
[0009] In order to achieve at least one of the above-mentioned objects, an information processing device embodying one aspect of the present invention comprises: This information processing device is used in a 3D additive manufacturing device that uses a modeling file. an irradiation point output unit that outputs the irradiation point of the modeling beam read from the modeling file to a display unit; a position specifying unit that specifies the position of the irradiation point specified by the input unit; and a melting condition of the irradiation point at the specified position that is searched for in the modeling file; According to the position of the irradiation point specified by the input unit, and a melt condition output unit that outputs the retrieved melt conditions to a display unit. The above-described information processing device is one aspect of the present invention, and a three-dimensional additive manufacturing device embodying one aspect of the present invention is configured in the same manner as the above-described information processing device. [Effects of the Invention]
[0010] According to the present invention, it becomes easier for the user to check the melt conditions. Problems, configurations, and effects other than those described above will become apparent from the following description of the embodiments. [Brief explanation of the drawings]
[0011] [Figure 1] 1 is a schematic cross-sectional view showing a three-dimensional additive manufacturing apparatus according to a first embodiment of the present invention. [Figure 2] 1 is a block diagram showing an example of the configuration of a control system of a three-dimensional additive manufacturing apparatus according to a first embodiment of the present invention. FIG. [Figure 3] 1 is a block diagram showing an example of the configuration of a control block of a PC according to a first embodiment of the present invention. [Figure 4] FIG. 2 is a diagram showing a display example of a printing region display screen according to the first embodiment of the present invention. [Figure 5] FIG. 2 is a diagram showing a display example of an area enlargement screen according to the first embodiment of the present invention. [Figure 6] FIG. 4 is a diagram showing a display example of a correction condition change screen according to the first embodiment of the present invention. [Figure 7] 5 is a flowchart showing an example of a model-forming file creation process in the model-forming control software according to the first embodiment of the present invention. [Figure 8] FIG. 10 is a block diagram showing an example of the configuration of a control block of a PC according to a second embodiment of the present invention. [Figure 9] FIG. 10 is a diagram showing a display example of a melt condition search screen (melt condition type change) according to the second embodiment of the present invention. [Figure 10] FIG. 10 is a diagram showing a display example of a melt condition search screen (search condition addition) according to the second embodiment of the present invention. [Figure 11] FIG. 10 is a diagram showing a display example of a melt condition search screen (search next) according to the second embodiment of the present invention. [Figure 12] FIG. 10 is a diagram showing a display example of a printing area display screen (search next) according to the second embodiment of the present invention. [Figure 13] FIG. 11 is a diagram showing a display example of a melt condition search screen (search range designation) according to the third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0012] Hereinafter, embodiments of a three-dimensional additive manufacturing device and a method for controlling a three-dimensional additive manufacturing device of the present invention will be described with reference to Figures 1 to 7. Note that common members in the figures are designated by the same reference numerals, and redundant explanations will be omitted.
[0013] 1. First embodiment 1-1.Configuration of 3D additive manufacturing equipment First, a three-dimensional additive manufacturing apparatus according to a first embodiment of the present invention (hereinafter referred to as "this example") will be described with reference to FIG.
[0014] Fig. 1 is a schematic cross-sectional view showing a three-dimensional additive manufacturing apparatus according to this embodiment. In the following description, in order to clarify the shapes and positional relationships of the various components of the three-dimensional additive manufacturing apparatus, the left-right direction in Fig. 1 is referred to as the X direction, the depth direction in Fig. 1 as the Y direction, and the up-down direction in Fig. 1 as the Z direction. The X direction, Y direction, and Z direction are perpendicular to one another. Furthermore, the X direction and Y direction are parallel to the horizontal direction, and the Z direction is parallel to the vertical direction.
[0015] The three-dimensional additive manufacturing device 1 shown in Figure 1 is a device that irradiates powder material 32, which is made of metal powder such as titanium, aluminum, iron, etc., with an electron beam 15 (an example of a manufacturing beam) to melt the powder material 32, and then stacks the solidified layers of this powder material 32 to form a three-dimensional object.
[0016] 1, the 3D additive manufacturing apparatus 1 includes a vacuum chamber 3, a beam irradiation device 2, a powder supply device 16, a modeling table 18, a modeling box 20, and a collection box 21. The 3D additive manufacturing apparatus 1 also includes a modeling plate 22, an inner base 24, a plate moving device 26, a radiation shield cover 28, a mask cover 30, a camera 42, and a shutter 44. The 3D additive manufacturing apparatus 1 also includes a plurality of detection units 46 that detect reflected electrons.
[0017] The vacuum chamber 3 is a chamber for creating a vacuum state by evacuating the air inside the chamber using a vacuum pump (not shown). A vacuum is maintained inside the vacuum chamber 3. The beam irradiation device 2 is also attached to the vacuum chamber 3.
[0018] The beam irradiation device 2 is a device that irradiates the electron beam 15 onto the building plate 22 or the building surface 32a of the powder layer formed from the powder material 32, and is equipped with an electron gun (an example of a beam irradiation unit) and an electron optical system. The building surface 32a corresponds to the upper surface of the powder layer. The state of the powder layer changes as the 3D additive manufacturing process progresses. Although not shown, the beam irradiation device 2 has, as its electron optical system, an electron gun that is the source of the electron beam 15, a focusing lens that focuses the electron beam 15 generated by the electron gun, and a deflection lens that deflects the electron beam 15 focused by the focusing lens.
[0019] The focusing lens is configured using a focusing coil and focuses the electron beam 15 by the magnetic field generated by the focusing coil. The deflection lens is configured using a deflection coil and deflects the electron beam 15 by the magnetic field generated by the deflection coil. Therefore, the electron optical system scans the electron beam 15 in accordance with melting conditions for melting the powder material, and the top layer of the powder material (an example of a powder bed) spread on the build plate 22 is melted by the electron beam 15.
[0020] The powder supplying device 16 (an example of a powder supply system) supplies powder material 32, which is an example of a powder material that is a raw material for the molded object 38, onto the molding table 18, and spreads the powder material 32 over the molding plate 22 to form a powder layer. The powder supplying device 16 has a hopper 16a, a powder dropper 16b, and a squeegee 16c.
[0021] The hopper 16a is a container for storing metal powder. The powder dropper 16b is a device that drops the powder material 32 stored in the hopper 16a onto the modeling table 18. The squeegee 16c is a long, elongated member that is long in the Y direction and has a blade 16d for spreading the powder. The squeegee 16c spreads the powder material 32 dropped by the powder dropper 16b over the modeling table 18 and the modeling plate 22. The squeegee 16c is movable in the X direction to spread the powder material 32 over the entire surface of the modeling table 18.
[0022] The modeling table 18 is arranged horizontally inside the vacuum chamber 3. The modeling table 18 is arranged below the powder supplying device 16. The center of the modeling table 18 is open. The shape of the opening of the modeling table 18 is circular in plan view or angular in plan view (for example, rectangular in plan view).
[0023] The modeling box 20 forms a space for modeling. The modeling box 20, which has a circular or angular cross section, is provided inside the vacuum chamber 3. The upper end of the modeling box 20 is connected to the edge of the opening of the modeling table 18. The lower end of the modeling box 20 is connected to the bottom wall of the vacuum chamber 3.
[0024] The recovery box 21 recovers the powder material 32 that has been supplied onto the modeling table 18 by the powder supplying device 16 in excess of what is needed.
[0025] The build plate 22 forms a molded object 38 using the powder material 32. The molded object 38 is formed by being stacked on the build plate 22. The build plate 22 is formed to have a circular or angular shape in plan view to match the shape of the opening of the build table 18. To prevent the build plate 22 from being electrically floating, it is connected (grounded) to the inner base 24 by a ground wire 34. The inner base 24 is maintained at GND (ground) potential.
[0026] When each layer of the object 38 is being molded, a powder bed is formed on the molding plate 22 and the inner base 24. The powder bed is formed by spreading the powder material 32 up to a position several millimeters higher than the molding table 18 installed on the molding box 20. This powder bed is formed by the powder supplying device 16 filled with the powder material 32 and the squeegee 16c.
[0027] The inner base 24 is arranged to be movable in the vertical direction (Z direction). The shaping plate 22 moves vertically together with the inner base 24. The inner base 24 has larger outer dimensions than the shaping plate 22. The inner base 24 slides vertically along the inner surface of the shaping box 20. A sealing member 36 is attached to the outer periphery of the inner base 24. The sealing member 36 is a member that maintains sliding properties and airtightness between the outer periphery of the inner base 24 and the inner surface of the shaping box 20. The sealing member 36 is made of a heat-resistant and elastic material. The powder material 32 is spread on the inner base 24, and the molding plate 22 on which the molded object 38 is molded is placed.
[0028] The plate moving device 26 moves the shaping plate 22 and the inner base 24 in the vertical direction. The plate moving device 26 is provided inside the lower part of the shaping box 20. The plate moving device 26 includes a shaft 26a and a drive mechanism unit 26b. The shaft 26a is connected to the underside of the inner base 24. The drive mechanism unit 26b includes a motor and a power transmission mechanism (not shown), and by driving the power transmission mechanism, which is driven by the motor, the shaping plate 22 and the inner base 24 are moved in the vertical direction together with the shaft 26a. The power transmission mechanism is configured, for example, by a rack and pinion mechanism, a ball screw mechanism, or the like.
[0029] The radiation shield cover 28 is disposed between the build plate 22 and the beam irradiation device 2 in the Z direction. The radiation shield cover 28 is made of a metal such as stainless steel. The radiation shield cover 28 shields against radiant heat generated when the electron beam 15 is irradiated onto the powder material 32 by the beam irradiation device 2.
[0030] The electron beam 15 is irradiated onto the powder material 32 to melt the powder material 32. At this time, if the radiant heat emitted from the molding surface 32a of the powder layer is widely diffused within the vacuum chamber 3, the thermal efficiency will be reduced. In contrast, when the radiation shield cover 28 is placed above the build plate 22, the heat radiated from the build surface 32a is shielded by the radiation shield cover 28, and the shielded heat is reflected by the radiation shield cover 28 and returned to the build plate 22. This allows for efficient use of the heat generated by irradiation with the electron beam 15.
[0031] The radiation shield cover 28 also functions to prevent evaporated substances generated when the powder material 32 is irradiated with the electron beam 15 from adhering (depositing) onto the inner wall of the vacuum chamber 3. The deposited substances here include metal vapor and metal sputtering by fireworks. That is, when the powder material 32 is irradiated with the electron beam 15, part of the molten metal turns into mist-like evaporated material and rises from the manufacturing surface 32a. The radiation shield cover 28 is arranged to cover the space above the manufacturing surface 32a to prevent the evaporated material from diffusing into the vacuum chamber 3.
[0032] The molded object 38 is constructed by two-dimensionally melting one layer of powder material 32 present in the region of the molded object 38 using the electron beam 15 from the beam irradiation device 2 and stacking the melted layers. The region of the powder material 32 spread on the molding plate 22 other than the molded object 38 is a pre-sintered body 35 formed by pre-sintering the powder material 32, and has conductivity due to the electron beam 15 irradiated from the beam irradiation device 2.
[0033] A mask cover 30 is attached below the radiation shield cover 28. The mask cover 30 has an opening 30a and a mask portion 30b. When forming a molded object 38, the mask cover 30 is placed over the upper surface of the powder material 32, i.e., the molded surface 32a. At this time, the openings 30a expose the powder material 32 spread on the building plate 22. The masking portions 30b are made of a conductive material that shields the unsintered regions of the powder material 32 located outside the openings 30a. The masking portions 30b are preferably made of the same metal material as the powder material.
[0034] The shape of the opening 30a is formed to match the shape of the shaping plate 22. For example, if the shaping plate 22 is circular in plan view, the shape of the opening 30a in plan view is formed to match the circular shape, and if the shaping plate 22 is angular in plan view, the shape of the opening 30a in plan view is formed to match the angular shape.
[0035] The mask cover 30 is disposed below the radiation shield cover 28. The opening 30a and mask portion 30b of the mask cover 30 are disposed between the build plate 22 and the radiation shield cover 28 in the Z direction. The mask cover 30 has an enclosure portion 30c. The enclosure portion 30c is disposed so as to surround the space above the opening 30a. A portion (upper portion) of the enclosure portion 30c overlaps with the radiation shield cover 28 in the Z direction.
[0036] The enclosure 30c has the function of shielding radiant heat generated from the printing surface 32a and the function of suppressing the diffusion of evaporated materials generated from the printing surface 32a. In other words, the enclosure 30c has the same function as the radiation shield cover 28. Although not shown, the mask cover 30 is equipped with a vertical drive mechanism that allows it to rise so as not to interfere with the squeegee 16c during squeegeeing.
[0037] The mask cover 30 is made of a metal with a higher melting point than the powder material 32 used as the raw material for the molded object 38. The mask cover 30 is also made of a material that is less reactive with the powder material 32. Titanium, for example, can be used as a material for the mask cover 30. The mask cover 30 may also be made of the same metal as the powder material 32 used. Although not shown, the mask cover 30 is electrically grounded to GND. The mask cover 30 has an electrical shielding function that minimizes powder scattering when the powder material 32 is pre-sintered by irradiating it with an electron beam 15 in a pre-heating step prior to the main sintering step, which will be described later.
[0038] A camera 42 that photographs the state of the build surface and a shutter 44 that prevents deposition onto the camera 42 as much as possible are attached to the upper surface of the radiation shield cover 28. The camera 42 is capable of photographing the build surface 32a of the powder layer. The camera 42 is positioned offset in the Y direction from the beam irradiation device 2 so as not to interfere with its position. The camera 42 is preferably configured as a visible light camera such as a digital video camera. The camera 42 captures an image of the powder layer's building surface 32a to generate an image (image data) of the powder layer. Therefore, the image generated by the camera 42 shows the state of the powder layer's building surface 32a. Note that the image is captured by the camera 42 while illuminating the powder layer's building surface 32a with illumination light emitted by an illumination light source (not shown) included in the 3D additive manufacturing device 1.
[0039] The shutter 44 protects the camera 42 and the observation window so that evaporated substances generated from the build surface 32a when the powder material 32 is melted by irradiation with the electron beam 15 do not adhere to the camera 42 or the observation window. The camera 42 photographs the build surface 32a with the shutter 44 open. The camera 42 basically continues to photograph, and the shutter 44 closes only during the melting process. Furthermore, in processes in which evaporated substances are likely to be generated or in which a large amount of evaporated substances are generated, i.e., in the process of melting the powder material 32 with the electron beam 15, the camera 42 photographs with the shutter 44 closed.
[0040] A plurality of detectors 46 for detecting reflected electrons are disposed below the beam irradiation device 2. Specifically, the detection unit 46 is disposed between the beam irradiation device 2 and the printing surface 32 a of the object 38 to be formed on the printing plate 22 .
[0041] In recent years, for the purpose of quality control of the model 38, a three-dimensional additive manufacturing apparatus 1 has been provided that is equipped with a function for monitoring the surface of the model 38. Fig. 2 is a block diagram showing an example of the configuration of the control system of the 3D additive manufacturing apparatus 1 of this example. The 3D additive manufacturing apparatus 1 includes the above-mentioned detection unit 46. Furthermore, Fig. 2 adds hardware and software components for modeling control that are outside the configuration of the 3D additive manufacturing apparatus 1 shown in Fig. 1.
[0042] As shown in Figure 2, the three-dimensional additive manufacturing device 1 includes a polarization amplifier control circuit 51 which is an electron beam control unit, an ADC (analog-to-digital conversion circuit) 52, a preamplifier 53, a PC (personal computer) 54 which is an example of a control unit, and a BSE monitor 55.
[0043] The polarization amplifier control circuit 51 is connected to the beam irradiation device 2 and the PC 54. The polarization amplifier control circuit 51 controls the beam irradiation device 2 based on the set beam scanning information. As a result, the beam irradiation device 2 irradiates the electron beam 15 at a predetermined position. The polarization amplifier control circuit 51 also transmits beam irradiation position information indicating the irradiation position of the electron beam 15 to the PC 54.
[0044] The preamplifier 53 is connected to the detection unit 46 and the ADC 52. The preamplifier 53 converts the reflected electron current detected by the detection unit 46 from a current signal to a voltage signal. The voltage signal converted by the preamplifier 53 is sent to the ADC 52. The ADC 52 converts the reflected electron signal, which has become a voltage signal, from an analog signal to a digital signal and sends it to the PC 54.
[0045] The PC 54 is an example of an information processing device, and includes a central processing unit (CPU) 54a, a read-only memory (ROM) 54b, a random access memory (RAM) 54c, and a storage device 54d.
[0046] The CPU 54a reads out the program code of the software that realizes each function according to this embodiment from the ROM 54b, loads it into the RAM 54c, and executes it. Variables, parameters, etc. that are generated during the calculation processing of the CPU 54a are temporarily written to the RAM 54c, and these variables, parameters, etc. are read out by the CPU 54a as appropriate.
[0047] The image processing unit, which is one function of the CPU 54a, captures images generated by the camera 42 and performs predetermined image processing on the captured images. The PC 54 then outputs the camera images that have been subjected to image processing by the image processing unit to the BSE monitor 55. In addition, a modeling control software program (hereinafter abbreviated as "modeling control software") that the CPU 54a reads from the ROM 54b and executes controls the polarization amplifier control circuit 51. In addition, the modeling control software controls the preamplifier 53 via the ADC 52.
[0048] The recording device 54d may be, for example, a non-volatile recording medium such as a hard disk drive (HDD), a solid state drive (SSD), an optical disk, a magneto-optical disk, or a flash memory. The recording device 54d stores an operating system (OS), various parameters, and programs for operating the PC 54.
[0049] The ROM 54b and the recording device 54d store programs, data, etc. required for the CPU 54a to operate, and are used as an example of a computer-readable non-transitory storage medium storing programs executed by the PC 54. The recording device 54d stores camera images generated by the image processing unit. Furthermore, the recording device 54d stores beam irradiation position information transmitted from the polarization amplifier control circuit 51.
[0050] The CPU 54a selects a predetermined arithmetic expression from a plurality of arithmetic expressions according to the modeling process. Then, the CPU 54a performs arithmetic processing on the backscattered electron signal using the selected arithmetic expression to calculate the arithmetic signal. Then, the image processing unit converts the arithmetic signal into an image to acquire a backscattered electron image (BSE image). The CPU 54a outputs the acquired backscattered electron image (BSE image) to the BSE monitor 55. In addition, the backscattered electron image (BSE image) is stored in the recording device 54d.
[0051] The BSE monitor 55 is configured with a display such as a liquid crystal display (LCD) or an organic ELD (Electro Luminescence Display), etc. The BSE monitor 55 displays the BSE image and camera image output from the PC 54 on a display screen such as those shown in Figures 4 and 5, which will be described later.
[0052] The input device 56 may be, for example, a keyboard, a mouse, etc. A user can use the input device 56 to input predetermined operations and give instructions to the PC 54.
[0053] 1-2. Example of operation of 3D additive manufacturing equipment Next, an example of the operation of the three-dimensional additive manufacturing device 1 will be described.
[0054] First, the user uses the modeling control software in the PC 54 to create modeling data for melting according to the shape of the desired object. At this time, the user inputs appropriate melting conditions, including correction functions. Once the user has completed creating the modeling data, the user starts modeling using the 3D additive manufacturing device 1 based on the modeling data.
[0055] Next, the beam irradiation device 2 operates based on a control command given from the PC 54 to heat the build plate 22. The beam irradiation device 2 irradiates the build plate 22 with the electron beam 15 through the opening 30a of the mask cover 30, and scans the build plate 22 with the electron beam 15. As a result, the build plate 22 is heated to a temperature at which the powder material 32 is pre-sintered.
[0056] Next, the powder material 32 is spread over the building plate 22. The plate moving device 26 operates based on a control command given by the PC 54, thereby lowering the building plate 22 by a predetermined amount.
[0057] Next, the user places the upper surface of the build plate 22 covered with the powder material 32 at approximately the same height as the upper surface of the powder material 32 spread on the build table 18. Next, the user lowers the mask cover 30 onto the upper surface of the build plate 22 and keeps the mask cover 30 in contact with the powder material 32 so as to cover the powder material 32 present on the outer periphery of the build plate 22.
[0058] Next, the beam irradiation device 2 irradiates the electron beam 15 onto an area slightly narrower than the entire area of the top surface of the build plate 22. In other words, the area slightly narrower than the entire area of the top surface of the build plate 22 is an area where the electron beam 15 does not hit the opening inside the mask cover 30, and the beam irradiation device 2 irradiates this area with the electron beam. In this way, the beam irradiation device 2 irradiates the electron beam 15 onto an area slightly narrower than the entire upper surface of the building plate 22, thereby preheating the building plate 22 to a temperature at which the powder material 32 is completely pre-sintered.
[0059] At the start of modeling, the plate moving device 26 lowers the inner base 24 by a predetermined amount so that the upper surface of the modeling plate 22 is slightly lower than the upper surface of the powder material 32 spread on the modeling table 18. At this time, the modeling plate 22 is lowered by a predetermined amount ΔZ together with the inner base 24. This slight lowering ΔZ corresponds to the subsequent layer thickness in the Z direction. Thereafter, the plate moving device 26 moves the mask cover 30 upward.
[0060] Next, the powder supplying device 16 causes the powder dropper 16b to drop the powder material 32 supplied from the hopper 16a onto the modeling table 18. Thereafter, the powder supplying device 16 moves the squeegee 16c from one end to the other in the X direction, thereby spreading the powder material 32 over the inner base 24 and forming a powder bed. As a result, the powder material 32 is spread over the modeling table 18 to a thickness equivalent to ΔZ. Excess powder material 32 is collected in the collection box 21. After the squeegee 16c passes outside the mask cover 30, the powder supplying device 16 lowers the mask cover 30 back down to the modeling surface, and the mask cover 30 covers the powder material 32 present on the outer periphery of the modeling plate 22.
[0061] Next, the beam irradiation device 2 operates based on control commands given by the polarization amplifier control circuit 51 and the PC 54 to preheat the powder layer on the building plate 22. That is, the beam irradiation device 2 powder heats (PH) the powder layer on the building plate 22, pre-sintering the powder material 32. Pre-sintering the powder material 32 allows the powder material 32 to become conductive. Therefore, the powder material 32 can suppress powder scattering during the main sintering process that is performed after the pre-heating process.
[0062] The beam irradiation device 2 irradiates the powder material 32 spread on the building plate 22 with the electron beam 15. The beam irradiation device 2 also scans the electron beam 15 over an area that is wider than the area for forming the object 38 (hereinafter also referred to as the "building area"), but is such that the electron beam does not hit the opening inside the mask cover 30. As a result, the powder material 32 present in the building area and the powder material 32 present around the building area are both pre-sintered.
[0063] The beam irradiation device 2 melts the two-dimensional shape area using the electron beam 15 according to the two-dimensional shape obtained by slicing a pre-designed object at ΔZ intervals. After melting and solidifying one layer of powder material 32, the beam irradiation device 2 again irradiates an area slightly narrower than the building plate 22 with the electron beam 15 to raise the temperature and prepare to spread the powder material 32. After raising the temperature to a predetermined temperature, the beam irradiation device 2 turns off the electron beam 15 and moves the mask cover 30 upward.
[0064] The plate moving device 26 lowers the inner base 24 by ΔZ, and again moves the squeegee 16c to the opposite side along the upper surface of the powder material 32 spread on the building table 18. Then, the plate moving device 26 spreads ΔZ amount of powder material 32 on top of the previous layer, and again lowers the mask cover 30 to the building surface.
[0065] The beam irradiation device 2 irradiates the electron beam 15 to an area of the mask cover 30 such that the electron beam 15 does not hit the opening inside the mask cover 30, and after the newly laid powder material 32 is pre-sintered, the beam irradiation device 2 melts the area of the two-dimensional shape corresponding to that layer. The beam irradiation device 2 repeats this process to form a shaped object 38.
[0066] The beam irradiation device 2 also acquires a backscattered electron composition image (BSE image), as described below. First, the beam irradiation device 2 operates based on control commands given by the polarization amplifier control circuit 51 and the PC 54 to scan the electron beam 15 over the pre-sintering region where the pre-sintered powder material 32 is present. At this time, the beam irradiation device 2 minimizes the electron beam current of the electron beam 15 and focuses the electron beam 15 onto the build surface 32a for irradiation. The detection unit 46 detects backscattered electrons generated by the electron beam 15. The detection unit 46 outputs the detected backscattered electron signal to the PC 54 via the preamplifier 53 and the ADC 52.
[0067] 1-3. Control block configuration example Fig. 3 is a diagram showing an example of the configuration of the control block of the PC 54. The CPU 54a of the PC 54 executes the modeling control software to realize the modeling file creation process (see Fig. 7, which will be described later) performed in cooperation with the respective function blocks shown in Fig. 3. It is also possible to configure the 3D additive manufacturing device 1 by incorporating the respective function blocks of the PC 54 shown in Fig. 3.
[0068] The PC 54 includes an input unit 60, a correction condition changing unit 61, a melting condition correcting unit 62, an irradiation point output unit 63, a position specifying unit 64, a melting condition output unit 65, a display unit 70, and a modeling file recording unit D1.
[0069] The input unit 60 is used by the user to perform input operations. The input unit 60 is a functional part of the input device 56 shown in FIG. 2. The user's input operations include, for example, melting conditions that the user inputs and sets through the input unit 60. The melting conditions are conditions that define how the 3D additive manufacturing apparatus 1 irradiates the electron beam 15 onto the powder material 32 to melt it. The user can set the irradiation current, irradiation time, irradiation on / off timing, etc. of the electron beam 15 for the irradiation area of the electron beam 15.
[0070] The correction condition change unit 61 changes the correction conditions for correcting the melt conditions by the melt condition correction unit 62. When the correction condition change unit 61 changes the correction conditions, the changed correction conditions are output to the melt condition correction unit 62. However, since default values of the melt conditions are set in the melt condition correction unit 62 for the first time, the correction condition change unit 61 does not perform processing.
[0071] The melt condition correction unit 62 automatically corrects the melt conditions for melting the powder material in accordance with the corrected conditions. The melt conditions set by the user are not suitable for molding the powder material 32 as they are. For example, the melt condition correction unit 62 changes the melt conditions (scanning speed, irradiation current, etc.) of the electron beam 15 depending on the shape of the object to be molded, etc. The melt conditions corrected by the melt condition correction unit 62 are recorded (added) to the molding file recording unit D1 as corrected melt conditions. The molding file recording unit D1 is recorded in the recording device 54d shown in FIG. 2.
[0072] After the corrected melt conditions are output to the display unit 70, the melt condition correcting unit 62 corrects the melt conditions again when the revised melt conditions are input from the input unit 60. At this time, if the correction conditions are changed by the correction condition changing unit 61, the melt condition correcting unit 62 corrects the melt conditions according to the changed correction conditions. The re-corrected melt conditions are recorded in the modeling file.
[0073] The irradiation point output unit 63 outputs the irradiation point of the modeling beam read from the modeling file including the corrected melt conditions corrected by the melt condition correction unit 62 to the display unit 70. For example, the irradiation point output unit 63 outputs information indicating the irradiation point in the layer input by the user through the input unit 60 (see FIGS. 4 and 5 described later) to the display unit 70.
[0074] The display unit 70 displays information indicating the irradiation point (see FIGS. 4 and 5 described later). The display unit 70 may be, for example, a liquid crystal display device, an organic EL display device, or the like. When a touch panel display is used in the PC 54, the input unit 60 and the display unit 70 are integrally formed.
[0075] The user may perform an operation to check the melt conditions of an irradiation point by specifying the irradiation point displayed on the display unit 70. In this operation, the user operates the input unit 60 to specify the irradiation point for which the user wants to check the melt conditions from the information representing the irradiation point displayed on the display unit 70.
[0076] The position specifying unit 64 specifies the position of the irradiation point specified by the input unit 60. For example, the position specifying unit 64 specifies the position of the irradiation point at the position input by the user through the input unit 60, and outputs the position of the irradiation point to the melt condition output unit 65.
[0077] The melt condition output unit 65 searches for the corrected melt conditions of the irradiation point at the position of the irradiation point identified by the position identifying unit 64 from the modeling file recorded in the modeling file recording unit D1, and outputs the searched corrected melt conditions to the display unit 70. Thereafter, the melt condition output unit 65 outputs the acquired corrected melt conditions to the display unit 70.
[0078] The display unit 70 displays the corrected melt conditions output by the melt condition output unit 65 (see FIG. 5, which will be described later). The display unit 70 is a functional part of the BSE monitor 55 shown in FIG.
[0079] 3, the PC 54 is configured to include the modeling file recording unit D1, but the modeling file recording unit D1 may be configured in a recording medium external to the PC 54. In this case, the melt condition correcting unit 62 records a modeling file including the corrected melt conditions in the external recording medium, and the irradiation point output unit 63 and the melt condition output unit 65 read out the modeling file from the external recording medium.
[0080] Next, the function of disclosing information about the irradiation point of the electron beam 15, which has been added to the modeling control software, will be described with reference to the display screens shown in Fig. 4 and subsequent figures. All of these display screens are displayed on the display unit 70.
[0081] 1-4. Display examples of each screen FIG. 4 is a diagram showing a display example of the printing region display screen W1. The detection unit 46 (see FIG. 2) acquires, as a reflected electron signal, reflected electrons generated by irradiating the electron beam 15 from the beam irradiation device 2 onto the object 38 or the pre-sintered body 35. The PC 54 performs arithmetic processing, imaging processing, etc. on the reflected electron signal to monitor the state on the building plate 22 and the state of the object 38, and displays an image of the building plate 22.
[0082] The printing area display screen W1 displays a printing area 80 and multiple irradiation points 81. The printing area 80 is an area scanned by the electron beam 15. One irradiation point 81 represents a set of irradiation points of the electron beam 15 that are irradiated to form the object 38. When the user wants to check the irradiation points 81 in detail, the user specifies an enlargement area 82. When the enlargement area 82 is specified, the area enlargement screen W2 shown in FIG. 5 is displayed.
[0083] FIG. 5 is a diagram showing a display example of the area enlargement screen W2. A plurality of irradiation points 83 and 84 are displayed on the area enlargement screen W2. Each of the irradiation points 83 and 84 represents a position irradiated by the electron beam 15 once. The irradiation points 83 and 84 are displayed connected by a straight line so that the scanning direction of the electron beam 15 can be seen. The irradiation point 83 (white circle) indicates the position of the electron beam 15 irradiated to part of the outer periphery and the interior of the irradiation point 81. The irradiation point 84 (gray circle) indicates the position of the electron beam 15 irradiated to the outer periphery of the irradiation point 81.
[0084] The melt condition output unit 65 forms and displays a melt condition display section 86 for displaying the corrected melt conditions on the display unit 70, in accordance with the positions of the irradiation points 83, 84 specified by the input unit 60. For example, when the user moves the cursor 85 and the cursor 85 stops at an arbitrary irradiation point 83, the melt condition display section 86 is automatically displayed on the display unit 70.
[0085] The melt condition display section 86 displays the melt conditions of the irradiation point 83 where the cursor 85 stops. The melt conditions include, for example, Emission, which represents the beam current value of the electron beam 15, Speed, which represents the scanning speed of the electron beam 15, Scan pitch, which represents the interval between irradiation points in the scanning direction of the electron beam 15, and Hatching distance, which represents the distance between scan lines of the electron beam 15. The correction results of the above-mentioned correction appear in Emission and Speed.
[0086] The melt conditions may include information other than the above. Alternatively, when the user clicks the irradiation point 81 on the printing area display screen W1 shown in Fig. 4 with the cursor, the melt condition display section 86 for the irradiation point 81 may be displayed. However, since the irradiation point 81 is a collection of irradiation points of the electron beam 15, the melt conditions displayed in the melt condition display section 86 may be the average value, mode, or the like of the melt conditions for the multiple irradiation points 81.
[0087] FIG. 6 is a diagram showing a display example of the correction condition change screen W3. The correction condition change screen W3 has a correction type selection button 91 for the user to select a correction type, and a parameter value display section 92 that shows the change in parameter value before and after the correction condition change.
[0088] If the display result of the area enlargement screen W2 shown in FIG. 5 is not what the user intended, the user needs to change the correction conditions. The user selects any correction type (e.g., one of corrections 1 to 4) from the correction type selection button 91. The melt condition correction unit 62 shown in FIG. 3 re-corrects the melt conditions based on the selected correction type. Thereafter, the parameter value display unit 92 displays the parameter value before the correction type was changed (e.g., A) and the parameter value after the correction type was changed (e.g., B). This allows the user to confirm whether the change in parameter value is appropriate. The user can also display the area enlargement screen W2 shown in FIG. 5 again, select any irradiation point 83 with the cursor 85, and check the values of the melt conditions after the correction type was changed.
[0089] 1-5. Example of creating a modeling file FIG. 7 is a flowchart showing an example of a model-forming file creation process in the model-forming control software. First, the user inputs melting conditions and correction conditions (correction parameters) (S1) by operating the input unit 60. In addition to the melting conditions, the user also inputs various other parameters required to create a modeling file.
[0090] Next, the melt condition correcting unit 62 automatically corrects the melt conditions input from the input unit 60, and creates a model-forming file (S2). The created model-forming file is recorded in the model-forming file recording unit D1. Next, the irradiation point output unit 63 reads out the model-forming file from the model-forming file recording unit D1, and outputs the calculated irradiation points on the layer designated by the user to the display unit 70 (S3).
[0091] Next, the display unit 70 displays the irradiation point output by the irradiation point output unit 63 (S4). In this flowchart, the irradiation point is displayed on the display unit 70, but the display unit 70 may also display the scanning line of the electron beam 15. Next, the user operates the input unit 60 to place the cursor 85 on the irradiation point displayed on the display unit 70, and designate the irradiation point for which the user wishes to check the melting conditions (S5). Here, the irradiation point is selected on the printing area display screen W1 shown in FIG. 4 or on the area enlargement screen W2 shown in FIG. 5.
[0092] Next, the position specifying unit 64 specifies the position of the irradiation point specified by the user (S6). The position specifying unit 64 notifies the melt condition output unit 65 of the specified position. Next, the melt condition output unit 65 reads out the melt conditions of the irradiation point at the position identified by the position identifying unit 64 from the object-forming file recording unit D1, and outputs the melt conditions to the display unit 70 (S6).
[0093] The display unit 70 displays the melt conditions output by the melt condition output unit 65 (S8). The melt conditions displayed on the display unit 70 may include other parameters in addition to the Emission, Speed, Scan pitch, and Hatching distance shown in FIG.
[0094] The user checks whether the melting conditions displayed on the display unit 70 are the conditions intended by the user (S9). If the melting conditions displayed on the display unit 70 are not the conditions intended by the user (NO in S9), the correction condition change unit 61 changes the correction conditions (correction parameters) according to the user's instructions (S10). Thereafter, the modeling control software repeats the processes from step S1 onwards.
[0095] For example, after the user corrects any of the Emission, Speed, Scan pitch, or Hatching distance displayed on the display unit 70, the melt condition correction unit 62 again corrects the melt conditions to create a modeling file, which is then recorded in the modeling file recording unit D1. The modeling file recording unit D1 may retain a modeling file correction history, allowing previously created modeling files to be readable. Thereafter, the user performs the process of specifying the irradiation point in step S5 and checks the melt conditions displayed on the display unit 70. Note that the user may change only the melt conditions input by the user in step S1, without changing the correction conditions using the correction condition changing unit 61 in step S10.
[0096] If the melting conditions displayed on the display unit 70 are the conditions intended by the user (YES in S9), this process ends.
[0097] In the PC 54 having the modeling control software according to the first embodiment described above, the melting conditions are displayed on the area enlargement screen W2 shown in Fig. 5. This allows the user to check the melting conditions.
[0098] Furthermore, even if the melt conditions entered in advance are automatically corrected, the user can check the corrected melt conditions for each irradiation point displayed on the display unit 70. Using the scanning line (irradiation point) display function of the modeling control software, the user can check the melt conditions for each scanning line (irradiation point) before the powder material 32 is melted. Therefore, if the corrected melt conditions are corrected to melt conditions that the user does not intend, the user can create a modeling file with the melt conditions desired by correcting the melt conditions and repeating the process of checking the automatically corrected melt conditions again.
[0099] The corrected melt conditions for the irradiation point at the user-specified position are displayed, allowing the user to confirm the final melt conditions that have been automatically corrected and set for each scanning line or irradiation point. The melt conditions, which were previously a black box, are now clearly defined, allowing users to easily obtain the information necessary for developing and researching modeling procedures. This is expected to dramatically improve work efficiency in developing and researching modeling procedures.
[0100] 2. Second embodiment 2-1. Control block configuration example Next, a configuration example and an operation example of a PC having the modeling control software according to the second embodiment of the present invention will be described with reference to Fig. 8 to Fig. 12. The PC having the modeling control software according to the second embodiment has an additional function of searching for irradiation point information, and enables a user to perform a variety of searches by changing search conditions for searching for melt conditions in various ways.
[0101] 8 is a block diagram showing an example of the configuration of the control block of the PC 54A. The control block of the PC 54A is realized by the object-forming control software according to the second embodiment. The PC 54A has a configuration in which a search condition change unit 66 is added to the control block of the PC 54 shown in Fig. 3. A description of the control block of the PC 54 according to the first embodiment will be omitted.
[0102] The search condition change unit 66 changes the search conditions for searching for the corrected melt conditions. The search condition change unit 66 outputs the search conditions for searching for the melt conditions, which the user changed from the input unit 60, to the melt condition output unit 65. In step S1 in the flowchart of the modeling file creation process shown in FIG. 7, the user performs a process of inputting melt conditions using the input unit 60, and at this time, the user also performs a process in the search condition change unit 66.
[0103] The melt condition output unit 65 searches for the corrected melt conditions from the modeling files recorded in the modeling file recording unit D1 based on the changed search conditions. In addition, the melt condition output unit 65 can increase or decrease the search conditions according to an instruction from the input unit 60. The display unit 70 displays the corrected melt conditions output by the melt condition output unit 65 (see FIGS. 9 to 12, which will be described later).
[0104] 2-2. Examples of each screen FIG. 9 is a diagram showing a display example of the melt condition search screen W4 (melt condition type change). The melt condition search screen W4 includes a search condition setting section 100, an add search condition button 101, a search next button 102, and a close button 103. The melt condition search screen W4 is displayed superimposed on the printing area display screen W1 shown in FIG. 4 or the area enlargement screen W2 shown in FIG. 5.
[0105] The search condition setting section 100 displays the melt condition type, search parameter value, and search layer number (No.). The melt condition type is displayed as "Emission," which represents the beam current, by default. The search parameter value is entered as the parameter value when searching for "Emission," with the beam current value of 10 [mA]. The search layer number is entered as the layer number when searching for the beam current value.
[0106] The add search condition button 101 is a button used by the user to add search conditions. The search next button 102 is a button that instructs the display of the next irradiation point 83 that matches the search conditions when an irradiation point 83 that matches the search conditions is displayed. The close button 103 is a button that the user uses to instruct the display of the melt condition search screen W4.
[0107] As shown in the lower part of FIG. 9, when the user selects the melt condition type pull-down with the cursor 104, Speed, Scan pitch, and Hatching distance are displayed in addition to Emission. If the user selects, for example, Speed in addition to Emission, the search parameter value and search layer number (No.) corresponding to Speed are displayed. The search condition change unit 66 outputs the Speed selected by the user to the melt condition output unit 65 as a changed search condition. The melt condition output unit 65 outputs the search parameter value and search layer number (No.) corresponding to Speed to the display unit 70, extracted from the modeling file.
[0108] FIG. 10 is a diagram showing a display example of the melt condition search screen W4 (add search condition). When the user operates the cursor 104 to press the search condition addition button 101 on the melt condition search screen W4 shown in Fig. 9, the melt condition search screen W4 with the added melt condition is displayed. The melt condition search screen W4 is displayed when the user sets multiple search conditions simultaneously.
[0109] For example, in addition to the melt condition type (Emission), search parameter value, and search layer number (No.) displayed on the melt condition search screen W4, the melt condition type (Speed) and search parameter value are displayed. It is also possible to set a different melt condition type for the added melt condition type. The search condition change unit 66 outputs the added melt condition type to the melt condition output unit 65 as a changed search condition. The melt condition output unit 65 outputs information on the search parameter value and search layer number (No.) corresponding to the added melt condition type extracted from the modeling file to the display unit 70.
[0110] FIG. 11 is a diagram showing a display example of the melt condition search screen W4 (search next). This melt condition search screen W4 shows that the user has operated the cursor 104 to select the search next button 102. The position identification unit 64 outputs the corrected melt conditions searched by the melt condition output unit 65 and the irradiation points that meet the search conditions to the display unit 70 in the order that they meet the search conditions.
[0111] For example, when the user presses the search next button 102, the position specifying unit 64 specifies the position of the irradiation point 81 (represented as a search target point 87 in FIG. 12 described later) that meets the search criteria that can be displayed next on the display unit 70, and outputs the position to the melt condition output unit 65. The melt condition output unit 65 extracts the irradiation point 81 at the specified position from the modeling file as the search target point 87, and outputs information about the search target point 87 to the display unit 70.
[0112] FIG. 12 is a diagram showing a display example of the printing area display screen W1 (next search). First, the irradiation point 81 of the electron beam 15 that satisfies the melting conditions is displayed as the search target point 87. In FIG. 12, the search target point 87 is highlighted with a thick black frame, but it may be displayed in a different color from the other parts. When the user presses the Search Next button 102 as shown in FIG. 11, the irradiation point 81 that satisfies the melting conditions is next displayed as the search target point 87 on the printing area display screen W1.
[0113] Therefore, the user does not need to search for the melt conditions by selecting each irradiation point 81. Note that multiple irradiation points 81 that meet the melt conditions may be simultaneously highlighted with a black frame or displayed in a different color from other points. Also, on the area enlargement screen W2, when the "Search Next" button 102 is pressed, irradiation points 83 and 84 that meet the melt conditions are highlighted or displayed in a different color from other points, just like on the printing area display screen W1.
[0114] The PC 54A having the modeling control software according to the second embodiment described above has an additional function for searching for irradiation point information, allowing the user to check the melt conditions or corrected melt conditions that match the search criteria for each irradiation point displayed on the display unit 70. The user can change, for example, the melt condition type, search parameter value, or search layer number, and check only the corresponding corrected melt conditions, thereby improving work efficiency. Furthermore, since search criteria can be added or deleted as desired, the user can also search for corrected melt conditions by combining multiple search criteria.
[0115] 12, the user can successively change the search target point 87 that meets the search criteria from among the multiple irradiation points 81 displayed on the printing area display screen W1. This allows the user to easily grasp where in the printing area the search target point 87 is located.
[0116] In addition, since the modeling control software according to the second embodiment includes the functions of the modeling control software according to the first embodiment, PC54A can use the modeling control software according to the first and second embodiments in combination.
[0117] 3. Third embodiment 3-1. Examples of each screen Next, a configuration example and an operation example of a PC having the modeling control software according to the third embodiment of the present invention will be described with reference to Fig. 13. The PC having the modeling control software according to the third embodiment has an additional function of searching for irradiation point information by limiting it to a predetermined range, and enables a user to perform a variety of searches by changing the search conditions for searching for melt conditions in various ways.
[0118] The function that characterizes the modeling control software according to the third embodiment is one function of the search condition changing unit 66. Therefore, the configuration of the PC 54A having the modeling control software according to the third embodiment is the same as the PC 54A shown in Fig. 8, but the functions of the melt condition output unit 65 and the search condition changing unit 66 are different.
[0119] The search condition change unit 66 changes the range of search parameter values for the search conditions according to the type of melt condition. The melt condition output unit 65 searches the modeling file for corrected melt conditions that fall within the range of the changed search parameter values.
[0120] FIG. 13 is a diagram showing a display example of the melt condition search screen W4A (search range designation) according to the third embodiment. The melt condition search screen W4A shown in the upper part of Fig. 13 has the same configuration as the melt condition search screen W4 shown in Fig. 9, but an input field for specifying a range is provided in the search parameter value field. The user can specify a range of search parameter values for the melt condition specified in the melt condition type. Fig. 13 shows a case where Emission is specified as the melt condition type and 1 to 5 mA, for example, is specified as the search parameter value range. Information on irradiation points that correspond to melt conditions whose search parameter values fall within the specified range is displayed on the display unit 70.
[0121] The melt condition search screen W4A shown at the bottom of Fig. 13 has a melt condition type added by pressing the add search condition button 101. An example of an added melt condition type is Speed. An input field for specifying a range is also provided in the search parameter value field for the added melt condition type. This diagram shows a case where the added melt condition type is Speed and, for example, 1 to 3 [m / s] is specified as the range of the search parameter value.
[0122] As with the melt condition search screen W4 shown in Figures 11 and 12, when the user presses the search next button 102, the position identification unit 64 identifies the position of the irradiation point 81 (represented as search target point 87 in Figure 12 described later) that matches the search conditions and whose search parameter value matches the search conditions and can be displayed next on the display unit 70, and outputs that position to the melt condition output unit 65.
[0123] The melt condition output unit 65 extracts the irradiation point 81 at the specified position from the modeling file as a search target point 87, and outputs information about the search target point 87 to the display unit 70. The melt condition output unit 65 extracts the irradiation point 81 at the specified position from the modeling file as a search target point 87, and outputs information about the search target point 87 to the display unit 70.
[0124] In the PC 54A having the modeling control software according to the third embodiment described above, search results for search parameter values within a range specified by the user are displayed on the display unit 70. Therefore, it is possible to display only the search target points 87 that correspond to the search parameter values within the range that the user wants to know, thereby improving the efficiency of searching for corrected melt conditions.
[0125] In addition, since the modeling control software according to the third embodiment includes the functions of the modeling control software according to the first embodiment, PC54A can use the modeling control software according to the first and third embodiments in combination.
[0126] 4. Variations In the above-described embodiments, examples have been described in which the present invention is applied to modeling control software dedicated to modeling used in a powder bed type 3D additive manufacturing device. However, the modeling beam does not need to be limited to an electron beam type, and the present invention may be applied to modeling control software for modeling devices that use other types, such as a laser type.
[0127] It should be noted that the present invention is not limited to the above-described embodiments, and it goes without saying that various other applications and modifications are possible without departing from the gist of the present invention as set forth in the claims. For example, the above-described embodiments have described in detail and specifically the configurations of the 3D additive manufacturing apparatus 1 and the modeling control software of the PC 54 in order to clearly explain the present invention, and are not necessarily limited to those including all of the described configurations. Furthermore, it is possible to replace part of the configuration of the embodiments described here with the configuration of other embodiments, and it is also possible to add the configuration of one embodiment to the configuration of another embodiment. Furthermore, it is also possible to add, delete, or replace part of the configuration of each embodiment with other configurations. In addition, the control lines and information lines shown are those that are considered necessary for the explanation, and do not necessarily show all the control lines and information lines in the product. In reality, it can be assumed that almost all components are interconnected. [Explanation of symbols]
[0128] 1...3D additive manufacturing device, 2...beam irradiation device, 15...electron beam, 32...powder material, 35...preliminary sintered body, 38...model, 42...camera, 60...input section, 61...correction condition change section, 62...melt condition correction section, 63...irradiation point output section, 64...position identification section, 65...melt condition output section, 66...search condition change section, 70...display section, 86...melt condition display section, 91...correction type selection button, W1...printing area display screen, W2...area enlargement screen, W3...correction condition change screen, W4...melt condition search screen
Claims
1. An information processing device used in a three-dimensional additive manufacturing device that uses a modeling file, an irradiation point output unit that outputs an irradiation point of the object-forming beam read from the object-forming file to a display unit; a position specifying unit that specifies the position of the irradiation point designated by an input unit; a melt condition output unit that searches the modeling file for melt conditions of the irradiation point at the specified position, and outputs the searched melt conditions to the display unit in accordance with the position of the irradiation point specified by the input unit. Information processing device.
2. The melting conditions displayed on the display unit include at least one of a beam current value of the shaping beam, a scanning speed of the shaping beam, an irradiation point interval in a scanning direction of the shaping beam, and a distance between scan lines of the shaping beam. The information processing device according to claim 1 .
3. a melt condition correction unit that corrects the melt conditions according to correction conditions and adds the corrected melt conditions to the modeling file; The information processing device according to claim 2 .
4. The melt condition correction unit corrects the melt conditions again when the corrected melt conditions are input from the input unit after the corrected melt conditions are output to the display unit. The information processing device according to claim 3 .
5. a search condition change unit that changes search conditions for searching the corrected melt conditions; The melt condition output unit searches for the corrected melt conditions from the modeling file in accordance with the changed search conditions.
5. The information processing device according to claim 3 or 4.
6. The melt condition output unit increases or decreases the search conditions in response to an instruction from the input unit. The information processing device according to claim 5 .
7. The position specifying unit outputs the corrected melt conditions searched by the melt condition output unit and the irradiation points corresponding to the search conditions to the display unit in the order of matching to the search conditions. The information processing device according to claim 5 .
8. the search condition change unit changes a range of search parameter values for the search conditions according to the type of the melt condition, The melt condition output unit searches the modeling file for the corrected melt conditions included in the changed range of the search parameter values. The information processing device according to claim 5 .
9. a correction condition changing unit that changes the correction condition, The melt condition correction unit corrects the melt conditions in accordance with the corrected correction conditions. The information processing device according to claim 3 .
10. a build plate on which a powder bed is formed on which the powder material is spread; a powder supply system that spreads the powder material onto the powder bed; a beam irradiation unit that irradiates the powder material spread on the powder bed with a modeling beam; an electron optical system that scans the manufacturing beam in accordance with melting conditions for melting the powder material, and melts the powder material spread on the powder bed; an irradiation point output unit that outputs the irradiation point of the modeling beam read from the modeling file to a display unit; a position specifying unit that specifies the position of the irradiation point designated by an input unit; a melt condition output unit that searches the modeling file for the melt condition of the irradiation point at the specified position, and outputs the searched melt condition to the display unit in accordance with the position of the irradiation point specified by the input unit. 3D additive manufacturing device.
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