Mounting device, inspection device, and semiconductor device manufacturing method

Abstract

To provide technology that can improve the stability of inspections.SOLUTION: A mounting equipment comprises an imaging device installed above a plurality of inspection objects, and a control unit configured to inspect the plurality of inspection objects based on images obtained by the imaging device capturing the plurality of inspection objects in the same exposure. The control unit is configured to acquire first image data by placing the reference object at the center of the field of view of the imaging device and capturing the reference object, acquire first data concerning the reference object based on the first image data, acquire second image data by placing the reference object at a position where the reference object is at a predetermined distance from the center of view and capturing the reference object, acquire second data concerning the reference object based on the second image data and calculate correction coefficients in an area at a predetermined distance from the center of the field of view based on the first data and the second data.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a mounting apparatus, and is applicable to, for example, a die bonder that uses paste as a bonding material. [Background technology]

[0002] Mounting devices such as die bonders are devices that use a bonding material to attach (mount) elements onto a substrate or other elements. Bonding materials include, for example, resin paste and solder. Resin paste is a liquid adhesive, such as silver paste, such as silver epoxy or silver acrylic. Hereinafter, resin paste will be simply referred to as paste. Elements include, for example, semiconductor chips (hereinafter referred to as dies) and MEMS (Micro Electro Mechanical Systems). Substrates include, for example, wiring boards, lead frames formed from thin metal plates, glass substrates, etc.

[0003] For example, based on images acquired using a camera and lighting device, the position of the substrate to which the paste is to be applied can be confirmed and positioning can be performed, and it can be confirmed whether the paste applied to the substrate is applied in a predetermined position, in a predetermined shape, and in a predetermined amount. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-44466 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure aims to provide a technique that can improve the stability of testing. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0006] A brief summary of representative aspects of this disclosure is as follows. That is, the mounting apparatus includes an imaging device provided above a plurality of inspection objects, and a control device configured to inspect the plurality of inspection objects based on images obtained by the imaging device photographing the plurality of inspection objects within the same exposure, wherein the control device is configured to: position a reference object at the center of a field of view of the imaging device, photograph the reference object to acquire first image data, acquire first data regarding the reference object based on the first image data, position the reference object at a position a predetermined distance from the center of the field of view, photograph the reference object to acquire second image data, acquire second data regarding the reference object based on the second image data, and calculate a correction coefficient for a region at the predetermined distance from the center of the field of view based on the first data and the second data. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to improve the stability of testing. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a top view showing an outline of a die bonder according to an embodiment. [Figure 2] FIG. 2 is a diagram illustrating the schematic configuration when viewed from the direction of arrow A in FIG. [Figure 3] FIG. 3 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Figure 4] FIG. 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Figure 5] FIG. 5 is a diagram showing the positional relationship between the field of view of the preform camera and the substrate, and the positional relationship between the preform camera and the lighting device in the embodiment. [Figure 6] FIG. 6 is a flowchart showing a method for calculating the correction coefficients. [Figure 7]Figure 7(a) is a top view showing a case where the paste is applied to the substrate near the center of the field of view of the preform camera, while Figures 7(b) and 7(c) are top views showing a case where the paste is applied to the substrate near the periphery of the field of view of the preform camera. [Figure 8] FIG. 8 is a flowchart showing the process during production. [Figure 9] FIG. 9 is a diagram showing the positional relationship between the field of view of the preform camera and the substrate in a comparative example. [Figure 10] FIG. 10 is a diagram showing the positional relationship between the field of view of the preform camera and the substrate in the first modified example. [Figure 11] Figure 11(c) is a top view showing the case where the paste is applied to the substrate near the center of the field of view of the preform camera, while Figures 11(a), 11(b), 11(d), and 11(e) are top views showing the case where the paste is applied to the substrate near the periphery of the field of view of the preform camera. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the drawings. However, in the following description, the same components will be assigned the same reference numerals, and repeated description may be omitted. Note that, to clarify the description, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but this is merely an example and does not limit the interpretation of the present disclosure.

[0010] The configuration of a die bonder in an embodiment as one aspect of a mounting apparatus will be described with reference to FIGS.

[0011] The die bonder 10 broadly comprises a die supply unit 1 that supplies a die D to be mounted on a substrate S, a pickup unit 2, an intermediate stage unit 3, a preform unit 9, a bonding unit 4, a transport unit 5, a substrate supply unit 6, a substrate unloading unit 7, and a control unit (control device) 8 that monitors and controls the operation of each unit. The Y-axis direction is the front-to-rear direction of the die bonder 10, and the X-axis direction is the left-to-right direction. The die supply unit 1 is located at the front of the die bonder 10, and the bonding unit 4 is located at the rear. Here, the substrate S has multiple product areas (hereinafter referred to as attachment areas P) that will eventually become a single package. For example, if the substrate S is a lead frame, the attachment area P has tabs on which the die D is placed.

[0012] The die supply unit 1 has a wafer holder 12 that holds a wafer 11, and a peeling unit 13, shown by a dotted line, that peels a die D from the wafer 11. The wafer holder 12 moves in the X and Y directions by a driving means (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The peeling unit 13 moves in the vertical direction by a driving means (not shown). The wafer 11 is adhered to a dicing tape 16 and is divided into multiple dies D. The dicing tape 16 with the wafer 11 attached is held by a wafer ring (not shown).

[0013] The pickup unit 2 has a pickup head 21, a Y drive unit 23, various drive units (not shown) that raise and lower, rotate, and move the collet 22 in the X-axis direction, and a wafer recognition camera 24. The pickup head 21 has the collet 22 that suction-holds the peeled die D at its tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y-axis direction. The wafer recognition camera 24 determines the pickup position of the die D to be picked up from the wafer 11.

[0014] The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

[0015] The preform unit 9 has a syringe 91, a drive unit 93, a preform camera 94 as an imaging device, and a preform stage 96. The syringe 91 applies (attaches) paste to the substrate S that has been transported to the preform stage 96 by the transport unit 5. The drive unit 93 moves the syringe 91 in the X-axis direction, the Y-axis direction, and the up-and-down direction. The preform camera 94 grasps the application position of the syringe 91, etc. The preform stage 96 is raised when applying paste to the substrate S, and supports the substrate S from below. The preform stage 96 has suction holes (not shown) for vacuum-absorbing the substrate S, making it possible to fix the substrate S.

[0016] The bonding unit 4 includes a bond head 41, a Y-axis drive unit 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41, like the pickup head 21, includes a collet 42 that suction-holds the die D at its tip. The Y-axis drive unit 43 moves the bond head 41 in the Y-axis direction. The substrate recognition camera 44 captures an image of a position recognition mark (not shown) in the attachment area P of the substrate S and recognizes the bond position. The bond stage 46 is raised when the die D is placed on the substrate S and supports the substrate S from below. The bond stage 46 has suction holes (not shown) for vacuum-suctioning the substrate S, enabling the substrate S to be fixed in place. With this configuration, the bond head 41 corrects the pickup position and orientation based on the image data captured by the stage recognition camera 32 and picks up the die D from the intermediate stage 31. Then, based on the image data captured by the substrate recognition camera 44, the bond head 41 bonds (places and adheres) the die D onto the attachment area P of the transported substrate S where the paste has been applied.

[0017] The transport unit 5 has a substrate transport claw 51 that grips and transports the substrate S, and a transport lane 52 that serves as a transport path along which the substrate S moves. The substrate S moves by driving a nut (not shown) of the substrate transport claw 51 that is provided on the transport lane 52 with a ball screw (not shown) that is provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 6 along the transport lane 52, passing through the coating position to the bonding position, and after bonding, moves to the substrate unloading unit 7 and hands the substrate S over to the substrate unloading unit 7.

[0018] The control system of the die bonder 10 will be described with reference to FIG.

[0019] The control system 80 includes a control unit 8, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 8 broadly includes a control / arithmetic unit 81, primarily composed of a CPU (Central Processing Unit), a storage unit 82, an input / output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 includes a main storage unit 82a, typically composed of a RAM (Random Access Memory) for storing processing programs, and an auxiliary storage unit 82b, typically composed of a HDD (Hard Disk Drive) for storing control data and image data required for control. The input / output unit 83 includes a monitor 83a for displaying device status and information, a touch panel 83b for inputting operator instructions, a mouse 83c for operating the monitor, and an image capture unit 83d for capturing image data from the optical system 88. The input / output unit 83 also includes a drive unit 86, a motor control unit 83e for controlling the drive unit 86, and an I / O signal control unit 83f for capturing or controlling signals from the signal unit 87.

[0020] The drive unit 86 includes the XY table (not shown) of the die supply unit 1, the Y drive unit 23 which is the ZY drive axis of the pickup head 21 shown in FIG. 1, the drive unit 93 which is the ZY drive axis of the syringe 91, and the Y drive unit 43 which is the ZY drive axis of the bond head 41. The signal unit 87 includes switches and volumes which control various sensor signals and the brightness of lighting devices, etc. The optical system 88 includes the wafer recognition camera 24, preform camera 94, stage recognition camera 32, and substrate recognition camera 44 shown in FIG. 1 or 2. The control / arithmetic unit 81 receives necessary data via the bus line 84, performs calculations, and controls the bond head 41, etc., and sends information to the monitor 83a, etc.

[0021] The control unit 8 stores image data captured by the optical system 88 via the image capture device 83d in the storage device 82. Using software programmed based on the stored image data, the control and calculation device 81 positions the die D and substrate S, inspects the application pattern of the paste adhesive, and inspects the surfaces of the die D and substrate S. Based on the positions of the die D and substrate S calculated by the control and calculation device 81, the software drives the drive unit 86 via the motor control device 83e. Through this process, the die D on the wafer 11 is positioned, and the drive units of the die supply unit 1 and bonding unit 4 are operated to bond the die D onto the substrate S. The recognition camera used in the optical system 88 digitizes light intensity and color.

[0022] A bonding process (a method for manufacturing a semiconductor device), which is one of the manufacturing processes for a semiconductor device using the die bonder 10, will be described with reference to Fig. 4. In the following description, the operation of each part constituting the die bonder 10 is controlled by a control unit 8.

[0023] (Wafer carrying-in process (process S1)) A wafer ring (not shown) is carried into the die bonder 10. The carried-in wafer ring is supplied to the die supply unit 1. Here, the wafer ring holds a dicing tape 16 to which a die D separated from a wafer 11 is attached.

[0024] (Substrate loading process (process S2)) A magazine (not shown) storing substrates S is carried into the die bonder 10. The carried-in magazine is supplied to the substrate supply unit 6. In the substrate supply unit 6, the substrates S are attached to the substrate transport claws 51.

[0025] (Pickup process (process S3)) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape 16. The die D is photographed by the wafer recognition camera 24, and the die D is positioned and its surface is inspected based on the image data acquired by the photograph.

[0026] The positioned die D is peeled off from the dicing tape 16 by the peeling unit 13 and the pickup head 21. The die D peeled off from the dicing tape 16 is attracted to and held by a collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0027] The die D on the intermediate stage 31 is photographed by the stage recognition camera 32, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 10, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the intermediate stage 31 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0028] The pickup head 21 that transported the die D to the intermediate stage 31 is returned to the die supply unit 1. Following the procedure described above, the next die D is peeled off from the dicing tape 16, and thereafter, the dies D are peeled off one by one from the dicing tape 16 following the same procedure.

[0029] (Preforming process (process S4)) After step S2, the substrate S is transported to the preform stage 96 by the transport unit 5. The surface of the substrate S before application is photographed by the preform camera 94, and the surface to which the paste is to be applied is confirmed based on the image data acquired by photographing. If there are no problems with the surface to be applied, the position where the paste is to be applied on the substrate S supported by the preform stage 96 is confirmed and positioned. Positioning is performed by pattern matching, as in the bonding unit 4.

[0030] The paste is ejected from the nozzle at the tip of syringe 91 and applied according to the nozzle's trajectory. Syringe 91 is driven along the X, Y, and Z axes by driver 93 to the desired shape, and the trajectory of syringe 91 allows for application (drawing) of any desired shape, such as an X or a cross.

[0031] The applied paste is photographed by a preform camera 94. Whether the paste has been applied accurately is confirmed based on the image obtained by photographing, and an inspection (visual inspection) of the applied paste is performed. That is, the visual inspection confirms whether the applied paste has been applied in a predetermined position, in a predetermined shape, and in a predetermined amount. The inspection contents include, for example, the presence or absence of paste, the applied area, and the applied shape (insufficiency, overflow). The inspection is performed by counting the number of pixels after separating the paste area using binarization processing, as well as by comparing differences and comparing scores using pattern matching.

[0032] (Bonding process (process S5)) If there are no problems with the coating, the substrate S is transported to the bond stage 46 by the transport unit 5. The substrate S placed on the bond stage 46 is photographed by the substrate recognition camera 44, and image data is acquired by the photograph. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 4 as the initial setting of the device.

[0033] The suction position of the bond head 41 is corrected based on the amount of deviation of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41 that has suctioned the die D from the intermediate stage 31 bonds (attaches) the die D to a predetermined location on the substrate S supported by the bond stage 46. The die D bonded to the substrate S is photographed by the substrate recognition camera 44, and an inspection is performed based on the image data acquired by photographing to determine whether the die D has been attached to the desired position, etc.

[0034] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until the die D is attached to all of the attachment areas P of the substrate S.

[0035] (Substrate unloading process (process S6)) The substrate S with the die D bonded thereto is transported to the substrate unloading section 7. At the substrate unloading section 7, the substrate S with the die D bonded thereto is removed from the substrate transport claws 51 and stored in a magazine. The magazine storing the substrate S is unloaded from the die bonder 10.

[0036] As described above, the die D is mounted on the substrate S and carried out from the die bonder 10. The substrate S on which the die D is mounted is carried to a wire bonding process, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. The substrate S is carried to a molding process, where the die D and the Au wires are sealed with molding resin (not shown), thereby completing the package.

[0037] The optical system of the preform part 9 will be described with reference to FIG.

[0038] An illumination device 95 is disposed between the preform camera 94 and the substrate S. The preform camera 94 and illumination device 95 are movable along the Y direction, and the substrate S is movable along the X direction. When the preform camera 94 moves, the illumination device 95 moves together with the preform camera 94. Here, as an example, the substrate S has three attachment areas in one row (Y direction) and three rows of attachment areas in the X direction. The illumination device 95 is, for example, a coaxial epi-illumination (coaxial illumination) equipped with a surface-emitting illumination (light source) and a half mirror (semi-transmitting mirror) inside. The preform camera 94, illumination device 95, and control unit 8 constitute an inspection device.

[0039] The preform camera 94 and the substrate S are moved so that multiple attachment regions are located within the field of view CV of the preform camera 94. For example, the preform camera 94 is positioned so that attachment regions P1, P2, and P3 of the substrate S are located within the field of view CV of the preform camera 94. At this time, it is preferable that the center of attachment region P2 (the center of gravity of attachment regions P1, P2, and P3), which is located equidistant from the centers of attachment regions P1 and P3, is located at the center of the field of view CV. The illumination area IA of the illumination device 95 is set to be wider than the field of view CV of the preform camera 94.

[0040] When using a single camera to simultaneously (within the same exposure) capture and inspect multiple pastes applied to a substrate or multiple bonded dies, uniformity of illuminance distribution within the camera's field of view is required. However, while uniformity of illuminance distribution is generally maintained within a single attachment area near the center of the field of view, attachment areas located near the periphery of the field of view may exhibit differences in illuminance compared to the center. For this reason, for example, when calculating the area of ​​applied paste using image processing, the area may differ when the paste is located near the center of the field of view and when it is located near the periphery.

[0041] In this embodiment, a correction coefficient is calculated based on image data of a reference object located near the center of the field of view and image data of a reference object located near the periphery of the field of view, and the inspection value of an inspection object located near the periphery of the field of view is corrected based on the calculated correction coefficient.

[0042] An example of calculating the correction coefficient when the reference object is a paste will be described with reference to FIG. 6 and FIGS. 7(a) to 7(c).

[0043] (Step S10) 7(a), the control unit 8 applies paste as a reference object to any one attachment region of the substrate S using a syringe 91. An example in which paste PAo is applied to the attachment region Po will be described below.

[0044] (Step S11) The control unit 8 moves one or both of the substrate S and the preform camera 94 so that the center of the field of view CV of the preform camera 94 is located at the center of the attachment area Po. The position of the attachment area Po relative to the center of the field of view CV corresponds to the position of the attachment area P2 in FIG.

[0045] (Step S12) The control unit 8 photographs the paste PAo on the attachment area Po with the preform camera 94 to obtain an image (first image data).

[0046] (Step S13) The control unit 8 calculates and acquires, from the image acquired in step S12, the area (Ao) as first data of the paste PAo on the attachment area Po located near the center of the field of view CV of the preform camera 94. Here, the area is an example of an inspection value of the appearance inspection.

[0047] (Step S14) 7(b), the control unit 8 moves the preform camera 94 so that the center of the field of view CV of the preform camera 94 is positioned at the center of the attachment area Pa. The position of the attachment area Po based on the center of the field of view CV corresponds to the position of the attachment area P1 in FIG.

[0048] (Step S15) The control unit 8 photographs the paste PAo on the attachment area Po with the preform camera 94 to obtain an image (second image data).

[0049] (Step S16) The control unit 8 calculates and acquires the area (Aa) of the paste PAo on the attachment area Po located near the periphery of the field of view CV of the preform camera 94 from the image acquired in step S12 as second data.

[0050] (Step S17) 5, the preform camera 94 is positioned so that three attachment areas P1, P2, and P3 are located within the field of view CV of the preform camera 94. Therefore, in this example, the process of photographing, image acquisition, and area calculation is required three times (the predetermined number of times is three). Since the process has been performed two times up to this point, return to step S14.

[0051] (Step S14) 7(c), the control unit 8 moves the preform camera 94 so that the center of the field of view CV of the preform camera 94 is positioned at the center of the attachment area Pb. The position of the attachment area Po based on the center of the field of view CV corresponds to the position of the attachment area P3 in FIG. (Step S15) The control unit 8 photographs the paste PAo on the attachment area Po with the preform camera 94 to obtain an image (second image data).

[0052] (Step S16) The control unit 8 calculates and acquires the area (Ab) of the paste PAo on the attachment area Po located near the periphery of the field of view CV of the preform camera 94 from the image acquired in step S14 as second data.

[0053] (Step S17) Up to this point, the process of photographing, acquiring images, and calculating the area has been performed three times, so the process proceeds to step S18.

[0054] (Step S18) The control unit 8 calculates a correction coefficient for each attachment region based on Ao, which is the area of ​​the paste PAo near the center of the field of view CV, and Aa and Ab, which are the areas of the paste PAo near the periphery of the field of view CV.

[0055] For example, if the correction coefficient in the attachment area Po shown in FIG. 7(b) is Ca and the correction coefficient in the attachment area Po shown in FIG. 7(c) is Cb, then Ca, Cb teeth It is calculated using the following formulas (1) and (2): 、C a teeth This is the correction coefficient for the attachment area P1 shown in FIG. 、C b teeth This is the correction coefficient for the attachment region P3 shown in FIG.

[0056] Ca = Ao / Aa (1) Cb=Ao / Ab (2)

[0057] The above-described steps S10 to S18 are performed before a continuous operation in production, and the correction coefficients (Ca, Cb) are stored in the storage device 82 of the control unit 8, for example.

[0058] Next, the continuous operations in production will be described with reference to Figures 5 and 8. Figure 8 is a flowchart showing the processes during production. In the preforming process (step S4), the following processes are performed.

[0059] (Step S20) The control unit 8 applies paste as an inspection object to each attachment area of ​​the substrate S using a syringe 91.

[0060] (Step S21) The control unit 8 moves one or both of the substrate S and the preform camera 94 so that the center of the field of view CV of the preform camera 94 is positioned at the center of the attachment region P2.

[0061] (Step S22) The control unit 8 photographs the pastes PA1 to PA3 on the attachment regions P1 to P3 within the field of view CV using the preform camera 94 to obtain an image (third image data).

[0062] (Step S23) The control unit 8 calculates and acquires the areas (MA1, MA2, MA3) as the inspection values ​​of the appearance inspection of the pastes PA1, PA2, PA3 from the images acquired in step S22.

[0063] (Step S24) The control unit 8 corrects the areas (MA1, MA3) of the pastes PA1 and PA3 based on the correction coefficients (Ca, Cb). Here, since the paste PA2 is located near the center of the field of view CV, the area (MA2) of the paste PA2 is not corrected.

[0064] If the corrected area of ​​the paste PA1 in the attachment region P1 is CA1 and the corrected area of ​​the paste PA3 in the attachment region P3 is CA3, CA1 and CA3 are calculated by the following formulas (3) and (4).

[0065] CA1 = MA1 * Ca (3) CA3=MA3*Cb (4)

[0066] When the inspection of the first row of attachment regions is completed, the substrate S is moved in the X direction, and the second row of attachment regions is inspected in the same manner as the first row of attachment regions. When the inspection of the second row of attachment regions is completed, the substrate S is further moved in the X direction, and the third row of attachment regions is inspected in the same manner as the first row of attachment regions. Instead of moving the substrate S, the preform camera 94 may be moved.

[0067] 5 shows an example in which all attachment areas arranged in a row fall within the same field of view CV. If all attachment areas arranged in a row do not fall within the same field of view CV, the preform camera 94 is moved along the Y direction to move the field of view CV for inspection.

[0068] (Comparative Example) A visual inspection according to a comparative example will be described with reference to FIG.

[0069] In the embodiment, an example has been described in which multiple attachment areas arranged in a row in the Y direction are photographed for visual inspection, but it is also possible to photograph each attachment area individually for visual inspection. The configuration of the optical system of the preform part in the comparative example is the same as the optical system of the embodiment shown in Figure 4.

[0070] In the comparative example, paste PA1 is photographed by moving preform camera 94 so that attachment region P1 is located near the center of the field of view CV of preform camera 94. Next, paste PA2 is photographed by moving preform camera 94 so that attachment region P2 is located near the center of the field of view CV of preform camera 94. Next, paste PA3 is photographed by moving preform camera 94 so that attachment region P3 is located near the center of the field of view CV of preform camera 94.

[0071] Since one attachment area is always positioned near the center of the field of view, uniformity of the illuminance distribution is maintained. However, in the comparative example, three images of the three pastes PA1 to PA3 must be taken by the preform camera 94. On the other hand, in the embodiment, the three pastes PA1 to PA3 are only taken once. Therefore, in the embodiment, the number of images taken is reduced compared to the comparative example, and therefore the inspection time can be reduced.

[0072] Embodiments may have one or more of the following advantages.

[0073] (1) Stable inspection results can be obtained without being affected by the illuminance distribution in each attachment area, which is caused by the luminance distribution of the light source, etc.

[0074] (2) Stable testing leads to improved productivity.

[0075] (3) By simultaneously photographing multiple inspection objects within the field of view (within the same exposure), the inspection time can be shortened, improving production capacity.

[0076] <Modification> Below, several representative modified examples of the embodiment are given. In the following description of the modified examples, the same reference numerals as those in the above-described embodiment may be used for parts having the same configurations and functions as those described in the above-described embodiment. Furthermore, the description of such parts may be appropriately cited within the scope of not being technically inconsistent. Furthermore, a part of the above-described embodiment and all or part of the multiple modified examples may be appropriately applied in a composite manner within the scope of not being technically inconsistent.

[0077] (First Modification) The appearance inspection according to the first modified example will be described with reference to FIG.

[0078] In the embodiment, an example has been described in which multiple attachment areas arranged in a row in the Y direction are photographed and visually inspected, but it is also possible to photograph multiple attachment areas arranged in a matrix in the Y and X directions and visually inspect them.

[0079] For example, the preform camera 94 is positioned so that the attachment regions P1, P2, P4, and P5 of the substrate S are located within the field of view CV of the preform camera 94. In this case, it is preferable that a position equidistant from the center of each of the attachment regions P1, P2, P4, and P5 (hereinafter referred to as the substrate position SC) is located at the center of the field of view CV. The substrate position SC is the center of gravity of the attachment regions P1, P2, P4, and P5.

[0080] An example of calculation of the correction coefficient will be described with reference to FIGS. 6, 7, 10, and 11(a) to 11(e).

[0081] (Step S10) 11(c), the control unit 8 applies paste to any one of the attachment areas of the substrate S using a syringe 91. An example in which paste PAo is applied to an attachment area Po will be described below.

[0082] (Step S11) 11(c), the control unit 8 moves the preform camera 94 and the substrate S so that the center of the field of view CV of the preform camera 94 is positioned at the center of the attachment area Po. The position of the attachment area Po relative to the center of the field of view CV corresponds to the substrate position SC in FIG.

[0083] (Step S12) The control unit 8 photographs the paste PAo on the attachment area Po with the preform camera 94 to obtain an image (first image data).

[0084] (Step S13) The control unit 8 calculates and acquires the area (Ao) of the paste PAo on the attachment area Po located near the center of the field of view CV of the preform camera 94 from the image acquired in step S12 as first data.

[0085] (Step S14) 11(a), the control unit 8 moves the preform camera 94 and the substrate S so that the center of the field of view CV of the preform camera 94 is located at the substrate position SCa of the center of gravity determined by the centers of the attachment regions Po, Pb, Pc, and Pd. The position of the attachment region Po relative to the center of the field of view CV corresponds to the position of the attachment region P4 in FIG.

[0086] (Step S15) The control unit 8 photographs the paste PAo on the attachment area Po with the preform camera 94 to obtain an image (second image data).

[0087] (Step S16) The control unit 8 calculates and acquires the area (Aa) of the paste PAo on the attachment area Po located near the periphery of the field of view CV of the preform camera 94 from the image acquired in step S15 as second data.

[0088] (Step S17) As shown in Figure 10, the preform camera 94 is positioned so that four attachment areas P1, P2, P4, and P5 are located within the field of view CV of the preform camera 94. Furthermore, no attachment area is located at the center of the four attachment areas P1, P2, P4, and P5. Therefore, in this example, the process of photographing, image acquisition, and area calculation is required five times (the predetermined number of times is five). Since the process has been performed two times up to this point, return to step S14.

[0089] (Step S14) 11(b), the control unit 8 moves the substrate S so that the center of the field of view CV of the preform camera 94 is positioned at the substrate position SCb of the center of gravity determined by the centers of the attachment regions Po, Pd, Pe, and Pf. The position of the attachment region Po relative to the center of the field of view CV corresponds to the position of the attachment region P1 in FIG.

[0090] (Step S15) The control unit 8 photographs the paste PAo on the attachment area Po with the preform camera 94 to obtain an image (second image data).

[0091] (Step S16) The control unit 8 calculates and acquires the area (Ab) of the paste PAo on the attachment area Po located near the periphery of the field of view CV of the preform camera 94 from the image acquired in step S15 as second data.

[0092] (Step S17) Since the process has been performed three times so far, the process returns to step S14.

[0093] (Step S14) 11(d), the control unit 8 moves the preform camera 94 and the substrate S so that the center of the field of view CV of the preform camera 94 is located at the substrate position SCd of the center of gravity determined by the centers of the attachment regions Po, Pa, Pb, and Ph. The position of the attachment region Po relative to the center of the field of view CV corresponds to the position of the attachment region P5 in FIG.

[0094] (Step S15) The control unit 8 photographs the paste PAo on the attachment area Po with the preform camera 94 to obtain an image (second image data).

[0095] (Step S16) The control unit 8 calculates and acquires the area (Ad) of the paste PAo on the attachment area Po located near the periphery of the field of view CV of the preform camera 94 from the image acquired in step S15 as second data.

[0096] (Step S17) Since the process has been performed four times so far, the process returns to step S14.

[0097] (Step S14) 11(e), the control unit 8 moves the substrate S so that the center of the field of view CV of the preform camera 94 is located at the substrate position SCe of the center of gravity determined by the centers of the attachment regions Po, Pf, Pg, and Ph. The position of the attachment region Po relative to the center of the field of view CV corresponds to the position of the attachment region P2 in FIG.

[0098] (Step S15) The control unit 8 photographs the paste PAo on the attachment area Po with the preform camera 94 to obtain an image (second image data).

[0099] (Step S16) The control unit 8 calculates and acquires the area (Ae) of the paste PAo on the attachment area Po located near the periphery of the field of view CV of the preform camera 94 from the image acquired in step S15 as second data.

[0100] (Step S17) Up to this point, the process of photographing, acquiring images, and calculating the area has been performed five times, so the process proceeds to step S18.

[0101] (Step S18) The control unit 8 calculates a correction coefficient for each attachment region based on Ao, which is the area of ​​the paste PAo near the center of the field of view CV, and Aa, Ab, Ad, and Ae, which are the areas of the paste PAo near the periphery of the field of view CV.

[0102] For example, if the correction coefficient in the attachment area Po shown in FIG. 11(a) is Ca, the correction coefficient in the attachment area Po shown in FIG. 11(b) is Cb, the correction coefficient in the attachment area Po shown in FIG. 11(d) is Cd, and the correction coefficient in the attachment area Po shown in FIG. 11(e) is Ce, then Ca, Cb, Cd, and Ce are calculated using the following equations (5) to (8).

[0103] Ca = Ao / Aa (5) Cb=Ao / Ab (6) Cd=Ao / Ad (7) Ce = Ao / Ae (8)

[0104] Here, the correction coefficient Ca is the correction coefficient for the attachment region P4 shown in Fig. 10. Furthermore, the correction coefficient Cb is the correction coefficient for the attachment region P1 shown in Fig. 10. Furthermore, the correction coefficient Cd is the correction coefficient for the attachment region P5 shown in Fig. 10. Furthermore, the correction coefficient Ce is the correction coefficient for the attachment region P2 shown in Fig. 10.

[0105] In this modification, the above-described steps S10 to S18 are performed before a continuous operation in production, and the correction coefficients (Ca, Cb, Cd, Ce) are stored in the storage device 82 of the control unit 8.

[0106] Next, continuous operation will be described with reference to FIGS.

[0107] (Step S20) The control unit 8 applies paste to each attachment area of ​​the substrate S using the syringe 91.

[0108] (Step S21) The control unit 8 moves one or both of the substrate S and the preform camera 94 so that the center of the field of view CV of the preform camera 94 is positioned at the center of the attachment region P2.

[0109] (Step S22) The control unit 8 photographs the pastes PA1, PA2, PA4, and PA5 on the attachment regions P1, P2, P4, and P5 within the field of view CV using the preform camera 94 to obtain an image (third image data).

[0110] (Step S23) The control unit 8 calculates and acquires the areas (MA1, MA2, MA4, MA5) as inspection values ​​of the appearance inspection of the pastes PA1, PA2, PA4, PA5 from the images acquired in step S22.

[0111] (Step S24) The control unit 8 corrects the areas (MA1, MA2, MA4, MA5) of the pastes PA1, PA2, PA4, PA5 based on the correction coefficients (Ca, Cb, Cd, Ce).

[0112] If the corrected area of ​​paste PA1 in attachment area P1 is CA1, the corrected area of ​​paste PA2 in attachment area P2 is CA2, the corrected area of ​​paste PA4 in attachment area P4 is CA4, and the corrected area of ​​paste PA5 in attachment area P5 is CA5, CA1, CA2, CA4, and CA5 are calculated using the following formulas (9) to (12).

[0113] CA1 = MA1 * Ca (9) CA2=MA2*Cb (10) CA4=MA4*Cd (11) CA5=MA5*Ce (12)

[0114] (Second Modification) In the embodiment, a correction coefficient is calculated based on the area of ​​the paste image near the center of the field of view and the area of ​​the paste image near the periphery of the field of view, and the inspection value (area) of the paste image near the periphery of the field of view is corrected based on the calculated correction coefficient. In the second modification, the correction coefficient is calculated based on the brightness of the paste image near the center of the field of view and the brightness of the paste image near the periphery of the field of view. Below, the method of calculating the correction coefficient will be described, focusing on the differences from the embodiment.

[0115] In step S13 of the embodiment, the control unit 8 acquires the area (Ao) of the paste PAo on the attachment area Po located near the center of the field of view CV of the preform camera 94 from the image captured by the preform camera 94. In the second modified example, the control unit 8 calculates and acquires the brightness (Bo) near the center of the paste PAo instead of the area (Ao) of the paste PAo.

[0116] In step S16 of the embodiment, the control unit 8 acquires the area (Aa) and area (Ac) of the paste PAo on the attachment region Po located near the periphery of the field of view CV of the preform camera 94 from the image captured by the preform camera 94. In the second modified example, the control unit 8 acquires the brightness (Ba) and brightness (Bc) near the center of the paste PAo instead of the area (Aa) and area (Ac) of the paste PAo.

[0117] In step S18 of the embodiment, the control unit 8 calculates the correction coefficient for each attachment region based on Ao, Aa, and Ab. In the second modified example, the control unit 8 calculates the correction coefficient for each attachment region based on Bo, Ba, and Bb instead of Ao, Aa, and Ab.

[0118] For example, if the correction coefficient for the attachment area Po shown in Fig. 7(b) is Ca and the correction coefficient for the attachment area Po shown in Fig. 7(c) is Cb, Ca and Cb are calculated using the following equations (13) and (14). Here, the correction coefficient Ca is the correction coefficient for the attachment area P1 shown in Fig. 5. Furthermore, the correction coefficient Cb is the correction coefficient for the attachment area P3 shown in Fig. 5.

[0119] Ca=Bo / Ba...(13) Cb=Bo / Bb (14)

[0120] The disclosure made by the present inventors has been specifically described above based on embodiments and modified examples, but it goes without saying that the present disclosure is not limited to the above embodiments and modified examples, and various modifications are possible.

[0121] For example, in the embodiment, an example was described in which multiple attachment areas arranged in a line in the Y direction were photographed and visually inspected, but it is also possible to photograph multiple attachment areas arranged in a line in the X direction and visually inspect them.

[0122] Furthermore, in the embodiment, an example has been described in which paste is the object of inspection, but the object of inspection may be a joining material such as solder, a die, or a substrate.

[0123] In the embodiment, the inspection value of the appearance inspection is the applied area of ​​the paste, but it may be the applied width of the paste, the shape of the paste, or the like.

[0124] Furthermore, in the embodiment, the illumination device has been described as a coaxial illumination device, but the illumination device may be an oblique illumination device, a dome illumination device, a ring illumination device, or the like.

[0125] Furthermore, in the embodiment, an example has been described in which the paste PA is applied to the substrate S, but the paste may be applied to a die that has already been bonded.

[0126] In addition, in the embodiment, an intermediate stage section 3 is provided between the die supply section 1 and the bonding section 4, and the die D picked up from the die supply section 1 by the pickup head 21 is placed on the intermediate stage 31, and the die D is picked up again from the intermediate stage 31 by the bond head 41 and bonded to the transported substrate S. However, it is also possible to bond the die D picked up from the die supply section 1 to the substrate S by the bond head 41. [Explanation of symbols]

[0127] 8. Control unit (control device) 10. Die bonder (mounting device) 94···Preform camera (imaging device) 95 Lighting equipment PA···Paste S... board

Claims

1. an imaging device provided above a plurality of inspection objects; an illumination device provided above the plurality of inspection objects; a control device configured to inspect the plurality of inspection objects based on images obtained by the illumination device irradiating the plurality of inspection objects with illumination light and the imaging device photographing the plurality of inspection objects within the same exposure; and Equipped with The control device a reference object is placed at the center of the field of view of the imaging device, and an image of the reference object is captured to obtain first image data; acquiring first data relating to the area or illuminance of the reference object based on the first image data; The reference object is placed at a position a predetermined distance away from the center of the field of view, and an image of the reference object is captured to obtain second image data; acquiring second data relating to the area or illuminance of the reference object based on the second image data; Calculating a correction coefficient in an area spaced a predetermined distance from the center of the field of view using a ratio between the first data and the second data in order to correct a difference in area of ​​the object to be inspected caused by a difference in illuminance caused by a position within the field of view of the imaging device A mounting device configured to:

2. 2. The mounting device of claim 1, The control device a center of gravity on the substrate determined by the areas where the plurality of inspection objects are provided is positioned at the center of the field of view, and the plurality of inspection objects are photographed to obtain third image data; calculating an inspection value for each of the plurality of inspection objects based on the third image data; The inspection value of the inspection object located in the area separated by the predetermined distance from the center of the field of view is corrected by the correction coefficient. A mounting device configured to:

3. 2. The mounting device of claim 1, A mounting apparatus in which the inspection object and the reference object are pastes applied to a substrate.

4. In the mounting device of claim 1, The mounting device, wherein the illumination device is a coaxial illumination device.

5. In the mounting device of claim 4, A mounting apparatus in which an illumination area of ​​the illumination device is set to be wider than a field of view of the imaging device.

6. 2. The mounting device of claim 1, A mounting apparatus in which the test object and the reference object are attachment areas of a substrate or elements placed on the attachment areas.

7. 2. The mounting device of claim 1, The control device is configured to move the center of view by moving one or both of the imaging device and the reference object.

8. an imaging device provided above a plurality of inspection objects; an illumination device provided above the plurality of inspection objects; a control device configured to inspect the plurality of inspection objects based on images obtained by the illumination device irradiating the plurality of inspection objects with illumination light and the imaging device photographing the plurality of inspection objects within the same exposure; and Equipped with The control device a reference object is placed at the center of the field of view of the imaging device, and an image of the reference object is captured to obtain first image data; acquiring first data relating to the area or illuminance of the reference object based on the first image data; The reference object is placed at a position separated by a predetermined distance from the center of the field of view, and an image of the reference object is captured to obtain second image data; acquiring second data relating to the area or illuminance of the reference object based on the second image data; Calculating a correction coefficient in an area spaced a predetermined distance from the center of the field of view using a ratio between the first data and the second data in order to correct a difference in area of ​​the object to be inspected caused by a difference in illuminance caused by a position within the field of view of the imaging device An inspection device configured to:

9. 9. The inspection device according to claim 8, The control device a center of gravity on the substrate determined by the areas where the plurality of inspection objects are provided is positioned at the center of the field of view, and the plurality of inspection objects are photographed to obtain third image data; calculating an inspection value for each of the plurality of inspection objects based on the third image data; The inspection value of the inspection object located in the area separated by the predetermined distance from the center of the field of view is corrected by the correction coefficient. An inspection device configured to:

10. a step of carrying a first substrate into a mounting device including an imaging device provided above a plurality of inspection objects, an illumination device provided above the plurality of inspection objects, and a control device configured to inspect the plurality of inspection objects based on images obtained by the illumination device irradiating the plurality of inspection objects with illumination light and the imaging device photographing the plurality of inspection objects within the same exposure; attaching a reference object to the first substrate; a step of placing the reference object at the center of the field of view of the imaging device, photographing the reference object to obtain first image data, obtaining first data relating to the area or illuminance of the reference object based on the first image data, placing the reference object at a position a predetermined distance from the center of the field of view, photographing the reference object to obtain second image data, obtaining second data relating to the area or illuminance of the reference object based on the second image data, and calculating a correction coefficient in a region at a predetermined distance from the center of the field of view using a ratio between the first data and the second data to correct a difference in area of ​​the object to be inspected caused by a difference in illuminance due to a position within the field of view of the imaging device; A method for manufacturing a semiconductor device having the above structure.

11. 11. The method of manufacturing a semiconductor device according to claim 10, further comprising: carrying a second substrate into the mounting device; attaching the plurality of test objects to the second substrate; a method for manufacturing a semiconductor device, comprising the steps of: positioning a center of gravity on the second substrate, which is determined by an area in which the plurality of inspection objects are provided, at the center of the field of view, photographing the plurality of inspection objects to obtain third image data; calculating an inspection value for each of the plurality of inspection objects based on the third image data; and correcting the inspection value of the inspection object located in an area away from the center of the field of view by the correction coefficient.

Images