Substrate inspection device, substrate inspection method, and substrate inspection program

Abstract

To provide a technique for acquiring an image from which a defect of a substrate can be detected with higher precision.SOLUTION: A substrate inspection apparatus, which inspects a substrate using an image obtained by imaging a surface of the substrate, includes: a holding portion 31 that holds the substrate; a first light source portion 51 that emits visible light to the substrate held by the holding portion 31; a second light source portion 52 that emits infrared light to the substrate held by the holding portion 31; a first imaging sensor that captures a visible light image of the surface of the substrate by receiving first reflected light emitted from the substrate as a result of radiating the visible light; and a second imaging sensor that captures an infrared light image of the surface of the substrate by receiving second reflected light emitted from the substrate as a result of radiating the infrared light.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate inspection device, a substrate inspection method, and a substrate inspection program. [Background technology]

[0002] Patent Document 1 describes a method of removing the roughness components of the substrate surface and obtaining an image of defective portions by irradiating the substrate with near-infrared light and capturing an image. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-002648 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for acquiring images that allow for more accurate detection of defects on a substrate. [Means for solving the problem]

[0005] A substrate inspection device according to one aspect of the present disclosure is a substrate inspection device that inspects a substrate using an image of the surface of the substrate, and includes: a holding unit that holds the substrate; a first light source unit that emits visible light toward the substrate held in the holding unit; a second light source unit that emits infrared light toward the substrate held in the holding unit; a first imaging sensor that receives first reflected light emitted from the substrate by irradiating it with the visible light, and captures a visible light image of the surface of the substrate; and a second imaging sensor that receives second reflected light emitted from the substrate by irradiating it with the infrared light, and captures an infrared light image of the surface of the substrate. [Effects of the Invention]

[0006] According to the present disclosure, a technique for acquiring an image that allows for detection of defects on a substrate with higher accuracy is provided. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing an example of a schematic configuration of a substrate processing system. [Figure 2] FIG. 2 is a schematic diagram showing an example of a coating and developing apparatus. [Figure 3] FIG. 3 is a schematic diagram showing an example of an imaging unit. [Figure 4] FIG. 4 is a schematic diagram illustrating an example of the arrangement of the imaging section and the light projecting / reflecting section in the imaging unit. [Figure 5] FIG. 5 is a diagram illustrating an example of optical characteristics of an optical filter. [Figure 6] FIG. 6 is a block diagram illustrating an example of the functional configuration of the control device. [Figure 7] FIG. 7(a) is a diagram illustrating an example of an image acquired by the control device, and FIG. 7(b) is a diagram illustrating an example of a method for creating a pseudo RGB image. [Figure 8] FIG. 8 is a block diagram illustrating an example of a hardware configuration of the control device. [Figure 9] FIG. 9 is a flow chart illustrating an example of a substrate inspection method. DETAILED DESCRIPTION OF THE INVENTION

[0008] Various exemplary embodiments are described below.

[0009] In one exemplary embodiment, a substrate inspection apparatus is provided that inspects a substrate using an image of a surface of the substrate, the substrate inspection apparatus including: a holder that holds the substrate; a first light source that emits visible light toward the substrate held in the holder; a second light source that emits infrared light toward the substrate held in the holder; a first image sensor that captures a visible light image of the surface of the substrate by irradiating the substrate with the visible light and receiving a first reflected light emitted from the substrate; and a second image sensor that captures an infrared light image of the surface of the substrate by irradiating the substrate with the infrared light and receiving a second reflected light emitted from the substrate.

[0010] In the above-described substrate inspection device, a first image sensor acquires a visible light image of the substrate surface, and a second image sensor acquires an infrared image of the substrate surface, allowing the substrate to be inspected using these two types of images. The visible light image and the infrared light image contain different information for detecting defects in the substrate, and using these images for inspection allows for more detailed information about the substrate to be obtained. Therefore, the above-described substrate inspection device makes it possible to acquire images that allow for more accurate detection of substrate defects.

[0011] The imaging device may further include a direction changer that changes the first reflected light and the second reflected light to the same direction, wherein the first imaging sensor receives the first reflected light whose direction has been changed by the direction changer, and the second imaging sensor receives the second reflected light whose direction has been changed by the direction changer.

[0012] With the above configuration, the arrangement of the first and second image sensors can be changed more flexibly than in a case where no direction changing section is provided.

[0013] The first image sensor and the second image sensor may be housed in the same camera.

[0014] By using a camera that houses the first and second image sensors as described above, it is possible to acquire visible light images and infrared light images with a single camera, thereby preventing the substrate inspection device from becoming too large.

[0015] The light source device may further include an incident direction adjustment unit that adjusts the visible light from the first light source unit and the infrared light from the second light source unit so that they are incident in the same direction relative to the substrate.

[0016] With the above configuration, the arrangement of the first light source unit and the second light source unit can be changed more flexibly than in a case where no incident direction adjustment unit is provided.

[0017] The visible light incident on the substrate, the infrared light incident on the substrate, the first reflected light exiting from the substrate, and the second reflected light exiting from the substrate may be on the same optical axis.

[0018] By arranging the above four lights on the same optical axis, the space in which these optical axes exist can be reduced, which reduces restrictions on the device configuration, such as configuring the device so that the path of the light is not blocked, and allows for flexible changes to the arrangement of components other than the optical system.

[0019] The holding unit, the first light source unit, the second light source unit, the first imaging sensor, and the second imaging sensor may be housed in an imaging unit, and the imaging unit may further include a control unit that controls the imaging unit to capture the visible light image with the first imaging sensor and the infrared light image with the second imaging sensor, and that performs inspection of the substrate using the visible light image and the infrared light image.

[0020] With the above configuration, the control unit can comprehensively control the capturing of visible light images and infrared light images, and the inspection of the substrate using these images.

[0021] The holding portion may be movable horizontally within the imaging unit, and under the control of the control unit, the first imaging sensor may capture the visible light image and the second imaging sensor may capture the infrared light image in parallel while the holding portion is moving.

[0022] With the above configuration, the time required to capture the visible light image and the infrared light image can be shortened, and the time required to inspect the substrate can be shortened.

[0023] The control unit may detect defects on the surface of the substrate by comparing the visible light image with the infrared light image.

[0024] The information about defects in the substrate contained in the visible light image and the information about defects in the substrate contained in the infrared light image are not the same, and may contain different information. Therefore, by detecting defects by comparing the two images, it becomes possible to detect defects that cannot be detected using only one image.

[0025] The visible light image may be an image synthesized from multiple types of color component images each having a different color component, and the control unit may be configured to cause the display unit to display an image synthesized from the infrared light image and at least one of the multiple types of color component images.

[0026] With the above configuration, a composite image different from a normal visible light image or infrared light image is displayed on the display unit, allowing the user to view a type of image different from a visible light image or infrared light image.

[0027] In another exemplary embodiment, a substrate inspection method is provided for inspecting a substrate using an image of a surface of the substrate, the method including: holding the substrate with a holder; emitting visible light from a first light source to the substrate held by the holder; emitting infrared light from a second light source to the substrate held by the holder; capturing a visible light image of the surface of the substrate by receiving first reflected light emitted from the substrate by irradiating the visible light with a first image sensor; and capturing an infrared light image of the surface of the substrate by receiving second reflected light emitted from the substrate by irradiating the infrared light with a second image sensor.

[0028] In the above-described substrate inspection method, a first image sensor acquires a visible light image of the substrate surface, and a second image sensor acquires an infrared image of the substrate surface, allowing the substrate to be inspected using these two types of images. The visible light image and the infrared light image contain different information for detecting defects in the substrate, and using these images for inspection allows for obtaining more detailed information about the substrate. Therefore, the above-described substrate inspection method allows for the acquisition of images that enable detection of substrate defects with higher accuracy.

[0029] The method may further include changing the first reflected light and the second reflected light to the same direction by a direction change unit, and in capturing the visible light image, the first imaging sensor receives the first reflected light whose direction has been changed by the direction change unit, and in capturing the infrared light image, the second imaging sensor receives the second reflected light whose direction has been changed by the direction change unit.

[0030] With the above configuration, the arrangement of the first and second imaging sensors can be changed more flexibly than when the direction is not changed by the direction changing section.

[0031] The first image sensor and the second image sensor may be housed in the same camera.

[0032] By using a camera that houses the first and second image sensors as described above, it is possible to acquire visible light images and infrared light images with a single camera, thereby preventing the device for inspecting substrates from becoming too large.

[0033] The embodiment may further include adjusting, by an incident direction adjustment unit, the visible light from the first light source unit and the infrared light from the second light source unit so that they are incident in the same direction relative to the substrate.

[0034] With the above configuration, the arrangement of the first light source unit and the second light source unit can be changed more flexibly than when adjustment by the incident direction adjustment unit is not performed.

[0035] The visible light incident on the substrate, the infrared light incident on the substrate, the first reflected light exiting from the substrate, and the second reflected light exiting from the substrate may be on the same optical axis.

[0036] By arranging the above four lights on the same optical axis, the space in which these optical axes exist can be reduced, which reduces restrictions on the device configuration, such as configuring the device so that the path of the light is not blocked, and allows for flexible changes to the arrangement of components other than the optical system.

[0037] The holding unit, the first light source unit, the second light source unit, the first imaging sensor, and the second imaging sensor may be housed in an imaging unit, and a control unit may control the imaging unit to capture the visible light image with the first imaging sensor and the infrared light image with the second imaging sensor, and the control unit may inspect the substrate using the visible light image and the infrared light image.

[0038] With the above configuration, the control unit can comprehensively control the capturing of visible light images and infrared light images, and the inspection of the substrate using these images.

[0039] The holding portion may be movable horizontally within the imaging unit, and under the control of the control unit, the first imaging sensor may capture the visible light image and the second imaging sensor may capture the infrared light image in parallel while the holding portion is moving.

[0040] With the above configuration, the time required to capture the visible light image and the infrared light image can be shortened, and the time required to inspect the substrate can be shortened.

[0041] In the inspection, the control unit may detect defects on the surface of the substrate by comparing the visible light image with the infrared light image.

[0042] The information about defects in the substrate contained in the visible light image and the information about defects in the substrate contained in the infrared light image are not the same, and may contain different information. Therefore, by detecting defects by comparing the two images, it becomes possible to detect defects that cannot be detected using only one image.

[0043] The visible light image may be an image synthesized from multiple types of color component images each having a different color component, and the method may further include causing the control unit to display on a display unit an image synthesized from the infrared light image and at least one of the multiple types of color component images.

[0044] With the above configuration, a composite image different from a normal visible light image or infrared light image is displayed on the display unit, allowing the user to view a type of image different from a visible light image or infrared light image.

[0045] In another exemplary embodiment, a substrate inspection program is provided that causes a computer to inspect a substrate in a substrate inspection device using an image of the surface of the substrate, the program causing the computer to hold the substrate with a holder, emitting visible light from a first light source unit to the substrate held by the holder, emitting infrared light from a second light source unit to the substrate held by the holder, receiving first reflected light emitted from the substrate by irradiating the visible light with a first image sensor to capture a visible light image of the surface of the substrate, and receiving second reflected light emitted from the substrate by irradiating the infrared light with a second image sensor to capture an infrared light image of the surface of the substrate.

[0046] According to the above-described substrate inspection program, the same effects as those of the substrate inspection method can be achieved.

[0047] Various exemplary embodiments will be described in detail below with reference to the drawings, in which the same or equivalent parts are designated by the same reference numerals.

[0048] [Substrate processing system]

[0049] The substrate processing system 1 is a system that forms a photosensitive coating on a workpiece W, exposes the photosensitive coating, and develops the photosensitive coating. The workpiece W to be processed is, for example, a substrate, or a substrate on which a film, circuit, or the like has been formed by undergoing a predetermined process. One example of the substrate is a silicon wafer. The workpiece W (substrate) may be circular. The workpiece W may also be a glass substrate, a mask substrate, or an FPD (Flat Panel Display), etc. The photosensitive coating is, for example, a resist film.

[0050] As shown in FIGS. 1 and 2, the substrate processing system 1 includes a coating / developing apparatus 2 and an exposure apparatus 3. The exposure apparatus 3 performs an exposure process on a resist film (photosensitive coating) applied to a workpiece W (substrate). Specifically, the exposure apparatus 3 irradiates an exposure target portion of the resist film with energy rays using a method such as immersion exposure. The coating / developing apparatus 2 performs a process of coating a resist film on the surface of the workpiece W (substrate) before the exposure process by the exposure apparatus 3, and then performs a development process on the resist film after the exposure process. A resist film having a predetermined pattern is formed by performing a series of processes.

[0051] [Circuit board inspection equipment] The configuration of a coating and developing apparatus 2 will be described below as an example of a substrate processing apparatus. As shown in FIGS. 1 and 2, the coating and developing apparatus 2 includes a carrier block 4, a processing block 5, an interface block 6, and a control device 100 (control unit). A display unit 200 is connected to the control device 100. The coating and developing apparatus 2 described in this embodiment as a substrate inspection apparatus has a function of inspecting the state of a target film formed on a substrate.

[0052] The carrier block 4 introduces the workpiece W into the coating and developing apparatus 2 and removes the workpiece W from the coating and developing apparatus 2. For example, the carrier block 4 can support a plurality of carriers C (storage sections) for the workpiece W and has a built-in transport device A1 including a transfer arm. The carrier C stores a plurality of circular workpieces W, for example. The transport device A1 removes the workpiece W from the carrier C and passes it to the processing block 5, and receives the workpiece W from the processing block 5 and returns it to the carrier C. The processing block 5 has a plurality of processing modules 11, 12, 13, and 14.

[0053] The processing module 11 incorporates multiple coating units U1, multiple heat treatment units U2, multiple imaging units U3, and a transport device A3 that transports the workpiece W to these units. The processing module 11 forms an underlayer film on the surface of the workpiece W using the coating units U1 and heat treatment units U2. The coating unit U1 of the processing module 11 applies a treatment liquid for forming the underlayer film to the workpiece W, for example, while rotating the workpiece W at a predetermined rotation speed. The heat treatment unit U2 of the processing module 11 performs various heat treatments associated with the formation of the underlayer film. The heat treatment unit U2 incorporates, for example, a hot plate and a cooling plate, and heats the workpiece W to a predetermined heating temperature using the hot plate and then cools the heated workpiece W using the cooling plate to perform the heat treatment. The imaging unit U3 performs processing to inspect the surface condition of the workpiece W and acquires information indicating the surface condition of the workpiece W, such as information related to a surface image.

[0054] The processing module 12 incorporates multiple coating units U1, multiple heat treatment units U2, multiple imaging units U3, and a transport device A3 that transports the workpiece W to these units. The processing module 12 forms an intermediate film on the base film using the coating units U1 and heat treatment units U2. The coating unit U1 of the processing module 12 applies a treatment liquid for forming the intermediate film onto the base film to form a coating film on the surface of the workpiece W. The heat treatment unit U2 of the processing module 12 performs various heat treatments associated with the formation of the intermediate film. The heat treatment unit U2 incorporates, for example, a hot plate and a cooling plate, and heats the workpiece W to a predetermined heating temperature using the hot plate and then cools the heated workpiece W using the cooling plate to perform the heat treatment. The imaging unit U3 performs processing to inspect the surface condition of the workpiece W and acquires information indicating the surface condition of the workpiece W, such as information related to a surface image.

[0055] The processing module 13 incorporates multiple coating units U1, multiple heat-treating units U2, multiple imaging units U3, and a transport device A3 that transports the workpiece W to these units. The processing module 13 forms a resist film on the intermediate film using the coating units U1 and heat-treating units U2. The coating unit U1 of the processing module 13 applies a resist film-forming treatment liquid to the intermediate film while rotating the workpiece W at a predetermined rotation speed, for example. The heat-treating unit U2 of the processing module 13 performs various heat treatments associated with the formation of the resist film. The heat-treating unit U2 of the processing module 13 forms a resist film by performing a heat treatment (PAB: Post Applied Bake) at a predetermined heating temperature on the workpiece W on which the coating film has been formed. The imaging unit U3 performs processing to inspect the surface condition of the workpiece W and acquires information indicating the surface condition of the workpiece W, such as information related to a surface image.

[0056] The processing module 14 incorporates multiple coating units U1, multiple thermal processing units U2, and a transport device A3 that transports the workpiece W to these units. The processing module 14 uses the coating units U1 and thermal processing units U2 to perform a development process on the exposed resist film R. The coating unit U1 of the processing module 14, for example, rotates the workpiece W at a predetermined rotation speed while applying a developer to the exposed surface of the workpiece W, and then rinses the developer away with a rinse liquid, thereby performing a development process on the resist film R. The thermal processing unit U2 of the processing module 14 performs various thermal processes associated with the development process. Specific examples of thermal processes include a post-exposure bake (PEB) before the development process and a post-exposure bake (PB) after the development process.

[0057] A shelf unit U10 is provided on the carrier block 4 side within the processing block 5. The shelf unit U10 is divided into multiple cells arranged in the vertical direction. A transport device A7 including a lifting arm is provided near the shelf unit U10. The transport device A7 raises and lowers the workpiece W between the cells of the shelf unit U10.

[0058] A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is divided into a plurality of cells arranged in the vertical direction.

[0059] The interface block 6 transfers the workpiece W to and from the exposure apparatus 3. For example, the interface block 6 has a built-in transport device A8 including a transfer arm, and is connected to the exposure apparatus 3. The transport device A8 transfers the workpiece W placed on the shelf unit U11 to the exposure apparatus 3, receives the workpiece W from the exposure apparatus 3, and returns it to the shelf unit U11.

[0060] [Imaging unit] The following describes the imaging unit U3 included in the processing modules 11 to 13. The imaging unit U3 has the function of capturing an image of the surface of a film (e.g., an underlayer film, an intermediate film, a resist film, etc.) formed by the coating unit U1 and the thermal processing unit U2, and obtaining image data.

[0061] 3, the imaging unit U3 includes a housing 30, a holder 31, a linear drive unit 32, an imaging unit 40, and a light projecting / reflecting unit 50. The holder 31 holds the workpiece W horizontally. The linear drive unit 32 is powered by, for example, an electric motor, and moves the holder 31 along a horizontal, linear path (a path extending in the X-axis direction).

[0062] The configurations of the imaging unit 40 and the light projecting / reflecting unit 50 will be described with reference to Fig. 4. Fig. 4 is a diagram schematically illustrating a part of the configuration of the imaging unit 40 and the light projecting / reflecting unit 50 in Fig. 3.

[0063] The imaging section 40 has a camera 41. The camera 41 is provided at one end of the imaging unit U3 in the movement direction (X-axis direction) of the holding section 31, and is directed toward the other end in the movement direction. The camera 41 used is a camera 41 that is sensitive to the visible light region with wavelengths of 380 nm to 780 nm and the infrared light region with wavelengths of 780 nm or more. A camera 41 that is sensitive to the infrared light region, particularly the near-infrared light region with wavelengths of 780 nm to 1000 nm, can be suitably used.

[0064] Specifically, a camera 41 capable of separating the visible light region into three wavelength regions and separating the visible light region from the near-infrared light region may be used as such a camera 41. A specific configuration of the camera 41 may be a four-line color line scan camera in which four types of sensors (e.g., CMOS sensors) for RGB and near-infrared light (NIR) are arranged in a line. The R sensor, G sensor, and B sensor correspond to sensors (first image sensor) sensitive to visible light, and the NIR sensor corresponds to a sensor (second image sensor) sensitive to infrared light (near-infrared light).

[0065] The four types of sensors may be arranged so as to extend horizontally and in a direction perpendicular to the direction of movement of the holder 31 (Y-axis direction).

[0066] The light projecting / reflecting unit 50 projects light onto the imaging range and guides the light reflected from the imaging range towards the camera 41. For example, the light projecting / reflecting unit 50 includes a first light source unit 51, a second light source unit 52, an optical filter 53, and a half mirror 54.

[0067] The first light source unit 51 is a light source that emits visible light and has a function of emitting visible light toward the optical filter 53 located below. The wavelength range of the visible light emitted from the first light source unit 51 is not particularly limited, and as an example, white light or similar light that evenly includes the wavelength range of visible light may be used. The second light source unit 52 has a function of emitting near-infrared light of a single wavelength as a type of infrared light. The second light source unit 52 is provided at the same height as the optical filter 53 in the vertical direction and has a function of emitting near-infrared light toward the optical filter 53 in the movement direction (X-axis direction) of the holder 31. The wavelength range of the near-infrared light emitted from the second light source unit 52 is not particularly limited, and as an example, light of a single wavelength of 850 nm may be used.

[0068] The first light source unit 51 and the second light source unit 52 are disposed in the housing 30 as elongated line light sources that extend horizontally and in a direction (Y-axis direction) perpendicular to the movement direction of the holder 31. The longitudinal lengths of the first light source unit 51 and the second light source unit 52 are greater than the diameter of the workpiece W.

[0069] The optical filter 53 is positioned higher than the half mirror 54 and has the function of guiding light from the first light source unit 51 and the second light source unit 52 toward the half mirror 54. The optical filter 53 corresponds to an incident direction adjustment unit that adjusts the direction of light incident on the workpiece W. The optical filter 53 is arranged inside the housing 30 at an angle of approximately 45° with respect to the horizontal. The optical filter 53 is located above the middle part of the holder 31 so as to be perpendicular to the movement direction (X-axis direction) of the holder 31 when viewed from above. The optical filter 53 has a rectangular shape. The length (longitudinal length) of the optical filter 53 is greater than the diameter of the workpiece W.

[0070] FIG. 5 is a diagram showing a schematic diagram of the optical characteristics of the optical filter 53. The optical filter 53 does not reflect light with wavelengths of 750 nm or less in the so-called visible light region, but reflects almost 100% of light with wavelengths of 750 nm or more in the so-called near-infrared light region. Therefore, as shown in FIG. 4, by setting the inclination of the optical filter 53 so that the light emitted from the second light source unit 52 is reflected downward, the light from the second light source unit 52 can be guided to the workpiece W. In this case, the positions of the first light source unit 51, the second light source unit 52, and the optical filter 53 are set so that the reflection position of the near-infrared light from the second light source unit 52 overlaps with the optical axis of the light from the first light source unit 51. As a result, as shown in FIG. 4, both the visible light L1 and the near-infrared light L2 reach the half mirror 54 along the same optical axis (intentionally shown slightly offset in FIG. 4).

[0071] The half mirror 54 is located below the optical filter 53 and higher than the holder 31, and has the function of transmitting light from the optical filter 53 and reflecting light from below toward the camera 41. The half mirror 54 corresponds to a direction changing unit that changes the direction of reflected light from the workpiece W.

[0072] The half mirror 54 is disposed in the housing 30 at an angle of approximately 45° relative to the horizontal. When viewed from above, the half mirror 54 is positioned so as to be perpendicular to the movement direction (X-axis direction) of the holder 31 and overlap with the optical filter 53. The half mirror 54 has a rectangular shape. The length (longitudinal length) of the half mirror 54 is greater than the diameter of the workpiece W.

[0073] The imaging unit U3 operates as follows to acquire image data of the surface of the workpiece W. First, the linear drive unit 32 moves the holder 31. As a result, the workpiece W passes under the half mirror 54. During this passage, the imaging unit 40 and the light projecting / reflecting unit 50 as described above are configured such that visible light L1 emitted downward from the first light source unit 51 passes entirely through the optical filter 53 and the half mirror 54 and is irradiated downward (toward the linear drive unit 32). Furthermore, near-infrared light L2 emitted horizontally from the second light source unit 52 is reflected by the optical filter 53, changes its course downward, passes entirely through the half mirror 54, and is irradiated downward (toward the linear drive unit 32). As described above, when the light sources and the optical filter 53 are set so that the optical axes of the light from the first light source unit 51 and the second light source unit 52 are aligned, the light L1 and L2 irradiate the same irradiation area.

[0074] The visible light L1 and near-infrared light L2 that pass through the half mirror 54 are reflected by an object (workpiece W) located below the half mirror 54. That is, the reflected light L3 may include reflected light L1' (first reflected light) of the visible light L1 and reflected light L2' (second reflected light) of the near-infrared light L1. The reflected light L3 is reflected again by the half mirror 54, passes through the lens of the camera 41, and is incident on the imaging element of the camera 41. That is, the camera 41 can capture images of objects present in the irradiation areas of the first light source unit 51 and the second light source unit 52 via the half mirror 54. For example, when the holder 31 that holds the workpiece W moves, the camera 41 can capture images of the surface of the workpiece W that passes through the irradiation areas of the first light source unit 51 and the second light source unit 52. When the condition of the film formed on the surface of the workpiece W (e.g., film thickness, line width, defects, etc.) changes, the image data of the surface of the workpiece W captured by the camera 41 changes, for example, the color of the surface of the workpiece W changes depending on the change in shape.

[0075] The image data acquired by the camera 41 is sent to the control device 100. The control device 100 can estimate the shape characteristic values ​​of the film on the surface of the workpiece W based on the image data, and the estimation results are stored as inspection results in the control device 100. The image data is also stored in the control device 100.

[0076] In the control device 100, one RGB image (color image) is usually formed based on pixel information acquired by each of the R, G, and B sensors, and one NIR image (monochrome image) is formed based on pixel information acquired by the NIR sensor. The R sensor, G sensor, B sensor, and NIR sensor are sensors that are sensitive to different wavelength ranges. However, the configuration of the image output to the display unit 200 may be changed by control of the control device 100. This point will be described later.

[0077] The display unit 200 connected to the control device 100 is, for example, a monitor. The monitor may be any device capable of displaying information on a screen, and a specific example thereof is a liquid crystal panel. The display unit 200 may have a function to display the control details of the control device 100. The display unit 200 may also have a function to process and display an image captured by the imaging unit U3 based on instructions from a user, etc. This point will be described later.

[0078] [Control device] An example of the control device 100 will be described in detail. The control device 100 controls each element included in the coating and developing apparatus 2. The control device 100 is configured to execute process treatments including forming each of the above-mentioned films on the surface of the workpiece W and performing a development process. The control device 100 is also configured to execute a process of inspecting the surface of the workpiece W and displaying the results. Here, an example of the configuration of the control device 100 as a substrate inspection device that inspects substrates in the coating and developing apparatus 2 will be described.

[0079] As shown in FIG. 6, the control device 100 has, as its functional configuration, an imaging instruction acquisition unit 101, an imaging control unit 102, an RGB image acquisition unit 103, an NIR image acquisition unit 104, an image storage unit 105, an inspection instruction acquisition unit 106, an image inspection unit 107, a display instruction acquisition unit 108, a channel setting change unit 109, and an image output unit 110.

[0080] The imaging instruction acquisition unit 101 has a function of acquiring instructions relating to imaging of the workpiece W by the imaging unit U3. The instructions may be given, for example, by a user of the coating and developing apparatus 2. Furthermore, execution of a program relating to substrate processing of the workpiece W that has been created in advance may essentially be the imaging instruction for the imaging unit U3.

[0081] The imaging control unit 102 has a function of controlling the imaging unit U3 to capture an image of the surface of the workpiece W after processing, based on the instruction acquired by the imaging instruction acquisition unit 101.

[0082] The RGB image acquisition unit 103 has a function of acquiring an RGB image of the surface of the workpiece W from the camera 41 of the imaging unit U3. Specifically, it acquires pixel information acquired by three types of sensors of the camera 41: an R sensor, a G sensor, and a B sensor.

[0083] The NIR image acquisition unit 104 has a function of acquiring an NIR image of the surface of the workpiece W from the camera 41 of the imaging unit U3. Specifically, pixel information acquired by the NIR sensor of the camera 41 is acquired.

[0084] The image storage unit 105 has a function of storing images acquired by the RGB image acquisition unit 103 and the NIR image acquisition unit 104. The image information stored in the image storage unit 105 is used in the inspection of the workpiece W. It can also be used for display on the display unit 200 based on instructions from the user, etc.

[0085] The inspection instruction acquisition unit 106 has a function of acquiring instructions related to the inspection of the workpiece W based on the image of the workpiece W captured by the imaging unit U3. The instructions may be given, for example, by a user of the coating and developing apparatus 2. Furthermore, the instruction related to the inspection may essentially be to execute a program related to substrate processing of the workpiece W that has been created in advance.

[0086] The image inspection unit 107 has a function of controlling the inspection of the workpiece W using an image of the workpiece W based on instructions acquired by the inspection instruction acquisition unit 106. Inspection of the workpiece W using an image is an inspection of the workpiece W for the presence or absence of defects. As described above, if there is a defect in the film formed on the workpiece W, changes may occur in the captured image. Furthermore, the information contained in the image may differ between a visible light image (RGB image) and a near-infrared light image (NIR image). Therefore, the image inspection unit 107 uses the above-mentioned visible light image and near-infrared light image to inspect the workpiece W in detail for the presence or absence of defects.

[0087] An example of an image-based inspection of defects in the workpiece W is an inspection by comparing a visible light image with a near-infrared image. Visible light images generally allow for detailed understanding of changes in the surface of the workpiece W. On the other hand, compared to visible light, near-infrared light can be reflected by the inner surface of the workpiece W, and therefore, a near-infrared image shows information about the inner layers of the workpiece W rather than the surface. Therefore, by observing a near-infrared image, it is possible to discover defects in areas other than the surface of the workpiece W that could not be detected in the past. Similarly, by comparing a visible light image with a near-infrared image, it is possible to identify, for example, that color unevenness, etc., that is only visible in the visible light image is caused by a surface defect.

[0088] The display instruction acquiring unit 108 has a function of acquiring an instruction related to the display of an image on the display unit 200. The instruction may be given, for example, by a user of the coating and developing apparatus 2. Alternatively, the display instruction acquiring unit 108 may be configured to acquire an instruction to change the display content as part of an inspection instruction.

[0089] The channel setting change unit 109 has a function of setting a channel to be connected to the display unit 200 in order to output an image on the display unit 200 based on an instruction related to the display instruction acquisition unit .

[0090] The change of the channel setting in the channel setting change unit 109 will be described with reference to Fig. 7. Fig. 7(a) explains how the visible light image (RGB image) acquired by the RGB image acquisition unit 103 and the near-infrared light image (NIR image) acquired by the NIR image acquisition unit 104 are configured.

[0091] As described above, an RGB image is a color image created by combining pixel information from three types of sensors (R sensor, G sensor, and B sensor). When an image is displayed on the display unit 200, pixel information from each sensor is assigned to one channel (ch) and the image is output by combining these. In other words, when an RGB image is output on the display unit 200, images from the three channels are superimposed and output. In other words, an RGB image can be separated into three color images: an R image from the R sensor, a G image from the G sensor, and a B image from the B sensor.

[0092] On the other hand, an NIR image is a flattened version of pixel information from one type of sensor (NIR sensor), and therefore cannot be decomposed like the RGB image described above. Therefore, when displaying an NIR image on the display unit 200, it is sufficient to assign pixel information from the NIR sensor to one channel.

[0093] In this way, camera 41 acquires pixel information from four types of sensors. On the other hand, when displaying an image on display unit 200, it is possible to combine images from channels 1 to 3. Therefore, by changing the types of images assigned to the three channels, it is possible to generate and display a composite image that differs from a normal RGB image as a pseudo RGB image.

[0094] FIG. 7(b) shows an example of a combination of image types to be assigned to each channel when generating an image to be displayed on the display unit 200 using three channels (1ch to 3ch). FIG. 7(b) shows all example combinations when allocating any of images captured by four types of sensors (R image, G image, B image, NIR image) to all three channels (1ch to 3ch). By changing the type of image to be assigned to the channels in this way, different images (output images 1 to 4) can be displayed on the display unit 200. The channel setting change unit 109 has a function of determining which sensor's image to assign to the three channels of the display unit 200. Note that it is not necessary to use all three channels when generating an image to be displayed on the display unit 200. For example, an output image may be generated using only two of the three channels.

[0095] The image output unit 110 has a function of selecting image information to be displayed on the display unit 200 from the information stored in the image storage unit 105 based on the settings made by the channel setting change unit 109, and outputting the image to each channel of the display unit 200. As a result, the display unit 200 can combine the images assigned to the three channels and display one pseudo RGB image.

[0096] By creating such a pseudo RGB image and displaying it on the display unit 200, it may be possible for a user to obtain information that would not be recognized in a normal RGB image or an NIR image. For example, when inspecting defects related to the film of a specific workpiece W, it may be difficult to detect the defect in an image related to a specific wavelength range due to, for example, the color of the workpiece W. In such a case, by excluding the image related to the wavelength range in which defects are difficult to detect and combining the remaining three images to display as a pseudo RGB image on the display unit 200, it may be easier for the user to visually check whether or not there is a defect in the workpiece W.

[0097] The pseudo RGB image may be used when inspecting the workpiece W. In other words, in addition to comparing the visible light image with the near-infrared light image, for example, the pseudo RGB image may be compared with the visible light image or the pseudo RGB image with the near-infrared light image to inspect for defects in the workpiece W.

[0098] The control device 100 is composed of one or more control computers. For example, the control device 100 has a circuit 120 shown in FIG. 8. The circuit 120 has one or more processors 121, a memory 122, a storage 123, and an input / output port 124. The storage 123 has a computer-readable storage medium, such as a hard disk. The storage medium stores a program for causing the control device 100 to execute the substrate inspection procedure described below. The storage medium may be a removable medium, such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The memory 122 temporarily stores the program loaded from the storage medium of the storage 123 and the results of calculations by the processor 121. The processor 121 executes the program in cooperation with the memory 122 to configure each of the above-mentioned functional modules. The input / output port 124 inputs and outputs electrical signals to and from the components to be controlled in accordance with instructions from the processor 121.

[0099] The hardware configuration of the control device 100 is not necessarily limited to configuring each functional module by a program. For example, each functional module of the control device 100 may be configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) that integrates such dedicated logic circuits.

[0100] In the following embodiment, a case will be described in which the above configuration is included in the control device 100, but all of the above functions do not necessarily have to be included in the control device 100. For example, a functional unit serving as a database, such as the image storage unit 105, may be provided in an external device.

[0101] Furthermore, the control device 100 and the display unit 200 may be configured to be connected to the carrier block 4, the processing block 5, and the interface block 6 in the coating and developing apparatus 2 via a wired or wireless network. In other words, the control device 100 may be provided at a position separated from the block that actually processes the workpiece W in the coating and developing apparatus 2.

[0102] [Processing Procedure] The process procedure executed in the coating and developing apparatus 2 will be described.

[0103] In the process treatment procedure, the control device 100 first controls the transport device A1 to transport the work W to be processed in the carrier C to the shelf unit U10, and then controls the transport device A7 to place the work W in the cell for the treatment module 11.

[0104] Next, the control device 100 controls the transport device A3 to transport the workpiece W on the shelf unit U10 to the coating unit U1 and heat treatment unit U2 in the processing module 11. The control device 100 also controls the coating unit U1 and heat treatment unit U2 to form an underlayer film on the surface of the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W on which the underlayer film has been formed to the shelf unit U10, and controls the transport device A7 to place the workpiece W in a cell for the processing module 12.

[0105] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 in the processing module 12. The control device 100 also controls the coating unit U1 and heat treatment unit U2 to form an intermediate film on the underlying film of the workpiece W. For example, the control device 100 controls the coating unit U1 to form an intermediate film by applying a treatment liquid for forming an intermediate film on the underlying film of the workpiece W. Next, the control device 100 controls the heat treatment unit U2 to perform heat treatment on the intermediate film. After the intermediate film is formed, the control device 100 controls the transport device A3 to transport the workpiece W to the imaging unit U3, and controls the imaging unit U3 to capture an image of the surface of the workpiece W and acquire image information (base image). Thereafter, the control device 100 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport device A7 to place the workpiece W in a cell for the processing module 13.

[0106] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf unit U10 to each unit in the processing module 13, and controls the coating unit U1 and the heat-treating unit U2 to form a resist film on the intermediate film of the workpiece W. For example, the control device 100 controls the coating unit U1 to form a resist film by applying a processing liquid for forming a resist film on the intermediate film of the workpiece W. Next, the control device 100 controls the heat-treating unit U2 to perform a heat treatment on the resist film. After the resist film is formed, the control device 100 controls the transport device A3 to transport the workpiece W to the imaging unit U3, and controls the imaging unit U3 to capture an image of the surface of the workpiece W and acquire image information (post-processing image). Thereafter, the control device 100 controls the transport device A3 to transport the workpiece W to the shelf unit U11.

[0107] Next, the control device 100 controls the transport device A8 to send the workpiece W on the shelf unit U11 to the exposure device 3. Thereafter, the control device 100 controls the transport device A8 to receive the workpiece W that has been subjected to the exposure process from the exposure device 3 and place it in a cell for the processing module 14 in the shelf unit U11.

[0108] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf unit U11 to each unit in the processing module 14, and controls the coating unit U1 and the heat treatment unit U2 to perform development processing on the resist film R on the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport devices A7 and A1 to return the workpiece W into the carrier C. This completes the process.

[0109] [Board inspection method] A substrate inspection method under the control of the control device 100 of the coating and developing apparatus 2 will be described with reference to FIG.

[0110] First, the control device 100 executes step S01. In step S01, the imaging instruction acquisition unit 101 acquires an imaging instruction, and the inspection instruction acquisition unit 106 acquires an inspection instruction. Here, it is assumed that the control device 100 acquires a series of instructions related to substrate processing including the inspection of the workpiece W. In this case, the control device 100 may acquire an imaging instruction and an inspection instruction.

[0111] Next, the control device 100 executes step S02. In step S02, the imaging control unit 102 controls the imaging unit U3 to capture an image using the camera 41. A visible light image (RGB image) and a near-infrared image (NIR image), which are the imaging results, are acquired by the RGB image acquisition unit 103 and the NIR image acquisition unit 104, respectively, and stored in the image storage unit 105.

[0112] Next, the control device 100 executes step S03. In step S03, the image inspection unit 107 inspects the surface of the workpiece W for defects using the visible light image and near-infrared light image stored in the image storage unit 105. At this time, the above-mentioned pseudo RGB image may also be used for the inspection.

[0113] Next, the control device 100 executes step S04. In step S04, the image inspection unit 107 outputs the inspection results. An example of the output destination is the display unit 200, but the inspection results may be output to an external device other than the display unit 200.

[0114] Next, the control device 100 executes step S05. In step S05, the channel setting change unit 109 assigns images to channels on the display unit 200 based on an instruction to display an image on the display unit 200 acquired by the display instruction acquisition unit .

[0115] Next, the control device 100 executes step S06. In step S06, the image output unit 110 outputs an image to the display unit 200 based on the settings made by the channel setting change unit 109 as well.

[0116] 9, a series of processes are described in order as S01 to S09, but steps S01 to S04 and steps S05 and S06 may be performed independently. Furthermore, steps S01 and S02 may be performed independently of steps S03 and S04. Furthermore, the inspection instruction described in step S01 may be obtained at a different time from step S01, and the obtaining of this inspection instruction may be used as a trigger for executing step S03. In this way, the procedure of the process shown in FIG. 9 may be modified as appropriate.

[0117] [Effect] In the coating / developing apparatus 2 and substrate inspection method corresponding to the above-described substrate inspection apparatus, a visible light image of the substrate surface is acquired by a visible light sensor (RGB sensor) as a first imaging sensor, and an infrared image of the substrate surface is acquired by a second imaging sensor (NIR sensor). Therefore, the substrate can be inspected using these two types of images. The visible light image and the infrared light image contain different information for detecting defects in the substrate, and using these images for inspection can obtain more detailed information about the substrate. Therefore, the above-described configuration makes it possible to acquire images that can detect defects in the substrate with higher accuracy.

[0118] Infrared light images can be particularly effective when the processed film formed on the substrate is thick (several μm thick). Visible light images make it difficult to detect defects other than surface irregularities, particularly when the processed film is thick, making it difficult to detect defects that are difficult to identify as surface irregularities, such as striations, film irregularities, and comets. On the other hand, infrared light images can detect film changes other than surface irregularities. Therefore, by combining visible light images and infrared light images, information on a wider variety of defects can be obtained, making it possible to detect defects that could not be detected using visible light images alone.

[0119] Here, a half mirror 54 may be further provided as a direction changer that changes the first reflected light L1' and the second reflected light L2' (i.e., reflected light L3) in the same direction. Furthermore, the first imaging sensor may receive the first reflected light L1' whose direction has been changed by the half mirror 54, and the second imaging sensor may receive the second reflected light L2' whose direction has also been changed by the half mirror 54. With the above configuration, the arrangement of the first imaging sensor and the second imaging sensor can be changed more flexibly than in a case where a direction changer is not provided.

[0120] The first and second image sensors may be housed in the same camera 41. With this configuration, a single camera can acquire visible light images and infrared light images, preventing the substrate inspection device from becoming too large.

[0121] The light source device may further include an optical filter 53 as an incident direction adjuster that adjusts the visible light L1 from the first light source unit and the near-infrared light L2 (infrared light) from the second light source unit so that they are incident in the same direction relative to the substrate. With this configuration, the arrangement of the first light source unit and the second light source unit can be changed more flexibly than when no incident direction adjuster is provided.

[0122] The visible light L1 incident on the substrate, the near-infrared light L2 incident on the substrate, the first reflected light L1' exiting the substrate, and the second reflected light L2' exiting the substrate may be on the same optical axis. This configuration can reduce the space in which the optical axes of these lights exist. Therefore, restrictions on the device configuration can be reduced, such as by configuring the device so as not to block the path of light, allowing for flexible changes to the arrangement of components other than the optical system.

[0123] The holder, first light source, second light source, first imaging sensor, and second imaging sensor may be housed in a single imaging unit U3. Furthermore, the control device 100, which serves as a control unit, may control the imaging unit U3 to capture visible light images and infrared light images. Furthermore, the control unit may control inspection of the board using the visible light images and infrared light images. With the above configuration, the control unit can comprehensively control the capture of visible light images and infrared light images and the inspection of the board using these images.

[0124] The holder 31 may be movable horizontally within the imaging unit U3. Furthermore, under the control of the control unit, the visible light image and the infrared light image may be captured in parallel while the holder 31 is moving. With this configuration, the time required to capture the visible light image and the infrared light image can be shortened, thereby shortening the time required to inspect the board.

[0125] The control unit may also detect defects on the substrate surface by comparing the visible light image and the infrared light image. The information related to defects in the substrate contained in the visible light image and the information related to defects in the substrate contained in the infrared light image may not be the same, and may contain different information. Therefore, by detecting defects by comparing the two images, it is possible to detect defects that cannot be detected using only one image.

[0126] The visible light image may be a composite image of multiple types of color component images having different color components, and the control unit may cause the display unit to display an image obtained by combining the infrared light image and at least one of the multiple types of color component images. For example, as described in the above embodiment, the image may be displayed on the display unit 200 as a pseudo RGB image. With this configuration, a composite image different from a normal visible light image or infrared light image is displayed on the display unit, allowing the user to view an image of a type different from the visible light image or infrared light image.

[0127] [Variations] Although various exemplary embodiments have been described above, the present invention is not limited to the above-described exemplary embodiments, and various omissions, substitutions, and modifications may be made. Furthermore, elements in different embodiments may be combined to form other embodiments.

[0128] For example, in the above embodiment, a case where a near-infrared light image is captured as an infrared light image is described, but the wavelength range of near-infrared light is not limited to a wavelength of approximately 780 mm to 2 μm, and infrared light with a wavelength greater than 2 μm may also be used.

[0129] In the above embodiment, a single imaging unit U3 simultaneously captures both visible light images and near-infrared light images while moving the workpiece W. However, instead of this configuration, the visible light images and near-infrared light images may be captured sequentially. The arrangement of the light source and camera within the imaging unit U3 may also be changed as appropriate. The number and arrangement of optical elements for adjusting the path of light, such as the optical filter 53 and half mirror 54, may also be changed as appropriate depending on the arrangement of the light source and camera.

[0130] From the foregoing, it will be understood that various embodiments of the present disclosure have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the appended claims. [Explanation of symbols]

[0131] 1...substrate processing system, 2...coating / developing apparatus, 3...exposure apparatus, 30...housing, 31...holding section, 32...linear drive section, 40...imaging section, 41...camera, 50...reflecting section, 51...first light source section, 52...second light source section, 53...optical filter, 54...half mirror, 100...control device (control section), 101...imaging instruction acquisition section, 102...imaging control section, 103...RGB image acquisition section, 104...NIR image acquisition section, 105...image holding section, 106...inspection instruction acquisition section, 107...image inspection section, 108...display instruction acquisition section, 109...channel setting change section.

Claims

1. A substrate inspection device that inspects a substrate using an image of a surface of the substrate, a holder for holding the substrate; a first light source unit that emits visible light toward the substrate held by the holder; a second light source unit that emits infrared light toward the substrate held by the holder; a first image sensor that receives first reflected light emitted from the substrate by irradiating the substrate with visible light and captures a visible light image of the surface of the substrate; a second imaging sensor that receives second reflected light emitted from the substrate by irradiating the substrate with the infrared light and captures an infrared light image of the surface of the substrate; a control unit that controls an imaging unit accommodating the holding unit, the first light source unit, the second light source unit, the first imaging sensor, and the second imaging sensor to capture the visible light image with the first imaging sensor and the infrared light image with the second imaging sensor, and detects defects on the surface of the substrate by comparing the visible light image with the infrared light image; and The substrate inspection device, wherein the second image sensor is sensitive to light having a wavelength of at least 780 to 1000 nm.

2. a direction changer that changes the first reflected light and the second reflected light to the same direction; the first imaging sensor receives the first reflected light whose direction has been changed by the direction changer; The substrate inspection device according to claim 1 , wherein the second image sensor receives the second reflected light whose direction has been changed by the direction changer.

3. 3. The substrate inspection device according to claim 1, wherein the first image sensor and the second image sensor are housed in the same camera.

4. 4. The substrate inspection device according to claim 1, further comprising an incident direction adjustment unit that adjusts the visible light from the first light source unit and the infrared light from the second light source unit so that they are incident in the same direction relative to the substrate.

5. A substrate inspection device according to any one of claims 1 to 4, wherein the visible light incident on the substrate, the infrared light incident on the substrate, the first reflected light exiting the substrate, and the second reflected light exiting the substrate are on the same optical axis.

6. the holding portion is movable in a horizontal direction within the imaging unit, By the control of the control unit, 6. A substrate inspection device according to claim 1, wherein while the holding part is moving, the first imaging sensor captures the visible light image and the second imaging sensor captures the infrared light image in parallel.

7. the visible light image is an image obtained by combining a plurality of color component images each having a different color component, A substrate inspection device as described in any one of claims 1 to 6, wherein the control unit causes a display unit to display an image that is a combination of the infrared light image and at least one of the multiple types of color component images.

8. A substrate inspection method for inspecting a substrate using an image of a surface of the substrate, the method comprising: holding the substrate with a holding portion; emitting visible light from a first light source unit to the substrate held by the holder; emitting infrared light from a second light source unit to the substrate held by the holder; receiving first reflected light emitted from the substrate by irradiating the substrate with the visible light with a first image sensor, and capturing a visible light image of the surface of the substrate; receiving second reflected light emitted from the substrate by irradiating the substrate with the infrared light using a second image sensor having sensitivity to light with a wavelength of at least 780 to 1000 nm, and capturing an infrared light image of the surface of the substrate; acquiring the visible light image and the infrared light image by a control unit, and comparing the visible light image with the infrared light image to detect defects on the surface of the substrate; A substrate inspection method comprising:

9. The method further includes changing the direction of the first reflected light and the second reflected light to the same direction by a direction changing unit, In capturing the visible light image, the first image sensor receives the first reflected light whose direction has been changed by the direction changer; The substrate inspection method according to claim 8 , wherein in capturing the infrared light image, the second image sensor receives the second reflected light whose direction has been changed by the direction changer.

10. 10. The substrate inspection method according to claim 8, wherein the first image sensor and the second image sensor are housed in the same camera.

11. 11. A substrate inspection method according to claim 8, further comprising adjusting, by an incident direction adjustment unit, the visible light from the first light source unit and the infrared light from the second light source unit so that they are incident in the same direction relative to the substrate.

12. 12. A substrate inspection method according to claim 8, wherein the visible light incident on the substrate, the infrared light incident on the substrate, the first reflected light exiting the substrate, and the second reflected light exiting the substrate are on the same optical axis.

13. The holding part is movable in a horizontal direction, 13. The substrate inspection method according to claim 8, wherein, under control of the control unit, the first imaging sensor captures the visible light image and the second imaging sensor capture the infrared light image in parallel while the holding unit is moving.

14. the visible light image is an image obtained by combining a plurality of color component images each having a different color component, The substrate inspection method according to any one of claims 8 to 13, further comprising causing the control unit to display on a display unit an image obtained by combining the infrared light image and at least one of the plurality of types of color component images.

15. A substrate inspection program for causing a computer to inspect a substrate using an image of a surface of the substrate in a substrate inspection device, holding the substrate with a holding portion; emitting visible light from a first light source unit to the substrate held by the holder; emitting infrared light from a second light source unit to the substrate held by the holder; receiving first reflected light emitted from the substrate by irradiating the substrate with the visible light with a first image sensor, and capturing a visible light image of the surface of the substrate; receiving second reflected light emitted from the substrate by irradiating the substrate with the infrared light using a second image sensor having sensitivity to light with a wavelength of at least 780 to 1000 nm, and capturing an infrared light image of the surface of the substrate; acquiring the visible light image and the infrared light image by a control unit, and comparing the visible light image with the infrared light image to detect defects on the surface of the substrate; A substrate inspection program that causes the computer to execute the above steps.

Images